Display device

Abstract

According to an embodiment of the present disclosure, a display device includes: a display panel having a display area for displaying an image and a non-display area adjacent to the display area; a protective film disposed below the display panel; and an adhesive component disposed between the display panel and the protective film, having a thickness of 15um to 18um, and defining a first non-folding area, a folding area, and a second non-folding area in sequence in a first direction. Therefore, the present disclosure can provide a display device with reduced defects.

Description

Technical Field

[0001] The present disclosure relates to a display device, and more particularly, to a display device with reduced defects. Background Art

[0002] Various display devices are being developed for multimedia devices such as televisions, mobile phones, tablet computers, navigation devices, game consoles, etc. In order to meet the use of multimedia devices, the form of the display device is changing.

[0003] Recently, various forms of flexible display devices are being developed. For example, rollable, foldable, and retractable display devices are being developed. Depending on the form of the display device, unpredictable defects may occur. Summary of the invention

[0004] An object of the present disclosure is to provide a display device having reduced defects in a folding area of ​​a foldable device.

[0005] The object of the present disclosure is to provide a display device that can be applied to a chip on plastic (COP) structure without defects.

[0006] In an embodiment, the display device may include: a display panel, having a display area for displaying an image and a non-display area adjacent to the display area; a protective film, arranged below the display panel; and an adhesive component, arranged between the display panel and the protective film, having a thickness of 15um to 18um, and defining a first non-folding area, a folding area, and a second non-folding area in sequence in a first direction.

[0007] The protective film may be made of polyimide.

[0008] The adhesive member may include an acrylic compound.

[0009] The acrylic compound may include buthylacrylate, ethylacrylate and acrylic acid.

[0010] Alternatively, the display device according to an embodiment further includes a driving chip mounted on the display panel.

[0011] The driving chip may be configured on the non-display area of ​​the second non-folding area.

[0012] Alternatively, the driving chip may be directly mounted on the display panel.

[0013] The adhesive component may adhere the display panel and the protective film in the first non-folding area, the second non-folding area, and the folding area.

[0014] The display panel may have a thickness of 35 um to 40 um.

[0015] The protective film may have a thickness of 47 um to 52 um.

[0016] In an embodiment, the display device may include: a display panel having a display area for displaying an image and a non-display area adjacent to the display area; a protective film arranged below the display panel; an adhesive component arranged between the display panel and the protective film and having a thickness of 15um to 18um; and a driving chip mounted on the display panel, the protective film being composed of polyimide, and the adhesive component containing an acrylic compound.

[0017] The display panel may include a base layer, and the base layer includes a polyimide substrate.

[0018] The protective film may be disposed under the polyimide substrate.

[0019] The thickness of the adhesive component may be 16 um to 17 um.

[0020] The protective film may have a thickness of 50 um.

[0021] Effects of the Invention

[0022] As described above, the present disclosure can provide a display device that reduces interface peeling and other defects in the folding area of ​​a foldable device. The display device according to an embodiment of the present disclosure can be applied to a COP structure while reducing defects in a foldable or flexible device. Therefore, an embodiment of the present disclosure can achieve high resolution, simplify the process, and save material costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1a to Figure 1c is a perspective view of a display device according to an embodiment of the present disclosure.

[0024] Figures 2a to 2f is a cross-sectional view of a display device according to an embodiment of the present disclosure.

[0025] Figure 3 is a cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0026] Figure 4 is a top view of a display panel according to an embodiment of the present disclosure.

[0027] Figure 5is an enlarged cross-sectional view of a display panel according to an embodiment of the present disclosure.

[0028] Figures 6a to 6c is a diagram showing a display device according to an embodiment of the present disclosure.

[0029] Description of Reference Numerals

[0030] DD: Display Device

[0031] DP: Display Panel

[0032] DA: Display Area

[0033] NDA: Non-Display Area

[0034] PF: Protective Film

[0035] PSA: Bonding parts

[0036] NFA1: First non-folding region

[0037] NFA2: Second non-folding region

[0038] FA: Folding Area

[0039] TH: Thickness DETAILED DESCRIPTION

[0040] In this specification, when it is mentioned that a certain component (or region, layer, part, etc.) is "on" other components, "connected" or "combined" to other components, it means that it can be directly connected / combined to other components, or a third component can be arranged between them.

[0041] The same reference numerals refer to the same components. In addition, in the drawings, the thickness, proportion and size of the components are exaggerated for the effective description of the technical content. "And / or" includes all the combinations that can be defined by the relevant components.

[0042] The terms "first", "second", etc. may be used to describe various constituent elements, but the constituent elements are not limited to the above terms. The above terms are only used to distinguish one constituent element from other constituent elements. For example, without departing from the scope of the present disclosure, the first constituent element may be named as the second constituent element, and similarly, the second constituent element may be named as the first constituent element. Singular expressions include plural expressions unless otherwise clearly indicated in the context.

[0043] In addition, terms such as “below”, “below”, “above”, and “upper” are used to explain the relationship between the structures shown in the drawings. The above terms are relative concepts and are explained based on the directions shown in the drawings.

[0044] The terms "include" or "have" should be understood as specifying the features, numbers, steps, actions, constituent elements, accessories or combinations thereof recorded in the specification, and do not preclude the existence or additional possibility of one or more other features or numbers, steps, actions, constituent elements, parts or combinations thereof.

[0045] Unless otherwise defined, all terms (including technical terms and scientific terms) used in this specification have the same meanings as those commonly understood by those skilled in the art to which the present disclosure belongs. In addition, terms that are the same as terms defined in commonly used dictionaries should be interpreted as having the same meanings in the context of the relevant technology, unless interpreted as ideal or overly formalized meanings, which may be clearly defined here.

[0046] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings.

[0047] Figure 1a to Figure 1c FIG. 1 is a perspective view of a display device DD according to an embodiment of the present disclosure. Figure 1a As shown, the display device DD can display the image IMG through the display surface DD-IS. The display surface DD-IS is parallel to the plane defined by the first direction DR1 and the second direction DR2. The normal direction of the display surface DD-IS, that is, the thickness direction of the display device DD indicates the third direction DR3.

[0048] The front (or top) and back (or bottom) of each component or unit described below are distinguished by the third direction DR3. However, the first direction DR1 to the third direction DR3 shown in this embodiment are only examples. Hereinafter, the first direction to the third direction may be defined as the directions indicated by the first direction DR1 to the third direction DR3, respectively, with reference to the same reference numerals.

[0049] like Figure 1a As shown, the display surface DD-IS includes a display area DD-DA for displaying an image IMG and a non-display area DD-NDA adjacent to the display area DD-DA. The non-display area DD-NDA is an area where no image is displayed. Figure 1a , an icon image is shown as an example of the image IMG.

[0050] like Figure 1aAs shown, the display area DD-DA may be a quadrilateral. The non-display area DD-NDA may surround the display area DD-DA. However, this is not limited thereto, and the shape of the display area DD-DA and the shape of the non-display area DD-NDA may be designed relatively.

[0051] like Figure 1a to Figure 1c As shown, the display device DD may include a plurality of areas defined according to the action form. The display device DD may include a first area NFA1, a second area NFA2, and a third area FA disposed between the first area NFA1 and the second area NFA2. The third area FA is an area folded based on the folding axis FX (on the basis of the folding axis), and is essentially an area forming a curvature. Hereinafter, the first area NFA1, the second area NFA2, and the third area FA may be referred to as the first non-folding area NFA1, the second non-folding area NFA2, and the folding area FA.

[0052] like Figure 1b As shown, the display device DD may be folded inwardly (inner-folding) so that the display surface DD-IS of the first non-folding area NFA1 and the display surface DD-IS of the second non-folding area NFA2 face each other. Figure 1c As shown, the display device DD can also be folded outward (outer-folding) to expose the display surface DD-IS to the outside.

[0053] In an embodiment of the present disclosure, the display device DD may include a plurality of folding areas FA. Furthermore, the folding areas FA may be defined to correspond to the form in which the user operates the display device DD. Figure 1b as well as Figure 1c The folding area FA can be defined to be parallel to the first direction DR1 or to be defined to be diagonal. The area of ​​the folding area FA is not fixed and can be determined according to the curvature radius. In one embodiment of the present disclosure, the display device DD can also be configured to only repeat Figure 1a as well as Figure 1b The action pattern shown, or just repeat Figure 1a as well as Figure 1c In this embodiment, a foldable display device is disclosed, but it is not limited thereto. The display device DD according to an embodiment of the present disclosure may include a flexible display device other than a foldable display device.

[0054] In this embodiment, a display device DD that can be used in a mobile phone terminal is exemplified. Although not shown in the figure, the electronic module, camera module, power module, etc. installed on the mainboard can be configured together with the display device DD on a bracket / shell, etc., to form a mobile phone terminal. The display device DD according to the present disclosure can be applied to large electronic devices such as televisions and monitors, and even small and medium-sized electronic devices such as tablet computers, car navigation systems, game consoles, smart watches, etc.

[0055] Figure 2a to Figure 2f is a cross-sectional view of a display device DD according to an embodiment of the present disclosure. Figure 2a to Figure 2f A cross section defined by the second direction DR2 and the third direction DR3 is shown. Figure 2a to Figure 2f In order to illustrate the stacking relationship of the functional panels and / or functional units constituting the display device DD, they are simply shown.

[0056] The display device DD according to an embodiment of the present disclosure may include a display panel, an input sensing unit, an anti-reflection unit, and a window unit. At least a portion of the display panel, the input sensing unit, the anti-reflection unit, and the window unit may be formed by a continuous process, or at least a portion of the display panel, the input sensing unit, the anti-reflection unit, and the window unit may be bonded to each other by an adhesive component. Figures 2a to 2f In the embodiment, as the adhesive component, an optically transparent adhesive component OCA is exemplarily shown. The adhesive component described below may include a pressure-sensitive adhesive, a common adhesive or an adhesive. In one embodiment, the optically transparent adhesive component OCA may have a thickness of 15um to 18um. In one embodiment of the present disclosure, the anti-reflection unit and the window unit may be replaced or omitted with other structures.

[0057] exist Figure 2a to Figure 2f In the input sensing unit, anti-reflection unit and window unit, the corresponding structure formed by a continuous process with other structures is expressed as a "layer". In the input sensing unit, anti-reflection unit and window unit, the structure combined with other structures by an adhesive component is expressed as a "panel". The panel includes a base layer providing a base surface, such as a synthetic resin film, a composite material film, a glass substrate, etc., but the base layer can be omitted in the "layer". In other words, the unit expressed as a "layer" is arranged on the base surface provided by other units.

[0058] The input sensing unit, anti-reflection unit, and window unit can be called input sensing panel ISP, anti-reflection panel RPP, window panel WP, or input sensing layer ISL, anti-reflection layer RPL, and window layer WL according to the presence or absence of a substrate layer.

[0059] like Figure 2aAs shown, the display device DD may include a display panel DP, an input sensing layer ISL, an anti-reflection panel RPP, and a window panel WP. The input sensing layer ISL is directly disposed on the display panel DP. In this specification, "B configuration is directly disposed on A configuration" means that no additional adhesive layer / adhesive component is disposed between A configuration and B configuration. B configuration is formed by a continuous process on the substrate surface provided with A configuration after A configuration is formed.

[0060] The display module DM includes the display panel DP and the input sensing layer ISL directly disposed on the display panel DP. An optically transparent adhesive member OCA is disposed between the display module DM and the anti-reflection panel RPP, and between the anti-reflection panel RPP and the window panel WP.

[0061] The display panel DP generates an image, and the input sensing layer ISL obtains coordinate information of an external input (e.g., a touch event). The display module DM may further include a protective film PF disposed under the display panel DP. The protective film PF and the display panel DP may be combined by an adhesive component PSA. The adhesive component PSA may be equivalent to a pressure-sensitive adhesive. Figure 2b to Figure 2f The display device DD may also include a protective film PF. The protective film PF protects the display panel DP from external impacts. As long as it is a general protective film known in the technical field, there is no limitation on the use of the protective film PF. For example, the protective film PF may be a polyimide (PI) film. For example, the protective film PF may be a flexible film. When a protective film PF composed of polyimide (PI) is used, compared with other protective films PF, in the folding area of ​​the flexible or foldable display device, the peeling or defect of the interface can be relatively reduced. Figures 6a to 6c Detailed description is given in .

[0062] The display panel DP according to an embodiment of the present disclosure may be a light-emitting display panel, which is not particularly limited. For example, the display panel DP may be an organic light-emitting display panel or a quantum dot light-emitting display panel. The light-emitting layer of the organic light-emitting display panel may include an organic light-emitting substance. The light-emitting layer of the quantum dot light-emitting display panel may include quantum dots and quantum rods, etc. In the following, the display panel DP is described as an organic light-emitting display panel.

[0063] The anti-reflection panel RPP reduces the reflectivity of external light incident from the upper side of the window panel WP. The anti-reflection panel RPP according to an embodiment of the present disclosure may include a phase retarder and a polarizer. The phase retarder may be a film type or a liquid crystal coating type, and may include a λ / 2 phase retarder and / or a λ / 4 phase retarder. The polarizer may also be a film type or a liquid crystal coating type. The film type may include an extended synthetic resin film, and the liquid crystal coating type may include liquid crystals arranged in a predetermined arrangement. The phase retarder and the polarizer may also include a protective film. The phase retarder and the polarizer themselves or the protective film may be defined as the base layer of the anti-reflection panel RPP.

[0064] The anti-reflection panel RPP according to an embodiment of the present disclosure may include a color filter. The color filter has a predetermined arrangement. The arrangement of the color filter may be determined in consideration of the luminous color of the pixels included in the display panel DP. The anti-reflection panel RPP may further include a black matrix adjacent to the color filter.

[0065] The window panel WP according to an embodiment of the present disclosure includes a base film WP-BS and a light shielding pattern WP-BZ. The base film WP-BS may include a glass substrate and / or a synthetic resin film, etc. The base film WP-BS is not limited to a single layer. The base film WP-BS may include two or more films bonded by an adhesive component.

[0066] The light shielding pattern WP-BZ partially overlaps with the base film WP-BS. The light shielding pattern WP-BZ may be disposed on the back of the base film WP-BS, thereby defining a frame area of ​​the display device DD, namely, a non-display area DD-NDA (see FIG. 1 ).

[0067] The light shielding pattern WP-BZ is a colored organic film, which can be formed by a coating method, for example. Although not shown separately, the window panel WP may also include a functional coating layer disposed in front of the base film WP-BS. The functional coating layer may include an anti-fingerprint layer, an anti-reflection layer, and a hard coating layer. Figure 2b to Figure 2f In the figure, the window panel WP and the window layer WL are simply shown without distinguishing between the base film WP-BS and the light shielding pattern WP-BZ.

[0068] like Figure 2b as well as Figure 2c As shown, the display device DD may include a display panel DP, an input sensing panel ISP, an anti-reflection panel RPP, and a window panel WP. The stacking order of the input sensing panel ISP and the anti-reflection panel RPP may be changed.

[0069] like Figure 2dAs shown, the display device DD may include a display panel DP, an input sensing layer ISL, an anti-reflection layer RPL, and a window layer WL. The bonding component is omitted from the display device DD, and the input sensing layer ISL, the anti-reflection layer RPL, and the window layer WL may be formed on the substrate surface provided on the display panel DP through a continuous process. The stacking order of the input sensing layer ISL and the anti-reflection layer RPL may be changed.

[0070] like Figure 2e as well as Figure 2f As shown, the display device DD may not include an additional anti-reflection unit.

[0071] like Figure 2e As shown, the display device DD may include a display panel DP, an input sensing layer ISL-1, and a window panel WP. Figure 2a to Figure 2d Different from the input sensing panel ISP or the input sensing layer ISL shown, the input sensing layer ISL- 1 according to this embodiment may also have an anti-reflection function.

[0072] like Figure 2f As shown, the display device DD may include a display panel DP-1, an input sensing layer ISL, and a window panel WP. Figure 2a to Figure 2e Unlike the display panel DP shown, the display panel DP-1 according to this embodiment may also have an anti-reflection function.

[0073] exist Figure 2a to Figure 2f As shown in FIG. 1 , the input sensing unit and the display panel are entirely overlapped. Figure 2a As shown, the input sensing unit may fully overlap the display area DD-DA.

[0074] However, in one embodiment of the present disclosure, the input sensing unit may also overlap only partially with the display area DD-DA, or overlap only with the non-display area DD-NDA. The input sensing unit may be a touch sensing panel that senses the touch of the user, or a fingerprint sensing panel that senses the fingerprint information of the user's finger. The spacing of the sensing electrodes and the width of the sensing electrodes described below may be changed according to the purpose of the input sensing unit. The sensing electrodes of the touch sensing panel may have a width of several mm to tens of mm, and the sensing electrodes of the fingerprint sensing panel may have a width of tens of um to hundreds of um.

[0075] Figure 3 is a cross-sectional view of a display panel DP according to an embodiment of the present disclosure. The display panel DP described below may be applicable to Figure 2a to Figure 2f All display devices DD are described.

[0076] like Figure 3As shown, the display panel DP includes a base layer BL, a circuit element layer DP-CL arranged on the base layer BL, a display element layer DP-OLED and a thin film encapsulation layer TFE. Although not shown, the display panel DP may also include functional layers such as an anti-reflection layer and a refractive index adjustment layer.

[0077] The base layer BL may include a synthetic resin film. A synthetic resin layer is formed on a working substrate used in manufacturing the display panel DP. Thereafter, a conductive layer, an insulating layer, and the like are formed on the synthetic resin layer. If the working substrate is removed, the synthetic resin layer corresponds to the base layer BL. The synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. In addition, the base layer BL may include a glass substrate, a metal substrate, or an organic / inorganic composite material substrate, and the like. For example, the base layer BL may be equivalent to a polyimide (PI) substrate. In one embodiment, the display device DD may attach a protective film PF to the bottom of the base layer BL through an adhesive component PSA.

[0078] The circuit element layer DP-CL includes at least one insulating layer and a circuit element. Hereinafter, the insulating layer included in the circuit element layer DP-CL is referred to as an intermediate insulating layer. The intermediate insulating layer includes at least one intermediate inorganic film and at least one intermediate organic film. The circuit element includes a signal line, a pixel driving circuit, etc. The circuit element layer DP-CL can be formed by a formation process of an insulating layer, a semiconductor layer, and a conductive layer based on coating, evaporation, etc. and a patterning process of an insulating layer, a semiconductor layer, and a conductive layer based on a photolithography process.

[0079] The display element layer DP-OLED may include a light emitting element, an organic light emitting diode, or an organic film such as a pixel definition film.

[0080] The thin film encapsulation layer TFE seals the display element layer DP-OLED. The thin film encapsulation layer TFE includes at least one insulating layer. The thin film encapsulation layer TFE according to an embodiment of the present disclosure may include at least one inorganic film (hereinafter, encapsulated inorganic film). The thin film encapsulation layer TFE according to an embodiment of the present disclosure may include at least one organic film (hereinafter, encapsulated organic film) and at least one encapsulated inorganic film.

[0081] The encapsulation inorganic film protects the display element layer DP-OLED from moisture / oxygen, and the encapsulation organic film protects the display element layer DP-OLED from foreign matter such as dust particles. The encapsulation inorganic film may include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, etc., without particular limitation. The encapsulation organic film may include an acrylic organic film, without particular limitation.

[0082] Figure 4is a top view of the display panel DP according to an embodiment of the present disclosure.

[0083] Reference Figure 4 , the display panel DP may include a driving circuit GDC, a plurality of signal lines SGL, a plurality of signal pads DP-PD, a plurality of first connection pads DPS-PD, and a plurality of pixels PX (hereinafter, pixels). The pixels PX are arranged in the display area DP-DA. Each pixel PX includes an organic light emitting diode and a pixel driving circuit connected to the organic light emitting diode. The driving circuit GDC, the signal lines SGL, the signal pads DP-PD, the first connection pads DPS-PD, and the pixel driving circuit may include Figure 3 The circuit element layer DP-CL is shown in FIG.

[0084] The drive circuit GDC may include a scan drive circuit. The scan drive circuit generates a plurality of scan signals (hereinafter, scan signals) and sequentially outputs the scan signals to a plurality of scan lines GL (hereinafter, scan lines) described later. The scan drive circuit may further output another control signal to the drive circuit GDC of the pixel PX.

[0085] The scan driving circuit may include a plurality of thin film transistors formed by the same process as the driving circuit GDC of the pixel PX, for example, an LTPS (Low Temperature Polycrystalline Silicon) process or an LTPO (Low Temperature Polycrystalline Oxide) process.

[0086] The signal lines SGL include scan lines GL, data lines DL, power lines PL, and control signal lines CSL. The scan lines GL are connected to corresponding pixels PX in the pixels PX, respectively, and the data lines DL are connected to corresponding pixels PX in the pixels PX, respectively. The power lines PL are connected to the pixels PX. The control signal lines CSL can provide control signals to the scan driving circuit.

[0087] The signal line SGL overlaps the display area DP-DA and the non-display area DP-NDA. Each signal line SGL may include a pad portion and a line portion. The line portion overlaps the display area DP-DA and the non-display area DP-NDA. The pad portion is connected to the end of the line portion. The pad portion is arranged in the non-display area DP-NDA and overlaps with a corresponding signal pad in the signal pads DP-PD.

[0088] Hereinafter, in this specification, a region in the non-display area DP-NDA where the signal pads DP-PD are arranged may be defined as a chip region NDA-DC, and a region where the first connection pads DPS-PD are arranged may be defined as a first pad region NDA-PC.

[0089] According to an embodiment of the present disclosure, a driving chip DC may be mounted on the chip area NDA-DC. The signal pads DP-PD are electrically connected to the driving chip DC to transmit an electrical signal received from the driving chip DC to the signal lines SGL.

[0090] Specifically, the signal pads DP-PD include first signal pads DP-PD1 arranged in a first row along the first direction DR1 and second signal pads DP-PD2 arranged in a second row along the first direction DR1. However, it is not limited thereto, and the signal pads DP-PD may be arranged in a row along the first direction DR1.

[0091] A portion of the circuit board PCB may be disposed on the first pad area NDA-PC. The first connection pad DPS-PD is electrically connected to the circuit board PCB, thereby transmitting an electrical signal received from the circuit board PCB to the signal pad DP-PD. The circuit board PCB may be rigid or flexible. For example, when the circuit board PCB is flexible, it may be provided as a flexible printed circuit board (Flexible Printed Circuit Board).

[0092] The circuit board PCB may include a timing control circuit for controlling the action of the display panel DP. The timing control circuit may be mounted on the circuit board PCB in the form of an integrated chip. In addition, although not shown, the circuit board PCB may include an input sensing circuit for controlling the input sensing unit.

[0093] The circuit board PCB may include a second connection pad DPS-PDz electrically connected to the display panel DP. The second connection pad DPS-PDz may be configured in a second pad area defined in the circuit board PCB. The second connection pad DPS-PDz is electrically bonded to the first connection pad DPS-PD. For example, the first connection pad DPS-PD and the second connection pad DPS-PDz may be electrically connected to each other through an anisotropic conductive film (Anisotropic Conductive Film), or may be in direct contact through ultrasonic bonding.

[0094] Figure 5 is an enlarged cross-sectional view of a display panel DP according to an embodiment of the present disclosure.

[0095] Reference Figure 5 The display panel DP may include a plurality of insulating layers and semiconductor patterns, conductive patterns, signal lines, etc. The insulating layers, semiconductor layers, and conductive layers are formed by coating, evaporation, etc. Thereafter, the insulating layers, semiconductor layers, and conductive layers may be selectively patterned by photolithography. In this way, semiconductor patterns, conductive patterns, signal lines, etc. included in the circuit element layer DP-CL and the display element layer DP-OLED are formed.

[0096] The base layer BL may include a synthetic resin film. The synthetic resin layer may include a thermosetting resin. The base layer BL may have a multilayer structure. For example, the base layer BL may also have a three-layer structure of a synthetic resin layer, an adhesive layer and a synthetic resin layer. In particular, the synthetic resin layer may be a polyimide resin layer, and its material is not particularly limited. The synthetic resin layer may include at least one of acrylic resin, methacrylic resin, polyisoprene, vinyl resin, epoxy resin, polyurethane resin, cellulose resin, siloxane resin, polyamide resin and perylene resin. In addition, the base layer BL may include a glass substrate, a metal substrate or an organic / inorganic composite material substrate, etc.

[0097] At least one inorganic layer is formed on the base layer BL. The inorganic layer may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer may be formed into multiple layers. The multiple inorganic layers may constitute a barrier layer and / or a buffer layer. In this embodiment, the display panel DP is shown to include a buffer layer BFL.

[0098] The buffer layer BFL improves the bonding force between the base layer BL and the semiconductor pattern. The buffer layer BFL may include a silicon oxide layer and a silicon nitride layer. The silicon oxide layer and the silicon nitride layer may be alternately stacked.

[0099] A semiconductor pattern is disposed on the buffer layer BFL. The semiconductor pattern may include polysilicon. However, it is not limited thereto, and the semiconductor pattern may also include amorphous silicon or metal oxide.

[0100] Figure 5 Only a partial semiconductor pattern is shown, and a semiconductor pattern may be configured in other areas of the pixel PX on a plane. The semiconductor pattern may be arranged according to a specific rule across the pixel PX. The semiconductor pattern has different electrical properties depending on whether it is doped. The semiconductor pattern may include a doped region and an undoped region. The doped region may be doped by an N-type dopant or a P-type dopant. A P-type transistor includes a doped region doped by a P-type dopant.

[0101] like Figure 5 As shown, the source S1, active area A1 and drain D1 of the first transistor T1 are formed from a semiconductor pattern, and the source S2, active area A2 and drain D2 of the second transistor T2 are formed from a semiconductor pattern. The sources S1, S2 and drains D1, D2 extend from the active areas A1, A2 in opposite directions in cross section.

[0102] A first insulating layer 10 is disposed on the buffer layer BFL. The first insulating layer 10 overlaps with a plurality of pixels PX (see Figure 4), and covers the semiconductor pattern. The first insulating layer 10 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The first insulating layer 10 may include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 may be a single-layer silicon oxide layer. Not only the first insulating layer 10, but also the insulating layer of the circuit element layer DP-CL described later may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. The inorganic layer may include at least one of the above substances.

[0103] The gates G1 and G2 are disposed on the first insulating layer 10. The gates G1 and G2 may be part of the metal pattern. The gates G1 and G2 overlap with the active areas A1 and A2. In the process of doping the semiconductor pattern, the gates G1 and G2 act as masks.

[0104] A second insulating layer 20 covering the gates G1 and G2 is disposed on the first insulating layer 10. The second insulating layer 20 overlaps the pixel PX (see Figure 4 The second insulating layer 20 may be an inorganic layer and / or an organic layer, and may have a single-layer or multi-layer structure. In this embodiment, the second insulating layer 20 may be a single-layer silicon oxide layer.

[0105] An upper electrode UE may be disposed on the second insulating layer 20. The upper electrode UE may overlap with the gate G2 of the second transistor T2. The upper electrode UE may be a portion of the metal pattern. A portion of the gate G2 and the upper electrode UE overlapping the gate G2 may define a capacitor. In one embodiment of the present disclosure, the upper electrode UE may also be omitted.

[0106] A third insulating layer 30 covering the upper electrode UE is disposed on the second insulating layer 20. In this embodiment, the third insulating layer 30 may be a single-layer silicon oxide layer.

[0107] like Figure 5 As shown, the display area DP-DA may include a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA may surround the light emitting area PXA. In the present embodiment, the light emitting area PXA is defined to correspond to a partial area of ​​the first electrode AE ​​exposed through the opening portion OP.

[0108] The hole control layer HCL may be disposed in both the light emitting area PXA and the non-light emitting area NPXA. The hole control layer HCL includes a hole transport layer and may also include a hole injection layer. A light emitting layer EML is disposed on the hole control layer HCL. The light emitting layer EML may be disposed in an area corresponding to the opening OP. That is, the light emitting layer EML may be disposed in each pixel PX (refer to Figure 4 ) are separated and formed.

[0109] An electron control layer ECL is disposed on the light emitting layer EML. The electron control layer ECL includes an electron transport layer and may also include an electron injection layer. The hole control layer HCL and the electron control layer ECL may be formed together in a plurality of pixels using an opening mask. A second electrode CE is disposed on the electron control layer ECL. The second electrode CE has an integral shape and is disposed together in a plurality of pixels PX (refer to Figure 4 ).

[0110] Figures 6a to 6c is a diagram showing a display device according to an embodiment of the present disclosure.

[0111] Figure 6a is a top view of the display device, Figure 6b It is a cross-sectional view taken along the cutting plane from I to I', showing the developed state. Figure 6c It is shown Figure 6b Figure folded state.

[0112] Reference Figure 6a According to an embodiment, the display device DD defines a display area DA for displaying an image and a non-display area NDA surrounding the display area DA on a plane. The display device DD can define a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 in sequence in the first direction DR1. In an embodiment, when the display device DD defines the first non-folding area NFA1, the folding area FA, and the second non-folding area NFA2, it can be equivalent to a foldable display device. Figure 6a , a foldable display device having a folding area FA is shown, however, the display device DD is not limited to a foldable display device and may include a rigid or all kinds of flexible display devices.

[0113] The display device DD may include a driver chip DC. The driver chip DC may be configured in the non-display area DNA. Specifically, the driver chip DC may be configured in the non-display area NDA of the second non-folding area NFA2. The driver chip DC may be directly mounted on the display panel DP of the display device DD. The driver chip DC may be equivalent to an electronic component that transmits a driving signal to the display panel DP. For example, the driver chip DC may generate a driving signal required for the display panel DP to operate based on a control signal transmitted from the outside. The driver chip DC may provide a control signal for the pixels PX (refer to Figure 4) signal. The driving chip DC can be electrically connected to the display panel DP by ultrasonic bonding. The driving chip DC can be installed on the display panel DP in various ways. There are a chip on glass (COG, Chip On Glass) method with a hard glass substrate directly attached to the display panel DP, a chip on film (COF, Chip On Film) method with other flexible films superimposed on the display panel DP, and a chip on plastic (COP, Chip On Plastic) method directly attached to the flexible display panel DP. In one embodiment, the driving chip DC can be directly attached to the display panel DP by COP method. In this embodiment, the display panel DP may include flexible polyimide (PI).

[0114] Reference Figure 6b as well as Figure 6c , the display device DD may include a display panel DP, a protective film PF disposed under the display panel DP, and an adhesive component PSA disposed between the display panel DP and the protective film PF. The protective film PF may be disposed under the polyimide substrate of the display panel DP. In one embodiment, the protective film PF may be composed of polyimide (PI). For example, the protective film PF may include transparent polyimide. The adhesive component PSA may contain an acrylic compound. For example, the acrylic compound may include buthylacrylate, ethylacrylate, and acrylic acid or a mixture thereof. The adhesive component PSA may be equivalent to a pressure-sensitive adhesive (Pressure Sensitive Adhesive). The thickness TH of the adhesive component PSA may be equivalent to 15um to 18um.

[0115] In one embodiment, when the thickness TH of the adhesive member PSA is 15um to 18um, the thickness of the display panel DP may be 35um to 40um, preferably 37um. The thickness of the protective film PF may be 47um to 52um, preferably 50um.

[0116] exist Figure 6b as well as Figure 6c In the embodiment, the adhesive component PSA may adhere the display panel DP and the protection film PF in the first non-folding area NFA1, the second non-folding area NFA2 and the folding area FA. The display panel DP, the protection film PF and the adhesive component PSA may all be folded or unfolded in the folding area FA.

[0117] Table 1

[0118]

[0119] Table 1 shows the probability of failure in the folding area FA of the display device DD according to the thickness of the adhesive component PSA. In Table 1, the pressure is 39 MPa higher than usual for the purpose of experiment. Table 1 can show the probability of the protective film PF being peeled off from the display panel DP according to the thickness TH of the adhesive component PSA. For example, the display device DD is Figure 6b or Figure 6c During the unfolding or folding process shown, the display panel DP and the protective film PF can be unfolded or folded respectively. The protective film PF can be peeled off from the display panel DP in the folding area FA. In Table 1, it can be confirmed that when the thickness TH of the adhesive component PSA is 25um, 4 of the 10 samples put in caused defects. When the thickness TH of the adhesive component PSA is 15um, no defects such as peeling in the folding area FA occurred in all the samples put in. In Table 1, it can be confirmed that when it is a foldable display device, the thickness TH of the best adhesive component PSA that does not cause defects in the folding area FA is 15um. However, if the thickness TH of the adhesive component PSA is too thin, problems other than the peeling problem in the folding area FA that cannot be confirmed in Table 1 may occur. For example, adhesion problems may be caused in the first non-folding area NFA1 and the second non-folding area NFA2. In this embodiment, the display device DD may include an adhesive component PSA having a thickness TH of 15um to 18um.

[0120] Table 2

[0121]

[0122] Table 2 shows the strain rate (Strain, %) of each thickness TH of the adhesive component PSA applicable in the applicable inspection model relative to the existing model (Ref model), that is, in the display device DD according to one embodiment of the present disclosure, which is equivalent to a foldable display device applicable to the COP structure. It can be seen that the existing model has a strain rate of 0.092% when the thickness TH of the adhesive component PSA is 25um. The display device DD according to this embodiment has a strain rate of 0.105% when including an adhesive component PSA with a thickness TH of 15um, and a strain rate of 0.095% when including an adhesive component PSA with a thickness TH of 18um. That is, it can be seen that the strain rate has the smallest deviation compared to the existing model in 15um to 18um. For example, it can be seen that the strain rate deviation relative to the existing model at 18um is smaller than that at 15um. That is, it can be confirmed that it is different from the minimum defective rate at 15um shown in Table 1. When the display device DD uses an adhesive component PSA that is too thick at 25um or too thin at 10um, it shows a large deviation compared to the existing model. The display device DD of the present disclosure may include an adhesive component PSA disposed between the display panel DP and the protective film PF and having a thickness TH of 15um to 18um. In another embodiment, although not shown in Tables 1 and 2, the display device DD may include an adhesive component PSA having a thickness TH of 16um to 17um. In this case, the thickness of the protective film PF may be 47um to 52um, preferably, 50um.

[0123] Therefore, the present disclosure may disclose a foldable (or flexible) display device DD including a driving chip DC directly mounted on a display panel DP and defining a first non-folding area NFA1, a folding area FA, and a second non-folding area NFA2 in sequence in a first direction. The display device DD according to an embodiment of the present disclosure includes a protective film PF composed of polyimide and an adhesive component PSA including an acrylic compound and having a thickness TH of 15um to 18um, thereby being able to reduce defects in the folding area FA.

[0124] As described above, embodiments are disclosed in the drawings and the specification. Specific terms are used, but they are used only for the purpose of illustrating the present disclosure, and are not used to limit the meaning or the scope of the present disclosure recorded in the claims. Therefore, it is understood that various modifications and other equivalent embodiments can be made therefrom for those with ordinary knowledge in the technical field. Therefore, the true technical protection scope of the present disclosure should be determined by the technical concept of the claims.

Claims

1. A display device, wherein: include: A display panel having a display area for displaying an image and a non-display area adjacent to the display area; An anti-reflection panel, arranged above the display panel; A protective film, disposed below the display panel; as well as The adhesive component is disposed between the display panel and the protective film and has a thickness of 15 um to 18 um. A first non-folding area, a folding area and a second non-folding area are defined in sequence in a first direction, The protective film is made of polyimide. The thickness of the protective film is 47um to 52um. The thickness of the display panel is 35um to 40um. The adhesive component adheres the display panel and the protective film in the first non-folding area, the second non-folding area, and the folding area.

2. The display device according to claim 1, wherein: The adhesive member includes an acrylic compound.

3. The display device according to claim 2, wherein: The acrylic compound includes at least one of butyl acrylate, ethyl acrylate and acrylic acid.

4. The display device according to claim 1, wherein: Also includes: A driving chip is mounted on the display panel.

5. The display device according to claim 4, wherein: The driving chip is configured on the non-display area of ​​the second non-folding area.

6. The display device according to claim 5, wherein: The driving chip is directly mounted on the display panel.

7. The display device according to claim 1, wherein: The display device further includes: An optically transparent adhesive member is disposed between the display panel and the anti-reflection panel.

8. A display device, wherein: include: A display panel having a display area for displaying an image and a non-display area adjacent to the display area; An anti-reflection panel, arranged above the display panel; A protective film, disposed below the display panel; An adhesive component, disposed between the display panel and the protective film, having a thickness of 15 um to 18 um; as well as A driver chip is mounted on the display panel. The protective film is made of polyimide. The adhesive component comprises an acrylic compound, The thickness of the display panel is 35um to 40um. The thickness of the protective film is 47um to 52um. A first non-folding area, a folding area and a second non-folding area are defined in sequence in a first direction, The adhesive component adheres the display panel and the protective film in the first non-folding area, the second non-folding area, and the folding area.

9. The display device according to claim 8, wherein: The display panel includes a base layer, The base layer includes a polyimide substrate.

10. The display device according to claim 9, wherein: The protective film is disposed under the polyimide substrate.

11. The display device according to claim 8, wherein: The thickness of the adhesive component is 16 um to 17 um.

12. The display device according to claim 11, wherein: The thickness of the protective film is 50 um.

13. The display device according to claim 8, wherein: The display device further includes: An optically transparent adhesive member is disposed between the display panel and the anti-reflection panel.

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