Photosensitive Component, Camera Module and Manufacturing Method Thereof

Abstract

The present application discloses a photosensitive component, a camera module and a manufacturing method thereof. The photosensitive component includes a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping component disposed on the circuit board. The lower surface of the photosensitive chip is attached to the shaping component to form an accommodation space with the shaping component and the circuit board. The accommodation space is configured such that the photosensitive chip bends downward during the assembly of the photosensitive component. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process to improve the imaging quality.

Description

Technical Field

[0001] The present application relates to the field of camera modules, and particularly to a photosensitive component, a camera module and a manufacturing method thereof. Through a specific structural design, a planar photosensitive chip is bent into a shape adapted to the actual focal imaging plane, thereby improving the imaging quality of the camera module in this way. Background Art

[0002] A camera module is an important image sensing device. As consumers' requirements for the imaging quality of terminal devices (such as smart phones) are getting higher and higher, the size of the photosensitive chips collected by the camera module is gradually increasing, which has caused a series of technical problems, such as chip deformation, poor chip heat dissipation, etc. These technical problems cannot be properly solved in the existing manufacturing process of camera modules.

[0003] Therefore, an improved camera module structure and manufacturing solution are needed to provide a camera module that meets the requirements. Summary of the Invention

[0004] The main purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, which can bend a planar photosensitive chip into a shape adapted to the actual focal imaging plane, thereby improving the imaging quality of the camera module in this way.

[0005] Another purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein the photosensitive chip of the camera module is still planar during transportation, so that it can still be transported in a panel-like manner.

[0006] Another purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein the chip manufacturer does not need to change the existing manufacturing process of photosensitive chips. That is to say, the manufacturing process of the photosensitive component provided by the present application can be implemented based on the existing planar photosensitive chips.

[0007] Another purpose of the present application is to provide a photosensitive component, a camera module and a manufacturing method thereof, wherein a heat dissipation member for enhancing the heat dissipation of the photosensitive chip is included in the accommodation space below the photosensitive chip to enhance the heat dissipation performance of the camera module.

[0008] To achieve the above at least one purpose or advantage, the present application is proposed. Embodiments of the present application provide a photosensitive component, which includes:

[0009] A circuit board;

[0010] A photosensitive chip electrically connected to the circuit board; and

[0011] A shaping component disposed on the circuit board, wherein the lower surface of the photosensitive chip adheres to the shaping component to form an accommodating space with the shaping component and the circuit board. Wherein, the circuit board has at least one opening formed therethrough and communicating with the accommodating space. Wherein, the accommodating space and the opening are configured such that the photosensitive chip bends downward during the assembly of the photosensitive component.

[0012] In the photosensitive component according to the present application, the at least one opening is configured such that at least one adsorption device can extend into the accommodating space through the at least one opening and adhere to at least a part of the lower surface of the photosensitive chip, so as to bend the photosensitive chip downward by means of a pulling force.

[0013] In the photosensitive component according to the present application, the shaping component includes a first shaping member and a second shaping member. The first shaping member forms the accommodating space with the photosensitive chip and the circuit board. The second shaping member is disposed on the circuit board and within the accommodating space, and the height of the second shaping member is lower than that of the first shaping member.

[0014] In the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is recessed downward and inward. The arc-shaped surface is configured such that when the photosensitive chip bends downward, a lower surface adapted to the focal imaging surface of the photosensitive component is formed.

[0015] In the photosensitive component according to the present application, the circuit board has at least one opening formed therethrough and communicating with the accommodating space. The at least one opening is configured to discharge the gas in the accommodating space during the assembly of the photosensitive component so as to bend the photosensitive chip downward.

[0016] In the photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central region of the photosensitive chip.

[0017] In the photosensitive component according to the present application, the position where the opening is formed on the circuit board is located between the first shaping member and the second shaping member.

[0018] In the photosensitive component according to the present application, part of the opening is formed at a position on the circuit board corresponding to the central region of the photosensitive chip, and another part of the opening is formed at a position on the circuit board located between the first shaping member and the second shaping member.

[0019] In the photosensitive component according to the present application, the positions where the openings are formed on the circuit board are symmetrically arranged with respect to the center of the photosensitive chip.

[0020] In the photosensitive component according to the present application, the positions of the other part of the openings formed on the circuit board are symmetrically arranged with respect to the center of the photosensitive chip.

[0021] In the photosensitive component according to the present application, the second shaping member is symmetrically arranged with respect to the center of the photosensitive chip.

[0022] In the photosensitive component according to the present application, the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.

[0023] In the photosensitive component according to the present application, the cross-sectional shape of the first shaping member is a closed ring.

[0024] In the photosensitive component according to the present application, the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

[0025] In the photosensitive component according to the present application, the cross-sectional shape of the second shaping member is a closed ring, wherein the shaping component further includes an adhesive disposed between the first shaping member and the second shaping member, and the height of the adhesive is lower than the height of the second shaping member.

[0026] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board.

[0027] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are made of a metal material.

[0028] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are prefabricated and installed on the circuit board.

[0029] In the photosensitive component according to the present application, the first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board by an electroplating process.

[0030] In the photosensitive component according to the present application, the photosensitive component further includes a heat dissipation member, wherein the heat dissipation member is formed in the accommodation space, and the heat dissipation member adheres to at least a part of the lower surface of the photosensitive chip.

[0031] In the photosensitive component according to the present application, the heat dissipation member is formed by the heat dissipation material entering the accommodation space through the at least one opening via the heat dissipation member.

[0032] In the photosensitive component according to the present application, the photosensitive component further includes at least one electronic component disposed in a non-photosensitive area of the photosensitive chip.

[0033] In the photosensitive component according to the present application, the photosensitive component further includes a bracket provided on the circuit board, wherein the bracket forms a light passing hole corresponding to a photosensitive area of the photosensitive chip.

[0034] In the photosensitive component according to the present application, the bracket is integrally formed on the circuit board by a molding process to integrally cover at least a part of the circuit board and at least part of the at least one electronic component.

[0035] In the photosensitive component according to the present application, the bracket is integrally formed on the circuit board by a molding process to integrally cover at least a part of the circuit board, the at least one electronic component, and at least a part of a non-photosensitive area of the photosensitive chip.

[0036] In the photosensitive component according to the present application, an inner side surface of the bracket is perpendicular to an upper surface of the photosensitive chip.

[0037] In the photosensitive component according to the present application, the inner side surface of the bracket extends outwardly in an inclined manner.

[0038] In the photosensitive component according to the present application, the bracket includes a mounting platform recessedly formed on a top surface of the bracket for supporting a filter element thereon.

[0039] In the photosensitive component according to the present application, the photosensitive component further includes a side encapsulation that wraps an outer side of the photosensitive chip and the shaping component for preventing the position of the photosensitive chip from shifting during the execution of the molding process.

[0040] In the photosensitive component according to the present application, the photosensitive component further includes a filter element held in a photosensitive path of the photosensitive component.

[0041] In the photosensitive component according to the present application, the filter element is stacked on the photosensitive element, and after the bracket is integrally formed on the circuit board by a molding process, the bracket integrally covers at least a part of the circuit board, the at least one electronic component, at least a part of a non-photosensitive area of the photosensitive chip, and at least a part of the filter element.

[0042] In the photosensitive component according to the present application, the filter element is supported on a top of the bracket.

[0043] In the photosensitive component according to the present application, the filter element is mounted on the mounting platform of the bracket.

[0044] In the photosensitive component according to the present application, the photosensitive component further includes a filter element bracket, which is mounted on the bracket and is used for mounting the filter element.

[0045] According to another aspect of the present application, the present application further provides an imaging module, which includes:

[0046] An optical lens; and

[0047] The photosensitive component as described above, wherein the optical lens is held in the photosensitive path of the photosensitive component.

[0048] In the imaging module according to the present application, the curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the imaging module.

[0049] In the imaging module according to the present application, the optical lens is mounted on the bracket.

[0050] In the imaging module according to the present application, the imaging module further includes a driving element, wherein the driving element is supported by the bracket, and the optical lens is mounted on the driving element.

[0051] In the imaging module according to the present application, the optical lens is mounted on the filter element bracket.

[0052] According to still another aspect of the present application, there is further provided a manufacturing method of a photosensitive component, which includes:

[0053] Providing a circuit board, a photosensitive chip, a first shaping member and a second shaping member, wherein the circuit board includes at least one opening;

[0054] Placing the first shaping member and the second shaping member on the circuit board, wherein the height of the second shaping member is less than that of the first shaping member;

[0055] Attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodating space with the shaping member and the circuit board, wherein the at least one opening communicates with the accommodating space, and the second shaping member is located in the accommodating space;

[0056] Attaching an adsorption device to at least a part of the lower surface of the photosensitive chip through the opening; and,

[0057] Pulling the photosensitive chip downward through the adsorption device so that the photosensitive chip bends downward.

[0058] In the manufacturing method of the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is recessed downward and inward, wherein pulling the photosensitive chip downward by the adsorption device to cause the photosensitive chip to bend downward includes:

[0059] Bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc-shaped surface, so that when the photosensitive chip bends downward, a lower surface adapted to the focal imaging surface of the photosensitive component is formed.

[0060] In the manufacturing method of the photosensitive component according to the present application, after the first shaping member and the second shaping member are disposed on the circuit board, and before the lower surface of the photosensitive chip adheres to the first shaping member to form an accommodation space with the shaping member and the circuit board, it further includes:

[0061] Applying an adhesive between the first shaping member and the second shaping member, wherein the upper surface height of the adhesive is lower than that of the second shaping member.

[0062] In the manufacturing method of the photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.

[0063] In the manufacturing method of the photosensitive component according to the present application, it further includes:

[0064] Injecting a heat dissipation material into the accommodation space through the opening to form the heat dissipation member in the accommodation space, wherein the heat dissipation member adheres to at least a part of the lower surface of the photosensitive chip.

[0065] According to another aspect of the present application, there is also provided a manufacturing method of a photosensitive component, which includes:

[0066] Providing a circuit board and a photosensitive chip, wherein the circuit board includes at least one opening;

[0067] Integrally forming a first shaping member and a second shaping member on the circuit board, wherein the height of the second shaping member is less than that of the first shaping member;

[0068] Attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodation space with the shaping member and the circuit board, wherein the at least one opening communicates with the accommodation space, and the second shaping member is located in the accommodation space;

[0069] Attaching an adsorption device to at least a part of the lower surface of the photosensitive chip through the opening; and,

[0070] Pull down the photosensitive chip through the adsorption device so that the photosensitive chip bends downward.

[0071] In the manufacturing method of the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc surface that is recessed downward and inward, wherein pulling down the photosensitive chip through the adsorption device so that the photosensitive chip bends downward includes:

[0072] Bend the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc surface, so that a lower surface adapted to the focal imaging surface of the photosensitive component is formed when the photosensitive chip bends downward.

[0073] In the manufacturing method of the photosensitive component according to the present application, integrally forming a first shaping member and a second shaping member on the circuit board includes:

[0074] Integrally forming a first shaping member main body and a second shaping member main body on the circuit board by an electroplating process; and

[0075] Apply adhesives on the first shaping member main body and the second shaping member main body respectively.

[0076] In the manufacturing method of the photosensitive component according to the present application, after integrally forming a first shaping member and a second shaping member on the circuit board, and before attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodation space with the shaping member and the circuit board, it further includes:

[0077] Apply an adhesive between the first shaping member and the second shaping member, wherein the upper surface height of the adhesive is lower than that of the second shaping member.

[0078] In the manufacturing method of the photosensitive component according to the present application, the upper surface of at least one of the first shaping member and the second shaping member includes an arc surface that is recessed downward and inward, wherein pulling down the photosensitive chip through the adsorption device so that the photosensitive chip bends downward includes:

[0079] Bend the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc surface, so that a lower surface adapted to the focal imaging surface of the photosensitive component is formed when the photosensitive chip bends downward.

[0080] In the manufacturing method of the photosensitive component according to the present application, the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.

[0081] In the manufacturing method of the photosensitive component according to the present application, it further includes:

[0082] Inject a heat dissipation material into the accommodation space through the opening to form the heat dissipation member in the accommodation space, wherein the heat dissipation member adheres to at least a part of the lower surface of the photosensitive chip.

[0083] Through the understanding of the subsequent description and the drawings, the further purposes and advantages of the present application will be fully reflected.

[0084] These and other purposes, features and advantages of the present application are fully reflected through the following detailed description, drawings and claims. Brief Description of the Drawings

[0085] By describing the embodiments of the present application in more detail in conjunction with the drawings, the above and other purposes, features and advantages of the present application will become more obvious. The drawings are used to provide a further understanding of the embodiments of the present application, and constitute a part of the specification, and are used to explain the present application together with the embodiments of the present application, and do not constitute a limitation to the present application. In the drawings, the same reference numerals generally represent the same components or steps.

[0086] Figure 1 The schematic diagram of the pickup process of the photosensitive chip in the existing COB assembly process is illustrated.

[0087] Figure 2 The schematic diagram of the imaging optical path of the camera module is illustrated.

[0088] Figure 3 The schematic diagram of the photosensitive component according to the embodiment of the present application is illustrated.

[0089] Figure 4A and Figure 4B The schematic diagram of the manufacturing process of the photosensitive component according to the embodiment of the present application is illustrated.

[0090] Figure 5 The top view of the photosensitive component according to the embodiment of the present application is illustrated.

[0091] Figure 6 The enlarged schematic diagram of the upper surface of the shaping component in the photosensitive component according to the embodiment of the present application is illustrated.

[0092] Figure 7 The top view of a variant implementation of the photosensitive component according to the embodiment of the present application is illustrated.

[0093] Figure 8 The top view of another variant implementation of the photosensitive component according to the embodiment of the present application is illustrated.

[0094] Figure 9 The schematic diagram of yet another variant implementation of the photosensitive component according to the embodiment of the present application is illustrated.

[0095] Figure 10 The figure shows a schematic diagram of another variant embodiment of the photosensitive component according to an embodiment of the present application.

[0096] Figure 11 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0097] Figure 12 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0098] Figure 13 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0099] Figure 14 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0100] Figure 15 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0101] Figure 16 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0102] Figure 17 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0103] Figure 18 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0104] Figure 19 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0105] Figure 20 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0106] Figure 21 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application.

[0107] Figure 22A and Figure 22B The figure shows a schematic diagram of another manufacturing process of the photosensitive component according to an embodiment of the present application.

[0108] Figure 23 The figure shows a schematic diagram of an imaging module according to an embodiment of the present application, wherein the imaging module is a fixed-focus imaging module.

[0109] Figure 24 Illustrated is a schematic diagram showing another variant implementation of the imaging module according to an embodiment of the present application.

[0110] Figure 25 Illustrated is a schematic diagram showing yet another variant implementation of the imaging module according to an embodiment of the present application.

[0111] Figure 26 Illustrated is a schematic diagram showing yet another variant implementation of the imaging module according to an embodiment of the present application.

[0112] Figure 27 Illustrated is a schematic diagram showing yet another variant implementation of the imaging module according to an embodiment of the present application

[0113] Figure 28 Illustrated is a schematic diagram of an imaging module according to an embodiment of the present application, wherein the imaging module is a variable-focus imaging module. Detailed implementation manners

[0114] Hereinafter, exemplary embodiments according to the present application will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all of the embodiments of the present application. It should be understood that the present application is not limited by the exemplary embodiments described herein.

[0115] Application Overview

[0116] As described above, as consumers' requirements for the imaging quality of terminal devices are getting higher and higher, the size of the photosensitive chips collected by the imaging module is gradually increasing, which has caused a series of technical problems. Moreover, these technical problems cannot be properly solved in the existing manufacturing process of the imaging module. Therefore, an improved imaging module structure and its manufacturing solution are needed to produce photosensitive components and imaging modules that meet the performance requirements.

[0117] Specifically, the existing imaging module usually adopts the COB (Chip on Board) process for assembly: pick up the photosensitive chip → attach it to the circuit board → mount the plastic bracket on the circuit board. However, as the size continues to increase, the photosensitive chip is prone to deformation during the picking process.

[0118] Figure 1 Illustrated is a schematic diagram of the picking process of the photosensitive chip in the existing COB assembly process. As Figure 1 shown, in the existing COB assembly process, the photosensitive chip is picked up by adsorption, and since the photosensitive area of the photosensitive chip cannot be contacted, the suction nozzle of the picker can only be attached to the non-photosensitive area of the photosensitive chip. During the picking process, due to the suction adsorption effect of the suction nozzle, the photosensitive chip will bend towards the photosensitive surface of the photosensitive chip due to being adsorbed, presenting a shape with an upward bulge (from asFigure 1 Judging from the presented effect, figuratively speaking, the curved shape of the photosensitive chip can be defined as a "crying face" shape).

[0119] Those skilled in the art should be aware that even if the photosensitive chip does not undergo a "crying face" deformation (i.e., the photosensitive chip is planar), due to the different optical path differences between the edge part and the central part of the photosensitive chip relative to the optical lens, when the optical center reaches the edge part of the photosensitive chip, adverse phenomena such as distortion, vignetting at the corners, and sharpness decline are likely to occur, resulting in a deteriorated imaging effect. After the "crying face" deformation occurs, these adverse phenomena will be further aggravated, more seriously affecting the imaging quality.

[0120] Specifically, Figure 2 The figure shows a schematic diagram of the imaging optical path of the camera module. As Figure 2 shown, during the imaging process of the camera module (generally, the side where the optical lens is located is defined as the object side, and the side where the photosensitive chip is located is defined as the image side), the actual focal plane (the actual focal imaging plane) forms an arc convex toward the image side. That is to say, the actual focal plane is an arc surface. Those skilled in the art should be aware that when the plane where the photosensitive chip is located coincides with the focal plane, the imaging quality is the best. However, in actual situations, even when using multiple lenses to modulate the optical system of the camera module, the focal plane still presents as an arc surface. This is also the reason why adverse phenomena such as distortion, vignetting at the corners, and sharpness decline still occur even though the photosensitive chip does not deform during the pickup process. However, due to the "crying face" deformation of the photosensitive chip during the pickup process, compared Figure 2 with the shape of the actual focal plane in the figure, it can be seen that the "crying face" deformation is exactly opposite to the deformation mode of the actual focal plane, resulting in an aggravation of the degree of adverse phenomena such as distortion, vignetting at the corners, and sharpness decline, more seriously affecting the imaging quality of the camera module.

[0121] To solve the problem of the "crying face" bending of the photosensitive chip, currently, there is a technical direction to provide a photosensitive chip with a "smiling face" bending (for related technologies, reference can be made to the patent application document CN201480052226.4). Although the bent photosensitive chip can alleviate the above technical problems, it brings a series of new problems, and some technical problems are difficult to overcome in the actual industry.

[0122] Specifically, first, it is urgent to solve the problem of how to install the curved photosensitive chip in the camera module, because the existing camera module assembly process is designed for flat photosensitive chips. Secondly, compared with flat photosensitive chips, the manufacturing process of curved photosensitive chips is more complex and has a higher process difficulty. Moreover, currently, most photosensitive chip manufacturers and camera module manufacturers are separated. For curved photosensitive chips, transportation has become a major problem: flat photosensitive chips can be transported in a panelized manner, while curved photosensitive chips are difficult to be transported in a panelized manner.

[0123] In addition to the imaging problem, as the size of the photosensitive chip continues to increase (or rather, the frame rate increases), the photosensitive chip will generate a large amount of heat during operation. How to achieve heat dissipation is also an urgent problem to be solved.

[0124] To address the above technical problems, the basic concept of this application is to bend the flat photosensitive chip into a shape adapted to the actual focal imaging plane through a special manufacturing process. In this way, the imaging quality of the camera module is improved. Moreover, a heat dissipation component for enhancing heat dissipation is formed on the back of the photosensitive chip to solve the heat dissipation problem.

[0125] Based on this, this application proposes a photosensitive component, which includes: a circuit board, a photosensitive chip, and a shaping component. Among them, the circuit board has at least one through-hole formed therein, the photosensitive chip is electrically connected to the circuit board, and the lower surface of the photosensitive chip is attached to the shaping component to form an accommodation space with the shaping component and the circuit board. Among them, the accommodation space communicates with the at least one through-hole and is configured to cause the photosensitive chip to bend downward during the assembly of the photosensitive component. In this way, the flat photosensitive chip is bent into a shape adapted to the actual focal imaging plane through a special manufacturing process to improve the imaging quality of the camera module.

[0126] After introducing the basic principle of this application, the various non-limiting embodiments of this application will be specifically introduced below with reference to the accompanying drawings.

[0127] Exemplary Photosensitive Component and Its Manufacturing Method

[0128] As Figures 3 to 4B shown, the photosensitive component according to the embodiment of this application and its manufacturing process are illustrated. As Figure 3As shown, the photosensitive component 10 includes a circuit board 11, a photosensitive chip 12 electrically connected to the circuit board 11, and a shaping component 13. Among them, the lower surface 122 of the photosensitive chip 12 is attached to the shaping component 13 to form an accommodating space 100 with the shaping component 13 and the circuit board 11. The accommodating space 100 is configured such that the photosensitive chip 12 bends downward during the assembly of the photosensitive component 10. In particular, in the embodiment of the present application, the photosensitive chip 12 is bent into a shape adapted to the actual focal plane, thereby improving the imaging quality in this way.

[0129] As Figure 3 and 4B shown, in the embodiment of the present application, the shaping component 13 is fixed on the top surface of the circuit board 11. Among them, the top surface of the shaping component 13 is attached to the lower surface 122 of the photosensitive chip 12 to form the accommodating space 100 with the photosensitive chip 12 and the circuit board 11. It should be understood that the accommodating space 100 located below the photosensitive chip 12 provides a deformation space for the photosensitive chip 12 to bend downward under the action of a specific force. And, in the embodiment of the present application, the shaping component 13 sets a shaping surface 130, where the shaping surface 130 is configured to limit the shape of the photosensitive chip 12 bending downward, so that the shape of the lower surface 122 of the photosensitive chip 12 after bending is adapted to the actual focal plane, thereby improving the imaging quality in this way.

[0130] More specifically, in the embodiments of the present application, the shaping component 13 includes a first shaping member 131 and a second shaping member 132. Among them, the first shaping member 131 is fixedly provided on the circuit board 11, and the lower surface 122 of the photosensitive chip 12 adheres to the first shaping member 131. In this way, an accommodating space 100 is formed among the first shaping member 131, the photosensitive chip 12, and the circuit board 11. The second shaping member 132 is fixedly provided on the circuit board 11 and is located within the accommodating space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131. In other words, in the embodiments of the present application, the first shaping member 131 and the second shaping member 132 are arranged in a stepped shape. In particular, in the embodiments of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface that is recessed downward and inward. The arc-shaped surface is configured such that when the photosensitive chip 12 bends downward, a lower surface 122 that is adapted to the focal imaging surface of the photosensitive assembly 10 is formed, so as to form the downwardly curved shaping surface 130 through the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiments of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include arc-shaped surfaces that are recessed downward and inward, as Figure 6 shown.

[0131] Furthermore, the shaping component 13 further includes at least one opening 133 that is formed through the circuit board 11 and communicates with the accommodating space 100. Among them, after the photosensitive chip 12 adheres to the first shaping member 131 to form the accommodating space 100, the at least one opening 133 is configured such that the adsorption device 40 can extend into the accommodating space 100 and adhere to at least a part of the lower surface 122 of the photosensitive chip 12, so as to bend the photosensitive chip 12 downward through a pulling force. That is to say, in the embodiments of the present application, the specific force for bending the photosensitive chip 12 is the pulling force generated by the adsorption device 40. That is to say, in the embodiments of the present application, the technical principle of bending the photosensitive chip 12 downward within the accommodating space 100 is as follows: the adsorption device 40 for bending the photosensitive chip 12 is extended into the accommodating space 100 through the opening 133 and adsorbed on the lower surface 122 of the photosensitive chip 12, so as to force the photosensitive chip 12 to bend downward by pulling the adsorption device 40 downward.

[0132] Figure 4A and Figure 4B illustrate an example of the adsorption device. As Figure 4A and Figure 4BAs shown, the adsorption device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41. Among them, the suction cup 41 is used to adsorb at least a part of the lower surface 122 of the photosensitive chip 12. After the suction cup 41 adheres to the photosensitive chip 12, the photosensitive chip 12 can be bent downward by pulling the extension rod 42. It is worth mentioning that in other examples of this application, the adsorption device 40 can also be implemented as other types, which is not limited to this application.

[0133] Specifically, in the embodiment of this application, the first shaping member 131 has a closed shape, so that the accommodation space 100 formed by the first shaping member 131, the circuit board 11, and the photosensitive chip 12 is a closed space, which can effectively prevent dust outside the first shaping member 131 from entering the accommodation space 100 through the first shaping member 131 and contaminating the photosensitive chip. As Figure 5 shown, preferably, the shape of the first shaping member 131 is adapted to the shapes of the circuit board 11 and the photosensitive chip 12. Those skilled in the art should know that the shapes of the existing circuit board 11 and photosensitive chip 12 are usually rectangular. Correspondingly, the shape of the first shaping member 131 is preferably implemented as a closed "square" shape. Of course, those skilled in the art should understand that with the development of the camera module technology and the expansion of its application scenarios, the shapes of the circuit board 11 and the photosensitive chip 12 will change. Correspondingly, the shape of the first shaping member 131 can also be adaptively adjusted, which is not limited to this application.

[0134] In some embodiments, the first shaping member 131 is symmetrically arranged about the center of the photosensitive chip 12 on the circuit board 11. Preferably, the first shaping member 131 is symmetrically arranged about the center line of the longer side of the photosensitive chip. The first shaping member 131 does not need to form a closed shape, that is, the first shaping member 131 only needs to ensure that it can support the edge of the shorter side of the photosensitive chip. For example, the first shaping member 131 is implemented as a long strip and is arranged on the circuit board 12 along the shorter side of the photosensitive chip 12.

[0135] Preferably, the size of the first shaping member 131 is adapted to the size of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 supports the edge portion of the photosensitive chip 12. Those skilled in the art should know that the upper surface 121 of the photosensitive chip 12 includes a photosensitive area 1211 and a non-photosensitive area 1212 located around the photosensitive area 1211. Among them, since the photosensitive area 1211 is a sensitive area, it is usually disposed in the central portion of the upper surface 121 of the photosensitive chip 12, and the non-photosensitive area 1212 is located at the edge portion of the upper surface 121 and surrounds the photosensitive area 1211. That is to say, the size of the first shaping member 131 is adapted to the photosensitive chip 12, so that the first shaping member 131 supports the non-photosensitive area 1212 of the photosensitive chip 12, which can ensure that the photosensitive area 1211 of the photosensitive chip 12 will not be damaged during the subsequent bending process of the photosensitive chip 12. It should be noted that the center line of the photosensitive chip 12 mentioned in the present invention is based on the premise that the photosensitive chip is a regular shape, that is, the photosensitive area 1211 and the non-photosensitive area 1212 of the photosensitive chip 12 are symmetrically distributed about the center. When the photosensitive chip 12 is an irregular shape, the center line of the photosensitive chip 12 described in the present invention refers to the center line of the photosensitive area 1211.

[0136] More preferably, the shape and size of the first shaping member 131 are adapted to the size and shape of the photosensitive chip 12, so that when the photosensitive chip 12 is attached to the first shaping member 131, the first shaping member 131 supports the non-photosensitive area 1212 of the photosensitive chip 12, and the center of the first shaping member 131 is coaxial with the center of the photosensitive chip 12. That is to say, the photosensitive chip 12 is coaxially attached to the first shaping member 131.

[0137] Such as Figure 3As shown, in the embodiment of the present application, the first shaping member 131 includes a first shaping member main body 1311 and an adhesive 1340 applied to the first shaping member main body. Among them, the first shaping member main body 1311 is disposed on the circuit board 11, and the adhesive 1340 is used to bond the photosensitive chip 12. It should be understood that the function of the adhesive 1340 is to bond the first shaping member main body 1311 and the photosensitive chip 12, and its thickness and material do not limit the present application. Moreover, in other examples of the present application, the photosensitive chip 12 can also be directly disposed on the first shaping member main body 1311 by processes such as ultrasonic welding without the adhesive 1340. That is to say, in other examples of the present application, the adhesive 1340 is a non-essential element. Preferably, in the embodiment of the present application, the adhesive 1340 has certain flexibility and high viscosity.

[0138] Particularly, before forming the accommodation space 100, the second shaping member 132 should be preset at a preset position on the circuit board 11 so that after the photosensitive chip 12 is bonded to the first shaping member 131 to form the accommodation space 100, the second shaping member 132 is received in the accommodation space 100.

[0139] As mentioned above, the height of the second shaping member 132 is less than the height of the first shaping member 131. Particularly, in the embodiment of the present application, the height of the second shaping member 132 is set related to its relative position relationship with the first shaping member 131. Specifically, the shape of the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132 is set based on the shape of the actual focal plane. That is to say, the relative position relationship between the first shaping member 131 and the second shaping member 132 and the setting of the height difference between the two should match the shape of the actual focal plane. More specifically, when the second shaping member 132 approaches the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced, that is, the height of the second shaping member 132 should increase; when the second shaping member 132 moves away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should increase, that is, the height of the second shaping member 132 should be reduced. It is worth mentioning that in the embodiment of the present application, the shape of the shaping surface 130 matching the shape of the actual focal plane does not mean that the shape of the shaping surface 130 is exactly the same as or completely coincides with the shape of the actual focal plane, but only means that the shape of the shaping surface 130 tends to be consistent with the shape of the actual focal plane.

[0140] Preferably, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged with respect to the center of the photosensitive chip 12. In this way, when the lower surface 122 of the photosensitive chip 12 adheres to the second shaping member 132 under the action of a pressure difference, the bonding points between the second shaping member 132 and the photosensitive chip 12 are also symmetrically distributed with respect to the center of the photosensitive chip 12, so as to form a uniform adhesive force on the opposite sides or around the photosensitive chip 12, ensuring that the photosensitive chip 12 can be shaped more stably. More specifically, in the embodiment of the present application, the second shaping member 132 is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip 12. Of course, those skilled in the art should understand that in other examples of the present application, the second shaping member 132 can also be symmetrically arranged with respect to the center of the photosensitive chip 12 in other ways. It is worth mentioning that in the embodiment of the present application, the shape of the second shaping member 132 is not limited by the present application, and it includes but is not limited to an elongated shape, a columnar shape, etc.

[0141] Similar to the first shaping member 131, in the embodiment of the present application, the second shaping member 132 includes a second shaping member main body 1321 and an adhesive 1340 applied to the second shaping member main body 1321. It should be understood that the photosensitive chip 12 is bonded to the upper surface of the second shaping member 132 through the adhesive 1340 to prevent the photosensitive chip 12 from breaking due to the middle being suspended, and to prevent the photosensitive chip 12 from deforming during use (for example, a photosensitive chip gradually tending to be planar). It is worth noting that in the embodiment of the present application, the adhesive 1340 applied to the first shaping member main body 1311 and the adhesive 1340 applied to the second shaping member main body 1321 can be implemented as the same adhesive 1340 or different types of adhesives 1340, and the application amount or thickness of the adhesive 1340 is not limited by the present application.

[0142] Preferably, in the embodiments of the present application, the first shaping member main body 1311 and the second shaping member main body 1321 are made of materials with relatively high hardness and relatively high thermal conductivity. For example, metal materials (including pure metal materials, metal-nonmetal alloy materials, and metal-metal alloy materials). It should be noted that, in the embodiments of the present application, the first shaping member main body 1311 and the second shaping member main body 1321 respectively extend between the photosensitive chip 12 and the circuit board 11. Thus, when the first shaping member main body 1311 and the second shaping member main body 1321 are implemented to be made of metal materials with relatively high thermal conductivity, the heat generated by the operation of the photosensitive chip 12 can be efficiently conducted to the circuit board 11 through the first shaping member main body 1311 and the second shaping member main body 1321 and finally dissipated to the outside. The heat dissipation part will be further described in the subsequent description and will not be elaborated here.

[0143] When the photosensitive chip 12 is bonded to the first shaping member 131 to define the accommodation space 100, there is a certain distance between the lower surface 122 of the photosensitive chip 12 and the adhesive 1340 of the second shaping member 132. Correspondingly, as the adsorption device 40 pulls the photosensitive chip 12 to bend downward, under the action of the pulling force, the photosensitive chip 12 continuously bends downward so that the distance between the lower surface 122 of the photosensitive chip 12 and the second shaping member 132 is continuously reduced until the lower surface 122 of the photosensitive chip 12 contacts the adhesive 1340 of the second shaping member 132, and the photosensitive chip 12 is also bonded to the second shaping member 132 through the adhesive 1340. When the photosensitive chip 12 is simultaneously bonded to the first shaping member 131 and the second shaping member 132, the shape of the photosensitive chip 12 is shaped into the shape of the shaping surface 130, so that the shape of the lower surface 122 of the photosensitive chip 12 adapts to the actual focal plane.

[0144] As Figure 5As shown, in the embodiment of the present application, the position where the opening 133 is formed on the circuit board 11 corresponds to the central region of the photosensitive chip 12. In this way, when the adsorption device 40 extends into the accommodation space 100 through the opening 133, the suction cup 41 of the adsorption device 40 can adhere to the central region of the lower surface 122 of the photosensitive chip 12. In this way, the bending force generated by the adsorption device 40 is the largest in the central region of the photosensitive chip 12 and gradually decreases from the central region to the edge part, so that the degree of deformation of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12, adapting to the shape of the actual focal plane. It is worth mentioning that, in the embodiment of the present application, the number of the openings 133 can be set to one or more, which is not limited in this application. It should also be understood that in other examples of the embodiment of the present application, the opening 133 can also be formed at other positions on the circuit board 11.

[0145] Figure 7 FIG. shows a top view schematic diagram of a modified implementation of the photosensitive component according to the embodiment of the present application. As Figure 7 shown, in this modified embodiment, the position where the opening 133 is formed on the circuit board 11 is located between the first shaping member 131 and the second shaping member 132. Correspondingly, in this modified embodiment, the corresponding number of the adsorption devices 40 can be used to bend the photosensitive chip. For example, in this modified embodiment, the number of the openings 133 is 2, and correspondingly, the number of the adsorption devices 40 is also 2.

[0146] Preferably, in this modified embodiment, the position where the opening 133 is formed on the circuit board 11 is symmetrically arranged with respect to the central region of the photosensitive chip 12. In this way, the attachment positions of the adsorption device 40 to the lower surface of the photosensitive chip 12 are also symmetrically arranged with respect to the central region of the photosensitive chip 12, so as to form relatively consistent pulling forces at positions symmetric with respect to the central region of the photosensitive chip 12, so that the photosensitive chip 12 can bend downward more symmetrically and gently in a manner tending to the shape of the shaping surface 130.

[0147] Figure 8 FIG. shows a schematic diagram of another modified implementation of the photosensitive component according to the embodiment of the present application. As Figure 8As shown, in this modified embodiment, some of the openings 133 are formed in the circuit board 11 at positions corresponding to the central region of the photosensitive chip 12, and some of the other openings 133 are formed in the circuit board 11 at positions between the first shaping member 131 and the second shaping member 132. Correspondingly, in this modified embodiment, the corresponding number of the adsorption devices 40 can be used to bend the photosensitive chip. For example, in this modified embodiment, the number of the openings 133 is three (wherein, one is arranged in the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12, and the other two are arranged between the first shaping member 131 and the second shaping member 132). Correspondingly, the number of the adsorption devices 40 is also three. Particularly, in this modified embodiment, some of the other openings 133 are symmetrically arranged with respect to the center of the photosensitive chip 12 in the circuit board 11. In this way, the attachment positions of the adsorption devices 40 attached to the lower surface of the photosensitive chip 12 are also symmetrically arranged with respect to the central region of the photosensitive chip 12, so as to form relatively consistent pulling forces at positions symmetric with respect to the central region of the photosensitive chip 12, so that the photosensitive chip 12 can be bent downward more symmetrically and smoothly in a manner tending to the shape of the shaping surface 130.

[0148] To facilitate the positioning and installation of the first shaping member 131 and the second shaping member 132, as Figure 9 shown, in some examples of the embodiments of the present application, the circuit board 11 further includes a first positioning groove 111 and a second positioning groove 112 recessed on the top surface of the circuit board 11. Among them, the first positioning groove 111 is used for positioning to adaptively install the first shaping member 131 therein, and the second positioning groove 112 is used for positioning to adaptively install the second shaping member 132 therein.

[0149] In some other examples of the present application, to facilitate the positioning and installation of the first shaping member 131 and the second shaping member 132, as Figure 10 shown, the circuit board 11 further includes a first positioning through hole 111A and a second positioning through hole 112A formed through the circuit board 11. Among them, the first positioning through hole 111A is used for positioning to adaptively install the first shaping member 131 therein, and the second positioning through hole 112A is used for positioning to adaptively install the second shaping member 132 therein. And, the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with a higher thermal conductivity, so that the heat generated by the photosensitive chip 12 can be directly conducted to the reinforcing plate 18 through the first shaping member 131 and the second shaping member 132 to achieve the purpose of heat dissipation.

[0150] It is worth mentioning that in the embodiments of the present application, the first shaping member 131 and the second shaping member 132 are prefabricated parts, that is, the first shaping member main body 1311 and the second shaping member main body 1321 are attached to the preset positions on the circuit board 1 after prefabrication. Alternatively, the first shaping member 131 and the second shaping member 132 can also be integrally formed at the preset positions on the circuit board 11. For example, when the first shaping member main body 1311 and the second shaping member main body 1321 are made of a metal material, the first shaping member main body 1311 and the second shaping member main body 1321 can be integrally formed at the preset positions on the circuit board 11 through an electroplating forming process. Of course, it should be easily understood that when the first shaping member main body 1311 and the second shaping member main body 1321 are made of other materials with relatively high hardness and high thermal conductivity, corresponding integral forming processes can be used to integrally form the first shaping member 131 and the second shaping member 132 at the preset positions on the circuit board 11. This is not limited to the present application.

[0151] It is also worth mentioning that in other examples of the embodiments of the present application, the shaping component 13 may further include a greater or smaller number of shaping members. For example, in another example of the present application, as Figure 11 shown, the shaping component 13 further includes a third shaping member 134 (including a third shaping member main body and an adhesive 1340 applied to the top surface of the third shaping member main body), wherein the third shaping member 134 is disposed between the first shaping member 131 and the second shaping member 132 to form the shaping surface 130 through the first shaping member 131, the second shaping member 132, and the third shaping member 134. Again, as Figure 12 shown, in another example of the present application, the shaping component 13 only includes the first shaping member 131, wherein the upper surface of the first shaping member 131 includes an arc-shaped surface that is recessed downward and inward, and the arc-shaped surface is configured such that when the photosensitive chip 12 bends downward, a lower surface 122 that is adapted to the focal imaging surface of the photosensitive component 10 is formed.

[0152] Figure 13 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to the embodiments of the present application. As Figure 13As shown, in this modified embodiment, both the first shaping member 131 and the second shaping member 132 have a closed ring shape to form a receiving cavity between the first shaping member 131 and the second shaping member 132. In particular, in this modified embodiment, the shaping component 13 further includes an adhesive 1340 disposed between the first shaping member 131 and the second shaping member 132. The height of the highest point on the upper surface of the adhesive 1340 is higher than the upper surface of the second shaping member 132. It should be understood that in this modified embodiment, the adhesive 1340 should have a relatively high viscosity to prevent the adhesive 1340 from flowing out from the upper surface of the second shaping member 132. In this way, after the photosensitive chip 12 is attached to the first shaping member 131, the adsorption device 40 pulls the photosensitive chip 12 to force the photosensitive chip 12 to bend downward until it adheres to the adhesive 1340 disposed between the first shaping member 131 and the second shaping member 132. It is worth mentioning that in this modified embodiment, the upper surface of the second shaping member 132 may not be provided with the adhesive 1340. It should be noted that since the height of the adhesive 1340 is higher than that of the second shaping member 132, when inhaling, the adhesive 1340 may flow to the upper surface of the second shaping member 132, so that after the photosensitive chip 12 bends downward, it adheres to the second shaping member 132 through the adhesive 1340, making the adhesion better and improving the reliability. Further, the adhesive 1340 may not be higher than the second shaping member 132 either. For example, the upper surface of the adhesive 1340 is flush with the upper surface of the second shaping member 132.

[0153] To improve the heat dissipation performance of the photosensitive assembly, as Figures 3 to 4B shown, in the embodiment of the present application, the photosensitive assembly 10 further includes a heat dissipation member 19 formed in the accommodation space 100. The heat dissipation member 19 adheres to at least a part of the lower surface 122 of the photosensitive chip 12, so that the heat generated by the photosensitive chip 12 can be conducted to the outside through the heat dissipation member 19 in contact with the photosensitive chip 12. In this embodiment, since the heat dissipation member 19 needs to fill the accommodation space 100, the first shaping member 131 is preferably implemented as a closed shape.

[0154] Preferably, in the embodiment of the present application, the heat dissipation member 19 fills the entire accommodation space 100, so that the lower surface 122 of the photosensitive chip 12 is completely in contact with the heat dissipation member 19, maximizing the heat dissipation area and improving the heat dissipation performance. It is worth mentioning that the formation position and filling ratio of the heat dissipation member 19 in the accommodation space 100 depend on the shape of the second shaping member 132 and the position setting of the at least one opening 133.

[0155] Specifically, when the second shaping member 132 is implemented as a closed "mouth" shape, and the at least one opening 133 is formed in the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12, the heat dissipation member 19 can at most fill the chamber enclosed by the second shaping member 132, the photosensitive chip 12, and the circuit board 11, as Figure 14 shown. Of course, even if the second shaping member 132 is implemented as a closed "mouth" shape, the heat dissipation member 19 can also fill the entire accommodation space 100, as long as part of the positions where the openings 133 are formed in the circuit board 11 are set to correspond to the central region of the photosensitive chip 12, and at the same time, another part of the positions where the openings 133 are formed in the circuit board 11 are set to be located between the first shaping member 131 and the second shaping member 132.

[0156] In a specific implementation, the heat dissipation material 190 for forming the heat dissipation member 19 can enter the accommodation space 100 through the opening 133 to form the heat dissipation member 19 in the accommodation space 100.

[0157] For example, when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the fluid heat dissipation material 190 can be injected into the accommodation space 100 through the opening 133 to form the heat dissipation member 19 after curing and molding. For ease of operation, when performing the injection process, the photosensitive assembly 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when the number of the openings 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodation space 100, a vent hole 135 can be further opened on the circuit board 11, as Figure 15 shown. Of course, when the number of the openings 133 exceeds one, among the suction holes, except for those used to inject the heat dissipation material 190, their functions are equivalent to the vent hole 135. That is to say, when the number of the openings 133 exceeds one, at least one of the openings forms the vent hole 135.

[0158] It is worth mentioning that when the heat dissipation member 19 is formed by curing a fluid heat dissipation material 190, preferably, the heat dissipation material 190 can fill the entire accommodation space 100. After curing and forming, on the one hand, the heat dissipation member 19 adheres to the entire lower surface 122 (the part corresponding to the accommodation space 100) of the photosensitive chip 12 to increase the heat dissipation area; on the other hand, the heat dissipation member 19 extends from the lower surface 122 of the photosensitive chip 12 to the opening 133, that is to say, the heat dissipation member 19 directly extends to the outside, which is more conducive to heat dissipation. Of course, in other examples of the embodiments of the present application, the photosensitive component 10 further includes a reinforcing plate 18 attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with a higher thermal conductivity, and in this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.

[0159] Of course, in other examples of the embodiments of the present application, the heat dissipation material 190 can also be implemented in other forms. For example, the heat dissipation material 190 in granular form, as Figure 16 shown. Correspondingly, the granular heat dissipation material 190 can be filled into the accommodation space 100 to form the heat dissipation member 19. In order to prevent the granular heat dissipation material 190 from leaking out of the opening 133, in this example of the embodiments of the present application, the photosensitive component 10 further includes a reinforcing plate 18 for sealing the opening 133. And preferably, the reinforcing plate 18 is made of a metal material with a higher thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive component 10 while sealing the opening 133.

[0160] Furthermore, as Figure 3 shown, in the embodiments of the present application, the photosensitive component 10 further includes at least one electronic component 14 for electrically connecting the lead wires of the photosensitive chip 12 to the circuit board 11, a light filtering element 15 and a bracket 16. Among them, the at least one electronic component 14 is arranged on the circuit board 11 and around the photosensitive chip 12, and it includes but is not limited to capacitors, resistors, inductors, etc.

[0161] After the photosensitive chip 12 is attached to the first shaping member 131 and bent and formed, the electrical connection between the photosensitive chip 12 and the circuit board 11 is realized through the lead wires 123. Specifically, each lead wire 123 extends bendably between the photosensitive chip 12 and the circuit board 11, so as to electrically connect the photosensitive chip 12 to the circuit board 11 through the lead wires 123. Thus, the circuit board 11 can supply power to the photosensitive chip 12 based on the lead wires 123, and the photosensitive chip 12 can transmit the collected signals based on the lead wires 123.

[0162] It is worth mentioning that in this specific example, the type of the lead wire 123 is not limited by this application. For example, the lead wire 123 can be a gold wire, a silver wire, or a copper wire. Moreover, the lead wire 123 can be installed between the circuit board 11 and the photosensitive chip 12 through the process of "bonding gold wire" to achieve electrical connection between the two.

[0163] Specifically, the process of "bonding gold wire" generally falls into two types: the "front bonding gold wire" process and the "reverse bonding gold wire" process. The "front bonding gold wire" process means that during the process of laying the lead wire 123, one end of the lead wire 123 is first formed on the conductive end of the circuit board 11, and then the lead wire 123 is bent and extended, and finally the other end of the lead wire 123 is formed on the conductive end of the photosensitive chip 12. In this way, the lead wire 123 is formed between the photosensitive chip 12 and the circuit board 11. The "reverse bonding gold wire" process means that during the process of laying the lead wire 123, one end of the lead wire 123 is first formed on the conductive end of the photosensitive chip 12, and then the lead wire 123 is bent and extended, and finally the other end of the lead wire 123 is formed on the conductive end of the circuit board 11. In this way, the lead wire 123 is formed between the photosensitive chip 12 and the circuit board 11. It is worth mentioning that the height of the lead wire 123 protruding upward formed by the "reverse bonding gold wire" process is relative to the height of the lead wire 123 protruding upward formed by the "front bonding gold wire" process. Therefore, preferably, in this specific implementation, the "reverse bonding gold wire" process is adopted to form the lead wire 123.

[0164] Of course, those skilled in the art should know that in other examples of the embodiments of this application, the photosensitive chip 12 and the circuit board 11 can be conducted through other means (the lead wire 123 may not be used), such as adopting a back conduction technical solution. This is not limited by this application.

[0165] As Figure 3 shown, in the embodiments of this application, the bracket 16 is disposed on the circuit board 11 to support the filter element 15. Specifically, in the embodiments of this application, the bracket 16 is implemented as a traditional plastic bracket 16, which is preformed and attached to the top surface of the circuit board 11. Among them, the filter element 15 is installed on the top of the bracket 16 and corresponds to at least the photosensitive area 1211 of the photosensitive chip 12 to filter the light entering the photosensitive chip 12 to improve the imaging quality. That is to say, in the embodiments of this application, the photosensitive component 10 is based on the traditional COB process.

[0166] Those skilled in the art should be aware that the filter element 15 can be implemented in different types, including but not limited to that the filter element 15 can be implemented as an infrared cut-off filter, a full-transmission spectrum filter, and other filters or a combination of multiple filters. Specifically, for example, when the filter element 15 is implemented as a combination of an infrared cut-off filter and a full-transmission spectrum filter, that is, the infrared cut-off filter and the full-transmission spectrum filter can be switched to selectively be located on the light-sensitive path of the photosensitive chip 12. In this way, when used in an environment with sufficient light such as during the day, the infrared cut-off filter can be switched to the light-sensitive path of the photosensitive chip 12 to filter the infrared rays in the light reflected by the object and entering the photosensitive chip 12. And when used in an environment with dim light such as at night, the full-transmission spectrum filter can be switched to the light-sensitive path of the photosensitive chip 12 to allow the infrared ray part in the light reflected by the object and entering the photosensitive chip 12 to transmit through.

[0167] Figure 17 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application. As Figure 17 shown, in this variant implementation, the photosensitive component 10 is prepared based on the MOB (Molding on Board) process. Specifically, in this variant embodiment, the bracket 16 is implemented as a molded bracket 16A, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a part of the circuit board 11 and at least part of the electronic components 14.

[0168] In the specific preparation process, the circuit board 11 can be placed in the lower mold, and then an upper mold matching with the lower mold is provided to form a molding cavity between the upper and lower molds after they are closed. Among them, the upper mold includes a pressing block that presses on the circuit board 11 when closed. Further, the molding material is injected into the molding cavity, and after curing, molding, and demolding, the molded bracket 16A that integrally covers at least a part of the circuit board 11 and at least part of the electronic components 14 is obtained.

[0169] It is worth mentioning that the shape of the inner side surface of the molded bracket 16A is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the circuit board 11, the inner side surface of the molded bracket 16A is perpendicular to the upper surface 121 of the photosensitive chip 12. Another example is that when the inner side surface of the pressing block is inclined to the circuit board 11, the inner side surface of the molded bracket 16A extends outwardly and obliquely.

[0170] It is worth mentioning that when the photosensitive component 10 is manufactured based on the MOB process, preferably, after the first shaping member 131 and the second shaping member 132 of the shaping component are integrally formed at a preset position of the circuit board 11 on the module bracket 16, they are then installed at the preset position of the circuit board 11. Such a manufacturing sequence is beneficial to engineering implementation.

[0171] Figure 18 The figure shows a schematic diagram of another variant implementation of the photosensitive component according to an embodiment of the present application. As Figure 18 shown, in this variant implementation, the photosensitive component 10 is prepared based on the MOC (Molding on Chip) process. Specifically, in this variant embodiment, the bracket 16 is implemented as a molded bracket 16B, which is integrally formed on the circuit board 11 through a molding process to integrally cover at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12.

[0172] In the specific manufacturing process, after the photosensitive chip 12 is attached to the first shaping member 131 and bent and formed to be attached to the second shaping member 132 (for the convenience of description, this state is defined as a component semi-finished product), the component semi-finished product is placed in the lower mold, and then an upper mold matching the lower mold is provided to form a molding cavity between the upper and lower molds after they are closed. The upper mold includes a pressing block, wherein, when the molds are closed, the pressing block presses on the non-photosensitive area 1212 of the photosensitive chip 12. Further, a molding material is injected into the molding cavity, and after curing and demolding, the molded bracket 16B that integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12 is obtained, wherein the area occupied by the pressing block correspondingly forms a light passing hole of the photosensitive chip 12.

[0173] It is worth mentioning that the shape of the inner side surface of the molded bracket 16B is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the upper surface 121 of the photosensitive chip 12, the inner side surface of the molded bracket 16B is perpendicular to the upper surface 121 of the photosensitive chip 12. Again, when the inner side surface of the pressing block is inclined to the upper surface 121 of the photosensitive chip 12, the inner side surface of the molded bracket 16B extends outwardly and obliquely. In particular, when the inner side surface of the pressing block has a stepped shape, the inner side surface of the molded bracket 16 also has a stepped shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the molded bracket 16B. For the convenience of explanation, in this application, this technical solution is defined as the IOM scheme (IR Filter on Molding), as Figure 19as shown

[0174] It is worth mentioning that when the photosensitive component 10 is made based on the MOC process, the first shaping member 131 and the second shaping member 132 of the shaping component are pre-installed or integrally formed at a preset position of the circuit board 11 before the module bracket 16 is integrally formed at a preset position of the circuit board 11 and the photosensitive chip 12. Such a manufacturing sequence is beneficial to engineering implementation.

[0175] It is worth mentioning that in order to prevent the photosensitive chip 12 from being impacted by the injected molding material during the execution of the MOC process and causing a positional shift, in some examples of this modified embodiment of the present application, the photosensitive component 10 further includes a side encapsulation 161 that wraps the side portions of the photosensitive chip 12 and the first shaping member 131, which is used to prevent the position of the photosensitive chip 12 from shifting during the execution of the molding process, as Figure 20 shown. It should be understood that the side encapsulation 161 can not only prevent the position of the photosensitive chip 12 from shifting, but also effectively reduce the stress generated by the molding bracket 16B from being transmitted to the photosensitive chip 12.

[0176] Figure 21 The figure illustrates a schematic diagram of another modified implementation of the photosensitive component according to an embodiment of the present application. As Figure 21 shown, in this modified implementation, the filter element 15 is stacked on the photosensitive chip 12, and the bracket 16 is implemented as a molding bracket 16C, which is integrally formed through a molding process to cover at least a part of the circuit board 11, the at least one electronic component 14, at least a part of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a part of the filter element 15.

[0177] In a specific manufacturing process, after the photosensitive chip 12 is attached to the first shaping member 131 and bent and formed to be attached to the second shaping member 132, the filter element 15 is stacked on the photosensitive chip 12 to form a component semi-finished product. Then, the component semi-finished product is placed in a lower mold, and an upper mold that cooperates with the lower mold is provided, so as to form a molding cavity between the upper and lower molds after they are closed. The upper mold includes a pressing block, wherein the pressing block presses on the filter element 15 when the molds are closed. Then, a molding material is injected into the molding cavity, and after curing, molding, and demolding, the molding bracket 16C that integrally covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12 is obtained, wherein the area occupied by the pressing block correspondingly forms a light passing hole of the photosensitive chip 12.

[0178] It is worth mentioning that the shape of the inner side surface of the molding bracket 16C is determined by the shape of the pressing block. For example, when the side surface of the pressing block is perpendicular to the filter element 15, the inner side surface of the molding bracket 16C is perpendicular to the filter element 15. Another example is that when the inner side surface of the pressing block is inclined to the filter element 15, the inner side surface of the molding bracket 16C extends outwardly and obliquely. For the sake of convenience of description, this technical solution is defined as the IOC scheme (IR Filter on Chip) in this application.

[0179] It is worth mentioning that in the embodiments of this application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, molding brackets 16A, 16B, 16C) and the photosensitive chip 12, the filter element 15 can also be installed in other ways, and it only needs to hold the filter element 15 in the light-sensitive path of the photosensitive component 10. For example, in other examples of the embodiments of this application, the photosensitive component 10 further includes a filter element bracket 17, and the filter element bracket 17 is installed on the bracket 16 and is used to install the filter element 15. Another example is that when the photosensitive component 10 is combined with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited to this application.

[0180] In summary, the photosensitive component based on the embodiments of this application is clarified, and its planar photosensitive chip is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process to improve the imaging quality of the camera module.

[0181] The manufacturing process of the photosensitive component 10 will be described below from the perspective of the manufacturing process.

[0182] As Figure 4A and Figure 4B shown, the manufacturing process of the photosensitive component 10 based on the embodiments of this application is clarified, which is used to prepare the above-mentioned photosensitive component and its deformation embodiments.

[0183] Specifically, the manufacturing method of the photosensitive component 10 according to the embodiments of this application includes the steps:

[0184] First, provide a circuit board 11, a photosensitive chip 12, a first shaping member 131 and a second shaping member 132, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 can also be formed by a punching process after the accommodation space 100 is formed. This is not limited to this application.

[0185] Next, fix the first shaping member 131 and the second shaping member 132 at a preset position on the circuit board 11.

[0186] Then, attach the photosensitive chip 12 to the first shaping member 131 to define an accommodation space 100 between the first shaping member 131, the circuit board 11, and the photosensitive chip 12. Among them, the opening 133 formed on the circuit board 11 communicates with the accommodation space 100. Among them, the second shaping member 132 is located within the accommodation space 100, and the height of the second shaping member 132 is lower than that of the first shaping member 131. Among them, the upper surface of at least one of the first shaping member and the second shaping member includes an arc surface that is concave downward and inward.

[0187] Subsequently, attach the adsorption device 40 to at least a part of the lower surface 122 of the photosensitive chip 12 through the opening 133.

[0188] Next, pull the photosensitive chip 12 downward through the adsorption device 40 so that the photosensitive chip 12 bends downward.

[0189] In the embodiment of the present application, the adsorption device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41. Among them, the suction cup 41 is used to adsorb at least a part of the lower surface 122 of the photosensitive chip 12. After the suction cup 41 is attached to the photosensitive chip 12, the photosensitive chip 12 can be bent downward by pulling the extension rod 42. It is worth mentioning that in other examples of the present application, the adsorption device 40 can also be implemented as other types, and this is not limited by the present application.

[0190] Preferably, the position where the opening 133 is formed on the circuit board 11 corresponds to the central region of the photosensitive chip 12. In this way, when the adsorption device 40 extends into the accommodation space 100 through the opening 133, the suction cup 41 of the adsorption device 40 can be attached to the central region of the lower surface 122 of the photosensitive chip 12. In this way, the bending force generated by the adsorption device 40 is the largest in the central region of the photosensitive chip 12 and gradually decreases from the central region to the edge part, so that the degree of deformation of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12, adapting to the shape of the actual focal plane. It is worth mentioning that in the embodiment of the present application, the number of the openings 133 can be set to one or more, and this is not limited by the present application. It should also be understood that in other examples of the embodiment of the present application, the opening 133 can also be formed at other positions on the circuit board 11.

[0191] Preferably, in the embodiments of the present application, the first shaping member 131 should have a closed shape (for example, implemented as having a "mouth" shape), and the second shaping member 132 is symmetrically arranged relative to the center of the photosensitive chip 12. It is worth mentioning that the height setting of the second shaping member 132 is related to its relative positional relationship with the first shaping member 131. Specifically, the shape of the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132 for defining the bending shape of the photosensitive chip 12 is set based on the shape of the actual focal plane. More specifically, when the second shaping member 132 approaches the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced (i.e., the height of the second shaping member 132 should increase); when the second shaping member 132 moves away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should increase (i.e., the height of the second shaping member 132 should be reduced).

[0192] Particularly, in the embodiments of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface that is recessed downward and inward, and the arc-shaped surface is configured such that when the photosensitive chip 12 bends downward, a lower surface 122 adapted to the focal imaging surface of the photosensitive assembly 10 is formed, so as to form the downwardly curved shaping surface 130 through the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiments of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include arc-shaped surfaces that are recessed downward and inward.

[0193] Accordingly, the process of bending the photosensitive chip 12 includes:

[0194] Bending the photosensitive chip 12 until the lower surface 122 of the photosensitive chip 12 adheres to the arc-shaped surface, so that when the photosensitive chip 12 bends downward, a lower surface adapted to the focal imaging surface of the photosensitive assembly 10 is formed.

[0195] As Figure 4B shown, the manufacturing method further includes the step of:

[0196] Forming a heat dissipation member 19 in the accommodation space 100 defined by the first shaping member 131, the photosensitive chip 12, and the circuit board 11, wherein the heat dissipation member 19 adheres to at least a part of the lower surface 122 of the photosensitive chip 12.

[0197] Preferably, in the embodiment of the present application, the heat dissipation member 19 fills the entire accommodation space 100, so that the lower surface 122 (the part corresponding to the accommodation space 100) of the photosensitive chip 12 is completely in contact with the heat dissipation member 19, thereby maximizing the heat dissipation area and improving the heat dissipation performance in this way.

[0198] In a specific implementation, when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the process of forming the heat dissipation member 19 in the accommodation space 100 includes: injecting the fluid heat dissipation material 190 into the accommodation space 100 through the opening 133, so as to form the heat dissipation member 19 after curing and molding.

[0199] For the convenience of operation, when performing the injection process, the photosensitive assembly 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when the number of the openings 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodation space 100, a ventilation hole 135 can be further opened on the circuit board 11. Of course, when the number of the openings 133 exceeds one, except for the one used to inject the heat dissipation material 190 among the suction holes, its function is equivalent to that of the ventilation hole 135. That is to say, when the number of the openings 133 exceeds one, at least one of the suction holes forms the ventilation hole 135.

[0200] After the heat dissipation member 19 is formed, a reinforcing plate 18 can be further attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with a high thermal conductivity, thereby further enhancing the heat dissipation performance of the photosensitive assembly 10 in this way.

[0201] In a specific implementation, when the heat dissipation material 190 is implemented as a granular heat dissipation material 190. The process of forming the heat dissipation member 19 in the accommodation space 100 includes: filling the granular heat dissipation material 190 into the accommodation space 100 through the opening 133, and attaching a reinforcing plate 18 to the bottom surface of the circuit board 11 to seal the opening 133 through the reinforcing plate 18. Preferably, the reinforcing plate 18 is made of a metal material with a high thermal conductivity, so as to further enhance the heat dissipation performance of the photosensitive assembly 10 while sealing the opening 133.

[0202] Furthermore, the manufacturing process of the photosensitive assembly 10 further includes: arranging the bracket 16 on the circuit board 11, and installing the light filtering element 15 on the bracket 16.

[0203] Specifically, in the COB process, the bracket 16 is implemented as a conventional plastic bracket 16. Accordingly, the process of disposing the bracket 16 on the circuit board 11 is specifically manifested as: mounting the plastic bracket 16 on the circuit board 11. Further, the filter element 15 is mounted on the bracket 16.

[0204] In the MOB process, the bracket 16 is implemented as a molded bracket 16A. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: integrally molding the molded bracket 16A on the circuit board 11 by a molding process, wherein the molded bracket 16A covers at least a part of the circuit board 11 and at least part of the at least one electronic component 14. Further, the filter element 15 is mounted on the molded bracket 16A.

[0205] It is worth mentioning that in the MOB process, the first shaping member 131 and the second shaping member 132 are installed at the preset positions on the circuit board 11 after the module bracket 16 is integrally molded at the preset positions on the circuit board 11. Such a manufacturing sequence is beneficial to engineering implementation.

[0206] In the MOC process, the bracket 16 is implemented as a molded bracket 16B. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: integrally molding the molded bracket 16B on the circuit board 11 by a molding process, wherein the molded bracket 16B covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12. Further, the filter element 15 is mounted on the molded bracket 16B.

[0207] In order to prevent the photosensitive chip 12 from being impacted by the injected molding material during the execution of the MOC process and causing a positional shift, before performing the MOC process to form the molded bracket 16B, it further includes applying a side encapsulation glue 161 to the side portions of the photosensitive chip 12 and the first shaping member 131, so that the side encapsulation glue 161 wraps the side portions of the photosensitive chip 12 and the first shaping member 131. In this way, the position of the photosensitive chip 12 is prevented from shifting during the execution of the molding process.

[0208] In the IOC process, the bracket 16 is implemented as a molded bracket 16C. Correspondingly, the process of disposing the bracket 16 and the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12, and integrally molding the molded bracket 16C on the circuit board 11, wherein the molded bracket integrally covers at least a part of the circuit board 11, at least one electronic component 14, at least a part of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a part of the filter element 15.

[0209] It is worth mentioning that in the MOB, MOC, and IOC processes, the shape of the inner side surface of the molded bracket 16 is determined by the shape of the pressing block. In particular, when the inner side surface of the pressing block has a stepped shape, the inner side surface of the molded bracket 16 also has a stepped shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the molded bracket 16. Correspondingly, in these examples, the filter element 15 is mounted on the mounting platform 160.

[0210] It is also worth mentioning that in the embodiments of the present application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket 16, molded brackets 16A, 16B, 16C) and the photosensitive chip 12, the filter element 15 can also be mounted in other ways, and only needs to keep the filter element 15 in the photosensitive path of the photosensitive assembly 10. For example, in other examples of the embodiments of the present application, the photosensitive assembly 10 further includes a filter element bracket 17, and the filter element bracket 17 is mounted on the bracket 16 and used for mounting the filter element 15. Again, when the photosensitive assembly 10 cooperates with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited by the present application.

[0211] As Figure 22A and 22B shown, the second manufacturing process of the photosensitive assembly based on the embodiments of the present application is illustrated, which is used to prepare the photosensitive assembly 10 and its variant embodiments as described above.

[0212] Specifically, as Figure 22A shown, the manufacturing process of the photosensitive assembly 10 according to the embodiments of the present application includes the steps:

[0213] First, a circuit board 11 and a photosensitive chip 12 are provided, wherein the circuit board 11 includes at least one opening 133. It is worth mentioning that the opening 133 on the circuit board 11 can also be formed by a punching process after forming the accommodation space 100. This is not limited by the present application.

[0214] Next, a first shaping member 131 and a second shaping member 132 are integrally formed on the circuit board 11. Among them, the height of the second shaping member 132 is lower than that of the first shaping member 131. In this way, the first shaping member and the second shaping member 132 define a concave shaping surface 130.

[0215] Then, the photosensitive chip 12 is attached to the first shaping member 131. In this way, a receiving space 100 is defined between the first shaping member 131, the circuit board 11, and the photosensitive chip 12. Among them, the opening 133 communicates with the receiving space 100.

[0216] Subsequently, the adsorption device 40 is attached to at least a part of the lower surface 122 of the photosensitive chip 12 through the opening 133.

[0217] Then, the photosensitive chip 12 is pulled downward by the adsorption device 40 so that the photosensitive chip 12 bends downward.

[0218] That is to say, compared with the first preparation process, in the second preparation process, the first shaping member 131 and the second shaping member 132 are integrally formed on the circuit board 11, rather than being prefabricated and then mounted.

[0219] Specifically, in the embodiment of the present application, the process of integrally forming a first shaping member 131 and a second shaping member 132 on the circuit board 11 includes:

[0220] Integrally forming a first shaping member main body 1311 and a second shaping member main body 1321 on the circuit board 11 through an electroplating forming process; and

[0221] An adhesive 1340 is respectively applied on the first shaping member main body 1311 and the second shaping member main body 1321, so that the first shaping member 131 is formed by the first shaping member main body 1311 and the adhesive 1340, and the second shaping member 132 is formed by the second shaping member main body 1321 and the adhesive 1340.

[0222] In the embodiment of the present application, the adsorption device 40 includes a suction cup 41 and an extension rod 42 extending downward from the suction cup 41. Among them, the suction cup 41 is used to adsorb at least a part of the lower surface 122 of the photosensitive chip 12. After the suction cup 41 is attached to the photosensitive chip 12, the photosensitive chip 12 can be bent downward by pulling the extension rod 42. It is worth mentioning that in other examples of the present application, the adsorption device 40 can also be implemented as other types, and this is not limited by the present application.

[0223] Preferably, the opening 133 is formed in the circuit board 11 at a position corresponding to the central region of the photosensitive chip 12. In this way, when the adsorption device 40 extends into the accommodation space 100 through the opening 133, the suction cup 41 of the adsorption device 40 can adhere to the central region of the lower surface 122 of the photosensitive chip 12. In this way, the bending force generated by the adsorption device 40 is the largest in the central region of the photosensitive chip 12 and gradually decreases from the central region to the edge portion, so that the degree of deformation of the photosensitive chip 12 gradually increases from the edge of the photosensitive chip 12 to the center of the photosensitive chip 12, adapting to the shape of the actual focal plane. It is worth mentioning that in the embodiment of the present application, the number of the openings 133 can be set to one or more, which is not limited to the present application. It should also be understood that in other examples of the embodiment of the present application, the opening 133 can also be formed at other positions on the circuit board 11.

[0224] Preferably, in the embodiment of the present application, the first shaping member 131 should have a closed shape (for example, implemented as having a "mouth" shape), and the second shaping member 132 is symmetrically arranged with respect to the center of the photosensitive chip 12. It is worth mentioning that the height setting of the second shaping member 132 is related to its relative position relationship with the first shaping member 131. Specifically, the shape of the shaping surface 130 formed by the first shaping member 131 and the second shaping member 132 for defining the bending shape of the photosensitive chip 12 is set based on the shape of the actual focal plane. More specifically, when the second shaping member 132 approaches the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be reduced (that is, the height of the second shaping member 132 should be increased); when the second shaping member 132 is away from the first shaping member 131, the height difference between the first shaping member 131 and the second shaping member 132 should be increased (that is, the height of the second shaping member 132 should be reduced).

[0225] Particularly, in the embodiment of the present application, the upper surface of at least one of the first shaping member 131 and the second shaping member 132 includes an arc-shaped surface that is recessed downward and inward. The arc-shaped surface is configured such that when the photosensitive chip 12 is bent downward, a lower surface 122 that is adapted to the focal imaging surface of the photosensitive assembly 10 is formed, so as to form the downwardly bent shaping surface 130 through the upper surfaces of the first shaping member 131 and the second shaping member 132. Preferably, in the embodiment of the present application, the upper surfaces of both the first shaping member 131 and the second shaping member 132 include arc-shaped surfaces that are recessed downward and inward.

[0226] Correspondingly, the process of bending the photosensitive chip 12 includes:

[0227] Bend the photosensitive chip 12 until the lower surface 122 of the photosensitive chip 12 adheres to the arc surface, so that when the photosensitive chip 12 is bent downward, a lower surface adapted to the focal imaging surface of the photosensitive component 10 is formed.

[0228] As Figure 22B shown, the preparation process of the photosensitive component 10 further includes the steps of:

[0229] Inject a heat dissipation material into the accommodation space 100 through the opening 133 to form the heat dissipation member in the accommodation space 100, wherein the heat dissipation member adheres to at least a part of the lower surface 122 of the photosensitive chip 12.

[0230] Preferably, in the embodiment of the present application, the heat dissipation member 19 fills the entire accommodation space 100, so that the lower surface 122 (the part corresponding to the accommodation space 100) of the photosensitive chip 12 is completely in contact with the heat dissipation member 19, and in this way, the heat dissipation area is maximized to improve the heat dissipation performance.

[0231] In a specific implementation, when the heat dissipation material 190 is implemented as a fluid heat dissipation material 190, the process of forming the heat dissipation member 19 in the accommodation space 100 includes: injecting the fluid heat dissipation material 190 into the accommodation space 100 through the opening 133 to form the heat dissipation member 19 after curing and molding.

[0232] For the convenience of operation, when performing the injection process, the photosensitive component 10 can be inverted to prevent the fluid heat dissipation material 190 from flowing out of the opening 133. In particular, when the number of the openings 133 is only one, in order to balance the internal and external pressures so that the fluid heat dissipation material 190 can be smoothly injected into the accommodation space 100, a vent hole 135 can be further opened on the circuit board 11. Of course, when the number of the openings 133 exceeds one, except for the one used to inject the heat dissipation material 190 among the openings 133, its function is equivalent to that of the vent hole 135. That is to say, when the number of the openings 133 exceeds one, at least one of the openings 133 forms the vent hole 135.

[0233] After the heat dissipation member 19 is formed, a reinforcing plate 18 can be further attached to the bottom surface of the circuit board 11. Preferably, the reinforcing plate 18 is made of a metal material with a higher thermal conductivity, and in this way, the heat dissipation performance of the photosensitive component 10 is further enhanced.

[0234] Further, the manufacturing process of the photosensitive component 10 further includes: disposing the bracket 16 on the circuit board 11, and mounting the filter element 15 on the bracket 16.

[0235] Specifically, in the COB process, the bracket 16 is implemented as a conventional plastic bracket 16. Accordingly, the process of disposing the bracket 16 on the circuit board 11 is specifically: mounting the plastic bracket 16 on the circuit board 11. Further, mounting the filter element 15 on the bracket 16.

[0236] In the MOB process, the bracket 16 is implemented as a molded bracket 16A. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: integrally molding the molded bracket on the circuit board 11 by a molding process, wherein the molded bracket 16A covers at least a part of the circuit board 11 and at least part of the at least one electronic component 14. Further, mounting the filter element 15 on the molded bracket.

[0237] In the MOC process, the bracket 16 is implemented as a molded bracket. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: integrally molding the molded bracket on the circuit board 11 by a molding process, wherein the molded bracket covers at least a part of the circuit board 11, the at least one electronic component 14, and at least a part of the non-photosensitive area 1212 of the photosensitive chip 12. Further, mounting the filter element 15 on the molded bracket.

[0238] In order to prevent the photosensitive chip 12 from being impacted by the injected molding material during the execution of the MOC process and causing a positional shift, before performing the MOC process to form the molded bracket, it further includes applying a side encapsulation 161 to the side of the photosensitive chip 12 and the shaping component 13, so that the side encapsulation 161 wraps the sides of the photosensitive chip 12 and the shaping component 13. In this way, it is prevented that the position of the photosensitive chip 12 shifts during the execution of the molding process.

[0239] In the IOC process, the bracket 16 is implemented as a molded bracket. Accordingly, the process of disposing the bracket 16 on the circuit board 11 includes: stacking the filter element 15 on the photosensitive chip 12, and integrally molding the molded bracket 16C on the circuit board 11, wherein the integral covers at least a part of the circuit board 11, the at least one electronic component 14, at least a part of the non-photosensitive area 1212 of the photosensitive chip 12, and at least a part of the filter element 15.

[0240] It is worth mentioning that in the MOB, MOC, and IOC processes, the shape of the inner side surface of the molding bracket 16 is determined by the shape of the pressing block. In particular, when the inner side surface of the pressing block has a stepped shape, the inner side surface of the molding bracket 16 also has a stepped shape to form a mounting platform 160 for mounting the filter element 15 on the top surface of the molding bracket 16. Correspondingly, in these examples, the filter element 15 is mounted on the mounting platform 160.

[0241] It is also worth mentioning that in the embodiments of the present application, in addition to supporting the filter element 15 on the bracket 16 (including the plastic bracket and the molding bracket) and the photosensitive chip 12, the filter element 15 can also be mounted in other ways, and only the filter element 15 needs to be held in the photosensitive path of the photosensitive component 10. For example, in other examples of the embodiments of the present application, the photosensitive component 10 further includes a filter element bracket 17, and the filter element bracket 17 is mounted on the bracket 16 and is used to mount the filter element 15. Again, when the photosensitive component 10 cooperates with the optical lens 20 to form a camera module, the filter element 15 can also be supported in the optical lens 20, or formed on the surface of the lens in the optical lens 20 in the form of a coating. This is not limited to the present application.

[0242] In summary, the manufacturing method of the photosensitive component 10 based on the embodiments of the present application is clarified. The planar photosensitive chip 12 is bent into a shape adapted to the actual focal imaging surface through a special manufacturing process to improve the imaging quality of the camera module. And a heat dissipation member 19 for enhancing heat dissipation is formed on the back surface of the photosensitive chip 12 to improve the heat dissipation performance.

[0243] Schematic Imaging Module

[0244] The application of the photosensitive component 10 as described above to a camera module will be specifically introduced below. Those skilled in the art know that camera modules include autofocus camera modules and fixed-focus camera modules.

[0245] When the camera module is implemented as a fixed-focus camera module, the camera module includes the photosensitive component and the optical lens 20 as described above, wherein the optical lens 20 is held in the photosensitive path of the photosensitive component 10. Specifically, generally the optical lens 20 is mounted on the bracket 16 to hold the optical lens 20 in the photosensitive component of the photosensitive component 10, and the specific effects can be seen as Figure 23 to Figure 27 . It is worth mentioning that only several typical photosensitive components in the embodiments of the present application are schematically shown in the drawings, and the corresponding deformation embodiments are not listed one by one. Those skilled in the art should be able to fully understand this.

[0246] During the imaging process, external light first passes through the optical lens 20, and after being filtered by the filter element 15, it is collected by the photosensitive chip 12. In particular, in the embodiment of the present application, the photosensitive chip 12 is bent based on the shape of the actual focal plane, and in this way, the imaging quality of the camera module is improved.

[0247] When the camera module is implemented as a variable-focus camera module, as Figure 28 shown, the camera module includes the photosensitive component, the optical lens 20 and the driving element 30 as described above. Among them, the driving element 30 is mounted on the bracket 16, and the optical lens 20 is mounted on the driving element 30. In this way, the driving element 30 can carry the optical lens 20 and move along the photosensitive path of the photosensitive component 10 to achieve the variable-focus function. It is worth mentioning that only a typical photosensitive component in the embodiment of the present application is schematically shown in the drawings, and the corresponding deformation implementations are not listed one by one, and those skilled in the art should fully understand this.

[0248] In summary, the camera module based on the embodiment of the present application is described. It bends the planar photosensitive chip 12 into a shape adapted to the actual focal imaging plane through a special manufacturing process, and in this way, the imaging quality of the camera module is improved.

[0249] Those skilled in the art should understand that the embodiments of the present invention described above and shown in the drawings are only examples and do not limit the present invention. The object of the present invention has been fully and effectively achieved. The function and structural principle of the present invention have been shown and described in the embodiments, and without departing from the principle, the embodiments of the present invention can have any deformation or modification.

Claims

1. A photosensitive component, characterized in that, comprising: a circuit board; a photosensitive chip electrically connected to the circuit board; and a shaping member disposed on the circuit board, wherein a lower surface of the photosensitive chip adheres to the shaping member to form an accommodation space with the shaping member and the circuit board, wherein the circuit board has at least one opening formed therethrough and communicating with the accommodation space, and wherein the accommodation space and the opening are configured such that the photosensitive chip bends downward during the assembly of the photosensitive component; and a heat dissipation member; wherein the shaping member includes a first shaping member and a second shaping member, the first shaping member forms the accommodation space with the photosensitive chip and the circuit board, the second shaping member is disposed on the circuit board and within the accommodation space, and the height of the second shaping member is lower than that of the first shaping member; the cross-sectional shape of the second shaping member is a closed ring; the heat dissipation member is formed within the accommodation space and adheres to at least a portion of the lower surface of the photosensitive chip; the heat dissipation member is formed by a heat dissipation material entering the accommodation space through the at least one opening, wherein the heat dissipation material for forming the heat dissipation member fills the entire accommodation space and extends from the lower surface of the photosensitive chip to the opening, such that the finally formed heat dissipation member extends from the photosensitive chip to the outside.

2. The photosensitive component according to claim 1, wherein, the at least one opening is configured such that at least one adsorption device can extend into the accommodation space through the at least one opening and adhere to at least a portion of the lower surface of the photosensitive chip, so as to bend the photosensitive chip downward by a pulling force.

3. The photosensitive component according to claim 1, wherein, an upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is recessed downward and inward, and the arc-shaped surface is configured such that when the photosensitive chip bends downward, a lower surface adapted to the focal imaging surface of the photosensitive component is formed.

4. The photosensitive component according to claim 1, wherein, the opening is formed in a position on the circuit board corresponding to the central region of the photosensitive chip.

5. The photosensitive component according to claim 4, wherein, the at least one opening is configured such that at least one adsorption device can extend into the accommodation space through the at least one opening and adhere to at least a portion of the lower surface of the photosensitive chip, so as to bend the photosensitive chip downward by a pulling force; the position where the adsorption device adheres to the lower surface of the photosensitive chip is the central region of the lower surface of the photosensitive chip.

6. The photosensitive component according to claim 3, wherein, the second shaping member is symmetrically arranged with respect to the center of the photosensitive chip.

7. The photosensitive component according to claim 6, wherein, the second shaping member is symmetrically arranged on both sides of the center line set by the longer side of the photosensitive chip.

8. The photosensitive component according to claim 1, wherein, The shaping component further includes an adhesive disposed between the first shaping member and the second shaping member, wherein the height of the adhesive is higher than the height of the second shaping member.

9. The photosensitive component according to claim 1, wherein, the first shaping member includes a first shaping member body and an adhesive applied to the first shaping member body, and the second shaping member includes a second shaping member body and an adhesive applied to the second shaping member body.

10. The photosensitive component according to claim 9, wherein, the first shaping member body and the second shaping member body are integrally formed on the top surface of the circuit board.

11. The photosensitive component according to claim 10, wherein, the first shaping member body and the second shaping member body are prefabricated and installed on the circuit board.

12. An imaging module, characterized in that, comprising: an optical lens; and the photosensitive component according to any one of claims 1-11, wherein the optical lens is held in the photosensitive path of the photosensitive component.

13. The imaging module according to claim 12, wherein, the curved shape of the lower surface of the photosensitive chip is adapted to the shape of the actual focal imaging surface of the imaging module.

14. A manufacturing method of a photosensitive component, characterized in that, comprising: providing a circuit board, a photosensitive chip, a first shaping member and a second shaping member, wherein the circuit board includes at least one opening; the cross-sectional shape of the first shaping member is a closed ring; the cross-sectional shape of the second shaping member is a closed ring; disposing the first shaping member and the second shaping member on the circuit board, wherein the height of the second shaping member is less than that of the first shaping member; attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodation space with the first shaping member and the circuit board, wherein the at least one opening communicates with the accommodation space, and the second shaping member is located in the accommodation space; attaching an adsorption device to at least a part of the lower surface of the photosensitive chip through the opening; and pulling the photosensitive chip downward by the adsorption device so that the photosensitive chip bends downward; injecting a heat dissipation material into the accommodation space through the opening to form a heat dissipation member in the accommodation space, wherein the heat dissipation material used to form the heat dissipation member fills the entire accommodation space, the heat dissipation member adheres to at least a part of the lower surface of the photosensitive chip, and extends from the lower surface of the photosensitive chip to the opening, so that the heat dissipation member extends from the photosensitive chip to the outside.

15. The manufacturing method of the photosensitive component according to claim 14, wherein, the upper surface of at least one of the first shaping member and the second shaping member includes a downward and inward concave arc surface, wherein pulling the photosensitive chip downward by the adsorption device so that the photosensitive chip bends downward includes: bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc surface, so that the lower surface formed when the photosensitive chip bends downward is adapted to the focal imaging surface of the photosensitive component.

16. The manufacturing method of the photosensitive component according to claim 14, wherein, after the first shaping member and the second shaping member are disposed on the circuit board, and before the lower surface of the photosensitive chip is attached to the first shaping member to form an accommodating space with the first shaping member and the circuit board, it further includes: applying an adhesive between the first shaping member and the second shaping member, wherein the upper surface height of the adhesive is lower than that of the second shaping member.

17. The manufacturing method of the photosensitive component according to claim 14, wherein, the position where the opening is formed on the circuit board corresponds to the central area of the photosensitive chip.

18. A manufacturing method of a photosensitive component, characterized in that, it includes: providing a circuit board and a photosensitive chip, wherein the circuit board includes at least one opening; integrally forming a first shaping member and a second shaping member on the circuit board, wherein the cross-sectional shape of the first shaping member is a closed ring; the cross-sectional shape of the second shaping member is a closed ring; the height of the second shaping member is less than that of the first shaping member; attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodating space with the first shaping member and the circuit board, wherein the at least one opening communicates with the accommodating space, and the second shaping member is located in the accommodating space; attaching an adsorption device to at least a part of the lower surface of the photosensitive chip through the opening; and pulling the photosensitive chip downward through the adsorption device so that the photosensitive chip bends downward; injecting a heat dissipation material into the accommodating space through the opening to form a heat dissipation member in the accommodating space, wherein the heat dissipation material used to form the heat dissipation member fills the entire accommodating space, the heat dissipation member adheres to at least a part of the lower surface of the photosensitive chip, and extends from the lower surface of the photosensitive chip to the opening, so that the heat dissipation member extends from the photosensitive chip to the outside.

19. The manufacturing method of the photosensitive component according to claim 18, wherein, the upper surface of at least one of the first shaping member and the second shaping member includes a downward and inward concave arc surface, wherein pulling the photosensitive chip downward through the adsorption device so that the photosensitive chip bends downward includes: bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc surface, so that when the photosensitive chip bends downward, a lower surface adapted to the focal imaging surface of the photosensitive component is formed.

20. The manufacturing method of the photosensitive component according to claim 18, wherein, integrally forming a first shaping member and a second shaping member on the circuit board includes: integrally forming a first shaping member main body and a second shaping member main body on the circuit board by an electroplating process; and applying adhesives on the first shaping member main body and the second shaping member main body respectively.

21. The manufacturing method of the photosensitive component according to claim 18, wherein, After integrally forming a first shaping member and a second shaping member on the circuit board, and before attaching the lower surface of the photosensitive chip to the first shaping member to form an accommodating space with the first shaping member and the circuit board, it further includes: applying an adhesive between the first shaping member and the second shaping member, wherein the upper surface height of the adhesive is lower than that of the second shaping member.

22. The manufacturing method of the photosensitive component according to claim 18, wherein, the upper surface of at least one of the first shaping member and the second shaping member includes an arc-shaped surface that is recessed downward and inward. When the photosensitive chip is pulled downward by the adsorption device so that the photosensitive chip bends downward, it includes: bending the photosensitive chip until the lower surface of the photosensitive chip adheres to the arc-shaped surface, so that when the photosensitive chip bends downward, a lower surface adapted to the focal imaging surface of the photosensitive component is formed.

23. The manufacturing method of the photosensitive component according to claim 18, wherein, the position where the opening is formed on the circuit board corresponds to the central region of the photosensitive chip.

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