Display device

Abstract

The present disclosure relates to a display device, which includes: a display panel, a side surface electrode, and a flexible film; the display panel includes a display area, a non-display area defined outside the display area, pixels arranged in the display area, signal lines connected to the pixels, and connection pads extending from the signal lines and arranged in the non-display area; the side surface electrode is arranged on one side surface of the display panel and contacts one side surface of the connection pad; the flexible film includes a driving electrode contacting the side surface electrode; the connection pad includes a first electrode layer and a second electrode layer, the first electrode layer includes a plurality of first electrodes, and the second electrode layer is arranged on the first electrode layer and includes a plurality of second electrodes; the first electrode layer and the second electrode layer have different hardnesses.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims priority to and the benefit of Korean Patent Application No. 10-2019-0088991, filed on Jul. 23, 2019, which is hereby incorporated by reference for all purposes as if fully set forth herein. Technical Field

[0003] Exemplary embodiments of the present disclosure relate to a display device, and more particularly, to a display device with a reduced bezel width. Background Art

[0004] Typically, a display device includes a display panel containing pixels and a driver chip that drives the pixels. The driver chip is disposed on a flexible film, and the flexible film is connected to the display panel. The driver chip is connected to the pixels of the display panel via the flexible film. This connection method is called a "chip-on-film" method.

[0005] The pads connected to the driving chip are arranged on the flexible film, and the display panel includes connection pads connected to the pixels. When the pads are in contact with the connection pads, respectively, the driving chip is connected to the pixels.

[0006] The pads can be connected to the connection pads in various ways. For example, the pads can be electrically connected to the connection pads through an anisotropic conductive film. Alternatively, the pads can be connected to the connection pads by ultrasonic bonding without using an anisotropic conductive film.

[0007] In recent years, a structure in which a flexible film is provided at a side surface of a display panel is being studied to reduce a bezel width and expand a display area of ​​a display device.

[0008] The above information disclosed in this Background section is only for understanding the background of the present inventive concept and therefore it may contain information that does not constitute prior art. Summary of the Invention

[0009] Exemplary embodiments of the present disclosure provide a display device having a reduced bezel width.

[0010] Exemplary embodiments of the present disclosure provide a method of manufacturing the display device.

[0011] Additional features of the inventive concept will be set forth in the description which follows, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0012] An exemplary embodiment of the present disclosure provides a display device including a display panel, a side surface electrode, and a flexible film. The display panel includes a display area, a non-display area defined outside the display area, pixels disposed in the display area, signal lines connected to the pixels, and connection pads extending from the signal lines and disposed in the non-display area. The side surface electrode is disposed on one side surface of the display panel and contacts one side surface of the connection pad. The flexible film includes a drive electrode in contact with the side surface electrode.

[0013] The connection pad may include a first electrode layer and a second electrode layer disposed on the first electrode layer. The first electrode layer may include a plurality of first electrodes extending in a first direction and spaced apart from each other in a second direction intersecting the first direction. The second electrode layer may include a plurality of second electrodes extending in the first direction and spaced apart from each other in the second direction. The first electrode layer and the second electrode layer may have different hardnesses.

[0014] The first electrode layer may include a first lower electrode layer and a first upper electrode layer disposed on the first lower electrode layer. The first electrode may be included in at least one of the first lower electrode layer and the first upper electrode layer.

[0015] The connection pad may further include a first insulating interlayer disposed between the first lower electrode layer and the first upper electrode layer.

[0016] The first lower electrode layer may include a plurality of first lower electrodes, and the first upper electrode layer may include a plurality of first upper electrodes. The first lower electrodes may extend in the first direction and may be spaced apart from each other in the second direction. The first upper electrodes may extend in the first direction and may be spaced apart from each other in the second direction.

[0017] A side surface of the first lower electrode and a side surface of the first upper electrode may contact the side surface electrode.

[0018] The first lower electrode and the first upper electrode may include the same material.

[0019] The second electrode layer may include a second lower electrode layer and a second upper electrode layer disposed on the second lower electrode layer. The second electrode may be included in at least one of the second lower electrode layer and the second upper electrode layer.

[0020] The connection pad may further include a second insulating interlayer disposed between the second lower electrode layer and the second upper electrode layer.

[0021] The second lower electrode layer may include a plurality of second lower electrodes, and the second upper electrode layer may include a plurality of second upper electrodes. The second lower electrodes may extend in the first direction and may be spaced apart from each other in the second direction, and the second upper electrodes may extend in the first direction and may be spaced apart from each other in the second direction.

[0022] A side surface of the second lower electrode and a side surface of the second upper electrode may contact the side surface electrode.

[0023] The second lower electrode and the second upper electrode may include the same material.

[0024] The first electrodes may be spaced apart from each other by a first distance in the second direction, and the second electrodes may be spaced apart from each other by a second distance in the second direction. The second distance may be smaller than the first distance.

[0025] Due to the difference in hardness between the first electrode and the second electrode, the connection pad may have a concavo-convex structure in the second direction.

[0026] The side surface electrode may have a shape corresponding to the concavo-convex structure at a contact portion where the side surface electrode contacts the connection pad.

[0027] The connection pad may further include a third insulating intermediate layer interposed between the first electrode layer and the second electrode layer.

[0028] The display panel may further include a base substrate, and one side surface of the base substrate may be aligned with a side surface of the third insulating interlayer.

[0029] The side surface of the first electrode layer is more recessed inward than the one side surface of the base substrate and the side surface of the third insulating interlayer, and the side surface of the second electrode layer may be more recessed inward than the one side surface of the base substrate and the side surface of the third insulating interlayer.

[0030] The side surface of the second electrode layer may be more recessed than the side surface of the first electrode layer with respect to the one side surface of the base substrate.

[0031] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the disclosure as claimed. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The accompanying drawings are included to provide a further understanding of the disclosure and are incorporated in and constitute a part of this specification. They illustrate exemplary embodiments of the disclosure and together with the description serve to explain the inventive concept.

[0033] Figure 1 is a perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0034] Figure 2 is an exploded perspective view illustrating a display device according to an exemplary embodiment of the present disclosure.

[0035] Figure 3 is a plan view illustrating a display panel according to an exemplary embodiment of the present disclosure.

[0036] Figure 4 is a plan view illustrating an input sensing layer according to an exemplary embodiment of the present disclosure.

[0037] Figure 5 It is along Figure 2 sectional view taken along line II' shown in FIG.

[0038] Figure 6A 、 Figure 6B 、 Figure 6C 、 Figure 6D and Figure 6E is a process diagram illustrating a bonding process of the first flexible film.

[0039] Figure 7 It is shown in Figure 6D A side view of part II is shown in FIG.

[0040] Figure 8 It is shown that the Figure 7 An enlarged view of the side surface of the connection pad in portion III is shown.

[0041] Figure 9 It is shown in Figure 8 A perspective view of the connection pads is shown in FIG.

[0042] Figure 10 It is shown in Figure 9 A plan view of the connection pads is shown in FIG.

[0043] Figure 11A is an enlarged view illustrating a side surface of a connection pad according to another exemplary embodiment of the present disclosure.

[0044] Figure 11B is an enlarged view illustrating a side surface of a connection pad according to another exemplary embodiment of the present disclosure.

[0045] Figure 11Cis an enlarged view illustrating a side surface of a connection pad according to another exemplary embodiment of the present disclosure.

[0046] Figure 12 is a side perspective view illustrating a display panel according to an exemplary embodiment of the present disclosure.

[0047] Figure 13A It is along Figure 12 sectional view taken along line IV-IV' shown in FIG.

[0048] Figure 13B It is along Figure 12 sectional view taken along line VV' shown in FIG. DETAILED DESCRIPTION

[0049] In the following description, many specific details are set forth for the purpose of explanation in order to provide a thorough understanding of the various exemplary embodiments of the present disclosure. As used herein, an embodiment is a non-limiting example of a device or method using one or more of the inventive concepts disclosed herein. However, it is apparent that various exemplary embodiments can be practiced without these specific details or with one or more equivalent arrangements. In other examples, well-known structures and devices are shown in block diagram form to avoid unnecessary confusion of various exemplary embodiments. In addition, various exemplary embodiments may be different, but do not have to be exclusive. For example, the specific shape, configuration and characteristics of an exemplary embodiment may be used or implemented in another exemplary embodiment without departing from the present invention.

[0050] Unless otherwise indicated, the exemplary embodiments described should be understood as providing exemplary features of varying details of certain ways in which the inventive concept can be implemented in practice. Therefore, unless otherwise indicated, the features, components, modules, layers, films, panels, regions and / or aspects of the various embodiments (hereinafter individually or collectively referred to as "elements") may be combined, separated, interchanged and / or rearranged without departing from the inventive concept.

[0051] Cross hatching and / or shading are typically used in the drawings to illustrate the boundaries between adjacent elements. Thus, the presence or absence of cross hatching or shading cannot convey or indicate any preference or requirement for the specific material, material properties, dimensions, proportions, commonality between the elements shown, and / or any other features, attributes, characteristics, etc. of the elements, unless otherwise stated. In addition, in the drawings, the size and relative sizes of the elements may be exaggerated for clarity and / or descriptive purposes. When the exemplary embodiments can be implemented differently, a specific process sequence can be performed differently from the described sequence. For example, two processes described in succession can be performed substantially simultaneously or in an order opposite to the described sequence. In addition, the same reference numerals represent similar elements.

[0052] When an element or layer is referred to as being "on" another element or layer, "connected to" or "coupled to" another element or layer, it can be directly on another element or layer, directly connected to or coupled to another element or layer, or there can be an intermediate element or layer. However, when an element or layer is referred to as being "directly on" another element or layer, "directly connected to" or "directly coupled to" another element or layer, there is no intermediate element or layer. For this reason, the term "connection" can refer to a physical, electrical and / or fluid connection with or without an intermediate element. In addition, the first axis, the second axis and the third axis are not limited to the three axes of a rectangular coordinate system, such as the x, y and z axes, and can be interpreted in a broader sense. For example, the first axis, the second axis and the third axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y and Z" and "at least one selected from the group consisting of X, Y and Z" can be interpreted as any combination of only X, only Y, only Z or two or more of X, Y and Z, such as, for example, XYZ, XYY, YZ and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0053] Although the terms "first," "second," etc. may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, the first element discussed below could be referred to as the second element without departing from the teachings of the present disclosure.

[0054] Spatially relative terms such as "below," "beneath," "beneath," "lower," "above," "upper," "above," "higher," and "side" (e.g., as in "sidewall") may be used herein for descriptive purposes and thereby describe the relationship between one element and another element(s) as shown in the figures. Spatially relative terms are intended to encompass different orientations of the device in use, operation, and / or manufacture in addition to the orientation depicted in the figures. For example, if the device in the figures is flipped, elements described as "below" or "beneath" other elements or features would then be oriented "above" the other elements or features. Thus, the exemplary term "below" can include both the orientations of "above" and "below." Furthermore, the device may be oriented in other ways (e.g., rotated 90 degrees or in other orientations), and thus, the spatially relative descriptors used herein may be interpreted accordingly.

[0055] The terms used herein are for the purpose of describing specific embodiments and are not intended to be limiting. As used herein, the singular forms "one", "an" and "said" are intended to also include plural forms, unless the context clearly indicates otherwise. In addition, when used in this specification, the terms "include" and / or "comprise" specify the presence of stated features, integral bodies, steps, operations, elements, components and / or groups thereof, but do not exclude the presence or addition of one or more other features, integral bodies, steps, operations, elements, components and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "approximately" and other similar terms are used as terms of approximation rather than degrees, and are therefore used to illustrate the inherent deviations of the values ​​measured, calculated and / or provided that will be recognized by those of ordinary skill in the art.

[0056] Various exemplary embodiments are described herein with reference to cross-sectional illustrations and / or exploded illustrations, which are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. As such, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are contemplated. Therefore, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the specific illustrated shapes of the regions, but rather include deviations in shape due to, for example, manufacturing. In this manner, the regions illustrated in the accompanying drawings may be schematic in nature, and the shapes of these regions may not reflect the actual shapes of the regions of the device and are therefore not necessarily intended to be limiting.

[0057] Hereinafter, the present disclosure will be explained in detail with reference to the accompanying drawings.

[0058] Figure 1 is a perspective view showing a display device DD according to an exemplary embodiment of the present disclosure, and Figure 2 is an exploded perspective view illustrating a display device DD according to an exemplary embodiment of the present disclosure.

[0059] refer to Figure 1 and Figure 2 , the display device DD can be activated in response to the electrical signal to display an image. The display device DD may be a smartphone, a tablet computer, a notebook computer, a computer, or a television. In this exemplary embodiment, a smartphone is described as a representative example of the display device DD.

[0060] The display device DD may display an image IM toward a third direction DR3 through a display surface FS that is substantially parallel to each of the first direction DR1 and the second direction DR2. The display surface FS on which the image IM is displayed may correspond to the front surface of the display device DD and the front surface of the window 100. Hereinafter, the front surface of the display device DD and the front surface of the window 100 will be referred to as the "display surface FS." The image IM includes still images as well as moving images. Figure 1A clock application and application icons are shown as representative examples of the image IM.

[0061] In this exemplary embodiment, the front (or upper) and rear (or lower) surfaces of each member are defined relative to the direction in which the image IM is displayed. The front and rear surfaces are opposite to each other in a third direction DR3, and the normal direction of each of the front and rear surfaces is substantially parallel to the third direction DR3. The directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are opposite to each other, and therefore the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 can be changed to other directions.

[0062] The display device DD includes a window 100, a display module 200, a driving circuit unit 300, and a housing 400. In the present exemplary embodiment, the window 100 and the housing 400 are coupled to each other to form an external appearance of the display device DD.

[0063] Window 100 comprises an optically transparent insulating material. For example, window 100 comprises glass or plastic. Window 100 has a single-layer or multi-layer structure. For example, window 100 comprises multiple plastic films attached to each other by an adhesive, or comprises a glass substrate and plastic films attached to the glass substrate by an adhesive.

[0064] When viewed in a plan view, the window 100 may be divided into a transmissive area TA and a frame area BZA. In this exemplary embodiment, the expression "when viewed in a plan view" may refer to a state viewed in the third direction DR3. In addition, the expression "thickness direction" may refer to the third direction DR3.

[0065] The transmissive area TA may be an optically transparent area. The frame area BZA may be a region having a light transmittance relatively lower than that of the transmissive area TA. The frame area BZA may define the shape of the transmissive area TA. The frame area BZA may be disposed adjacent to the transmissive area TA and may surround the transmissive area TA.

[0066] The bezel area BZA may have a predetermined color. The bezel area BZA may cover the non-display area NDA of the display module 200 to prevent the non-display area NDA from being viewed from the outside.

[0067] As in Figure 2 As shown in FIG. 1 , the display module 200 may be disposed below the window 100. In this exemplary embodiment, the term "below" may refer to a direction opposite to the direction in which the display module 200 displays the image IM. The display module 200 may display the image IM and may sense an external input TC. The display module 200 may include a front surface IS including a display area DA and a non-display area NDA. The display area DA may be a region that displays an image in response to an electrical signal.

[0068] In this exemplary embodiment, the display area DA may be an area in which an image IM is displayed and an external input TC is sensed. The transmissive area TA may overlap at least the display area DA. For example, the transmissive area TA may overlap at least a portion or the entire surface of the display area DA. Thus, a user may view the image IM through the transmissive area TA or may provide an external input TC through the transmissive area TA.

[0069] The non-display area NDA may be covered by the bezel area BZA. The non-display area NDA may be disposed adjacent to the display area DA. The non-display area NDA may surround the display area DA. A driving circuit or driving line may be disposed in the non-display area NDA to drive the display area DA.

[0070] The width of the bezel area BZA may be defined as a "bezel width." A reduction in the bezel width of a display device DD having a given size may indicate an increase in the size of the transmissive area TA. Furthermore, a reduction in the bezel width may indicate a reduction in the width of the non-display area NDA corresponding to the bezel area BZA.

[0071] In the present exemplary embodiment, the display module 200 has a flat shape in the display area DA and the non-display area NDA, but the shape should not be limited thereto or thereby. For example, the display module 200 may be foldable or curved.

[0072] The display module 200 includes a display panel 210 and an input sensing layer 220 .

[0073] The display panel 210 may be configured to substantially generate an image IM. The image IM generated by the display panel 210 may be displayed through the front surface IS of the display module 200 and viewed from the outside by a user through the transmissive area TA.

[0074] The input sensing layer 220 senses external input TC provided from the outside. For example, the input sensing layer 220 can sense external input TC provided through the window 100. The external input TC can be user input. User input can include various forms of external input, such as a part of the user's body, light, heat, a pen, or pressure. In this exemplary embodiment, the external input TC is shown as a touch operation using the user's hand applied via the display surface FS of the display device DD. However, this is purely exemplary. As described above, the external input TC can be provided in various forms, and the display device DD can sense the external input TC applied to the side surface or rear surface of the display device DD depending on the structure of the display device DD, although the external input TC should not be limited to any specific embodiment.

[0075] The driving circuit unit 300 may be electrically connected to the display panel 210 and the input sensing layer 220. The driving circuit unit 300 may include a main circuit board MB, a first flexible film CF1, a second flexible film CF2, and a driving chip D-IC.

[0076] The first flexible film CF1 is electrically connected to the display panel 210. The first flexible film CF1 connects the display panel 210 and the main circuit board MB. The first flexible film CF1 is connected to a pad (connection pad) arranged on one side surface of the display module 200. The first flexible film CF1 provides an electrical signal to the display panel 210 to drive the display panel 210. The electrical signal is generated by the first flexible film CF1 or the main circuit board MB.

[0077] The second flexible film CF2 is electrically connected to the input sensing layer 220. The second flexible film CF2 connects the input sensing layer 220 and the main circuit board MB. The second flexible film CF2 is connected to pads (sensing pads) of the input sensing layer 220 arranged in the non-display area NDA. The second flexible film CF2 provides electrical signals to the input sensing layer 220 to drive the input sensing layer 220. The electrical signals are generated by the second flexible film CF2 or the main circuit board MB.

[0078] The main circuit board MB may include various drive circuits for driving the display module 200 or connectors for supplying power. The first flexible film CF1 and the second flexible film CF2 may be connected to the main circuit board MB. According to this exemplary embodiment, the display module 200 can be easily controlled using a single main circuit board MB. However, this is purely exemplary. In the display module 200 according to the exemplary embodiment of the present disclosure, the display panel 210 and the input sensing layer 220 may be connected to different main circuit boards, and one of the first flexible film CF1 and the second flexible film CF2 may not be connected to the main circuit board MB. This should not be limited to a specific embodiment. The main circuit board MB may be provided as a flexible printed circuit board.

[0079] According to an exemplary embodiment of the present disclosure, the driving circuit unit 300 is disposed on one side surface of the display module 200. However, the driving circuit unit 300 may be provided in plural and may be disposed on at least one side surface of the display module 200.

[0080] The driving chip D-IC may be disposed on the first flexible film CF1. The driving chip D-IC may generate driving signals necessary for the operation of the display panel 210 of the present exemplary embodiment. The driving signals output from the driving chip D-IC may be applied to the display panel 210 through the first flexible film CF1.

[0081] The first flexible film CF1 may be bent from the side surface of the display module 200 toward the rear surface of the display panel 210. Therefore, the driving chip D-IC and the main circuit board MB may be disposed on the rear surface of the display panel 210.

[0082] Compared to a display device in which the first flexible film CF1 is attached to the front surface of the display panel 210, the display device DD according to this exemplary embodiment can ensure a wider display area DA. That is, when the first flexible film CF1 is disposed in the non-display area NDA of the display panel 210, the non-display area NDA includes a bonding area to which the first flexible film CF1 is coupled. However, according to this exemplary embodiment, the bonding area is removed from the non-display area NDA, and thus, the bezel width can be reduced, and the display area DA can be increased due to the reduced bezel width.

[0083] The housing 400 is coupled to the window 100. The housing 400 is coupled to the window 100 to provide an inner space. The display module 200 is accommodated in the inner space.

[0084] The housing 400 may include a material having relatively high hardness. For example, the housing 400 may include multiple frames and / or plates including glass, plastic, metal, or a combination thereof. The housing 400 may stably protect the components of the display device DD housed in the internal space from external impact.

[0085] Figure 3 is a plan view showing a display panel 210 according to an exemplary embodiment of the present disclosure, and Figure 4 is a plan view illustrating the input sensing layer 220 according to an exemplary embodiment of the present disclosure.

[0086] refer to Figure 3 , the display panel 210 includes a first base substrate BS1, a plurality of pixels PX, a plurality of signal lines, and a plurality of connection pads PDD.

[0087] The display area DA of the display panel 210 is a region in which an image IM is displayed, and the non-display area NDA is another region in which a driving circuit or a driving line is disposed. Figure 3 There are shown a display area DA and a non-display area NDA of the display panel 210. Pixels PX are provided in the display area DA.

[0088] The first base substrate BS1 may be a stack structure including a silicon substrate, a plastic substrate, a glass substrate, an insulating film, or a plurality of insulating layers.

[0089] The signal lines are connected to the pixels PX to apply electrical signals to the pixels PX. Among the signal lines included in the display panel 210, the scan lines GL, the data lines DL, and the power lines PL are connected to the pixels PX to apply electrical signals to the pixels PX. Figure 31 is shown as a representative example. However, this is purely exemplary. That is, the signal line may further include at least one of an initialization voltage line and a light emitting control line, and should not be specifically limited. The signal line may be provided on the display area DA of the first base substrate BS1.

[0090] In this exemplary embodiment, an equivalent circuit diagram of one pixel PX among the pixels PX is enlarged and shown as a representative example. The pixel PX may include a first transistor TR1, a capacitor CP, a second transistor TR2, and a light-emitting diode OLED. The first transistor TR1 may be a switching device that controls the on / off state of the pixel PX. The first transistor TR1 may transmit or block a data signal applied to it via a data line DL in response to a scan signal applied to it via a scan line GL.

[0091] The capacitor CP is connected to the first transistor TR1 and the power line PL. The capacitor CP is charged with charges corresponding to a difference between a data signal supplied from the first transistor TR1 and a first power signal applied to the power line PL.

[0092] The second transistor TR2 is connected to the first transistor TR1, the capacitor CP, and the light-emitting diode OLED. The second transistor TR2 controls the drive current flowing through the light-emitting diode OLED in response to the amount of charge stored in the capacitor CP. The on-time of the second transistor TR2 is determined by the amount of charge stored in the capacitor CP. During the on-time, the second transistor TR2 applies the first power signal provided by the power line PL to the light-emitting diode OLED.

[0093] The light emitting diode OLED may generate light in response to an electrical signal or may control the amount of light. For example, the light emitting diode OLED may include an organic light emitting diode or a quantum dot light emitting diode.

[0094] The light-emitting diode OLED is connected to the power supply terminal VSS to receive a power supply signal (hereinafter referred to as a "second power supply signal") different from the first power supply signal provided by the power supply line PL. A driving current corresponding to the difference between the electrical signal provided by the second transistor TR2 and the second power supply signal flows through the light-emitting diode OLED, and the light-emitting diode OLED generates light corresponding to the driving current. However, this is purely exemplary. That is, the pixel PX may include electronic devices having various configurations and arrangements and should not be specifically limited.

[0095] The connection pad PDD may include a first connection pad D1 and a second connection pad D2. The first connection pad D1 may be provided in plurality and may be connected to the data line DL. The second connection pad D2 may be electrically connected to the power line PL. The display panel 210 may apply an electrical signal provided thereto from the outside through the connection pad PDD to the pixel PX. At the same time, the connection pad PDD may also include pads other than the first connection pad D1 and the second connection pad D2 to receive other electrical signals. However, the connection pad PDD should not be limited to or restricted thereto. The connection pad PDD may be provided in the non-display area NDA. One side surface of the connection pad PDD may be exposed to the outside to be electrically connected to the driving circuit unit 300. That is, the connection pad PDD may extend to the edge where the upper surface and the side surface of the first base substrate BS1 are connected to each other, and one side surface of the connection pad PDD is provided at the same position as the side surface of the first base substrate BS1 to be exposed to the outside.

[0096] refer to Figure 2 and Figure 4 , the input sensing layer 220 may be provided on the display panel 210. For example, the input sensing layer 220 may be directly provided on the display panel 210, or may be coupled to the display panel 210 via an adhesive member. When the input sensing layer 220 may be directly provided on the display panel 210, the input sensing layer 220 may be formed on the display panel 210 through a continuous process after the display panel 210 is formed.

[0097] The input sensing layer 220 may include a first sensing electrode TE1 , a second sensing electrode TE2 , a plurality of sensing lines TL1 , TL2 , and TL3 , and a plurality of sensing pads PDT.

[0098] The first sensing electrode TE1 and the second sensing electrode TE2 are provided in the display area DA. The input sensing layer 220 can ensure the capacitance between the first sensing electrode TE1 and the second sensing electrode TE2 with respect to the external input TC (reference Figure 1 ) information.

[0099] The first sensing electrode TE1 includes a first sensing pattern SP1 and a first connection pattern BP1. At least one first connection pattern BP1 is connected to two adjacent first sensing patterns SP1. The second sensing electrode TE2 includes a second sensing pattern SP2 and a second connection pattern BP2. At least one second connection pattern BP2 is connected to two adjacent second sensing patterns SP2.

[0100] The sensing lines TL1, TL2, and TL3 are disposed in the non-display area NDA. The sensing lines TL1, TL2, and TL3 include a first sensing line TL1, a second sensing line TL2, and a third sensing line TL3.

[0101] The first sensing line TL1 is connected to the first sensing electrode TE1. The second sensing line TL2 is connected to one end of the second sensing electrode TE2. The third sensing line TL3 is connected to the other end of the second sensing electrode TE2. The other end of the second sensing electrode TE2 is opposite to one end of the second sensing electrode TE2.

[0102] According to this exemplary embodiment, the second sensing electrode TE2 is connected to the second sensing line TL2 and the third sensing line TL3. Therefore, the sensitivity of the area of ​​the second sensing electrode TE2, which is longer than the first sensing electrode TE1, can be uniformly maintained. However, this is purely exemplary. According to exemplary embodiments, the third sensing line TL3 may be omitted, and the present inventive concept should not be particularly limited.

[0103] The sensing pads PDT are provided in the non-display area NDA. The sensing pads PDT include a first sensing pad T1, a second sensing pad T2, and a third sensing pad T3. The first sensing pad T1 is connected to the first sensing line TL1 and electrically connected to the first sensing electrode TE1. The second sensing pad T2 is connected to the second sensing line TL2, and the third sensing pad T3 is connected to the third sensing line TL3. Therefore, the second sensing pad T2 and the third sensing pad T3 are electrically connected to the second sensing electrode TE2.

[0104] The sensing pad PDT may be bonded to the second flexible film CF2 in the non-display area NDA (refer to Figure 2 ). Figure 2 and Figure 4 A structure is shown in which the second flexible film CF2 is bonded to the front surface of the input sensing layer 220. However, the present inventive concept should not be limited thereto or thereby. That is, according to another exemplary embodiment, the second flexible film CF2 may be bonded to one side surface of the display module 200 to apply a signal to the input sensing layer 220 to drive the input sensing layer 220. The one side surface of the display module 200 may be substantially the same as the one side surface of the display panel 210 to which the first flexible film CF1 is bonded.

[0105] Figure 5 It is along Figure 2 sectional view taken along line II' shown in FIG.

[0106] refer to Figure 5 The display panel 210 includes a first base substrate BS1, a circuit element layer DP-CL, a light emitting element layer DP-EDL, a thin film encapsulation layer TFE, a second base substrate BS2, and a sealant SM. According to an exemplary embodiment, the first base substrate BS1, the circuit element layer DP-CL, the light emitting element layer DP-EDL, and the thin film encapsulation layer TFE may be sequentially stacked in the third direction DR3.

[0107] The first base substrate BS1 may be a member that provides a base surface on which the circuit element layer DP-CL is disposed. The first base substrate BS1 may be a glass substrate, a metal substrate, or a plastic substrate. However, the composition of the first base substrate BS1 should not be limited thereto. The first base substrate BS1 may be an inorganic layer, an organic layer, or a composite material layer.

[0108] The circuit element layer DP-CL is disposed on the first base substrate BS1. The circuit element layer DP-CL includes a circuit element layer for driving the pixel PX (refer to FIG. Figure 3 ) elements, namely, the first transistor TR1 and the second transistor TR2 (reference Figure 3 ) and capacitor CP (reference Figure 3 ).

[0109] The light emitting element layer DP-EDL is provided on the circuit element layer DP-CL. The light emitting element layer DP-EDL includes a plurality of light emitting diodes OLED (refer to Figure 3 ).

[0110] The thin film encapsulation layer TFE may be disposed on the light emitting element layer DP-EDL to encapsulate the light emitting diode OLED. The thin film encapsulation layer TFE may completely cover the display area DA. The thin film encapsulation layer TFE may also cover a portion of the non-display area NDA.

[0111] The thin film encapsulation layer TFE may include a first inorganic layer, an organic layer, and a second inorganic layer sequentially stacked in the third direction DR3. Each of the first inorganic layer, the organic layer, and the second inorganic layer may have a single layer or a multilayer structure. In addition, at least one of the first inorganic layer, the organic layer, and the second inorganic layer may be provided in a plurality or may be omitted, and they should not be limited thereto.

[0112] The second base substrate BS2 is disposed facing the first base substrate BS1. The second base substrate BS2 may be a glass substrate, a metal substrate, or a plastic substrate. As an example of this exemplary embodiment, the first base substrate BS1 and the second base substrate BS2 may comprise substantially the same material. However, the present invention is not limited to or by this. That is, the second base substrate BS2 may be an inorganic layer, an organic layer, or a composite material layer.

[0113] The second base substrate BS2 may be coupled to the first base substrate BS1 by a sealant SM, and a space between the first and second base substrates BS1 and BS2 may be sealed by the sealant SM. The sealant SM may include an organic bonding member or an inorganic bonding member. The sealant SM may include glass frit.

[0114] The input sensing layer 220 may be disposed on the second base substrate BS2 .

[0115] The display panel 210 may include a connection pad PDD extending from the circuit element layer DP-CL and disposed in the non-display area NDA. The connection pad PDD may extend in the first direction DR1, and one end of the connection pad PDD may be aligned with the side surface SS1 of the first base substrate BS1. The other end of the connection pad PDD may be connected to the data line DL and the power line PL (reference Figure 3 ). In addition, the side surface PS1 of each connection pad PDD may be more recessed than the side surface SS1 of the first base substrate BS1. Therefore, the side surface PS1 of each connection pad PDD may have a concavo-convex structure.

[0116] The first base substrate BS1 includes an upper surface, a lower surface, and a side surface SS1 connecting the upper and lower surfaces. In this case, the side surface SS1 of the first base substrate BS1 will be described as being adjacent to the connection pad PDD.

[0117] A plurality of side surface electrodes SBE may be provided on the side surfaces of the display panel 210. The side surface electrodes SBE may be provided in a one-to-one correspondence with the connection pads PDD. Each side surface electrode SBE may directly contact the side surface PS1 of the corresponding connection pad PDD. Thus, each side surface electrode SBE may be electrically connected to the corresponding connection pad PDD. The concavo-convex structure formed on the side surface PS1 of the connection pad PDD may be reflected on the side surface electrodes SBE. In other words, the side surface electrodes SBE may have a concavo-convex structure in the portion corresponding to the side surface PS1 of the connection pad PDD.

[0118] Each side surface electrode SBE may be provided on the side surface SS1 of the first base substrate BS1, the side surface SMS of the sealant SM, and the side surface SS2 of the second base substrate BS2. As an example of this exemplary embodiment, the side surface SS1 of the first base substrate BS1, the side surface SMS of the sealant SM, and the side surface SS2 of the second base substrate BS2 may be aligned with the side surface PS1 of the connection pad PDD. Each side surface electrode SBE may partially cover the side surface SS1 of the first base substrate BS1 and the side surface SMS of the sealant SM aligned with the side surface PS1 of the connection pad PDD. In addition, as another example, each side surface electrode SBE may further cover the side surface SS2 of the second base substrate BS2 aligned with the side surface PS1 of the connection pad PDD.

[0119] The side surface electrodes SBE may include a metal material including copper (Cu), silver (Ag), gold (Au), or aluminum (Al). The side surface electrodes SBE may be formed on the side surfaces of the display panel 210 by depositing the metal material and then forming an electrode using a laser beam or by screen printing.

[0120] The first flexible film CF1 is attached to the side surface of the display panel 210. The first flexible film CF1 includes a base film BF and a plurality of drive electrodes DBE disposed on one surface of the base film BF. The first flexible film CF1 is configured to allow the drive electrodes DBE to face the plurality of side surface electrodes SBE and is bonded to the display panel 210. The drive electrodes DBE may be disposed to correspond to the side surface electrodes SBE in a one-to-one manner.

[0121] After the bonding process, each driving electrode DBE can directly contact the corresponding side surface electrode SBE. As an example of this exemplary embodiment, the driving electrode DBE can be directly connected to the side surface electrode SBE by an ultrasonic bonding method. Therefore, each driving electrode DBE can be connected from the driving chip D-IC (reference Figure 2 ) is transmitted to the corresponding side surface electrode SBE.

[0122] Figures 6A to 6E is a process diagram showing a bonding process of the first flexible film CF1, and Figure 7 It is shown in Figure 6D A side view of part II is shown in FIG.

[0123] refer to Figure 5 and Figure 6A , before the side surface electrode SBE is formed on one side surface of the display panel 210 , a process of grinding one side surface of the display panel 210 is performed.

[0124] A grinding device GD may be provided on one side surface of the display panel 210. The grinding device GD may include a rotation axis and a grinding wheel that rotates about the rotation axis. The grinding wheel rotates along the rotation axis and grinds one side surface of the display panel 210. In this exemplary embodiment, one side surface of the display panel 210 may include a side surface SS1 of the first base substrate BS1, a side surface PS1 of the connection pad PDD, a side surface SMS of the sealant SM, and a side surface SS2 of the second base substrate BS2.

[0125] As in Figure 6B As shown in FIG, a plurality of concavo-convex portions CC may be formed on the side surface PS1 of the connection pad PDD through a grinding process. That is, the concavo-convex portions CC may be formed on the side surface PS1 of the connection pad PDD aligned with the first base substrate BS1. As an example of this exemplary embodiment, the concavo-convex portions CC may be arranged to be spaced apart from each other in the second direction DR2 and the third direction DR3.

[0126] In the case where each connection pad PDD includes a plurality of metal layers having different hardnesses, the metal layers may be ground at different grinding rates during the grinding process. For example, a metal layer having a relatively high hardness has a relatively low grinding rate compared to a metal layer having a relatively low hardness. The difference in grinding rate may be reflected as a concave-convex portion CC on the side surface PS1 of the connection pad PDD. Figures 8 to 12 The structure of the connection pad PDD is described in detail.

[0127] refer to Figure 6C The side surface metal layer SML may be deposited on the side surface of the display panel 210. The side surface metal layer SML may be formed to cover the side surface PS1 of the connection pad PDD. The side surface metal layer SML may be bonded to the side surface SS1 of the first base substrate BS1, the side surface SMS of the sealant SM (reference Figure 6B ) partially overlaps with the side surface SS2 of the second base substrate BS2.

[0128] The side surface metal layer SML may include a metal material including copper (Cu), silver (Ag), gold (Au), or aluminum (Al).

[0129] Then, the side surface metal layer SML is partially removed by a laser process. Figure 6D and Figure 7 As shown in FIG, the side surface electrode SBE may be formed on the side surface of the display panel 210. The side surface electrode SBE may be formed to correspond to the connection pad PDD in a one-to-one correspondence. The side surface electrode SBE may be directly formed on the side surface PS1 (refer to FIG. Figure 6B ). Therefore, a concavo-convex portion CC (reference Figure 6B ) is reflected on the side surface electrode SBE, and therefore, the side surface electrode SBE may have a concavo-convex structure in a portion in contact with the side surface PS1 of the connection pad PDD (hereinafter referred to as a “contact portion”).

[0130] The connection pads PDD may be arranged to be spaced apart from each other in the second direction DR2 and may be electrically insulated from each other. In addition, the side surface electrodes SBE may be arranged to be spaced apart from each other in the second direction DR2 and may be electrically insulated from each other.

[0131] 6E, the first flexible film CF1 is attached to the side surface of the display panel 210 by an ultrasonic bonding method. The first flexible film CF1 includes a base film BF and a driving electrode DBE provided on one surface of the base film BF.

[0132] When the first flexible film CF1 is disposed on the side surface of the display panel 210 so that the drive electrodes DBE face the side surface electrodes SBE, an ultrasonic bonding process is performed. The ultrasonic bonding method can be performed using an ultrasonic vibration device. The ultrasonic vibration device can generate vibrations at a predetermined frequency. For example, the ultrasonic vibration device can generate ultrasonic vibrations at a frequency of approximately 35 kHz. The ultrasonic vibrations can be applied to the drive electrodes DBE via the base film BF.

[0133] Ultrasonic vibrations generate frictional heat at the contact surfaces of drive electrode DBE and side surface electrode SBE. The contact surfaces between drive electrode DBE and side surface electrode SBE melt due to frictional heat, causing metal diffusion. Consequently, drive electrode DBE and side surface electrode SBE can be coupled to each other. This bonding method can be defined as an "ultrasonic bonding method."

[0134] As in Figures 6D to 7 As shown in FIG, the surface of the side surface electrode SBE has a concavo-convex structure in the contact portion. In the portion with the concavo-convex structure, a greater amount of frictional heat may be generated during the ultrasonic bonding process. Increased frictional heat may lead to more metal diffusion between the drive electrode DBE and the side surface electrode SBE. When metal diffusion increases, the coupling force between the drive electrode DBE and the side surface electrode SBE may increase. Consequently, the coupling force and electrical connection characteristics between the display panel 210 and the first flexible film CF1 may be improved.

[0135] Figure 8 It is shown that the Figure 7 1 is an enlarged view of the side surface of the connection pad PDD1 in portion III shown in FIG. Figure 9 It is shown in Figure 8 1 is a perspective view of the connection pad PDD1 shown in FIG. Figure 10 It is shown in Figure 9 1 is a plan view of the connection pad PDD1 shown in FIG. Figures 8 to 10 One connection pad PDD1 among the connection pads PDD is shown. Since the connection pads PDD have substantially the same structure, one connection pad PDD1 will be described as a representative example, and details of the other connection pads will be omitted.

[0136] refer to Figures 8 to 10 The connection pad PDD1 is provided on the upper surface of the first base substrate BS1. The connection pad PDD1 includes a first electrode layer EL1 and a second electrode layer EL2. As an example of the present exemplary embodiment, the first electrode layer EL1 includes a first lower electrode layer LE1 and a first upper electrode layer UE1 provided on the first lower electrode layer LE1. The second electrode layer EL2 includes a second lower electrode layer LE2 and a second upper electrode layer UE2 provided on the second lower electrode layer LE2.

[0137] The first lower electrode layer LE1 may include a plurality of first lower electrodes LE1-1 and LE1-2, and the first upper electrode layer UE1 may include a plurality of first upper electrodes UE1-1 and UE1-2. Each of the first lower electrodes LE1-1 and LE1-2 may extend in a first direction DR1. In addition, the first lower electrodes LE1-1 and LE1-2 may be arranged to be spaced apart from each other in a second direction DR2. Each of the first upper electrodes UE1-1 and UE1-2 may extend in the first direction DR1. In addition, the first upper electrodes UE1-1 and UE1-2 may be spaced apart from each other in the second direction DR2. As an example of this exemplary embodiment, the first lower electrodes LE1-1 and LE1-2 may be spaced apart from each other by a first distance d1 in the second direction DR2, and the first upper electrodes UE1-1 and UE1-2 may be spaced apart from each other by a first distance d1 in the second direction DR2.

[0138] As an example of this exemplary embodiment, the first lower electrode layer LE1 includes two first lower electrodes LE1-1 and LE1-2, and the first upper electrode layer UE1 includes two first upper electrodes UE1-1 and UE1-2. However, the present invention is not limited to or restricted by this. In addition, the first electrode layer EL1 includes two electrode layers, the first lower electrode layer LE1 and the first upper electrode layer UE1. However, the number of electrode layers included in the first electrode layer EL1 is not limited to or restricted by this. That is, the first electrode layer EL1 may include one, three, or four electrode layers.

[0139] The first lower electrode layer LE1 and the first upper electrode layer UE1 may include substantially the same material. As an example of this exemplary embodiment, the first lower electrode layer LE1 and the first upper electrode layer UE1 may include molybdenum or an alloy thereof. As another example of this exemplary embodiment, the first lower electrode layer LE1 and the first upper electrode layer UE1 may include different materials.

[0140] The connection pad PDD1 may further include a first insulating interlayer ILD1 disposed between the first lower electrode layer LE1 and the first upper electrode layer UE1. The first insulating interlayer ILD1 may include an inorganic material. The first lower electrode layer LE1 and the first upper electrode layer UE1 may be spaced apart from each other in the third direction DR3 by the first insulating interlayer ILD1.

[0141] Figure 8 and Figure 9 A structure is shown in which the first insulating interlayer ILD1 is disposed between the first lower electrode layer LE1 and the first upper electrode layer UE1. However, the present inventive concept should not be limited thereto or thereby. That is, the first upper electrode layer UE1 may be directly disposed on the first lower electrode layer LE1.

[0142] The second lower electrode layer LE2 may include a plurality of second lower electrodes LE2-1, LE2-2, and LE2-3, and the second upper electrode layer UE2 may include a plurality of second upper electrodes UE2-1, UE2-2, and UE2-3. Each of the second lower electrodes LE2-1, LE2-2, and LE2-3 may extend in the first direction DR1. The second lower electrodes LE2-1, LE2-2, and LE2-3 may be arranged to be spaced apart from each other in the second direction DR2. Each of the second upper electrodes UE2-1, UE2-2, and UE2-3 may extend in the first direction DR1. The second upper electrodes UE2-1, UE2-2, and UE2-3 may be arranged to be spaced apart from each other in the second direction DR2. As an example of this exemplary embodiment, the second lower electrodes LE2-1, LE2-2, and LE2-3 may be spaced apart from each other by a second distance d2 in the second direction DR2, and the second upper electrodes UE2-1, UE2-2, and UE2-3 may be spaced apart from each other by a second distance d2 in the second direction DR2. In this case, the second distance d2 may be smaller than the first distance d1.

[0143] As an example of this exemplary embodiment, the second lower electrode layer LE2 includes three second lower electrodes LE2-1, LE2-2 and LE2-3, and the second upper electrode layer UE2 includes three second upper electrodes UE2-1, UE2-2 and UE2-3, however, this exemplary embodiment should not be limited to or thereby.

[0144] One of the second lower electrodes LE2-1, LE2-2, and LE2-3 may not overlap with the first electrode layer EL1. One of the second upper electrodes UE2-1, UE2-2, and UE2-3 may not overlap with the first electrode layer EL1.

[0145] In addition, the second electrode layer EL2 includes two electrode layers: a second lower electrode layer LE2 and a second upper electrode layer UE2. However, the number of electrode layers included in the second electrode layer EL2 should not be limited thereto or subject to such limitations. That is, the second electrode layer EL2 may include one, three, or four electrode layers.

[0146] The second lower electrode layer LE2 and the second upper electrode layer UE2 may include substantially the same material. As an example of this exemplary embodiment, the second lower electrode layer LE2 and the second upper electrode layer UE2 may include aluminum or an alloy thereof. As another example of this exemplary embodiment, the second lower electrode layer LE2 and the second upper electrode layer UE2 may include different materials.

[0147] The connection pad PDD1 may further include a second insulating interlayer ILD2 disposed between the second lower electrode layer LE2 and the second upper electrode layer UE2. The second insulating interlayer ILD2 may include an inorganic material. The second lower electrode layer LE2 and the second upper electrode layer UE2 may be disposed to be spaced apart from each other in the third direction DR3 by the second insulating interlayer ILD2.

[0148] Figure 8 and Figure 9 A structure is shown in which the second insulating interlayer ILD2 is disposed between the second lower electrode layer LE2 and the second upper electrode layer UE2, however, the present exemplary embodiment should not be limited thereto or thereby. That is, the second upper electrode layer UE2 may be directly disposed on the second lower electrode layer LE2.

[0149] The connection pad PDD1 may further include a third insulating interlayer ILD3 disposed between the first electrode layer EL1 and the second electrode layer EL2. In detail, the third insulating interlayer ILD3 may be disposed between the first upper electrode layer UE1 and the second lower electrode layer LE2.

[0150] Figure 8 and Figure 9 A structure is shown in which the third insulating interlayer ILD3 is disposed between the first upper electrode layer UE1 and the second lower electrode layer LE2, however, the present exemplary embodiment should not be limited thereto or thereby. That is, the second lower electrode layer LE2 may be directly disposed on the first upper electrode layer UE1.

[0151] The first electrode layer EL1 may include a material having a hardness different from that of the second electrode layer EL2. As an example in this exemplary embodiment, the first electrode layer EL1 may have a harder hardness than the second electrode layer EL2. In this case, the second electrode layer EL2 may have a higher polishing level during the polishing process than the first electrode layer EL1. In other words, the polishing amount of the second electrode layer EL2 may be greater than the polishing amount of the first electrode layer EL1.

[0152] Each of the first lower electrodes LE1-1 and LE1-2 and the first upper electrodes UE1-1 and UE1-2 may have the same thickness and the same width. As an example of the present exemplary embodiment, each of the first lower electrodes LE1-1 and LE1-2 and the first upper electrodes UE1-1 and UE1-2 may have a thickness of about 2500 angstroms.

[0153] Each of the second lower electrodes LE2-1, LE2-2, and LE2-3 and the second upper electrodes UE2-1, UE2-2, and UE2-3 may have the same thickness and the same width. As an example of the present exemplary embodiment, each of the second lower electrodes LE2-1, LE2-2, and LE2-3 and the second upper electrodes UE2-1, UE2-2, and UE2-3 may have a thickness of approximately 6000 angstroms.

[0154] The connection pad PDD1 may have a first width W1 in the second direction DR2, and the first lower electrodes LE1-1 and LE1-2 may have a second width W2 that is equal to or different from a width W3 of the second lower electrodes LE2-1, LE2-2, and LE2-3. In addition, the second lower electrodes LE2-1, LE2-2, and LE2-3 may have different widths, and the second upper electrodes UE2-1, UE2-2, and UE2-3 may have different widths.

[0155] refer to Figure 10 The first lower electrodes LE1-1 and LE1-2 are connected to each other through the first bridge electrode BE1, and the first upper electrodes UE1-1 and UE1-2 are connected to each other through the second bridge electrode BE2. The first bridge electrode BE1 and the second bridge electrode BE2 may extend in the second direction DR2, and the second bridge electrode BE2 may be disposed on the first bridge electrode BE1.

[0156] The second lower electrodes LE2-1, LE2-2, and LE2-3 may be connected to each other via the third bridge electrode BE3, and the second upper electrodes UE2-1, UE2-2, and UE2-3 may be connected to each other via the fourth bridge electrode BE4. The third bridge electrode BE3 and the fourth bridge electrode BE4 may extend in the second direction DR2, and the fourth bridge electrode BE4 may be disposed on the third bridge electrode BE3.

[0157] The first electrode layer EL1 and the second electrode layer EL2 may be electrically connected to the data line DL and the power line PL. Figure 10 The structure in which the first electrode layer EL1 and the second electrode layer EL2 of the connection pad PDD1 are branched from the data line DL is shown, however, the connection pad PDD1 may be branched from the power line PL. The first electrode layer EL1 and the second electrode layer EL2 of the connection pad PDD1 may be electrically connected to each other through the contact hole CNT.

[0158] As an example of the present exemplary embodiment, the connection pad PDD1 may further include a third electrode layer. The third electrode layer may be provided on the second electrode layer EL2. The third electrode layer may include a transparent conductive material.

[0159] Reference again Figure 8 , a sealant SM may be provided on the connection pad PDD1 . Figure 8 A structure in which the sealant SM is directly formed on the connection pad PDD1 is shown, however, the present exemplary embodiment should not be limited thereto or thereby. One or more insulating layers may be provided between the sealant SM and the connection pad PDD1. The insulating layer may include an organic material or an inorganic material.

[0160] Figure 11A is an enlarged view illustrating a side surface of a connection pad PDD2 according to another exemplary embodiment of the present disclosure. Figure 11B is an enlarged view illustrating a side surface of a connection pad PDD3 according to another exemplary embodiment of the present disclosure. Figure 11C is an enlarged view showing a side surface of a connection pad PDD4 according to another exemplary embodiment of the present disclosure.

[0161] refer to Figure 11A The connection pad PDD2 includes a first electrode layer EL1 and a second electrode layer EL2. The first electrode layer EL1 includes a first lower electrode layer LE1 and a first upper electrode layer UE1. Figure 8 The first lower electrode layer LE1 shown in FIG. 1 is different in that the first lower electrode layer LE1 includes one lower electrode. The first upper electrode layer UE1 may be disposed on the first lower electrode layer LE1 and may include a plurality of first upper electrodes UE1 - 1 and UE1 - 2 .

[0162] The second electrode layer EL2 has Figure 8 The structure of the second electrode layer EL2 shown in FIG. 1 is substantially the same as that of FIG. 4 , and thus details of the second electrode layer EL2 will be omitted.

[0163] refer to Figure 11B The connection pad PDD3 may further include a third electrode layer EL3 and a fourth insulating interlayer ILD4. The third electrode layer EL3 may be disposed on the second electrode layer EL2. The third electrode layer EL3 may include a material having a hardness different from that of the first electrode layer EL1 and the second electrode layer EL2. As an example of this exemplary embodiment, the third electrode layer EL3 may include a transparent conductive material, such as indium tin oxide. The third electrode layer EL3 may have a hardness less than that of the first electrode layer EL1 and greater than that of the second electrode layer EL2. In this case, the grinding amount of the third electrode layer EL3 may be greater than that of the first electrode layer EL1 and less than that of the second electrode layer EL2.

[0164] The third electrode layer EL3 includes a plurality of sub-electrodes EL3-1 and EL3-2. The sub-electrodes EL3-1 and EL3-2 may be provided on at least one of the second upper electrodes UE2-1, UE2-2, and UE2-3. As an example of this exemplary embodiment, Figure 11BThe third electrode layer EL3 shown in FIG may include two sub-electrodes EL3-1 and EL3-2 (hereinafter referred to as "first sub-electrode and second sub-electrode" respectively) that are smaller in number than the second upper electrodes UE2-1, UE2-2, and UE2-3. In this case, the spacing distance d3 between the first sub-electrode EL3-1 and the second sub-electrode EL3-2 may be greater than the spacing distance between the second upper electrodes UE2-1, UE2-2, and UE2-3, for example, the second distance d2. As another example, a plurality of sub-electrodes may be provided so as to correspond to the second upper electrodes UE2-1, UE2-2, and UE2-3 in a one-to-one correspondence.

[0165] The first electrode layer EL1 and the second electrode layer EL2 have Figure 8 The first electrode layer EL1 and the second electrode layer EL2 shown in FIG. 1 have substantially the same structure, and therefore, details of the first electrode layer EL1 and the second electrode layer EL2 will be omitted.

[0166] The connection pad PDD3 may further include a fourth insulating interlayer ILD4 between the third electrode layer EL3 and the second electrode layer EL2. The fourth insulating interlayer ILD4 may include an inorganic material. The second upper electrode layer UE2 and the third electrode layer EL3 may be arranged to be spaced apart from each other in the third direction DR3 by the fourth insulating interlayer ILD4.

[0167] refer to Figure 11C The second electrode layer EL2 of the connection pad PDD4 includes a second lower electrode layer LE2 and a second upper electrode layer UE2. The second lower electrode layer LE2 includes a plurality of second lower electrodes LE2-1 and LE2-3, and the second upper electrode layer UE2 includes a plurality of second upper electrodes UE2-1 and UE2-3. The second lower electrodes LE2-1 and LE2-3 may be disposed on the first upper electrodes UE1-1 and UE1-2 of the first electrode layer EL1.

[0168] In this case, the second lower electrodes LE2-1 and LE2-3 may be disposed to correspond to the first upper electrodes UE1-1 and UE1-2 in a one-to-one correspondence, and the second upper electrodes UE2-1 and UE2-3 may be disposed to correspond to the second lower electrodes LE2-1 and LE2-3 in a one-to-one correspondence.

[0169] The connection pad PDD4 may further include a third electrode layer EL3 and a fourth insulating interlayer ILD4. The third electrode layer EL3 includes a plurality of sub-electrodes EL3-1 and EL3-2. The sub-electrodes EL3-1 and EL3-2 may be disposed on the second upper electrodes UE2-1 and UE2-3, respectively. That is, the sub-electrodes EL3-1 and EL3-2 may be disposed so as to correspond to the second upper electrodes UE2-1 and UE2-3 in a one-to-one manner.

[0170] Figure 12 is a side perspective view illustrating a display panel 210 according to an exemplary embodiment of the present disclosure. Figure 13A It is along Figure 12 sectional view taken along line IV-IV' shown in FIG. Figure 13B It is along Figure 12 sectional view taken along line VV' shown in FIG.

[0171] refer to Figure 8 、 Figure 12 、 Figure 13A and Figure 13B Due to the difference in hardness between the first electrode layer EL1 and the second electrode layer EL2, the side surface of the connection pad PDD1 may have a concavo-convex structure in the third direction DR3. The side surface electrode SBE provided on the side surface of the connection pad PDD1 has a concavo-convex shape corresponding to the concavo-convex structure provided on the side surface of the connection pad PDD1. In other words, the side surface electrode SBE may have a concavo-convex portion at the contact portion where the side surface electrode SBE and the connection pad PDD1 contact each other.

[0172] When the connecting pad PDD1 also includes a first insulating interlayer ILD1, a second insulating interlayer ILD2 and a third insulating interlayer ILD3, the difference in hardness between the first insulating interlayer ILD1, the second insulating interlayer ILD2 and the third insulating interlayer ILD3 and the first electrode layer EL1 and the second electrode layer EL2 can result in a concave and convex shape on the side surface of the connecting pad PDD1.

[0173] The side surface of the first electrode layer EL1 may be more recessed inward than the side surface SS1 of the first base substrate BS1 and the side surfaces of the first insulating interlayer ILD1, the second insulating interlayer ILD2, and the third insulating interlayer ILD3. In the case where the first electrode layer EL1 includes the first lower electrode layer LE1 and the first upper electrode layer UE1, the side surface of the first lower electrode layer LE1 and the side surface of the first upper electrode layer UE1 may be more recessed inward than the side surface SS1 of the first base substrate BS1 and the side surfaces of the first insulating interlayer ILD1, the second insulating interlayer ILD2, and the third insulating interlayer ILD3.

[0174] The side surface of the second electrode layer EL2 may be more recessed inward than the side surface SS1 of the first base substrate BS1 and the side surfaces of the first insulating interlayer ILD1, the second insulating interlayer ILD2, and the third insulating interlayer ILD3. In the case where the second electrode layer EL2 includes the second lower electrode layer LE2 and the second upper electrode layer UE2, the side surface of the second lower electrode layer LE2 and the side surface of the second upper electrode layer UE2 may be more recessed inward than the side surface SS1 of the first base substrate BS1 and the side surfaces of the first insulating interlayer ILD1, the second insulating interlayer ILD2, and the third insulating interlayer ILD3.

[0175] Due to the difference in hardness between the first electrode layer EL1 and the second electrode layer EL2, the depth of the depression in the side surface of the second electrode layer EL2 can differ from the depth of the depression in the side surface of the first electrode layer EL1. That is, when the hardness of the first electrode layer EL1 is greater than that of the second electrode layer EL2, the depth of the depression in the second electrode layer EL2 can be greater than that of the first electrode layer EL1. This is because the grinding amount of the second electrode layer EL2 is greater than that of the first electrode layer EL1. Due to the difference in grinding amount, a concave-convex structure is formed on the side surface of the connection pad PDD1, and this concave-convex structure is reflected on the side surface electrode SBE. During the ultrasonic bonding process, when the side surface electrode has a concave-convex structure, the friction between the side surface electrode SBE and the drive electrode DBE increases, thereby enhancing metal diffusion. Therefore, the bonding and electrical characteristics between the display panel 210 and the first flexible film CF1 can be improved.

[0176] According to the above, the connection pad includes electrode layers having different hardnesses. Due to the difference in hardness, the grinding amount of the electrode layer can be changed, and due to the difference in grinding amount, a concave-convex structure can be formed on the side surface of the connection pad.

[0177] Since the concavo-convex structure is reflected on the side surface electrode, the friction between the side surface electrode and the driving electrode can be increased during the ultrasonic bonding process. As a result, metal diffusion is increased, and thus, the bonding and electrical characteristics between the display panel and the flexible film can be improved.

[0178] Although exemplary embodiments of the present disclosure have been described, it should be understood that the present disclosure should not be limited to these exemplary embodiments, but rather various changes and modifications may be made by those skilled in the art within the spirit and scope of the present disclosure as claimed below. Therefore, the disclosed subject matter should not be limited to any single embodiment described herein.

Claims

1. A display device, wherein: The display device includes: A display panel including a display area, a non-display area defined outside the display area, pixels disposed in the display area, signal lines connected to the pixels, and connection pads extending from the signal lines and disposed in the non-display area; a side surface electrode provided on one side surface of the display panel and in contact with one side surface of the connection pad; and a flexible membrane comprising a driving electrode directly contacting said side surface electrode, The connecting pad includes: a first electrode layer including a plurality of first electrodes extending in a first direction and spaced apart from each other in a second direction crossing the first direction; and a second electrode layer provided on the first electrode layer and comprising a plurality of second electrodes extending in the first direction and spaced apart from each other in the second direction, wherein the first electrode layer and the second electrode layer have different hardnesses, and The side surface of the first electrode layer and the side surface of the second electrode layer are in direct contact with the side surface electrodes, and The one side surface of the connection pad has a concavo-convex structure in the second direction, and the side surface electrode has a shape corresponding to the concavo-convex structure at a contact portion where the side surface electrode contacts the one side surface of the connection pad.

2. The display device according to claim 1, wherein The first electrode layer includes: a first lower electrode layer; and A first upper electrode layer is provided on the first lower electrode layer, and the first electrode is included in at least one of the first lower electrode layer and the first upper electrode layer.

3. The display device according to claim 2, wherein: The connection pad further includes a first insulating intermediate layer disposed between the first lower electrode layer and the first upper electrode layer.

4. The display device according to claim 2, wherein: The first lower electrode layer includes a plurality of first lower electrodes extending in the first direction and spaced apart from each other in the second direction; and The first upper electrode layer includes a plurality of first upper electrodes extending in the first direction and spaced apart from each other in the second direction.

5. The display device according to claim 4, wherein A side surface of the first lower electrode and a side surface of the first upper electrode contact the side surface electrode. The display device according to claim 4 , wherein: The first lower electrode and the first upper electrode include the same material.

7. The display device according to claim 1, wherein The second electrode layer includes: a second lower electrode layer; and A second upper electrode layer is provided on the second lower electrode layer, and the second electrode is included in at least one of the second lower electrode layer and the second upper electrode layer.

8. The display device according to claim 7, wherein: The connection pad further includes a second insulating interlayer disposed between the second lower electrode layer and the second upper electrode layer.

9. The display device according to claim 7, wherein: The second lower electrode layer includes a plurality of second lower electrodes extending in the first direction and spaced apart from each other in the second direction; and The second upper electrode layer includes a plurality of second upper electrodes extending in the first direction and spaced apart from each other in the second direction.

10. The display device according to claim 9, wherein A side surface of the second lower electrode and a side surface of the second upper electrode contact the side surface electrode.

11. The display device according to claim 9, wherein The second lower electrode and the second upper electrode include the same material.

12. The display device according to claim 1, wherein The first electrodes are spaced apart from each other by a first distance in the second direction, and the second electrodes are spaced apart from each other by a second distance in the second direction.

13. The display device according to claim 12, wherein: The second distance is smaller than the first distance.

14. The display device according to claim 1, wherein The connection pad further includes a third insulating intermediate layer interposed between the first electrode layer and the second electrode layer.

15. The display device according to claim 14, wherein The display panel further includes a base substrate, and one side surface of the base substrate is aligned with a side surface of the third insulating interlayer.

16. The display device according to claim 15, wherein: A side surface of the first electrode layer is more recessed inwardly than the one side surface of the base substrate and the side surface of the third insulating interlayer; and A side surface of the second electrode layer is more recessed inward than the one side surface of the base substrate and the side surface of the third insulating interlayer.

17. The display device according to claim 16, wherein: The side surface of the second electrode layer is more recessed than the side surface of the first electrode layer with respect to the one side surface of the base substrate.

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