Portable Electronic Devices

Abstract

The present disclosure relates to a portable electronic device that may include a housing defining an aperture and a display positioned in the aperture. The display and the housing may define an internal volume and a speaker assembly may be positioned in the internal volume. The speaker assembly may include a speaker housing sealed to the housing within the internal volume, the speaker housing and the housing defining a speaker volume; and a speaker module in fluid communication with the speaker volume, the speaker module including a diaphragm positioned at the aperture defined by the speaker volume, the diaphragm defining a plurality of ridges.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This patent application claims priority to U.S. Provisional Patent Application No. 63 / 004,191, filed on April 2, 2020, entitled “PORTABLE ELECTRONIC DEVICE,” the entire disclosure of which is hereby incorporated by reference into this document. Technical Field

[0003] The embodiments described herein generally relate to electronic devices. More particularly, examples of the invention relate to portable electronic device components, systems, and architectures. Background Art

[0004] Electronic devices are ubiquitous in society and can take many forms, from watches to computers. Electronic devices, including portable electronic devices such as handheld phones, tablet computers, and watches, typically include a type of housing or casing that houses internal components.

[0005] Components of an electronic device, such as processors, memory, cooling devices, input components and other components may partially determine the available functionality and performance level of the electronic device. In addition, the arrangement of these components and their related systems relative to each other in the device may also determine the performance level of the electronic device.

[0006] Continuous advancements in electronic devices and their components have resulted in considerable performance improvements as well as new uses and functions. However, existing components and structures of electronic devices may limit the performance level of such devices. For example, conventional arrangements of components in existing electronic device architectures and conventional designs of the components themselves may limit the performance of electronic devices by failing to effectively distribute or remove heat generated by components of the electronic device. In addition, the design of components and their arrangement may also affect other characteristics of the device, such as the overall size of the device, the amount of noise generated by the device, the specific function of the device, and the cost of manufacturing the device. Therefore, it may be desirable to further customize and arrange the components of electronic devices to provide additional or enhanced functionality without introducing or adding undesirable device characteristics. Summary of the invention

[0007] According to some aspects of the present disclosure, an electronic device may include a housing defining a hole, a display assembly positioned in the hole, and an antenna, the antenna comprising: an antenna circuit; a resonant structure comprising a sheet of conductive material disposed between the housing and the display assembly, the resonant structure electrically coupled to the antenna circuit; and a conductive shunt disposed between the resonant structure and the housing.

[0008] In some examples, the conductive shunt includes a metal. The conductive shunt may include a ferrous metal. The shunt may be capacitively coupled to the antenna circuit. The antenna circuit may include a WI-FI antenna. The antenna circuit may operate at a frequency of at least one of 2.4 GHz or 5 GHz. The conductive shunt may be part of an accessory sensing circuit.

[0009] According to some examples, an electronic device may include a housing defining an aperture; a display positioned in the aperture, the display and the housing defining an interior volume; and a speaker assembly disposed in the interior volume, the speaker assembly including a speaker housing sealed to the housing within the interior volume. The speaker housing and the housing may define a speaker volume. A speaker module may be in fluid communication with the speaker volume, the speaker module may include a diaphragm positioned at the aperture defined by the speaker volume, the diaphragm defining a plurality of ridges.

[0010] In some examples, the device may also include a compressible material disposed on the speaker housing and opposite to a surface of the speaker housing defining the speaker volume. The compressible material may include foam. The compressible material may at least partially surround the hole defined by the speaker volume. The compressible material may contact a surface of the display that at least partially defines the internal volume. The compressible material may include a first portion positioned adjacent to a first side of the hole and a second portion separated from the first portion and positioned adjacent to a second side of the hole. The diaphragm may have a length and a width, with a plurality of ridges spaced apart along the length. The diaphragm may define between 5 and 15 ridges.

[0011] According to some examples, an audio component may include a speaker housing that at least partially defines a speaker volume and an aperture, a speaker module that is in fluid communication with the speaker volume and positioned at the aperture, and a passive radiator that is disposed in the speaker volume and defines an opening. A portion of the speaker housing may extend through the opening to attach the passive radiator to the speaker housing.

[0012] In some examples, the passive radiator includes a plate defining a perforation. The plate may include metal. The speaker housing may include a polymer material. The portion of the speaker housing extending through the opening may be deformed after passing therethrough to define a structure that secures the passive radiator to the housing. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0014] Figure 1A A front view of the electronic device is shown.

[0015] Figure 1B Shows Figure 1A view of different electronic devices.

[0016] Figure 1C Shows Figure 1A A cross-sectional view of an electronic device.

[0017] Figure 2 An exploded view of the electronic device is shown.

[0018] Figure 3A Shows Figure 2 A close-up view of an area of ​​an electronic device.

[0019] Figure 3B Shows Figure 1A A close-up perspective view of an area of ​​an electronic device.

[0020] Figure 3C Shows Figure 3B Close-up top view of the area.

[0021] Figure 4A A top close-up view of an area of ​​an electronic device is shown.

[0022] Figure 4B A perspective close-up view of an area of ​​an electronic device is shown.

[0023] Figure 5A A cross-sectional view of a portion of an electronic device is shown.

[0024] Figure 5B A cross-sectional view of a portion of an electronic device is shown.

[0025] Fig. 6A A close-up view of an area of ​​an electronic device is shown.

[0026] Figure 6B A close-up view of an area of ​​an electronic device is shown.

[0027] Fig. 7A A cross-sectional view of a portion of an electronic device is shown.

[0028] Figure 7B A cross-sectional view of a portion of an electronic device is shown.

[0029] Figure 8 A cross-sectional side view of a loudspeaker housing is shown.

[0030] Fig. 9A An enlarged front view of an electronic device is shown.

[0031] Fig. 9B Shows Fig. 9A A cross-sectional side view of an electronic device.

[0032] Fig. 9C An exploded perspective view of a speaker assembly is shown.

[0033] Fig.9D Shows Fig. 9A view of speaker assembly of electronic device.

[0034] Fig.9E Shows Fig. 9A view of speaker assembly of electronic device.

[0035] Fig. 10A An enlarged front view of an electronic device is shown.

[0036] Fig. 10B Shows Fig. 10A A cross-sectional side view of an electronic device.

[0037] Fig.11A An exploded perspective view of a speaker assembly is shown.

[0038] Fig. 11B Shows Fig. 10A view of speaker assembly of electronic device.

[0039] Fig. 12A A top view of a portion of a speaker assembly is shown.

[0040] Fig. 12B Shows Fig. 12A A cross-sectional side view of a loudspeaker assembly.

[0041] Fig. 12C Shows Fig. 12A A cross-sectional side view of a loudspeaker assembly.

[0042] Fig.13A A front view of a component of a speaker assembly is shown.

[0043] Fig. 13B Shows Fig.13A Exploded view of the components.

[0044] Fig.14A An enlarged partial front view of an electronic device is shown.

[0045] Fig. 14B Shows Fig.14A An enlarged partial front view of an electronic device.

[0046] Fig.15A A close-up view of components of one area of ​​an electronic device is shown.

[0047] Fig. 15B Shows Fig.15A A cross-sectional side view of a region of an electronic device.

[0048] Fig. 15C Shows Fig.15A Top view of the components of the area.

[0049] Fig.15D Shows Fig.15A Top view of the components of the area.

[0050] Fig.15E Shows Fig.15A Top view of the components of the area.

[0051] Fig.16 A close-up view of a component of an area of ​​an electronic device is shown.

[0052] Fig.17 A close-up view of a portion of an electronic device is shown.

[0053] Fig.18A A fingerprint image is shown.

[0054] Fig.18B A close-up view of a user's appendage in contact with an electronic device is shown.

[0055] Fig.18C A graph of capacitance versus distance of a sensor of an electronic device is shown.

[0056] Fig.19A A cross-sectional view of an electronic device is shown.

[0057] Fig.19B An exploded view of components of an electronic device is shown.

[0058] Fig.19C A close-up view of an area of ​​an electronic device is shown.

[0059] Fig. 20 A close-up view of an area of ​​an electronic device is shown. DETAILED DESCRIPTION

[0060] This specification provides examples and does not limit the scope, applicability or configuration set forth in the claims. Therefore, it should be understood that the functions and arrangements of the elements discussed may be changed without departing from the spirit and scope of the present disclosure, and various embodiments may appropriately omit, replace or add other programs or components. For example, the described method may be performed in an order different from the order described, and various steps may be added, omitted or combined. In addition, in other embodiments, the features described with respect to some embodiments may be combined.

[0061] According to one aspect of the present disclosure, a portable electronic device may include a housing that at least partially defines an internal volume. A display may be coupled to the housing and may be covered by a cover that, together with the housing, defines the internal volume of the device. The device may include multiple components that may provide desired functionality and performance levels. For example, the device may include multiple speaker assemblies, each of which may include a rear volume defined by a speaker housing, including a five-sided box sealed to the housing. The rear volume of the speaker may be transplanted into the internal volume of the device, rather than directly into the surrounding environment, to provide a surround sound type experience. In addition, the rear volume of the speaker may also act as an antenna volume to provide enhanced antenna performance, thereby wirelessly connecting the device to one or more other devices or components. In some examples, the device may also include a biometric component for authenticating a user. The biometric component may be incorporated into an existing input component (such as a button).

[0062] The architecture and components of electronic devices (including portable electronic devices) described herein can allow electronic device configurations that can maximize performance and provide multiple desired functions. In traditional electronic device configurations (such as portable devices with traditional designs), individual components may have only one function and may not be able to share space in the internal volume of the device with other components. In addition, component performance can be affected in traditional device configurations because single-function components may need to be formed into undesirable configurations to allow them to be included in the device. In contrast, as described herein, the multifunctional components of the device and the location of one or more components relative to other components and the device itself can allow for desired performance levels and desired user experiences.

[0063] The following will refer to Figures 1A to 20 However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be interpreted as limiting.

[0064] Figure 1A An electronic device 100 , such as a tablet computing device, is depicted. Figure 1A The tablet computer of is only one representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of portable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device, a consumer device, or simply a device.

[0065] The electronic device 100 includes a housing 102 that at least partially surrounds a display 104. The housing 102 may at least partially define an interior volume that may enclose or partially enclose the display and other internal components of the electronic device 100. The housing 102 may be formed of one or more pieces that are operably connected together, such as a front piece and a rear piece. Alternatively, the housing 102 may be formed of a single piece that is operably connected to the display 104.

[0066] Display 104 may provide visual output to a user. Display 104 may include any suitable display technology, including but not limited to liquid crystal display elements, light emitting diode elements, organic light emitting display elements, organic electroluminescent elements, and the like.

[0067] Cover sheet 108 may be positioned over the front surface (or a portion of the front surface) of electronic device 100. In some examples, at least a portion of cover sheet 108 may sense touch input and / or force input. Cover sheet 108 may be formed using any suitable material (such as glass, plastic, sapphire, or a combination thereof). In some examples, touch input and force input may be received by a portion of cover sheet 108 that covers display 104. In some examples, touch input and / or force input may be received across other portions of cover sheet 108 and / or portions of housing 102. Cover sheet 108 and housing 102 may together define an interior volume of electronic device 100.

[0068] The various layers of the display stackup, such as the cover sheet 108, the display 104, the touch sensor layer, the force sensor layer, etc., may be adhered together using an adhesive and / or may be supported by a common frame or portion of the housing 102. The common frame may extend around the perimeter or a portion of the perimeter of the layers, may be segmented around the perimeter or a portion of the perimeter, or may be coupled to the various layers of the display stackup in another manner.

[0069] In some examples, each of the layers of the display stack can be attached or deposited on a separate substrate, which can be laminated or bonded to each other. The display stack can also include other layers for improving the structural or optical performance of the display 104, including, for example, polarizer sheets, color masks, etc. In addition, the display stack can include a touch sensor layer and / or a force sensor layer for receiving input on the cover sheet 108 of the electronic device 100.

[0070] In many cases, the electronic device 100 may also include a processor, memory, a power source and / or battery, a network connection, sensors, input / output ports, acoustic components, tactile components, digital circuits and / or analog circuits for performing and / or coordinating tasks of the electronic device 100, as described herein. For simplicity of illustration, Figure 1A and Figure 1B102, each of which may be partially and / or completely included within housing 102. Electronic device 100 may also include one or more input components, such as input component 106. In some examples, input component 106 may include a button, such as a power button or a sleep / wake button. In some examples, input component 106 may have additional functionality and may, for example, include a biometric input component 106, as described herein.

[0071] Figure 1B Depicted Figure 1A 100. The electronic device 100 may include a biometric input component 106, which may be partially or completely recessed within the housing 102. The electronic device 100 may include a number of openings defined by the housing 102. For example, the electronic device 100 may include an opening 103 that allows one or more audio modules disposed in the internal volume of the electronic device 100 to emit acoustic energy from the electronic device 100. The housing 102 may also define other openings or holes that may allow components of the electronic device 100 to communicate with the surrounding environment or receive information from the surrounding environment. For example, the housing 102 may define a hole that may receive a camera or imaging module 109.

[0072] Figure 1C 1 shows a cross-sectional view of the electronic device 100 taken along the line indicated in the figure. It can be seen that Figure 1C The housing 102 of the electronic device 100 and various internal components at least partially disposed in the internal volume defined by the housing 102 are shown. In addition to components such as a processor, memory, power supply and / or battery, the electronic device 100 may also include components that can provide the electronic device 100 with desired performance levels and functions. In some examples, the electronic device 100 may include a first speaker assembly 110A and a second speaker assembly 110B, as further described herein. The device 100 may also include one or more wireless antennas, for example to wirelessly transmit information between the device 100 and one or more other devices. In some examples, the device may include at least a first antenna assembly 112, a second antenna assembly 120, and a third antenna assembly 121. The electronic device 100 may also include one or more input components, such as an input component 106 that may also serve as a biometric component, as described herein.

[0073] In some examples, the antenna assembly may include one or more electrical grounding features or components, as further described herein. For example, the second antenna assembly 120 may include features or components that may ground at least a portion of the second antenna assembly 120 to the housing 102. These components and features may be grounded relative to the lower housing 102. Figure 5A and Figure 5Bto be described. In some examples, the second antenna assembly 120 may also include one or more features, such as a spring contact finger 123, which may provide electrical coupling to one or more other components of the device 100, for example to provide grounding to the one or more other components. In some examples, the second antenna assembly 120 may include a spring contact finger 123, which may be electrically coupled to a display assembly, which may cover the second antenna assembly 120, as described herein. In some examples, the spring contact finger 123 may make electrical contact with a surface of the display assembly, such as making electrical contact with a surface of the display assembly that at least partially defines the interior volume of the device 100. In some examples, the spring contact finger 123 may be soldered to the second antenna assembly 120, connected via surface mount technology (SMT), or coupled using any other technique as desired.

[0074] In some examples, the third antenna assembly 121 can include some or all of the electrical grounding features or components of any antenna assembly described herein, including the second antenna assembly 120. In some examples, the third antenna assembly 121 can include a spring contact finger 125 that can provide electrical coupling to one or more other components of the device 100, for example, to provide grounding to the one or more other components. In some examples, the second antenna assembly 120 can include a spring contact finger 123 that can be electrically coupled to a display assembly that can cover the second antenna assembly 120, as described herein. In some examples, the spring contact finger 123 can make electrical contact with a surface of the display assembly, such as a surface of the display assembly that at least partially defines an interior volume of the device 100. In some examples, the third antenna assembly 121 can include one or more features that can be electrically coupled to the housing 102, such as a ground plate or tab, for example, as provided relative to the housing 102. Figure 4B described.

[0075] Any number or types of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding engagement features and retention features, may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. Figures 2 to 7B Various examples of electronic devices are described that include components, such as wireless antennas, having various features in various arrangements.

[0076] Modern electronic devices such as smart phones, tablets, etc. are often combined with wireless communication hardware (e.g., antennas and related circuits). Traditionally, the housing of an electronic device is at least partially constructed of a material that acts as a transparent material for radio frequency (RF) signals. These RF transparent portions may be referred to as RF windows or RF openings. These materials are generally less rigid than other RF opaque materials and are therefore prone to breakage or cracking in the event of an accidental drop of the electronic device. In addition, electronic devices with housings made of plastic or other RF transparent materials are not attractive to consumers in appearance. However, consumers want the housing of the electronic device to be attractive in appearance and more durable than a housing that may be provided with an RF window. One aspect of the present disclosure relates to a housing section that is coupled to an antenna circuit to act as an antenna. A non-limiting example of a housing configured to act as an antenna is described in U.S. Patent Application Publication 2020 / 0073445, published on March 5, 2020, the disclosure of which is hereby incorporated by reference in its entirety.

[0077] Figure 2 An electronic device 200 according to an example is shown. The electronic device 200 includes a cover 204, a display 206, and a housing 208. The cover 204 may be at least partially transparent and define an input surface of the electronic device 200 by including a touch sensor and / or a force sensor. The display 206 may be at least partially covered by the cover 204 and define an output area in which a graphical output is presented to a user via a liquid crystal display (LCD), an organic light emitting diode display (OLED), or any other suitable component or display technology. The cover 204 and the display 206 may be positioned within the housing 208.

[0078] The housing 208 may include molded elements 210 positioned within gaps, spaces, slots, or other areas between portions of housing segments 212. The housing segments 212 may define portions of the exterior surfaces of the electronic device 200, such as portions of the side walls and rear walls of the housing 208. The housing segments 212 may include conductive materials, such as metals (e.g., aluminum, steel, stainless steel, titanium, amorphous alloys, magnesium, or other metals or alloys), carbon fibers, etc. The molded elements 210 may be formed of, or include, substantially non-conductive materials or electrically insulating materials. Thus, the housing segments 212 between the molded elements 210 may act as antennas for the electronic device 200. Reference will be made below to the description of the molded elements 210. FIG. 3A to FIG. 3C Provide more details of the shell.

[0079] Figure 3A A partial view of housing 208 is shown according to one example. Figure 3AThe housing 208 shows a molded element 210 extending along the length of the housing segment 212. The housing segment 212 can be electrically coupled to an antenna circuit (not shown) to form an antenna. For example, the antenna circuit can be connected to the housing segment 212 at a first connection point 214 and a second connection point 216. In some cases, the first connection point 214 is coupled to an electrical ground and the second connection point 216 is coupled to an antenna feed (e.g., an electromagnetic signal source that sends wireless signals to the housing segment 212, and / or a circuit that receives and / or analyzes electromagnetic signals received by the housing segment 212). A conductive path 218 can be defined between the connection points 214, 216, which corresponds to a conductive path corresponding to an electromagnetic component of a transmitted or received wireless communication signal. Figure 3B Shows Figure 1A A close-up perspective view of an area of ​​an electronic device.

[0080] Figure 3B A partial view of housing 208 is shown according to another example. Figure 3B The housing 208 of FIG. 20 shows a molded element 210 extending along the length of the first housing segment 212 and the second housing segment 213. The housing segments 212, 213 can be separated and electrically isolated from each other. In some examples, the molded element 210 can engage the first and second housing segments 212, 213 with each other while maintaining electrical isolation of the housing segments 212, 213. One or both of the housing segments 212, 213 can be connected to an antenna circuit, as described herein. In addition, the molded element 210 can interlock with recesses, holes, protrusions, and / or other features of the housing segments 212, 213 to mechanically engage the housing segments 212, 213 with each other.

[0081] In some examples, the electrically isolated structure of the housing segments 212, 213 can allow antennas electrically coupled to those segments 212, 213 to operate over a wider frequency band than antennas connected to a single-piece housing structure. In some examples, one or more electrical components can be used to electrically couple the first housing segment 212 to the second housing segment 213 at one or more desired locations. In some examples, the one or more electrical components can have substantially any combination of resistance, capacitance, and / or inductance as desired, and can be selected to optimize antenna performance and / or bandwidth. In some examples, the one or more electrical components that electrically connect the first housing segment 212 to the second housing segment 213 can act as an electrical short circuit in the low frequency band and act as an electrical open circuit in the high frequency band, thereby allowing low frequency band antennas and high frequency band antennas to be coupled to one or more of the same housing segments 212, 213 as desired, while still having different antenna path lengths and / or different resonant frequencies. In some examples, one or more electrical components electrically connecting first housing segment 212 to second housing segment 213 may have a first resistance, capacitance, and / or inductance value for a first frequency band range and a second different resistance, capacitance, and / or inductance value for a second different frequency band range.

[0082] In some examples, such as Figure 3B As shown, one or more areas or portions of the shell segments 212 , 213 adjacent or neighboring the molded segment 210 may be recessed or depressed relative to other portions of the shell segments 212 , 213 . Figure 3C Shows Figure 3B The same area of ​​the housing 208 shown includes a structural member 215 coupled to the first housing segment 212 and the second housing segment 213. In some examples, the size and shape of the structural member 215 can be set to correspond to the recessed or recessed portion of the first housing segment 212 and the second housing segment 213. In some examples, the structural member 215 can include an electrically insulating material, such as a polymer material, a ceramic material, and / or a polymer and ceramic composite material. In this way, the structural member 215 can mechanically engage, retain, or assist in retaining the first housing segment 212 to the second housing segment 213 without electrically coupling the housing segments 212, 213 to each other through the structural member 215. In some examples, the structural member 215 can be coupled to the housing segments 212, 213 by any desired technique, including fasteners, screws, adhesives, or combinations thereof. Although shown with respect to a single corner or portion of housing 208, in some examples, any number and location of areas of housing 208 may include electrically isolated sections that may be joined by molded sections 210 and / or structural elements 215. FIG. 4A to FIG. 4B Provide additional details of the electronic device.

[0083] Figure 4AShows that Figure 1C The electronic devices shown are substantially similar and may include Figure 1C A close-up view of an upper right region of an electronic device of some or all of the features of the electronic device shown. The device may include ground plates 220 and 221 that may be electrically coupled to one or more electrical components of the electronic device and housing 212. As shown, ground plates 220, 221 may also be coupled to housing section 212 at one or more tabs 222.

[0084] Figure 4B A close-up perspective view of the ground plate 220 is shown, including a first connection point (similar to Figure 3A A first connection point 214 coupled to ground in the Figure 4B , a first connection point is represented as a ground plate 220 having first and second tabs 222, 224 that interface with the housing segment 212 to ground the housing segment 212. The first tab 222 of the ground plate 220 may extend vertically or substantially vertically from the ground plate 220. The first tab 222 may interface with or otherwise couple with an insert 226 that is at least partially positioned within a recess 228 formed by the housing segment 212. The insert 226 may be attached to the housing segment 212, for example, by laser welding or another coupling process that provides sufficient electrical conductivity between the housing segment 212 and the insert 226.

[0085] The insert 226 may include an electrically conductive material, such as a metal (e.g., aluminum, steel, stainless steel, titanium, an amorphous alloy, magnesium, or other metal or alloy), or have a metal plating attached to an outer surface of the insert 226. The insert 226 may be received within a recess 228 of the housing segment 212 such that the insert 226 is flush with the housing segment 212 (i.e., the insert 226 does not protrude from the housing segment 212). For example, the insert 226 may include a flat top surface that defines an overhang or flange that contacts the recess 228 within the housing segment 212. The insert 226 may also include a threaded hole 230 (see FIG. 230 ) for receiving a fastener. Figure 5A ,Right now Figure 1C Cross-sectional view at the indicated location).

[0086] In some examples, using insert 226 to allow ground plate 220 to be electrically connected to a component or portion of the device (such as housing segment 212) can allow the grounding location to be selected independently of other structural features or considerations of housing segment 212. Thus, the length of the path to be grounded can be highly controlled as desired and can be selected to optimize the efficiency and / or performance of one or more components (such as an antenna). In some examples, the location and / or design of one or more grounding components (such as insert 226) can allow the location of the component to be selected to provide a more robust contact with other components (such as a display module that can cover insert 226).

[0087] The second tab 224 may extend from the ground plate 220 at an angle between about 30 degrees and about 60 degrees (such as about 45 degrees) and may be coupled directly to the housing segment 212 (i.e., coupled to the housing segment 212 without using an insert 226). Figure 5A and Figure 5B As shown, the first and second tabs 222, 224 can be coupled to the housing 208, for example, by fasteners 232. In some examples, each fastener 232 can extend through a corresponding hole 234, 236 in the first and second tabs 222, 224 to retain the first and second tabs 222, 224 to the housing segment 212. As described herein, the insert 226 can define a threaded hole 230 to receive and retain the fastener 232. Thus, the first tab 222 can be retained to the insert 226 between the insert 226 and the head of the fastener 232. The housing segment 212 can define a threaded angled hole 238 to receive and retain the fastener 232 extending through the second tab 224. For example, the threaded angled hole 238 can be machined along a longitudinal axis perpendicular to the second tab 224.

[0088] like Figure 5B ,Right now Figure 1C As shown in the cross-sectional view at the indicated location, the threaded angled hole 238 occupies a significant portion of the housing segment 212. Therefore, additional features such as channels, through holes, slots, etc. cannot extend along the housing segment 212 to which the second tab 224 is attached. However, the insert 226 provides a coupling mechanism that does not occupy a significant portion of the housing segment 212. Figure 5AAs shown, the insert 226 allows a hole, channel, slot, etc. to be formed in the housing segment 212 in which the first tab 222 is attached. For example, a hole 240 for an audio output device (e.g., a speaker, see speaker cover 242) can be formed in the housing segment 212. In addition, coupling the housing segment 212 to the first tab 222 using the insert 226 requires less space in the housing 212 because the first tab 222 extends perpendicular to the ground plane 220 and is therefore positioned closer to the housing segment 212 than the non-perpendicular second tab 224. Therefore, the first tab 222 occupies less space in the housing 208 and thus provides additional space in the housing 208 for other components of the electronic device 200. Since space in the housing 208 is limited, freeing up additional space via the first tab 222 and the insert 226 provides significant design and performance advantages.

[0089] Fig. 6A An example of a second connection point (coupled to the antenna feed 218) is shown. The second connection point may include an insert 226 electrically and / or mechanically coupled to the housing segment 212. In some examples, the insert 226 may be attached to the housing segment 212 via laser welding or another process that provides conductivity between the insert 226 and the housing segment 212. In some examples, one or more components or portions of the antenna feed 218 may then be electrically coupled to the housing segment 212 and / or other components of the device to provide electrical grounding and allow these features to act as the radiating body of the antenna. For example, the antenna feed 218 may include a grounding portion or grounding braid 217, a non-conductive coating 216, and a conductive core 215. The non-conductive coating 216 may provide electrical insulation between the grounding portion 217 and the conductive core 215, for example, to electrically isolate these portions from each other. In some examples, the grounding portion 217 may be electrically coupled to the housing 212 at a first position or portion, which may be electrically isolated from a second position or portion of the conductive core 215 to which it is electrically coupled. In some examples, this configuration may allow one or both of these portions of the housing segments and components in electrical communication therewith to function as radiating components of an antenna.

[0090] As can be seen, component 304 may include a first portion or bracket 306 that may be in electrical communication with both the ground braid 217 and a portion of the housing 212. For example, the first bracket 306 may define one or more holes, and a fastener 314 may extend through the hole to electrically and mechanically couple the first bracket 306 to the housing 212. A second portion or bracket 308 may be in electrical communication with the first bracket 306 and may be electrically and mechanically coupled thereto. For example, the second bracket 308 may define one or more holes that align with the one or more holes defined by the first bracket 306. Fasteners, such as fasteners 312, may extend through the holes defined by the first and second brackets 306, 308 and may be received by the housing 212 to electrically and / or mechanically couple the brackets thereto.

[0091] In some examples, one or more surfaces of the second bracket 308 may include a non-conductive coating and / or an insulating coating 310 to prevent undesired electrical contact between the second bracket 308 and other components of the device. In some examples, the second bracket 308 may also be electrically coupled to one or more components of the device as needed so that the ground braid 217 is electrically coupled to those components. For example, the electronic device may include a display assembly that can cover the second bracket 308, as described herein. The second bracket 308 may be electrically coupled to or in contact with a surface of a display assembly (not shown). In some examples, the second bracket 308 may be in electrical contact with a surface of the display assembly that at least partially defines the internal volume of the device. In this way, some or all of the display assemblies may define the antenna volume of the antenna.

[0092] In some examples, the conductive core 215 can be electrically coupled to another portion of the housing 212, such as through the insert 226, as described herein. In some examples, a component or tab 302 can be electrically and / or mechanically coupled to the insert 226 and the conductive core 215. In some examples, the tab 302 can define a hole and can be coupled to the insert 226 using a fastener, such as a screw 232, which passes through the hole and is retained by the insert 226. The tab 302 can also include a crimped portion 303 that can mechanically retain the non-conductive coating 216 and the conductive core 215 in a desired position relative to the tab 302. In some examples, the conductive core 215 can be electrically coupled to the tab 302 and can be soldered, welded, brazed, or otherwise mechanically coupled to the tab 302. By electrically coupling the conductive core 215 to the insert 226, the portion of the housing 212 electrically coupled to the insert 226 can function as a radiating element of an antenna, including the antenna feed 218.

[0093] In some examples, one or more portions of component 304 may include a conductive material (e.g., aluminum, steel, stainless steel, titanium, an amorphous alloy, magnesium, or other metal or alloy) or otherwise have a metal plating attached to its outer surface. For example, component 304 may include stainless steel with a conductive plating of nickel and / or gold thereon. Component 304 may be attached at any location within housing 212 to support wires, feeds, conductive paths, or other components of electronic device 200.

[0094] Figure 6B An example of a connection point is shown. Fig. 6A The connection points shown are similar and are coupled to antenna feed 218 . Figure 6B The connection points shown can be connected with Fig. 6A The connection points shown are substantially similar and may include Fig. 6A Some or all of the features of the connection points shown. For example, the connection points may include Fig. 6A The antenna feed 218, the first bracket 306 and the second bracket 308, the first bracket 306 and the second bracket 308 similar to the antenna feed 218 are described. In some examples, the connection point may include an integrated insert 316. In some examples, the integrated insert 316 may be attached to the housing segment 212 via laser welding or another process that provides conductivity between the insert 316 and the housing segment 212. By directly connecting the conductive path 218 to the insert 316 without a flexible connector, controller or other component disposed therebetween, the signal loss between the conductive path 218 and the insert 316 can be significantly reduced, thereby enhancing antenna performance in addition to saving space within the electronic device. In some examples, the conductive core 215 and the insulating layer 216 can be held in place relative to the insert 316 by the curled portion 303. In some examples, the conductive core 215 can be electrically coupled to the conductive contact portion 305 of the insert 316. In some examples, the conductive core 215 can be soldered, welded or otherwise electrically coupled to the insert 316. By connecting the conductive path 218 directly to the interposer 316 without a flexible connector, controller, or other components therebetween, signal losses between the conductive path 218 and the interposer 316 may be significantly reduced, thereby enhancing antenna performance in addition to saving space within the electronic device.

[0095] The functionality of modern electronic devices (such as smart phones, tablets, etc.) is increasingly expanding to include high-performance speakers, cameras, wireless communication hardware, etc. As a result, the space within the housing of modern electronic devices is quickly consumed by the many components that provide functionality. Some components may require specific locations within the electronic device to fully perform. For example, the placement of the speaker within the housing may affect the quality of the audio emitted from the device. The antenna also requires specific placement within the housing to fully transmit and receive wireless signals. In some cases, the antenna volume required to operate the antenna satisfactorily may prevent the speaker from being placed in an optimal position relative to the user. One aspect of the present disclosure combines a ground layer (such as a copper tape) above at least a portion of an audio output device (e.g., a speaker) to ground the audio output device to the antenna volume. Therefore, the speaker may be at least partially incorporated within the antenna volume.

[0096] Fig. 7A For example, Figure 1C A partial cross-sectional view of the second antenna volume 406 at the indicated position. Fig. 7A As shown, radiating element 410 occupies a major portion of second antenna volume 406. Radiating element 406 may be coupled to housing 402 and antenna circuitry (not shown). Figure 7B A partial cross-sectional view of a first antenna volume 404 is shown having an audio output device 408 positioned between portions of a radiating element 412. To at least partially overcome this problem inherent in placing the audio output device 408 within the first antenna volume 404, at least a portion of the audio output device 408 may be electrically grounded to the radiating element 412. For example, a coupling layer 414 may be applied over the radiating portion 412 and at least a portion of the audio output device 408. In some examples, the coupling layer 414 may be a copper tape or other conductive material that electrically grounds a portion of the audio output device 408 to the radiating element 412. The coupling layer 414 may be applied such that the periphery of the audio output element 408 is covered by the coupling layer 414.

[0097] Figure 7B For example, Figure 1C A partial cross-sectional view of a first antenna volume 404 at the indicated location having at least a portion of an audio output device 408 coupled to a radiating element 412 via a coupling layer 414. More specifically, an audio output housing 416 supporting the audio output device 408 is electrically coupled to the radiating element 412 via the coupling layer 414. Thus, a portion of the audio output device 408 may also serve as an effective antenna volume within the first antenna volume 404.

[0098] Fig. 7A and Figure 7BAn electronic device according to one example is shown that includes a housing 402, a first antenna volume 404, and a second antenna volume 406. The first antenna volume 404 may include an audio output device (speaker) 408 positioned within the first antenna volume 404. In this particular example, the second antenna volume 406 does not include a speaker positioned therein. The antenna volume is the actual volume within the housing 402 of the electronic device 400 that is occupied by the radiating components of the antenna. The size or volume of the antenna volume directly affects the function or performance of the antenna. Therefore, components within the antenna volume, such as a speaker, may affect the performance and / or function of the antenna.

[0099] Any number or type of components in any configuration described herein may be included in an electronic device. The components may include any combination of the features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts of engagement features and retention features, may be applied not only to the specific examples discussed herein, but may also be applied to any number of examples in any combination. Various examples of electronic devices including components (such as speaker assemblies) having various features in various arrangements will be described below with reference to FIGS. 8 to 12.

[0100] Figure 8 5 shows a cross-sectional side view of a speaker housing 524 coupled to a surface of the housing 504. The speaker housing 524 can be substantially similar to the speaker housings described herein and can include some or all of the features of the speaker housings described herein. The speaker housing 524 can be plastic. In some examples, the speaker module (not shown) Figure 8 526 to form the speaker assembly 510. The volume 526 can be used as the rear volume of the speaker assembly 510. In some examples, the speaker housing 524 can be a five-sided box with open sides or large holes. Adhesion elements, films, layers or materials 556 such as pressure sensitive adhesives (PSA) can be configured to adhere the speaker housing 524 to the housing 504. Adhesion elements 556 can also be configured to form a seal between the speaker housing 524 and the housing 504.

[0101] In some examples, a sheet of fabric or a similar woven structure, a sheet of rubber (or a sheet of any other polymeric material), or a combination thereof can be configured to cover or close the open end of the five-sided box 524. The speaker housing 524 can be secured to the inner surface 552 of the housing 504 so that the sealing membrane 556 is positioned between the speaker housing 524 and the housing 504. In some examples, the membrane can be secured over the hole in the speaker housing 524 before the speaker housing 524 is secured to the housing 504. In this way, the manufacturing process of the electronic device can be improved by ensuring a properly sealed volume within the speaker housing 524 before the speaker housing 524 is secured to the housing 104. Reference will be made to the following. 9A to 9E Discuss speaker components in more detail.

[0102] Fig. 9A An enlarged front view of the electronic device 100 is shown, and Fig. 9B Shows from Fig. 9A The cross-sectional side view of the electronic device 100 is shown in cross section 9B-9B. Fig. 9C An exploded perspective view of speaker assembly 610A is shown.

[0103] refer to 9A to 9E , the speaker assembly 610A can be positioned in the upper area or "forehead" of the electronic device 100. The speaker assembly 610A may include a speaker housing 624. The speaker housing 624 may be substantially similar to the speaker housings described herein and may include some or all of the features of the speaker housings described herein. In some examples, the speaker housing 624 may be attached to the inner surface of the housing 104. The speaker housing 624 may include a variable amount of sides or areas. In other words, the speaker volume that accommodates the speaker components and forms the rear volume may be defined not only by the speaker housing 624, but also by one or more walls or areas of the housing 104, such as the rear wall of the housing 104 (i.e., opposite to the display).

[0104] like Fig. 9B and Fig. 9C As best shown in , speaker assembly 610A may include moving mass 614 such as a diaphragm, driver frame 618, magnet assembly 622, speaker housing 624, wiring 638, acoustic damping foam 630, adhesive elements 642 such as a sealing PSA, and adhesive 646 for the driver. Foam 630 may be positioned, sized, and optimized to provide damping to speaker assembly 610. That is, foam 630 may reduce the amount of movement or resonance of portions of speaker assembly 610 after no longer generating an acoustic signal. By strategically placing foam 630, the stereo quality of speaker assembly 610A may be improved.

[0105] In some examples, the speaker housing 624 in combination with the moving mass or diaphragm 614 can form a five-sided box with open sides defining an aperture. Fig. 9C As can be seen in FIG. 6 , the speaker housing 624 may define an opening in which the diaphragm 614 resides. As used herein, the term "five-sided box" refers to any substantially three-dimensional housing, such as a housing in the shape of a cuboid, that partially defines a volume but includes holes so as not to completely enclose the volume. The five-sided speaker housing 624 may have any shape and is not limited to a square or rectangular shape. The speaker housing 624 may then be secured to the rear inner surface of the housing 104 using the PSA 642 so that the inner surface covers or closes the open sides of the speaker housing 624 to form an enclosed speaker volume. An advantage of utilizing a five-sided box is that the height of the speaker housing is reduced, with the walls of the housing 104 acting as the sides of the speaker housing. It may be desirable to increase the rear volume of the speaker assembly to achieve a desired level of performance while reducing the amount of space occupied by the speaker assembly within the internal volume of the electronic device. This may be achieved by utilizing a five-sided speaker housing.

[0106] Fig.9D Shows Fig. 9A 6A, which includes a compressible material in the form of a compressible portion or member 631 positioned on top of a speaker housing 624 of the speaker assembly 610A. Although the speaker assembly 610A can have any location within an electronic device as described herein, in some examples, such as Fig.9D As shown, the speaker assembly 610A can be positioned adjacent to or adjacent to one or more edges of the device. In some examples, it may be desirable to direct the sound produced by the speaker assembly 610A in one or more directions, such as toward an edge of the device where a port or opening may be present to allow the sound to emanate from the device. Fig.9D In the example shown, it may be desirable to direct the sound produced by the moving diaphragm 614 toward the edge of the device positioned at the top of the page. Thus, the compressible portion 631 may be positioned on the top surface of the housing 624 to direct the sound and / or audio signal produced by the speaker assembly 610A in one or more desired directions. In some examples, the compressible portion 631 may include any desired compressible and / or elastic material, such as foam, including polymer foam. In some examples, the compressible portion 631 may include one or more separate portions or a single continuous portion. In some examples, the compressible portion 631 may at least partially surround a hole in which a speaker module including a diaphragm may be disposed. In some examples, the compressible portion 631 may surround at least one side, at least two sides, or at least three sides of the hole.

[0107] Fig.9E Shows Fig. 9AA top view of a speaker assembly 610A is shown, which includes a foam portion 631 disposed on an outer surface of the speaker assembly 610A and its position relative to other components of the speaker assembly 610A. The position and / or size of the foam portion 631 may be different from the position and / or size of the foam portion 631. Fig.9D The foam portion 631 is shown in different positions and / or sizes. For example, Fig.9E Some foam portions 631 may be larger or smaller than Fig.9D The corresponding foam 631 is shown to accommodate or make room for other components in the device while still providing the same or similar sound directing function. Fig.9D and Fig.9E The foam 631 shown can reduce air pressure imbalances that can occur when the speaker is driven in the absence of the foam 631. In some examples, such a reduction in pressure imbalance can reduce the incidence of rocking of the speaker assembly 610A and can result in improved sound quality and increased efficiency, especially for low frequency sounds. In addition, the presence of the foam 631 on top of the speaker housing can prevent accidental and / or undesired contact between the diaphragm of the speaker assembly 610 and any components of the device that may be disposed above the speaker assembly 610A, such as a display assembly. Fig. 10A FIG. 12 provides further details of the speaker assembly.

[0108] Fig. 10A An enlarged front view of the lower region or chin of the electronic device 100 is shown, and Fig. 10B Shows from Fig. 10A The cross-sectional side view of the electronic device 100 is shown in cross section 10B-10B. Fig.11A An exploded view of the speaker assembly 710B is shown. Fig.11A As best shown in the figure, the speaker assembly 710B may include a moving mass 714 such as a diaphragm, a driver frame 718, a magnet assembly or driver 722, a speaker housing 724, wiring 738, air pressure vents 728, sound damping and / or directing foam 730, a passive radiator 726, an adhesive element 742 such as a sealing PSA, and an adhesive 746 for the driver.

[0109] Speaker assembly 710B may be substantially similar to speaker assembly 610A described herein and may include some or all of the features of the speaker assembly described herein. However, due to space limitations in the bottom of device 100, speaker assembly 710B may be smaller than speaker assembly 610A. Therefore, speaker assembly 710B may include passive radiator 726 to amplify sound and produce a more balanced experience for the user. Speaker assembly 710B may include speaker housing 724. In some examples, speaker housing 724 may be attached to the inner surface of housing 104, for example, using PSA 742. Speaker housing 724 may include a variable amount of side or area. In other words, the speaker volume may be limited not only by speaker housing 724, but also by one or more walls or areas of housing 104, such as the rear wall of housing 104 (i.e., opposite to the display). Speaker housing 724 may define an opening in which a moving block or diaphragm 714 resides. In some examples, speaker housing 724 combined with diaphragm 714 may be a five-sided box with an open side defining a hole. The speaker housing 724 may then be positioned on the rear interior surface of the housing 104 such that the interior surface covers or closes the open sides of the speaker housing 724 to form an enclosed speaker volume.

[0110] Fig. 11B Shown with Fig.11A 710B is a top view of a speaker assembly 710B similar to the speaker assembly shown, which includes a foam portion 731 disposed on the surface of the speaker housing of the speaker assembly 710B. Although the speaker assembly 710B can be positioned at any location within an electronic device as described herein, in some examples, the speaker assembly 710B can be positioned adjacent to or adjacent to one or more edges of the device. In some examples, it may be desirable to direct the sound generated by the speaker assembly 710B in one or more directions, such as toward an edge of the device, where there may be a port or opening to allow the sound to be emitted from the device and away from the edge and into the internal volume of the device. Therefore, the foam 731 can be positioned in the housing 724 to direct the sound and / or audio signal generated by the speaker assembly 710B in two or more desired directions.

[0111] Fig. 12A A top view of a portion of a speaker assembly 810 is shown, which can be substantially similar to the speaker assemblies described herein (such as speaker assemblies 610A and 710B) and can include some or all of the features of the speaker assemblies described herein. As with other speaker assemblies described herein, speaker assembly 810 can include a moving mass 814 (such as a diaphragm) that can be coupled to a frame 818 and can be driven by a magnet assembly or driver disposed below diaphragm 814.

[0112] Fig. 12BShown along Fig. 12A The indicated line intercepts Fig. 12A 810 is a cross-sectional side view of a speaker assembly 810. As can be seen, the speaker assembly 810 may include a driver 822 disposed below a diaphragm 814 in a volume at least partially defined by a frame 818. In some examples, the diaphragm 814 may be a relatively flexible and compliant material, such as a rubber and / or polymer material. Further, in some examples, a single speaker assembly 810 may be used to produce both high and low frequency sounds, thereby eliminating the need for separate woofer and tweeter modules and saving space within the internal volume of the electronic device. However, in some examples, the flexibility of the diaphragm 814 to allow for the desired quality of low frequency sound output may be too flexible to achieve the desired quality of high frequency sound output. Therefore, in some examples, the diaphragm 814 may define a non-flat structure or feature, such as Fig. 12B Recess 815 is shown.

[0113] Fig. 12C Shown with Fig. 12B The cross-sectional view shown is taken vertically Fig. 12A A cross-sectional side view of a speaker assembly. Although the diaphragm 814 may be along Fig. 12B The axis shown defines a single recess 815, but the diaphragm 814 may also define multiple recesses 815 spaced along the length or width of the diaphragm 814. In some examples, adjacent recesses 815 may define ridges or raised portions 816, and the diaphragm 814 may define one or more ridges 816 as desired. In some examples, the diaphragm 814 may define between 1 and 50 ridges, between 1 and 25 ridges, between 5 and 20 ridges, or between 5 and 15 ridges, such as approximately 8, 9, 10, 11, or 12 ridges. The recesses 815 and / or ridges 816 defined by the diaphragm 814 can be used to increase the stiffness of the diaphragm 814 within one or more desired frequency ranges. Thus, the diaphragm 814 may include a flexible material that can provide a desired quality of sound at low frequencies, while the recesses 815 and / or ridges 816 defined by the diaphragm 814 can be used to strengthen the diaphragm 814 and allow a desired level of sound quality for high frequency sound output. Relative Fig.13A and Fig. 13B Provides more details regarding a speaker assembly of an electronic device.

[0114] Fig.13A Shown as Fig.11AFront view of passive radiator 926 shown. Passive radiator 926 may include a high tension, low elongation mesh 929 (such as a SAATI mesh) adhered using PSA and a stainless steel etched plate 931. To improve the performance of speaker assembly 710B in the chin, passive radiator 926 may be positioned in the rear volume to amplify speaker assembly 710B. Since speaker assembly 710B has a smaller speaker volume than speaker assembly 610A due to space limitations near the bottom of the device, speaker assembly 710B may incorporate passive radiator 926 to supplement the performance of speaker assembly 710B to better match and balance with speaker assembly 610A.

[0115] Fig. 13B Shows Fig.13A 926, which includes a SAATI mesh 929, a perforated stainless steel plate 931, and a speaker housing 940. As can be seen, the plate 931 may define one or more holes or apertures 932. In some examples, the apertures 932 may be separate from the perforations of the mesh, but in some other examples, the apertures may be perforations of the mesh. The apertures 932 may be positioned near the corners and / or edges of the plate 931 as desired. In some examples, the apertures 932 may be aligned with one or more columns or pillars 942, 944, 946, 948, which may be positioned in a volume 941 at least partially defined by the housing 940. In some examples, during assembly, the pillars 942, 944, 946, 948 may be at least partially positioned in or through the apertures or openings 932, and the plate 931 may be heat fused to the housing 940 to hold it in a desired position. Thus, in some examples, the speaker housing may include a polymer material that may be selectively melted and / or deformed to form a structure that cannot be passed back through opening 932 once struts 942, 944, 946, 948 have passed through opening 932, thereby securing plate 931 to housing 940. Although shown only at a single location of a housing of a speaker assembly (such as assembly 710B), the speaker assemblies described herein may include any number of passive radiators in any desired configuration. In some examples, the speaker assembly may include two passive radiators positioned on opposite sides of the speaker driver. This configuration may increase the balance of the speaker assembly, thereby reducing sway and improving sound quality.

[0116] Any number or type of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding engagement features and retention features, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. FIG. 14A to FIG. 16 Various examples of electronic devices are described that include components, such as antennas, having various features in various arrangements.

[0117] Fig.14A An enlarged front view of an upper region of an electronic device that may be substantially similar to an electronic device described herein, such as electronic device 100, and may include some or all of the features of the electronic device described herein is shown. The upper region may be referred to as the "forehead" of the electronic device and may include a housing 1012 that may at least partially define the internal volume of the device and one or more speaker assemblies 1010, as described herein. The forehead region may also include one or more antennas, such as antenna modules 1020, 1022, and 1024. In some examples, any of these antenna modules 1020, 1022, 1024 may radiate at one or more desired frequencies, such as WI-FI frequencies and / or cellular, LTE, and 5G frequencies. In some examples, antenna module 1020 may operate at 2.4 GHz, antenna module 1022 may operate at 5 GHz, and antenna module 1024 may be a dual-band antenna operating at 2.5 GHz and 5 GHz.

[0118] In some examples, housing 1012 may include a relatively electromagnetically opaque material, such as metal. Thus, the antenna module may not be able to radiate outward from the rear of housing 1012, but will radiate in a substantially upward direction, for example, extending outward from the rear of housing 1012. Fig.14A In some examples, such as Figure 1A As shown, a display or top module (not shown) may be disposed above antenna modules 1020, 1022, 1024. In some examples, antenna module 1020 may be coupled to component 1021, which may at least partially define a cavity of antenna module 1020. In some examples, component 1021 may include a metallic material, such as in the form of a plate or sheet. Thus, in some examples, antenna module 1020 and component 1021 may include parallel plate antennas. Although component 1021 may be positioned near antenna module 1020, in some examples, other components that are in electrical communication with other antenna modules 1022, 1024 may not be positioned adjacent to the antenna module.

[0119] In some examples, component 1026 can be coupled to antenna module 1022 to form a parallel plate antenna, and component 1025 can be coupled to antenna module 1024 to form a parallel plate antenna. Additionally, antenna modules 1020, 1022, 1024 and / or components 1021, 1025, 1026 can be electrically grounded to one or more other components of the device to tune the antenna and achieve a desired level of antenna performance.

[0120] Furthermore, since the antennas described herein may be parallel plate antennas, the presence of other components of the device (such as a display or a top module) may have capacitance values ​​that may affect the tuning of the antenna. Fig. 14B As shown, conductive components can be added at desired locations to compensate for the capacitance of components of the device. For example, conductive tape 1030 can be positioned as shown and can be electrically connected to one or more components of the device (such as housing 1012) to compensate for the capacitance of the top module on the parallel plate antenna described herein. FIG. 15A to FIG. 15E Describes more details about the antenna components.

[0121] Fig.15A For example, Fig.14A 1. A close-up view of several components of the forehead region of the electronic device shown. As described herein, the device may include one or more antenna modules 1120, 1122, which may be single-band modules or multi-band modules. In some examples, antenna module 1020 may operate at 2.4 GHz and antenna module 1022 may operate at 5 GHz. One or both of antenna modules 1120, 1122 may be electrically coupled to an antenna resonant structure 1130. The structure may include a metallic material, such as in the form of a metal sheet. In some examples, the resonant structure may include a first material coated with a second, more conductive metal, such as steel or plastic coated with copper. The antenna resonant structure 1130 may be in electrical communication with one or both antenna modules 1120, 1122, for example, via a flexible electrical connector that may be soldered, connected by SMT, or otherwise connected to the antenna resonant structure 1130.

[0122] Typically, the circuits including the antenna circuit are electrically isolated or shielded from other components of the device in order to prevent or reduce any effects that these components may have on the resonant frequency and / or performance of the antenna circuit. However, due to the relatively compact geometry of the devices described herein, it may be desirable to tune the antenna performance to accommodate components that may provide additional functionality to the device and may not be shielded or completely electrically isolated from the antenna circuit. Therefore, in some examples, the electronic device may include a component that can be positioned near the antenna resonant structure 1130, such as a shunt 1132. In some examples, the component may serve essentially any desired function and may be an operating component and / or a passive component. In some examples, the shunt 1132 may include a conductive material, such as a metal. In a certain example, the shunt 1132 may include a ferrous material, such as steel. In some examples, the shunt 1132 may be part of an accessory sensing circuit and / or an accessory sensing component. In some examples, the shunt 1132 may be part of a circuit for sensing a magnetically attachable accessory, such as a keyboard, a housing, or another accessory. That is, in some examples, the shunt 1132 and / or circuitry including the shunt 1132 can be used to detect the presence of an accessory at a desired location adjacent to the device. For example, the shunt 1132 and / or circuitry including the shunt 1132 can detect the presence of an accessory adjacent to an outer surface of the device at a location opposite the shunt 1132. In some examples, the shunt 1132 can be capacitively coupled to the antenna circuit during operation, and the performance and / or resonant frequency of the antenna modules 1120, 1122 can be tuned to accommodate the effects of one or more components (such as the shunt 1132). FIG. 15C to FIG. 15E Discuss more details about antenna tuning.

[0123] Fig. 15C Shows Fig.15A A close-up view of the housing 1112 of the area of ​​the device shown. In some examples, as shown in FIG. Figure 3B As shown, the housing 1112 may define a recess or recessed area, and the dielectric component 1132 may be disposed in the recessed area to help couple multiple parts of the housing 1112 to each other. However, in some examples, the dielectric component may not provide any mechanical coupling or support. In some examples, the dielectric component 1132 may include one or more dielectric materials, such as one or more polymers, ceramics, or combinations thereof. In some examples, the dielectric component 1132 may include a polymer-ceramic composite. In some examples, the dielectric component 1132 may include a glass-filled laminated polymer material. In some examples, the dielectric component 1132 may include a ceramic and polytetrafluoroethylene (PTFE) composite. In some examples, the dielectric component 1132 may have a dielectric constant of about 1 to about 10, or about 2 to about 5, such as about 3.

[0124] like Fig.15DAs shown, the dielectric component 1132 can be disposed below the antenna resonant structure 1130, which can be coupled to one or more antenna modules 1120, 1122, such as with respect to Fig.15A and Fig. 15B As described herein. The resonant structure 1130 acts as one plate of a parallel plate antenna structure, as described herein. Thus, the performance of any antenna circuit including the resonant structure 1130 can be tuned by controlling the dielectric constant of any material present between the parallel plates of the parallel plate antenna. Thus, the material, size, geometry, and position of the dielectric component 1132 can be selected as desired to improve the performance of the antenna. In some examples, the presence of the dielectric component 1132 described herein can improve the efficiency of an antenna including the resonant structure 1130 for frequencies between about 5500 MHz and about 5900 MHz, compared to the same parallel plate antenna not including the dielectric component 1132. Additionally, the antenna resonant structure 1130 can be positioned adjacent to and at least partially surround the periphery of the speaker assembly 1110, as described herein.

[0125] Fig.15E Shows Fig. 15B and Fig. 15C 1140 is a top view of an area of ​​the device that includes a housing disposed over antenna resonating structure 1130 and at least some speaker assemblies 1110. In some examples, housing 1140 may be used to electrically isolate antenna resonating structure 1130 and speaker assemblies 1110 from other components of the device, such as a display module that may be disposed over these components, as described herein.

[0126] Fig.16 Shown with FIG. 15A to FIG. 15E The area shown is a top view of an area of ​​the forehead adjacent to the area. Fig.16 The area of ​​the device shown may include an antenna module 1225, a housing 1212 that may at least partially define an interior volume of the device, and an electrical component 1240. In some examples, the electrical component 1240 may be electrically coupled to the antenna module 1225 and may be part of an antenna circuit. In order to provide an electrical ground for the component 1240 and / or the antenna circuit, portions 1241, 1242, 1243 of conductive material may be electrically coupled to the component 1240 and to other portions of the device, such as the housing 1212. In some examples, the portions 1241, 1242, 1243 of conductive material may include conductive tape. In some examples, the portions 1241, 1242, 1243 of conductive material may provide electrical shorts between various locations of the device to provide a desired antenna path length and, as desired, give a wide antenna frequency response.

[0127] Any number or type of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding engagement features and retention features, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Figures 17 to 19C Various examples of electronic devices are described that include components having various features in various arrangements, such as biometric components.

[0128] Fig.17 An electronic device (such as Figure 1C In some examples, electronic device 1300 can include some or all of the features of any electronic device described herein, such as electronic device 100. In some examples, electronic device 1300 can include biometric input component 1306.

[0129] The biometric input component 1306 can be disposed in an opening or aperture formed in the housing 1302. In some examples, the aperture extends through the housing 1302 and one or more components of the biometric input component 1306 are positioned in the housing. In some examples, the housing 1302 defines a recess to hold the biometric input device 1306 and can additionally include one or more apertures through which a portion of the biometric input component 1306 can extend through the housing 1302.

[0130] The biometric input component 1306 may include a sensor cover 1312, which may be a dielectric cover surrounded by a conductive frame 1310. The conductive frame 1310 may be a ring of conductive material. The sensor cover 1312 (e.g., a dielectric cover) may define an outer surface of the electronic device 1300 that may come into contact with an object (such as a user's finger). When a finger or other body part contacts the outer surface of the sensor cover 1312, the skin of the finger may be at least partially flattened above the outer surface, but this is not required. In the event that the skin of the finger contacts the outer surface of the sensor cover 1312, sensors below the sensor cover 1312 may capture biometric information, such as a fingerprint image. These sensors may be organized into sensor layers, as discussed in more detail below.

[0131] In one example, the biometric input component 1306 may be a capacitive fingerprint sensor; the fingerprint sensor may be a sensor layer in a stack of biometric input components. A capacitive fingerprint sensor may include an array of capacitive electrodes that may be driven by an electrical signal. In some examples, the user's finger may also be in contact with a conductive frame 1310, which may be maintained at a reference voltage level (such as ground potential). Other examples may use different types of sensing technologies. For example, ultrasonic, infrared, multispectral, RF, thermal, optical, resistive, and piezoelectric technologies may be used instead of or in addition to capacitive sensing.

[0132] In some examples, the biometric input component 1306 can receive additional input. For example, the biometric input component 1306 can sense touch input and / or gesture input on the sensor cover 1312 using capacitive sensing or similar sensing. Thus, the biometric input device 1306 can be configured to capacitively detect the movement of a finger across the sensor cover 1312, such as a swipe along the length of the sensor cover 1312. In response to such a gesture, the electronic device 1300 can perform a function, such as a volume change, a brightness change of the display 569, opening an application, changing another setting of the electronic device 1300, etc.

[0133] Fingerprints are typically formed of ridges and valleys arranged in a unique pattern. Fig.18A A graphic illustration depicting a portion of a fingerprint image. Fig.18A , ridges 1460 are indicated by dashed lines. Valleys 1462 are located in the area between ridges 1460. Typically, the capacitance measured between ridges 1460 and an electrode in the fingerprint sensor is different from the capacitance measured between valleys 1462 and another electrode in the fingerprint sensor. The elongated fingerprint sensors described herein can capture a single image at a time that is compared to stored images to authenticate a user or otherwise perform a function of the electronic device, rather than capturing a series of images as the user moves his or her finger across the sensor.

[0134] The capacitance measured between a ridge and an electrode in a fingerprint sensor may be greater than the capacitance measured between a valley and another electrode in the fingerprint sensor because the ridge is closer to the electrode. The difference between the measured capacitances may be used to distinguish between ridges and valleys and produce or generate a fingerprint image.

[0135] It should be understood that alternative fingerprint sensing technologies can measure fingerprints in different ways, and it should also be understood that these alternative fingerprint sensing technologies can be used or incorporated into the examples described herein. For example, as an alternative to capacitive sensing, ultrasonic, optical, inductive and / or thermal fingerprint sensing technologies can be used with the various examples described herein.

[0136] As used herein, the term "image" or "fingerprint image" includes images and other types of data that may be captured by a fingerprint sensor (which may be a sensor layer) and / or used to represent a fingerprint. By way of example only, a fingerprint sensor may generate a data structure that defines features in a fingerprint. In some examples, multiple images of various portions of a fingerprint may be combined to create a composite image.

[0137] For example, a fingerprint image can be considered to be composed of several nodes, each of which represents an area of ​​the fingerprint image. Nodes can generally overlap so that the nodes can be pieced together to form the entire fingerprint image. One or more electrodes in the fingerprint sensor / layer can capture nodes. One or more nodes can be matched with data stored in a memory (such as a fingerprint template) to authenticate the user's access rights to the feature of the electronic device. For example, the nodes captured by the fingerprint sensor can be compared with the stored nodes of the fingerprint template, or the captured fingerprint image can be compared with the stored fingerprint image in other ways. This comparison can be a comparison of the overall captured image with the overall stored image, a comparison of the nodes of the captured image with the nodes of the stored image, a hash or other mathematical representation or abstraction of the captured image with a hash or other mathematical representation or abstraction of the stored image, a comparison of a portion of the captured image with a portion of the stored image, etc. All of the foregoing are covered by the concept of comparing the captured fingerprint image (or the captured fingerprint data) with the stored fingerprint image (or the stored fingerprint data). Although multiple nodes and / or images can be captured to create a fingerprint template, during the authentication operation, a single set of nodes is usually captured by the sensor. In addition, the single set of nodes is captured at a single moment in one capture operation, rather than across multiple capture operations.

[0138] Fig.18BA cross-sectional view of a user's finger 1401 in contact with a biometric input component as described herein is shown. In this example, the biometric input component can be substantially similar to the biometric input components described herein and can include some or all of the features of the biometric input components described herein, including the sensor cover 1412 and the conductive frame 1402. The ridge 1460 of the user's finger 1401 can contact the sensor cover 1412 during operation. However, the user's finger 1401 can also contact the frame or decorative piece 1402. In some examples, in order to maximize the sensing area of ​​the biometric component, the active sensing area disposed below the sensor cover 1412 can be disposed adjacent to or very close to the frame 1402. For example, the active sensing area can be less than about 1 mm, less than about 0.75 mm, less than about 0.5 mm, less than about 0.3 mm, or even closer to the frame 1402. In some examples, it may be desirable to seal the sensor cover 1412 to the frame 1402 to prevent the ingress of contaminants or other materials that can affect sensing, such as sweat.

[0139] like Fig.18C As shown, the small distance between the sensing area under the cover 1412 and the frame 1402 can generate noise in the biometric sensor near this location (here indicated as area 1512). Therefore, the signals 1510 and 1520 detected by the biometric sensor, which may correspond to the ridges and valleys of the user's finger, may be washed out by the noise near the edge of the sensor. In some examples, the biometric input component and / or other components of the electronic device may apply one or more algorithms to the data or signals generated by the biometric input component to normalize the signal near the edge area, thereby effectively smoothing the noise in this area, thereby obtaining signals 1510 and 1520, such as Fig.18C As shown in the lower curve graph.

[0140] Return to Fig.17 , the biometric input component 1306 can be formed as a compressible button. Thus, the conductive frame 1310, the sensor cover 1312, and other components of the biometric input component can deflect in response to a force on the sensor cover 1312 and / or the conductive frame. The biometric input component 1306 can incorporate a pressure sensing component or a force sensing component to register the application of a force. For example, an electrical switch can cause an actuation signal to be generated in response to the application of sufficient force to the biometric input component 1306.

[0141] In response to the actuation signal, the electronic device 1300 may initiate a process. For example, a fingerprint sensor in the biometric input component 1306 may be activated in response to the actuation signal to capture a fingerprint image without requiring the user to move his or her finger, such as a single set of nodes (or other fingerprint data) captured in a single time. In other examples, the actuation signal may additionally or alternatively cause another action, such as a software action, powering on or off the electronic device 1300, a volume change, or another action.

[0142] In some examples, the biometric input component 1306 may incorporate a non-binary force sensor, or a force sensor that measures the amount of force with a range of values. In other words, the force sensor may exhibit a non-binary electrical response (e.g., a change in voltage, capacitance, resistance, or other electrical parameter) that indicates the amount of force applied to the biometric input component 1306. The non-binary response may produce or be a non-binary signal that conveys information corresponding to the amount of force applied on an input surface (such as an input surface defined by a sensor cover) and is not limited to presence or absence (e.g., on / off).

[0143] For example, the biometric input component 1306 may incorporate a force sensor that can distinguish three or more force values ​​and can respond to different force thresholds in different ways. As an example, no action may occur below a first force threshold. Between the first force threshold and a second force threshold, the biometric input component 1306 may capture one or more fingerprint images. Above the second force threshold, the electronic device 1300 may be powered off. It should be understood that a variety of actions may be caused by the application of varying amounts of force and that the above description is exemplary in nature.

[0144] Fig.19A Depicted along Fig.17 A cross-sectional view of the biometric input component 1506 is shown. Fig.19A As shown, the biometric input component 1506 can be at least partially recessed within the housing 1502 of the electronic device. The biometric input component 1506 can include a bracket 1530 or other support structure that can be attached or otherwise attached to the housing 1502. In some examples, the housing 1502 can include a shelf or other support structure for supporting the bracket 1530.

[0145] The biometric input component 1506 may include a sensor cover 1512 and a sensor layer 1518. The sensor cover 1512 may be any suitable dielectric or other non-conductive material, such as glass, sapphire, ceramic, plastic, acrylic, or a combination of such materials. In some examples, the sensor cover 1512 may be formed of a material that is at least partially transparent, but this is not necessary and opaque materials may also be used. One or more layers may be provided between the sensor cover 1512 and the sensor layer 1518, such as a color masking layer that reduces the visibility of the biometric sensor 1518 and provides a desired visual appearance to the user.

[0146] The sensor layer 1518 may be coupled to the sensor cover 1512 by an adhesive layer 1516. The adhesive layer 1516 may include a pressure sensitive adhesive or another adhesive that adheres the sensor cover 1512 to the sensor layer 1518. The sensor layer 1518 may include a capacitive electrode array disposed above a substrate (e.g., silicon or another suitable material). Analog and / or digital circuits may be electrically coupled to the capacitive electrode array to control the operation of the electrodes and receive biometric data. In some examples, the sensor layer 1518 may include analog and / or digital circuits, and in other examples, the analog and / or digital circuits may be disposed on another layer or separate from the biometric input component 1506. The sensor layer 1518 may be disposed within the conductive frame 1510 and may not be in contact with the conductive frame 1510.

[0147] Circuit layer 1520 (such as a flex circuit) connects sensor layer 1518 to additional processing circuitry. As an example, circuit layer 1520 can connect sensor layer 1518 to additional processing circuitry to transmit signals to or from the fingerprint sensor. In some examples, some additional processing circuitry can be disposed in circuit layer 1520.

[0148] The conductive frame 1510 can surround and support components of the biometric input component 1506. When a force is applied to the sensor cover 1512 and / or the conductive frame 1510, the conductive frame 1510 can deflect, thereby moving the sensor cover 1512 and other components into the cavity of the housing 1502. In some examples, the conductive frame 1510 can be formed of a material that is sufficiently rigid to provide structural support to the sensor cover 1512. Therefore, the conductive frame 1510 can be formed of suitable materials, such as steel, aluminum, brass, nickel, and other conductive materials or combinations of materials.

[0149] Conductive frame 1510 may also be coupled to a reference voltage, such as a system ground. When a user contacts conductive frame 1510, coupling to ground may reduce signal attenuation caused by variable capacitive coupling between the user and system ground due to contact of other fingers, hands, or body parts with other components of electronic device 1500.

[0150] In some examples, the sensor cover 1512 may be sealed to the frame 1510 around some or all of the periphery of the sensor cover 1512. In some examples, the sensor cover 1512 may be sealed to the frame 1510 using an adhesive to prevent the ingress of materials or contaminants that may undesirably affect the performance of the sensor layer 1518. In some examples, the adhesive may have a certain viscosity so that the adhesive can be wicked into the gap between the sensor cover 1512 and the frame 1510 to fill substantially the entire volume of the gap. In some examples, the frame 1510 may at least partially surround the periphery of the sensor layer 1518. In some examples, the conductive frame 1510 may completely surround the periphery of the sensor layer 1518. In some examples, the sensor layer 1518 may include sensing pixels, each of which provides a corresponding signal. In some examples, the distance between the sidewalls of the conductive frame 1510 and the pixels of the sensor layer 1518 may be less than 1 mm, less than 0.9 mm, less than 0.75 mm, less than 0.5 mm, or less than 0.3 mm, or less than 0.25 mm, or even less.

[0151] See now Fig.19B (This figure shows an exploded view of the biometric input component 1506), an isolation member or layer can be positioned between the housing sensor layer 1518 and the sensor cover 1512 to electrically isolate components of the biometric input component 1506 from the housing 1502. For example, the housing 1502 can be formed of a conductive material, such as aluminum, steel, or other metal. In such cases, the isolation member can further reduce signal attenuation of biometric data captured by the biometric input component 1506 by electrically isolating the sensor layer 1518 from the housing 1502. In some examples, the isolation layer can include an insulating or relatively non-conductive material, such as a polymer material.

[0152] In some examples, isolating the conductive frame 1510 from the housing 1502 can be accomplished by any technique as desired, such as a film or surface treatment of the housing 1502 and / or the conductive frame 1510. For example, an anodized layer can be formed in a portion of the housing 1502 surrounding the biometric input component 1506. The anodized layer can be formed with a sufficient thickness to electrically isolate the conductive frame 1510 from the housing 1502.

[0153] like Fig.19BAs depicted, the conductive frame 1510 can be coupled to a stiffener layer 1522. The sensor cover 1512, the sensor layer 1518, and the circuit layer 1520 can be coupled to the stiffener layer 1522 to transfer forces applied to the sensor cover 1512 to the force sensor 1528. In some examples, the force sensor 1528 is disposed within a housing 1502 of the electronic device. Thus, a bracket 1530 or other support member can be engaged or secured to the housing 1502, thereby coupling the biometric input member 1506 to the housing 1502.

[0154] Conductive frame 1510, bracket 1530, and stiffener layer 1522 may be formed of the same or different materials and may be coupled together by suitable techniques, such as welding, soldering, brazing, one or more adhesive layers, mechanical coupling (e.g., screws or studs passing through stiffener layer 1522 and into conductive frame 1510), etc. Stiffener layer 1522 generally provides a rigid structure by which forces may be transferred to force sensor 1528. In some examples, stiffener layer 1522 may include metal, which may be the same or different metal as conductive frame 1510, and in other examples, stiffener layer 1522 may be formed of glass, plastic, sapphire, or another material. In some examples, conductive frame 1510 may be electrically grounded to one or more components of the device, including a device housing, for example, through bracket 1530. In some examples, stiffener layer 1522 may include a conductive material and may be in electrical communication with frame 1510 and one or more other components of the device to ground frame 1510 or other portions of component 1506. In some examples, the reinforcement layer may include brackets or curved material portions.

[0155] The reinforcement layer 1522 can be coupled to the force sensor 1528 by an adhesive layer (which can be the same or different adhesive as the adhesive layer 1516). In some examples, a flexible circuit can be coupled to the force sensor 1528 and can provide signals to and from the force sensor 1528. The force sensor 1528 can be further coupled to the circuit layer 1520 (e.g., connected to each other by vias or flexible circuits, or otherwise electrically and / or physically coupled together) and / or processing circuitry. Thus, the operation of the fingerprint sensor can be controlled or affected by actuation of the force sensor 1528.

[0156] The force sensor 1528 can be positioned near a structural component, such as a bracket 1530 for an electronic device. In some examples, the force sensor 1528 can be an electrical switch, such as a compressible dome switch. When a force is applied to the sensor cover 1512, the force can be transferred from the conductive frame 1510 to the reinforcement layer 1522, and from the reinforcement layer 1522 through the adhesive layer 1527 to the force sensor 1528.

[0157] The force sensor 1528 may include a compliant component and / or a biasing component, such as a compressible spring, a spring, a beam, or other structure. When the force is transferred from the reinforcement layer 1522 to the force sensor 1528, the biasing component may contact the structural component 1530 and compress. In some examples, when the biasing component collapses, it completes a circuit, thereby causing an actuation signal to be generated or otherwise sent to the processing circuit and / or the sensor layer 1518. When the input on the sensor cover 1512 is released, the compressible spring can provide a restoring force to at least return the sensor cover and the conductive frame of the biometric input device 1506 to their initial position.

[0158] In other examples, force sensor 1528 may be implemented as another type of switch or force sensing device. For example, force sensor 1528 may detect non-binary amounts of force through capacitive force sensing, ultrasonic force sensing, strain gauge, optical, resistive, and piezoelectric technologies. Force sensor 1528 may output a signal voltage range to processing circuitry in some examples, and may additionally or alternatively provide an actuation signal at a given force threshold in other examples.

[0159] In some examples, the bracket 1530 may include one or more attachment features, such as holes or apertures, through which fasteners may be passed to engage the bracket 15150 to the housing 1502 and secure the biometric input component 1506. In some examples, the bracket 1530 may maintain the position of the biometric input component 1506 so that the force sensor 1528 can be actuated in a direction perpendicular to the attachment direction between the housing 1502 and the bracket 1530. In some examples, the bracket 1530 may include a relatively hard and rigid material, such as a metallic material, such as aluminum or steel. Fig.19C More details about bracket 1530 are described.

[0160] Fig.19C A front view of a biometric input component 1506 is shown, which includes a bracket 1530 attached to the housing 1502 of the electronic device 1500. In some examples, the bracket 1530 may include multiple components that can be joined or fixed together in any manner, such as a first bracket component 1531 and a second bracket component 1532. In some examples, one or more other components of the electronic device may also be supported by the bracket 1530, so that the single support component 1530 can provide mechanical support and fix the position of multiple components and / or circuits of the device, thereby reducing the amount of internal volume required to support the components. This configuration can allow the size of the internal volume to be reduced and / or allow additional space in the internal volume for other functional components.

[0161] For example, one or more sensors, such as ambient light sensor 1540, may be attached to bracket 1530 at a desired location. In some examples, the location of bracket 1530 adjacent to an edge or outer surface of housing 1502 may allow for support of other components that may also be positioned near an edge or exterior of housing 1502. For example, ambient light sensor (ALS) 1540 may be positioned adjacent or proximate to an edge of a display (not shown) and beneath a cover (not shown) of the device so that ALS 1540 may receive light from the surrounding environment that passes through the cover. In some examples, any other components or circuits, such as one or more controllers or processors, may also be carried or supported by bracket 1530 and thus fixed in position relative to housing 1502. In some examples, one or more printed circuit boards may be supported by bracket 1530. Additionally, in some examples, at least a portion of component 1506 may be disposed in an antenna volume of the device, as described herein. In those examples, the printed circuit board supported by bracket 1530 may include one or more chokes to electrically and / or capacitively decouple bracket 1530 and / or component 1506 from the antenna.

[0162] Any number or type of components in any configuration described herein may be included in an electronic device. Components may include any combination of features described herein and may be arranged in any of the various configurations described herein. The structure and arrangement of components of an electronic device having a housing with the structure described herein and defining an internal volume, as well as the concepts regarding engagement features and retention features, may be applied not only to the specific examples discussed herein, but also to any number of examples in any combination. Fig. 20 Various examples of electronic devices are described that include components, such as charging components, having various features in various arrangements.

[0163] Fig. 20 An electronic device (such as Figure 1C1600). In some examples, electronic device 1600 may include some or all of the features of any electronic device described herein, such as electronic device 100. It can be seen that in some examples, housing 1602 may define one or more features that allow for positioning and retention of desired components. In some examples, device 1600 may include an inductive charging component 1650. The inductive charging component 1650 may be any form of wireless charging component, such as an inductive charging coil, as desired. In use, the inductive charging component 1650 may be used to wirelessly charge one or more peripheral or external components that are positioned substantially adjacent or adjacent to the inductive charging component 1650 at the housing 1602. For example, a secondary input component, such as a stylus or digital pen or pencil, may be positioned adjacent to the inductive charging component 1650 to receive wireless power therefrom.

[0164] In some examples, housing 1602 may define a recess or cavity 1603 in which inductive charging component 1650 may be positioned and secured. In some examples, recess 1603 may be machined into the material of housing 1602. In some other examples, recess 1603 may be molded or cast when housing 1602 is formed. The efficiency of the inductive charging component may depend on the position of the component relative to the component to be charged, so it may be desirable to precisely secure the position of the inductive charging component relative to other components of device 1600 (e.g., housing 1602). In addition, by attaching inductive charging component 1650 directly to the housing, such as at recess 1603, the need for a separate bracket component may be eliminated or reduced, thereby saving space and / or cost. The housing may also define an aperture or hole 1604 that may allow communication between recess 1603 and the interior volume of housing 1602. One or more electrical connectors may pass through aperture 1604 and allow power and / or data to be transferred between components of electronic device 1600 and inductive charging component 1650 .

[0165] In some examples, one or more magnets 1653 may also be positioned in or near recess 1603, such as between housing 1602 and inductive charging component 1650. In use, these magnets 1653 may help to hold and / or position the peripheral component to be charged relative to inductive charging component 1650. In some cases, a charging cover 1652 may be provided at recess 1603 above inductive charging component 1650 to protect inductive charging component 1650 and provide a desired visual appearance to housing 1602. In some examples, the window or cover 1652 may include any one or more substantially non-conductive materials, such as polymers, ceramics, and / or glass.

[0166] Although the present disclosure generally describes components and features of electronic devices, the components and features described herein may be used in any combination or order and with any component or electronic device as desired. In addition, the components and features may take on any geometric shape, pattern, size, or combination of shapes, patterns, and sizes. In addition, the features described herein may be positioned on or extend from any one or more surfaces of any desired housing and / or component.

[0167] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, the collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0168] The present disclosure recognizes that the use of such personal information data in the present technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0169] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA); while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0170] Regardless of the foregoing, the present disclosure also contemplates examples where users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data to a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or to completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then reminded again just before the personal information data is accessed by the application.

[0171] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0172] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed examples, the present disclosure also contemplates that various examples may also be implemented without access to such personal information data. That is, various examples of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0173] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the examples. However, it will be apparent to those skilled in the art that the examples can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific examples described herein is presented. These descriptions are not intended to be exhaustive or to limit these examples to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. An electronic device, comprising: a housing defining a first aperture, the housing comprising a first housing section and a second housing section, the first housing section defining a recess; a display assembly positioned in the first aperture; an antenna circuit electrically connected to an electrical ground via a conductive path, wherein the conductive path includes a ground plane, the ground plane includes a tab extending perpendicular to the ground plane, the tab defining a second aperture; a resonant structure comprising a sheet of conductive material disposed between the housing and the display assembly, the resonant structure being electrically coupled to the antenna circuit; an insert disposed in the recess, the insert electrically coupling the conductive path to the first housing segment, wherein the insert defines a third aperture aligned with the second aperture; and A fastener extends at least partially through the second aperture and the third aperture.

2. The electronic device according to claim 1, wherein: The insert is laser welded to the first shell segment.

3. The electronic device according to claim 1, wherein: The first housing section includes a radiating element coupled to the antenna circuit.

4. The electronic device according to claim 1, wherein: The electronic device further includes an electrically insulating element that joins the first housing section to the second housing section; The first housing section is electrically coupled to the second housing section via an electrical component.

5. The electronic device according to claim 4, wherein: The electrical component functions as an electrical short circuit in a first range of frequencies driven by the antenna circuit and functions as an electrical open circuit in a second range of frequencies driven by the antenna circuit.

6. The electronic device according to claim 1, wherein: The insert includes a planar top surface that is flush with a surface defined by the first housing segment.

7. An electronic device comprising: a housing defining an aperture; a display assembly positioned in the aperture; as well as An antenna, comprising: Antenna circuit; a resonant structure comprising a sheet of conductive material disposed between the housing and the display assembly, the resonant structure being electrically coupled to the antenna circuit; and a conductive shunt disposed between the resonant structure and the housing, Wherein, the conductive shunt is part of an accessory sensing circuit.

8. The electronic device according to claim 7, wherein: The conductive shunt comprises metal.

9. The electronic device according to claim 7, wherein: The conductive shunt is capacitively coupled to the antenna circuit.

10. The electronic device according to claim 7, wherein: The antenna circuit includes a Wi-Fi antenna.

11. An electronic device, comprising: a housing defining a bore, the housing comprising a first housing segment and a second housing segment; a display assembly positioned in the aperture; An antenna, comprising: antenna circuit; and a resonant structure comprising a sheet of conductive material disposed between the housing and the display assembly, the resonant structure being electrically coupled to the antenna circuit and the first housing segment; and A dielectric member is disposed between the resonant structure and the housing, the dielectric member mechanically coupling the first housing section to the second housing section.

12. The electronic device according to claim 11, wherein: The dielectric component includes a polymer-ceramic composite material.

13. The electronic device according to claim 11, wherein: The electronic device further comprises a speaker assembly, wherein the speaker assembly comprises: a speaker housing sealed to the housing, the speaker housing and the housing defining a speaker volume; and A speaker module is in fluid communication with the speaker volume.

14. The electronic device according to claim 13, wherein: The resonant structure is disposed adjacent to a first side and a second side of the speaker housing.

15. The electronic device according to claim 13, wherein: The speaker housing defines an opening that is closed by the enclosure.

16. The electronic device according to claim 13, wherein: The speaker module also includes a diaphragm positioned at an aperture defined by the speaker housing, the diaphragm defining a plurality of ridges.

17. The electronic device according to claim 13, wherein: The speaker module also includes a passive radiator disposed in the speaker volume and defining an aperture through which a portion of the speaker housing extends to attach the passive radiator to the speaker housing.

Images