Display module and display device having the same

Abstract

A display module and a display device having the display module are provided. The display module may include: (1) a substrate including a mounting surface on which a thin film transistor (TFT) layer is formed, a side surface, and a chamfered portion formed between the mounting surface and the side surface; (2) a plurality of inorganic light emitting diodes (LEDs) disposed on the TFT layer, each of the plurality of inorganic light emitting diodes including: a pair of electrodes electrically connected to the TFT layer and disposed to face the mounting surface; and a light emitting surface configured to emit light in a first direction opposite to a second direction, the second direction extending from the plurality of inorganic LEDs to the mounting surface of the substrate; and (3) a molding provided to cover the plurality of inorganic light emitting diodes, the chamfered portion of the substrate, and the side surface of the substrate.

Description

Technical Field

[0001] The present disclosure relates to a display device for displaying an image through a coupling module, each module having a self-emitting inorganic light-emitting diode mounted on its substrate. Background Art

[0002] A display device is an output device that visually displays data information such as characters, numbers, images, etc.

[0003] Generally, for display devices, liquid crystal panels that require backlighting or organic light-emitting diode (OLED) panels formed of an organic compound film that emits light by itself in response to current are mainly used. However, liquid crystal panels have a slow response time and high power consumption, and require backlighting due to the limitation of self-luminescence, making it difficult to provide a display device in a compact size. In contrast, OLED panels do not require backlighting due to self-luminescence, thus achieving a thin thickness. However, OLED panels are prone to the burn-in phenomenon, in which when the same screen image is displayed for a long time, due to the end of the lifespan of sub-pixels, a part of the screen image remains even when the screen image is switched.

[0004] Therefore, in order to find alternatives to LCD panels and OED panels, research has been conducted on micro light-emitting diode (micro LED or μLED) panels that mount inorganic light-emitting diodes on a substrate and use the inorganic light-emitting diodes themselves as pixels.

[0005] A micro light-emitting diode display panel (hereinafter referred to as a micro LED panel) is one of flat panel display panels and includes a plurality of inorganic light-emitting diodes (inorganic LEDs), each inorganic light-emitting diode having a size of 100 micrometers or less.

[0006] Such an LED panel is a self-luminous device, but is not prone to OLED burn-in like inorganic light-emitting devices, and has excellent brightness, resolution, power consumption, and durability.

[0007] Compared with LCD panels that require backlighting, micro LED display panels provide better contrast, response time, and energy efficiency. Both OLEDs and micro LEDs (i.e., inorganic LEDs) are energy-saving, but compared with OLEDs, micro LEDs have excellent brightness, luminous efficiency, and lifespan.

[0008] In addition, micro LEDs can achieve display modulation at the substrate level by arranging LEDs on a circuit board in units of pixels, and can provide various resolutions and screen sizes of the display according to customer requirements. Summary of the Invention

[0009] The exemplary embodiments at least solve the above problems and / or disadvantages and other disadvantages not described above. Moreover, the exemplary embodiments need not overcome the above disadvantages, but may not overcome any of the above problems.

[0010] One or more exemplary embodiments of the present disclosure provide a display device and a manufacturing method thereof. Specifically, a display module suitable for a large display, a display device having the display module, and a manufacturing method thereof are provided.

[0011] Other aspects of the present disclosure will be partially described in the following description, and will be partially apparent from the description, or may be learned through the practice of the present disclosure.

[0012] According to an aspect of the present disclosure, a display module is provided, including: (1) a substrate including a mounting surface on which a thin film transistor (TFT) layer is formed, a side surface, and a chamfered portion formed between the mounting surface and the side surface; (2) a plurality of inorganic light emitting diodes (LEDs) disposed on the TFT layer, each of the plurality of inorganic LEDs including: a pair of electrodes electrically connected to the TFT layer and disposed to face the mounting surface; and a light emitting surface configured to emit light in a first direction opposite to a second direction, the second direction extending from the plurality of inorganic LEDs to the mounting surface of the substrate; and a molding provided to cover the plurality of inorganic LEDs, the chamfered portion of the substrate, and the side surface of the substrate.

[0013] The mounting surface may include four edges, one of the four edges may correspond to the side surface, and the molding may cover the four edges of the mounting surface.

[0014] The display module may further include a printed circuit board (PCB) configured to electrically control the plurality of inorganic LEDs, wherein the PCB may be disposed on a rear surface of the substrate that is provided to be opposite to the mounting surface, and the molding may surround the mounting surface, the chamfered portion, and the side surface.

[0015] The display module may further include a cover disposed on an upper surface of the molding, wherein the molding may have a first surface area larger than a second surface area of the mounting surface of the substrate, and the cover may have a third surface area equal to or larger than the first surface area of the molding.

[0016] The display module may further include a cover disposed on an upper surface of the molding, wherein the cover may include: cover glass; and a circular polarization layer disposed in front of the cover glass and configured to circularly polarize light transmitted through the circular polarization layer.

[0017] The display module may further include a light absorption pattern disposed between the molded part and the cover glass, and a black matrix formed on the mounting surface between the plurality of inorganic LEDs, wherein the light absorption pattern may be located at a position corresponding to the position of the black matrix in a third direction facing the mounting surface.

[0018] The light absorption pattern may extend to the outside of the side surface in a fourth direction perpendicular to the third direction facing the mounting surface.

[0019] The display module may further include a cover disposed on the upper surface of the molded part, wherein the cover may include a first layer and a second layer, and the second layer is stacked on the first layer and is located at the rear side of the first layer in a first direction.

[0020] The first layer may include at least one of an antiglare layer provided to diffusely reflect incident light or an antireflection layer provided to change the reflection direction of incident light.

[0021] The second layer may include a material that reduces the transmission of incident light that is incident on the second layer and then transmitted through the second layer.

[0022] The second layer may include a circularly polarized layer.

[0023] The display module may further include a black matrix disposed between the plurality of inorganic LEDs.

[0024] Each of the plurality of inorganic LEDs may further include a bottom surface formed on a side opposite to the light emitting surface, wherein the pair of electrodes may be disposed on the bottom surface.

[0025] According to another aspect of the present disclosure, there is provided a display device including an array of display modules, wherein a plurality of display modules are arranged in an M×N matrix, where M and N may be natural numbers, and each of the plurality of display modules may include: (1) a substrate including a mounting surface on which a thin film transistor (TFT) layer is formed, a side surface, and a chamfered portion formed between the mounting surface and the side surface; (2) a plurality of inorganic light emitting diodes (LEDs) disposed on the TFT layer, each of the plurality of inorganic LEDs including: a pair of electrodes electrically connected to the TFT layer and disposed to face the mounting surface; and a light emitting surface configured to emit light in a first direction opposite to a second direction, the second direction extending from the plurality of inorganic LEDs to the mounting surface of the substrate on which the pair of electrodes is disposed; and a molded part provided to cover the plurality of inorganic LEDs, the chamfered portion of the substrate, and the side surface of the substrate.

[0026] Each of the plurality of display modules may further include: a printed circuit board (PCB) provided to drive a plurality of inorganic LEDs and disposed on a side opposite to the mounting surface; and wirings that connect the plurality of inorganic LEDs to the PCB and extend along the side surface, wherein a molding is provided to cover the wirings extending on the side surface.

[0027] The mounting surface may include four edges, each of the four edges may correspond to the side surface, and the molding may cover the four edges of the mounting surface.

[0028] The molding may include a first region located outside the mounting surface in a third direction perpendicular to the first direction and a second region located on the mounting surface, and the cover may include a first region positioned to correspond to the first region of the molding in the first direction and a second region positioned to correspond to the second region of the molding in the first direction.

[0029] The plurality of display modules may include a first display module and a second display module, and the second display module is disposed adjacent to the first display module in the third direction. The plurality of inorganic LEDs of the first display module may include a first inorganic LED adjacent to the second display module in the third direction and a second inorganic LED adjacent to the first inorganic LED in the third direction. The plurality of inorganic LEDs of the second display module may include a third inorganic LED adjacent to the first display module in the third direction and a fourth inorganic LED adjacent to the third inorganic LED in the third direction. The interval between the first inorganic LED and the second inorganic LED may correspond to the interval between the first inorganic LED and the third inorganic LED.

[0030] The sum of the length between the end of the substrate of the first display module and the first inorganic LED in a fourth direction toward the second display module and the length of the first region of the molding in the fourth direction toward the second display module may correspond to half of the interval between the first inorganic LED and the second inorganic LED.

[0031] The cover may include cover glass and a circularly polarizing layer disposed on the upper side of the cover glass in the first direction.

[0032] According to another aspect of the present disclosure, a display device is provided, which includes: (1) a front cover configured to protect the display device from external forces; (2) a substrate disposed opposite to the front cover; (3) a thin film transistor (TFT) layer disposed on the substrate and between the substrate and the front cover; (4) a plurality of micro inorganic light emitting diodes (LEDs) disposed on the TFT layer, each of the plurality of micro inorganic LEDs including: at least one electrode connected to the TFT layer; and a light emitting surface configured to emit light in a direction towards the front cover; and (5) a molding member disposed between the substrate and the front cover to cover the micro inorganic LEDs and the substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] These and / or other aspects of the present disclosure will become apparent and easier to understand by the following description of embodiments in conjunction with the accompanying drawings.

[0034] Figure 1 is a view showing a display device according to an embodiment of the present disclosure;

[0035] Figure 2 is a view showing Figure 1 an exploded view of the main components of the display device shown in

[0036] Figure 3 is a view showing Figure 1 an enlarged cross-sectional view of some components shown in

[0037] Figure 4 is a view showing Figure 1 a perspective view of a display module of the display device shown in

[0038] Figure 5 is a view showing Figure 1 a cross-sectional view of some components of the display device shown in

[0039] Figure 6 is a view showing Figure 5 an enlarged cross-sectional view of other components shown in

[0040] Figure 7 is a view showing Figure 1 a cross-sectional view of some components of the display device shown in

[0041] Figure 8 is a flowchart showing a method of manufacturing a display device according to an embodiment of the present disclosure; and

[0042] Figure 9 is an enlarged cross-sectional view of some components of a display device according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0043] Example embodiments will be described in more detail below with reference to the accompanying drawings.

[0044] In the following description, even in different drawings, the same reference numerals are used for the same elements. The content defined in the description, such as detailed configurations and elements, is provided to assist in a comprehensive understanding of the example embodiments. However, it is obvious that the example embodiments can be practiced without those specific defined contents. In addition, well-known functions or configurations will not be described in detail because they will obscure the description with unnecessary details.

[0045] In the following description, it will be understood that the singular forms "a", "an", and "the" include plural referents unless the context clearly indicates otherwise. To make the description of the present disclosure clear, irrelevant parts are not shown, and for clarity, the dimensions of the components are enlarged.

[0046] It will be further understood that when used in this specification, the terms "comprises", "comprising", and / or "has" indicate the presence of the stated features, integers, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof.

[0047] In addition, the meaning of "the same" in the specification may include having similar properties or similarities within a specific range. In addition, "the same" means "substantially the same". It should be understood that the meaning of "substantially the same" refers to values that fall within the error range in manufacturing or have differences within a range that is not significant relative to the reference value.

[0048] Expressions such as "at least one of..." when following a list of elements modify the entire list of elements and not individual elements in the list. For example, the expression "at least one of a, b, and c" should be understood to include only a, only b, only c, both a and b, both a and c, both b and c, all of a, b, and c, or any variation of the above examples.

[0049] Hereinafter, embodiments according to the present disclosure will be described in detail with reference to the drawings.

[0050] Figure 1 is a view showing a display device according to an embodiment of the present disclosure, Figure 2 is a view showing Figure 1 an exploded view of the main components of the display device shown in Figure 3 is a view showing Figure 1 an enlarged cross-sectional view of some of the components shown in Figure 4 is a view showing Figure 1 a perspective view of the display module of the display device shown in Figure 5 is a view showingFigure 1 A cross-sectional view of some components of the display device shown in Figure 6 is a diagram showing Figure 5 an enlarged cross-sectional view of other components shown in

[0051] In the following description, components of the display device 1 including a plurality of inorganic light-emitting diodes 50 shown in the drawings are components in micro-units having dimensions of several μm to several hundred μm. For ease of description, the dimensions of some components (a plurality of inorganic light-emitting diodes 50, black matrix 80, etc.) shown in the drawings may be enlarged.

[0052] The display device 1 is a device that displays information, materials, data, etc. as characters, numbers, charts, images, etc., and can be implemented as a television (TV), personal computer (PC), mobile phone, digital signage, etc.

[0053] According to an embodiment of the present disclosure, with reference to Figure 1 and Figure 2 , the display device 1 includes a display panel 20 that displays an image, a power supply device configured to supply power to the display panel 20, a main board 25 that controls the overall operation of the display panel 20, a frame 21 that supports the display panel 20, and a rear cover 10 that covers the rear surface of the frame 21.

[0054] The display panel 20 may include: a plurality of display modules 30A to 30P; a driving board for driving each of the display modules 30A to 30P; and a timing controller (TCON) board that generates timing signals required to control each of the display modules 30A to 30P.

[0055] The rear cover 10 may support the display panel 20. The rear cover 10 may be mounted on the floor through a bracket, or may be mounted on the wall through a suspension bracket.

[0056] A plurality of display modules 30A to 30P may be arranged adjacent to each other in the up-down side direction and the left-right side direction. A plurality of display modules 30A to 30P may be arranged in an M×N matrix form, where M and N are natural numbers. In an embodiment, the display modules 30A to 30P are provided as 16 display modules 30A to 30P and arranged in a 4×4 matrix form, but there is no limitation on the number and arrangement method of the plurality of display modules 30A to 30P.

[0057] A plurality of display modules 30A to 30P may be mounted on the frame 21. A plurality of display modules 30A to 30P may be mounted on the frame 21 by various methods (such as using the magnetic force of a magnet or a mechanical assembly structure). The rear cover 10 is coupled to the rear of the frame 21, and the rear cover 10 may form the rear appearance of the display device 1.

[0058] As described above, the display device 1 according to an embodiment of the present disclosure can implement a large screen by tiling a plurality of display modules 30A to 30P.

[0059] According to another embodiment, among the plurality of display modules 30A to 30P, each individual display module can be applied to a display device. That is, the display modules 30A to 30P can be individually installed on electronic products or machine components, such as wearable devices, portable devices, handheld devices, and various other displays that require various displays, or can be assembled in a matrix form as in the embodiment and used for a display device, such as a monitor for a PC, a high-definition TV, a sign, and an electronic display.

[0060] The plurality of display modules 30A to 30P can have the same configuration. Therefore, any description of one of the display modules described below can be equivalently applied to all other display modules.

[0061] One of the plurality of display modules 30A to 30P, for example, the first display module 30A can be formed in a quadrilateral type. Alternatively, the first display module 30A can be provided in a rectangular type or a square type.

[0062] Therefore, the first display module 30A can include edges 31, 32, 33, and 34 formed in the up-and-down side direction and the left-and-right side direction with respect to a first direction X as a forward direction. The first direction X can be orthogonal or perpendicular to the surface of the first display module 30A and can be opposite to the direction extending from the plurality of inorganic light-emitting diodes 50 to the mounting surface 41.

[0063] Refer to Figure 3 , each of the plurality of display modules 30A to 30P can include a substrate 40 and a plurality of inorganic light-emitting diodes 50 mounted on the substrate 40. The plurality of inorganic light-emitting diodes 50 can be mounted on a mounting surface 41 of the substrate 40 facing the first direction X.

[0064] The substrate 40 can be formed in a quadrilateral type. As described above, the plurality of display modules 30A to 30P can be formed in a quadrilateral shape, and the substrate 40 can be formed in a quadrilateral shape to correspond to each display module.

[0065] The substrate 40 can be provided in a rectangular shape or a square shape.

[0066] Therefore, taking the first display module 30A as an example, the substrate 40 can include four edges E corresponding to the edges 31, 32, 33, and 34 of the first display module 30A formed in the up-and-down side direction and the left-and-right side direction with respect to a first direction X as a forward direction (see Figure 4 ).

[0067] The substrate 40 may include a base substrate 42 and a thin film transistor (TFT) layer 43 formed on the base substrate 42 to drive the inorganic light-emitting diode 50. The base substrate 42 may include a glass substrate. That is, the substrate 40 may include a chip on glass (COG) type substrate. The substrate 40 may include a first pad electrode 44a and a second pad electrode 44b, which are provided to electrically connect the inorganic light-emitting diode 50 to the TFT layer 43.

[0068] The TFTs constituting the TFT layer 43 are not limited to a specific structure or type and may be configured in various embodiments. That is, the TFTs of the TFT layer 43 according to an embodiment of the present disclosure may be implemented as low-temperature polycrystalline silicon (LTPS) TFTs, oxide TFTs, Si (polycrystalline silicon or amorphous silicon (a-silicon)) TFTs, organic TFTs, graphene TFTs, etc. The TFT layer 43 may completely or partially cover the mounting surface 41 of the substrate 40.

[0069] In addition, when the base substrate 42 of the substrate 40 is formed of a silicon wafer, the TFT layer 43 may be replaced by a complementary metal oxide semiconductor (CMOS) type transistor or an n-type or p-type MOSFET transistor.

[0070] The plurality of inorganic light-emitting diodes 50 may include inorganic light-emitting diodes formed of an inorganic material and having a width, length, and height of several μm to several tens of μm each. The micro inorganic light-emitting diodes may have a short side of 100 μm or less among the width, length, and height. That is, the inorganic light-emitting diodes 50 may be picked up from a sapphire or silicon wafer and directly transferred onto the substrate 40. A plurality of inorganic light-emitting diodes 50 may be picked up and transferred by an electrostatic method using an electrostatic head or an imprinting method using an elastic polymer material such as polydimethylsiloxane (PDMS) or silicon as the head.

[0071] The plurality of inorganic light-emitting diodes 50 are light-emitting structures including an n-type semiconductor 58a, an active layer 58c, a p-type semiconductor 58b, a first contact electrode 57a, and a second contact electrode 57b.

[0072] One of the first contact electrode 57a and the second contact electrode 57b is electrically connected to the n-type semiconductor 58a, and the other is provided to be electrically connected to the p-type semiconductor 58b.

[0073] The first contact electrode 57a and the second contact electrode 57b may be in the form of flip chips so as to be disposed parallel to each other while facing the same direction (the direction opposite to the light emission direction).

[0074] The inorganic light-emitting diode 50 includes: a light-emitting surface 54, which is set to face the first direction X when mounted on the mounting surface 41; a side surface 55; and a bottom surface 56, which is provided on the side opposite to the light-emitting surface 54, and the first contact electrode 57a and the second contact electrode 57b may be formed on the bottom surface 56.

[0075] That is, the contact electrodes 57a and 57b of the inorganic light-emitting diode 50 may be provided on the side opposite to the light-emitting surface 54, and thus are provided on the side opposite to and facing away from the light-emitting direction.

[0076] The contact electrodes 57a and 57b may be set to face the mounting surface 41, may be electrically connected to the TFT layer 43, and the light-emitting surface 54 may be arranged to emit light in a direction opposite to and facing away from the direction in which the contact electrodes 57a and 57b are oriented.

[0077] Therefore, when the light generated from the active layer 58c is emitted through the light-emitting surface 54 in the first direction X, the light can be emitted in the first direction X without disturbing the first contact electrode 57a or the second contact electrode 57b.

[0078] That is, the first direction X may be defined as the direction in which light is emitted from the light-emitting surface 54.

[0079] The first contact electrode 57a and the second contact electrode 57b may be electrically connected to the first pad electrode 44a and the second pad electrode 44b formed on the mounting surface 41 side of the substrate 40, respectively.

[0080] As will be described below, the inorganic light-emitting diode 50 may be directly connected to the pad electrodes 44a and 44b through a bonding structure such as an anisotropic conductive layer 70 or solder.

[0081] The anisotropic conductive layer 70 may be formed on the substrate 40 to mediate the electrical bonding between the contact electrodes 57a and 57b and the pad electrodes 44a and 44b. The anisotropic conductive layer 70 may represent an anisotropic conductive adhesive attached to the protective film and has a structure in which conductive balls 71 are dispersed in the adhesive resin. The conductive balls 71 may be conductive balls surrounded by a thin insulating film, and when the insulating film is broken by pressure, electrical connection occurs between the conductors.

[0082] The anisotropic conductive layer 70 may include an anisotropic conductive film (ACF) in the form of a film and an anisotropic conductive paste (ACP) in the form of a paste.

[0083] Therefore, when a plurality of inorganic light-emitting diodes 50 are mounted on the substrate 40, the pressure applied to the anisotropic conductive layer 70 causes the insulating film of the conductive balls 71 to break, so that the contact electrodes 57a and 57b of the inorganic light-emitting diodes 50 can be electrically connected to the pad electrodes 44a and 44b of the substrate 40.

[0084] In another example, a plurality of inorganic light-emitting diodes 50 can be mounted on the substrate 40 by solder instead of the anisotropic conductive layer 70. The inorganic light-emitting diodes 50 can be first arranged on the substrate 40, and then the inorganic light-emitting diodes 50 can be subjected to a reflow process to be bonded to the substrate 40.

[0085] The plurality of inorganic light-emitting diodes 50 can include a red light-emitting device 51, a green light-emitting device 52, and a blue light-emitting device 53, and the light-emitting devices 50 can be mounted on the mounting surface 41 of the substrate 40 as a unit with a series of red light-emitting devices 51, green light-emitting devices 52, and blue light-emitting devices 53. A series of red light-emitting devices 51, green light-emitting devices 52, and blue light-emitting devices 53 can form a pixel. In this case, the red light-emitting device 51, the green light-emitting device 52, and the blue light-emitting device 53 can each form a sub-pixel.

[0086] The red light-emitting device 51, the green light-emitting device 52, and the blue light-emitting device 53 can be arranged in a row at a predetermined interval as in the embodiments of the present disclosure, or can be arranged in a different shape such as a triangular shape.

[0087] The substrate 40 can include a light absorption layer 60 for improving the contrast by absorbing external light. The light absorption layer 60 can be formed integrally on one side of the mounting surface 41 of the substrate 40. The light absorption layer 60 can be formed between the TFT layer 43 and the anisotropic conductive layer 70.

[0088] The plurality of display modules 30A to 30P can further include a black matrix 80 formed between the plurality of inorganic light-emitting diodes 5O.

[0089] The black matrix 80 can perform a function of supplementing the light absorption layer 60 formed entirely on the side of the mounting surface 41 of the substrate 40. That is, the black matrix 80 absorbs external light and makes the substrate 40 appear black, thereby improving the contrast of the screen.

[0090] The black matrix 80 can be black.

[0091] In an embodiment, the black matrix 80 is formed to be disposed between pixels, and each pixel is respectively formed by a series of red light-emitting devices 51, green light-emitting devices 52, and blue light-emitting devices 53. In another embodiment, the black matrix 80 can be formed with higher precision and separate each light-emitting device 51, 52, and 53 serving as a sub-pixel.

[0092] The black matrix 80 may be formed in a grid shape having horizontal and vertical patterns so as to be disposed between pixels.

[0093] The black matrix 80 may be formed by applying a light-absorbing ink onto the anisotropic conductive layer 70 by an inkjet process and curing the light-absorbing ink, or the black matrix 80 may be formed by coating a light-absorbing film onto the anisotropic conductive layer 70.

[0094] That is, on the entire anisotropic conductive layer 70 formed on the mounting surface 41, the black matrix 80 may form gaps between the plurality of inorganic light-emitting diodes 50, in which the plurality of inorganic light-emitting diodes 50 are not mounted.

[0095] The plurality of display modules 30A to 30P may include a molding 100 disposed on the upper side of the mounting surface 41 in the first direction X so as to cover the plurality of display modules 30A to 30P and / or the mounting surface 41 of the plurality of display modules 30A to 30P, respectively.

[0096] Referring Figure 4 and Figure 5 , the plurality of moldings 100 may be provided to be formed on the upper sides of the plurality of display modules 30A to 30P in the first direction X, respectively.

[0097] Each of the plurality of display modules 30A to 30P may be assembled after the separate molding 100 is formed. That is, when taking the first display module 30A and the second display module 30E among the plurality of display modules 30A to 30P as an example, the first molding 100A may be formed on the mounting surface 41 of the first display module 30A, and the second molding 100E may be formed on the mounting surface 41 of the second display module 30E.

[0098] The molding 100 may cover the substrate 40 to protect the substrate 40 from external force or external moisture.

[0099] Each molding 100 may be formed of an optically transparent resin (e.g., optically clear resin (OCR)). The OCR may be highly transparent, having a transmittance of 90% or more.

[0100] The OCR may improve visibility and image quality by increasing the transmittance via low reflection characteristics. That is, in a structure having an air gap, light loss occurs due to the difference in refractive index between the film layer and the air layer, but in a structure using the OCR, the difference in refractive index is reduced, thereby reducing light loss and thus improving visibility and image quality.

[0101] That is, the OCR may improve image quality and protect the substrate 40.

[0102] The molded part 100 may have a predetermined height or greater in the first direction X facing the mounting surface 41 or the light-emitting surface 54.

[0103] This is to sufficiently fill the gap that may be formed between the molded part 100 and the plurality of inorganic light-emitting diodes 50 when the molded part 100 is formed on the substrate 40.

[0104] Specifically, the plurality of inorganic light-emitting diodes 50 mounted on the mounting surface 41 are arranged to protrude from the mounting surface 41 in the first direction X, and due to the plurality of inorganic light-emitting diodes 50, an uneven portion may be formed on the mounting surface 41.

[0105] When the molded part 100 is formed on the mounting surface 41, an air gap region may be formed between the mounting surface 41 and the molded part 100 due to the uneven portion formed on the mounting surface 41. To fill the uneven portion formed by the plurality of inorganic light-emitting diodes 50 on the mounting surface 41, the molded part 100 needs to have a height that is at least several tens or hundreds of times the height of the plurality of protruding inorganic light-emitting diodes 50. That is, the molded part 100 is formed on the mounting surface 41 by being compression-hardened on the mounting surface 41, and during the curing process of the molded part, an air gap region may be formed between the mounting surface 41 and the molded part 100 due to the uneven portion, which may cause the formation of air bubbles.

[0106] However, when the molded part 100 is formed to a certain height, the molded part 100 may be formed inside the uneven portion formed on the mounting surface 41 during compression hardening, so that the molded part 100 can be completely formed on the mounting surface 41 without an empty space between the mounting surface 41 and the molded part 100.

[0107] The plurality of display modules 30A to 30P may include front covers 200 respectively provided at the foremost sides in the first direction X of the plurality of display modules 30A to 30P.

[0108] The front covers 200 may be provided in plurality so as to be provided on each of the plurality of display modules 30A to 30P. Each front cover 200 may be coupled to the upper side of the corresponding one of the molded parts 100 of the plurality of display modules 30A to 30P in the first direction.

[0109] The front cover 200 may protect the substrate 40 from external forces. As will be described below, the front cover 200 may reduce the exposure of the seam formed by the gap G formed between the plurality of display modules 30A to 30P and improve the color deviation between the plurality of display modules 30A to 30P.

[0110] A plurality of display modules 30A to 30P may be assembled after the separate front covers 200 are coupled to the respective molded parts 100. That is, when taking the first display module 30A and the second display module 30E among the plurality of display modules 30A to 30P as examples, the first front cover 200A may be formed on the first molded part 100A of the first display module 30A, and the second front cover 200E may be formed on the second molded part 100E of the second display module 30E.

[0111] Hereinafter, the molded part 100 and the front cover 200 will be described in detail.

[0112] Since the plurality of display modules 30A to 30P are formed identically to each other, the plurality of display modules 30A to 30P will be described with respect to the first display module 30A.

[0113] That is, in order to avoid redundant description, the configurations of the plurality of display modules 30A to 30P will be described by taking the display module 30, the substrate 40, the molded part 100, and the front cover 200 as examples.

[0114] In addition, the first display module 30A among the plurality of display modules 30A to 30P and the second display module 30E disposed adjacent to the first display module 30A in the second direction Y will be described as needed.

[0115] In addition, since the plurality of display modules 30A to 30P are formed identically to each other, the molded part 100 and the front cover 200 formed on the plurality of display modules 30A to 30P will be described by taking the first molded part 100A and the first front cover 200A of the first display module 30A and the second molded part 100E and the second front cover 200E of the second display module 30E as examples.

[0116] One of the plurality of display manufacturing processes for implementing a display panel using a display module is set in the following form: arranging a plurality of display modules adjacent to each other; forming a single molded part on the entire area of the mounting surface of the plurality of display modules and on the gaps between the plurality of display modules; forming a light absorption pattern on the molded part; and forming a single front cover over the light absorption pattern.

[0117] Alternatively, another processing method is set in the following form: forming a light absorption pattern on a single front cover; and tiling a plurality of display modules to match the light absorption pattern so as to dispose the light absorption pattern between the gaps between the plurality of display modules.

[0118] Alternatively, another processing method is set in the following form: when forming a light absorption pattern on a molded part or a front cover before tiling a plurality of display modules, a light absorption pattern structure is pre-formed. Different from the above processing method, the display device 1 according to an embodiment of the present disclosure is manufactured as follows: the molded part 100 and the front cover 200 are formed on each of the plurality of display modules 30A to 30P before tiling the plurality of display modules 30A to 30P. In addition, in order to absorb the light reflected from the gap G between the plurality of display modules 30A to 30P, the molded part 100 and the front cover 200 of each of the plurality of display modules 30A to 30P may be formed to extend beyond the substrate 40 of each of the plurality of display modules 30A to 30P.

[0119] The gap G formed between the plurality of display modules 30A to 30P represents the gap between one side surface of the side surfaces of the display modules 30A to 30P and the other side surface of the side surfaces of the display modules 30A to 30P that is adjacent to the one side surface in the second direction Y or the third direction Z.

[0120] However, the side surfaces of the display modules 30A to 30P do not refer to the side surfaces 45 of the substrate 40, but refer to the edges 41e of the mounting surfaces 41 of the display modules 30A to 30P.

[0121] Basically, the gap between the display modules 30A to 30P may be formed between the side surfaces 45 of the substrates 40 of the display modules 30A to 30P. However, since the gap G according to the embodiment of the present disclosure refers to the non-display area that can be formed between the display modules 30A to 30P, the gap G formed between the plurality of display modules 30A to 30P should be understood as the gap from one edge 41e of the mounting surfaces 41 of the substrates 40 of the display modules 30A to 30P to the other edge 41e of the mounting surfaces 41 of the substrates 40 of the display modules 30A to 30P that is adjacent to the one edge 41e.

[0122] Therefore, the gap G formed between the plurality of display modules 30A to 30P refers to the gap between one edge 41e of the mounting surfaces 41 of the display modules 30A to 30P and the other edge 41e of the mounting surfaces 41 of the display modules 30A to 30P that is adjacent to the one edge 41e in the second direction Y or the third direction Z.

[0123] Therefore, as will be described below, the chamfered portions 49 and the side surfaces 45 of the substrates 40 of the display modules 30A to 30P may be provided in the gap G formed between the plurality of display modules 30A to 30P.

[0124] Accordingly, when a plurality of display modules 30A to 30P are tiled, the molded members 100 and the front covers 200 extending from each of the display modules 30A to 30P are disposed in the gap G between the plurality of display modules 30A to 30P to absorb the light transmitted to the gap G or the light reflected from the gap G, thereby minimizing the perception of the docking seam.

[0125] Referring Figure 6 , the molded members 100 and the front covers 200 extend outside the substrate 40 in the second direction Y.

[0126] The substrate 40 may include a mounting surface 41, a rear surface 48 formed parallel to the mounting surface 41, and side surfaces 45 provided between the mounting surface 41 and the rear surface 48.

[0127] The substrate 40 may include chamfered portions 49 formed between the mounting surface 41 and the side surfaces 45 and between the rear surface 48 and the side surfaces 45.

[0128] When a plurality of display modules 30A to 30P are arranged, the chamfered portions 49 may prevent each substrate from colliding and being damaged.

[0129] The molded member 100 may surround and cover the substrate 40. For example, the molded member may cover the mounting surface 41 of the substrate 40 in the first direction X.

[0130] In addition, the molded member 100 may cover not only the mounting surface 41 of the substrate 40, but also the side surfaces 45 facing the second direction Y perpendicular to the first direction X and the chamfered portions 49.

[0131] Embodiments of the present disclosure have been described with respect to an edge E of the substrate 40 corresponding to the right edge 31 of the first display module 30A, but as Figure 4 shown, the chamfered portions 49 and the side surfaces 45 may be formed on other edges E of the substrate 40 corresponding to other edges 32, 33, and 34.

[0132] That is, the chamfered portions 49 and the side surfaces 45 may be disposed on each of the four edges E of the substrate 40. In addition, the molded member 100 may cover the side surfaces 45 and the chamfered portions 49 formed on the two side edges E of the substrate 40 in the second direction Y, and cover the side surfaces 45 and the chamfered portions 49 formed on the two side edges E of the substrate 40 in the third direction Z (see Figure 4 ).

[0133] Accordingly, the molded member 100 may protect the plurality of inorganic light emitting diodes 50 mounted on the mounting surface 41 from external forces, while protecting the side surfaces 45 of the substrate 40 from external forces.

[0134] In addition, the molded part 100 can protect the substrate 40 from external moisture.

[0135] The first display module 30A may include a printed circuit board (PCB) 47a, which is provided to electrically control a plurality of inorganic light-emitting diodes 50 mounted on the mounting surface 41 (see Figure 5 ).

[0136] The PCB 47a can supply power to the plurality of inorganic light-emitting diodes 50, or transmit an electrical signal to the plurality of inorganic light-emitting diodes 50 to control the corresponding driving of the plurality of inorganic light-emitting diodes 50.

[0137] The PCB 47a can be disposed on the rear surface 48 of the substrate 40 in the first direction X.

[0138] The substrate 40 may include wirings 46 that electrically connect the PCB 47a to the plurality of inorganic light-emitting diodes 50. The wirings 46 can be provided in the form of a thin film.

[0139] The wirings 46 can connect the TFT layer 43 formed on the mounting surface 41 to the PCB 47a. In addition, a flexible printed circuit board 47b can be disposed between the wirings 46 and the PCB 47a to electrically connect the wirings 46 to the PCB 47a.

[0140] The flexible printed circuit board 47b can be disposed on the rear surface 48 of the substrate 40 together with the PCB 47a.

[0141] The TFT layer 43, the wirings 46, the flexible printed circuit board 47b, and the PCB 47a can be electrically connected in this order.

[0142] The wiring 46 has one end that is connected to the contact pad of the TFT layer 43 disposed on the edge 41e side of the mounting surface 41, so that the TFT layer 43 is electrically connected to the wiring 46.

[0143] In addition, the wiring 46 has the other end that is connected to the flexible printed circuit board 47b, so that the wiring 46 is electrically connected to the flexible printed circuit board 47b.

[0144] That is, the contact pad of the TFT layer 43 and a part of the wiring 46 can be disposed on the mounting surface 41 of the substrate 40, the wiring 46 can be disposed on the side surface 45 of the substrate 40, and the PCB 47a, the flexible printed circuit board 47b, and at least a part of the wiring 46 can be disposed on the rear surface 48 of the substrate 40.

[0145] As described above, since the TFT layer 43 is formed on the mounting surface 41 of the substrate 40 and the PCB 47a is disposed on the rear surface 48 of the substrate 40 opposite to the mounting surface 41, the wiring 46 can be formed to extend along the chamfered portion 49 and the side surface 45 of the substrate 40 to connect the TFT layer 43 and the PCB 47a to each other.

[0146] The molding 100 can cover the mounting surface 41, the chamfered portion 49, and the side surface 45 of the substrate 40. Additionally, the molding 100 can cover the wiring 46 extending along the chamfered portion 49 and the side surface 45 while covering the chamfered portion 49 and the side surface 45.

[0147] That is, the molding 100 can be provided such that a part of the molding 100 extends outside the mounting surface 41 in the second direction Y and covers the chamfered portion 49, the side surface 45, and the wiring 46.

[0148] Therefore, in addition to the substrate 40, the molding 100 can also cover at least a part of the wiring 46, thereby protecting the substrate 40 and the wiring 46 from external forces.

[0149] According to an embodiment of the present disclosure, the wiring 46 can extend along the side surface 45 of the substrate 40 in the second direction Y to reach the rear surface 48 of the substrate 40. Thus, the wiring 46 of the first display module 30A can be disposed adjacent to the second display module 30E adjacent to the first display module 30A in the second direction Y.

[0150] However, the present disclosure is not limited thereto, and the wiring 46 can extend along the side surface 45 of the substrate 40 in the third direction Z perpendicular to the first direction X and the second direction Y to reach the rear surface 48 of the substrate 40. In this case, the wiring 46 of the first display module 30A can be disposed adjacent to the third display module 30B adjacent to the first display module 30A in the third direction Z.

[0151] That is, according to an embodiment of the present disclosure, the wiring 46 can extend along one side of an edge E corresponding to the right edge 31 of the first display module 30A. However, the present disclosure is not limited thereto, and the wiring 46 can extend along the edge E corresponding to at least two of the four edges 31, 32, 33, and 34 of the first display module 30A.

[0152] According to an embodiment of the present disclosure, the wiring 46 can extend along the side surface 45 formed on a pair of edges E corresponding to the right edge 31 and the left edge 33 of the substrate 40 to reach the rear surface 48 of the substrate 40.

[0153] However, the present disclosure is not limited thereto. The wiring 46 may not extend along the edge E corresponding to the right edge 31 of the substrate 40, but may extend along the edge E corresponding to the upper edge 32 or the lower edge 34 of the substrate 40.

[0154] On one side of the substrate 40 where the edge E on which the wiring 46 is disposed (such as the edge E corresponding to the right edge 31 among the four edges 31, 32, 33, and 34 of the substrate 40) is located, the molding 100 may cover all the chamfered portions 49, the side surfaces 45, and the wiring 46. However, on the side of the substrate 40 where the edge E on which the wiring 46 is not disposed is located, the molding 100 may cover only the chamfered portions 49 and the side surfaces 45.

[0155] The front cover 200 may include a first layer 210 disposed on the outermost side of the display module 30 in the first direction X and a second layer 220 disposed behind the first layer 220. The first layer 210 and the second layer 220 may be stacked one on top of the other in the first direction X.

[0156] The front cover 200 may include an adhesive layer 230 provided such that the first layer 210 and the second layer 220 are attached to the upper surface of the molding 100 in the first direction X. The adhesive layer 230 may be disposed on the rearmost side of the front cover 200 in the first direction X.

[0157] However, the present disclosure is not limited thereto. The adhesive layer 230 may be provided as a component disposed on the upper surface of the molding 100 in the first direction X of the molding 100 such that the front cover 200 is attached to the molding 100.

[0158] The adhesive layer 230 may be formed of a transparent material such that light can easily transmit therethrough. In one embodiment, the adhesive layer 230 may be in a highly transparent state having a transmittance of 90% or higher, such as an optically clear resin (OCR).

[0159] Therefore, external light can sequentially pass through the first layer 210, the second layer 220, and the adhesive layer 230, and then transmit through the molding 100 to reach the substrate 40 and the gap G.

[0160] Conversely, the light reflected from the substrate 40 and the gap G can transmit through the molding 100, and then sequentially pass through the adhesive layer 230, the second layer 220, and the first layer 210 to reach the outside of the display panel 20.

[0161] The first layer 210 may be provided as an anti-glare layer 210. That is, the first layer 210 may be formed of a material that diffusely reflects the light incident from the outside, or may include particles that diffusely reflect the light incident from the outside.

[0162] However, the present disclosure is not limited thereto, and the first layer 210 may be formed as a layer having different properties or materials or having different functions, which will be described below. In the following description, for convenience of description, the first layer 210 will be shown as an antiglare layer 210.

[0163] The antiglare layer 210 may diffusely reflect light incident from the outside, thereby preventing the externally incident light from being regularly reflected and dazzling the user.

[0164] Since the light incident from the outside is diffusely reflected, the glare phenomenon can be reduced and the contrast of the screen image displayed on the display panel 20 can be improved.

[0165] The second layer 220 may be provided as a light transmittance control layer 220. That is, the second layer 220 may be formed of a material that allows only a part of the light incident from the outside to pass through, or may include particles having a low light transmittance.

[0166] However, the present disclosure is not limited thereto, and the second layer 220 may be formed as a layer having different properties or materials or having different functions, which will be described below. In the following description, for convenience of description, the second layer 210 will be described as a light transmittance control layer 210.

[0167] The light transmittance control layer 220 may reduce the transmittance of the incident external light or the transmittance of the external light reflected from the substrate 40 and the gap G.

[0168] The light transmittance control layer 220 according to an embodiment of the present disclosure includes a material having a component that reduces the light transmittance, thereby allowing at least a part of the light to pass therethrough and reach the substrate 40 or absorbing at least a part of the light reflected from the substrate 40 and traveling in the first direction X.

[0169] The light transmittance control layer 220 may have a transparency lower than that of the molded article 100, thereby reducing the light transmittance. When producing a plurality of substrates, due to process errors during production, some substrates may have different colors. Therefore, substrates having different unique colors may be tiled to form a single display panel.

[0170] As described above, the light transmittance control layer 220 according to an embodiment of the present disclosure absorbs at least a part of the light reflected from the substrate 40 and transmitted to the outside, thereby increasing the overall sense of the screen image of the display panel 20.

[0171] That is, the light transmittance control layer 220 may reduce the color deviation of each of the display modules 30A to 30P due to process errors of the display modules 30A to 30P by reducing the external light transmittance.

[0172] The anti-glare layer 210 can prevent external light incident on the display panel 20 from transmitting through the substrate 40, and the light transmittance control layer 220 can absorb a part of the light incident on the display panel 20 from the outside or absorb a part of the external light reflected from the substrate 40 and transmitted to the outside of the display panel 20 to improve the contrast of the screen image displayed on the display panel.

[0173] That is, the front cover 200 can be disposed in front of the substrate 40 in the first direction X to improve the contrast that may be deteriorated due to external light on the screen image displayed on the display panel 20.

[0174] As described above, in the case of the display module 30 according to an embodiment of the present disclosure, the front cover 200 can extend outside the substrate 40 in the second direction Y.

[0175] Therefore, a part of the light introduced into the gap G formed between the plurality of display modules 30A to 30P can be blocked by at least a part of the anti-glare layer 210 provided in the gap G, and at least a part of the external light introduced into or reflected in the gap G can be absorbed by the light transmittance control layer 220 provided in the gap G and be prevented from transmitting to the outside. Therefore, the exposure of the seams formed in the gap G can be reduced, and since the exposure of the seams is reduced, the overall sense of the screen image displayed on the display panel 20 can be improved.

[0176] Specifically, the molding 100 includes a first region 101 disposed outside the mounting surface 41 or disposed in the gap G in the second direction Y and a second region 102 disposed on the mounting surface 41.

[0177] The first region 101 of the molding 100 is a region of the molding 100 formed to cover the side surface 45 of the substrate 40.

[0178] The first region 101 and the second region 102 of the molding 100 can be divided by the edge 41e of the mounting surface 41. That is, the region disposed outside the mounting surface 41 with respect to the edge 41e of the mounting surface 41 is the first region 101, and the region disposed on the mounting surface 41 is the second region 102.

[0179] The molding 100 can surround the mounting surface 41 of the substrate 40 and the four side surfaces 45 of the substrate 40 corresponding to the four edges of the display module 30 (see Figure 4 ).

[0180] That is, the molding 100 can surround all the side surfaces 45 of the substrate 40. Therefore, the molding 100 can include two first regions 101 in the second direction Y and two first regions 101 in the third direction Z.

[0181] Thus, all four side surfaces 45 of the substrate 40 can be protected from external forces by the molded part 100, and the wiring 46 extending along at least one of the four side surfaces 45 can be protected from external forces.

[0182] In addition, the exposure of seams that may occur between the four side surfaces 45 and the display modules 30B and 30E adjacent to the side surfaces 45 can be reduced. The reduction of the exposure will be described in detail below.

[0183] Hereinafter, only the first region 101 of the side surface 45 of the substrate 40 corresponding to the right edge 31 of the first display module 30A will be described to avoid redundant description.

[0184] The front cover 200 may include a first region 201 disposed outside the mounting surface 41 in the second direction Y or disposed in the gap G to correspond to the first region 101 of the molded part 100 in the first direction X, and a second region 202 disposed on the mounting surface 41 to correspond to the second region 102 of the molded part 100 in the first direction X.

[0185] The first regions 101 and 201 of the molded part 100 and the front cover 200 and the second regions 102 and 202 of the molded part 100 and the front cover 200 may be divided by the gap G in the second direction Y.

[0186] The first region 201 of the front cover 200 is disposed in the gap G, and the first region 101 of the molded part 100 that supports the first region 201 of the front cover 200 is disposed in the gap G. Thus, the external light guided to the outside of the gap G can be blocked by the first region 201 of the front cover 200, or the light reflected from the gap G and then guided to the outside is blocked by the first region 201 of the front cover 200, so that the exposure of the seams that can be formed by the gap G as the boundary between the plurality of display modules 30A to 30P is reduced, and the overall sense of the display panel 20 is improved.

[0187] When the first region 101 of the molded part 100 is disposed in the gap G, the first region 201 of the front cover 200 can be stably supported. In addition, as described above, the first region 101 of the molded part 100 covers the chamfered portion 49, the side surface 45, and the wiring 46 of the substrate 40, thereby protecting the mounting surface 41, the chamfered portion 49, the side surface 45, and the wiring 46 of the substrate 40 from external forces.

[0188] That is, when the molded part 100 only includes the second region 102 without the first region 101, the side surface 45 and the wiring 46 of the substrate 40 may not be protected, and the first region 201 of the front cover 200 is not easily supported. Therefore, the reliability of the display module 30 may deteriorate.

[0189] As described above, the molded part 100 and the front cover 200 can extend outside the mounting surface 41 not only in the second direction Y but also in the direction opposite to the second direction Y.

[0190] In addition, the molded part 100 and the front cover 200 can also extend outside the mounting surface 41 in a third direction Z perpendicular to each of the first direction X and the second direction Y. That is, in one embodiment, the molded part 100 and the front cover 200 can extend outside the four edges 41e of the mounting surface 41 (see Figure 4 ).

[0191] Taking the first display module 30A and the second display module 30E as an example, the first region 101A of the first molded part 100A extending from the first display module 30A and the first region 201A of the first front cover 200A can be disposed in the gap G formed between the first display module 30A and the second display module 30E.

[0192] The gap G can be defined as the interval in the second direction Y between the edge 41e of the mounting surface 41 of the first display module 30A and the edge 41e of the mounting surface 41 of the second display module 30E.

[0193] Therefore, the side surfaces 45, the chamfered portions 49, and the wirings 46 of the first display module 30A and the second display module 30E can be disposed in the gap G.

[0194] The second region 102A of the first molded part 100A and the second region 202A of the first front cover 200A can be disposed on the mounting surface 41 of the first display module 30A.

[0195] The first region 101E of the second molded part 100E extending from the second display module 30E and the first region 201E of the second front cover 200E can be disposed in the gap G formed between the first display module 30A and the second display module 30E, and the second region 102E of the second molded part 100E and the second region 202E of the second front cover 200E can be disposed on the mounting surface 41 of the second display module 30E.

[0196] That is, in the gap G formed between the first display module 30A and the second display module 30E, the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200 are arranged parallel to the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y.

[0197] The first and second molded parts 100A and 100E, and the first regions 101A, 201A, 101E, and 201E of the first front cover 200A and the second front cover 200E may all extend in the second direction Y or in the direction opposite to the second direction Y by a length less than half of the gap G.

[0198] Therefore, when the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A are arranged parallel to the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y, the dimensions of the first region 101A or 201A and the dimensions of the first region 101E or 201E are set such that the value obtained by adding the length of the first region 101A of the first molded part 100A or the first region 201A of the first front cover 200A to the length of the first region 101E of the second molded part 100E or the first region 201E of the second front cover 200E in the second direction Y can be set to be equal to or less than the length of the gap G in the second direction Y.

[0199] According to an embodiment of the present disclosure, when the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A are arranged parallel to the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y, a predetermined distance d may exist between the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A and the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y.

[0200] However, the present disclosure is not limited thereto. The first display module 30A and the second display module 30E may be tiled without spacing the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A apart from the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y. However, a predetermined distance d may exist between the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A and the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E in the second direction Y. However, for assembly performance, in one embodiment, the first region 101A of the first molded part 100A and the first region 201A of the first front cover 200A may be spaced apart from the first region 101E of the second molded part 100E and the first region 201E of the second front cover 200E by a predetermined distance d in the second direction Y.

[0201] As described above, in the gap G between the first display module 30A and the second display module 30E, the first region 101A of the first molding 100A and the first region 201A of the first front cover 200A, and the first region 101E of the second molding 100E and the first region 201E of the second front cover 200E can be arranged.

[0202] External light sequentially passes through the first region 201A of the first front cover 200A and the first region 201E of the second front cover 200E, and then passes through the first region 101A of the first molding 100A and the first region 101E of the second molding 100E. In this way, the external light is diffusely reflected to the outside or partially absorbed by the first region 201A of the first front cover 200A and the first region 201E of the second front cover 200E, thereby reducing the amount of external light reaching the gap G, and the exposure of the boundary between the first display module 30A and the second display module 30E caused by the gap G can be reduced.

[0203] In addition, the light reflected from the gap G and guided to the outside of the display panel 20 sequentially passes through the first region 101A of the first molding 100A and the first region 101E of the second molding 100E, and then passes through the first region 201A of the first front cover 200A and the first region 201E of the second front cover 200E. In this way, the light is diffusely reflected to the outside of the display panel 20 or partially absorbed by the first region 201A of the first front cover 200A and the first region 201E of the second front cover 200E, and the amount of light transmitted to the outside of the display panel 20 is reduced, and the exposure of the boundary between the first display module 30A and the second display module 30E caused by the gap G can be reduced.

[0204] That is, the first region 101 of the molding 100 and the first region 201 of the front cover 200 can reduce the amount of external light introduced into the gap G formed between the plurality of display modules 30A to 30P, while absorbing at least a part of the external light reflected from the gap G, thereby improving the overall sense of the screen image of the display panel 20.

[0205] In addition, even when the substrates 40A of the first display module 30A and the substrate 40E of the second display module 30E have different colors, when each of the display substrates 40A and 40E is displayed to the outside by the reflection of external light, at least a part of the reflected light is absorbed by the corresponding one of the first front cover 200A and the second front cover 200E, so that the unique color of each of the substrates 40A and 40E is not perceived by the outside world, thereby improving the overall sense of the screen image.

[0206] That is, as described above, the molded member 100 and the front cover 200 reduce the exposure of seams that may occur in the gap G between the plurality of display modules 30A to 30P, while reducing the color deviation of the plurality of display modules 30A to 30P, thereby improving the overall sense of the screen image of the display panel 20.

[0207] In one embodiment, the ends of the molded member 100 and the front cover 200 in the second direction Y may be arranged parallel to the direction corresponding to the first direction X. With this configuration, when the plurality of display modules 30A to 30P are tiled, the gap between each of the display modules 30A to 30P can be minimized.

[0208] In addition, when the ends of the molded member 100 and the front cover 200 in the second direction Y are arranged at an angle with respect to the first direction X and the plurality of display modules 30A to 30P are tiled, the molded member 100 or the front cover 200 may not be arranged in the gap G formed between the plurality of display modules 30A to 30P.

[0209] When the light emitted from the plurality of display modules 30A to 30P passes through the molded member 100 and the front cover 200, a part of the light is reflected inside the molded member 100 and the front cover 200 to move substantially in the second direction Y, which may cause a light leakage phenomenon, in which the light is transmitted through the ends of the molded member 100 and the front cover 200 in the second direction Y.

[0210] In this case, since the ends of the molded member 100 and the front cover 200 in the second direction Y are arranged in the gap G formed between the plurality of display modules 30A to 30P, when a part of the light is transmitted to the outside of the display panel 20 at the gap G, the exposure of the seam perceived from the gap G can be increased.

[0211] However, when the ends of the molded member 100 and the front cover 200 of each of the display modules 30A to 30P are formed to be parallel in the direction corresponding to the first direction X, the gap between the molded member 100 and the front cover 200 of one display module among the display modules 30A to 30P and the molded member 100 and the front cover 200 of another display module adjacent to the one display module among the display modules 30A to 30P can be minimized.

[0212] Therefore, the light moving in the second direction Y inside the molded member 100 and the front cover 200 of each of the display modules 30A to 30P is not transmitted outside the ends of its molded member 100 and the front cover 200 in the second direction Y (or outside the gap G), but is introduced into the molded member 100 and the front cover 200 of an adjacent one of the display modules 30A to 30P, thereby reducing the exposure of the seam that may be perceived in the gap G. Hereinafter, reference will be made to Figure 7Additionally, the positional technical features between the first display module 30A and the second display module 30E of the display device 1 according to an embodiment of the present disclosure are described. As described above, the first display module 30A and the second display module 30E are taken as examples of the plurality of display modules 30A to 30P, so the positional technical features can be applied to all of the plurality of display modules 30A to 30P.

[0213] Figure 7 is a cross-sectional view showing Figure 1 some components of the display device that is being displayed.

[0214] The plurality of inorganic light-emitting diodes 50 mounted on the plurality of display modules 30A to 30P can be arranged at regular intervals. When some of the plurality of inorganic light-emitting diodes 50 are arranged at different intervals, a part of the entire display image of the display panel 20 may be deformed.

[0215] When the interval between the plurality of inorganic light-emitting diodes 50 mounted on each of the display modules 30A to 30P is referred to as a pitch P, the plurality of inorganic light-emitting diodes 50 mounted on each of the display modules 30A to 30P can have the same pitch P.

[0216] Additionally, regarding one display module (the first display module 30A) among the plurality of display modules 30A to 30P and another display module (the second display module 30E) adjacent to the one display module 30A, the interval between the inorganic light-emitting diodes 50 on the one display module 30A adjacent to the other display module 30E and the inorganic light-emitting diodes 50 on the other display module 30E adjacent to the one display module 30A can be set with the same pitch P.

[0217] This is to prevent the screen image of the display panel 20 from being deformed even at the boundary between the display modules 30A to 30P.

[0218] The above configuration can be applied not only to the first display module 30A and the second display module 30E to be described below, but also to other display modules adjacent to each other in the second direction Y or the third direction Z among the plurality of display modules 30A - 30P.

[0219] The plurality of inorganic light-emitting diodes 50 mounted on the first display module 30A and the second display module 30E can be set with the same pitch P.

[0220] The interval between the first inorganic light-emitting diode 50a and the second inorganic light-emitting diode 50b mounted on the first display module 30A and the interval between the third inorganic light-emitting diode 50c and the fourth inorganic light-emitting diode 50d mounted on the second display module 30E can have the same pitch P.

[0221] In addition, the interval between an inorganic light-emitting diode 50 among the plurality of inorganic light-emitting diodes 50 mounted on the first display module 30A, which is closest to the substrate 40 of the first display module 30A in the second direction Y and adjacent to the side surface 45a of the second display module 30E, and an inorganic light-emitting diode 50b among the plurality of inorganic light-emitting diodes 50 mounted on the second display module 30E, which is closest to the substrate 40 of the second display module 30E in the second direction Y and adjacent to the side surface 45a of the first display module 30A, may be equal to the pitch P.

[0222] That is, the interval between a first inorganic light-emitting diode 50a on the first display module 30A, which is adjacent to the second display module 30E in the second direction Y, and a third inorganic light-emitting diode 50c on the second display module 30E, which is adjacent to the first display module 30A in the second direction Y, may also be set to the pitch P.

[0223] In this way, in order to set the interval between the first inorganic light-emitting diode 50a and the third inorganic light-emitting diode 50c to the pitch P, the sum of the length L1 in the second direction Y between the first inorganic light-emitting diode 50a and the edge 41e of the mounting surface 41 of the substrate 40 and the length L2 in the second direction Y of the first region 101A of the molding 100A or the first region 201A of the front cover 200A may be set to half of the pitch P.

[0224] In addition, the sum of the length L1 in the second direction Y between the third inorganic light-emitting diode 50c and the edge 41e of the mounting surface 41 of the substrate 40 and the length L2 in the second direction Y of the first region 101E of the molding 100E or the first region 201E of the front cover 200E may be set to half of the pitch P.

[0225] When the first display module 30A and the second display module 30E are arranged adjacent to each other in the second direction Y, the first region 101A of the molding 100A and the first region 201A of the front cover 200A of the first display module 30A may be arranged to be in contact with the first region 101E of the molding 100E and the first region 201E of the front cover 200E of the second display module 30E.

[0226] An interval d may exist between the first region 101A of the molding 100A and the first region 201A of the front cover 200A of the first display module 30A and the first region 101E of the molding 100E and the first region 201E of the front cover 200E of the second display module 30E (see Figure 6 ), but the interval d is measured in microns and is small enough to be ignored.

[0227] In this case, in the region between the first inorganic light-emitting diode 50a and the third inorganic light-emitting diode 50c, an edge 41e of the mounting surface 41 of the substrate 40 of the first display module 30A that is outside the first inorganic light-emitting diode 50a in the second direction Y, a first region 101A of the molding 100A of the first display module 30A that extends in the second direction Y, and a first region 201A of the front cover 200A that extends in the second direction Y, an edge 41e of the mounting surface 41 of the substrate 40 of the second display module 30E that is outside the third inorganic light-emitting diode 50c in the second direction Y, and a first region 101E of the molding 100E of the second display module 30E that extends in the second direction Y and a first region 201E of the front cover 200E that extends in the second direction Y can be provided.

[0228] Therefore, the distance between the first inorganic light-emitting diode 50a and the third inorganic light-emitting diode 50c can be obtained by the sum of the length L1 in the second direction Y from the first inorganic light-emitting diode 50a to the edge 41e, the length L2 of the first region 101A of the molding 100A that extends in the second direction Y or the length L2 of the first region 201A of the front cover 200A that extends in the second direction Y, the length L1 in the second direction Y from the third inorganic light-emitting diode 50c to the edge 41e of the mounting surface 41, and the length L2 of the first region 101E of the molding 100E that extends in the second direction Y or the length L2 of the first region 201E of the front cover 200E that extends in the second direction Y.

[0229] As described above, since the sum of L1 and L2 is formed as half of the pitch P, the distance between the first inorganic light-emitting diode 50a and the third inorganic light-emitting diode 50c can be formed as the pitch P.

[0230] As described above, the second layer 220 can be formed as a light transmittance control layer, but the present disclosure is not limited thereto, and the second layer 220 can be provided as a circularly polarized layer. That is, the second layer 220 can include a polarization member provided to polarize light incident from the outside. In addition, the second layer 220 can be formed of a material provided to allow only light within a specific polarization range to pass through and absorb light outside the specific polarization range.

[0231] Hereinafter, for convenience of description, the second layer 220 will be described as the circularly polarized layer 220. That is, the first layer 210 can be provided as the antiglare layer 210, and the second layer 220 can be provided as the circularly polarized layer 220.

[0232] The circularly polarized layer 220 can allow only light having a specific phase among the transmitted light to pass through and absorb light having other phases, thereby reducing the transmittance of the light passing through the circularly polarized layer 220.

[0233] The circularly polarizing layer 220 may include a linearly polarizing member and a circularly polarizing member. For example, the circularly polarizing layer 220 may be provided by overlapping a linearly polarizing film and a circularly polarizing film. The linearly polarizing film and the circularly polarizing film may be sequentially disposed in the first direction X.

[0234] Specifically, the linearly polarizing film and the circularly polarizing film of the circularly polarizing layer 220 may change the phase of external light incident from the outside of the display module 20. The circularly polarizing layer 220 prevents external light having a phase changed due to passing through it, which is reflected from the substrate 40 or the gap G and then redirected toward the circularly polarizing layer 220, from passing through the circularly polarizing layer 220 based on the changed phase.

[0235] Accordingly, at least a part of the external light incident on the display module 20 may be absorbed by the circularly polarizing layer 220 without being reflected to the outside. That is, the circularly polarizing layer 220 may allow only light having a specific phase among the transmitted light to pass through and absorb light having a phase other than the specific phase.

[0236] Accordingly, the circularly polarizing layer 220 absorbs a part of the light transmitted through the circularly polarizing layer 220 and reflected from the substrate 40 or the gap G, particularly the light reflected from the gap G, thereby reducing the exposure of the seam perceived in the gap G.

[0237] As described above, when the second layer 220 is provided as the light transmittance control layer 220, the degree of light transmission may be adjusted by adjusting the transparency of the material of the second layer 220. In contrast, when the second layer 220 is provided as the circularly polarizing layer 220, the degree to which the light reflected from the substrate 40 or the gap G is transmitted back to the outside may be adjusted by the phase difference of the light.

[0238] As described above, the molding 100 and the front cover 200 may be disposed in the gap G in the first direction X.

[0239] Accordingly, the external light incident on the display module 20 may pass through the antiglare layer 210, the circularly polarizing layer 220, and the molding 100 to enter the gap G. In this case, the incident light may be diffusely reflected by the antiglare layer 210 without entering the gap G, only a part of the light having a specific phase is allowed to enter the gap G, and the remaining part of the light is absorbed by the circularly polarizing layer 220.

[0240] In addition, the light reflected from the gap G may be guided to the outside by passing through the molding 100, the circularly polarizing layer 220, and the antiglare layer 210 in sequence. In this case, the light passing through the circularly polarizing layer 220 and having a phase other than the specific phase is absorbed by the circularly polarizing layer 220 and not transmitted to the outside.

[0241] As described above, the first layer 210 may be formed as an antiglare layer, but is not limited thereto, and may be formed as an antireflection layer. That is, the first layer 210 may include a material that reflects external incident light to the outside of the display panel 20 (which is not in the direction of the substrate 40 or the gap G), or may include a structure that reflects external incident light to the outside of the display panel 20 (which is not in the direction of the substrate 40 or the gap G).

[0242] Hereinafter, for ease of description, the first layer 210 will be described as the antireflection layer 210. That is, the first layer 210 may be provided as the antireflection layer 210, and the second layer 220 may be provided as the light transmittance control layer 220.

[0243] As described above, the antireflection layer 210 may reflect external light incident on the display panel 20 to the outside of the display panel 20 (which is not in the direction of the substrate 40 or the gap G). Therefore, the amount of light passing through the antireflection layer 210 and incident on the gap G can be reduced.

[0244] Therefore, the reflectance of the external light incident on the gap G and incident on the display panel 20 is reduced, thereby improving the overall sense of the screen image of the display module 20.

[0245] The antireflection layer 210 may include a plurality of layers having different refractive indices. When external light is incident on the antireflection layer 210, due to the difference in refractive indices of the plurality of layers, the external light may undergo internal reflection and thus travel to the outside of the display panel 20 rather than to the substrate 40 or the gap G.

[0246] Therefore, the antireflection layer 210 only allows a part of the light to transmit through it to the substrate 40 or the gap G and absorbs the remaining light (especially a part of the light guided to the gap G), thereby reducing the exposure of the seams perceived in the gap G and reducing the exposure of the boundaries between the plurality of display modules 30A to 30P.

[0247] Conversely, the antireflection layer 210 may be provided such that the light reflected from the gap G or the substrate 40 and incident on the antireflection layer 210 undergoes internal reflection, thereby preventing it from transmitting in the first direction X. For example, the light from the gap G in the first direction X transmits through the antireflection layer 210 in a direction corresponding to the second direction Y or the third direction Z, thereby reducing the reflectance of the external light on the display panel 20 and reducing the exposure of the boundaries between the plurality of display modules 30A to 30P.

[0248] Therefore, only a part of the light reflected from the substrate 40 or the gap G transmits through the antireflection layer 210, thereby reducing the exposure of the seams perceived in the gap G and improving the overall sense of the screen image of the display panel 20.

[0249] As described above, when the first layer 210 is provided as the anti-glare layer 210, the reflectance of external light can be adjusted by allowing the external light to diffusely reflect on the surface of the anti-glare layer 210, and when the first layer 210 is provided as the anti-reflection layer 210, the light transmittance can be adjusted by adjusting the reflection direction of the light passing through the anti-reflection layer 210.

[0250] Therefore, the external light incident on the display module 20 can sequentially pass through the anti-reflection layer 210, the light transmittance control layer 220, and the molding 100 to enter the gap G. In this case, at least a part of the incident light can be prevented from entering the gap G due to the anti-reflection layer 210 and the light transmittance control layer 220.

[0251] In addition, the light reflected from the gap G can be transmitted to the outside by sequentially passing through the molding 100, the light transmittance control layer 220, and the anti-reflection layer 210, and a part of the light passing through the light transmittance control layer 220 and the anti-reflection layer 210 can be prevented from being guided to the front of the display panel 20.

[0252] Hereinafter, the case where the first layer 210 is provided as the anti-reflection layer 210 and the second layer 220 is provided as the circularly polarizing layer 220 will be described.

[0253] For ease of description, the first layer 210 will be described as the anti-reflection layer 210, and the second layer 220 will be described as the circularly polarizing layer 220. That is, the first layer 210 can be provided as the anti-reflection layer 210, and the second layer 220 can be provided as the circularly polarizing layer 220.

[0254] The anti-reflection layer 210 reflects the external light incident on the display panel 20 to the outside of the display panel 20 (which is not in the direction of the substrate 40 or the gap G), thereby reducing the amount of external light passing through the anti-reflection layer 210. Therefore, the reflectance of the external light introduced into the display panel 20 incident on the gap G can be reduced, thereby improving the overall sense of the screen image of the display module 20.

[0255] The circularly polarizing layer 220 can allow only the light with a specific phase to pass through the transmitted light and absorb the light with a phase other than the specific phase.

[0256] Therefore, only a part of the light passing through the anti-reflection layer 210 is transmitted to the substrate 40 or the gap G, and due to the internal reflection of the anti-reflection layer 210, the amount of light guided to the gap G is reduced. Only the part with a specific phase of the light transmitted through the anti-reflection layer 210 can pass through the circularly polarizing layer 220 and move to the substrate 40 or the gap G, and the remaining light can be absorbed by the circularly polarizing layer 220.

[0257] Conversely, the light reflected from the gap G or the substrate 40 and transmitted through the circularly polarizing layer 220 and the antireflection layer 210 is partially absorbed by the circularly polarizing layer 220 or undergoes internal reflection in the antireflection layer 210 and is not transmitted in the first direction X, thereby reducing the reflectance of the light reflected from the gap G in the display panel 20. Therefore, the overall sense of the screen image of the display module 20 can be improved.

[0258] Therefore, in particular, the amount of light guided to the gap G is reduced, so that the reflectance itself is reduced, and the amount of light reflected from the gap G and reflected to the outside of the display 20 is reduced. Therefore, the exposure of the seam perceived in the gap G is reduced, and the overall sense of the screen image of the display module 20 can be improved.

[0259] In addition, the present disclosure is not limited to the above. The first layer 210 may include both the antireflection layer and the antiglare layer described above. That is, the first layer 210 may be configured in a stacked form in which the antireflection layer and the antiglare layer are laminated.

[0260] The antiglare layer can diffusely reflect the light incident on the first layer 210 from the outside, and the antireflection layer can change the reflection direction of the light so that the light incident on the first layer 210 is reflected to the outside with respect to the first direction X of the display panel 20.

[0261] In this way, the first layer 210 can reduce the reflectance of the external light incident on the display panel 20 through the antiglare layer and the antireflection layer.

[0262] The antiglare layer and the antireflection layer can be sequentially arranged in the first direction X.

[0263] When the first layer 210 is formed into a stacked structure of an antiglare layer and an antireflection layer, as described above, the second layer 220 can be provided as the light transmittance control layer 220.

[0264] As described above, the second layer 220 provided as the light transmittance control layer can reduce the transmittance of the incident external light or the external light reflected from the substrate 40 and the gap G.

[0265] The first layer 210 and the second layer 220 are provided to allow only a part of the light passing through them to be transmitted to the substrate 40 or the gap G.

[0266] The incident light can be diffusely reflected by the first layer 210 or changed in direction by internal reflection, and can be absorbed by the second layer 220, so that the amount of light, especially the amount of light guided to the gap G, can be reduced.

[0267] Conversely, when the light reflected from the gap G or the substrate 40 sequentially passes through the second layer 220 and the first layer 210, the light can be absorbed by the second layer 220 or can be prevented by the first layer 210 from passing through the display panel 20 in the first direction X.

[0268] Therefore, as the amount of light, particularly the amount of light guided to the gap G, decreases, the reflectivity itself decreases, and the amount of light reflected from the gap G and guided to the outside of the display module 20 decreases, thereby reducing the exposure of the seam perceived in the gap G and improving the overall sense of the screen image of the display module 20.

[0269] In addition, when the first layer 210 is formed as a stacked structure of an antireflection layer and an antiglare layer, the second layer 220 can be provided as a circular polarization layer. As described above, the first layer 210 can reduce the reflectivity of external light incident on the display panel 20 through the antireflection layer and the antiglare layer.

[0270] In addition, the second layer 220 can polarize external light passing through it, absorb external light having a phase other than a specific phase, and absorb external light having a phase other than a specific phase reflected from the substrate 40 and the gap G to prevent the reflected external light from passing through the second layer 220. The front cover 200 is configured such that incident light is diffusely reflected by the first layer 210 or redirected by internal reflection, the light passing through the first layer 210 and reaching the second layer 220 is polarized by the second layer 220, such that a part of the light having a specific phase passes through the second layer 220, and the remaining light having a phase other than the specific phase is absorbed by the second layer 220. The front cover 200 can reduce the amount of light, particularly the amount of light guided to the gap G, thereby reducing the exposure of the seam perceived in the gap G.

[0271] Conversely, for at least a part of the light transmitted through the circular polarization layer 220 and reflected from the substrate 40 and the gap G, the light having a phase other than the specific phase is absorbed by the second layer 220 and prevented from passing through the first layer 210 and leaving the display panel 20 in the first direction X.

[0272] Therefore, as the amount of light, particularly the amount of light guided to the gap G, decreases, the reflectivity itself decreases, and the amount of light reflected from the gap G and guided to the display module 20 decreases, thereby reducing the exposure of the seam perceived in the gap G and improving the overall sense of the screen image of the display module 20.

[0273] Unlike the adhesive layer 230 described above as being formed of a transparent material, the adhesive layer 230 can be formed of different components.

[0274] Specifically, the adhesive layer 230 can be formed of a material capable of absorbing light transmitted through at least a part of the adhesive layer 230. For example, the adhesive layer 230 can be partially opaque.

[0275] That is, similar to the light transmittance control layer described above, the adhesive layer 230 can reduce the transmittance of light incident on the adhesive layer 230 to serve as a light transmittance control layer.

[0276] In this case, the second layer 220 can be provided as a transparent layer formed of a transparent material. Hereinafter, for ease of description, the second layer 220 is described as the transparent layer 220.

[0277] The transparent layer 220 can be disposed between the first layer 210 and the adhesive layer 230.

[0278] The transparent layer 220 can be in a highly transparent state having a transmittance of 90% or more, such as an optically clear resin (OCR).

[0279] This is because the adhesive layer 230 reduces the transmittance of light passing through the display panel 20, and further reducing the light transmittance can reduce the brightness of the screen image of the display panel 20 itself.

[0280] Therefore, the transparent layer 220 can be formed of a transparent material such that light incident on the transparent layer 220 easily passes through it.

[0281] The present disclosure is not limited thereto, and the transparent layer 220 can be omitted from the front cover 200.

[0282] In this case, the first layer 210 can be provided in any one structure including an antiglare layer, an antireflection layer, or an antiglare layer and an antireflection layer stacked on each other.

[0283] The front cover 200 can transmit only a part of the light passing through the first layer 210, the transparent layer 220, and the adhesive layer 230 to the substrate 40 or the gap G.

[0284] With the front cover 200, the incident light is diffusely reflected or redirected by the first layer 210 and then absorbed by the adhesive layer 230, so that the amount of light guided to the gap G can be reduced. Conversely, with the front cover 200, at least a part of the light reflected from the gap G or the substrate 40 is absorbed by the adhesive layer 230 and thus does not pass through the first layer 210 and the display panel 20 in the first direction X.

[0285] Therefore, as the amount of light (especially the amount of light guided to the gap G) decreases, the reflectivity itself decreases, and the light reflected from the gap G to the outside of the display module 20 decreases, the exposure of the seam in the gap G can be reduced, and the overall sense of the screen image of the display module 20 can be improved. Hereinafter, a method of manufacturing a display device according to an embodiment of the present disclosure will be briefly described. Figures 1 to 7 of the display device.

[0286] Figure 8It is a flowchart showing a method of manufacturing a display device according to an embodiment of the present disclosure.

[0287] First, a display module 30 including a plurality of inorganic light-emitting diodes 50 is prepared (operation 501). A plurality of inorganic light-emitting diodes 50 are mounted on the mounting surface 41 of the substrate 40 of the display module 30. In order to improve the contrast between the colors generated by the red, green, and blue inorganic light-emitting diodes 50, the substrate 40 may include a light absorption layer 60. The substrate 40 may also include an anisotropic conductive layer 70 such that the plurality of inorganic light-emitting diodes 50 are electrically connected to the substrate 40.

[0288] In addition, a black matrix 80 may be formed on the anisotropic conductive layer 70 of the plurality of display modules 30A to 30P.

[0289] Next, a molding 100 is formed on the mounting surface 41 of the display module 30 (operation 502). The molding 100 may cover the entire area of the substrate 40, including the mounting surface 41. The molding 100 may be formed by a compression hardening process on the mounting surface 41.

[0290] The molding 100 may cover not only the mounting surface 41 but also the chamfered portion 49 and the side surface 45 of the substrate 40.

[0291] Next, the front cover 200 is coupled to the molding 100 (operation 503). The front cover 200 includes a coupling layer 230 provided to be coupled to the molding 100, and the front cover 200 may be coupled to the outer surface of the molding 100 through the coupling layer 230.

[0292] Next, the molding 100 and the front cover 200 are cut such that at least a portion of the molding 100 and the front cover 200 extends outside the substrate 40 in a second direction Y perpendicular to the first direction X facing the mounting surface 41 (operation 504).

[0293] Specifically, the molding 100 and the front cover 200 may be cut to form a first region 101 of the molding 100 and a first region 201 of the front cover 200 outside the mounting surface 41 in the second direction Y.

[0294] The cutting process may be performed by laser cutting or the like.

[0295] In addition to the second direction Y, a cutting process may also be performed to form a first region 101 of the molding 100 and a first region 201 of the front cover 200 outside the mounting surface 41 in a third direction Z perpendicular to the first direction X and the second direction Y.

[0296] That is, the molded part 100 and the front cover 200 can be cut to have first regions 101 and 201 extending outward from the four sides of the mounting surface 41.

[0297] In one embodiment, the molded part 100 and the front cover 200 can be cut in the first direction X. In this way, when the plurality of display modules 30A to 30P are tiled, the gaps between the display modules 30A to 30P can be minimized as described above.

[0298] In addition, when the molded part 100 and the front cover 200 are cut obliquely with respect to the first direction X and the plurality of display modules 30A to 30P are tiled, the molded part 100 or the front cover 200 may not be able to be disposed in the gap G formed between the plurality of display modules 30A to 30P.

[0299] In the cutting process, the first regions 101 and 201 extending outside the mounting surface 41 can be processed to have a length less than or equal to approximately half of the length of the gap formed between the display modules 30, and the display modules 30 can be provided as the plurality of display modules 30A to 30P.

[0300] Next, the display modules 30 processed as above can be prepared as the plurality of display modules 30A to 30P, and the plurality of display modules 30A to 30P can be disposed adjacent to each other (operation 505). In this case, the plurality of display modules 30A to 30P can be fixed by a jig. The plurality of display modules 30A to 30P can be arranged in an M×N matrix form.

[0301] Therefore, when the plurality of display modules 30A to 30P are arranged adjacent to each other, the first regions 101 of the molded part 100 and the first regions 201 of the front cover 200 extending from each of the display modules 30A to 30P can be disposed in the gap G formed between the plurality of display modules 30A to 30P.

[0302] Hereinafter, a display device according to another embodiment of the present disclosure will be described. Components other than the molded part 100 and the front cover 300 to be described below are the same as those of the display device 1 according to the above embodiment, and thus their descriptions will be omitted.

[0303] Figure 9 It is an enlarged cross-sectional view showing some components of a display device according to another embodiment of the present disclosure.

[0304] The molded part 100 can include a light absorption pattern 110 formed on the upper surface of the molded part 100 in the first direction X and configured to absorb light guided to the substrate 40 or the gap G.

[0305] The light absorption pattern 110 may be formed of a material similar to that of the black matrix 80.

[0306] The light absorption pattern 110 may be formed in a lattice shape having horizontal and vertical patterns so as to be disposed between pixels in the second direction Y.

[0307] The light absorption pattern 110 may be formed by applying a light absorption ink onto the molded member 100 by means of an inkjet process and then curing the light absorption ink, or the light absorption pattern 110 may be formed by coating a light absorption film onto the molded member 100.

[0308] That is, the light absorption pattern 110 may be located in a space corresponding to the space between the plurality of inorganic light emitting diodes 50 in the first direction X, in which the plurality of inorganic light emitting diodes 50 are not installed.

[0309] The light absorption pattern 110 may be formed of a black-based material that effectively absorbs light so as to maximize the light absorption effect. In one embodiment, the light absorption pattern 110 may have a color corresponding to that of the black matrix 80.

[0310] In order to emphasize that the light absorption pattern 110 is a component formed on the upper surface of the molded member 100 and is distinguishable from the black matrix 80 formed on the mounting surface 41, the light absorption pattern 110 is named as such, but the light absorption pattern 110 may have the same composition as the black matrix 80.

[0311] The light absorption pattern 110 may be disposed at a position corresponding to the black matrix 80 in the first direction X.

[0312] The light absorption pattern 110 may not be disposed at a position where the plurality of inorganic light emitting diodes 50 are disposed in the first direction X. This is to prevent the light emitted from the plurality of inorganic light emitting diodes 50 from being absorbed by the light absorption pattern 110. Accordingly, the light efficiency of the display panel 20 can be improved.

[0313] Additionally, the light absorption pattern 110 may extend outside the substrate 40 in the second direction Y.

[0314] That is, the light absorption pattern 110 may include a first region 111 corresponding to the first region 101 of the molded member 100 in the first direction X and a second region 112 corresponding to the second region 102 of the molded member 100 in the first direction X.

[0315] The light incident on the display panel 20 and guided toward the gap G may be absorbed by the first region 111 of the light absorption pattern 110.

[0316] In addition, the light reflected from the gap G can be absorbed by the first region 111 of the light absorption pattern 110. Therefore, since the first region 111 of the light absorption pattern 110 capable of absorbing light is disposed in the gap G in the first direction X, the exposure of the seam perceived in the gap G can be reduced and the overall sense of the screen image of the display panel 20 can be improved.

[0317] The front cover 300 can be disposed on the plurality of display modules 30A to 30P in the first direction X.

[0318] Different from the front cover 200 disclosed in the one embodiment and the other embodiment of the present disclosure described above, the front cover 300 according to the embodiment of the present disclosure can be formed as a single unit.

[0319] That is, in the case of the front cover 200 disclosed in the one embodiment and the other embodiment of the present disclosure, the front cover 200 is formed on the plurality of display modules 30A to 30P, so that when the display modules 30A to 30P are tiled, the front cover 200 is also provided to be tiled.

[0320] However, the front cover 300 according to the present disclosure is formed as a single unit and can be disposed on the plurality of display modules 30A to 30P after the plurality of display modules 30A to 30P are tiled.

[0321] The front cover 300 may include: a cover glass 310 provided to protect the substrate 40 from external forces; and a front layer 320 disposed on the upper side of the cover glass 310 in the first direction X and configured to absorb at least a part of the light incident on the front cover 300 or adjust the reflection direction of the light to reduce the light transmittance.

[0322] The front layer 320 may include at least one of an antiglare layer, an antireflection layer, a circular polarization layer, or a light transmittance control layer described in the above embodiments of the present disclosure.

[0323] It is obvious from the above that the display device according to the embodiment absorbs the light incident on or reflected from the gap between adjacent display modules, thereby providing a seamless effect that prevents the seam from being visually perceived.

[0324] The display device according to the embodiment of the present disclosure includes a plurality of display modules, and the plurality of display modules individually include components configured to absorb the light incident on or reflected from the gap between adjacent display modules, so that the seamless effect can be easily and effectively achieved even when assembled.

[0325] The foregoing exemplary embodiments are merely exemplary and should not be construed as restrictive. The present teachings can be readily applied to other types of devices. Moreover, the description of the exemplary embodiments is intended to be illustrative and not intended to limit the scope of the claims, and many alternatives, modifications, and variations will be apparent to those skilled in the art.

[0326] This application is based on and claims the benefit of priority from Korean Patent Application No. 10-2019-0167071, filed with the Korean Intellectual Property Office on December 13, 2019, and Korean Patent Application No. 10-2020-0038840, filed with the Korean Intellectual Property Office on March 31, 2020, the disclosures of which are hereby incorporated by reference in their entirety.

Claims

1. A display module, comprising: a substrate, comprising: a mounting surface on which a thin film transistor layer and a plurality of pairs of pad electrodes are formed, the plurality of pairs of pad electrodes being electrically connected to the thin film transistor layer, a side surface, a rear surface, formed opposite to the mounting surface, a front chamfer portion formed between the mounting surface and the side surface, and a rear chamfer portion formed between the rear surface and the side surface; a plurality of inorganic light emitting diodes (LEDs), each of the plurality of inorganic light emitting diodes comprising: a pair of contact electrodes disposed on a pair of the plurality of pairs of pad electrodes, on one side of each of the plurality of inorganic light emitting diodes facing the mounting surface, each contact electrode of the pair of contact electrodes being electrically connected to a corresponding pad electrode of the pair of the plurality of pairs of pad electrodes, and a light emitting surface configured to emit light in a first direction opposite to a second direction, the second direction extending from the plurality of inorganic light emitting diodes to the mounting surface of the substrate, and disposed on the other side of each of the plurality of inorganic light emitting diodes, the other side of each of the plurality of inorganic light emitting diodes being opposite to the one side of each of the plurality of inorganic light emitting diodes; an anisotropic conductive layer formed on the mounting surface, the pair of contact electrodes being electrically connected to the pair of the plurality of pairs of pad electrodes through the anisotropic conductive layer; and a molding provided to cover the plurality of inorganic light emitting diodes, the front chamfer portion of the substrate, the rear chamfer portion of the substrate, the side surface of the substrate, and the anisotropic conductive layer.

2. The display module according to claim 1, wherein, The mounting surface includes four edges, one of the four edges corresponding to the side surface, and the molding is provided to cover the four edges of the mounting surface.

3. The display module according to claim 2, further comprising a printed circuit board (PCB) configured to electrically control the plurality of inorganic light emitting diodes, Among them, the printed circuit board being disposed on the rear surface of the substrate, and the molding is provided to surround the mounting surface, the front chamfer portion, the rear chamfer portion, and the side surface.

4. The display module according to claim 1, further comprising a cover disposed on the upper surface of the molding, Among them, the molding having a first surface area larger than a second surface area of the mounting surface of the substrate, and the cover having a third surface area equal to or larger than the first surface area of the molding.

5. The display module according to claim 1, further comprising a cover disposed on the upper surface of the molding, Among them, the cover comprising: cover glass; and a circularly polarizing layer disposed in front of the cover glass and configured to circularly polarize light transmitted through the circularly polarizing layer.

6. The display module according to claim 5, wherein The display module further comprises a light absorption pattern disposed between the molding and the cover glass and a black matrix formed on the mounting surface between the plurality of inorganic light emitting diodes, and wherein the light absorption pattern is located at a position corresponding to the position of the black matrix in a third direction facing the mounting surface.

7. The display module according to claim 6, wherein, The light absorption pattern is provided to extend outside the side surface in a fourth direction perpendicular to the third direction facing the mounting surface.

8. The display module according to claim 1, further comprising a cover disposed on an upper surface of the molded member, Among them, The cover includes: a first layer, and a second layer stacked on the first layer and located at a rear side of the first layer in the first direction.

9. The display module according to claim 8, wherein, The first layer includes at least one of an antiglare layer provided to diffusely reflect incident light or an antireflection layer provided to change a reflection direction of the incident light.

10. The display module according to claim 8, wherein, The second layer includes a material that reduces transmission of incident light that is incident on the second layer and then transmitted through the second layer.

11. The display module according to claim 10, wherein, The second layer includes a circularly polarizing layer.

12. The display module according to claim 1, further comprising a black matrix disposed between the plurality of inorganic light emitting diodes.

13. The display module according to claim 1, wherein, Each of the plurality of inorganic light emitting diodes further includes a bottom surface formed on a side opposite to the light emitting surface, wherein the pair of contact electrodes are disposed on the bottom surface.

14. A display device, comprising an array of display modules, wherein a plurality of display modules are arranged in an M×N matrix, where M and N are natural numbers, and Each of the plurality of display modules comprising: a substrate, comprising: a mounting surface on which a thin film transistor layer and a plurality of pairs of pad electrodes are formed, the plurality of pairs of pad electrodes being electrically connected to the thin film transistor layer, a side surface, a rear surface formed opposite to the mounting surface, a front chamfer portion formed between the mounting surface and the side surface, and a rear chamfer portion formed between the rear surface and the side surface; a plurality of inorganic light emitting diodes, each of the plurality of inorganic light emitting diodes comprising: a pair of contact electrodes disposed on a pair of the plurality of pairs of pad electrodes, on one side of each of the plurality of inorganic light emitting diodes facing the mounting surface, each contact electrode of the pair of contact electrodes being electrically connected to a corresponding pad electrode of the pair of the plurality of pairs of pad electrodes, and a light emitting surface configured to emit light in a first direction opposite to a second direction, the second direction extending from the plurality of inorganic light emitting diodes to the mounting surface of the substrate, and disposed on the other side of each of the plurality of inorganic light emitting diodes, the other side of each of the plurality of inorganic light emitting diodes being opposite to the one side of each of the plurality of inorganic light emitting diodes; an anisotropic conductive layer formed on the mounting surface, the pair of contact electrodes being electrically connected to the pair of the plurality of pairs of pad electrodes through the anisotropic conductive layer; a molded member provided to cover the plurality of inorganic light emitting diodes, the front chamfer portion of the substrate, the rear chamfer portion of the substrate, the side surface of the substrate, and the anisotropic conductive layer; and a cover disposed on a front surface of the molded member in a direction in which the light emitting surface faces.

15. The display device according to claim 14, wherein, Each of the plurality of display modules further comprises: a printed circuit board (PCB) provided to drive the plurality of inorganic light emitting diodes and disposed on a side opposite to the mounting surface; and A wiring that connects the plurality of inorganic light-emitting diodes to the printed circuit board and extends along the side surface, wherein the molding is provided to cover the wiring extending on the side surface.

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