Measuring device for sample detection and method for mounting thereof

By setting a grounding terminal in the sample analyzer, the problem of the influence of static electricity on the measurement components is solved, ensuring the normal operation of the measurement components and preventing external interference.

CN113533219BActive Publication Date: 2026-04-07SHENZHEN MINDRAY BIO MEDICAL ELECTRONICS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2020-04-17
Publication Date
2026-04-07

AI Technical Summary

Technical Problem

In a sample analyzer, static electricity can be transmitted through the metal casing to the measuring components, affecting their normal operation or even damaging them.

Method used

Set a component grounding terminal on the metal casing or component base of the measuring device, and connect it to the ground before installation to ensure that static electricity is released through the grounding terminal and avoids affecting the measuring component.

Benefits of technology

It effectively prevents electrostatic discharge from damaging the measurement components, prevents external environmental interference with the circuitry on the component board, and ensures the normal operation of the measurement components.

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Abstract

A measuring device for sample detection and its mounting method, the measuring device comprises a measuring assembly, an assembly base for carrying the measuring assembly, and a metal shell wrapped outside the measuring assembly, the metal shell is electrically connected with the assembly base. The assembly board for controlling the working of the measuring assembly is integrated inside the measuring device, avoiding the interference of the external environment on the circuit on the assembly board; the assembly ground end is arranged on the metal shell or the assembly base and is electrically connected, the assembly ground end is connected with the ground before the measuring assembly is mounted, so that the static electricity on the metal shell and the assembly base is released to the ground along the assembly ground end, avoiding the influence of static electricity on the measuring assembly.
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Description

TECHNICAL FIELD

[0001] The present application relates to the field of in vitro diagnosis, in particular to a measuring device for sample detection and a mounting method thereof. BACKGROUND

[0002] In hospitals or medical laboratories, sample analyzers are often used to perform immunological, hematological, cytological tests on materials taken from living beings to provide a basis for preventing, diagnosing or evaluating the health status of living beings, such as the detection of C-reactive protein (CRP), lipase, etc. in blood.

[0003] The measuring device for some detection items can be integrated in the sample analyzer, for example, the CRP measuring device for detecting CRP is usually integrated in the sample analyzer (such as a blood analyzer) for use. Taking the CRP measuring device as an example, it generally includes a metal shell and a measuring assembly mounted inside the metal shell through an assembly base. The measuring assembly generally includes a reaction cell, a reagent adding component, a liquid path pipeline, a light source component, a light detector and the like. The metal shell can serve as a fixed support and prevent environmental light interference. The light source component, light detector and the like in the measuring assembly are usually made of metal. When the measuring assembly is installed, if static electricity hits the metal shell or the assembly base, the static electricity will be transmitted to the metal components in the measuring assembly through the metal shell, thereby affecting the normal work of the components in the measuring assembly, and even damaging these components. SUMMARY

[0004] The present application provides a measuring device for sample detection and a mounting method thereof to prevent the influence of static electricity on the measuring assembly during installation of the measuring assembly.

[0005] In one embodiment, a measuring device for sample detection is provided, comprising a measuring assembly, an assembly base for carrying the measuring assembly, and a metal shell wrapped outside the measuring assembly, the metal shell being electrically connected with the assembly base, the measuring assembly comprising a light source module and an assembly board card, the assembly board card comprising a light source driving circuit board, a signal processing circuit board and a photoelectric detection circuit board;

[0006] The signal processing circuit board is mounted on the assembly base and is signal connected with the light source driving circuit board and the photoelectric detection circuit board respectively, for controlling the light source driving circuit board and the photoelectric detection circuit board, receiving and processing the electrical signal generated by the photoelectric detection circuit board;

[0007] The metal shell or the assembly base is provided with and electrically connected with an assembly ground end, the assembly ground end being used to be connected with the ground before the light source module and the assembly board card are installed;

[0008] The light source module is installed on the assembly base and is signal connected with the light source driving circuit board, and the light source module is used for emitting detection light to the sample to be detected under the driving of the light source driving circuit board;

[0009] The photoelectric detection circuit board is used for receiving the light beam after passing through the sample to be detected and generating an electric signal according to the light beam.

[0010] In one embodiment, a mounting method of a measuring device is provided, comprising:

[0011] A metal shell is installed at a position of the case for mounting the measuring device, the metal shell is used for wrapping a measuring assembly of the measuring device, and the metal shell is electrically connected with an assembly base for mounting the measuring assembly, and an assembly ground terminal is arranged on the metal shell or the assembly base and is electrically connected;

[0012] The assembly ground terminal is connected with a case ground of the case;

[0013] A measuring assembly is installed on the assembly base, and the measuring assembly comprises a light source module and an assembly board card.

[0014] According to the measuring device and the mounting method thereof, the assembly ground terminal is arranged on the metal shell or the assembly base of the measuring device and is electrically connected, the assembly ground terminal is connected with the ground before the measuring assembly is installed, and when static electricity hits the metal shell or the assembly base, the static electricity can be released to the ground along the assembly ground terminal, so that the measuring assembly is not affected. Moreover, the assembly board card for controlling the work of the measuring assembly is integrated in the measuring device, so that the circuit on the assembly board card is not disturbed by the external environment. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 A structural schematic diagram of a measuring device for sample detection is provided for the embodiment of the present application;

[0016] Figure 2 Another structural schematic diagram of a measuring device for sample detection is provided for the embodiment of the present application;

[0017] Figure 3 A connection relationship diagram of the measuring device in the embodiment of the present application is provided;

[0018] Figure 4 A ground distribution diagram of a signal processing circuit board is provided for the embodiment of the present application;

[0019] Figure 5 A flowchart of a mounting method of a measuring device is provided for the embodiment of the present application. DETAILED DESCRIPTION

[0020] The application will be described in further detail below with specific reference to the drawings. Like elements in different embodiments are denoted by like reference numerals. In the following description, numerous specific details are described to provide a thorough understanding of the application. However, it will be apparent to one skilled in the art that the application can be practiced without these specific details. In other instances, well-known methods have not been described in detail in order to avoid unnecessarily obscuring the application. In addition, features described in the specification and accompanying claims can be combined in any suitable manner in various embodiments.

[0021] In addition, the features, operations or characteristics described in the specification can be combined in any suitable manner to form various embodiments. Meanwhile, the steps or actions in the method description can also be sequentially changed or adjusted in a manner that is obvious to those skilled in the art.

[0022] The serial numbers of components in this paper, such as "first", "second", etc., are only used to distinguish the described objects, and do not have any order or technical meaning. The "connection" and "coupling" in this application include direct and indirect connection (coupling) unless otherwise specified.

[0023] The measuring device for sample detection generally includes a reaction pool, a reagent adding component, a liquid path pipeline, a light source component, a photoelectric detector and other components, which are usually wrapped in a metal shell. In order to avoid the metal shell and the internal metal substances from forming a capacitor or coupling into the internal space and causing various disturbances, some grounding treatment can be considered for the measuring device.

[0024] The light source component, photoelectric detector and other components in the measuring device are important detection components in the measuring device, which are far away from the host computer board card. If the related circuit boards for controlling the work of each component in the measuring device are arranged at the end of the host computer board card, the analog circuits on these circuit boards are easily disturbed by the outside world. Therefore, some measures need to be taken to shield or avoid these disturbances.

[0025] In the embodiment of the application, the measuring device for sample detection includes a measuring assembly, an assembly base for carrying and installing the measuring assembly, and a metal shell wrapped outside the measuring assembly, the metal shell being electrically connected with the assembly base, wherein the measuring assembly includes a light source module and an assembly board card, the assembly board card including a light source driving circuit board, a signal processing circuit board and a photoelectric detection circuit board. The metal shell or the assembly base is provided with an assembly grounding end, the assembly grounding end being electrically connected with the metal shell or the assembly base, and the assembly grounding end is connected with the ground before the light source module and the assembly board card are installed.

[0026] Please refer to Figure 1 A structural schematic diagram of a measuring device for sample detection is provided for an embodiment of the present application, which comprises a measuring assembly 01, a metal shell 02 wrapped outside the measuring assembly 01, and an assembly base 21 for carrying the measuring assembly 01. The metal shell 02 can serve to fix and support and prevent environmental light interference, and the metal shell 02 and the assembly base 21 can be in an insulating connection relationship or an electrical connection relationship. The measuring assembly 01 comprises a light source module 11 and an assembly board card, and the assembly board card comprises a light source driving circuit board 12, a signal processing circuit board 13, and a photoelectric detection circuit board 14.

[0027] The light source module 11 is installed on the assembly base 21 and is in signal connection with the light source driving circuit board 12, and the light source module 11 is used to emit detection light to the sample to be detected under the driving of the light source driving circuit board 12. The photoelectric detection circuit board 14 is used to receive the light beam after passing through the sample to be detected, generate an electrical signal according to the light beam, and output the electrical signal to the signal processing circuit board 13.

[0028] The signal processing circuit board 13 is installed on the assembly base 21, and the signal processing circuit board 13 is in signal connection with the light source driving circuit board 12 and the photoelectric detection circuit board 14, respectively. The signal processing circuit board 13 is used to control the light source driving circuit board 12 and the photoelectric detection circuit board 14, receive the electrical signal generated by the photoelectric detection circuit board 14, and process the electrical signal.

[0029] The assembly base 21 is provided with an assembly ground end 22 in electrical connection with the assembly base 21, and the assembly ground end 22 is used to be connected with the ground before the light source module 11 and the assembly board card are installed.

[0030] According to Figure 1 The measuring device for sample detection shown in the figure, before the light source module 11 and the assembly board card are installed, the assembly ground end 22 is connected with the ground. For the case that the metal shell 02 and the assembly base 21 are in an insulating connection relationship, when the light source module 11 and the assembly board card are installed, if static electricity hits the metal shell 02, the static electricity will not be conducted to the assembly base 21, and the static electricity on the metal shell 02 will not affect the measuring assembly 01, and if static electricity hits the assembly base 21, the static electricity will be released to the ground along the assembly ground end 22. For the case that the metal shell 02 and the assembly base 21 are in an electrical connection relationship, if static electricity hits the metal shell 02 and / or the assembly base 21, the static electricity will be released to the ground along the assembly ground end 22. In this way, the static electricity on the metal shell 02 and / or the assembly base 21 will not affect the measuring assembly 01.

[0031] Please refer to Figure 2This is a schematic diagram of another measuring device for sample detection provided in an embodiment of the present invention. The measuring device includes a measuring component 01, a metal housing 02 enclosing the measuring component 01, and a component base 21 for supporting and mounting the measuring component 01. The measuring component 01 includes a light source module 11 and a component board. The component board includes a light source driving circuit board 12, a signal processing circuit board 13, and a photoelectric detection circuit board 14. The metal housing 02 serves to fix and support the device and prevent interference from ambient light. A component grounding terminal 22 is provided on the metal housing 02, which is electrically connected to the metal housing 02, and the metal housing 02 is electrically connected to the component base 21. The component grounding terminal 22 is used to connect to the ground before installing the light source module 11 and the component board.

[0032] The light source module 11 is mounted on the component base 21 and is signal-connected to the light source driving circuit board 12. The light source module 11 is used to emit detection light to the sample under the drive of the light source driving circuit board 12. The photoelectric detection circuit board 14 is used to receive the light beam after passing through the sample under test, generate an electrical signal based on the light beam, and output the electrical signal to the signal processing circuit board 13.

[0033] The signal processing circuit board 13 is mounted on the component base 21 and is connected to the light source driving circuit board 12 and the photoelectric detection circuit board 14 respectively. The signal processing circuit board 13 is used to control the light source driving circuit board 12 and the photoelectric detection circuit board 14, receive the electrical signals generated by the photoelectric detection circuit board 14 and process them.

[0034] according to Figure 2 The measuring device shown for sample detection connects the component grounding terminal 22 to the ground before installing the light source module 11 and component board. This way, if static electricity hits the metal casing 02 and / or the component base 21 during the installation of the light source module 11 and component board, the static electricity will be quickly released to the ground along the component grounding terminal 22, so that the static electricity on the metal casing 02 and / or the component base 21 will not affect the measuring component 01.

[0035] The following example illustrates the solution of the present invention in further detail, taking the component grounding terminal 22 as being located on the component base 21 and the metal casing 02 being electrically connected to the component base 21.

[0036] In practical applications, the ground terminal of the light source driving circuit board 12 is connected to the metal housing 02 and / or the component base 21, while the photoelectric detection circuit board 14 can be insulated from the metal housing 02 and / or the component base 21.

[0037] In one specific embodiment, reference is made to... Figure 3This is a schematic diagram of the connection relationship of the measuring device. The signal processing circuit board 13 is also used to connect to the host computer board, and can transmit the signal processing results to the host computer for further processing, analysis, and result display. The host computer board is connected to the ground through the chassis ground. In this embodiment, the component grounding terminal 22 is used to connect to the chassis ground before installing the light source module 11 and the component board, and is connected to the ground through the chassis ground. The chassis is the chassis used to install the measuring device described in this application. When the component grounding terminal 22 is not connected to the chassis ground, the chassis is insulated from the metal shell 02 of the measuring device. In this way, when installing the light source module 11 and the component board, if static electricity hits the metal shell 02, the component base 21, or the light source module 11, the static electricity will be quickly discharged along the component grounding terminal 22 and the chassis ground in sequence, effectively avoiding damage to the light source module 11 by static electricity.

[0038] In practical applications, the component grounding terminal 22 is also used to disconnect from the chassis ground after the light source module 11 and component board are installed. In this way, after the light source module 11 and component board are installed, the metal casing 02 and component base 21 are no longer connected to the chassis ground, which can prevent interference signals on the chassis from flowing into the metal casing 02 and component base 21 through the short path of "chassis ground → component grounding terminal 22" and affecting the measurement component 01.

[0039] Figure 4 The ground plane distribution of the signal processing circuit board 13 is shown. The circuit board 13 includes a component ground, an analog ground, and a digital ground, which are not connected to either the analog ground or the digital ground. Four positioning holes, NH1, NH2, NH3, and NH4, are opened at the four corners of the signal processing circuit board 13. These four positioning holes allow the signal processing circuit board 13 to be mounted and fixed to the component base 21. NH1 is a metallized positioning hole (NH1 is referred to as the first metallized positioning hole), located in the ground plane containing the component ground and connected to the component ground plane. In one embodiment, NH1 is a metallized positioning hole, while NH2, NH3, and NH4 are non-metallized positioning holes. After the signal processing circuit board 13 is mounted on the component base 21, the component ground will be connected to the component base 21 through the first metallized positioning hole NH1. Since the component ground in the signal processing circuit board 13 is connected to the component base 21 and is not directly connected to the analog ground and digital ground inside the measuring device, the interference signal on the metal casing 02 of the measuring device will not flow into other signals on the circuit board. This prevents the interference signal on the metal casing 02 from flowing into other signals on the component board through a short path, thus avoiding interference with other signals on the component board.

[0040] In practical applications, the analog ground and digital ground of the signal processing circuit board 13 are usually connected by a 0-ohm resistor, or they can be directly connected by a thicker signal line when manufacturing the PCB (Printed Circuit Board) of the signal processing circuit board 13.

[0041] In one embodiment, the signal processing circuit board 13 further includes a socket 130 for connection to a host computer board, the socket 130 including pins G, A, and D respectively connected to component ground, analog ground, and digital ground. Figure 3 and Figure 4 After the signal processing circuit board 13 is connected to the host computer board through the socket 130, the metal casing 02 and the component base 21 can be connected to the ground in sequence through the first metallized positioning hole NH1, the component ground, the pin G corresponding to the component ground on the socket 130, the host computer board and the chassis ground.

[0042] Taking a CRP measuring device as an example, its measuring components generally include a reaction cell, reagent addition component, liquid path pipeline, light source component, photodetector, etc. To better illustrate the purpose of this invention, this application focuses on the measuring component 01, which mainly includes a light source module 11 and a component board. The structure and working principle of the reaction cell, reagent addition component, liquid path pipeline, etc., can be designed according to techniques known in the art, and will not be described in detail here. For the CRP measuring device, the light source module 11 can be a laser. Lasers have advantages such as pure light quality and stable spectrum, which also places high demands on their working environment. During the installation and operation of the laser, it is necessary to avoid unnecessary damage to it. Based on the solution of this application, before installing the laser and component board, the component grounding terminal 22 is connected to the chassis ground. During laser and component board installation, if static electricity strikes the metal casing 02, component base 21, or laser, the static electricity will be quickly discharged along the short path "metal casing 02 → component grounding terminal 22 → chassis ground," thus preventing damage to the laser and also preventing static electricity from flowing into the component board and damaging the components on the component board. After installing the laser and component board, disconnecting the component grounding terminal 22 from the chassis ground prevents interference signals from the chassis from flowing into the metal casing 02 or component base 21 through the short path "chassis ground → component grounding terminal 22," thus preventing them from affecting the measurement component. After disconnecting the component grounding terminal 22 from the chassis ground, the metal casing 02 and the component base 21 can be grounded through the path "first metallized positioning hole NH1 → component ground → pin G corresponding to component ground on socket 130 → host computer board → chassis ground", which can release static electricity and shield spatial interference. Since other signal processing-related ground layers (digital ground and analog ground) on the component board are not directly connected to the metal casing 02 and component base 21 within the measurement device, interference signals on the metal casing 02 can be prevented from flowing into other signals on the component board through a short path within the measurement device, thus avoiding interference with other signals (especially analog signals) on the component board.

[0043] In one embodiment, NH2 can also be a metallized positioning hole (in which case NH2 is referred to as the second metallized positioning hole), such as Figure 4 As shown, NH2 is located in the layer where the digital ground is located. When NH2 is a metallized positioning hole, it is connected to the digital ground. At this time, the metal casing 02 and the component base 21 can also be grounded through the path "second metallized positioning hole NH2 → digital ground → pin D corresponding to digital ground on socket 130 → host computer board → chassis ground". This can prevent electrostatic discharge on the metal casing 02 and the component base 21 from damaging the laser. At the same time, it can extract interference signals on some devices in the measurement component 01 and prevent these interference signals from affecting the analog signals on the component board.

[0044] The above explanation uses the example of the component grounding terminal 22 being located on the component base 21. In practical applications, the component grounding terminal 22 can also be located on the metal casing 02. When the component grounding terminal 22 is located on the metal casing 02, the component grounding terminal 22 is electrically connected to the metal casing 02, and the metal casing 02 is electrically connected to the component base 21. In this case, when installing the measuring device, first connect the component grounding terminal 22 to the ground, and then install the component base 21 onto the metal casing 02 at the location for installing the measuring component 01. Alternatively, the component base 21, which is electrically connected to the metal casing 02, can be directly integrated onto the metal casing 02. Then, install the measuring component 01 on the component base 21. This ensures that static electricity on the metal casing 02 and / or the component base 21 will not affect the measuring component 01 when installing it.

[0045] The measurement device for sample detection provided in this application includes a measurement component, a component base for supporting and mounting the measurement component, and a metal casing enclosing the measurement component. A component board for controlling the operation of the measurement component is integrated inside the measurement device, close to the internal components, thus avoiding interference from the external environment to the circuitry on the component board. A component grounding terminal is provided and electrically connected on the metal casing or component base of the measurement device. Before installing the measurement component, this component grounding terminal is directly connected to ground or connected to ground through the chassis ground to prevent static electricity on the metal casing and / or component base from affecting the measurement component. After installing the measurement component, disconnecting the connection between the component grounding terminal and the chassis ground prevents interference signals from the chassis from flowing into the metal casing and component base via the short path "chassis ground → component grounding terminal" and affecting the measurement component. The component ground on the signal processing circuit board in the component board is not connected to either the digital ground or the analog ground, preventing interference signals from the metal casing and component base of the measurement device from flowing into other signals on the component board through the component ground, thus avoiding interference to other signals on the component board. After the measurement components are installed, the metal casing and component base can be connected to ground sequentially through the metallized positioning holes on the signal processing circuit board, the non-analog ground, the non-analog ground pins on the socket, the host computer board, and the chassis ground. This can prevent electrostatic discharge on the metal casing and component base from damaging the light source module in the measurement components, and can also export interference signals on the metal casing to prevent the interference signals from affecting the analog signals on the component board.

[0046] Based on the same inventive concept, this application also provides a method for installing a measuring device, which can be used to install the measuring device described in the above embodiments. See the flowchart below. Figure 5 The method may include the following steps:

[0047] Step 101: Install the metal casing.

[0048] The measuring device described above can be, for example, a CRP measuring device, which is typically integrated into a sample analyzer. When installing the measuring device in the sample analyzer, a metal housing 02 can be installed on the sample analyzer chassis at the location where the measuring device is installed. The metal housing 02 is used to enclose the measuring component 01 of the measuring device. The metal housing 02 is electrically connected to the component base 21 for installing the measuring component 01. At the same time, a component grounding terminal 22 is provided on the metal housing 02 or the component base 21 and is electrically connected to it.

[0049] Step 102: Connect the component grounding terminal to the chassis ground.

[0050] Step 103: Install the measurement components.

[0051] After the component grounding terminal 22 is connected to the chassis ground, the measurement component 01 is installed on the component base 21. The measurement component 01 includes a light source module 11 and a component board. The component board includes a light source driving circuit board 12 for driving the light source module 11 to emit detection light to the sample under test, a photoelectric detection circuit board 14 for receiving the light beam after passing through the sample under test and generating an electrical signal according to the light beam, and a signal processing circuit board 13 for controlling the light source driving circuit board 12 and the photoelectric detection circuit board 14.

[0052] Specifically, in one embodiment, when the component grounding terminal 22 is located on the component base 21, after the component grounding terminal 22 is connected to the chassis ground, the component base 21 can be first installed on the metal casing 02 at the location for installing the measuring component 01, and then the measuring component 01 can be installed on the component base 21. In practical applications, the component base 21 can also be directly integrated on the metal casing 02. The component base 21 and the metal casing 02 can be electrically connected. After the metal casing 02 is installed on the chassis and the component grounding terminal 22 is connected to the chassis ground, the measuring component 01 can be installed on the component base 21.

[0053] In one embodiment, when the component grounding terminal 22 is located on the metal casing 02, after the component grounding terminal 22 is connected to the chassis ground, the component base 21 is installed on the metal casing 02 at the position for installing the measuring component 01, ensuring that the component base 21 and the metal casing 02 are electrically connected. Then, the measuring component 01 is installed on the component base 21. In practical applications, the component base 21, which is electrically connected to the metal casing 02, can also be directly integrated on the metal casing 02. After the metal casing 02 is installed on the chassis and the component grounding terminal 22 is connected to the chassis ground, the measuring component 01 is installed on the component base 21.

[0054] After installing the measurement components, you can also perform the following step 104.

[0055] Step 104: Disconnect the component grounding terminal from the chassis ground.

[0056] The installation method of the measuring device provided in this application involves connecting the grounding terminal of the measuring component to the chassis ground before installation. This allows static electricity to be released to the ground along the component grounding terminal and chassis ground when it strikes the metal casing and / or the component base, preventing any impact on the measuring component and achieving electrostatic discharge (ESD) protection. After installation, the connection between the component grounding terminal and chassis ground can be disconnected to prevent interference signals from the chassis from flowing into the metal casing and component base through the chassis ground and component grounding terminal, thus avoiding any impact on the measuring component.

[0057] The method described in the above embodiment first installs a metal casing 02 on the chassis at the location where the measuring device is installed, and then installs the measuring component 01. In practical applications, when the component grounding terminal 22 is located on the component base 21 and electrically connected to the component base 21, the component grounding terminal 22 can also be connected to the chassis ground first, and then the measuring component 01 is installed on the component base 21. After the measuring component 01 is installed, the component base 21 and the measuring component 01 are wrapped with the metal casing 02. During the wrapping process, the metal casing 02 can be electrically connected to the component base 21. Then, the metal casing wrapping the measuring component 01 and the component base 21 is installed on the chassis.

[0058] Those skilled in the art will understand that all or part of the functions of the various methods in the above embodiments can be implemented by hardware or by computer programs. When all or part of the functions in the above embodiments are implemented by computer programs, the program can be stored in a computer-readable storage medium, which may include: read-only memory, random access memory, disk, optical disk, hard disk, etc., and the program is executed by a computer to achieve the above functions. For example, the program can be stored in the memory of a device, and when the program in the memory is executed by the processor, all or part of the above functions can be achieved. In addition, when all or part of the functions in the above embodiments are implemented by computer programs, the program can also be stored in a server, another computer, disk, optical disk, flash drive, or external hard drive, etc., and can be downloaded or copied to the memory of a local device, or the system of the local device can be updated. When the program in the memory is executed by the processor, all or part of the functions in the above embodiments can be achieved.

[0059] The above examples illustrate the present invention only to aid in understanding it and are not intended to limit the scope of the invention. Those skilled in the art can make various simple deductions, modifications, or substitutions based on the principles of this invention.

Claims

1. A measuring device for sample detection, characterized in that, include: The measurement component includes a component base for supporting and mounting the measurement component, and a metal housing enclosing the measurement component. The metal housing is electrically connected to the component base. The measurement component includes a light source module and a component board. The component board includes a light source driving circuit board, a signal processing circuit board, and a photoelectric detection circuit board. The signal processing circuit board is mounted on the component base and is connected to the light source driving circuit board and the photoelectric detection circuit board respectively. It is used to control the light source driving circuit board and the photoelectric detection circuit board, and to receive and process the electrical signals generated by the photoelectric detection circuit board. The metal casing or the component base is provided with and electrically connected to a component grounding terminal, which is used to connect to the ground before the light source module and the component board are installed; The light source module is mounted on the component base and is signal-connected to the light source driving circuit board. The light source module is used to emit detection light to the sample under the drive of the light source driving circuit board. The photoelectric detection circuit board is used to receive the light beam after passing through the sample to be tested, and generate an electrical signal based on the light beam; The signal processing circuit board includes: component ground, analog ground, and digital ground; The component ground is connected to the component base through a first metallized positioning hole in the signal processing circuit board; or, the digital ground is connected to the component base through a second metallized positioning hole in the signal processing circuit board.

2. The measuring device as described in claim 1, characterized in that, The component grounding terminal is specifically used to connect to the chassis ground of the chassis before installing the light source module and the component board, and to connect to the earth through the chassis ground. The chassis is a chassis used to install the measuring device.

3. The measuring device as described in claim 2, characterized in that, The component grounding terminal is also used to disconnect from the chassis ground after the light source module and the component board are installed.

4. The measuring device as described in claim 2, characterized in that, The component ground is not connected to the analog ground and the digital ground.

5. The measuring device as described in claim 4, characterized in that, The signal processing circuit board also includes a socket for connecting to a host computer board, the socket having pins that are respectively connected to the component ground, the analog ground, and the digital ground; The metal casing is connected to ground sequentially through the first metallized positioning hole, component ground, the pin corresponding to the component ground on the socket, the host computer board, and the chassis ground; or, the metal casing is connected to ground sequentially through the second metallized positioning hole, digital ground, the pin corresponding to the digital ground on the socket, the host computer board, and the chassis ground.

6. The measuring device as described in claim 4, characterized in that, The analog ground and the digital ground are connected by a 0-ohm resistor.

7. The measuring device as described in claim 1, characterized in that, The ground terminal of the light source driving circuit board is connected to the metal casing and / or the component base.

8. The measuring device as described in claim 1, characterized in that, The light source module is a laser.

9. A method for installing a measuring device, characterized in that, include: A metal housing is installed at the location of the chassis where the measuring device is installed. The metal housing is used to enclose the measuring components of the measuring device, and the metal housing is electrically connected to the component base for mounting the measuring components. The metal housing or the component base is provided with and electrically connected to the component grounding terminal. Connect the grounding terminal of the component to the chassis ground of the chassis; A measuring component is installed on the component base, the measuring component including a light source module and a component board; The component board includes a light source driving circuit board, a signal processing circuit board, and a photoelectric detection circuit board; The signal processing circuit board includes: component ground, analog ground, and digital ground; The component ground is connected to the component base through a first metallized positioning hole in the signal processing circuit board; or, the digital ground is connected to the component base through a second metallized positioning hole in the signal processing circuit board.

10. The method as described in claim 9, characterized in that, After the measurement components are installed, the method further includes: Disconnect the connection between the component's grounding terminal and the chassis ground.

Citation Information

Patent Citations

  • Measuring apparatus

    CN109387502A

  • Electronic apparatus with jack

    US20060216974A1

  • Computer and electronics assembly mat

    US9060460B1