Intelligent power module and electronic device having the same

Abstract

The present invention discloses an intelligent power module and an electronic device having the same; the intelligent power module comprises a ceramic substrate and a first frame and a second frame respectively connected to both sides of the ceramic substrate, the ceramic substrate comprises a plurality of ceramic plates arranged in sequence along a preset direction, and two adjacent ceramic plates are connected by a connecting component. According to the intelligent power module provided by the present invention, the ceramic substrate is divided into a plurality of ceramic plates, and the plurality of ceramic plates are spliced ​​into a whole by a connecting component, so as to avoid stress concentration and prevent the ceramic substrate from cracking due to uneven force during installation.

Description

Technical Field

[0001] The present invention relates to the technical field of power devices, and in particular to an intelligent power module and an electronic device having the same. Background Art

[0002] Intelligent Power Module, or IPM (Intelligent Power Module), is a power drive device that combines power electronics and integrated circuit technology. Due to its advantages such as high integration and high reliability, intelligent power modules have won an increasingly large market, especially suitable for frequency converters and various inverter power supplies for driving motors. It is a power electronic device commonly used in variable frequency speed regulation, metallurgical machinery, electric traction, servo drive and variable frequency home appliances.

[0003] There are two common IPM frames on the market, one is a copper integral frame, and the other is a connection method that uses a whole DBC ceramic substrate instead of a copper base. Although the connection method of using a whole DBC ceramic substrate instead of a copper base can effectively reduce thermal resistance and reduce costs, due to the material of the ceramic substrate itself, it is easy to cause cracks in the DBC ceramic substrate during installation, resulting in insulation failure. Summary of the invention

[0004] The object of the present invention is to provide an intelligent power module to solve the problem that cracks are easily generated on the existing ceramic substrate during installation, thereby causing insulation failure.

[0005] To achieve the above purpose, the technical solution proposed by the present invention is as follows:

[0006] An intelligent power module comprises a ceramic substrate and a first frame and a second frame respectively connected to two sides of the ceramic substrate. The ceramic substrate comprises a plurality of ceramic plates arranged in sequence along a preset direction, and two adjacent ceramic plates are connected by a connecting component.

[0007] According to the intelligent power module provided by the present invention, the ceramic substrate is divided into a plurality of ceramic plates, and the plurality of ceramic plates are spliced ​​into a whole through a connecting component, thereby avoiding stress concentration and preventing the ceramic substrate from cracking due to uneven force during installation.

[0008] In addition, the intelligent power module according to the above embodiment of the present invention may also have the following additional technical features:

[0009] According to an example of the present invention, a plurality of the ceramic panels are arranged at intervals along the preset direction.

[0010] According to an example of the present invention, two adjacent ceramic panels are flexibly connected via the connecting assembly.

[0011] According to an example of the present invention, the connection assembly includes at least two connection plates, opposite ends of the connection plates are respectively connected to two adjacent ceramic plates, and there is a preset distance between two adjacent connection plates.

[0012] According to an example of the present invention, the material of the connecting piece includes metal or alloy.

[0013] According to an example of the present invention, the first frame includes a plurality of first frames, and the plurality of first frames are connected to the plurality of ceramic plates in a one-to-one correspondence.

[0014] According to an example of the present invention, the second frame includes a plurality of second frames, and the plurality of second frames are connected to the plurality of ceramic plates in a one-to-one correspondence.

[0015] According to an example of the present invention, a chip component is mounted on each of the ceramic plates.

[0016] According to an example of the present invention, the chip assembly includes a first chip and a second chip installed on the ceramic plate at an interval.

[0017] In addition, the present invention also provides an electronic device having the intelligent power module as described in the above technical solution.

[0018] The advantages of the above additional aspects will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 FIG. 4 is a schematic diagram of the structure of an intelligent power module according to an embodiment of the present invention.

[0020] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0021] 1. Ceramic substrate; 11. Ceramic plate; 2. First frame; 21. First frame; 3. Second frame; 31. Second frame; 4. Connecting assembly; 41. Connecting piece; 5. Chip assembly; 51. First chip; 52. Second chip. DETAILED DESCRIPTION

[0022] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0023] Combined with Figure 1 As shown ( Figure 1Specifically, it is a top view of the intelligent power module. This embodiment provides an intelligent power module, including a ceramic substrate 1 and a first frame 2 and a second frame 31 respectively connected to both sides of the ceramic substrate 1. Based on the problems in the background technology, the inventors found that the main reason for the cracks on the ceramic substrate 1 is that the shape of the IPM is a long strip structure, so the shape of the ceramic substrate 1 is generally rectangular, which easily causes stress to be concentrated on a certain part of the ceramic substrate 1 (mostly in the middle part of the ceramic substrate 1) during installation, and other parts are unevenly stressed, so cracks or even ruptures are easily generated.

[0024] Therefore, the present application improves the structure of the ceramic substrate 1, and divides the ceramic substrate 1 into multiple ceramic blocks 11. Taking the attached figure of this embodiment as an example, the number of ceramic blocks 11 is three, and the three ceramic blocks 11 are arranged in sequence along a preset direction (the left and right direction in the figure), and two adjacent ceramic blocks 11 are connected by a connecting component 4. Since the middle ceramic block 11 is not integrally connected to other ceramic blocks 11 on both sides of this structure, it is easy to release stress during installation, avoid stress concentration, and prevent the ceramic substrate 1 from cracking due to uneven force during installation.

[0025] The plurality of ceramic substrates 1 of this embodiment are arranged at intervals along a preset direction, preferably at even intervals, and a certain interval or gap is reserved between two adjacent ceramic plates 11 to form a certain deformation space, thereby further preventing the occurrence of stress concentration.

[0026] Preferably, two adjacent ceramic panels 11 of the present embodiment are flexibly connected via a connecting assembly 4 to further prevent stress concentration, facilitate adjustment of the spacing and height between the two adjacent ceramic panels 11 , and further facilitate installation of the ceramic panels 11 .

[0027] Preferably, the connecting assembly 4 of this embodiment includes at least two connecting plates 41, and the number of the connecting plates 41 in this embodiment is two. The opposite ends of each connecting plate 41 are respectively connected to two adjacent ceramic blocks 11, and there is a preset distance between the two connecting plates 41 to ensure a stable connection between the two adjacent ceramic blocks 11.

[0028] Specifically, the material of the connecting piece 41 of this embodiment includes metal or alloy, which can be the soft connection as described above, and the connecting piece 41 can be a copper sheet or a copper alloy sheet, or other metal or alloy materials with properties similar to copper.

[0029] In this embodiment, the connecting piece 41 is in an arc shape to improve its own stability, and the two connecting pieces 41 are respectively located near the two sides of the ceramic block 11 .

[0030] Based on the above structure, in order to facilitate the adaptation with the above ceramic substrate 1, the first frame 2 of this embodiment includes a plurality of first frames 21, and the plurality of first frames 21 are connected one-to-one with the plurality of ceramic plates 11. Similarly, the second frame 31 of this embodiment includes a plurality of second frames, and the plurality of second frames are connected one-to-one with the plurality of ceramic plates 11. Specifically, the material of the first frame 21 and the second frame of this embodiment can also be copper.

[0031] In order to ensure the functionality of the intelligent power module, in this embodiment, a chip assembly 5 is installed on each ceramic block 11. The number of chip assemblies 5 on each ceramic block 11 can be two as shown in the figure. The chip assembly 5 includes a first chip 51 and a second chip 52. The first chip 51 and the second chip 52 are installed on the ceramic block 11 at intervals. The first chip 51 is an IGBT chip, and the second chip 52 is an FRD chip.

[0032] Specifically, IGBT (Insulated Gate Bipolar Transistor) is an insulated gate bipolar transistor, which is a composite fully controlled voltage-driven power semiconductor device composed of BJT (bipolar transistor) and MOS (insulated gate field effect transistor), and has the advantages of both MOSFET's high input impedance and GTR's low conduction voltage drop. FRD chip (Fastrecovery diode) is a fast recovery diode, which is an important power device and is widely used in important occasions such as smart grids, new energy vehicles, photovoltaics and rail traction.

[0033] In addition, this embodiment also provides an electronic device having an intelligent power module as described in the above technical solution. The electronic device can be any device in the prior art that uses an intelligent power module. Except for the intelligent power module, other structures thereof are common knowledge to those skilled in the art. Therefore, this embodiment does not provide a structural description or illustrations thereof.

[0034] In the description of the present invention, it is necessary to understand that the terms "inside", "outside", etc. indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device referred to must have a specific orientation, be constructed and operated in a specific orientation, and cannot be understood as a limitation on the present invention.

[0035] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is more than two, unless otherwise clearly and specifically defined.

[0036] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, etc. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. An intelligent power module, comprising a ceramic substrate (1) and a first frame (2) and a second frame (3) respectively connected to two sides of the ceramic substrate (1), characterized in that: The ceramic substrate (1) comprises a plurality of ceramic plates (11) arranged in sequence along a preset direction, and two adjacent ceramic plates (11) are connected via a connecting assembly (4); Two adjacent ceramic plates (11) are flexibly connected via the connecting assembly (4); the connecting assembly (4) comprises at least two connecting plates (41); opposite ends of the connecting plates (41) are respectively connected to the two adjacent ceramic plates (11); and a preset distance is provided between the two adjacent connecting plates (41); the connecting plates (41) are in an arc shape, wherein the two connecting plates (41) are respectively located near the two sides of the corresponding ceramic plates (11).

2. The intelligent power module according to claim 1, characterized in that: The plurality of ceramic plates (11) are arranged at intervals along the preset direction.

3. The intelligent power module according to claim 1, characterized in that: The material of the connecting piece (41) includes metal or alloy.

4. The intelligent power module according to claim 1, characterized in that: The first frame (2) comprises a plurality of first frames (21), and the plurality of first frames (21) are connected to the plurality of ceramic plates (11) in a one-to-one correspondence.

5. The intelligent power module according to claim 1, characterized in that: The second frame (3) comprises a plurality of second frames (31), and the plurality of second frames (31) are connected to the plurality of ceramic plates (11) in a one-to-one correspondence.

6. The intelligent power module according to claim 1, characterized in that: A chip assembly (5) is mounted on each of the ceramic plates (11).

7. The intelligent power module according to claim 6, characterized in that: The chip assembly (5) comprises a first chip (51) and a second chip (52) which are installed on the ceramic plate (11) at intervals.

8. An electronic device, characterized in that: Comprising the intelligent power module as described in any one of claims 1-7.

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