Display device

Abstract

A display device includes: a substrate including a display area and a sensor area, the display area including a plurality of main pixels, and the sensor area including a plurality of auxiliary pixels and a plurality of transmission portions; and a plurality of wirings disposed along edges of the plurality of transmission portions and electrically connecting the plurality of auxiliary pixels to each other. The plurality of wirings include first-direction wirings extending in a first direction and arranged in a second direction intersecting the first direction, and second-direction wirings extending in the second direction and arranged in the first direction, and the wirings among the first-direction wirings adjacent to the transmission portions include first extension portions.

Description

Technical Field

[0001] Exemplary embodiments of the present disclosure generally relate to a display device. Background Art

[0002] With the development of the information society, the demand for display devices (for displaying images) has increased in various forms. For example, display devices are applied to various suitable electronic appliances, such as smart phones, digital cameras, laptop computers, navigators, and / or smart televisions. The display device may be a flat panel display, such as a liquid crystal display device, a field emission display device, an organic light emitting display device, and / or a quantum dot emission display device.

[0003] Recently, various methods for reducing or minimizing the ratio of the non-display area to the display area of a display device have been studied. One of the various methods is a method of arranging various sensors under the display panel instead of in holes formed in the display panel. A display device in which sensors are arranged under the display panel may include a sensor area provided with a pixel area (for implementing an image) and a transmissive portion (for arranging sensors). Summary of the Invention

[0004] Aspects of the present disclosure are directed to a display device in which wirings are disposed around a transmissive portion such that the transmissive portion is formed in an octagonal shape or a circular shape, thereby improving the light reception amount and light reception quality of a sensor device disposed under the transmissive portion.

[0005] Additional features of the present disclosure will be set forth in the following description, and in part will be apparent from the description, or may be learned by practice of the inventive concept.

[0006] According to an embodiment of the present disclosure, a display device includes: a substrate including a display area and a sensor area, the display area including a plurality of main pixels, and the sensor area including a plurality of auxiliary pixels and a plurality of transmissive portions; and a plurality of wirings disposed along edges of the plurality of transmissive portions and electrically connecting the plurality of auxiliary pixels to each other. The plurality of wirings include a plurality of first-direction wirings extending in a first direction and disposed in a second direction intersecting the first direction, and a plurality of second-direction wirings extending in the second direction and disposed in the first direction, and the wirings among the plurality of first-direction wirings adjacent to the transmissive portion include first extension portions.

[0007] Each of the plurality of transmissive portions may have a polygonal shape, a circular shape, or an elliptical shape in a plan view.

[0008] Each of the plurality of transmissive portions may have an octagonal shape in a plan view.

[0009] The display device may further include a sensor device that overlaps the plurality of transmissive portions in the thickness direction of the substrate, and the sensor device is configured to utilize infrared light, visible light, and / or sound.

[0010] The plurality of first-direction wirings may include: a first wiring for applying an initialization voltage to the auxiliary pixels arranged in the first direction among the plurality of auxiliary pixels; a second wiring for applying a first scan signal to the auxiliary pixels arranged in the first direction; a third wiring for applying a second scan signal to the auxiliary pixels arranged in the first direction; and a fourth wiring for applying a light emission control signal to the auxiliary pixels arranged in the first direction.

[0011] The plurality of second-direction wirings may include: a fifth wiring for applying a data voltage to the auxiliary pixels arranged in the second direction among the plurality of auxiliary pixels; and a sixth wiring for applying a first power to the auxiliary pixels arranged in the second direction.

[0012] In the region where the auxiliary pixels arranged in the first direction are arranged, the second wiring, the third wiring, and the fourth wiring may be on the substrate, the first insulating layer may be on the second wiring, the third wiring, and the fourth wiring, and the first wiring may be on the first insulating layer.

[0013] At the edges of the plurality of transmissive portions, the second wiring and the fourth wiring may be on the substrate, and the connection wiring of the first wiring and the third wiring may be on the first insulating layer.

[0014] The connection wiring of the third wiring may be connected to the third wiring through a first contact hole penetrating the first insulating layer.

[0015] In the region where the auxiliary pixels arranged in the first direction are arranged, the second insulating layer may be on the first wiring, and the fifth wiring and the sixth wiring may be on the second insulating layer.

[0016] At the edges of the plurality of transmissive portions, the fifth wiring may be on the second insulating layer, the third insulating layer may be on the fifth wiring, and the connection wiring of the sixth wiring may be on the third insulating layer.

[0017] The connection wiring of the sixth wiring may be connected to the sixth wiring through a second contact hole penetrating the third insulating layer.

[0018] Each of the first wiring to the sixth wiring may include a bent portion that is bent at the edges of the plurality of transmissive portions in a plan view, and a first extension portion may extend from the bent portion of the fourth wiring.

[0019] The first extension portion may have a triangular shape in a plan view.

[0020] The first extension portion may include a first bevel edge facing the bent portion, and for each transmissive portion, the angle of the first bevel edge with respect to the first direction may be different.

[0021] The sixth wiring may include a second extension portion extending from the bent portion of the sixth wiring toward the transmissive portion.

[0022] The second extension portion may have a triangular shape in a plan view.

[0023] The first extension portion may include the same material as the fourth wiring (e.g., the same material), and the second extension portion may include the same material as the sixth wiring (e.g., the same material).

[0024] The second extension portion may include a second bevel edge facing the bent portion, and the angle of the second bevel edge with respect to the first direction may be different from the angle of the first bevel edge with respect to the first direction.

[0025] According to another embodiment of the present disclosure, a display device includes: a substrate including a display area and a sensor area, the display area including a plurality of main pixels, and the sensor area including a plurality of auxiliary pixels and a plurality of transmissive portions; and a plurality of wirings disposed along edges of the plurality of transmissive portions and electrically connecting the plurality of auxiliary pixels to each other. The plurality of wirings includes a plurality of first-direction wirings extending in a first direction and disposed in a second direction intersecting the first direction, and a plurality of second-direction wirings extending in the second direction and disposed in the first direction, and each of the plurality of first-direction wirings and the plurality of second-direction wirings includes at least two bent portions at an edge of the transmissive portion.

[0026] The area of one of the plurality of transmissive portions may be larger than the light-emitting area of one of the plurality of auxiliary pixels.

[0027] The plurality of first-direction wirings and the plurality of second-direction wirings may overlap each other in a thickness direction of the substrate at at least two bent portions.

[0028] It should be understood that the foregoing general description and the following detailed description are both exemplary and explanatory and are intended to provide further explanation of the claimed subject matter of the present disclosure and its equivalents. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings, which are included to provide a further understanding of the present disclosure and are incorporated in and constitute a part of this specification, illustrate exemplary embodiments of the present disclosure and, together with the description, serve to explain the subject matter of the present disclosure.

[0030] Figure 1 is a schematic perspective view of a display device according to an embodiment.

[0031] Figure 2 is a schematic cross-sectional view of a display device according to an embodiment.

[0032] Figure 3 is a schematic plan view of a display device according to an embodiment.

[0033] Figure 4 is a view showing wirings provided on a transmissive portion according to an embodiment.

[0034] Figure 5A and Figure 5B is a view showing the degree of diffraction of light emitted from a sensor device when the transmissive portion has a rectangular shape.

[0035] Figure 6A and Figure 6B is a view showing the degree of diffraction of light emitted from a sensor device when the transmissive portion has a circular shape.

[0036] Figure 7 is an equivalent circuit diagram of a pixel for active matrix driving that can be provided in a display area of a display device according to an embodiment.

[0037] Figure 8 is a plan view specifically showing an auxiliary pixel according to an embodiment.

[0038] Figure 9 is along Figure 8 a cross-sectional view taken along line I-I'.

[0039] Figure 10 is according to an embodiment of Figure 4 an enlarged view of region A.

[0040] Figure 11 is along Figure 10 a cross-sectional view taken along line III-III'.

[0041] Figure 12 is along Figure 10 a cross-sectional view taken along line IV-IV'.

[0042] Figure 13 is according to another embodiment of Figure 4 an enlarged view of region A.

[0043] Figure 14A and Figure 14B are both enlarged views of region A according to other embodiments of Figure 4 ...

[0044] Figure 15 is according to another embodiment of Figure 4 an enlarged view of region B.

[0045] Figure 16 It is a view showing wirings provided on a transmissive portion according to another embodiment.

[0046] Figure 17 It is a view showing wirings provided on a transmissive portion according to another embodiment.

[0047] Figure 18 is Figure 17 an enlarged view of region C of

[0048] Figure 19 It is a view showing wirings provided on a transmissive portion according to another embodiment.

[0049] Figure 20 is Figure 19 an enlarged view of region D of Detailed Description

[0050] In the following description, for purposes of explanation, numerous specific details are set forth in order to provide a thorough understanding of the various exemplary embodiments of the present disclosure. As used herein, "embodiment" and "implementation" are interchangeable words for non-limiting examples of a device or method that employs one or more of the inventive concepts disclosed herein. However, it will be apparent that the various exemplary embodiments may be practiced without these specific details or with one or more equivalent arrangements. In other instances, known structures and devices (e.g., well-known) are shown in block diagram form to avoid unnecessarily obscuring the various exemplary embodiments. Additionally, the various exemplary embodiments may be different, but not necessarily exclusive. For example, without departing from the subject matter of the present disclosure, the specific shape, configuration, and / or characteristics of one exemplary embodiment may be utilized or implemented in another exemplary embodiment.

[0051] Unless otherwise specified, the illustrated exemplary embodiments should be understood to provide exemplary features of different details of some ways in which the subject matter of the present disclosure may be implemented in practice. Thus, unless otherwise specified, the features, sensor devices, modules, layers, films, panels, regions, and / or aspects, etc. (hereinafter individually or collectively referred to as "elements") of the various embodiments may be combined, separated, interchanged, and / or rearranged in other ways without departing from the subject matter of the present disclosure.

[0052] In the accompanying drawings, the use of cross-hatching and / or shading is generally provided to clarify the boundaries between adjacent elements. Thus, unless otherwise specified, neither the presence nor the absence of cross-hatching or shading conveys or indicates any preference or requirement for a particular material, material property, size, scale, commonality between the elements shown and / or any other characteristic, attribute, property, etc. of the elements. Additionally, in the accompanying drawings, for clarity and / or descriptive purposes, the sizes and relative sizes of the elements may be exaggerated. When an exemplary embodiment can be implemented in different ways, the specific processes may be performed in a different order than described. For example, two consecutively described processes may be performed substantially simultaneously or in an order opposite to the described order. Further, like reference numerals refer to like elements.

[0053] When an element such as a layer is referred to as being "on," "connected to," or "coupled to" another element or layer, the element can be directly on, directly connected to, or directly coupled to the other element or layer, or intervening elements or layers may be present. However, when an element or layer is referred to as being "directly" on, "directly connected to," or "directly coupled to" another element or layer, no intervening elements or layers are present. For this reason, the term "connected" can refer to physical connection, electrical connection, and / or fluid connection with or without intervening elements. Additionally, the D1 axis, D2 axis, and D3 axis are not limited to the three axes of a rectangular coordinate system (such as the x-axis, y-axis, and z-axis), but can be interpreted in a broader sense. For example, the D1 axis, D2 axis, and D3 axis can be perpendicular to each other, or can represent different directions that are not perpendicular to each other. For the purposes of this disclosure, "at least one of X, Y, and Z" and "at least one selected from the group consisting of X, Y, and Z" can be interpreted as only X, only Y, only Z, or any combination of two or more of X, Y, and Z, such as, for example, XYZ, XYY, YZ, and ZZ. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] Although the terms "first," "second," etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Thus, without departing from the teachings of this disclosure, the first element discussed below may be referred to as the second element.

[0055] For descriptive purposes, spatial relative terms such as "below", "beneath", "under", "lower", "above", "upper", "on top of", "over", "side" (e.g., as in "sidewall") may be used herein and are thus used to describe the relationship of one element to another element as shown in the figures. Except for the orientation depicted in the figures, spatial relative terms are intended to encompass different orientations of the device during use, operation, and / or manufacturing. For example, if the device in the figures is turned over, an element described as "below" or "beneath" other elements or features will then be oriented "above" the other elements or features. Thus, the exemplary term "below" can encompass both an upper and a lower orientation. In addition, the device may be otherwise oriented (e.g., rotated 90 degrees or at other orientations), and thus, the spatial relative descriptors used herein should be interpreted accordingly.

[0056] The terms used herein are for the purpose of describing particular embodiments only and are not intended to be limiting. Unless the context clearly dictates otherwise, the singular forms "a", "an", and "the" as used herein are also intended to include the plural forms. Additionally, when used in this specification, the terms "comprises" and / or "comprising" indicate the presence of the stated features, integers, steps, operations, elements, sensor devices, and / or groups thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, sensor devices, and / or groups thereof. It should also be noted that, as used herein, the terms "substantially", "about", and other similar terms are used as approximate terms and not as terms of degree, and are thus used to encompass the inherent deviations in the measured, calculated, and / or provided values that are recognized by those of ordinary skill in the art.

[0057] Various exemplary embodiments are described herein with reference to cross-sectional views and / or exploded views, which are schematic illustrations of idealized exemplary embodiments and / or intermediate structures. Accordingly, variations in the shapes of the illustrations due to, for example, manufacturing techniques and / or tolerances are to be expected. Thus, the exemplary embodiments disclosed herein should not necessarily be construed as limited to the particular shapes of the regions shown, but include shape deviations resulting from, for example, manufacturing. In this manner, the regions shown in the figures are essentially schematic, and the shapes of these regions may not reflect the actual shape of the regions of the device and are thus not necessarily intended to be limiting.

[0058] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs as part of it. Terms such as those defined in common dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and should not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0059] Figure 1 is a schematic perspective view of a display device according to an embodiment. Refer to Figure 1 , the display device 1 includes a display area DA for implementing (e.g., displaying) an image and a non-display area NDA for not implementing an image. The display device 1 can provide a main image by using light emitted from a plurality of main pixels Pm arranged in the display area DA.

[0060] The display device 1 includes a sensor area SA. As will be described in more detail later with reference to Figure 2 , the sensor area SA can be an area in which a sensor device (e.g., a sensor) using infrared light, visible light, and / or sound is provided. The sensor area SA can include a transmissive portion (e.g., a transmissive area) TA through which light and / or sound output from the sensor device to the outside or propagating from the outside toward the sensor device can pass.

[0061] A plurality of auxiliary pixels Pa can be arranged in the sensor area SA, and a set or predetermined image can be provided by using light emitted from the plurality of auxiliary pixels Pa. The image provided from the sensor area SA can be an auxiliary image and can have a lower resolution than the image provided from the display area DA. That is, since the sensor area SA includes the transmissive portion TA through which light and / or sound passes, the number of auxiliary pixels Pa per unit area can be less than the number of main pixels Pm per unit area.

[0062] The sensor area SA can be provided on one side of the display area DA. In an embodiment, in Figure 1 it is shown that the sensor area SA is provided on the upper side of the display area DA and is provided between the non-display area NDA and the display area DA.

[0063] Hereinafter, although an organic light-emitting display device is described as an example of the display device 1 according to an embodiment of the present disclosure, the display device of the present disclosure is not limited thereto. In another embodiment, various suitable types (kinds) of display devices such as inorganic light-emitting display devices and / or quantum dot light-emitting display devices can be used as the display device 1.

[0064] Although in Figure 1The sensor area SA is shown to be provided on the upper side of the display area DA having a rectangular shape, but the present disclosure is not limited thereto. The shape of the display area DA may be circular, elliptical, or a polygon such as a triangle or a pentagon. The position and number of the sensor areas SA may also be changed in various suitable ways.

[0065] Figure 2 is a schematic cross-sectional view of a display device according to an embodiment and may correspond to a cross-section taken along Figure 1 line A-A' thereof.

[0066] Referring Figure 2 , the display device 1 may include a display panel PN including display elements and a sensor device SS corresponding to the sensor area SA.

[0067] The display panel PN may include a first substrate SUB1, a display element layer DE provided on the first substrate SUB1, and a thin film encapsulation layer TFE as an encapsulation member for encapsulating the display element layer DE. The display panel PN may further include a cover pad CP provided under the first substrate SUB1.

[0068] The first substrate SUB1 may include glass or a polymer resin. Examples of the polymer resin may include polyethersulfone (PES), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polyphenylene sulfide (PPS), polyacrylate, polyimide (PI), polycarbonate (PC), and cellulose acetate propionate (CAP). The first substrate SUB1 including the polymer resin may have flexible, rollable, and / or bendable characteristics. In one embodiment, the first substrate SUB1 may have a multilayer structure including an inorganic layer and a layer including the above polymer resin.

[0069] The display element layer DE may include a circuit layer including thin film transistors TFT or TFT', an organic light emitting diode OLED or OLED' as a display element, and an insulating layer IL or IL' provided between the circuit layer and the organic light emitting diode OLED or OLED'.

[0070] The display area DA may be provided with a main pixel Pm including a main thin film transistor TFT and an organic light emitting diode OLED connected to the main thin film transistor TFT, and the sensor area SA may be provided with an auxiliary pixel Pa including an auxiliary thin film transistor TFT' and an organic light emitting diode OLED' connected to the auxiliary thin film transistor TFT'.

[0071] The sensor region SA may be provided with a transmissive portion TA in which no auxiliary thin film transistor TFT’ and display element are provided. The transmissive portion TA may be understood as the region through which the light / signal emitted from the sensor device SS or the light / signal incident on the sensor device SS passes through.

[0072] The sensor device SS may be located in the sensor region SA. The sensor device SS may be an electronic component that utilizes light or sound. For example, the sensor device SS may be a sensor for receiving and utilizing light (such as an infrared sensor), a sensor for measuring distance or identifying fingerprints by outputting and detecting light or sound, a small lamp for outputting light, a speaker for outputting sound, and / or a camera for taking images. The electronic component that utilizes light may also use light of various suitable wavelength bands, such as visible light, infrared light, and / or ultraviolet light. The number of sensor devices SS arranged in the sensor region SA may be provided as multiple. For example, as the sensor device SS, a light emitting element and a light receiving device may be provided together in one sensor region SA. In an alternative embodiment, a light emitting unit and a light receiving unit may be provided concurrently or simultaneously in one sensor device SS. Although for ease of illustration, in the drawings one sensor device SS is shown as corresponding to one auxiliary pixel Pa and the transmissive portion TA, one sensor device SS may be provided to correspond to multiple auxiliary pixels Pa and the transmissive portion TA.

[0073] The lower metal layer BSM may be provided in the sensor region SA. The lower metal layer BSM may be provided under the auxiliary thin film transistor TFT’ to correspond to the auxiliary thin film transistor TFT’. The lower metal layer BSM may prevent or substantially prevent external light from reaching the auxiliary pixel Pa including the auxiliary thin film transistor TFT’. For example, the lower metal layer BSM may prevent or substantially prevent the light emitted from the sensor device SS from reaching the auxiliary pixel Pa.

[0074] In some embodiments, a constant voltage or signal is applied to the lower metal layer BSM to reduce or prevent damage to the pixel circuit due to electrostatic discharge.

[0075] The thin film encapsulation layer TFE may include at least one inorganic encapsulation layer and at least one organic encapsulation layer. In this regard, Figure 2 the first inorganic encapsulation layer TFE1 and the second inorganic encapsulation layer TFE3 and the organic encapsulation layer TFE2 located between the first inorganic encapsulation layer TFE1 and the second inorganic encapsulation layer TFE3 are shown.

[0076] The first inorganic encapsulation layer TFE1 and the second inorganic encapsulation layer TFE3 may include at least one inorganic insulating material selected from alumina, titanium oxide, tantalum oxide, hafnium oxide, zinc oxide, silicon oxide, silicon nitride, and silicon oxynitride. The organic encapsulation layer TFE2 may include a polymeric material. Examples of the polymeric material may include acrylic resin, epoxy resin, polyimide, and polyethylene.

[0077] The cover pad CP may be attached to the lower surface of the first substrate SUB1. The cover pad CP may have an opening CP_OP corresponding to the sensor area SA. The opening CP_OP is provided in the cover pad CP, thereby improving the light transmittance of the sensor area SA.

[0078] In one or more embodiments, the cover pad CP may include a protective layer and / or a cushion layer.

[0079] The protective layer may protect the first substrate SUB1 from external impacts occurring at the bottom of the first substrate SUB1 (e.g., applied through the bottom of the first substrate SUB1). For example, the protective layer may protect the first substrate SUB1 from contamination, scratching, and / or impacts that may occur during the manufacture and / or use of the display device 1. The protective layer may contain components such as fine powder silica, silicone defoamer, additives, antistatic agents, petroleum naphtha solvent, and / or diethylene glycol monoethyl ether acetate.

[0080] The cushion layer may be provided on the lower surface of the protective layer. The cushion layer has an adhesive layer on one of its surfaces and thus may be attached to the lower surface of the protective layer through the adhesive layer.

[0081] The cushion layer may include a buffer member capable of absorbing external impacts. The buffer member may include a material capable of absorbing impacts. In an embodiment, the buffer member may be formed of a sponge in which an elastic polymer resin, a rubber liquid, a polyurethane material, and / or an acrylic material is foamed.

[0082] In addition to the above buffer member, the cushion layer may further include a light-shielding member for preventing or substantially preventing light emitted from the first substrate SUB1 from leaking to the bottom of the first substrate SUB1 and / or a heat-dissipating member for scattering heat generated by the display device 1. The heat-dissipating member may include a metal (e.g., copper (Cu), silver (Ag), copper alloy, and / or aluminum (Al)) having a suitable (e.g., excellent) thermal conductivity, or may include a carbon-based material (e.g., graphite and / or graphene). The aforementioned buffer member, light-shielding member, and heat-dissipating member may be stacked in the thickness direction.

[0083] In one or more embodiments, a lower protective film for supporting and protecting the first substrate SUB1 may be further provided between the first substrate SUB1 and the cover pad CP.

[0084] The lower protective film can be set to overlap with the entire sensor area SA and can include polyethylene terephthalate (PET) and / or polyimide (PI).

[0085] The area of the sensor area SA can be larger than the area of the region in which the sensor device SS is provided. Accordingly, the area of the opening CP_OP provided in the cover pad CP may not match the area of the sensor area SA. For example, the area of the opening CP_OP may be smaller than the area of the sensor area SA.

[0086] A plurality of sensor devices SS can be provided in the sensor area SA. The plurality of sensor devices SS can have different functions from each other.

[0087] In one or more embodiments, an input detection member for detecting a touch input, an antireflection member including a polarizer and a retarder or including a color filter and a black matrix, and / or a transparent window can be further provided on the display panel PN.

[0088] Meanwhile, although the thin film encapsulation layer TFE is described as an encapsulation member for encapsulating the display element layer DE in the present embodiment, the present disclosure is not limited thereto. For example, an encapsulation substrate attached to the first substrate SUB1 by a sealant and / or a frit can be used as an encapsulation member for encapsulating the display element layer DE.

[0089] Figure 3 is a schematic plan view of a display device according to an embodiment.

[0090] Reference Figure 3 , the display panel PN is disposed in the display area DA and includes a plurality of main pixels Pm. Each of the main pixels Pm can include a display element such as an organic light emitting diode. Each main pixel Pm can emit, for example, red light, green light, blue light, or white light through the organic light emitting diode. As used herein, as described above, the main pixel Pm can be understood as a sub-pixel that emits light of any one of red, green, blue, and white. Referring to the above Figure 2 The encapsulation member described can cover the display area DA to protect the display area DA from external air and / or moisture.

[0091] The sensor area SA can be provided on one side of the display area DA, and a plurality of auxiliary pixels Pa can be arranged in the sensor area SA. Each of the auxiliary pixels Pa can include a display element such as an organic light-emitting diode. Each of the auxiliary pixels Pa can emit, for example, red light, green light, blue light, or white light through the organic light-emitting diode. As used herein, as described above, the auxiliary pixel Pa can be understood as a sub-pixel that emits light of any one of red, green, blue, and white. At the same time, the sensor area SA can be provided with a transmissive portion TA disposed between the auxiliary pixels Pa. At least one sensor device SS can be provided corresponding to the lower portion of the sensor area SA of the display panel PN.

[0092] In an embodiment, one main pixel Pm and one auxiliary pixel Pa can include the same pixel circuit. However, the present disclosure is not limited thereto. The pixel circuit included in the main pixel Pm and the pixel circuit included in the auxiliary pixel Pa can be different from each other.

[0093] Since the sensor area SA includes the transmissive portion TA, the resolution of the sensor area SA can be lower than the resolution of the display area DA. For example, the resolution of the sensor area SA can be about 1 / 2 of the resolution of the display area DA.

[0094] Each of the pixels Pm and Pa can be electrically connected to an external circuit disposed in the non-display area NDA. The first scan driving circuit DC1, the second scan driving circuit DC2, the terminal TM, the data driving circuit DD, the first power supply line PSL1, and the second power supply line PSL2 are disposed in the non-display area NDA.

[0095] The first scan driving circuit DC1 can provide a scan signal to each of the pixels Pm and Pa through the scan line SL. The first scan driving circuit DC1 can provide a light emission control signal to each pixel through the light emission control line EL. The second scan driving circuit DC2 can be provided in parallel with the first scan driving circuit DC1, with the display area DA therebetween. Some of the pixels Pm and Pa disposed in the display area DA and the sensor area SA can be electrically connected to the first scan driving circuit DC1, and the remaining pixels of the pixels Pm and Pa can be connected to the second scan driving circuit DC2. In another embodiment, the second scan driving circuit DC2 can be omitted.

[0096] The terminal TM can be disposed on one side of the first substrate SUB1. The terminal TM can be exposed without being covered by an insulating layer and can be electrically connected to the printed circuit board PCB. The terminal PCB-P of the printed circuit board PCB can be electrically connected to the terminal TM of the display panel PN. The printed circuit board PCB transmits the signals or power of the controller to the display panel PN. The control signal generated by the controller can be transmitted to the first scan driving circuit DC1 and the second scan driving circuit DC2 through the printed circuit board PCB. The controller can supply the first driving voltage and the second driving voltage (refer to Figure 7 ) to the first power supply line PSL1 and the second power supply line PSL2 through the first connection line PBL1 and the second connection line PBL2 respectively. The first driving voltage is supplied to each of the pixels Pm and Pa through the driving voltage line PL connected to the first power supply line PSL1, and the second driving voltage can be supplied to the counter electrode of each of the pixels Pm and Pa connected to the second power supply line PSL2.

[0097] The data driving circuit DD is electrically connected to the data line DL. The data signal of the data driving circuit DD can be supplied to each of the pixels Pm and Pa through the connection line DBL connected to the terminal TM and the data line DL connected to the connection line DBL. Although in Figure 3 it is shown that the data driving circuit DD is disposed on the printed circuit board PCB, in another embodiment, the data driving circuit DD can be disposed on the first substrate SUB1. For example, the data driving circuit DD can be disposed between the terminal TM and the first power supply line PSL1.

[0098] The first power supply line PSL1 can include a first sub-line SBL1 and a second sub-line SBL2. The first sub-line SBL1 and the second sub-line SBL2 extend in the X direction parallel to each other, with the display area DA therebetween. The second power supply line PSL2 can partially surround the display area DA in an annular shape with one side open.

[0099] Figure 4 is a view showing the wiring disposed on the transmissive portion according to an embodiment.

[0100] Refer to Figure 4 , the sensor area SA can include a plurality of auxiliary pixels Pa, a transmissive portion TA, and a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 connecting the plurality of auxiliary pixels Pa.

[0101] At least one pixel Pa can be included in the pixel group Pg. In Figure 4As shown, a pixel group Pg includes eight auxiliary pixels Pa arranged in two rows and four columns. However, the present disclosure is not limited thereto. The number and arrangement of pixels Pa included in a pixel group Pg can be variously and appropriately changed. For example, a pixel group Pg can include three auxiliary pixels Pa arranged in one row and three columns, or can include four auxiliary pixels Pa arranged in two rows and two columns. As used herein, the auxiliary pixel Pa can refer to a sub-pixel that emits red, green, blue, and white light.

[0102] Since no display element is provided, the transmissive portion TA is a region having a high light transmittance, and the sensor region SA can be provided with a plurality of transmissive portions TA. The transmissive portions TA can be arranged alternately with the pixel groups Pg in the first direction X and / or the second direction Y. In an alternative embodiment, the transmissive portions TA can be arranged to surround the pixel groups Pg. In an alternative embodiment, the auxiliary pixels Pa can be arranged to surround the transmissive portions TA.

[0103] The size of the transmissive portion TA can be larger than the size of the light-emitting region of at least one auxiliary pixel Pa. In some embodiments, the size of the transmissive portion TA can be equal to or larger than the size of a pixel group Pg.

[0104] A plurality of pixel groups Pg can be electrically connected to each other through a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2. For example, pixel groups Pg arranged in a matrix form can be electrically connected to each other through four wirings VIL, SLK-1, SLK, and ELK extending in the first direction X and two wirings DL and VDDL2 extending in the second direction Y.

[0105] According to an embodiment, the four wirings VIL, SLK-1, SLK, and ELK extending in the first direction X can include an initialization voltage line VIL, a K-1 (i.e., k-1) scan line SLK-1, a K scan line SLK, and a light emission control line ELK. The two wirings DL and VDDL2 extending in the second direction Y can include a data line DL and a second sub-driving voltage line VDDL2.

[0106] When a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 are formed on the transmissive portion TA, for the light transmission of the transmissive portion TA, the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 can be arranged along the shape of the edge of the transmissive portion TA. For example, the shape of the transmissive portion TA surrounded by a plurality of pixel groups Pg can be a quadrilateral, and the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 can be formed to bend at right angles near the four vertices of the quadrilateral.

[0107] Some of the multiple wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 can be set to overlap with each other in the third direction (Z direction). As Figure 4 shown, based on the rectangular transmissive portion TA provided in the center, data lines DL extending in the second direction (Y direction) on two auxiliary pixels Pa arranged in a row adjacent to the upper side of the transmissive portion TA (as part of a pixel group Pg arranged in two rows and four columns) can be set to overlap in some regions in the third direction (Z direction) with an initialization voltage line VIL, a (K-1)th scan line SLK-1, a Kth scan line SLK, and a light emission control line ELK that extend in the first direction (X direction) and are sequentially arranged in the second direction (Y direction).

[0108] The light emission control line ELK provided closest to the center of the transmissive portion TA can include an extension portion ELK_EX in some regions. For example, the extension portion ELK_EX can be formed in a triangular shape in a region of the light emission control line ELK. A region of the light emission control line ELK can be a bent portion formed by bending at right angles at four vertices of the rectangular transmissive portion TA. That is, the rectangular transmissive portion TA includes the extension portion ELK_EX at four vertices and thus can have an octagonal shape.

[0109] Reference Figure 2 , a sensor device SS (e.g., a sensor) using infrared light, visible light, and / or sound can be provided below the multiple transmissive portions TA. That is, light and / or sound output from the sensor device SS to the outside or propagated from the outside to the sensor device SS can pass through the multiple transmissive portions TA. According to an embodiment, when a deposition material including an opaque metal component is deposited on the transmissive portion TA, the light transmittance can be reduced by about 30% or more. The multiple wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 provided on the transmissive portion TA and the multiple extension portions ELK_EX can include an opaque metal. Hereinafter, reference will be made to Figure 5A , Figure 5B , Figure 6A and Figure 6B to describe the reason for providing the extension portion ELK_EX on the transmissive portion TA.

[0110] Figure 5A and Figure 5B are views showing the diffraction degree of light emitted from the sensor device when the transmissive portion has a rectangular shape. Figure 6A and Figure 6B are views showing the diffraction degree of light emitted from the sensor device when the transmissive portion has a circular shape.

[0111] Reference Figure 5A ,Figure 5B , Figure 6A and Figure 6B , as shown in Figure 5A and Figure 6A , the area marked in black can correspond to (for example, can represent) the area provided with the above display element, and the rectangular and circular areas marked in white can correspond to (for example, can represent) the area provided with the transmission part TA.

[0112] As shown in Figure 5B and Figure 6B , assuming that light is emitted from the rectangular and circular openings, the light passing through the rectangular opening diffracts in a cross shape, while the light passing through the circular opening has no large difference in the up, down, left, and right directions. That is, even when the aperture ratios of the rectangular opening and the circular opening (for example, the ratio of the area of the rectangular opening to the total area and the ratio of the area of the circular opening to the total area) are the same, less diffraction phenomenon may occur at the circular opening than at the rectangular opening.

[0113] Diffraction phenomenon, as one of the representative wave phenomena, is the phenomenon that when light waves and / or sound waves pass through an obstacle or a slit, the wave propagates to the back of the obstacle or the slit. When there is an obstacle with a slit in the path of a particle, the particle passes through the slit and propagates linearly (for example, along a straight path). In contrast, in the case of a wave, the wave not only propagates along the straight path passing through the slit, but also propagates to a set or predetermined range around the straight path. Like this, diffraction is the phenomenon that the wave bends and reaches an area where the particle cannot reach.

[0114] The light and / or sound output from a sensor device SS such as a sensor provided below the transmission part TA to the outside or propagated from the outside to the sensor device SS can be transmitted. In this case, the greater the above diffraction phenomenon, the lower the detection ability of the sensor device SS (for example, the sensor). The reason for this is that since the wave not only propagates along the straight path passing through the slit, but also, with the increase of diffraction, propagates to a set or predetermined range around the straight path, the amount of light and / or sound propagating on the straight path may decrease. That is, the emission amount and incident amount of light and / or sound utilized by the sensor device SS (for example, the sensor) may decrease. Therefore, in order to maintain the good detection ability of the sensor device SS (for example, the sensor) provided below the transmission part TA, it is desirable to reduce or minimize the diffraction phenomenon of the transmission part TA.

[0115] Hereinafter, the layout relationship of the plurality of wirings arranged on the plurality of auxiliary pixels Pa and the plurality of transmission parts TA will be described in more detail with reference to Figures 7 to 12 .

[0116] Figure 7 is a circuit diagram specifically showing the sub-pixels according to the embodiment.

[0117] Refer toFigure 7 , the pixel circuit PC can be connected to the (K - 1)-th (K is a positive integer greater than or equal to 2) scan line SLK - 1, the K-th scan line SLK, and the j-th (j is a positive integer) data line Dj. In addition, the pixel circuit PC can be connected to a first driving voltage line VDDL supplied with a first driving voltage, an initialization voltage line VIL supplied with an initialization voltage, and a second driving voltage line VSSL supplied with a second driving voltage.

[0118] The pixel circuit PC includes a driving transistor DT, a light-emitting element LD, a switching element, and a first capacitor C1. The switching element includes first to sixth transistors ST1, ST2, ST3, ST4, ST5, and ST6.

[0119] The driving transistor DT may include a gate electrode, a first electrode, and a second electrode. The gate electrode may be an upper gate electrode provided on the active layer of the driving transistor DT.

[0120] The gate electrode of the driving transistor DT can be connected to the first electrode of the first capacitor C1, the first electrode of the driving transistor DT can be connected to the first driving voltage line VDDL through the fifth transistor ST5, and the second electrode of the driving transistor DT can be electrically connected to the anode electrode of the light-emitting element LD through the sixth transistor ST6. The driving transistor DT receives a data signal according to the switching operation of the second transistor ST2 and supplies a driving current Ids to the light-emitting element LD.

[0121] The light-emitting element LD emits light according to the driving current Ids. The amount of light emitted by the light-emitting element LD can be proportional to the driving current Ids.

[0122] The light-emitting element LD can be an organic light-emitting diode including an anode electrode, a cathode electrode, and an organic light-emitting layer provided between the anode electrode and the cathode electrode. In an alternative embodiment, the light-emitting element LD can be an inorganic light-emitting element including an anode electrode, a cathode electrode, and an inorganic semiconductor layer provided between the anode electrode and the cathode electrode. In an alternative embodiment, the light-emitting element LD can be a quantum dot light-emitting element including an anode electrode, a cathode electrode, and a quantum dot light-emitting layer provided between the anode electrode and the cathode electrode. In an alternative embodiment, the light-emitting element LD can be a micro light-emitting diode.

[0123] The anode electrode of the light-emitting element LD can be connected to the first electrode of the fourth transistor ST4 and the second electrode of the sixth transistor ST6, and the cathode electrode of the light-emitting element LD can be connected to the second driving voltage line VSSL.

[0124] The first transistor ST1 may be formed as a dual transistor including a first-first transistor ST1-1 and a first-second transistor ST1-2. The gate electrode of the first-first transistor ST1-1 may be connected to the (K-1)-th scan line SLK-1, its first electrode may be connected to the gate electrode of the driving transistor DT, and its second electrode may be connected to the first electrode of the first-second transistor ST1-2. The gate electrode of the first-second transistor ST1-2 may be connected to the (K-1)-th scan line SLK-1, its first electrode may be connected to the second electrode of the first-first transistor ST1-1, and its second electrode may be connected to the initialization voltage line VIL.

[0125] The second transistor ST2 is turned on by the scan signal of the K-th scan line SLK to connect the first electrode of the driving transistor DT to the j-th data line Dj. The gate electrode of the second transistor ST2 may be connected to the K-th scan line SLK, its first electrode may be connected to the first electrode of the driving transistor DT, and its second electrode may be connected to the j-th data line Dj.

[0126] The third transistor ST3 may be formed as a dual transistor including a third-first transistor ST3-1 and a third-second transistor ST3-2. The third-first transistor ST3-1 and the third-second transistor ST3-2 are turned on by the scan signal of the K-th scan line SLK to connect the gate electrode and the second electrode of the driving transistor DT. That is, when the third-first transistor ST3-1 and the third-second transistor ST3-2 are turned on, the gate electrode and the second electrode of the driving transistor DT are connected to each other, so that the driving transistor DT is driven as a diode. The gate electrode of the third-first transistor ST3-1 may be connected to the K-th scan line SLK, its first electrode may be connected to the second electrode of the third-second transistor ST3-2, and its second electrode may be connected to the gate electrode of the driving transistor DT. The gate electrode of the third-second transistor ST3-2 may be connected to the K-th scan line SLK, its first electrode may be connected to the second electrode of the driving transistor DT, and its second electrode may be connected to the first electrode of the third-first transistor ST3-1.

[0127] The fourth transistor ST4 is turned on by the scan signal of the K-th scan line SLK to connect the anode electrode of the light-emitting element LD to the initialization voltage line VIL. The anode electrode of the light-emitting element LD may be discharged to the initialization voltage. The gate electrode of the fourth transistor ST4 may be connected to the K-th scan line SLK, its first electrode may be connected to the anode electrode of the light-emitting element LD, and its second electrode may be connected to the initialization voltage line VIL.

[0128] The fifth transistor ST5 is turned on by the light emission control signal of the K-th light emission control line ELK to connect the first electrode of the driving transistor DT to the first driving voltage line VDDL. The gate electrode of the fifth transistor ST5 may be connected to the K-th light emission control line ELK, its first electrode may be connected to the first driving voltage line VDDL, and its second electrode may be connected to the first electrode of the driving transistor DT.

[0129] The sixth transistor ST6 is connected between the second electrode of the driving transistor DT and the anode electrode of the light emitting element LD. The sixth transistor ST6 is turned on by the light emission control signal of the K-th light emission control line ELK to connect the second electrode of the driving transistor DT to the anode electrode of the light emitting element LD. The gate electrode of the sixth transistor ST6 may be connected to the K-th light emission control line ELK, its first electrode may be connected to the second electrode of the driving transistor DT, and its second electrode may be connected to the anode electrode of the light emitting element LD. When both the fifth transistor ST5 and the sixth transistor ST6 are turned on, a driving current Ids can be supplied to the light emitting element LD.

[0130] The first capacitor C1 is formed between the gate electrode of the driving transistor DT and the first driving voltage line VDDL. The first electrode of the first capacitor C1 may be connected to the gate electrode of the driving transistor DT, and the second electrode of the first capacitor C1 may be connected to the first driving voltage line VDDL.

[0131] When the first electrode of each of the first to sixth transistors ST1, ST2, ST3, ST4, ST5, ST6 and the driving transistor DT is a source electrode, its second electrode may all be drain electrodes. In an alternative embodiment, when the first electrode of each of the first to sixth transistors ST1, ST2, ST3, ST4, ST5, ST6 and the driving transistor DT is a drain electrode, its second electrode may all be source electrodes.

[0132] The active layer of each of the first to sixth transistors ST1, ST2, ST3, ST4, ST5, ST6 and the driving transistor DT may be formed of at least one of polysilicon, amorphous silicon, and oxide semiconductor. When the active layer of each of the first to sixth transistors ST1, ST2, ST3, ST4, ST5, ST6 and the driving transistor DT is formed of polysilicon, its active layer may be formed of low-temperature polysilicon (LTPS).

[0133] Although in Figure 7 it is shown that the first to sixth transistors ST1, ST2, ST3, ST4, ST5, ST6 and the driving transistor DT are formed as P-type metal oxide semiconductor field effect transistors (MOSFETs), the present disclosure is not limited thereto, and they may be formed as N-type MOSFETs.

[0134] The characteristics of the driving transistor DT and the characteristics of the light-emitting element LD can be considered to set the first driving voltage of the first driving voltage line VDDL, the second driving voltage of the second driving voltage line VSSL, and the initialization voltage of the initialization voltage line VIL. For example, the voltage difference between the initialization voltage and the data voltage supplied to the source electrode of the driving transistor DT can be set to be less than the threshold voltage of the driving transistor DT.

[0135] Figure 8 is a plan view specifically showing a pixel circuit according to an embodiment.

[0136] Reference Figure 8 , the pixel circuit PC may include a driving transistor DT, first transistors ST1 to ST6, and a first capacitor C1.

[0137] The driving transistor DT may include an active layer DT_ACT, a gate electrode DT_G, a first electrode DT_S, and a second electrode DT_D. The active layer DT_ACT of the driving transistor DT may overlap with the gate electrode DT_G of the driving transistor DT. The gate electrode DT_G may be provided on the active layer DT_ACT of the driving transistor DT.

[0138] The first electrode DT_S of the driving transistor DT may be connected to the first electrode S2 of the second transistor ST2. The second electrode DT_D of the driving transistor DT may be connected to the first electrode S3-2 of the third-second transistor ST3-2 and the first electrode S6 of the sixth transistor ST6.

[0139] The first transistor ST1 may be formed as a dual transistor. The first transistor ST1 may include a first-first transistor ST1-1 and a first-second transistor ST1-2.

[0140] The first-first transistor ST1-1 may include an active layer ACT1-1, a gate electrode G1-1, a first electrode S1-1, and a second electrode D1-1. The gate electrode G1-1, which is part of the (K-1)th scan line SLK-1, of the first-first transistor ST1-1 may be an overlapping region between the active layer ACT1-1 of the first-first transistor ST1-1 and the (K-1)th scan line SLK-1. The first electrode S1-1 of the first-first transistor ST1-1 may be connected to the connection electrode BE of the driving transistor DT through a second contact hole CNT2. The second electrode D1-1 of the first-first transistor ST1-1 may be connected to the first electrode S1-2 of the first-second transistor ST1-2.

[0141] The first - second transistor ST1 - 2 may include an active layer ACT1 - 2, a gate electrode G1 - 2, a first electrode S1 - 2, and a second electrode D1 - 2. The gate electrode G1 - 2, which is part of the (K - 1)th scan line SLK - 1, of the first - second transistor ST1 - 2 may be an overlapping region between the active layer ACT1 - 2 of the first - second transistor ST1 - 2 and the (K - 1)th scan line SLK - 1. The first electrode S1 - 2 of the first - second transistor ST1 - 2 may be connected to the second electrode D1 - 1 of the first - first transistor ST1 - 1. The second electrode D1 - 2 of the first - second transistor ST1 - 2 may be connected to the initialization connection electrode VIE through the fourth contact hole CNT4.

[0142] The second transistor ST2 may include an active layer ACT2, a gate electrode G2, a first electrode S2, and a second electrode D2. The gate electrode G2, which is part of the Kth scan line SLK (where K is a positive integer greater than or equal to 2), of the second transistor ST2 may be an overlapping region between the active layer ACT2 of the second transistor ST2 and the Kth scan line SLK. The first electrode S2 of the second transistor ST2 may be connected to the first electrode DT_S of the driving transistor DT. The second electrode D2 of the second transistor ST2 may be connected to the data line DL through the third contact hole CNT3.

[0143] The third transistor ST3 may be formed as a dual transistor. The third transistor ST3 may include a third - first transistor ST3 - 1 and a third - second transistor ST3 - 2.

[0144] The third - first transistor ST3 - 1 may include an active layer ACT3 - 1, a gate electrode G3 - 1, a first electrode S3 - 1, and a second electrode D3 - 1. The gate electrode G3 - 1, which is part of the Kth scan line SLK, of the third - first transistor ST3 - 1 may be an overlapping region between the active layer ACT3 - 1 of the third - first transistor ST3 - 1 and the Kth scan line SLK. The first electrode S3 - 1 of the third - first transistor ST3 - 1 may be connected to the second electrode S3 - 2 of the third - second transistor ST3 - 2. The second electrode D3 - 1 of the third - first transistor ST3 - 1 may be connected to the connection electrode BE of the driving transistor DT through the second contact hole CNT2.

[0145] The third-second transistor ST3-2 may include an active layer ACT3-2, a gate electrode G3-2, a first electrode S3-2, and a second electrode D3-2. The gate electrode G3-2, which is part of the K-th scan line SLK, of the third-second transistor ST3-2 may be an overlapping region between the active layer ACT3-2 of the third-second transistor ST3-2 and the K-th scan line SLK. The second electrode D3-2 of the third-second transistor ST3-2 may be connected to the first electrode S3-1 of the third-first transistor ST3-1.

[0146] The fourth transistor ST4 may include an active layer ACT4, a gate electrode G4, a first electrode S4, and a second electrode D4. The gate electrode G4, which is part of the K-th scan line SLK, of the fourth transistor ST4 may be an overlapping region between the active layer ACT4 of the fourth transistor ST4 and the K-th scan line SLK. The first electrode S4 of the fourth transistor ST4 may be connected to the anode connection electrode ANDE through the sixth contact hole CNT6. The anode electrode of the light-emitting element may be connected to the anode connection electrode ANDE through the anode contact hole AND_CNT. The second electrode D4 of the fourth transistor ST4 may be connected to the initialization connection electrode VIE through the fourth contact hole CNT4. The initialization voltage line VIL may be connected to the initialization connection electrode VIE through the fifth contact hole CNT5, and the initialization connection electrode VIE may be connected to the second electrode D1-2 of the first-second transistor ST1-2 and the second electrode D4 of the fourth transistor ST4 through the fourth contact hole CNT4. The initialization connection electrode VIE may be set to intersect with the (K-1)-th scan line SLK-1.

[0147] The fifth transistor ST5 may include an active layer ACT5, a gate electrode G5, a first electrode S5, and a second electrode D5. The gate electrode G5, which is part of the K-th light emission control line ELK, of the fifth transistor ST5 may be an overlapping region between the active layer ACT5 of the fifth transistor ST5 and the K-th light emission control line ELK. The first electrode S5 of the fifth transistor ST5 may be connected to the second sub-driving voltage line VDDL2 through the seventh contact hole CNT7. The second electrode D5 of the fifth transistor ST5 may be connected to the first electrode DT_S of the driving transistor DT.

[0148] The sixth transistor ST6 may include an active layer ACT6, a gate electrode G6, a first electrode S6, and a second electrode D6. The gate electrode G6, which is part of the K-th light emission control line ELK, of the sixth transistor ST6 may be an overlapping region between the active layer ACT6 of the sixth transistor ST6 and the K-th light emission control line ELK. The first electrode S6 of the sixth transistor ST6 may be connected to the second electrode DT_D of the driving transistor DT. The second electrode D6 of the sixth transistor ST6 may be connected to the anode electrode of the light-emitting element through the sixth contact hole CNT6.

[0149] The first electrode CE11 of the first capacitor C1 may be a part of the gate electrode DT_G of the driving transistor DT, and the second electrode CE12 of the first capacitor C1 may be the first sub-driving voltage line VDDL1 that overlaps with the gate electrode DT_G of the driving transistor DT. The first sub-driving voltage line VDDL1 may be connected to the second sub-driving voltage line VDDL2 through the eighth contact hole CNT8. The second sub-driving voltage line VDDL2 may be disposed in parallel with the data line DL, and the first sub-driving voltage line VDDL1 may be disposed in parallel with the K-th scanning line SLK.

[0150] Figure 9 is the cross-sectional view taken along Figure 8 the line I-I’ of

[0151] Reference Figure 8 and Figure 9 , a thin-film transistor layer, a light-emitting element layer EML, and a packaging layer TFE may be sequentially formed on the first substrate SUB1.

[0152] The thin-film transistor layer includes an underlying metal layer BSM, a buffer film BF, an active layer ACT, a first gate layer GTL1, a second gate layer GTL2, a gate insulating film 130, a first interlayer insulating film 141, a first data metal layer DTL1, a second interlayer insulating film 142, a second data metal layer DTL2, a protective film 150, and a planarization film 160.

[0153] The underlying metal layer BSM may be formed on one surface of the first substrate SUB1. The underlying metal layer BSM may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof. According to an embodiment, the underlying metal layer BSM may be disposed under the thin-film transistor to reduce or prevent deterioration of the characteristics of the thin-film transistor due to light emitted from the sensor device SS.

[0154] The buffer film BF may be formed on the underlying metal layer BSM. The buffer film BF may be formed on one surface of the first substrate SUB1 to protect the thin-film transistor and the organic light-emitting layer 172 of the light-emitting element layer EML from moisture that penetrates the first substrate SUB1 and is vulnerable to moisture penetration. The buffer film BF may be formed of multiple inorganic layers stacked alternately. For example, the buffer film BF may be formed as a multilayer film in which one or more inorganic layers among a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and an aluminum oxide layer are stacked alternately. The buffer film BF may be omitted.

[0155] The active layer ACT may be formed on the first substrate SUB1 or the buffer film BF. The active layer ACT may include polysilicon, single-crystalline silicon, low-temperature polysilicon, amorphous silicon, and / or oxide semiconductors. When the active layer ACT is made of polysilicon, the ion-doped active layer ACT may have conductivity. Thus, the active layer ACT may include not only the active layers DT_ACT and ACT1 to ACT6 of the driving transistor DT and the first transistor ST1 to the sixth transistor ST6, but also the source electrodes DT_S, S1-1, S1-2, S2, S3-1, S3-2, S4, S5, S6 and the drain electrodes DT_D, D1-1, D1-2, D2, D3-1, D3-2, D4, D5, D6.

[0156] The gate insulating film 130 may be formed on the active layer ACT. The gate insulating film 130 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer.

[0157] The first gate layer GTL1 may be formed on the gate insulating film 130. The first gate layer GTL1 may include not only the gate electrode DT_G of the driving transistor DT and the gate electrodes G1 to G6 of the first transistor ST1 to the sixth transistor ST6, but also the scan lines SLK-1 and SLK and the emission control line ELK. The first gate layer GTL1 may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0158] The first interlayer insulating film 141 may be formed on the first gate layer GTL1. The first interlayer insulating film 141 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer. The first interlayer insulating film 141 may include a plurality of inorganic layers.

[0159] The second gate layer GTL2 may be formed on the first interlayer insulating film 141. The second gate layer GTL2 may include an initialization voltage line VIL and a first sub-driving voltage line VDDL1. The second gate layer GTL2 may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0160] The second interlayer insulating film 142 may be formed on the second gate layer GTL2. The second interlayer insulating film 142 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer. The second interlayer insulating film 142 may include a plurality of inorganic layers.

[0161] The first data metal layer DTL1 may be formed on the second interlayer insulating film 142. The first data metal layer DTL1 may include a data line DL, a second sub-driving voltage line VDDL2, a connection electrode BE, an anode connection electrode ANDE, and an initialization connection electrode VIE. The first data metal layer DTL1 may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0162] A planarization film 160 may be formed on the first data metal layer DTL1 to planarize the steps caused by the active layer ACT, the first gate layer GTL1, the second gate layer GTL2, and the first data metal layer DTL1. The planarization film 160 may be formed as an organic film including an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, and / or a polyimide resin.

[0163] Meanwhile, a protective film 150 may be additionally formed between the first data metal layer DTL1 and the planarization film 160. The protective film 150 may be formed of an inorganic layer such as a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, and / or an aluminum oxide layer.

[0164] Reference Figure 11 and Figure 12 as shown in, a second data metal layer DTL2 may be formed on the protective film 150. The second data metal layer DTL2 may include a second sub-driving voltage line connection wiring VDDL2_Br which will be described later. The second data metal layer DTL2 may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0165] Referring again to Figure 8 and Figure 9 as shown in, a driving transistor DT and first transistors ST1 to ST6 may be formed by a top-gate method (e.g., top-gate configuration) in which a gate electrode is located above the active layer. However, the present disclosure is not limited thereto. That is, the driving transistor DT and first transistors ST1 to ST6 may be formed by a bottom-gate method (e.g., bottom-gate configuration) in which a gate electrode is located below the active layer or a double-gate method (e.g., double-gate configuration) in which a gate electrode is located both above and below the active layer. Figure 8 as shown in, a second connection contact hole BCNT2 may be a hole that penetrates the first interlayer insulating film 141 and the second interlayer insulating film 142 to expose the gate electrode DT_G of the driving transistor DT.

[0166] As Figure 9 shown in, the second connection contact hole BCNT2 may be a hole that penetrates the first interlayer insulating film 141 and the second interlayer insulating film 142 to expose the gate electrode DT_G of the driving transistor DT.

[0167] The second contact hole CNT2 may be a hole that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 to expose the second electrode D3-1 of the third-first transistor ST3-1. The connection electrode BE may be connected to the second electrode D3-1 of the third-first transistor ST3-1 through the second contact hole CNT2.

[0168] The third contact hole CNT3 may be a hole that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 to expose the second electrode D2 of the second transistor ST2. The data line DL may be connected to the second electrode D2 of the second transistor ST2 through the third contact hole CNT3.

[0169] The fourth contact hole CNT4 may be a hole that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 to expose the second electrode D1-2 of the first-second transistor ST1-2 and the second electrode D4 of the fourth transistor ST4. The initialization connection electrode VIE may be connected to the second electrode D1-2 of the first-second transistor ST1-2 and the second electrode D4 of the fourth transistor ST4 through the fourth contact hole CNT4.

[0170] The fifth contact hole CNT5 may be a hole that penetrates the second interlayer insulating film 142 to expose the initialization voltage line VIL. The initialization connection electrode VIE may be connected to the initialization voltage line VIL through the fifth contact hole CNT5.

[0171] The sixth contact hole CNT6 may be a hole that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 to expose the second electrode D6 of the sixth transistor ST6. The anode connection electrode ANDE may be connected to the second electrode D6 of the sixth transistor ST6 through the sixth contact hole CNT6.

[0172] The seventh contact hole CNT7 may be a hole that penetrates the gate insulating film 130, the first interlayer insulating film 141, and the second interlayer insulating film 142 to expose the first electrode S5 of the fifth transistor ST5. The second sub-driving voltage line VDDL2 may be connected to the first electrode S5 of the fifth transistor ST5 through the seventh contact hole CNT7.

[0173] The eighth contact hole CNT8 may be a hole that penetrates the second interlayer insulating film 142 to expose the first sub-driving voltage line VDDL1. The second sub-driving voltage line VDDL2 may be connected to the first sub-driving voltage line VDDL1 through the eighth contact hole CNT8.

[0174] The anode contact hole AND_CNT may be a hole that penetrates the protective film 150 and the planarization film 160 to expose the anode connection electrode ANDE.

[0175] The light-emitting element layer EML is formed on the thin-film transistor layer. The light-emitting element layer EML includes a light-emitting element 170 and a pixel defining film 180.

[0176] The light-emitting element 170 and the pixel defining film 180 are formed on the planarization film 160. Each of the light-emitting elements 170 may include a first electrode 171, an organic light-emitting layer 172, and a second electrode 173.

[0177] The first electrode 171 may be formed on the planarization film 160. The first electrode 171 may be connected to the anode connection electrode ANDE through an anode contact hole AND_CNT passing through the protective film 150 and the planarization film 160.

[0178] In a top-emission structure in which light is emitted from the organic light-emitting layer 172 to the second electrode 173, the first electrode 171 may be formed of a material having a high reflectivity, such as a laminated structure of aluminum and titanium (Ti / Al / Ti), a laminated structure of aluminum and ITO (ITO / Al / ITO), an APC alloy, or a laminated structure of an APC alloy and ITO (ITO / APC / ITO). The APC alloy is an alloy of silver (Ag), palladium (Pd), and copper (Cu).

[0179] The pixel defining film 180 may be formed to divide the first electrode 171 on the planarization film 160 so as to define a light-emitting region EA of each auxiliary pixel Pa. The pixel defining film 180 may be formed to cover the edge of the first electrode 171. The pixel defining film 180 may be formed of an organic film including an acrylic resin, an epoxy resin, a phenolic resin, a polyamide resin, or a polyimide resin.

[0180] The light-emitting region EA of each of the auxiliary pixels Pa refers to a region in which the first electrode 171, the organic light-emitting layer 172, and the second electrode 173 are sequentially stacked, and holes from the first electrode 171 are combined with electrons from the second electrode 173 to emit light.

[0181] The organic light-emitting layer 172 is formed on the first electrode 171 and the pixel defining film 180. The organic light-emitting layer 172 may include an organic material that emits light of a set or predetermined color. For example, the organic light-emitting layer 172 may include a hole transport layer, an organic material layer, and an electron transport layer.

[0182] The second electrode 173 is formed on the organic light-emitting layer 172. The second electrode 173 may be formed to cover the organic light-emitting layer 172. The second electrode 173 may be a common layer formed in the sub-pixels. A cover layer may be formed on the second electrode 173.

[0183] In a top emission structure, the second electrode 173 may be formed of a transparent conductive material (TCO) such as ITO and / or IZO that can transmit light, or may be formed of a semi-transmissive conductive material such as magnesium (Mg), silver (Ag), or an alloy thereof. When the second electrode 173 is formed of a semi-transmissive conductive material, the light emission efficiency may be improved by a microcavity (e.g., by including a microcavity).

[0184] The thin film encapsulation layer TFE may be formed on the light emitting element layer EML. The thin film encapsulation layer TFE may include at least one inorganic film to prevent or substantially prevent oxygen and / or moisture from penetrating into the light emitting element layer EML. In addition, the thin film encapsulation layer TFE may include at least one organic layer to protect the light emitting element layer EML from foreign substances such as dust.

[0185] In an alternative embodiment, a second substrate is provided on the light emitting element layer EML instead of the thin film encapsulation layer TFE, and the space between the light emitting element layer EML and the second substrate is empty in a vacuum state or filled with a filling film. The filling film may be an epoxy filling film and / or a silicon filling film.

[0186] Figure 10 is according to an embodiment Figure 4 an enlarged view of region A of Figure 11 is a cross-sectional view taken along Figure 10 line III-III’ of Figure 12 is a cross-sectional view taken along Figure 10 line IV-IV’ of

[0187] Refer to Figure 4 and Figures 10 to 12 , at least one transmissive portion TA may be surrounded by a plurality of auxiliary pixels Pa. The plurality of auxiliary pixels Pa may be electrically connected to each other through a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2.

[0188] According to an embodiment, before arranging the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2, the transmissive portion TA may have a rectangular shape, and the plurality of auxiliary pixels Pa may be arranged in two rows and four columns. As Figure 10 shown in

[0189] The data line DL and the second sub-driving voltage line VDDL2 can extend in the second direction (Y direction) on the auxiliary pixel Pa1 corresponding to the second row and the first column of the first pixel group Pg1, and the data line DL and the second sub-driving voltage line VDDL2 can extend in the second direction (Y direction) on the auxiliary pixel Pa2 corresponding to the second row and the second column of the first pixel group Pg1. The initialization voltage line VIL, the (K - 1)th scan line SLK-1, the Kth scan line SLK, and the emission control line ELK can extend in the first direction (X direction) on the auxiliary pixel Pa3 corresponding to the first row and the fourth column of the second pixel group Pg2.

[0190] In order to ensure the maximum transmittance of the transmissive portion TA, a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 can be arranged along the edge of the transmissive portion TA. At the same time, the second electrode 173 can be not provided on the transmissive portion TA. For ease of explanation, although in the drawings, the initialization voltage line VIL, the (K - 1)th scan line SLK-1, the Kth scan line SLK, and the emission control line ELK extending in the first direction (X direction) are shown to be arranged at a set or predetermined interval from each other, in a plan view, the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 can be arranged without being spaced apart from each other.

[0191] According to an embodiment, the initialization voltage line VIL can be formed by the second gate layer GTL2 formed on the first interlayer insulating film 141 on both the auxiliary pixel Pa3 and the transmissive portion TA. The (K - 1)th scan line SLK-1 can be formed by the first gate layer GTL1 formed on the gate insulating film 130 on both the auxiliary pixel Pa3 and the transmissive portion TA. The Kth scan line SLK can be formed by the first gate layer GTL1 formed on the gate insulating film 130 on the auxiliary pixel Pa3, and the Kth scan line connection line SLK_Br can be formed by the second gate layer GTL2 formed on the first interlayer insulating film 141 on the transmissive portion TA. The Kth scan line connection line SLK_Br can be electrically connected and / or physically connected to the Kth scan line SLK through the ninth contact hole CNT9 formed in the first interlayer insulating film 141. The emission control line ELK can be formed by the first gate layer GTL1 formed on the gate insulating film 130 on both the auxiliary pixel Pa3 and the transmissive portion TA.

[0192] Generally, the initialization voltage line VIL, the (K - 1)th scan line SLK-1, the Kth scan line SLK, and the emission control line ELK extending in the first direction (X direction) can each include a bent portion extending in the second direction (Y direction) intersecting (or crossing) the first direction (X direction) around a vertex of the transmissive portion TA.

[0193] The light-emitting control line ELK may include a triangular first extension portion ELK_EX in a region near the bent portion. The first extension portion ELK_EX may be formed concurrently or simultaneously with the light-emitting control line ELK from the same material. For example, the first extension portion ELK_EX may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0194] The first extension portion ELK_EX may include a first hypotenuse facing the bent portion. Among the plurality of transmissive portions TA, the angle θ1 between the first hypotenuse and the first direction (X direction) may be the same. For example, the angle θ1 between the first hypotenuse and the first direction (X direction) may be approximately 45°.

[0195] According to an embodiment, the data line DL may be formed on both the auxiliary pixels Pa1 and Pa2 and the transmissive portion TA by a first data metal layer DTL1 formed on the second interlayer insulating film 142. The second sub-driving voltage line VDDL2 may be formed on the auxiliary pixels Pa1 and Pa2 by the first data metal layer DTL1 formed on the second interlayer insulating film 142. The second sub-driving voltage line connection wiring VDDL2_Br may be formed on the transmissive portion TA by a second data metal layer DTL2 formed on the protective film 150. The second sub-driving voltage line connection wiring VDDL2_Br may be electrically connected and / or physically connected to the second sub-driving voltage line VDDL2 through a tenth contact hole CNT10 formed in the protective film 150.

[0196] Generally, the data line DL and the second sub-driving voltage line VDDL2 extending in the second direction (Y direction) may include a bent portion extending in the first direction (X direction) intersecting (or crossing) the second direction (Y direction) around a vertex of the transmissive portion TA.

[0197] The data line DL and the second sub-driving voltage line VDDL2 provided on the auxiliary pixel Pa1 may be arranged to overlap with the initialization voltage line VIL and the (K - 1)th scan line SLK-1 in the third direction (Z direction) at the bent portion, and the data line DL and the second sub-driving voltage line VDDL2 provided on the auxiliary pixel Pa2 may be arranged to overlap with the Kth scan line SLK and the light-emitting control line ELK in the third direction (Z direction) at the bent portion. Specifically, the second sub-driving voltage line VDDL2 provided on the auxiliary pixel Pa2 may be arranged to overlap with the first extension portion ELK_EX of the light-emitting control line ELK in the third direction (Z direction) at the bent portion.

[0198] Since the arrangement of the multiple wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 at the other vertex of the transmission part TA is symmetric to the above, its detailed description will be omitted hereinafter. Since the triangular first extension part ELK_EX is provided at each of the four vertices of the rectangular transmission part TA, as a result, the transmission part TA may have an octagonal shape in the plan view. Compared with the rectangular transmission part TA, in the octagonal transmission part TA, the above-described diffraction phenomenon can be reduced. Therefore, without an additional separate process, the first extension part ELK_EX is further formed in the process of forming the multiple wirings, thereby maintaining the appropriate (e.g., good) detection ability of the sensor device SS (e.g., a sensor) provided below the transmission part TA.

[0199] Hereinafter, other embodiments will be described. In the following embodiments, the configurations that are the same as those already described will be omitted or simplified, and the differences will be mainly described.

[0200] Figure 13 is according to another embodiment Figure 4 of the enlarged view of region A.

[0201] Reference Figures 11 to 13 , the first extension part ELK_EX1 of the light emission control line ELK is different from the first extension part ELK_EX including the Figure 10 straight hypotenuse in that the first extension part ELK_EX1 includes a curved hypotenuse.

[0202] More specifically, the light emission control line ELK can be formed on both the auxiliary pixel Pa3 and the transmission part TA by the first gate layer GTL1 formed on the gate insulating film 130. Generally, the light emission control line ELK extending in the first direction (X direction) includes a curved part extending in the second direction (Y direction) crossing the first direction (X direction) around one vertex of the transmission part TA.

[0203] The light emission control line ELK can include the first extension part ELK_EX1 in the region near the curved part. The first extension part ELK_EX1 can be formed concurrently or simultaneously with the light emission control line ELK from the same material. For example, the first extension part ELK_EX1 can be formed to include a single layer or multiple layers of any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0204] The first extension part ELK_EX1 can include a curved side facing the curved part. In the multiple transmission parts TA, the curvature of the curved sides can be the same.

[0205] The second sub-driving voltage line VDDL2 can be set to overlap with the first extension portion ELK_EX1 of the emission control line ELK in the third direction (Z direction) at the bent portion.

[0206] Since the first extension portion ELK_EX1 having a bent side is provided at each of the four vertices of the rectangular transmissive portion TA, as a result, the transmissive portion TA can have an oval or circular shape in the plan view. Compared with the rectangular transmissive portion TA, in the oval or circular transmissive portion TA, the above-described diffraction phenomenon can be reduced. Therefore, without an additional separate process, the first extension portion ELK_EX1 is further formed in the process of forming a plurality of wirings, thereby maintaining an appropriate (e.g., good) detection ability of the sensor device SS (e.g., a sensor) provided below the transmissive portion TA.

[0207] Figure 14A and Figure 14B are all according to other embodiments Figure 4 is an enlarged view of region A.

[0208] Reference Figure 11 、 Figure 12 、 Figure 14A and Figure 14B Using the lower metal layer BSM, instead of the emission control line ELK, to form a structure the same as the first extension portions ELK_EX and ELK_EX1 shown in Figure 10 and Figure 13 The first extension portions ELK_EX and ELK_EX1 shown in

[0209] More specifically, before arranging a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2, the transmissive portion TA can have a rectangular shape, and a plurality of auxiliary pixels Pa can be arranged in two rows and four columns. As shown in Figure 14A and Figure 14B The auxiliary pixel Pa1 corresponding to the second row and the first column of the first pixel group Pg1, the auxiliary pixel Pa2 corresponding to the second row and the second column of the first pixel group Pg1, and the auxiliary pixel Pa3 corresponding to the first row and the fourth column of the second pixel group Pg2 can be arranged around one vertex of the transmissive portion TA having a rectangular shape.

[0210] The data line DL and the second sub-driving voltage line VDDL2 may extend in the second direction (Y direction) on the auxiliary pixel Pa1 corresponding to the second row and the first column of the first pixel group Pg1, and the data line DL and the second sub-driving voltage line VDDL2 may extend in the second direction (Y direction) on the auxiliary pixel Pa2 corresponding to the second row and the second column of the first pixel group Pg1. The initialization voltage line VIL, the (K-1)-th scan line SLK-1, the K-th scan line SLK, and the emission control line ELK may extend in the first direction (X direction) on the auxiliary pixel Pa3 corresponding to the first row and the fourth column of the second pixel group Pg2.

[0211] To ensure the desired (e.g., maximum) transmittance of the transmissive portion TA, a plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 may be arranged along the edge of the transmissive portion TA. Meanwhile, the second electrode 173 may not be provided on the transmissive portion TA. For ease of explanation, although in the drawings the initialization voltage line VIL, the (K-1)-th scan line SLK-1, the K-th scan line SLK, and the emission control line ELK extending in the first direction (X direction) are shown to be arranged at a set or predetermined interval from each other, in a plan view, the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 may be arranged without being spaced apart from each other.

[0212] According to an embodiment, the initialization voltage line VIL may be formed of the second gate layer GTL2 formed on the first interlayer insulating film 141 on both the auxiliary pixel Pa3 and the transmissive portion TA. The (K-1)-th scan line SLK-1 may be formed of the first gate layer GTL1 formed on the gate insulating film 130 on both the auxiliary pixel Pa3 and the transmissive portion TA. The K-th scan line SLK may be formed of the first gate layer GTL1 formed on the gate insulating film 130 on the auxiliary pixel Pa3, and the K-th scan line connecting line SLK_Br may be formed of the second gate layer GTL2 formed on the first interlayer insulating film 141 on the transmissive portion TA. The K-th scan line connecting line SLK_Br may be electrically connected and / or physically connected to the K-th scan line SLK through the ninth contact hole CNT9 formed in the first interlayer insulating film 141. The emission control line ELK may be formed of the first gate layer GTL1 formed on the gate insulating film 130 on both the auxiliary pixel Pa3 and the transmissive portion TA.

[0213] Generally, the initialization voltage line VIL, the (K-1)-th scan line SLK-1, the K-th scan line SLK, and the emission control line ELK extending in the first direction (X direction) may include a bent portion extending in the second direction (Y direction) intersecting (or crossing) the first direction (X direction) around a vertex of the transmissive portion TA.

[0214] The lower metal layer BSM can be disposed on the first substrate SUB1. According to an embodiment, the lower metal layer BSM can be disposed over the entire sensor area SA, except for an area where the transmissive portion TA of the sensor area SA is arranged. For example, in an area of the main body portion BSM_BD and the curved portion of the lower metal layer BSM that overlaps with the plurality of auxiliary pixels Pa and the plurality of wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 along the edge of the transmissive portion TA in the third direction (Z direction), the lower metal layer BSM can include a triangular extension portion BSM_EX.

[0215] The main body portion BSM_BD and the extension portion BSM_EX of the lower metal layer BSM can be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0216] As Figure 14A shown, the extension portion BSM_EX of the lower metal layer BSM can include a first bevel edge facing the curved portion. Among the plurality of transmissive portions TA, the angle θ1 between the first bevel edge and the first direction (X direction) can be the same. For example, the angle θ1 between the first bevel edge and the first direction (X direction) can be approximately 45°.

[0217] In addition, as Figure 14B shown, the extension portion BSM_EX1 of the lower metal layer BSM can include a curved edge facing the curved portion. Among the plurality of transmissive portions TA, the curvature of the curved edge can be the same.

[0218] According to an embodiment, the data line DL can be formed of a first data metal layer DTL1 formed on the second interlayer insulating film 142 over both the auxiliary pixels Pa1 and Pa2 and the transmissive portion TA. The second sub-driving voltage line VDDL2 can be formed of the first data metal layer DTL1 formed on the second interlayer insulating film 142 over the auxiliary pixels Pa1 and Pa2. The second sub-driving voltage line connection wiring VDDL2_Br can be formed of a second data metal layer DTL2 formed on the protective film 150 over the transmissive portion TA. The second sub-driving voltage line connection wiring VDDL2_Br can be electrically connected and / or physically connected to the second sub-driving voltage line VDDL2 through a tenth contact hole CNT10 formed in the protective film 150.

[0219] Generally, the data line DL and the second sub-driving voltage line VDDL2 extending in the second direction (Y direction) can include curved portions extending in the first direction (X direction) intersecting (or crossing) the second direction (Y direction) around a vertex of the transmissive portion TA.

[0220] The data line DL and the second sub-driving voltage line VDDL2 provided on the auxiliary pixel Pa1 can be set to overlap with the initialization voltage line VIL and the (K-1)-th scan line SLK-1 in the third direction (Z direction) at the bent portion, and the data line DL and the second sub-driving voltage line VDDL2 provided on the auxiliary pixel Pa2 can be set to overlap with the K-th scan line SLK and the emission control line ELK in the third direction (Z direction) at the bent portion.

[0221] Since the arrangement of the multiple wirings VIL, SLK-1, SLK, ELK, DL, and VDDL2 at the other vertex of the transmissive portion TA is symmetric to the above, the detailed description thereof will be omitted hereinafter.

[0222] When the triangular extension portion BSM_EX of the lower metal layer BSM is provided at each of the four vertices of the rectangular transmissive portion TA, the transmissive portion TA can have an octagonal shape in the plan view, and when the extension portion BSM_EX1 having a curved edge of the lower metal layer BSM is provided at each of the four vertices of the rectangular transmissive portion TA, the transmissive portion TA can have an elliptical or circular shape in the plan view.

[0223] Compared with the rectangular transmissive portion TA, the above diffraction phenomenon can be reduced in the octagonal transmissive portion TA and the elliptical or circular transmissive portion TA. Therefore, without an additional separate process, the main body portion BSM_BD of the lower metal layer BSM and the extension portion BSM_EX or BSM_EX1 of the lower metal layer BSM are further formed in the process of forming the lower metal layer BSM, so as to maintain the appropriate (e.g., good) detection ability of the sensor device SS (e.g., a sensor) provided below the transmissive portion TA.

[0224] Figure 15 is according to another embodiment Figure 4 is an enlarged view of region B.

[0225] Referring to Figure 15 , this embodiment is different from the embodiment shown in Figure 10 in that a second sub-driving voltage line integrated wiring VDDL2_BE for electrically connecting the multiple second sub-driving voltage lines VDDL2 to each other is provided.

[0226] More specifically, the multiple auxiliary pixels Pa can be pixels arranged in two rows and four columns. As Figure 15As shown, around a vertex of the transmissive portion TA having a rectangular shape, auxiliary pixels Pa1 corresponding to the second row and the first column of the first pixel group Pg1, auxiliary pixels Pa2 corresponding to the second row and the second column of the first pixel group Pg1, auxiliary pixels Pa4 corresponding to the second row and the third column of the first pixel group Pg1, and auxiliary pixels Pa5 corresponding to the second row and the fourth column of the first pixel group Pg1 can be arranged. In addition, auxiliary pixels Pa3 corresponding to the first row and the fourth column of the second pixel group Pg2 can be arranged around a vertex of the transmissive portion TA.

[0227] Generally, the initialization voltage line VIL, the (K - 1)-th scan line SLK-1, the K-th scan line SLK, and the emission control line ELK extending in the first direction (X direction) can include bent portions extending in the second direction (Y direction) intersecting (or crossing) the first direction (X direction) around a vertex of the transmissive portion TA.

[0228] The data line DL_a and the second sub-driving voltage line VDDL2_a can extend in the second direction (Y direction) on the auxiliary pixel Pa1 corresponding to the second row and the first column of the first pixel group Pg1, the data line DL_b and the second sub-driving voltage line VDDL2_b can extend in the second direction (Y direction) on the auxiliary pixel Pa2 corresponding to the second row and the second column of the first pixel group Pg1, the data line DL_c and the second sub-driving voltage line VDDL2_c can extend in the second direction (Y direction) on the auxiliary pixel Pa4 corresponding to the second row and the third column of the first pixel group Pg1, and the data line DL_d and the second sub-driving voltage line VDDL2_d can extend in the second direction (Y direction) on the auxiliary pixel Pa5 corresponding to the second row and the fourth column of the first pixel group Pg1.

[0229] The initialization voltage line VIL, the (K - 1)-th scan line SLK-1, the K-th scan line SLK, and the emission control line ELK can extend in the first direction (X direction) on the auxiliary pixel Pa3 corresponding to the first row and the fourth column of the second pixel group Pg2.

[0230] According to an embodiment, the data lines DL_a, DL_b, DL_c, and DL_d can be formed by a first data metal layer DTL1 formed on the second interlayer insulating film 142 on both the auxiliary pixels Pa1, Pa2, Pa4, and Pa5 and the transmissive portion TA. The second sub-driving voltage lines VDDL2_a, VDDL2_b, VDDL2_c, and VDDL2_d can be formed by the first data metal layer DTL1 formed on the second interlayer insulating film 142 on the auxiliary pixels Pa1, Pa2, Pa4, and Pa5. The second sub-driving voltage line integrated wiring VDDL2_BE can be formed by a second data metal layer DTL2 formed on the protective film 150 on the transmissive portion TA. The second sub-driving voltage line integrated wiring VDDL2_BE can be electrically and / or physically connected to the corresponding second sub-driving voltage lines VDDL2_a, VDDL2_b, VDDL2_c, and VDDL2_d through tenth contact holes CNT10_a, CNT10_b, CNT10_c, and CNT10_d formed in the protective film 150.

[0231] Generally, the data lines DL_a, DL_b, DL_c, and DL_d extending in the second direction (Y direction) and the second sub-driving voltage line integrated wiring VDDL2_BE can include bent portions extending in the first direction (X direction) intersecting (or crossing) the second direction (Y direction) around a vertex of the transmissive portion TA. The second sub-driving voltage line integrated wiring VDDL2_BE can overlap with the (K - 1)-th scan line SLK-1 in the third direction (Z direction) in a region around a vertex of the transmissive portion TA.

[0232] Figure 16 It is a view showing wirings provided on a transmissive portion according to another embodiment.

[0233] Reference Figure 16 , the difference between this embodiment and the embodiment shown in Figure 4 is that the angles θ1, θ2, θ3, θ4, and θ5 of the hypotenuses of the extension portions of the light emission control lines respectively arranged in a plurality of transmissive portions TA with respect to the first direction (X direction) are different from each other.

[0234] More specifically, the plurality of transmissive portions TA can be alternately arranged with a plurality of pixel groups Pg in the first direction X and / or the second direction Y. In an alternative embodiment, the transmissive portion TA can be arranged to surround the pixel group Pg.

[0235] A plurality of light-emitting control lines ELK_a, ELK_b, ELK_c, ELK_d, ELK_e, and ELK_f can be generally arranged in a first direction (X direction), and can include a triangular extension ELK_EX at the vertex of the transmissive portion TA. The extension ELK_EX can include a hypotenuse extending in a first diagonal direction DDR1 between the first direction (X direction) and a second direction (Y direction). The angles θ1, θ2, θ3, θ4, and θ5 between the hypotenuse and the first direction (X direction) can be different from each other. For example, the angles θ1, θ2, θ3, θ4, and θ5 between the hypotenuse and the first direction (X direction) can be acute angles greater than 0° and less than 90°. As the angles θ1, θ2, θ3, θ4, and θ5 between the hypotenuse and the first direction (X direction) increase, the light transmittance of the transmissive portion TA can increase.

[0236] Since the triangular extension ELK_EX is provided at the vertex of the rectangular transmissive portion TA, the transmissive portion TA can have an octagonal shape in a plan view, and a sensor device SS (such as a sensor) can be disposed below the plurality of transmissive portions TA. According to an embodiment, the length of one side of the transmissive portion TA can be 80 μm, and the length of one side of a sensor device SS such as a sensor can be 4 mm. That is, a very large number of transmissive portions TA can be matched with one sensor device SS. When the angles θ1, θ2, θ3, θ4, and θ5 of the hypotenuses of the extensions ELK_EX provided in the respective transmissive portions TA are different from each other, the light passing through the transmissive portion TA is diffracted slightly differently, and can exhibit an effect similar to the case where the light passing through a circular transmissive portion TA is diffracted, on average.

[0237] Figure 17 is a view showing wirings provided on a transmissive portion according to another embodiment, and Figure 18 is Figure 17 an enlarged view of region C of

[0238] Referring to Figure 17 and Figure 18 , the difference between this embodiment and the Figure 4 embodiment is that a triangular second extension VDDL2_EX is further provided in a region near the bent portion of the second sub-driving voltage line connection wiring VDDL22_Br.

[0239] More specifically, the light-emitting control line ELK can be formed by a first gate layer GTL1 on both the auxiliary pixel Pa3 and the transmissive portion TA. Generally, the light-emitting control line ELK extending in the first direction (X direction) can include a bent portion extending in a second direction (Y direction) that intersects (or crosses) the first direction (X direction) near a vertex of the transmissive portion TA.

[0240] The light-emitting control line ELK may include a first extension portion ELK_EX in a region near the bent portion. The first extension portion ELK_EX may be formed concurrently or simultaneously with the light-emitting control line ELK from the same material. For example, the first extension portion ELK_EX may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0241] The second sub-driving voltage line connection wiring VDDL22_Br may be electrically connected and / or physically connected to the second sub-driving voltage line VDDL22 through the tenth contact hole CNT10. The second sub-driving voltage line connection wiring VDDL22_Br may be formed on the transmission portion TA by the second data metal layer DTL2 formed on the protective film 150.

[0242] The second sub-driving voltage line connection wiring VDDL22_Br may include a second extension portion VDDL2_EX in a region near the bent portion. The second extension portion VDDL2_EX may be formed concurrently or simultaneously with the second sub-driving voltage line connection wiring VDDL22_Br from the same material. For example, the second extension portion VDDL2_EX may be formed as a single layer or multiple layers including any one of molybdenum (Mo), aluminum (Al), chromium (Cr), gold (Au), titanium (Ti), nickel (Ni), neodymium (Nd), and copper (Cu) or an alloy thereof.

[0243] The second extension portion VDDL2_EX may include a hypotenuse extending in a first diagonal direction DDR1 between the first direction (X direction) and the second direction (Y direction). The angle θ6 of the hypotenuse of the second extension portion VDDL2_EX with the first direction (X direction) may be different from the angle θ1 of the hypotenuse of the first extension portion ELK_EX with the first direction (X direction). According to an embodiment, the angle θ6 of the hypotenuse of the second extension portion VDDL2_EX with the first direction (X direction) may be greater than the angle θ1 of the hypotenuse of the first extension portion ELK_EX with the first direction (X direction). In this case, the first extension portion ELK_EX and the second extension portion VDDL2_EX may only partially overlap each other in the third direction (Z direction).

[0244] Since the first triangular extension part ELK_EX and the second triangular extension part VDDL2_EX of the triangle are provided at each of the four vertices of the rectangular transmission part TA, as a result, the transmission part TA can have a dodecagonal shape in the plan view. Compared with the rectangular transmission part TA, in the dodecagonal transmission part TA, the above-mentioned diffraction phenomenon can be reduced. Therefore, without an additional separate process, the first extension part ELK_EX and the second extension part VDDL2_EX are further formed in the process of forming multiple wirings, so as to maintain the appropriate (e.g., good) detection ability of the sensor device SS (e.g., sensor) provided below the transmission part TA.

[0245] Figure 19 is a view showing wirings provided on a transmission part according to another embodiment, and Figure 20 is Figure 19 an enlarged view of region D of

[0246] Refer to Figure 19 and Figure 20 , the difference between this embodiment and the embodiment of Figure 4 is that Figure 19 the pixel group Pg_1 shown in Figure 4 has an area smaller than the area of the pixel group Pg shown in

[0247] More specifically, when the pixel group Pg shown in Figure 4 has a pixel size of FHD (Full High Definition) (about 400 ppi), Figure 19 and Figure 20 the pixel group Pg_1 shown in

[0248] According to the embodiment, before arranging the multiple wirings VIL_1, SLK-1_1, SLK_1, ELK_1, DL_1 and VDDL2_1, the transmission part TA can have a rectangular shape, and multiple auxiliary pixels Pa_1 can be arranged in two rows and four columns. As Figure 20As shown, around a vertex of the transmissive portion TA having a rectangular shape, an auxiliary pixel Pa1_1 corresponding to the second row and the first column of the first pixel group Pg1_1, an auxiliary pixel Pa2_1 corresponding to the second row and the second column of the first pixel group Pg1_1, and an auxiliary pixel Pa3_1 corresponding to the first row and the fourth column of the second pixel group Pg2_1 can be arranged.

[0249] The data line DL1_1 and the second sub-driving voltage line VDDL21_1 can extend in the second direction (Y direction) on the auxiliary pixel Pa1_1 corresponding to the second row and the first column of the first pixel group Pg1_1, and the data line DL2_1 and the second sub-driving voltage line VDDL22_1 can extend in the second direction (Y direction) on the auxiliary pixel Pa2_1 corresponding to the second row and the second column of the first pixel group Pg1_1. The initialization voltage line VIL_1, the (K - 1)-th scan line SLK-1_1, the K-th scan line SLK_1, and the emission control line ELK_1 can extend in the first direction (X direction) on the auxiliary pixel Pa3_1 corresponding to the first row and the fourth column of the second pixel group Pg2_1.

[0250] To ensure the maximum transmittance of the transmissive portion TA, multiple wirings VIL_1, SLK-1_1, SLK_1, ELK_1, DL_1, and VDDL2_1 can be arranged along the edge of the transmissive portion TA. For ease of explanation, although in the drawings the initialization voltage line VIL_1, the (K - 1)-th scan line SLK-1_1, the K-th scan line SLK_1, and the emission control line ELK_1 extending in the first direction (X direction) are shown to be arranged at a set or predetermined interval from each other, the multiple wirings VIL_1, SLK-1_1, SLK_1, ELK_1, DL1_1, VDDL21_1, DL2_1, and VDDL22_1 can be arranged without being spaced apart from each other in the plan view.

[0251] According to an embodiment, the initialization voltage line VIL_1 may be formed on both the auxiliary pixel Pa3_1 and the transmission part TA by a second gate layer GTL2 formed on the first interlayer insulating film 141. The (K-1)th scan line SLK-1_1 may be formed on both the auxiliary pixel Pa3_1 and the transmission part TA by a first gate layer GTL1 formed on the gate insulating film 130. The Kth scan line SLK_1 may be formed on the auxiliary pixel Pa3_1 by a first gate layer GTL1 formed on the gate insulating film 130, and the Kth scan line connection line SLK_Br1 may be formed on the transmission part TA by a second gate layer GTL2 formed on the first interlayer insulating film 141. The Kth scan line connection line SLK_Br1 may be electrically connected and / or physically connected to the Kth scan line SLK_1 through a ninth contact hole CNT9 formed in the first interlayer insulating film 141. The emission control line ELK_1 may be formed on both the auxiliary pixel Pa3_1 and the transmission part TA by a first gate layer GTL1 formed on the gate insulating film 130.

[0252] Generally, the initialization voltage line VIL_1, the (K-1)th scan line SLK-1_1, the Kth scan line SLK_1, and the emission control line ELK_1 extending in the first direction (X direction) may include sections extending in a first diagonal direction DDR1 between the first direction (X direction) and the second direction (Y direction), and thus may include two bent portions.

[0253] According to an embodiment, the data lines DL1_1 and DL2_1 may be formed on both the auxiliary pixels Pa1_1 and Pa2_1 and the transmission part TA by a first data metal layer DTL1 formed on the second interlayer insulating film 142. The second sub-driving voltage lines VDDL21_1 and VDDL22_1 may be formed on the auxiliary pixels Pa1_1 and Pa2_1 by a first data metal layer DTL1 formed on the second interlayer insulating film 142. The second sub-driving voltage line connection wirings VDDL21_Br1 and VDDL22_Br1 may be formed on the transmission part TA by a second data metal layer DTL2 formed on the protective film 150. The second sub-driving voltage line connection wirings VDDL21_Br1 and VDDL22_Br1 may be electrically connected and / or physically connected to the second sub-driving voltage lines VDDL21_1 and VDDL22_1 respectively through a tenth contact hole CNT10 formed in the protective film 150.

[0254] Generally, the data lines DL1_1 and DL2_1 and the second sub-driving voltage lines VDDL21_1 and VDDL22_1 extending in the second direction (Y direction) may include sections extending in a first diagonal direction DDR1 between the first direction (X direction) and the second direction (Y direction), and thus may include two bent portions.

[0255] The data line DL1_1 and the second sub-driving voltage line VDDL21_1 provided on the auxiliary pixel Pa1_1 can be respectively set to overlap with the initialization voltage line VIL_1 and the (K-1)th scanning line SLK-1_1 in the third direction (Z direction) at and around the two bending portions, and the data line DL2_1 and the second sub-driving voltage line VDDL22_1 provided on the auxiliary pixel Pa2_1 can be respectively set to overlap with the Kth scanning line SLK_1 and the emission control line ELK_1 in the third direction (Z direction) at and around the two bending portions.

[0256] According to an embodiment of the present disclosure, since the arrangement of the plurality of wirings VIL_1, SLK-1_1, SLK_1, ELK_1, DL1_1, VDDL21_1, DL2_1, and VDDL22_1 at the other vertex of the transmissive portion TA is symmetric in the first direction (X direction) and the second direction (Y direction) with respect to the above, the detailed description thereof will be omitted hereinafter. Since the wirings extending in the first direction include sections extending two bending portions in the first diagonal direction DDR1 at each of the four vertices of the rectangular transmissive portion TA, as a result, the transmissive portion TA may have an octagonal shape in the plan view. Compared with the rectangular transmissive portion TA, in the octagonal transmissive portion TA, the above-described diffraction phenomenon can be reduced. Therefore, without an additional separate process, sections extending two bending portions in the first diagonal direction DDR1 are further formed in the process of forming the plurality of wirings, thereby maintaining an appropriate (e.g., good) detection ability of the sensor device SS (e.g., a sensor) provided below the transmissive portion TA.

[0257] According to an embodiment of the present disclosure, a display device can be provided in which light diffraction is reduced around a transmissive portion, thereby increasing the light reception amount and light reception quality of a sensor device provided below the transmissive portion.

[0258] When describing embodiments of the present invention, the use of "may" means "one or more embodiments of the present invention". Moreover, the term "exemplary" means an example or illustration.

[0259] Although certain exemplary embodiments and implementations have been described herein, other embodiments and modifications will be apparent from this specification. Therefore, the subject matter of the present disclosure is not limited to these embodiments, but rather to the broader scope of the appended claims and various obvious modifications and equivalent arrangements that will be apparent to those of ordinary skill in the art.

Claims

1. A display device, comprising: a substrate including a display area and a sensor area, the display area including a plurality of main pixels, and the sensor area including a plurality of auxiliary pixels and a plurality of transmissive portions; and a plurality of wirings arranged along edges of the plurality of transmissive portions and electrically connecting the plurality of auxiliary pixels, wherein: the plurality of wirings include a plurality of first-direction wirings extending in a first direction and arranged in a second direction intersecting the first direction, and a plurality of second-direction wirings extending in the second direction and arranged in the first direction, and the wirings among the plurality of first-direction wirings adjacent to the transmissive portions include first extension portions, wherein the plurality of first-direction wirings include a first wiring for applying an initialization voltage to the auxiliary pixels arranged in the first direction among the plurality of auxiliary pixels, and a second wiring for applying a first scan signal to the auxiliary pixels arranged in the first direction, and wherein, in an area where the auxiliary pixels arranged in the first direction are arranged, the second wiring is on the substrate, a first insulating layer is on the second wiring, and the first wiring is on the first insulating layer.

2. The display device according to claim 1, wherein each of the plurality of transmissive portions has a polygonal shape, a circular shape, or an elliptical shape in a plan view.

3. The display device according to claim 2, wherein each of the plurality of transmissive portions has an octagonal shape in the plan view.

4. The display device according to claim 1, further comprising: A sensor device overlapping the plurality of transmissive portions in a thickness direction of the substrate, the sensor device configured to sense infrared light, visible light, and / or sound.

5. The display device according to claim 1, wherein the plurality of first-direction wirings further include: a third wiring for applying a second scan signal to the auxiliary pixels arranged in the first direction; and a fourth wiring for applying a light emission control signal to the auxiliary pixels arranged in the first direction.

6. The display device according to claim 5, wherein the plurality of second-direction wirings include: a fifth wiring for applying a data voltage to the auxiliary pixels arranged in the second direction among the plurality of auxiliary pixels; and a sixth wiring for applying a first power to the auxiliary pixels arranged in the second direction.

7. The display device according to claim 6, Among them, in the area where the auxiliary pixels arranged in the first direction are arranged, the third wiring and the fourth wiring are on the substrate, and the first insulating layer is on the third wiring and the fourth wiring.

8. The display device according to claim 7, wherein, among the edges of the plurality of transmissive portions, the second wiring and the fourth wiring are on the substrate, and a connection wiring of the first wiring and the third wiring is on the first insulating layer.

9. The display device according to claim 8, The connection wiring of the third wiring is connected to the third wiring through a first contact hole penetrating the first insulating layer.

10. The display device according to claim 7, Among them, In the region where the auxiliary pixels arranged in the first direction are arranged, a second insulating layer is on the first wiring, and the fifth wiring and the sixth wiring are on the second insulating layer.

11. The display device according to claim 10, Wherein, among the edges of the plurality of transmissive portions, the fifth wiring is on the second insulating layer, a third insulating layer is on the fifth wiring, and the connection wiring of the sixth wiring is on the third insulating layer.

12. The display device according to claim 11, Wherein the connection wiring of the sixth wiring is connected to the sixth wiring through a second contact hole penetrating the third insulating layer.

13. The display device according to claim 6, Wherein, in a plan view, each of the first wiring to the sixth wiring includes a bent portion bent at the edge of the plurality of transmissive portions, and The first extension portion extends from the bent portion of the fourth wiring.

14. The display device according to claim 13, Wherein the first extension portion has a triangular shape in the plan view.

15. The display device according to claim 13, Wherein the first extension portion includes a first hypotenuse facing the bent portion, and for each transmissive portion, the angle of the first hypotenuse with the first direction is different.

16. The display device according to claim 15, Wherein the sixth wiring includes a second extension portion extending from the bent portion of the sixth wiring toward the transmissive portion.

17. The display device according to claim 16, Wherein the second extension portion has a triangular shape in the plan view.

18. The display device according to claim 16, Wherein the first extension portion includes the same material as the fourth wiring, and the second extension portion includes the same material as the sixth wiring.

19. The display device according to claim 17, Wherein the second extension portion includes a second hypotenuse facing the bent portion, and the angle of the second hypotenuse with the first direction is different from the angle of the first hypotenuse with the first direction.

20. A display device, comprising: A substrate including a display area and a sensor area, the display area including a plurality of main pixels, and the sensor area including a plurality of auxiliary pixels and a plurality of transmissive portions; And A plurality of wirings arranged along the edges of the plurality of transmissive portions and electrically connecting the plurality of auxiliary pixels to each other, Wherein the plurality of wirings include a plurality of first-direction wirings extending in a first direction and arranged in a second direction intersecting the first direction, and a plurality of second-direction wirings extending in the second direction and arranged in the first direction, and Each of the plurality of first-direction wirings and the plurality of second-direction wirings includes at least two bent portions at the edges of the plurality of transmissive portions, Wherein the plurality of first-direction wirings include a first wiring and a second wiring, the first wiring is configured to apply an initialization voltage to the auxiliary pixels arranged in the first direction among the plurality of auxiliary pixels, and the second wiring is configured to apply a first scan signal to the auxiliary pixels arranged in the first direction, and wherein, in a region where the auxiliary pixels arranged in the first direction are arranged, the second wiring is on the substrate, a first insulating layer is on the second wiring, and the first wiring is on the first insulating layer.

21. The display device according to claim 20, wherein an area of one of the plurality of transmissive portions is larger than a light-emitting area of one of the plurality of auxiliary pixels.

22. The display device according to claim 20, wherein the plurality of first-direction wirings and the plurality of second-direction wirings overlap each other in the thickness direction of the substrate in the at least two bending portions.

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