Organic light emitting display device including a connection structure

Abstract

Provided is an organic light emitting display device including a connection structure. The organic light emitting display device may include: a substrate having a display area and a non-display area at least partially surrounding the display area, a pixel structure disposed in the display area on the substrate, a via insulating layer disposed in the non-display area on the substrate and having a contact hole, a lower pad disposed on the via insulating layer, and a connection structure. Herein, the connection structure may include: a flexible substrate disposed on the lower pad, an upper pad disposed between the flexible substrate and the lower pad, and an upper dummy pad spaced apart from the upper pad in a first direction on a bottom surface of the flexible substrate.

Description

Technical Field

[0001] The present disclosure relates to an organic light emitting display device, and more particularly, to an organic light emitting display device including a connection structure. Background Art

[0002] Display devices include liquid crystal display devices, organic light emitting display devices, and the like. For example, an organic light emitting display device includes a display substrate providing a pixel region and a non-pixel region. In addition, the organic light emitting display device includes a sealing substrate disposed to face the display substrate to seal the display substrate. The sealing substrate is bonded to the display substrate through a sealing material such as an epoxy resin.

[0003] Pixels that emit light are formed in the pixel region of the display substrate, and pads are formed in the non-pixel region of the display substrate. After the pads are formed on the display substrate, a connection structure may be connected to the pads.

[0004] A method of connecting a flexible printed circuit board (FPC (Flexible Printed Circuit Board) or flexible PCB) (also referred to as "FOP") on a panel is used to directly connect the FPC to the pads. In this case, an integrated circuit is formed in the non-pixel region of the display substrate. The FOP connection method may include a process of connecting a connection structure to the pads. In some cases, after the connection structure is connected to the pads, a part of the connection structure located adjacent to the integrated circuit may be removed. Residues may occur during the process of removing this part of the connection structure, and the residues may come into contact with the anisotropic conductive film connecting the pads and the connection structure. In this case, the pads included in the pads or the connection structure may be short-circuited due to the residues. Summary of the Invention

[0005] According to an exemplary embodiment, an organic light emitting display device may include: a substrate having a display region and a non-display region at least partially surrounding the display region; a pixel structure disposed in the display region on the substrate; a via insulating layer disposed in the non-display region on the substrate and having a contact hole; a lower pad disposed on the via insulating layer; and a connection structure. Here, the connection structure may include: a flexible substrate disposed on the lower pad; an upper pad disposed between the flexible substrate and the lower pad; and an upper dummy pad spaced apart from the upper pad in a first direction on the bottom surface of the flexible substrate.

[0006] In an embodiment of the inventive concept, the upper pad may at least partially overlap with the lower pad.

[0007] In an embodiment of the inventive concept, the organic light emitting display device may further include a signal wiring spaced apart from the lower pad in a first direction on the via insulating layer.

[0008] In an embodiment of the inventive concept, the organic light-emitting display device may further include a connection electrode disposed between the through-hole insulating layer and the substrate.

[0009] In an embodiment of the inventive concept, the contact holes of the through-hole insulating layer may include a first contact hole that at least partially overlaps with the lower pad and a second contact hole that at least partially overlaps with the signal wiring.

[0010] In an embodiment of the inventive concept, the lower pad is connected to a first portion of the connection electrode through the first contact hole, and the signal wiring may be connected to a second portion of the connection electrode different from the first portion of the connection electrode through the second contact hole.

[0011] In an embodiment of the inventive concept, the organic light-emitting display device may further include a lower dummy pad disposed on the through-hole insulating layer between the signal wiring and the lower pad.

[0012] In an embodiment of the inventive concept, the lower dummy pad, the signal wiring, and the lower pad may be located on the same layer.

[0013] In an embodiment of the inventive concept, the upper dummy pad may at least partially overlap with the lower dummy pad.

[0014] In an embodiment of the inventive concept, the organic light-emitting display device may further include an anisotropic conductive film disposed between the upper pad and the lower pad.

[0015] In an embodiment of the inventive concept, the anisotropic conductive film may be spaced apart from the signal wiring.

[0016] In an embodiment of the inventive concept, the anisotropic conductive film may be in contact with the upper dummy pad or the lower dummy pad.

[0017] In an embodiment of the inventive concept, the anisotropic conductive film may fill the space between the upper pad and the upper dummy pad and the space between the lower pad and the lower dummy pad.

[0018] In an embodiment of the inventive concept, the organic light-emitting display device may further include an integrated circuit disposed in a non-display area on the substrate.

[0019] In an embodiment of the inventive concept, the through-hole insulating layer may not overlap with the integrated circuit.

[0020] In an embodiment of the inventive concept, a first end portion of the signal wiring may at least partially overlap with the through-hole insulating layer, and a second end portion of the signal wiring opposite to the first end portion is connected to the integrated circuit.

[0021] In an embodiment of the inventive concept, the pixel structure may include a lower electrode disposed in a display area on a substrate, an intermediate layer disposed on the lower electrode, and an upper electrode disposed on the intermediate layer.

[0022] In an embodiment of the inventive concept, the organic light emitting display device may further include a semiconductor element disposed between the pixel structure and the substrate, and the semiconductor element may include an active layer disposed on the substrate, a gate electrode disposed on the active layer, and a source electrode and a drain electrode disposed on the gate electrode.

[0023] In an embodiment of the inventive concept, the organic light emitting display device may further include a wiring pattern disposed on the source electrode and the drain electrode. Here, the wiring pattern and the lower pad may be located on the same layer.

[0024] In an embodiment of the inventive concept, the organic light emitting display device may further include another via insulating layer disposed in the display area on the substrate and covering the wiring pattern.

[0025] According to some exemplary embodiments of the present invention, the organic light emitting display device may include pads having upper dummy patterns and lower dummy patterns. Accordingly, even if residues adhere to ends of the anisotropic conductive film, the pads do not short-circuit, and the driving efficiency of the organic light emitting display device may be improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and other features of the inventive concept will become more apparent by describing in detail its exemplary embodiments with reference to the accompanying drawings, in which:

[0027] Figure 1 is a plan view showing an organic light emitting display device according to an exemplary embodiment of the inventive concept.

[0028] Figure 2 is a cross-sectional view taken along line I-I’ of an exemplary embodiment of the inventive concept. Figure 1 of.

[0029] Figure 3 and Figure 4 are cross-sectional views taken along line I-I’ of methods of manufacturing an organic light emitting display device according to some exemplary embodiments of the inventive concept. Figure 1 of.

[0030] Figure 5 is a plan view showing a method of manufacturing an organic light emitting display device according to an exemplary embodiment of the inventive concept.

[0031] Figure 6 is a cross-sectional view showing an organic light emitting display device according to an exemplary embodiment of the inventive concept. DETAILED DESCRIPTION

[0032] In this document, it will be understood that when an element or layer is referred to as being "on," "connected to," or "coupled to" another element or layer, it can be directly on the other element or layer, directly connected or coupled to the other element or layer, or there can be intervening elements or layers.

[0033] Throughout the specification, like reference numerals may refer to like elements. In the figures, for clarity, the thickness of layers, films, or regions may be exaggerated.

[0034] The term "and / or" includes any and all combinations of one or more of the associated listed items.

[0035] It will be understood that although terms such as "first" and "second" are used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one component from other components. For example, without departing from the scope of the appended claims, a first element referred to as the first element in one embodiment may be referred to as the second element in another embodiment. Unless the context clearly indicates otherwise, the singular forms "a" and "the" are also intended to include the plural forms.

[0036] Furthermore, terms such as "below," "beneath," "above," "on," and the like are used to explain the relative relationship of components or elements shown in the drawings. These terms are intended as relative concepts and are described based on the directions shown in the drawings.

[0037] Hereinafter, exemplary embodiments of the inventive concept will be described in detail with reference to the drawings. In the drawings, the same or substantially similar components will be denoted by the same reference numerals.

[0038] Figure 1 is a plan view showing an organic light-emitting display device 1000 according to some exemplary embodiments of the present invention, and Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 .

[0039] Referring to Figure 1 and Figure 2 , the organic light-emitting display device 1000 may include a substrate 100, a buffer layer 105, a gate insulating layer 110, an interlayer insulating layer 135, a first via insulating layer 140, a wiring pattern 150, a second via insulating layer 155, a pixel defining layer 175, a connection electrode 145, a pixel PX, a connection structure 190, an integrated circuit IC, a wiring 910, a signal wiring 900, a lower pad 200a, a lower dummy pad 800a, an anisotropic conductive film 300, and the like.

[0040] Here, the connection structure 190 may include an upper pad 200b, an upper dummy pad 800b, and a flexible substrate 400. The pixel PX may include an organic light-emitting diode 180 and a semiconductor device 185. Additionally, the semiconductor device 185 may include an active layer 120, a gate electrode 125, a source electrode 115, and a drain electrode 130. The organic light-emitting diode 180 may include a lower electrode 160, an intermediate layer 165, and an upper electrode 170. Furthermore, the organic light-emitting display device 1000 may include a display area DA and a non-display area NDA. In an embodiment of the inventive concept, the non-display area NDA may be positioned adjacent to the display area DA. For example, the non-display area NDA may at least partially surround the display area DA.

[0041] As Figure 1 shown, a plurality of pixels PX may be disposed in the display area DA on the substrate 100. The pixels PX may be arranged in a matrix form as a whole in the display area DA. For example, an image may be displayed in the display area DA through the organic light-emitting diode 180 included in each pixel PX.

[0042] A plurality of wirings 910 may be disposed in the non-display area NDA on the substrate 100. For example, the wirings 910 may be disposed between the display area DA and the integrated circuit IC. The wirings 910 may electrically connect the integrated circuit IC disposed in the non-display area NDA and the pixels PX disposed in the display area DA. The wirings 910 may include data signal wirings, gate signal wirings, light emission control signal wirings, gate initialization signal wirings, initialization voltage wirings, power supply voltage wirings, and similar wirings.

[0043] Additionally, the integrated circuit IC connected to the signal wirings 900 and the wirings 910 may be disposed in the non-display area NDA on the substrate 100. The integrated circuit IC may receive signals (e.g., data signals, gate signals, light emission control signals, gate initialization signals, initialization voltages, power supply voltages, etc.) generated from an external device through the signal wirings 900. Then, the signals may be transmitted to the pixels PX in the display area DA through the wirings 910.

[0044] Furthermore, the connection structure 190 may be disposed to be spaced apart from the integrated circuit IC in the non-display area NDA on the substrate 100. For example, the connection structure 190 may be disposed in the lower side portion of the organic light-emitting display device 1000. The connection structure 190 and the integrated circuit IC are electrically connected through the signal wirings 900. In an embodiment of the inventive concept, the signals applied to the connection structure 190 may be provided to the integrated circuit IC through the signal wirings 900.

[0045] However, Figure 1The connection structure 190 is shown to be disposed in the lower side portion of the organic light emitting display device 1000, but the configuration of the inventive concept is not limited thereto. For example, the connection structure 190 may be disposed in the left side portion, the upper side portion, or the right side portion of the non-display area NDA of the organic light emitting display device 1000.

[0046] In addition, although each of the display area DA, the pixel PX, and the non-display area NDA of the organic light emitting display device 1000 has a rectangular planar shape, the shape is not limited thereto. For example, each of the display area DA, the pixel PX, and the non-display area NDA may have a triangular planar shape, a rhombic planar shape, a polygonal planar shape, a circular planar shape, a track planar shape, or an elliptical planar shape.

[0047] As Figure 2 shown, a substrate 100 may be provided. Since the organic light emitting display device 1000 includes a display area DA and a non-display area NDA, the substrate 100 may also be divided into a display area DA and a non-display area NDA. The substrate 100 may be formed of various materials (such as quartz, synthetic quartz, calcium fluoride, fluorine-doped quartz, soda lime glass, alkali-free glass, polyethylene terephthalate, polyethylene naphthalate, or polyimide).

[0048] The buffer layer 105 may be disposed in the display area DA on the substrate 100. The buffer layer 105 may prevent metal atoms or impurities from diffusing from the substrate 100 into the pixel PX, and may control the rate of heat transfer during the crystallization process for forming the active layer 120 to obtain a substantially uniform active layer 120. In addition, when the surface of the substrate 100 is uneven, the buffer layer 105 may increase the uniformity of the surface of the substrate 100. Depending on the type of the substrate 100, two or more buffer layers 105 may be provided on the substrate 100, or the buffer layer 105 may not be provided. For example, the buffer layer 105 may include an organic material or an inorganic material. In some exemplary embodiments, the buffer layer 105 may have a single-layer or multi-layer structure formed of an inorganic insulator such as silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiO x N y ) and the like. In some exemplary embodiments, the buffer layer 105 may be disposed in the non-display area NDA as well as the display area DA.

[0049] The active layer 120 may be disposed in the display area DA on the buffer layer 105. According to an embodiment of the inventive concept, the active layer 120 may be disposed between the buffer layer 105 and the gate insulating layer 110. The active layer 120 may include a metal oxide semiconductor, an inorganic semiconductor (e.g., amorphous silicon, polycrystalline silicon), or an organic semiconductor.

[0050] The gate insulating layer 110 may be disposed in the display area DA on the buffer layer 105. The gate insulating layer 110 may at least partially cover the active layer 120 disposed on the buffer layer 105 and have a flat upper surface without forming a step around the gate insulating layer 110. Alternatively, the gate insulating layer 110 may be disposed to have substantially the same thickness along the contour of the active layer 120 on the buffer layer 105. The gate insulating layer 110 may include silicon compounds, metal oxides, and the like. For example, the gate insulating layer 110 may include silicon oxide (SiO x ), silicon nitride (SiN x ), or silicon oxynitride (SiO x N y ), silicon oxycarbide (SiOC), silicon carbonitride (SiCN), aluminum oxide (Al2O3), aluminum nitride (AlN), tantalum oxide (Ta2O5), hafnium oxide (HfO2), zirconium oxide (ZrO2), titanium oxide (TiO2), and the like. In some exemplary embodiments, the gate insulating layer 110 may have a multi-layer structure including a plurality of insulating layers. The insulating layers may have different materials and different thicknesses. Additionally, the gate insulating layer 110 may be disposed in the non-display area NDA as well as the display area DA.

[0051] The gate electrode 125 may be disposed in the display area DA on the gate insulating layer 110. According to an exemplary embodiment of the inventive concept, the gate electrode 125 may be disposed on a portion of the gate insulating layer 110, while the active layer 120 is disposed below the portion of the gate insulating layer 110. The gate electrode 125 may include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, and the like. For example, the gate electrode 125 may be formed of one or more materials or a combination thereof, such as aluminum (Al), platinum (Pt), palladium (Pd), silver (Ag), magnesium (Mg), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), calcium (Ca), molybdenum (Mo), titanium (Ti), tungsten (W), copper (Cu), and their alloys, as a single layer or multiple layers.

[0052] The interlayer insulating layer 135 may be disposed on the gate insulating layer 110. The interlayer insulating layer 135 may at least partially cover the gate electrode 125 disposed on the gate insulating layer 110 and have a flat upper surface without forming a step around the interlayer insulating layer 135. Alternatively, the interlayer insulating layer 135 may be disposed on the gate insulating layer 110 to have substantially the same thickness along the contour of the gate electrode 125. The interlayer insulating layer 135 may include a silicon compound, a metal oxide, and the like. In some exemplary embodiments, the interlayer insulating layer 135 may have a multi-layer structure including a plurality of insulating layers. The insulating layers may have different materials and different thicknesses. Additionally, the interlayer insulating layer 135 may be disposed in the non-display area NDA as well as the display area DA.

[0053] The source electrode 115 and the drain electrode 130 may be disposed in the display area DA on the interlayer insulating layer 135. The source electrode 115 may be connected to the source region of the active layer 120 via a first contact hole formed by removing a first portion of the interlayer insulating layer 135 and the gate insulating layer 110. The drain electrode 130 may be connected to the drain region of the active layer 120 via a second contact hole formed by removing a second portion of the interlayer insulating layer 135 and the gate insulating layer 110. Each of the source electrode 115 and the drain electrode 130 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0054] Accordingly, a semiconductor device 185 including the active layer 120, the gate electrode 125, the source electrode 115, and the drain electrode 130 may be provided.

[0055] The connection electrode 145 may be disposed in the non-display area NDA on the substrate 100. The connection electrode 145 may be electrically connected to the lower pad 200a through a first contact hole 500 of the first via insulating layer 140 disposed in the non-display area NDA on the substrate 100. The connection electrode 145 may be electrically connected to the signal wiring 900 through a second contact hole 510 of the first via insulating layer 140. The connection electrode 145 may not be in contact with the lower dummy pad 800a and the integrated circuit IC through the first via insulating layer 140. The connection electrode 145 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0056] The first via insulating layer 140 may be disposed on the interlayer insulating layer 135 in the display area DA, and the first via insulating layer 140 may cover the source electrode 115 and the drain electrode 130. Additionally, the first via insulating layer 140 may be disposed in a part of the non-display area NDA on the substrate 100 and may cover the connection electrode 145. In some exemplary embodiments, the first via insulating layer 140 may include a first contact hole 500 and a second contact hole 510. The first contact hole 500 may overlap with the lower pad 200a and expose a first portion of the connection electrode 145. The second contact hole 510 may overlap with the signal wiring 900 and expose a second portion of the connection electrode 145. Further, the first contact hole 500 and the second contact hole 510 may not overlap with the lower dummy pad 800a. The first via insulating layer 140 may contact the anisotropic conductive film 300 through an area or space where the lower pad 200a and the lower dummy pad 800a are spaced apart from each other. Additionally, in the non-display area NDA on the substrate 100, the first via insulating layer 140 may be spaced apart from the integrated circuit IC and may not overlap with the integrated circuit IC.

[0057] The first via insulating layer 140 may be provided to have a relatively large thickness to sufficiently cover the source electrode 115, the drain electrode 130, and the connection electrode 145. In this case, a planarization process may be added to the first via insulating layer 140 to achieve a flat upper surface of the first via insulating layer 140. Alternatively, the first via insulating layer 140 may cover the source electrode 115, the drain electrode 130, and the connection electrode 145 (in the non-display area NDA) and may be provided with a uniform thickness along the contours of the source electrode 115, the drain electrode 130, and the connection electrode 145. The first via insulating layer 140 may be formed of an organic material or an inorganic material. In some exemplary embodiments of the inventive concept, the first via insulating layer 140 may be formed of an organic material (such as acrylic, Benzo-Cyclobutene (BCB), polyimide, or Hexa-Methyl-Di-Siloxane (HMDSO)) and the like.

[0058] The wiring pattern 150 may be disposed in the display area DA on the first via insulating layer 140. Alternatively, in a cross-sectional view of the organic light-emitting display device 1000, the wiring pattern 150 may be connected to the drain electrode 130 or the lower electrode 160. The wiring pattern 150 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, combinations thereof, and the like.

[0059] The lower pad 200a may be disposed in a non-display area NDA on the first via insulating layer 140. The lower pad 200a may be connected to a first portion of the connection electrode 145 through a first contact hole 500. The lower pad 200a may receive a signal from the upper pad 200b and transmit the signal to the connection electrode 145 through the first contact hole 500. The lower pad 200a may be in contact with the anisotropic conductive film 300. The lower pad 200a may extend in a direction from the non-display area NDA to the display area DA and may be electrically connected to the pixel PX. According to an embodiment of the inventive concept, the lower pad 200a may be electrically connected to a wiring 910 disposed in the display area DA. The lower pad 200a may include a first lower pad to an nth lower pad, where n is an integer of 1 or greater. The first lower pad to the nth lower pad may be spaced apart from each other and arranged parallel to the non-display area NDA. The lower pad 200a may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0060] The lower dummy pad 800a may be spaced apart from the lower pad 200a in a first direction DR1 in the non-display area NDA on the first via insulating layer 140. The lower dummy pad 800a may be disposed to at least partially overlap with the anisotropic conductive film 300. Since the lower dummy pad 800a is spaced apart from the lower pad 200a, no signal may be applied or transmitted between the two elements. The lower dummy pad 800a and the lower pad 200a may be disposed on the same layer. The lower dummy pad 800a may be disposed to at least partially overlap with the upper dummy pad 800b. The lower dummy pad 800a may not be in contact with the connection electrode 145. The lower dummy pad 800a may include a first lower dummy pad to an nth lower dummy pad. The first lower dummy pad to the nth lower dummy pad may be spaced apart from each other and arranged parallel to the non-display area NDA. For example, each of the first lower dummy pad to the nth lower dummy pad may be spaced apart from each of the first lower pad to the nth lower pad in the first direction DR1. The lower dummy pad 800a may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0061] The signal wiring 900 may be spaced apart from the lower dummy pad 800a in the first direction DR1 in the non-display area NDA on the first via insulating layer 140. The signal wiring 900 may be connected to the second portion of the connection electrode 145 through the second contact hole 510. According to an embodiment of the inventive concept, the signal wiring 900 may be electrically connected to the connection electrode 145 through the second contact hole 510. Since the signal wiring 900 is spaced apart from the lower dummy pad 800a, the signal wiring 900 may not be electrically connected to the lower dummy pad 800a. The first end of the signal wiring 900 may overlap with the first via insulating layer 140, and the second end of the signal wiring 900 opposite to the first end may be connected to the integrated circuit IC. The signal wiring 900 may not contact the anisotropic conductive film 300. For example, when the signal wiring 900 contacts the anisotropic conductive film 300, the signal wiring 900 may be short-circuited. The signal wiring 900 may include a first signal wiring to an nth signal wiring. The first signal wiring to the nth signal wiring may be spaced apart from each other and arranged parallel to the non-display area NDA. Each of the first signal wiring to the nth signal wiring may be spaced apart from each of the first lower dummy pad to the nth lower dummy pad in the first direction DR1. Alternatively, the anisotropic conductive film 300 may be disposed in at least a part of the space where each of the first signal wiring to the nth signal wiring is spaced apart from the corresponding lower dummy pad among the first lower dummy pad to the nth lower dummy pad. According to an embodiment of the inventive concept, even in this case, the anisotropic conductive film 300 does not contact the first signal wiring to the nth signal wiring. The signal wiring 900 may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0062] The second via insulating layer 155 may be disposed in the display area DA on the first via insulating layer 140. The second via insulating layer 155 may cover the wiring pattern 150 on the first via insulating layer 140 and have a flat upper surface without forming a step around the second via insulating layer 155. Alternatively, the second via insulating layer 155 may be disposed on the first via insulating layer 140 to have substantially the same thickness along the contour of the wiring pattern 150. In some exemplary embodiments of the inventive concept, the second via insulating layer 155 may include an organic material.

[0063] The lower electrode 160 may be disposed on the second via insulating layer 155, and the lower electrode 160 may include a transparent electrode, a reflective electrode, or a transflective electrode.

[0064] The pixel defining layer 175 may be disposed in the display area DA on the substrate 100. The pixel defining layer 175 may be disposed on the second via insulating layer 155 to expose a part of the upper surface of the lower electrode 160. The pixel defining layer 175 may include an organic material.

[0065] The intermediate layer 165 may be disposed on the lower electrode 160 where a part of the upper surface is exposed by the pixel defining layer 175. The intermediate layer 165 may have a structure in which a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, an electron injection layer, and similar layers are provided as single or multiple layers.

[0066] The upper electrode 170 may be disposed on the pixel defining layer 175 and the intermediate layer 165. The upper electrode 170 may include a semi-transparent electrode or a reflective electrode.

[0067] Therefore, an organic light emitting diode 180 including the lower electrode 160, the intermediate layer 165, and the upper electrode 170 may be provided.

[0068] The upper pad 200b may be disposed to at least partially overlap with the lower pad 200a. The upper pad 200b may be disposed to at least partially overlap with the anisotropic conductive film 300. The upper pad 200b may transmit a signal provided from the outside to the lower pad 200a through the anisotropic conductive film 300. The upper pad 200b may include a first upper pad to an n-th upper pad. The first upper pad to the n-th upper pad may be spaced apart from each other and arranged parallel to the non-display area NDA. The upper pad 200b may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0069] The upper dummy pad 800b may be disposed to overlap with the lower dummy pad 800a. The upper dummy pad 800b may be spaced apart from the upper pad 200b in the first direction DR1. Since the upper dummy pad 800b and the upper pad 200b are spaced apart from each other, the upper dummy pad 800b and the upper pad 200b may not be electrically connected to each other. The upper dummy pad 800b and the upper pad 200b may be disposed on the same layer. The upper dummy pad 800b may include a first upper dummy pad to an n-th upper dummy pad. The first upper dummy pad to the n-th upper dummy pad may be spaced apart from each other and arranged parallel to the non-display area NDA. According to an embodiment of the inventive concept, each of the first upper dummy pad to the n-th upper dummy pad may be spaced apart from each of the first upper pad to the n-th upper pad in the first direction DR1. The anisotropic conductive film 300 may fill a space or area where each of the first upper dummy pad to the n-th upper dummy pad is spaced apart from the corresponding upper pad among the first upper pad to the n-th upper pad. The upper dummy pad 800b may include a metal, an alloy, a metal nitride, a conductive metal oxide, a transparent conductive material, a combination thereof, and the like.

[0070] The flexible substrate 400 may be disposed on the upper dummy pad 800b and the upper pad 200b. For example, the upper pad 200b may be disposed between the flexible substrate 400 and the lower pad 200a. The flexible substrate 400 and the anisotropic conductive film 300 may contact each other through a space or region (e.g., empty) where the upper pad 200b and the upper dummy pad 800b are spaced apart from each other. The flexible substrate 400 may be formed of various materials similar to the substrate 100.

[0071] The anisotropic conductive film 300 may be disposed between the upper pad 200b and the lower pad 200a. The anisotropic conductive film 300 is a conductive film in which conductive fine particles are mixed with a common thermosetting adhesive resin to form a film state and electrically connected only in one direction. In some embodiments, the flow of electric energy may occur only in one direction through the anisotropic conductive film 300. The signal may be transmitted from the upper pad 200b to the lower pad 200a through the anisotropic conductive film 300. The anisotropic conductive film 300 may also be disposed between the upper dummy pad 800b and the lower dummy pad 800a. Since the upper dummy pad 800b is spaced apart from the upper pad 200b, the signal is not transmitted from the upper dummy pad 800b to the anisotropic conductive film 300. When heat and pressure are applied to the anisotropic conductive film 300, the end of the anisotropic conductive film 300 in the first direction DR1 may overflow in the first direction DR1. As described above, when heat and pressure are applied to the anisotropic conductive film 300, the anisotropic conductive film 300 can fill the space or area where the upper pad 200b and the upper dummy pad 800b are spaced apart from each other and the lower pad 200a and the lower dummy pad 800a are spaced apart from each other. The anisotropic conductive film 300 can be formed of conductive fine particles. The conductive fine particles include nickel (Ni) particles, carbon (C) particles, lead (Pb) particles, and the like, but are not limited thereto.

[0072] Therefore, a connection structure 190 including the upper dummy pad 800 b , the upper pad 200 b , and the flexible substrate 400 may be provided.

[0073] According to some exemplary embodiments of the inventive concept, the organic light-emitting display device 1000 may include a pad including an upper dummy pad 800b and a lower dummy pad 800a. Therefore, even if the residue 20 is attached to the end of the anisotropic conductive film 300, the pad is not short-circuited. Therefore, the driving efficiency of the organic light-emitting display device 1000 can be improved.

[0074] Figure 3 , Figure 4 and Figure 5 is a view illustrating a method of manufacturing the organic light emitting display device 1000 .

[0075] Reference Figure 3, the anisotropic conductive film 300 may be disposed on the substrate 100 provided with the lower pad 200a. The uncut upper pad 200b and the flexible substrate 400 may be disposed on the anisotropic conductive film 300. In the organic light-emitting display device 1000, signals may be transmitted along the upper pad 200b in the first direction DR1. The signals transmitted along the upper pad 200b may be transmitted through the anisotropic conductive film 300 in the opposite direction of the second direction DR2 and transmitted to the lower pad 200a. The signals reaching the lower pad 200a may flow from the lower pad 200a to the integrated circuit IC and the display area DA in the first direction DR1. The display area DA may display an image in response to the signal. However, in order to increase the process margin and effectively transmit signals, the upper pad 200b and the flexible substrate 400 disposed on the anisotropic conductive film 300 may be cut along the dashed line 11. Residues 20 may occur during the cutting operation. Some conventional processing techniques may not be able to completely remove the residues 20.

[0076] Figure 4 is a cross-sectional view showing the state in which the residue 20 adheres to the end portion of the anisotropic conductive film 300 in the first direction DR1.

[0077] Referring to Figure 4 , the residue 20 may adhere to the end portion of the anisotropic conductive film 300 in the first direction DR1. The residue 20 may include a metal material. Therefore, the signals transmitted through the upper pad 200b may be transmitted to the lower pad 200a through the residue 20 including the metal material rather than through the anisotropic conductive film 300. When the signals are transmitted through the residue 20, a short circuit may occur because the resistance of the metal material contained in the residue 20 is low. When a short circuit occurs, excessive signals are transmitted through the residue 20, and the driving efficiency of the organic light-emitting display device 1000 may be reduced.

[0078] Figure 5 is a plan view showing the state in which the residue 20 adheres to the end portion of the anisotropic conductive film 300 in the first direction DR1.

[0079] Referring to Figure 5 , signals may be transmitted through the signal wiring 900 connecting the non-display area NDA and the integrated circuit IC and the wiring 910 connecting the integrated circuit IC and the display area DA. In order to send signals, it may be necessary to send signals from the non-display area NDA. When the residue 20 adheres to the end portion 14 of the anisotropic conductive film 300 along the first direction DR1, the signals cannot be smoothly transmitted due to the short circuit.

[0080] The flexible substrate 400 may be disposed on the non-display area NDA of the substrate 100. The dashed-line 16 portion indicated on the flexible substrate 400 may represent pads. The pads disposed in the dashed-line 16 portion may be formed to extend in the first direction DR1 and may overlap each other in the second direction DR2. In addition, the pads disposed in the dashed-line 16 portion may be parallelly spaced apart in a direction perpendicular to the first direction DR1. The dashed-line 14 portion shown at an end of the flexible substrate 400 along the first direction DR1 may represent an end of the anisotropic conductive film 300 in the first direction DR1. Residue 20 attached to the anisotropic conductive film 300 positioned in the dashed-line 14 portion may cause a short circuit between the pads overlapping in the second direction DR2. In addition, due to the residue 20, a short circuit may occur between the pads parallelly spaced apart in a direction perpendicular to the first direction DR1. Accordingly, by patterning the dashed-line 12 portion to prevent a signal from being transmitted to an end of the pad in the first direction DR1 so as to prevent a short circuit, the driving efficiency of the organic light emitting display device 1000 may be improved.

[0081] Accordingly, as described above, according to some exemplary embodiments of the present inventive concept, the upper pad 200b may be patterned to form an upper dummy pad 800b spaced apart from the patterned upper pad 200b. The lower pad 200a may be patterned to form a lower dummy pad 800a spaced apart from the patterned lower pad 200a. The lower dummy pad 800a may be patterned to form a signal wiring 900 spaced apart from the patterned lower dummy pad 800a. The signal wiring 900 may be spaced apart from the anisotropic conductive film 300. In this process, an end of the anisotropic conductive film 300 to which the residue 20 is attached in the first direction DR1 may contact the upper dummy pad 800b and the lower dummy pad 800a and may not contact other portions. Accordingly, a signal may not be transmitted through the residue 20, thereby preventing a short circuit from occurring through the residue 20.

[0082] Figure 6 is a cross-sectional view showing an organic light emitting display device 1100 according to some exemplary embodiments of the present inventive concept. Except that there are a lower dummy pad 800a, a signal wiring 900, a first via insulating layer 140 including a first contact hole 500 and a second contact hole 510, and a connection electrode 145 in the non-display area NDA, Figure 6 the organic light emitting display device 1100 of Figure 2 may be the same as or substantially similar to Figure 6 the organic light emitting display device 1000 of Figure 1 Accordingly, to the extent that the description of the elements has been omitted, it may be assumed that the description is at least similar to the description of the corresponding elements described elsewhere in this specification. For example,

[0083] Reference Figure 6 As shown in Figure 6 , the organic light-emitting display device 1100 may include a substrate 100, a buffer layer 105, a gate insulating layer 110, an interlayer insulating layer 135, wiring patterns 150, a second via insulating layer 155, a pixel defining layer 175, pixels PX, a connection structure 190, an integrated circuit IC, a lower pad 200a, an anisotropic conductive film 300, and the like.

[0084] The lower pad 200a may be disposed on the substrate 100. In some exemplary embodiments of the inventive concept, a bottom surface of the lower pad 200a may be in direct contact with the substrate 100. The anisotropic conductive film 300 may be disposed on one side of the lower pad 200a. The lower pad 200a may extend along a first direction DR1 on the substrate 100 to contact the integrated circuit IC. The lower pad 200a may transmit signals received through the connection structure 190 to the display area DA through the integrated circuit IC.

[0085] The organic light-emitting display device 1000 according to some exemplary embodiments may include pads having an upper dummy pad 800b and a lower dummy pad 800a. Accordingly, even when residues 20 adhere to an end of the anisotropic conductive film 300, the pads may not be short-circuited. Accordingly, the driving efficiency of the organic light-emitting display device 1000 may be improved.

[0086] In addition, the organic light-emitting display device 1100 may not include a first via insulating layer 140 in which a first contact hole 500 and a second contact hole 510 are formed, a connection electrode 145, and the like in a non-display area NDA. The organic light-emitting display device 1100 may not include the second via insulating layer 155 and the wiring patterns 150 in the display area DA. Accordingly, the size of the organic light-emitting display device 1100 may be smaller than Figure 2 the size of the organic light-emitting display device 1000.

[0087] Embodiments of the present invention may be applied to various electronic devices including an organic light-emitting display device. For example, embodiments of the inventive concept may be applied to a vehicle-based display device, a ship-based display device, an aircraft-based display device, a portable communication device, a display device for display or information communication, a medical display device, and the like.

[0088] Although the inventive concept has been specifically shown and described with reference to exemplary embodiments of the inventive concept, those of ordinary skill in the art will understand that changes in form and detail may be made therein without departing from the spirit and scope of the inventive concept.

Claims

1. An organic light emitting display device, comprising: a substrate having a display area and a non-display area at least partially surrounding the display area; a pixel structure disposed in the display area on the substrate; a via insulating layer disposed in the non-display area on the substrate and having a contact hole; a lower pad disposed on the via insulating layer; and a connection structure, comprising: a flexible substrate disposed on the lower pad; an upper pad disposed between the flexible substrate and the lower pad; and an upper dummy pad spaced apart from an end of the upper pad in a first direction on a bottom surface of the flexible substrate, and wherein the first direction is a direction in which the lower pad is spaced apart from the pixel structure, and the end of the upper pad is an end close to the pixel structure.

2. The organic light emitting display device according to claim 1, wherein The upper pad at least partially overlaps with the lower pad.

3. The organic light emitting display device according to claim 1, further comprising a signal wiring spaced apart from the lower pad in the first direction on the via insulating layer.

4. The organic light emitting display device according to claim 3, further comprising a connection electrode disposed between the via insulating layer and the substrate.

5. The organic light emitting display device according to claim 4, wherein, The contact hole of the via insulating layer includes: a first contact hole at least partially overlapping with the lower pad; and a second contact hole at least partially overlapping with the signal wiring.

6. The organic light emitting display device according to claim 5, wherein, The lower pad is connected to a first portion of the connection electrode through the first contact hole, and the signal wiring is connected to a second portion of the connection electrode different from the first portion of the connection electrode through the second contact hole.

7. The organic light emitting display device according to claim 3, further comprising a lower dummy pad disposed on the via insulating layer between the signal wiring and the lower pad.

8. The organic light emitting display device according to claim 7, wherein The lower dummy pad, the signal wiring and the lower pad are located on the same layer.

9. The organic light-emitting display device according to claim 7, wherein, The upper dummy pad at least partially overlaps with the lower dummy pad.

10. The organic light emitting display device according to claim 7, further comprising an anisotropic conductive film disposed between the upper pad and the lower pad.

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