Wire-to-board signal transmission mechanism

Abstract

A wire-to-board signal transmission mechanism constructs a shielding loop inside the mechanism so that the shielding signal of the rear end circuit area of ​​the printed circuit board is guided to the front end circuit area thereof, thereby providing shielding for the front end circuit area to avoid interference and overflow wave phenomenon of the signal transmission in the front end circuit area. In this way, the wire-to-board signal transmission mechanism of the present application has good anti-interference performance, can improve the stability of high-frequency signal transmission, and enable high-frequency signals to be transmitted over long distances.

Description

Technical Field

[0001] The present application relates to signal transmission technology, and more specifically, to a wire-to-board signal transmission mechanism that can effectively avoid signal attenuation. Background Art

[0002] The 5G wireless communication era is coming after 2020. According to the specifications of the Wireless Gigabit Alliance (WiGig), 5G wireless communication will use high-frequency signals from the 6GHz band to the 55-67GHz band, and even ultra-high frequency signals in the 80GHz band may be used.

[0003] Since 5G wireless communication needs to be realized through high-frequency signals, the transmission of high-frequency signals will be affected by interference and spillover between signals, especially when transmitting high-frequency signals through the circuits on FPC and PCB. The transmission of high-frequency signals is most seriously affected. The existing wire-to-board signal transmission mechanism is limited by the poor shielding effect of the mechanism design, and there are problems of signal attenuation and interference caused by spillover, which makes it impossible to effectively transmit high-frequency signals over long distances. It can usually only be used to transmit low-frequency signals below 6GHz, such as GPS or WIFI. Therefore, for the transmission of high-frequency signals, how to suppress interference and prevent spillover will be the first technical issue to be solved.

[0004] Therefore, it is necessary and urgent to develop a wire-to-board signal transmission mechanism that can effectively transmit high-frequency signals over long distances. This has become a technical issue that the industry is eager to challenge and overcome. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, the present application provides a wire-to-board signal transmission mechanism, which can effectively avoid signal attenuation and improve the stability of high-frequency signal transmission.

[0006] The present application provides a wire-to-board signal transmission mechanism, comprising a printed circuit board, a high-frequency signal line group, a line end connector, and a shielding component, wherein the printed circuit board has a front-end circuit area and a rear-end circuit area, and the front-end circuit area is provided with a shielding signal circuit group, a high-frequency signal circuit group, and a low-frequency signal circuit group, wherein the low-frequency signal circuit group also extends to the rear-end circuit area; the high-frequency signal line group extends from the rear-end circuit area to the front-end circuit area, and is electrically connected to the high-frequency signal circuit group in the front-end circuit area, the high-frequency signal line group has a shielding conductor, and the shielding conductor is electrically connected to the shielding signal circuit group to transmit the shielding signal; the line end connector The device is electrically connected to the high-frequency signal circuit group and the low-frequency signal circuit group respectively, and is used to receive the high-frequency signal and the low-frequency signal through the printed circuit board. The line end connector also has a metal shell, which extends from the top of the front-end circuit area to the top of the back-end circuit area; the shielding component is electrically connected to the shielding conductor and the metal shell in the back-end circuit area, and is electrically connected to the shielding signal circuit group and the metal shell in the front-end circuit area to form a shielding loop, so that the shielding signal of the back-end circuit area is guided to the front-end circuit area, thereby providing shielding for the front-end circuit area to avoid interference with the signal transmission of the front-end circuit area.

[0007] Optionally, the above-mentioned wire-to-board signal transmission mechanism also includes a front-end isolation component, which is located in the front-end circuit area and between the metal shell and the printed circuit board, so as to provide isolation to prevent the high-frequency signal circuit group and the low-frequency signal circuit group from electrically contacting the metal shell.

[0008] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the high-frequency signal line group includes at least one coaxial line, the coaxial line has an exposed coaxial line center conductor to electrically connect the high-frequency signal circuit group, and the front end isolation component covers the coaxial line center conductor to prevent the high-frequency signal line group from electrically contacting the metal shell.

[0009] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the shielding assembly includes a rear-end shielding component and a front-end shielding component, the rear-end shielding component provides an electrical connection between the shielding conductor and the metal shell located above the rear-end circuit area; the front-end shielding component spans the front-end isolation component and provides an electrical connection between the metal shell located above the front-end circuit area and the shielding signal circuit group.

[0010] Optionally, the above-mentioned wire-to-board signal transmission mechanism also includes a shielding extension member, which spans across the printed circuit board and is electrically connected to the rear-end shielding member to form a shielding loop to provide shielding for the front-end circuit area to prevent interference with signal transmission in the front-end circuit area.

[0011] Optionally, in the above-mentioned wire-to-board signal transmission mechanism, the rear-end shielding component is solder located on the left and right sides of the rear-end circuit area, and the shielding extension component is electrically connected to the rear-end shielding component on the left and right sides of the rear-end circuit area respectively.

[0012] Optionally, the above-mentioned wire-to-board signal transmission mechanism further includes a rear-end isolation component, which covers the low-frequency signal circuit group in the rear-end circuit area to provide isolation to avoid electrical short circuit of the low-frequency signal circuit group.

[0013] It can be seen that the wire-to-board signal transmission mechanism of the present application can guide the shielding signal of the rear circuit area of ​​the printed circuit board to the front circuit area through the setting of the shielding component, thereby providing shielding for the front circuit area to suppress interference and prevent overflow. Therefore, the wire-to-board signal transmission mechanism of the present application has good anti-interference performance, can improve the stability of high-frequency signal transmission, and enable high-frequency signals to be transmitted over long distances, thereby solving the problem that the existing wire-to-board signal transmission mechanism cannot effectively transmit high-frequency signals. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figures 1 to 3 This is a schematic diagram of the overall architecture of the wire-to-board signal transmission mechanism of the present application;

[0015] 4A to 7C A schematic diagram of a portion of the structure of the wire-to-board signal transmission mechanism of the present application;

[0016] Figure 8 A schematic diagram showing an embodiment of a shielding loop formed by a shielding component of the present application.

[0017] Description of Reference Numerals

[0018] 1 Wire-to-board signal transmission mechanism

[0019] 11. Printed Circuit Board

[0020] 11A front-end circuit area

[0021] 11B Back-end circuit area

[0022] 111 Shielding signal circuit group

[0023] 112 High Frequency Signal Circuit Group

[0024] 113 Low frequency signal circuit group

[0025] 12 high frequency signal line set (coaxial line)

[0026] 120 Shielded conductor

[0027] 121 Coaxial center conductor

[0028] 13-wire connector

[0029] 131 Metal Shell

[0030] 14 Shielding components

[0031] 141 rear end shielding member

[0032] 142 front shielding member

[0033] 1421 Positioning portion of front end shield member

[0034] 15 Front end isolation component

[0035] 16 Shield extension member

[0036] 17 Rear isolation component DETAILED DESCRIPTION

[0037] The following content will be accompanied by drawings to illustrate the technical content of the present application through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present application from the contents disclosed in this specification. The present application can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the spirit of the present application. In particular, the proportional relationship and relative position of each component in the drawings are only for exemplary purposes and do not represent the actual situation of the implementation of the present application.

[0038] See also Figures 1 to 8 , respectively, are a schematic diagram and a decomposition diagram of the wire-to-board signal transmission mechanism of the present application. As shown in the figure, the wire-to-board signal transmission mechanism 1 mainly includes a printed circuit board 11, a high-frequency signal line group 12, a line end connector 13, and a shielding component 14. Among them, the line end connector 13 can be inserted into the board end connector (not shown), so that the high-frequency signal and the low-frequency signal are further transmitted to the board end connector.

[0039] Please refer to FIG. 4A to FIG. 5C The printed circuit board 11 has a front-end circuit area 11A and a back-end circuit area 11B. In this embodiment, the front-end circuit area 11A refers to a side area of ​​the printed circuit board 11 close to the line end connector 13, and the back-end circuit area 11B refers to a side area of ​​the printed circuit board 11 away from the line end connector 13.

[0040] Furthermore, a shielded signal circuit group 111, a high frequency signal circuit group 112 and a low frequency signal circuit group 113 are arranged in the front circuit area 11A of the printed circuit board 11, wherein the low frequency signal circuit group 113 also extends from the front circuit area 11A to the back circuit area 11B (refer to Figure 5CIn the present embodiment, the printed circuit board 11 is, for example, a multi-layer circuit board. Optionally, the shielding signal circuit group 111 is arranged in the middle circuit layer of the printed circuit board 11 to provide shielding for the upper and lower layers of the multi-layer circuit board. It should be noted that the shielding signal circuit group 111 can be selectively arranged in other circuit layers other than the middle circuit layer of the printed circuit board 11.

[0041] The high-frequency signal line group 12 extends from the rear end circuit area 11B of the printed circuit board 11 to the front end circuit area 11A, and is electrically connected to the high-frequency signal circuit group 112 at the front end circuit area 11A. In addition, the high-frequency signal line group 12 also has a shielding conductor 120, and the shielding conductor 120 is electrically connected to the shielding signal circuit group 111 to transmit a shielding signal to the shielding signal circuit group 111.

[0042] Optionally, the high-frequency signal line group 12 is, for example, a line group composed of coaxial lines, and the shielded conductor 120 is, for example, a shielding layer (braided layer) in the coaxial line.

[0043] The line end connector 13 is electrically connected to the high frequency signal circuit group 112 and the low frequency signal circuit group 113 of the printed circuit board 11, respectively, and is used to receive high frequency signals and low frequency signals through the printed circuit board 11. In addition, the line end connector 13 also has a metal shell 131, wherein the metal shell 131 extends from the body of the line end connector 13 above the front end circuit area 11A of the printed circuit board 11, and extends all the way to the top of the back end circuit area 11B. In this embodiment, the metal shell 131 circumferentially surrounds the periphery of the printed circuit board 11 and exposes a portion of the back end circuit area 11B.

[0044] The shielding component 14 is used to electrically connect the shielding conductor 120 of the high-frequency signal line group 12 and the metal shell 131 of the line end connector 13 in the rear-end circuit area 11B of the printed circuit board 11, and to electrically connect the shielding signal circuit group 111 and the metal shell 131 of the printed circuit board 11 in the front-end circuit area 11A of the printed circuit board 11 to form a shielding loop, so that the shielding signal of the rear-end circuit area 11B is guided to the front-end circuit area 11A, and the front-end circuit area 11A is shielded to avoid interference with the signal transmission of the front-end circuit area 11A. Therefore, for the transmission of high-frequency signals, interference can be effectively suppressed and signal attenuation caused by overflow waves can be prevented.

[0045] Specifically, the shielding assembly 14 includes a rear shielding member 141 and a front shielding member 142 .

[0046] refer to Figure 6B, the rear shielding member 141 provides electrical connection between the shielding conductor 120 and the metal shell 131 located above the rear circuit area 11B. In this embodiment, the high-frequency signal line group 12 is disposed on the left and right sides of the printed circuit board 11, and accordingly, the rear shielding member 141 is, for example, two solders disposed at corresponding positions on the left and right sides of the rear circuit area 11B, the two solders are respectively electrically connected to the shielding conductor 120 inside the high-frequency signal line group 12, and the two solders are also respectively in contact with the metal shell 131 located above it.

[0047] refer to Figure 6C The front shielding member 142 provides electrical connection between the portion of the metal shell 131 located above the front circuit area 11A and the shielded signal circuit group 111 .

[0048] In this embodiment, the wire-to-board signal transmission mechanism 1 also includes a front-end isolation component 15, which is located in the front-end circuit area 11A of the printed circuit board 11 and is located between the metal shell 131 and the printed circuit board 11, so as to provide isolation between the two to avoid the high-frequency signal circuit group 112 and the low-frequency signal circuit group 113 arranged on the printed circuit board 11 from electrically contacting the metal shell 131 and causing an unexpected electrical short circuit.

[0049] Furthermore, the front shielding member 142 spans over the front isolation member 15 and provides electrical connection between the metal shell 131 located above the front circuit area 11A and the shielded signal circuit group 111. In this embodiment, the front shielding member 142 is in the form of a saddle and spans over the front isolation member 15, and the two sides of the front shielding member 142 extend downward to form a positioning portion 1421 (refer to FIG. 2A to FIG. 2B ), the positioning parts 1421 on both sides can be engaged with the front isolation member 15 to achieve positioning. At the same time, the shielding signal circuit group 111 arranged on the middle circuit layer of the printed circuit board 11 is exposed at the side of the printed circuit board 11, so as to generate electrical contact with the positioning parts 1421 on both sides of the front shielding member 142. Furthermore, the middle part of the front shielding member 142 generates electrical contact with the metal shell 131 above it, thereby providing electrical connection between the metal shell 131 and the shielding signal circuit group 111 arranged on the printed circuit board 11.

[0050] Thus, the rear shielding member 141 and the front shielding member 142 can form a shielding loop (eg, Figure 8The dotted line portion shown in the figure) guides the shielded signal of the back-end circuit area 11B to the front-end circuit area 11A to avoid interference with the signal transmission of the front-end circuit area 11A, so as to solve the problem that the existing wire-to-board signal transmission mechanism is limited by the poor shielding effect of the mechanism design and the existence of spillover waves causing signal attenuation and interference. Therefore, the wire-to-board signal transmission mechanism of the present application can transmit high-frequency signals over long distances.

[0051] In another embodiment, the high-frequency signal line group (coaxial line) 12 has an exposed coaxial line center conductor 121, which is used to electrically connect the high-frequency signal circuit group 112 of the printed circuit board 11, and the above-mentioned front end isolation component 15 also covers the exposed coaxial line center conductor 121 to prevent the high-frequency signal line group 12 from making electrical contact with the metal shell 131 and causing an unexpected electrical short circuit.

[0052] In addition, the wire-to-board signal transmission mechanism 1 further includes a shielding extension member 16 that spans across the printed circuit board 11 and is electrically connected to the rear shielding member 141 to form a shielding loop to provide shielding for the front circuit area 11A.

[0053] In this embodiment, the shielding extension member 16 is a metal rod that spans across the printed circuit board 11 and is electrically connected to the two rear end shielding members 141 located on the left and right sides of the printed circuit board 11, so as to further expand the shielding loop and provide a shielding function at the junction of the front end circuit area 11A and the rear end circuit area 11B to prevent interference with the signal transmission in the front end circuit area 11A.

[0054] refer to Figure 5C In another embodiment, the wire-to-board signal transmission mechanism 1 also includes a rear-end isolation component 17, which is used to cover the low-frequency signal circuit group 113 of the printed circuit board 11 in the rear-end circuit area 11B, so that the low-frequency signal circuit group 113 is isolated from the outside world, thereby avoiding an electrical short circuit in the low-frequency signal circuit group 113.

[0055] To summarize, the wire-to-board signal transmission mechanism of the present application electrically connects the shielded conductor of the high-frequency signal line group and the metal shell of the line end connector in the rear end circuit area of ​​the printed circuit board through a shielding component, and at the same time electrically connects the shielded signal circuit group inside the printed circuit board and the metal shell of the line end connector in the front end circuit area of ​​the printed circuit board to form a shielding loop spanning the front end circuit area and the rear end circuit area, so that the shielded signal of the rear end circuit area is guided to the front end circuit area, thereby realizing the function of providing shielding for the front end circuit area to avoid interference with the signal transmission in the front end circuit area. In this way, for the transmission of high-frequency signals, the present application can suppress interference and prevent overflow waves from causing signal attenuation, thereby improving the stability of high-frequency signal transmission and enabling high-frequency signals to be transmitted over long distances.

[0056] The above embodiments are only illustrative of the principles and effects of the application, and are not intended to limit the present application. Those skilled in the art may modify and change the above embodiments without violating the spirit and scope of the present application. Therefore, the scope of protection of the present application shall be as set forth in the claims of the present application.

Claims

1. A wire-to-board signal transmission mechanism, characterized in that: include: A printed circuit board, the printed circuit board having a front-end circuit area and a back-end circuit area, wherein the front-end circuit area is provided with a shielded signal circuit group, a high-frequency signal circuit group and a low-frequency signal circuit group, wherein the low-frequency signal circuit group also extends to the back-end circuit area; A high-frequency signal line group, the high-frequency signal line group extends from the back-end circuit area to the front-end circuit area and is electrically connected to the high-frequency signal circuit group in the front-end circuit area, the high-frequency signal line group has a shielding conductor, and the shielding conductor is electrically connected to the shielding signal circuit group to transmit a shielding signal; a line end connector, the line end connector being electrically connected to the high frequency signal circuit group and the low frequency signal circuit group respectively, and being used for receiving high frequency signals and low frequency signals through the printed circuit board, the line end connector further comprising a metal shell, the metal shell extending from above the front end circuit area to above the back end circuit area; and A shielding component, wherein the shielding component electrically connects the shielding conductor and the metal shell in the back-end circuit area, and electrically connects the shielding signal circuit group and the metal shell in the front-end circuit area to form a shielding loop, so that the shielding signal in the back-end circuit area is guided to the front-end circuit area, thereby providing shielding for the front-end circuit area to avoid interference with signal transmission in the front-end circuit area.

2. The wire-to-board signal transmission mechanism according to claim 1, characterized in that: It also includes a front-end isolation component, which is located in the front-end circuit area and between the metal shell and the printed circuit board, so as to provide isolation to prevent the high-frequency signal circuit group and the low-frequency signal circuit group from electrically contacting the metal shell.

3. The wire-to-board signal transmission mechanism according to claim 2, characterized in that: The high-frequency signal line group includes at least one coaxial line, and the coaxial line has a coaxial line center conductor exposed to electrically connect the high-frequency signal circuit group. The front-end isolation component covers the coaxial line center conductor to prevent the high-frequency signal line group from electrically contacting the metal shell.

4. The wire-to-board signal transmission mechanism according to claim 2, characterized in that: The shielding assembly comprises: a back-end shielding member, the back-end shielding member providing electrical connection between the shielding conductor and the metal shell located above the back-end circuit area; and The front-end shielding component spans across the front-end isolation component and provides electrical connection between the metal shell located above the front-end circuit area and the shielding signal circuit group.

5. The wire-to-board signal transmission mechanism according to claim 4, characterized in that: It also includes a shielding extension component, which spans across the printed circuit board and is electrically connected to the rear end shielding component to form the shielding loop to provide shielding for the front end circuit area to prevent interference with signal transmission in the front end circuit area.

6. The wire-to-board signal transmission mechanism according to claim 4, characterized in that: The rear end shielding component is solder located at the left and right sides of the rear end circuit area, and the shielding extension component is electrically connected to the rear end shielding component at the left and right sides of the rear end circuit area respectively.

7. The wire-to-board signal transmission mechanism according to claim 1, characterized in that: The invention also includes a rear-end isolation component, wherein the rear-end isolation component covers the low-frequency signal circuit group in the rear-end circuit area, so as to provide isolation to prevent the low-frequency signal circuit group from being electrically short-circuited.

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