Mini led die bonding device

Abstract

The application discloses a Mini LED die bonding device, which comprises a table plate, a working box and a flow channel are arranged on the table plate, and two sides of the working box are respectively provided with mounting assemblies; the mounting assemblies comprise a material loading assembly, a die taking assembly, a correction assembly and a die bonding assembly; the material loading assembly comprises at least two material loading tables; the correction assembly comprises a correction table; the die taking assembly comprises a die taking arm; the die bonding assembly comprises a die bonding arm; the mounting assemblies further comprise a ring changing assembly and a ring feeding assembly; the ring feeding assembly is arranged close to the material loading assembly, and a plurality of die rings are stacked on the ring feeding assembly; the ring changing assembly comprises movable suction claws, and the suction claws are used for carrying the die rings. The Mini LED die bonding device can produce Mini LED products with better display effect, greatly improves the production efficiency, and ensures that the position and angle of the small-size Mini LED chip mounted on the LED support are consistent with the preset, prevents the Mini LED chip from being undesirably skewed on the LED support, and improves the quality of the Mini LED products and avoids the generation of defective products.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging equipment technology, and more particularly to a Mini LED die bonding device. Background Technology

[0002] With the development of LED display technology, Mini LED chips with sizes between 50-200μm have appeared on the market. Mini LED chips are smaller than traditional LED chips, allowing more chips to be mounted on the same display area, resulting in a more refined display effect and improved brightness, color gamut, and other performance characteristics. However, this smaller size of Mini LED chips makes it difficult for existing die bonders to meet production demands in terms of mounting accuracy. Furthermore, the number and types of chips that need to be mounted on the LED bracket during production have increased significantly. Conventional die bonders require frequent downtime to replace or replenish the crystal rings holding the Mini LED chips, leading to reduced production efficiency. Therefore, existing die bonders are struggling to meet market demand for Mini LED products. Summary of the Invention

[0003] The technical problem to be solved by the present invention is to provide a high-precision Mini LED die bonding device.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a Mini LED die bonding device, including a platform, on which a connected working box and flow channel are provided. The working box is movably arranged along the X-axis and Y-axis directions. Placement components are respectively provided on opposite sides of the working box along the X-axis direction. The placement components include a material carrier component, a die picking component, a calibration component, and a die bonding component. The material carrier component includes at least two material carrier stages. The calibration component includes a calibration stage. The die picking component includes a die picking arm that moves the chip on the material carrier stage to the die picking arm on the calibration stage. The die bonding component includes a die bonding arm that moves the chip on the calibration stage to the die bonding arm on the working box. The placement components also include a ring changing component and a ring delivery component. The ring delivery component is arranged close to the material carrier component and multiple crystal rings are stacked on the ring delivery component. The ring changing component includes a movable pick-up claw, which is used to transport crystal rings between the ring delivery component and the material carrier stage.

[0005] The beneficial effects of this invention are as follows: The Mini LED die bonding device provided by this invention replaces the crystal ring above the carrier stage with a crystal ring with Mini LED chips attached through the cooperation of the ring feeding component and the ring changing component. Multiple carrier stages can each hold crystal rings with different Mini LED chips for the die picking component to pick up, enabling the Mini LED die bonding device to produce Mini LED products with better display effects. The mounting components located on opposite sides of the work box simultaneously mount Mini LED chips onto the LED bracket, significantly improving the production efficiency of Mini LED products. Simultaneously, the Mini LED chips on the crystal ring are moved from the carrier stage by the die picking component to the calibration component for calibration, and then moved by the die bonding component to the work box for mounting. This ensures that the position and angle of the small-sized Mini LED chips mounted on the LED bracket are consistent with the preset values, preventing unexpected skewing of the Mini LED chips on the LED bracket, thereby improving the quality of Mini LED products and avoiding defective products. Attached Figure Description

[0006] Figure 1 This is a schematic diagram of the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0007] Figure 2 This is a top view of the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0008] Figure 3 This is a schematic diagram of the working box structure in the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0009] Figure 4 This is a schematic diagram of the flow channel structure in the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0010] Figure 5 This is a schematic diagram of the material carrier component in the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0011] Figure 6 This is a schematic diagram of the ring delivery component in the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0012] Figure 7 This is a schematic diagram of the ring-changing assembly in the Mini LED die-bonding device according to Embodiment 1 of the present invention;

[0013] Figure 8 This is a schematic diagram of the correction component in the Mini LED die bonding device according to Embodiment 1 of the present invention;

[0014] Figure 9 This is a schematic diagram of the ejector pin structure in the Mini LED die bonding device according to Embodiment 1 of the present invention.

[0015] Label Explanation:

[0016] 1. Platform; 11. Waste box; 12. Calibration tube; 13. Die-taking tube; 14. Die-bonding tube; 15. Photoelectric sensor; 16. Ejector pin; 17. Second drive unit; 2. Working box; 21. Top plate; 22. Cover plate; 3. Flow channel; 31. Channel; 4. Material loading assembly; 41. Material loading stage; 42. Material loading plate; 5. Die-taking assembly; 51. Die-taking arm; 52. Die-taking welding head; 6. Calibration assembly; 61. Calibration table; 62. Vacuum suction plate; 7. Die-bonding assembly; 71. Die-bonding arm; 72. Die-bonding welding head; 8. Ring changing assembly; 81. Pick-up claw; 82. First drive unit; 9. Ring delivery assembly; 91. Ring delivery platform. Detailed Implementation

[0017] To explain in detail the technical content, objectives, and effects of the present invention, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0018] Please refer to Figures 1 to 9 A Mini LED die bonding device includes a platform 1, on which a connected work box 2 and a flow channel 3 are provided. The work box 2 is movably arranged along the X-axis and Y-axis directions. Placement components are respectively provided on opposite sides of the work box 2 along the X-axis direction. The placement components include a material carrier component 4, a die picking component 5, a calibration component 6, and a die bonding component 7. The material carrier component 4 includes at least two material carrier stages 41. The calibration component 6 includes a calibration stage 61. The die picking component 5 includes a die picking arm 51 for moving the chip on the material carrier stage 41 to the calibration stage 61. The die bonding component 7 includes a die bonding arm 71 for moving the chip on the calibration stage 61 to the work box 2. The placement components also include a ring changing component 8 and a ring delivery component 9. The ring delivery component 9 is arranged close to the material carrier component 4 and multiple crystal rings are stacked on the ring delivery component 9. The ring changing component 8 includes a movable pick-up claw 81 for transporting crystal rings between the ring delivery component 9 and the material carrier stage 41.

[0019] As can be seen from the above description, the beneficial effects of the present invention are as follows: The Mini LED die bonding device provided by the present invention can produce Mini LED products with better display effects, greatly improve the production efficiency of Mini LED products, and at the same time ensure that the position and angle of the small-sized Mini LED chip when it is mounted on the LED bracket are consistent with the preset, preventing unexpected skewing of the Mini LED chip on the LED bracket, thereby improving the quality of Mini LED products and avoiding defective products.

[0020] Furthermore, the ring delivery assembly 9 includes a ring delivery platform 91 that can be raised and lowered along the Z-axis direction, and multiple crystal rings are stacked on the ring delivery platform 91.

[0021] As described above, multiple crystal rings are stacked on the ring delivery platform 91 for the ring replacement assembly 8 to pick up in sequence. The crystal rings are sent into the picking range of the ring replacement assembly 8 by the lifting and lowering of the ring delivery platform 91, while avoiding the moving ring delivery platform 91.

[0022] Furthermore, the ring-changing assembly 8 also includes a first driving member 82, which drives the suction claw 81 to move in the Y-axis direction and the Z-axis direction.

[0023] As described above, the first driving member 82 drives the suction claw 81 to move in the Y-axis and Z-axis directions, so that the suction claw 81 can stably grasp and move the crystal ring.

[0024] Furthermore, the material loading assembly 4 also includes a material loading plate 42 that is movable along the X-axis and Y-axis directions, and a material loading platform 41 is respectively disposed on the material loading plate 42, and the material loading platform 41 is rotatably disposed relative to the material loading plate 42.

[0025] As described above, the movement of the carrier plate 42 in the X and Y axes drives the movement of the carrier stage 41 and the rotation of the carrier stage 41 itself, so that the chip-taking arm 51 is aligned with a specific Mini LED chip on the carrier stage 41, enabling the Mini LED die bonding device to sequentially mount the corresponding Mini LED chips onto the LED bracket according to the process specifications.

[0026] Furthermore, the platform 1 is also provided with a waste box 11, which is located close to the material loading assembly 4.

[0027] As described above, after the crystal removal component 5 removes all the Mini LED chips from the crystal ring, the ring replacement component 8 picks up the crystal ring and puts it into the waste box 11 to collect the empty crystal rings in one place for processing.

[0028] Furthermore, the mounting assembly also includes a barcode scanner, which is positioned above the material carrier 41.

[0029] As described above, a barcode scanner is installed above the loading platform 41 to identify the type of crystal ring placed on the loading platform 41, so that the crystal picking component 5 can pick up the corresponding type of Mini LED chip.

[0030] Furthermore, the calibration table 61 is provided with a rotatable vacuum suction plate 62, and the calibration table 61 is movable along the X-axis and Y-axis directions.

[0031] As described above, the chip-taking arm 51 places the Mini LED chip on the vacuum suction plate 62. The rotation of the vacuum suction plate 62 causes the Mini LED chip to rotate in order to correct the deviation of the Mini LED chip angle. The position of the Mini LED chip is adjusted by the horizontal movement of the calibration stage 61.

[0032] Furthermore, the platform 1 is also provided with a die-bonding lens barrel 14, which is located above the work box 2.

[0033] Furthermore, the mounting assembly also includes a crystal-taking lens barrel 13 and a calibration lens barrel 12, wherein the crystal-taking lens barrel 13 is disposed above the material carrier stage 41 and the calibration lens barrel 12 is disposed above the calibration stage 61.

[0034] As described above, the Mini LED chip to be picked up on the carrier stage 41, the degree of deviation of the Mini LED chip on the calibration stage 61, and the position of the Mini LED chip to be mounted on the LED bracket are identified by components such as the crystal picking lens 13, the calibration lens 12, and the die bonding lens 14, so as to further improve the accuracy of the Mini LED die bonding equipment.

[0035] Furthermore, the flow channels 3 are respectively provided on opposite sides of the working box 2 in the Y-axis direction, and the end of the flow channel 3 away from the working box 2 is provided with an opening 31 for the LED bracket to enter and exit the working box 2.

[0036] As described above, multiple Mini LED die bonding devices can be connected by connecting the ports 31 of the devices. Then, after some Mini LED chips are mounted on one Mini LED die bonding device, the same LED bracket can be transferred to the next Mini LED die bonding device to mount another part of the Mini LED chips, so as to enable the coordinated operation of multiple Mini LED die bonding devices.

[0037] Example 1

[0038] Please refer to Figures 1 to 9 Embodiment 1 of the present invention is: a Mini LED die bonding device, used in the back-end packaging production line of Mini LED products to mount Mini LED chips onto the LED bracket in a certain order.

[0039] like Figure 1 and Figure 2As shown, the Mini LED die bonding equipment includes a platform 1, a working box 2 for fixing the position of the LED bracket and a flow channel 3 communicating with the working box 2. The LED bracket enters and exits the working box 2 through the flow channel 3. The working box 2 has mounting components on opposite sides along the X-axis. The mounting components include a material carrier 4 for holding the crystal ring, a correction component 6 for correcting the position and angle of the Mini LED chip, a chip picking component 5 for transporting the Mini LED chip between the material carrier 4 and the correction component 6, and a die bonding component 7 for transporting the Mini LED chip between the correction component 6 and the working box 2. Through the coordinated operation of the material carrier 4, the chip picking component 5, the correction component 6 and the die bonding component 7, the Mini LED chip attached to the crystal ring on the material carrier 4 is mounted onto the LED bracket in the working box 2.

[0040] Specifically, the chip-feeding assembly 5 includes a chip-feeding arm 51 and a chip-feeding bonding head 52 that drives the chip-feeding arm 51 to swing. The end of the chip-feeding arm 51 is equipped with a suction nozzle. The die-bonding assembly 7 includes a die-bonding arm 71 and a die-bonding bonding head 72 that drives the die-bonding arm 71 to swing, both of which are equipped with suction nozzles at their ends. The chip-feeding arm 51 and the die-bonding arm 71 both pick up Mini LED chips through the suction nozzles at their ends and move the Mini LED chips by swinging, thereby realizing the transfer of Mini LED chips between the material carrier assembly 4, the calibration assembly 6, and the work box 2. Furthermore, the mounting assemblies located on opposite sides of the work box 2 operate simultaneously and mount Mini LED chips onto the LED brackets within the work box 2 in a specific order, increasing the number of Mini LED chips mounted on the LED brackets per unit time, thereby improving the production efficiency of Mini LED products.

[0041] like Figure 2The work box 2 is movable along the X-axis and Y-axis on the platform 1 so that the nozzle at the end of the die bonding arm 71 can be aligned with the position to be mounted on the LED bracket. The work box 2 includes a liftable top plate 21 and a cover plate 22 spaced apart from the top plate 21. A space for accommodating the LED bracket is formed between the top plate 21 and the cover plate 22. The work box 2 is equipped with a sensor and a liftable first baffle. After the sensor detects that the LED bracket has entered the space, the first baffle rises to prevent the LED bracket from moving further. At the same time, the top plate 21 rises to hold the LED bracket, fixing it between the top plate 21 and the cover plate 22. After the mounting operation on the LED bracket is completed, the top plate 21 and the first baffle fall down to release the LED bracket, and the LED bracket exits the work box 2 along the flow channel 3. After the sensor detects that the LED bracket has left, the flow channel 3 sends another LED bracket into the work box 2.

[0042] Please combine Figure 1 , Figure 2 and Figure 4 The working box 2 has flow channels 3 on opposite sides along the Y-axis, and the two flow channels 3 are respectively connected to the working box 2. The end of the flow channel 3 away from the working box 2 is provided with an opening 31 for driving the LED bracket to move on the flow channel 3 and enter and exit the working box 2. The flow channel 3 is provided with a second baffle to block the movement of the LED bracket. The platform 1 is provided with a gate covering the flow channel 3, and a photoelectric sensor 15 is provided in the gate. The photoelectric sensor 15 can identify whether there is an LED bracket in the flow channel 3. When there is an LED bracket in the working box 2 and there is also a bracket on the flow channel 3, the second baffle rises to prevent the LED bracket in the flow channel 3 from entering the working box 2. When the LED bracket in the working box 2 moves out, the second baffle descends to allow the LED bracket in the flow channel 3 to continue to move, thereby allowing multiple LED brackets to enter the working box 2 in sequence.

[0043] Preferably, the flow channels 3 of multiple Mini LED die bonding devices can be connected sequentially, so that an LED bracket enters the working box 2 of multiple Mini LED die bonding devices in sequence, and each Mini LED die bonding device completes the mounting work on a part of the LED bracket. In this way, Mini LED chips of different colors or different wavelengths can be mounted on the same LED bracket by multiple Mini LED die bonding devices, reducing the number of times Mini LED chips need to be replaced on a single Mini LED die bonding device, enabling multiple Mini LED die bonding devices to work together and improving the display effect of Mini LED products.

[0044] like Figure 5 As shown, the material carrier assembly 4 includes a material carrier plate 42 movable along the X-axis and Y-axis, and three material carrier stages 41 respectively disposed on the material carrier plate 42. Each material carrier stage 41 holds a crystal ring. The three material carrier stages 41 are arranged in a row on the material carrier plate 42 and are rotatably disposed relative to the material carrier plate 42. Simultaneously, the material carrier plate 42 is movable relative to the stage 1 along the X-axis and Y-axis, so that the movement of the material carrier plate 42 drives the material carrier stages 41 to move horizontally. The rotation of the material carrier stages 41 allows the nozzle of the crystal picker arm 51 to be aligned with any Mini LED chip on the crystal ring. Furthermore, each of the three material carrier stages 41 can hold a crystal ring with Mini LED chips of different colors or wavelengths for the crystal picker arm 51 to pick up, avoiding downtime during operation of the Mini LED die bonding equipment to replace different crystal rings, thus ensuring continuous operation of the Mini LED die bonding equipment.

[0045] Please refer to Figure 1 , Figure 6 and Figure 7 The mounting assembly further includes a ring changing assembly 8 and a ring feeding assembly 9. The ring feeding assembly 9 has a ring feeding platform 91 that is liftable in the Z-axis direction, and multiple crystal rings are stacked on the ring feeding platform 91. The ring feeding platform 91 is provided with multiple vertical limiting rods to fix the relative position of the crystal rings and the ring feeding platform 91. The ring changing assembly 8 includes a suction claw 81 and a first driving member 82 that drives the suction claw 81 to move. The suction claw 81 includes multiple spaced suction nozzles to ensure that the suction claw 81 is stably adsorbed on the surface of the crystal ring. The suction claw 81 can move along the Y-axis and Z-axis directions under the drive of the first driving member 82 to transport crystal rings between the ring feeding platform 91 and the material table. The platform 1 is also provided with a waste box 11. The suction claw 81 can move empty crystal rings picked up from the material table into the waste box 11 to collect the empty crystal rings for subsequent processing.

[0046] like Figure 8As shown, the calibration component 6 includes a calibration stage 61 with a rotatable vacuum suction plate 62. After the chip-taking arm 51 places the Mini LED chip onto the vacuum suction plate 62, the vacuum suction plate 62 adheres to the Mini LED chip to fix its position. The calibration stage 61 is movable relative to the platform 1 in the X and Y axes. The position of the Mini LED chip can be calibrated by the horizontal movement of the calibration stage 61 and the rotation of the vacuum suction plate 62. A calibration lens 12 is provided on the platform 1, positioned directly above the calibration stage 61. When the Mini LED chip is placed on the vacuum suction plate 62, the calibration lens 12 photographs and identifies the chip to determine the distance and angle of its horizontal offset. This allows the calibration stage 61 and the vacuum suction plate 62 to adjust the chip accordingly, improving the calibration accuracy of the calibration component 6.

[0047] like Figure 1 To further improve the mounting accuracy of the Mini LED die bonding equipment, the platform 1 is also equipped with a pick-up lens 13 and a die bonding lens 14. The pick-up lens 13 is located directly above the material stage and facing the position where the pick-up arm 51 contacts the material stage. The pick-up lens 13 is used to capture images of the material stage to determine the distance between the position of the next Mini LED chip to be picked up and the position picked up by the pick-up arm 51. Then, the material carrier assembly 4 moves the Mini LED chip to a preset position. The die bonding lens 14 is located above the work box 2 and facing the work box 2. The die bonding lens 14 is used to capture images of the work box 2 and determine the distance between the next position to be bonded on the LED bracket and the position of the die bonding arm 71. Then, the work box 2 performs corresponding actions to align the die bonding arm 71 with the position to be bonded.

[0048] like Figure 1 and Figure 9 As shown, the mounting assembly also includes a pin 16 disposed below the carrier stage 41. The pin 16 is vertically movable in the Z-axis direction, and the stage 1 is provided with a second driving member 17 that drives the pin 16 to move in the X-axis and Y-axis directions. The second driving member 17 drives the pin 16 to align with the Mini LED chip to be picked up. Then the pin 16 rises and abuts against the blue film of the crystal ring, so that the Mini LED chip attached to the other side of the blue film of the crystal ring is detached. At this time, the chip picking arm 51 above the Mini LED chip picks up the Mini LED chip so that the chip picking arm 51 can accurately pick up the Mini LED chip to be mounted.

[0049] In summary, the material carrier component of the Mini LED die bonding equipment provided by this invention includes multiple material carrier platforms. Different crystal rings can be placed on the material carrier platforms for the die bonding component to pick up, so as to mount different types of chips on the LED bracket according to actual production needs. Furthermore, the crystal rings above the material carrier platforms are replaced by the cooperation of the ring feeding component and the ring changing component, which improves the working efficiency of the Mini LED die bonding equipment and enhances the display effect of the Mini LED products. The Mini LED die bonding equipment uses mounting components set on opposite sides of the working box to simultaneously mount chips onto the LED bracket inside the working box, thereby increasing the number of chips that can be mounted on the LED bracket per unit time and significantly improving the production efficiency of the Mini LED die bonding equipment. The Mini LED die bonding equipment also uses the cooperation of the calibration component and the calibration lens to calibrate the position and angle of the Mini LED chips placed on the vacuum suction plate of the calibration platform, so that the Mini LED chips attached to the surface of the LED bracket are aligned with the LED bracket, preventing the Mini LED chips from being skewed, effectively avoiding defective products, and improving the mounting accuracy of the Mini LED chips.

[0050] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent modifications made based on the content of the present invention specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A Mini LED die bonding device, comprising a platform, wherein the platform is provided with a connected working box and a flow channel, the working box being movable along the X-axis and Y-axis directions, characterized in that: The work box has mounting components on opposite sides along the X-axis. Each mounting component includes a material carrier, a die picking component, a calibration component, and a die bonding component. The material carrier includes at least two material carrier stages. The calibration component includes a calibration stage. The die picking component includes a die picking arm that moves the die on the material carrier stage to the die picking arm on the calibration stage. The die bonding component includes a die bonding arm that moves the die on the calibration stage to the die bonding arm on the work box. The mounting components also include a ring changing component and a ring delivery component. The ring delivery component is located close to the material carrier and has multiple die rings stacked on it. The ring changing component includes a movable pick-up claw that is used to transport the die rings between the ring delivery component and the material carrier stage. The ring delivery assembly has a ring delivery platform that can be raised and lowered in the Z-axis direction, and multiple crystal rings are stacked on the ring delivery platform. The ring delivery platform is provided with multiple vertical limiting rods to fix the relative position of the crystal rings and the ring delivery platform.

2. The Mini LED die bonding device according to claim 1, characterized in that: The ring delivery assembly includes a ring delivery platform that can be raised and lowered along the Z-axis, and multiple crystal rings are stacked on the ring delivery platform.

3. The Mini LED die bonding device according to claim 1, characterized in that: The ring-changing assembly further includes a first driving member, which drives the suction claw to move in the Y-axis direction and the Z-axis direction.

4. The Mini LED die bonding device according to claim 1, characterized in that: The material loading assembly also includes a material loading plate that is movable along the X-axis and Y-axis directions. The material loading platform is respectively disposed on the material loading plate, and the material loading platform is rotatably disposed relative to the material loading plate.

5. The Mini LED die bonding device according to claim 1, characterized in that: The platform is also equipped with a waste box, which is located close to the material loading assembly.

6. The Mini LED die bonding device according to claim 1, characterized in that: The mounting assembly also includes a barcode scanner, which is positioned above the material carrier.

7. The Mini LED die bonding device according to claim 1, characterized in that: The calibration platform is equipped with a rotatable vacuum suction plate, and the calibration platform is movable along the X-axis and Y-axis directions.

8. The Mini LED die bonding device according to claim 1, characterized in that: The platform is also equipped with a die-bonding lens barrel, which is located above the work box.

9. The Mini LED die bonding device according to claim 1, characterized in that: The mounting assembly also includes a crystal-taking lens barrel and a calibration lens barrel, with the crystal-taking lens barrel positioned above the material carrier stage and the calibration lens barrel positioned above the calibration stage.

10. The Mini LED die bonding device according to claim 1, characterized in that: The flow channels are respectively provided on opposite sides of the working box in the Y-axis direction, and the end of the flow channel away from the working box is provided with an opening for the LED bracket to enter and exit the working box.

Images