Display device and method for manufacturing the same

Abstract

The present disclosure relates to a display device, the display device including: a light-emitting element at a display area; a driving element electrically connected to the light-emitting element; a packaging layer covering the light-emitting element; a touch sensor on the packaging layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the cladding layer and including an inorganic material, a part of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.

Description

Technical Field

[0001] Aspects of exemplary embodiments of the inventive concept relate to a display device. More specifically, aspects of exemplary embodiments of the inventive concept relate to a display device and a method of manufacturing a display device. Background Art

[0002] An organic light emitting display device is a display device capable of emitting light by itself (e.g., without using a backlight, etc.). Since an organic light emitting display device may have a reduced weight and thickness and may have characteristics suitable for a flexible display device, the use of an organic light emitting display device has been expanded.

[0003] An organic light emitting display device includes an array of light emitting elements and a driving unit (e.g., a driver or a driving circuit) for providing driving signals to the light emitting elements. The driving circuit of the driving unit may be provided in a driving chip. The driving chip (or a circuit board combined with the driving chip) may be bonded to a substrate of the organic light emitting display device.

[0004] The driving chip may be bonded to the substrate by thermocompression or the like. During (or after) the bonding process, bonding defects may occur, and thus the reliability of the display device may be reduced.

[0005] The above information disclosed in this background art section is for enhancing the understanding of the background of the inventive concept. Therefore, the above information may include information that does not constitute the prior art. Summary of the Invention

[0006] One or more exemplary embodiments of the inventive concept relate to a display device having improved reliability.

[0007] One or more exemplary embodiments of the inventive concept relate to a method of manufacturing a display device.

[0008] According to an exemplary embodiment of the inventive concept, a display device includes: a light emitting element at a display area; a driving element electrically connected to the light emitting element; a encapsulation layer covering the light emitting element; a touch sensor on the encapsulation layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a covering layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the covering layer and including an inorganic material, a part of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.

[0009] In an exemplary embodiment, the driving element may include: a gate metal pattern including a gate electrode; and a source metal pattern including a drain electrode or a connection electrode electrically connecting the drain electrode to the light-emitting element, and the touch sensor may include a sensing conductive pattern.

[0010] In an exemplary embodiment, the lower conductive layer may be formed of the same layer as the layer of the gate metal pattern, the intermediate conductive layer may be formed of the same layer as the layer of the source metal pattern, and the upper conductive layer may be formed of the same layer as the layer of the sensing conductive pattern.

[0011] In an exemplary embodiment, the source metal pattern may include: a first source metal pattern including the drain electrode and a second source metal pattern including the connection electrode, and the intermediate conductive layer may include: a first intermediate conductive layer formed of the same layer as the layer of the first source metal pattern and a second intermediate conductive layer formed of the same layer as the layer of the second source metal pattern.

[0012] In an exemplary embodiment, the connection pad may further include: a third intermediate conductive layer between the second intermediate conductive layer and the upper conductive layer.

[0013] In an exemplary embodiment, the touch sensor may include: a lower touch insulating layer; a first sensing conductive pattern on the lower touch insulating layer; a touch intermediate insulating layer covering the first sensing conductive pattern; and a second sensing conductive pattern on the touch intermediate insulating layer, and the upper conductive layer may be formed of the same layer as the layer of the second sensing conductive pattern.

[0014] In an exemplary embodiment, the passivation layer may be formed of the same layer as the layer of the lower touch insulating layer, the touch intermediate insulating layer, or a combination thereof.

[0015] In an exemplary embodiment, the capping layer may be formed of an organic insulating layer covering the source metal pattern, and the thickness of the capping layer may be less than the thickness of the organic insulating layer.

[0016] In an exemplary embodiment, the thickness of the capping layer may be less than or equal to 1 μm.

[0017] In an exemplary embodiment, the intermediate conductive layer may have a multi-layer structure including an aluminum-containing layer.

[0018] In an exemplary embodiment, the first electrode of the light-emitting element may include silver.

[0019] In an exemplary embodiment, the connection pad may be electrically connected to the driving circuit through a conductive bonding member contacting the upper conductive layer.

[0020] According to an exemplary embodiment of the inventive concept, a display device includes: a pixel array at a display area; connection pads at a bonding area, the connection pads including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering at least a side surface of the intermediate conductive layer and including an organic material; a passivation layer covering an upper surface of the cladding layer and including an inorganic material, a part of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pads.

[0021] In the exemplary embodiment, the pixel array may include: a light-emitting element and a driving element electrically connected to the light-emitting element; the driving element may include: a gate metal pattern including a gate electrode; and a source metal pattern including: a drain electrode; or a connection electrode electrically connecting the drain electrode to the light-emitting element; a touch sensor may be on the pixel array and may include a sensing conductive pattern; and the lower conductive layer may be formed of the same layer as a layer of the gate metal pattern, the intermediate conductive layer may be formed of the same layer as a layer of the source metal pattern, and the upper conductive layer may be formed of the same layer as a layer of the sensing conductive pattern.

[0022] In the exemplary embodiment, the cladding layer may be formed of an organic insulating layer covering the source metal pattern, and a thickness of the cladding layer may be less than a thickness of the organic insulating layer.

[0023] In the exemplary embodiment, the intermediate conductive layer may have a multilayer structure including an aluminum-containing layer.

[0024] According to an exemplary embodiment of the inventive concept, a method for manufacturing a display device is provided, the display device including a light-emitting element at a display area, a driving element electrically connected to the light-emitting element, and connection pads at a bonding area. The method includes: forming a lower conductive layer of the connection pads; forming an intermediate conductive layer of the connection pads to be in electrical contact with the lower conductive layer; forming a cladding layer to cover a side surface of the intermediate conductive layer while exposing an upper surface of the intermediate conductive layer; forming a passivation layer to cover an upper surface of the cladding layer; and forming an upper conductive layer of the connection pads to be in electrical contact with the intermediate conductive layer.

[0025] In the exemplary embodiment, the lower conductive layer may be formed of the same layer as a layer of a gate electrode of the driving element; and the intermediate conductive layer may be formed of the same layer as a layer of a drain electrode of the driving element or of the same layer as a layer of a connection electrode that electrically connects the drain electrode to the light-emitting element.

[0026] In an exemplary embodiment, the display device may further include: an encapsulation layer covering the light-emitting element; and a touch sensor on the encapsulation layer and including a sensing conductive pattern, and the upper conductive layer may be formed of the same layer as the layer of the sensing conductive pattern.

[0027] In an exemplary embodiment, the touch sensor may include: a lower touch insulating layer; a first sensing conductive pattern on the lower touch insulating layer; a touch intermediate insulating layer covering the first sensing conductive pattern; and a second sensing conductive pattern on the touch intermediate insulating layer, and the upper conductive layer may be formed of the same layer as the layer of the second sensing conductive pattern.

[0028] In an exemplary embodiment, the passivation layer may be formed of the same layer as the layer of the lower touch insulating layer, the touch intermediate insulating layer, or a combination thereof.

[0029] In an exemplary embodiment, the capping layer may be formed of an organic insulating layer covering a source metal pattern of the driving element, and the capping layer may have a thickness less than the thickness of the organic insulating layer.

[0030] In an exemplary embodiment, the intermediate conductive layer may have a multi-layer structure including an aluminum-containing layer.

[0031] According to one or more exemplary embodiments of the inventive concept, a capping layer may be formed at a bonding region (e.g., in or on the bonding region) to prevent or reduce exposure of a conductive layer containing aluminum. Accordingly, particles due to reduction of metal ions may be prevented or substantially prevented. In addition, the thickness of the capping layer including an organic material may be reduced, and the capping layer may be passivated by an inorganic layer. Accordingly, bonding defects may be prevented or reduced, and the reliability of the display device may be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other aspects and features of the inventive concept will be more clearly understood from the following detailed description of illustrative, non-limiting exemplary embodiments with reference to the accompanying drawings.

[0033] Figure 1 is a plan view showing a display device according to an exemplary embodiment.

[0034] Figure 2 is a view showing Figure 1 an enlarged plan view of region A of

[0035] Figure 3 is a cross-sectional view showing a display area of a display device according to an exemplary embodiment.

[0036] Figure 4It is a plan view showing a sensing electrode of a display device according to an exemplary embodiment.

[0037] Figure 5 It is a cross-sectional view taken along line I-I' in Figure 2 showing a bonding region of a display device according to an exemplary embodiment.

[0038] Figure 6 It is showing Figure 5 an enlarged cross-sectional view of region B.

[0039] Figures 7 to 16 It is a cross-sectional view showing a method for manufacturing a display device according to an exemplary embodiment, wherein Figure 8 , Figure 10 , Figure 12 and Figure 14 are cross-sectional views taken along line I-I' in Figure 2 showing the same.

[0040] Figures 17 to 18 It is a cross-sectional view showing a display device according to various exemplary embodiments. Detailed Description

[0041] Hereinafter, a display device and a method for manufacturing a display device according to an exemplary embodiment of the inventive concept will be described in more detail with reference to the drawings showing some exemplary embodiments. However, the inventive concept may be implemented in various different forms and should not be construed as limited to the embodiments shown herein. Rather, these embodiments are provided as examples so that the present disclosure will be thorough and complete, and will fully convey aspects and features of the inventive concept to those skilled in the art. Accordingly, processes, elements, and techniques that are not necessary for a person of ordinary skill in the art to fully understand aspects and features of the inventive concept may not be described. Unless otherwise indicated, the same reference numerals refer to the same elements throughout the drawings and the written description, and thus, their description may not be repeated.

[0042] In the drawings, for the sake of clarity, the relative dimensions of elements, layers, and regions may be exaggerated and / or simplified. For ease of explanation, spatially relative terms such as "under", "below", "beneath", "underneath", "above", and "on" may be used herein to describe the relationship of one element or feature to another element(s) or feature(s) as shown in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, if the device in the drawings is flipped, an element described as "under", "below", or "beneath" another element or feature will then be oriented "above" the other element or feature. Thus, the example terms "under" and "below" can encompass both an upper and a lower orientation. The device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and thus, the spatially relative descriptors used herein should be interpreted accordingly.

[0043] It will be understood that although the terms "first", "second", "third", etc. may be used herein to describe various elements, components, regions, layers, and / or parts, these elements, components, regions, layers, and / or parts should not be limited by these terms. These terms are used to distinguish one element, component, region, layer, or part from another element, component, region, layer, or part. Thus, a first element, component, region, layer, or part described below may be termed a second element, component, region, layer, or part without departing from the spirit and scope of the inventive concept.

[0044] It will be understood that when an element or layer is referred to as being "on", "connected to", or "coupled to" another element or layer, the element or layer may be directly on, directly connected to, or directly coupled to the other element or layer, or there may be one or more intervening elements or layers. Additionally, it will also be understood that when an element or layer is referred to as being "between" two elements or layers, the element or layer may be the sole element or layer between the two elements or layers, or there may also be one or more intervening elements or layers.

[0045] The terms used herein are for the purpose of describing particular embodiments and are not intended to limit the inventive concept. As used herein, unless the context clearly dictates otherwise, the singular forms "a" and "an" are also intended to include the plural forms. It will also be understood that when used in this specification, the terms "comprises," "comprising," "includes," and "including" specify the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. When an expression such as "at least one" follows a list of elements, it modifies the entire list of elements and not individual elements of the list.

[0046] As used herein, the terms "substantially," "about," and similar terms are used as approximate terms and not as terms of degree, and are intended to account for inherent deviations in measured or calculated values recognized by those of ordinary skill in the art. Further, when describing embodiments of the inventive concept, the use of "may" means "one or more embodiments of the inventive concept." As used herein, the term "use" may be considered synonymous with the term "utilize." Further, the term "exemplary" is intended to represent an example or illustration.

[0047] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the inventive concept pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and / or this specification, and should not be interpreted in an idealized or overly formal sense.

[0048] Figure 1 is a plan view showing a display device according to an exemplary embodiment. Figure 2 is showing Figure 1 an enlarged plan view of region A of

[0049] Referring to Figure 1 , the display device includes a display area DA and a non-display area PA.

[0050] An array of pixels PX may be provided at a display area DA (e.g., within or on the display area DA), and the pixels PX may emit light to display an image. For example, the display device may be an organic light-emitting display device, and each pixel PX may include an organic light-emitting diode and a driving element for driving the organic light-emitting diode. The driving element may include at least one thin-film transistor. The display device may further include: a encapsulation layer that may protect the organic light-emitting diode; and a touch sensing portion (e.g., a touch sensor) provided on the encapsulation layer.

[0051] The non-display area PA may include: a peripheral area PA1 that is adjacent to or surrounds the display area DA (e.g., surrounds the periphery of the display area DA); and a bonding area PA2 where a driving portion (e.g., a driver or a driving circuit) DC may be attached (e.g., bonded).

[0052] The driving portion DC may supply driving signals such as data signals to the pixel array of the display area DA. In an exemplary embodiment, the driving portion DC may include a driving chip that includes an integrated circuit. The driving signals generated by the driving portion DC may be provided to the pixel array of the display area DA through transmission lines TL. For example, the transmission lines TL may extend along a first direction D1.

[0053] In some embodiments, the display device may have an area that is foldable and / or bendable, etc., such that the area has a folded shape or a bent shape. For example, an area between the peripheral area PA1 and the bonding area PA2 may define (e.g., form) a bending area PA3 that may have a curvature when folded or bent, such that the bonding area PA2 may be disposed below the display area DA.

[0054] Connection pads electrically connected to the driving portion DC may be provided at the bonding area PA2 (e.g., within or on the bonding area PA2). For example, a plurality of connection pads may be arranged in a zigzag configuration along a second direction D2 that intersects the first direction D1. For example, as Figure 2 shown, a first connection pad CP1 electrically connected to a first transmission line TL1 may be arranged in a first row (e.g., within or on the first row), and a second connection pad CP2 electrically connected to a second transmission line TL2 may be arranged in a second row (e.g., within or on the second row).

[0055] The connection pads CP1 and CP2 may have a multilayer structure including a plurality of conductive layers. For example, the connection pads CP1 and CP2 may include a combination of conductive layers formed of the same layer as at least two of the gate metal pattern of the driving element, the source metal pattern of the driving element, and the sensing conductive pattern of the touch sensing unit. As used herein, when a layer or pattern is described as being formed of the same layer as another component or layer, the layer or pattern may include the same or substantially the same material as the other component or layer, or may be disposed at the same layer as the other component or layer (e.g., disposed in the same layer as the other component or layer or disposed on the same layer as the other component or layer).

[0056] Figure 3 is a cross-sectional view showing a display area of a display device according to an exemplary embodiment. Figure 4 is a plan view showing a sensing electrode of a display device according to an exemplary embodiment.

[0057] Referring to Figure 3 , in the display area DA (e.g., in the display area DA or on the display area DA), a buffer layer 120 is disposed on the substrate base 110. An active pattern AP is disposed on the buffer layer 120. A first gate metal pattern including a gate electrode GE is disposed on the active pattern AP. A first insulating layer 130 is disposed between the active pattern AP and the gate electrode GE. The first insulating layer 130 may be referred to as a first gate insulating layer.

[0058] A second gate metal pattern including a gate wiring pattern GP is disposed on the gate electrode GE. The gate wiring pattern GP may include a capacitor electrode and / or a signal wiring for transmitting a driving signal, etc. A second insulating layer 140 is disposed between the gate electrode GE and the gate wiring pattern GP. The second insulating layer 140 may be referred to as a second gate insulating layer. A third insulating layer 150 is disposed on the gate wiring pattern GP. The third insulating layer 150 may be referred to as an interlayer insulating layer.

[0059] A source electrode SE and a drain electrode DE are disposed on the third insulating layer 150. The source electrode SE and the drain electrode DE may extend through (e.g., may penetrate) one or more insulating layers disposed thereunder to be electrically connected to (e.g., to contact) the active pattern AP. For example, the source electrode SE and the drain electrode DE may extend through (e.g., may penetrate) each of the first insulating layer 130, the second insulating layer 140, and the third insulating layer 150 to contact a part of the top surface of the active pattern AP. A fourth insulating layer 160 is disposed on the first source metal pattern including the source electrode SE and the drain electrode DE. In an exemplary embodiment, the fourth insulating layer 160 may include an inorganic layer 162 and an organic layer 164 disposed on the inorganic layer 162. The fourth insulating layer 160 may be referred to as a first via insulation layer.

[0060] A second source metal pattern including a connection electrode CE is disposed on the fourth insulating layer 160. The connection electrode CE may be electrically connected to (e.g., may contact) the drain electrode DE. The second source metal pattern may further include a grid-shaped power line to compensate for a voltage drop of a current applied to the organic light emitting diode. A fifth insulating layer 170 is disposed on the second source metal pattern. The fifth insulating layer 170 may be referred to as a second via insulation layer.

[0061] An organic light emitting diode 210 is disposed on the fifth insulating layer 170. For example, a first electrode 212 of the organic light emitting diode 210 may be disposed on the fifth insulating layer 170. The first electrode 212 may be electrically connected to (e.g., may contact) the connection electrode CE. In another exemplary embodiment, the connection electrode CE may be omitted, and the first electrode 212 may be directly electrically connected to (e.g., may contact) the drain electrode DE.

[0062] An organic light emitting layer 214 is disposed on the first electrode 212. For example, at least a part of the organic light emitting layer 214 may be disposed at an opening of the pixel defining layer 180 (e.g., disposed in the opening of the pixel defining layer 180 or disposed on the opening of the pixel defining layer 180). A second electrode 216 is disposed on the organic light emitting layer 214.

[0063] A encapsulation layer 220 is disposed on the second electrode 216. For example, the encapsulation layer 220 may have a stacked structure including at least one organic thin film and at least one inorganic thin film. For example, as Figure 3As shown, the encapsulation layer 220 may include a first inorganic thin film 222, an organic thin film 224 disposed on the first inorganic thin film 222, and a second inorganic thin film 226 disposed on the organic thin film 224. However, the inventive concept is not limited thereto. For example, in another exemplary embodiment, the encapsulation layer 220 may include at least two organic thin films and at least three inorganic thin films, and the organic thin films may be stacked alternately with the inorganic thin films.

[0064] In an exemplary embodiment, a touch sensing unit (e.g., a touch sensor) may be disposed on the encapsulation layer 220. For example, the touch sensing unit may sense an external input by detecting a change in capacitance, thereby obtaining coordinate information of the external input.

[0065] For example, the touch sensing unit may include a lower touch insulating layer 310, a first sensing conductive pattern, a touch intermediate insulating layer 330, a second sensing conductive pattern, and a protective layer 350.

[0066] The first sensing conductive pattern may be disposed on the lower touch insulating layer 310. The first sensing conductive pattern may include a bridging pattern 320. The touch intermediate insulating layer 330 may be disposed on the first sensing conductive pattern. The second sensing conductive pattern may be disposed on the touch intermediate insulating layer 330. The protective layer 350 may cover the second sensing conductive pattern.

[0067] Referring to Figure 3 and Figure 4 , the second sensing conductive pattern may include a first sensing electrode and a second sensing electrode. The first sensing electrode may be electrically insulated from the second sensing electrode. For example, the first sensing electrode may include an array of electrode patterns arranged along a first direction D1. The second sensing electrode may include an array of electrode patterns arranged along a second direction D2 intersecting the first direction D1.

[0068] For example, the first sensing electrode may include a first electrode pattern 342a and a second electrode pattern 342b, and the first electrode pattern 342a and the second electrode pattern 342b are spaced apart from each other along one direction (e.g., along the second direction D2). The first electrode pattern 342a and the second electrode pattern 342b may be electrically connected to (e.g., may contact) the bridging pattern 320 through vias extending through (e.g., through) the touch intermediate insulating layer 330. Accordingly, the first electrode pattern 342a and the second electrode pattern 342b may be electrically connected to each other (e.g., through the bridging pattern 320).

[0069] The second sensing electrode may include a plurality of electrode patterns 343 and a connection part 344 disposed at the same layer as the layer of the electrode patterns 343 (e.g., disposed in the same layer as the layer of the electrode patterns 343 or disposed on the same layer as the layer of the electrode patterns 343). The connection part 344 may be connected to (e.g., continuously connected to) the electrode patterns 343. For example, the connection part 344 may extend between the plurality of electrode patterns 343 or may be integrally formed with the plurality of electrode patterns 343, but the inventive concept is not limited thereto.

[0070] The inventive concept is not limited to Figure 3 and Figure 4 the exemplary embodiments shown therein. For example, the touch sensing unit (e.g., touch sensor) may have various suitable configurations known to those skilled in the art. For example, in another exemplary embodiment, the lower touch insulating layer 310 may be omitted. In addition, electrode patterns adjacent to each other in the first sensing electrode may be connected to a plurality of bridging patterns. Furthermore, the first sensing electrode and the second sensing electrode may be disposed at different layers from each other (e.g., disposed in different layers from each other or disposed on different layers from each other) such that the first sensing electrode may have a continuous shape (e.g., may have an integral shape) without a bridging pattern.

[0071] Figure 5 is a cross-sectional view taken along line I-I' of the bonding region of the display device according to an exemplary embodiment Figure 2 in Figure 6 is a view showing Figure 5 an enlarged cross-sectional view of region B of

[0072] Referring to Figure 5 , at the bonding region PA2 (e.g., in the bonding region PA2 or on the bonding region PA2), connection pads CP1 and CP2 are disposed on the substrate base 110. In one or more exemplary embodiments, the connection pads CP1 and CP2 may each include a lower conductive layer CP1a and CP2a, a first intermediate conductive layer CP1b and CP2b, a second intermediate conductive layer CP1c and CP2c, and an upper conductive layer CP1d and CP2d.

[0073] In an exemplary embodiment, the lower conductive layer CP1a of the first connection pad CP1 may be made of the same material as the first gate metal pattern (e.g., referring to Figure 3 ) disposed at the display area DA (e.g., disposed in the display area DA or disposed on the display area DA) (e.g., referring to Figure 3 and Figure 7) is formed of the same layer as the layer at. For example, the lower conductive layer CP1a may be disposed between the first insulating layer 130 and the second insulating layer 140. The lower conductive layer CP2a of the second connection pad CP2 may be formed of the same layer as the layer of the second gate metal pattern disposed at the display area DA (for example, disposed in the display area DA or on the display area DA). For example, see Figure 3 and Figure 7 ). For example, the lower conductive layer CP2a may be disposed between the second insulating layer 140 and the third insulating layer 150.

[0074] The first intermediate conductive layers CP1b and CP2b of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the first source metal pattern disposed at the display area DA (for example, disposed in the display area DA or on the display area DA). For example, see Figure 3 and Figure 9 ). For example, the first intermediate conductive layer CP1b may be disposed between the second insulating layer 140 and the third insulating layer 150 and the fourth insulating layer, and the first intermediate conductive layer CP2b may be disposed between the third insulating layer 150 and the fourth insulating layer. The fourth insulating layer may include the inorganic layer 162 and not include the organic layer.

[0075] The second intermediate conductive layers CP1c and CP2c of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the second source metal pattern disposed at the display area DA (for example, disposed in the display area DA or on the display area DA). For example, see Figure 3 and Figure 11 ). For example, the second intermediate conductive layers CP1c and CP2c may be disposed on the fourth insulating layer (for example, the inorganic layer 162 of the fourth insulating layer).

[0076] The upper conductive layers CP1d and CP2d of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the sensing conductive pattern of the touch sensing unit disposed at the display area DA (for example, disposed in the display area DA or on the display area DA). For example, the upper conductive layers CP1d and CP2d may be formed of the same layer as the second sensing conductive pattern (for example, see Figure 3 ).

[0077] A cladding layer 172 is disposed at the bonding area PA2 (for example, disposed in the bonding area PA2 or on the bonding area PA2) to cover at least a part of the second intermediate conductive layers CP1c and CP2c. In an exemplary embodiment, the cladding layer 172 may be formed of the same layer as the fifth insulating layer 170 (for example, see Figure 3) is formed of the same layer as the layer of (), and may include an organic material. In an exemplary embodiment, the cladding layer 172 may cover at least the side surfaces of the second intermediate conductive layers CP1c and CP2c. For example, as Figure 5 shown, the cladding layer 172 may be disposed between the second intermediate conductive layers CP1c and CP2c, and may cover at least the side surfaces of the second intermediate conductive layers CP1c and CP2c facing each other.

[0078] A passivation layer including an inorganic material may be disposed on the cladding layer 172. For example, the passivation layer may be formed of the same layer as the layer of the lower touch insulating layer 310 (e.g., see Figure 3 ), the touch intermediate insulating layer 330 (e.g., see Figure 3 ) or a combination thereof. In an exemplary embodiment, the passivation layer may include a lower passivation layer 312 and an upper passivation layer 332. The passivation layer may extend to be partially disposed under the upper conductive layers CP1d and CP2d. For example, the passivation layer may partially overlap each of the upper conductive layers CP1d and CP2d.

[0079] A driving unit (e.g., a driver or a driving circuit) DC including a driving chip may be attached to the bonding region PA2 (e.g., bonded on the bonding region PA2). The driving unit DC may be attached to and electrically connected to the connection pads CP1 and CP2 (e.g., bonded on the connection pads CP1 and CP2) through conductive bonding members BP1 and BP2. For example, the conductive bonding members BP1 and BP2 may include (e.g., may be) metal bumps. The conductive bonding members BP1 and BP2 may be electrically connected to the connection pads CP1 and CP2 and the connection terminals CT1 and CT2 electrically connected to the driving unit DC, such that a driving signal may be transmitted from the driving unit DC to the connection pads CP1 and CP2. In another exemplary embodiment, an anisotropic conductive film including conductive balls or the like may be used for the conductive bonding members.

[0080] Referring to Figure 6 , each of the second intermediate conductive layers CP1c and CP2c may include an upper layer UL, a middle layer ML, and a lower layer LL. In an exemplary embodiment, the upper layer UL and the lower layer LL may include metals having a relatively small ionization tendency such as titanium for example. The middle layer ML may include metals having a relatively large ionization tendency such as aluminum for example.

[0081] The cladding layer 172 covers at least the side surfaces of the second intermediate conductive layers CP1c and CP2c. Therefore, at least a part of the upper surface of the upper layer UL may be exposed without being covered by the cladding layer 172, and the middle layer ML may not be exposed.

[0082] In an exemplary embodiment, the thickness T2 of the cladding layer 172 may be less than (e.g., smaller than) the thickness T1 of the fifth insulating layer 170 (e.g., see Figure 3 ). Accordingly, the height of the upper surface of the cladding layer 172 may be lower than the height of the upper surfaces of the upper conductive layers CP1d and CP2d. In an exemplary embodiment, the height of the upper surface of the cladding layer 172 may be lower than the height of the upper surfaces of the second intermediate conductive layers CP1c and CP2c. For example, the thickness T2 of the cladding layer 172 may be less than or equal to 1 μm (e.g., 1 micron), and may be greater than the thicknesses of the second intermediate conductive layers CP1c and CP2c.

[0083] Figures 7 to 16 is a cross-sectional view showing a method for manufacturing a display device according to an exemplary embodiment, where Figure 8 , Figure 10 , Figure 12 and Figure 14 are cross-sectional views taken along the line I-I' in Figure 2 .

[0084] Referring to Figure 7 , in the display area DA (e.g., in or on the display area DA), a buffer layer 120 is formed on the substrate substrate 110.

[0085] For example, the substrate substrate 110 may include glass, quartz, silicon, and / or polymer materials, etc. In an exemplary embodiment, the substrate substrate 110 may be a flexible substrate including a polymer material. For example, the polymer material may include polyethylene terephthalate, polyethylene naphthalate, polyether ketone, polycarbonate, polyaryl compound, polyethersulfone, polyimide, or a combination thereof.

[0086] The buffer layer 120 may prevent or reduce the infiltration of impurities, moisture, and / or external gases from below the substrate substrate 110, and may planarize the upper surface of the substrate substrate 110. For example, the buffer layer 120 may include an inorganic material such as silicon oxide and / or silicon nitride, etc. or a combination thereof.

[0087] An active pattern AP is formed on the buffer layer 120.

[0088] For example, the active pattern AP may include a semiconductor material such as amorphous silicon, polysilicon (polysilicon), and / or metal oxide, etc. When the active pattern AP includes polysilicon, at least a part of the active pattern AP may be doped with impurities such as n-type impurities or p-type impurities as examples.

[0089] In another exemplary embodiment, the active pattern AP may include a metal oxide semiconductor. For example, the active pattern AP may include a binary compound (AB x) A ternary compound (AB x C y ) or a quaternary compound (AB x C y D z ), a binary compound (AB x ), a ternary compound (AB x C y ) or a quaternary compound (AB x C y D z ) may include indium (In), zinc (Zn), gallium (Ga), tin (Sn), titanium (Ti), aluminum (Al), hafnium (Hf), zirconium (Zr), and / or magnesium (Mg), etc. For example, the active pattern may include zinc oxide (ZnO x ), gallium oxide (GaO x ), titanium oxide (TiO x ), tin oxide (SnO x ), indium oxide (InO x ), indium gallium oxide (IGO), indium zinc oxide (IZO), indium tin oxide (ITO), gallium zinc oxide (GZO), zinc magnesium oxide (ZMO), zinc tin oxide (ZTO), zinc zirconium oxide (ZnZr x O y ), indium gallium zinc oxide (IGZO), indium zinc tin oxide (IZTO), indium gallium hafnium oxide (IGHO), tin aluminum zinc oxide (TAZO), and / or indium gallium tin oxide (IGTO), etc.

[0090] A first insulating layer 130 is formed on the active pattern AP. A first gate metal pattern including a gate electrode GE is formed on the first insulating layer 130. The gate electrode GE overlaps the active pattern AP. A second insulating layer 140 is formed to cover the first gate metal pattern. A second gate metal pattern including a gate wiring pattern GP is formed on the second insulating layer 140.

[0091] For example, the first insulating layer 130 and the second insulating layer 140 may each include silicon oxide, silicon nitride, silicon carbide, or a combination thereof. In addition, the first insulating layer 130 and the second insulating layer 140 may include insulating metal oxides, such as, for example, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and / or titanium oxide, etc. For example, the first insulating layer 130 and the second insulating layer 140 may each have a single-layer structure or a multi-layer structure, and the single-layer structure or multi-layer structure may include silicon nitride and / or silicon oxide.

[0092] For example, the first gate metal pattern and the second gate metal pattern may each include gold (Au), silver (Ag), aluminum (Al), copper (Cu), nickel (Ni), platinum (Pt), magnesium (Mg), chromium (Cr), tungsten (W), molybdenum (Mo), titanium (Ti), tantalum (Ta), or an alloy thereof. The first gate metal pattern and the second gate metal pattern may each have a single-layer structure or a multi-layer structure including different metal layers stacked on each other.

[0093] Referring to Figure 8 , a lower conductive layer of the connection pad is formed at the bonding region PA2 (e.g., in or on the bonding region PA2).

[0094] In an exemplary embodiment, the lower conductive layer CP1a of the first connection pad may be formed of the same layer as the layer of the first gate metal pattern, and the lower conductive layer CP2a of the second connection pad may be formed of the same layer as the layer of the second gate metal pattern. Accordingly, the lower conductive layer CP1a of the first connection pad may be disposed between the first insulating layer 130 and the second insulating layer 140, and the lower conductive layer CP2a of the second connection pad may be disposed on the second insulating layer 140.

[0095] In addition, Figure 2 the transmission lines TL1 and TL2 shown in

[0096] Referring to Figure 9 , the third insulating layer 150 is formed at the display area DA (e.g., in or on the display area DA) to cover the second gate metal pattern. Thereafter, a first source metal pattern is formed on the third insulating layer 150. The first source metal pattern may include a source electrode SE and a drain electrode DE that are electrically connected to (e.g., in electrical contact with) the active pattern AP. For example, the source electrode SE and the drain electrode DE may extend through (e.g., pass through) the third insulating layer 150, the second insulating layer 140, and the first insulating layer 130 to be electrically connected to (e.g., in electrical contact with) the active pattern AP.

[0097] Referring to Figure 10 , a first intermediate conductive layer of the connection pad is formed at the bonding region PA2 (e.g., in or on the bonding region PA2).

[0098] In an exemplary embodiment, the first intermediate conductive layer CP1b of the first connection pad and the first intermediate conductive layer CP2b of the second connection pad may be formed of the same layer as the layer of the first source metal pattern including the source electrode SE and the drain electrode DE. Accordingly, the first intermediate conductive layers CP1b and CP2b may be disposed on the third insulating layer 150.

[0099] For example, the first intermediate conductive layer CP1b of the first connection pad may extend through (e.g., may pass through) the third insulating layer 150 and the second insulating layer 140 to be electrically connected to the lower conductive layer CP1a. The first intermediate conductive layer CP2b of the second connection pad may extend through (e.g., may pass through) the third insulating layer 150 to be electrically connected to the lower conductive layer CP2a.

[0100] Refer to Figure 11 , the fourth insulating layer 160 is formed to cover the first source metal pattern. In an exemplary embodiment, the fourth insulating layer 160 may include an inorganic layer 162 disposed on the first source metal pattern and an organic layer 164 disposed on the inorganic layer 162. For example, in an exemplary embodiment, the inorganic layer 162 of the fourth insulating layer 160 may be disposed between the first source metal pattern and the organic layer 164 to contact the first source metal pattern, but the inventive concept is not limited thereto. For example, in another exemplary embodiment, the fourth insulating layer 160 may include the organic layer 164 without including the inorganic layer 162.

[0101] A second source metal pattern is formed on the fourth insulating layer 160. The second source metal pattern may include a connection electrode CE electrically connected to (e.g., in electrical contact with) the drain electrode DE. For example, the connection electrode CE may extend through (e.g., may pass through) the fourth insulating layer 160 to be electrically connected to (e.g., in electrical contact with) the drain electrode DE. The second source metal pattern may further include a mesh-shaped power line to compensate for a voltage drop of a current applied to the organic light-emitting diode.

[0102] The fifth insulating layer 170 is formed to cover the second source metal pattern. The fifth insulating layer 170 may include an opening to expose at least a part of an upper surface of the connection electrode CE.

[0103] For example, the first source metal pattern and the second source metal pattern may include gold, silver, aluminum, copper, nickel, platinum, magnesium, chromium, tungsten, molybdenum, titanium, tantalum, or an alloy thereof, and may have a single-layer structure or a multi-layer structure including different metal layers. In an exemplary embodiment, the first source metal pattern and the second source metal pattern may include at least one layer including aluminum or an aluminum alloy. For example, the first source metal pattern and the second source metal pattern may each have a double-layer structure of titanium / aluminum or a triple-layer structure of titanium / aluminum / titanium.

[0104] For example, each of the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may include silicon oxide, silicon nitride, silicon carbide, or a combination thereof. In addition, the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may include insulating metal oxides, such as, for example, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, or titanium oxide. For example, the inorganic layers 162 of the third insulating layer 150 and the fourth insulating layer 160 may each have a single-layer structure or a multi-layer structure, and the single-layer structure or multi-layer structure may include silicon nitride and / or silicon oxide.

[0105] For example, the organic layers 164 of the fifth insulating layer 170 and the fourth insulating layer 160 may include organic insulating materials, such as phenolic resin, acrylic resin, polyimide resin, polyamide resin, epoxy resin, and / or benzocyclobutene.

[0106] Referring to Figure 12 , a second intermediate conductive layer for connecting the pads is formed at the bonding region PA2 (e.g., in or on the bonding region PA2).

[0107] In an exemplary embodiment, the fourth insulating layer 160 formed on the first intermediate conductive layers CP1b and CP2b may include an inorganic layer 162 and not include an organic layer (e.g., not include the organic layer 164). For example, during the process of patterning the organic layer 164 at the display region DA (e.g., in or on the display region DA), the organic layer 164 provided at the bonding region PA2 (e.g., in or on the bonding region PA2) may be removed (e.g., completely removed), or the organic layer 164 may not be provided at the bonding region PA2 (e.g., in or on the bonding region PA2).

[0108] The second intermediate conductive layers CP1c and CP2c may be formed on the inorganic layer 162 and may extend through (e.g., pass through) the inorganic layer 162 to be electrically connected to (e.g., make electrical contact with) the first intermediate conductive layers CP1b and CP2b, respectively. In an exemplary embodiment, the second intermediate conductive layers CP1c and CP2c may be formed of the same layer as the layer of the connection electrode CE.

[0109] A cladding layer 172 is formed at the bonding region PA2 (e.g., in or on the bonding region PA2) to cover at least a portion of the second intermediate conductive layers CP1c and CP2c. In an exemplary embodiment, the cladding layer 172 may be formed of the same layer as the layer of the fifth insulating layer 170.

[0110] For example, the fifth insulating layer 170 and the cover layer 172 may be formed by a photolithography process using halftone exposure. For example, a photoresist composition may be coated at the display area DA (e.g., in or on the display area DA) and at the bonding area PA2 (e.g., in or on the bonding area PA2), and the photoresist composition may be exposed to light such that the amount of light for the area corresponding to the fifth insulating layer 170 is different from the amount of light for the area corresponding to the cover layer 172. Thus, the fifth insulating layer 170 and the cover layer 172 having a thickness different from the thickness of the fifth insulating layer 170 may be formed during the same or substantially the same process.

[0111] Referring Figure 13 and Figure 14 , a lower electrode layer is formed on the fifth insulating layer 170 and the cover layer 172, and the lower electrode layer may be patterned to form the first electrode 212 of the light-emitting diode at the display area DA (e.g., in or on the display area DA). The lower electrode layer 211 may be removed (e.g., completely removed) at the bonding area PA2 (e.g., in or on the bonding area PA2).

[0112] In an exemplary embodiment, the lower electrode layer 211 may have a multilayer structure including a metal oxide layer and a metal layer. The metal oxide layer may include, for example, indium tin oxide, indium zinc oxide, zinc oxide tin, indium oxide, zinc oxide, tin oxide, or a combination thereof. The metal layer may include, for example, gold, silver, aluminum, copper, nickel, platinum, magnesium, chromium, tungsten, molybdenum, titanium, or a combination thereof.

[0113] In an exemplary embodiment, the lower electrode layer 211 may include silver. When the lower electrode layer 211 includes silver, silver ions may dissolve in the etchant during the process of etching the lower electrode layer 211. When the silver ion-containing etchant contacts aluminum having a greater ionization tendency, silver particles may be formed by electroreduction. The silver particles may be transferred to the first electrode 212, may contaminate the strip apparatus, and / or may cause a short circuit between the touch sensing electrodes formed during one or more subsequent processes. Thus, the reliability of the display device may be deteriorated.

[0114] According to an exemplary embodiment, the cover layer 172 covers the aluminum-containing layer of the connection pad. Thus, the above-discussed silver particles and the problems caused by them may be prevented or substantially prevented. Thus, the reliability of the display device may be improved.

[0115] Referring Figure 15, a pixel defining layer 180 is formed at the display area DA (e.g., in or on the display area DA). The pixel defining layer 180 may have an opening exposing at least a part of the first electrode 212. For example, the pixel defining layer 180 may include an organic insulating material that can be used to form the fifth insulating layer 170 and the like.

[0116] An organic light-emitting layer 214 is formed on the first electrode 212. For example, the organic light-emitting layer 214 may be formed at the opening of the pixel defining layer 180 (e.g., in or on the opening of the pixel defining layer 180). However, the inventive concept is not limited thereto. For example, the organic light-emitting layer 214 may extend above the upper surface of the pixel defining layer 180, and / or the organic light-emitting layer 214 may be formed as a common layer that extends over a plurality of pixels at the display area DA (e.g., in or on the display area DA).

[0117] The organic light-emitting layer 214 may include at least a light-emitting layer, and may also include at least one of a hole injection layer (HIL), a hole transport layer (HTL), an electron transport layer (ETL), and an electron injection layer (EIL). For example, the organic light-emitting layer 214 may include a low molecular weight organic compound or a high molecular weight organic compound.

[0118] In an exemplary embodiment, the organic light-emitting layer 214 may emit red, green, or blue light. In another exemplary embodiment, the organic light-emitting layer 214 may emit white light. When the organic light-emitting layer 214 emits white light, the organic light-emitting layer 214 may have a multilayer structure including a red emission layer, a green emission layer, and a blue emission layer, or the organic light-emitting layer 214 may have a single-layer structure including a mixture of a red emission material, a green emission material, and a blue emission material.

[0119] A second electrode 216 is formed on the organic light-emitting layer 214. The second electrode 216 may be formed as a common layer that extends over a plurality of pixels at the display area DA (e.g., in or on the display area DA).

[0120] In an exemplary embodiment, the second electrode 216 may be used as a cathode. For example, according to the emission type of the display device, the second electrode 216 may be formed as a transmissive electrode or a reflective electrode. For example, when the second electrode 216 is a transmissive electrode, the second electrode 216 may include lithium (Li), calcium (Ca), lithium fluoride, aluminum, magnesium, indium tin oxide, indium zinc oxide, zinc oxide tin, indium oxide, zinc oxide, tin oxide, or a combination thereof.

[0121] The encapsulation layer 220 may be disposed on the second electrode 216. For example, the encapsulation layer 220 may include a first inorganic thin film 222, an organic thin film 224 disposed on the first inorganic thin film 222, and a second inorganic thin film 226 disposed on the organic thin film 224.

[0122] For example, the organic thin film 224 may include a solidifying resin such as polyacrylate. For example, the solidifying resin may be formed by a crosslinking reaction of monomers. For example, the inorganic thin films 222 and 226 may include inorganic materials such as silicon oxide, silicon nitride, silicon carbide, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and / or titanium oxide.

[0123] The pixel defining layer 180, the organic light emitting layer 214, the second electrode 216, and the encapsulation layer 220 may not be formed at the bonding region PA2 (e.g., not formed in the bonding region PA2 or not formed on the bonding region PA2), or the pixel defining layer 180, the organic light emitting layer 214, the second electrode 216, and the encapsulation layer 220 may be removed at the bonding region PA2 (e.g., in the bonding region PA2 or on the bonding region PA2).

[0124] In an exemplary embodiment, a touch sensing unit (e.g., a touch sensor) may be formed on the encapsulation layer 220.

[0125] For example, a lower touch insulating layer 310 may be formed on the encapsulation layer 220. A first sensing conductive pattern may be formed on the lower touch insulating layer 310. The first sensing conductive pattern may include a bridging pattern 320. A touch intermediate insulating layer 330 may be formed on the first sensing conductive pattern. A via may be formed through the touch intermediate insulating layer 330 to expose the bridging pattern 320.

[0126] Referring to Figure 16 , at the bonding region PA2 (e.g., in the bonding region PA2 or on the bonding region PA2), a passivation layer is formed on the second intermediate conductive layers CP1c and CP2c and the cladding 172. For example, the passivation layer may include a lower passivation layer 312 formed of the same layer as the layer of the lower touch insulating layer 310 and an upper passivation layer 332 formed of the same layer as the layer of the touch intermediate insulating layer 330. The passivation layer may have vias exposing the second intermediate conductive layers CP1c and CP2c.

[0127] Thereafter, as Figure 3 and Figure 5As shown, a second sensing conductive pattern is formed at the display area DA (e.g., in or on the display area DA), and upper conductive layers CP1d and CP2d connecting the connection pads CP1 and CP2 are formed at the bonding area PA2 (e.g., in or on the bonding area PA2). The upper conductive layers CP1d and CP2d may extend through (e.g., may pass through) the passivation layer to be electrically connected to (e.g., to make electrical contact with) the second intermediate conductive layers CP1c and CP2c.

[0128] The lower touch insulating layer 310 and the touch intermediate insulating layer 330 may each include an inorganic insulating material. For example, the lower touch insulating layer 310 and the touch intermediate insulating layer 330 may each include silicon oxide, silicon nitride, silicon carbide, or a combination thereof. In addition, the lower touch insulating layer 310 and the touch intermediate insulating layer 330 may include insulating metal oxides, such as, for example, aluminum oxide, tantalum oxide, hafnium oxide, zirconium oxide, and / or titanium oxide. In an exemplary embodiment, the lower touch insulating layer 310 and the touch intermediate insulating layer 330 may include silicon nitride.

[0129] The first sensing conductive pattern and the second sensing conductive pattern include a conductive material. For example, the first sensing conductive pattern and the second sensing conductive pattern may each include a metal, a conductive metal oxide, a conductive polymer, graphene, carbon nanotubes, or a combination thereof. For example, the metal may include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. For example, the metal may be provided in the form of a continuous thin film or nanowires. For example, the conductive metal oxide may include indium tin oxide, indium zinc oxide, zinc oxide tin, indium oxide, zinc oxide, tin oxide, or a combination thereof. The first sensing conductive pattern and the second sensing conductive pattern may each have a single-layer structure or a multi-layer structure including different materials.

[0130] Thereafter, a driving part (e.g., a driver or a driving circuit) DC including a driving chip may be attached to the bonding area PA2 (e.g., may be bonded to the bonding area PA2). In an exemplary embodiment, the driving part DC may be attached to (e.g., may be bonded to) the bonding area PA2 by thermocompression and / or ultrasonic welding, etc., and may be electrically connected to the connection pads CP1 and CP2 through the conductive bonding members BP1 and BP2.

[0131] According to one or more exemplary embodiments, the cladding 172 including the organic material is not exposed to the outside (e.g., is not exposed to the exterior). Thus, it is possible to prevent or substantially prevent the cladding 172 from absorbing moisture and / or swelling in an environment with high humidity and / or high temperature. Thus, it is possible to prevent or reduce bonding defects such as, for example, interface separation of the connection pads and the bonding members.

[0132] In addition, the cover layer 172 has a reduced thickness. Accordingly, protrusion of the cover layer 172 can be prevented or substantially prevented. Accordingly, the influence caused by the expansion of the cover layer 172 can be reduced, and the contact area between the connection pads and the bonding members can be increased.

[0133] Figure 17 and Figure 18 are cross-sectional views showing display devices according to various exemplary embodiments.

[0134] Referring Figure 17 , the connection pads CP1 and CP2 disposed at the bonding region PA2 (e.g., disposed in the bonding region PA2 or on the bonding region PA2) may include lower conductive layers CP1a and CP2a, first intermediate conductive layers CP1b and CP2b, second intermediate conductive layers CP1c and CP2c, third intermediate conductive layers CP1e and CP2e, and upper conductive layers CP1d and CP2d, respectively.

[0135] In an exemplary embodiment, the lower conductive layer CP1a of the first connection pad CP1 may be formed of the same layer as the layer of the first gate metal pattern disposed at the display region (e.g., disposed in the display region or on the display region). For example, the lower conductive layer CP1a may be disposed between the first insulating layer 130 and the second insulating layer 140. The lower conductive layer CP2a of the second connection pad CP2 may be formed of the same layer as the layer of the second gate metal pattern disposed at the display region (e.g., disposed in the display region or on the display region). For example, the lower conductive layer CP2a may be disposed between the second insulating layer 140 and the third insulating layer 150.

[0136] The first intermediate conductive layers CP1b and CP2b of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the first source metal pattern disposed at the display region (e.g., disposed in the display region or on the display region). For example, the first intermediate conductive layer CP1b may be disposed between the second insulating layer 140, the third insulating layer 150, and the fourth insulating layer, and the first intermediate conductive layer CP2b may be disposed between the third insulating layer 150 and the fourth insulating layer. The fourth insulating layer may include the inorganic layer 162 and not include an organic layer.

[0137] The second intermediate conductive layers CP1c and CP2c of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the second source metal pattern disposed at the display region (e.g., disposed in the display region or on the display region). For example, the second intermediate conductive layers CP1c and CP2c may be disposed on the fourth insulating layer.

[0138] The third intermediate conductive layers CP1e and CP2e connecting the connection pads CP1 and CP2 may be formed of the same layer as the layer of the sensing conductive pattern of the touch sensing unit provided in the display area (e.g., provided in or on the display area). For example, the third intermediate conductive layers CP1e and CP2e may be formed of the same layer as the layer of the first sensing conductive pattern.

[0139] The upper conductive layers CP1d and CP2d connecting the connection pads CP1 and CP2 may be formed of the same layer as the layer of the sensing conductive pattern of the touch sensing unit provided in the display area (e.g., provided in or on the display area). For example, the upper conductive layers CP1d and CP2d may be formed of the same layer as the layer of the second sensing conductive pattern.

[0140] The cladding layer 172 is provided at the bonding region PA2 (e.g., provided in or on the bonding region PA2) to cover at least a part of the second intermediate conductive layers CP1c and CP2c. In an exemplary embodiment, the cladding layer 172 may be formed of the same layer as the layer of the fifth insulating layer provided in the display area (e.g., provided in or on the display area), and may include an organic material. In an exemplary embodiment, the cladding layer 172 may cover at least the side surfaces of the second intermediate conductive layers CP1c and CP2c.

[0141] A passivation layer including an inorganic material may be provided on the cladding layer 172. For example, the passivation layer may be formed of the same layer as the lower touch insulating layer 310 (e.g., see Figure 3 ), the touch intermediate insulating layer 330 (e.g., see Figure 3 ) or a combination thereof. In an exemplary embodiment, the passivation layer may include a lower passivation layer 312 and an upper passivation layer 332. The passivation layer may extend to be partially provided under the upper conductive layers CP1d and CP2d.

[0142] In an exemplary embodiment, the third intermediate conductive layers CP1e and CP2e may be partially provided between the lower passivation layer 312 and the upper passivation layer 332.

[0143] Referring to Figure 18 , the connection pads CP1 and CP2 provided at the bonding region PA2 (e.g., provided in or on the bonding region PA2) may include lower conductive layers CP1a and CP2a, intermediate conductive layers CP1b and CP2b, and upper conductive layers CP1d and CP2d, respectively.

[0144] In an exemplary embodiment, the lower conductive layer CP1a of the first connection pad CP1 may be formed of the same layer as the layer of the first gate metal pattern provided in the display area (e.g., provided in or on the display area). For example, the lower conductive layer CP1a may be disposed between the first insulating layer 130 and the second insulating layer 140. The lower conductive layer CP2a of the second connection pad CP2 may be formed of the same layer as the layer of the second gate metal pattern provided in the display area (e.g., provided in or on the display area). For example, the lower conductive layer CP2a may be disposed between the second insulating layer 140 and the third insulating layer 150.

[0145] The intermediate conductive layers CP1b and CP2b of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the first source metal pattern or the second source metal pattern provided in the display area (e.g., provided in or on the display area).

[0146] The upper conductive layers CP1d and CP2d of the connection pads CP1 and CP2 may be formed of the same layer as the layer of the sensing conductive pattern of the touch sensing portion provided in the display area (e.g., provided in or on the display area). For example, the upper conductive layers CP1d and CP2d may be formed of the same layer as the layer of the second sensing conductive pattern.

[0147] A cover layer 172 is disposed at the bonding region PA2 (e.g., provided in or on the bonding region PA2) to cover at least a portion of the intermediate conductive layers CP1b and CP2b. In an exemplary embodiment, the cover layer 172 may include an organic material. In an exemplary embodiment, the cover layer 172 may cover at least the side surfaces of the intermediate conductive layers CP1b and CP2b.

[0148] A passivation layer including an inorganic material may be disposed on the cover layer 172. For example, the passivation layer may be formed of the same layer as the layer of the lower touch insulating layer 310 (e.g., see Figure 3 ), the touch intermediate insulating layer 330 (e.g., see Figure 3 ) or a combination thereof. In an exemplary embodiment, the passivation layer may include a lower passivation layer 312 and an upper passivation layer 332. The passivation layer may extend to be partially disposed under the upper conductive layers CP1d and CP2d.

[0149] As Figure 17 and Figure 18As shown, connection pads in one or more exemplary embodiments may have various configurations. However, the inventive concept is not limited to the examples shown in the exemplary embodiments described herein, and within the spirit and scope of the inventive concept, connection pads may have various suitable or desired configurations known to those skilled in the art.

[0150] For example, when the touch sensing part (e.g., touch sensor) of the display device does not include a lower touch insulating layer, the passivation layer at the bonding region (e.g., in or on the bonding region) may have a single-layer structure.

[0151] For example, the layer for forming the upper conductive layer of the connection pad is not limited to the conductive layer for forming a capacitive touch sensing part (e.g., touch sensor), and the conductive layer for forming a touch sensing part (e.g., touch sensor) with various suitable types or sensors may be used to form the upper conductive layer.

[0152] For example, the layer for forming the cladding layer is not limited to the second via insulating layer. The cladding layer may be formed of the same layer as the first via insulating layer or may be formed separately.

[0153] For example, the lower conductive layer of the first connection pad and the lower conductive layer of the second connection pad may be formed of the same layer.

[0154] Furthermore, the inventive concept is not limited to a display device including a connection pad that includes an aluminum-containing layer. For example, the connection pad may include various suitable or desired metals or alloys thereof.

[0155] One or more exemplary embodiments of the inventive concept may be applied to various display devices. In an exemplary embodiment, for example, one or more exemplary embodiments may be applied to vehicle display devices, ship display devices, aircraft display devices, portable communication devices, display devices for display and / or for information transmission, and / or medical display devices, etc.

[0156] The foregoing is an illustration of exemplary embodiments and is not to be construed as a limitation thereof. Although some exemplary embodiments have been described, those skilled in the art will readily understand that various modifications can be made in the exemplary embodiments without departing from the aspects and features of the inventive concept. Therefore, all such modifications are intended to be included within the spirit and scope of the inventive concept. Accordingly, it will be understood that the foregoing is an illustration of various exemplary embodiments and will not be construed as limited to the specific exemplary embodiments disclosed herein, and various modifications to the disclosed exemplary embodiments and other exemplary embodiments are intended to be included within the spirit and scope of the inventive concept as set forth in this disclosure and its equivalents.

Claims

1. A display device, wherein, The display device includes: a light-emitting element at a display area; a driving element electrically connected to the light-emitting element; a encapsulation layer covering the light-emitting element; a touch sensor on the encapsulation layer; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering side surfaces of the intermediate conductive layer while exposing an upper surface of the intermediate conductive layer, and the cladding layer includes an organic material; a passivation layer covering an upper surface of the cladding layer, covering and contacting the intermediate conductive layer, and the passivation layer includes an inorganic material, a part of the passivation layer being located under the upper conductive layer; and a driving circuit attached to the connection pad.

2. The display device according to claim 1, wherein, The driving element includes: a gate metal pattern including a gate electrode; and a source metal pattern including a drain electrode or a connection electrode electrically connecting the drain electrode to the light-emitting element, and wherein the touch sensor includes a sensing conductive pattern.

3. The display device according to claim 2, wherein, The lower conductive layer is formed of the same layer as a layer of the gate metal pattern, the intermediate conductive layer is formed of the same layer as a layer of the source metal pattern, and the upper conductive layer is formed of the same layer as a layer of the sensing conductive pattern.

4. The display device according to claim 3, wherein, The source metal pattern includes: a first source metal pattern including the drain electrode and a second source metal pattern including the connection electrode, and wherein the intermediate conductive layer includes: a first intermediate conductive layer formed of the same layer as a layer of the first source metal pattern and a second intermediate conductive layer formed of the same layer as a layer of the second source metal pattern.

5. The display device according to claim 4, wherein, The connection pad further includes: a third intermediate conductive layer between the second intermediate conductive layer and the upper conductive layer.

6. The display device according to claim 2, wherein, The touch sensor includes: a lower touch insulating layer; a first sensing conductive pattern on the lower touch insulating layer; a touch intermediate insulating layer covering the first sensing conductive pattern; and a second sensing conductive pattern on the touch intermediate insulating layer, and wherein the upper conductive layer is formed of the same layer as a layer of the second sensing conductive pattern.

7. The display device according to claim 6, wherein, The passivation layer is formed of the same layer as a layer of the lower touch insulating layer, the touch intermediate insulating layer, or a combination thereof.

8. The display device according to claim 2, wherein, The cladding layer is formed of an organic insulating layer covering the source metal pattern, and a thickness of the cladding layer is less than a thickness of the organic insulating layer.

9. The display device according to claim 8, wherein, The thickness of the cladding layer is less than or equal to 1 μm.

10. The display device according to claim 1, wherein, The intermediate conductive layer has a multilayer structure including an aluminum-containing layer.

11. The display device according to claim 10, wherein, A first electrode of the light-emitting element includes silver.

12. The display device according to claim 1, wherein, The connection pad is electrically connected to the driving circuit through a conductive bonding member contacting the upper conductive layer.

13. A display device, wherein, The display device includes: a pixel array at a display area; a connection pad at a bonding area, the connection pad including a lower conductive layer, an intermediate conductive layer on the lower conductive layer, and an upper conductive layer on the intermediate conductive layer; a cladding layer covering side surfaces of the intermediate conductive layer while exposing an upper surface of the intermediate conductive layer, and the cladding layer includes an organic material; A passivation layer, covering the upper surface of the cladding layer, covering and contacting the intermediate conductive layer, and the passivation layer includes an inorganic material, and a part of the passivation layer is located under the upper conductive layer; and A driving circuit, attached to the connection pad.

14. The display device according to claim 13, wherein: The pixel array includes a light-emitting element and a driving element electrically connected to the light-emitting element; The driving element includes: A gate metal pattern including a gate electrode; and A source metal pattern including: A drain electrode; or A connection electrode electrically connecting the drain electrode to the light-emitting element; A touch sensor is on the pixel array and includes a sensing conductive pattern; and The lower conductive layer is formed of the same layer as the layer of the gate metal pattern, the intermediate conductive layer is formed of the same layer as the layer of the source metal pattern, and the upper conductive layer is formed of the same layer as the layer of the sensing conductive pattern.

15. The display device according to claim 14, wherein, The cladding layer is formed of an organic insulating layer covering the source metal pattern, and the thickness of the cladding layer is less than the thickness of the organic insulating layer.

16. The display device according to claim 13, wherein, The intermediate conductive layer has a multi-layer structure including an aluminum-containing layer.

17. A method for manufacturing a display device, the display device including a light-emitting element at a display area, a driving element electrically connected to the light-emitting element, and a connection pad at a bonding area, wherein, The method includes: Forming a lower conductive layer of the connection pad; Forming an intermediate conductive layer of the connection pad to electrically contact the lower conductive layer; Forming a cladding layer to cover the side surface of the intermediate conductive layer while exposing the upper surface of the intermediate conductive layer; Forming a passivation layer to cover the upper surface of the cladding layer and cover and contact the intermediate conductive layer; and Forming an upper conductive layer of the connection pad to electrically contact the intermediate conductive layer.

18. The method according to claim 17, wherein: The lower conductive layer is formed of the same layer as the layer of the gate electrode of the driving element; and The intermediate conductive layer is formed of the same layer as the layer of the drain electrode of the driving element or the same layer as the layer of the connection electrode that electrically connects the drain electrode to the light-emitting element.

19. The method according to claim 18, wherein, The display device further includes: A packaging layer, covering the light-emitting element; and A touch sensor, on the packaging layer and including a sensing conductive pattern, and wherein, the upper conductive layer is formed of the same layer as the layer of the sensing conductive pattern.

20. The method according to claim 19, wherein, The touch sensor includes: A lower touch insulating layer; A first sensing conductive pattern, on the lower touch insulating layer; A touch intermediate insulating layer, covering the first sensing conductive pattern; and A second sensing conductive pattern, on the touch intermediate insulating layer, and wherein, the upper conductive layer is formed of the same layer as the layer of the second sensing conductive pattern.

21. The method according to claim 20, wherein, The passivation layer is formed of the same layer as the layer of the lower touch insulating layer, the touch intermediate insulating layer, or a combination thereof.

22. The method according to claim 18, wherein The cladding layer is formed of an organic insulating layer covering the source metal pattern of the driving element, and the cladding layer has a thickness less than the thickness of the organic insulating layer.

23. The method according to claim 17, wherein, The intermediate conductive layer has a multi-layer structure including an aluminum-containing layer.

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