Display device and bonding device

Abstract

A display device and a bonding device are disclosed. The display device according to an embodiment includes: a substrate; a plurality of pad terminals disposed on the substrate; a driving component including a chip and a plurality of bumps, the plurality of bumps being connected to the chip and directly bonded to the plurality of pad terminals respectively; and a resin filling between the substrate and the driving component, wherein the chip includes an upper surface, a lower surface, and a side surface between the upper surface and the lower surface, and the resin covers the lower surface and the side surface of the chip.

Description

Technical Field

[0001] The present invention relates to a display device, a bonding device, and a method for manufacturing a display device using the bonding device. Background Art

[0002] A display device, as a device for displaying images, includes a display panel such as an organic light emitting display panel or a liquid crystal display panel including organic light emitting diodes (OLED) elements or quantum dot electroluminescence (QD-EL) elements.

[0003] Bumps of a chip for driving such a display device can be bonded to pads on a substrate by ultrasonic bonding. Thereafter, an underfill material is injected around the edge of the chip, and the underfill material is filled and cured between the bumps by capillary action to fix the chip. Summary of the Invention

[0004] The technical problem to be solved by the present invention is to provide a display device, a bonding device, and a method for manufacturing a display device using the bonding device with relatively high bonding reliability.

[0005] Another technical problem to be solved by the present invention is to provide a display device, a bonding device, and a method for manufacturing a display device using the bonding device capable of achieving rapid processes.

[0006] The technical problems to be solved by the present invention are not limited to the above-mentioned technical problems, and those skilled in the art can clearly understand other technical problems not mentioned from the following description.

[0007] A display device according to an embodiment for solving the above technical problems includes: a substrate; a plurality of pad terminals arranged on the substrate; a driving component including a chip and a plurality of bumps, the plurality of bumps being connected to the chip and directly bonded to the plurality of pad terminals respectively; and a resin filling between the substrate and the driving component, wherein the chip includes an upper surface, a lower surface, and a side surface between the upper surface and the lower surface, and the resin covers the lower surface and the side surface of the chip.

[0008] The plurality of pad terminals and the plurality of bumps can be ultrasonically bonded.

[0009] The resin may include an inclined surface extending from the side surface of the chip toward the substrate.

[0010] The inclined surface may include a curved surface protruding outward.

[0011] The resin may include a corner portion that surrounds at least a part of the chip and is bent so as to protrude outwardly.

[0012] According to an embodiment, a bonding device for solving the above technical problem includes: a cavity, an open lower side of which is placed on a support surface and includes an inlet and an outlet; a resin supply unit that supplies resin into the cavity through the inlet; and a pressure adjustment unit that sucks air inside the cavity from the outlet.

[0013] The cavity may include an upper part and a plurality of side walls arranged at an edge of the upper part, and the upper part and the plurality of side walls may form an internal space of the cavity that is recessed upward.

[0014] The plurality of side walls may include two long side walls extending in a first direction and two short side walls extending in a second direction intersecting the first direction, and the inlet and the outlet may be respectively arranged on the two long side walls.

[0015] The inlet may be arranged on a side wall of the cavity, and the outlet may be arranged on an upper part of the cavity.

[0016] The bonding device may further include: a resin supply pipe, one end of which is connected to the resin supply unit and the other end of which is connected to the inlet; an air suction pipe, one end of which is connected to the pressure adjustment unit and the other end of which is connected to the outlet; a first elastic pipe that is coupled to the cavity in a manner communicating with the inlet, and the other end of the resin supply pipe is inserted into a hollow portion of the first elastic pipe; and a second elastic pipe that is coupled to the cavity in a manner communicating with the outlet, and the other end of the air suction pipe is inserted into a hollow portion of the second elastic pipe.

[0017] An open side of the cavity may be sealed by the support surface.

[0018] The bonding device may further include: a shielding member, arranged at an end of an open side of the cavity and elastically deformed corresponding to the shape of the support surface.

[0019] The bonding device may further include a pressing member that presses the cavity downward.

[0020] The support surface may be one side of a substrate on which a chip is arranged, and the cavity may cover the chip in a manner of accommodating the chip in the internal space.

[0021] The chip may include a display driver integrated circuit that drives pixel circuits of a display panel.

[0022] At least a part of the cavity may be in close contact with the chip.

[0023] A method for manufacturing a display device according to an embodiment for solving the above technical problem includes the following steps: using a cavity with an open bottom to seal a driving component directly bonded to a substrate of a display panel; supplying resin into the interior of the cavity through an inlet of the cavity and sucking air inside the cavity through an outlet of the cavity, thereby coating and filling the resin between the substrate and the driving component; and removing the cavity.

[0024] The step of using the cavity with an open bottom to seal a driving component directly bonded to a substrate of a display panel may further include the step of applying pressure to the cavity in a downward direction.

[0025] The step of coating and filling the resin between the substrate and the driving component may include the step of filling a space between a plurality of bumps of the driving component that are joined to a plurality of pad terminals of the substrate.

[0026] After removing the cavity, a step of heating the resin to cure it may further be included.

[0027] Specific contents of other embodiments are included in the detailed description and the drawings.

[0028] A bonding device according to various embodiments and a method for manufacturing a display device using the bonding device can provide high bonding reliability.

[0029] A bonding device according to various embodiments and a method for manufacturing a display device using the bonding device can achieve a rapid process.

[0030] The effects according to the embodiments are not limited to those shown above, and more diverse effects are included in this specification. Description of the Drawings

[0031] Figure 1 is a plan view of a display device according to an embodiment.

[0032] Figure 2 is along Figure 1 a cross-sectional view taken along line I-I' of.

[0033] Figure 3 is a cross-sectional view of a display device according to another embodiment.

[0034] Figure 4 is a perspective view conceptually showing a bonding device according to an embodiment.

[0035] Figure 5 is Figure 4 a cross-sectional view of the bonding device of.

[0036] Figure 6 is a plan view of the cavity.

[0037] Figure 7 It is a cross-sectional view of the cavity.

[0038] Figure 8 It is a plan view of the bonding device according to another embodiment.

[0039] Figure 9 It is a plan view of the bonding device according to yet another embodiment.

[0040] Figure 10 It is a cross-sectional view of the bonding device according to yet another embodiment.

[0041] Figure 11 It is a cross-sectional view of the bonding device according to yet another embodiment.

[0042] Figure 12 It is a flowchart of the method for manufacturing a display device.

[0043] Figure 13 It is a cross-sectional view showing the case where the chip covers the cavity on the substrate.

[0044] Figure 14 It is a cross-sectional view showing the state where the resin is coated and filled between the substrate and the chip.

[0045] Figure 15 It is a cross-sectional view showing the case where the cavity is removed.

[0046] Symbol Explanation:

[0047] T: Display device

[0048] 1: Bonding device

[0049] 100: Cavity

[0050] 210: Resin supply section

[0051] 310: Pressure regulating section Detailed Description of the Embodiment

[0052] Referring to the embodiments described in detail below in conjunction with the accompanying drawings, the advantages and features of the present invention and the method for achieving these will become clear. However, the present invention will be implemented in various different forms and is not limited to the embodiments disclosed below. These embodiments are only used to make the disclosure of the present invention complete. The purpose of providing these embodiments is to fully inform those with ordinary knowledge in the technical field to which the present invention pertains of the scope of the invention, and the present invention is only defined by the scope of the claims.

[0053] When referring to an element or a layer being "on" another element or layer, it includes all cases where it is immediately above the other element or where there are other layers or elements sandwiched in between. Throughout the specification, the same reference numerals refer to the same components. The shapes, dimensions, ratios, angles, quantities, etc. disclosed in the drawings for illustrating the embodiments are exemplary, and the present invention is not limited to the matters shown in the drawings.

[0054] Hereinafter, specific embodiments will be described with reference to the drawings.

[0055] Figure 1 It is a plan view of a display device according to an embodiment.

[0056] Hereinafter, as an example of the bonding object of the bonding device 1 according to an embodiment, the substrate SUB and the driving component DM of the display device T are exemplarily shown, but it is not limited thereto. The bonding object of the bonding device 1 may include various semiconductor chips IC that can be pasted on the substrate SUB by underfill resin UF.

[0057] Referring to Figure 1 , the display device T may be a rectangle with vertical corners or a rectangle with rounded corners in a plane. The planar shape of the display device T is not limited thereto and may have a circular, oval or other various shapes.

[0058] The display device T may include a display area DA and a non-display area NDA.

[0059] The display area DA displays an image. The display area DA may include a plurality of pixels. The display area DA may be a rectangle with vertical corners or a rectangle with rounded corners in a plane. The planar shape of the display area DA is not limited to a rectangle and may have a circular, oval or other various shapes.

[0060] The non-display area NDA is arranged around the display area DA. The non-display area NDA may be arranged to surround the display area DA. The non-display area NDA may form a border of the display area DA. The non-display area NDA may be an area other than the display area DA.

[0061] The display device T may include a display panel DP and a driving component DM.

[0062] For example, the display panel DP may be an organic light emitting display panel, but is not limited thereto. The display panel DP includes not only an organic light emitting display panel, but also various types of display panels such as a liquid crystal display (LCD) panel, a field emission display (FED) panel, and an electrophoretic device. Although not illustrated in the drawings, a plurality of conductive layers, a plurality of insulating layers, and an organic light emitting layer for constituting a pixel circuit for displaying an image may be stacked on the substrate SUB described later.

[0063] The display panel DP may include a substrate SUB, a plurality of pad terminals PE, and a plurality of wirings WL.

[0064] The substrate SUB may be disposed across the display area DA and the non-display area NDA. The substrate SUB may be a rigid substrate made of glass, quartz, etc. The substrate SUB may also be a flexible substrate capable of realizing bending, folding, rolling, etc.

[0065] The substrate SUB may be made of an insulating material such as a polymer resin. Examples of the above polymer materials may include polyethersulphone (PES), polyacrylate (PA), polyarylate (PAR), polyetherimide (PEI), polyethylene napthalate (PEN), polyethylene terepthalate (PET), polyphenylene sulfide (PPS), polyallylate, polyimide (PI), polycarbonate (PC), cellulose triacetate (CAT), cellulose acetate propionate (CAP), or a combination thereof.

[0066] The substrate SUB may include a main body portion MA and a pad portion PA. The substrate SUB may further include a bending portion BA and a printed circuit board PCB.

[0067] The main body MA can be a rectangle with perpendicular corners or a rectangle with rounded corners on a plane. The planar shape of the main body MA is not limited to a rectangle and can have a circular, oval, or various other shapes. The middle part of the main body MA can be arranged in the display area DA, and the edge of the main body MA can be arranged in the non-display area NDA.

[0068] The pad part PA is arranged on one side of the main body MA. The pad part PA can be arranged in the non-display area DA. The pad part PA can be connected to one side of the main body MA. The pad part PA has a smaller width than the main body MA, so that it is arranged to protrude from one side of the main body MA on the plane.

[0069] The bending part BA can be arranged between the main body MA and the pad part PA. The bending part BA can be arranged in the non-display area NDA. One side of the bending part BA can be connected to the main body MA, and the other side can be connected to the pad part PA. The bending part BA can be bent along the thickness direction with the bending line BL as the reference. Accordingly, at least a part of the bending part BA, the pad part PA, and the main body MA can overlap along the thickness direction. In some embodiments, the bending part BA can be omitted, and the main body MA and the pad part PA can be directly connected.

[0070] In some embodiments, the pad part PA and / or the bending part BA can be replaced by a flexible film or a printed circuit board PCB adhered to one side of the main body MA. In this case, the driving component DM described later can be arranged on the flexible film or the printed circuit board PCB.

[0071] A plurality of pad terminals PE can be arranged on the pad part PA. The plurality of pad terminals PE can be connected to a plurality of wirings WL extending from the display area DA.

[0072] The driving component DM is adhered to the plurality of pad terminals PE.

[0073] Hereinafter, Figure 2 will be described in detail for the driving component DM.

[0074] Figure 2 is a cross-sectional view taken along the Figure 1 I-I' line.

[0075] Referring to Figure 1 and Figure 2 the driving component DM can include a chip IC and a plurality of bumps BP.

[0076] For example, the chip IC can be adhered to the substrate SUB in the form of chip on plastic (COP), chip on film (COF), or chip on glass (COG). The chip IC can include a display driver integrated circuit for driving the pixel circuits of the display panel DP.

[0077] A plurality of bumps BP are electrically connected to the chip IC. The bumps BP can include at least one of gold (Au), nickel (Ni), and tin (Sn).

[0078] As described above, the driving component DM can be adhered to the pad portion PA of the display panel DP. Specifically, a plurality of pad terminals PE can be provided on the pad portion PA of the display panel DP, and each bump BP of the driving component DM can be electrically connected to each pad terminal PE of the display panel DP.

[0079] As an embodiment, the bumps BP of the driving component DM can be directly joined to the pad terminals PE without interposing other layers or structures. Figure 3 A pair of directly joined bumps BP and pad terminals PE are illustrated, however, the bumps BP and pad terminals PE can have various arrangements and numbers. The direct joining of the bumps BP and pad terminals PE of the driving component DM as described above can be achieved by ultrasonic welding.

[0080] Specifically, the bumps BP of the driving component DM can be placed on the pad terminals PE of the display panel DP, and ultrasonic treatment can be performed under constant pressure. In this case, frictional force can be generated at the interface between the bumps BP and the pad terminals PE, and the interface between the bumps BP and the pad terminals PE can be locally melted, so that the components of the bumps BP and the pad terminals PE can diffuse locally towards each other simultaneously. As a result, the pad terminals PE can have a partial region formed by the diffusion of the components contained in the bumps BP of the driving component DM. At the same time, the bumps BP of the driving component DM can have a partial region formed by the diffusion of the components contained in the pad terminals PE. Accordingly, the bumps BP and the pad terminals PE can be directly joined to each other. The interface of the directly joined bumps BP and pad terminals PE can have an uneven shape after melting and solidification. And alloys of different substances can be formed at the interface due to the diffusion of components with each other.

[0081] The display device T may further include a resin UF that bonds the substrate SUB and the driving component DM. The resin UF may be filled and coated between the directly bonded bumps BP and the pad terminals PE. The resin UF includes an underfill resin UF. In some embodiments, the bumps BP and the pad terminals PE may be ultrasonically bonded. The coating and filling of the resin UF may be performed by the bonding device 1 described below. Hereinafter, Figures 4 to 15 the bonding device 1 and a method for manufacturing a display device T using the bonding device 1 will be described in detail.

[0082] Referring to Figure 1 , the resin UF may be arranged on a plane to protrude from the edge of the chip IC. Specifically, a part of the resin UF may be filled in the space between the substrate SUB and the chip IC, and another part of the resin UF may be exposed to the outside. As an embodiment, the chip IC may include an upper surface, a lower surface, and at least one side surface between the upper surface and the lower surface, and the resin UF may be arranged such that a part exposed to the outside covers at least one side surface of the chip IC. In some embodiments, the resin UF may also be arranged to cover only a part of at least one side surface of the chip IC.

[0083] Referring again to Figure 1 and Figure 2 , the resin UF may include an inclined surface.

[0084] The inclined surface of the resin UF extends from at least one side surface of the chip IC toward the substrate SUB. The inclined surface of the resin UF may extend at a predetermined angle with respect to the upper surface of the chip IC or the substrate SUB. In one embodiment, the angle between the inclined surface of the resin UF and the upper surface of the chip IC or the substrate SUB may be about 60° or less. In some embodiments, the angle between the inclined surface of the resin UF and the upper surface of the chip IC or the substrate SUB may be about 45° or less. In one embodiment, the inclined surface may include a curved surface protruding outward. In some embodiments, the inclined surface may be a flat surface. In some embodiments, the inclined surface may include both a flat surface and a curved surface.

[0085] Figure 3 is a cross-sectional view of a display device according to another embodiment.

[0086] Figure 3 The display device T of Figure 1 is different from the display device T of

[0087] Referring to Figure 3 , the resin UF may include a corner portion C.

[0088] Referring to Figure 1 and Figure 3, the corner portion C of the resin UF can be arranged to surround at least a part of the chip IC. Specifically, the corner portion C of the resin UF can be arranged in a plane to surround the edge of the chip IC. In one embodiment, the corner portion C of the resin UF can be arranged in a plane to be a rectangular shape that completely surrounds the edge of the chip IC. The corner portion C of the resin UF can have a shape that is curved so as to protrude outward. The corner portion C of the resin UF can have a shape that protrudes sharply in cross-section. In one embodiment, the resin UF can include: an upper surface arranged side by side with the upper surface of the chip IC; a side surface that bends from one end of the upper surface and extends toward the substrate SUB; and a corner portion C formed by the intersection of the upper surface and the side surface. The corner portion C of the resin UF can include a curved surface that protrudes outward.

[0089] Except that the resin UF includes the corner portion C, Figure 3 the display device T of Figure 1 is substantially the same as or similar to the display device T of

[0090] Therefore, the repeated description is omitted below.

[0091] As described above, the resin UF can be filled and coated by the bonding device 1.

[0091] Hereinafter, with reference to Figure 4 and Figure 11 , the bonding device 1 will be described in detail.

[0092] Figure 4 A perspective view conceptually showing a bonding device according to an embodiment. Figure 5 is Figure 4 A cross-sectional view of the bonding device of

[0093] Hereinafter, the first direction X, the second direction Y, and the third direction Z intersect along directions different from each other. The first direction X can be the lateral direction. The second direction Y can be the longitudinal direction. The third direction Z can be the thickness direction or the height direction. Based on Figure 1 as a reference, the third direction Z facing upward can be the upper side direction, and the third direction Z facing downward can be the lower side direction. Accordingly, based on any one component, the surface located in the upper side direction can be called the upper surface, and the surface located on the opposite side of the upper surface can be called the lower surface. However, the above directions are exemplary and relative directions and are not limited to the above.

[0094] With reference to Figure 3 and Figure 4 , the bonding device 1 according to an embodiment can be a device that injects the underfill resin UF between the substrate SUB and the chip IC to bond the substrate SUB and the chip IC.

[0095] The bonding device 1 may include a cavity 100, a resin supply unit 210, and a pressure adjustment unit 310. The bonding device 1 may further include at least one of a resin supply pipe 220, an air suction pipe 320, an elastic tube 400, and a pressing member 500.

[0096] The cavity 100 may have a shape corresponding to a chip IC on a substrate SUB described later. In one embodiment, the cavity 100 may have a shape of a long rectangular parallelepiped including an upper portion 101 forming an internal space and a plurality of side walls 102, but is not limited thereto. The upper portion 101 of the cavity 100 may include a covering portion covering the substrate SUB and / or the chip IC on the substrate SUB. In one embodiment, the cavity 100 may include a material with a high thermal conductivity (e.g., metal).

[0097] One side of the cavity 100 may be open. For example, the cavity 100 may have a shape of a cover covering the chip IC on the substrate SUB. In one embodiment, one side of the cavity 100 may be the lower side of the cavity 100. The open side of the cavity 100 may be covered by a support surface on which the cavity 100 is placed. In one embodiment, the open side of the cavity 100 may be sealed by the support surface to form a negative pressure or a vacuum in the internal space of the cavity 100. The support surface may be one surface of the substrate SUB. The cavity 100 may cover the chip IC arranged on the substrate SUB. The cavity 100 may receive the chip IC on the substrate SUB into the internal space through the open lower side. The substrate SUB may be a rigid substrate or a flexible substrate. The chip IC may be at least one of a chip on plastic (COP), a chip on film (COF), and a chip on glass (COG). Refer to Figure 1 and Figure 2 , in some embodiments, the substrate SUB may be a substrate SUB of a display panel DP, and the chip IC may be a chip IC of a driving component DM directly bonded to the substrate SUB of the display panel DP. In some embodiments, the chip IC may include a plurality of bumps BP, the substrate SUB may include a plurality of pad terminals PE, the plurality of bumps BP and the plurality of pad terminals PE may be directly bonded respectively, and a plurality of gaps may be formed between the chip IC and the substrate SUB. The pitch of the gaps may be about 10 μm to 25 μm. In Figure 4 , the bumps BP may protrude from the lower surface of the chip IC, but the bumps BP and the pad terminals PE may have various shapes and arrangements.

[0098] The cavity 100 may include an inlet OP_1 and an outlet OP_2.

[0099] The inlet OP_1 can be connected to the resin supply unit 210. Specifically, the inlet OP_1 can communicate with a resin supply pipe 220 described later to allow the resin UF of the resin supply unit 210 to flow into the internal space of the cavity 100. In one embodiment, the inlet OP_1 can be disposed on the sidewall 102 of the cavity 100. In some embodiments, the inlet OP_1 can also be disposed on the upper portion 101 of the cavity 100.

[0100] The outlet OP_2 can be connected to the pressure regulating unit 310. Specifically, the outlet OP_2 can communicate with an air suction pipe 320 described later to discharge the air inside the cavity 100 to the outside. In one embodiment, the outlet OP_2 can be disposed on the sidewall 102 of the cavity 100. In some embodiments, the outlet OP_2 can also be disposed on the upper portion 101 of the cavity 100.

[0101] In one embodiment, the inlet OP_1 and the outlet OP_2 can be respectively disposed on the sidewalls 102 of the cavity 100 facing each other. In some embodiments, the inlet OP_1 and the outlet OP_2 can also be disposed on one sidewall 102 of the cavity 100. In some embodiments, at least one of the inlet OP_1 and the outlet OP_2 can be disposed on the upper portion 101 of the cavity 100.

[0102] The resin supply unit 210 supplies the resin UF to the internal space of the cavity 100. The resin UF can be an underfill resin UF coated and filled between the substrate SUB and the chip IC. The resin UF can include at least one of a polyester resin, a transparent polyurethane resin, an acrylic resin, an ultraviolet curable resin, and an epoxy resin. The epoxy resin can include a rapid curing epoxy resin and a low viscosity epoxy resin. In some embodiments, the resin supply unit 210 can include a pump that discharges the resin UF at a predetermined pressure.

[0103] One end of the resin supply pipe 220 is connected to the resin supply unit 210, and the other end is connected to the inlet OP_1. The hollow portion of the resin supply pipe 220 can communicate with the internal space of the cavity 100. In one embodiment, the other end of the resin supply pipe 220 can be inserted into and / or fixed to the inlet OP_1 of the cavity 100. The resin supply pipe 220 can include a pipe or a hose made of an elastic material. In some embodiments, the bonding device 1 can further include an adjustment component (such as a clamp or a valve, etc.) for adjusting the flow rate of the resin UF flowing through the resin supply pipe 220.

[0104] The pressure regulating unit 310 regulates the pressure of the internal space of the cavity 100. Specifically, the pressure regulating unit 310 can regulate the pressure of the internal space of the cavity 100 so that an appropriate amount of resin UF flows into the internal space of the cavity 100. In one embodiment, the pressure regulating unit 310 can create a negative pressure in the internal space of the cavity 100. The negative pressure can be lower than the pressure of the external space of the cavity 100 or the atmospheric pressure. Specifically, the pressure regulating unit 310 can suck the air inside the cavity 100 through the outlet OP_2, so that the resin UF of the resin supply unit 210 flows into the internal space of the cavity 100 through the inlet OP_1. In some embodiments, the pressure regulating unit 310 can make the internal space of the cavity 100 a vacuum. In some embodiments, when a sufficient amount of resin UF flows into the internal space of the cavity 100, the pressure regulating unit 310 can interrupt the suction of air, so that the resin UF does not flow into the internal space of the cavity 100 additionally. In some embodiments, the pressure regulating unit 310 can also increase the pressure of the internal space of the cavity 100. In one embodiment, the pressure regulating unit 310 can include a vacuum pump.

[0105] One end of the air suction pipe 320 is connected to the pressure regulating unit 310, and the other end is connected to the outlet OP_2. The hollow portion of the air suction pipe 320 can communicate with the internal space of the cavity 100. In one embodiment, the other end of the air suction pipe 320 can be inserted into and / or fixed to the outlet OP_2 of the cavity 100. The air suction pipe 320 can include a pipe or a hose made of an elastic material. In some embodiments, the bonding device 1 can further include an adjusting component (such as a clamp or a valve, etc.) for adjusting the flow rate of the air flowing through the air suction pipe 320.

[0106] The elastic tube 400 can be a tube made of an elastic material including a hollow portion. The elastic tube 400 can be arranged at the inlet OP_1 and / or the outlet OP_2 of the cavity 100. The elastic tube 400 can be arranged to protrude from the upper part 101 or the side wall 102 of the cavity 100 by a predetermined height. The elastic tube 400 can provide a restoring force to the resin UF inlet pipe and / or the air suction pipe 320. The elastic tube 400 can limit the movement of the resin UF inlet pipe and / or the air suction pipe 320 within a predetermined range, thereby preventing the resin UF inlet pipe and / or the air suction pipe 320 from being bent and making it easy to adjust the injection amount of air or resin UF. The elastic tube 400 can include a first elastic tube 410 arranged at the inlet OP_1 and a second elastic tube 420 arranged at the outlet OP_2.

[0107] The first elastic tube 410 may be arranged in the upper part 101 or the side wall 102 of the cavity 100 in a manner that communicates with the inflow port OP_1 of the cavity 100. The other end of the resin supply tube 220 may be inserted into the hollow portion of the first elastic tube 410. At least a part of the resin supply tube 220 may be received in the hollow portion of the first elastic tube 410.

[0108] The second elastic tube 420 may be arranged in the upper part 101 or the side wall 102 of the cavity 100 in a manner that communicates with the outflow port OP_2 of the cavity 100. The other end of the air suction tube 320 may be inserted into the hollow portion of the second elastic tube 420. At least a part of the air suction tube 320 may be received in the hollow portion of the second elastic tube 420.

[0109] The pressing member 500 may apply a force downward to the cavity 100. Specifically, when the resin UF flows into the internal space of the cavity 100 or the air in the internal space of the cavity 100 flows out, the pressing member 500 presses the cavity 100 so that the cavity 100 closely adheres to the support surface or the substrate SUB. The pressing member 500 may prevent the cavity 100 from tilting due to the inflow of the resin UF, the outflow of the air, or the shape of the support surface. The pressing member 500 may move and / or expand and contract in the vertical direction. The pressing member 500 may include a cylinder.

[0110] Hereinafter, Figure 6 and Figure 7 the arrangement of the cavity 100 will be described in detail.

[0111] Figure 6 is a plan view of the cavity. Figure 7 is a cross-sectional view of the cavity.

[0112] For the sake of convenience of description, Figure 6 the illustration of the upper part 101 of the cavity 100 is omitted.

[0113] Referring to Figures 1 to 7 , as described above, the cavity 100 may include an upper part 101 and a plurality of side walls 102. The plurality of side walls 102 may extend downward from the edge of the upper part 101 to form an internal space of the cavity 100 that is recessed upward. In one embodiment, the internal space of the cavity 100 may have a rectangular parallelepiped shape.

[0114] The upper part 101 of the cavity 100 may have a rectangular shape including two short sides extending in the first direction X and two long sides extending in the second direction Y on a plane.

[0115] The multiple side walls 102 of the cavity 100 may include two long side walls 102_1, 102_2 extending in the second direction Y on a plane and two short side walls 102_3, 102_4 extending in the first direction X intersecting with the second direction Y. In some embodiments, the cavity 100 may include at least one inner side wall extending a predetermined distance from the inner side surfaces of the two long side walls 102_1, 102_2 and / or the two short side walls 102_3, 102_4 toward the chip IC disposed on the substrate SUB. The position of the cavity 100 relative to the chip IC on the substrate SUB can be aligned by the at least one inner side wall.

[0116] The inflow port OP_1 and the outflow port OP_2 may be respectively disposed on two side walls 102 facing each other. In one embodiment, the inflow port OP_1 and the outflow port OP_2 may be respectively disposed on the two long side walls 102_1, 102_2, and the first elastic tube 410 and the second elastic tube 420 may be disposed to protrude outward from the two side walls 102 facing each other. Accordingly, the flow distance of the resin UF flowing into the interior of the cavity 100 can be shortened. In some embodiments, the inflow port OP_1 and the outflow port OP_2 may also be respectively disposed on two adjacent side walls 102. For example, the inflow port OP_1 may be disposed on the long side walls 102_1, 102_2 or the short side walls 102_3, 102_4, and the outflow port OP_2 may be disposed on the short side walls 102_3, 102_4 or the long side walls 102_1, 102_2. In some embodiments, the inflow port OP_1 and the outflow port OP_2 may be disposed at the same height from the support surface. In some embodiments, the inflow port OP_1 and the outflow port OP_2 may be disposed at different heights from the support surface. For example, the outflow port OP_2 may be disposed higher than the inflow port OP_1.

[0117] The multiple side walls 102 of the cavity 100 may be disposed such that at least a part thereof is separated from the chip IC disposed on the substrate SUB. In one embodiment, the long side walls 102_1, 102_2 of the cavity 100 may be separated from the chip IC by a first distance D1 in the first direction X, and the short side walls 102_3, 102_4 of the cavity 100 may be separated from the chip IC by a second distance D2 in the second direction Y. The first distance D1 may be greater than the second distance D2. Accordingly, the resin UF can flow sufficiently in the second direction Y in the internal space between the long side walls 102_1, 102_2 of the cavity 100 and the side surfaces of the chip IC. In some embodiments, the short side walls 102_3, 102_4 of the cavity 100 may be in close contact with the chip IC.

[0118] The upper portion 101 of the cavity 100 can be arranged to be in close contact with the chip IC disposed on the substrate SUB. Specifically, the lower surface of the upper portion 101 of the cavity 100 that constitutes the internal space of the cavity 100 and the upper surface of the chip IC can be in close contact. Accordingly, it is possible to prevent the resin UF in the internal space of the cavity 100 from being coated on the upper surface of the chip IC. In one embodiment, the height h1 of the internal space of the cavity 100 can be substantially the same as the sum of the thickness h2 of the chip IC, the height h3 of the bump BP, and the height h4 of the pad terminal PE. For example, the height h1 of the internal space of the cavity 100 can be about 250 μm to 270 μm. Here, the thickness of the chip IC can be about 245 μm to 255 μm, and the height of the bonded bump BP and pad terminal PE can be about 5 μm to 15 μm.

[0119] The bonding device 1 can seal the chip IC on the substrate SUB by using the cavity 100 with one side open, and cause the underfill resin UF to flow into the internal space of the cavity 100 where a negative pressure or vacuum is formed, so that the underfill resin UF is coated and filled in the space between the substrate SUB and the chip IC at one time. Thus, compared with the existing method of bonding using capillary action, a rapid process can be achieved. Moreover, it is possible to fill the fine gap between the bonded bump BP and the pad terminal PE structure with the underfill resin UF having a high viscosity or high adhesive force, thereby ensuring a high bonding reliability.

[0120] Hereinafter, Figures 8 to 11 a plurality of embodiments of the bonding device 1 will be described.

[0121] Figure 8 is a plan view of a bonding device according to another embodiment. Figure 9 is a plan view of a bonding device according to still another embodiment.

[0122] For the sake of convenience of explanation, Figure 8 and Figure 9 the illustration of the upper portion 101 of the cavity 100 is omitted.

[0123] Figure 8 and Figure 9 the bonding device 1a is different from Figure 4 the bonding device 1 in that it includes a plurality of inlets OP_1.

[0124] Referring to Figure 8 and Figure 9 , the lengths of the plurality of side walls 102 and the arrangements of the inlets OP_1 and the outlets OP_2 can vary according to the shape of the chip IC.

[0125] Referring to Figure 8, when the shape of the chip IC is longer along the second direction Y, a plurality of inlets OP_1 may be arranged in any one of the long side walls 102_1 and 102_2. For example, the plurality of inlets OP_1 may be arranged in the long side wall 102_1 arranged on the left side in Figure 8 . The number of inlets OP_1 arranged may vary according to the ratio of the lengths of the long side walls 102_1 and 102_2 and the lengths of the short side walls 102_3 and 102_4. In some embodiments, when the ratio of the lengths of the long side walls 102_1 and 102_2 to the lengths of the short side walls 102_3 and 102_4 is about 2:1 or more, two or more inlets OP_1 may be arranged in any one of the long side walls 102_1 and 102_2. In some embodiments, when the ratio of the lengths of the long side walls 102_1 and 102_2 to the lengths of the short side walls 102_3 and 102_4 is about n:1 or more, n - 1 inlets OP_1 may be arranged in any one of the long side walls 102_1 and 102_2. In some embodiments, a plurality of outlets OP_2 may also be arranged in any one of the long side walls 102_1 and 102_2.

[0126] Referring to Figure 9 , when the lengths of the long side walls 102_1 and 102_2 and the lengths of the short side walls 102_3 and 102_4 are almost the same, the inlet OP_1 may be arranged in at least one of the short side walls 102_3 and 102_4. Specifically, in Figure 9 , one inlet OP_1 may be arranged in the left long side wall 102_1, the upper short side wall 102_3, and the lower short side wall 102_4 respectively. In some embodiments, when the ratio of the lengths of the long side walls 102_1 and 102_2 to the lengths of the short side walls 102_3 and 102_4 is about 2:1 or less, the inlet OP_1 may be arranged in at least one of the short side walls 102_3 and 102_4.

[0127] Except for including a plurality of inlets OP_1, Figure 8 and Figure 9 the bonding devices 1a and 1b of Figure 4 are substantially the same as or similar to the bonding device 1 of

[0128] Figure 10 So the repeated description is omitted.

[0129] Figure 10 The bonding device 1c of Figure 4 is different from the bonding device 1 of

[0130] Referring to Figure 10, the outlet OP_2 can be arranged at the upper part 101 of the cavity 100, and the inlet OP_1 can be arranged at any one of the plurality of side walls 102 of the cavity 100. For example, the inlet OP_1 can be arranged at Figure 10 the long side wall 102_1 on the left side. Thus, when performing a bonding process that requires delicate operations, the bonding device 1 can be easily operated, and the space for the bonding process can be saved.

[0131] The outlet OP_2 can be arranged at the center of the upper part 101 of the cavity 100. In this case, the upper part 101 of the cavity 100 can be separated from the upper surface of the chip IC by a predetermined distance G1. In some embodiments, the outlet OP_2 can also be arranged in a region adjacent to the edge of the upper part 101 of the cavity 100. For example, the outlet OP_2 can be arranged in a partial region of the upper part 101 of the cavity 100 that covers the distance between the side wall 102 of the cavity 100 and the chip IC. In this case, the upper part 101 of the cavity 100 can still be in close contact with the upper surface of the chip IC.

[0132] In some embodiments, the short side walls 102_3, 102_4 of the cavity 100 can be in close contact with the side surface of the chip IC. In some embodiments, the inlet OP_1 can also be arranged at any one of the short side walls 102_3, 102_4 of the cavity 100.

[0133] Except for the fact that the outlet OP_2 is arranged at the upper part 101 of the cavity 100, Figure 10 the bonding device 1c and Figure 4 the bonding device 1 are substantially the same or similar, so the repeated description is omitted below.

[0134] Figure 11 is a cross-sectional view of a bonding device according to another embodiment.

[0135] Figure 11 The bonding device 1d differs from Figure 4 the bonding device 1 in that it further includes a shielding member 600.

[0136] Referring to Figure 11 , the bonding device 1d can further include a shielding member 600.

[0137] The shielding member 600 can be arranged at the end of the open side of the cavity 100. When the cavity 100 is placed on a support surface, the shielding member 600 can be arranged between the support surface and the cavity 100. The shielding member 600 can be arranged following the border of the open side of the cavity 100. When the cavity 100 has a cuboid shape as in Figure 4 the embodiment, the shielding member 600 can be arranged in a rectangular strip shape across the ends of the plurality of side walls 102.

[0138] The shielding member 600 may include elastic members (such as rubber and silicone resin, etc.).

[0139] The shielding member 600 may be elastically deformed corresponding to the shape of the support surface. Even when the shielding member 600 is elastically deformed due to the pressing of the pressing member 500 and unevenness is formed on the substrate SUB due to a plurality of wirings WL or the like, the gap between the substrate SUB and the cavity 100 can be sealed.

[0140] The upper portion 101 of the cavity 100 and the chip IC may be separated by a predetermined distance G1. Thereby, damage to the chip IC caused by the lifting of the upper portion 101 of the cavity 100 can be prevented.

[0141] Except for further including the shielding member 600 Figure 11 the bonding device 1d and Figure 4 the bonding device 1 are substantially the same or similar, and thus the repeated description is omitted below.

[0142] Hereinafter, Figures 12 to 15 a method for manufacturing the display device T using the bonding device 1 will be described.

[0143] Figure 12 is a flowchart of a method for manufacturing a display device. Figure 13 is a cross-sectional view illustrating a situation where a chip on a substrate covers a cavity. Figure 14 is a cross-sectional view illustrating a state where resin is coated and filled between a substrate and a chip. Figure 15 is a cross-sectional view illustrating a situation where a cavity is removed.

[0144] Figures 12 to 15 The method for manufacturing the display device T can be performed by Figure 4 the bonding device 1.

[0145] Referring to Figure 12 , the method for manufacturing the display device T may include the following steps: sealing the driving member DM directly bonded to the substrate SUB of the display panel DP using the cavity 100 open at the lower side (S101); supplying the resin UF to the inside of the cavity 100 through the inlet OP_1 of the cavity 100 and sucking the air inside the cavity 100 through the outlet OP_2 of the cavity 100, thereby coating and filling the resin UF between the substrate SUB and the driving member DM (S102); and removing the cavity 100 (S103).

[0146] The step (S101) of sealing the driving member DM directly bonded to the substrate SUB of the display panel DP using the cavity 100 open at the lower side may further include the following step: pressing the cavity 100 in the downward direction.

[0147] The step (S102) of coating and filling the resin UF between the substrate SUB and the driving component DM may further include the step of filling the space between the plurality of bump terminals BP of the driving component DM that are joined to the plurality of pad terminals PE of the substrate SUB.

[0148] In the method of manufacturing the display device T, after removing the cavity 100, a step of heating the resin UF to cure it may further be included.

[0149] In the method of manufacturing the display device T, before removing the cavity 100, a step of heating the cavity 100 to cure the resin UF may further be included.

[0150] The method of manufacturing the display device T is not limited to the above examples. Referring to various embodiments of this specification, at least one of the above steps may be omitted or at least one other step may further be included.

[0151] Hereinafter, with reference to Figures 13 to 15 The method of manufacturing the display device T will be described in detail.

[0152] With reference to Figure 13 , the cavity 100 may be disposed on the substrate SUB in such a manner as to cover the chip IC directly joined to the substrate SUB. The pad terminals PE of the substrate SUB and the bump terminals BP of the chip IC may be directly joined, and a plurality of minute gaps may be formed in the space between the substrate SUB and the cavity 100. In one embodiment, the substrate SUB may be the substrate SUB of the display panel DP, and the chip IC may be a driving integrated circuit. The pad terminals PE of the substrate SUB of the display panel DP and the bump terminals BP of the driving component DM may be in a state of ultrasonic bonding. For example, the chip IC may be a chip on plastic (COP), a chip on film (COF), or a chip on glass (COG).

[0153] The lower side of the cavity 100 is open, and an internal space that is recessed upward is formed to be arranged to accommodate the chip IC in the internal space. In one embodiment, the upper portion 101 of the cavity 100 may be in close contact with the chip IC, and the side wall 102 of the cavity 100 may be spaced apart from the chip IC.

[0154] Before disposing the cavity 100, the resin supply pipe 220 and the air suction pipe 320 may be respectively connected to the inflow port OP_1 and the outflow port OP_2. In some embodiments, after disposing the cavity 100, the resin supply pipe 220 and the air suction pipe 320 may also be respectively connected to the inflow port OP_1 and the outflow port OP_2.

[0155] With reference to Figure 14, after the placement of the cavity 100, the pressurizing member 500 can apply a downward force to the cavity 100. In one embodiment, the pressurizing member 500 can descend toward the cavity 100 and closely adhere to the upper portion 101 of the cavity 100. Accordingly, the gap between the cavity 100 and the substrate SUB can be sealed. The pressurizing member 500 can maintain the pressure during the period when the resin UF flows into the internal space of the cavity 100.

[0156] After sealing the internal space of the cavity 100, the pressure regulating unit 310 can discharge the air inside the cavity 100 to the outside through the outflow port OP_2. In some embodiments, the inside of the cavity 100 can become a state close to vacuum. As the pressure inside the internal space of the cavity 100 decreases, the resin UF can flow in through the inflow port OP_1.

[0157] The resin UF can flow along the substrate SUB and the inner side surface forming the internal space of the cavity 100 and coat and fill the gap between the chip IC and the substrate SUB. In one embodiment, the resin UF can be filled in a manner that fills the entire internal space of the cavity 100. In some embodiments, the resin UF can be filled in a manner that fills only a part of the internal space of the cavity 100.

[0158] When a sufficient amount of the resin UF is filled, the pressure regulating unit 310 can stop operating to prevent the additional inflow of the resin UF. At this time, the pressurizing member 500 can rise upward to release the pressure applied to the cavity 100.

[0159] Refer to Figure 15 , after finishing the coating and filling of the resin UF, the cavity 100 can be removed. After removing the cavity 100, the resin UF on the substrate SUB can be thermally cured. Accordingly, a shape of the resin UF as Figure 2 can be formed.

[0160] In some embodiments, before removing the cavity 100, the cavity 100 can be heated to thermally cure the resin UF in the internal space of the cavity 100. Accordingly, a shape of the resin UF as Figure 3 shown can be formed. In some embodiments, before removing the cavity 100, the cavity 100 can be heated to cure a part of the resin UF.

[0161] In some embodiments, the resin UF can also be cured by ultraviolet rays. The ultraviolet curing can be performed by irradiating ultraviolet rays toward the side surface or the lower surface direction of the chip IC. In this case, the substrate SUB and / or the cavity 100 can be made of a transparent material that can transmit ultraviolet rays.

[0162] A display device, a bonding device, and a method of manufacturing a display device using the bonding device according to various embodiments can provide high bonding reliability.

[0163] A display device, a bonding device, and a method of manufacturing a display device using the bonding device according to various embodiments can achieve rapid processes.

[0164] The embodiments of the present invention have been described above with reference to the accompanying drawings. However, those of ordinary skill in the art to which the present invention pertains will understand that the present invention can be implemented in other specific forms without changing its technical idea or essential features. Therefore, the embodiments described above should be considered exemplary in all respects and not restrictive.

Claims

1. A bonding device, comprising: A cavity configured such that a lower side including an open opening is placed on a support surface, and including an inlet and an outlet; A resin supply unit that supplies resin into the cavity through the inlet; A pressure regulating unit that sucks air inside the cavity from the outlet during the supply of the resin; And A pressing member disposed above the cavity and applying a force in a direction toward the lower side of the cavity, and maintaining the pressing during the supply of the resin, The support surface is a part of an object of a bonding process, The size of the opening on the lower side is smaller than the size of the object, When the lower side is placed on the support surface, the lower side of the cavity is in direct contact with the upper surface of the support surface, and at least a part of the support surface is located outside the internal space of the cavity in a plan view.

2. The bonding device according to claim 1, wherein The cavity includes an upper part and a plurality of side walls disposed at an edge of the upper part, and the upper part and the plurality of side walls form an internal space of the cavity that is recessed upward.

3. The bonding device according to claim 2, wherein The plurality of side walls include two long side walls extending in a first direction and two short side walls extending in a second direction intersecting the first direction, and the inlet and the outlet are respectively disposed on the two long side walls.

4. The bonding device according to claim 1, further comprising: A resin supply pipe having one end connected to the resin supply unit and the other end connected to the inlet; An air suction pipe having one end connected to the pressure regulating unit and the other end connected to the outlet; A first elastic pipe coupled to the cavity in communication with the inlet, and the other end of the resin supply pipe is inserted into a hollow portion of the first elastic pipe; And A second elastic pipe coupled to the cavity in communication with the outlet, and the other end of the air suction pipe is inserted into a hollow portion of the second elastic pipe.

5. The bonding device according to claim 1, wherein An open side of the cavity is sealed by the support surface.

6. The bonding device according to claim 1, wherein The support surface is one side of a substrate on which a chip is disposed, and the cavity covers the chip in a manner of accommodating the chip in an internal space. When the lower side of the cavity is placed on the support surface, the lower side of the cavity is in direct contact with the upper surface of the chip.

7. A display device, comprising: A substrate; A plurality of pad terminals disposed on the substrate; A driving component including a chip and a plurality of bumps, the plurality of bumps being connected to the chip and respectively directly bonded to the plurality of pad terminals; And Resin filled between the substrate and the driving component by the bonding device according to any one of claims 1 to 6, Wherein the chip includes an upper surface, a lower surface, and a side surface between the upper surface and the lower surface, The resin covers the lower surface and the side surface of the chip.

8. The display device according to claim 7, wherein The plurality of pad terminals and the plurality of bumps are ultrasonically bonded.

9. The display device according to claim 7, wherein, the resin includes a corner portion that surrounds at least a part of the chip and is bent so as to protrude outward.

10. The display device according to claim 7, wherein, a side surface of the resin includes a flat surface perpendicular to one surface of the substrate or a curved surface that is inclined with respect to one surface of the substrate and protrudes outward.

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