Photosensitive Component, Camera Module, Manufacturing Method Thereof, and Electronic Device

Abstract

A photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. The photosensitive component is used to be assembled with at least one optical lens into a camera module. The photosensitive component includes: a circuit board; at least one photosensitive element, wherein each photosensitive element is electrically connected to the circuit board; and at least one shaping device, wherein each shaping device includes a first adhesive layer and a second adhesive layer disposed between the corresponding photosensitive element and the circuit board, and the second adhesive layer is located outside the first adhesive layer to plastically mount the corresponding photosensitive element on the circuit board.

Description

Technical Field

[0001] The present invention relates to the field of optical imaging, and particularly to a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. Background Art

[0002] As one of the standard configurations of most electronic devices, the high imaging quality of the camera module plays an extremely important role in the development of electronic devices towards high performance. Moreover, the assembly quality of the camera module directly affects the imaging quality of the camera module, making the prior art pay more and more attention to the assembly of the camera module and putting forward more and more stringent requirements for the assembly quality.

[0003] Currently, in the conventional technical solution, the camera module generally includes a lens, a filter component, and a photosensitive component. When assembling the camera module, the photosensitive chip is first directly bonded to the circuit board by glue and electrically connected to the circuit board by gold wires to assemble the photosensitive component, and then the filter component and the optical lens are sequentially arranged corresponding to the photosensitive component to complete the assembly. However, during the process of attaching the photosensitive chip, the photosensitive chip is usually picked up by means of a suction nozzle, for example, the suction nozzle is close to the outer periphery (i.e., the non-photosensitive area) of the photosensitive chip, and the photosensitive chip is sucked by means of pumping air. Therefore, the photosensitive chip will inevitably bend convexly towards the object side due to the suction force of the suction nozzle. At the same time, the glue disposed between the photosensitive chip and the circuit board will shrink during curing. After the photosensitive chip is attached to the circuit board, the photosensitive chip will still present a convexly bent state towards the object side. That is to say, in the finally assembled camera module, the photosensitive surface of the photosensitive chip is uneven or the photosensitive surface of the photosensitive chip bends convexly towards the object side to form a "crying face" chip. Although the ideal focal plane of the lens in the camera module is a plane, due to the reasons of lens optical design and assembly tolerance in assembling the lens, the actual focal plane of the finished lens is usually concave and bent towards the object side. Therefore, the photosensitive surface of the photosensitive chip and the focal plane of the lens cannot be matched, resulting in aberration problems such as field curvature and distortion during imaging of the assembled camera module, and reducing the imaging quality of the camera module.

[0004] In addition, when the photosensitive chip is bonded to the object side surface of the circuit board by glue, it is usually necessary to heat and bake to cure the glue. During the baking and cooling process of the circuit board, warping will occur, causing the photosensitive surface of the photosensitive chip to bend. In particular, after the photosensitive chip is adhesively fixed to the circuit board by baking and curing the glue, during the cooling process, the object side surface of the circuit board shrinks less than the image side surface of the circuit board due to the influence of the photosensitive chip and the glue, resulting in the circuit board also bending convexly towards the object side, further bending the photosensitive surface of the photosensitive chip convexly towards the object side, seriously affecting the imaging quality of the camera module.

[0005] In particular, for a camera module with high pixels and a large chip size, since its chip size increases rapidly (for example, the chip size of more than 48 million pixels is commonly 1 / 2 inch at present, and chips with a size of 1 / 1.7 inch or even larger will appear in the future), and the photosensitive chip is thinner than a general chip, with a thickness of only about 0.15 mm, large chips are more likely to bend, which has an increasing impact on the imaging quality of the camera module. In addition, with the popularization of large-pixel chips, the corresponding improvement in optical performance is an inevitable trend. For example, lens optical parameters such as large aperture and large wide-angle modules will be gradually improved to maximize the resolution performance of the photosensitive chip. However, large aperture and large wide-angle modules have higher requirements for flatness because the flatness of the photosensitive chip has a greater impact on the imaging of the camera module. Summary of the Invention

[0006] An object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device, which can improve the bending problem of the photosensitive chip and contribute to improving the imaging quality of the camera module.

[0007] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In an embodiment of the present invention, the camera module can improve the problem that the photosensitive chip of the photosensitive component bends convexly toward the object side, which is beneficial to improving the imaging quality of the camera module.

[0008] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In an embodiment of the present invention, the camera module can adjust the bending of the photosensitive chip so that the photosensitive surface of the photosensitive chip remains flat or bends concavely toward the object side to adapt and match the focal plane of the optical lens.

[0009] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In an embodiment of the present invention, the camera module can improve the problem that the photosensitive chip bends convexly toward the object side caused by the suction of the suction nozzle.

[0010] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In an embodiment of the present invention, the camera module can improve the problem that the photosensitive chip bends convexly toward the object side caused by the shrinkage of the glue during curing.

[0011] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can improve the problem that the photosensitive chip bulges and bends toward the object side due to baking the circuit board in the photosensitive component.

[0012] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can adjust the bending of the photosensitive chip by disposing a first glue and a second glue with different shrinkage amounts between the photosensitive chip and the circuit board, so that the photosensitive surface of the photosensitive chip is adaptively matched with the focal plane of the optical lens.

[0013] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can adjust the bending of the photosensitive chip by disposing a first glue and a second glue with different shrinkage rates between the photosensitive chip and the circuit board, so that the photosensitive surface of the photosensitive chip is adaptively matched with the focal plane of the optical lens.

[0014] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can adjust the bending of the photosensitive chip by disposing first glue and second glue with different thicknesses between the photosensitive chip and the circuit board, so that the photosensitive surface of the photosensitive chip is adaptively matched with the focal plane of the optical lens.

[0015] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can further adjust the bending of the photosensitive chip by disposing a reinforcing element, so that the photosensitive surface of the photosensitive chip is adaptively matched with the focal plane of the optical lens.

[0016] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, by disposing the reinforcing element, the camera module can, while improving the bending problem of the photosensitive chip, also reduce the bending of the circuit board, which helps to provide a flat mounting surface for the photosensitive chip.

[0017] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the camera module can, while reducing the influence of the circuit board on the photosensitive chip by the reinforcing element, also reinforce the strength of the circuit board and the photosensitive chip.

[0018] Another object of the present invention is to provide a photosensitive component, a camera module, a manufacturing method thereof, and an electronic device. In order to achieve the above object, in the present invention, expensive materials or complex structures do not need to be adopted. Therefore, the present invention successfully and effectively provides a solution, which not only provides a simple photosensitive component, a camera module, a manufacturing method thereof, and an electronic device, but also increases the practicability and reliability of the photosensitive component, the camera module, the manufacturing method thereof, and the electronic device.

[0019] To achieve the above at least one object of the invention or other objects and advantages, the present invention provides a photosensitive component for being assembled with at least one optical lens into a camera module, wherein the photosensitive component includes:

[0020] A circuit board;

[0021] At least one photosensitive element, wherein each photosensitive element is electrically connected to the circuit board; and

[0022] At least one shaping device, wherein each shaping device includes a first adhesive layer and a second adhesive layer disposed between the corresponding photosensitive element and the circuit board, and the second adhesive layer is located outside the first adhesive layer to adhesively mount the corresponding photosensitive element on the circuit board in a shaped manner.

[0023] In an embodiment of the present invention, the shrinkage amount of the second adhesive layer of the shaping device during forming is different from the shrinkage amount of the first adhesive layer of the shaping device during forming, so as to adhesively bond the photosensitive element to the circuit board and also shape the photosensitive element through the shrinkage of the first adhesive layer and the second adhesive layer, so that the photosensitive surface of the photosensitive chip is adaptively matched with the focal plane of the optical lens.

[0024] In an embodiment of the present invention, the shrinkage amount of the second adhesive layer of the shaping device during forming is less than the shrinkage amount of the first adhesive layer of the shaping device during forming.

[0025] In an embodiment of the present invention, the second adhesive layer is located around the first adhesive layer, and the second adhesive layer corresponds to the peripheral portion of the photosensitive element, and the first adhesive layer corresponds to the middle portion of the photosensitive element.

[0026] In an embodiment of the present invention, the second adhesive layer is symmetrically located around the first adhesive layer, and the width of the second adhesive layer corresponding to the short side of the photosensitive element is greater than the width of the second adhesive layer corresponding to the long side of the photosensitive element.

[0027] In an embodiment of the present invention, the second adhesive layer is in direct contact with the first adhesive layer.

[0028] In an embodiment of the present invention, the outer peripheral edge of the second adhesive layer is located within the outer peripheral edge of the photosensitive element, so as to leave a space between the second adhesive layer and the outer peripheral edge of the photosensitive element.

[0029] In an embodiment of the present invention, the outer peripheral edge of the second adhesive layer is located outside the outer peripheral edge of the photosensitive element, so that the second adhesive layer covers the outer peripheral edge of the photosensitive element.

[0030] In an embodiment of the present invention, the second adhesive layer and the first adhesive layer are arranged at intervals to form a gap between the first adhesive layer and the second adhesive layer.

[0031] In an embodiment of the present invention, the second adhesive layer has at least one notch to communicate the gap between the first adhesive layer and the second adhesive layer with the external space through the notch.

[0032] In an embodiment of the present invention, the second adhesive layer is located on both sides of the first adhesive layer, and the second adhesive layer respectively corresponds to the short sides of the photosensitive element.

[0033] In an embodiment of the present invention, the second adhesive layer is located at the four corners of the first adhesive layer, and the second adhesive layer respectively corresponds to the four corners of the photosensitive element.

[0034] In an embodiment of the present invention, the shrinkage amount of the second adhesive layer of the shaping device during shaping is greater than the shrinkage amount of the first adhesive layer during shaping.

[0035] In an embodiment of the present invention, the shaping device shapes the photosensitive element so that the photosensitive surface of the photosensitive element is flat or curved concavely toward the object side.

[0036] In an embodiment of the present invention, the first adhesive layer is formed by curing a first glue, and the second adhesive layer is formed by curing a second glue, wherein the shrinkage rate of the first glue is greater than the shrinkage rate of the second glue.

[0037] In an embodiment of the present invention, the first adhesive layer is formed by curing a first glue, and the second adhesive layer is formed by curing a second glue, wherein the shrinkage rate of the first glue is less than the shrinkage rate of the second glue.

[0038] In an embodiment of the present invention, the shaping device further includes a third adhesive layer, wherein the third adhesive layer is disposed between the first adhesive layer and the third adhesive layer, and the shrinkage amount of the third adhesive layer during forming is between the shrinkage amount of the first adhesive layer during forming and the shrinkage amount of the second adhesive layer during forming.

[0039] In an embodiment of the present invention, the third adhesive layer is formed by curing a third glue, wherein the shrinkage rate of the third glue is greater than the shrinkage rate of the second glue, and the shrinkage rate of the third glue is less than the shrinkage rate of the first glue.

[0040] In an embodiment of the present invention, the shaping device further includes a reinforcing element, wherein the reinforcing element is disposed between the photosensitive element and the circuit board for reinforcing the structural strength of the circuit board.

[0041] In an embodiment of the present invention, the reinforcing element is a reinforcing flat plate cured by a molding process on the circuit board by a molding material, wherein both the first adhesive layer and the second adhesive layer are located between the reinforcing flat plate and the photosensitive element.

[0042] In an embodiment of the present invention, the shaping device further includes a reinforcing element, wherein the reinforcing element is disposed between the photosensitive element and the circuit board for reinforcing the structural strength of the circuit board.

[0043] In an embodiment of the present invention, the reinforcing element is a reinforcing ring plate cured by a molding process on the circuit board by a molding material, wherein the first adhesive layer is located between the circuit board and the photosensitive element, and the second adhesive layer is located between the reinforcing ring plate and the photosensitive element, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

[0044] In an embodiment of the present invention, the first adhesive layer is formed by curing a first glue, and the second adhesive layer is formed by curing a second glue, wherein the shrinkage rate of the first glue is less than or equal to the shrinkage rate of the second glue.

[0045] In an embodiment of the present invention, the reinforcing element further includes at least two connecting reinforcing parts, wherein the connecting reinforcing parts respectively extend integrally from both sides of the reinforcing ring plate to the edge of the circuit board to further reinforce the structural strength of the circuit board.

[0046] In an embodiment of the present invention, each of the connecting reinforcing parts extends integrally from the reinforcing ring plate to the short side of the circuit board.

[0047] In an embodiment of the present invention, the reinforcing element is a separately manufactured reinforcing ring plate, wherein the first adhesive layer is located between the circuit board and the photosensitive element, and the second adhesive layer is located between the reinforcing ring plate and the circuit board, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

[0048] In an embodiment of the present invention, the reinforcing element is a reinforcing concave plate cured from a molding material on the circuit board through a molding process, wherein a groove is provided in the middle of the reinforcing concave plate to provide a lower first upper surface and a higher second upper surface, wherein the first adhesive layer is located between the photosensitive element and the first upper surface of the reinforcing concave plate, and the second adhesive layer is located between the photosensitive element and the second upper surface of the reinforcing concave plate, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

[0049] In an embodiment of the present invention, the photosensitive assembly further includes a base, wherein the base is disposed on the circuit board for mounting the optical lens such that the optical lens is located in the photosensitive path of the photosensitive element.

[0050] In an embodiment of the present invention, it further includes a base, wherein the base is disposed on the circuit board for mounting the optical lens such that the optical lens is located in the photosensitive path of the photosensitive element.

[0051] In an embodiment of the present invention, the base is a bracket base, wherein the bracket base is mounted on the edge region of the circuit board to surround the photosensitive element mounted on the circuit board for mounting a filter assembly and the optical lens such that both the filter assembly and the optical lens are located in the photosensitive path of the photosensitive element.

[0052] In an embodiment of the present invention, the base is a molded base, wherein the molded base is cured on the circuit board through a molding process by a molding material to cover the electronic components on the circuit board.

[0053] In an embodiment of the present invention, the reinforcing element of the shaping device further includes at least one connecting reinforcing portion, wherein each connecting reinforcing portion extends integrally from the reinforcing ring plate to the molded base so that the molded base and the reinforcing ring plate are molded together.

[0054] In an embodiment of the present invention, the base is a molded base, wherein the molded base is cured on the circuit board through a molding process by a molding material to cover the electronic components on the circuit board and the non-photosensitive area of the photosensitive element.

[0055] According to another aspect of the present invention, the present invention further provides an imaging module, comprising:

[0056] at least one optical lens; and

[0057] the photosensitive component described in any one of the above, wherein each of the optical lenses is correspondingly disposed on the photosensitive component so that each of the optical lenses is located in the photosensitive path of the corresponding photosensitive element in the photosensitive component.

[0058] In an embodiment of the present invention, the imaging module further includes a filter component, wherein the filter component is correspondingly disposed between the optical lens and the photosensitive element of the photosensitive component, so that the light entering through the optical lens is received by the photosensitive element after passing through the filter component.

[0059] In an embodiment of the present invention, the filter component includes a filter element, wherein the filter element is correspondingly disposed on the photosensitive component, and the filter element corresponds to the photosensitive path of the photosensitive element.

[0060] In an embodiment of the present invention, the filter component further includes a support member, wherein the filter element is assembled on the support member, and the support member is disposed on the photosensitive component.

[0061] In an embodiment of the present invention, the imaging module further includes a driver, wherein the optical lens is drivably assembled on the driver, and the driver is mounted on the base of the photosensitive component so that the optical lens is held in the photosensitive path of the photosensitive element.

[0062] In an embodiment of the present invention, the imaging module further includes a lens barrel, wherein the optical lens is fixedly assembled on the lens barrel, and the lens barrel is mounted on the base of the photosensitive component so that the optical lens is held in the photosensitive path of the photosensitive element.

[0063] In an embodiment of the present invention, the imaging module further includes a light steering mechanism, wherein the light steering mechanism is disposed in the photosensitive path of the photosensitive element of the photosensitive component for steering the light incident on the light steering mechanism so that the steered light is received by the photosensitive element after passing through the optical lens.

[0064] According to another aspect of the present invention, the present invention further provides an electronic device, comprising:

[0065] an electronic device body; and

[0066] At least one of the above-described camera modules, each of which is disposed on the electronic device body for acquiring images.

[0067] According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, including the steps of:

[0068] By means of a shaping device, at least one photosensitive element is shaped and mounted on a circuit board, wherein the shaping device includes a first adhesive layer and a second adhesive layer, and the second adhesive layer is located outside the first adhesive layer to adhesively bond the photosensitive element to the circuit board in a shaped manner to assemble a photosensitive component; and

[0069] Correspondingly, at least one optical lens is disposed on the photosensitive component such that each optical lens is located in the photosensitive path of the corresponding photosensitive element, and the photosensitive surface of each photosensitive element adaptively matches the focal plane of the optical lens.

[0070] In an embodiment of the present invention, the shrinkage amount of the second adhesive layer of the shaping device during forming is different from the shrinkage amount of the first adhesive layer during forming, so as to adhesively bond the photosensitive element to the circuit board and also shape the photosensitive element through the shrinkage of the first adhesive layer and the second adhesive layer, so that the photosensitive surface of the photosensitive chip adaptively matches the focal plane of the optical lens.

[0071] In an embodiment of the present invention, the step of shaping and mounting at least one photosensitive element on a circuit board by means of a shaping device to improve the bending problem of the photosensitive element and electrically connecting each photosensitive element to the circuit board to assemble a photosensitive component includes the steps of:

[0072] The first glue and the second glue are respectively applied to the chip mounting surface of the circuit board, wherein the second glue is located outside the first glue, and the shrinkage rate of the first glue is greater than that of the second glue;

[0073] Place the photosensitive element on the first glue and the second glue; and

[0074] After the first glue and the second glue are cured, the first adhesive layer and the second adhesive layer are respectively formed between the photosensitive element and the circuit board.

[0075] In an embodiment of the present invention, the step of shaping and mounting at least one photosensitive element on a circuit board by means of a shaping device to improve the bending problem of the photosensitive element and electrically connecting each photosensitive element to the circuit board to assemble a photosensitive component includes the steps of:

[0076] A reinforcing element is disposed on the chip mounting surface of the circuit board;

[0077] Apply a first glue between the circuit board and the photosensitive element, and apply a second glue between the reinforcing element and the photosensitive element, wherein the second glue is located outside the first glue; and

[0078] After the first glue and the second glue are cured, a first bonding layer is formed between the photosensitive element and the circuit board, and a second bonding layer is formed between the photosensitive element and the reinforcing element, wherein the thickness of the first bonding layer is greater than the thickness of the second bonding layer.

[0079] In an embodiment of the present invention, the reinforcing element is a reinforcing ring plate or a reinforcing concave plate cured by a molding material on the circuit board through a molding process.

[0080] In an embodiment of the present invention, the steps of plastically mounting at least one photosensitive element on a circuit board by means of a shaping device to improve the bending problem of the photosensitive element and electrically connecting each of the photosensitive elements to the circuit board to assemble a photosensitive component include the steps of:

[0081] Apply the first glue and the second glue to the chip mounting surface of the circuit board respectively, wherein the second glue is located outside the first glue;

[0082] Place a reinforcing ring plate correspondingly on the second glue;

[0083] Place the photosensitive element on the first glue and the reinforcing ring plate so that the first glue is located between the photosensitive element and the circuit board, and the second glue is located between the reinforcing ring plate and the circuit board; and

[0084] After the first glue and the second glue are cured, a first bonding layer is formed between the photosensitive element and the circuit board, and a second bonding layer is formed between the reinforcing ring plate and the circuit board, wherein the thickness of the first bonding layer is greater than the thickness of the second bonding layer.

[0085] In an embodiment of the present invention, the shrinkage rate of the first glue is less than or equal to the shrinkage rate of the second glue.

[0086] In an embodiment of the present invention, the method for manufacturing the camera module further includes the steps of:

[0087] Correspondingly arrange a filter component between the photosensitive component and the optical lens so that the light entering from the optical lens is received by the photosensitive element of the photosensitive component after passing through the filter component.

[0088] Through the understanding of the subsequent description and the drawings, the further objects and advantages of the present invention will be fully reflected.

[0089] These and other objects, features, and advantages of the present invention will be fully embodied in the following detailed description, drawings, and claims. Description of the Drawings

[0090] Figure 1 is a three-dimensional schematic diagram of an imaging module according to a first embodiment of the present invention.

[0091] Figure 2 Shows a cross-sectional schematic diagram of the imaging module according to the above-mentioned first embodiment of the present invention.

[0092] Figure 3 Shows a schematic diagram of the manufacturing process of the photosensitive component of the imaging module according to the above-mentioned first embodiment of the present invention.

[0093] Figure 4A Shows a first variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0094] Figure 4B Shows a second variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0095] Figure 4C Shows a third variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0096] Figure 4D Shows a fourth variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0097] Figure 4E Shows a fifth variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0098] Figure 4F Shows a sixth variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0099] Figure 4G Shows a seventh variant embodiment of the photosensitive component according to the above-mentioned first embodiment of the present invention.

[0100] Figure 5A Shows a first variant embodiment of the imaging module according to the above-mentioned first embodiment of the present invention.

[0101] Figure 5B Shows a second variant embodiment of the imaging module according to the above-mentioned first embodiment of the present invention.

[0102] Figure 5C Shows a third variant embodiment of the imaging module according to the above-mentioned first embodiment of the present invention.

[0103] Figure 5D Shows a fourth modified embodiment of the imaging module according to the above first embodiment of the present invention.

[0104] Figure 6 Is a schematic cross-sectional view of an imaging module according to a second embodiment of the present invention.

[0105] Figure 7 Shows a schematic diagram of the manufacturing process of the photosensitive component of the imaging module according to the above second embodiment of the present invention.

[0106] Figure 8A Shows a first modified embodiment of the photosensitive component according to the above second embodiment of the present invention.

[0107] Figure 8B Shows a second modified embodiment of the photosensitive component according to the above second embodiment of the present invention.

[0108] Figure 8C Shows a third modified embodiment of the photosensitive component according to the above second embodiment of the present invention.

[0109] Figure 8D Shows a fourth modified embodiment of the photosensitive component according to the above second embodiment of the present invention.

[0110] Figure 8E Shows a fifth modified embodiment of the photosensitive component according to the above second embodiment of the present invention.

[0111] Figure 9 Shows a schematic flowchart of a manufacturing method of an imaging module according to an embodiment of the present invention.

[0112] Figure 10A Shows a first example of manufacturing a photosensitive component in the manufacturing method of the imaging module according to the above embodiment of the present invention.

[0113] Figure 10B Shows a second example of manufacturing a photosensitive component in the manufacturing method of the imaging module according to the above embodiment of the present invention.

[0114] Figure 10C Shows a third example of manufacturing a photosensitive component in the manufacturing method of the imaging module according to the above embodiment of the present invention.

[0115] Figure 11 Shows a three-dimensional schematic diagram of an electronic device according to an embodiment of the present invention. Detailed implementation manners

[0116] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and other obvious variations can be conceived by those skilled in the art. The basic principles defined in the following description of the present invention can be applied to other embodiments, variations, improvements, equivalent solutions, and other technical solutions without departing from the spirit and scope of the present invention.

[0117] Those skilled in the art should understand that in the disclosure of the present invention, the orientation or positional relationship indicated by the terms "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be construed as limiting the present invention.

[0118] In the present invention, the term "a" in the claims and the specification should be understood as "one or more". That is, in one embodiment, the number of an element can be one, while in other embodiments, the number of the element can be multiple. Unless it is clearly indicated in the disclosure of the present invention that the number of the element is only one, the term "a" should not be understood as being unique or single, and the term "a" should not be construed as a limitation on the quantity.

[0119] In the description of the present invention, it should be understood that terms such as "first", "second", etc. are only for descriptive purposes and cannot be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "connected" and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection; it can be a direct connection, or an indirect connection through a medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0120] In the description of this specification, the description referring to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0121] With the rapid development of science and technology, people's requirements for the imaging quality of camera modules are becoming increasingly stringent. As is well known, in a camera module, whether the photosensitive surface of the photosensitive chip matches the focal plane of the optical lens directly affects the imaging quality of the camera module. Due to the assembly tolerance of the optical lens in the existing camera module, the actual focal plane of the finished optical lens is recessedly curved towards the object side to form a concave curved surface, and the photosensitive surface of the photosensitive chip in the existing camera module is convexly curved towards the object side due to the suction of the suction nozzle to form a convex curved surface (that is, the existing photosensitive chip is often a "crying face" chip). Therefore, in the existing camera module, the photosensitive surface of the photosensitive chip cannot match the actual focal plane of the optical lens, resulting in a low imaging quality of the existing camera module.

[0122] In addition, the degree of curvature of the actual focal plane of the optical lens is determined by the optical design and assembly tolerance of the optical lens. Due to the limitation of the assembly process level of the optical lens, the actual focal plane of the optical lens can usually only be a concave curved surface towards the object side. Therefore, it is very difficult for the actual focal plane of the optical lens to be an ideal focal plane or a convex curved surface towards the object side to adaptively match the photosensitive surface of the photosensitive chip. In summary, the present invention shapes the photosensitive chip to adjust the curvature of the photosensitive chip, so that the photosensitive surface of the photosensitive chip adaptively matches the actual focal plane of the optical lens, in order to improve the imaging quality of the camera module.

[0123] Referring to Figures 1 to 3 shown in the accompanying drawings of the specification, a camera module according to a first embodiment of the present invention is illustrated. Specifically, as Figure 1 shown, the camera module 1 includes at least one optical lens 10 and a photosensitive assembly 20, wherein each optical lens 10 is correspondingly disposed on the photosensitive assembly 20 to assemble the camera module 1.

[0124] As Figure 2 and Figure 3As shown, the photosensitive component 20 includes a circuit board 21, at least one photosensitive element 22, and at least one shaping device 23. Each of the photosensitive elements 22 is electrically connected to the circuit board 21. Each of the shaping devices 23 is disposed between each of the photosensitive elements 22 and the circuit board 21 for plastically mounting each of the photosensitive elements 22 on the chip mounting area of the circuit board 21 to improve the bending problem of each of the photosensitive elements 22, so that the photosensitive surface 220 of the photosensitive element 22 is adaptively matched with the focal plane 100 of the optical lens 10, which helps to improve the imaging quality of the imaging module 1. Each of the optical lenses 10 is correspondingly mounted on the circuit board 21, and each of the optical lenses 10 is respectively located in the photosensitive path of the corresponding photosensitive element 22.

[0125] It can be understood that in the imaging module 1 of the present invention, after the photosensitive element 22 is shaped by the shaping device 23, the bending problem of the photosensitive element 22 is improved. For example, the degree of convex bending of the photosensitive surface 220 of the photosensitive element 22 toward the object side is reduced, or the photosensitive surface 220 of the photosensitive element 22 tends to be flat, or even the photosensitive surface 220 of the photosensitive element 22 is concave-bent toward the object side, so that the photosensitive surface 220 of the photosensitive element 22 is adaptively matched with the focal plane 100 of the optical lens 10 to improve the imaging quality of the imaging module 1. It should be noted that in the present invention, the adaptive matching of the photosensitive surface 220 of the photosensitive element 22 with the focal plane 100 of the optical lens 10 does not mean that the photosensitive surface 220 of the photosensitive element 22 completely coincides with the focal plane 100 of the optical lens 10, but rather to minimize the assembly tolerance between the photosensitive surface 220 of the photosensitive element 22 and the focal plane 100 of the optical lens 10.

[0126] It is worth mentioning that although in the attached Figures 1 to 5D and the following description, the imaging module 1 is taken as an example in which only one optical lens 10 and one photosensitive element 22 are included to illustrate the features and advantages of the imaging module 1 of the present invention. Those skilled in the art can understand that the imaging module 1 disclosed in the attached Figures 1 to 5D and the following description is only an example, which does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the imaging module, the number of the optical lenses 10 and the photosensitive elements 22 can both exceed one to form an array-type imaging module. In addition, the type of the optical lens 10 can be adjusted accordingly according to the requirements of the imaging module. For example, the optical lens 10 can be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, etc. The present invention does not limit this.

[0127] Specifically, as Figure 2 and Figure 3 shown, the shaping device 23 of the photosensitive component 20 includes a first adhesive layer 231 and a second adhesive layer 232, wherein the second adhesive layer 232 is located outside the first adhesive layer 231, and the shrinkage amount of the second adhesive layer 232 during curing and forming is different from the shrinkage amount of the first adhesive layer 231 during curing and forming. When bonding the photosensitive element 22 to the circuit board 21, the photosensitive element 22 is shaped by different shrinkage amounts, so that the photosensitive surface 220 of the photosensitive element 22 is adaptively matched with the focal plane 100 of the optical lens 10, thereby achieving the purpose of improving the imaging quality of the imaging module 1.

[0128] Preferably, in the imaging module 1 of the first embodiment of the present invention, the shrinkage amount of the second adhesive layer 232 during forming is less than the shrinkage amount of the first adhesive layer 231 during forming, so as to shape the photosensitive element 22, so that the photosensitive surface 220 of the photosensitive element 22 is adaptively matched with the focal plane 100 of the optical lens 10. It should be noted that the thicknesses of the first adhesive layer 231 and the second adhesive layer 232 are controlled between 10 microns and 60 microns.

[0129] More preferably, after being shaped by the shaping device 23, the curvature of the photosensitive surface 220 of the photosensitive element 22 is controlled within ±10 microns, because the field curvature of the optical lens 10 is usually within this range, so that the shaped photosensitive element 22 is matched with the optical lens 10. Most preferably, the curvature of the photosensitive surface 220 of the photosensitive element 22 is controlled within ±7 microns, and even within ±3 microns. It can be understood that the curvature of the photosensitive surface 220 of the photosensitive element 22 refers to the height difference between the lowest point and the highest point on the photosensitive surface 220 of the photosensitive element 22.

[0130] More specifically, as Figure 3As shown, the first adhesive layer 231 is formed by curing the first glue 2310, and the second adhesive layer 232 is formed by curing the second glue 2320. The shrinkage rate of the first glue 2310 is greater than that of the second glue 2320, so that the shrinkage amount when the first glue 2310 cures to form the first adhesive layer 231 is greater than the shrinkage amount when the second glue 2320 cures to form the second adhesive layer 232. Thus, while firmly bonding the photosensitive element 22 to the circuit board 21, the first adhesive layer 231 and the second adhesive layer 232 can also shape the photosensitive element 22, enabling the photosensitive surface 220 of the photosensitive element 22 to be adaptively matched with the focal plane 100 of the optical lens 10.

[0131] Exemplarily, as Figure 3 shown, first, the first glue 2310 and the second glue 2320 are respectively applied on the chip mounting surface 210 of the circuit board 21, where the second glue 2320 is located around the first glue 2310; then, the photosensitive element 22 can be picked up by means of a suction nozzle 50 and placed corresponding to the first glue 2310 and the second glue 2320, with the first glue 2310 corresponding to the middle part of the photosensitive element 22 and the second glue 2320 corresponding to the peripheral part of the photosensitive element 22; finally, after the first glue 2310 and the second glue 2320 are cured, the first adhesive layer 231 is formed between the middle part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and the second adhesive layer 232 is formed between the peripheral part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21 to assemble the photosensitive component 20. It can be understood that the first glue 2310 and the second glue 2320 can be cured by baking and heating according to the glue properties, or can be cured by means of light, moisture, cooling, etc. The present invention does not make further limitations on this.

[0132] In other words, the second adhesive layer 232 is located around the first adhesive layer 231, that is, the first adhesive layer 231 corresponds to the middle part of the photosensitive element 22, and the second adhesive layer 232 corresponds to the peripheral part of the photosensitive element 22. The photosensitive element 22 is plastically attached to the chip mounting surface 210 of the circuit board 21 through the first adhesive layer 231 and the second adhesive layer 232, so that the photosensitive surface 220 of the photosensitive element 22 is plastically bent in a concave shape toward the object side to form a "smiling face type" chip, thereby enabling the photosensitive surface 220 of the photosensitive element 22 to be adaptively matched with the focal plane 100 of the optical lens 10. It can be understood that in other examples of the present invention, the first glue 2310 and the second glue 2320 can also be respectively applied on the non-photosensitive surface of the photosensitive element 22, or the first glue 2310 can be applied on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 can be applied on the non-photosensitive surface of the photosensitive element 22 to simplify the process of module production and improve the assembly efficiency of the module. It can be understood that the surface of the photosensitive element 22 facing the object side (such as Figure 2 the upper surface of the photosensitive element 22 described therein) is the photosensitive surface 220 of the photosensitive element 22; the surface of the photosensitive element 22 facing the image side (such as Figure 2 the lower surface of the photosensitive element 22 described therein) is the non-photosensitive surface of the photosensitive element 22.

[0133] It should be noted that since the first glue 2310 and the second glue 2320 have a certain fluidity before curing, after the first glue 2310 and the second glue 2320 are applied, when the photosensitive element 22 is placed on the circuit board 21, the first glue 2310 and the second glue 2320 will be extruded to fill the gap between the photosensitive element 22 and the circuit board 21. And since the photosensitive element 22 is bent convexly toward the object side under the suction of the suction nozzle 50, the thickness of the first glue 2310 is often greater than the thickness of the second glue 2320. At this time, if the shrinkage rate of the first glue 2310 is less than or equal to the shrinkage rate of the second glue 2320, such that the shrinkage amount of the first adhesive layer 231 is greater than or equal to the shrinkage amount of the second adhesive layer 232, then the thickness of the first adhesive layer 231 will necessarily be greater than the thickness of the second adhesive layer 232, causing the photosensitive element 22 to remain in a state of being bent convexly toward the object side to form a "crying face type" chip, seriously affecting the imaging quality of the camera module.

[0134] However, in the imaging module 1 of the first embodiment of the present invention, since the shrinkage rate of the first glue 2310 is greater than that of the second glue 2320, the shrinkage amount of the first bonding layer 231 is greater than that of the second bonding layer 232. That is, the thickness difference between the first bonding layer 231 and the second bonding layer 232 is reduced, and even the thickness of the first bonding layer 231 may be less than that of the second bonding layer 232 to form a "smiling face type" chip, so that the photosensitive surface 220 of the photosensitive element 22 is adaptively matched with the focal plane 100 of the optical lens 10, thereby improving the imaging quality of the imaging module 1. In other words, although the photosensitive element 22 still bends convexly toward the object side under the suction of the suction nozzle 50, making the thickness of the first glue 2310 greater than that of the second glue 2320, the shrinkage rate of the first glue 2310 is greater than that of the second glue 2320, so that the thickness difference between the first glue 2310 and the first bonding layer 231 is greater than the thickness difference between the second glue 2320 and the second bonding layer 232, which helps to adaptively match the photosensitive surface 220 of the photosensitive element 22 with the focal plane 100 of the optical lens 10 and facilitates improving the imaging quality of the imaging module 1.

[0135] Preferably, in the first embodiment of the present invention, as Figure 3 shown, the first bonding layer 231 is in contact with the second bonding layer 232 without a gap. In other words, the first glue 2310 and the second glue 2320 are applied without an interval to avoid the presence of air bubbles between the first glue 2310 and the second glue 2320, thereby preventing the photosensitive element 22 from bending due to the expansion of air bubbles during baking. Therefore, applying the glue without an interval helps to prevent the photosensitive element 22 from bending adversely while providing a relatively large bonding area as much as possible to ensure that the first bonding layer 231 and the second bonding layer 232 can firmly bond the photosensitive element 22 to the circuit board 21.

[0136] More preferably, as Figure 3 shown, the first glue 2310 and the second glue 2320 are symmetrically distributed, so that the second bonding layer 232 is symmetrically located around the first bonding layer 231, and further enables the photosensitive element 22 to bend symmetrically to ensure that the photosensitive surface 220 of the photosensitive element 22 matches the focal plane 100 of the optical lens 10 as much as possible.

[0137] Most preferably, as Figure 3As shown, the width of the portion of the second adhesive layer 232 corresponding to the short side of the photosensitive element 22 is greater than the width of the portion of the second adhesive layer 232 corresponding to the long side of the photosensitive element 22. That is to say, the width of the second adhesive layer 232 corresponding to the short side of the photosensitive element 22 is greater than the width of the second adhesive layer 232 corresponding to the long side of the photosensitive element 22, so as to ensure that the photosensitive element 22 generates a greater bending at the short side of the photosensitive element 22 (i.e., the position away from the center of the field of view) to meet the requirements of the focal plane 100 of the optical lens 10 for the photosensitive surface 220 of the photosensitive element 22. It can be understood that since the photosensitive element 22 usually has a rectangular structure, the focal plane 100 of the optical lens 10 is more curved at a position farther away from the center of the field of view (i.e., the center of the photosensitive element 22). Therefore, in order to better match the focal plane 100 of the optical lens 10, the bending generated by the photosensitive element 22 at the short side of the photosensitive element 22 should be greater than the bending generated by the photosensitive element 22 at the long side of the photosensitive element 22.

[0138] Attached Figure 4A shows a first modified embodiment of the photosensitive assembly 20 of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first embodiment of the present invention, the shaping device 23 of the photosensitive assembly 20 according to the first modified embodiment of the present invention further includes a third adhesive layer 233, wherein the third adhesive layer 233 is located between the first adhesive layer 231 and the second adhesive layer 232, and the shrinkage amount of the third adhesive layer 233 during forming is between the shrinkage amount of the second adhesive layer 232 during forming and the shrinkage amount of the first adhesive layer 231 during forming, so as to provide a gradually changing stress for the photosensitive element 22 through the first adhesive layer 231, the third adhesive layer 233 and the second adhesive layer 232, which is beneficial to adjusting the bending of the photosensitive element 22, so that the photosensitive surface 220 of the photosensitive element 22 further matches the focal plane 100 of the optical lens 10.

[0139] More specifically, as Figure 4A shown, the third adhesive layer 233 is formed by curing a third glue 2330, wherein the shrinkage rate of the third glue 2330 is between the shrinkage rate of the first glue 2310 and the shrinkage rate of the second glue 2320, that is, the shrinkage rate of the third glue 2330 is less than the shrinkage rate of the first glue 2310 and greater than the shrinkage rate of the second glue 2320, so as to ensure that the shrinkage amount of the third adhesive layer 233 during forming is between the shrinkage amount of the second adhesive layer 232 during forming and the shrinkage amount of the first adhesive layer 231 during forming, so as to realize the shaping of the photosensitive element 22.

[0140] Exemplarily, as Figure 4A shown, first, the first glue 2310, the third glue 2330, and the second glue 2320 are respectively applied from the inside to the outside on the chip mounting surface 210 of the circuit board 21; then, the photosensitive element 22 is correspondingly placed on the chip mounting surface 210 of the circuit board 21, so that the first glue 2310, the third glue 2330, and the second glue 2320 are located between the non-photosensitive surface of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21; finally, after the first glue 2310, the third glue 2330, and the second glue 2320 are cured, the first bonding layer 231, the third bonding layer 233, and the second bonding layer 232 are sequentially formed from the inside to the outside between the photosensitive element 22 and the circuit board 21 to assemble the photosensitive component 20.

[0141] It is worth mentioning that in other examples of the present invention, the photosensitive component 20 may further include more bonding layers with different shrinkage amounts, and the shrinkage amount of the bonding layers between the photosensitive element 22 and the circuit board 21 gradually decreases from the inside to the outside, so as to provide a slowly changing stress for the photosensitive element 22, which is more conducive to adjusting the bending of the photosensitive element 22, so that the photosensitive surface 220 of the photosensitive element 22 maximally matches the focal plane 100 of the optical lens 10. In other words, more glues with different shrinkage rates are applied between the photosensitive element 22 and the circuit board 21, and the shrinkage rate of the applied glues gradually decreases from the inside to the outside, so as to ensure that the bonding layers formed after the glues are cured have sequentially decreasing shrinkage amounts from the inside to the outside, providing a gradually changing stress for the shaping of the photosensitive element 22, so that the photosensitive surface 220 of the photosensitive element 22 maximally matches the focal plane 100 of the optical lens 10.

[0142] Appendix Figure 4BThe second variant embodiment of the photosensitive component 20 of the imaging module 1 according to the above-mentioned first embodiment of the present invention is shown. Specifically, compared with the above-mentioned first embodiment of the present invention, the second adhesive layer 232 of the shaping device 23 of the photosensitive component 20 according to the second variant embodiment of the present invention is located on both sides of the first adhesive layer 231, and the second adhesive layer 232 corresponds to the short side of the photosensitive element 22, so that the photosensitive element 22 generates a larger bend at a position away from the center of the field of view (i.e., the short side region of the photosensitive element 22) through the shaping device 23, so as to match the focal plane 100 of the optical lens 10. Generally speaking, the farther the focal plane 100 of the optical lens 10 is from the center of the field of view, the greater the field curvature. Therefore, making the photosensitive surface 220 of the photosensitive element 22 bend more at a position away from the center can better match the field curvature of the optical lens 10.

[0143] Exemplarily, as Figure 4B shown, first, the first glue 2310 and the second glue 2320 are respectively applied on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 is located on both sides of the first glue 2310; then, the photosensitive element 22 is correspondingly placed on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 corresponds to the short side of the photosensitive element 22, so that the first glue 2310 and the second glue 2320 are between the non-photosensitive surface of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21; finally, after the first glue 2310 and the second glue 2320 are cured, the first adhesive layer 231 and the second adhesive layer 232 located on both sides of the first adhesive layer 231 are formed between the photosensitive element 22 and the circuit board 21 to assemble the photosensitive component 20.

[0144] Attached Figure 4CShows a third modified embodiment of the photosensitive component 20 of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first embodiment of the present invention, the second adhesive layer 232 of the shaping device 23 of the photosensitive component 20 according to the third modified embodiment of the present invention is located at the four corners of the first adhesive layer 231, so that the first adhesive layer 231 is distributed in a cross shape. That is to say, the second adhesive layer 232 corresponds to the four corners of the photosensitive element 22, so that the photosensitive element 22 generates a larger bend at a position far from the center of the field of view (i.e., the four-corner area of the photosensitive element 22) through the shaping device 23, so as to further match the focal plane 100 of the optical lens 10. Generally speaking, the farther the focal plane 100 of the optical lens 10 is from the center of the field of view, the greater the field curvature. Therefore, making the photosensitive surface 220 of the photosensitive element 22 bend more at a position far from the center can better match the field curvature of the optical lens 10, and the four-corner position of the photosensitive element 22 is the position farthest from the center. It can be understood that in other examples of the present invention, there may also be a gap between the first adhesive layer 231 and the second adhesive layer 232, so that the first adhesive layer 231 has a regular shape such as a rectangle, a circle, or other irregular shapes.

[0145] Exemplarily, as Figure 4C shown, first, the first glue 2310 and the second glue 2320 are respectively applied on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 is located at the four corners of the first glue 2310; then, the photosensitive element 22 is correspondingly placed on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 corresponds to the four-corner area of the photosensitive element 22, so that the first glue 2310 and the second glue 2320 are located between the non-photosensitive surface of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21; finally, after the first glue 2310 and the second glue 2320 are cured, the first adhesive layer 231 and the second adhesive layer 232 located at the four corners of the first adhesive layer 231 are formed between the photosensitive element 22 and the circuit board 21 to assemble the photosensitive component 20.

[0146] Att Figure 4DThe fourth modified embodiment of the photosensitive component 20 of the imaging module 1 according to the above first embodiment of the present invention is shown. Specifically, compared with the above first embodiment of the present invention, during the assembly process of the photosensitive component 20 according to the fourth modified embodiment of the present invention, the mechanical arm 60 is used to clamp the photosensitive element 22 to place the photosensitive element 22 on the chip mounting surface 210 of the circuit board 21. The photosensitive element 22 is bent concave toward the object side due to being clamped by the mechanical arm 60. The shrinkage amount of the first adhesive layer 231 of the shaping device 23 during shaping is less than the shrinkage amount of the second adhesive layer 232 of the shaping device 23 during shaping, so as to reduce the bending degree of the photosensitive element 22, which helps to ensure that the photosensitive surface 220 of the photosensitive element 22 adaptively matches the focal plane 100 of the optical lens 10, thereby improving the imaging quality of the imaging module 1.

[0147] It should be noted that since the clamping force of the mechanical arm 60 is too large, it is easy to cause the photosensitive element 22 to be bent too much concave toward the object side. Therefore, the photosensitive surface 220 of the photosensitive element 22 still cannot adaptively match the focal plane 100 of the optical lens 10. In this modified embodiment of the present invention, the photosensitive element 22 is shaped by changing the shrinkage amount between the first adhesive layer 231 and the second adhesive layer 232 to reduce the bending degree of the photosensitive element 22 concave toward the object side, so that the photosensitive surface 220 of the photosensitive element 22 can adaptively match the focal plane 100 of the optical lens 10.

[0148] Exemplarily, as Figure 4D shown, first, the first glue 2310 and the second glue 2320 are respectively applied to the chip mounting surface 210 of the circuit board 21. The second glue 2320 is located around the first glue 2310, and the shrinkage rate of the second glue 2320 is greater than the shrinkage rate of the first glue 2310. Then, the mechanical arm 60 is used to clamp the photosensitive element 22 to place the photosensitive element 22 correspondingly on the first glue 2310 and the second glue 2320, and make the second glue 2320 correspond to the peripheral part of the photosensitive element 22, and the first glue 2310 correspond to the middle part of the photosensitive element 22. Finally, after the first glue 2310 and the second glue 2320 are cured, the first adhesive layer 231 is formed between the middle part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and the second adhesive layer 232 is formed between the peripheral part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21 to assemble the photosensitive component 20.

[0149] Attached Figure 4E It shows a fifth variant embodiment of the photosensitive component 20 of the imaging module 1 according to the above-mentioned first embodiment of the present invention. Specifically, compared with the above-mentioned first embodiment of the present invention, the difference of the photosensitive component 20 according to the fifth variant embodiment of the present invention is that: the first adhesive layer 231 and the second adhesive layer 232 are spaced apart to form a gap 2301 between the first adhesive layer 231 and the second adhesive layer 232. In other words, the first glue 2310 and the second glue 2320 are applied in a spaced manner so that after the first glue 2310 and the second glue 2320 are cured to form the first adhesive layer 231 and the second adhesive layer 232 respectively, the gap 2301 is left between the first adhesive layer 231 and the second adhesive layer 232, thereby avoiding the adverse effects caused by the contact between the first glue 2310 and the second glue 2320.

[0150] Preferably, the second adhesive layer 232 has at least one notch 2302 to communicate the gap 2301 with the external space through the notch 2302, so that the gap 2301 between the first adhesive layer 231 and the second adhesive layer 232 communicates with the area outside the chip mounting surface 210 of the circuit board 21, which helps to significantly reduce the probability of air bubbles appearing due to the downward pressing and bonding of the photosensitive element 22.

[0151] More preferably, the second adhesive layer 232 is in a C shape to form one notch 2302 on the second adhesive layer 232 to communicate the gap 2301 with the external space through the notch 2302.

[0152] Exemplarily, such as Figure 4EAs shown, first, the first adhesive 2310 and the second adhesive 2320 are respectively and intermittently applied to the chip mounting surface 210 of the circuit board 21, wherein the second adhesive 2320 is located around the first adhesive 2310, and the second adhesive 2320 is applied in a C shape; then, the photosensitive element 22 can be picked up by a suction nozzle 50 and placed corresponding to the first adhesive 2310 and the second adhesive 2320, and the first adhesive 2310 corresponds to the middle part of the photosensitive element 22, and the second adhesive 2320 corresponds to the peripheral part of the photosensitive element 22; finally, after the first adhesive 2310 and the second adhesive 2320 are cured, the first bonding layer 231 is formed between the middle part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and the second bonding layer 232 having the notch 2302 is formed between the peripheral part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and the gap 2301 is formed between the first bonding layer 231 and the second bonding layer 232 to assemble the photosensitive component 20.

[0153] Appended Figure 4F Fig. shows a sixth modified embodiment of the photosensitive component 20 of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first embodiment of the present invention, the difference of the photosensitive component 20 according to the sixth modified embodiment of the present invention is that: the outer peripheral edge of the second bonding layer 232 is located within the outer peripheral edge of the photosensitive element 22, that is to say, the size of the second bonding layer 232 is smaller than the size of the photosensitive element 22. In other words, when applying the first adhesive 2310 and the second adhesive 2320, the application area of the first adhesive 2310 and the second adhesive 2320 is smaller than the area of the photosensitive element 22, so as to leave a space between the outer peripheral edge of the second bonding layer 232 and the outer peripheral edge of the photosensitive element 22, avoiding contaminating the photosensitive element 22 or the pads on the circuit board 21 due to the overflow of the adhesive.

[0154] Specifically, the application area of the first adhesive 2310 and the second adhesive 2320 is smaller than the area of the chip mounting surface 210 of the circuit board 21, that is, the first adhesive 2310 and the second adhesive 2320 do not fill the chip mounting surface 210 of the circuit board 21, preventing the second adhesive 2320 from overflowing outside the chip mounting surface 210, and further avoiding the adhesive from contaminating the photosensitive element 22 or the pads on the circuit board 21.

[0155] Exemplarily, as Figure 4FAs shown, first, the first glue 2310 and the second glue 2320 are respectively applied on the chip mounting surface 210 of the circuit board 21, wherein the second glue 2320 is located around the first glue 2310, and the application areas of the first glue 2310 and the second glue 2320 are smaller than the area of the photosensitive element 22. Then, the photosensitive element 22 can be picked up by means of a suction nozzle 50 and placed corresponding to the first glue 2310 and the second glue 2320, with the first glue 2310 corresponding to the middle part of the photosensitive element 22 and the second glue 2320 corresponding to the peripheral part of the photosensitive element 22. Finally, after the first glue 2310 and the second glue 2320 are cured, a first bonding layer 231 is formed between the middle part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and a second bonding layer 232 is formed between the peripheral part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, wherein a space is reserved between the second bonding layer 232 and the outer peripheral edge of the photosensitive element 22 to assemble the photosensitive component 20.

[0156] Attached Figure 4G Fig. shows a seventh variant embodiment of the photosensitive component 20 of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first embodiment of the present invention, the difference of the photosensitive component 20 according to the seventh variant embodiment of the present invention is that: the outer peripheral edge of the second bonding layer 232 is located outside the outer peripheral edge of the photosensitive element 22 to form an overflow glue part at the outer peripheral edge of the photosensitive element 22, that is to say, the size of the second bonding layer 232 is larger than the size of the photosensitive element 22, and the overflow glue part of the second bonding layer 232 can cover the outer peripheral edge of the photosensitive element 22 to increase the bonding strength between the photosensitive element 22 and the circuit board 21. In other words, when applying the first glue 2310 and the second glue 2320, the application areas of the first glue 2310 and the second glue 2320 are larger than the area of the photosensitive element 22, so that when the photosensitive element 22 is placed on the first glue 2310 and the second glue 2320, the second glue 2320 overflows to the outer peripheral edge of the photosensitive element 22, so that the first glue 2310 and the second glue 2320 can fill the entire chip mounting surface 210 of the circuit board 21 to increase the bonding strength between the photosensitive element 22 and the circuit board 21. It should be noted that when applying the second glue 2320, the amount of the second glue 2320 needs to be controlled to prevent the second glue 2320 from overflowing to the photosensitive surface 220 of the photosensitive element 22 and the pads on the circuit board 21, thereby avoiding glue contamination.

[0157] Specifically, the application areas of the first glue 2310 and the second glue 2320 are larger than the area of the chip mounting surface 210 of the circuit board 21, that is, the first glue 2310 and the second glue 2320 fill the chip mounting surface 210 of the circuit board 21 to increase the bonding strength between the photosensitive element 22 and the circuit board 21.

[0158] Exemplarily, as Figure 4G shown, first, the first glue 2310 and the second glue 2320 are respectively applied on the chip mounting surface 210 of the circuit board 21, wherein the second glue 2320 is located around the first glue 2310, and the application areas of the first glue 2310 and the second glue 2320 are larger than the area of the photosensitive element 22; then, the photosensitive element 22 can be picked up by means of suction through a suction nozzle 50 to place the photosensitive element 22 correspondingly on the first glue 2310 and the second glue 2320, and make the first glue 2310 correspond to the middle part of the photosensitive element 22, and the second glue 2320 correspond to the peripheral part of the photosensitive element 22; finally, after the first glue 2310 and the second glue 2320 are cured, a first bonding layer 231 is formed between the middle part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, wherein a second bonding layer 232 is formed between the peripheral part of the photosensitive element 22 and the chip mounting surface 210 of the circuit board 21, and the second bonding layer 232 covers the outer periphery of the photosensitive element 22 to assemble the photosensitive component 20.

[0159] According to the above first embodiment of the present invention, as Figure 2 shown, the photosensitive component 20 of the imaging module 1 further includes a base 24, wherein the base 24 is disposed on the circuit board 21, and the optical lens 10 is adapted to be mounted on the base 24 to ensure that the optical lens 10 is located on the light sensing path of the photosensitive element 22. It can be understood that on the circuit board 21, the edge area is located around the chip mounting area, so that the optical lens 10 mounted on the edge area of the circuit board 21 can correspond to the light sensing path of the photosensitive element 22 mounted on the chip mounting area of the circuit board 21, to ensure that the light entering the imaging module 1 from the optical lens 10 can be received by the photosensitive element 22, and then an image is captured.

[0160] Exemplarily, as Figure 2As shown, the base 24 of the photosensitive component 20 is implemented as a bracket base 241, where the bracket base 241 is installed in the edge area of the circuit board 21 to surround the photosensitive element 22 mounted on the chip mounting area of the circuit board 21, and the optical lens 10 is disposed on the bracket base 241 so that the optical lens 10 corresponds to the photosensitive path of the photosensitive element 22. It can be understood that in this example of the present invention, the bracket base 241 can be separately manufactured and then firmly installed on the circuit board 21 through an adhesive. Of course, in other examples of the present invention, the bracket base 241 can also be installed on the circuit board 21 by other means such as snap-fitting.

[0161] Further, in the above first embodiment of the present invention, as Figure 2 shown, the imaging module 1 further includes a filter component 30, where the filter component 30 is correspondingly disposed between the optical lens 10 and the photosensitive element 22 of the photosensitive component 20, so that the light entering through the optical lens 10 is received by the photosensitive element 22 of the photosensitive component 20 after passing through the filter component 30, thereby improving the imaging quality of the imaging module 1.

[0162] Specifically, as Figure 2 shown, the filter component 30 includes a filter element 31, where the filter element 31 is correspondingly disposed on the bracket base 241 of the photosensitive component 20, so that while the filter element 31 is located between the photosensitive element 22 and the optical lens 10, the filter element 31 also corresponds to the photosensitive path of the photosensitive element 22, and the size of the filter element 31 is larger than the size of the photosensitive area of the photosensitive element 22, to ensure that the light entering the imaging module 1 from the optical lens 10 is filtered by the filter element 31 before being received by the photosensitive element 22 for photoelectric conversion, thereby improving the imaging quality of the imaging module 1. For example, the filter element 31 can filter the infrared part of the light entering the interior of the imaging module from the optical lens 10.

[0163] Preferably, a light-shielding structure such as silk printing is provided on the upper surface and / or the lower surface of the periphery of the filter element 31 to reduce the interference of stray light from the lens and stray light reflected by the photosensitive component on the photosensitive element 22.

[0164] Those skilled in the art can understand that in different examples of the camera module, the filter element 31 can be implemented as different types. For example, the filter element 31 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. For example, the filter element 31 can be implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensing path of the light-sensing element 22. For example, when using the camera module in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensing path of the light-sensing element 22 to filter the infrared rays in the light reflected by the object entering the camera module through the infrared cut-off filter. When using the camera module in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensing path of the light-sensing element 22 to allow the infrared part in the light reflected by the object entering the camera module to pass through.

[0165] Refer to the attached Figures 1 to 2 As shown, the camera module 1 may further include a driver 40, wherein the optical lens 10 is drivably assembled to the driver 40, and the driver 40 is assembled to the top surface of the bracket base 241 so that the optical lens 10 is held on the light-sensing path of the light-sensing element 22 of the light-sensing assembly 20. In addition, when using the camera module 1, the driver 40 can drive the optical lens 10 to move back and forth along the light-sensing path of the light-sensing element 22 to adjust the focal length of the camera module 1 by adjusting the distance between the optical lens 10 and the light-sensing element 22, so that the camera module 1 is implemented as an auto-focus camera module. The type of the driver 40 of the camera module 1 of the present invention is not limited, and the driver 40 can be implemented as a voice coil motor, which can be electrically connected to the circuit board 21 to be in a working state after receiving electrical energy and a control signal, and drive the optical lens 10 to move back and forth along the light-sensing path of the light-sensing element 22. Nevertheless, those skilled in the art can understand that the type of the driver 40 is not limited as long as it can drive the optical lens 10 to move back and forth along the light-sensing path of the light-sensing element 22.

[0166] It is worth mentioning that the attached Figure 5AShows a first variant embodiment of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first embodiment of the present invention, the imaging module 1 according to the first variant embodiment of the present invention is implemented as a fixed-focus imaging module. That is to say, in this variant embodiment of the present invention, the imaging module 1 may also not have the driver 40. Specifically, the imaging module 1 includes a lens barrel 40', wherein the lens barrel 40' is assembled on the top surface of the bracket base 241, and the optical lens 10 is fixedly assembled in the lens barrel 40', so that the optical lens 10 is held in the light-sensitive path of the light-sensitive element 22 of the light-sensitive assembly 20 through the lens barrel 40'. In addition, during the process of assembling the lens barrel 40' on the top surface of the bracket base 241, the angle at which the lens barrel 40' is assembled on the top surface of the bracket base 241 can be adjusted by a calibration device, so that the optical axis of the optical lens 10 can be perpendicular to the light-sensitive surface 220 of the light-sensitive element 22 to ensure the imaging quality of the imaging module 1. It can be understood that the lens barrel 40' can be manufactured separately, so that the lens barrel 40' can have threads or not, and the present invention is not limited in this regard.

[0167] Appendix Figure 5BShows a second variant embodiment of the imaging module 1 according to the above first embodiment of the present invention. Specifically, compared with the above first variant embodiment of the present invention, the base 24 of the imaging module 1 according to the second variant embodiment of the present invention is implemented as a molded base 242, wherein the molded base 242 is formed by curing a molding material on the circuit board 21 through a molding process by means of a mold, and wherein the lens barrel 40' is assembled to the molded base 242 to hold the optical lens 10 in the light sensing path of the light sensing element 22 by means of the lens barrel 40'. That is to say, in this variant embodiment of the present invention, the molded base 242 is first fabricated through a molding process, and then the separately fabricated lens barrel 40' is assembled to the top surface of the molded base 242, so that the angle at which the lens barrel 40' is assembled to the top surface of the molded base 242 can be adjusted by a calibration device, so that the optical axis of the optical lens 10 can be perpendicular to the light sensing surface 220 of the light sensing element 22 to ensure the imaging quality of the imaging module 1. Of course, in other examples of the present invention, the lens barrel 40' may also extend integrally from the top surface of the molded base 242, that is to say, the lens barrel 40' and the molded base 242 may be integrally cured and formed by a module process by means of the molding material, thereby enhancing the stability and reliability of the imaging module 1. In addition, the molded base 242 can provide a flat top surface and can strengthen the strength of the circuit board 21, thereby enhancing the structural strength of the light sensing assembly 20 to improve the quality of the imaging module.

[0168] Preferably, in this variant embodiment of the present invention, the molded base 242 covers the electronic components on the circuit board 21 after molding and is located around the light sensing element 22 mounted on the circuit board 21 to isolate adjacent electronic components and isolate the electronic components from the light sensing element 22 by means of the molded base 242, thereby reducing interference between electronic components, and at the same time encapsulating the electronic components can reduce the possibility of contamination of the light sensing element 22 caused by dirt they may carry.

[0169] In addition, as Figure 5B shown, the filter assembly 30 further includes a support member 32, wherein the filter element 31 is assembled to the support member 32, and the support member 32 is mounted on the top surface of the molded base 242 to reduce the size of the filter element 31 in this way to reduce the manufacturing cost of the imaging module 1.

[0170] Preferably, as Figure 5BAs shown, the support member 32 is stepped, the lens barrel 40' is assembled on the higher upper surface of the support member 32, and the filter element 31 is assembled on the lower upper surface of the support member 32, so as to ensure that the filter element 31 is located between the optical lens 10 and the photosensitive element 22, while also helping to shorten the distance between the filter element 31 and the photosensitive element 22, thereby helping to reduce the overall height of the camera module 1.

[0171] Attached Figure 5C The third variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the second variant embodiment of the present invention, the camera module 1 according to the third variant embodiment of the present invention is different in that: the molded base 242 covers the electronic components on the circuit board 21 and the non-photosensitive area of the photosensitive element 22 after molding, so as to firmly mount the photosensitive element 22 on the circuit board 21, which can further reduce the pollution of the photosensitive element 22 by the dirt that may be carried on the circuit board 21. In addition, the lens barrel 40' and the filter element 31 can be directly mounted on the mounting surface of the molded base 242 to omit the support member 32. It can be understood that since the molded base 242 is integrally molded on the circuit board 21 by a mold, the molded base 242 can provide a relatively flat mounting surface, so that the filter element 31 can be substantially parallel to the photosensitive element 22, and produce a small inclination.

[0172] Preferably, the module base 242 has a stepped structure to provide a lower mounting surface for the filter element 31 and a higher mounting surface for the lens barrel 40', so as to reduce the distance between the filter element 31 and the photosensitive element 22, thereby helping to reduce the overall height of the camera module 1.

[0173] Attached Figure 5DThe fourth variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first embodiment of the present invention, the camera module 1 according to the fourth variant embodiment of the present invention is implemented as a periscope camera module. That is to say, the camera module 1 further includes a light steering mechanism 11, wherein the light steering mechanism 11 is disposed on the light sensing path of the light sensing element 22 of the light sensing assembly 20 for steering the light incident on the light steering mechanism 11 so that the light steered by the light steering mechanism 11 is received by the light sensing element 22 after passing through the optical lens 10. It can be understood that since the periscope camera module can be installed on various electronic device bodies in a "lying" installation manner, the height of the periscope array module is reduced. Therefore, after the periscope array module is installed on the electronic device body, the thickness of the electronic device body will not be increased, thus conforming to the development trend of the thin and light of the electronic device.

[0174] Referring to FIGS. Figure 6 and Figure 7 As shown, a camera module 1A according to a second embodiment of the present invention is illustrated. Compared with the first embodiment of the present invention, the difference in the second embodiment of the present invention is that: the shaping device 23A of the light sensing assembly 20A of the camera module 1A further includes a reinforcing element 234A, wherein the reinforcing element 234A is disposed between the circuit board 21 and the light sensing element 22 for reinforcing the strength of the circuit board 21 and reducing the degree of warping or bending of the circuit board 21. At the same time, the reinforcing element 234A can provide a flat attachment surface for the light sensing element 22, wherein the first adhesive layer 231 and the second adhesive layer 232 are both located between the light sensing element 22 and the reinforcing element 234A for shaping the bending shape of the light sensing element 22 so that the light sensing surface 220 of the light sensing element 22 adaptively matches the focal plane 100 of the optical lens 10. It can be understood that the reinforcing element 234A can be made of hard materials such as plastics, metals, polymer materials, ceramics, etc. In this way, the reinforcing element 234A is located between the light sensing element 22 and the circuit board 21, which can not only reinforce the structural strength of the circuit board 21 to reduce the adverse effects of the circuit board 21 on the light sensing element 22, but also provide a sufficiently flat attachment surface for attaching the light sensing element 22, which is beneficial to shaping the light sensing element 22.

[0175] More specifically, as Figure 6As shown, in the second embodiment of the present invention, the reinforcing element 234A of the shaping device 23A is implemented as a reinforcing flat plate 2341A cured by a molding material on the circuit board 21 through a molding process, wherein the reinforcing flat plate 2341A has a flat upper surface to ensure that the reinforcing flat plate 2341A can provide a sufficiently flat attachment surface. Of course, in other examples of the present invention, the reinforcing element 234A can also be separately manufactured first and then disposed on the chip mounting surface 210 of the circuit board 21 through connection methods such as pasting, riveting, screwing, welding, nesting, etc., and the present invention will not elaborate further on this.

[0176] Exemplarily, as Figure 7 shown, first, the reinforcing flat plate 2341A is molded on the chip mounting surface 210 of the circuit board 21 through a molding process; then the first glue 2310 and the second glue 2320 are respectively applied to the upper surface of the reinforcing flat plate 2341A, and the second glue 2320 is located around the first glue 2310; then, the photosensitive element 22 is correspondingly placed on the first glue 2310 and the second glue 2320, and the second glue 2320 corresponds to the peripheral portion of the photosensitive element 22, and the first glue 2310 corresponds to the middle portion of the photosensitive element 22; finally, after the first glue 2310 and the second glue 2320 are cured, the first adhesive layer 231 and the second adhesive layer 232 are formed between the photosensitive element 22 and the reinforcing flat plate 2341A to assemble the photosensitive component 20. It can be understood that in this embodiment of the present invention, the shrinkage rate of the first glue 2310 is greater than the shrinkage rate of the second glue 2320 to ensure that the shrinkage amount of the first adhesive layer 231 during forming is greater than the shrinkage amount of the second adhesive layer 232 during forming. It should be noted that in other examples of the present invention, the separately manufactured reinforcing flat plate 2341A can be first bonded to the circuit board 21 using glue, and then the first glue 2310 and the second glue 2320 are respectively applied to plastically bond the photosensitive element 22 to the reinforcing flat plate 2341A.

[0177] Attached Figure 8AFIG. 0 shows a first variant embodiment of the photosensitive component 20A of the imaging module 1A according to the second embodiment of the present invention. Specifically, compared with the second embodiment of the present invention, the difference of the photosensitive component 20A according to the first variant embodiment of the present invention lies in that: the reinforcing element 234A of the shaping device 23A is implemented as a reinforcing ring plate 2342A cured by a molding material on the circuit board 21 through a molding process, wherein the reinforcing ring plate 2342A corresponds to the second adhesive layer 232 to reduce the thickness of the second adhesive layer 232, thereby further reducing the shrinkage amount of the second adhesive layer 232 during forming, so that the shrinkage amount of the second adhesive layer 232 is further smaller than the shrinkage amount of the first adhesive layer 231, which is beneficial to strengthen and shape the photosensitive element 22, so that the photosensitive surface 220 of the photosensitive element 22 matches the focal plane 100 of the optical lens 10. In other words, the second adhesive layer 232 is located between the reinforcing ring plate 2342A and the photosensitive element 22, and the first adhesive layer 231 is located between the circuit board 21 and the photosensitive element 22, so that the thickness of the second adhesive layer 232 is smaller than the thickness of the first adhesive layer 231 to further reduce the shrinkage amount of the second adhesive layer 232, which helps to increase the gap between the shrinkage amount of the first adhesive layer 231 and the shrinkage amount of the second adhesive layer 232 and improve the shaping ability of the shaping device 23A. It can be understood that in other examples of the present invention, the reinforcing ring plate 2342 can also be separately manufactured and disposed between the reinforcing ring plate 2342A and the photosensitive element 22.

[0178] Exemplarily, as Figure 8A shown, first, the reinforcing ring plate 2342A is molded on the chip mounting surface 210 of the circuit board 21 through a molding process; then, the second glue 2320 is applied to the upper surface of the reinforcing ring plate 2342A, and the first glue 2310 is applied to the circuit board 21, wherein the second glue 2320 is located around the first glue 2310; then, the photosensitive element 22 is correspondingly placed on the first glue 2310 and the second glue 2320, and the second glue 2320 corresponds to the peripheral portion of the photosensitive element 22, and the first glue 2310 corresponds to the middle portion of the photosensitive element 22; finally, after the first glue 2310 and the second glue 2320 are cured, the second adhesive layer 232 is formed between the photosensitive element 22 and the reinforcing ring plate 2342A, and the first adhesive layer 231 is formed between the photosensitive element 22 and the circuit board 21 to assemble the photosensitive component 20A.

[0179] It should be noted that, in this variant embodiment of the present invention, the shrinkage rate of the first adhesive 2310 may be greater than the shrinkage rate of the second adhesive 2320 to ensure that the shrinkage amount of the first adhesive layer 231 during forming is greater than the shrinkage amount of the second adhesive layer 232 during forming. Of course, in other examples of the present invention, the shrinkage rate of the first adhesive 2310 may also be equal to the shrinkage rate of the second adhesive 2320 (i.e., the first adhesive 2310 and the second adhesive 2320 may be implemented as the same adhesive), or even the shrinkage rate of the first adhesive 2310 may be less than the shrinkage rate of the second adhesive 2320. This is because the presence of the reinforcing ring plate 2342A makes the thickness of the second adhesive layer 232 less than the thickness of the first adhesive layer 231. Therefore, even if the shrinkage rate of the first adhesive 2310 is less than or equal to the shrinkage rate of the second adhesive 2320, it can still ensure that the shrinkage amount of the first adhesive layer 231 during forming is greater than the shrinkage amount of the second adhesive layer 232 during forming.

[0180] Attached Figure 8B FIG. shows a second variant embodiment of the photosensitive component 20A of the camera module 1A according to the above second embodiment of the present invention. Specifically, compared with the first variant embodiment of the above second embodiment of the present invention, the difference of the photosensitive component 20A in the second variant embodiment of the present invention is that: after the reinforcing ring plate 2342A is separately manufactured, it is disposed between the second adhesive layer 232 and the photosensitive element 22, that is, the second adhesive layer 232 is located between the reinforcing ring plate 2342A and the circuit board 21, and the first adhesive layer 231 is located between the circuit board 21 and the photosensitive element 22. It can still make the thickness of the second adhesive layer 232 less than the thickness of the first adhesive layer 231 to further reduce the shrinkage amount of the second adhesive layer 232, which helps to increase the gap between the shrinkage amount of the first adhesive layer 231 and the shrinkage amount of the second adhesive layer 232, and improve the shaping ability of the shaping device 23A.

[0181] Exemplarily, such as Figure 8BAs shown, first, the first adhesive 2310 and the second adhesive 2320 are respectively applied to the circuit board 21, wherein the second adhesive 2320 is located around the first adhesive 2310; then, after the reinforcing ring plate 2342A is correspondingly placed on the second adhesive 2320, the photosensitive element 22 is correspondingly placed on the first adhesive 2310 and the reinforcing ring plate 2342A, and the reinforcing ring plate 2342A corresponds to the peripheral portion of the photosensitive element 22, and the first adhesive 2310 corresponds to the middle portion of the photosensitive element 22; finally, after the first adhesive 2310 and the second adhesive 2320 are cured, the second bonding layer 232 is formed between the circuit board 21 and the reinforcing ring plate 2342A, and the first bonding layer 231 is formed between the photosensitive element 22 and the circuit board 21 to assemble the photosensitive component 20A. It can be understood that in this variant embodiment of the present invention, the first adhesive 2310 and the second adhesive 2320 can be applied simultaneously, or the second adhesive 2320 can be applied first, and then the first adhesive 2310 can be applied after placing the reinforcing ring plate 2342A.

[0182] Appendix Figure 8C Fig. Figure 8C shows a third variant embodiment of the photosensitive component 20A of the imaging module 1A according to the second embodiment of the present invention above. Specifically, compared with the second embodiment of the present invention above, the difference of the photosensitive component 20A according to the third variant embodiment of the present invention is that: the reinforcing element 234A of the shaping device 23A is implemented as a reinforcing concave plate 2343A formed by curing a molding material on the circuit board 21 through a molding process, wherein a groove is provided in the middle of the reinforcing concave plate 2343A to provide a lower first upper surface and a higher second upper surface through the reinforcing concave plate 2343A, wherein the first bonding layer 231 is located between the first upper surface of the reinforcing concave plate 2343A and the photosensitive element 22, and the second bonding layer 232 is located between the second upper surface of the reinforcing concave plate 2343A and the photosensitive element 22, so that the thickness of the first bonding layer 231 is greater than the thickness of the second bonding layer 232, so that while the reinforcing concave plate 2343A further reinforces the circuit board 21, a thickness difference can also exist between the first bonding layer 231 and the second bonding layer 232, thereby ensuring that the shrinkage amount of the first bonding layer 231 during forming is greater than the shrinkage amount of the second bonding layer 232 during forming. Of course, in other examples of the present invention, the reinforcing concave plate 2343A can also be formed by fitting together reinforcing plates with different thicknesses (such as a reinforcing ring plate with a larger thickness and a reinforcing flat plate with a smaller thickness), as long as the reinforcing concave plate 2343A can be formed, and the present invention will not elaborate on this.

[0183] Exemplarily, as Figure 8C shown, first, the reinforcing concave plate 2343A is molded on the chip mounting surface 210 of the circuit board 21 through a molding process; then, the second glue 2320 is applied to the second upper surface of the reinforcing concave plate 2343A, and the first glue 2310 is applied to the first upper surface of the reinforcing concave plate 2343A, so that the second glue 2320 is located around the first glue 2310; then, the photosensitive element 22 is correspondingly placed on the first glue 2310 and the second glue 2320, and the second glue 2320 corresponds to the peripheral portion of the photosensitive element 22, and the first glue 2310 corresponds to the middle portion of the photosensitive element 22; finally, after the first glue 2310 and the second glue 2320 are cured, the second bonding layer 232 is formed between the photosensitive element 22 and the second upper surface of the reinforcing ring plate 2342A, and the first bonding layer 231 is formed between the photosensitive element 22 and the first upper surface of the reinforcing ring plate 2342A to assemble the photosensitive component 20A.

[0184] It is worth mentioning that in the above second embodiment and some variant embodiments of the present invention, the reinforcing element 234A is a molded reinforcing plate formed by integrally molding a molding material on the circuit board 21 through a mold. However, in the manufacturing process of the photosensitive component 20A, it is usually manufactured in the form of a panel. Therefore, the molding spaces formed between each circuit board and the mold need to be connected in order to achieve mass production, which helps to reduce the manufacturing cost. In other words, once the molding spaces formed between each circuit board and the mold are not connected, mass production cannot be achieved, resulting in a significant increase in the manufacturing cost.

[0185] To solve the above problems, attach Figure 8DThe fourth variant embodiment of the photosensitive component 20A of the camera module 1A according to the above-mentioned second embodiment of the present invention is shown. Specifically, compared with the first variant embodiment of the above-mentioned second embodiment of the present invention, the difference of the photosensitive component 20A according to the fourth variant embodiment of the present invention lies in that: the reinforcing element 234A of the shaping device 23A further includes at least two connecting reinforcing parts 2340A, wherein the connecting reinforcing parts 2340A respectively extend integrally from both sides of the reinforcing ring plate 2342A to the edge of the circuit board 21, so as to further reinforce the structural strength of the circuit board 21 while reducing the manufacturing difficulty of the photosensitive component 20A, which helps to reduce the manufacturing cost of the photosensitive component 20A. It can be understood that the connecting reinforcing part 2340A and the reinforcing ring plate 2342A are integrally formed by a molding process using a molding material, and are used to connect the reinforcing ring plates on adjacent circuit boards, so that the molding spaces formed between each circuit board and the mold can be ensured to be connected during molding.

[0186] Preferably, as Figure 8D shown, each of the connecting reinforcing parts 2340A extends integrally from the reinforcing ring plate 2342A to the short side of the circuit board 21 to reinforce the structural strength of the circuit board 21 as much as possible. It can be understood that since the circuit board 21 is usually rectangular, the short side of the circuit board 21 is more likely to warp. Therefore, the connecting reinforcing part 2340A of the present invention extends integrally from the reinforcing ring plate 2342A to the short side of the circuit board 21, which can effectively limit the warping of the short side of the circuit board 21, so as to reduce the adverse effect of the circuit board 21 on the photosensitive element 22.

[0187] Attached Figure 8EFIG. 0 shows a fifth variant embodiment of the photosensitive component 20A of the imaging module 1A according to the second embodiment of the present invention. Specifically, compared with the fourth variant embodiment of the second embodiment of the present invention, the difference of the photosensitive component 20A according to the fifth variant embodiment of the present invention is that the base 24A of the photosensitive component 20A is implemented as a molded base 242A, wherein the reinforcing element 234A of the shaping device 23A includes a connecting reinforcing portion 2340A, and the connecting reinforcing portion 2340A integrally extends from the reinforcing ring plate 2342A to the molded base 242A to communicate the molding space forming the molded base 242A with the molding space forming the reinforcing ring plate 2342A during molding, so that the reinforcing ring plate 2342A and the molded base 242A can be molded together, which can also simplify the manufacturing process of the photosensitive component 20A and help reduce the manufacturing difficulty of the photosensitive component 20A. In addition, since the molded base 242A and the reinforcing ring plate 2342A are integrally formed by molding, the circuit board 21 is not easily bent, so as to provide a relatively flat mounting surface.

[0188] Exemplarily, as Figure 8E shown, in this variant embodiment of the present invention, the manufacturing method of the photosensitive component 20A can be but is not limited to being implemented as the following steps: first, various electronic components are soldered to the circuit board 21 through the SMT process; then, by using the molding process, the molten liquid molding material is injected into the molding space formed by the mold and the circuit board 21 to form the molded base 242A and the reinforcing ring plate 2342A on the circuit board 21, wherein the molded base 242A covers the electronic components; then, the first glue 2310 is disposed on the chip mounting surface 210 of the circuit board 21, and the second glue 2320 is disposed on the upper surface of the reinforcing ring plate 2342A; then, the photosensitive element 22 is placed on the first glue 2310 and the second glue 2320 to respectively form the first bonding layer 231 and the second bonding layer 232 after the first glue 2310 and the second glue 2320 are cured, for fixing the photosensitive element 22 on the circuit board 21; finally, the photosensitive element 22 is electrically connected to the circuit board 21 to form the photosensitive component 20A. It can be understood that, in some embodiments of the present invention, the photosensitive element 22 and the circuit board 21 can be electrically connected by wire bonding.

[0189] It should be noted that in the second embodiment and its modified embodiments of the present invention, except for the above-mentioned different structures, the other structures of the imaging module 1A are the same as those of the imaging module 1 according to the first embodiment of the present invention, and the imaging module 1A also has modified embodiments similar to or the same as the various modified embodiments of the imaging module 1 of the first embodiment, which will not be elaborated here.

[0190] On the other hand, according to the present invention, an embodiment of the present invention further provides a method for manufacturing an imaging module. Specifically, referring to the attached Figure 9 As shown, the method for manufacturing the imaging module includes the steps:

[0191] S100: By means of a shaping device 23 (23A), at least one photosensitive element 22 is plastically mounted on a circuit board 21, wherein the shaping device 23 (23A) includes a first adhesive layer 231 and a second adhesive layer 232, and the second adhesive layer 232 is located outside the first adhesive layer 231 to plastically bond the photosensitive element 22 to the circuit board 21 and electrically connect each photosensitive element 22 to the circuit board 21 to assemble a photosensitive component 20 (20A); and

[0192] S200: Corresponding to at least one optical lens 10 is disposed on the photosensitive component 20 (20A) such that each optical lens 10 is located in the light-sensing path of the corresponding photosensitive element 22, and the light-sensing surface 220 of each photosensitive element 22 adaptively matches the focal plane 100 of the optical lens 10.

[0193] Furthermore, in step S100 of the method for manufacturing the imaging module in the above embodiment of the present invention, the shrinkage amount of the second adhesive layer 232 of the shaping device 23 (23A) during forming is different from the shrinkage amount of the first adhesive layer 231 during forming, so as to plastically shape the photosensitive element 22 by different shrinkage amounts while bonding the photosensitive element 22 to the circuit board 21, such that the light-sensing surface 220 of the photosensitive element 22 adaptively matches the focal plane 100 of the optical lens 10.

[0194] In the first example of the present invention, as Figure 10A shown, step S100 in the method for manufacturing the imaging module may include the steps:

[0195] S110: A first glue 2310 and a second glue 2320 are respectively applied to the chip mounting surface 210 of the circuit board 21, wherein the second glue 2320 is located outside the first glue 2310, and the shrinkage rate of the first glue 2310 is greater than the shrinkage rate of the second glue 2320;

[0196] S120: Place the photosensitive element 22 on the first adhesive 2310 and the second adhesive 2320; and

[0197] S130: After the first adhesive 2310 and the second adhesive 2320 are cured, form the first bonding layer 231 and the second bonding layer 232 between the photosensitive element 22 and the circuit board 21 respectively.

[0198] It should be noted that in other examples of the present invention, the first adhesive 2310 and the second adhesive 2320 may also be respectively applied to a reinforcing element 234A disposed on the circuit board 21 to reinforce the structural strength of the circuit board 21 through the reinforcing element 234A. It should be noted that the reinforcing element 234A may be implemented as, but not limited to, a reinforcing flat plate 2341A, a reinforcing ring plate 2342A or a reinforcing concave plate 2343A.

[0199] In the second example of the present invention, as Figure 10B shown, the step S100 in the manufacturing method of the camera module may include the steps:

[0200] S110': Dispose a reinforcing element 234A on the chip mounting surface 210 of the circuit board 21;

[0201] S120': Apply a first adhesive 2310 between the circuit board 21 and the photosensitive element 22, and apply a second adhesive 2320 between the reinforcing element 234A and the photosensitive element 22, wherein the second adhesive 2320 is located outside the first adhesive 2310; and

[0202] S130': After the first adhesive 2310 and the second adhesive 2320 are cured, form the first bonding layer 231 and the second bonding layer 232 respectively, wherein the thickness of the first bonding layer 231 is greater than the thickness of the second bonding layer 232.

[0203] More specifically, in the step S110' in the above example, the reinforcing element 234A may be formed on the circuit board 21 by curing a molding material through a molding process. It should be noted that the reinforcing element 234A may be implemented as, but not limited to, a reinforcing ring plate 2342A or a reinforcing concave plate 2343A.

[0204] In the third example of the present invention, as Figure 10C shown, the step S100 in the manufacturing method of the camera module may also include the steps:

[0205] "S110": Apply a first glue 2310 and a second glue 2320 respectively on the chip mounting surface 210 of the circuit board 21, where the second glue 2320 is located outside the first glue 2310;

[0206] S120": Place a reinforcing ring plate 2342A correspondingly on the second glue 2320;

[0207] S130": Place the photosensitive element 22 on the first glue 2310 and the reinforcing ring plate 2342, so that the first glue 2310 is located between the photosensitive element 22 and the circuit board 21, and the second glue 2320 is located between the reinforcing ring plate 2342A and the circuit board 21; and

[0208] S140": After the first glue 2310 and the second glue 2320 are cured, form the first bonding layer 231 between the photosensitive element 22 and the circuit board 21, and form the second bonding layer 232 between the reinforcing ring plate 2342A and the circuit board 21, where the thickness of the first bonding layer 231 is greater than the thickness of the second bonding layer 232.

[0209] It should be noted that in this example of the present invention, the shrinkage rate of the first glue 2310 can be greater than the shrinkage rate of the second glue 2320, can be equal to the shrinkage rate of the second glue 2320, or even can be less than the shrinkage rate of the second glue 2320, as long as it can ensure that the shrinkage amount of the first bonding layer 231 during forming is greater than the shrinkage amount of the second bonding layer 232 during forming.

[0210] It is worth mentioning that in the above embodiments of the present invention, as Figure 9 shown, the manufacturing method of the camera module further includes the steps:

[0211] S300: Correspondingly set a filter component 30 between the photosensitive component 20 (20A) and the optical lens 10, so that the light entering from the optical lens 10 is received by the photosensitive element 22 of the photosensitive component 20 (20A) after passing through the filter component 30.

[0212] Refer to the attached Figure 11, According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device includes an electronic device body 70 and at least one of the camera modules 1 (1A), and each of the camera modules 1 (1A) is respectively disposed on the electronic device body 70 for acquiring images. It is worth mentioning that the type of the electronic device body 70 is not limited. For example, the electronic device body 70 can be any electronic device capable of being configured with the camera module 1, such as a smart phone, a tablet computer, a notebook computer, an e-book, a personal digital assistant, a camera, etc. Those skilled in the art can understand that although in the attached Figure 11 the electronic device body 70 is implemented as a smart phone as an example, it does not constitute a limitation on the content and scope of the present invention.

[0213] It should be noted that the orientation or positional relationship indicated by "up", "down", "inside", "outside", etc. mentioned in the present invention is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0214] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments. Without departing from the principle, the embodiments of the present invention can have any deformation or modification.

Claims

1. A photosensitive component, which is used to be assembled with at least one optical lens into a camera module, and is characterized in that The photosensitive component includes: A circuit board; At least one photosensitive element, each of which is electrically connected to the circuit board; and At least one shaping device, each of which includes a first adhesive layer and a second adhesive layer disposed between the corresponding photosensitive element and the circuit board, wherein the second adhesive layer is located outside the first adhesive layer to adhesively mount the corresponding photosensitive element to the circuit board in a shaped manner, wherein the first adhesive layer is formed by curing a first glue, the second adhesive layer is formed by curing a second glue, and the shrinkage rate of the first glue is less than that of the second glue.

2. The photosensitive component according to claim 1, wherein, The shrinkage amount of the second adhesive layer of the shaping device during forming is different from the shrinkage amount of the first adhesive layer of the shaping device during forming, so that while adhesively bonding the photosensitive element to the circuit board, the photosensitive element is also shaped by the shrinkage of the first adhesive layer and the second adhesive layer, so that the photosensitive surface of the photosensitive element is adaptively matched with the focal plane of the optical lens.

3. The photosensitive component according to claim 1, wherein, The second adhesive layer is located around the first adhesive layer, and the second adhesive layer corresponds to the peripheral portion of the photosensitive element, and the first adhesive layer corresponds to the middle portion of the photosensitive element.

4. The photosensitive component according to claim 2, wherein, The second adhesive layer is located around the first adhesive layer, and the second adhesive layer corresponds to the peripheral portion of the photosensitive element, and the first adhesive layer corresponds to the middle portion of the photosensitive element.

5. The photosensitive component according to claim 4, wherein, The second adhesive layer is symmetrically located around the first adhesive layer, and the width of the second adhesive layer corresponding to the short side of the photosensitive element is greater than the width of the second adhesive layer corresponding to the long side of the photosensitive element.

6. The photosensitive component according to claim 5, wherein, The second adhesive layer is in direct contact with the first adhesive layer.

7. The photosensitive component according to claim 6, wherein, The outer peripheral edge of the second adhesive layer is located within the outer peripheral edge of the photosensitive element to leave a space between the second adhesive layer and the outer peripheral edge of the photosensitive element.

8. The photosensitive component according to claim 6, wherein, The outer peripheral edge of the second adhesive layer is located outside the outer peripheral edge of the photosensitive element so that the second adhesive layer covers the outer peripheral edge of the photosensitive element.

9. The photosensitive component according to claim 5, wherein, The second adhesive layer and the first adhesive layer are spaced apart to form a gap between the first adhesive layer and the second adhesive layer.

10. The photosensitive component according to claim 9, wherein, The second adhesive layer has at least one notch to communicate the gap between the first adhesive layer and the second adhesive layer with the external space through the notch.

11. The photosensitive component according to claim 2, wherein, The second adhesive layer is located on both sides of the first adhesive layer, and the second adhesive layer corresponds to the short sides of the photosensitive element respectively.

12. The photosensitive component according to claim 2, wherein, The second adhesive layer is located at the four corners of the first adhesive layer, and the second adhesive layer corresponds to the four corners of the photosensitive element respectively.

13. The photosensitive component according to claim 1, wherein, The shrinkage amount of the second adhesive layer of the shaping device during forming is greater than the shrinkage amount of the first adhesive layer during forming.

14. The photosensitive component according to any one of claims 4 to 12, wherein, The shaping device shapes the photosensitive element so that the photosensitive surface of the photosensitive element is flat or curved concavely toward the object side.

15. The photosensitive component according to claim 1, wherein, The shaping device further includes a third adhesive layer, wherein the third adhesive layer is disposed between the first adhesive layer and the second adhesive layer, and the shrinkage amount of the third adhesive layer during shaping is between the shrinkage amount of the first adhesive layer during shaping and the shrinkage amount of the second adhesive layer during shaping.

16. The photosensitive component according to claim 1, wherein, The shaping device further includes a reinforcing element, wherein the reinforcing element is disposed between the photosensitive element and the circuit board for reinforcing the structural strength of the circuit board.

17. The photosensitive component according to claim 16, wherein, The reinforcing element is a reinforcing flat plate cured by a molding material on the circuit board through a molding process, wherein both the first adhesive layer and the second adhesive layer are located between the reinforcing flat plate and the photosensitive element.

18. The photosensitive component according to any one of claims 1 to 13, wherein, The shaping device further includes a reinforcing element, wherein the reinforcing element is disposed between the photosensitive element and the circuit board for reinforcing the structural strength of the circuit board.

19. The photosensitive component according to claim 18, wherein, The reinforcing element is a reinforcing ring plate cured by a molding material on the circuit board through a molding process, wherein the first adhesive layer is located between the circuit board and the photosensitive element, and the second adhesive layer is located between the reinforcing ring plate and the photosensitive element, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

20. The photosensitive component according to claim 19, wherein, The reinforcing element further includes at least two connecting reinforcing portions, wherein the connecting reinforcing portions respectively extend integrally from both sides of the reinforcing ring plate to the edge of the circuit board to further reinforce the structural strength of the circuit board.

21. The photosensitive component according to claim 20, wherein, Each of the connecting reinforcing portions extends integrally from the reinforcing ring plate to the short side of the circuit board.

22. The photosensitive component according to claim 18, wherein, The reinforcing element is a separately manufactured reinforcing ring plate, wherein the first adhesive layer is located between the circuit board and the photosensitive element, and the second adhesive layer is located between the reinforcing ring plate and the circuit board, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

23. The photosensitive component according to claim 18, wherein, The reinforcing element is a reinforcing concave plate cured by a molding material on the circuit board through a molding process, wherein a groove is provided in the middle of the reinforcing concave plate to provide a lower first upper surface and a higher second upper surface, wherein the first adhesive layer is located between the photosensitive element and the first upper surface of the reinforcing concave plate, and the second adhesive layer is located between the photosensitive element and the second upper surface of the reinforcing concave plate, so that the thickness of the second adhesive layer is less than the thickness of the first adhesive layer.

24. The photosensitive component according to any one of claims 1 to 13, further comprising a base, wherein the base is disposed on the circuit board for mounting the optical lens such that the optical lens is located in the light-sensitive path of the photosensitive element.

25. The photosensitive component according to claim 19, further comprising a base, wherein the base is disposed on the circuit board for mounting the optical lens such that the optical lens is located in the light-sensitive path of the photosensitive element.

26. The photosensitive component according to claim 25, wherein, The base is a bracket base, wherein the bracket base is mounted on the edge area of the circuit board to surround the photosensitive element mounted on the circuit board, for mounting a filter assembly and the optical lens, so that both the filter assembly and the optical lens are located in the photosensitive path of the photosensitive element.

27. The photosensitive component according to claim 25, wherein, The base is a molded base, wherein the molded base is cured on the circuit board by a molding process using a molding material to cover the electronic components on the circuit board.

28. The photosensitive component according to claim 27, wherein, The reinforcing element of the shaping device further includes at least one connecting reinforcing part, wherein each connecting reinforcing part extends integrally from the reinforcing ring plate to the molded base, so that the molded base and the reinforcing ring plate are molded together.

29. The photosensitive component according to claim 25, wherein, The base is a molded base, wherein the molded base is cured on the circuit board by a molding process using a molding material to cover the electronic components on the circuit board and the non-photosensitive area of the photosensitive element.

30. A camera module, characterized in that, Comprising: At least one optical lens; And A photosensitive component as described in any one of claims 1 to 29, wherein each optical lens is correspondingly arranged on the photosensitive component, so that each optical lens is located in the photosensitive path of the corresponding photosensitive element in the photosensitive component.

31. The imaging module as described in claim 30, further comprising a filter assembly, wherein the filter assembly is correspondingly arranged between the optical lens and the photosensitive element of the photosensitive component, so that the light entering through the optical lens is received by the photosensitive element after passing through the filter assembly.

32. The imaging module according to claim 31, wherein, The filter assembly includes a filter element, wherein the filter element is correspondingly arranged on the photosensitive component, and the filter element corresponds to the photosensitive path of the photosensitive element.

33. The imaging module according to claim 32, wherein, The filter assembly further includes a support, wherein the filter element is assembled on the support, and the support is arranged on the photosensitive component.

34. The imaging module as described in any one of claims 30 to 33, further comprising a driver, wherein the optical lens is drivably assembled on the driver, and the driver is mounted on the base of the photosensitive component, so that the optical lens is held in the photosensitive path of the photosensitive element.

35. The imaging module as described in any one of claims 30 to 33, further comprising a lens barrel, wherein the optical lens is fixedly assembled on the lens barrel, and the lens barrel is mounted on the base of the photosensitive component, so that the optical lens is held in the photosensitive path of the photosensitive element.

36. The imaging module as described in any one of claims 30 to 33, further comprising a light steering mechanism, wherein the light steering mechanism is arranged in the photosensitive path of the photosensitive element of the photosensitive component, for steering the light incident on the light steering mechanism, so that the steered light is received by the photosensitive element after passing through the optical lens.

37. An electronic device, characterized in that, Comprising: An electronic device body; And At least one imaging module as described in any one of claims 30 to 36, wherein each imaging module is arranged on the electronic device body for acquiring images.

38. A manufacturing method of an imaging module, characterized in that, Including the steps of: Using a shaping device to shape and mount at least one photosensitive element onto a circuit board, wherein the shaping device includes a first adhesive layer and a second adhesive layer, and the second adhesive layer is located outside the first adhesive layer to adhesively bond the photosensitive element to the circuit board in a shaped manner and electrically connect each of the photosensitive elements to the circuit board to assemble a photosensitive component; and Correspondingly disposing at least one optical lens on the photosensitive component such that each optical lens is located on the light-sensing path of the corresponding photosensitive element, and the light-sensing surface of each photosensitive element adaptively matches the focal plane of the optical lens. Wherein, the shrinkage amount of the second adhesive layer of the shaping device during shaping is different from the shrinkage amount of the first adhesive layer during shaping, so that while adhesively bonding the photosensitive element to the circuit board, the photosensitive element is also shaped by the shrinkage of the first adhesive layer and the second adhesive layer, so that the light-sensing surface of the photosensitive element adaptively matches the focal plane of the optical lens. The step of using a shaping device to shape and mount at least one photosensitive element onto a circuit board to improve the bending problem of the photosensitive element and electrically connect each photosensitive element to the circuit board to assemble a photosensitive component includes the steps of: Applying a first glue and a second glue respectively to the chip mounting surface of the circuit board, wherein the second glue is located outside the first glue; correspondingly placing a reinforcing ring plate on the second glue; Placing the photosensitive element on the first glue and the reinforcing ring plate such that the first glue is located between the photosensitive element and the circuit board, and the second glue is located between the reinforcing ring plate and the circuit board; and After the first glue and the second glue are cured, forming the first adhesive layer between the photosensitive element and the circuit board and forming the second adhesive layer between the reinforcing ring plate and the circuit board, wherein the thickness of the first adhesive layer is greater than the thickness of the second adhesive layer.

39. The manufacturing method of the camera module according to claim 38, wherein, The step of using a shaping device to shape and mount at least one photosensitive element onto a circuit board to improve the bending problem of the photosensitive element and electrically connect each photosensitive element to the circuit board to assemble a photosensitive component includes the steps of: Applying a first glue and a second glue respectively to the chip mounting surface of the circuit board, wherein the second glue is located outside the first glue, and the shrinkage rate of the first glue is less than the shrinkage rate of the second glue; Placing the photosensitive element on the first glue and the second glue; and After the first glue and the second glue are cured, forming the first adhesive layer and the second adhesive layer respectively between the photosensitive element and the circuit board.

40. The manufacturing method of the camera module according to claim 39, wherein, The step of plastically mounting at least one photosensitive element on a circuit board by means of a shaping device to improve the bending problem of the photosensitive element and electrically connecting each of the photosensitive elements to the circuit board to assemble a photosensitive component includes the steps of: disposing a reinforcing element on the chip mounting surface of the circuit board; applying a first glue between the circuit board and the photosensitive element, and applying a second glue between the reinforcing element and the photosensitive element, wherein the second glue is located outside the first glue; and after the first glue and the second glue are cured, forming the first bonding layer between the photosensitive element and the circuit board and forming the second bonding layer between the photosensitive element and the reinforcing element, wherein the thickness of the first bonding layer is greater than the thickness of the second bonding layer.

41. The manufacturing method of the camera module according to claim 40, wherein, The reinforcing element is a reinforcing ring plate or a reinforcing concave plate formed by curing a molding material on the circuit board through a molding process.

42. The manufacturing method of the camera module according to any one of claims 38 to 41, further comprising the step of correspondingly disposing a filter assembly between the photosensitive component and the optical lens so that the light entering from the optical lens is received by the photosensitive element of the photosensitive component after passing through the filter assembly.

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