LED module glue coating process and LED module
A LED module and glue-covering technology, which is applied to the cleaning method of tools, instruments, and pre-treated surfaces, can solve the problems of poor adhesion of potting glue, easy penetration of water vapor, and lack of moisture-proof ability, etc., to achieve The effect of increasing strength
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2021-06-01
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of LED display screens, and more specifically relates to a glue coating process for an LED module and an LED module. Background technique
[0002] In the prior art, outdoor LED display module products are packaged with silica gel, and the silica gel becomes black after curing. The operation method is: put the LED display module with the light-emitting surface facing up and place it in the tooling fixture, and then pour glue directly from the light-emitting surface, that is, Inject silica gel so that there is a layer of black potting glue on the surface of the LED display module. This glue is mainly to protect the LED lamp pins and pads from absorbing water, but this potting glue has poor adhesion and weak strength; water vapor can easily penetrate into the Inside, there is no moisture-proof ability, and it is easy to absorb moisture during use. Contents of the invention
[0003] The purpose of the present...
Examples
Embodiment Construction
[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.
[0025] The present invention provides an LED module. The LED module adopts the LED module glue coating process to carry out glue coating. Further, the LED module includes a PCB board, an LED lamp and a welding pad. The PCB board, The LED lamp and the welding pad are covered with glue using the above-mentioned LED module glue covering process. Please also refer to figure 1 and figure 2 , the LED module coating process provided by the present invention will now be described. The process of covering the LED module with glue specifically includes the following step...