Molded circuit board and camera module and manufacturing method thereof and electronic equipment

Abstract

A molded circuit board and camera module, a manufacturing method thereof, and an electronic device. The molded circuit board includes a circuit board body and a molded structure. The circuit board body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked with an interval. The molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body.

Description

Technical Field

[0001] The present invention relates to the field of electronic information technology, and in particular to a molded circuit board and a camera module, a manufacturing method thereof, and electronic equipment. Background Art

[0002] As one of the core components of various electronic devices, the circuit board can provide mechanical support for the fixation and assembly of various electronic components such as integrated circuits, so as to achieve wiring, electrical connection or electrical insulation between various electronic components. Generally speaking, a circuit board is a conductive pattern formed by printing circuits, printed components or a combination of the two on an insulating substrate according to a predetermined design. The types of circuit boards generally include single-sided circuit boards, double-sided circuit boards and multi-layer circuit boards. Single-sided circuit boards or double-sided circuit boards are generally made by etching circuits on a copper-clad board with single-sided copper cladding or double-sided copper cladding (of course, some circuit boards also use a punching process). The copper-clad board is made by pressing copper foil and a substrate (the substrate is an insulating material) together. Multi-layer circuit boards are usually manufactured by lamination, mainly by pressing multiple circuit layers (currently the circuit layer material is generally copper) and multiple substrates together, and then drilling conductive holes (not shown in the figure) between each circuit layer on the multi-layer circuit board to electrically connect each circuit layer, thereby forming the multi-layer circuit board.

[0003] Currently, whether it is a single-sided circuit board, a double-sided circuit board, or a multi-layer circuit board, or a circuit board manufactured by a lamination method or a circuit board manufactured by an additive method, its surface usually has exposed circuits, vias, pads, and substrates. Therefore, a layer of ink is generally provided on the surface of the circuit board by printing, curtain coating, spraying, or roller coating to be used for solder resistance insulation (i.e., the ink layer covers all the circuits and copper surfaces on the circuit board, and leaves the vias and pads to be soldered on the circuit board to prevent short circuits when soldering electronic components, and at the same time avoids conduction between circuits) and protection of the circuit board (i.e., the ink layer covers all the circuits on the circuit board to prevent oxidation of the circuits due to the invasion of moisture and various dielectrics, thereby endangering the electrical performance, and to prevent external mechanical damage).

[0004] However, as electronic devices become increasingly powerful, the chips mounted on circuit boards generate more heat. Ink's relatively poor heat dissipation performance can severely impact the heat dissipation of the circuit board and chip, leading to a decrease in electronic device performance. This is particularly true for camera modules, where the photosensitive chip is typically mounted on a circuit board. The presence of the ink layer impairs the circuit board's heat dissipation, further impacting the heat dissipation of the photosensitive chip and severely degrading the camera module's performance.

[0005] In addition, due to the inherent defects of the ink layer layout process (printing, curtain coating, spraying or roller coating, etc.), the surface of the ink layer is not flat. Therefore, for electronic devices such as camera modules that need to directly mount the chip on the circuit board, the ink layer on the circuit board will cause the chip to be tilted or bent when mounted on the circuit board, which will cause errors in the assembly of the electronic equipment and reduce the performance of the electronic equipment.

[0006] In addition, due to the lack of plastic deformation ability and toughness of the ink layer, the ink layer on the surface of the circuit board is easily broken, thereby generating dirt to damage the circuits on the circuit board, thereby affecting the performance of the electronic equipment. Summary of the Invention

[0007] One object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device, which can improve the performance of the camera module and the electronic device.

[0008] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded circuit board has good heat dissipation performance, which helps to improve the relatively poor heat dissipation performance of existing circuit boards.

[0009] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded circuit board replaces the ink layer on the existing circuit board through a molded structure, which helps to solve the problems caused by the inherent defects of the ink layer.

[0010] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded layer of the molded structure of the molded circuit board is solidified on the surface of the circuit board body by a molding process using a molding material with good heat dissipation performance, so that the heat dissipation performance of the molded structure is better than the heat dissipation performance of the ink layer, which is beneficial to enhancing the heat dissipation of the molded circuit board and facilitating the improvement of the performance of the camera module and the electronic device.

[0011] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molding structure can enhance the structural strength of the molded circuit board and reduce the degree of bending of the molded circuit board.

[0012] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the molded circuit board eliminates the layout of ink on the circuit board body, so that the molded structure can be directly combined with the circuit board body, which helps to increase the bonding strength between the two.

[0013] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the manufacturing method of the molded circuit board is simplified by eliminating the ink layout process, which helps to reduce manufacturing costs.

[0014] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded circuit board can provide a flat mounting surface through the molding structure, which helps to improve the performance of the camera module and the electronic device.

[0015] Another object of the present invention is to provide a molded circuit board and a camera module, a method for manufacturing the same, and an electronic device. In one embodiment of the present invention, the molded circuit board can avoid the problem of dirt caused by the rupture of the ink layer like existing circuit boards, which helps to enhance the protection of the circuit board body.

[0016] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded structure of the molded circuit board can provide a mounting surface for the lens assembly to replace the lens mount or base in the existing camera module, which helps to simplify the assembly process of the camera module.

[0017] Another object of the present invention is to provide a molded circuit board and a camera module, a manufacturing method thereof, and an electronic device. In one embodiment of the present invention, the molded structure of the molded circuit board can provide a chip mounting surface and / or mounting surface with good flatness, thereby avoiding the problem of tilting or bending of the chip and optical lens during installation, and helping to ensure that the camera module and the electronic device have better performance.

[0018] Another object of the present invention is to provide a molded circuit board, camera module, method for manufacturing the same, and electronic device, wherein achieving the aforementioned object does not require the use of expensive materials or complex structures. Thus, the present invention successfully and effectively provides a solution that not only provides a simple molded circuit board, camera module, method for manufacturing the same, and electronic device, but also increases the practicality and reliability of the molded circuit board, camera module, method for manufacturing the same, and electronic device.

[0019] In order to achieve at least one of the above-mentioned objectives or other objectives and advantages, the present invention provides a method for manufacturing a molded circuit board, comprising the steps of:

[0020] A circuit board body is provided, and an insulating molding material is solidified on at least one surface of the circuit board body through a molding mold to form a molding layer of a molding structure.

[0021] According to one embodiment of the present invention, the step of providing a circuit board body and forming a molding layer of a molding structure by curing an insulating molding material on at least one surface of the circuit board body through a molding mold includes the following steps:

[0022] By means of an upper mold of the molding mold, the insulating molding material is solidified on the front side of the circuit board body to form a front molding layer of the molding structure, wherein the front molding layer only covers the front conductive line of the front circuit layer of the circuit board body, so that the solder pad of the front circuit layer is exposed.

[0023] According to one embodiment of the present invention, the step of forming the front molding layer of the molding structure by curing the insulating molding material on the front surface of the circuit board body through an upper mold of the molding mold includes the steps of:

[0024] Placing the circuit board body on the upper mold of the molding mold so that the inner surface of the upper mold is pressed against the pad of the front circuit layer of the circuit board body, and forming a front molding space between the inner surface of the upper mold and the front surface of the circuit board body; and

[0025] The insulating molding material is injected into the front molding space to form the front molding layer after solidification.

[0026] According to one embodiment of the present invention, the method for manufacturing a molded circuit board further comprises the following steps before the step of placing the circuit board body on the upper mold of the molding mold:

[0027] The front conductive circuit of the front circuit layer of the circuit board body is etched to reduce the height of the front conductive circuit so that the surface of the front conductive circuit is lower than the surface of the pad.

[0028] According to one embodiment of the present invention, before the step of placing the circuit board body on the upper mold of the forming mold, the method further includes the following steps:

[0029] Metal is deposited on the pad of the front circuit layer of the circuit board body through a deposition process to increase the height of the pad so that the surface of the front conductive circuit is lower than the surface of the pad.

[0030] According to one embodiment of the present invention, the step of providing a circuit board body and forming a molding layer of a molding structure by curing an insulating molding material on at least one surface of the circuit board body through a molding mold includes the following steps:

[0031] By using an upper mold of the molding mold, the insulating molding material is cured on the front surface of the circuit board body to form a front molding layer of the molding layer of the molding structure, wherein the front molding layer only covers the surface of the substrate layer of the circuit board body, so that the front conductive circuits and pads of the front circuit layer are exposed; and

[0032] An insulating protection layer is correspondingly disposed on the front conductive circuit of the front circuit layer to cover the front conductive circuit.

[0033] According to one embodiment of the present invention, the step of forming the front molding layer of the molding structure by curing the insulating molding material on the front surface of the circuit board body using an upper mold of a molding mold includes the steps of:

[0034] Placing the circuit board body on the upper mold of the molding mold so that the inner surface of the upper mold is simultaneously pressed against the front conductive line and the pad of the front circuit layer of the circuit board body, thereby forming a front molding space between the inner surface of the upper mold and the front surface of the circuit board body; and

[0035] The insulating molding material is injected into the front molding space to form the front molding layer after solidification.

[0036] According to one embodiment of the present invention, the step of providing a circuit board body and forming a molding layer of a molding structure by curing an insulating molding material on at least one surface of the circuit board body through a molding mold further includes the steps of:

[0037] By means of a lower mold of the molding mold, the insulating molding material is solidified on the reverse side of the circuit board body to form a reverse molding layer of the molding layer of the molding structure, wherein the reverse molding layer covers the reverse conductive circuit of the reverse circuit layer of the circuit board body.

[0038] According to one embodiment of the present invention, the method for manufacturing the molded circuit board further comprises the steps of:

[0039] A group of electronic components are mounted on the soldering pad of the front circuit layer of the circuit board body.

[0040] According to one embodiment of the present invention, the step of providing a circuit board body and forming a molding layer of a molding structure by curing an insulating molding material on at least one surface of the circuit board body through a molding mold includes the following steps:

[0041] Mounting a group of electronic components on the pads of the front circuit layer of the circuit board body;

[0042] By using an upper mold of the molding mold, the insulating molding material is cured on the front surface of the circuit board body to form a front molding layer and a molded package of the molding structure, wherein the front molding layer covers the front conductive circuit of the front circuit layer, and the molded package covers the electronic component; and

[0043] By means of a lower mold of the molding mold, the insulating molding material is solidified on the reverse side of the circuit board body to form a reverse molding layer of the molding structure, wherein the reverse molding layer covers the reverse conductive circuit of the reverse circuit layer of the circuit board body to form the molded circuit board.

[0044] According to an embodiment of the present invention, the front molding layer only covers the front conducting circuit on the front circuit layer located at an edge region of the circuit board body.

[0045] According to an embodiment of the present invention, the heat dissipation efficiency of the insulating molding material is greater than the heat dissipation efficiency of the ink material.

[0046] According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:

[0047] Manufacturing the molded circuit board according to any of the above-mentioned methods for manufacturing the molded circuit board;

[0048] Mounting at least one photosensitive chip on the molded circuit board, and conductively connecting each photosensitive chip to the molded circuit board; and

[0049] A lens assembly is correspondingly arranged on the molded circuit board so that each optical lens of the lens assembly is located in the light sensing path of the corresponding light sensing chip.

[0050] According to one embodiment of the present invention, the method for manufacturing the camera module further comprises the steps of:

[0051] A filter assembly is correspondingly arranged between the molded circuit board and the lens assembly, so that the light entering from each optical lens passes through the filter element of the filter assembly and is then received by the photosensitive chip.

[0052] According to another aspect of the present invention, the present invention also provides a method for manufacturing a camera module, comprising the steps of:

[0053] At least one photosensitive chip can be conductively mounted on a chip mounting area of ​​a circuit board body, and a group of electronic components can be conductively mounted on an edge area of ​​the circuit board body;

[0054] Forming a front molding layer, a front molding layer, and a molded package of a molding structure on the front surface of the circuit board body by solidifying an insulating molding material through a molding mold, wherein the front molding layer only covers the front conductive circuit located at the edge region of the circuit board body on the front wiring layer of the circuit board body, and the molded package covers the electronic components and the non-photosensitive region of the photosensitive chip;

[0055] Correspondingly disposing at least one filter element of a filter assembly on the molded package, wherein each filter element is located in a light sensing path of a corresponding light sensing chip; and

[0056] A lens assembly is correspondingly arranged in the molded package of the molded structure, wherein each optical lens of the lens assembly is located in the photosensitive path of the corresponding photosensitive chip, so that the light entering from each optical lens is received by the photosensitive chip after passing through the corresponding filter element.

[0057] According to one embodiment of the present invention, the method for manufacturing the camera module further comprises the steps of:

[0058] The insulating molding material is solidified on the reverse side of the circuit board body by the molding die to form a reverse molding layer of the molding layer of the molding structure, wherein the reverse molding layer covers the reverse conductive circuit of the reverse circuit layer of the circuit board body.

[0059] According to another aspect of the present invention, the present invention also provides a molded circuit board, comprising:

[0060] a circuit board body, wherein the circuit board body comprises at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked at intervals; and

[0061] A molding structure, wherein the molding structure includes a molding layer, wherein the molding layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body.

[0062] According to one embodiment of the present invention, the molding layer of the molding structure includes a front molding layer, wherein the front molding layer is stacked on the front surface of the circuit board body to cover the substrate layer located on the front surface of the circuit board body.

[0063] According to one embodiment of the present invention, the circuit layer of the circuit board body includes a front circuit layer stacked on the front side of the substrate layer, wherein the front circuit layer includes a front conductive circuit and a group of solder pads conductively connected to the front conductive circuit, wherein the front mold layer further covers the front conductive circuit of the front circuit layer.

[0064] According to one embodiment of the present invention, the front molding layer of the molding structure is provided with a groove corresponding to the solder pad of the front circuit layer, so as to ensure that the solder pad of the front circuit layer is exposed while the front molding layer covers the front conductive circuit of the front circuit layer of the circuit board body.

[0065] According to one embodiment of the present invention, the circuit layer of the circuit board main body includes a front circuit layer stacked on the front side of the substrate layer, wherein the front circuit layer includes a front conductive circuit and a group of pads conductively connected to the front conductive circuit, wherein the molded structure further includes an insulating protective layer, wherein the insulating protective layer is stacked on the front mold layer and corresponds to the front conductive circuit of the front circuit layer of the circuit board main body to cover the front conductive circuit.

[0066] According to an embodiment of the present invention, a surface of the front conductive circuit of the front circuit layer of the circuit board body is flush with a surface of the pad of the front circuit layer.

[0067] According to an embodiment of the present invention, a surface of the front conductive circuit of the front circuit layer of the circuit board body is lower than a surface of the pad of the front circuit layer.

[0068] According to one embodiment of the present invention, the molding layer of the molding structure includes a reverse molding layer, wherein the reverse molding layer is stacked on the reverse side of the circuit board body to cover the substrate layer located on the reverse side of the circuit board body.

[0069] According to one embodiment of the present invention, the circuit layer of the circuit board body includes a reverse circuit layer stacked on the reverse side of the substrate layer, wherein the reverse circuit layer includes a reverse conductive circuit, and wherein the reverse mold layer covers the reverse conductive circuit of the reverse circuit layer.

[0070] According to one embodiment of the present invention, the molded circuit board further includes a group of electronic components, wherein each of the electronic components is mounted on the pad of the front circuit layer of the circuit board body, wherein the molded structure further includes a molded package, wherein the molded package extends integrally from the front mold layer to cover the electronic components.

[0071] According to one embodiment of the present invention, the front molding layer of the molding structure covers the front conductive line and the substrate layer of the front wiring layer located at the edge area of ​​the wiring board body, so that the front conductive line and the substrate layer of the front wiring layer located at the chip mounting area of ​​the wiring board body are exposed.

[0072] According to an embodiment of the present invention, the molding layer of the molding structure is formed by solidifying an insulating molding material on at least one surface of the circuit board body through a molding mold.

[0073] According to an embodiment of the present invention, the heat dissipation efficiency of the insulating molding material is greater than the heat dissipation efficiency of the ink material.

[0074] According to another aspect of the present invention, the present invention also provides a camera module, comprising:

[0075] A molded circuit board, wherein the molded circuit board comprises:

[0076] a circuit board body, wherein the circuit board body comprises at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked at intervals; and

[0077] a molded structure, wherein the molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body;

[0078] At least one photosensitive chip, wherein each photosensitive chip is mounted on the molded circuit board, and each photosensitive chip is electrically connected to the molded circuit board; and

[0079] A lens assembly, wherein the lens assembly includes at least one optical lens, wherein the lens assembly is correspondingly arranged on the molded circuit board, and each optical lens is located in the photosensitive path of the corresponding photosensitive chip.

[0080] According to one embodiment of the present invention, the molding layer of the molding structure includes a front molding layer, wherein the front molding layer is stacked on the front surface of the circuit board body to cover the substrate layer located on the front surface of the circuit board body.

[0081] According to one embodiment of the present invention, the circuit layer of the circuit board body includes a front circuit layer stacked on the front side of the substrate layer, wherein the front circuit layer includes a front conductive circuit and a group of solder pads conductively connected to the front conductive circuit, wherein the front mold layer further covers the front conductive circuit of the front circuit layer, wherein each photosensitive chip is mounted on the front mold layer.

[0082] According to one embodiment of the present invention, the front molding layer of the molding structure is provided with a groove corresponding to the solder pad of the front circuit layer, so as to ensure that the solder pad of the front circuit layer is exposed while the front molding layer covers the front conductive circuit of the front circuit layer of the circuit board body.

[0083] According to one embodiment of the present invention, the circuit layer of the circuit board main body includes a front circuit layer stacked on the front side of the substrate layer, wherein the front circuit layer includes a front conductive circuit and a group of solder pads conductively connected to the front conductive circuit, wherein the molded structure further includes an insulating protective layer, wherein the insulating protective layer is stacked on the front molded layer and corresponds to the front conductive circuit of the front circuit layer of the circuit board main body to cover the front conductive circuit, wherein each of the photosensitive chips is mounted on the insulating protective layer.

[0084] According to one embodiment of the present invention, the molding layer of the molding structure includes a reverse molding layer, wherein the reverse molding layer is stacked on the reverse side of the circuit board body to cover the substrate layer located on the reverse side of the circuit board body.

[0085] According to one embodiment of the present invention, the circuit layer of the circuit board body includes a reverse circuit layer stacked on the reverse side of the substrate layer, wherein the reverse circuit layer includes a reverse conductive circuit, and wherein the reverse mold layer covers the reverse conductive circuit of the reverse circuit layer.

[0086] According to one embodiment of the present invention, the front molding layer of the molding structure covers the front conductive line and the substrate layer of the front wiring layer located at the edge area of ​​the wiring board body, so that the front conductive line and the substrate layer of the front wiring layer located at the chip mounting area of ​​the wiring board body are exposed, wherein each photosensitive chip is directly mounted on the chip mounting area of ​​the wiring board body through an adhesive.

[0087] According to one embodiment of the present invention, the camera module further includes a group of electronic components, wherein each of the electronic components is mounted on the solder pad of the front circuit layer of the circuit board body, wherein the molded structure further includes a molded package body, wherein the molded package body extends integrally from the front molded layer to cover the electronic components, and wherein the lens assembly is assembled in the molded package body.

[0088] According to an embodiment of the present invention, the molded package of the molded structure further covers a non-photosensitive area of ​​the photosensitive chip.

[0089] According to an embodiment of the present invention, the molding layer of the molding structure is formed by solidifying an insulating molding material on at least one surface of the circuit board body through a molding mold.

[0090] According to an embodiment of the present invention, the insulating molding material is epoxy resin molding compound.

[0091] According to one embodiment of the present invention, the lens assembly further includes at least one driver, wherein each of the optical lenses is assembled to the driver, and each of the drivers is mounted on the molded circuit board so as to be drivable to keep each of the optical lenses located in the photosensitive path of the corresponding photosensitive chip.

[0092] According to one embodiment of the present invention, the lens assembly further includes at least one lens barrel, wherein each optical lens is assembled in the lens barrel, and each lens barrel is mounted on the molded circuit board to keep each optical lens located in the photosensitive path of the corresponding photosensitive chip.

[0093] According to one embodiment of the present invention, the lens assembly further includes a light deflection mechanism, wherein the light deflection mechanism is arranged in the photosensitive path of the photosensitive chip, and is used to deflect the light entering the light deflection mechanism so that the deflected light is received by the photosensitive element after passing through the optical lens.

[0094] According to one embodiment of the present invention, the camera module further includes a filter component, wherein the filter component is correspondingly arranged between the optical lens and the photosensitive chip, so that the light entering through the optical lens is received by the photosensitive chip after passing through the filter component.

[0095] According to one embodiment of the present invention, the filter assembly includes at least one filter element and a base, wherein each filter element is assembled on the base, and the base is correspondingly arranged at a position corresponding to the edge area of ​​the circuit board body on the molded structure of the molded circuit board, so that each filter element corresponds to the photosensitive path of the corresponding photosensitive element, wherein the lens assembly is assembled on the base.

[0096] According to an embodiment of the present invention, the base is a separately manufactured bracket base or a molded base manufactured by a molding process.

[0097] According to another aspect of the present invention, the present invention also provides an electronic device, comprising:

[0098] an electronic device body; and

[0099] At least one camera module as described above, wherein each camera module is arranged on the electronic device body for acquiring images.

[0100] According to another aspect of the present invention, the present invention also provides an electronic device, wherein the electronic device is configured with at least one molded circuit board as described above.

[0101] Further objects and advantages of the present invention will be fully apparent from an understanding of the following description and accompanying drawings.

[0102] These and other objects, features and advantages of the present invention will be more fully understood from the following detailed description, accompanying drawings and claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0103] Figure 1 It is a three-dimensional schematic diagram of a camera module according to a first embodiment of the present invention.

[0104] Figure 2 A cross-sectional schematic diagram of the camera module according to the first embodiment of the present invention is shown.

[0105] Figure 3A A schematic diagram showing one of the manufacturing processes of the molded circuit board according to the first embodiment of the present invention is shown.

[0106] Figure 3B A schematic diagram shows the second manufacturing process of the molded circuit board according to the first embodiment of the present invention.

[0107] Figure 4A A first modified embodiment of the molded wiring board according to the first embodiment of the present invention is shown.

[0108] Figure 4B A second modified embodiment of the molded wiring board according to the first embodiment of the present invention is shown.

[0109] Figure 4C A third modified embodiment of the molded wiring board according to the first embodiment of the present invention is shown.

[0110] Figure 4D A fourth modified embodiment of the molded wiring board according to the first embodiment of the present invention is shown.

[0111] Figure 4E A fifth modified embodiment of the molded wiring board according to the first embodiment of the present invention is shown.

[0112] Figure 5A A first variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0113] Figure 5B A second variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0114] Figure 5C A first variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0115] Figure 5D A second variant implementation of the camera module according to the above-mentioned first embodiment of the present invention is shown.

[0116] Figure 6 A cross-sectional schematic diagram of a camera module according to a second embodiment of the present invention is shown.

[0117] Figure 7 A schematic diagram of the manufacturing process of the molded circuit board of the camera module according to the above-mentioned second embodiment of the present invention is shown.

[0118] Figure 8A A first variant implementation of the camera module according to the second embodiment of the present invention is shown.

[0119] Figure 8B A second variant implementation of the camera module according to the above-mentioned second embodiment of the present invention is shown.

[0120] Figure 9 1 is a flow chart of a method for manufacturing a camera module according to an embodiment of the present invention.

[0121] Figure 10A A first example of manufacturing a molded circuit board in the method for manufacturing the camera module according to the above embodiment of the present invention is shown.

[0122] Figure 10B A second example of manufacturing a molded circuit board in the method for manufacturing the camera module according to the above embodiment of the present invention is shown.

[0123] Figure 10C A third example of manufacturing a molded circuit board in the method for manufacturing the camera module according to the above embodiment of the present invention is shown.

[0124] Figure 11 A modified implementation of the method for manufacturing the camera module according to the above embodiment of the present invention is shown.

[0125] Figure 12 A schematic perspective view of an electronic device according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0126] The following description is intended to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are for illustrative purposes only, and those skilled in the art will readily appreciate other obvious variations. The basic principles of the present invention defined in the following description may be applied to other embodiments, variations, improvements, equivalents, and other technical solutions that do not depart from the spirit and scope of the present invention.

[0127] Those skilled in the art should understand that, in the disclosure of the present invention, the terms "longitudinal", "transverse", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like to indicate orientations or positional relationships are based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the above terms should not be understood as limiting the present invention.

[0128] In the present invention, the term "a" or "an" in the claims and the specification should be understood as "one or more." That is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple. Unless the disclosure of the present invention clearly indicates that the number of the element is only one, the term "a" or "an" should not be understood as a unique or singular element, and the term "a" or "an" should not be understood as a limitation on the quantity.

[0129] In the description of the present invention, it should be understood that the terms "first", "second", etc. are used for descriptive purposes only and should not be understood as indicating or implying relative importance. In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "connected" and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through a medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0130] In the description of this specification, the reference terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0131] As an essential component of electronic equipment, circuit boards primarily provide mechanical support for the fixation and assembly of various electronic components, such as integrated circuits. Circuit boards typically include single-sided, double-sided, and multi-layer boards. Since the surfaces of various circuit boards typically have exposed circuits, vias, pads, and substrates, existing technologies typically apply an ink layer to the surface of the circuit board through printing, curtain coating, spraying, or roller coating. For example, a layer of ink is first applied by spraying, and then the conductive pattern on the film is transferred to the ink on the circuit board using the photosensitivity of a photoresist. The ink is then irradiated with ultraviolet light. Since the transparent portions of the film outside the conductive pattern transmit ultraviolet light, the corresponding ink on the circuit board surface undergoes photopolymerization, transforming from monomers to polymers. Finally, a weak alkaline solution is used to remove the unphotopolymerized ink on the circuit board surface, exposing the copper surface. This is done to provide solder resistance, insulation, and protect the circuit board.

[0132] However, as the performance of electronic devices becomes higher and higher, the chips or other devices mounted on the circuit board will generate more heat, and the heat dissipation performance of the ink is relatively poor, which will seriously affect the heat dissipation of the circuit board, thereby causing the performance of the electronic device to decline. In particular, for camera modules, the photosensitive chip of the camera module is usually directly mounted on the circuit board. Due to the presence of the ink layer, the heat dissipation capacity of the circuit board is relatively poor, which in turn affects the heat dissipation of the photosensitive chip, resulting in a serious decline in the performance of the camera module. In addition, due to the inherent defects in the layout process of the ink layer (printing, curtain coating, spraying or roller coating, etc.), that is, the surface of the ink layer is not flat, so for electronic devices such as camera modules that need to mount the chip directly on the circuit board, the ink layer on the circuit board will cause the chip to be mounted on the circuit board. There are problems such as tilting and bending, which will cause errors in the assembly of the electronic device and cause the performance of the electronic device to decline. Therefore, in order to solve the above problems, the present invention provides a molded circuit board and a method for manufacturing the same, which can improve the heat dissipation performance and / or flatness of the circuit board, and help improve the performance of various electronic devices equipped with the molded circuit board.

[0133] It is worth mentioning that although Figures 1 to 8B In the following description, the circuit board of the camera module is used as an example to illustrate the features and advantages of the molded circuit board of the present invention. It can be understood by those skilled in the art that the attached Figures 1 to 8B The molded circuit board disclosed in the following description is only an example and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the molded circuit board, the molded circuit board can also be used as other electronic devices such as e-books, AR glasses, robots, computers, etc., and the present invention will not go into details about this.

[0134] Reference to the accompanying drawings Figures 1 to 3BAs shown, a molded circuit board and a manufacturing method thereof and a camera module according to an embodiment of the present invention are explained. Specifically, as Figure 1 and Figure 2 As shown, the camera module 1 includes a lens assembly 10, at least one photosensitive chip 20 and a molded circuit board 30, wherein each photosensitive chip 20 is mounted on the molded circuit board 30, and each photosensitive chip 20 is electrically connected to the molded circuit board 30, wherein the lens assembly 10 includes at least one optical lens 11, wherein the lens assembly 10 is correspondingly arranged on the molded circuit board 30, and each optical lens 11 is located in the photosensitive path of the corresponding photosensitive chip 20 to assemble the camera module 1.

[0135] In particular, if Figure 2 and Figure 3A As shown, the molded circuit board 30 includes a circuit board body 31 and a molded structure 32. The circuit board body 31 includes at least one circuit layer 310 and at least one substrate layer 314. The circuit layer 310 and the substrate layer 314 are stacked with an interval. The molded structure 32 includes a molded layer 321. The molded layer 321 is stacked on at least one surface of the circuit board body 31 to cover at least a portion of the substrate layer 314 of the circuit board body 31. It is understood that the substrate layer 314 of the circuit board body 31 can be made of, but is not limited to, polyimide film (PI film) or polypropylene (PP).

[0136] Specifically, the molding layer 321 of the molding structure 32 is formed by curing an insulating molding material 320 on at least one surface of the circuit board body 31 using a molding die. It is understood that because the molding structure 32 is directly and integrally formed onto the surface of the circuit board body 31 through a molding process, the molding structure 32 not only improves the flatness of the circuit board body 31 to provide a highly flat chip mounting surface, but also directly bonds to the circuit board body 31, increasing the bonding strength between the two, preventing the molding structure 32 from loosening or falling off, and helping to extend the service life of the molding structure 32.

[0137] It is worth noting that in the present invention, the thickness of the mold layer 321 of the mold structure 32 is between 10 microns and 100 microns. Preferably, the thickness of the mold layer 321 of the mold structure 32 is between 10 microns and 50 microns. It is understood that the thickness of the circuit layer 310 of the circuit board body 31 is typically between 10 microns and 50 microns (generally around 25 microns), and the thickness of the ink layer in a conventional circuit board is also around 25 microns.

[0138] Preferably, the heat dissipation efficiency of the insulating molding material 320 is greater than that of the ink material, so that the heat dissipation performance of the molded circuit board 30 is better than the heat dissipation performance of the circuit board with an ink layer, which helps to improve the overall heat dissipation performance of the camera module 1.

[0139] More preferably, the insulating molding material 320 is implemented as an epoxy molding compound (English: Epoxy Molding Compound; abbreviated as: EMC material), which enables the molded circuit board 30 to avoid the problem of dirt caused by the rupture of the ink layer like the existing circuit board, which helps to improve the protection of the circuit board body. It can be understood that since the heat dissipation efficiency of EMC materials is usually between 1W and 3W, and the heat dissipation efficiency of ink materials is usually only 0.2W, the molded circuit board 30 of the present invention has better heat dissipation performance than traditional ink circuit boards, which is conducive to meeting the high-performance development needs of current electronic devices. Of course, in other examples of the present invention, the insulating molding material 320 can also be implemented as other insulating molding materials with good heat dissipation performance, as long as the heat dissipation efficiency is better than that of ink materials, and the present invention will not be repeated here.

[0140] It is worth mentioning that although Figures 1 to 5D In the following description, the camera module 1 includes only one optical lens 11 and one photosensitive chip 20 as an example to illustrate the features and advantages of the camera module 1 of the present invention. It can be understood by those skilled in the art that the attached Figures 1 to 5D The camera module 1 disclosed in the following description is only an example and does not constitute a limitation on the content and scope of the present invention. For example, in other examples of the camera module, the number of the optical lens 11 and the photosensitive chip 20 can be more than one to form an array camera module. In addition, the type of the optical lens 10 can be adjusted accordingly according to the requirements of the camera module. For example, the optical lens 10 can be implemented as an integrated optical lens, a split optical lens, a bare lens, or an optical lens including a lens barrel, etc. The present invention does not limit this. The type of the circuit board body 31 of the molded circuit board 30 can be adjusted accordingly according to the requirements of the camera module. For example, in this embodiment of the present invention, the circuit board body 31 can be implemented as a multi-layer circuit board. In other examples of the present invention, the circuit board body 31 can also be implemented as other types of circuit boards such as a single-sided circuit board or a double-sided circuit board.

[0141] For example, Figure 2 He Ru Figure 3AAs shown, in this embodiment of the present invention, the circuit layer 310 of the circuit board body 31 of the molded circuit board 30 includes a front circuit layer 311, at least one intermediate circuit layer 312, and a rear circuit layer 313, wherein all the substrate layers 314 are stacked, wherein the front circuit layer 311 and the rear circuit layer 312 are respectively stacked on the outermost sides of the substrate layers 314, and each intermediate circuit layer 312 is stacked between adjacent substrate layers 314, to form the circuit board body 31 through lamination. It is understood that the front circuit layer 311, the intermediate circuit layer 312, and the rear circuit layer 313 can be electrically connected through, but not limited to, conductive vias (not shown) provided in the circuit board body 31. Of course, the circuit board body 31 can also be formed by stacking a front circuit layer 311 and a substrate layer 314 on each other to serve as a single-sided circuit board; or, the circuit board body 31 can also be formed by stacking a front circuit layer 311, a substrate layer 314 and a back circuit layer 313 on each other to serve as a double-sided circuit board.

[0142] It is worth noting that the present invention defines the front circuit layer 311, the middle circuit layer 312 and the back circuit layer 313 respectively according to the different positions of the circuit layer 310 in the circuit board body 31. For example, the circuit layer 310 located on the front of the circuit board body 31 is defined as the front circuit layer 311, the circuit layer 310 located in the middle of the circuit board body 31 is defined as the middle circuit layer 312, and the circuit layer 310 located on the back of the circuit board body 31 is defined as the back circuit layer 313. It can be understood that in the present invention, the surface of the circuit board body 31 for attaching the photosensitive chip 20 is defined as the front of the circuit board body 31 (such as Figure 2 The surface of the circuit board body 31 opposite to the surface on which the photosensitive chip 20 is attached is defined as the reverse side of the circuit board body 31 (e.g. Figure 2 The lower surface of the circuit board body 31 described in FIG.

[0143] Furthermore, in this embodiment of the present invention, Figure 2 and Figure 3AAs shown, the front circuit layer 311 of the circuit board body 31 of the molded circuit board 30 includes a front conductive circuit 3111 and a group of pads 3112, wherein each of the pads 3112 can be conductively connected to the front conductive circuit 3111; the back circuit layer 313 only includes a back conductive circuit 3131, and does not include any pads. In other words, in this embodiment of the present invention, all the pads are concentrated on the front of the circuit board body 31, so that various electronic components and the photosensitive chip 20 can only be set on the front of the circuit board body 31, which is conducive to reducing the height of the molded circuit board 30, and then reducing the overall height of the camera module 1. Of course, in other examples of the present invention, the back circuit layer 313 may also include pads for soldering various electronic components, which will not be described in detail in the present invention.

[0144] It is worth noting that Figure 2 As shown, the circuit board body 31 has a chip mounting area 3101 and an edge area 3102, wherein the edge area 3102 is located around the chip mounting area 3101, and the solder pads 3112 are located in the edge area 3102 of the circuit board body 31. Thus, when the photosensitive chip 20 is mounted on the chip mounting area 3101 of the circuit board body 31 of the molded circuit board 30, the photosensitive chip 20 can be electrically connected to the solder pads 3112 via wires, thereby providing electrical connection between the photosensitive chip 20 and the molded circuit board 30. Of course, in other examples of the present invention, when the solder pads of the photosensitive chip 20 are located on the non-photosensitive surface of the photosensitive chip 20 (such as the reverse side of the photosensitive chip 20), the solder pads 3112 of the front circuit layer 311 may also be located in the chip mounting area 3101 of the circuit board body 31, which will not be further described in the present invention.

[0145] Preferably, the surface of the front conductive traces 3111 of the front circuit layer 311 is flush with the surface of the pads 3112 of the front circuit layer 311. For example, the front conductive traces 3111 and the pads 3112 of the front circuit layer 311 of the circuit board body 31 are etched from a single piece of copper foil to ensure that the surface of the front conductive traces 3111 is flush with the surface of the pads 3112. Of course, in other examples of the present invention, the front conductive traces 3111 and the pads 3112 may also be manufactured using other processes, which will not be further described herein.

[0146] According to the above embodiments of the present invention, Figure 3AAs shown, the molding layer 321 of the molding structure 32 of the molded circuit board 30 includes a front molding layer 3211, wherein the front molding layer 3211 is stacked on the front surface of the circuit board body 31 to cover the substrate layer 314 located on the front surface of the circuit board body 31. In particular, the front molding layer 3211 can simultaneously cover the surface of the front conductive traces 3111 of the front circuit layer 311 (i.e., the front molding layer 3211 simultaneously covers the conductive traces 3111 located in the chip attaching area 3101 and the edge area 3102 of the circuit board body 31) and the surface of the substrate layer 314 located on the front surface of the circuit board body 31, and the front molding layer 3211 does not cover the surface of the pads 3112 of the front circuit layer 311.

[0147] In other words, the molding layer 321 of the molding structure 32 of the molded circuit board 30 includes a front molding layer 3211 formed by curing the insulating molding material 320 on the front surface of the circuit board body 31 through a molding process. The surfaces of the solder pads 3112 of the front wiring layer 311 are exposed because they are not covered by the front molding layer 3211, while the surfaces of the front conductive traces 3111 of the front wiring layer 311 and the surface of the substrate layer 314 located on the front surface of the circuit board body 31 are protected because they are covered by the front molding layer 3211. It can be understood that precisely because the solder pads 3112 are exposed and the front conductive traces 3111 are covered by the front molding layer 3211, the front molding layer 3211 of the molding structure 32 can perfectly replace the ink layer to provide solder mask insulation and protect the circuit board. At the same time, since the heat dissipation efficiency of the insulating molding material 320 used to form the front molding layer 3211 is greater than that of the ink material, the front molding layer 3211 can also improve the heat dissipation performance of the molded circuit board 30.

[0148] When manufacturing the molded circuit board 30, a circuit board body 31 can be placed in a molding mold 50 for a molding process, so that the insulating molding material 320 is solidified on the front side of the circuit board body 31 to form the front molding layer 3211 of the molding structure 32, wherein the front molding layer 3211 covers the surface of the front conductive line 3111 of the front circuit layer 311 and the surface of the substrate layer 314 located on the front side of the circuit board body 31, and leaves the solder pad 3112 exposed to the outside for power supply connection to various electronic components and chips.

[0149] Specifically, if Figure 3AAs shown, the molding die 50 includes an upper mold 51, wherein the upper mold 51 can be moved to perform mold closing and demolding operations. When the molding die 50 is in the mold closing state, a front molding space 510 is formed between the upper mold 51 and the front surface of the circuit board body 31. The front molding layer 3211 of the module structure 32 is formed by adding the insulating molding material into the front molding space 510 and curing it. It is understood that the height of the front molding space 510 of the molding die 50 is between 10 microns and 100 microns. Preferably, the height of the front molding space 510 of the molding die 50 is between 10 microns and 50 microns, so as to mold the front molding layer 321 that meets the thickness requirements.

[0150] More specifically, if Figure 3A As shown, the upper mold 51 of the molding mold 50 has a pressing surface 511 and an upper molding surface 512, wherein the pressing surface 511 of the upper mold 51 corresponds to the pads 3112 of the front circuit layer 311 of the circuit board body 31, and the pressing surface 511 of the upper mold 51 is lower than the upper molding surface 512 of the upper mold 51 (that is, the upper mold 51 has a stepped inner surface), so that when the pressing surface 511 of the upper mold 51 is pressed on the corresponding pad 3112, a gap is still left between the upper molding surface 512 of the upper mold 51 and the front conductive circuit 3111, so as to ensure that the insulating molding material 320 can enter the gap between the upper molding surface 512 of the upper mold 51 and the front conductive circuit 3111, so that the solidified front molding layer 3211 can cover the front conductive circuit 3111 to protect the front conductive circuit 3111.

[0151] For example, Figure 3A As shown, after the circuit board body 31 is placed on the upper mold 51, the upper mold 51 is operated to close the mold so that the pressing surface 511 of the upper mold 51 is pressed against the surface of the solder pad 3112, and the front molding space 510 is formed between the upper molding surface 512 of the upper mold 51 and the surface of the front conductive line 3111 of the front circuit layer 311 and the surface of the substrate layer 314; then, the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 that simultaneously covers the front conductive line 3111 and the substrate layer 314 after curing, thereby making the molded circuit board 30 (or molded circuit board semi-finished product); finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to demold and remove the molded circuit board 30 (or molded circuit board semi-finished product) from the molding mold 50.

[0152] It is worth noting that Figure 3A As shown, it is precisely because the pressing surface 511 of the upper mold 51 applies pressure to the surface of the pad 3112 during the molding process that the insulating molding material 320 cannot cover the surface of the pad 3112. Therefore, a groove 3210 will be formed at the position corresponding to the pad 3112 on the front molding layer 3211 formed by curing the insulating molding material 320, so that the surface of the pad 3112 is exposed, so that various electronic components can be electrically connected to the molded circuit board 30. In particular, when electronic components are soldered to the soldering pads 3112 to be electrically connected to the molded circuit board 30, the presence of the groove 3210 at the position corresponding to the soldering pads 3112 on the front molding layer 3211 can effectively prevent the molten solder from flowing out. Therefore, the molding structure 32 can improve the structural strength and heat dissipation performance of the molded circuit board 30 while avoiding the waste of resources caused by the outflow of molten solder, and also helps to improve the welding performance at the soldering pads 3112.

[0153] Furthermore, because the front molding layer 3211 is integrally formed through a molding process, it provides a flat chip mounting surface for mounting the photosensitive chip 20, thereby reducing the possibility of tilting or bending the photosensitive chip 20 during mounting, helping to reduce mounting errors and improve the performance of the camera module 1. Even for larger photosensitive chips, the front molding layer 3211 can control chip mounting errors within a controllable range, ensuring high performance of the camera module 1.

[0154] Attachment Figure 4A A first variant embodiment of the molded circuit board 30 of the camera module 1 according to the above-described embodiment of the present invention is shown. Compared to the above-described embodiment of the present invention, the molded circuit board 30 according to the first variant embodiment of the present invention differs in that the front molded layer 3211 of the molded structure 32 only covers the surface of the substrate layer 314 of the circuit board body 31, but does not cover the front conductive traces 3111 and the solder pads 3112 of the front circuit layer 311. In other words, the front conductive traces 3111 and the solder pads 3112 of the front circuit layer 311 are exposed.

[0155] Specifically, if Figure 4AAs shown, the upper mold 51 of the molding mold 50 only has a pressing surface 511 (that is, the upper mold 51 has a flat inner surface), so that when the pressing surface 511 of the upper mold 51 is pressed on the solder pad 3112, there is no gap between the pressing surface 511 of the upper mold 51 and the front conductive circuit 3111, so that the solidified front molding layer 3211 only covers the surface of the substrate layer 314 of the circuit board body 31, while the front conductive circuit 3111 and the solder pad 3112 of the front circuit layer 311 are exposed.

[0156] For example, Figure 4A As shown, after the circuit board body 31 is placed on the upper mold 51, the upper mold 51 is operated to close the mold so that the pressing surface 511 of the upper mold 51 is pressed on the surface of the pad 3112 and the surface of the front conductive line 3111 at the same time, and the front molding space 510 is formed between the pressing surface 511 of the upper mold 51 and the surface of the substrate layer 314 of the circuit board body 31; then, the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 that only covers the surface of the substrate layer 314 after curing, thereby making the molded circuit board 30; finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to demold and remove the molded circuit board 30 from the molding mold 50.

[0157] It is worth noting that in the first variant embodiment of the present invention, since the front conductive line 3111 of the front circuit layer 311 of the circuit board body 31 is still exposed outside the front molded layer 3211, the front conductive line 3111 still has the risk of mechanical damage and short circuit. Therefore, in order to solve this problem, the present invention further provides a second variant embodiment of the molded circuit board 30 based on the above-mentioned first variant embodiment. Specifically, Figure 4B As shown, the molded structure 32 further includes an insulating protective layer 322, wherein the insulating protective layer 322 is correspondingly arranged on the surface of the front conductive line 3111 of the front circuit layer 311 to cover the front conductive line 3111 and prevent the front conductive line 3111 from being mechanically damaged or short-circuited.

[0158] Preferably, the insulating protective layer 322 of the molded structure 32 is formed by curing an insulating molding material on the exposed surface of the front conductive trace 311 through a molding process after the front molded layer 3211 is formed, so that the exposed surface of the front conductive trace 311 is further covered by the insulating protective layer 322. Of course, in other embodiments of the present invention, the insulating protective layer 322 can also be provided on the exposed surface of the front conductive trace 311 by methods such as gluing, applying glue, or coating.

[0159] Attachment Figure 4C A third variant embodiment of the molded circuit board 30 of the camera module 1 according to the above-mentioned embodiment of the present invention is shown. Compared with the above-mentioned embodiment of the present invention, the molded circuit board 30 according to the third variant embodiment of the present invention is different in that: when manufacturing the molded circuit board 30, the upper mold 51 of the molding mold 50 used has only an upper molding surface 512 (i.e., the upper mold 51 has a flat inner surface), and when the molding mold 50 is in the mold closing state, the upper molding surface 512 of the upper mold 51 does not contact the front conductive traces 311 and the solder pads 3112 of the front circuit layer 311, so that the solidified front molding layer 3211 simultaneously covers the surface of the substrate layer 314 of the circuit board body 31 as well as the front conductive traces 311 and the solder pads 3112 of the front circuit layer 311. Afterwards, the molding is thinned by grinding or the like, so that the groove 3210 is formed at a position of the front molding layer 3211 corresponding to the pad 3112 , so that the pad 3112 of the front circuit layer 311 is exposed.

[0160] For example, Figure 4CAs shown, first, after the circuit board body 31 is placed on the upper mold 51, the upper mold 51 is operated to close the mold so that the upper molding surface 512 of the upper mold 51 does not abut against the front conductive line 311 and the solder pad 3112 of the front circuit layer 311, so as to form the front molding space 510 between the inner surface of the upper mold 51 and the front of the circuit board body 31; then, the insulating molding material 320 is injected into the front molding space 510 to form a covering of the circuit board body 31 after solidification. The front conductive lines 311 of the front wiring layer 311 and the front molding layer 3211 of the solder pads 3112 are formed to produce the semi-finished molded circuit board. After the insulating molding material 320 is solidified to form the front molding layer 3211, the upper mold 51 is operated to perform demolding to remove the semi-finished molded circuit board from the molding mold 50. Finally, the grooves 3210 are formed on the front molding layer 3211 at positions corresponding to the solder pads 3112, thereby producing the molded circuit board 30. Of course, in other examples of the present invention, the front molding layer 3211 can also be thinned by grinding so that the front conductive lines 311 and the solder pads 3112 of the front wiring layer 311 are exposed.

[0161] It is worth noting that since the inner surface of the upper mold 51 does not rest against the front conductive line 311 and the solder pad 3112 of the front circuit layer 311, the distance between the inner surface of the upper mold 51 and the front of the circuit board body 31 is increased, so the front molding space 510 becomes larger, making it easier for the insulating molding material 320 to flow to fill the front molding space 510, which helps to complete the molding process.

[0162] Attachment Figure 4D A fourth variant embodiment of the molded circuit board 30 of the camera module 1 according to the above-described embodiment of the present invention is shown. Compared to the above-described embodiment of the present invention, the molded circuit board 30 according to the fourth variant embodiment of the present invention differs in that the surface of the front conductive traces 3111 of the front circuit layer 311 of the circuit board body 31 is lower than the surface of the pads 3112 of the front circuit layer 311. In other words, the height of the front conductive traces 3111 is lower than the height of the pads 3112. This allows the pads 3112 of the front circuit layer 311 to remain exposed when the front conductive traces 3111 of the front circuit layer 311 are covered by the front mold layer 3211.

[0163] Specifically, if Figure 4DAs shown, when manufacturing the molded circuit board 30, the front conductive line 3111 of the front circuit layer 311 is first etched through an etching process to reduce the height of the front conductive line 3111 of the front circuit layer 311, so that the height of the front conductive line 3111 is less than the height of the pad 3112; and then the front mold layer 3211 is formed on the front of the circuit board body 31 through the molding mold 50 through a molding process, so that the front conductive line 3111 of the front circuit layer 311 is covered by the front mold layer 3211, and the pad 3112 of the front circuit layer 311 can still be exposed. Of course, in other examples of the present invention, when manufacturing the molded circuit board 30, metal can be first deposited on the pad 3112 of the front circuit layer 311 through a deposition process to increase the height of the pad 3112 of the front circuit layer 311, so that the height of the pad 3112 is greater than the height of the front conductive line 3111; and then the front molded layer 3211 is formed on the front of the circuit board body 31 through a molding mold through a molding process, so that the front conductive line 3111 of the front circuit layer 311 is covered by the front molded layer 3211, and the pad 3112 of the front circuit layer 311 can still be exposed.

[0164] For example, Figure 4D As shown, first, the front conductive line 3111 of the front circuit layer 311 of the circuit board body 31 is etched to reduce the height of the front conductive line 3111 so that the surface of the front conductive line 3111 is lower than the surface of the pad 3112; then, the etched circuit board body 31 is placed on the upper mold 51, and the upper mold 51 is operated to close the mold so that the pressing surface 511 of the upper mold 51 is pressed against the surface of the pad 3112, and a gap is still left between the pressing surface 511 of the upper mold 51 and the surface of the front conductive line 3111, so that the upper mold 51 is pressed against the surface of the pad 3112. The front molding space 510 is formed between the pressing surface 511 and the surface of the substrate layer 314 of the circuit board body 31 and the surface of the front conductive line 3111; then, the insulating molding material 320 is injected into the front molding space 510 to form the front molding layer 3211 that only covers the surface of the substrate layer 314 and the surface of the front conductive line 3111 after curing, thereby making the molded circuit board 30; finally, after the insulating molding material 320 is cured to form the front molding layer 3211, the upper mold 51 is operated to perform demolding to remove the molded circuit board 30 from the molding mold 50.

[0165] Attachment Figure 4EThe fifth variant embodiment of the molded circuit board 30 of the camera module 1 according to the above-mentioned embodiment of the present invention is shown. Compared with the above-mentioned embodiment of the present invention, the difference of the molded circuit board 30 according to the fifth variant embodiment of the present invention is that: a panel manufacturing process is adopted, and multiple circuit board bodies 31 are placed in a molding mold at the same time to mold the multiple circuit board bodies 31, thereby forming multiple molded structures 32 at one time. It is worth noting that since multiple circuit board bodies 31 are molded simultaneously and corresponding molded structures 32 are formed on the multiple circuit board bodies 31, this not only improves the manufacturing efficiency of the molded circuit board 30, but also helps to ensure that the molded circuit board 30 can provide a flat chip mounting surface.

[0166] For example, Figure 4E As shown, after placing the two combined circuit board bodies 31 on the corresponding upper mold 51, the upper mold 51 is operated to close the mold so that the pressing surface 511 of the upper mold 51 is pressed against the surface of the solder pad 3112, and the pressing head 513 of the upper mold 51 is pressed against the joint of the circuit board bodies 31, wherein the upper molding surface 512 of the upper mold 51 and the front conductive line 3111 of the front circuit layer 311 of each circuit board body 31 and the surface of the substrate layer 314 are separated. Each of the front molding spaces 510 is formed; then, the insulating molding material 320 is injected into each of the front molding spaces 510 to form the front molding layer 3211 that simultaneously covers the front conductive traces 3111 and the substrate layer 314 after curing, thereby producing a semi-finished molded circuit board. Finally, after operating the upper mold 51 to perform demolding to remove the semi-finished molded circuit board, the semi-finished molded circuit board is cut along the junction of the two circuit board bodies 31 to obtain two molded circuit boards 30. It will be understood that in this embodiment of the present invention, because the pressing head 513 of the upper mold 51 is directly pressed against the circuit board body 31, at least a portion of the circuit board body 31 of the molded circuit board 30 (such as at least one side of the circuit board body 31) is not covered by the front molding layer 3211 and is exposed, that is, there is at least one exposed portion on the circuit board body 31 of the molded circuit board 30. Of course, in other examples of the present invention, the exposed portion of the circuit board body 31 of the molded circuit board 30 may be subsequently covered with other insulating materials, or the exposed portion of the circuit board body 31 of the molded circuit board 30 may be directly cut off.

[0167] It is worth mentioning that in the above embodiments of the present invention, Figure 2 and Figure 3BAs shown, the molding layer 321 of the molding structure 32 of the molded circuit board 30 may further include a reverse molding layer 3212 formed by curing the insulating molding material 320 on the reverse side of the circuit board body 31 through a molding process, wherein the reverse molding layer 3212 covers the surface of the reverse conductive traces 3131 of the reverse circuit layer 313 and the surface of the substrate layer 314 located on the reverse side of the circuit board body 31 to protect the reverse conductive traces 3131. It will be understood that in this embodiment of the present invention, since the reverse circuit layer 313 of the circuit board body 31 only includes the reverse conductive traces 3131 and does not include solder pads, the process of molding the reverse molding layer 3212 does not need to consider whether the solder pads are exposed, and the molding can be performed directly using the molding die 50. Of course, in other examples of the present invention, the molding structure 32 of the molded circuit board 30 may also only include the reverse molding layer 3212 or the front molding layer 3211, and the surface of the circuit board body 31 without the molding layer may be provided with an ink layer.

[0168] Specifically, if Figure 3B As shown, the molding mold 50 further includes a lower mold 52, wherein the lower mold 52 can be moved to perform mold closing and demolding operations, and when the molding mold 50 is in the mold closing state, a reverse molding space 520 is formed between the lower mold 52 and the reverse side of the circuit board body 31, wherein the reverse molding layer 3212 of the module structure 32 is formed by adding the insulating molding material into the reverse molding space 520 and curing.

[0169] More specifically, if Figure 3B As shown, the lower mold 52 of the molding mold 50 has a flat lower molding surface 521. When the circuit board body 31 is placed on the lower mold 52, a reverse molding space 520 is formed between the lower molding surface 521 of the lower mold 52 and the reverse side of the circuit board body 31. After the insulating molding material 320 is cured in the reverse molding space 520, it forms the reverse molding layer 3212 that covers both the reverse conductive traces 3131 of the reverse circuit layer 313 and the substrate layer 314. Of course, in other examples of the present invention, the reverse molding layer 3212 may only cover the substrate layer 314 on the reverse side of the circuit board body 31, without covering the reverse conductive traces 3131 of the reverse circuit layer 313, so that the reverse conductive traces 3131 are exposed.

[0170] For example, Figure 3BAs shown, after the circuit board body 31 is placed on the lower mold 52, the lower mold 52 is operated to close the mold to form the reverse molding space 520 between the lower molding surface 521 of the lower mold 52 and the reverse side of the circuit board body 31; then, the insulating molding material 320 is injected into the reverse molding space 520 to form the reverse molding layer 3212 that simultaneously covers the reverse conductive line 3131 and the substrate layer 314 after curing; finally, after the insulating molding material 320 is cured to form the reverse molding layer 3212, the lower mold 52 is operated to demold and remove the molded circuit board 30 from the molding mold 50.

[0171] It is worth noting that the molding layer 321, the reverse molding layer 3212, and the front molding layer 3211 of the molding structure 32 can be molded together by the molding mold 50 through a molding process. Alternatively, the reverse molding layer 3212 and the front molding layer 3211 of the molding structure 32 can also be molded separately through a molding process. Of course, the reverse molding layer 3212 can be molded by the lower mold 52 of the molding mold 50 after the front molding layer 3211 is molded, or it can be molded by the lower mold 52 of the molding mold 50 before the front molding layer 3211 is molded. The present invention does not impose any further restrictions on this.

[0172] In addition, in order to further enhance the heat dissipation capability of the molded circuit board 30, the circuit board body 31 of the molded circuit board 30 may further include a copper cladding layer (not shown in the figure), wherein the copper cladding layer and the reverse circuit layer 313 are arranged at intervals on the reverse side of the circuit board body 31, so that the copper cladding layer does not contact the reverse conductive line 3131 of the reverse circuit layer 313, which is beneficial to enhancing the heat dissipation performance of the molded circuit board 30 through the copper cladding layer.

[0173] Furthermore, the reverse mold layer 3212 can be molded in the same manner as the front mold layer 3211, so that the reverse mold layer 3212 only covers the reverse conductive traces 3131 of the reverse circuit layer 313, but does not cover the copper clad layer, leaving the copper clad layer exposed. This maximizes the heat dissipation performance of the molded circuit board 30. In other words, during the molding process of the reverse mold layer 3212, the copper clad layer can be exposed outside the reverse mold layer 3212 in the same manner as the pads 3112 are exposed outside the front mold layer 3211 in the above-described embodiment. This description will not be repeated herein.

[0174] According to the above embodiments of the present invention, Figure 2As shown, the molded circuit board 30 further includes a group of electronic components 33, and each of the electronic components 33 can be mounted on the pads 3112 of the front circuit layer 311 of the circuit board body 31 by a process such as SMT (Surface Mount Technology). It is worth mentioning that in this embodiment of the present invention, the photosensitive chip 20 and each of the electronic components 33 can be mounted after the front molding layer 3211 of the molded circuit board 30 is formed, and the photosensitive chip 20 is mounted on the chip mounting surface of the front molding layer 3211 to correspond to the chip mounting area 3101 of the circuit board body 31, and each of the electronic components 33 is mounted on the pads 3112 to correspond to the edge area 3102 of the circuit board body 31. It should be understood that in the camera module of the present invention, the type of the electronic components 33 is not limited. For example, the electronic components 33 can be implemented as resistors, capacitors, drive devices, etc.

[0175] In addition, after the photosensitive chip 20 is mounted on the front molding layer 3211 of the molding structure 32 of the molded circuit board 30, the photosensitive chip 20 can be electrically connected to the solder pad 3112 of the front circuit layer 311 through a gold wire punching process to conduct electricity between the photosensitive chip 20 and the molded circuit board 30.

[0176] It is worth mentioning that Figure 2 As shown, in the above-mentioned first embodiment of the present invention, the camera module 1 further includes a filter component 40, wherein the filter component 30 is correspondingly arranged between the optical lens 11 and the photosensitive chip 20 of the lens assembly 10, so that the light entering through the optical lens 11 is received by the photosensitive chip 20 after passing through the filter component 40, thereby improving the imaging quality of the camera module 1.

[0177] Specifically, the filter assembly 40 includes a filter element 41 and a base 42, wherein the filter element 41 is assembled on the base 42, and the base 42 is correspondingly arranged on the front molded layer 3211 of the molded structure 32 of the molded circuit board 30 at a position corresponding to the edge area 3102 of the circuit board body 31, so that the filter element 41 is located between the photosensitive chip 20 and the optical lens 11, and the filter element 41 also corresponds to the photosensitive path of the photosensitive chip 20, wherein the size of the filter element 31 is larger than the size of the photosensitive area of ​​the photosensitive chip 20, so as to ensure that the light entering the interior of the camera module 1 from the optical lens 11 is filtered by the filter element 41 before being received by the photosensitive chip 20 for photoelectric conversion, thereby improving the imaging quality of the camera module 1. For example, the filter element 41 can filter the infrared part of the light entering the interior of the camera module 1 from the optical lens 11.

[0178] Preferably, the base 42 is implemented as a separately manufactured bracket base 421, wherein the bracket base 421 is bonded to the front mold layer 3211 so that while the filter element 41 assembled on the bracket base 421 is maintained in the photosensitive path of the photosensitive chip 20, the bracket base 421 can also serve as a lens seat for installing the lens assembly 10.

[0179] Furthermore, if Figure 2 As shown, the lens assembly 10 of the camera module 1 may further include a driver 12, wherein the optical lens 11 is drivably assembled to the driver 12, and the driver 12 is assembled to the top surface of the bracket base 421 so that the optical lens 11 is maintained in the light-sensitive path of the photosensitive chip 20. In addition, when the camera module 1 is in use, the driver 12 can drive the optical lens 11 to move back and forth along the light-sensitive path of the photosensitive chip 20, so as to adjust the focal length of the camera module 1 by adjusting the distance between the optical lens 11 and the photosensitive chip 20, so that the camera module 1 is implemented as a zoom camera module. The type of the driver 12 of the camera module 1 of the present invention is not limited. The driver 2 can be implemented as a voice coil motor, which can be electrically connected to the molded circuit board 30 to be in working state after receiving electrical energy and control signals, and drive the optical lens 11 to move back and forth along the light-sensitive path of the photosensitive chip 20. Nevertheless, those skilled in the art will appreciate that the type of the driver 12 is not limited, as long as it can drive the optical lens 11 to move back and forth along the photosensitive path of the photosensitive chip 20 .

[0180] It is worth mentioning that Figure 5AA first variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared to the first embodiment of the present invention, the camera module 1 according to the first variant embodiment of the present invention is implemented as a fixed-focus camera module. That is, in this variant embodiment of the present invention, the lens assembly 10 of the camera module 1 may also not have the driver 12. Specifically, the lens assembly 10 includes a lens barrel 12', wherein the lens barrel 12' is assembled to the top surface of the bracket base 421, and the optical lens 11 is fixedly assembled to the lens barrel 12', so that the optical lens 11 is maintained in the light-sensitive path of the photosensitive chip 20 by the lens barrel 12'. In addition, during the process of assembling the lens barrel 12' to the top surface of the bracket base 421, the angle at which the lens barrel 12' is assembled to the top surface of the bracket base 421 can be adjusted by a calibration device, so that the optical axis of the optical lens 11 can be perpendicular to the light-sensitive surface of the photosensitive chip 20, thereby ensuring the imaging quality of the camera module 1. It is understood that the lens barrel 12 ′ can be manufactured separately, so that the lens barrel 12 ′ can be provided with threads or not, and the present invention is not limited in this respect.

[0181] Attachment Figure 5B A second variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared to the first variant embodiment of the present invention, the base 42 of the filter assembly 40 of the camera module 1 according to the second variant embodiment of the present invention is implemented as a molded base 422, wherein the molded base 422 is formed by solidifying a molding material on the front molding layer 3211 of the molded circuit board 30 at a position corresponding to the edge region 3102 of the circuit board body 31 through a molding process, and the lens barrel 12' is assembled to the top surface of the molded base 422 to maintain the optical lens 11 in the light-sensing path of the photosensitive chip 20 via the lens barrel 12'. That is to say, in this modified embodiment of the present invention, the mold base 422 is first manufactured by a molding process, and then the separately manufactured lens barrel 12' is assembled to the top surface of the mold base 422. In this way, the angle at which the lens barrel 12' is assembled to the top surface of the mold base 422 can be adjusted by a calibration device, so that the optical axis of the optical lens 11 can be perpendicular to the photosensitive surface of the photosensitive chip 20 to ensure the imaging quality of the camera module 1. Of course, in other examples of the present invention, the lens barrel 12' can also extend integrally to the top surface of the mold base 422, that is, the lens barrel 12' and the mold base 422 can be integrally solidified and formed by the molding material through a module process, thereby enhancing the stability and reliability of the camera module 1.

[0182] Preferably, in this variant embodiment of the present invention, Figure 5B As shown, the molded base 422 covers the electronic components 33 on the molded circuit board 30 after molding, and is located around the photosensitive chip 20 mounted on the molded circuit board 30, so as to isolate the adjacent electronic components 33 and isolate the electronic components 33 from the photosensitive chip 20 through the molded base 422.

[0183] Attachment Figure 5C A third variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared to the second variant embodiment of the present invention, the camera module 1 according to the third variant embodiment of the present invention is different in that: after molding, the molded base 422 covers the electronic components 33 on the molded circuit board 30 and the non-photosensitive area of ​​the photosensitive chip 20, so as to securely attach the photosensitive chip 20 to the molded circuit board 30, thereby achieving a compact structure and reducing the impact of dirt on the electronic components and the circuit board body on the photosensitive chip 20.

[0184] Preferably, if Figure 5C As shown, the module base 422 has a stepped structure, providing a lower mounting surface for the filter element 41 and a higher mounting surface for the lens barrel 12', thereby reducing the distance between the filter element 41 and the photosensitive chip 20, thereby helping to reduce the overall height of the camera module 1. It is understandable that because the molded base 422 is integrally formed on the molded circuit board 30 through a mold, the molded base 422 can provide a relatively flat mounting surface, allowing the filter element 41 to be substantially parallel to the photosensitive chip 20 with minimal tilt.

[0185] Attachment Figure 5DThe fourth variant embodiment of the camera module 1 according to the first embodiment of the present invention is shown. Specifically, compared with the first embodiment of the present invention, the camera module 1 according to the fourth variant embodiment of the present invention is implemented as a periscope camera module, that is, the camera module 1 further includes a light deflection mechanism 13, wherein the light deflection mechanism 13 is arranged in the light sensing path of the photosensitive chip 20, and is used to deflect the light incident on the light deflection mechanism 13, so that the light deflected by the light deflection mechanism 13 is received by the photosensitive chip 20 after passing through the optical lens 11. It can be understood that since the periscope camera module can be installed in a "horizontal" installation manner on various electronic device bodies, the height of the periscope array module can be reduced. Therefore, after the periscope array module is installed on the electronic device body, the thickness of the electronic device body will not be increased, thereby complying with the trend of lightweight and thin development of electronic devices.

[0186] Reference to the accompanying drawings Figure 6 and Figure 7 As shown, a camera module 1A according to a second embodiment of the present invention is illustrated. Compared with the above-mentioned first embodiment of the present invention, the difference according to the second embodiment of the present invention is that the molded structure 32A of the molded circuit board 30A of the camera module 1A further includes a molded package body 323A, wherein the molded package body 323A integrally extends from the front molded layer 3211 to replace the base in the filter assembly 40, so that the filter element 41 and the lens assembly 10 can be directly assembled to the molded package body 323A of the molded circuit board 30A, so as to facilitate keeping the filter element 41 and the optical lens 11 of the lens assembly 10 located in the light-sensitive path of the photosensitive chip 20. Preferably, the molded package body 323A covers the electronic components 33 of the molded circuit board 30A, so as to isolate the adjacent electronic components 33 by the molded package body 323A, and isolate the electronic components 33 from the photosensitive chip 20, so as to reduce the contamination of the photosensitive chip 20 by the dirt carried on the electronic components 33.

[0187] Furthermore, if Figure 7As shown, the molded package body 323A and the front molded layer 3211 of the molded structure 32A are formed together by curing the insulating molding material 320 on the front side of the circuit board body 31 through a molding process, so that the electronic components 33 of the molded circuit board 30A are covered by the molded package body 323A, and the surface of the front conductive line 3111 of the front circuit layer 311 and the surface of the substrate layer 314 located on the front side of the circuit board body 31 are covered by the front molded layer 3211, so that the surface of the solder pad 3112 of the front circuit layer 311 is exposed.

[0188] In other words, when manufacturing the molded circuit board 30A, the electronic components 33 can first be mounted on the pads 3112 of the front circuit layer 311 of the circuit board body 31 by soldering; then the circuit board body 31 is placed in a molding mold 50A for a molding process, so that the insulating molding material 320 is solidified on the front of the circuit board body 31 to form the front molding layer 3211 of the molding structure 32A and the molded package 323A, wherein the front molding layer 3211 covers the surface of the front conductive line 3111 of the front circuit layer 311 and the surface of the substrate layer 314 located on the front of the circuit board body 31, and leaves part of the pads 3112 exposed to the outside, and the power supply is connected to the photosensitive chip 20. It is worth noting that since the molded package body 323A and the front molded layer 3211 are integrally formed by the forming mold 50A, the mounting surface provided by the molded package body 323A can maintain good parallelism with the chip mounting surface provided by the front molded layer 3211, which not only helps to ensure that the photosensitive chip 20 and the filter element 41 are parallel to each other, but also helps to ensure that the optical axis of the optical lens 11 is perpendicular to the photosensitive surface of the photosensitive chip 20.

[0189] Specifically, if Figure 7 As shown, the molding mold 50A includes an upper mold 51A, wherein the upper mold 51A can be moved to perform mold closing and demolding operations, and when the molding mold 50A is in the mold closing state, a front molding space 510A is formed between the upper mold 51A and the front surface of the circuit board body 31, wherein the front molding layer 3211 of the module structure 32A and the molded package body 323A are added to the front molding space 510A by the insulating molding material 320 and formed after curing.

[0190] More specifically, if Figure 7As shown, the upper mold 51A of the molding mold 50A has a pressing surface 511A, a first upper molding surface 512A and a second upper molding surface 513A, wherein the pressing surface 511A of the upper mold 51A corresponds to the solder pad 3112 of the front circuit layer 311 of the circuit board body 31, the second upper molding surface 513A of the upper mold 51A is located around the first upper molding surface 512A of the upper mold 51A, and the second upper molding surface 513A of the upper mold 51A corresponds to the electronic component 33. The pressing surface 511A of the upper mold 51A is lower than the first upper molding surface 512A of the upper mold 51A, and the first upper molding surface 512A of the upper mold 51A is lower than the second upper molding surface 513A of the upper mold 51A (that is, the upper mold 51A has a stepped inner surface), so that when the pressing surface 511A of the upper mold 51A is pressed against the corresponding solder pad 3112, a gap is still left between the first upper molding surface 512A of the upper mold 51A and the front conductive line 3111, and the A gap is left between the second upper molding surface 513A and the top surface of the electronic component 33 to ensure that the insulating molding material 320 can enter the gap between the first upper molding surface 512A and the front conductive line 3111 and the gap between the second upper molding surface 513A and the electronic component 33, so that the cured front molding layer 3211 can cover the front conductive line 3111, and the cured molded package 323A can cover the electronic component 33 to protect the front conductive line 3111 and the electronic component 33.

[0191] For example, Figure 7As shown, the electronic component 33 is first mounted on the pad 3112 on the upper portion of the front circuit layer 311 of the circuit board body 31; after the circuit board body 31 is placed on the upper mold 51A, the upper mold 51A is operated to close the mold so that the pressing surface 511A of the upper mold 51A is pressed against the surface of the remaining pad 3112 on the front circuit layer 311, and between the first and second upper molding surfaces 512A, 513A of the upper mold 51A and the front conductive circuit 3111 of the front circuit layer 311, the substrate layer 314 and the surface of the electronic component 33. The front molding space 510A is formed; then, the insulating molding material 320 is injected into the front molding space 510A to form the front molding layer 3211 that simultaneously covers the front conductive line 3111A and the substrate layer 314A after solidification, and the molded package body 323A that covers the electronic component 33, thereby forming the molded circuit board 30A; finally, after the insulating molding material 320 is solidified to form the front molding layer 3211 and the molded package body 323A, the upper mold 51A is operated to perform demolding to remove the molded circuit board 30A from the molding mold 50A. Of course, in this example of the present invention, after the reverse molding layer 3212 is molded on the reverse side of the circuit board body 31, the photosensitive chip 20, the filter element 41, and the lens assembly 10 are sequentially installed on the molded circuit board 30A to assemble the camera module 1A.

[0192] It is worth noting that in the above-mentioned embodiment of the present invention, the front molding layer 3211 of the molding structure 32A covers the chip mounting area 3101 and the edge area 3102 of the circuit board body 31, so that the photosensitive chip 20 is mounted on the front molding layer 3211 of the molding structure 32A of the molded circuit board 30A, thereby reducing the adverse effect of the circuit board body 31 on the mounting accuracy of the photosensitive chip 20 through the front molding layer 3211. Of course, in other examples of the present invention, the photosensitive chip 20 can also be directly mounted on the chip mounting area 3101 of the circuit board body 31 by an adhesive.

[0193] For example, Figure 8AA first variant implementation of the camera module 1A according to the second embodiment of the present invention is shown. Specifically, compared with the second embodiment of the present invention, the difference of the camera module 1A according to the first variant implementation of the present invention is that: the photosensitive chip 20 is directly mounted on the chip mounting area 3101 of the circuit board body 31 of the molded circuit board 30A through the adhesive 60; the front molding layer 3211A of the molding layer 321A of the molding structure 32A only covers the front conductive line 3111 and the substrate layer 314 of the front wiring layer 311 located at the edge area 3102 of the circuit board body 31, so that the front conductive line 3111 of the front wiring layer 311 located at the chip mounting area 3101 of the circuit board body 31 is exposed due to not being covered. Thus, when the photosensitive chip 20 is mounted via the adhesive 60, the adhesive 60 can enter the gap in the front circuit layer 311, thereby increasing the contact area between the adhesive 60 and the molded circuit board 30A, thereby enhancing the mounting strength of the photosensitive chip 20. Furthermore, in this modified embodiment of the present invention, the molded package 323A of the molded structure 32A only covers the electronic components 33 to prevent interference between adjacent electronic components 33.

[0194] It is worth noting that Figure 8A As shown, since the photosensitive chip 20 is directly mounted on the chip mounting area 3101 of the circuit board body 31, and the front molding layer 3211A of the molding structure 32A only covers the edge area 3102 of the circuit board body 31, the present invention can first mold the molding structure 32A on the circuit board body 31 through a molding process, and then mount the photosensitive chip 20 on the chip mounting area 3101 of the circuit board body 31; or, the present invention can first mount the photosensitive chip 20 on the chip mounting area 3101 of the circuit board body 31, and then mold the molding structure 32A on the circuit board body 31 through a molding process. The present invention does not impose further restrictions on this.

[0195] Attachment Figure 8BA second variant embodiment of the camera module 1A according to the second embodiment of the present invention is shown. Specifically, compared to the first variant embodiment of the second embodiment of the present invention, the camera module 1A according to the second variant embodiment of the present invention differs in that the molded package 323A of the molded structure 32A simultaneously covers the electronic component 33 and the non-photosensitive area of ​​the photosensitive chip 20, thereby further strengthening the bonding strength between the photosensitive chip 20 and the molded circuit board 32A and helping to prevent dirt on the circuit board body 31 from contaminating the photosensitive chip 20. It is worth noting that because the molded package 323A of the molded structure 32A covers the non-photosensitive area of ​​the photosensitive chip 20, before molding the molded structure 32A on the circuit board body 31 through a molding process, it is necessary to first attach the photosensitive chip 20 to the chip mounting area 3101 of the circuit board body 31 using the adhesive 60, and electrically connect the photosensitive chip 20 to the circuit board body 31.

[0196] It is worth noting that in the second embodiment of the present invention and its modified embodiments, except for the above-mentioned structural differences, the other structures of the camera module 1A are the same as the structures of the camera module 1 according to the first embodiment of the present invention, and the camera module 1A also has modified embodiments that are similar to or identical to the various modified embodiments of the camera module 1 of the first embodiment, which will not be repeated here.

[0197] According to another aspect of the present invention, an embodiment of the present invention further provides a method for manufacturing a camera module. Figure 9 As shown, the manufacturing method of the camera module includes the steps of:

[0198] S100: Providing a circuit board body 31, and forming a molding layer 321 (321A) of a molding structure 32 (32A) by curing an insulating molding material 320 on at least one surface of the circuit board body 31 through a molding mold 50 (50A);

[0199] S200: Mounting at least one photosensitive chip 20 on the molded circuit board 30 (30A), and conductively connecting each photosensitive chip 20 to the molded circuit board 30 (30A);

[0200] S300 : A lens assembly 10 is correspondingly arranged on the molded circuit board 30 ( 30A), so that each optical lens 11 of the lens assembly 10 is located in the light-sensing path of the corresponding photosensitive chip 20 .

[0201] Furthermore, if Figure 9As shown, the manufacturing method of the camera module further includes the steps of:

[0202] S400: A filter assembly 40 is correspondingly arranged between the molded circuit board 30 (30A) and the lens assembly 10, so that the light entering from each optical lens 11 passes through the filter element 41 of the filter assembly 40 and is then received by the photosensitive chip 20.

[0203] It is worth noting that in the first example of the present invention, Figure 10A As shown, step S100 in the manufacturing method of the camera module, that is, the manufacturing method of the molded circuit board 30 (30A), may include the following steps:

[0204] S110: By means of an upper mold 51 of the molding mold 50, the insulating molding material 320 is solidified on the front surface of the circuit board body 31 to form a front molding layer 321 of the molding layer 321 of the molding structure 32, wherein the front molding layer 3211 only covers the front conductive line 3111 of the front circuit layer 311 of the circuit board body 31, so that the solder pad 3112 of the front circuit layer 311 is exposed.

[0205] Furthermore, if Figure 10A As shown, the method for manufacturing the molded circuit board 30 (30A) may include the following steps:

[0206] S120: By means of the lower mold 52 of the molding mold 50, the insulating molding material 320 is solidified on the reverse side of the circuit board body 31 to form a reverse molding layer 3212 of the molding structure 32, wherein the reverse molding layer 3212 covers the reverse conductive circuit 3131 of the reverse circuit layer 313 of the circuit board body 31.

[0207] Furthermore, if Figure 10A As shown, the method for manufacturing the molded circuit board 30 (30A) may further include the steps of:

[0208] S130 : Mounting a group of electronic components 33 on the solder pads 3112 of the front circuit layer 311 of the circuit board body 31 .

[0209] It is worth mentioning that according to the above first example of the present invention, Figure 10A As shown, step S110 may include the following steps:

[0210] S112: placing the circuit board body 31 on the upper mold 51 of the molding mold 50, so that the inner surface of the upper mold 51 is pressed against the pad 3112 of the front circuit layer 311 of the circuit board body 31, and forming a front molding space 510 between the inner surface of the upper mold 51 and the front surface of the circuit board body 31; and

[0211] S113 : injecting the insulating molding material 320 into the front molding space 510 to form the front molding layer 3211 after curing.

[0212] It is worth noting that the inner surface of the upper mold 51 of the molding mold 50 can be designed as needed to mold the front molding layer 3211 that meets the requirements. For example, the surface of the front conductive line 3111 of the front wiring layer 311 is generally flush with the surface of the pad 3112 of the front wiring layer 311. In this case, the inner surface of the upper mold 51 can be designed to form a pressing surface 511 and a molding surface 512, wherein the pressing surface 511 is lower than the molding surface 512, so that the upper mold 51 has a stepped inner surface. Of course, the upper mold 51 may also have a flat inner surface. In this case, the front mold layer 3211 that simultaneously covers the front circuit layer 311 and the solder pad 3112 may be molded first, and then the solder pad 3112 may be exposed by grinding; or the front circuit layer 311 of the circuit board body 31 may be pre-processed so that the surface of the front conductive circuit 3111 of the front circuit layer 311 is lower than the surface of the solder pad 3112.

[0213] For example, Figure 10A As shown, in the first example of the present invention, before step S112, step S110 may further include the following steps:

[0214] S111 : etching the front conductive line 3111 of the front circuit layer 311 of the circuit board body 31 to reduce the height of the front conductive line 3111 so that the surface of the front conductive line 3111 is lower than the surface of the pad 3112 .

[0215] Of course, in other examples of the present invention, before step S112, step S110 may further include the step of depositing metal on the pad 3112 of the front circuit layer 311 of the circuit board body 31 through a deposition process to increase the height of the pad 3112 so that the surface of the front conductive circuit 3111 is lower than the surface of the pad 3112.

[0216] In a second example of the present invention, Figure 10B As shown, the step S100, i.e., the method for manufacturing the molded circuit board 30 (30A), may also include the steps of:

[0217] S110′: Using an upper mold 51 of the molding mold 50, the insulating molding material 320 is cured on the front surface of the circuit board body 31 to form a front molding layer 3211 of the molding structure 32, wherein the front molding layer 3211 only covers the surface of the substrate layer 314 of the circuit board body 31, leaving the front conductive traces 3111 and the solder pads 3112 of the front wiring layer 311 exposed.

[0218] S120 ′: disposing an insulating protection layer 322 correspondingly on the front conductive line 3111 of the front circuit layer 311 to cover the front conductive line 3111 ;

[0219] S130′: Using the lower mold 52 of the molding mold 50, the insulating molding material 320 is solidified on the reverse side of the circuit board body 31 to form a reverse molding layer 3212 of the molding structure 32, wherein the reverse molding layer 3212 covers the reverse conductive circuit 3131 of the reverse circuit layer 313 of the circuit board body 31; and

[0220] S140 ′: mounting a group of electronic components 33 on the pads 3112 of the front circuit layer 311 of the circuit board body 31 to manufacture the molded circuit board 30 .

[0221] It is worth noting that, in this second example of the present invention, the insulating protection layer 322 can be provided to cover the front conductive line 3111 of the front line layer 311 by methods such as molding, bonding, etc.

[0222] According to the above second example of the present invention, Figure 10B As shown, the step S110' further includes the steps of:

[0223] S111′: placing the circuit board body 31 on the upper mold 51 of the molding mold 50, so that the inner surface of the upper mold 51 is simultaneously pressed against the front conductive lines 3111 and the solder pads 3112 of the front circuit layer 311 of the circuit board body 31, thereby forming a front molding space 510 between the inner surface of the upper mold 51 and the front surface of the circuit board body 31; and

[0224] S112 ′: injecting the insulating molding material 320 into the front molding space 510 to form the front molding layer 3211 after curing.

[0225] In a third example of the present invention, Figure 10C As shown, the step S100, i.e., the method for manufacturing the molded circuit board 30 (30A), may include the following steps:

[0226] S110 ”: mounting a group of electronic components 33 on the pads 3112 of the front circuit layer 311 of the circuit board body 31 ;

[0227] S120″: Using an upper mold 51A of the molding mold 50A, the insulating molding material 320 is solidified on the front surface of the circuit board body 31 to form a front molding layer 3211A and a molded package body 323A of the molding structure 32A, wherein the front molding layer 3211A covers the front conductive line 3111 of the front wiring layer 311, and the molded package body 323A covers the electronic component 33; and

[0228] S130": By using the lower mold 52 of the molding mold 50, the insulating molding material 320 is solidified on the reverse side of the circuit board body 31 to form a reverse molding layer 3212 of the molding structure 32A, wherein the reverse molding layer 3212 covers the reverse conductive circuit 3131 of the reverse circuit layer 313 of the circuit board body 31 to produce the molded circuit board 30A.

[0229] It is worth noting that, in some examples of the present invention, the front molding layer 3211A only covers the front conductive circuit 3111 of the front circuit layer 311 located at the edge region 3101 of the circuit board body 31 .

[0230] It is worth mentioning that the present invention further provides a variant implementation of the manufacturing method of the camera module according to the above-mentioned embodiment of the present invention, and the step S100 may also include the steps of: first mounting the electronic component 33 and the photosensitive chip 20 on the front of the circuit board body 31, and electrically connecting the photosensitive chip 20 to the circuit board body 31; then curing the insulating molding material 320 on the front of the circuit board body 31 through the molding mold 50A to form the front molding layer 3211A and the molded package body 323A of the molding structure 32A, wherein the molded package body 323A covers the non-photosensitive areas of the electronic component 33 and the photosensitive chip 20.

[0231] For example, Figure 11 As shown, in this variant embodiment of the present invention, the manufacturing method of the camera module includes the steps of:

[0232] S100 ′: conductively mounting at least one photosensitive chip 20 on a chip mounting area 3101 of a circuit board body 31 , and conductively mounting a group of electronic components 33 on an edge area 3102 of the circuit board body 31 ;

[0233] S200′: forming a front mold layer 321A, a front mold layer 3211A, and a molded package body 323A of a molded layer 321A of a molded structure 32A on the front surface of the circuit board body 31 by curing the insulating molding material 320 through the molding mold 50 (50A), wherein the front mold layer 3211A only covers the front conductive circuit 3111 located at the edge region 3101 of the circuit board body 31 on the front circuit layer 311 of the circuit board body 31, and the molded package body 323A covers the electronic component 33 and the non-photosensitive region of the photosensitive chip 20;

[0234] S300 ′: correspondingly disposing at least one filter element 41 of a filter assembly 40 in the molded package 323A, wherein each filter element 41 is located in a light sensing path of a corresponding light sensing chip 20 ; and

[0235] S400': A lens assembly 10 is correspondingly arranged in the molded package 323A of the molded structure 32A, wherein each optical lens 11 of the lens assembly 10 is located in the photosensitive path of the corresponding photosensitive chip 20, so that the light entering from each optical lens 11 is received by the photosensitive chip 20 after passing through the corresponding filter element 41.

[0236] Furthermore, if Figure 11 As shown, the manufacturing method of the camera module further includes the steps of:

[0237] S500': The insulating molding material 320 is solidified on the reverse side of the circuit board body 31 through the molding mold 50 (50A) to form a reverse molding layer 3212 of the molding layer 321A of the molding structure 32A, wherein the reverse molding layer 3212 covers the reverse conductive circuit 3131 of the reverse circuit layer 313 of the circuit board body 31.

[0238] It is worth mentioning that, according to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device is configured with at least one molded circuit board 30 (30A) for providing mechanical support for fixing and assembling various electronic components such as integrated circuits. For example, in the above-mentioned embodiment of the present invention, the electronic device can be, but is not limited to, implemented as a camera module 1 (1A) configured with the molded circuit board 30 (30A). In other examples of the present invention, the electronic device can also be implemented as various electronic devices such as computers, robots, AR glasses, etc. configured with the molded circuit board 30 (30A).

[0239] In addition, refer to the attached Figure 12 According to another aspect of the present invention, the present invention further provides an electronic device, wherein the electronic device includes an electronic device body 70 and at least one camera module 1 (1A), wherein each camera module 1 (1A) is respectively arranged on the electronic device body 70 for acquiring images. It is worth mentioning that the type of the electronic device body 70 is not limited. For example, the electronic device body 70 can be any electronic device that can be configured with the camera module 1, such as a smart phone, a tablet computer, a laptop computer, an e-book, a personal digital assistant, a camera, etc. It can be understood by those skilled in the art that although the attached Figure 12 The electronic device body 70 is implemented as a smart phone as an example, but it does not constitute a limitation on the content and scope of the present invention.

[0240] It is worth noting that the orientations or positional relationships indicated by “upper”, “lower”, “inside” and “outside” mentioned in the present invention are based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0241] Those skilled in the art will appreciate that the embodiments of the present invention described above and shown in the accompanying drawings are intended to be illustrative only and are not intended to limit the present invention. The objectives of the present invention have been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and illustrated in the embodiments. Any variations or modifications may be made to the embodiments of the present invention without departing from the principles described.

Claims

1. A method for manufacturing a molded circuit board, characterized in that: Including steps: A circuit board body is provided, and a molding layer of a molding structure is formed by solidifying an insulating molding material on at least one surface of the circuit board body through a molding mold, wherein: Mounting a group of electronic components on the pads of the front circuit layer of the circuit board body; By using an upper mold of the molding mold, the insulating molding material is solidified on the front surface of the circuit board body to form a front molding layer and a molded package body of the molding structure, wherein the molded package body extends upward from the front molding layer as a whole, wherein the molded package body covers the electronic components, and the front molding layer simultaneously covers the conductive circuits located in the chip mounting area and edge area of ​​the circuit board body and the surface of the substrate layer located on the front surface of the circuit board body, and the front molding layer does not cover the surface of the pads of the front wiring layer; and By using a lower mold of the molding mold, the insulating molding material is solidified on the reverse side of the circuit board body to form a reverse molding layer of the molding structure, wherein the reverse molding layer covers the reverse conductive circuit of the reverse circuit layer of the circuit board body, thereby manufacturing the molded circuit board; Before or after the front molding layer and the molded package of the molding structure are molded, the photosensitive chip is mounted on the chip mounting area of ​​the circuit board body through an adhesive, wherein a portion of the adhesive enters the gap of the front circuit layer.

2. The method for manufacturing a molded circuit board according to claim 1, wherein: The front mold layer does not cover the pads for electrical connection with the photosensitive chip.

3. The method for manufacturing a molded circuit board according to claim 1, wherein: The molded package of the molded structure simultaneously covers the electronic components and the non-photosensitive area of ​​the photosensitive chip. Before the front molded layer of the molded structure and the molded package are formed, the photosensitive chip is mounted on the chip mounting area of ​​the circuit board body by an adhesive, and the photosensitive chip is electrically connected to the circuit board body.

4. The method for manufacturing a molded circuit board according to any one of claims 1 to 3, wherein: The heat dissipation efficiency of the insulating molding material is greater than the heat dissipation efficiency of the ink material.

5. A method for manufacturing a camera module, characterized in that: Including steps: The molded circuit board is manufactured according to the method for manufacturing the molded circuit board according to any one of claims 1 to 4; A lens assembly is correspondingly arranged on the molded circuit board so that each optical lens of the lens assembly is located in the light sensing path of the corresponding light sensing chip.

6. The method for manufacturing a camera module according to claim 5, wherein: Further comprising the steps of: A filter assembly is correspondingly arranged between the molded circuit board and the lens assembly, so that the light entering from each optical lens passes through the filter element of the filter assembly and is then received by the photosensitive chip.

7. A molded circuit board, characterized in that include: A circuit board body, wherein the circuit board body comprises at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked at intervals; A molded structure, wherein the molded structure includes a molded layer, wherein the molded layer is stacked on at least one surface of the circuit board body to cover at least a portion of the substrate layer of the circuit board body, the molded layer of the molded structure includes a front molded layer, wherein the front molded layer is stacked on the front surface of the circuit board body, the circuit layer of the circuit board body includes a front circuit layer stacked on the front surface of the substrate layer, wherein the front circuit layer includes a front conductive circuit and a group of pads conductively connected to the front conductive circuit, the front molded layer simultaneously covers the conductive circuit located in the chip mounting area and edge area of ​​the circuit board body and the surface of the substrate layer located on the front surface of the circuit board body, and the front molded layer does not cover the surfaces of the pads of the front circuit layer; A group of electronic components, wherein each of the electronic components is mounted on the pad of the front circuit layer of the circuit board body, wherein the molded structure further includes a molded package body, the molded package body integrally extending upward from the front molded layer, the molded package body covering the electronic components; and At least one photosensitive chip, wherein each photosensitive chip is mounted on the chip mounting area of ​​the circuit board body through an adhesive, and each photosensitive chip is electrically connected to the circuit board body, wherein a portion of the adhesive enters the gap of the front circuit layer.

8. The molded circuit board according to claim 7, wherein: The front mold layer does not cover the pads for electrical connection with the photosensitive chip.

9. The molded circuit board according to claim 7, wherein: The molded package of the molded structure simultaneously covers the electronic components and the non-photosensitive area of ​​the photosensitive chip.

10. The molded circuit board according to any one of claims 7 to 9, wherein: The molding layer of the molding structure includes a reverse molding layer, wherein the reverse molding layer is stacked on the reverse side of the circuit board body to cover the substrate layer located on the reverse side of the circuit board body.

11. The molded circuit board according to claim 10, wherein: The circuit layer of the circuit board body includes a reverse circuit layer stacked on the reverse side of the substrate layer, wherein the reverse circuit layer includes a reverse conductive circuit, and the reverse mold layer covers the reverse conductive circuit of the reverse circuit layer.

12. The molded circuit board according to any one of claims 7 to 9, wherein: The molding layer of the molding structure is formed by solidifying an insulating molding material on at least one surface of the circuit board body through a molding die.

13. The molded circuit board according to claim 12, wherein: The heat dissipation efficiency of the insulating molding material is greater than the heat dissipation efficiency of the ink material.

14. A camera module, characterized in that: include: The molded circuit board according to any one of claims 7 to 9; and A lens assembly, wherein the lens assembly includes at least one optical lens, wherein the lens assembly is correspondingly arranged on the molded circuit board, and each optical lens is located in the photosensitive path of the corresponding photosensitive chip.

15. The camera module according to claim 14, wherein: The molding layer of the molding structure includes a reverse molding layer, wherein the reverse molding layer is stacked on the reverse side of the circuit board body to cover the substrate layer located on the reverse side of the circuit board body.

16. The camera module according to claim 15, wherein: The circuit layer of the circuit board body includes a reverse circuit layer stacked on the reverse side of the substrate layer, wherein the reverse circuit layer includes a reverse conductive circuit, and the reverse mold layer covers the reverse conductive circuit of the reverse circuit layer.

17. The camera module according to claim 14, wherein: The molding layer of the molding structure is formed by solidifying an insulating molding material on at least one surface of the circuit board body through a molding die.

18. The camera module according to claim 17, wherein: The insulating molding material is epoxy resin molding compound.

19. The camera module according to claim 14, wherein: The lens assembly further includes at least one driver, wherein each optical lens is assembled to the driver, and each driver is mounted on the molded circuit board to drivably maintain each optical lens located in the photosensitive path of the corresponding photosensitive chip.

20. The camera module according to claim 14, wherein: The lens assembly further includes at least one lens barrel, wherein each optical lens is assembled in the lens barrel, and each lens barrel is mounted on the molded circuit board to keep each optical lens located in the photosensitive path of the corresponding photosensitive chip.

21. The camera module according to claim 14, wherein: The lens assembly further includes a light deflection mechanism, wherein the light deflection mechanism is arranged in the photosensitive path of the photosensitive chip, and is used to deflect the light entering the light deflection mechanism so that the deflected light is received by the photosensitive element after passing through the optical lens.

22. The camera module according to claim 14, wherein: It further includes a filter component, wherein the filter component is correspondingly arranged between the optical lens and the photosensitive chip, so that the light entering through the optical lens is received by the photosensitive chip after passing through the filter component.

23. The camera module according to claim 22, wherein: The filter assembly includes at least one filter element and a base, wherein each filter element is assembled on the base, and the base is correspondingly arranged at a position corresponding to the edge area of ​​the circuit board body on the molded structure of the molded circuit board, so that each filter element corresponds to the photosensitive path of the corresponding photosensitive element, wherein the lens assembly is assembled on the base.

24. The camera module according to claim 23, wherein: The base is a separately manufactured bracket base or a molded base manufactured by a molding process.

25. An electronic device, characterized in that include: an electronic device body; and At least one camera module as described in claim 14 is characterized in that each camera module is arranged on the electronic device body to capture images.

26. An electronic device, characterized in that, The electronic device is provided with at least one molded circuit board according to any one of claims 7 to 9.

Images