Display device and method of manufacturing the same

Abstract

A display device is provided, comprising: a plurality of display modules, each comprising a plurality of inorganic light-emitting elements mounted on a mounting surface of a substrate; a light absorption pattern formed between the plurality of display modules; and an encapsulation layer formed on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

Description

Technical Field

[0001] The present disclosure relates to a display device that displays an image using a combination of modules having a self-luminous inorganic light-emitting element mounted on a substrate. Background Art

[0002] A display device is an output device used to visually present data information such as characters, graphics, etc., as well as still images or video images.

[0003] For conventional display devices, a liquid crystal panel or an OLED panel formed by depositing an organic light emitting diode (OLED) on a substrate is generally used. However, the response time of the liquid crystal panel is slow and the power consumption is high, and it is difficult to be compact because it cannot emit light by itself and requires a backlight. OLED panels also have problems of short life and poor productivity. Therefore, as a new type of panel to replace them, a micro LED panel having an inorganic light emitting element mounted on a substrate and using the inorganic light emitting element itself as a pixel is being studied.

[0004] The micro LED panel can be designed to be compact and slim because it does not require a backlight and can have a minimized bezel portion, and has good properties in terms of brightness, resolution, power consumption, and durability.

[0005] In addition, since no complicated process is required except for the process of picking up the inorganic light-emitting element from the wafer and transferring it to the substrate, the micro LED panel can be manufactured to have various resolutions and sizes, and the micro LED panel can realize a large screen by putting the unit panels together. However, when putting the unit panels together, a gap is generated at the joint between the panels, which may reduce the image quality. Summary of the invention

[0006] Technical issues

[0007] The present disclosure provides a display device and a method for manufacturing the same, by which image degradation that may otherwise occur due to seams between multiple display modules when display panels are put together to achieve a large screen can be minimized.

[0008] Technical Solution

[0009] According to one aspect of the present disclosure, a display device is provided, comprising: a plurality of display modules, each comprising a substrate and a plurality of inorganic light-emitting elements mounted on a mounting surface of the substrate; a light absorption pattern formed to cover gaps between the plurality of display modules; and an encapsulation layer formed on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

[0010] The light absorption pattern may include a form of cross-stripes.

[0011] The substrate may include an anisotropic conductive layer for electrically connecting contact electrodes of the plurality of inorganic light emitting elements to pad electrodes of the substrate.

[0012] The light absorption pattern may be formed on the anisotropic conductive layer.

[0013] The encapsulation layer may be formed to cover the light absorption pattern.

[0014] The substrate may include a glass substrate, and a thin film transistor (TFT) layer formed on the glass substrate.

[0015] The encapsulation layer may include a transparent mold resin made of at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, or silicone resin.

[0016] The encapsulation layer may include an optical adhesive made of one of an optically clear adhesive (OCA) and an optically clear resin (OCR).

[0017] The display device may further include: a cover glass attached to the optical adhesive.

[0018] The display device may further include: an auxiliary light absorption pattern formed between the plurality of inorganic light emitting elements.

[0019] The display device may further include: a back cover for supporting the plurality of display modules.

[0020] The substrate may include a light absorbing layer integrally formed on the mounting surface to enhance contrast by absorbing external light.

[0021] According to another aspect of the present disclosure, a method for manufacturing a display device is provided, the method comprising: preparing a plurality of display modules, each of the plurality of display modules being formed with a plurality of inorganic light-emitting elements mounted on a mounting surface of a substrate; arranging the plurality of display modules to be adjacent to each other; forming a light absorption pattern to cover gaps formed between the plurality of display modules; and forming an encapsulation layer on the mounting surfaces of the plurality of display modules to cover the mounting surfaces of the plurality of display modules.

[0022] The plurality of inorganic light emitting elements mounted on the mounting surface of the substrate can be obtained by picking up the plurality of inorganic light emitting elements from a wafer and transferring the plurality of inorganic light emitting elements onto the substrate.

[0023] Arranging the plurality of display modules adjacent to each other may include arranging the plurality of display modules in the form of an M×N matrix.

[0024] The method may further include forming an auxiliary light absorption pattern between the plurality of inorganic light emitting elements.

[0025] The forming of the light absorption pattern between the plurality of display modules and the forming of the auxiliary light absorption pattern between the plurality of light emitting elements may be performed simultaneously.

[0026] Forming the encapsulation layer may include applying a transparent mold resin made of at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin, or silicone resin to mounting surfaces of the plurality of display modules.

[0027] The forming of the encapsulation layer may include adhering an optical adhesive made of one of an optically clear adhesive (OCA) and an optically clear resin (OCR) to mounting surfaces of the plurality of display modules.

[0028] The method may further include attaching the cover glass to the optical adhesive.

[0029] Advantageous Effects of the Invention

[0030] The display device may have a seamless effect that makes seams between adjacent display modules invisible because light entering the gap is absorbed by the light absorption pattern.

[0031] According to an embodiment of the present disclosure, a display device may have an encapsulation layer that is commonly formed after assembling a plurality of display modules, thereby more easily and effectively obtaining a seamless effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A display device in which a light absorption layer, a light absorption pattern, and an encapsulation layer are omitted according to an embodiment of the present disclosure is shown;

[0033] Figure 2 yes Figure 1 An exploded view of the main structure of the display device shown;

[0034] Figure 3 yes Figure 1 A cross-sectional view of a plurality of display modules of a display device;

[0035] Figure 4 An inorganic light emitting element mounting structure according to an embodiment of the present disclosure is shown;

[0036] Figure 5 An inorganic light emitting element mounting structure according to another embodiment of the present disclosure is shown;

[0037] Figure 6 is Figure 1 A cross-sectional view of a structure in which a light absorption pattern is formed between a plurality of display modules of a display device;

[0038] Figure 7 is Figure 1 A perspective view of a structure in which a light absorption pattern is formed between a plurality of display modules of a display device;

[0039] Figure 8 is Figure 1 A cross-sectional view of a structure in which an encapsulation layer (molding resin) is formed on a plurality of display modules of a display device;

[0040] Fig. 9 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure;

[0041] Fig.10 is a cross-sectional view of a structure in which a light absorption pattern and an auxiliary light absorption pattern are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of a display device according to another embodiment of the present disclosure;

[0042] Fig.11 is Fig.10 A perspective view of a structure in which a light absorption pattern and an auxiliary light absorption pattern are formed between a plurality of display modules and a plurality of inorganic light emitting elements of a display device;

[0043] Fig.12 is Fig.10 A cross-sectional view of a structure in which an encapsulation layer (molding resin) is formed on a plurality of display modules of a display device;

[0044] Fig.13 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure;

[0045] Fig.14 is an exploded view of the main structure of a display device according to another embodiment of the present disclosure;

[0046] Fig.15 is Fig.14 A cross-sectional view of a structure in which an encapsulation layer (optical adhesive) is formed on a mounting surface of a plurality of display modules of a display device; and

[0047] Fig.16 is a cross-sectional view of a structure in which an encapsulation layer (optical adhesive) and a cover glass are attached to a mounting surface of a plurality of display modules of a display device according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0048] The embodiments of the present disclosure are provided to help a comprehensive understanding of the present disclosure as defined by the claims and their equivalents. Therefore, those skilled in the art will recognize that various changes and modifications may be made to the embodiments described herein without departing from the scope and spirit of the present disclosure.

[0049] As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. For the sake of clarity, elements of the drawings are drawn in exaggerated forms and sizes.

[0050] It will also be understood that the terms “include” and / or “comprising” when used in this specification specify the presence of stated features, integers, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or combinations thereof.

[0051] Reference will now be made in detail to the embodiments of the present disclosure, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to like elements throughout.

[0052] Figure 1 A display device in which a light absorption layer, a light absorption pattern, and an encapsulation layer are omitted according to an embodiment of the present disclosure is shown. Figure 2 yes Figure 1 An exploded view of the main structure of the display device is shown. Figure 3 yes Figure 1 A cross-sectional view of multiple display modules of a display device. Figure 4 An inorganic light emitting element mounting structure according to an embodiment of the present disclosure is shown. Figure 5 An inorganic light emitting element mounting structure according to another embodiment of the present disclosure is shown. Figure 6 is Figure 1 A cross-sectional view of a structure in which a light absorption pattern is formed between multiple display modules of a display device. Figure 7 is Figure 1 A perspective view of a structure in which a light absorption pattern is formed between multiple display modules of a display device. Figure 8 is Figure 1 A cross-sectional view of a structure in which an encapsulation layer (molding resin) is formed on multiple display modules of a display device.

[0053] The display device 1 may be a device for displaying information, materials, data, etc. in characters, graphics, charts, images, etc., and may be implemented as a television, a personal computer, a mobile device, a digital signage, etc.

[0054] In an embodiment of the present disclosure, the display device 1 may include a display panel 20 for displaying an image, a frame 21 for supporting the display panel 20, and a back cover 10 for covering the back of the frame 21. Figure 2 shown.

[0055] The display panel 20 may include: a plurality of display modules 30A to 30L; a light absorption pattern 80 formed between the plurality of display modules 30A to 30L; and an encapsulation layer 90 formed on the plurality of display modules 30A to 30L to cover the plurality of light emitting elements 50 and mounting surfaces of the display modules 30A-30L.

[0056] The back cover 10 may support the display panel 20. The back cover 10 may be mounted on the floor by a bracket (not shown) or mounted on the wall by a suspension (not shown). The display device 1 may include a power supply (not shown) for supplying power to the plurality of display modules 30A to 30L and a control board 25 for controlling the operation of the plurality of display modules 30A to 30L.

[0057] The plurality of display modules 30A to 30L may be arranged vertically and horizontally adjacent to each other. The plurality of display modules 30A to 30L may be arranged in the form of an M×N matrix. In an embodiment of the present disclosure, there are 12 display modules 30A to 30L arranged in a 4×3 matrix, but the number and arrangement of the display modules 30A to 30L are not limited thereto.

[0058] A plurality of display modules 30A to 30L may be mounted in the frame 21. The plurality of display modules 30A-30L may be mounted in the frame 21 in various well-known methods, such as using the magnetic force of a magnet, a mechanical assembly structure, etc. The back cover 10 may be coupled to the back of the frame 21, and thus may form a back shape of the display device 1.

[0059] The display device 1 can realize a large screen by splicing a plurality of display modules 30A to 30L.

[0060] The plurality of display modules 30A to 30L may all have the same structure. Therefore, a description of one display module may be equally applicable to any other display module.

[0061] For example, the display module 30A may include a substrate 40 and a plurality of light emitting elements 50 mounted on the substrate 40. The substrate 40 may include a base substrate 42 and a thin film transistor (TFT) layer 43 formed on the base substrate 42 to drive the inorganic light emitting element 50. The base substrate 42 may include a glass substrate. For example, the substrate 40 may include a substrate of a chip on glass (COG) type. A first pad electrode 44a and a second pad electrode 44b for electrically connecting the inorganic light emitting element 50 may be formed on the substrate 40.

[0062] The plurality of inorganic light emitting elements 50 may be formed of an inorganic material and may include inorganic light emitting elements having a size of several micrometers (μm) to hundreds of micrometers in each of width, length, and height. The shortest of the width, length, and height of the micro inorganic light emitting element may have a size of 100 μm or less. The plurality of inorganic light emitting elements 50 may be picked up from a silicon wafer and directly transferred to the substrate 40. The plurality of inorganic light emitting elements 50 may be picked up and transferred by an electrostatic method using an electrostatic head, or by a bonding method using an elastic polymer substance such as PDMS, silicon, etc. as a head.

[0063] The multiple inorganic light-emitting elements 50 can be a light-emitting structure including an n-type semiconductor, an active layer, a p-type semiconductor, a first contact electrode 57a and a second contact electrode 57b, and can have the form of a flip chip, wherein the first contact electrode 57a and the second contact electrode 57b are arranged in the same direction (the direction opposite to the light-emitting direction).

[0064] The inorganic light emitting element 50 may have a light emitting surface 54 , a side surface 55 , and a bottom surface 56 , and a first contact electrode 57 a and a second contact electrode 57 b may be formed on the bottom surface 56 .

[0065] The first and second contact electrodes 57 a and 57 b may be electrically coupled to the first and second pad electrodes 44 a and 44 b , respectively, and formed on the mounting surface 41 of the substrate 40 .

[0066] The substrate 40 may include an anisotropic conductive layer 70 formed as a medium for electrical connection between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 70 may have an anisotropic conductive adhesive adhered to a protective film, and may have a structure in which conductive balls 71 are distributed in an adhesive resin. The conductive balls 71 each have a conductive spherical body covered with a thin insulating film, and when the insulating film is broken by pressure, the conductive balls 71 may be able to electrically join two conductors together.

[0067] The anisotropic conductive layer 70 may include an anisotropic conductive film (ACF) in a film form and an anisotropic conductive paste (ACP) in a paste form.

[0068] Therefore, when the anisotropic conductive layer 70 is pressurized while a plurality of inorganic light emitting elements 50 are mounted on the substrate 40 , the insulating film of the conductive ball is broken, thereby allowing the contact electrodes 57 a and 57 b of the inorganic light emitting element 50 to be electrically bonded to the pad electrodes 44 a and 44 b of the inorganic light emitting element 50 .

[0069] Alternatively, a plurality of inorganic light emitting elements 50 may be mounted on the substrate 40 by soldering instead of the anisotropic conductive layer 70 (see Figure 5 After the inorganic light emitting element 50 is disposed on the substrate 40 , the inorganic light emitting element 50 may be bonded to the substrate 40 through a reflow process.

[0070] The plurality of inorganic light emitting elements 50 may include a red light emitting element 51, a green light emitting element 52, and a blue light emitting element 53, and may be mounted on the mounting surface 41 of the substrate 40 in groups of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. A group of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53 may form a pixel. The red light emitting element 51, green light emitting element 52, and blue light emitting element 53 may each form a sub-pixel.

[0071] The red light emitting elements 51 , the green light emitting elements 52 , and the blue light emitting elements 53 may be arranged in a row at certain intervals or in any other form such as a triangular form.

[0072] The substrate 40 may include a light absorption layer 60 to enhance contrast by absorbing external light. The light absorption layer 60 may be formed on the entire mounting surface of the substrate 40 using the same material as the light absorption pattern 80 to be described later. The light absorption layer 60 may be formed between the TFT layer 43 and the anisotropic conductive layer 70.

[0073] Reference Figure 1 and Figure 3 In the display device 1, when a plurality of display modules 30A to 30L are spliced, a gap G may be formed between the plurality of display modules 30A to 30L. Scattered reflection of light occurs in the gap G, thereby generating a sense of strangeness and reducing image quality.

[0074] Therefore, according to an embodiment of the present disclosure, the display panel 20 may include a light absorption pattern 80 formed between the plurality of display modules 30A to 30L to prevent the generation of a sense of strangeness and degradation of image quality due to seams exposed by the gaps G between the plurality of display modules 30A to 30L.

[0075] As described above, since the display modules 30A to 30L are arranged vertically and horizontally in the form of an M×N matrix, the light absorption pattern 80 may be formed as a cross stripe or grid pattern including a horizontal pattern 81 and a vertical pattern 82 (see FIG. 1 ). Figure 7 ). The light absorption pattern 80 may physically fill the gap G between the plurality of display modules 30A to 30L.

[0076] For example, the light absorption pattern 80 may be formed to cover the gap G between the adjacent plurality of display modules 30A to 30L. The light absorption pattern 80 may be formed on the substrate 40 of the display module 30A and on the substrate 40 of the display module 30D. Specifically, the light absorption pattern 80 may be formed on the anisotropic conductive layer 70 of the display module 30A and on the anisotropic conductive layer 70 of the display module 30D.

[0077] The light absorption pattern 80 may be formed on the anisotropic conductive layer 70 of the plurality of display modules 30 and thus formed between the anisotropic conductive layer 70 and the encapsulation layer 90 .

[0078] Alternatively, the light absorption pattern 80 may be formed to fill the gap G between the adjacent display modules 30A and 30D. Some of the light absorption patterns 80 may be formed on the substrate 40 to cover the gap G, and some of the light absorption patterns 80 may be formed in the gap G to fill the gap G.

[0079] The light absorption pattern 80 may include a black inorganic material, a black organic material, a black metal, etc., which absorb light well to maximize the light absorption effect.

[0080] For example, the light absorption pattern 80 can be formed of materials such as carbon black, polyene pigments, azo pigments, azomethine pigments, diammonium pigments, phthalocyanine pigments, quinone pigments, indigo pigments, thioindigo pigments, dioxazine pigments, quinacridone pigments, isoindolinone pigments, metal oxides, metal complexes, aromatic hydrocarbons, etc.

[0081] The light absorption pattern 80 may be formed by applying light absorption ink between the plurality of display modules 30A to 30L and hardening the ink. Alternatively, the light absorption pattern 80 may be formed by coating a light absorption film between the plurality of display modules 30A to 30L.

[0082] In an embodiment of the present disclosure, after forming the light absorption pattern 80 between the plurality of display modules 30A to 30L, an encapsulation layer 90 may be formed on the plurality of display modules 30A to 30L to cover the plurality of inorganic light emitting elements 50 and the mounting surface 41 of the substrate.

[0083] According to the conventional technology of realizing a large screen by splicing, a display panel is made by forming an encapsulation layer for each display module to protect multiple inorganic light-emitting elements thereon, and then multiple display panels are spliced ​​to realize a large screen. In this case, a gap is formed even between adjacent encapsulation layers, and in order to identify the seam caused by the gap between the encapsulation layers and solve the generation of a sense of strangeness and degradation of image quality caused by the gap, a side light absorption layer is sometimes formed on the side of the encapsulation layer. However, this process is very challenging and very complicated.

[0084] To solve this problem, according to an embodiment of the present disclosure, a plurality of display modules 30A to 30L are firstly arranged adjacently, and then an encapsulation layer 90 is formed collectively on the entire area of ​​the mounting surface 41 of the display modules 30A to 30L. The encapsulation layer 90 may be formed to cover the light absorption pattern 80 .

[0085] Therefore, since the encapsulation layer 90 is formed on all the display modules 30A to 30L at once, no gap is formed in the region of the encapsulation layer 90. Therefore, when a large screen is realized by splicing, a seamless effect can be obtained more easily and effectively.

[0086] Furthermore, fully packaging the plurality of display modules 30A to 30L may also have the effect of putting the plurality of display modules 30A to 30L together.

[0087] The encapsulation layer 90 may be formed by applying a transparent molded resin on the plurality of display modules 30A to 30L and hardening the molded resin. The molded resin may include a translucent material or a fluorescent material that is liquid at room temperature, such as an acrylic resin, a polyimide resin, an epoxy resin, or a polyurethane resin. The molded resin may be cured by hardening, thereby physically protecting the inorganic light emitting element 50.

[0088] Fig. 9 is a flowchart illustrating a method for manufacturing a display device according to an embodiment of the present disclosure.

[0089] Reference Figures 1 to 9 , a method for manufacturing a display device according to an embodiment of the present disclosure will be briefly described.

[0090] First, in 210, a plurality of display modules 30A to 30L are prepared. Each of the plurality of display modules 30A to 30L may be formed by mounting a plurality of inorganic light emitting elements 50 on a mounting surface 41 of a substrate 40. In order to have an enhanced contrast, the substrate 40 may include a light absorbing layer 60. The substrate 40 may include an anisotropic conductive layer 70 to easily bond the plurality of inorganic light emitting elements 50 to the substrate 40.

[0091] Next, in 220, the plurality of display modules 30A to 30L may be arranged adjacent to each other. The plurality of display modules 30A to 30L may be fixed by a jig. The plurality of display modules 30A to 30L may be arranged in the form of an M×N matrix.

[0092] Next, a light absorption pattern 80 may be formed between the plurality of display modules 30A to 30L in 230. The light absorption pattern 80 may prevent scattered reflection and leakage of light and obtain a seamless effect by filling the gap G between the plurality of display modules 30A to 30L.

[0093] Subsequently, in 240, an encapsulation layer 90 may be formed on the plurality of display modules 30A to 30L to cover and protect the plurality of inorganic light emitting elements 50. When the encapsulation layer 90 is formed, the plurality of display modules 30A to 30L are not separately encapsulated but are integrally encapsulated, thereby preventing a gap from being formed in the region of the encapsulation layer 90. The display panel 20 thus formed is mounted within the frame 21.

[0094] Fig.10 is a cross-sectional view of a structure in which a light absorption pattern and an auxiliary light absorption pattern are formed between a plurality of display modules and between a plurality of inorganic light emitting elements of a display device according to another embodiment of the present disclosure. Fig.11 is Fig.10 A perspective view of a structure in which light absorption patterns and auxiliary light absorption patterns are formed between multiple display modules and between multiple inorganic light emitting elements of a display device. Fig.12 is Fig.10 A cross-sectional view of a structure in which an encapsulation layer (molding resin) is formed on multiple display modules of a display device.

[0095] refer to Figures 10 to 12 , a display device 201 according to another embodiment of the present disclosure will be described. The same features as those of the aforementioned embodiment are denoted by the same reference numerals, and overlapping descriptions will not be repeated.

[0096] Unlike the previous embodiment, the display panel 20 may further include an auxiliary light absorption pattern 100 formed between the plurality of inorganic light emitting elements 50 in addition to the light absorption pattern 80 formed between the plurality of display modules 30A to 30L.

[0097] The auxiliary light absorption pattern 100 may be used to supplement the light absorption layer 60 integrally formed on the mounting surface 41 of the substrate 40. For example, the auxiliary light absorption pattern 100 may absorb external light so that the substrate 40 appears black, thereby enhancing the contrast of the screen.

[0098] Similar to the light absorption layer 60 and the light absorption pattern 80 , the auxiliary light absorption pattern 100 may have a black color.

[0099] In this embodiment, the auxiliary light absorption pattern 100 may be formed to be arranged between pixels, each pixel including a group of red light emitting elements 51, green light emitting elements 52, and blue light emitting elements 53. Alternatively, the auxiliary light absorption pattern 100 may be formed more finely to separate each sub-pixel, that is, each of the light emitting elements 51, 52, and 53.

[0100] The auxiliary light absorption pattern 100 may be formed as a cross stripe pattern including a horizontal pattern 101 and a vertical pattern 102 arranged between pixels. The auxiliary light absorption pattern 100 may be formed in a method similar to the light absorption pattern 80. For example, the auxiliary light absorption pattern 100 may be formed by applying light absorption ink and then hardening the light absorption ink, or by coating a light absorption film.

[0101] Thus, since the auxiliary light absorption pattern 100 can be formed using the same material and the same method as the light absorption pattern 80, the auxiliary light absorption pattern 100 can be simultaneously formed with the light absorption pattern 80 in a single process. Therefore, the manufacturing process of the display device can be simplified and easier.

[0102] Fig.13 is a flowchart illustrating a method for manufacturing a display device according to another embodiment of the present disclosure.

[0103] Reference Figures 10 to 13 , a method for manufacturing a display device according to another embodiment of the present disclosure will be briefly described.

[0104] First, in 210, a plurality of display modules 30A to 30L are prepared. Each of the plurality of display modules 30A to 30L may be formed by mounting a plurality of inorganic light emitting elements on a substrate 40. In order to have an enhanced contrast, the substrate 40 may include a light absorbing layer 60. The substrate 40 may include an anisotropic conductive layer 70 to easily bond the plurality of inorganic light emitting elements 50 to the substrate 40.

[0105] Next, in 220, the plurality of display modules 30A to 30L may be arranged adjacent to each other. The plurality of display modules 30A to 30L may be fixed by a jig. The plurality of display modules 30A to 30L may be arranged in the form of an M×N matrix.

[0106] Next, a light absorption pattern 80 may be formed between the plurality of display modules 30A to 30L in 330. The light absorption pattern 80 may prevent scattered reflection and leakage of light and obtain a seamless effect by filling the gap G between the plurality of display modules 30A to 30L.

[0107] In this regard, an auxiliary light absorption pattern 100 may be formed between the plurality of inorganic light emitting elements 50. The auxiliary light absorption pattern 100 may absorb external light, thereby enabling the display device 201 to produce a clearer image. The auxiliary light absorption pattern 100 may be formed using the same material and the same method as the light absorption pattern 80. Therefore, the light absorption pattern 80 and the auxiliary light absorption pattern 100 may be simultaneously formed in a single process.

[0108] Subsequently, in 240, an encapsulation layer 90 may be formed on the plurality of display modules 30A to 30L to cover and protect the plurality of inorganic light emitting elements 50. When the encapsulation layer 90 is formed, the plurality of display modules 30A to 30L are not separately encapsulated but are integrally encapsulated, thereby preventing a gap from being formed in the region of the encapsulation layer 90. The display panel 20 thus formed is mounted within the frame 21.

[0109] Fig.14is an exploded view of a main structure of a display device according to another embodiment of the present disclosure. Fig.15 is Fig.14 A cross-sectional view of a structure in which an encapsulation layer (optical adhesive) is formed on the mounting surface of multiple display modules of a display device. Fig.16 is a cross-sectional view of a structure in which an encapsulation layer (optical adhesive) and a cover glass are attached to a mounting surface of a plurality of display modules of a display device according to an embodiment of the present disclosure.

[0110] refer to Figures 14 to 16 , a display device 301 , 401 according to another embodiment of the present disclosure will be described.

[0111] Unlike the previous embodiment of the present disclosure, an optical adhesive 190 may be used for the encapsulation layer instead of the mold resin.

[0112] An optically clear adhesive (OCA) or an optically clear resin (OCR) may be used for the optical adhesive 190. When the transmittance of the OCA and the OCR is greater than about 90%, they may be in a very transparent state.

[0113] Both OCA and OCR can improve their transmittance through low reflectivity characteristics, thereby improving visibility and image quality. Although the structure with air gap causes light loss due to the refractive index difference between the film layer and the air layer, the structure using OCA or OCR can reduce light loss because the refractive index difference between the film layer and the optical adhesive layer is reduced, thereby improving visibility and image quality.

[0114] In other words, OCA and OCR can simply join adjacent component layers and also have benefits in improving image quality.

[0115] The difference is that in this process, OCA and OCR are applied in film form and liquid form, respectively.

[0116] When the optical adhesive 190 is used for the encapsulation layer, a cover glass 191 may be attached to the optical adhesive 190 to physically protect the plurality of inorganic light emitting elements 50 .

[0117] Even when the optical adhesive 190 is used for the encapsulation layer, the light absorption pattern 80 may be formed between the plurality of display modules 30A to 30L, as shown in FIG. Fig.14 and Fig.15 In addition, a light absorption pattern 80 may be formed between a plurality of display modules 30A to 30L, and an auxiliary light absorption pattern 100 may be formed between a plurality of inorganic light emitting elements 50, as shown in FIG. Fig.16 shown.

[0118] According to an embodiment of the present disclosure, the display device may have a seamless effect of making a seam between adjacent display modules invisible because light entering the gap is absorbed by the light absorption pattern.

[0119] According to an embodiment of the present disclosure, a display device may have an encapsulation layer that is commonly formed after assembling a plurality of display modules, thereby more easily and effectively obtaining a seamless effect.

[0120] Several embodiments have been described above, but those skilled in the art will understand and appreciate that various modifications can be made without departing from the scope of the present disclosure. Therefore, it is obvious to those skilled in the art that the true scope of technical protection is limited only by the appended claims.

Claims

1. A display device, include: a plurality of display modules, each comprising a substrate and a plurality of inorganic light emitting elements mounted on a mounting surface of the substrate; a light absorption pattern formed to cover gaps between the plurality of display modules; as well as an encapsulation layer, which is formed together on the entire area of ​​the mounting surface of the plurality of display modules to cover the mounting surface of the substrate of each of the plurality of display modules and the plurality of inorganic light-emitting elements of each of the plurality of display modules, The substrate of each display module in the plurality of display modules comprises an anisotropic conductive layer on the mounting surface, the anisotropic conductive layer being used to electrically connect the contact electrodes of the plurality of inorganic light-emitting elements to the pad electrodes of the substrate, and The light absorption pattern is formed between the anisotropic conductive layer and the encapsulation layer, and is covered by the encapsulation layer.

2. The display device according to claim 1, in, The light absorption pattern has a form of cross stripes.

3. The display device according to claim 1, in, The substrate includes a glass substrate and a thin film transistor (TFT) layer formed on the glass substrate.

4. The display device according to claim 1, in, The encapsulation layer includes a transparent mold resin made of at least one of acrylic resin, polyimide resin, epoxy resin, polyurethane resin or silicone resin.

5. The display device according to claim 1, in, The encapsulation layer includes an optical adhesive made of one of an optically clear adhesive (OCA) and an optically clear resin (OCR).

6. The display device according to claim 5, further comprising: include: Cover glass, attached to the optical adhesive.

7. The display device according to claim 1, further comprising: include: The auxiliary light absorption pattern is formed between the plurality of inorganic light emitting elements.

8. The display device according to claim 1, further comprising: include: The back cover is used to support the multiple display modules.

9. The display device according to claim 1, in, The substrate includes a light absorbing layer integrally formed on the mounting surface to enhance contrast by absorbing external light.

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