Power board, single board, power supply device and power management method

Abstract

The application provides a power panel, a single panel, a power supply device and a power management method, and relates to the field of communication. The power panel is installed on a back panel in a plug-in manner, and is provided with a first MCU. The back panel is also provided with plug-in interfaces of multiple single panels. The power panel provides power supply to the single panels inserted on the back panel through the plug-in interfaces. The first MCU communicates with second MCUs on the single panels through a bus on the back panel. The second MCUs are used for collecting power state information of the single panels respectively. The first MCU receives the power state information and controls the power supply of the corresponding single panel according to the power state information. In the power panel provided by the application, the power management part in the single board card in the prior art is split into an independent power panel. When a power failure occurs in the power panel, only the power panel needs to be replaced, and other board cards do not need to be replaced, so that the maintainability of the board card is improved, and the cost is reduced.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to a power board, a single board, a power supply device, and a power management method. Background Technology

[0002] A circuit board is a type of printed circuit board, or PCB for short. It is manufactured with inserts that can be inserted into slots on the main circuit board of a computer to control the operation of hardware such as monitors and capture cards. After installing drivers, the corresponding hardware functions can be realized.

[0003] In existing technologies, the control circuits of related devices are generally designed on the same circuit board. However, the design of a single circuit board means that if the power supply fails, the entire circuit board needs to be replaced, resulting in poor maintainability and high costs. Summary of the Invention

[0004] To solve at least one of the above-mentioned technical problems, this application provides the following technical solution:

[0005] In a first aspect, this application provides a power board that is pluggably mounted on a backplane and includes a first MCU; the backplane also includes multiple pluggable interfaces for individual boards; the power board provides power to the individual boards inserted into the backplane through the pluggable interfaces; the first MCU communicates with a second MCU on each individual board through a bus on the backplane, each second MCU is used to collect power status information of its respective individual board, and the first MCU receives the power status information and controls the power supply of the corresponding individual board according to the power status information.

[0006] Optionally, the power board is further provided with a first power IC and a second power IC respectively connected to the first MCU; the first power IC is used to provide a first power to the board under the control of the first MCU; the second power IC is used to provide a second power to the second MCU of the board under the control of the first MCU.

[0007] Optionally, the power board is further provided with a dry contact alarm interface connected to the first MCU, for outputting dry contact alarm information generated based on the power status information.

[0008] Optionally, the first MCU is externally connected to a pull-up resistor or a pull-down resistor; the first MCU reads the IO state of the pin of the external pull-up resistor or pull-down resistor during startup to characterize the ID of the power board.

[0009] In a second aspect, the application provides a single board which is installed on a backboard in a plug-in manner and is provided with a second MCU; the backboard is also provided with a plug-in interface of a power board; the single board receives power output by the power board on the backboard through the plug-in interface; the second MCU communicates with the first MCU on the power board through a bus on the backboard, and feeds back power state information of the single board to the first MCU, so that the first MCU controls power of the single board according to the power state information.

[0010] Optionally, the single board is also provided with a third power IC; a PG pin of the third power IC is connected with the second MCU; and the PG pin is connected with a pull-down capacitor.

[0011] Optionally, the single board is also provided with a fuse connected with the second MCU; the fuse receives an enable issued by the power board through the second MCU to turn on power supply.

[0012] Optionally, the second MCU is externally connected with a pull-up resistor or a pull-down resistor; the second MCU reads an IO state of a pin of the externally connected pull-up resistor or pull-down resistor when starting, to represent an ID of the single board.

[0013] In a third aspect, the application provides a power supply device, comprising: a backboard, the power board in the first aspect, and at least one single board in the second aspect.

[0014] In a fourth aspect, the application provides a power management method, applied to the power supply device in the third aspect, and comprising the following steps: the first MCU communicates with the second MCU through a bus; when determining that power of the single board is abnormal, the first MCU judges whether the abnormality is caused by the power board; if yes, the first MCU acquires power state information of the power board, controls to turn off power output of the power board, and outputs alarm information based on the power state information through the power board; if no, the first MCU acquires power state information reported by the second MCU corresponding to the single board with abnormal power, controls the second MCU to turn off power input of the single board, and outputs alarm information based on the power state information through the power board.

[0015] Optionally, before the first MCU communicates with the second MCU through the bus, the method further comprises: when the whole machine is powered on, the first MCU determines that the first power controlled by the first power IC of the power board and the second MCU are normal; the first MCU controls the first power IC of the power board to supply power to the single board; and the second MCU acquires current power state information of the single board and reports to the first MCU.

[0016] Optionally, the method further comprises: the first MCU and / or the second MCU performing a signal debouncing operation during the whole machine operation.

[0017] Optionally, the first MCU communicates with the second MCU through a bus, and the method further comprises:

[0018] The second MCU periodically collects power state information of the single board on which the second MCU is located, and reports the power state information to the first MCU through the bus, or the second MCU reports the power state information and / or a power abnormality signal to the first MCU through the bus when the second MCU determines that there is a power abnormality in the single board based on the power state information.

[0019] Optionally, the output of the alarm information by the power board comprises:

[0020] When it is determined that the current power abnormality is caused by the power board, dry contact alarm information related to the power board is output through a panel of the power board based on the IO state of the first MCU.

[0021] When it is determined that the current power abnormality is caused by the single board, dry contact alarm information related to the single board is output through the panel of the power board based on the IO state of the second MCU.

[0022] Compared with the prior art, the scheme of the present application has the following advantages:

[0023] (1) The power board provided by the present application splits the power management part in the single board card in the prior art and designs the power management part in a separate board card. The power board is installed on a backboard in a plug-in manner, and is provided with a first MCU. The backboard is also provided with plug-in interfaces of a plurality of single boards. The power board provides power to the single boards inserted into the backboard through the plug-in interfaces. The first MCU communicates with second MCUs on the single boards through a bus on the backboard. The second MCUs on the single boards are used to collect power state information of the single boards on which the second MCUs are located, respectively. The first MCU receives the power state information and controls the power of the corresponding single board according to the power state information. The implementation of the present application only needs to replace the power board when the power board has a power failure, without the need to replace other board cards (such as the backboard and the single board), thereby improving the maintainability of the board card and reducing the cost.

[0024] (2) The single board provided by the application is designed by splitting the circuit for controlling one or more devices in the single board card in the prior art into independent board cards, the single board is installed on the backboard in a plug-in manner, and the second MCU is arranged on the single board; the backboard is also provided with a plug-in interface of the power board; the single board receives the power output by the power board on the backboard through the plug-in interface; the second MCU communicates with the first MCU on the power board through the bus on the backboard, and the second MCU feeds back the power state information of the single board to the first MCU, so that the first MCU controls the power of the single board according to the power state information. The implementation of the application only needs to replace the single board when the single board fails, without replacing other board cards (such as the backboard and the power board), thereby improving the maintainability of the board card and reducing the cost.

[0025] (3) The power supply device provided by the application comprises a backboard, a power board and a single board, the power supply device is designed by splitting the circuit for controlling different devices in the single board card in the prior art into different board cards, and the bus of the backboard is used for communication. The implementation of the application only needs to replace the corresponding board card when a certain board card fails, thereby improving the maintainability of the board card and reducing the cost.

[0026] (4) The power management method provided by the application is applied to the power supply device, the first MCU of the power board is used as a control end of power management, and the first MCU communicates with the second MCU through the bus; specifically, when it is determined that the power of the current single board is abnormal (which can be determined by the first MCU or the second MCU), the first MCU further determines whether the abnormality is caused by the power board or the single board; if it is determined that the abnormality is caused by the power board, the first MCU acquires the power state information of the power board, controls the power output of the power board to be turned off, and outputs alarm information based on the power state information through the power board; if it is determined that the abnormality is caused by the single board, the first MCU acquires the power state information reported by the second MCU corresponding to the single board with the power abnormality, controls the second MCU to turn off the power input of the single board, and outputs alarm information based on the power state information through the power board. The implementation of the application can improve the reliability of power management, and is beneficial to providing favorable power management information (dry contact alarm information) for operation and maintenance personnel, thereby improving the efficiency of operation and maintenance.

[0027] Additional aspects and advantages of the application will be described in part in the description which follows, and will become apparent from the description, or can be learned by practice of the application. BRIEF DESCRIPTION OF DRAWINGS

[0028] The above and / or additional aspects and advantages of the application will become apparent and be readily understood from the following description, taken in conjunction with the accompanying drawings, in which:

[0029] Figure 1A structural schematic diagram of a power supply device provided in an embodiment of the present application is shown in the figure.

[0030] Figure 2 Another structural schematic diagram of a power supply device provided in an embodiment of the present application is shown in the figure.

[0031] Figure 3 A flow chart of a power management method provided in an embodiment of the present application is shown in the figure.

[0032] Figure 4 Another flow chart of a power management method provided in an embodiment of the present application is shown in the figure. DETAILED DESCRIPTION

[0033] Embodiments of the present application are described in detail below with reference to the accompanying drawings, in which the same or similar notations used throughout the drawings and the specific embodiments described herein represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary only, and are used only to explain the present application, and cannot be interpreted as limiting the present application.

[0034] Those skilled in the art can understand that, unless specifically stated, the wording "comprising" used in the specification of the present application means that the features, integers, steps, operations, components and / or assemblies described exist, but does not exclude the presence or addition of one or more other features, integers, steps, operations, components, assemblies and / or combinations thereof. It should be understood that when we say that a component is "connected" to another component, it can be directly connected to the other component, or there can be an intermediate component. The wording "and / or" used herein includes all or any unit and all combinations of the associated listed items.

[0035] The following explains the related terms that may be involved in the embodiments of the present application.

[0036] Board card: A board card is a printed circuit board, referred to as a PCB board, which is made with a pin core that can be inserted into a slot of a main circuit board (mainboard) of a computer, and can be used to control the operation of hardware, such as a display, a capture card, and the like, and after installing a driver program, the corresponding hardware function can be realized.

[0037] Single board: A single board is a type of board card, and a single board can be designed as a board card for controlling the operation of multiple devices such as a display and a capture card, or can be designed as a board card for controlling the operation of a device. In the embodiments of the present application, the power supply device can include one or more single boards, and the number of single boards can be set based on actual needs, which is not limited by the present application.

[0038] Power supply board: A power supply board is a type of board card, and is used to control the power supply of each single board in the power supply device.

[0039] Backplane: The backplane belongs to a kind of board card, which is used to support other circuit boards, devices and interconnection between devices, and provides a circuit board or frame for the supported devices. In the embodiment of the application, the backplane is provided with a bus (which can be a CAN bus or a CANBus bus) and a plurality of plug-in interfaces, which are plug-in connected with a single board and a power board, and the single board and the power board communicate through the bus of the backplane.

[0040] In the embodiment of the application, the bus mainly refers to a CAN bus and a CANBus bus, wherein the CAN bus is a Controller Area Network (CAN) and the CANBus bus is a CANBus (Controller Area Network Bus) of ISO11898 CAN standard.

[0041] MCU: Microcontroller Unit (MCU), also known as Single Chip Microcomputer or Single Chip Microcomputer, is a computer that integrates a central processing unit (CPU) frequency and specifications, memory, counters, USB, A / D conversion, UART, PLC, DMA, and even LCD driver circuits on a single chip, forming a chip-level computer for different application scenarios.

[0042] Power IC: also known as power chip IC, refers to the pulse width control integration of switching power supply. In the present application, it can include LDO (voltage stabilizing) power chip, DC / DC (voltage conversion) power chip, etc.

[0043] Fuse: also known as electronic fuse, the correct placement of fuse in the circuit, the fuse can cut off the current when the current abnormally rises to a certain height and heat, protecting the safe operation of the circuit.

[0044] Diode: Diode is a kind of electronic device made of semiconductor materials (silicon, selenium, germanium, etc.). It has a one-way conduction property, that is, when a forward voltage is applied to the anode and cathode of the diode, the diode is turned on. When the anode and cathode are applied with a reverse voltage, the diode is cut off. Therefore, the conduction and cut-off of the diode are equivalent to the connection and disconnection of the switch.

[0045] Enable: Enable (EN) is an input pin of a chip or an input port of a circuit. Only when the pin is activated, for example, set to high level, the entire module can work normally.

[0046] PG pin: power good (PG) pin.

[0047] Dry contact: A dry contact is an electrical switch that has two states, closed and open. There is no polarity between the two contacts of a dry contact, and they can be interchanged.

[0048] IO state: input level state.

[0049] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0050] In the prior art, the control circuit of the related device is generally designed in the same board card. However, the design of a single board card results in that once the power supply fails, the entire board card needs to be replaced, which is poor in maintainability and high in cost.

[0051] In order to solve at least one of the above problems, the present application provides a power supply board, a single board, a power supply device and a power management method, which splits the single board card in the prior art into several board cards, so that only the corresponding board card needs to be replaced when the power supply fails, improves the maintainability of the board card, reduces the cost, and improves the efficiency of operation and maintenance.

[0052] In order to make the purpose, technical solutions and advantages of the present application clearer, the embodiments of the present application will be further described in detail below with reference to the drawings.

[0053] In combination with the content shown in Figure 1 , 2 The embodiments of the present application provide a power supply board 10 and a single board 20. Specifically, the power supply board 10 is used for power management, and the single board 20 controls the corresponding device to run based on the power supply control of the power supply board 10. In an embodiment, the power supply board 10 and the single board 20 can exist as independent board cards.

[0054] Among them, the first MCU 11 is arranged on the power supply board 10, and is used for power management.

[0055] Among them, the second MCU 21 is arranged on the single board 20, and is used for communication with the first MCU 11 and control of the corresponding device to run.

[0056] Specifically, the first MCU 11 and the second MCU 21 are respectively provided with corresponding programs, which are fixed in the internal of the MCU and will not be changed (i.e., will not be overwritten) due to the change of external environment.

[0057] The backboard 30 is provided with a plug-in interface of the power board 10 and a plurality of plug-in interfaces of the single boards 20. The power board 10 and the single boards 20 can be installed on the backboard 30 in a plug-in manner through the plug-in interfaces. The power board 10 can provide power to the single boards 20 inserted into the same backboard 30 through the plug-in interface, and the single boards 20 can receive the power output by the power board inserted into the same backboard 30 through the plug-in interface.

[0058] Optionally, as shown in Figure 1 , 2 , the current single boards 20 inserted into the same backboard 30 include one power board 10 and four single boards 20 (other number of single boards 20 can also be inserted, which is only an example here). The power board 10 can provide power to the four single boards 20 at the same time. In an embodiment, in addition to the plug-in interface of the single board 20 at which the single board 20 is currently inserted, the backboard 30 can also have an additional plug-in interface of the single board 20, that is, during the use of the backboard 30, the plug-in interface of the backboard 30 designed based on the single board 20 can be empty.

[0059] In an embodiment, the first MCU 11 can communicate with the second MCUs 21 on the single boards 20 through the bus on the backboard 30. During the communication, each second MCU 21 can collect the power state information on the single board 20 and report it to the first MCU 11, and the first MCU 11 can receive the power state information collected by the second MCU 21 and control the power of the corresponding single board 20 according to the power state information. The power state information can represent the power state represented by a state code, that is, the power state information can be a state code such as D0, D1, D2, D3, and different state codes represent different power states; for example, the state code D0 can represent a fully on state, and D1 can represent a low power consumption state. The content represented by the state code can be set according to actual needs, which is not limited in the present application.

[0060] Optionally, as shown in Figure 1 and 2 , the power board 10 is further provided with a first power IC 12 and a second power IC 13 connected with the first MCU 11 respectively.

[0061] The first power IC 12 is used to provide the first power to the single boards 20 under the control of the first MCU 11 (for example, Figure 212V voltage). Specifically, the single board 20 is further provided with an electronic fuse 23 connected with the second MCU 21. When the power board 10 and the single board 20 are inserted into the same backboard 30 to work, the power board 10 controls the first power IC to issue an enable to the single board 20 through the first MCU 11; specifically, the electronic fuse 23 receives the enable issued by the power board 10 through the second MCU 21 to turn on the power supply.

[0062] The second power IC 13 is used to provide the second MCU 21 of the single board 20 with a second power (such as 3.3V) under the control of the first MCU 11. Figure 2 Specifically, when the power board 10 and the single board 20 are inserted into the same backboard 30 to work, the power board 10 controls the second power IC to supply power to the second MCU 21 in the single board 20 through the first MCU 11.

[0063] Optionally, the first power is the power used by the single board 20, and the second power is the power used by the second MCU 21 on the single board 20. The first power used by the single board 20 and the second power used by the second MCU 21 are independent of each other and do not interfere with each other, so as to ensure that the second MCU 21 can timely report to the first MCU 11 in the case of power abnormality. In an embodiment, the power input end on the single board 20 is further provided with a diode to prevent the power from flowing backward; wherein the power input end can include one end of the second MCU 21 receiving the second power (such as 3.3V power), and can also include one end of the second MCU 21 receiving the first power (such as 12V power).

[0064] In an embodiment, as shown in Figure 1 and 2 The single board 20 is further provided with a third power IC 22, and a PG pin of the third power IC 22 is connected with the second MCU 21. Since the power board 10 provides the same voltage power to each single board 20 inserted into the backboard 30 when working, but due to the different running environments of the devices controlled by each single board 20, the third power IC 22 can be used to adjust the voltage received by the single board 20, so as to improve the adaptability of the single board 20.

[0065] Optionally, the PG pin of the third power IC 22 on the single board 20 is further connected with a pull-down capacitor. The arrangement of the pull-down capacitor can realize signal debouncing, so as to improve the accuracy of power abnormality judgment.

[0066] In an embodiment, considering that multiple single boards 20 can be inserted on the same backboard 30, to improve the convenience and accuracy of power management, a pull-up resistor or a pull-down resistor can be externally connected to the second MCU 21 of each single board 20. When the second MCU 21 is started, the IO state of the pin of the externally connected pull-up resistor or pull-down resistor can be read and reported to the first MCU 11, so that the first MCU 11 distinguishes the power state information reported by different single boards 20 as the identity identification code ID of the single boards 20.

[0067] Optionally, a pull-up resistor or a pull-down resistor can also be externally connected to the first MCU 11 of the power board 10; the first MCU 11 can read the IO state of the pin of the externally connected pull-up resistor or pull-down resistor when started, to represent the identity identification code ID of the power board 10 where the first MCU 11 is located.

[0068] In an embodiment, the power board 10 is also provided with a dry contact alarm interface 14 connected with the first MCU 11, for outputting dry contact alarm information generated by the first MCU 11 based on the collected power state information of each single board. Specifically, the dry contact alarm interface 14 can be provided with a dry contact device, and the power board 10 and each single board 20 inserted in the same backboard 30 correspond to different ports of the dry contact device, that is, when the first MCU 11 transmits the dry contact alarm information to the dry contact device, the dry contact alarm information will be transmitted to the dry contact device through the corresponding port based on the IO state shown in the above embodiment.

[0069] Based on the same inventive concept, the embodiment of the present application provides a power supply device, which comprises a backboard 30, a power board 10 and at least one single board 20. The specific content of the backboard 30, the power board 10 and the single board 20 can be referred to the content described in the above embodiments, which will not be described in detail here.

[0070] Specifically, different numbers of single boards 20 can be designed in the power supply device according to actual needs, and the number and position of the plug-in interfaces for the single boards 20 on the backboard 30 can be arranged according to the number of the single boards 20 actually arranged.

[0071] Based on the same inventive concept, the embodiment of the present application provides a power management method, which is applied to the power supply device provided in the above embodiments; specifically, as shown in Figure 3 and 4 the method comprises the following steps S101-S104:

[0072] Step S101: The first MCU communicates with the second MCU through a bus.

[0073] Specifically, the power supply device can be installed in the whole machine and run with the whole machine powered on. During the operation of the whole machine, the first MCU on the power board and the second MCU on the single board inserted into the same backplane continuously communicate through the bus of the backplane. During the communication, the second MCU can monitor the power state of the single board in real time and report to the first MCU.

[0074] Optionally, the execution of the step S101 that the first MCU communicates with the second MCU through the bus includes at least one of the following steps S1011-S1012:

[0075] Step S1011: The second MCU periodically collects the power state information of the single board itself and reports to the first MCU through the bus.

[0076] Specifically, the second MCU can collect the power state information of the single board based on a preset period of time, for example, collect once every 4s, and report the currently collected power state information to the first MCU in real time.

[0077] Step S1012: The second MCU periodically collects the power state information of the single board; and the second MCU reports the power state information and / or a power abnormality signal to the first MCU through the bus when determining that the single board has a power abnormality based on the power state information.

[0078] Specifically, the second MCU can collect the power state information of the single board based on a preset period of time, for example, collect once every 4s; but the second MCU does not report to the first MCU immediately after collecting the power state information, but judges whether the power state of the single board has an abnormality based on the currently collected power state information. If yes, the second MCU reports the power state information and / or a power abnormality signal to the first MCU; otherwise, the second MCU does not report any information to the first MCU. The implementation of this step can effectively reduce the data resources required for communication between the first MCU and the second MCU, and improve the efficiency of the first MCU in processing the received power state information, by first screening the collected power state information of the single board by the second MCU and reporting only the power state information and / or the corresponding power abnormality signal determined to have a power abnormality to the first MCU.

[0079] Step S102: The first MCU determines whether the abnormality of the power of the single board is caused by the power board when determining that the power of the single board has an abnormality.

[0080] Specifically, in step S102, the first MCU determining that the power of the single board has an abnormality can include the following two cases:

[0081] (1) Based on step S1011, the first MCU needs to combine the current received power state information with the IO state of the corresponding second MCU to analyze whether the current power state of the corresponding single board is different from the normal power state. If so, it is determined that the power of the single board is abnormal.

[0082] (2) Based on step S1012, the first MCU can determine that the power of the single board is abnormal when receiving the power state information and / or the power abnormal signal. Alternatively, the first MCU can further analyze the power state of the single board based on the power state information to avoid analysis errors of the second MCU and improve the accuracy of power management.

[0083] In an embodiment, the determination by the first MCU in step S102 that the power of the single board is abnormal can be a determination that the power of any single board is abnormal, or a determination that the power of all single boards is abnormal. Specifically, to determine whether the power abnormality is caused by the power board in the subsequent judgment, the first MCU can correspond to the following implementation when determining that the power of the single board is abnormal:

[0084] Method one, when the first MCU determines that the power of any single board is abnormal, it immediately enters the judgment of whether the power abnormality is caused by the power board, that is, the first MCU analyzes the power state information of the power board to which it belongs to determine whether the current power state of the power board is consistent with the normal power state. If not, it is determined that the current power abnormality of the power device is caused by the power board; if so, it is determined that the current power abnormality of the power device is caused by the single board (in combination with the ID of the single board, it can be specifically analyzed which single board has the power abnormality).

[0085] Method two, considering that the probability of power abnormality caused by the single board itself leading to the simultaneous power abnormality of all single boards is low, therefore, when the first MCU determines that the power of all single boards is abnormal, it further judges whether the current power abnormality is caused by the power board (judges whether the current power state of the power board is consistent with the normal power state). If so, it is determined that the current power abnormality of the power device is caused by all single boards; if not, it is determined that the current power abnormality of the power device is caused by the power board.

[0086] Step S103: If so, the first MCU acquires the power state information of the power board to which it belongs, controls the power output of the power board to be turned off, and outputs the alarm information through the power board based on the power state information.

[0087] Specifically, when it is determined that the current power panel has an abnormality, the first MCU controls to turn off the power output of the power panel, such as controlling the first power IC to turn off the output of the first power. Wherein, the first MCU further generates dry contact alarm information based on the power state information of the power panel where it is located, and outputs the alarm information through the power panel, prompting the staff to check and replace the abnormal board of the power device.

[0088] Step S104: If no, the first MCU acquires the power state information reported by the second MCU corresponding to the single board with power abnormality, controls the second MCU to turn off the power input of the single board where it is located, and outputs alarm information through the power panel based on the power state information.

[0089] Specifically, when it is determined that the current power abnormality is caused by a single board, the first MCU acquires the power state information reported by the second MCU corresponding to the single board with power abnormality, and issues an instruction to the second MCU to control the second MCU to turn off the power input of the single board where it is located, such as turning off the input of the first power. Wherein, the power state information reported by the second MCU corresponding to the single board with power abnormality can be reported after the first MCU determines that the power abnormality is caused by a single board, or can be reported when the second MCU determines that the single board where it is located has a power abnormality; That is, the time when the second MCU reports the power state information and the time when the first MCU acquires the power state information reported by the second MCU can be inconsistent. Wherein, the first MCU further generates dry contact alarm information corresponding to the single board with power abnormality based on the power state information, and outputs the alarm information through the power panel, prompting the staff to check and replace the abnormal board of the power device.

[0090] In an embodiment, in step S101, the first MCU communicates with the second MCU through the bus, and before execution, the following steps S201-S203 are further included:

[0091] Step S201: When the whole machine is powered on, the first MCU determines that the first power controlled by the first power IC of the power panel and the second MCU are running normally.

[0092] Specifically, when the whole machine is powered on, the power device starts, and the first MCU will first determine whether the currently output first power is normal, and whether the second MCU communicating with the first MCU through the bus is running normally, to complete the basic interaction to ensure that the power device enters the initial state normally before running. Wherein, when the first MCU determines whether the second MCU is running normally, it includes determining whether the second power controlled by the second IC of the power panel is running normally.

[0093] Step S202: The first MCU controls the first power IC of the power panel to supply power to the single board.

[0094] Optionally, the first MCU controls the first power IC of the power board to supply power to the single board, including supplying power to all single boards inserted into the same backplane. It can be understood that after step 201 is implemented, the first MCU can issue a power input enabling signal to open the single board to supply power to the single board.

[0095] Step S203: The second MCU collects the current power state information of the single board and reports it to the first MCU.

[0096] Specifically, the second MCU can collect the current power state information of the single board and report it to the first MCU after a preset time in step S202. At this time, the reported power state information can be considered as the power state information at the time when the single board is running normally. The preset time can be 5s, for example, the second MCU can collect the power state information of the single board and report it to the first MCU after 5s of the first MCU issuing the enabling signal.

[0097] In an embodiment, the power management method further comprises the following step A: the first MCU and / or the second MCU performs a signal debouncing operation during the operation of the whole machine.

[0098] Specifically, with respect to the signal debouncing on the PG pin of the third power IC of the single board shown in the above embodiment, step A belongs to a software signal debouncing operation. The signal debouncing operation task is written in the program of the first MCU and / or the second MCU to improve the accuracy of judging power abnormalities.

[0099] Optionally, to improve the convenience of the staff replacing the abnormal board card when the power is abnormal, the present embodiment outputs the ID of the abnormal board card when performing the dry contact alarm to automatically identify the position of the power abnormal board card and improve the efficiency of operation and maintenance. Specifically, step S103 outputs the dry contact alarm information through the power board, including the following step B1:

[0100] Step B1: When it is determined that the current power abnormality is caused by the power board, the dry contact alarm information related to the power board is output through the panel of the power board based on the IO state of the first MCU.

[0101] Optionally, in the present embodiment, the IO state of the pin read by the first MCU when starting is used as the ID information of the power board card by connecting a pull-up resistor or a pull-down resistor to the pin of the first MCU. Since the power board and the single board correspond to different ports of the dry contact device, at this time, the corresponding port of the power board can be found based on the IO state of the first MCU to input the dry contact alarm information to the dry contact device, and then the dry contact alarm information related to the power board is output through the panel of the power board.

[0102] Specifically, step S104 outputs the dry contact alarm information through the power panel, including the following step B2:

[0103] Step B2: when it is determined that the current power supply abnormality is caused by the single board, outputting the dry contact alarm information related to the single board through the panel of the power panel based on the IO state of the second MCU.

[0104] Optionally, in the embodiment of the present application, the IO state of the pin read by the second MCU when starting is taken as the ID information of the single board where the second MCU is located by connecting a pull-up resistor or a pull-down resistor to the pin of the second MCU. Since the power panel and each single board correspond to different ports of the dry contact device, the IO state information can be carried for data transmission in the whole process of communication between the second MCU and the first MCU. After receiving the power supply state information reported by the second MCU, the first MCU generates corresponding dry contact alarm information based on the power supply state information, finds the port corresponding to the single board where the second MCU is located based on the IO state of the second MCU, inputs the dry contact alarm information to the dry contact device, and then outputs the dry contact alarm information related to the single board where the second MCU is located through the panel of the power panel.

[0105] To better illustrate the power management method of the embodiment of the present application, the specific process of applying the power management method will be described below in combination with each step shown in Figure 4

[0106] Step S1: the whole machine is powered on; specifically, the power-on of the whole machine is a trigger event of the power management method of the embodiment of the present application, and after the whole machine is powered on, the following step S2 will be executed.

[0107] Step S2: the second MCU of each single board collects the power supply state information of the single board; specifically, when the whole machine is powered on, the first MCU controls the first power supply IC to output the first power supply to the single board, and the first MCU controls the second power supply IC to output the second power supply to the second MCU of the single board; at this time, the second MCU of each single board will collect the power supply state information of the single board when the single board is started, and then step S3 is executed.

[0108] Step S3: determining whether the power supply of the single board is normal; if yes, step S4 is executed; if no, step S6 is executed; specifically, step S3 can be executed by the second MCU of the single board or by the first MCU of the power panel.

[0109] Step S4: the whole machine runs normally; specifically, when it is determined that the power supply of the single board is normal, it is determined that the output power supply of the current power panel is normal and the single board has no fault, and it is determined that the whole machine runs normally, and then step S5 is executed.

[0110] ​Step S5: The second MCU on all single boards monitors and reports the power supply state information of the single board in real time through the bus; specifically, after it is determined in step S4 that the whole machine is running normally, the second MCU on each single board will monitor the power supply state information of the single board in real time, and report the current power supply state information of the single board to the first MCU through the bus.

[0111] It can be understood that the above steps S1-S5 can correspond to steps S201-S203 in the above embodiment, which belong to the initial interaction process before the first MCU and the second MCU normally communicate through the bus.

[0112] Step S6: Determine whether the power board is abnormal; if yes, execute step S7; if no, execute step S9; specifically, if the power of the current single board is abnormal, it may be caused by single board failure, or it may be caused by power board output power abnormality, therefore, it is necessary to determine whether the power board is abnormal first. Whether the power board is abnormal can be determined by comparing and analyzing the power supply state information of the current power board with the normal power supply state information of the power board.

[0113] Step S7: The first MCU on the power board with power failure turns off the output of the power board; specifically, when it is determined that the power board is abnormal, the first MCU controls to turn off the power output of the power board, and then step S8 is executed.

[0114] Step S8: The power board panel outputs a dry contact alarm; specifically, the first MCU generates a dry contact alarm information based on the current power supply state information of the power board, and displays it on the panel of the power board.

[0115] Step S9: The second MCU on the faulty single board reports the power supply state information to the first MCU of the power board through the bus; specifically, when it is determined that the power abnormality of the single board is caused by single board failure, the second MCU on the faulty single board will report the corresponding power supply state information to the first MCU through the bus, and then step S10 is executed.

[0116] Step S10: The second MCU on the single board with power failure turns off the power input of the single board; specifically, the second MCU turning off the power input of the single board can be an operation automatically executed by the second MCU, or an operation executed by the second MCU based on the indication of the first MCU.

[0117] Step S11: The engineering personnel replace the abnormal board card. Specifically, after the engineering personnel see the dry contact alarm information output by the power board, they will replace the abnormal board card (directly pull out the abnormal board card from the backplane and insert a new board card).

[0118] The power management method provided in the application is applied to a power supply device, a first MCU of a power board serves as a control end of power management, when the first MCU and a second MCU communicate through a bus, the second MCU can report power state information and / or power abnormal signal of a single board to the first MCU, and then the first MCU determines whether the current power supply device has power abnormality based on the received power state information and / or power abnormal signal; specifically, when it is determined that the power of the current single board has abnormality (which can be determined by the first MCU or the second MCU), it is further determined whether the abnormality is caused by the power board or the single board; if it is determined that the abnormality is caused by the power board, the first MCU acquires power state information of the power board, controls to turn off the power output of the power board, and outputs dry contact alarm information through the power board based on the power state information; if it is determined that the abnormality is caused by the single board, the first MCU acquires the power state information reported by the second MCU corresponding to the single board with power abnormality, controls the second MCU to turn off the power input of the single board, and outputs dry contact alarm information through the power board based on the power state information. The implementation of the application can improve the reliability of power management, and is beneficial to providing favorable power management information (dry contact alarm information) for operation and maintenance personnel, and improving the efficiency of operation and maintenance.

[0119] The above only describes some embodiments of the application, and it should be pointed out that, for those skilled in the art, without departing from the principles of the application, a number of improvements and refinements can be made, and these improvements and refinements should also be regarded as the protection scope of the application.

Claims

1. A power supply board, characterized in that, The power board is pluggably mounted on the back panel and contains a first MCU. The backplane is also provided with multiple pluggable interfaces for individual boards; the power board provides power to the individual boards inserted into the backplane through the pluggable interfaces; The first MCU communicates with the second MCUs on each board via a bus on the backplane. Each second MCU is used to collect the power status information and / or power abnormality signal of its respective board and report it to the first MCU. The first MCU is used to control the power output of the power board and / or the power input of the board based on the received power status information and / or power abnormality signal, including: if any board has an abnormality, and it is determined that the abnormality is caused by the power board, then the power output of the power board is turned off; if it is determined that the abnormality is caused by the board, then the corresponding second MCU is controlled to turn off the power input of the board.

2. The power board according to claim 1, characterized in that, The power board is also provided with a first power IC and a second power IC that are respectively connected to the first MCU; The first power IC is used to provide a first power supply to the single board under the control of the first MCU; The second power IC is used to provide a second power supply to the second MCU of the single board under the control of the first MCU; Wherein, for any of the single boards, the first power supply used by the single board and the second power supply used by the second MCU are independent of each other; Specifically, controlling the power output of the power board to shut down includes controlling the first power IC to shut down the output of the first power supply; controlling the corresponding second MCU to shut down the power input of the board includes shutting down the input of the first power supply.

3. The power board according to claim 1, characterized in that, The power board is also provided with a dry contact alarm interface connected to the first MCU, which is used to output dry contact alarm information generated based on the power status information.

4. The power board according to claim 1, characterized in that, The first MCU is externally connected to a pull-up resistor or a pull-down resistor; The first MCU reads the IO state of the pins of the external pull-up resistor or pull-down resistor during startup to characterize the ID of the power board.

5. A single-board, characterized in that, This board is pluggable and mounted on the backplane, and it has a second MCU. The backplane is also provided with a pluggable interface for the power board; the single board receives power output from the power board on the backplane through the pluggable interface. The second MCU communicates with the first MCU on the power board via a bus on the backplane. The second MCU feeds back the power status information and / or power abnormality signal of its own board to the first MCU, so that the first MCU can control the power output of the power board and / or the power input of the board according to the power status information and / or the power abnormality signal. This includes: if any board has an abnormality, and it is determined that the abnormality is caused by the power board, then the power output of the power board is turned off; if it is determined that the abnormality is caused by the board, then the corresponding second MCU is controlled to turn off the power input of the board.

6. The single board according to claim 5, characterized in that, The board also includes a third power supply IC; the PG pin of the third power supply IC is connected to the second MCU; and a pull-down capacitor is connected to the PG pin. And / or, the power board is further provided with a first power IC and a second power IC respectively connected to the first MCU; the first power IC is used to provide a first power to the board under the control of the first MCU; the second power IC is used to provide a second power to the second MCU of the board under the control of the first MCU; for any board, the first power used by the board and the second power used by the second MCU are independent of each other; Specifically, controlling the power output of the power board to shut down includes controlling the first power IC to shut down the output of the first power supply; controlling the corresponding second MCU to shut down the power input of the board includes shutting down the input of the first power supply.

7. The single board according to claim 5, characterized in that, The single board is also equipped with a fuse connected to the second MCU; the fuse receives an enable signal from the power board through the second MCU to connect the power supply.

8. The single board according to claim 5, characterized in that, The second MCU is externally connected to a pull-up resistor or a pull-down resistor; when the second MCU starts up, it reads the IO state of the pin of the external pull-up resistor or pull-down resistor to characterize the ID of the board.

9. A power supply device, characterized in that, include: The backplate, the power board according to any one of claims 1 to 4, and at least one single board according to any one of claims 5 to 8.

10. A power management method, characterized in that, When applied to the power supply device of claim 9, the method includes the following steps: The first MCU communicates with the second MCU via a bus; When the first MCU determines that the power supply of the single board is abnormal, it determines whether the abnormality is caused by the power supply board. If so, the first MCU obtains the power status information of the power board, controls the power output of the power board to be turned off, and outputs alarm information through the power board based on the power status information; If not, the first MCU obtains the power status information reported by the second MCU corresponding to the board with the abnormal power supply, controls the second MCU to shut down the power input of the board, and outputs alarm information through the power board based on the power status information.

11. The method according to claim 10, characterized in that, Before the first MCU communicates with the second MCU via the bus, it also includes: When the entire machine is powered on, the first MCU determines that the first power supply controlled by the first power IC of the power board and the second MCU are operating normally; The first MCU controls the first power IC of the power board to supply power to the single board; The second MCU collects the current power status information of the board it is on and reports it to the first MCU.

12. The method according to claim 10, characterized in that, The method further includes: The first MCU and / or the second MCU perform signal debouncing during the operation of the entire machine.

13. The method according to claim 10, characterized in that, The first MCU communicates with the second MCU via a bus, and also includes: The second MCU periodically collects the power status information of the board it is on and reports it to the first MCU via the bus. Alternatively, when the second MCU determines that there is a power abnormality on the board based on the power status information, it reports the power status information and / or the power abnormality signal to the first MCU via the bus.

14. The method according to claim 10, characterized in that, The alarm information output through the power board includes: When it is determined that the current power failure is caused by the power board, the dry contact alarm information related to the power board is output through the panel of the power board based on the IO status of the first MCU. When it is determined that the current power supply abnormality is caused by the single board, the dry contact alarm information related to the single board is output through the panel of the power board based on the IO status of the second MCU.

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