A 3D camera module and a terminal device
By setting the light emitting component around the outer periphery of the lens to form a ring-like structure, the 3D camera module is solved, and the 3D camera module is large in size and heat concentration is achieved, which is smaller and better heat dissipation effect is achieved, and macro or ultra-macro measurement is supported.
Patent Information
- Application Number
- CN202011319381.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-11-23
- Publication Date
- 2025-07-18
- Estimated Expiration
- 2040-11-23
AI Technical Summary
The existing 3D camera modules are large in size, with concentrated heat generation at the transmitting end, and are not conducive to macro or ultra-macro measurements.
The light emitting component is arranged around the outer periphery of the lens, including a transmitter, a diffuser, a heat dissipation substrate and a circuit component, forming a ring-like structure, reducing the bracket design of the light emitting component, dispersing heat, and improving the heat dissipation effect.
Reduces the volume of the 3D camera module, improves imaging quality, and supports macro or ultra-macro measurements.
Smart Images
Figure CN112333374B_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of cameras, and more specifically, to a 3D camera module and a terminal device. Background Art
[0002] 3D cameras are widely used in technical fields such as face recognition, gesture recognition, three-dimensional measurement, or environmental perception, and can be installed on terminal devices such as mobile phones, tablet computers, televisions, drones, and automobiles. By acquiring data, a 3D camera can accurately determine the distance between each point in an image and the camera, thereby obtaining the three-dimensional spatial coordinates of each point in the image and restoring the real scene.
[0003] In the prior art, a 3D camera generally includes a transmitting end and a receiving end. Among them, the transmitting end is installed on one bracket, and the receiving end is installed on another bracket. The two brackets are arranged side by side, which not only makes the transmitting end and the receiving end occupy too much spatial position, but also the bottom space of the transmitting end bracket is not fully utilized, resulting in a low space utilization rate of the 3D camera. In addition, the transmitting end of the 3D camera emits light in the form of a surface light source, resulting in concentrated heat generation at the transmitting end, which affects the imaging quality of the 3D camera. Moreover, since the transmitting end of the 3D camera is located on one side of the receiving end, it also causes the minimum measurement distance of the 3D camera to be relatively large, which is not conducive to macro or ultra-macro measurement of the 3D camera. Therefore, how to design a 3D camera module that can not only reduce the volume of the 3D camera module, but also improve the heat dissipation effect of the transmitting end of the 3D camera module, and is also conducive to the 3D camera module to achieve macro or ultra-macro measurement has become a technical problem that needs to be solved urgently by those skilled in the art. Summary of the Invention
[0004] In view of this, the purpose of the present invention is to overcome the deficiencies of the prior art. In the first aspect, a 3D camera module is provided to solve the technical problems of the existing 3D camera module having a large volume, concentrated heat generation at the transmitting end, and being not conducive to macro or ultra-macro measurement.
[0005] The technical solution adopted by the present invention to solve this technical problem is as follows:
[0006] A 3D camera module includes:
[0007] A receiving end module, the receiving end module includes a lens;
[0008] A light-emitting component, the light-emitting component is arranged around the outer periphery of the lens; and,
[0009] A circuit component, the circuit component is electrically connected to the light-emitting component, and the circuit component is stacked with the lens.
[0010] Based on the above technical solutions, the 3D camera module can be further improved as follows.
[0011] Optionally, the light-emitting component includes a transmitter for emitting a light signal to the image to be measured and a heat dissipation substrate for dissipating heat from the transmitter. The transmitter is electrically connected to the circuit component, and the heat dissipation substrate is disposed between the transmitter and the circuit component.
[0012] Optionally, the heat dissipation substrate is connected to a diffusion bracket. The transmitter is located inside the diffusion bracket, and a diffuser for diffusing the light source of the transmitter is installed inside the diffusion bracket.
[0013] Optionally, the transmitter and the diffuser are respectively in an annular structure surrounding the outer periphery of the lens. The diffusion bracket and the heat dissipation substrate are respectively in a plate-like structure. The diffusion bracket is provided with a first hole, and the heat dissipation substrate is provided with a second hole. The lens passes through the first hole and the second hole. An annular groove is provided on the diffusion bracket along the outer periphery of the first hole, and the transmitter and the diffuser are installed in the annular groove.
[0014] Optionally, the circuit component includes a first circuit board, a flexible cable, and a second circuit board. The light-emitting component is electrically connected to the first circuit board. The second circuit board is electrically connected to an imaging chip. The lens is installed above the imaging chip. The first circuit board is provided with a third hole for the lens to pass through, and the first circuit board and the second circuit board are electrically connected through the flexible cable.
[0015] Optionally, a filter bracket is provided between the lens and the second circuit board, and a filter is installed on the filter bracket above the imaging chip.
[0016] Optionally, it further includes a module bracket, and the light-emitting component, the lens, and the circuit component are respectively installed in the module bracket.
[0017] Optionally, the light source field of view of the light-emitting component is 40° - 70°, the receiving field of view of the lens is 40° - 70°, and the light source field of view of the light-emitting component is greater than the receiving field of view of the lens.
[0018] Optionally, the light-emitting component includes a plurality of arc-shaped light bands or point light sources surrounding the outer periphery of the lens.
[0019] In a second aspect, the present invention further provides a terminal device, including the above 3D camera module.
[0020] Compared with the prior art, the beneficial effects of the 3D camera module provided by the present invention are:
[0021] In the present invention, the light-emitting component is arranged around the outer periphery of the lens, enabling the light-emitting component to be conditionally installed at the outer wall position of the lens. Thus, there is no need to separately design a bracket for the light-emitting component, reducing the volume of the 3D camera module. In addition, the light-emitting components are dispersedly arranged around the outer periphery of the lens, which is also beneficial to dispersing the heat generated by the light-emitting components and improving the imaging quality of the 3D camera module. Moreover, since the light-emitting components are dispersedly arranged relative to the lens, it is also beneficial to achieve macro or ultra-macro measurement of the 3D camera module. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.
[0023] Figure 1 is a schematic cross-sectional structure diagram of the 3D camera module of the present invention;
[0024] Figure 2 is an exploded structure diagram of the 3D camera module of the present invention;
[0025] Figure 3 is Figure 2 a three-dimensional structure diagram of the light-emitting component in
[0026] Figure 4 is Figure 2 a three-dimensional structure diagram of the lens and the filter bracket in
[0027] Figure 5 is a schematic optical path diagram of the 3D camera module of the present invention;
[0028] Figure 6 is Figure 5 an imaging schematic diagram when the object distance is less than L1 in
[0029] Figure 7 is Figure 5 an imaging schematic diagram when the object distance is between L1 and L2 in
[0030] Figure 8 is Figure 5 an imaging schematic diagram when the object distance is equal to L2 in
[0031] Figure 9 is Figure 5 an imaging schematic diagram when the object distance is between L2 and L3 in
[0032] Figure 10 is Figure 5 an imaging schematic diagram when the object distance is equal to L3 in
[0033] Figure 11 is Figure 5 The schematic diagram of imaging when the object distance is greater than L3.
[0034] In the figure:
[0035] a - light source; b - optical center of the lens; c - inner field of view of the light source; d - outer field of view of the light source; e - receiving field of view of the lens;
[0036] 1 - lens; 2 - emitter; 3 - diffuser; 4 - diffuser bracket; 41 - first hole; 42 - annular groove; 5 - heat dissipation substrate; 51 - second hole; 6 - first circuit board; 61 - third hole; 7 - flexible cable; 8 - module bracket; 81 - fourth hole; 9 - second circuit board; 10 - filter bracket; 11 - filter; 12 - imaging chip. Specific embodiments
[0037] To make the objectives, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be described in detail below. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art without creative efforts based on the embodiments of the present invention fall within the scope protected by the present invention.
[0038] Embodiment 1:
[0039] The present invention provides a 3D camera module, as Figures 1 to 4 shown, which includes a light emitting component, a receiving end module and a circuit component. Among them, the receiving end module includes a lens 1, the light emitting component is arranged in a ring structure on the outer periphery of the lens 1, the light emitting component is electrically connected to the circuit component, and the lens 1 is installed on the circuit component. When the circuit component is powered on, the light emitting component is powered on and emits a light signal to the image to be measured, and the lens 1 receives the light signal reflected by the image to be measured and forms an image on the circuit component. Of course, the light emitting component can also be designed in shapes such as an arc or a rectangle surrounding the outer periphery of the lens 1.
[0040] Such as Figures 1 to 3As shown, specifically, the light-emitting component includes a transmitter 2, a diffuser 3, a diffuser bracket 4, and a heat dissipation substrate 5. The transmitter 2 is electrically connected to the circuit component. The heat dissipation substrate 5 is disposed between the transmitter 2 and the circuit component by pasting. For example, holes for wires to pass through or wire grooves for wires to bypass can be formed on the heat dissipation substrate 5, so that the transmitter 2 is electrically connected to the circuit component through wires. The heat dissipation substrate 5 includes, but is not limited to, a structure made of heat dissipation and heat insulation materials such as a ceramic substrate or a resin substrate, which is beneficial to the full heat dissipation of the transmitter 2. The diffuser bracket 4 is installed above the heat dissipation substrate 5. An annular groove 42 is formed on the diffuser bracket 4. The transmitter 2 is installed in the annular groove 42, and the diffuser 3 is installed at a position above the transmitter 2 in the annular groove 42. The diffuser bracket 4 is used to support the diffuser 3 to diffuse the light beam emitted by the transmitter 2.
[0041] Among them, the diffuser bracket 4 and the heat dissipation substrate 5 are respectively in a plate-like structure. A first hole 41 for the lens 1 to pass through is formed on the diffuser bracket 4, and a second hole 51 for the lens 1 to pass through is formed on the heat dissipation substrate 5. The transmitter 2 and the diffuser 3 are respectively in an annular structure. The transmitter 2 includes, but is not limited to, a structure form of a plurality of arc-shaped light bands or point light sources surrounding the outer periphery of the lens 1, such as annularly arranged LEDs, laser emitters, or a light guide column with an overall arc-shaped light source. The annular groove 42 surrounds the lens 1 along the outer periphery of the first hole 41, that is, the optical center of the lens 1 is equidistant from the transmitters 2 at various positions.
[0042] As Figure 1 , Figure 2 and Figure 4 shown, the circuit component includes a first circuit board 6, a flexible cable 7, and a second circuit board 9. A third hole 61 for the lens 1 to pass through is formed on the first circuit board 6. The first circuit board 6 and the second circuit board 9 are electrically connected through the flexible cable 7 to form a C-shaped structure. The second circuit board 9 is electrically connected to an imaging chip 12. A filter bracket 10 is installed on the second circuit board 9. A filter 11 located above the imaging chip 12 is installed in the filter bracket 10. The lens 1 is installed on the filter bracket 10 and above the filter 11, and is used to filter the useless wavelength bands of the light wave to make the imaging of the imaging chip clearer. The other end of the lens 1 passes through the third hole 61 on the first circuit board 6. The transmitter 2, the diffuser 3, the diffuser bracket 4, and the heat dissipation substrate 5 are all installed on the first circuit board 6 and surround the outer periphery of the lens 1. Among them, the top of the light-emitting component is flush with the top of the lens 1.
[0043] As Figure 1 and Figure 2As shown in the figure, a module bracket 8 is provided between the first circuit board 6 and the second circuit board 9. The module bracket 8 is integrally in a box-shaped structure. The first circuit board 6 is installed on the top of the module bracket 8, the second circuit board 9 is installed on the bottom of the module bracket 8, and the flexible cable 7 is arranged on the outer side wall of the module bracket 8. Among them, a fourth hole 81 for the lens 1 to pass through is opened at the top of the module bracket 8, and the lens 1 passes through the fourth hole 81, the third hole 61, the second hole 51, and the first hole 41 in sequence.
[0044] In the present invention, by designing the emitter 2 as an annular structure surrounding the outer side wall of the lens 1, the integrated design of the emitter 2 and the lens 1 is realized. There is no need to separately design a bracket for the light-emitting component, saving the space of the 3D camera module, enabling the planar size of the 3D camera module to be made smaller, and being beneficial to the miniaturized design of the 3D camera module. The annular light-emitting component disperses the light source, increasing the unit heat dissipation area. Cooperating with the heat dissipation substrate 5 can greatly improve the heat dissipation effect. In addition, the annular light-emitting component structure design is also beneficial to realizing the macro or ultra-macro measurement of the 3D camera module.
[0045] As Figures 5 to 11 shown, the annular light-emitting component surrounds the outer periphery of the lens 1. From the cross-sectional view along the optical axis direction of the lens 1, that is, emitters 2 for emitting optical signals are distributed on both the left and right sides of the lens 1. According to different specifications of the lens 1 and the emitter 2, the lens 1 has a lens receiving field of view e, and the emitter 2 has a light source field of view. Among them, the boundary of the light source field of view on the side close to the optical axis is the inner light source field of view c, the boundary of the light source field of view on the side far from the optical axis is the outer light source field of view d, and the distance between the light source a and the lens optical center b is the baseline.
[0046] As Figure 5 With Figure 6 shown, when the object distance of the 3D camera is less than L1, both the inner light source field of view c and the outer light source field of view d are located outside the lens receiving field of view e. At this time, no light enters the lens receiving field of view e, so the imaging is in a black screen state.
[0047] As Figure 5 With Figure 7 shown, as the object distance of the 3D camera increases, when the object distance is between L1 and L2, part of the inner light source field of view c enters the lens receiving field of view e. At this time, since the light does not completely enter the lens receiving field of view e, the imaging is in a state of a black screen in the middle area.
[0048] As Figure 5 With Figure 8As shown, when the object distance of the 3D camera is equal to L2, the inner fields of view c of the light sources of the left and right transmitters 2 just intersect, illuminating the entire lens receiving field of view e. However, half of the light in the lens receiving field of view e is emitted by the left transmitter 2 and half is emitted by the right transmitter 2, resulting in a dark imaging state.
[0049] As Figure 5 shown in Figure 9 When the object distance of the 3D camera is between L2 and L3, the inner fields of view c of the light sources of the left and right transmitters 2 begin to gradually overlap and illuminate the lens receiving field of view e. However, the light intensity after the overlap of the inner fields of view c of the light sources in the lens receiving field of view e is significantly higher than that of the non-overlapped light, resulting in a vignetting imaging state.
[0050] As Figure 5 shown in Figure 10 When the object distance of the 3D camera is equal to L3, the inner fields of view c of the light sources of the left and right transmitters 2 overlap to the boundary of the lens receiving field of view e. At this time, the light in the lens receiving field of view e is just the light intensity after the overlap. Once the object distance changes slightly, it will result in a vignetting imaging state.
[0051] As Figure 5 shown in Figure 11 When the object distance of the 3D camera is greater than L3, the inner fields of view c of the light sources of the left and right transmitters 2 overlap and exceed the boundary of the lens receiving field of view e. At this time, all the light in the lens receiving field of view e is the light intensity after the overlap, and the imaging is clear.
[0052] In summary, it can be seen that the object distance L3 is the minimum measurable object distance of the 3D camera. The prior art adopts a structural form with a single-sided emission end. Under the conditions of the same lens 1 with the lens receiving field of view e and the same transmitter 2 with the light source field of view, since there is no overlap of the light from the left and right transmitters 2 in the lens 1, the minimum measurable object distance of the existing 3D camera is too large, which is not conducive to macro or ultra-macro measurement. It has been experimentally proven that the present invention adopts a transmitter 2 with a light source field of view of 40° - 70° and a lens 1 with a receiving field of view of 40° - 70°. The light source field of view is greater than the lens receiving field of view e, which can effectively reduce the minimum measurable object distance of the 3D camera, thus being conducive to realizing macro or ultra-macro measurement.
[0053] Specifically, the present invention adopts a transmitter 2 with a light source field of view of 54° and a lens 1 with a receiving field of view of 51°, which can make L1 reach 4 mm, L2 reach 8 mm, and L3 reach 121 mm. That is, the minimum measurable object distance of the 3D camera reaches 121 mm.
[0054] Embodiment 2:
[0055] The present invention also provides a terminal device, and the 3D camera module in the above embodiment is installed in the camera hole of the terminal device. Among them, the terminal device includes, but is not limited to, terminal devices such as mobile phones, tablet computers, televisions, drones, and automobiles.
[0056] As described above, the above are only specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention can easily think of changes or substitutions, and all should be covered within the protection scope of the present invention.
Claims
1. A 3D camera module, characterized in that, Comprising: A receiving end module, the receiving end module including a lens (1); A light emitting component, the light emitting component being disposed around the outer periphery of the lens (1); And, A circuit component, the circuit component being electrically connected to the light emitting component and stacked with the lens (1); wherein, The light emitting component includes a transmitter (2) for emitting a light signal to an image to be measured and a heat dissipation substrate (5) for dissipating heat from the transmitter (2). The heat dissipation substrate (5) is connected to a diffusion bracket (4). The transmitter (2) is located inside the diffusion bracket (4). A diffuser (3) for diffusing the light source of the transmitter (2) is installed inside the diffusion bracket (4). The transmitter (2) and the diffuser (3) are respectively in a circular ring structure surrounding the outer periphery of the lens (1). The diffusion bracket (4) is provided with a first hole (41), and the heat dissipation substrate (5) is provided with a second hole (51). The lens (1) passes through the first hole (41) and the second hole (51). An annular groove (42) is provided on the diffusion bracket (4) along the outer periphery of the first hole (41). The transmitter (2) and the diffuser (3) are installed in the annular groove (42). The annular groove (42) surrounds the lens (1) along the outer periphery of the first hole (41). The distance between the optical center of the lens (1) and the transmitters (2) at various positions is equal; The circuit component includes a first circuit board (6), a flexible cable (7) and a second circuit board (9). The light emitting component is electrically connected to the first circuit board (6). The second circuit board (9) is electrically connected to an imaging chip (12). The lens (1) is installed above the imaging chip (12). The first circuit board (6) is provided with a third hole (61) for the lens (1) to pass through. The first circuit board (6) and the second circuit board (9) are electrically connected through the flexible cable (7).
2. The 3D camera module according to claim 1, wherein The transmitter (2) is electrically connected to the circuit component, and the heat dissipation substrate (5) is disposed between the transmitter (2) and the circuit component.
3. The 3D camera module according to claim 2, wherein, The diffusion bracket (4) and the heat dissipation substrate (5) are respectively in a plate-like structure.
4. The 3D camera module according to claim 1, wherein A filter bracket (10) is provided between the lens (1) and the second circuit board (9). A filter (11) located above the imaging chip (12) is installed on the filter bracket (10).
5. The 3D camera module according to any one of claims 1 to 4, characterized in that, Further included is a module bracket (8), and the light emitting component, the lens (1) and the circuit component are respectively installed inside the module bracket (8).
6. The 3D camera module according to claim 5, wherein, The light source field of view of the light emitting component is 40° - 70°, the receiving field of view of the lens (1) is 40° - 70°, and the light source field of view of the light emitting component is greater than the receiving field of view of the lens (1).
7. The 3D camera module according to claim 1, wherein, The light emitting component includes a plurality of arc-shaped light bands or point light sources surrounding the outer periphery of the lens (1).
8. A terminal device, characterized in that, Including the 3D camera module according to any one of claims 1 to 7.
Citation Information
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