Display device

Abstract

The present invention discloses a display device, comprising: a substrate; a common electrode layer provided on the substrate, wherein the common electrode layer includes a first common pad protruding from a first reference side extending along a first direction toward a second direction intersecting the first direction; a driving layer provided between the substrate and the common electrode layer; a display layer provided between the driving layer and the common electrode layer; a first conductive via spaced apart from the driving layer and provided between the substrate and the first common pad; and a driving chip provided opposite to the first conductive via with the driving layer as a reference.

Description

[0001] Cross - reference to related applications

[0002] This application claims the priority and benefit of Korean Patent Application No. 10 - 2020 - 0046822, filed on April 17, 2020, which is incorporated herein by reference for all purposes as if fully set forth herein. Technical field

[0003] The present invention relates to a display device. Background art

[0004] Types of electronic paper include a twisted - sphere display using hemispherical twisted spheres with static charges, an electrophoretic display using an electrophoretic method and microcapsules, an in - plane switching electrophoretic display, and a cholesteric display using cholesteric liquid crystals. The most commercially available electrophoretic display utilizes the electrophoretic phenomenon, in which charged particles are dispersed in a dielectric liquid and move through an applied electric field.

[0005] The most representative electrophoretic display utilizes microcapsules filled with a dielectric liquid, which contain various types of ink particles having different charging characteristics and colors. When the microcapsules are mixed with an adhesive and placed between upper and lower electrodes, and then an electric field is applied, the charged ink particles move to the surface according to the electric field applied to each pixel, thereby completing color display.

[0006] The in - plane switching electrophoretic display has a partition structure called a microcup The microcup structure is formed by molding a photosensitive polymer layer using a calender with a patterned surface and then curing it with ultraviolet light. When observed on a plane, the microcup structure can have various shapes, but generally has a hexagonal honeycomb structure. The in - plane switching electrophoretic display is manufactured by spraying an electrophoretic dispersion liquid obtained by dispersing various charged pigment particles in a dielectric liquid onto the microcup structure and filling it, and then sealing the entrance of the microcup using a sealing layer formed by calendering. Summary of the invention

[0007] The problem to be solved is to provide a display device in which a non - display area is miniaturized.

[0008] The problem to be solved is to provide a display device including additional elements.

[0009] However, the problems to be solved are not limited to the disclosure.

[0010] One aspect of an embodiment of the present disclosure may provide a display device, comprising: a substrate; a common electrode layer provided on the substrate, wherein the common electrode layer includes a first common pad protruding from a first reference side extending along a first direction toward a second direction intersecting the first direction; a driving layer provided between the substrate and the common electrode layer; a display layer provided between the driving layer and the common electrode layer; a first conductive via spaced apart from the driving layer and provided between the substrate and the first common pad; and a driving chip provided opposite the first conductive via with the driving layer as a reference.

[0011] The display device may further include: a second conductive via spaced apart from the first conductive via along the first direction, the common electrode layer further includes a second common pad provided on the second conductive via, and the second common pad protrudes from the first reference side.

[0012] The first common pad and the second common pad may be respectively arranged at two opposite ends along the first direction on the first reference side.

[0013] The display device may further include a protective layer provided on the common electrode layer, wherein the protective layer includes: a first protective pad provided on the first common pad; and a second protective pad provided on the second common pad, wherein the first protective pad and the second protective pad protrude from a second reference side of the protective layer extending along the first direction, and the protective layer, the first protective pad, and the second pad may include an electrically insulating material.

[0014] Viewed from an angle along a third direction perpendicular to the upper surface of the substrate, the first common pad and the second common pad may be respectively provided within the first protective pad and the second protective pad.

[0015] The substrate may include: a first protruding substrate provided opposite the first protective pad with the first conductive via as a reference; and a second protruding substrate provided opposite the second protective pad with the second conductive via as a reference, wherein the first and second protruding substrates may protrude from a third reference side of the substrate extending along the first direction.

[0016] A display device may include: a sealing film extending on the substrate along the edges of the protective layer, the first protective pad, and the second protective pad.

[0017] The side surface of the sealing film can extend along a third direction perpendicular to the upper surface of the substrate.

[0018] Viewed from an angle along the third direction perpendicular to the upper surface of the substrate, the distance between the side surface of the sealing film and the protective layer can be smaller as it is farther from the upper surface of the substrate.

[0019] The sealing film can form a single-layer film together with the protective layer, the first protective pad, and the second protective pad.

[0020] A display device may include: a printed circuit board provided opposite to the display layer with the substrate as a reference; and additional components provided on the printed circuit board, where the additional components may include at least one light-emitting component and an antenna component, and viewed from an angle along the third direction perpendicular to the upper surface of the substrate, the additional components may be arranged between the first protective pad and the second protective pad.

[0021] The substrate may include: a first protruding substrate provided between the first conductive via and the printed circuit board; and a second protruding substrate provided between the second conductive via and the printed circuit board, where the first and second protruding substrates may protrude from a third reference side surface of the substrate extending along the first direction, and the additional components may be exposed between the first protruding substrate and the second protruding substrate.

[0022] The first common pad may be arranged on any one of the two opposite ends arranged along the first direction on the first reference side surface.

[0023] The first common pad may be arranged in a region between the two opposite ends arranged along the first direction on the first reference side surface.

[0024] The display device may further include a housing, where the substrate, the driving layer, the display layer, the protective layer, the first protective pad, the second protective pad, the first conductive via, the second conductive via, and the driving chip are arranged inside the housing, and the housing may include a first window overlapping with the display layer along a third direction perpendicular to the upper surface of the substrate.

[0025] The display device may further include: a printed circuit board provided on the opposite side of the display layer with respect to the substrate; and a light-emitting component provided on the printed circuit board, wherein the printed circuit board and the light-emitting component may be disposed within the housing, and the housing may further include a second window overlapping the light-emitting component along the third direction.

[0026] One aspect of an embodiment of the present disclosure may provide a display device including: a substrate; an electronic paper layer provided on the substrate; and a driving chip controlling the electronic paper layer, wherein the driving chip and the electronic paper layer are arranged along a first direction parallel to the upper surface of the substrate, and the electronic paper layer has a first protrusion and a second protrusion protruding from a reference side surface disposed opposite to the driving chip, and the driving chip generates an electric field in the electronic paper layer to control electrophoretic particles in the electronic paper layer.

[0027] The display device may include: a first conductive via provided between the first protrusion and the substrate; and a second conductive via provided between the second protrusion and the substrate, wherein the first conductive via and the second conductive via may apply a common voltage to the electronic paper layer.

[0028] The display device may further include: a printed circuit board provided on the opposite side of the electronic paper layer with respect to the substrate; and additional components provided on the printed circuit board, wherein the additional components may include at least one light-emitting component and an antenna component, and the additional components may be disposed between the first protrusion and the second protrusion when viewed from an angle along a second direction perpendicular to the upper surface of the substrate.

[0029] The display device may further include: a housing covering the substrate, the electronic paper layer, the driving chip, the printed circuit board, and the additional components, wherein the electronic paper layer includes: a display area where the electrophoretic particles are provided; and a non-display area provided at the periphery of the display area, and the housing may include: a first window exposing the display area of the electronic paper layer; and a second window overlapping the additional components along the second direction. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] Figure 1 is a perspective view of a display device according to an exemplary embodiment.

[0031] Figure 2 is Figure 1 a plan view of the display device.

[0032] Figure 3 A sectional view taken along line A-A' according to Figure 2 .

[0033] Figure 4 A sectional view taken along line B-B' according to Figure 2 .

[0034] Figure 5 A perspective view of a display device according to an exemplary embodiment.

[0035] Figure 6 A plan view of the display device of Figure 5 .

[0036] Figure 7 A sectional view taken along line C-C' according to Figure 6 .

[0037] Figure 8 A perspective view of a display device according to an exemplary embodiment.

[0038] Figure 9 A plan view of the display device of Figure 8 .

[0039] Figure 10 A sectional view taken along line D-D' according to Figure 9 .

[0040] Figure 11 A plan view of a display device according to an exemplary embodiment.

[0041] Figure 12 A sectional view taken along line E-E' according to Figure 11 .

[0042] Figure 13 A sectional view taken along line F-F' according to Figure 11 .

[0043] Figure 14 A sectional view of a display device according to an exemplary embodiment corresponding to Figure 11 line E-E'.

[0044] Figure 15 A plan view of the display device of Figure 14 corresponding to Figure 11 line F-F'.

[0045] Figure 16 A perspective view of a display device according to an exemplary embodiment.

[0046] Figure 17 A plan view of the display device of Figure 16 .

[0047] Figure 18 A sectional view taken along line according toFigure 17 Cross-sectional view of the G-G' line.

[0048] Figure 19 Perspective view of a display device according to an exemplary embodiment.

[0049] Figure 20 is Figure 19 Plan view of the display device of

[0050] Figure 21 According to Figure 20 Cross-sectional view of the H-H' line of

[0051] Figure 22 Perspective view of a display device according to an exemplary embodiment.

[0052] Figure 23 is Figure 22 Plan view of the display device of

[0053] Figure 24 According to Figure 23 Cross-sectional view of the I-I' line of

[0054] Figure 25 Perspective view of a display device according to an exemplary embodiment.

[0055] Figure 26 is Figure 25 Plan view of the display device of Detailed Description of the Invention

[0056] Hereinafter, the embodiments will be described in more detail with reference to the accompanying drawings. In the following drawings, the same reference numerals denote the same technical features, and for clarity and convenience of explanation, the dimensions of each technical feature in the drawings may be enlarged. In addition, the embodiments described below are merely exemplary, and various modifications can be made based on these embodiments.

[0057] Hereinafter, the so-called "upper part" or "upper" may include not only what is in direct contact with the upper surface but also what is not in direct contact with the upper surface.

[0058] A singular expression includes a plural expression unless the context clearly indicates otherwise. In addition, when a part "includes" a certain technical feature, this means that other technical features may be further included rather than excluding other technical features, unless otherwise clearly stated.

[0059] Figure 1 Perspective view of a display device according to an exemplary embodiment. Figure 2 is Figure 1 Plan view of the display device of Figure 3 According to Figure 2 Cross-sectional view of the A-A' line of Figure 4Cross-sectional view taken along line B-B' according to Figure 2

[0060] Referring to Figures 1 to 4 , a display device 1 can be provided. The display device 1 may include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a common pad 410, a conductive via 600, a lower pad 610, a protective layer 500, a protection pad 510, and a sealing film 700. The driving layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the protective layer 500, and the protection pad 510 may be referred to as an electronic paper layer. The substrate 100 may include a transparent electrical insulating material. For example, the substrate 100 may be a glass substrate or a plastic substrate.

[0061] The driving chip 10 may be provided on the substrate 100. The driving chip 10 may be electrically connected to the driving layer 200 and the common electrode layer 400. For example, the driving chip 10 may be electrically connected to the driving layer 200 and the common electrode layer 400 through wires (not shown) provided on the substrate 100. The driving chip 10 may control driving elements in the driving layer 200 and may apply a common voltage to the common electrode layer 400.

[0062] The driving layer 200 may be provided on the substrate 100. The driving layer 200 and the driving chip 10 may be arranged along a first direction DR1 parallel to the upper surface 100u of the substrate 100. For example, the driving layer 200 may be spaced apart from the driving chip 10 along the first direction DR1. The driving layer 200 may include driving elements, a first conductive wire, and a second conductive wire. The driving elements may define each pixel. For example, the driving elements may be thin film transistors. The driving elements may respectively have pixel electrodes facing the display layer 300.

[0063] The first conductive wire may extend along a first direction DR1 parallel to the upper surface 100u of the substrate 100. The second conductive wire may extend along a second direction DR2, which is parallel to the upper surface 100u of the substrate 100 and intersects the first direction DR1. The driving elements may be respectively arranged in regions where the first conductive wire and the second conductive wire intersect. The first conductive wire and the second conductive wire may receive electrical signals from the driving chip. A driving voltage may be applied to the pixel electrodes of the driving elements in the regions where the first conductive wire and the second conductive wire receiving the electrical signals intersect.

[0064] ​The display layer 300 may be provided on the driving layer 200. The display layer 300 may cover the driving layer 200. As an example, a bonding layer may be provided between the display layer 300 and the driving layer 200. The display layer 300 may include electrophoretic particles having different electrical properties and different colors. For example, among the electrophoretic particles, some electrophoretic particles may have a positive charge and black color, and some other electrophoretic particles may have a negative charge and white color. For example, the electrophoretic particles having a positive charge and black color may be carbon black particles, and the electrophoretic particles having a negative charge and white color may be titanium dioxide (TiO2) particles or silicon dioxide (SiO2) particles. The electrophoretic particles may be provided within microcapsules or a partition structure together with a transparent dielectric liquid. The content output by the display device 1 may be determined according to the positions of the electrophoretic particles. In one embodiment, the electrophoretic particles may include white particles, black particles, and colored particles. The white particles and the black particles may be substantially the same as described above. The colored particles may have a color different from white and black. For example, the colored particles may have cyan, magenta, yellow, red, green, or blue. The colored particles may be charged negatively or positively. For example, the net charge amount of the colored particles may be less than the net charge amounts of the white particles and the black particles. The common electrode layer 400 may be provided on the display layer 300. The common electrode layer 400 may face the driving layer 200 with the display layer 300 therebetween. The common electrode layer 400 may include a transparent conductive material. For example, the common electrode layer 400 may include indium tin oxide (ITO). A common voltage different from the driving voltage may be applied to the common electrode layer 400. An electric field may be formed between the common electrode layer 400 and the pixel electrode. The positions of the electrophoretic particles may be controlled by the electric field between the common electrode layer 400 and the pixel electrode. In other words, the content output by the display device 1 may be determined by the electric field between the common electrode layer 400 controlled by the driving chip 10 and the pixel electrode. From the perspective of the third direction DR3 perpendicular to the upper surface 100u of the substrate 100, although the common electrode layer 400 is illustrated as including the display layer 300, it is not limited thereto. In other embodiments, from the perspective of the third direction DR3, the common electrode layer 400 may completely overlap with the display layer 300.

[0065] The common pad 410 may be provided on the first reference side 400s of the common electrode layer 400. The first reference side 400s may be the side of the common electrode layer 400 facing the first direction DR1. From the perspective of the angle along the third direction DR3, the distance between the first reference side 400s and the side of the substrate 100 may be approximately 5 to 7 millimeters. The common pad 410 may be provided at one end of the first reference side 400s. The common pad 410 may protrude from the first reference side 400s. For example, the common pad 410 may extend along the first direction DR1 on the first reference side 400s. The common pad 410 may include a conductive material. For example, the common pad 410 may include a metal (e.g., aluminum (Al) or copper (Cu)) or a transparent electrode material (e.g., ITO). The common pad 410 may be electrically connected to the common electrode layer 400. For example, the common pad 410 may directly contact the common electrode layer 400. As an example, the common pad 410 and the common electrode layer 400 may form a single-layer film. In other words, the common pad 410 and the common electrode layer 400 may be connected to each other without an interface therebetween. As an example, the common pad 410 and the common electrode layer 400 may be different films. In other words, the common pad 410 and the common electrode layer 400 may be connected to each other with an interface therebetween.

[0066] The lower pad 610 may be provided between the common pad 410 and the substrate 100. For example, the lower pad 610 may directly contact the upper surface 100u of the substrate 100. The lower pad 610 may be electrically connected to the driving chip 10 through a conductive wire extending along the upper surface 100u of the substrate 100. The lower pad 610 may include a conductive material. For example, the lower pad 610 may include aluminum (Al) or copper (Cu).

[0067] The conductive via 600 may be provided between the lower pad 610 and the common pad 410. The conductive via 600 may be electrically connected to the lower pad 610 and the common pad 410. For example, the conductive via 600 may directly contact the lower pad 610 and the common pad 410. The conductive via 600 may apply a common voltage to the common pad 410. For example, the conductive via 600 may include silver paste. The common pad 410 may apply a common voltage to the common electrode layer 400.

[0068] The protective layer 500 may be provided on the common electrode layer 400. The protective layer 500 may cover the common electrode layer 400. The protective layer 500 may protect the film disposed thereunder to prevent damage to the film. The protective layer 500 may include a transparent electrical insulating material. For example, the protective layer 500 may include a polyethylene terephthalate (PET) film. As an example, an antiglare film may be provided on the upper or bottom surface of the protective layer 500. Although the protective layer 500 is illustrated as including the common electrode layer 400 when viewed from the angle along the third direction DR3, it is not limited thereto. In other embodiments, when viewed from the angle along the third direction DR3, the protective layer 500 may completely overlap with the common electrode layer 400.

[0069] The protection pad 510 may be provided on the common pad 410. The protection pad 510 may cover the common pad 410. The protection pad 510 may be provided on the second reference side surface 500s of the protective layer 500. The second reference side surface 500s may be the side surface of the protective layer 500 facing the first direction DR1. The second reference side surface 500s may be the side surface of the protective layer 500 directly adjacent to the first reference side surface 400s. The protection pad 510 may protrude from the second reference side surface 500s. For example, the protective layer 500 may extend along the first direction DR1 on the second reference side surface 500s. The protection pad 510 may include an electrical insulating material. For example, the protection pad 510 may include a PET film. As an example, the protection pad 410 and the protective layer 500 may form a single-layer film. In other words, the protection pad 510 and the protective layer 500 may be connected to each other without an interface therebetween. As an example, the protection pad 510 and the protective layer 500 may be different films. In other words, the protection pad 510 and the protective layer 500 may be connected to each other with an interface therebetween. Although the protection pad 510 is illustrated as including the common pad 410 when viewed from the angle along the third direction DR3, it is not limited thereto. In other embodiments, when viewed from the angle along the third direction DR3, the protection pad 510 may completely overlap with the common pad 410.

[0070] The sealing film 700 can be provided between the protective layer 500 and the substrate 100 and between the protective pad 510 and the substrate 100. The sealing film 700 can extend along the edges of the protective layer 500 and the protective pad 510. The sealing film 700 can cover the technical features to prevent the driving layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the lower pad 610, and the conductive vias 600 from being damaged. The outer side surface 700s of the sealing film 700 can be perpendicular to the upper surface 100u of the substrate 100. The outer side surface 700s of the sealing film 700 can extend along the third direction DR3. Although the outer side surface 700s of the sealing film 700 directly adjacent to the second reference side surface 500s is illustrated as being coplanar with the second reference side surface 500s, it is not limited thereto. In other embodiments, the outer side surface 700s of the sealing film 700 and the second reference side surface 500s can have a step difference, or the sealing film 700 can cover the second reference side surface 500s. The sealing film 700 can include an electrically insulating material. For example, the sealing film 700 can include silicon (Si) or a hot melt epoxy adhesive.

[0071] An additional region R1 can be provided on the second reference side surface 500s. The additional region R1 can be the region between the sealing film 700 directly adjacent to the second reference side surface 500s and the sealing film 700 provided under the protective pad 510. As an example, additional components can be provided on the opposite side of the additional region R1 with respect to the substrate 100. For example, the additional components can be at least one of a light-emitting component and an antenna component. When the additional component is a light-emitting component, the additional region R1 can be a region for emitting the light generated from the light-emitting component to the outside of the display device 1. When the additional component is an antenna component, the additional region can be a region for smoothly performing radio wave transmission / reception operations between the antenna component and an external device. When the driving layer 200, the display layer 300, and the common electrode layer 400 are arranged in the additional region R1, these layers can absorb light or interfere with communication.

[0072] Different from the present disclosure, when the common pad 410, the protective pad 510, the lower pad 610, and the conductive vias 600 are arranged adjacent to the driving chip 10, in order to arrange the common pad 410, the protective pad 510, the lower pad 610, and the conductive vias 600, the substrate 100 on the driving chip 10 side may be required to have a large area. In addition, in order for the display device 1 to have additional components (for example, a light-emitting component or an antenna component), as described in the present disclosure, an additional region R1 may be additionally required.

[0073] The common pad 410, the protection pad 510, the lower pad 610, the conductive via 600, and the additional region R1 of the present disclosure can improve the integration degree of the display device 1 by being provided on the opposite side of the driving chip 10. The size of the non-display region of the display device 1 (i.e., the region other than the display layer 300 when viewed from the angle along the third direction DR3) can be reduced.

[0074] Figure 5 Perspective view of a display device according to an exemplary embodiment. Figure 6 is Figure 5 plan view of the display device. Figure 7 According to Figure 6 Cross-sectional view taken along line C-C' of. For the sake of brevity of description, the content substantially the same as that described with reference to Figures 1 to 4 will not be described again.

[0075] Refer to Figures 5 to 7 a display device 2 can be provided. The display device 2 may include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a common pad 410, a conductive via 600, a lower pad 610, a protective layer 500, a protection pad 510, and a sealing film 700.

[0076] Except for the positions of the common pad 410, the protection pad 510, the lower pad 610, and the conductive via 600, the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, the common pad 410, the conductive via 600, the lower pad 610, the protective layer 500, the protection pad 510, and the sealing film 700 may be substantially the same as those described with reference to Figures 1 to 4 respectively.

[0077] Different from that described with reference to Figures 1 to 4 the common pad 410 may be provided between the two ends of the first reference side 400s along the second direction DR2. For example, the common pad 410 may be disposed at the central portion of the first reference side 400s. The lower pad 610 and the conductive via 600 may be provided under the common pad 410.

[0078] The protection pad 510 may be provided between the two ends of the second reference side 500s along the second direction DR2. For example, the protection pad 510 may be disposed at the central portion of the second reference side 500s. The protection pad 510 may be provided on the common pad 410 to cover the common pad 410.

[0079] The first additional region R2a and the second additional region R2b may be arranged to be spaced apart from each other with the guard pad 510 therebetween. Except for the positions of the first additional region R2a and the second additional region R2b, it may be substantially the same as the additional region R1 described with reference to Figures 1 to 4 described.

[0080] The common pad 410, the guard pad 510, the lower pad 610, the conductive via 600, the first additional region R2a, and the second additional region R2b of the present disclosure may be provided on the opposite side of the driving chip 10, and thus the integration degree of the display device 2 may be improved. The display device 2 may be provided with a non-display area having a small area.

[0081] Figure 8 A perspective view of a display device according to an exemplary embodiment. Figure 9 is Figure 8 a plan view of the display device. Figure 10 is according to Figure 9 a cross-sectional view taken along line D-D' of. For the sake of brevity of description, the content substantially the same as that described with reference to Figures 1 to 4 described may not be described again.

[0082] With reference to Figures 8 to 10 , the display device 3 may be provided. The display device 3 may include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protective layer 500, a first guard pad 512, a second guard pad 514, and a sealing film 700.

[0083] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 may be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 described with reference to Figures 1 to 4 described.

[0084] The first common pad 412 and the second common pad 414 may be provided on the first reference side 400s. The first common pad 412 and the second common pad 414 may be spaced apart from each other along the second direction DR2. The first common pad 412 and the second common pad 414 may be respectively provided at two ends of the first reference side 400s along the second direction DR2. Except for the positions of the first common pad 412 and the second common pad 414, it may be substantially the same as the common pad 410 described with reference to Figures 1 to 4 described.

[0085] The first lower pad 612 and the second lower pad 614 may be spaced apart from each other along the second direction DR2. The first lower pad 612 and the second lower pad 614 may be respectively provided below the first common pad 412 and the second common pad 414. Except for the positions of the first lower pad 612 and the second lower pad 614, it may be substantially the same as the lower pad 610 described with reference to Figures 1 to 4 The lower pad 610 described in

[0086] The first conductive via 602 and the second conductive via 604 may be spaced apart from each other along the second direction DR2. The first conductive via 602 may be provided between the first common pad 412 and the first lower pad 612. The second conductive via 604 may be provided between the second common pad 414 and the second lower pad 614. Except for the positions of the first conductive via 602 and the second conductive via 604, it may be substantially the same as the conductive via 600 described with reference to Figures 1 to 4 The conductive via 600 described in

[0087] The first protective pad 512 and the second protective pad 514 may be provided on the second reference side 500s. The first protective pad 512 and the second protective pad 514 may be spaced apart from each other along the second direction DR2. For example, the first protective pad 512 and the second protective pad 514 may be respectively provided at two ends of the second reference side 500s along the second direction DR2. The first protective pad 512 and the second protective pad 514 may be respectively provided on the first common pad 412 and the second common pad 414. Except for the positions of the first protective pad 512 and the second protective pad 514, it may be substantially the same as the protective pad 510 described with reference to Figures 1 to 4 The protective pad 510 described in

[0088] The sealing film 700 may extend on the substrate 100 along the edges of the first protective pad 512, the edges of the second protective pad 514, and the edges of the protective layer 500. Except for the shape of the sealing film 700, it may be substantially the same as the sealing film 700 described with reference to Figures 1 to 4 The sealing film 700 described in

[0089] The additional area R3 may be provided between the first protective pad 512 and the second protective pad 514. Except for the position of the additional area R3, it may be substantially the same as the additional area R1 described with reference to Figures 1 to 4 The additional area R1 described in

[0090] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, and the additional region R3 of the present disclosure can improve the integration degree of the display device 3 by being provided opposite to the driving chip 10. The display device 3 can be provided with a non-display region having a small area.

[0091] Figure 11 It is a plan view of a display device according to an exemplary embodiment. Figure 12 It is according to Figure 11 a cross-sectional view taken along line E-E'. Figure 13 It is according to Figure 11 a cross-sectional view taken along line F-F'. For the sake of brevity of description, the content substantially the same as that described with reference to Figures 1 to 4 and the content described with reference to Figures 8 to 10 will not be described again.

[0092] Referring to Figures 11 to 13 , the display device 4 can be provided. The display device 4 can include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protection layer 500, a first protection pad 512, a second protection pad 514, and a sealing film 700.

[0093] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 can be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described with reference to Figures 1 to 4 . The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 can be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, and the second protection pad 514 described with reference to Figures 8 to 10 .

[0094] The outer side surface 700s of the sealing film 700 may be inclined. The outer side surface 700s of the sealing film 700 may extend in a direction intersecting the third direction DR3. For example, from the perspective along the third direction DR3, the greater the distance between the outer side surface 700s of the sealing film 700 and the upper surface 100u of the substrate 100, the smaller the distances between it and the driving layer 200, the display layer 300, the common electrode layer 400, the first common pad 412, the second common pad 414, the protective layer 500, the first protective pad 512, and the second protective pad 514. For example, the greater the distance between the perimeter of the outer side surface 700s of the sealing film 700 and the upper surface 100u of the substrate 100, the smaller the perimeter of the outer side surface 700s of the sealing film 700. The perimeter of the outer side surface 700s of the sealing film 700 may be a closed loop extending in a direction parallel to the upper surface 100u of the substrate 100 on the outer side surface 700s. Although the outer side surface 700s of the sealing film 700 is illustrated as a curved surface, it is not limited thereto. The sealing film may be substantially the same as the sealing film 700 described with reference to Figures 1 to 4 except for the shape of the outer side surface 700s of the sealing film 700.

[0095] An additional region R4 may be provided between the first protective pad 512 and the second protective pad 514. The additional region R4 may be substantially the same as the additional region R1 described with reference to Figures 1 to 4 except for the position of the additional region R4.

[0096] A display device 4 may be provided, in which the first common pad 412, the first protective pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protective pad 514, the second lower pad 614, the second conductive via 604, and the additional region R4 disclosed herein are provided on the opposite side of the driving chip 10. A display device 4 may be provided, which has a small non-display area.

[0097] Figure 14 A cross-sectional view corresponding to the E-E' line of the display device according to an exemplary embodiment for Figure 11 . Figure 15 For Figure 14 of the display device, a cross-sectional view corresponding to the F-F' line for Figure 11 . For the sake of brevity of description, the content substantially the same as that described with reference to Figures 1 to 4 , the content described with reference to Figures 8 to 10 , and the content described with reference to Figures 11 to 13 will not be described again.

[0098] Refer to Figures 14 to 15, a display device 5 may be provided. The display device 5 may include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protective layer 500, a first protective pad 512, a second protective pad 514, and a sealing film 520.

[0099] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400 and the protective layer 500 can be respectively Figures 1 to 4 The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400 and the protective layer 500 described above are substantially the same. The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protective pad 512 and the second protective pad 514 can be respectively the same as those in the reference Figures 8 to 10 The illustrated first common pad 412 , second common pad 414 , first conductive via 602 , second conductive via 604 , first lower pad 612 , second lower pad 614 , first protection pad 512 , and second protection pad 514 are substantially the same.

[0100] The sealing film 520 may constitute a single-layer film with the protective layer 500. In other words, the sealing film 520 and the protective layer 500 may be connected to each other without an interface therebetween. The sealing film 520 may constitute a single-layer film with the first protective pad 512. In other words, the sealing film 520 and the first protective pad 512 may be connected to each other without an interface therebetween. The sealing film 520 may constitute a single-layer film with the second protective pad 514. In other words, the sealing film 520 and the second protective pad 514 may be connected to each other without an interface therebetween. For example, the sealing film 520, the protective layer 500, the first protective pad 512, and the second protective pad 514 may constitute a single-layer film. The sealing film 520 may include the same material as the protective pad 510. For example, the sealing film 520 may include a PET film. As described with reference to Figures 11 to 13 As described above, the outer side surface 520s of the sealing film 520 may be inclined. The sealing film 520 may be similar to the reference Figures 1 to 4 The sealing film 700 described is substantially the same.

[0101] The additional region R5 may be provided between the first protection pad 512 and the second protection pad 514. The additional region R5 may be similar to the reference region except for its position. Figures 1 to 4 The additional region R1 described above is substantially the same.

[0102] A display device 5 may be provided, in which a first common pad 412, a first protection pad 512, a first lower pad 612, a first conductive via 602, a second common pad 414, a second protection pad 514, a second lower pad 614, a second conductive via 604, and an additional region R5 of the present disclosure are provided on the opposite side of the driving chip 10. A display device 5 may be provided, which has a non-display area with a small area.

[0103] Figure 16 A perspective view of a display device according to an exemplary embodiment. Figure 17 is Figure 16 a plan view of the display device. Figure 18 is according to Figure 17 a cross-sectional view taken along the G-G' line of. For the sake of brevity of description, the content that is substantially the same as that described with reference to Figures 1 to 4 and the content described with reference to Figures 8 to 10 will not be described again.

[0104] Referring to Figures 16 to 18 , a display device 6 may be provided. The display device 6 may include a substrate 100, a first protruding substrate 122, a second protruding substrate 124, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protection layer 500, a first protection pad 512, a second protection pad 514, and a sealing film 700.

[0105] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 may be substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protection layer 500 described with reference to Figures 1 to 4 . The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 may be substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protection pad 512, the second protection pad 514, and the sealing film 700 described with reference to Figures 8 to 10 .

[0106] The first protruding substrate 122 and the second protruding substrate 124 may be provided on the third reference side 100s of the substrate 100. The third reference side 100s may be the side of the substrate 1100 facing the first direction DR1. The first protruding substrate 122 and the second protruding substrate 124 may be respectively provided at two ends of the third reference side 100s along the second direction DR2. The first protruding substrate 122 and the second protruding substrate 124 may protrude from the third reference side 100s. For example, the first protruding substrate 122 and the second protruding substrate 124 may extend along the first direction DR1 on the third reference side 100s. The first protruding substrate 122 and the second protruding substrate 124 may include a transparent electrical insulating material. For example, the first protruding substrate 122 and the second protruding substrate 124 may include glass. As an example, the first protruding substrate 122 and the second protruding substrate 124 may form a single-layer film with the substrate 100. In other words, the first protruding substrate 122 and the second protruding substrate 124 may be connected to each other without an interface therebetween. As an example, the first protruding substrate 122 and the second protruding substrate 124 may be different films from the substrate 100. In other words, the first protruding substrate 122 and the second protruding substrate 124 may be connected to each other with an interface therebetween.

[0107] The first lower pad 612, the first conductive via 602, the first common pad 412, and the first protection pad 512 may be sequentially provided on the first protruding substrate 122. The second lower pad 614, the second conductive via 604, the second common pad 414, and the second protection pad 514 may be sequentially provided on the second protruding substrate 124. The sealing film 700 may be provided between the first protruding substrate 122 and the first protection pad 512 and between the second protruding substrate 124 and the second protection pad 514.

[0108] The upper additional region R6 may be provided between the first protection pad 512 and the second protection pad 514. The lower additional region R7 may be provided between the first protruding substrate 122 and the second protruding substrate 124. Different from that described with reference to Figures 1 to 4 As described, additional components may be provided below the lower additional region R7. When the additional component is a light-emitting component, the upper additional region R6 and the lower additional region R7 may be regions for radiating light generated from the light-emitting component to the outside of the display device 6. When the additional component is an antenna component, the upper additional region and the lower additional region may be regions for facilitating radio wave transmission / reception operations between the antenna component and an external device.

[0109] Although the illustrated embodiment shows a step difference between the sealing film 700 and the third reference side surface 100s that is directly adjacent to the third reference side surface 100s, this is not limiting. In another embodiment, the third reference side surface 100s may be coplanar with the sealing film 700. From the perspective along the third direction DR3, although the first protection pad 512 and the second protection pad 514 are illustrated as being disposed within the first protruding substrate 122 and the second protruding substrate 124, respectively, this is not limiting. In another embodiment, the first protection pad 512 and the second protection pad 514 may completely overlap the first protruding substrate 122 and the second protruding substrate 124, respectively.

[0110] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, the upper additional region R6, and the lower additional region R7 of the present disclosure may be provided on the opposite side of the driving chip 10. A display device 6 may be provided, which has a non-display area with a small area.

[0111] Figure 19 Is a perspective view of a display device according to an exemplary embodiment. Figure 20 Is Figure 19 A plan view of the display device. Figure 21 Is according to Figure 20 A cross-sectional view taken along line H-H' of. For the sake of brevity of description, the content that is substantially the same as that described with reference to Figures 1 to 4 And the content described with reference to Figures 8 to 10 Will not be described again.

[0112] Referring to Figures 19 to 21 A display device 1100 may be provided. The display device 1100 may include a substrate 100, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protective layer 500, a first protection pad 512, a second protection pad 514, a sealing film 700, a printed circuit board 20, a connector 40, and a light-emitting component 30. The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 may be respectively referred to Figures 1 to 4The substrate 100, driving chip 10, driving layer 200, display layer 300, common electrode layer 400, and protective layer 500 described are substantially the same. The first common pad 412, second common pad 414, first conductive via 602, second conductive via 604, first lower pad 612, second lower pad 614, first protective pad 512, second protective pad 514, and sealing film 700 can respectively correspond to those Figures 8 to 10 described for the first common pad 412, second common pad 414, first conductive via 602, second conductive via 604, first lower pad 612, second lower pad 614, first protective pad 512, second protective pad 514, and sealing film 700 are substantially the same.

[0113] Taking the substrate 100 as a reference, the printed circuit board 20 can be provided on the opposite side of the electronic paper layer. The printed circuit board 20 can include predetermined elements for controlling the display device 1100. For example, the printed circuit board 20 can include a control component, a storage component, a communication component for generating command signals provided to the driving chip 10, and an input component for receiving signals from the user of the display device 7. The printed circuit board 20 and the driving chip 10 can be electrically connected to each other through the connector 40.

[0114] The light-emitting component 30 can be provided on the printed circuit board 20. For example, the light-emitting component 30 can be inserted into the printed circuit board 20 and can penetrate the printed circuit board 20. The light-emitting component 30 can overlap with the additional area R8 along the third direction DR3. The light emitted from the light-emitting component 30 can sequentially pass through the substrate 100 and the additional area R8. For example, the light-emitting component 30 can include a light-emitting diode (LED; Light-Emitting Diode). In another embodiment, the antenna component can be provided on the printed circuit board 20 instead of or together with the light-emitting component 30.

[0115] The first common pad 412, first protective pad 512, first lower pad 612, first conductive via 602, second common pad 414, second protective pad 514, second lower pad 614, second conductive via 604, and additional area R8 of the present disclosure can be provided on the opposite side of the driving chip 10. The display device 1100 can be provided with a small-area non-display area.

[0116] Figure 22 Perspective view of a display device according to an exemplary embodiment. Figure 23 is Figure 22 plan view of the display device. Figure 24 is according to Figure 23 sectional view taken along line I-I' of. For the sake of brevity of description, those in reference Figures 1 to 4Content of the description, reference Figures 8 to 10 Content of the description and reference Figures 16 to 18 Content substantially the same as the content of the description.

[0117] Reference Figures 22 to 24 , a display device 1200 can be provided. The display device 1200 may include a substrate 100, a first protruding substrate 122, a second protruding substrate 124, a driving chip 10, a driving layer 200, a display layer 300, a common electrode layer 400, a first common pad 412, a second common pad 414, a first conductive via 602, a second conductive via 604, a first lower pad 612, a second lower pad 614, a protective layer 500, a first protective pad 512, a second protective pad 514, a sealing film 700, a printed circuit board 20, a connector 40, and a light-emitting component 30.

[0118] The substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 may be respectively substantially the same as the substrate 100, the driving chip 10, the driving layer 200, the display layer 300, the common electrode layer 400, and the protective layer 500 with reference to Figures 1 to 4 the description. The first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protective pad 512, the second protective pad 514, and the sealing film 700 may be respectively substantially the same as the first common pad 412, the second common pad 414, the first conductive via 602, the second conductive via 604, the first lower pad 612, the second lower pad 614, the first protective pad 512, the second protective pad 514, and the sealing film 700 with reference to Figures 8 to 10 the description. The first protruding substrate 122 and the second protruding substrate 124 may be respectively substantially the same as the first protruding substrate 122 and the second protruding substrate 124 with reference to Figures 16 to 18 the description.

[0119] Taking the substrate 100 as a reference, the printed circuit board 20 can be provided on the opposite side of the electronic paper layer. The printed circuit board 20 may include predetermined components for controlling the display device 1200. For example, the printed circuit board 20 may include a control component, a storage component, a communication component for generating a command signal provided to the driving chip 10, and an input component for receiving a signal from a user of the display device 1200. The printed circuit board 20 and the driving chip 10 may be electrically connected to each other through the connector 40.

[0120] The light-emitting component 30 may be provided on the printed circuit board 20. For example, the light-emitting component 30 may be inserted into the printed circuit board 20 and may penetrate the printed circuit board 20. The light-emitting component 30 may overlap with the upper additional region R9 and the lower additional region R10 along the third direction DR3. The light-emitting component 30 may be exposed by the lower additional region R10. The light radiated from the light-emitting component 30 may sequentially pass through the lower additional region R10 and the upper additional region R9. For example, the light-emitting component 30 may include an LED. In another embodiment, the antenna component may be provided on the printed circuit board 20 instead of or together with the light-emitting component 30.

[0121] The first common pad 412, the first protection pad 512, the first lower pad 612, the first conductive via 602, the second common pad 414, the second protection pad 514, the second lower pad 614, the second conductive via 604, the upper additional region R9, and the lower additional region R10 of the present disclosure may be provided on the opposite side of the driving chip 10. The display device 1200 may be provided, which has a small non-display area.

[0122] Figure 25 Perspective view of a display device according to an exemplary embodiment. Figure 26 is Figure 25 Plan view of the display device. For the sake of brevity of description, the content that is substantially the same as that described with reference to Figures 19 to 21 and the content described with reference to Figures 22 to 24 will not be described again.

[0123] Referring to Figure 25 and Figure 26 , the display device 2000 may be provided, which includes a housing 2100, a first window 2200, a second window 2300, and an input area 2400. The housing 2100 may surround the display device 1100 described with reference to Figures 19 to 21 or the display device 1200 described with reference to Figures 22 to 24 .

[0124] The first window 2200 may be provided on the light-emitting component. The first window 2200 may receive the light generated by the light-emitting component and radiate it to the outside of the display device 2000. The first window 2200 may include a transparent material or a translucent material, or may be an opening.

[0125] A second window 2300 may be provided on the display layer 300. A user of the display device 2000 may view the content output on the display layer 300 through the second window 2300. The second window 2300 may include a transparent material or may be an opening. From the perspective of the direction in which the second window 2300 and the display layer 300 face each other, although the second window 2300 is illustrated as being included in the display layer 300, it is not limited thereto. In another embodiment, from the perspective of the direction in which the second window 2300 and the display layer 300 face each other, the second window 2300 and the display layer 300 may completely overlap each other.

[0126] A first common pad 412, a first protection pad 512, a first lower pad 612, a first conductive via 602, a second common pad 414, a second protection pad 514, a second lower pad 614, a second conductive via 604, and an additional area of the present disclosure may be provided on the opposite side of the driving chip. A display device 2000 may be provided having a small non-display area.

[0127] The above description of the embodiments of the technical idea of the present invention provides examples for explaining the technical idea of the present invention. Therefore, the technical idea of the present invention is not limited to the above embodiments, and it is clearly possible for those skilled in the art to make various modifications and changes such as combinations and implementations of the embodiments within the scope of the technical idea of the present invention.

[0128] The present disclosure may provide a display device including a minimized non-display area.

[0129] The present disclosure may provide a display device including additional elements.

[0130] However, the effects of the present invention are not limited to the above disclosure.

[0131] Description of Reference Numerals

[0132] 1, 2, 3, 4, 5, 6, 1100, 1200, 2000: Display device

[0133] 10: Driving chip

[0134] 20: Printed circuit board

[0135] 30: Light-emitting component

[0136] 40: Connector

[0137] 100: Substrate

[0138] 200: Driving layer

[0139] 300: Display layer

[0140] 400: Common electrode layer

[0141] 410: Common pad

[0142] 500: Protective layer

[0143] 510: Protective pad

[0144] 600: Conductive via

[0145] 700: Sealing film

Claims

1. A display device, comprising: a substrate; a common electrode layer provided on the substrate, wherein the common electrode layer includes: a first common pad protruding from a first reference side surface extending in a second direction parallel to the upper surface of the substrate toward a first direction, the second direction being parallel to the upper surface of the substrate and intersecting the first direction; and a second common pad protruding from the first reference side surface; a driving layer including driving elements and provided between the substrate and the common electrode layer; a display layer including electrophoretic particles and provided between the driving layer and the common electrode layer; a first lower pad on the substrate, the first lower pad including a conductive material in direct contact with the upper surface of the substrate and electrically insulated from the driving layer; a first conductive via electrically connecting the first lower pad and the first common pad and spaced apart from the driving layer, and provided between the substrate and the first common pad; a second conductive via spaced apart from the first conductive via along the second direction; a driving chip on the substrate, the driving chip being provided opposite the first conductive via with respect to the driving layer along the first direction such that the driving chip and the first conductive via are disposed on both sides of the driving layer; and a protective layer provided on the common electrode layer, wherein the protective layer includes: a first protective pad provided on the first common pad; and a second protective pad provided on the second common pad, wherein the first protective pad and the second protective pad protrude from a second reference side surface of the protective layer extending in the second direction, and the protective layer, the first protective pad, and the second protective pad include an electrically insulating material; wherein the substrate includes: a first protruding substrate provided opposite the first protective pad with respect to the first conductive via such that the first conductive via is disposed between the first protruding substrate and the first protective pad; and a second protruding substrate provided opposite the second protective pad with respect to the second conductive via such that the second conductive via is disposed between the second protruding substrate and the second protective pad.

2. The display device according to claim 1, wherein the first common pad and the second common pad are respectively disposed at two end portions of the first reference side surface disposed on both sides along the second direction.

3. The display device according to claim 2, wherein: viewed from an angle along a third direction perpendicular to the upper surface of the substrate, the first common pad and the second common pad are respectively provided within the first protective pad and the second protective pad.

4. The display device according to claim 1, the device further comprising: A sealing film, which extends along the edge of the protective layer, the edge of the first protective pad, and the edge of the second protective pad on the substrate.

5. The display device according to claim 4, wherein: The side surface of the sealing film extends along a third direction perpendicular to the upper surface of the substrate.

6. The display device according to claim 4, wherein: Viewed from an angle along the third direction perpendicular to the upper surface of the substrate, the distance between the side surface of the sealing film and the protective layer becomes smaller as it is farther away from the upper surface of the substrate.

7. The display device according to claim 4, wherein: The sealing film and the protective layer, the first protective pad, and the second protective pad form a single-layer film.

8. The display device according to claim 1, the device further comprising: A printed circuit board, which is provided opposite to the substrate with respect to the substrate, such that the substrate is disposed between the printed circuit board and the display layer; And An additional component, which is provided on the printed circuit board, wherein The additional component includes at least one of a light-emitting component and an antenna component, And viewed from an angle along the third direction perpendicular to the upper surface of the substrate, the additional component is disposed between the first protective pad and the second protective pad.

9. The display device according to claim 8, wherein: The substrate includes: A first protruding substrate, which is provided between the first conductive via and the printed circuit board; and A second protruding substrate, which is provided between the second conductive via and the printed circuit board, wherein The first protruding substrate and the second protruding substrate protrude from a third reference side surface of the substrate extending along the second direction, And the additional component is exposed between the first protruding substrate and the second protruding substrate.

10. The display device according to claim 1, wherein: The first common pad is disposed on any one of the two ends disposed on both sides along the second direction of the first reference side surface.

11. The display device according to claim 1, wherein: The first common pad is disposed on a region between the two ends disposed on both sides along the second direction of the first reference side surface.

12. The display device according to claim 1, the device further comprising: A housing, wherein The substrate, the driving layer, the display layer, the protective layer, the first protective pad, the second protective pad, the first conductive via, the second conductive via, and the driving chip are disposed within the housing, And the housing includes a first window, which overlaps with the display layer along a third direction perpendicular to the upper surface of the substrate.

13. The display device according to claim 12, the device further comprising: A printed circuit board, which is provided opposite to the substrate with respect to the substrate, such that the substrate is disposed between the printed circuit board and the display layer; And A light-emitting component, the light-emitting component being provided on the printed circuit board, wherein, the printed circuit board and the light-emitting component are disposed within the housing, and the housing further includes a second window, the second window overlapping the light-emitting component along the third direction.

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