Antenna Assemblies and Electronic Devices

Abstract

An antenna assembly includes a circuit board formed with an antenna, a coaxial cable, and a conductive film. The circuit board has an edge, a first pad, and a second pad. The outer conductor of the coaxial cable has an exposed portion, and the exposed portion is exposed from an outer cover in a predetermined area. The exposed portion is connected to the second pad. In a second direction perpendicular to the first direction, the center of the coaxial cable is located at a predetermined position. The conductive film is fixed to the circuit board. The conductive film has a main body and at least one extension. In the predetermined area, the at least one extension and the second pad are aligned in the first direction. The at least one extension extends from the main body over the predetermined position in the second direction.

Description

Technical Field

[0001] The present invention relates to an antenna assembly including a conductive film. Background Art

[0002] Reference Fig.33 , US 2012 / 0050119 A1 (Patent Document 1) discloses this type of antenna assembly 900. Antenna assembly 900 includes a circuit board 910 formed with an antenna 920, a coaxial cable 930, and a conductive film 950. Circuit board 910 has an edge 912, a feed portion 914, and a ground portion 916. Coaxial cable 930 includes a center conductor 934 and an outer conductor 936. Center conductor 934 is connected to feed portion 914. Outer conductor 936 is connected to ground portion 916. Conductive film 950 is connected to ground portion 916. Since antenna assembly 900 has conductive film 950 connected to ground portion 916, the size of the ground plane of antenna assembly 900 is increased. As a result, antenna assembly 900 has improved antenna characteristics.

[0003] Antenna assemblies such as antenna assembly 900 of Patent Document 1 require improvement in the operation of fixing the conductive film to the circuit board. Summary of the invention

[0004] Therefore, an object of the present invention is to provide an antenna assembly that facilitates the operation of fixing a conductive film to a circuit board.

[0005] One aspect of the present invention (first aspect) provides an antenna assembly, which includes a circuit board formed with an antenna, a coaxial cable and a conductive film. The circuit board has an edge, a first pad and a second pad. The coaxial cable includes a center conductor, an insulator, an outer conductor and an outer cover. The center conductor is connected to the first pad. The outer conductor is insulated from the center conductor by the insulator. The outer conductor has an exposed portion, which is exposed from the outer cover in a predetermined area. The exposed portion extends in a first direction. The exposed portion is connected to the second pad. In a second direction perpendicular to the first direction, the center of the coaxial cable is located at a predetermined position. The conductive film is fixed on the circuit board. The conductive film has a main body and at least one extension. In a predetermined area, at least one extension is aligned with the second pad in the first direction. At least one extension extends from the main body in the second direction beyond the predetermined position.

[0006] Another aspect (second aspect) of the present invention provides an electronic device, comprising the antenna assembly of the first aspect and a ground member. The ground member is separate and apart from the antenna assembly. The conductive film is connected to the ground member.

[0007] The antenna assembly of the present invention has a conductive film, a main body and at least one extension. In addition, in a predetermined area, at least one extension and a second pad are aligned in a first direction. In addition, at least one extension extends from the main body over a predetermined position in a second direction. Therefore, the antenna assembly of the present invention is configured so that when the conductive film is fixed on the circuit board, the conductive film has a portion of increased size temporarily placed on the circuit board. Therefore, the antenna assembly of the present invention can facilitate the operation of fixing the conductive film to the circuit board.

[0008] An appreciation of the objectives of the present invention and a more complete understanding of its structure may be had by studying the following description of the preferred embodiment and referring to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 FIG. 1 is a top view of an electronic device according to a first embodiment of the present invention, in which a part of an antenna assembly is enlarged and shown.

[0010] Figure 2 It is shown for Figure 1 A perspective view of an antenna assembly of an electronic device.

[0011] Figure 3 It is shown Figure 2 A side view of an antenna assembly is shown in FIG.

[0012] Figure 4 It is shown Figure 2 Rear view of the antenna assembly.

[0013] Figure 5 It is shown Figure 4 A cross-sectional view of the antenna assembly taken along line AA. In the figure, a part of the antenna assembly is enlarged and shown.

[0014] Figure 6 It is shown Figure 4 A cross-sectional view of the antenna assembly taken along line BB. In the figure, a portion of the antenna assembly is enlarged and shown.

[0015] Figure 7 It is used to illustrate Figure 2 FIG. 1 is a top view of an assembly method of an antenna assembly of FIG. 1 , in which the conductive film is fixed to the circuit board, while the coaxial cable is not soldered to the circuit board.

[0016] Figure 8 It is shown Figure 7 3D view of an antenna assembly of FIG. 4 , in which the conductive film is fixed to the circuit board, but the coaxial cable is not soldered to the circuit board.

[0017] Fig. 9 It is used to illustrate Figure 2Another top view of the assembly method of the antenna assembly. In the figure, the conductive film is not fixed to the circuit board.

[0018] Fig.10 It is shown Fig. 9 A three-dimensional view of an antenna assembly of FIG. 1 . In the figure, the conductive film is not fixed to the circuit board.

[0019] Fig.11 FIG. 2 is a top view of an electronic device according to a second embodiment of the present invention, in which a part of the antenna assembly is enlarged.

[0020] Fig.12 It is shown for Fig.11 A perspective view of an antenna assembly of an electronic device.

[0021] Fig.13 It is shown Fig.12 A side view of an antenna assembly is shown in FIG.

[0022] Fig.14 It is shown Fig.12 Rear view of the antenna assembly.

[0023] Fig.15 It is shown Fig.14 A cross-sectional view of the antenna assembly taken along line CC. In the figure, a portion of the antenna assembly is enlarged and shown.

[0024] Fig.16 It is shown Fig.14 A cross-sectional view of the antenna assembly taken along line DD. In the figure, a part of the antenna assembly is enlarged and shown.

[0025] Fig.17 It is shown Fig.14 A cross-sectional view of the antenna assembly taken along line EE of FIG.

[0026] Fig.18 It is used to illustrate Fig.12 FIG. 1 is a top view of an assembly method of an antenna assembly of FIG. 1 , in which the conductive film is fixed to the circuit board, while the coaxial cable is not soldered to the circuit board.

[0027] Fig.19 It is shown Fig.18 3D view of an antenna assembly of FIG. 4 , in which the conductive film is fixed to the circuit board, but the coaxial cable is not soldered to the circuit board.

[0028] Fig. 20 It is used to illustrate Fig.12 Another top view of the assembly method of the antenna assembly. In the figure, the conductive film is not fixed to the circuit board, and a part of the circuit board and the conductive film are enlarged to show.

[0029] Fig.21 It is shown Fig. 20 A three-dimensional view of an antenna assembly of FIG. 1 . In the figure, the conductive film is not fixed to the circuit board.

[0030] Fig. 22 FIG. 1 is a top view of an electronic device according to a third embodiment of the present invention, in which a part of the antenna assembly is enlarged.

[0031] Fig.23 It is shown for Fig. 22 A perspective view of an antenna assembly of an electronic device.

[0032] Fig.24 It is shown Fig.23 A side view of an antenna assembly is shown in FIG.

[0033] Fig.25 It is shown Fig.23 Rear view of the antenna assembly.

[0034] Fig.26 It is shown Fig.25 A cross-sectional view of the antenna assembly taken along line FF. In the figure, a portion of the antenna assembly is enlarged and shown.

[0035] Fig. 27 It is shown Fig.25 A cross-sectional view of the antenna assembly taken along line GG. In the figure, a portion of the antenna assembly is enlarged and shown.

[0036] Fig.28 It is shown Fig.25 A cross-sectional view of the antenna assembly taken along line HH of FIG.

[0037] Fig.29 It is used to illustrate Fig.23 FIG. 1 is a top view of an assembly method of an antenna assembly of FIG. 1 , in which the conductive film is fixed to the circuit board, while the coaxial cable is not soldered to the circuit board.

[0038] Fig.30 It is shown Fig.29 3D view of an antenna assembly of FIG. 4 , in which the conductive film is fixed to the circuit board, but the coaxial cable is not soldered to the circuit board.

[0039] Fig.31 It is used to illustrate Figure 2 Another top view of the assembly method of the antenna assembly. In the figure, the conductive film is not fixed to the circuit board, and a part of the circuit board and the conductive film are enlarged to show.

[0040] Fig.32 It is shown Fig.31A three-dimensional view of an antenna assembly of FIG. 1 . In the figure, the conductive film is not fixed to the circuit board.

[0041] Fig.33 This is a perspective view showing the antenna assembly of Patent Document 1.

[0042] Although the present invention is susceptible to various modifications and alternative forms, specific embodiments of the present invention are shown by way of example in the drawings and will be described in detail herein. However, it should be understood that the drawings and detailed description are not intended to limit the invention to the particular form disclosed, but on the contrary, the invention is intended to cover all modifications, equivalent forms and alternative forms that fall within the concept and scope of the invention as defined by the appended claims. DETAILED DESCRIPTION

[0043] [First embodiment]

[0044] like Figure 1 As shown, the electronic device 700 according to the first embodiment of the present invention includes the antenna assembly 100 and a ground member 600. The ground member 600 is separate and apart from the antenna assembly 100. The ground member 600 is, for example, a ground portion of a liquid crystal display panel or a housing made of metal.

[0045] like Figure 2 As shown, the antenna assembly 100 according to the first embodiment of the present invention includes a circuit board 200, a coaxial cable 300, and a conductive film 400. Specifically, the circuit board 200 is formed with an antenna 220.

[0046] Reference Fig.10 , the circuit board 200 of this embodiment has an upper surface, a ground layer (not shown) and a through hole (not shown). Specifically, the upper surface faces the up-down direction. The ground layer is located below the upper surface in the up-down direction. The through hole is connected to the ground layer. In this embodiment, the up-down direction is the Z direction. Specifically, the upward direction is the +Z direction, and the downward direction is the -Z direction.

[0047] like Fig.10 As shown, the circuit board 200 has a first solder pad 240 , a second solder pad 250 and an edge 230 .

[0048] like Fig.10 As shown, the first solder pad 240 of the present embodiment is disposed on the upper surface of the circuit board 200 .

[0049] like Fig.10As shown, the second pad 250 of the present embodiment is arranged on the upper surface of the circuit board 200. The first pad 240 and the second pad 250 are arranged in a first direction perpendicular to the up and down direction. In the present embodiment, the first direction is the Y direction. In addition, the first direction is also referred to as the left and right direction. Specifically, it is assumed that the right is the +Y direction and the left is the -Y direction. The second pad 250 is located on the left side of the first pad 240 in the left and right direction. The second pad 250 is located near the left end of the circuit board 200 in the left and right direction.

[0050] like Fig.10 As shown, the edge 230 of the present embodiment defines the end of the circuit board 200 in a second direction perpendicular to the up-down direction and the first direction. In the present embodiment, the second direction is the X direction. In addition, the second direction is also referred to as the front-back direction. Specifically, it is assumed that the forward direction is the +X direction, and the backward direction is the -X direction. The edge 230 defines the rear end of the circuit board 200 in the front-back direction.

[0051] like Fig.10 As shown, the circuit board 200 further has a third solder pad 270 .

[0052] like Fig.10 As shown, the third pad 270 of the present embodiment is arranged on the upper surface of the circuit board 200. The first pad 240, the second pad 250 and the third pad 270 are all located on the same surface of the circuit board 200. The third pad 270 is located on the right side of the first pad 240 in the left-right direction. The first pad 240 is located between the second pad 250 and the third pad 270 in the first direction or the left-right direction. The third pad 270 is electrically connected to the second pad 250. More specifically, the second pad 250 is connected to the ground layer through a through hole, and the third pad 270 is connected to the ground layer through a through hole. Therefore, the second pad 250 and the third pad 270 are electrically connected to each other through the through hole and the ground layer.

[0053] like Figure 1 As shown, the coaxial cable 300 of the present embodiment extends in a first direction or a left-right direction. In a second direction perpendicular to the first direction, the center of the coaxial cable 300 is located at a predetermined position PP. In other words, in the front-to-back direction, the center of the coaxial cable 300 is located at a predetermined position PP. The predetermined position PP is located in front of the edge 230 in the front-to-back direction. In addition, the predetermined position PP is located behind the front end of the conductive film 400 in the front-to-back direction.

[0054] like Figure 3 As shown, the coaxial cable 300 includes a center conductor 310 , an insulator 320 , an outer conductor 330 , and a jacket 340 .

[0055] Reference Figure 5 , the center conductor 310 is made of metal. Figure 8As shown, the center conductor 310 extends in a first direction or in a left-right direction. The exposed portion of the center conductor 310 exposed to the outside of the coaxial cable 300 defines the right end of the coaxial cable 300. Figure 1 As shown, the center conductor 310 is connected to the first pad 240. Specifically, the center conductor 310 is soldered on the first pad 240. More specifically, the exposed portion of the center conductor 310 is bonded to the first pad 240 by the solder 500.

[0056] Reference Figure 5 , the insulator 320 of this embodiment is made of resin. Figure 8 As shown, the insulator 320 extends in the left-right direction or the first direction. The exposed portion of the insulator 320 exposed to the outside of the coaxial cable 300 is located on the left side of the exposed portion of the center conductor 310 in the left-right direction. Figure 7 and Fig. 9 The exposed portion of the insulator 320 is located between the first pad 240 and the second pad 250 in the first direction or the left-right direction. Specifically, the exposed portion of the insulator 320 is located on the left side of the first pad 240 and on the right side of the second pad 250 in the left-right direction.

[0057] Reference Figure 5 , the outer conductor 330 of this embodiment is made of metal. Figure 8 As shown, the outer conductor 330 extends in a first direction or a left-right direction. Figure 1 , Figure 3 and Figure 7 It can be seen that the outer conductor 330 is insulated from the central conductor 310 by the insulator 320. The outer conductor 330 has an exposed portion exposed from the outer cover 340 at a predetermined area PA. Figure 8 As shown, the exposed portion of the outer conductor 330 extends in the first direction or the left-right direction. The exposed portion of the outer conductor 330 is located on the left side of the exposed portion of the insulator 320 in the left-right direction. Figure 5 As shown, the exposed portion of the outer conductor 330 is connected to the second pad 250. The outer conductor 330 is soldered on the second pad 250. In other words, the outer conductor 330 is bonded to the second pad 250 by the solder 500.

[0058] Reference Figure 7 The outer cover 340 of this embodiment is made of resin. The outer cover 340 extends in a first direction or a left-right direction. The outer cover 340 defines the outer end of the coaxial cable 300 in a direction perpendicular to the first direction.

[0059] Reference Figure 1, the conductive film 400 of this embodiment is a copper tape. However, the present invention is not limited thereto. The conductive film 400 may be made of a conductive material other than a copper tape. The conductive film 400 is connected to the grounding member 600. The conductive film 400 is fixed to the circuit board 200.

[0060] like Fig.10 As shown, the conductive film 400 has a main portion 410 and an extending portion 420 .

[0061] like Fig.10 As shown, the main body 410 of this embodiment has a flat plate shape perpendicular to the up and down directions. Figure 5 As shown, the main body portion 410 is arranged to extend across the edge 230 .

[0062] like Figure 1 As shown, the main body 410 has a middle portion 465. The middle portion 465 is located near the center of the main body 410 in the first direction or the left-right direction. The middle portion 465 is located at the front end of the main body 410 in the front-back direction. The middle portion 465 is located on the right side of the extension portion 420 in the left-right direction. The middle portion 465 is arranged to extend across the edge 230.

[0063] like Fig.10 As shown, the conductive film 400 of the present embodiment has an extension portion 420. More specifically, the number of the extension portions 420 is three. However, the present embodiment is not limited thereto. The number of the extension portions 420 may be three or more. The extension portions 420 are spaced apart from each other in the first direction or in the left-right direction. Figure 1 and Fig. 9 , in the predetermined area PA, the extension 420 and the second pad 250 are aligned in the first direction or the left-right direction. Each extension 420 extends from the main body 410 in the second direction. Specifically, each extension 420 extends forward from the main body 410 in the front-to-back direction. Each extension 420 extends from the main body 410 in the second direction over a predetermined position PP. Specifically, each extension 420 extends forward from the main body 410 in the front-to-back direction over a predetermined position PP. Figure 5 and Fig. 9 , the extension portion 420 is located between the outer conductor 330 and the circuit board 200 in the up-down direction or in a direction perpendicular to both the first direction and the second direction. The second pad 250 and the outer conductor 330 are connected to each other between the extension portions 420. More specifically, the second pad 250 and the outer conductor 330 are connected to each other between the extension portions 420 by the solder 500. However, the present invention is not limited thereto. The second pad 250 and the outer conductor 330 should be connected to each other at least between the extension portions 420.

[0064] like Fig. 9As shown, the conductive film 400 further includes a connecting portion 430. The connecting portion 430 extends in the first direction or the left-right direction. The connecting portion 430 connects the extension portions 420 to each other at a position away from the main body portion 410 in the second direction. Specifically, the connecting portion 430 connects the extension portions 420 to each other at a position away from the main body portion 410 in the front-to-back direction. The connecting portion 430 connects all the extension portions 420 to each other. Figure 5 As shown, the joint 430 is located in front of the predetermined position PP in the second direction or in the front-rear direction. The joint 430 is located between the outer conductor 330 and the circuit board 200 in the up-down direction or in a direction perpendicular to both the first and second directions.

[0065] like Fig.10 As shown, the main body 410, the extension 420 and the connecting portion 430 form two holes 460. In other words, the conductive film 400 has two holes 460. Each hole 460 penetrates the conductive film 400 in the up and down directions. However, the present invention is not limited to this. The conductive film 400 may not have the hole 460. If the conductive film 400 does not have the hole 460, the number of the extension 420 should be one.

[0066] like Figure 5 As shown, the inner space of the hole 460 is filled with solder 500 .

[0067] like Figure 1 As shown, the conductive film 400 also has an auxiliary extension portion 440. The auxiliary extension portion 440 has a flat plate shape perpendicular to the up-down direction. When the conductive film 400 is observed in the up-down direction, the auxiliary extension portion 440 has a rectangular shape extending in the first direction or the left-right direction. The auxiliary extension portion 440 does not have a hole that penetrates the conductive film 400 in the up-down direction. However, the present invention is not limited to this. The auxiliary extension portion 440 may have any shape. The auxiliary extension portion 440 extends from the main body portion 410 in the second direction beyond the predetermined position PP. Specifically, the auxiliary extension portion 440 extends forward from the main body portion 410 in the front-to-back direction beyond the predetermined position PP. As shown in FIG. Fig. 9 As shown, the middle portion 465 is located between the extension portion 420 and the auxiliary extension portion 440 in the first direction or the left-right direction. The middle portion 465 is located on the left side of the auxiliary extension portion 440 in the left-right direction.

[0068] Since the conductive film 400 of the present embodiment has the auxiliary extension 440, the ground connection between the ground layer of the circuit board 200 and the conductive film 400 is enhanced. Therefore, the antenna 220 can have further improved antenna characteristics.

[0069] like Figure 5 and Figure 6 As shown, the conductive film 400 further has an adhesive layer 470 and a release paper 480 .

[0070] like Figure 5 and Figure 6 As shown, the adhesive layer 470 of the present embodiment is disposed on the lower surface of the conductive film 400. The front portion of the adhesive layer 470 is bonded to the circuit board 200. In other words, the conductive film 400 is fixed to the circuit board 200 by the adhesive layer 470. More specifically, the conductive film 400 is fixed to the upper surface of the circuit board 200 via the adhesive layer 470. Before the conductive film 400 is bonded to the circuit board 200, the front portion of the adhesive layer 470 adhered to the circuit board 200 is covered by the release paper 480. Therefore, the front portion of the adhesive layer 470 is adhered to the circuit board 200 by: removing the release paper 480 from the adhesive layer 470 so that the front portion of the adhesive layer 470 is exposed to the outside of the conductive film 400; and adhering the exposed front portion of the adhesive layer 470 to the circuit board 200.

[0071] like Figure 6 As shown, the auxiliary extension 440 and the third pad 270 are connected to each other by the adhesive layer 470. However, the present invention is not limited thereto. Specifically, the auxiliary extension 440 may be directly connected to the third pad 270 by ultrasonic welding or the like, so that the adhesive layer 470 is not interposed between the auxiliary extension 440 and the third pad 270. Alternatively, the auxiliary extension 440 may be welded to the third pad 270. In other words, the auxiliary extension 440 may be directly connected to the third pad 270, or may be indirectly connected to the third pad 270 by a conductive member such as solder 500.

[0072] like Figure 5 and Figure 6 As shown, the release paper 480 of the present embodiment covers a portion of the lower surface of the adhesive layer 470. The conductive film 400 is connected to the grounding member 600 by: removing the release paper 480 from the adhesive layer 470 so that a portion of the adhesive layer 470 is exposed to the outside of the conductive film 400; and adhering the exposed portion of the adhesive layer 470 to the upper surface of the grounding member 600.

[0073] Hereinafter, an example of an assembling method of the antenna assembly 100 will be described in detail.

[0074] First, refer to Figure 5 , Figure 6 , Figure 8 and Fig.10 , the release paper 480 covering the front portion of the adhesive layer 470 is removed from the adhesive layer 470. Then, the front portion of the adhesive layer 470 is exposed to the outside of the conductive film 400. Next, the conductive film 400 is bonded to the upper surface of the circuit board 200 via the exposed front portion of the adhesive layer 470, so that the main body 410 is arranged to extend across the edge 230 of the circuit board 200. Therefore, the circuit board 200 and the conductive film 400 are in Figure 8 Status shown.

[0075] After that, the coaxial cable 300 is temporarily placed on the conductive film 400 bonded to the circuit board 200 so that the central conductor 310 is placed on the first pad 240 and the outer conductor 330 is placed on the second pad 250. Figure 1 In the predetermined area PA shown, the extension portion 420 and the second pad 250 are aligned in the first direction or the left-right direction. At the same time, each extension portion 420 extends from the main body portion 410 in the second direction or the front-back direction. Figure 1 Thereafter, the center conductor 310 and the first pad 240 are bonded to each other by the solder 500, and the outer conductor 330 and the second pad 250 are bonded to each other by the solder 500. Thus, the conductive film 400 is fixed to the circuit board 200, thereby completing the assembly of the antenna assembly 100.

[0076] In particular, in the above-mentioned assembly process, the conductive film 400 is bonded to the circuit board 200 so that the extensions 420 and the second pads 250 are aligned in the first direction in the predetermined area PA, and each extension 420 extends from the main body 410 in the second direction over the predetermined position PP. Therefore, when the conductive film 400 is fixed to the circuit board 200, the conductive film 400 has a portion of an increased size bonded to the circuit board 200. Therefore, the antenna assembly 100 of the present embodiment can facilitate the operation of fixing the conductive film 400 to the circuit board 200.

[0077] [Second embodiment]

[0078] like Fig.11 As shown, the electronic device 700A according to the second embodiment of the present invention includes an antenna assembly 100A and a ground member 600. Like the ground member 600 of the first embodiment, the ground member 600 of this embodiment is separate and apart from the antenna assembly 100A.

[0079] like Fig.11 As shown, the antenna assembly 100A according to the second embodiment of the present invention has Figure 1 The antenna assembly 100 shown has the same structure as the first embodiment described above. Figures 11 to 21 Components of the antenna assembly 100A shown as being the same as those of the antenna assembly 100 of the first embodiment are denoted by the same reference numerals as those of the antenna assembly 100 of the first embodiment. With respect to directions and orientations in this embodiment, the same expressions as those of the first embodiment will be used below.

[0080] like Fig.11As shown, the antenna assembly 100A of this embodiment includes a circuit board 200A, a coaxial cable 300 and a conductive film 400A. Specifically, the circuit board 200A is formed with an antenna 220. The coaxial cable 300 of this embodiment has the same structure as the coaxial cable 300 of the first embodiment. Therefore, its detailed description is omitted.

[0081] like Fig.21 As shown, the circuit board 200A has a first pad 240, a second pad 250 and an edge 230. The first pad 240 and the edge 230 of this embodiment have the same structure as the first pad 240 and the edge 230 of the first embodiment. Therefore, detailed description thereof is omitted.

[0082] like Fig.21 As shown, the second pad 250A of the present embodiment is arranged on the upper surface of the circuit board 200A. The first pad 240 and the second pad 250A are aligned in a first direction perpendicular to the up-down direction. The second pad 250A is located on the left side of the first pad 240 in the left-right direction. The second pad 250A is located near the left end of the circuit board 200A in the left-right direction. The second pad 250A is provided with a first portion 252 and a second portion 254.

[0083] like Fig. 20 As shown, the first portion 252 is a portion of the upper surface of the second pad 250A. The first portion 252 is located between the first pad 240 and the second portion 254 in the first direction or the left-right direction. Fig.16 As shown, the outer conductor 330 is connected to the first portion 252. The outer conductor 330 is soldered on the first portion 252. In other words, the outer conductor 330 is bonded to the first portion 252 by the solder 500.

[0084] like Fig. 20 As shown, the second portion 254 of the present embodiment is a portion of the upper surface of the second solder pad 250A. In other words, the first portion 252 and the second portion 254 are portions on the same upper surface of the second solder pad 250A. The second portion 254 is located to the left of the first portion 252 in the left-right direction. The second portion 254 is located near the left end of the circuit board 200A in the left-right direction. Fig.15 As shown, the outer conductor 330 is connected to the second portion 254. The outer conductor 330 is soldered on the second portion 254. In other words, the outer conductor 330 is bonded to the second portion 254 by the solder 500. More specifically, the base of the outer conductor 330 is bonded to the second portion 254 by the solder 500. As described above, since the outer conductor 330 is connected to the first portion 252, the outer conductor 330 is connected to both the first portion 252 and the second portion 254.

[0085] As described above, the base of the outer conductor 330 is bonded to the second portion 254 by the solder 500. This enables the outer conductor 330 to be firmly held by the second pad 250A. Therefore, even if the coaxial cable 300 soldered to the circuit board 200A is shaken, it is difficult for the outer conductor 330 to be detached from the second pad 250A.

[0086] Reference Fig.11 , the conductive film 400A of this embodiment is a copper tape. However, the present invention is not limited thereto. The conductive film 400A may be made of a conductive material other than a copper tape. The conductive film 400A is connected to the grounding member 600. The conductive film 400A is fixed to the circuit board 200A.

[0087] like Fig.21 As shown in FIG. 4 , the conductive film 400A has a main body portion 410 and an extension portion 420A. The main body portion 410 of this embodiment has the same structure as the main body portion 410 of the first embodiment. Therefore, a detailed description thereof is omitted.

[0088] like Fig. 20 As shown, the conductive film 400A of this embodiment has an extension portion 420A. More specifically, the number of the extension portions 420A is two. The extension portions 420A are separated from each other in the first direction or in the left-right direction. Each extension portion 420A extends from the main body portion 410 in the second direction. Specifically, each extension portion 420A extends forward from the main body portion 410 in the front-to-back direction. Each extension portion 420A is located on the right side of the second portion 254 in the left-to-right direction. Fig.11 and Fig. 20 In the predetermined area PA, the extension portion 420A and the second pad 250A are aligned in the first direction or the left-right direction. Each extension portion 420A extends from the main body 410 in the second direction beyond the predetermined position PP. Specifically, each extension portion 420A extends forward from the main body 410 in the front-to-back direction beyond the predetermined position PP. Fig.16 and Fig. 20 , the extension 420A is located between the outer conductor 330 and the circuit board 200A in the up-down direction or in a direction perpendicular to both the first direction and the second direction. The second pad 250A and the outer conductor 330 are connected to each other between the extensions 420A. More specifically, the second pad 250A and the outer conductor 330 are connected to each other between the extensions 420A by solder 500. However, the present invention is not limited thereto. The second pad 250A and the outer conductor 330 should be connected to each other at least between the extensions 420A.

[0089] like Fig. 20As shown, the conductive film 400A also has a connecting portion 430A. The connecting portion 430A extends in the first direction or the left-right direction. The connecting portion 430A connects the extension portions 420A to each other at a position away from the main body portion 410 in the second direction. Specifically, the connecting portion 430A connects the extension portions 420A to each other at a position away from the main body portion 410 in the front-to-back direction. The first portion 252 is located in an area AR surrounded by the extension portion 420A and the connecting portion 430A. The connecting portion 430A is located on the right side of the second portion 254 in the left-right direction. Fig.16 As shown, the joint portion 430A is located in front of the predetermined position PP in the second direction or in the front-rear direction. The joint portion 430A is located between the outer conductor 330 and the circuit board 200A in the up-down direction or in a direction perpendicular to both the first and second directions.

[0090] like Fig. 20 As shown, the main body 410, the extension 420A and the connecting portion 430A form a single hole 460A. In other words, the conductive film 400A has a single hole 460A. The hole 460A penetrates the conductive film 400A in the up and down directions. However, the present invention is not limited to this. The conductive film 400A may not have the hole 460A. If the conductive film 400A does not have the hole 460A, the number of the extension 420A should be one.

[0091] like Fig.16 As shown, the inner space of the hole 460A is filled with solder 50 .

[0092] Hereinafter, an example of an assembling method of the antenna assembly 100A will be described in detail.

[0093] First, refer to Fig.15 , Fig.16 , Fig.17 , Fig.19 and Fig.21 , the release paper 480 covering the front portion of the adhesive layer 470 is removed from the adhesive layer 470. Then, the front portion of the adhesive layer 470 is exposed to the outside of the conductive film 400A. Next, the conductive film 400A is bonded to the upper surface of the circuit board 200A via the exposed front portion of the adhesive layer 470, so that the main body 410 is arranged to extend across the edge 230 of the circuit board 200A. Therefore, the circuit substrate 200A and the conductive film 400A are in Fig.19 Status shown.

[0094] After that, the coaxial cable 300 is temporarily placed on the conductive film 400A bonded to the circuit board 200A so that the central conductor 310 is placed on the first pad 240 and the outer conductor 330 is placed on the second pad 250A. Fig.11In the predetermined area PA shown, the extension portion 420A and the second pad 250A are aligned in the first direction or the left-right direction. At the same time, each extension portion 420A extends from the main body 410 in the second direction or the front-back direction. Fig.11 Thereafter, the center conductor 310 and the first pad 240 are bonded to each other by the solder 500, and the outer conductor 330 and the second pad 250A are bonded to each other by the solder 500. Thus, the conductive film 400A is fixed to the circuit board 200A, thereby completing the assembly of the antenna assembly 100A.

[0095] In particular, in the above-mentioned assembly process, the conductive film 400A is bonded to the circuit board 200A so that the extensions 420A and the second pads 250A are aligned in the first direction in the predetermined area PA, and each extension 420A extends from the main body 410 in the second direction beyond the predetermined position PP. Therefore, when the conductive film 400A is fixed to the circuit board 200A, the conductive film 400A has a portion with an increased size bonded to the circuit board 200A. Therefore, the antenna assembly 100A of the present embodiment can facilitate the operation of fixing the conductive film 400A to the circuit board 200A.

[0096] [Third embodiment]

[0097] like Fig. 22 As shown, the electronic device 700B according to the third embodiment of the present invention includes an antenna assembly 100B and a ground member 600. Similar to the ground member 600 of the first embodiment, the ground member 600 of this embodiment is separate and apart from the antenna assembly 100B.

[0098] like Fig. 22 As shown, the antenna assembly 100B according to the third embodiment of the present invention has the same Figure 1 The antenna assembly 100 of the first embodiment shown above and Fig.11 The antenna assembly 100A of the second embodiment shown in FIG. 1 has the same structure as the antenna assembly 100A of the first embodiment. Fig. 22 and Fig.23 The components of the antenna assembly 100B shown in FIG. 1 are denoted by the same reference numerals as those of the antenna assembly 100 of the first embodiment. Figures 22 to 32 The components of the antenna assembly 100B shown in FIG. 1 are denoted by the same reference numerals as those of the antenna assembly 100A of the second embodiment. With respect to directions and orientations in this embodiment, the same expressions as those of the first embodiment will be used below.

[0099] like Fig. 22As shown, the antenna assembly 100B of this embodiment includes a circuit board 200B, a coaxial cable 300 and a conductive film 400B. Specifically, the circuit board 200B is formed with an antenna 220. The coaxial cable 300 of this embodiment has the same structure as the coaxial cable 300 of the first embodiment. Therefore, its detailed description is omitted.

[0100] Reference Fig.32 The circuit board 200B of this embodiment has an upper surface, a ground layer (not shown) and a through hole (not shown). Specifically, the upper surface faces the up-down direction. The ground layer is located below the upper surface in the up-down direction. The through hole is connected to the ground layer.

[0101] like Fig.32 As shown, the circuit board 200B has a first pad 240, a second pad 250A and an edge 230. The second pad 250A of this embodiment has the same structure as the second pad 250A of the second embodiment, and the edge 230 of this embodiment has the same structure as any one of the edges 230 of the above-mentioned embodiments. Therefore, detailed description thereof is omitted.

[0102] like Fig.32 As shown, the circuit board 200B further has a third solder pad 270B.

[0103] like Fig.32 As shown, the third pad 270B of the present embodiment is arranged on the upper surface of the circuit board 200B. The first pad 240, the second pad 250A and the third pad 270B are all located on the same surface of the circuit board 200B. The third pad 270B is located on the right side of the first pad 240 in the left-right direction. The first pad 240 is located between the second pad 250A and the third pad 270B in the first direction or the left-right direction. The third pad 270B is electrically connected to the second pad 250A. More specifically, the second pad 250A is connected to the ground layer through a through hole, and the third pad 270B is connected to the ground layer through a through hole. Therefore, the second pad 250A and the third pad 270B are electrically connected to each other through a through hole and a ground layer.

[0104] Reference Fig. 22 , the conductive film 400B of this embodiment is a copper tape. However, the present invention is not limited thereto. The conductive film 400B may be made of a conductive material other than a copper tape. The conductive film 400B is connected to the grounding member 600. Figure 26 to Figure 28 As shown, the conductive film 400B is fixed to the circuit board 200B. Unlike the conductive films 400 and 400A of the previous embodiments, the conductive film 400B does not have an adhesive layer 470 at the portion fixed to the circuit board 200B. Specifically, the conductive film 400B is fixed to the circuit board 200B so that the adhesive layer 470 is not interposed between the conductive film 400B and the circuit board 200B.

[0105] like Fig.31 As shown, the conductive film 400B has a main body 410, an extension 420A and a connecting portion 430A. The main body 410 of this embodiment has the same structure as the main body 410 of the first embodiment. Therefore, a detailed description thereof is omitted. The extension 420A and the connecting portion 430A of this embodiment have the same structure as the extension 420A and the connecting portion 430A of the second embodiment. Therefore, a detailed description thereof is omitted.

[0106] like Fig.31 As shown, the conductive film 400B further has an auxiliary extension portion 440B and an auxiliary connecting portion 450 .

[0107] like Fig.31 As shown, the number of auxiliary extensions 440B in this embodiment is three. The auxiliary extensions 440B are away from each other in the first direction. The third pad 270B is partially located between the auxiliary extensions 440B. Fig. 22 and Fig.28 It can be seen that each auxiliary extension 440B is soldered on the third pad 270B. Specifically, each auxiliary extension 440B is indirectly connected to the third pad 270B through a solder 500 used as a conductive member. Solder 500 is provided to connect the auxiliary extension 440B and the third pad 270B to each other. However, the present invention is not limited to this. The auxiliary extension 440B can be directly connected to the third pad 270B by means of ultrasonic welding or the like. In other words, the auxiliary extension 440B should be directly connected to the third pad 270B or indirectly connected to the third pad 270B through a conductive member further included in the antenna assembly 100B. This enables the ground plane of the antenna assembly 100B to be connected to the conductive film 400B, so that AC current can flow between the ground plane of the antenna assembly 100B and the conductive film 400B. In addition, this also enables the ground plane of the antenna assembly 100B to be connected to the conductive film 400B, allowing a DC current to flow between the ground plane of the antenna assembly 100B and the conductive film 400B. Therefore, the antenna 220 can have further improved antenna characteristics.

[0108] like Fig.31 As shown, the auxiliary connecting portion 450 of this embodiment extends in the first direction or the left-right direction. The auxiliary connecting portion 450 connects the auxiliary extension portions 440B to each other at a position away from the main body 410 in the second direction. Specifically, the auxiliary connecting portion 450 connects the auxiliary extension portions 440B to each other at a position away from the main body 410 in the front-to-back direction. The auxiliary connecting portion 450 connects all the auxiliary extension portions 440B to each other.

[0109] like Fig.31As shown, the main body 410, the auxiliary extension portion 440B and the auxiliary connecting portion 450 form two auxiliary holes 468. In other words, the conductive film 400B has two auxiliary holes 468. Each auxiliary hole 468 penetrates the conductive film 400B in the up and down directions. However, the present invention is not limited to this. The conductive film 400B may not have the auxiliary hole 468. If the conductive film 400B does not have the auxiliary hole 468, the number of the auxiliary extension portion 440B should be one.

[0110] like Fig.28 As shown, the inner space of each auxiliary hole 468 is filled with solder 500 .

[0111] Hereinafter, an example of an assembling method of the antenna assembly 100B will be described in detail.

[0112] First, refer to Fig.26 , Fig. 27 , Fig.28 , Fig.30 and Fig.32 , the conductive film 400B is temporarily placed on the upper surface of the circuit board 200B by using a positioning jig (not shown) so that the main body 410 is arranged to extend across the edge 230 of the circuit board 200B. Fig.30 Status shown.

[0113] Next, the coaxial cable 300 is temporarily placed on the conductive film 400B, wherein the conductive film 400B is temporarily placed on the circuit board 200B, so that the center conductor 310 is placed on the first pad 240 and the outer conductor 330 is placed on the second pad 250A. Fig. 22 In the predetermined area PA shown, the extension portion 420A and the second pad 250A are aligned in the first direction or the left-right direction. At the same time, each extension portion 420A extends from the main body 410 in the second direction or the front-back direction. Fig. 22 The predetermined position PP shown is shown. After that, the center conductor 310 and the first pad 240 are bonded to each other by the solder 500, the outer conductor 330 and the second pad 250A are bonded to each other by the solder 500, and the auxiliary extension 440B and the third pad 270B are bonded to each other by the solder 500. Thus, the conductive film 400B is fixed to the circuit board 200B, thereby completing the assembly of the antenna assembly 100B.

[0114] In particular, in the above-mentioned assembly process, the conductive film 400B is temporarily placed on the circuit board 200B so that the extension portion 420A and the second pad 250A are aligned in the first direction in the predetermined area PA, and each extension portion 420A extends from the main body portion 410 over the predetermined position PP in the second direction. Therefore, when the conductive film 400B is fixed to the circuit board 200B, the conductive film 400B has a portion of increased size temporarily placed on the circuit board 200B. Therefore, the antenna assembly 100B of the present embodiment can facilitate the operation of fixing the conductive film 400B to the circuit board 200B.

[0115] Although the present invention has been specifically described above with reference to the embodiments, the present invention is not limited thereto, and various modifications and alternative forms may be made. In addition, the above-described embodiments and modifications may also be combined.

[0116] While there have been described what are considered to be preferred embodiments of the present invention, those skilled in the art will recognize that other and further modifications may be made thereto without departing from the spirit of the invention, and it is intended to claim all such embodiments that fall within the true scope of the invention.

Claims

1. An antenna assembly, comprising a circuit board formed with an antenna, a coaxial cable and a conductive film, wherein: The circuit board has an edge, a first pad and a second pad; The coaxial cable comprises a central conductor, an insulator, an outer conductor and an outer cover; The central conductor is connected to the first pad; The outer conductor is insulated from the central conductor by the insulator; The outer conductor has an exposed portion, the exposed portion being exposed from the outer cover at a predetermined area; The exposed portion extends in a first direction; The exposed portion is connected to the second pad; In a second direction perpendicular to the first direction, the center of the coaxial cable is located at a predetermined position; The conductive film is separate and formed separately from the circuit board, and is fixed on the circuit board; The conductive film has a main body portion and at least one extension portion; In the predetermined area, the at least one extension portion and the second pad are aligned in the first direction; and The at least one extension portion extends from the main body portion beyond the predetermined position in the second direction.

2. The antenna assembly according to claim 1, wherein: The at least one extension comprises a plurality of extensions; The plurality of extensions are arranged to be away from each other in the first direction; The conductive film further comprises a connecting portion; The connecting portion connects the plurality of extension portions to each other at a position away from the main body portion in the second direction; and The second pad and the outer conductor are connected to each other at least between the plurality of extension portions.

3. The antenna assembly according to claim 2, wherein: The at least one extension comprises three or more extensions; and The connecting portion connects all the extending portions to each other.

4. The antenna assembly according to claim 2, wherein: The second pad is provided with a first portion and a second portion; The first portion is located between the first pad and the second portion in the first direction; The first portion is located within a region surrounded by the plurality of extension portions and the connecting portion; and The outer conductor is connected to both the first portion and the second portion.

5. The antenna assembly of claim 1, wherein: The center conductor is soldered to the first pad; and The outer conductor is soldered to the second pad.

6. The antenna assembly of claim 1, wherein: The circuit board also has a third solder pad; The first pad is located between the second pad and the third pad in the first direction; The third pad is electrically connected to the second pad; The conductive film also has at least one auxiliary extension; The at least one auxiliary extension portion extends from the main body portion beyond the predetermined position in the second direction; and The at least one auxiliary extension is directly connected to the third pad or is indirectly connected to the third pad via a conductive member further included in the antenna assembly.

7. The antenna assembly of claim 6, wherein: The at least one auxiliary extension is soldered to the third solder pad; and Solder is used as the conductive member.

8. The antenna assembly of claim 7, wherein: The at least one auxiliary extension comprises a plurality of auxiliary extensions; The plurality of auxiliary extensions are arranged to be away from each other in the first direction; The conductive film also has an auxiliary connecting portion; The auxiliary connecting portion connects the plurality of auxiliary extension portions to each other at a position away from the main body portion in the second direction; The third pad is partially located between the plurality of auxiliary extensions; and Solder is provided to connect the auxiliary extension and the third pad to each other.

9. The antenna assembly according to claim 1, wherein: The main body portion is arranged to extend across the edge.

10. The antenna assembly of claim 1, wherein: The conductive film has an adhesive layer; and The conductive film is fixed to the circuit board through the adhesive layer.

11. The antenna assembly of claim 1 , wherein: The conductive film has an adhesive layer; and The conductive film is fixed to the circuit board so that the adhesive layer is not interposed between the conductive film and the circuit board.

12. An electronic device comprising the antenna assembly and a ground member according to claim 1, wherein: The ground member is separate and apart from the antenna assembly; and The conductive film is connected to the ground member.

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