Etching device and manufacturing method of display device

Abstract

The present invention provides an etching apparatus and a method for manufacturing a display device. The etching apparatus includes: a vacuum chamber, which is a vacuum chamber for performing an etching process on an object substrate inside, and includes a light-transmitting window on the upper surface; a substrate transfer unit, which is disposed inside the vacuum chamber and places the object substrate at the lower part; and at least one laser module, which is disposed outside the vacuum chamber and includes a laser irradiation unit, and the laser irradiation unit irradiates a laser beam into the vacuum chamber through the light-transmitting window to perform the etching process.

Description

Technical Field

[0001] The present invention relates to an etching apparatus and a method for manufacturing a display device. Background Art

[0002] With the rapid development of information and communication technologies and the expansion of the market, flat panel display elements have attracted much attention as display elements.

[0003] Such flat panel display elements include liquid crystal displays (LCDs), plasma display panels (PDPs), organic light emitting diode displays (OLEDs), etc. Among them, organic light emitting diode displays (OLED displays) have attracted much attention as next-generation display elements because of their very excellent advantages such as a fast response speed, lower power consumption than existing liquid crystal displays (LCDs), light weight, and the ability to be made ultrathin and high-brightness without the need for an additional backlight device.

[0004] Such an organic light emitting diode display (OLED display) can be produced as a product through processes such as a pattern formation process, an organic thin film deposition process, an etching process, a packaging process, and an attachment process of attaching a substrate on which an organic thin film is deposited and a substrate that has undergone the packaging process. In addition, among various processes, the etching process is a process of obtaining a desired pattern by etching unnecessary portions on the surface of a substrate. Summary of the Invention

[0005] The present invention provides an etching apparatus that increases the efficiency of an etching process by placing a laser irradiation unit above a vacuum chamber and being unaffected by particles that are separated from an object substrate and fall downward into the lower part of the vacuum chamber.

[0006] The present invention provides a method for manufacturing a display device using the etching apparatus, which increases the efficiency of the etching process by placing a laser irradiation unit above a vacuum chamber and being unaffected by particles that are separated from an object substrate and fall downward into the lower part of the vacuum chamber.

[0007] The problems of the present invention are not limited to the above-mentioned problems, and those skilled in the art should clearly understand other technical problems not mentioned based on the following description.

[0008] An etching apparatus according to an embodiment of the present invention for solving the above problems includes: a vacuum chamber, which is a vacuum chamber for performing an etching process on an object substrate inside, and has a light transmissive window on its upper surface; a substrate transfer unit, which is arranged inside the vacuum chamber and places the object substrate at the lower part; and at least one laser module, which is arranged outside the vacuum chamber and includes a laser irradiation unit, and the laser irradiation unit irradiates a laser beam into the vacuum chamber through the light transmissive window to perform the etching process.

[0009] The laser module may further include a first optical system, a second optical system, and a scanner. The first optical system and the second optical system change the path of the laser beam emitted by the laser irradiation unit to transfer the laser beam to the scanner, and the scanner emits the laser beam towards the object substrate.

[0010] The first optical system may include a first mirror part for reflecting the laser beam, and the second optical system may include a second mirror part for reflecting the laser beam.

[0011] The substrate transfer unit may include a workbench unit and a clamping unit, and the object substrate is placed on the lower surface of the clamping unit.

[0012] The clamping unit may include at least one hole for beam transmission penetrating through the clamping unit.

[0013] The workbench unit may include an upper workbench plate and a lower workbench plate. The upper workbench plate includes: an upper plate edge part in a frame shape; and an upper plate window, which is surrounded by the upper plate edge part and is used for the laser beam to pass through.

[0014] The lower workbench plate may include: a lower plate edge part arranged on both sides in a first direction; a lower plate step part arranged on both sides in a second direction intersecting with the first direction; and a lower plate connection part connecting the lower plate edge part and the lower plate step part, and there is a step between the lower plate edge part and the lower plate step part.

[0015] The lower plate step part may be located above the lower plate edge part.

[0016] The etching apparatus may further include an optical system platform, which is arranged outside the vacuum chamber and surrounds the vacuum chamber.

[0017] The optical system platform may include: a lower support table arranged at the lower part of the vacuum chamber; an upper bridge arranged at the upper part of the vacuum chamber; and a platform connection part connecting the lower support table and the upper bridge.

[0018] The laser module can be disposed on the upper bridge.

[0019] The etching device may further include an inspection optical unit disposed inside the vacuum chamber for inspecting the target substrate.

[0020] The inspection optical unit may be located below the target substrate.

[0021] A method for manufacturing a display device according to an embodiment of the present invention for solving the above problems includes the following steps: placing a target substrate inside a vacuum chamber having a light-transmitting window on an upper surface, the target substrate including a plurality of pixels and light-emitting elements provided in each of the pixels; transferring the target substrate and mounting it below a substrate transfer unit; and irradiating a laser beam emitted from a laser irradiation unit disposed outside the vacuum chamber through the light-transmitting window onto the target substrate to perform an etching process on the target substrate.

[0022] The substrate transfer unit may be composed of a table unit and a clamping unit, the clamping unit including at least one beam-transmitting hole penetrating through the clamping unit, and placing the target substrate on a lower surface of the clamping unit.

[0023] The table unit may include an upper table plate and a lower table plate, the upper table plate including: an upper plate edge portion in a frame shape; and an upper plate window surrounded by the upper plate edge portion and for allowing a laser beam to pass through.

[0024] The lower table plate may include: lower plate edge portions provided on both sides in a first direction; lower plate step portions provided on both sides in a second direction intersecting the first direction; and a lower plate connecting portion connecting the lower plate edge portions and the lower plate step portions, having a step between the lower plate edge portions and the lower plate step portions.

[0025] The lower plate step portion may be located above the lower plate edge portion.

[0026] The method may further include a step of inspecting the target substrate after performing etching on the target substrate, and the inspection optical unit for inspecting the target substrate may pass between the lower plate edge portions while passing below the lower plate step portion.

[0027] The step of etching the target substrate may further include: a step of forming a hole penetrating through a part of the target substrate.

[0028] Specific contents of other embodiments are included in the detailed description and the drawings.

[0029] The present invention can provide an etching apparatus. By arranging the laser irradiation unit above the vacuum chamber, the etching apparatus is not affected by particles separated from the target substrate and falling downward in the vacuum chamber, thereby increasing the efficiency of the etching process.

[0030] The present invention can provide a method for manufacturing a display device using an etching apparatus. By arranging the laser irradiation unit above the vacuum chamber, the etching apparatus is not affected by particles separated from the target substrate and falling downward in the vacuum chamber, thereby increasing the efficiency of the etching process.

[0031] The effects of the embodiments are not limited to those exemplified above, and this specification includes more diverse effects. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 is a perspective view of an etching apparatus according to an embodiment of the present invention.

[0033] Figure 2 is along Figure 1 a sectional view taken along line II-II' of.

[0034] Figure 3 is a perspective view of an optical system platform according to an embodiment of the present invention.

[0035] Figure 4 is an enlarged view showing Figure 2 region A of.

[0036] Figure 5 is an enlarged view showing Figure 2 region B of.

[0037] Figure 6 is an enlarged Figure 5 view of region C of.

[0038] Figure 7 is a perspective view of a combined substrate moving unit, a target substrate, and an inspection optical unit according to an embodiment of the present invention.

[0039] Figure 8 is Figure 7 a side view of.

[0040] Figure 9 is an exploded perspective view showing the connection relationship between a workbench unit, a clamping unit, and a target substrate according to an embodiment of the present invention.

[0041] Figure 10 is a perspective view of a clamping unit according to an embodiment of the present invention.

[0042] Figure 11 is a top view of an etching apparatus according to an embodiment of the present invention as viewed from above.

[0043] Figure 12 is a cross-sectional view taken along line XII-XII' of Figure 11 .

[0044] Figure 13 is a sequential diagram showing a method of manufacturing a display device using an etching apparatus according to an embodiment of the present invention.

[0045] Figures 14 to 16 is a cross-sectional view showing a method of manufacturing a display device using an etching apparatus according to an embodiment of the present invention.

[0046] Figure 17 is a perspective view of a display device manufactured using an etching apparatus according to an embodiment of the present invention.

[0047] Figure 18 is along Figure 17 a cross-sectional view taken along line XVIII-XVIII' of

[0048] Figure 19 is a perspective view of an etching apparatus according to another embodiment of the present invention.

[0049] Figure 20 is along Figure 19 a cross-sectional view taken along line XX-XX' of

[0050] Figure 21 is a cross-sectional view of an etching apparatus according to still another embodiment of the present invention. DETAILED DESCRIPTION

[0051] Advantages, features, and methods for realizing these of the present invention will become clear while referring to the accompanying drawings and also to the embodiments described in detail below. However, the present invention is not limited to the embodiments disclosed below, but is implemented in various different forms. These embodiments are only provided to make the disclosure of the present invention complete and to fully inform those skilled in the art to which the present invention pertains of the scope of the invention. The present invention is only defined by the scope of the claims.

[0052] When an element or layer is referred to as being "on" another element or layer, it includes both the case where the element or layer is directly on the other element or layer and the case where there are other layers or other elements interposed therebetween. The same reference numerals denote the same structural elements throughout the specification.

[0053] Although first, second, etc. are used to describe various structural elements, it is needless to say that these structural elements are not limited to these terms. These terms are only used to distinguish one structural element from other structural elements. Therefore, the first structural element mentioned below may also be the second structural element within the technical idea of the present invention.

[0054] Hereinafter, specific embodiments will be described with reference to the accompanying drawings.

[0055] Figure 1 is a perspective view of an etching apparatus according to an embodiment of the present invention. Figure 2 is along Figure 1 a cross-sectional view taken along line II-II' of

[0056] Referring to Figure 1 and Figure 2 an etching apparatus 10 according to an embodiment of the present invention may include: a vacuum chamber 100 that performs an etching process on a target substrate therein; a laser optical system 200 that is disposed outside the vacuum chamber 100 and performs an etching process by irradiating a laser beam L (Laser Beam) onto the target substrate in the vacuum chamber 100; and an optical system platform 300 on which the laser optical system 200 is disposed.

[0057] Inside the vacuum chamber 100, a worktable unit 120, a clamping unit 130, a particle trapping unit 140, and an inspection optical unit 150 may be provided. Although not shown, the target substrate 20 may be transferred from the outside of the vacuum chamber 100 to the inside of the vacuum chamber 100 by a robot arm or the like. The target substrate 20 transferred to the inside of the vacuum chamber 100 may be attached to the clamping unit 130 and the worktable unit 120.

[0058] The clamping unit 130 is provided on the target substrate 20, and the worktable unit 120 is provided on the clamping unit 130. That is, the clamping unit 130 may be located between the target substrate 20 and the worktable unit 120.

[0059] In the drawings, the first direction DR1 represents the direction in which the side surface of the vacuum chamber 100 partially covered by the platform connection portion 330 of the optical system platform 300 extends, the second direction DR2 represents the direction in which the side surface of the vacuum chamber 100 not covered by the platform connection portion 330 of the optical system platform 300 extends. In addition, the third direction DR3 represents the thickness direction of the vacuum chamber 100. The first direction DR1 and the second direction DR2 intersect perpendicularly with each other, and the third direction DR3 is a direction intersecting the plane in which the first direction DR1 and the second direction DR2 are located, and is perpendicular to both the first direction DR1 and the second direction DR2.

[0060] Unless otherwise defined, in this specification, "upper part", "upper surface", and "upper side" represented with reference to the third direction DR3 refer to the side of the clamping unit 130 with respect to the target substrate 20, and "lower part", "lower surface", and "lower side" refer to the side opposite to the clamping unit 130 with respect to the target substrate 20.

[0061] AsFigure 1 and Figure 2 As shown in Figure 2 , the vacuum chamber 100 is a box - type structure, and an etching process can be performed on the target substrate 20 inside the vacuum chamber 100. That is, the vacuum chamber 100 can provide a space for performing the etching process on the target substrate 20. A gate valve 110 for the substrate to enter and exit can be provided on one side wall surface of the vacuum chamber 100.

[0062] On the upper surface of the vacuum chamber 100, a first chamber window 101a and a second chamber window 101b are provided. The first chamber window 101a and the second chamber window 101b are light - transmitting windows that can allow a laser beam L of a specific wavelength to pass through. The laser beam L from a laser irradiation unit provided outside the vacuum chamber 100 can enter the inside of the vacuum chamber 100 through the first chamber window 101a and the second chamber window 101b of the vacuum chamber 100.

[0063] In this embodiment, a plurality of chamber windows can be provided on the upper surface of the vacuum chamber 100. In addition, a chamber window protection part (not shown) can be further provided on the upper surface of the vacuum chamber 100, and the chamber window protection part has protection windows (not shown) that shield the first chamber window 101a and the second chamber window 101b.

[0064] And, although not shown, an inspection chamber window (not shown) can be further provided on the bottom surface of the vacuum chamber 100. The inspection chamber window (not shown) is a window that can also allow a laser beam L of a specific wavelength to pass through, similar to the first chamber window 101a and the second chamber window 101b. The laser beam L inside the vacuum chamber 100 can be transmitted to a laser output measurement unit (not shown) provided outside the vacuum chamber 100 through the inspection chamber window (not shown).

[0065] A substrate transfer unit STU can be provided inside the vacuum chamber 100. The substrate transfer unit STU transfers the substrate inside the vacuum chamber 100. The substrate transfer unit STU includes: a clamping unit 130 for fixing the target substrate 20 loaded inside the vacuum chamber 100; a table unit 120 provided on the upper surface of the clamping unit 130; and a table moving unit (not shown).

[0066] The table unit 120 moves or rotates in a state where the clamping unit 130 and the target substrate 20 are combined to the lower part of the table unit 120, so that the position and orientation of the target substrate 20 to be etched can be adjusted. Thus, the laser beam L emitted from the laser irradiation unit can reach the required area of the target substrate 20.

[0067] A clamping unit 130 may be disposed on the lower surface of the worktable unit 120. The clamping unit 130 is used to place a substrate loaded into the interior of the vacuum chamber 100. The clamping unit 130 is disposed below the worktable unit 120 and can contact the upper surface portion of the target substrate 20, and can couple the target substrate 20 to the worktable unit 120. In this embodiment, the clamping unit 130 may use an electrostatic chuck (ESC), but is not limited thereto, and various clamping devices that can fix the substrate can be used as the clamping unit 130.

[0068] A detailed description of the worktable unit 120 and the clamping unit 130 will be described later.

[0069] Moreover, although not shown, a worktable moving unit (not shown) may be further disposed inside the vacuum chamber 100. The worktable moving unit is connected to the worktable unit 120 and supports the worktable unit 120. The worktable moving unit (not shown) may include: a worktable guide rail (not shown) that is connected to the worktable unit 120 and guides the movement of the worktable unit 120; and a driving unit (not shown) that moves the worktable unit 120 by electromagnetic force. The driving unit (not shown) includes a second magnetic body for the worktable (not shown), and the second magnetic body for the worktable is disposed along the length direction of the worktable guide rail (not shown) in such a manner that it interacts with a first magnetic body for the worktable (not shown) provided on the worktable unit 120 to generate a propulsive force using electromagnetic force on the worktable unit 120. The first magnetic body for the worktable is formed of a permanent magnet, and the second magnetic body for the worktable is formed of an electromagnet.

[0070] A particle trapping unit 140 may be disposed below the target substrate 20. During an etching process using a laser irradiation unit, the particle trapping unit 140 can trap particles P separated from the target substrate 20. That is, by trapping the particles P separated from the target substrate 20, it is possible to prevent the particles P from accumulating inside the chamber, and it is possible to maintain the internal state of the vacuum chamber 100 so that the etching process can be smoothly performed inside the vacuum chamber 100.

[0071] An inspection optical unit 150 may be disposed inside the vacuum chamber 100. The inspection optical unit 150 is disposed on the lower side of the vacuum chamber 100 and inspects the substrate.

[0072] An optical system platform 300 may be disposed outside the vacuum chamber 100. For a detailed description of the optical system platform 300, further refer to Figure 3 .

[0073] Figure 3 is a perspective view of an optical system platform according to an embodiment of the present invention. In Figure 3The optical system platform 300 of the etching apparatus 10 is illustrated in the figure.

[0074] The optical system platform 300 may include: a lower support table 310, located at the lower part of the vacuum chamber 100 and supporting the vacuum chamber 100; an upper bridge 320, located at the upper part of the vacuum chamber 100 and provided with a laser module; and a platform connection part 330, located at the side of the vacuum chamber 100 and connecting the lower support table 310 and the upper bridge 320. That is, the lower support table 310, the upper bridge 320, and the platform connection part 330 of the optical system platform 300 may surround the vacuum chamber 100. In addition, the lower support table 310, the upper bridge 320, and the platform connection part 330 may be formed and combined independently, but are not limited thereto, and may also be integrally formed. The optical system platform 300 may be formed of granite or the like, but is not limited thereto.

[0075] The lower support table 310 of the optical system platform 300 is located at the lower part of the vacuum chamber 100 and functions to support the vacuum chamber 100, and may include an additional structure such as a laser output inspection unit (not shown). The top view shape of the lower support table 310 may be substantially similar to the top view shape of the vacuum chamber 100, but is not limited thereto.

[0076] The platform connection part 330 of the optical system platform 300 may protrude from the lower support table 310 and extend upward. The platform connection part 330 extending upward may cover the side of the vacuum chamber 100. The lower side of the platform connection part 330 may be combined with a part of the side surface of the lower support table 310. The width of the platform connection part 330 in the first direction DR1 may be smaller than the length of the two side surfaces of the lower support table 310 connected to the platform connection part 330 extending in the first direction DR2. And the lower part of the platform connection part 330 may be combined with the central part of the two side surfaces, but is not limited thereto. The upper side of the platform connection part 330 may be combined with the lower surface of the upper bridge 320 of the optical system platform 300, and the platform connection part 330 may function to support the upper bridge 320.

[0077] The upper bridge 320 of the optical system platform 300 may be connected to the upper side of the platform connection part 330 and is provided on the upper side of the vacuum chamber 100. The upper bridge 320 may be provided at a predetermined distance from the vacuum chamber 100, but is not limited thereto. The upper bridge 320 may cover a part of the upper side of the vacuum chamber 100. The width of the upper bridge 320 extending in the first direction DR1 may be smaller than the width of the upper surface of the vacuum chamber 100 extending in the first direction DR1. The upper bridge 320 may be located near the center of the upper surface of the vacuum chamber 100, but is not limited thereto.

[0078] On the lower surface of the lower support table 310 of the optical system platform 300 and on the outer side in the second direction DR2 of the platform connection part 330, a plurality of grooves formed in a specified pattern may be included. However, it is not limited thereto. For example, on the lower surface of the lower support table 310, a plurality of first groove patterns HP1 in a triangular shape may be included, and on the outer side surface of the platform connection part 330, a second groove pattern HP2 composed of a triangular shape and a quadrilateral shape may be included.

[0079] By including the first groove pattern HP1 and the second groove pattern HP2 in the lower support table 310 and the platform connection part 330, the overall weight of the optical system platform 300 can be reduced to facilitate the movement and assembly of the etching apparatus 10, and the materials required to form the optical system platform 300 can be reduced to lower the material cost. Also, even though the lower support table 310 and the platform connection part 330 include the first groove pattern HP1 and the second groove pattern HP2, since portions maintaining a specified thickness are left between the respective plurality of grooves, the rigidity against the vibration of the optical system platform 300 can be maintained. Therefore, the laser module provided on the upper bridging 320 of the optical system platform 300 will not shake even if vibrations are transmitted from the outside, and the laser beam L can be transmitted to a desired area of the target substrate 20.

[0080] A laser optical system 200 may be provided on the upper bridging 320 of the optical system platform 300. To illustrate in detail the laser optical system 200 and the path of the laser beam L, refer to Figure 4 and Figure 5 .

[0081] Figure 4 is an enlarged view Figure 2 of the A area in the enlarged illustration. Figure 5 is an enlarged view Figure 2 of the B area in the enlarged illustration.

[0082] Refer to Figures 1 to 5 , the laser optical system 200 may include a first laser module 200a and a second laser module 200b. The laser optical system 200 may be located above the vacuum chamber 100 and be separated from the vacuum chamber 100 by a specified distance. In addition, the laser optical system 200 is provided above the target substrate 20, the clamping unit 130, and the worktable unit 120 located within the vacuum chamber 100, and a worktable unit 120 and a clamping unit 130 may be provided between the laser optical system 200 and the target substrate 20.

[0083] The first laser module 200a can be disposed on one side of the upper bridge 320 in the first direction DR1, and the second laser module 200b can be disposed on the other side of the upper bridge 320 in the first direction DR1. The first laser module 200a and the second laser module 200b can each be two or more. The plurality of first laser modules 200a can be respectively maintained at a predetermined distance and spaced apart in the second direction DR2, and the plurality of second laser modules 200b can be respectively maintained at a predetermined distance and spaced apart in the second direction DR2. In the etching apparatus 10 according to an embodiment of the present invention, the first laser module 200a and the second laser module 200b are illustrated as being provided in four on one side and the other side of the upper bridge 320 in the first direction DR1, but are not limited thereto.

[0084] The first laser module 200a may include: a first laser irradiation unit 210a for emitting a laser beam L; a first optical system 220a and a second optical system 230a for changing the path of the emitted laser beam L; and a first scanner 240a for transferring the laser beam L received from the first laser irradiation unit 210a to a desired position on the object substrate 20. The second laser module 200b may include: a second laser irradiation unit 210b for emitting a laser beam L; a third optical system 220b and a fourth optical system 230b for changing the path of the laser beam L; and a second scanner 240b for transferring the laser beam L received from the second laser irradiation unit 210b to a desired position on the object substrate 20.

[0085] Since the etching apparatus 10 is provided with the first laser module 200a and the second laser module 200b that can emit the laser beam L, the etching apparatus 10 can perform etching or peeling by irradiating the laser beam L to more areas of the object substrate 20. And, even if a part of the first laser module 200a and the second laser module 200b does not work properly, if the remaining part works properly, the laser beam L can be irradiated to a desired part of the object substrate 20 by moving the object substrate 20. That is, it can be less affected by the failure of the first laser module 200a or the second laser module 200b. As a result, by respectively disposing the first laser module 200a and the second laser module 200b on one side and the other side of the upper bridge 320 of the optical system platform 300 in the first direction DR1, the process efficiency can be improved.

[0086] As described above, the first laser module 200a and the second laser module 200b are composed of substantially the same structure, and the structure can play substantially the same role. That is, hereinafter, the description will be made based on the first laser module 200a without further explanation, and of course, the description can also be applied to the second laser module 200b.

[0087] The first laser irradiation unit 210a can emit a laser beam L that can etch the target substrate 20. The first laser irradiation unit 210a emits the laser beam L toward the first optical system 220a. The first laser irradiation unit 210a can be disposed on the upper surface of the upper bridge 320.

[0088] The first optical system 220a can change the path of the laser beam L emitted from the first laser irradiation unit 210a to be toward the second optical system 230a. That is, the first optical system 220a can change the path of the laser beam L transmitted in the first direction DR1 to guide the laser beam L to the lower side of the third direction DR3. The first optical system 220a can be disposed at a predetermined distance from the first laser irradiation unit 210a along the first direction DR1.

[0089] The second optical system 230a can change the path of the laser beam L received from the first optical system 220a to be toward the first scanner 240a. That is, the second optical system 230a can change the path of the laser beam L transmitted to the lower side of the third direction DR3 to guide the laser beam L to the other side of the first direction DR1. The second optical system 230a can be disposed below the first optical system 220a and at a predetermined distance from the first optical system 220a.

[0090] In order to change the path of the laser beam L as described above, a first mirror portion (not shown) for reflecting the laser beam L can be provided in the first optical system 220a, and a second mirror portion (not shown) for reflecting the laser beam L can also be provided in the second optical system 230a. In this embodiment, the first mirror portion (not shown) and the second mirror portion (not shown) can include one or more laser mirrors.

[0091] At least one of the first optical system 220a and the second optical system 230a in this embodiment can include an angle adjustment portion (not shown) for adjusting the setting angle of the first mirror portion (not shown) or the second mirror portion (not shown). The angle adjustment portion (not shown) includes: a rotation shaft (not shown) rotatably provided inside the first optical system 220a and / or the second optical system 230a and coupled to the first mirror portion (not shown) and / or the second mirror portion (not shown); and an operation portion (not shown) connected to the rotation shaft (not shown) and rotating the rotation shaft (not shown). The user can rotate the rotation shaft (not shown) through the operation portion (not shown) to adjust the setting angle of the first mirror portion and / or the second mirror portion (not shown).

[0092] This angle adjustment unit (not shown) adjusts the reflection angle of the laser beam L reflected toward the first scanner 240a by adjusting the setting angle of the second mirror unit (not shown). Thus, in the first optical system 220a and / or the second optical system 230a of the present embodiment, since there is an angle adjustment unit (not shown) that can adjust the setting angle of the first mirror unit (not shown) and / or the second mirror unit (not shown), even if the emission angle of the laser beam L emitted from the first laser irradiation unit 210a changes, the laser beam L can be easily transmitted to the first scanner 240a by adjusting the reflection angle of the laser beam L reflected from the first optical system 220a and / or the second optical system 230a.

[0093] The first scanner 240a can receive the laser beam L emitted from the first laser irradiation unit 210a through the first optical system 220a and the second optical system 230a, and can change the path of the received laser beam L. The first scanner 240a emits the received laser beam L downward, and the laser beam L enters the inside of the vacuum chamber 100 through the first chamber window 101a of the vacuum chamber 100. Then, the laser beam L incident on the inside of the vacuum chamber 100 can reach the target substrate 20 through the worktable unit 120 and the clamping unit 130. That is, the first scanner 240a functions to adjust the laser beam L so that the laser beam L reaches the desired position of the target substrate 20.

[0094] The first scanner 240a can be separated from the second optical system 230a by a predetermined distance and is located on the other side of the first direction DR1 of the second optical system 230a. In addition, the first scanner 240a can be provided below the upper bridge 320 of the optical system platform 300. That is, the first scanner 240a can be provided between the upper bridge 320 of the optical system platform 300 and the vacuum chamber 100. The first scanner 240a can overlap with the first chamber window 101a of the vacuum chamber 100 in the third direction DR3.

[0095] The laser beam L reaching the target substrate 20 can etch the target substrate 20. As the target substrate 20 is etched, particles P may be peeled off from the target substrate 20, and the particles P may fall downward toward the lower part of the vacuum chamber 100 due to gravity.

[0096] Next, for a detailed description of the target substrate 20, refer to Figure 6 .

[0097] Figure 6 is an enlarged Figure 5 view of the C region of Figure 6 illustrates the stacked structure of the target substrate 20.

[0098] Refer to Figure 6, the object substrate 20 may include a lower member 21, a display panel 22, a touch member 23, a polarizing member 24, and a cover window 25, and the lower member 21, the display panel 22, the touch member 23, the polarizing member 24, and the cover window 25 may be stacked in order. At least one bonding member such as an adhesion layer or a bonding layer may be provided between the stacked members to bond adjacent stacked members. However, it is not limited thereto, and other layers may be further provided between the layers, and a part of each stacked member may be omitted.

[0099] The display panel 22 is a panel for displaying a screen or an image. As an example of the display panel 22, it may include not only self-emitting display panels such as an organic light-emitting display panel (OLED), an inorganic electroluminescent display panel (inorganic EL), a quantum dot light-emitting display panel (QED), a micro-LED display panel (micro-LED), a nano-LED display panel (nano-LED), a plasma display panel (PDP), a field emission display panel (FED), and a cathode ray display panel (CRT), but also light-receiving display panels such as a liquid crystal display panel (LCD) and an electrophoretic display panel (EPD). Hereinafter, an organic light-emitting display panel will be taken as an example of the display panel for illustration. Unless otherwise specifically distinguished, the organic light-emitting display panel applied to the above embodiments will be simply referred to as the display panel 22. However, the embodiments are not limited to the organic light-emitting display panel, and other display panels listed above or known in the art may also be applied within the scope of sharing the technical idea.

[0100] The display panel 22 may include a substrate SUB1, a buffer layer SUB2, a semiconductor layer ACT, a first insulating layer 221, a first gate conductive layer 230, a second insulating layer 222, a second gate conductive layer 240, a third insulating layer 223, a data conductive layer 250, a fourth insulating layer 224, an anode electrode 260, a bank layer 226 including an opening exposing the anode electrode 260, a light-emitting layer 270 provided in the opening of the bank layer 226, a cathode electrode 280 provided on the light-emitting layer 270 and the bank layer 226, and a thin film encapsulation layer 290 provided on the cathode electrode 280. Although each of the above layers may be formed of a single film, it may also be formed of a stacked film including a plurality of films. Other layers may be further provided between the layers.

[0101] The substrate SUB1 can support the layers provided thereon. The substrate SUB1 may also be made of an insulating material such as a polymer resin or an inorganic material such as glass or quartz.

[0102] A buffer layer SUB2 is provided on the substrate SUB1. The buffer layer SUB2 may include silicon nitride, silicon oxide, silicon oxynitride, or the like.

[0103] A semiconductor layer ACT is provided on the buffer layer SUB2. The semiconductor layer ACT constitutes the channel of the thin film transistor of the pixel.

[0104] A first insulating layer 221 is provided on the semiconductor layer ACT. The first insulating layer 221 may be a first gate insulating film having a gate insulating function.

[0105] A first gate conductive layer 230 is provided on the first insulating layer 221. The first gate conductive layer 230 may include the gate electrode GAT of the thin film transistor of the pixel PX (see Figure 17 ), the scanning line connected to the gate electrode GAT, and the first electrode CE1 of the sustain capacitor.

[0106] A second insulating layer 222 may be provided on the first gate conductive layer 230. The second insulating layer 222 may be an interlayer insulating film or a second gate insulating film.

[0107] A second gate conductive layer 240 is provided on the second insulating layer 222. The second gate conductive layer 240 may include the second electrode CE2 of the sustain capacitor.

[0108] A third insulating layer 223 is provided on the second gate conductive layer 240. The third insulating layer 223 may be an interlayer insulating film.

[0109] A data conductive layer 250 is provided on the third insulating layer 223. The data conductive layer 250 may include the first electrode SD1 and the second electrode SD2 of the thin film transistor of the pixel PX. The first electrode SD1 and the second electrode SD2 of the thin film transistor may be electrically connected to the source region and the drain region of the semiconductor layer 210 through a first contact hole penetrating the third insulating layer 223, the second insulating layer 222, and the first insulating layer 221.

[0110] A fourth insulating layer 224 is provided on the data conductive layer 250. The fourth insulating layer 224 covers the data conductive layer 250. The fourth insulating layer 224 may be a via layer.

[0111] An anode electrode 260 is provided on the fourth insulating layer 224. The anode electrode 260 may be a pixel electrode provided in each pixel PX. The anode electrode 260 may be connected to the second electrode SD2 of the thin film transistor through a second contact hole penetrating the fourth insulating layer 224.

[0112] The anode electrode 260 may have a laminated film structure formed by laminating a material layer with a high work function such as indium-tin-oxide (ITO), indium-zinc-oxide (IZO), zinc oxide (ZnO), indium oxide (In2O3), etc., and a reflective material layer such as silver (Ag), magnesium (Mg), aluminum (Al), platinum (Pt), lead (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), lithium (Li), calcium (Ca), or a mixture thereof, but is not limited thereto. The layer with a high work function may be disposed in a layer higher than the reflective material layer, so as to be disposed closer to the light-emitting layer 270. The anode electrode 260 may have a multilayer structure such as ITO / Mg, ITO / MgF, ITO / Ag, ITO / Ag / ITO, but is not limited thereto.

[0113] A bank layer 226 may be disposed on the anode electrode 260. The bank layer 226 may be disposed on the anode electrode 260 and include an opening exposing the anode electrode 260. The light-emitting region and the non-light-emitting region may be defined by the bank layer 226 and its opening.

[0114] A spacer 227 may be disposed on the bank layer 226. The spacer 227 may serve to maintain a gap with a structure disposed above.

[0115] A light-emitting layer 270 is disposed on the anode electrode 260 exposing the bank layer 226. The light-emitting layer 270 may include an organic material layer. The organic material layer of the light-emitting layer 270 includes an organic light-emitting layer and may further include a hole injection / transport layer and / or an electron injection / transport layer.

[0116] A cathode electrode 280 may be disposed on the light-emitting layer 270. The cathode electrode 280 may be a common electrode disposed integrally without distinguishing pixels PX. The anode electrode 260, the light-emitting layer 270, and the cathode electrode 280 may form an organic light-emitting element.

[0117] The cathode electrode 280 may include a material layer with a small work function such as Li, Ca, LiF / Ca, LiF / Al, Al, Mg, Ag, Pt, Pd, Ni, Au, Nd, Ir, Cr, BaF, Ba, or a compound or mixture thereof (for example, a mixture of Ag and Mg, etc.). The cathode electrode 280 may further include a transparent metal oxide layer disposed on the material layer with a small work function.

[0118] A thin film encapsulation layer 290 is provided on the upper part of the cathode electrode 280. The thin film encapsulation layer 290 includes a first inorganic film 291, a first organic film 292, and a second inorganic film 293. At the end of the thin film encapsulation layer 290, the first inorganic film 291 and the second inorganic film 293 can be in contact with each other. The first organic film 292 can be sealed by the first inorganic film 291 and the second inorganic film 293.

[0119] The first inorganic film 291 and the second inorganic film 293 can respectively include silicon nitride, silicon oxide, or silicon oxynitride, etc. The first organic film 292 can include an organic insulating material.

[0120] A touch component 23 can be provided on the display panel 22. The touch component 23 can sense touch inputs. As shown in the figure, the touch component 23 can be provided as a panel or film different from the display panel 22 and attached to the display panel 22, but can also be provided in the form of a touch layer inside the display panel 22.

[0121] A polarizing component 24 can be provided on the touch component 23. The polarizing component 24 polarizes the light passing through it. The polarizing component 24 can play a role in reducing external light reflection.

[0122] A cover window 25 can be provided on the touch component 23. The cover window 25 serves to cover and protect the display panel 22. The cover window 25 can be made of a transparent material. For example, the cover window 25 can include glass or plastic.

[0123] A lower component 21 can be provided at the lower part of the display panel 22. The lower component 21 can play a role in light shielding. That is, the lower component 21 can block light from entering the display panel 22 from the outside. And, the lower component 21 can perform functions such as shock absorption functions in addition to the light shielding function.

[0124] The display panel 22 can emit light upward, but is not limited to this. That is, a clamping unit 130, a workbench unit 120, and a laser optical system 200 that emits laser light can be provided on the path of the light emitted from the display panel 22.

[0125] The laser beam L for etching the target substrate 20 can be transmitted from above the target substrate 20 toward the target substrate 20, and at least a part of the stacked components of the target substrate 20 is etched or lifted off. In this process, particles P may be peeled off from the etched or lifted-off stacked components. The particles P separated by peeling off from the target substrate 20 fall toward the lower part of the target substrate 20. That is, by disposing the first laser module 200a that emits the laser beam L above the target substrate 20, the particles P peeled off from the target substrate 20 are not stacked on the path where the laser beam L is transmitted. Thereby, even if the etching process is continuously performed, the laser beam L for etching the target substrate 20 is not affected by the particles P peeled off from the target substrate 20. That is, since refraction, temporal change, energy density change, etc. of the laser beam L caused by the particles P can be prevented, a decrease in the processing quality of the actually processed area can be prevented, and a decrease in the efficiency of the etching process can be prevented.

[0126] As described above, the laser beam L can pass through the workbench unit 120 and the clamping unit 130 to reach the target substrate 20. In addition, in order to determine whether the etching process is performed at a desired position on the target substrate 20, an inspection optical unit 150 can be provided. Hereinafter, with reference to Figures 7 to 9 .

[0127] Figure 7 is a perspective view of a combined substrate moving unit, a target substrate, and an inspection optical unit according to an embodiment of the present invention. Figure 8 is Figure 7 a side view of Figure 9 is an exploded perspective view showing the combined relationship between a workbench unit, a clamping unit, and a target substrate according to an embodiment of the present invention.

[0128] With reference to Figures 7 to 9 , the target substrate 20, the clamping unit 130, and the workbench unit 120 can be sequentially provided, and the inspection optical unit 150 can be provided below the target substrate 20.

[0129] The workbench upper plate 121 of the workbench unit 120 can be formed in a rectangular shape in plan view, and can be composed of an upper plate edge portion 121a and an upper plate window 121b surrounded by the upper plate edge portion 121a. The upper plate edge portion 121a can be formed in a frame shape with a central opening, and the upper plate window 121b can be provided near the above-mentioned open center. The shape of the upper plate window 121b can correspond to the shape of the workbench upper plate 121, but is not limited thereto.

[0130] The laser beam L transmitted from the upper part of the object substrate 20 can pass through the upper plate window 121b of the upper plate 121 of the workbench and be transmitted to the lower part of the upper plate 121 of the workbench.

[0131] The lower plate 122 of the workbench can be provided below the upper plate 121 of the workbench unit 120. The lower plate 122 of the workbench can be composed of a lower plate edge portion 122a, a lower plate step portion 122b, and a lower plate connecting portion 122c. The lower plate 122 of the workbench can be formed in a rectangular frame shape with a central opening in a top view. In addition, the lower plate 122 of the workbench can have a step between the lower plate edge portion 122a and the lower plate step portion 122b. That is, the lower plate edge portion 122a and the lower plate step portion 122b can have different heights, and the lower plate edge portion 122a and the lower plate step portion 122b are connected by the lower plate connecting portion 122c.

[0132] If described in detail, the lower plate edge portion 122a can be located on both sides of the workbench lower plate 122 in the second direction DR2. The lower plate edge portion 122a extends along the first direction DR1 and has a predetermined width in the second direction DR2. The lower plate edge portion 122a can be spaced apart from the upper plate edge portion 121a by a predetermined interval below the upper plate edge portion 121a. The width of the lower plate edge portion 122a in the second direction DR2 can be greater than the width of the upper plate edge portion 121a in the second direction DR2, but is not limited thereto.

[0133] The lower plate step portion 122b can be located on both sides of the workbench lower plate 122 in the first direction DR1. The lower plate step portion 122b extends along the second direction DR2 and has a predetermined width in the first direction DR1. The lower plate step portion 122b and the lower plate edge portion 122a can have different heights, and the lower plate step portion 122b can be located above the lower plate edge portion 122a. The lower plate step portion 122b can be located outside the both side edges of the upper plate 121 of the workbench in the first direction DR1. The lower plate step portion 122b can have the same height as the upper plate 121 of the workbench, but is not limited thereto.

[0134] The lower plate connecting portion 122c can connect the lower plate edge portion 122a and the lower plate step portion 122b between the lower plate edge portion 122a and the lower plate step portion 122b. The lower plate connecting portion 122c can protrude from one side and the other end of the lower plate edge portion 122a in the first direction DR1 toward the upper part of the lower plate edge portion 122a. The lower plate connecting portion 122c can have a predetermined width in the first direction DR1, and the width of the lower plate connecting portion 122c in the first direction DR1 can be the same as the width of the lower plate step portion 122b in the first direction DR1.

[0135] As described above, the lower plate step portion 122b and the lower plate edge portion 122a may have a height difference equivalent to the sum of the thicknesses of the lower plate edge portion 122a and the lower plate connection portion 122c in the third direction DR3. The inspection optical unit 150 can pass through the lower part of the lower plate step portion 122b and between the lower plate connection portion 122c and the lower plate edge portion 122a on both sides in the second direction DR2. Thereby, the distance between the inspection optical unit 150 and the object substrate 20 can be reduced. Since the distance between the inspection optical unit 150 and the object substrate 20 is reduced, a high-resolution lens with a small working distance can be used to inspect the object substrate 20, and the inspection precision of the object substrate 20 can be improved.

[0136] For a detailed description, the inspection optical unit 150 can pass through the space formed by the height difference between the lower plate step portion 122b and the lower plate edge portion 122a, which is the space between the two lower plate connection portions 122c in the lower part of the lower plate step portion 122b. At this time, since the inspection optical unit 150 can pass through between the two lower plate edge portions 122a of the workbench lower plate 122, the distance between the object substrate 20 located on the upper surface of the workbench upper plate 121 and the lower surface of the clamping unit 130 and the inspection optical unit 150 can be reduced. That is, even though the working distance of the inspection optical unit 150 using a high-resolution lens is small, since the inspection optical unit 150 can pass through the space formed by the height difference between the lower plate step portion 122b and the lower plate edge portion 122a as described above, the working distance required for the high-resolution lens can be obtained. Thereby, the inspection optical unit 150 using a high-resolution lens can be used, and the object substrate 20 can be inspected more precisely.

[0137] The clamping unit 130 may be disposed on the lower surface of the workbench unit 120, and the object substrate 20 may be fixed on the lower surface of the clamping unit 130. For a detailed description of the clamping unit 130, refer to Figures 10 to 12 .

[0138] Figure 10 is a perspective view of a clamping unit according to an embodiment of the present invention. Figure 11 is a top view of an etching apparatus according to an embodiment of the present invention as viewed from above, Figure 12 is along Figure 11 The cross-sectional view taken along the XII-XII' line of. In Figure 11 and Figure 12 For ease of explanation, only the clamping unit 130, the upper bridging 320 of the optical system platform 300, the first scanner 240a of the first laser module 200a, and the second scanner 240b of the second laser module 200b are illustrated.

[0139] Refer toFigures 7 to 12 The clamping unit 130 can be disposed on the lower surface of the upper workbench plate 121 of the workbench unit 120, and can be disposed between two lower plate edge portions 122a of the lower workbench plate 122 and between two lower plate step portions 122b.

[0140] The clamping unit 130 may include a plurality of beam transmission holes BHL. The beam transmission holes BHL may be surrounded by the clamping unit 130 and penetrate the clamping unit 130 in the thickness direction. In an embodiment of the present invention, it is illustrated that eight beam transmission holes BHL are arranged at intervals in the first direction DR1 and four beam transmission holes BHL are arranged at intervals in the second direction DR2, so that a total of 32 beam transmission holes BHL are provided on the clamping unit 130. However, this is not limited thereto, and the number and positions of the beam transmission holes BHL can be various. However, the number of beam transmission holes BHL arranged in the second direction DR2 may be the same as the number of the first laser module 200a and / or the second laser module 200b arranged in the second direction DR2.

[0141] During the etching process, the clamping unit 130 can move along the first direction DR1. As the clamping unit 130 moves, the beam transmission holes BHL of the clamping unit 130 can overlap with the first scanner 240a and the second scanner 240b in the third direction DR3, and the positions of the first scanner 240a and the second scanner 240b can correspond to the positions of the beam transmission holes BHL of the clamping unit 130.

[0142] Moreover, the beam transmission holes BHL provided on the clamping unit 130 can all overlap with the upper plate windows 121b of the upper workbench plate 121 provided on the upper surface of the clamping unit 130. Thus, the laser beam L passing through the upper plate windows 121b of the upper workbench plate 121 can pass through the beam transmission holes BHL of the clamping unit 130 and reach the target substrate 20 provided on the lower surface of the clamping unit 130.

[0143] Therefore, although the target substrate 20 is placed below the workbench unit 120 and the clamping unit 130, and the laser beam L is transmitted from above the workbench unit 120, the clamping unit 130, and the target substrate 20, the laser beam L transmitted from above the workbench unit 120 and the clamping unit 130 can also penetrate the workbench unit 120 and the clamping unit 130 to reach the target substrate 20.

[0144] Hereinafter, with reference to Figures 13 to 15 a description will be given of a method for manufacturing a display device using the etching apparatus 10.

[0145] Figure 13It is a sequence diagram showing a method of manufacturing a display device using an etching apparatus according to an embodiment of the present invention. Figures 14 to 16 It is a cross-sectional view showing a method of manufacturing a display device using an etching apparatus according to an embodiment of the present invention.

[0146] Refer to Figures 13 to 16 , first, an object substrate 20 to be etched is prepared (S01), and the object substrate 20 is inserted into a vacuum chamber 100 (S02).

[0147] When transferring the object substrate 20 from the outside of the vacuum chamber 100 to the inside of the vacuum chamber 100, a robot arm may be used, but it is not limited thereto.

[0148] Next, the object substrate 20 inserted into the vacuum chamber 100 is transferred to the lower part of a substrate transfer unit STU including a workbench unit 120 and a clamping unit 130, and is placed on the lower surface of the clamping unit 130 (S03).

[0149] Inside the vacuum chamber 100, the object substrate 20 is placed on the lower surface of the clamping unit 130 of the substrate transfer unit STU and is transferred to the lower part of a laser optical system 200. The object substrate 20 and the substrate transfer unit STU transferred to the lower part of the laser optical system 200 are rotated by the workbench unit 120, so that they can be aligned with a first scanner 240a and a second scanner 240b of the laser optical system 200 and a laser beam L can be irradiated onto a required part of the object substrate 20.

[0150] Next, the laser beam L is irradiated onto the object substrate 20 aligned with the first scanner 240a and the second scanner 240b, so that the object substrate 20 is etched or peeled off (S04).

[0151] The laser beam L can be emitted from a laser irradiation unit provided on an optical system platform 300. The laser beam L can change its path through a first optical system 220a and a second optical system 230a and be directed toward the first scanner 240a. The path of the laser beam L directed toward the first scanner 240a can be changed again inside the first scanner 240a, so that the transmission direction is changed to be directed toward the object substrate 20, that is, toward the lower direction.

[0152] The object substrate 20 can move along a first direction DR1. Thus, even if the laser optical system 200 is fixed, the laser beam L can reach a required area of the object substrate 20 through the movement of the object substrate 20.

[0153] The laser beam L directed towards the target substrate 20 can reach the target substrate 20 through the workbench unit 120 and the clamping unit 130. The laser beam L can be adjusted to have a specific wavelength, and the stacked components etched in the target substrate 20 can vary according to this wavelength. At least a part of the stacked components in the target substrate 20 can be etched or peeled off according to the specific wavelength. According to the etching process, only one component of the stacked components can be peeled off, but it is not limited to this. Not only can a part of the stacked components peeled off by the specific wavelength in the stacked components of the target substrate 20 be etched, but also other stacked components provided below the part of the stacked components can be etched together.

[0154] Next, the target substrate 20 etched or peeled by the laser beam L can move again to one side in the first direction DR1. As the target substrate 20 moves, the target substrate 20 can pass above the inspection optical unit 150 provided on the bottom surface of the vacuum chamber 100. When the target substrate 20 passes above the inspection optical unit 150, the inspection optical unit 150 can inspect the etched or peeled area of the target substrate 20 (S05).

[0155] Hereinafter, referring to Figure 17 and Figure 18 , a display device that can be manufactured using the etching apparatus 10 according to an embodiment of the present invention will be described.

[0156] Figure 17 is a perspective view of a display device manufactured using the etching apparatus according to an embodiment of the present invention. Figure 18 is a cross-sectional view taken along the XVIII-XVIII' line of Figure 17 .

[0157] Referring to Figure 17 and Figure 18 , the display device 30 can display a screen or an image through the effective area AAR, and various devices including the effective area AAR can be included in the display device 30. Examples of the display device 30 are not limited to this, and can include various home appliance products including the effective area AAR such as smartphones, mobile phones, tablet computers, personal digital assistants (PDAs), portable multimedia players (PMPs), televisions, game consoles, watch electronic devices, head-mounted displays, personal computer monitors, laptop computers, car navigators, car dashboards, digital cameras, video cameras, outdoor billboards, electronic screens, various medical devices, various inspection devices, refrigerators or washing machines, and Internet of Things devices.

[0158] The display device 30 includes an active area AAR and a non-active area NAR. The active area AAR of the display device 30 may include a display area. In addition, when the display device 30 has a touch function, a touch area as an area for realizing touch input sensing may also be included in the active area AAR.

[0159] The non-active area NAR may surround the periphery of the active area AAR. The non-active area NAR may include a non-display area where display is not realized. The non-active area NAR may surround all sides of the active area AAR, but is not limited thereto, and the non-active area NAR may not be provided near at least a part of the four sides of the active area AAR. The border area of the display device 30 may be constituted by the non-active area NAR.

[0160] The display device 30 may include at least one hole HLE. The hole HLE is disposed to overlap with an optical element in the thickness direction of the display device 30 and serves to transmit light to the light receiving part of the optical element. The hole HLE may be provided inside the active area AAR, but is not limited thereto.

[0161] The hole HLE may be a through hole that physically penetrates. The hole HLE may physically penetrate the lower member 21, the display panel 22, the touch member 23, and the polarizing member 24. As the hole HLE physically penetrates the stacked members, the members may be removed from the area where the hole HLE is formed, improving the light transmittance of the area.

[0162] The display device 30 may further include an optical element OPS including a light receiving part. As an example of the optical element OPS including a light receiving part, optical sensors such as a camera, a lens (a condenser lens or a light path guiding lens, etc.), an infrared sensor, an iris recognition sensor, and an illuminance sensor may be cited. Part or all of the light receiving part of the optical element OPS may be located within the hole HLE. Light outside the display device 30 may enter the light receiving part through the cover window 25 and through the hole HLE below the cover window 25. When the cover window 25 exhibits a high transmittance, the external light may reach the light receiving part of the optical element OPS through the above optical path without significant loss.

[0163] Hereinafter, another embodiment of the etching device 10 will be described. In the following embodiments, the same structures as those in the embodiments already described will be omitted or briefly described, and the description will mainly focus on the differences.

[0164] Figure 19 It is a perspective view of an etching device according to another embodiment of the present invention. Figure 20 It is along Figure 19 A cross-sectional view taken along the XX-XX' line.

[0165] Refer to Figure 19 and Figure 20 , the etching device 10_1 of this embodiment andFigure 1 The embodiment is different in that the etching apparatus 10_1 of this embodiment not only includes a first laser module 200a and a second laser module 200b, but also includes a third laser module 200c (including a third laser irradiation unit 210c, a fifth optical system 220c, a sixth optical system 230c, and a third scanner 240c) and a fourth laser module 200d (including a fourth laser irradiation unit 210d, a seventh optical system 220d, an eighth optical system 230d, and a fourth scanner 240d).

[0166] Specifically, the laser optical system 200 of this embodiment may further include first to fourth laser modules 200a, 200b, 200c, and 200d. In addition, the optical system platform 300 may include a first upper bridge 320a and a second upper bridge 320b. The first upper bridge 320a and the second upper bridge 320b are supported by a platform connection portion 330 and are physically connected to the lower support table 310 through the platform connection portion 330.

[0167] The first laser module 200a and the second laser module 200b may be disposed on the first upper bridge 320a, and the third laser module 200c and the fourth laser module 200d may be disposed on the second upper bridge 320b. The first laser module 200a may be disposed on one side in a first direction DR1 of the first upper bridge 320a, and the second laser module 200b may be disposed on the other side in the first direction DR1 of the first upper bridge 320a. The third laser module 200c may be disposed on one side in the first direction DR1 of the second upper bridge 320b, and the fourth laser module 200d may be disposed on the other side in the first direction DR1 of the second upper bridge 320b.

[0168] Each of the first to fourth laser modules 200a, 200b, 200c, and 200d may be two or more, and may be spaced apart from each other in a second direction DR2.

[0169] In this case, the first to fourth laser modules 200a, 200b, 200c, and 200d that emit the laser beam L capable of etching or peeling the target substrate 20 are also disposed above the target substrate 20, and the laser beam L emitted from the first to fourth laser modules 200a, 200b, 200c, and 200d is emitted toward the upper part of the target substrate 20. Therefore, the particles P peeled from the target substrate 20 fall toward the lower part of the target substrate 20, so the laser beam L is not affected by the particles P, and a reduction in the efficiency of the etching process can be prevented. And, since the third laser module 200c and the fourth laser module 200d are further provided, more areas of the target substrate 20 can be etched or peeled simultaneously, thereby increasing the efficiency of the etching process.

[0170] Figure 21 A cross-sectional view of an etching apparatus according to another embodiment of the present invention.

[0171] Referring to Figure 21 , the difference between the etching apparatus 10_2 of this embodiment and the Figure 2 embodiment is that the etching apparatus 10_2 of this embodiment may not only include a first laser module 200a and a second laser module 200b disposed above the target substrate 20, but may further include a lower laser module 350 disposed below the target substrate 20.

[0172] Specifically, the etching apparatus 10_2 of this embodiment may further include a lower laser module 350. The lower laser module 350 is disposed below the target substrate 20 and outside the vacuum chamber 100. The lower laser module 350 may be disposed on a lower support table 310 of an optical system platform 300. In addition, the vacuum chamber 100 of the etching apparatus 10_2 may further include a lower chamber window 101c on the bottom surface of the vacuum chamber 100. The lower chamber window 101c is located above the lower laser module 350 and allows a laser beam L emitted from the lower laser module 350 to enter the interior of the vacuum chamber 100. That is, the laser beam L emitted from the lower laser module 350 can enter the interior of the vacuum chamber 100 through the lower chamber window 101c.

[0173] The lower laser module 350 disposed below the target substrate 20 may not overlap with the first laser module 200a and the second laser module 200b disposed above the target substrate 20 in the third direction DR3. Thereby, interference between the lower laser module 350 and the first laser module 200a and the second laser module 200b can be prevented.

[0174] In this case, the first laser module 200a and the second laser module 200b that emit the laser beam L capable of etching or peeling the target substrate 20 are also disposed above the target substrate 20, and the laser beam L emitted from the first laser module 200a and the second laser module 200b is emitted toward the upper part of the target substrate 20. Therefore, the particles P peeled from the target substrate 20 fall toward the lower part of the target substrate 20, so the laser beam L is not affected by the particles P, and a reduction in the efficiency of the etching process can be prevented. And since the lower laser module 350 is also disposed below the target substrate 20, the lower side of the target substrate 20 can be etched or peeled more precisely, thereby improving the reliability of the etching process.

[0175] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those skilled in the art to which the present invention pertains should be able to understand that the present invention can be implemented in other specific forms without changing the technical idea or essential features of the present invention. Therefore, it should be understood that the above-described embodiments are exemplary in all respects and not restrictive.

[0176] Description of Reference Numerals

[0177] 10: Etching device

[0178] 20: Object substrate

[0179] 30: Display device

[0180] 100: Vacuum chamber

[0181] 200: Laser optical system

[0182] 300: Optical system platform.

Claims

1. An etching device, comprising: A vacuum chamber, serving as a vacuum chamber for performing an etching process on an object substrate therein, and having a light-transmitting window on its upper surface; A substrate transfer unit, disposed inside the vacuum chamber, and having the object substrate placed thereon at the lower part; And At least one laser module, disposed outside the vacuum chamber, and including a laser irradiation unit that irradiates a laser beam into the vacuum chamber through the light-transmitting window to perform the etching process, Wherein, the substrate transfer unit includes a workbench unit, The workbench unit includes a workbench upper plate and a workbench lower plate, The workbench lower plate includes: A lower plate edge portion, disposed on both sides in a first direction; A lower plate step portion, disposed on both sides in a second direction intersecting the first direction; and A lower plate connection portion, connecting the lower plate edge portion and the lower plate step portion, There is a step between the lower plate edge portion and the lower plate step portion.

2. The etching device according to claim 1, wherein The laser module further includes a first optical system, a second optical system, and a scanner, The first optical system and the second optical system change the path of the laser beam emitted by the laser irradiation unit to transmit the laser beam to the scanner, The scanner emits the laser beam towards the object substrate.

3. The etching device according to claim 1, wherein The substrate transfer unit further includes a clamping unit, The clamping unit includes at least one beam-passing hole penetrating through the clamping unit, The object substrate is placed on the lower surface of the clamping unit.

4. The etching device according to claim 1, wherein The workbench upper plate includes: An upper plate edge portion in a frame shape; and An upper plate window, surrounded by the upper plate edge portion and for allowing the laser beam to pass through.

5. The etching device according to claim 1, wherein The lower plate step portion is located above the lower plate edge portion.

6. The etching device according to claim 1, wherein The etching device further includes an optical system platform, which is disposed outside the vacuum chamber and surrounds the vacuum chamber.

7. The etching device according to claim 6, wherein The optical system platform includes: A lower support platform, disposed at the lower part of the vacuum chamber; An upper bridging portion, disposed at the upper part of the vacuum chamber; and A platform connection portion, connecting the lower support platform and the upper bridging portion, The laser module is disposed on the upper bridging portion.

8. A manufacturing method of a display device, comprising the following steps: Placing an object substrate into the vacuum chamber, the vacuum chamber having a light-transmitting window on its upper surface, the object substrate including a plurality of pixels and light-emitting elements disposed in each of the pixels; Transferring the object substrate and mounting it at the lower part of the substrate transfer unit; And Irradiating a laser beam emitted by a laser irradiation unit disposed outside the vacuum chamber through the light-transmitting window onto the object substrate to perform an etching process on the object substrate, Wherein, the substrate transfer unit includes a workbench unit, The workbench unit includes an upper workbench plate and a lower workbench plate. The lower workbench plate includes: Lower plate edge portions provided on both sides in the first direction; Lower plate stepped portions provided on both sides in a second direction intersecting the first direction; and Lower plate connecting portions connecting the lower plate edge portions and the lower plate stepped portions, wherein there is a step between the lower plate edge portions and the lower plate stepped portions.

9. The method for manufacturing a display device according to claim 8, wherein the substrate transfer unit further includes a clamping unit, the clamping unit includes at least one light beam transmission hole penetrating through the clamping unit, the upper workbench plate includes: an upper plate edge portion in a frame shape; and an upper plate window surrounded by the upper plate edge portion and for allowing the laser beam to pass through, the object substrate is placed on the lower surface of the clamping unit.

10. The method for manufacturing a display device according to claim 9, wherein the method further includes a step of inspecting the object substrate after performing an etching process on the object substrate, an inspection optical unit for inspecting the object substrate passes between the lower plate edge portions while passing through the lower part of the lower plate stepped portion.

Images