Display device

Abstract

A display device is provided. The display device includes a display module. A shock absorption layer is disposed below the display module and includes a first opening exposing a lower surface of the display module. A rigid plate is disposed below the shock absorption layer. A sensor is disposed between the display module and the rigid plate within the first opening and is coupled to an upper surface of the rigid plate. A support member is disposed between the shock absorption layer and the sensor within the first opening and is in contact with the display module and the rigid plate.

Description

[0001] This application claims the priority and benefit of Korean Patent Application No. 10-2019-0092484, filed with the Korean Intellectual Property Office on Jul. 30, 2019, the entire contents of which are incorporated herein by reference. Technical Field

[0002] One or more aspects of example embodiments of the present disclosure relate to a display device. Background Art

[0003] Biometric authentication methods using biometric information such as a user's fingerprint have been widely used in display devices (such as smart phones, tablet PCs, etc.) in various fields. Various sensors such as fingerprint sensors can be embedded in such display devices.

[0004] Strategies for minimizing or reducing the movement of a fingerprint sensor when the fingerprint sensor is fixed (attached) to a display panel have been studied to provide accurate sensing capabilities after the fingerprint sensor is fixed. Summary of the Invention

[0005] One or more aspects of embodiments of the present disclosure are directed to a display device capable of improving fingerprint sensing capabilities while minimizing or reducing the movement of a fingerprint sensor.

[0006] One or more example embodiments of the present disclosure provide a display device including: a display module; a shock absorption layer disposed below the display module and including a first opening exposing a lower surface of the display module; a rigid plate disposed below the shock absorption layer; a sensor disposed between the display module and the rigid plate within the first opening and coupled to an upper surface of the rigid plate; and a support member disposed between the shock absorption layer and the sensor within the first opening and in contact with the display module and the rigid plate, respectively.

[0007] According to an example embodiment, the sensor may be spaced apart from the display module.

[0008] According to an example embodiment, the support member and the rigid plate may include the same material (e.g., be formed of the same material).

[0009] According to an example embodiment, the support member may have a planar shape of a circular ring or a square ring.

[0010] According to an example embodiment, the rigid plate may include a main body portion stacked with the shock absorption layer and a bent portion stacked with the sensor. The bent portion may include a flat portion and a connecting portion. The flat portion has a height different from that of the main body portion with respect to the surface of the display module. The connecting portion is inclined with respect to the main body portion and extends from the main body portion to the flat portion. The support member may be in contact with the main body portion.

[0011] According to an exemplary embodiment, the thickness of the connection part may be smaller than the average thickness of the main body part.

[0012] According to an exemplary embodiment, the rigid plate may include a cutout formed at an outer side of the support member with respect to the sensor, and the cutout may overlap with the shock-absorbing layer.

[0013] According to an exemplary embodiment, the cutout may have a planar shape corresponding to the planar shape of the support member and may include a plurality of sub-cutouts separated from each other.

[0014] According to an exemplary embodiment, the support member may be located around at least a part of the sensor (e.g., around at least a part of the sensor), and may include a plurality of sub-support members separated from each other in a plan view, and the sub-cutouts may be respectively formed corresponding to the sub-support members.

[0015] The display device may further include a fixing member disposed between the display module and the sensor, wherein the fixing member includes at least one selected from a thermosetting resin and a photocurable resin.

[0016] According to an exemplary embodiment, the display device may further include a fixing member disposed between the display module and the sensor, wherein the fixing member includes at least one selected from polyurethane (e.g., thermoplastic polyurethane), silicone resin, and polydimethylacrylamide.

[0017] According to an exemplary embodiment, the support member may include: a bottom part parallel to the lower surface of the display module; and a protruding part extending downward from an end of the bottom part, wherein the bottom part contacts the lower surface of the display module, and the protruding part is coupled to the rigid plate.

[0018] According to an exemplary embodiment, the support member may further include an extension part extending from a lower end of the protruding part toward the sensor, wherein the extension part contacts the sensor.

[0019] According to an exemplary embodiment, the support member may be manufactured by bending a plate member, and the support member may include a recessed part corresponding to the planar shape of the sensor.

[0020] According to an exemplary embodiment, the rigid plate may include a cutout formed adjacent to the protruding part, wherein the cutout overlaps with the shock-absorbing layer.

[0021] According to an exemplary embodiment, the rigid plate may include a main body part overlapping with the shock-absorbing layer and a bent part overlapping with the sensor, and the bent part may include a flat part and a connection part. The flat part has a height different from the height of the main body part with respect to the surface of the display module, and the connection part is inclined with respect to the main body part and extends from the main body part to the flat part, and the support member may contact the flat part.

[0022] According to an exemplary embodiment, the rigid plate and the support member may be integrally formed.

[0023] According to an exemplary embodiment, the sensor may include an ultrasonic sensor, an optical sensor, and an infrared sensor.

[0024] A display device according to an exemplary embodiment of the present disclosure includes: a display module including a first non-folded region and a second non-folded region and a folded region located between the first non-folded region and the second non-folded region; a first shock absorption layer and a second shock absorption layer respectively disposed below the first non-folded region and the second non-folded region of the display module; a rigid plate including a first sub-rigid plate and a second sub-rigid plate respectively disposed below the first shock absorption layer and the second shock absorption layer; a sensor disposed between the folded region of the display module and the rigid plate and coupled to an upper surface of the rigid plate; and a support member disposed between the first shock absorption layer and the second shock absorption layer in a plan view and surrounding the sensor.

[0025] According to an exemplary embodiment, the rigid plate may include a main body portion stacked with the first shock absorption layer and the second shock absorption layer and a bent portion stacked with the sensor. The bent portion may include a flat portion and a connecting portion. The flat portion has a height different from that of the main body portion with respect to the surface of the display module, and the connecting portion is inclined with respect to the main body portion and extends from the main body portion to the flat portion. The support member may be in contact with the main body portion.

[0026] According to an exemplary embodiment, the support member may include: a first sub-support member disposed between the first shock absorption layer and the sensor; and a second sub-support member disposed between the second shock absorption layer and the sensor.

[0027] A display device according to an exemplary embodiment of the present disclosure includes a support member that surrounds at least a portion of a fingerprint sensor (or an ultrasonic sensor) and is coupled to the display module and the rigid plate, thereby compensating for a step caused by an opening of the shock absorption layer and improving the fingerprint sensing ability of the fingerprint sensor. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1A and Figure 1B are diagrams showing a plan view of a display device according to an exemplary embodiment of the present disclosure.

[0029] Figure 2A is Figure 1A an exploded perspective view of an exemplary display device of

[0030] Figure 2B and Figure 2C is Figure 1B an exploded perspective view of an exemplary display device of

[0031] Figure 3 is a cross-sectional view showing an example of a display module included in Figure 2A a display device.

[0032] Figure 4 is a cross-sectional view showing an example of a display panel included in Figure 3 a display module.

[0033] Figure 5 is a cross-sectional view showing an example of a display device when observed along line I-I' in Figure 1A .

[0034] Figure 6A and Figure 6B is a diagram showing operations in a process of mounting an ultrasonic sensor on Figure 5 a display device.

[0035] Figure 7 is a cross-sectional view showing another example of a display device when observed along line I-I' in Figure 1A .

[0036] Figures 8A to 8C is Figure 7 a rear view of an example of a display device.

[0037] Figure 9A is a cross-sectional view showing another example of a display device when observed along line I-I' in Figure 1A .

[0038] Figure 9B is a diagram showing operations in a process of mounting an ultrasonic sensor on Figure 9A a display device.

[0039] Figure 10 is a cross-sectional view showing another example of a display device when observed along line I-I' in Figure 1A .

[0040] Figure 11A is a cross-sectional view showing another example of a display device when observed along line I-I' in Figure 1A .

[0041] Figure 11B is a diagram showing an example of a support member included in Figure 11A a display device.

[0042] Figure 11C is Figure 11A a rear view of an example of a display device.

[0043] Figure 12 is a cross-sectional view showing another example of a display device when observed along line I-I' in Figure 1A .

[0044] Figure 13 is a diagram showing operations in a process of installing a support member on a display device Figure 12 . DETAILED DESCRIPTION

[0045] It will be apparent to those skilled in the art that various modifications and variations can be made in the present disclosure without departing from the spirit or scope of the disclosure, and specific example embodiments are illustrated in the drawings and explained in the detailed description. However, the present disclosure is not limited to the example embodiments disclosed below, but can be implemented in various forms.

[0046] To clearly illustrate the present disclosure, selected elements not directly related to the features of the present disclosure may be omitted in the drawings. In addition, some elements in the drawings may be shown in slightly exaggerated dimensions, ratios, etc. For the same or similar components throughout the drawings, even if they are shown in different drawings, the same reference numerals and symbols will be used as much as possible, and repeated descriptions will be omitted. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" another element, the element can be directly on the other element, or there may also be an intermediate element. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element.

[0047] Figure 1A and Figure 1B is a diagram showing a plan view of a display device according to an example embodiment of the present disclosure.

[0048] First, referring to Figure 1A , the display device DD may include a display area DA for displaying an image, and a non-display area NDA provided at least one side or around the display area DA.

[0049] At least a part of the display device DD may be flexible (e.g., may be flexible), and the display device DD may be folded at the flexible part. In the present disclosure, the term "folded" may represent such a state or structure in which the form or physical configuration of the device is not fixed (e.g., not in a single set position), capable of changing from its original form to another form, and may be folded, bent, or rolled up along at least one specific line (i.e., a fold line) (e.g., folded, bent, or rolled up within or along the flexible part). For example, the display device DD may be a flexible display device.

[0050] In an exemplary embodiment, the display device DD may include a first non-foldable region NFA1 and a second non-foldable region NFA2 (or non-foldable regions NFA1 and NFA2) and a folding region (or foldable region) FA. The first non-foldable region NFA1 and the second non-foldable region NFA2 may not be flexible, or may both be parts that have (e.g., are capable of) a small degree of bending when an external pressure is applied.

[0051] The folding region FA may have a specific or set width in a first direction DR1 and may extend vertically in a second direction DR2 (along the second direction DR2). The folding region FA may be provided between the first non-foldable region NFA1 and the second non-foldable region NFA2. The folding region FA may be flexible, may be a part that is capable of a large degree of bending when exposed to an external pressure (e.g., force), and is capable of being folded or unfolded. The first non-foldable region NFA1, the second non-foldable region NFA2, and the folding region FA may be connected to each other or integrally formed, and may be distinguished from each other by their relationship with a rigid plate (e.g., a metal plate provided on the rear surface of the display device DD to support the structures provided thereon) described later. For example, the display device DD may be implemented as a foldable display device.

[0052] The display device DD may be folded inward (e.g., folded inwards) such that the display area DA faces inwards, or the display device DD may be folded outward (e.g., folded outwards) such that the display area DA faces outwards.

[0053] The display device DD may include a plurality of hardware modules for implementing various functions. For example, a pressure sensor for sensing the intensity (or pressure) of a user's touch input and / or a fingerprint sensor FPS for sensing the user's fingerprint may be provided on the rear surface of the display device DD.

[0054] In an exemplary embodiment, the fingerprint sensor FPS may be provided in at least a part of the first non-foldable region NFA1 and the second non-foldable region NFA2. As Figure 1A shown, the fingerprint sensor FPS may be provided at the lower center part of the first non-foldable region NFA1. For example, when the display device DD is in a folded state, the first non-foldable region NFA1 may be exposed to the user, and the fingerprint sensor FPS may be provided at the lower center part of the first non-foldable region NFA1 that is exposed to the user.

[0055] In an exemplary embodiment, the fingerprint sensor FPS may be provided in the folding region FA. As Figure 1BAs shown, the fingerprint sensor FPS may be disposed at the lower center portion of the folding area FA. For example, when the display device DD is in the unfolded state, the folding area FA may be disposed at the center portion of the display device DD, and the fingerprint sensor FPS may be disposed at the lower center portion of the folding area FA.

[0056] For example, the fingerprint sensor FPS may be disposed at various suitable positions within the display device DD, and the exact position of the fingerprint sensor FPS relative to the first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA is not limited.

[0057] Figure 2A is an exploded perspective view showing Figure 1A an example of the display device.

[0058] Referring to Figure 1A and Figure 2A , the display device DD may include a display module DM and a cover panel PTL (see the markings at the bottom of the attached drawings).

[0059] The display module DM may display an image. Additionally, the display module DM may sense an external touch input. For example, the display module DM may include a display panel for displaying an image and a touch panel for sensing a touch input. A more detailed configuration of the display module DM will be described later with reference to Figure 3 and Figure 4 .

[0060] The cover panel (or cover module) PTL may be disposed below the display module DM.

[0061] Unless otherwise defined in this specification, the terms "upper" and "upper surface" refer to the side of the display surface that is orthogonal to the thickness direction (e.g., orthogonal to the third direction DR3) relative to the display module DM (e.g., away from the coordinate origin), and "lower" and "lower surface" refer to the opposite side of the display surface that faces the display module DM (e.g., towards the coordinate origin). Additionally, "upper", "lower", "left", and "right" in the plan view represent the directions when observing the display surface from above (e.g., as in the Figure 1A plan view).

[0062] The cover panel PTL may include at least one functional layer. The functional layer may be a layer that will perform functions such as heat dissipation function, electromagnetic wave shielding function, grounding function, buffering function, strength enhancement function, support function, adhesion function, pressure sensing function, and / or digitization function, etc. The functional layer may be a sheet layer made of a sheet, a film layer made of a film, a thin film layer, a coating, a panel, a plate, etc. A functional layer may be formed not only by a single layer but also by a plurality of stacked thin film layers or coatings. The functional layer may be, for example, a support substrate, a heat dissipation layer, an electromagnetic wave shielding layer, a shock absorption layer, a binder layer, a pressure sensor, a digitizer, etc.

[0063] In an exemplary embodiment, the cover panel PTL may include a shock absorption layer CUS (or cushion layer) and a rigid plate MTL (or metal layer, metal plate), the shock absorption layer CUS includes portions CUS1 and CUS2, and the rigid plate MTL includes portions MTL1 and MTL2.

[0064] The shock absorption layer CUS may be disposed under the display module DM. The shock absorption layer CUS may be bonded to the lower surface of the display module DM through a separate adhesive layer (e.g., a pressure-sensitive adhesive layer PSA).

[0065] The shock absorption layer CUS may prevent or reduce the transmission of shocks from the outside (e.g., from the downward direction) to the display module DM. For example, the shock absorption layer CUS may include polyurethane (PU) (e.g., thermoplastic polyurethane (TPU)), poly(dimethylacrylamide) (PDMA), etc.

[0066] The shock absorption layer CUS may include a first shock absorption layer (or first pad) CUS1 and a second shock absorption layer (or second pad) CUS2 that are separated from each other. The first shock absorption layer CUS1 and the second shock absorption layer CUS2 may be disposed on the same layer and may be spaced apart from each other by a first distance D1 in a first direction DR1. The first distance D1 may be equal to the width of the folding region FA in the first direction DR1, but is not limited thereto.

[0067] The first shock absorption layer CUS1 may have a region corresponding to the first non-folding region NFA1 and may be disposed under the display module DM in the first non-folding region NFA1. Similarly, the second shock absorption layer CUS2 may have a region corresponding to the second non-folding region NFA2 and may be disposed under the display module DM in the second non-folding region NFA2. In this case, the first non-folding region NFA1, the second non-folding region NFA2, and the folding region FA may be distinguished by the shock absorption layer CUS (i.e., by being stacked with the shock absorption layer CUS).

[0068] In an exemplary embodiment, the first shock absorption layer CUS1 (or shock absorption layer CUS) may include a first opening OP1. The first opening OP1 may expose the display module DM by passing through the first shock absorption layer CUS1, and the first opening OP1 may provide a space in which a support member BOSS and a fingerprint sensor FPS, which will be described later, are installed. Since the fingerprint sensing ability of the fingerprint sensor FPS may deteriorate or decrease when the first shock absorption layer CUS1 is stacked with the fingerprint sensor FPS, the first opening OP1 may be formed in the first shock absorption layer CUS1.

[0069] The shock absorption layer CUS is shown in Figure 2A as not being provided in the folding region FA, but is not limited thereto. In some embodiments, for example, the shock absorption layer CUS may also be provided in the folding region FA.

[0070] A rigid plate MTL may be provided under the shock absorption layer CUS and may be bonded to the shock absorption layer CUS through a separate adhesive layer. The rigid plate MTL may be formed of a metal material such as stainless steel (SUS), or a polymer such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene (ABS), polyethylene terephthalate (PET), etc. The rigid plate MTL may reduce the degree of bending of the display module DM when exposed to an external force and may keep the display module DM in a relatively flat state.

[0071] The rigid plate MTL may include a first rigid plate (or first metal plate) MTL1 and a second rigid plate (or second metal plate) MTL2 that are separated from each other. The first rigid plate MTL1 and the second rigid plate MTL2 may be spaced apart from each other by a second interval D2 in a first direction DR1, and the second interval D2 may be smaller than the first interval D1 (or the width of the folding region FA).

[0072] The first rigid plate MTL1 and the second rigid plate MTL2 are shown in Figure 2A as being spaced apart from each other, but since Figure 2A this is only an example for clarifying that the first rigid plate MTL1 and the second rigid plate MTL2 are distinguishable from each other (different) (for example, the first rigid plate MTL1 and the second rigid plate MTL2 are two separate sheets), the embodiments or the spacing of the first rigid plate MTL1 and the second rigid plate MTL2 are not limited thereto. In some embodiments, for example, the second interval D2 may be substantially zero, and the first rigid plate MTL1 and the second rigid plate MTL2 may be provided in contact with each other.

[0073] The first rigid plate MTL1 may be bonded to the first shock-absorbing layer CUS1 through an adhesive layer, and the second rigid plate MTL2 may be bonded to the second shock-absorbing layer CUS2 through an adhesive layer.

[0074] The non-fold regions NFA1 and NFA2 and the fold region FA may be defined or set (e.g., formed) through the bonding between the display module DM, the shock-absorbing layer CUS, and the rigid plate MTL. The first non-fold region NFA1 may be a region where the display module DM, the first shock-absorbing layer CUS1, and the first rigid plate MTL1 are bonded in the third direction DR3 through an adhesive layer. Similarly, the second non-fold region NFA2 may be a region where the display module DM, the second shock-absorbing layer CUS2, and the second rigid plate MTL2 are bonded in the third direction DR3 through an adhesive layer. The fold region FA may be a region where the display module DM is not directly or indirectly bonded to the rigid plate MTL.

[0075] In an exemplary embodiment, the first rigid plate MTL1 (or the rigid plate MTL) may include a bent portion (part) (or a curved portion, a recessed portion) BEAD corresponding to the first opening OP1 of the first shock-absorbing layer CUS1. The bent portion BEAD may be a portion of the first rigid plate MTL1 that is bent or folded such that the first rigid plate MTL1 protrudes convexly in the downward direction, and may provide a space (e.g., a space formed by recessing the upper surface of the first rigid plate MTL1) in which the support member BOSS and the fingerprint sensor FPS are mounted on the upper surface of the first rigid plate MTL1.

[0076] In an exemplary embodiment, the cover panel PTL may further include a support member BOSS.

[0077] The support member BOSS may be disposed in the space formed by the first opening OP1 of the first shock-absorbing layer CUS1 and the bent portion BEAD of the first rigid plate MTL1. The support member BOSS may be disposed between the first shock-absorbing layer CUS1 and the fingerprint sensor FPS within the first opening OP1. The support member BOSS may be bonded to the lower surface of the display module DM through an adhesive layer and may be bonded to the upper surface of the first rigid plate MTL1 (or the bent portion BEAD) through an adhesive layer. However, the embodiment is not limited thereto. For example, the support member BOSS may be directly bonded to the upper surface of the first rigid plate MTL1 by thermal pressing. For example, the support member BOSS may be in contact with the lower surface of the display module DM but not bonded to the lower surface of the display module DM. The support member BOSS may support at least a part of some regions (e.g., the sensor arrangement region) of the display module DM corresponding to the first opening OP1 of the first shock-absorbing layer CUS1.

[0078] The support member BOSS can be formed of a metallic material such as stainless steel (SUS), a polymer such as polymethyl methacrylate (PMMA), polycarbonate (PC), polyvinyl alcohol (PVA), acrylonitrile-butadiene-styrene (ABS), polyethylene terephthalate (PET), etc. The support member BOSS can include the same material as that included in the rigid plate MTL (e.g., formed of the same material as that included in the rigid plate MTL).

[0079] In an exemplary embodiment, the support member BOSS can have a cylindrical or polygonal column (e.g., a square column) shape and can include a second opening (e.g., an internal through-hole or cavity). For example, the support member BOSS can have a pipe shape, an annular shape, or a donut shape. However, the embodiments are not limited thereto. For example, as Figure 2B shown, the support member BOSS can include sub-support members BOSS_S1 and BOSS_S2 that are spaced apart from each other by an interval corresponding to the second opening.

[0080] The fingerprint sensor FPS can be disposed in a space formed by the first opening OP1 of the first shock-absorbing layer CUS1, the bent portion BEAD of the first rigid plate MTL1, and the second opening of the support member BOSS (e.g., between their confluences). The support member BOSS can be disposed in the first opening OP1 of the first shock-absorbing layer CUS1 and the bent portion BEAD of the first rigid plate MTL1, the fingerprint sensor FPS can be disposed in the second opening of the support member BOSS, and the fingerprint sensor FPS can be bonded to the upper surface of the first rigid plate MTL1 (and / or bonded to the bent portion BEAD) through a separate adhesive layer.

[0081] The fingerprint sensor FPS can be a sensing element that recognizes a user's fingerprint (e.g., a received input from the user's fingerprint). The fingerprint sensor FPS can be connected to a fingerprint sensor driver (e.g., a flexible circuit board disposed under the first rigid plate MTL1 in the first non-folded area NFA1) through a separate wire, a flexible printed circuit substrate, a tape carrier package, a connecting member, a chip on film, etc.

[0082] The fingerprint sensor FPS can be a light-sensing type sensor (e.g., a light sensor), an infrared sensor, or an ultrasonic-sensing type sensor (e.g., an ultrasonic sensor).

[0083] In an exemplary embodiment, the fingerprint sensor FPS may be an ultrasonic sensing type sensor. The fingerprint sensor FPS may transmit an ultrasonic signal to a finger of a user that is in contact with the display module DM, and may receive a returned ultrasonic signal. The intensity of the returned ultrasonic signal may vary depending on whether the points on the user's fingerprint correspond to ridges or valleys, thereby enabling detection and recognition of the user's fingerprint. The fingerprint sensor FPS can recognize the user's fingerprint not only when the user's finger is in contact with the display module DM, but also when the user's finger moves while in a contact state.

[0084] As described with reference to Figure 2A The support member BOSS may be disposed in the first opening OP1 of the first shock absorption layer CUS1 and the bent portion BEAD of the first rigid plate MTL1. The support member BOSS may support at least a part (e.g., the sensor arrangement area) of the display module DM corresponding to the first opening OP1 of the first shock absorption layer CUS1. In addition, the fingerprint sensor FPS may be disposed in the second opening of the support member BOSS. The fingerprint sensor FPS may be coupled to the first rigid plate MTL1 (or the bent portion BEAD) and may be supported by the first rigid plate MTL1.

[0085] The fingerprint sensor FPS is shown in Figure 2A as being disposed within a support member BOSS having a square ring shape in the first non-fold region NFA1, but is not limited thereto.

[0086] Figure 2B and 2C are exploded perspective views showing examples of the display device Figure 1B .

[0087] Referring to Figures 2A to 2C , since Figure 2B and Figure 2C the display devices DD of Figure 2A are substantially identical or similar to the display device DD of

[0088] except for the arrangement of the fingerprint sensor FPS, a repetitive description will not be provided. Figure 2B As shown in Figure 2A , the first shock absorption layer CUS1 may include a first sub-opening (or first cut, first recessed portion) OP_S1. The first sub-opening OP_S1 may be formed at a side of the first shock absorption layer CUS1 adjacent to the folding region FA. Similarly, the second shock absorption layer CUS2 may include a second sub-opening (or second cut, second recessed portion) OP_S2, and the second sub-opening OP_S2 may be formed at a side of the second shock absorption layer CUS2 adjacent to the folding region FA. The first sub-opening OP_S1 and the second sub-opening OP_S2 may be formed corresponding to the Figure 2AThe space corresponding to the space formed by the first opening OP1 (e.g., the space where the support member BOSS and the fingerprint sensor FPS are provided).

[0089] The first rigid plate MTL1 may include a first bent portion BEAD_S1 corresponding to the first sub-opening OP_S1 of the first shock absorption layer CUS1, and the second rigid plate MTL2 may include a second bent portion BEAD_S2 corresponding to the second sub-opening OP_S2 of the second shock absorption layer CUS2. The first bent portion BEAD_S1 and the second bent portion BEAD_S2 may together form a space corresponding to the space formed by the Figure 2A bent portion BEAD (i.e., the space where the fingerprint sensor FPS is provided).

[0090] The support member BOSS may include a first sub-support member BOSS_S1 and a second sub-support member BOSS_S2 spaced apart from each other in the first direction DR1.

[0091] Each of the first sub-support member BOSS_S1 and the second sub-support member BOSS_S2 may have the shape of a polygonal column, and the length of the first sub-support member BOSS_S1 and the second sub-support member BOSS_S2 in the second direction DR2 may be greater than their width in the first direction DR1, but is not limited thereto.

[0092] The first sub-support member BOSS_S1 and the second sub-support member BOSS_S2 may be spaced apart from each other to form a space corresponding to the second opening of the support member BOSS described with reference to Figure 2A .

[0093] Meanwhile, the first shock absorption layer CUS1 and the second shock absorption layer CUS2 are described as respectively including Figure 2B the first sub-opening OP_S1 and the second sub-opening OP_S2 in, but is not limited thereto.

[0094] With reference to Figure 2C , in some embodiments, only the first shock absorption layer CUS1 may include a first opening OP1 corresponding to the first sub-opening OP_S1 (see Figure 2B ), and the second shock absorption layer CUS2 may not include a sub-opening.

[0095] In some embodiments, only the first rigid plate MTL1 may include a bent portion BEAD corresponding to the first opening OP1 of the first shock absorption layer CUS1, and the second rigid plate MTL2 may not include a bent portion. In addition, the support member BOSS corresponding to the first sub-support member BOSS_S1 (see Figure 2B ) may be provided only on the first rigid plate MTL1.

[0096] For example, the width of the folding region FA can be relatively large, the fingerprint sensor FPS (and the support member BOSS) can be relatively small, or the fingerprint sensor FPS can be set to be offset to one side within the folding region FA (e.g., toward the first non-folding region NFA1). In this case, only one selected from the first shock absorption layer CUS1 and the second shock absorption layer CUS2 may include a sub-opening, or the first shock absorption layer CUS1 and the second shock absorption layer CUS2 may not include a sub-opening. Similarly, only one selected from the first rigid plate MTL1 and the second rigid plate MTL2 may include a bent portion.

[0097] According to the setting of the fingerprint sensor FPS (e.g., the setting in the first non-folding region NFA1, the folding region FA), only the shape of the support member BOSS and the shape of the bent portion BEAD of the rigid plate MTL can be partially changed. However, the setting relationship and the bonding relationship among the support member BOSS, the bent portion BEAD, and the fingerprint sensor FPS can be substantially the same. Therefore, a description will be given with respect to the display device DD in which the fingerprint sensor FPS is set in the first non-folding region NFA1.

[0098] Figure 3 is a cross-sectional view showing an example of a display module included in Figure 2A the display device.

[0099] Referring to Figure 2A and Figure 3 , the display module DM may include a display panel DP and a touch sensor TS.

[0100] The touch sensor TS may be directly disposed on the display panel DP. In the present disclosure, "directly disposed" describes that the touch sensor TS is formed by a continuous process and is attached without using a separate adhesive layer (e.g., without an additional portion between the touch sensor TS and the display panel DP). However, the present disclosure is not limited thereto, and in some embodiments, another layer such as an adhesive layer, a substrate, etc. may be disposed between the display panel DP and the touch sensor TS.

[0101] The display panel DP may display any (any suitable) visual information, e.g., text, video, photo, two-dimensional or three-dimensional image, etc. Hereinafter, any visual information is referred to as an "image". The display panel DP may be any suitable display panel such as an organic light emitting diode display panel, a liquid crystal display panel, a plasma display panel, an electrophoretic display panel, an electro-wetting display panel, a quantum dot light emitting display panel, and a micro light emitting diode (LED) display panel. In an exemplary embodiment, an organic light emitting diode display panel is applied as the display panel DP.

[0102] The display panel DP may include a substrate SUB, a pixel circuit layer PCL disposed on the substrate SUB, a light-emitting element layer DPL disposed on the pixel circuit layer PCL, and a thin-film encapsulation layer TFE disposed on the light-emitting element layer DPL.

[0103] The substrate SUB may be formed of an insulating material such as glass, resin, etc. Additionally, the substrate SUB may be formed of a flexible material to be bent or folded, and may have a single-layer structure or a multi-layer structure. For example, the flexible material may include at least one selected from the group consisting of polystyrene, polyvinyl alcohol, polymethyl methacrylate, polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, cellulose triacetate, and cellulose acetate propionate. However, the material constituting the substrate SUB may be appropriately changed, and it may also be made of fiberglass-reinforced plastic (FRP). In an exemplary embodiment of the present disclosure, the substrate SUB may be formed of a flexible material.

[0104] The pixel circuit layer PCL may include a plurality of insulating layers, a plurality of conductive layers, and a semiconductor layer. The conductive layer may form signal lines or pixel driving circuits.

[0105] The light-emitting element layer DPL may include light-emitting (luminescent) elements to emit light.

[0106] The thin-film encapsulation layer TFE may seal the light-emitting element layer DPL. The thin-film encapsulation layer TFE may be formed not only of a single layer but also of multiple layers. The thin-film encapsulation layer TFE may include a plurality of insulating layers covering the light-emitting elements. The thin-film encapsulation layer TFE may include at least one inorganic layer and at least one organic layer. For example, the thin-film encapsulation layer TFE may have a structure in which the inorganic layer and the organic layer are alternately stacked. In some cases, the thin-film encapsulation layer TFE may be an encapsulation substrate disposed on the light-emitting element layer DPL and bonded to the substrate SUB through a sealant.

[0107] The touch sensor TS may be disposed on the surface of the display panel DP that emits images to sense a user's touch input. The touch sensor TS may identify a touch event of the display device DD through the user's hand or a separate input means. In some embodiments, for example, the touch sensor TS may identify a touch event in a capacitive manner (e.g., the touch sensor TS may be a capacitive touch sensor).

[0108] The touch sensor TS may include a plurality of touch electrodes and a plurality of sensing lines. The touch electrodes and the sensing lines may have a single-layer structure or a multi-layer structure.

[0109] The touch electrodes and sensing lines may include indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), indium tin zinc oxide (ITZO), PEDOT, metal nanowires, and / or graphene. The touch electrodes and sensing lines may include a metal layer, such as molybdenum, silver, titanium, copper, aluminum, and / or one or more alloys thereof. The touch electrodes and sensing lines may have the same layer structure or different layer structures.

[0110] In some embodiments, a window for protecting an exposed surface of the display module DM may be disposed on the display module DM. The window may protect the display module from external impacts and may provide an input surface and / or a display surface to a user. The window may be coupled to the display module DM through an optically transparent adhesive member.

[0111] In some embodiments, the window may have a multilayer structure formed of at least one selected from a glass substrate, a plastic film, and a plastic substrate. Such a multilayer structure may be formed by a continuous process or an adhesive process using one or more adhesive layers. All or part of the window may be flexible.

[0112] In some embodiments, the display module DM may further include a protective layer BRL. The protective layer BRL may be disposed or formed on a lower surface of the display panel DP (e.g., a surface on which the touch sensor TS is not disposed). The protective layer BRL may protect the display panel DP by absorbing and / or dispersing external impacts applied to the display panel DP. Additionally, the protective layer BRL may prevent or reduce the entry of external oxygen and moisture into the display panel DP.

[0113] The protective layer BRL may be formed as a plastic film including at least one organic layer. The plastic film may be formed of at least one thermoplastic polymer resin having high transparency and excellent thermal insulation properties (such as polycarbonate (PC), polyimide (PI), polyethersulfone (PES), polyarylate (PAR), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), cycloolefin copolymer, etc.) and at least one thermosetting polymer resin (such as epoxy resin, unsaturated polyester, phenol (PF), silicone resin, polyurethane, etc.). In exemplary embodiments of the present disclosure, the protective layer BRL is not limited to the materials described above, and any material suitable for the display conditions of the display panel DP among the materials capable of protecting the substrate SUB disposed thereon may be used to manufacture the protective layer BRL.

[0114] The protective layer BRL may be formed as a film to further ensure the flexibility of the display module DM. Additionally, an adhesive layer (e.g., a pressure-sensitive adhesive layer) may be disposed between the display panel DP and the protective layer BRL to firmly bond the display panel DP and the protective layer BRL.

[0115] Figure 4is a cross-sectional view showing an example of a display panel included in a display module of Figure 3 The display panel is shown in the following figure.

[0116] Referring to Figure 3 and Figure 4 , the pixel circuit layer PCL may include a buffer layer BFL, a first transistor T1 and a second transistor T2, an interlayer insulating layer ILD, a gate insulating layer GI, and a passivation layer PSV.

[0117] Figure 4 The first transistor T1 shown in

[0118] may directly or indirectly transfer a data signal to the second transistor T2 in response to an externally provided scan signal, and the second transistor T2 may provide a driving current to the light-emitting element OLED in response to the transferred data signal.

[0118] The buffer layer BFL may be disposed on the substrate SUB and may prevent or reduce impurity diffusion into the first transistor T1 and the second transistor T2. The buffer layer BFL may be provided as a single layer, or in some embodiments may be provided as a multi-layer of at least two layers. In some embodiments, the buffer layer BFL may be omitted depending on the material and process conditions of the substrate SUB.

[0119]

[0120]

[0121]

[0122]

[0123] ​The source electrode SE of each of the first transistor T1 and the second transistor T2 may be in contact with one selected from the first region and the second region of the corresponding semiconductor layer SCL through a contact hole penetrating through the interlayer insulating layer ILD and the gate insulating layer GI. For example, the source electrode SE of the first transistor T1 may be in contact with the first region of the corresponding semiconductor layer SCL through the first contact hole CH1 penetrating through the interlayer insulating layer ILD and the gate insulating layer GI, and the source electrode SE of the second transistor T2 may be in contact with the first region of the corresponding semiconductor layer SCL through the third contact hole CH3 penetrating through the interlayer insulating layer ILD and the gate insulating layer GI.

[0124] The drain electrode DE of each of the first transistor T1 and the second transistor T2 may be in contact with the other of the first region and the second region of the corresponding semiconductor layer SCL through a contact hole penetrating through the interlayer insulating layer ILD and the gate insulating layer GI. For example, the drain electrode DE of the first transistor T1 may be in contact with the second region of the corresponding semiconductor layer SCL through the second contact hole CH2 penetrating through the interlayer insulating layer ILD and the gate insulating layer GI, and the drain electrode DE of the second transistor T2 may be in contact with the second region of the corresponding semiconductor layer SCL through the fourth contact hole CH4 penetrating through the interlayer insulating layer ILD and the gate insulating layer GI.

[0125] The source electrode SE and the drain electrode DE of each of the first transistor T1 and the second transistor T2 are described as being electrically connected to separate electrodes of the semiconductor layer SCL, but the present disclosure is not limited thereto. According to an exemplary embodiment, the source electrode SE of each of the first transistor T1 and the second transistor T2 may be one selected from the first region and the second region adjacent to the channel region of each semiconductor layer SCL, and the drain electrode DE of each of the first transistor T1 and the second transistor T2 may be the other of the first region and the second region adjacent to the channel region of each semiconductor layer SCL. In this case, the drain electrode DE of the second transistor T2 may be electrically connected to the first electrode AE of the light-emitting element OLED through a bridge electrode or a contact electrode.

[0126] Each of the interlayer insulating layer ILD and the gate insulating layer GI may be formed of an inorganic insulating layer including an inorganic material or an organic insulating layer including an organic material.

[0127] A passivation layer PSV may be provided on the first transistor T1 and the second transistor T2 to cover the first transistor T1 and the second transistor T2. The passivation layer PSV may include a fifth contact hole CH5 that exposes a part of the drain electrode DE of the second transistor T2 to the outside.

[0128] A light-emitting element layer DPL may be provided on the passivation layer PSV and may include a light-emitting element OLED that emits light.

[0129] The light-emitting element OLED may include a first electrode AE and a second electrode CE, and an emission layer EML disposed between the two electrodes AE and CE. Here, one selected from the first electrode AE and the second electrode CE may be an anode, and the other selected from the first electrode AE and the second electrode CE may be a cathode. When the light-emitting element OLED is a front-emission type (for example, emits light in a direction toward the second electrode CE along the third direction DR3) organic light-emitting element, the first electrode AE may be a reflective electrode, and the second electrode CE may be a transmissive electrode. Hereinafter, a case where the light-emitting element OLED is a front-emission type organic light-emitting element and the first electrode AE is an anode will be described as an example.

[0130] The first electrode AE may be electrically connected to the drain electrode DE of the second transistor T2 through a fifth contact hole CH5 penetrating through the passivation layer PSV. The first electrode AE may include a reflective layer capable of reflecting light and a transparent conductive layer disposed on or under the reflective layer. At least one selected from the transparent conductive layer and the reflective layer may be electrically connected to the drain electrode DE of the second transistor T2.

[0131] The light-emitting element layer DPL may further include a pixel defining layer PDL having an opening OP exposing a part (for example, the upper surface of the first electrode AE) of the first electrode AE.

[0132] Each of the pixels provided in the display panel DP may be provided in a pixel region in a plan view. In an exemplary embodiment of the present disclosure, the pixel region may include a light-emitting region EMA and a non-light-emitting region NEMA adjacent to the light-emitting region EMA. The non-light-emitting region NEMA may be around the light-emitting region EMA (for example, surrounding the light-emitting region EMA). In an exemplary embodiment of the present disclosure, the light-emitting region EMA may be defined to correspond to the part of the first electrode AE exposed by the opening OP.

[0133] The light-emitting element OLED may include a hole control layer HCL and an electron control layer ECL.

[0134] The hole control layer HCL may be commonly provided in the light-emitting region EMA and the non-light-emitting region NEMA. A common layer such as the hole control layer HCL may be commonly formed in a plurality of pixels.

[0135] The emission layer EML may be disposed on the hole control layer HCL. The emission layer EML may be disposed in a region corresponding to the opening OP. For example, the emission layer EML may be individually disposed in each of a plurality of pixels. The emission layer EML may include an organic material and / or an inorganic material. In an exemplary embodiment of the present disclosure, a patterned emission layer EML is shown as an example, but according to the exemplary embodiment, the emission layer EML may be disposed commonly for the pixels. The color of the light generated in the emission layer EML may be one selected from red, green, blue, and white, but the exemplary embodiment of the present disclosure is not limited thereto. For example, the color of the light generated by the emission layer EML may be one selected from magenta, cyan, and yellow.

[0136] The electron control layer ECL may be disposed on the emission layer EML. The electron control layer ECL may be commonly formed in the pixels and may function to inject and / or transfer electrons to the emission layer EML.

[0137] The second electrode CE may be disposed on the electron control layer ECL. The second electrode CE may be disposed commonly for the pixels.

[0138] The thin film encapsulation layer TFE covering the second electrode CE may be disposed on the second electrode CE.

[0139] The thin film encapsulation layer TFE may be formed of a single layer and may be formed of multiple layers in some embodiments. The thin film encapsulation layer TFE may include a plurality of insulating layers covering the light emitting element OLED. More specifically, the thin film encapsulation layer TFE may include at least one inorganic layer and at least one organic layer. For example, the thin film encapsulation layer TFE may have a structure in which an inorganic film and an organic film are alternately stacked.

[0140] Figure 5 is a cross-sectional view showing an example of a display device taken along line I-I' Figure 1A of.

[0141] Referring to Figure 1A 、 Figure 2A and Figure 5 ,a first shock absorption layer CUS1 may be disposed under the display module DM, and the first shock absorption layer CUS1 may be bonded to the lower surface of the display module DM through an adhesive layer PSA. The adhesive layer PSA may be a pressure-sensitive adhesive film and may include an opening corresponding to a first opening OP1 of the first shock absorption layer CUS1.

[0142] A first rigid plate MTL1 may be disposed under the first shock absorption layer CUS1, and the first rigid plate MTL1 may be bonded to the first shock absorption layer CUS1 through the adhesive layer PSA.

[0143] The first rigid plate MTL1 may include a main body portion BDP and a bent portion BEAD. The bent portion BEAD may be stacked with the fingerprint sensor FPS and may include a flat portion BTP and a connecting portion (or inclined portion) CP.

[0144] The main body portion BDP may have a set or predetermined thickness, may have a substantially flat surface, and may constitute most of the first rigid plate MTL1 (e.g., the surface area or width of the first rigid plate MTL1). The main body portion BDP may be stacked with the first shock absorption layer CUS1.

[0145] The flat portion BTP may have a substantially flat surface and may have a height (or vertical position) different from that of the main body portion BDP. For example, the distance by which the flat portion BTP is spaced apart from the lower surface of the display module DM (e.g., below the lower surface of the display module DM) may be greater than the distance by which the main body portion BDP is spaced apart from the lower surface of the display module DM (e.g., below the lower surface of the display module DM).

[0146] The flat portion BTP may have an area equal to or greater than the area of the fingerprint sensor FPS in a plan view. In this case, the fingerprint sensor FPS may be sufficiently bonded to the flat portion BTP and supported by the flat portion BTP.

[0147] The connecting portion CP may extend from the boundary of the main body portion BDP to the flat portion BTP at a set or predetermined inclination and may connect the main body portion BDP and the flat portion BTP.

[0148] The main body portion BDP, the flat portion BTP, and the connecting portion CP may be integrally formed (e.g., formed as a single continuous sheet).

[0149] In an exemplary embodiment, the thickness (or average thickness) of the connecting portion CP (or the bent portion BEAD) may be smaller than the thickness of the main body portion BDP. The bent portion BEAD may be formed by extending a part of the first rigid plate MTL1 through a forging process, and then, the thickness of the connecting portion CP may be smaller than the thickness of the main body portion BDP.

[0150] The support member BOSS may be disposed between the display module DM and the first rigid plate MTL1 within the first opening OP1 of the first shock absorption layer CUS1.

[0151] The thickness H2 of the support member BOSS may be equal to the thickness of the first shock absorption layer CUS1 (or the total thickness H1 of the first shock absorption layer CUS1 and the adhesive layer PSA).

[0152] The support member BOSS may be adhered by an adhesive ADH (see Figure 6Bis coupled to the lower surface of the display module DM and can be coupled to the upper surface of the first rigid plate MTL1 through an adhesive ADH (see Figure 6B ). However, the exemplary embodiments are not limited thereto. For example, the support member BOSS can be coupled to the upper surface of the first rigid plate MTL1 through an adhesive and may not be coupled to the lower surface of the display module DM.

[0153] In the exemplary embodiment, the support member BOSS can be coupled to the main body portion BDP of the first rigid plate MTL1. In this case, some regions of the display module DM (for example, the regions corresponding to the first opening OP1 of the first shock absorption layer CUS1) can be supported by the support member BOSS and the main body portion BDP of the first rigid plate MTL1. Therefore, the movement of some regions of the display module DM in response to external pressure can be reduced, and the deformation of some regions of the display module DM and the external recognition of some regions of the display module DM in response to external pressure can be reduced.

[0154] The support member BOSS can have a size smaller (for example, narrower) than the first opening OP1 of the first shock absorption layer CUS1, and the support member BOSS can be spaced apart from the first shock absorption layer CUS1 by a reference interval D0, but is not limited thereto. Since the reference interval D0 includes or compensates for the dimensional deviation of the support member BOSS and the alignment error between the first opening OP1 of the first shock absorption layer CUS1 and the support member BOSS, in some embodiments, the support member BOSS can have a size substantially the same as the first opening OP1 of the first shock absorption layer CUS1, and at least a part of the support member BOSS can be in contact with the first shock absorption layer CUS1.

[0155] The support member BOSS can include a second opening OP2. The width W2 of the second opening OP2 (and the width or diameter of the support member BOSS) can be smaller than the width W1 of the first opening OP1 of the first shock absorption layer CUS1. In addition, the width W2 of the second opening OP2 can be larger than the width W0 of the fingerprint sensor FPS.

[0156] Within the second opening OP2 of the support member BOSS, the fingerprint sensor FPS can be disposed on the first rigid plate MTL1. As Figure 5 shown, the fingerprint sensor FPS can be disposed on the flat portion BTP (or the bent portion BEAD) of the first rigid plate MTL1.

[0157] The fingerprint sensor FPS can be coupled to the upper surface of the first rigid plate MTL1 through a first fixing member FXM1. For example, the first fixing member FXM1 can be a pressure-sensitive adhesive film, but is not limited thereto.

[0158] The thickness (or height) of the fingerprint sensor FPS in the third direction DR3 (or the total thickness (or height) H0 of the fingerprint sensor FPS and the first fixing member FXM1 in the third direction DR3) may be greater than the thickness H1 of the first shock-absorbing layer CUS1. However, the fingerprint sensor FPS may be spaced apart from the lower surface of the display module DM due to the height (vertical position) of the flat portion BTP of the first rigid plate MTL1. For example, the fingerprint sensor FPS may be in a floating state from (e.g., relative to) the display module DM.

[0159] The fingerprint sensor FPS may be coupled to the first rigid plate MTL1, and the first rigid plate MTL1 may contact the display module DM through the support member BOSS. In this case, an additional movement path of the ultrasonic signal (or ultrasonic wave) emitted from the fingerprint sensor FPS may be provided via the support member BOSS.

[0160] For example, the fingerprint sensor FPS may generate a first ultrasonic signal USW1 by vibration, and the first ultrasonic signal USW1 may be emitted in the third direction DR3. However, the fingerprint sensor FPS may be coupled to the first rigid plate MTL1, and the first rigid plate MTL1 may be hard or rigid. Therefore, the second ultrasonic signal USW2 caused by the vibration of the fingerprint sensor FPS may propagate through the first rigid plate MTL1 and also through the support member BOSS coupled to the first rigid plate MTL1, and the second ultrasonic signal USW2 may be emitted in the third direction DR3. The additionally emitted second ultrasonic signal USW2 may compensate for the first ultrasonic signal USW1 and may improve the fingerprint sensing ability of the fingerprint sensor FPS.

[0161] As described with reference to Figure 5 The support member BOSS may compensate for the step related to the first opening OP1 of the first shock-absorbing layer CUS1 and may transmit the signal of the fingerprint sensor FPS. Therefore, the phenomenon that the fingerprint sensor FPS is visually recognized in the display module DM may be alleviated, and the fingerprint sensing ability of the fingerprint sensor FPS may be improved.

[0162] Figure 6A and Figure 6B are diagrams showing operations in the process of mounting an ultrasonic sensor on the display device of Figure 5 .

[0163] First, referring to Figure 6A , a bent portion BEAD may be formed at the first rigid plate MTL1 through a forging process (see Figure 5 ).

[0164] For example, a preparation may be made with a bent portion BEAD (see Figure 5a mold MF having a corresponding shape, and the first rigid plate MTL1 can be provided on the mold MF. Next, the first rigid plate MTL1 can be pressed by a presser PSU having a shape (or pressing portion) corresponding to the bent portion BEAD (see Figure 5 ).

[0165] Next, as shown in Figure 6B , a support member BOSS can be provided on the first rigid plate MTL1. An adhesive ADH can be provided on the upper and lower surfaces of the support member BOSS, and the support member BOSS can be bonded to the upper surface of the first rigid plate MTL1 through the adhesive ADH.

[0166] Similarly, a fingerprint sensor FPS can be provided on the first rigid plate MTL1. The fingerprint sensor FPS can be bonded to the upper surface of the first rigid plate MTL1 through a first fixing member FXM1 disposed between the fingerprint sensor FPS and the first rigid plate MTL1.

[0167] The fingerprint sensor FPS can be provided or formed after the support member BOSS is formed on the first rigid plate MTL1, but the forming order is not limited thereto. For example, the support member BOSS can be provided after the fingerprint sensor FPS is provided on the first rigid plate MTL1.

[0168] The first rigid plate MTL1, the support member BOSS, and the fingerprint sensor FPS can form a first structure.

[0169] Next, the first structure can be bonded to the display module DM, and a first shock absorption layer CUS1 including a first opening OP1 can be bonded to the display module DM through a lamination process. The first rigid plate MTL1 can be bonded to the first shock absorption layer CUS1 through an adhesive layer PSA disposed below the first shock absorption layer CUS1, and the support member BOSS can be bonded to the lower surface of the display module DM through the adhesive ADH.

[0170] Figure 7 is a cross-sectional view showing another example of the display device taken along the line I-I' of Figure 1A . Figures 8A to 8C is a rear view showing an example of the display device of Figure 7 .

[0171] Referring to Figure 5 and Figure 7 , since the display device DD of Figure 7 is substantially identical or similar to the display device DD of Figure 5 except for the first rigid plate MTL1, a repeated description will not be provided.

[0172] The first rigid plate MTL1 may further include a cutout P_INC. The cutout P_INC may be a cut portion of the first rigid plate MTL1, may have a slit shape, and may expose the surface or a part of the first shock absorption layer CUS1. The cutout P_INC may be formed in the first rigid plate MTL1 by laser processing (e.g., laser hole patterning, laser cutting).

[0173] The cutout P_INC may be formed at the main body portion BDP of the first rigid plate MTL1, may be further spaced apart from the support member BOSS with respect to the fingerprint sensor FPS (e.g., disposed outside the support member BOSS), and may be further spaced apart from the first opening OP1 (or one side of the first shock absorption layer CUS1) of the first shock absorption layer CUS1 with respect to the fingerprint sensor FPS. The cutout P_INC may overlap with the first shock absorption layer CUS1. In this case, the cutout P_INC may reduce the propagation of the second ultrasonic signal USW2 described with reference to Figure 5 in the first direction DR1 (and / or the second direction DR2) through the main body portion BDP of the first rigid plate MTL1, and may allow the second ultrasonic signal USW2 to propagate in the third direction DR3 through the support member BOSS or facilitate the propagation of the second ultrasonic signal USW2 in the third direction DR3 through the support member BOSS.

[0174] The cutout P_INC may be formed to correspond to at least a part of the first opening OP1 of the first shock absorption layer CUS1, or may be formed corresponding to the support member BOSS.

[0175] With reference to Figure 8A , the support member BOSS may have a planar shape of a quadrilateral (or a rectangle or a square ring). In this case, the cutout P_INC may include sub - cutouts P_INC1, P_INC2, P_INC3, and P_INC4 provided corresponding to at least a part of the side surface (or the lateral surface) of the support member BOSS.

[0176] For example, the incision P_INC may include a first sub-incision P_INC1, a second sub-incision P_INC2, a third sub-incision P_INC3, and a fourth sub-incision P_INC4. The first sub-incision P_INC1, the second sub-incision P_INC2, the third sub-incision P_INC3, and the fourth sub-incision P_INC4 may be separated from each other and have the shape of a slit. The first sub-incision P_INC1 may be disposed adjacent to the left side of the support member BOSS. The second sub-incision P_INC2 may be disposed adjacent to the right side of the support member BOSS (e.g., adjacent to the right side of the support member BOSS in a direction opposite to or parallel to the first direction DR1 with respect to the support member BOSS). The third sub-incision P_INC3 may be disposed adjacent to the upper side of the support member BOSS. The fourth sub-incision P_INC4 may be disposed adjacent to the lower side of the support member BOSS (e.g., adjacent to the lower side of the support member BOSS in a direction opposite to or parallel to the second direction DR2 with respect to the support member BOSS).

[0177] Meanwhile, the first sub-incision P_INC1, the second sub-incision P_INC2, the third sub-incision P_INC3, and the fourth sub-incision P_INC4 are shown as being separated from each other in Figure 8A , but are not limited thereto. For example, at least two of the first sub-incision P_INC1, the second sub-incision P_INC2, the third sub-incision P_INC3, and the fourth sub-incision P_INC4 may be connected to each other (e.g., to form a larger composite incision).

[0178] Referring to Figure 8B , in some embodiments, the support member BOSS may have a circular (or ring-shaped) planar shape. In this case, the incision P_INC may include sub-incisions P_INC1, P_INC2, and P_INC3 that are disposed corresponding to at least a part of the boundary of the support member BOSS.

[0179] For example, the incision P_INC may include a first sub-incision P_INC1, a second sub-incision P_INC2, and a third sub-incision P_INC3. The first sub-incision P_INC1, the second sub-incision P_INC2, and the third sub-incision P_INC3 may be separated from each other and may each have the shape of an arc (together substantially forming a ring). The first sub-incision P_INC1, the second sub-incision P_INC2, and the third sub-incision P_INC3 may be disposed in different directions with respect to the support member BOSS, respectively.

[0180] Referring to Figure 8C, in some embodiments, the support member BOSS may include sub - support members BOSS_S1 and BOSS_S2, both having a quadrilateral planar shape. In this case, the incision P_INC may include sub - incisions P_INC1 and P_INC2 correspondingly provided for at least a part of the sub - support members BOSS_S1 and BOSS_S2.

[0181] For example, the support member BOSS may include a first sub - support member BOSS_S1 disposed in a first direction DR1 with respect to the fingerprint sensor FPS and a second sub - support member BOSS_S2 disposed in a direction opposite to the first direction DR1. The incision P_INC may include a first sub - incision P_INC1 and a second sub - incision P_INC2 having a slit shape. The first sub - incision P_INC1 may be disposed adjacent to the first sub - support member BOSS_S1, and the second sub - incision P_INC2 may be disposed adjacent to the second sub - support member BOSS_S2. However, the exemplary embodiments are not limited thereto, and the incision P_INC may include the first sub - incision P_INC1, the second sub - incision P_INC2, the third sub - incision P_INC3, and the fourth sub - incision P_INC4 described with reference to Figure 8A The support member BOSS and the incision P_INC shown in Figure 8C may be applied to a display device DD in which the fingerprint sensor FPS is disposed in the folding region FA (see Figure 1B and Figure 2B ).

[0182] As described with reference to Figures 7 to 8C , the first rigid plate MTL1 may include an incision P_INC formed outside the support member BOSS corresponding to at least a part of the support member BOSS (or, the first opening OP1 of the first shock - absorbing layer CUS1). Thus, the intensity of the second ultrasonic signal USW2 propagated through the support member BOSS can be relatively increased or retained, and the fingerprint sensing ability of the fingerprint sensor FPS can be improved.

[0183] Figure 9A is a cross - sectional view showing another example of the display device taken along the line I - I' of Figure 1A . Figure 9B is a diagram showing the operations in the process of mounting an ultrasonic sensor on the display device of Figure 9A .

[0184] Referring to Figure 5 and Figure 9A , Figure 9A the display device DD of Figure 5 differs from the display device DD of Figure 9A in that the display device DD of Figure 9AThe display device DD is substantially identical or similar to Figure 5 the display device DD except for the second fixing member FXM2, so a repeated description will not be provided.

[0185] The second fixing member FXM2 can be disposed between the display module DM and the fingerprint sensor FPS within the second opening OP2 of the support member BOSS (or within the first opening OP1 of the first shock absorbing layer CUS1).

[0186] As Figure 9B shown, after the support member BOSS and the fingerprint sensor FPS are disposed on the first rigid plate MTL1, the second fixing member FXM2 can be filled in the second opening OP2 of the support member BOSS.

[0187] When the first rigid plate MTL1 (or the first structure) on which the support member BOSS and the fingerprint sensor FPS are disposed is bonded to the first shock absorbing layer CUS1 and the display module DM, the second fixing member FXM2 can bond the fingerprint sensor FPS to the lower surface of the display module DM.

[0188] In an exemplary embodiment, the second fixing member FXM2 can include a thermosetting resin having adhesiveness due to a chemical reaction by heat. For example, the thermosetting resin can include epoxy resin, amino resin, phenolic resin, polyester resin, etc. formed of organic materials.

[0189] In an exemplary embodiment, the second fixing member FXM2 can be formed of a photocurable resin including a photoinitiator that is crosslinked and cured by light (such as ultraviolet light or UV light).

[0190] As Figure 9B shown, after the second fixing member FXM2 is filled in the second opening OP2 of the support member BOSS, the second fixing member FXM2 can be subjected to a first curing process (or a temporary curing process). After the first rigid plate MTL1 (or the first structure) on which the support member BOSS and the fingerprint sensor FPS are disposed is bonded to the first shock absorbing layer CUS1 and the display module DM, the second fixing member FXM2 can be subjected to a secondary curing process.

[0191] In an exemplary embodiment, the viscosity of the second fixing member FXM2 can be 50 centipoise (cps) or less. In this case, the transmission of the first ultrasonic signal USW1 (and the ultrasonic signal reflected by a finger) described with reference to Figure 5 can be improved.

[0192] As described with reference to Figure 9A and Figure 9BAs described, the second fixing member FXM2 can be disposed between the display module DM and the fingerprint sensor FPS within the second opening OP2 of the support member BOSS. Accordingly, the signal transmission characteristics and fingerprint sensing ability of the fingerprint sensor FPS can be improved.

[0193] Figure 10 is a cross-sectional view showing another example of a display device taken along line I-I' of Figure 1A .

[0194] Referring to Figure 5 and Figure 10 , Figure 10 the display device DD of Figure 5 differs from the display device DD of Figure 10 in that the display device DD of Figure 10 further includes a third fixing member FXM3. Since Figure 5 the display device DD of

[0195] is substantially identical or similar to the display device DD of

[0196] except for the third fixing member FXM3, a repeated description will not be provided.

[0197] The third fixing member FXM3 can be implemented as a film including polyurethane (PU) (e.g., thermoplastic polyurethane (TPU)), silicone resin, poly(dimethylacrylamide) (PDMA), etc. In this case, the third fixing member FXM3 can have characteristics such as high creepability, high elasticity, high recoverability, etc.

[0198] The third fixing member FXM3 can support some regions of the display module DM corresponding to the second opening OP2 of the support member BOSS, and can prevent or reduce deformation of some regions of the display module DM due to external pressure (e.g., finger pressing by a user's finger).

[0199] Figure 11A is a cross-sectional view showing another example of a display device taken along line I-I' of Figure 1A . Figure 11B is a cross-sectional view showing an example of a display device taken along line I-I' of Figure 11AA diagram of an example of a support member in a display device. Figure 11C shows Figure 11A a rear view of an example of a display device.

[0200] Referring to Figure 5 and Figure 11A , Figure 11A display device DD is substantially identical or similar to Figure 5 display device DD except for support member BOSS_1. Therefore, duplicate descriptions will not be provided.

[0201] Support member BOSS_1 may include a bottom (e.g., base) portion BOT, a protruding portion PRO, and an extension portion EXT. For example, support member BOSS_1 may have a cross-sectional shape that can be described as a lying "C" (e.g., a rectangular frame with a C-shaped clamp shape, with the opening facing the fingerprint sensor FPS and the rigid plate MTL, e.g., the opening is placed around the fingerprint sensor FPS).

[0202] Bottom portion BOT may have a set or predetermined thickness "T" and a substantially flat surface, and may have an area equal to or similar to the area of the first opening OP1 of the first shock absorption layer CUS1. Bottom portion BOT may contact the lower surface of the display module DM and may be bonded to the lower surface of the display module DM through a separate adhesive layer.

[0203] Protruding portion PRO may extend from at least a part of the boundary of bottom portion BOT in the third direction DR3. The height of protruding portion PRO (i.e., the thickness H2 of support member BOSS_1 defined by protruding portion PRO in the third direction DR3) may be equal to the thickness H1 of the first shock absorption layer CUS1.

[0204] Extension portion EXT may extend from the end of protruding portion PRO toward the fingerprint sensor FPS and may be parallel to bottom portion BOT. Extension portion EXT may contact the side portion of the fingerprint sensor FPS, but is not limited thereto.

[0205] The portion on the lower side of extension portion EXT may contact the main body portion BDP of the first rigid plate MTL1. In this case, some areas of the display module DM may be supported by the main body portion BDP of the first rigid plate MTL1 through the bottom portion BOT, protruding portion PRO, and extension portion EXT (or a part of extension portion EXT) of support member BOSS_1.

[0206] In an exemplary embodiment, support member BOSS_1 may be manufactured by applying a bending process to the plate member MP.

[0207] Referring to Figure 11B, the plate member MP has a set or predetermined thickness T and may have a planar shape of a quadrilateral (e.g., substantially rectangular) (e.g., before the bending process). Additionally, a first recessed portion P_CON1 and a second recessed portion P_CON2 may be formed at both ends of the plate member MP. The first recessed portion P_CON1 and the second recessed portion P_CON2 may have a shape corresponding to the planar shape of the fingerprint sensor FPS. For example, both the first recessed portion P_CON1 and the second recessed portion P_CON2 may have a planar shape of a quadrilateral (rectangular), a semi-circular shape, etc. However, the exemplary embodiments are not limited thereto, and the plate member MP may include only one selected from the first recessed portion P_CON1 and the second recessed portion P_CON2, or may not include a recessed portion in some embodiments.

[0208] The plate member MP may be bent along a first reference line L_B1, a second reference line L_B2, a third reference line L_B3, and a fourth reference line L_B4 to become a support member BOSS_1 as shown in the lower part of Figure 11B .

[0209] Referring to Figure 11C , the support member BOSS_1 (or an extension portion EXT of the support member BOSS_1 and the first recessed portion P_CON1 and the second recessed portion P_CON2) may be in contact with the fingerprint sensor FPS. In this case, vibrations (or ultrasonic signals) generated from the fingerprint sensor FPS may propagate in the third direction DR3 through the side portion, the extension portion EXT, and the protruding portion PRO of the fingerprint sensor FPS. Therefore, the fingerprint sensing ability of the fingerprint sensor FPS can be improved.

[0210] The extension portions of the support member BOSS_1 are shown to be spaced apart from each other, but are not limited thereto. For example, the extension portions may be in contact with each other.

[0211] As shown in Figure 11C , the first rigid plate MTL1 may include a structure substantially similar to the cutout P_INC (i.e., the first sub-cutout P_INC1 and the second sub-cutout P_INC2) described with reference to Figure 8C . In this case, the transmission of ultrasonic signals of the fingerprint sensor FPS can be further improved, and the sensing ability of the fingerprint sensor FPS can be further improved.

[0212] As described with reference to Figures 11A to 11C , the support member BOSS_1 may include a bottom portion BOT and a protruding portion PRO. Therefore, most of the regions of the display module DM corresponding to the first opening OP1 of the first shock absorption layer CUS1 may be supported by the bottom portion BOT and the protruding portion PRO, and deformation of these regions can be prevented or reduced.

[0213] In some embodiments, the support member BOSS_1 may further include an extension portion EXT that extends from the end of the protruding portion PRO and contacts the side surface of the fingerprint sensor FPS. Accordingly, a part of the ultrasonic signal of the fingerprint sensor FPS can be transmitted through the extension portion EXT and the protruding portion PRO, and the fingerprint sensing ability of the fingerprint sensor FPS can be improved.

[0214] Meanwhile, in Figures 11A to 11C the support member BOSS_1 is shown as including the extension portion EXT, but the support member BOSS_1 is not limited thereto. For example, the support member BOSS_1 may only include the bottom portion BOT and the protruding portion PRO, and may not include the extension portion EXT.

[0215] Figure 12 is a cross-sectional view showing another example of the display device taken along the line I-I' of Figure 1A

[0216] Referring to Figure 5 and Figure 12 , because Figure 12 the display device DD of Figure 5 is substantially identical or similar to the display device DD of

[0217] except for the first rigid plate MTL1' and the support member BOSS, a repetitive description will not be provided. Figure 12 the main body portion BDP, the flat portion BTP, and the connecting portion CP of Figure 5 are substantially identical or similar to the main body portion BDP, the flat portion BTP, and the connecting portion CP described with reference to

[0218] The area (or size, width) of the flat portion BTP of the first rigid plate MTL1' may be equal to or greater than the area (or size, width) of the support member BOSS.

[0219] The thickness H2' of the support member BOSS may be greater than the thickness of the first shock absorption layer CUS1 (or the total thickness H1 of the first shock absorption layer CUS1 and the adhesive layer PSA).

[0220] In this case, the support member BOSS may be bonded to the flat portion BTP of the first rigid plate MTL1'. The support member BOSS described with reference to Figure 5 may be supported by the main body portion BDP of the first rigid plate MTL1, while Figure 12 ​The support member BOSS shown in the figure can be supported by the flat portion BTP of the first rigid plate MTL1'.

[0221] In some embodiments, when the first rigid plate MTL1' includes the cutout P_INC described with reference to Figure 7 the cutout P_INC may be formed in the connection portion CP rather than in the main body portion BDP.

[0222] Figure 13 is a diagram showing operations in a process of mounting a support member on a display device shown in Figure 12 .

[0223] With reference to Figure 13 , a mold MF having a shape corresponding to the support member BOSS and the bent portion BEAD (see Figure 12 ) can be prepared, and the first rigid plate MTL1' can be provided on the mold MF. In addition, the support member BOSS can be provided on the presser PSU'.

[0224] Next, the first rigid plate MTL1' can be pressed by the presser PSU' and the support member BOSS. When the support member BOSS and the first rigid plate MTL1' include the same material, the support member BOSS can be bonded to the first rigid plate MTL1' due to the pressure and heat of the presser PSU'.

[0225] Next, as described with reference to Figure 6B , similarly, the fingerprint sensor FPS can be provided on the first rigid plate MTL1', the first rigid plate MTL1' can be bonded to the first shock-absorbing layer CUS1 by a lamination process or the like, and then, a display device DD of Figure 12 can be manufactured.

[0226] As used herein, when expressions such as "at least one of...", "one of...", and "selected from..." follow a list of elements, such expressions modify the entire list of elements rather than a single element in the list. In addition, when describing embodiments of the present disclosure, the use of "may" means "one or more embodiments of the present disclosure".

[0227] As used herein, the terms "substantially", "about", and similar terms are used as approximate terms rather than terms of degree, and are intended to explain the inherent deviation of measured or calculated values that would be recognized by a person of ordinary skill in the art.

[0228] The technical scope of the present disclosure can be determined by the technical scope of the appended claims. In addition, all changes or modifications falling within the meaning and scope of the claims and their equivalents will be construed as being included within the scope of the present disclosure.

Claims

1. A display device, the display device comprising: A display module; A shock absorption layer located below the display module, the shock absorption layer including a first opening exposing a lower surface of the display module; A rigid plate located below the shock absorption layer; A sensor within the first opening between the display module and the rigid plate, the sensor being coupled to an upper surface of the rigid plate; And A support member within the first opening between the shock absorption layer and the sensor, the support member contacting the display module and the rigid plate, Wherein the rigid plate includes a main body portion stacked with the shock absorption layer and a bent portion stacked with the sensor, Wherein the bent portion includes a flat portion and a connecting portion, the flat portion having a height different from that of the main body portion with respect to a surface of the display module, the connecting portion being inclined with respect to the main body portion and extending from the main body portion to the flat portion, and Wherein the support member contacts the flat portion.

2. The display device according to claim 1, wherein, The sensor is spaced apart from the display module, Wherein the support member and the rigid plate include the same material, and Wherein the sensor includes an ultrasonic sensor, an optical sensor, and an infrared sensor.

3. The display device according to claim 1, wherein, The support member has a planar shape of a circular ring or a square ring.

4. The display device according to claim 1, wherein, A thickness of the connecting portion is smaller than an average thickness of the main body portion.

5. The display device according to claim 1, wherein, The rigid plate has a cutout formed at an outer side of the support member with respect to the sensor, Wherein the cutout is stacked with the shock absorption layer, Wherein the cutout has a planar shape corresponding to a planar shape of the support member, Wherein the cutout includes a plurality of sub-cutouts separated from each other, Wherein, in a plan view, the support member is located around at least a part of the sensor and includes a plurality of sub-support members separated from each other, and Wherein the sub-cutouts are respectively formed corresponding to the sub-support members.

6. The display device according to claim 1, the display device further comprising: A fixing member located between the display module and the sensor, Wherein the fixing member includes at least one selected from a thermosetting resin and a photocurable resin.

7. The display device according to claim 1, the display device further comprising: A fixing member located between the display module and the sensor, Wherein the fixing member includes at least one selected from polyurethane, silicone resin, and polydimethylacrylamide.

8. The display device according to claim 1, wherein, The support member includes: A bottom portion parallel to a lower surface of the display module; and A protruding portion extending downward from an end of the bottom portion, Wherein the bottom portion contacts the lower surface of the display module, Wherein the protruding portion is coupled to the rigid plate, Wherein the support member further includes an extending portion extending from a lower end of the protruding portion toward the sensor, Wherein the extending portion contacts the sensor, Wherein the support member is manufactured by bending a plate member, and the support member includes a recessed portion corresponding to a planar shape of the sensor, Wherein, the rigid plate includes a cut formed adjacent to the protruding portion, and wherein, the cut is stacked with the shock absorption layer.

9. The display device according to claim 1, wherein, The rigid plate and the support member are integrally formed.

10. A display device, the display device comprising: a display module including a first non-foldable area and a second non-foldable area and a foldable area located between the first non-foldable area and the second non-foldable area; a first shock absorption layer and a second shock absorption layer respectively located below the first non-foldable area and the second non-foldable area of the display module; a rigid plate including a first sub-rigid plate and a second sub-rigid plate respectively located below the first shock absorption layer and the second shock absorption layer; a sensor located between the foldable area of the display module and the rigid plate and bonded to the upper surface of the rigid plate; and a support member located between the first shock absorption layer and the second shock absorption layer in a plan view and around the sensor, wherein, the rigid plate includes a main body portion stacked with the first shock absorption layer and the second shock absorption layer and a bent portion stacked with the sensor, wherein, the bent portion includes a flat portion and a connecting portion, the flat portion has a height different from that of the main body portion with respect to the surface of the display module, the connecting portion is inclined with respect to the main body portion and extends from the main body portion to the flat portion, and wherein, the support member contacts the flat portion.

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