Headphone stand and headphones with it

Abstract

The present invention relates to the field of earphone technology, and more particularly to an earphone holder and an earphone having the same. The earphone holder includes an internal support member and a support arm, and an embedding portion is provided at one end of the internal support member. The support arm is prepared by injection molding, and the support arm is wrapped around the external of the internal support member, and an earmuff is formed at the end of the support arm, and the earmuff has a fitting portion that matches the embedding portion. The earphone holder of the present invention is formed by wrapping the support arm around the external of the internal support member by injection molding. Compared with the traditional headphone holder, the overall weight of the earphone holder of the present invention is lighter and the structure is simpler. The injection molding method reduces the production process and reduces the cost. At the same time, the support member is embedded inside the main body of the earphone holder, which effectively increases the strength of the earphone holder.

Description

Technical Field

[0001] The present invention relates to the technical field of earphones, and in particular to an earphone bracket and an earphone having the same. Background Art

[0002] With the development of science and technology, there is an increasing variety of electronic devices, such as MP3 players, MP4 players, smartphones, and tablets. These devices have powerful audio-visual functions, leading to a growing demand and higher requirements for headphones. Among these, over-ear headphones are a commonly used type. Traditional over-ear headphone frames are typically assembled from multiple components such as steel plates and aluminum alloys. Due to the large number of metal parts, they are relatively bulky, have a complex structure, and are costly to manufacture. Summary of the Invention

[0003] Based on this, it is necessary to provide a headphone stand and a headphone having the same to address the problems that traditional headphone stands are bulky, complicated in structure and expensive to produce.

[0004] The above objectives are achieved through the following technical solutions:

[0005] This invention provides an earphone stand, comprising:

[0006] An internal support component, one end of which is provided with an embedded part;

[0007] The support arm is prepared by injection molding process, the support arm is wrapped around the internal support member, and an earmuff is formed at the end of the support arm, and the earmuff has a fitting portion that matches the embedding portion.

[0008] In one embodiment, the embedding part includes a first embedding plate and a second embedding plate. One end of the first embedding plate is connected to an internal support member, and the other end of the first embedding plate is connected to the second embedding plate. The first embedding plate and the second embedding plate form an L-shape. The first embedding plate and the second embedding plate are used to fit into the fitting part.

[0009] In one embodiment, a positioning hole is provided on the second embedded plate, and the positioning hole is used to cooperate with the injection mold to fix the position of the second embedded plate in the injection mold.

[0010] In one embodiment, the inner support member, the first insert plate and the second insert plate are integrally injection molded.

[0011] In one embodiment, both ends of the internal support member are provided with positioning blind holes, which are used to cooperate with the injection mold to fix the position of the internal support member in the injection mold.

[0012] In one embodiment, the earcups include:

[0013] An earmuff plate, wherein the earmuff plate is provided with a first engaging notch for cooperating with the first embedded plate; and

[0014] A ring plate is vertically disposed on the edge of the ear cup plate. The ring plate is connected to the support arm. A second fitting groove is provided at the connection between the ring plate and the support arm. The second fitting groove is used to fit with the second embedded plate. The first fitting groove and the second fitting groove form a fitting part.

[0015] In one embodiment, a plurality of positioning grooves are provided on the outer wall of the annular plate. The plurality of positioning grooves are arranged sequentially at intervals along the direction of the circumference of the annular plate. The plurality of positioning grooves are used to cooperate with the injection mold to fix the position of the earmuff in the injection mold.

[0016] In one embodiment, the annular plate is provided with two mounting holes, which are symmetrically arranged about the center of the annular plate, and the two mounting holes are used for assembly with other components;

[0017] The earmuff plate is provided with a mounting opening, which is communicated with the first engaging groove and is used for mounting other electronic components.

[0018] In one embodiment, the earcup plate is provided with a positioning through hole, which is used to cooperate with the injection mold to fix the position of the earcup in the injection mold.

[0019] The present invention also provides an earphone, including an earphone stand as described in any of the preceding claims.

[0020] The above-mentioned headphone stand has at least the following technical effects:

[0021] The headphone stand of the present invention includes an internal support member with an embedded portion at one end. A support arm is then wrapped around the internal support member by injection molding. Simultaneously, an earcup is formed at the end of the support arm, and the embedded portion engages with a fitting portion formed on the earcup. The headphone stand of the present invention forms the headphone stand by wrapping the support arm around the internal support member through injection molding. Compared to traditional headphone stands, the headphone stand of the present invention is lighter and simpler in structure. The injection molding method reduces manufacturing processes and lowers costs. Furthermore, the embedded support member inside the headphone stand effectively increases its strength. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an earphone stand provided in an embodiment of the present invention;

[0023] Figure 2 A schematic structural diagram of the headphone stand provided by one embodiment of the present invention from another angle;

[0024] Figure 3 for Figure 2 A cross-sectional view of the structure shown at AA;

[0025] Figure 4 for Figure 1 A schematic diagram of the internal support components of the structure shown.

[0026] Figure 5 for Figure 1 A schematic diagram of the structure of the support arm and earmuffs of the structure shown;

[0027] Figure 6 for Figure 1 A schematic diagram of the support arm and earcups at another angle of the structure shown.

[0028] in:

[0029] 100- internal support;

[0030] 110 - Threading hole; 120 - Positioning blind hole;

[0031] 200 - Embedded part;

[0032] 210 - First embedded plate; 220 - Second embedded plate; 221 - Positioning hole;

[0033] 300-Support Arm;

[0034] 400-earmuffs;

[0035] 410 - Earcup plate; 411 - First fitting groove;

[0036] 412 - Mounting port; 413 - Positioning through hole;

[0037] 420 - Annular plate; 421 - Second fitting groove;

[0038] 422 - Positioning groove; 423 - Mounting hole. Detailed Implementation

[0039] To make the objectives, technical solutions, and advantages of the present invention clearer, the following detailed description of the headphone holder and headphones having the same is provided through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0040] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages). In the description of this invention, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention.

[0041] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0042] See also Figure 1 , Figure 2 and Figure 3 As shown, an embodiment of a headphone stand according to the present invention includes an inner support member 100 and a support arm 300. An insert 200 is provided at one end of the inner support member 100. The support arm 300 is manufactured using an injection molding process and wraps around the inner support member 100. An earcup 400 is formed at the end of the support arm 300. The earcup 400 has a mating portion that mates with the insert 200.

[0043] When one support arm 300 corresponds to one earcup 400, an earcup 400 is formed on one end of the support arm 300, while the other end is an extension end. This extension end is connected to the extension end of the other support arm 300, thus forming a two-ear headphone frame with two earcups facing each other. When one support arm 300 corresponds to two earcups, earcups 400 are formed on both ends of the support arm 300, and the two earcups 400 face each other, forming a two-ear headphone frame.

[0044] Among them, combined Figure 4As shown, the internal support member 100 can have various structural forms. For example, the internal support member 100 is generally long and has a certain curvature. Of course, the shape of the internal support member 100 can be selected according to actual needs or design requirements. The internal support member 100 has a through hole 110 along its length, which is used to install the headphone cable.

[0045] The embedded part 200 can also have various structural forms. As one possible implementation, the embedded part 200 includes a first embedded plate 210 and a second embedded plate 220. One end of the first embedded plate 210 is connected to the internal support member 100, and the other end is connected to the second embedded plate 220. The first embedded plate 210 and the second embedded plate 220 form an L-shape. The first embedded plate 210 and the second embedded plate 220 are used to fit with the fitting part.

[0046] The first embedded plate 210 is a curved plate. When the first embedded plate 210 is engaged with the engaging portion on the earmuff 400, it forms a single curved surface with the annular plate 420 (described in the following embodiments). The second embedded plate 220 can be a fan-shaped plate, with the curved edge of the fan-shaped plate connected to the first embedded plate 210. Of course, the specific shapes of the first embedded plate 210 and the second embedded plate 220 can be selected according to actual needs, as long as they can engage with the engaging portion on the earmuff 400.

[0047] The connection between the internal support 100 and the embedded part 200 can be in various ways. Preferably, the internal support 100, the first embedded plate 210, and the second embedded plate 220 are integrally injection molded. By using the injection molding process to integrally injection mold the internal support 100 and the embedded part 200, the manufacturing process is further reduced, and the manufacturing cost is lowered.

[0048] The earmuff 400 may also have various structural forms. As an practicable method, Figure 5 and Figure 6 As shown, the earmuff 400 includes an earmuff plate 410 and an annular plate 420. The earmuff plate 410 is provided with a first engaging notch 411 for mating with the first embedded plate 210. The annular plate 420 is vertically arranged at the edge of the earmuff plate 410 and connected to the support arm 300. A second engaging notch 421 is provided at the connection between the annular plate 420 and the support arm 300. The second engaging notch 421 is used to engage with the second embedded plate 220. The first engaging notch 411 and the second engaging notch 421 form the aforementioned engaging portion. The earmuff plate 410 can be square, oval, circular, etc., and those skilled in the art can select the shape according to actual needs. The shape of the annular plate 420 can be determined based on the shape of the earmuff plate 410.

[0049] The material of the internal support member 100, the material of the embedded portion 200, the material of the support arm 300 and the material of the earmuff 400 of the present invention can be multiple. In one embodiment, the material of the internal support member 100, the material of the embedded portion 200, the material of the earmuff 400 and the material of the support arm 300 are all ABS engineering plastics. ABS engineering plastics is PC+ABS (engineering plastic alloy), and its Chinese name in the chemical industry is plastic alloy. It is named PC+ABS because this material has the excellent heat and weather resistance, dimensional stability and impact resistance of PC resin, and the excellent processing fluidity of ABS resin, thereby improving the strength of the headphone holder in this embodiment, reducing the possibility of deformation of the headphone holder, and improving the performance of the headphone holder. In some other embodiments, the material of the headphone holder as a whole can be replaced with other materials with good fluidity, fusion and high strength.

[0050] The headphone holder according to an embodiment of the present invention includes an internal support member 100, with an embedded portion 200 provided at one end of the internal support member 100. A support arm 300 is then wrapped around the internal support member 100 through an injection molding process. An earmuff 400 is formed at the end of the support arm 300, and the embedded portion 200 engages with an engaging portion formed on the earmuff 400. The headphone holder according to this embodiment is formed by wrapping the support arm 300 around the internal support member 100 through injection molding. Compared to conventional headphone holders, the headphone holder according to this embodiment is lighter and simpler in structure. The injection molding method reduces the production process and reduces costs. Furthermore, the embedded support member within the main body of the headphone holder effectively increases its strength.

[0051] See also Figure 4 Based on the above embodiments, both ends of the internal support member 100 are provided with positioning blind holes 120. The positioning blind holes 120 are used to cooperate with the injection mold to fix the position of the internal support member 100 in the injection mold. When the internal support member 100 and the embedded portion 200 are injection molded, the threading holes 110 are formed in the internal support member 100, and the positioning blind holes 120 are formed at both ends of the internal support member 100. In this way, the shrinkage of the internal support member 100 during the molding process is minimized. At the same time, the internal support member 100 can be fixed in the injection mold during the injection molding process of the support arm 300 and the earmuff 400. This not only allows the internal support member 100 to be assembled more tightly with the support arm 300 and the earmuff 400, but also minimizes shrinkage of the internal support member 100.

[0052] Based on the above embodiments, the second embedded plate 220 is provided with positioning holes 221. The positioning holes 221 are used to mate with the injection mold to secure the position of the second embedded plate 220 within the injection mold. During the injection molding process of the embedded portion 200 and the inner support member 100, and during the injection molding of the support arm 300 and the earmuff 400 and wrapping around the inner support member 100, shrinkage of the embedded portion 200 is minimized, allowing the embedded portion 200 to better maintain its shape.

[0053] See also Figure 5 and Figure 6 Based on the aforementioned embodiments, the outer wall of the annular plate 420 is provided with a plurality of positioning grooves 422. These positioning grooves 422 are sequentially spaced along the circumference of the annular plate 420. These positioning grooves 422 cooperate with the injection mold to secure the earmuff 400 in place within the mold. During the integral injection molding process of the support arm 300 and earmuff 400, the plurality of positioning grooves 422 are formed on the outer wall of the annular plate 420. During the molding process of the earmuff 400, the plurality of positioning grooves 422 cooperate with the injection mold to minimize shrinkage of the earmuff 400.

[0054] Based on the above embodiments, the annular plate 420 is provided with two mounting holes 423, symmetrically arranged about the center of the annular plate 420. The two mounting holes 423 are used for assembling other components, such as a speaker cover. Alternatively, a mounting opening 412 may be provided on the earmuff plate 410, communicating with the first engaging notch 411, for mounting other electronic components, such as a display screen, buttons, and the like.

[0055] Based on the above embodiments, positioning holes 413 may also be provided on the earmuff plate 410. These holes 413 are used to cooperate with the injection mold to secure the earmuff 400 in place within the mold. The positioning holes 413 can be positioned anywhere, but are preferably located on either side of the space formed by the mounting opening 412 and the first engaging notch 411. During the integral injection molding process of the support arm 300 and earmuff 400, multiple positioning holes 413 are formed on the earmuff plate 410. The cooperation between the positioning holes 413 and the injection mold prevents shrinkage of the earmuff 400, allowing the mounting opening 412 and the first engaging notch 411 to be stably formed.

[0056] The headphone stand provided by this invention utilizes a two-stage injection molding process to complete its fabrication, overcoming the problem that traditional processes cannot fully utilize injection molding to manufacture headphone stands. It also solves the problems of existing headphone stands being heavy, expensive, or requiring multiple assembly steps. The headphone stand of this invention significantly reduces the manufacturing process and cost, while also making the headphones more aesthetically pleasing and lightweight. Furthermore, compared to traditional single plastic parts, this invention adds a plastic insert inside the headphone stand, greatly improving strength without affecting the appearance.

[0057] On the other hand, the present application also provides an earphone comprising an earphone holder as described in any of the above embodiments.

[0058] The technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, not all possible combinations of the technical features in the above-mentioned embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0059] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A headphone stand, characterized in that: include: An internal support member, one end of which is provided with an embedded portion; A support arm, wherein the support arm is prepared by an injection molding process, the support arm is wrapped outside the internal support member, and an earmuff is formed at the end of the support arm, and the earmuff has an engaging portion that matches the embedding portion; The embedded portion includes a first embedded plate and a second embedded plate, one end of the first embedded plate is connected to the internal support member, the other end of the first embedded plate is connected to the second embedded plate, and the first embedded plate and the second embedded plate form an L shape; the first embedded plate and the second embedded plate are used to be embedded with the embedded portion; The earmuffs include: An earmuff plate, wherein the earmuff plate is provided with a first engaging notch for matching with the first embedded plate; as well as An annular plate is vertically arranged on the edge of the earmuff plate, the annular plate is connected to the support arm, a second fitting groove is arranged at the connection between the annular plate and the support arm, the second fitting groove is used to fit with the second embedded plate, and the first fitting groove and the second fitting groove form the fitting portion.

2. The earphone stand according to claim 1, characterized in that: The second embedded plate is provided with a positioning hole, and the positioning hole is used to cooperate with the injection mold to fix the position of the second embedded plate in the injection mold.

3. The earphone stand according to claim 1, characterized in that: The inner support member, the first embedded plate and the second embedded plate are integrally injection-molded.

4. The earphone stand according to claim 1, characterized in that: Both ends of the internal support member are provided with positioning blind holes, and the positioning blind holes are used to cooperate with the injection mold to fix the position of the internal support member in the injection mold.

5. The earphone stand according to claim 1, characterized in that: A plurality of positioning grooves are arranged on the outer wall of the annular plate, and the plurality of positioning grooves are arranged in sequence and spaced apart along the direction in which the circumference of the annular plate extends. The plurality of positioning grooves are used to cooperate with the injection mold to fix the position of the earmuff in the injection mold.

6. The earphone stand according to claim 1, characterized in that: The annular plate is provided with two mounting holes, the two mounting holes are symmetrically arranged about the center of the annular plate, and the two mounting holes are used for assembly with other components; The earmuff plate is provided with a mounting opening, the mounting opening is communicated with the first engaging groove, and the mounting opening is used for mounting other electronic components.

7. The earphone stand according to claim 1, characterized in that: The earmuff plate is provided with a positioning through hole, and the positioning through hole is used to cooperate with the injection mold to fix the position of the earmuff in the injection mold.

8. A headset, characterized in that: It comprises the earphone holder as described in any one of claims 1 to 7.

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