A sound insulation structure with low-frequency broadband sound insulation function

Abstract

The application provides a sound insulation structure with low-frequency broadband sound insulation function, and belongs to the technical field of sound insulation. The sound insulation structure comprises a plurality of periodically arranged sound insulation units. The sound insulation unit comprises a base body, a resonant body, a through slot, a cantilever plate, a plurality of support columns, and a gap. The base body is suitable for being arranged towards a sound source. The resonant body is arranged on one side of the base body. The through slot is arranged on the resonant body. The cantilever plate is connected in the through slot. The gap is between the edge of the cantilever plate and the inner wall of the through slot. One end of the support column is connected with the base body, and the other end of the support column is connected with the resonant body. The sound insulation structure with low-frequency broadband sound insulation function has an increase of 40% or more in sound transmission loss, and improves the sound wave attenuation capacity of the material.

Description

Technical Field

[0001] The present invention relates to the technical field of sound insulation, and in particular to a sound insulation structure with low-frequency and broadband sound insulation function. Background Art

[0002] Most noise in nature and everyday life occurs in the low-frequency range (hundreds of hertz), such as car noise, train vibrations, construction site noise, etc. However, these common low-frequency noises are difficult to eliminate, and low-frequency noise control remains a difficult problem in the field of acoustics.

[0003] Over the past 20 years, with the emergence and development of acoustic metamaterials, low-frequency noise control technology has made significant progress. Locally resonant acoustic metamaterials are artificial material structures that utilize the vibration characteristics of their structural units to prevent the propagation of sound waves. They can achieve low-frequency sound insulation within a specific frequency band with a relatively low surface density.

[0004] In the structure of the prior art, the sound insulation effect is poor, so we need a sound insulation structure with good sound insulation effect. Summary of the Invention

[0005] Therefore, the technical problem to be solved by the present invention is to overcome the defect of poor sound insulation effect in the prior art, thereby providing a sound insulation structure with low-frequency broadband sound insulation function.

[0006] In order to solve the above technical problems, the present invention provides a sound insulation structure with low-frequency broadband sound insulation function, comprising a plurality of periodically arranged sound insulation units; the sound insulation units include:

[0007] a base body, the base body being adapted to be disposed toward a sound source;

[0008] A resonant body is provided on one side of the base; a through slot is provided on the resonant body; a cantilever plate is connected to the through slot; a gap is formed between the edge of the cantilever plate and the inner wall of the through slot; the resonant body and the cantilever plate form a resonant structure;

[0009] There are multiple pillars; one end of each pillar is connected to the base, and the other end is connected to the resonator.

[0010] As a preferred solution, the resonator and the base are both cube structures, and the areas of their facing surfaces are the same.

[0011] As a preferred solution, the thickness of the base is 1-4 mm, and the side length is 1-30 mm; the height of the pillar is 5-10 mm; the thickness of the resonant structure is 1-3 mm, and the side length is 1-30 mm.

[0012] As a preferred solution, the pillar is in a quarter-circular ring structure; the pillars of the four sound insulation units are enclosed to form a hollow cylinder; the radius of the cylinder is 2-3 mm.

[0013] As a preferred solution, the resonator is formed into the cantilever plate by 3D printing or laser cutting.

[0014] As a preferred solution, each of the resonating bodies is provided with a cantilever plate; the resonating body and the cantilever plate are connected via a connecting portion.

[0015] As a preferred solution, each of the resonating bodies is provided with at least two cantilever plates used in conjunction with each other; the resonating body and the cantilever plates are connected via a connecting portion.

[0016] As a preferred solution, the gap between the edge of the cantilever plate and the inner wall of the through groove is d, and d is 1-3 mm.

[0017] As a preferred solution, the matrix, pillars and resonator are formed by mechanical cutting or 3D printing thermoforming.

[0018] As a preferred solution, the cantilever plate is in the shape of an equilateral triangle; the connecting portion is provided on one side of the triangular cantilever plate.

[0019] As a preferred solution, the cantilever plate is in a shape of a square, a rectangle, a circle, a semicircle or a triangle.

[0020] As a preferred solution, the base and the resonator are formed of a light-transmitting material.

[0021] The technical solution of the present invention has the following advantages:

[0022] 1. The present invention provides a sound insulation structure with low-frequency, broadband sound insulation, comprising multiple periodically arranged sound insulation units, each comprising a base, a resonant body, and struts. When sound waves vertically impact the base from a sound source, the energy is transferred along the struts to the resonant body, inducing vibration energy dissipation at a specific frequency within the resonant structure formed by the resonant body and the cantilever plate. This suppresses vibrations of the base, struts, and resonant structure, effectively reducing transmitted sound energy and improving the structure's sound insulation performance. Compared to traditional sound insulation structures, the structure provided by the present invention reduces sound transmission loss by over 40%, enhancing the material's sound wave attenuation capability.

[0023] 2. The sound insulation structure with low-frequency broadband sound insulation provided by the present invention has a quarter-circular ring structure; the four pillars of the sound insulation unit are enclosed into a hollow cylindrical shape; the hollow structure reduces the weight of the sound insulation unit and enables resonance.

[0024] 3. The sound insulation structure with low-frequency broadband sound insulation function provided by the present invention is formed by mechanical cutting or 3D printing thermoforming. Each structure can be separably processed independently, with good processability and controllable production costs. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the specific embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 It is a schematic diagram of the three-dimensional structure of the sound insulation structure of the present invention.

[0027] Figure 2 This is a schematic diagram of the three-dimensional structure of the sound insulation unit of the present invention from a first angle.

[0028] Figure 3 It is a front view of the sound insulation unit of the present invention.

[0029] Figure 4 This is a schematic diagram of the three-dimensional structure of the sound insulation unit of the present invention from a second angle.

[0030] Figure 5 It is a schematic diagram of the three-dimensional structure of another embodiment of the sound insulation unit of the present invention.

[0031] Description of reference numerals:

[0032] 1. Sound insulation unit; 2. Base; 3. Pillar; 4. Resonator; 5. Cantilever plate; 6. Resonant structure; 7. Gap; 8. Connecting part. DETAILED DESCRIPTION

[0033] The technical solution of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. All other embodiments obtained by ordinary technicians in this field based on the embodiments of the present invention without making any creative efforts shall fall within the scope of protection of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "up", "down", "left", "right", "vertical", "horizontal", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0035] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense. For example, they may refer to fixed, detachable, or integral connections; mechanical or electrical connections; direct or indirect connections through an intermediate medium; and internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0036] In addition, the technical features involved in the different embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0037] The sound insulation structure provided by this embodiment has a low-frequency broadband sound insulation function, such as Figure 1 As shown, it includes multiple periodically arranged sound insulation units 1; this sound insulation structure overcomes the disadvantage of insufficient low-frequency sound insulation. At the same time, the device has a simple structure and is easy to process. Each structure can be separated and independently processed, with good processability and controllable production costs. Compared with traditional structures, the low-frequency sound insulation transmission loss can be increased by more than 40%, which can effectively improve the sound wave attenuation ability of the material.

[0038] like Figure 2 As shown, each sound insulation unit 1 includes: a base 2, a support 3 and a resonant body 4; a through groove is formed on the resonant body 4; a cantilever plate 5 is connected to the through groove; a gap 7 is formed between the edge of the cantilever plate 5 and the inner wall of the through groove, and the gap is 1-3 mm; the resonant body 4 and the cantilever plate 5 form a resonant structure 6; through the resonance effect of the resonant structure 6, the structural vibration of the base 2 is suppressed and the transmitted sound energy is reduced.

[0039] The base 2, the pillars 3 and the resonator 4 are all made of polymethyl methacrylate (PMMA). The base 2 is a thin plate structure, the pillars 3 are a rigid structure, and the resonator 4 is also a thin plate structure.

[0040] like Figure 3 As shown, the base 2 has a cubic structure with a thickness of 1-4 mm and a side length of 1-30 mm; the resonator 4 has a cubic structure with a thickness of 1-3 mm and a side length of 1-30 mm; the resonator 4 is fixedly arranged on one side of the base 2 via pillars 3; the cross-sectional area of ​​the opposite surface of the resonator 4 and the base 2 is the same, and the resonator 4 and the base 2 are completely opposite to each other;

[0041] Specifically, such as Figure 4As shown, each sound insulation unit 1 has four struts 3, located at the four corners of the base 2, one end connected to the base 2 and the other end connected to the resonator 4. The height of the struts 3 is 5-10 mm. Furthermore, the struts 3 are quarter-circular ring structures. The four struts 3 of the sound insulation unit 1, arranged around one end, form a hollow cylinder with a radius of 2-3 mm.

[0042] The resonator 4 is spaced apart and arranged on one side of the base 2. The resonator 4 is cut by laser cutting technology to form a cantilever plate 5.

[0043] As an alternative embodiment, the resonant body 4 and the cantilever plate 5 may also be directly formed by 3D printing.

[0044] The edge of the cantilever plate 5 is connected to the inner side of the resonant body 4 through the connecting portion 8 , and each cantilever plate 5 is connected to the resonant body 4 through only one connecting portion 8 .

[0045] Specifically, the cantilever plate 5 can be a Figure 5 As shown, its shape can be a square, rectangle, circle, semicircle or triangle, and in this embodiment, it is preferably an equilateral triangle.

[0046] As an alternative embodiment, cantilever plates 5 of different shapes may be cut out on the resonant body 4 to form a double resonance structure 6. The two cantilever plates 5 of different shapes cooperate with each other to expand the sound insulation frequency band.

[0047] The substrate 2 can be a metal plate or a non-metal plate, such as PMMA, ABS-PMMA, etc.

[0048] The base 2 and the resonator 4 are formed of light-transmitting materials, so that the overall structure can achieve good light transmittance.

[0049] The following steps are included when manufacturing the sound insulation structure with low-frequency broadband sound insulation function of this embodiment:

[0050] The substrate 2 can be processed by selecting appropriate materials and thickness according to actual conditions, using cutting or laser cutting methods. 3D printing and thermoforming can also be performed, which is a cheap and widely used production process that is closer to practical applications and avoids the use of expensive non-ordinary industrial manufacturing processes.

[0051] The pillar 3 needs to be processed by selecting a rigid structural material to connect the base 2 and the resonant structure 6. Mechanical cutting methods such as cutting or laser cutting or 3D printing and thermoforming can be used;

[0052] The resonant body 4 is processed by mechanical cutting methods such as cutting or laser cutting, or 3D printing and thermoforming. Cantilever plates 5 of different forms and sizes are processed according to a specific target frequency. Two cantilever plates 5 of different sizes and forms can also be combined to form a dual resonant structure 6, thereby widening the sound insulation frequency band of the metamaterial.

[0053] In each sound insulation unit 1, the base 2 and the resonator 4 are connected at the four corners by pillars 3. If mechanical cutting is used, the pillars 3 can be used as rectangular supports when the entire structure is assembled, and their support and transmission functions are better; if 3D printing and thermoforming are used, the pillars 3 and the resonator 4 are formed together, and then the structure is bonded to the base 2, which also has a good application effect.

[0054] The three structures of base 2, support 3 and resonance structure 6 are easy to process, light and convenient to install, with low production cost and significant sound insulation effect.

[0055] Usage and principle

[0056] The sound insulation structure's base 2 is installed facing the sound source. When sound waves enter the base 2 perpendicularly from the sound source, the energy is transferred along the struts 3 to the resonant structure 6, causing the resonant structure 6 to dissipate vibration energy at a specific frequency. This suppresses vibrations in the base 2, struts 3, and resonant structure 6, effectively reducing transmitted sound energy and improving the structure's sound insulation performance. Based on this principle, cantilever panels 5 of different structural forms can be combined to form multiple resonant structures 6, broadening the structural sound insulation frequency band. Compared to traditional sound insulation structures, the structure provided by the present invention reduces sound transmission loss by over 40%, enhancing the material's sound wave attenuation capability.

[0057] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will readily appreciate that other variations or modifications based on the above descriptions are possible. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A sound insulation structure with low-frequency broadband sound insulation function, characterized in that: The invention comprises a plurality of periodically arranged sound insulation units (1); the sound insulation units (1) comprise: A base (2), wherein the base (2) is adapted to be arranged toward a sound source; A resonant body (4) is arranged on one side of the base (2); a through slot is provided on the resonant body (4); a cantilever plate (5) is connected to the through slot; a gap (7) is formed between the edge of the cantilever plate (5) and the inner wall of the through slot; the resonant body (4) and the cantilever plate (5) form a resonant structure (6); The pillars (3) have a plurality of pillars; one end of the pillars (3) is connected to the base (2), and the other end is connected to the resonator (4).

2. The sound insulation structure with low-frequency broadband sound insulation function according to claim 1, characterized in that: The resonator (4) and the base (2) are both cube structures, and the areas of their opposing surfaces are the same.

3. The sound insulation structure with low-frequency broadband sound insulation function according to claim 2, characterized in that: The thickness of the base (2) is 1-4 mm, and the side length is 1-30 mm; the height of the pillar (3) is 5-10 mm; the thickness of the resonant structure (6) is 1-3 mm, and the side length is 1-30 mm.

4. The sound insulation structure with low-frequency broadband sound insulation function according to claim 2, characterized in that: The pillar (3) is in a quarter-circular ring structure; the pillars (3) of the four sound insulation units (1) are enclosed to form a hollow cylinder; the radius of the cylinder is 2-3 mm.

5. The sound insulation structure with low-frequency broadband sound insulation function according to claim 1, characterized in that: The resonant body (4) is formed into the cantilever plate (5) by 3D printing or laser cutting.

6. The sound insulation structure with low-frequency broadband sound insulation function according to claim 5, characterized in that: A cantilever plate (5) is provided on each of the resonant bodies (4); the resonant bodies (4) and the cantilever plates (5) are connected via a connecting portion (8).

7. The sound insulation structure with low-frequency broadband sound insulation function according to claim 5, characterized in that: Each resonant body (4) is provided with at least two cantilever plates (5) used in conjunction with each other; the resonant body (4) and the cantilever plates (5) are connected via a connecting portion (8).

8. The sound insulation structure with low-frequency broadband sound insulation function according to claim 5, characterized in that: The gap (7) between the edge of the cantilever plate (5) and the inner wall of the through groove is d, and d is 1-3 mm.

9. The sound insulation structure with low-frequency broadband sound insulation function according to claim 1, characterized in that: The base (2), pillars (3) and resonator (4) are formed by mechanical cutting or 3D printing thermoforming.

10. The sound insulation structure with low-frequency broadband sound insulation function according to claim 7, characterized in that: The cantilever plate (5) is in the shape of an equilateral triangle; the connecting portion (8) is arranged on one side of the triangular cantilever plate (5).

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