Storage device and solid state drive device and operating method thereof

Abstract

A storage device includes a substrate, at least one data storage element, a housing, and at least one sensing pin. The substrate includes at least one security pad. The data storage element is mounted on the substrate. The housing surrounds the substrate and the data storage element, and includes at least one contact structure for electrically connecting with the security pad. The sensing pin receives an electrical signal. A level of the electrical signal changes depending on whether the security pad is electrically connected to the contact structure, and the level change of the electrical signal is detected based on a change in an internal resistance of the storage device. When at least a portion of the housing is removed, the level change of the electrical signal is detected, and a secure erase process is performed on data stored in the data storage element.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0048457, filed with the Korean Intellectual Property Office (KIPO) on April 22, 2020, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] Exemplary embodiments of the present invention generally relate to semiconductor integrated circuits, and more specifically, to storage devices and solid-state drive (SSD) devices having structures for improving security performance and removing data, and methods for operating the storage devices. Background Technology

[0004] Hard disk drives (HDDs) are typically used as data storage devices in electronic devices. However, recently, solid-state drives (SSDs), which include non-volatile memory devices such as flash memory, are being used instead of HDDs as data storage devices for electronic devices.

[0005] SSDs are superior to HDDs because they do not contain mechanical components such as motors and generate virtually no heat or noise. Furthermore, SSDs offer advantages such as faster access speeds, higher density, and greater stability.

[0006] Recently, with the development of the industry, the storage and management of secure data has become increasingly important, and applications to enhance security are being developed in various fields such as defense and finance. SSD devices are media with advantages such as low power consumption and high speed; however, in the event of loss or theft, security problems such as data leakage are likely to occur. Summary of the Invention

[0007] According to an exemplary embodiment of the present invention, a storage device includes: a substrate, at least one data storage element, a housing, and at least one sensing pin. The substrate includes at least one security pad. The at least one data storage element is mounted on the substrate. The housing surrounds the substrate and the at least one data storage element, and includes at least one contact structure for electrical connection to the at least one security pad. The at least one sensing pin receives an electrical signal. The level of the electrical signal changes depending on whether the at least one security pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on a change in the internal resistance of the storage device. When at least a portion of the housing is removed, the change in the level of the electrical signal is detected, and a secure erase process is performed on the data stored in the at least one data storage element.

[0008] According to an exemplary embodiment of the present invention, in a method of operating a storage device, multiple physical sensing structures included in the storage device are used to detect abnormal access to the storage device. When abnormal access to the storage device is detected, a step-by-step security process is executed, in which two or more security algorithms associated with data stored in the storage device are executed sequentially. The storage device includes at least one security pad, at least one data storage element, at least one contact structure, and at least one sensing pin. The at least one data storage element stores data. The at least one contact structure is a structure for electrical connection to the at least one security pad. The at least one sensing pin receives an electrical signal. The level of the electrical signal changes depending on whether the at least one security pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on a change in the internal resistance of the storage device. The at least one security pad and the at least one contact structure form at least one of a plurality of physical sensing structures. When a change in the level of the electrical signal is detected, at least one of two or more security algorithms is executed.

[0009] According to an exemplary embodiment of the present invention, a solid-state drive (SSD) device includes a substrate, a plurality of non-volatile memories, at least one secure memory, a controller, a housing, and at least one sensing pin. The substrate includes at least one secure pad. The plurality of non-volatile memories are mounted on the substrate and store normal data. At least one secure memory is mounted on the substrate and stores secure data. The controller is mounted on the substrate and controls the operation of the plurality of non-volatile memories and the secure memory. The housing surrounds the substrate, the plurality of non-volatile memories, the secure memory, and the controller, and includes at least one contact structure for electrical connection to the at least one secure pad. The at least one sensing pin receives an electrical signal. The level of the electrical signal changes depending on whether the at least one secure pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on a change in the internal resistance of the storage device. When at least a portion of the housing is removed, the change in the level of the electrical signal is detected, and a secure erase process is performed to permanently delete at least one of the normal data stored in the plurality of non-volatile memories and the secure data stored in the at least one secure memory.

[0010] According to an exemplary embodiment of the present invention, a storage device includes a substrate, a plurality of security pads disposed on the substrate, a data storage element mounted on the substrate, and a housing surrounding the substrate and including a plurality of protrusions. The plurality of protrusions correspond to the plurality of security pads. A conductive polymer is formed on at least one of the plurality of protrusions to make electrical contact with at least one of the plurality of security pads. When the conductive polymer is not in electrical contact with at least one of the plurality of security pads, a secure erase process is performed on data stored in the data storage element. Attached Figure Description

[0011] The above and other features of the inventive concept will be more clearly understood by describing exemplary embodiments of the inventive concept in detail with reference to the accompanying drawings.

[0012] Figure 1 This is a perspective view of a storage device according to an exemplary embodiment of the present invention.

[0013] Figure 2 This is an exemplary embodiment of the concept of the present invention. Figure 1 An exploded perspective view of the storage device.

[0014] Figure 3 , Figure 4A and Figure 4B This is for describing exemplary embodiments of the concept according to the present invention. Figure 1 A diagram illustrating the operation of a sensing pin in a storage device to detect changes in the level of an electrical signal.

[0015] Figure 5 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional view of the security pads, contact structure and sensing pins in the storage device.

[0016] Figure 6A , Figure 6B and Figure 6C This is for describing the use of exemplary embodiments based on the concept of the present invention. Figure 5 A diagram illustrating the secure erase process of the secure pads, contact structures, and sensing pins.

[0017] Figure 7 and Figure 8 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional view of the security pads, contact structure and sensing pins in the storage device.

[0018] Figure 9 and Figure 10 This is an exemplary embodiment of the concept of the present invention, including Figure 1 A cross-sectional view of the contact structure and sensing pins in a storage device.

[0019] Figure 11 and Figure 12 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional view of the security pads, contact structure and sensing pins in the storage device.

[0020] Figure 13 , Figure 14 and Figure 15 This is an exemplary embodiment of the concept of the present invention, including Figure 1A view of the security pads, contact structures, and sensing pins in a storage device.

[0021] Figure 16A , Figure 16B , Figure 17A , Figure 17B , Figure 18A and Figure 18B It is used to describe exemplary embodiments of the concept according to the present invention. Figure 1 A diagram illustrating the secure erase process performed on a storage device.

[0022] Figure 19A , Figure 19B and Figure 19C This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 1 A diagram of a security element in a storage device.

[0023] Figure 20 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention.

[0024] Figure 21 This illustrates the implementation of an exemplary embodiment based on the concept of the present invention. Figure 20 A flowchart illustrating an example of a step-by-step safety process.

[0025] Figure 22 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention.

[0026] Figure 23 This illustrates the implementation of an exemplary embodiment based on the concept of the present invention. Figure 22 The flowchart is an example of the authentication process.

[0027] Figure 24 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention.

[0028] Figure 25 This is a block diagram illustrating an exemplary embodiment of a data center including storage devices according to a concept conceived in this invention.

[0029] Figure 26 and Figure 27 This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 25 A block diagram of storage devices in a data center.

[0030] Figure 28 This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 26 or Figure 27 A block diagram of the memory in a storage device. Specific Implementation

[0031] Exemplary embodiments of the present invention provide storage devices and solid-state drive (SSD) devices having structures that improve security and effectively remove data when the casing is detected to be opened or damaged.

[0032] Exemplary embodiments of the present invention also provide methods for operating storage devices and / or SSD devices.

[0033] Exemplary embodiments of the present invention also provide a data center including storage devices and / or SSD devices.

[0034] Exemplary embodiments of the inventive concept will now be described more fully with reference to the accompanying drawings. Throughout this application, similar reference numerals may refer to similar elements.

[0035] Figure 1 This is a perspective view of a storage device according to an exemplary embodiment of the present invention. Figure 2 This is an exemplary embodiment of the concept of the present invention. Figure 1 An exploded perspective view of the storage device.

[0036] Reference Figure 1 and Figure 2 The storage device 10 includes a substrate 100, a plurality of electronic components (or electronic assemblies) 210, 220, 230 and 240 mounted or disposed on the substrate 100, a housing 400 surrounding the substrate 100 and the electronic components 210, 220, 230 and 240, at least one security pad 310, at least one contact structure 330 and at least one sensing pin 350. The storage device 10 may also include a support covering the electronic components 210, 220, 230 and 240, a heat sink in thermal communication with the electronic components 210, 220, 230 and 240, etc.

[0037] In an exemplary embodiment of the present invention, storage device 10 may be a solid-state drive (SSD) device. For example, storage device 10 may be an SSD device used in data centers, servers, etc., wherein the SSD device collects various data and provides various services, and / or storage device 10 may be a portable SSD device used to replace hard disk drive (HDD) devices used in personal computers (PCs), laptops, etc.

[0038] In the following description, exemplary embodiments will be based on the example that storage device 10 is an SSD device. However, the inventive concept is not limited thereto, and storage device 10 may be one of the following: Universal Flash Memory (UFS), Multimedia Card (MMC), Embedded Multimedia Card (eMMC), Secure Digital (SD) Card, Micro SD Card, Memory Stick, Chip Card, Universal Serial Bus (USB) Card, Smart Card, Compact Flash Memory (CF) Card, etc.

[0039] Substrate 100 may be a single-layer or multi-layer circuit substrate having upper and lower surfaces opposite each other. For example, substrate 100 may be a printed circuit board (PCB). The PCB may include wiring and through-holes connected to the wiring. The wiring may include printed circuit patterns for interconnecting with electronic components (e.g., electronic components 210, 220, 230, and 240).

[0040] The substrate 100 may extend in a first direction (e.g., a longitudinal direction). The substrate 100 may have a rectangular or square shape. The substrate 100 may have a first side and a second side opposite to each other. A connector 110 having connection terminals for connection to an external host device may be disposed in the first side of the substrate 100. The storage device 10 may be attached to or detached from the external host device via the connector 110. Therefore, the storage device 10 may be electrically connected to the external host device via the connector 110.

[0041] Multiple electronic components 210, 220, 230, and 240 may be mounted on the substrate 100 along a first direction to be configured as a storage device 10. The multiple electronic components 210, 220, 230, and 240 may include a controller (or storage controller) 210, multiple non-volatile memories 220, a buffer memory 230, and a security element 240. According to an exemplary embodiment of the present invention, the multiple non-volatile memories 220 and / or the security element 240 may form a data storage element.

[0042] The controller 210 can be configured or positioned adjacent to the connector 110 on the upper surface of the substrate 100. A plurality of non-volatile memories 220 can be configured or positioned adjacent to a second side of the substrate 100 opposite to the connector 110 on the upper surface of the substrate 100. For example, as... Figure 2 As shown, two non-volatile memories 220 may be disposed on the upper surface of the substrate 100. According to an exemplary embodiment of the present invention, the non-volatile memories may also be disposed on the lower surface of the substrate 100. Buffer memory 230 and safety element 240 may be disposed or positioned adjacent to the controller 210 on the upper surface of the substrate 100.

[0043] The controller 210 can control the overall operation of the storage device 10, including the operation of multiple non-volatile memories 220, buffer memories 230, and secure elements 240. It can also transmit signals to an external host device via a host interface. For example, signals transmitted between the controller 210 and the external host device may include commands, addresses, and data. The controller 210 can analyze and process signals received from the external host device and can control the operation of the multiple non-volatile memories 220 based on the received commands, addresses, and data.

[0044] In an exemplary embodiment of the present invention, the host interface may include a block-accessible interface, which may include, for example, a Universal Serial Bus (USB), a Small Computer System Interface (SCSI) bus, a Peripheral Component Interconnect (PCI) Express bus, an Advanced Technology Attachment (ATA) bus, a Serial ATA (SATA) bus, a Parallel ATA (PATA) bus, a Serial Attached SCSI (SAS) bus, a Non-Volatile Memory Express (NVMe) bus, etc. The storage device 10 may use a block-accessible address space corresponding to the access size of the plurality of non-volatile memories 220 to provide a block-accessible interface to an external host device, allowing access to data stored in the plurality of non-volatile memories 220 on a block-by-block basis.

[0045] Multiple non-volatile memories 220 can be used as storage media for storage device 10 and can be connected to controller 210 through at least one channel. For example, the multiple non-volatile memories 220 can store normal data, such as metadata, various user data, etc.

[0046] In an exemplary embodiment of the present invention, each of the plurality of non-volatile memories 220 may include NAND flash memory. In an exemplary embodiment of the present invention, each of the plurality of non-volatile memories 220 may include one of the following: phase-change random access memory (PRAM), resistive random access memory (RRAM), nanofloating gate memory (NFGM), polymer random access memory (PoRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), etc.

[0047] The buffer memory 230 can store instructions and / or data executed and / or processed by the controller 210, and can temporarily store data stored or to be stored in multiple non-volatile memories 220. Furthermore, the buffer memory 230 can be used to drive software and / or firmware for effectively managing the multiple non-volatile memories 220. Additionally, the buffer memory 230 can be used to store metadata received from external host devices and / or can be used to store cached data.

[0048] In an exemplary embodiment of the present invention, the buffer memory 230 may include volatile memory, such as dynamic random access memory (DRAM), static random access memory (SRAM), etc. In an exemplary embodiment of the present invention, the buffer memory 230 may include at least one of various non-volatile memories.

[0049] The secure element 240 can be implemented in the form of secure storage and / or any secure device. The secure element 240 can process and / or store secure data, such as cryptographic keys, sensitive data, sensitive codes, etc. For example, the secure element 240 can resist tampering attacks, such as microprobing, software attacks, eavesdropping, fault injection attacks, etc. The secure element 240 can be referred to as secure hardware, a secure component, or a secure module.

[0050] According to an exemplary embodiment of the present invention, the storage device 10 may further include a power management integrated circuit (PMIC) for controlling the power of a plurality of electronic components 210, 220, 230 and 240, passive components such as capacitors, etc.

[0051] The substrate 100 and multiple electronic components 210, 220, 230, and 240 can be fastened to the housing 400, such that the substrate 100 and the multiple electronic components 210, 220, 230, and 240 can be fixedly positioned within the housing 400. For example, the housing 400 may include a lower housing 400b on which the substrate 100 is mounted, and an upper housing 400a coupled to the lower housing 400b to cover the substrate 100 and the multiple electronic components 210, 220, 230, and 240. However, the inventive concept is not limited thereto, and the upper housing 400a and the lower housing 400b may be integrally formed.

[0052] In an exemplary embodiment of the present invention, the housing 400 may include at least one of various materials, such as metal, plastic (e.g., polymer), membrane, epoxy resin coated material, etc.

[0053] The substrate 100 includes at least one security pad 310, and the housing 400 includes at least one contact structure (or bonding structure) 330 for electrical connection or contact with the security pad 310. In the storage device 10 of an exemplary embodiment of the present invention, the security pad 310 may be formed, disposed, or applied in the substrate 100 instead of the housing 400.

[0054] The security pad 310 and the contact structure 330 can form a physical sensing structure, and each of the security pad 310 and the contact structure 330 can include a conductive material for electrical connection. For example, when the security pad 310 is disposed on the upper surface of the substrate 100 (e.g., Figure 2As shown, the contact structure 330 can be formed in the upper housing 400a. However, the inventive concept is not limited thereto, and when the safety pad 310 is disposed on the lower surface of the substrate 100, the contact structure 330 can be formed in the lower housing 400b.

[0055] although Figure 2 Only one security pad 310 and one contact structure 330 are shown, but the storage device may include multiple security pads and multiple contact structures. In this example, the storage device may include multiple physical sensing structures because a security pad-contact structure pair forms one physical sensing structure.

[0056] At least one sensing pin 350 is connected to the safety pad 310. For example, as Figure 2 As shown, the sensing pin 350 may be included in the controller 210. However, the inventive concept is not limited thereto, and the sensing pin 350 may be included in a plurality of non-volatile memories 220 and / or security elements 240, or may be included in the substrate 100. For example, the sensing pin 350 may be a general purpose input / output (GPIO) pin.

[0057] Sensing pin 350 receives an electrical signal from security pad 310. For example, the electrical signal can be a current signal and / or a voltage signal. The level of the electrical signal can change depending on whether security pad 310 is electrically connected to contact structure 330, and the change in the level of the electrical signal is detected based on a change in the internal resistance of the storage device. For example, each of security pad 310 and contact structure 330 may include a resistive material with inherent resistance. (See reference...) Figure 3 , Figure 4A and Figure 4B Describes changes in the level of an electrical signal.

[0058] In an exemplary embodiment of the present invention, the pads and / or pins may be contact pads and / or contact pins, but the present invention is not limited thereto.

[0059] The security pad 310, contact structure 330, and sensing pin 350 can be structures used to improve or enhance the security performance of the storage device 10. For example, as shown in the reference... Figures 5 to 15As described, when at least a portion of the housing 400 is removed (or separated, opened, damaged, etc.), for example, when the upper housing 400a is removed, a change in the level of an electrical signal can be detected, and then a secure erase process can be performed to permanently delete data stored in the data storage elements (e.g., at least one of normal data stored in the plurality of non-volatile memories 220 and secure data stored in the secure memory 240). In other words, the secure erase process can be selectively performed based on the electrical signal. In the storage device 10 of an exemplary embodiment of the present invention, the deletion and / or blocking of data can be determined by detecting changes in resistance (e.g., by detecting changes in the internal resistance of the storage device 10) based on the electrical connection between the secure pad 310 and the contact structure 330 (e.g., based on the state of the housing 400). Furthermore, the electrical signal may not be sent to the outside of the storage device 10, but may be processed internally to determine whether to perform a secure erase process. For example, the secure erase process may be performed under the control of the controller 210, or may be performed by the data storage elements (e.g., at least one of the plurality of non-volatile memories 220 and the secure element 240) themselves.

[0060] In an exemplary embodiment of the present invention, data deleted by a secure erase process may include security data stored in the secure element 240. In an exemplary embodiment of the present invention, data deleted by a secure erase process may include mapping data (e.g., logical-physical address mapping tables) stored in multiple non-volatile memories 220. In an exemplary embodiment of the present invention, data deleted by a secure erase process may include user data stored in multiple non-volatile memories 220.

[0061] According to an exemplary embodiment of the present invention, in the event that the storage device 10 is stolen, lost, or not used, changes in electrical signals caused by opening and / or damage to the housing 400 can be detected, effectively erasing data to improve or enhance security and thus preventing data leakage. Furthermore, users can personally open the housing 400 to confirm the end of use and securely erase their data. Because the electrical components are not damaged, they can be reused. Data in the secure data area can be selectively deleted, and the storage medium including the normal data area can continue to be used.

[0062] although Figure 2 An example is shown where the contact structure 330 is directly applied to the housing 400 (e.g., the upper housing 400a), or where the contact structure 330 is integrally formed with the housing 400. However, the inventive concept is not limited thereto, and the contact structure 330 can be modified according to exemplary embodiments of the inventive concept. (Refer to...) Figures 5 to 15Various examples of contact structure 330 are described.

[0063] Figure 3 , Figure 4A and Figure 4B This is for describing exemplary embodiments of the concept according to the present invention. Figure 1 A diagram illustrating the operation of a sensing pin in a storage device to detect changes in the level of an electrical signal.

[0064] Reference Figure 3 , Figure 4A and Figure 4B The safety pad 310, resistor R, and sensing pin 350 can be connected to each other. Resistor R can represent... Figure 2 The contact structure 330 has a resistor. The safety pad 310 can be connected to ground voltage GND, and the resistor R can be connected to the power supply voltage VCC. The sensing pin 350 can be included in the controller 210.

[0065] like Figure 4A As shown, when the safety pad 310 and the contact structure 330 are electrically connected (or in contact) with each other, for example, when the housing 400 is not opened or damaged and the upper housing 400a and the lower housing 400b are coupled to each other, the sensing pin 350 can be connected to the ground voltage GND through the safety pad 310, so the electrical signal ES can have a first logic level (e.g., low level L). In this case, the safety erase process may not be performed.

[0066] like Figure 4B As shown, when the safety pad 310 and the contact structure 330 are not electrically connected to each other, for example, when the housing 400 is opened or damaged and the upper housing 400a and the lower housing 400B are separated from each other, the sensing pin 350 can be connected to the power supply voltage VCC through a resistor R, so the electrical signal ES can have a second logic level (e.g., a high level H). In this case, the safety erase process can be performed based on the electrical signal ES. For example, since the sensing pin 350 is included in the controller 210, the safety erase process can be performed under the control of the controller 210 based on the electrical signal ES received through the sensing pin 350.

[0067] The above-described connection structure, which determines whether the safety pad 310 and the contact structure 330 are electrically connected to each other, including the ground voltage GND and the power supply voltage VCC, and the level change of the electrical signal ES, can be an example, and the inventive concept is not limited thereto.

[0068] In the following description, exemplary embodiments of the inventive concept will be illustrated by an example based on a security pad 310 disposed on the upper surface of the substrate 100 and a contact structure 330 formed in the upper housing 400a, and by an example based on a data storage element including a security element 240 and performing a secure erase process on the secure data stored in the security element 240. However, the inventive concept is not limited thereto. For example, the security pad 310 may be disposed on the lower surface of the substrate 100, and / or the data storage element may include a plurality of non-volatile memories 220, and a secure erase process may be performed on the mapped data and / or user data stored in the plurality of non-volatile memories 220. In other words, in all exemplary embodiments described later, the security element may be replaced by non-volatile memory, and the secure data may be replaced by mapped data and / or user data.

[0069] Figure 5 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional view of the security pads, contact structure and sensing pins in the storage device.

[0070] Reference Figure 5 The substrate 100 can be mounted and secured to the lower housing 401b. Although Figure 5 The illustration shows the substrate 100 in direct contact with the lower housing 401b. However, in actual implementations, the substrate 100 and the lower housing 401b may be spaced apart from each other, and at least one space may be formed between the substrate 100 and the lower housing 401b.

[0071] The safety element 240 may be mounted on the substrate 100 via conductive bumps 250 (e.g., solder bumps). The safety element 240 and the upper housing 401a may be spaced apart from each other, and at least one space may be formed between the safety element 240 and the upper housing 401a.

[0072] A safety pad 311 may be disposed in the substrate 100. A sensing pin 351 may be disposed in the substrate 100 and may be electrically connected to the controller 210 and / or the safety element 240. According to an exemplary embodiment of the present invention, the safety pad 311 and the sensing pin 351 may be connected to each other, as shown in reference to… Figure 3 As mentioned above.

[0073] The contact structure may include a first protrusion 331 formed in the upper housing 401a. The first protrusion 331 may be formed of the same material as the upper housing 401a and may be integrally formed with the upper housing 401a.

[0074] exist Figure 5In the example, the upper housing 401a can be formed of a conductive material, and the first protrusion 331 can also be formed of a conductive material. Therefore, the first protrusion 331 can be in direct contact with the safety pad 311, and the level of the electrical signal ES detected by the sensing pin 351 can change depending on whether the safety pad 311 and the first protrusion 331 are in electrical contact. Figure 5 An example is shown where a substrate 100 on which a safety element 240 is mounted is directly connected to an upper housing 401a including a contact structure.

[0075] Figure 6A , Figure 6B and Figure 6C This is for describing the use of exemplary embodiments based on the concept of the present invention. Figure 5 A diagram illustrating the secure erase process of the secure pads, contact structures, and sensing pins.

[0076] Reference Figure 6A When the safety pad 311 and the first protrusion 331 are in electrical contact with each other, the resistance can be maintained at its initial value, and the sensing pin 351 can receive an electrical signal ES with a first logic level (e.g., low level L). In this case, the safety erase process may not be performed.

[0077] Reference Figure 6B When the upper housing 401a is removed or separated and the safety pad 311 and the first protrusion 331 are not in electrical contact with each other, the resistance can be changed from the initial value, the level of the electrical signal ES can be changed, and then the sensing pin 351 can receive the electrical signal ES with a second logic level (e.g., high level H).

[0078] Reference Figure 6C When the sensing pin 351 receives an electrical signal ES with a second logic level, a secure erase process can be performed on the secure element 240. For example, the secure erase process can be performed under the control of the controller 210, or it can be performed by the secure element 240 itself.

[0079] Figure 7 and Figure 8 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional views of the security pads, contact structures, and sensing pins in the storage device. (The previously referenced data will be omitted.) Figure 5 Description of the components being described.

[0080] Reference Figure 7 and Figure 8 In addition to Figure 7 and Figure 8 In the example, the contact structure includes a first protrusion 331 and resistive materials 332a and 332b. This example can be used with... Figure 5 The examples are basically the same.

[0081] exist Figure 7 In the example, resistive material 332a may be formed on the first protrusion 331. Unlike the first protrusion 331, resistive material 332a may be a separate structure formed independently of the upper housing 401a, and may be formed of a material different from that of the upper housing 401a. Therefore, the first protrusion 331 may not be in direct contact with the safety pad 311, while the resistive material 332a formed on the first protrusion 331 may be in direct contact with the safety pad 311. The level of the electrical signal ES sensed by the sensing pin 351 may change depending on whether the safety pad 311 and the resistive material 332a are in electrical contact.

[0082] When setting and / or forming separate or individual resistive materials 332a (e.g.) Figure 7 As shown, even if the upper housing 401a and the first protrusion 331 are not formed of a conductive material, an electrical connection can be formed or realized between the safety pad 311 and the contact structure according to an exemplary embodiment of the present invention. However, the present invention is not limited thereto, and... Figure 7 In the example, the upper housing 401a and the first protrusion 331 can be formed of a conductive material.

[0083] exist Figure 8 In the example, resistive material 332b can be formed in the upper housing 401a to be spaced apart from the first protrusion 331. Therefore, with Figure 5 As in the example, the first protrusion 331 can directly contact the safety pad 311. However, with Figure 5 Unlike other examples, the level of the electrical signal ES sensed by the sensing pin 351 can change depending on whether the resistive material 332b and the safety pad 311 and the first protrusion 331 are in electrical contact. In other words, when generating the electrical signal ES, not only whether the safety pad 311 is in electrical contact with the first protrusion 331 can be considered, but also whether the resistive material 332b is in electrical contact.

[0084] When setting and / or forming separate or individual resistive materials 332b (e.g.) Figure 8 As shown, the upper housing 401a and the first protrusion 331 can be formed of a conductive material.

[0085] In an exemplary embodiment of the present invention, resistive materials 332a and 332b may comprise an adhesive composite. This adhesive composite comprises a metal layer and a strip having conductive properties, and can be used as a heat-dissipating pad with heat-dissipating properties. Therefore, when the adhesive composite is applied, thermal enhancement and safety features can be achieved. However, the present invention is not limited thereto, and resistive materials 332a and 332b may comprise any resistive and / or conductive material having inherent resistance. Resistive materials 332a and 332b can be used to apply resistances desired or desired by the designer and / or user.

[0086] Figure 9 and Figure 10 This is an exemplary embodiment of the concept of the present invention, including Figure 1 A cross-sectional view of the contact structure and sensing pins in a storage device. (The previously referenced data will be omitted.) Figure 5 Description of the components being described.

[0087] Reference Figure 9 The substrate 100 can be mounted and secured to the lower housing 403b. The safety element 240 can be mounted on the substrate 100 via conductive bumps 250.

[0088] The security element 240 may include a package substrate 241 and a security chip 243 mounted on the package substrate 241. In other words, the security element 240 may be implemented in the form of a semiconductor package. A sensing pin 353 may be included in the security element 240 and may be disposed on the package substrate 241.

[0089] The contact structure may include a security tag 333a attached to the upper housing 403a and electrically connected to the sensing pin 353. In other words, the security tag 333a can be directly connected to the sensing pin 353. Figure 9 An example is shown where the safety element 240 and the upper housing 403a, including the contact structure, are directly connected.

[0090] exist Figure 9 In this example, the level of the electrical signal ES sensed by the sensing pin 353 can change depending on whether the safety tag 333a included in the contact structure and the sensing pin 353 are in electrical contact. In this example, the safety pads in the substrate 100 can be omitted.

[0091] Reference Figure 10 The substrate 100 can be mounted and fixed on the lower housing 403b. The safety element 240 can be mounted on the substrate 100 via conductive bumps 250. The sensing pin 351 can be disposed in the substrate 100.

[0092] The contact structure may include a security tag 333b attached to the upper housing 403a and electrically connected to the sensing pin 351. In other words, the security tag 333b can be directly connected to the sensing pin 351.

[0093] exist Figure 10 In this example, the level of the electrical signal ES sensed by the sensing pin 351 can change depending on whether the safety tag 333b included in the contact structure and the sensing pin 351 are in electrical contact. In this example, the safety pads in the substrate 100 can be omitted.

[0094] In an exemplary embodiment of the present invention, security tags 333a and 333b may include any conductive material for electrical connection or contact with sensing pins 351 and 353. In an exemplary embodiment of the present invention, any security component or instrument comprising any conductive material may be used in place of security tags 333a and 333b.

[0095] According to an exemplary embodiment of the present invention, security tags 333a and 333b can be implemented as security pads directly electrically connected to the substrate 100.

[0096] Figure 11 and Figure 12 This is an exemplary embodiment of the concept of the present invention, including Figure 1 Cross-sectional view of the security pads, contact structure and sensing pins in the storage device.

[0097] Figure 11 The upper housing 405a and the lower housing 405b are shown to be coupled to each other, and the safety pads 315a and 315b and the contact structures 335a and 335b are in electrical contact with each other. Figure 12 The upper housing 405a and the lower housing 405b are shown to be separated from each other, and the safety pads 315a and 315b and the contact structures 335a and 335b are not in electrical contact with each other.

[0098] Reference Figure 11 and Figure 12 The housing may include an upper housing 405a, a lower housing 405b, and at least one screw 450 coupling the upper housing 405a and the lower housing 405b. A contact structure 335a may be formed in the upper housing 405a, and a contact structure 335b may be formed in the lower housing 405b. For example, each of the contact structures 335a and 335b may include a protrusion.

[0099] The substrate may include a first substrate 105a, a second substrate 105b, and a support member 150 supporting the first substrate 105a and the second substrate 105b. A safety pad 315a may be disposed in the first substrate 105a, and a safety pad 315b may be disposed in the second substrate 105b. In an exemplary embodiment of the present invention, the safety pads 315a and 315b may include an adhesive compound.

[0100] When the upper housing 405a and the lower housing 405b are coupled by screw 450 (e.g.) Figure 11 When (as shown), the electrical connection between the safety pads 315a and 315b and the contact structures 335a and 335b can be maintained.

[0101] When the upper housing 405a and lower housing 405b are separated by loosening screw 450 (as shown) Figure 12 When (as shown), the electrical connection between safety pads 315a and 315b and contact structures 335a and 335b can be released. In this case, a safe erasure process according to an exemplary embodiment of the present invention can be performed.

[0102] exist Figure 11 and Figure 12 In the example, only security pads 315a and 315b can be added to a conventional or existing substrate, and / or at least one of the pads present on a conventional substrate can be used as a security pad, so exemplary embodiments of the inventive concept can be effectively implemented without additional components and costs.

[0103] Figure 13 , Figure 14 and Figure 15 This is an exemplary embodiment of the concept of the present invention, including Figure 1 A view of the security pads, contact structures, and sensing pins in a storage device.

[0104] Reference Figure 13 , Figure 14 and Figure 15 Connector 110, controller 210, multiple non-volatile memories 220, buffer memory 230, and safety element 240 can be connected to Figure 2 The pads shown are similarly disposed on substrate 100. Furthermore, a plurality of security pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i may be randomly disposed on substrate 100. Each of the plurality of security pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i can be coupled with… Figure 5 It is similar to the safety pad 311 in the text.

[0105] Multiple protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i can be formed in the upper housing 407a to correspond to the positions of multiple safety pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i. The positions of the multiple protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i can correspond one-to-one with the positions of the multiple safety pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i. Each of the multiple protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i is related to Figure 5 The first protrusion in it is similar to 331.

[0106] Furthermore, conductive polymer 338a can be formed on at least one of a plurality of protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i to make electrical contact with at least one of a plurality of safety pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i. Although Figure 15 Only one conductive polymer 338a is shown formed on protrusion 337a and in electrical contact with safety pad 317a, but conductive polymer 338a may be formed on all of the protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i. Similar to the exemplary embodiment described above, substrate 100 may be mounted on lower housing 407b opposite upper housing 407a.

[0107] In other words, in Figure 13 , Figure 14 and Figure 15 In the example, the security pads formed in the substrate 100 may include a plurality of security pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h and 317i, and the contact structure formed in the upper housing 407a may include a plurality of protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h and 337i, and a conductive polymer 338a.

[0108] For example, a secure erase process can be performed when the conductive polymer 338a is not in electrical contact with at least one of the plurality of security pads 317a, 317b, 317c, 317d, 317e, 317f, 317g, 317h, and 317i. The secure erase process can be performed to erase data stored in at least one of the plurality of non-volatile memories 220 and security elements 240. Similar to the description above, the plurality of non-volatile memories 220 and security elements 240 can be referred to as data storage elements.

[0109] In an exemplary embodiment of the present invention, the upper housing 407a can be manufactured using a die-casting process. For example, in the die-casting process, a plurality of protrusions 337a, 337b, 337c, 337d, 337e, 337f, 337g, 337h, and 337i can be formed by forming safety bumps or walls (e.g., by cutting or perforating the housing), and the conductive polymer 338a can be formed using a liquid electropolymer (e.g., in-situ molded gasket (FIPG)). In other words, a liquid FIPG mass-production structure can be applied to the upper housing 407a.

[0110] In an exemplary embodiment of the present invention, reference can be made by... Figures 5 to 15 Two or more examples described are combined to implement a storage device. For example, a storage device may include multiple physical sensing structures. For example, since a security pad-contact structure pair forms a physical sensing structure (as described above), the first physical sensing structure among multiple physical sensing structures can be implemented as follows: Figure 5 , Figure 7 and Figure 8 In one example, the second physical sensing structure in a plurality of physical sensing structures can be implemented as Figure 9 and Figure 10 In one example, the third physical sensing structure in a plurality of physical sensing structures can be implemented as Figure 11 and Figure 12 For example, and the fourth physical sensing structure in a plurality of physical sensing structures can be implemented as Figure 13 , Figure 14 and Figure 15 Examples.

[0111] Figure 16A , Figure 16B , Figure 17A , Figure 17B , Figure 18A and Figure 18B It is used to describe exemplary embodiments of the concept according to the present invention. Figure 1 A diagram illustrating the secure erase process performed on a storage device.

[0112] Reference Figure 16A and Figure 16B Security data SDAT1 and SDAT2 can be stored in security element 240a. For example, security data SDAT1 can be data stored at the initial operation time (e.g., before the first time point t1), and security data SDAT2 can be data stored after the first time point t1. For example, security data SDAT1 can be data used for initial setup, and security data SDAT2 can be user data stored by the user.

[0113] like Figure 16B As shown, when according to the reference Figures 5 to 15 When the described exemplary embodiment of the inventive concept detects the removal of the housing and then performs a security erasure process, security data SDAT2 stored only after a specific time point (e.g., a first time point t1) can be permanently deleted, while security data SDAT1 stored before the specific time point (e.g., the first time point t1) can be retained without being deleted. Therefore, the security element 240a can be used continuously.

[0114] Reference Figure 17A and Figure 17B Security data SIDAT and SUDAT can be stored in the security element 240b. For example, security data SIDAT can be initial setup data stored by the manufacturer when manufacturing the security element 240b, and security data SUDAT can be user data stored by the user after the security element 240b is provided to the user (or consumer).

[0115] like Figure 17B As shown, when according to the reference Figures 5 to 15 In the exemplary embodiment of the inventive concept described herein, when the removal of the housing is detected and a security erasure process is then performed, only the user-stored security data SUDAT can be permanently deleted, while the user-unstored security data SIDAT can be retained without being deleted. Therefore, the security element 240b can be used continuously.

[0116] Reference Figure 18A and Figure 18B Security data SDATA and SDATB can be stored in security element 240c. For example, security data SDATA and SDATB can be stored as described in reference... Figure 16A The classification or division based on storage time, or as referred to Figure 17A The classification or division is based on the executor of the storage.

[0117] like Figure 18B As shown, when according to the reference Figures 5 to 15In an exemplary embodiment of the inventive concept described herein, when the removal of the housing is detected and a secure erasure process is then performed, the security data SDATA and SDATB can be randomly rearranged to make them inaccessible or unavailable. In an exemplary embodiment of the inventive concept, the security data SDATA and SDATB may be permanently inaccessible, or they may be recovered and accessed using a manufacturer-provided security key.

[0118] Although described based on security data Figure 16A , Figure 16B , Figure 17A , Figure 17B , Figure 18A and Figure 18B Examples are provided, but the inventive concept is not limited thereto, and can also be performed on mapped data and / or user data stored in non-volatile memory. Figure 16A , Figure 16B , Figure 17A , Figure 17B , Figure 18A and Figure 18B The safe erasure process.

[0119] Figure 19A , Figure 19B and Figure 19C This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 1 A diagram of a security element in a storage device.

[0120] Reference Figure 19A , Figure 19B and Figure 19C The security element 240 can be configured to be electrically attached to and detached from the storage device 11. For example, the security element 240 can be configured as a separate security module 1200 and implemented separately from the storage device 11. The storage device 11 may include a connector 110, a substrate 1100, and a housing 1400, and may also include a structure in the form of a slot 20 into which the security module 1200 containing the security element 240 is inserted. The connector 110, substrate 1100, and housing 1400 may respectively correspond to... Figure 2 The connector 110, substrate 100 and housing 400 are included.

[0121] like Figure 19A and Figure 19BAs shown, the security module 1200 can be inserted into slot 20 of storage device 11. Storage device 11 can identify security element 240 through electrical connection with security module 1200, and can determine whether to perform security functions by performing an authentication process for accessing security element 240. For example, serial numbers can be assigned to each of storage device 11 (or substrate 1100) and security element 240, and security functions can be performed only if the serial number of storage device 11 and the serial number of security element 240 are the same or match each other.

[0122] like Figure 19C As shown, the security module 1200 can be removed from the slot 20 of the storage device 11. In this case, the security data stored in the security element 240 can be permanently deleted, or the security data can be encrypted to make it inaccessible.

[0123] In an exemplary embodiment of the present invention, one of a plurality of pins included in connector 110 may be used to detect whether storage device 11 is connected to an external host device, and when storage device 11 is not connected to an external host device, access to storage device 11 and / or security element 240 may be blocked.

[0124] Figure 20 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention.

[0125] Reference Figure 20 In a method for operating a storage device according to an exemplary embodiment of the present invention, a plurality of physical sensing structures included in the storage device are used to detect abnormal (or illegal) access to the storage device (operation S100). For example, abnormal access may indicate that at least a portion of the housing 400 has been removed, separated, opened, or damaged for illegal data debugging.

[0126] When an abnormal access to a storage device is detected using multiple physical sensing structures, a step-by-step (or progressive) security process (operation S200) is executed. During this process, two or more security algorithms associated with data stored in the storage device are sequentially executed (e.g., to protect the data stored in the storage device). For example, the data may include at least one of security data, mapping data, and user data. (See reference...) Figure 21 As described, the security algorithms can correspond to different security levels, and depending on the security level, data can be processed differently and / or different security algorithms can be executed for the data. When the above-described step-by-step security process is performed, data can be effectively eliminated or removed when the casing is detected to be opened or damaged.

[0127] A storage device according to an exemplary embodiment of the present invention may include a reference Figures 5 to 15 The description includes multiple physical sensing structures. In other words, Figure 20 The method can be applied to storage devices comprising two or more physical sensing structures, each of which includes a security pad-contact structure pair. For example, a storage device may include at least one security pad, at least one data storage element, at least one contact structure, and at least one sensing pin. The security pad and contact structure may form at least one of a plurality of physical sensing structures. At least one of the security algorithms can be executed based on an electrical signal. The level of the electrical signal can change depending on whether the security pad is electrically connected to the contact structure, and the change in the level of the electrical signal can be detected based on a change in the internal resistance of the storage device.

[0128] Figure 21 This illustrates the implementation of an exemplary embodiment based on the concept of the present invention. Figure 20 A flowchart illustrating an example of a step-by-step safety process.

[0129] Reference Figure 21 This illustrates an example of sequentially executing two security algorithms, such as an example of performing a two-step security process.

[0130] When the step-by-step security process is executed (operation S200), if the first physical sensing structure among the multiple physical sensing structures detects abnormal access (operation S210: Yes), for example, when the first physical sensing structure is damaged, a first security algorithm can be executed (operation S220). The first security algorithm may correspond to a relatively low security level. For example, the first security algorithm may include operations for preventing access to the data while maintaining the data.

[0131] When no abnormal access is detected (Operation S210: No), no subsequent action may be performed, and Operation S210 may be repeated periodically and / or intermittently.

[0132] When a first physical sensing structure and a second physical sensing structure different from the first physical sensing structure detect abnormal access (operation S230: Yes), for example, when the second physical sensing structure is damaged after the first physical sensing structure is damaged, a second security algorithm can be executed (operation S240). The second security algorithm can correspond to a relatively high security level. For example, the second security algorithm may include operations for permanently deleting data.

[0133] When no abnormal access is detected (Operation S230: No), Operation S230 may be repeated periodically and / or intermittently after Operation S220 is executed.

[0134] In an exemplary embodiment of the present invention, the first security algorithm may include reference to Figure 18A and Figure 18B The description describes the operation of randomly rearranging the security data SDATA and SDATB. In this case, the security data SDATA and SDATB can be recovered and accessed using a security key provided by the manufacturer.

[0135] In an exemplary embodiment of the present invention, the second security algorithm may include reference to Figure 16A and Figure 16B The operation of permanently deleting secure data SDAT2 stored after a specific time point (e.g., the first time point t1), and / or referencing Figure 17A and Figure 17B The operation described is to permanently delete the user-stored security data SUDAT.

[0136] although Figure 21 A two-step security process is illustrated, but the inventive concept is not limited thereto, and exemplary embodiments of the inventive concept can be applied to examples of security processes that perform three or more steps, such as examples of sequentially executing three or more security algorithms. In this example, the security process corresponding to the highest security level and executed last may include operations for permanently deleting data, similar to operation S240.

[0137] Figure 22 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention. (Referring to previously referenced methods will be omitted.) Figure 20 Description of the components being described.

[0138] Reference Figure 22 In a method of operating a storage device according to an exemplary embodiment of the present invention, a safety element included in the storage device may be configured to be electrically attached to the storage device and detachable from the storage device, as shown in reference to Figure 19A , Figure 19B and Figure 19C As mentioned above.

[0139] When the secure element is electrically connected to the storage device, an authentication process for accessing the secure element can be performed (operation S1100). When the authentication process is successful or successfully completed (operation S1200: Yes), normal operation for accessing the secure element and secure data can be performed (operation S1300). In other words, secure data can only be accessed if the authentication process is successfully completed. When the authentication process fails (operation S1200: No), the method of operating the storage device according to an exemplary embodiment of the present invention can be terminated.

[0140] Operations S100 and S200, performed after operation S1100, can be respectively related to... Figure 20 The operations S100 and S200 are basically the same.

[0141] Figure 23 This illustrates the implementation of an exemplary embodiment based on the concept of the present invention. Figure 22 The flowchart is an example of the authentication process.

[0142] Reference Figure 23 When the authentication process is performed (operation S1100), the security element can be inserted into the slot of the storage device (operation S1110), and the serial number of the storage device or the substrate included in the storage device can be compared with the serial number of the security element. The serial number can be assigned during manufacturing or stored in advance.

[0143] When the serial number matches (Operation S1120: Yes), the authentication process can be determined to be successful (Operation S1130). When the serial number does not match (Operation S1120: No), the authentication process can be determined to be failed (Operation S1140).

[0144] Figure 24 This is a flowchart illustrating a method for operating a storage device according to an exemplary embodiment of the present invention. (Referring to previously referenced methods will be omitted.) Figure 20 and Figure 22 Description of the components being described.

[0145] Reference Figure 24 In a method of operating a storage device according to an exemplary embodiment of the present invention, a safety element included in the storage device may be configured to be electrically attached to the storage device and detachable from the storage device, as shown in reference to Figure 19A , Figure 19B and Figure 19C As mentioned above.

[0146] Figure 24 The operation is shown after the security element is electrically connected to the storage device. Figure 22 Operations S1100, S1200, and S1300 can be performed in the following ways: Figure 24 The operation S100 is executed before it. Figure 24 Operations S100 and S200 in the above can be respectively connected with Figure 20 The operations S100 and S200 are basically the same.

[0147] When the security element is removed from the storage device, at least one of the security algorithms can be executed (operation S2100). For example, operations to prevent access to the data (e.g., encryption) or operations to permanently delete the data can be executed.

[0148] As those skilled in the art will understand, the inventive concept can be embodied as a system, method, computer program product, and / or a computer program product embodied thereon in one or more computer-readable media having computer-readable program code embodied thereon. The computer-readable program code can be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing apparatus. The computer-readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be any tangible medium that can contain or store a program used by or in conjunction with an instruction execution system, apparatus, or device. For example, the computer-readable medium can be a non-transitory computer-readable medium.

[0149] Figure 25 This is a block diagram illustrating an exemplary embodiment of a data center including storage devices according to a concept conceived in this invention.

[0150] Reference Figure 25 Data center 3000 can be a facility that collects various types of data and provides various services, and can be referred to as a data storage center. Data center 3000 can be a system used to operate search engines and databases, and can be a computing system used by companies such as banks or government agencies. Data center 3000 may include application servers 31001 to 3100. n and storage servers 32001 to 3200 m According to an exemplary embodiment of the present invention, application servers 31001 to 3100 can be selected differently. n The number and storage servers 32001 to 3200 m The number, and application servers 31001 to 3100 n The number and storage servers 32001 to 3200 m The quantities can be different from each other.

[0151] Application server 31001 may include at least one processor 31101 and at least one memory 31201, and storage server 32001 may include at least one processor 32101 and at least one memory 32201. The operation of storage server 32001 will be described as an example. Processor 32101 can control the overall operation of storage server 32001 and can access memory 32201 to execute instructions and / or data loaded in memory 32201. Memory 32201 may include at least one of the following: Double Data Rate (DDR) Synchronous Dynamic Random Access Memory (SDRAM), High Bandwidth Memory (HBM), Hybrid Memory Cube (HMC), Dual In-line Memory Module (DIMM), Optane DIMM, Non-volatile DIMM (NVDIMM), etc. In exemplary embodiments of the present invention, the number of processors 32101 and the number of memories 32201 included in storage server 32001 may be selected differently. In exemplary embodiments of the present invention, processor 32101 and memory 32201 may provide a processor-memory pair. In an exemplary embodiment of the present invention, the number of processors 32101 and the number of memories 32201 may differ from each other. Processors 32101 may include single-core processors or multi-core processors.

[0152] The above description of storage server 32001 can be similarly applied to application server 31001. Application server 31001 may include at least one storage device 31501, and storage server 32001 may include at least one storage device 32501. In an exemplary embodiment of the inventive concept, application server 31001 may not include storage device 31501. The number of storage devices 32501 included in storage server 32001 may be selected differently according to an exemplary embodiment of the inventive concept.

[0153] Application servers 31001 to 3100 n and storage servers 32001 to 3200 m They can communicate with each other via Network 3300. Network 3300 can be implemented using Fibre Channel (FC) or Ethernet. FC can be a medium for relatively high-speed data transmission and can use optical switches that provide high performance and / or high availability. Depending on the access scheme of Network 3300, storage servers 32001 to 3200 can be provided. m It can be used as a file storage device, block storage device, or object storage device.

[0154] In exemplary embodiments of the present invention, network 3300 may be a storage-only network or a network dedicated to storage, such as a storage area network (SAN). For example, the SAN may be an FC-SAN implemented using an FC network and according to the FC protocol (FCP). As another example, the SAN may be an IP-SAN implemented using a Transmission Control Protocol / Internet Protocol (TCP / IP) network and according to the iSCSI (SCSI over TCP / IP or Internet SCSI) protocol. In exemplary embodiments of the present invention, network 3300 may be a general or ordinary network such as a TCP / IP network. For example, network 3300 may be implemented according to at least one of protocols such as FC over Ethernet (FCoE), Network Attached Storage (NAS), or Architectural Non-Volatile Memory Express (NVMe) (NVMe-oF).

[0155] In the following description, exemplary embodiments of the inventive concept will be based on application server 31001 and storage server 32001. The description of application server 31001 can be applied to other application servers, such as application server 3100... n Furthermore, the description of storage server 32001 can be applied to other storage servers, such as storage server 3200. m .

[0156] Application server 31001 can store user or client-requested data to storage servers 32001 to 3200 via network 3300. m One of them. Furthermore, application server 31001 can connect to storage server 32001 via network 3300. m One of them obtains the data requested by the user or client. For example, application server 31001 can be implemented as a web server or a database management system (DBMS).

[0157] Application server 31001 can be accessed via network 3300, including other application servers 3100. n Memory 3120 n or storage device 3150 n And / or can be accessed via network 3300 including storage servers 32001 to 3200. m Memory 32201 to 3220 in m Or storage devices 32501 to 3250 m Therefore, application server 31001 can access the data stored on application servers 31001 to 3100. n and / or storage servers 32001 to 3200 mThe data in the application server is used to perform various operations. For example, application server 31001 can perform operations on data between application servers 31001 and 3100. n and / or storage servers 32001 to 3200 m Commands for moving or copying data between storage servers. This can be done directly or via storage servers 32001 to 3200. m Memory 32201 to 3220 m Transfer data from storage server 32001 to 3200. m Storage devices 32501 to 3250 m Transmitted to application server 31001 to 3100 n Memory 31201 to 3120 n For example, for security or privacy reasons, data transmitted over the network 3300 can be encrypted.

[0158] In storage server 32001, interface 32541 can provide a physical connection between processor 32101 and controller 32511, and / or a physical connection between network interface card (NIC) 32401 and controller 32511. For example, interface 32541 can be implemented based on a Direct Attached Storage (DAS) scheme, in which storage device 32501 is directly connected to a dedicated cable. For example, interface 32541 can be implemented based on at least one of various interface schemes, such as Advanced Technology Attachment (ATA), Serial ATA (SATA), External SATA (e-SATA), Small Computer System Interface (SCSI), Serial Attached SCSI (SAS), Peripheral Component Interconnect (PCI), PCI Express (PCIe), NVMe, IEEE 1394, Universal Serial Bus (USB), Secure Digital (SD) card interface, Multimedia Card (MMC) interface, Embedded MMC (eMMC) interface, Universal Flash Memory (UFS) interface, Embedded UFS (eUFS) interface, Compact Flash Memory (CF) card interface, etc. Similarly, storage server 3200 m It can include interface 3254 m .

[0159] Storage server 32001 may also include switch 32301 and NIC 32401. Under the control of processor 32101, switch 32301 can selectively connect processor 32101 to storage device 32501, or selectively connect NIC 32401 to storage device 32501. Similarly, application server 31001 may also include switch 31301 and NIC 31401. Likewise, storage server 3200... m May include switch 3230 mand NIC 3240 m And application server 3100 n May include switch 3130 n and NIC 3140 n .

[0160] In an exemplary embodiment of the present invention, NIC 32401 may include a network interface card, a network adapter, etc. NIC 32401 can be connected to network 3300 via a wired interface, wireless interface, Bluetooth interface, optical interface, etc. NIC 32401 may also include internal memory, a digital signal processor (DSP), a host bus interface, etc., and can be connected to processor 32101 and / or switch 32301 via the host bus interface. The host bus interface can be implemented as one of the above examples of interface 32541. In an exemplary embodiment of the present invention, NIC 32401 may be integrated with at least one of processor 32101, switch 32301, and storage device 32501.

[0161] Storage servers 32001 to 3200 m and / or application servers 31001 to 3100 n In the processor (e.g., processors 31101, 32101, 3110), n Or 3210 m ) can be sent to storage devices 31501 to 3150 n and 32501 to 3250 m Or memory 31201 to 3120 n and 32201 to 3220 m Send commands to program or read data. For example, the data may be data corrected by an error-correcting code (ECC) engine. For example, the data may be processed via Data Bus Transformation (DBI) or Data Masking (DM) and may include Cyclic Redundancy Check (CRC) information. For example, the data may be encrypted for security or privacy.

[0162] Storage devices 31501 to 3150 m and 32501 to 3250 m Control signals and command / address signals can be sent to NAND flash memory devices 32521 to 3252 in response to read commands received from the processor. m When from NAND flash memory devices 32521 to 3252 mWhen reading data, the Read Enable (RE) signal can be input as a data output control signal and can also be used to output data to the DQ bus. The RE signal can be used to generate a Data strobe (DQS). Command and address signals can be latched in the page buffer based on the rising or falling edge of the Write Enable (WE) signal.

[0163] The controller 32511 can control the overall operation of the storage device 32501. In an exemplary embodiment of the present invention, the controller 32511 may include static random access memory (SRAM). The controller 32511 can write data to the NAND flash memory device 32521 in response to a write command, or can read data from the NAND flash memory device 32521 in response to a read command. For example, data can be read from the processor 32101 in the storage server 32001, other storage servers 3200... m Processor 3210 in m Or application server 31001 to 3100 n Processors 31101 to 3110 in n Write and / or read commands are provided. DRAM 32531 can temporarily store (e.g., buffer) data to be written to or read from NAND flash memory device 32521. Additionally, DRAM 32531 can store metadata. Metadata can be data generated by controller 32511 to manage user data or NAND flash memory device 32521. Storage device 32501 may include a security element 32551 for security or privacy purposes.

[0164] Similar to controller 32511, controller 3251 m It can control storage device 3250 m The overall operation. Similarly, storage device 3250 m DRAM 3253 m and safety element 3255 m They can perform functions similar to those of DRAM 32531 and Security Elements 32551, respectively.

[0165] Storage devices 31501 to 3150 m and 32501 to 3250 m Each of them can be a reference. Figures 1 to 19C The storage device described herein is an exemplary embodiment of the invention and can perform reference to... Figures 20 to 24 The method described is an exemplary embodiment of the concept of the present invention.

[0166] Figure 26 and Figure 27This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 25 A block diagram of storage devices in a data center.

[0167] Reference Figure 26 The storage device 1000a may include a connector 1002, a storage controller 1010, multiple non-volatile memories 1020a, 1020b and 1020c, a buffer memory 1030 and a security memory 1040.

[0168] Connector 1002, storage controller 1010, multiple non-volatile memories 1020a, 1020b and 1020c, buffer memory 1030 and security memory 1040 can respectively correspond to Figure 2 The connector 110, controller 210, multiple non-volatile memories 220, buffer memory 230 and safety element 240 are included.

[0169] exist Figure 26 In the example, the security memory 1040 can be formed as a separate chip, separate from the memory controller 1010 and the multiple non-volatile memories 1020a, 1020b and 1020c.

[0170] Reference Figure 27 Storage device 1000b may include connector 1002, storage controller 1010b, multiple non-volatile memories 1020a, 1020b, and 1020c, buffer memory 1030, and security memory 1040. Except for the security memory 1040 being disposed in or included in storage controller 1010b, storage device 1000b may be connected to… Figure 26 The storage device is basically the same as the 1000a.

[0171] exist Figure 27 In one example, the security memory 1040 may be integrated with the memory controller 1010b to form a single chip. According to an exemplary embodiment of the present invention, the security memory 1040 may be integrated with one of a plurality of non-volatile memories 1020a, 1020b, and 1020c to form a single chip.

[0172] Figure 28 This illustrates exemplary embodiments of the concept according to the present invention, including... Figure 26 or Figure 27 A block diagram of the memory in a storage device.

[0173] Reference Figure 28 The memory 500 includes a memory cell array 510, an address decoder 520, a page buffer circuit 530, a data input / output (I / O) circuit 540, a voltage generator 550, and a control circuit 560. The memory 500 can be... Figure 26 and Figure 27 One of the multiple non-volatile memories 1020a, 1020b and 1020c in it, or it may be Figure 26 and Figure 27 The secure storage 1040 in the memory.

[0174] The memory cell array 510 may include multiple memory cells for storing data. The control circuit 560 can control the operation of the memory 500 based on the command CMD and the address ADDR. The control circuit 560 can also send the row address R_ADDR to the address decoder 520, the column address C_ADDR to the data I / O circuit 540, and the page buffer control signal PBC to the page buffer circuit 530. The address decoder 520 can be connected to the memory cell array 510 via multiple serial select lines SSL, multiple word lines WL, and multiple ground select lines GSL. The voltage generator 550 can generate voltages VS and VERS for the operation of the memory 500 based on the power supply voltage PWR and the control signal CON. The page buffer circuit 530 can be connected to the memory cell array 510 via multiple bit lines BL. The data I / O circuit 540 can be connected to the page buffer circuit 530 via the data line DL and can receive write data DAT or output read data DAT.

[0175] The voltage VERS can be the erase voltage VERS. The erase voltage VERS can be used to perform a secure erase process according to exemplary embodiments of the present invention.

[0176] The inventive concept can be applied to a variety of electronic devices and / or systems, including storage devices and / or SSD devices. For example, the inventive concept can be applied to systems such as: personal computers (PCs), server computers, data centers, workstations, mobile phones, smartphones, tablet computers, laptop computers, personal digital assistants (PDAs), portable multimedia players (PMPs), digital cameras, portable game consoles, music players, camcorders, video players, navigation devices, wearable devices, Internet of Things (IoT) devices, Internet of Things (IoE) devices, e-book readers, virtual reality (VR) devices, augmented reality (AR) devices, robotic devices, drones, etc.

[0177] In storage devices, SSD devices, and data centers according to exemplary embodiments of the present invention, security pads in the substrate and contact structures in the housing can be formed or disposed. When at least a portion of the housing is removed, it can be detected whether the security pads and contact structures are in electrical contact, and a secure erasure process for permanently deleting data can be performed. Therefore, in the event of the storage device being stolen, lost, or not in use, data can be effectively erased to improve or enhance security performance, thereby preventing data leakage or confirming the end of user use of the data. Because the electrical components are not damaged, they can be reused, and data in the secure data area can be selectively deleted while the storage medium including the normal data area can continue to be used.

[0178] In the method of operating a storage device according to an exemplary embodiment of the present invention, a step-by-step security process can be performed so that data can be effectively erased or removed when the casing is detected to be opened or damaged.

[0179] Although the inventive concept has been shown and described with reference to exemplary embodiments thereof, it will be apparent to those skilled in the art that various changes in form and detail may be made to the inventive concept without departing from the spirit and scope of the inventive concept as set forth in the appended claims.

Claims

1. A storage device, comprising: Substrate, the substrate including at least one security pad; At least one data storage element, said at least one data storage element being mounted on the substrate; A housing surrounding the substrate and the at least one data storage element, and including at least one contact structure for electrical connection to the at least one security pad; as well as At least one sensing pin is configured to receive an electrical signal. The level of the electrical signal changes depending on whether the at least one security pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on the change in the internal resistance of the storage device. Specifically, when at least a portion of the housing is removed, a change in the level of the electrical signal is detected, and a secure erasure process is performed on the data stored in the at least one data storage element. Wherein, the at least one contact structure includes: The first protrusion formed in the housing; and The resistive material formed on the first protrusion, and The level of the electrical signal changes depending on whether the at least one safety pad and the resistive material are in electrical contact.

2. The storage device according to claim 1, wherein, When the at least one safety pad is electrically connected to the at least one contact structure, the at least one sensing pin is connected to ground voltage, and the electrical signal has a first level. When the at least one safety pad and the at least one contact structure are not electrically connected to each other, the at least one sensing pin is connected to the power supply voltage, and the electrical signal has a second level.

3. The storage device according to claim 1, wherein, The at least one contact structure also includes a security tag attached to the housing and electrically connected to the at least one sensing pin.

4. The storage device according to claim 3, wherein, The at least one data storage element includes a packaging substrate, and The at least one sensing pin is disposed on the package substrate.

5. The storage device according to claim 1, wherein, The housing includes: Lower housing; Upper housing, coupled to the lower housing to cover the substrate and the at least one data storage element; and At least one screw, said at least one screw coupling the lower housing to the upper housing. The at least one contact structure is formed in at least one of the lower housing and the upper housing.

6. The storage device according to claim 5, wherein, When the lower housing and the upper housing are coupled by the at least one screw, the electrical connection between the at least one safety pad and the at least one contact structure is maintained, and When the lower housing is separated from the upper housing by loosening the at least one screw, the electrical connection between the at least one safety pad and the at least one contact structure is released.

7. The storage device according to claim 1, wherein, The at least one security pad includes a plurality of security pads randomly disposed on the substrate.

8. The storage device according to claim 7, wherein, The at least one contact structure further includes: Multiple protrusions formed in the housing to correspond to the positions of the multiple safety pads; and A conductive polymer is formed on at least one of the plurality of protrusions to make electrical contact with at least one of the plurality of safety pads.

9. A method of operating a storage device, the method comprising: Using multiple physical sensing structures included in the storage device to detect abnormal access to the storage device; as well as When an abnormal access to the storage device is detected, a step-by-step security process is executed, in which two or more security algorithms associated with the data stored in the storage device are executed sequentially. The storage device mentioned above includes: At least one safety pad; At least one data storage element is configured to store the data; At least one contact structure for electrical connection with the at least one safety pad; and At least one sensing pin is configured to receive an electrical signal, wherein the level of the electrical signal changes depending on whether the at least one security pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on a change in the internal resistance of the storage device. Wherein, the at least one security pad and the at least one contact structure form at least one of the plurality of physical sensing structures, and When a change in the level of the electrical signal is detected, at least one of the two or more security algorithms is executed.

10. The method according to claim 9, wherein, Performing the step-by-step security process includes: When the first physical sensing structure among the plurality of physical sensing structures detects the abnormal access, a first security algorithm for preventing access to the data is executed; and When the first physical sensing structure and a second physical sensing structure that is different from the first physical sensing structure detect the abnormal access, a second security algorithm for permanently deleting the data is executed.

11. The method according to claim 10, wherein, When the second security algorithm is executed, data stored after a specific point in time is permanently deleted.

12. The method according to claim 10, wherein, When the second security algorithm is executed, the data stored by the user is permanently deleted.

13. The method according to claim 10, wherein, When the first security algorithm is executed, the data is randomly rearranged to make it inaccessible.

14. The method according to claim 9, wherein, The at least one data storage element includes a security element. The security element is configured to be electrically attached to and detached from the storage device. The method further includes: When the secure element is electrically connected to the storage device, an authentication process for accessing the secure element is performed, and The security data stored in the security element can only be accessed when the authentication process is successfully completed.

15. The method of claim 14, further comprising: When the security element is removed from the storage device, at least one of the two or more security algorithms is executed.

16. A solid-state drive (SSD) device, comprising: Substrate, the substrate including at least one security pad; Multiple non-volatile memories are mounted on the substrate and configured to store normal data; At least one secure memory, which is mounted on the substrate and configured to store secure data; A controller, mounted on the substrate and configured to control the operation of the plurality of nonvolatile memories and the at least one secure memory; A housing surrounding the substrate, the plurality of non-volatile memories, the at least one secure memory, and the controller, and including at least one contact structure for electrical connection to the at least one secure pad; as well as At least one sensing pin is configured to receive an electrical signal. The level of the electrical signal changes depending on whether the at least one security pad is electrically connected to the at least one contact structure, and the change in the level of the electrical signal is detected based on the change in the internal resistance of the SSD device. Specifically, when at least a portion of the housing is removed, a change in the level of the electrical signal is detected, and a secure erase process is performed to permanently delete at least one of the normal data stored in the plurality of non-volatile memories and the secure data stored in the at least one secure memory. Wherein, the at least one contact structure includes: The first protrusion formed in the housing; and The resistive material formed on the first protrusion, and The level of the electrical signal changes depending on whether the at least one safety pad and the resistive material are in electrical contact.

Images