Coupling structure for electronic device housing

Abstract

The present invention discloses a housing for an electronic device. The housing includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first interface surface and the second interface surface. The joint structure includes a molded element forming a portion of the outer surface of the housing, and a sealing member forming a waterproof seal between the first conductive component and the second conductive component. The present invention also discloses a method for forming the housing of an electronic device.

Description

[0001] This application is a divisional application of an invention patent application with an international application date of July 11, 2017, a national application number of 201780020795.4, and an invention name of “Coupling structure for electronic device housing”.

[0002] CROSS-REFERENCE TO RELATED APPLICATIONS

[0003] This Patent Cooperation Treaty patent application claims priority to U.S. Non-Provisional Patent Application No. 15 / 212,029, filed on July 15, 2016, and entitled “Coupling Structures for Electronic Device Housings,” the contents of which are incorporated herein by reference in their entirety. Technical Field

[0004] The presently disclosed subject matter relates generally to coupling structures for electronic device housings, and more particularly to coupling structures that provide a waterproof joint between components or sections of electronic device housings. Background Art

[0005] Electronic device housings typically include multiple components that are coupled together to form the housing. For example, two or more housing components may be coupled together to form an outer surface or exterior surface of the housing and form an interior cavity or volume that accommodates components of the electronic device. The housing may also include a joint structure or other intermediate components positioned between the housing components. The joint structure may form a portion of the exterior surface of the housing together with the housing components. The housing and the joint structure may be formed of a variety of materials, such as metal, plastic, etc. Summary of the invention

[0006] A housing for an electronic device includes a first conductive component defining a first interface surface, a second conductive component defining a second interface surface facing the first interface surface, and a joint structure between the first interface surface and the second interface surface. The joint structure includes a molded element forming a portion of an exterior surface of the housing, and a sealing member adjacent to the molded element and forming a waterproof seal between the first conductive component and the second conductive component.

[0007] A method for manufacturing a housing for an electronic device includes positioning a sealing member in a first portion of a gap between a first component and a second component to form a watertight seal between the first component and the second component, introducing a bonding material into a second portion of the gap, and curing the bonding material to form a molded element defining a portion of an exterior surface of the housing. In some embodiments, the operation of positioning the sealing member in the first portion of the gap occurs after the operation of curing the bonding material to form the molded element, and the operation of introducing the bonding material into the second portion of the gap includes: flowing the bonding material into the first portion and the second portion of the gap, curing the bonding material to form a hardened bonding material, and removing at least a portion of the hardened bonding material from the first portion of the gap to form the molded element.

[0008] A housing for an electronic device includes: a first housing component that includes a conductive material and forms a first portion of an exterior surface of the housing; and a second housing component that is attached to the first housing component via a waterproof joint. The second housing component includes: a non-conductive structural member that is coupled to the first housing component and forms a second portion of the exterior surface of the housing; and a conductive coating that is on at least a portion of the structural member and forms a third portion of the exterior surface of the housing.

[0009] A method of manufacturing a housing for an electronic device includes: coupling a first housing component to a second housing component to form a housing having an exterior surface at least partially defined by a portion of the first housing component and a portion of the second housing component; and removing a portion of a conductive coating from the first housing component to expose a substantially non-conductive material beneath the coating.

[0010] A method of manufacturing a housing for an electronic device includes removing material from a housing blank, the housing blank including a non-conductive component positioned between and bonded to a first conductive component and a second conductive component to form at least an exterior surface of the housing and an interior volume adapted to receive components of the electronic device. After the material is removed, the non-conductive component electrically isolates the first conductive component from the second conductive component, and an interface between the non-conductive component and a surface of the first conductive component is waterproof. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] The present disclosure will be readily understood by the following detailed description taken in conjunction with the accompanying drawings, wherein like reference numerals refer to like structural elements, and wherein:

[0012] Figure 1A An example electronic device is shown.

[0013] Figure 1B Show Figure 1A Exploded view of the housing of an electronic device.

[0014] Figure 2A An example electronic device is shown.

[0015] Figure 2B Show Figure 2A Exploded view of the housing of an electronic device.

[0016] Figure 3 Shown along Figure 2A The line AA in the Figure 2A A partial cross-sectional view of a housing showing an example joint structure.

[0017] Figure 4A-4C Shown along Figure 2A Line AA in the observation Figure 2A A partial cross-sectional view of the housing showing the formation of Figure 3 Example process for the joint structure of .

[0018] Figure 5A-5D Shown along Figure 2A Line AA in the observation Figure 2A A partial cross-sectional view of the housing showing the formation of Figure 3 Another example process of a joint structure.

[0019] Figure 6 Shown along Figure 2A The line AA in the Figure 2A A partial cross-sectional view of a housing showing another example joint structure.

[0020] Figure 7A-7C Shown along Figure 2A Line AA in the observation Figure 2A A partial cross-sectional view of the housing showing the formation of Figure 6 Example process for the joint structure of .

[0021] Figure 8A-8D Shown along Figure 2A Line AA in the observation Figure 2A A partial cross-sectional view of the housing showing the formation of Figure 6 Another example process of a joint structure.

[0022] Fig. 9 Shown along Figure 2A A partial cross-sectional view of the example housing as viewed along line AA.

[0023] Figures 10A-10D Show Fig. 9 A partial cross-sectional view of the housing showing the formation of Fig. 9 An example process for the shell.

[0024] Figure 11A-11CAn example process of forming another example housing is shown.

[0025] Figure 12A-12C An example process of forming another example housing is shown. DETAILED DESCRIPTION

[0026] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the essence and scope of the embodiments defined by the appended claims.

[0027] The housing for an electronic device may include a plurality of different components. For example, the housing may include a first component forming the back surface of the housing and a second component forming a front portion (e.g., a support or frame for supporting a display screen). In order to connect the first component and the second component (and / or provide other functionality), an intermediate or connecting structure formed by a polymer or other suitable material may be positioned between the components. For example, a polymer material in a viscous or flowable state may be introduced into the gap between the housing components, and then cured to keep the housing components together. Alternatively, a pad or other structure may be positioned in the gap and glued or otherwise adhered to the housing components. In some cases, the housing components may be conductive elements as part of the circuit of the device. In such cases, the intermediate or connecting structure may electrically isolate the housing components of the electrical operation from other housing components. For example, the housing components may serve as antennas for wireless communication circuits of electronic devices, and the intermediate or connecting structure may electrically isolate the components from other conductive housing components to facilitate normal antenna function.

[0028] Electronic devices, such as handheld electronic devices and wearable electronic devices, are often subjected to liquids, which can damage sensitive electrical components within the housing if the liquid is allowed to enter the housing of the device. In the case where the housing is formed by a plurality of different connected components, it may be advantageous to provide waterproof joints between the components. As used herein, the term "waterproof" refers to the ability of a joint, seal, seam, or interface to prevent water or other liquids from passing through it under expected or specific conditions. For example, when a joint, seal, or interface prevents water from passing through at a specific pressure or water depth (e.g., 10 millibars) within a specific duration (e.g., 1 hour), the joint, seal, or interface may be considered waterproof. Other combinations of pressure and duration may also be used, such as immersion at 1m for 30 minutes and / or subjecting to a water jet directed at the device. Other water resistance or water resistance measurements, classifications, or standards may also be used, such as the International Organization for Standardization (ISO) 2281 or 6425 standards, the International Electrotechnical Commission (IEC) IPX1-IPX9K standards, or water pressure ratings (e.g., the ability to withstand water pressures up to 1-20ATM). Generally, a joint, seal, seam, or interface may be considered waterproof if it prevents the passage of water under foreseeable use or misuse of the electronic device (e.g., being worn while swimming or showering, being exposed to sweat, rain, or spills, being dropped into standing water, etc.). Where a joint, seal, seam, or interface is described herein as waterproof, it may meet any one or more of the above standards, measurements, or classifications.

[0029] As described above, the shell may include a plurality of shell components connected to each other by a joint structure. The joint structure may provide various functions. For example, the joint structure may mechanically hold the shell components together while also electrically isolating the shell components from each other. Various shells are described herein, wherein the joint or seam between the joint structure and the shell components is waterproof. For example, in order to form a waterproof shell, the joint structure may include a plurality of elements, such as an outer element that provides structural and / or decorative functionality and forms a part of the outer side surface of the shell, and an inner element that provides a waterproof seal. The inner element may be, for example, a gasket, an O-ring, or other elastomer or deformable material compressed between the shell components. As another example, the inner element may be a sealant, an adhesive, or other materials that are introduced between the shell components and are optionally cured to form a waterproof seal.

[0030] A waterproof seal between the shell components may also be formed by assembling a shell blank and machining the shell blank to form the shell. For example, the shell blank may include material for the shell components and material for a joint structure that is bonded together so that when machined into the shell, the joint structure is properly positioned between the shell components. The bond between the various materials in the shell blank may be waterproof, resulting in a waterproof interface between the shell components and the joint structure in the final shell. Details of these and other shells and methods of forming them are discussed herein.

[0031] Figure 1A An example electronic device 100 is shown. The electronic device 100 is a smart phone, but this is only one representative example of an electronic device that can be used in conjunction with the ideas disclosed herein. Other example electronic devices include, but are not limited to, wearable electronic devices (such as, Figure 2A-2B smartwatch shown in ), tablet computer, laptop computer, etc.

[0032] The electronic device 100 includes a housing 104 and a cover 102, such as glass, plastic, or other substantially transparent material, component, or assembly, attached to the housing 104. The cover 102 can cover or otherwise be positioned over a display and / or a touch-sensitive surface (e.g., a touch screen).

[0033] As shown, the housing 104 may be a multi-piece housing. For example, the housing 104 may be composed of a main body portion 106 and end portions 108, 110 ( Figure 1B ) is formed. The device 100 also includes internal components, such as a processor, memory, circuit boards, batteries, sensors, etc. Such components, not shown, may be disposed within an internal volume at least partially defined by the housing 104.

[0034] Figure 1B An exploded view of device 100 is shown. Housing 104 includes a body portion 106 and end portions 108, 110 (also referred to herein as top portion 108 and bottom portion 110). Body portion 106 and end portions 108, 110 may be formed of any suitable material, such as aluminum, titanium, amorphous metal, polymer, etc. Any of body portion 106 and / or end portions 108, 110 may be part of the circuitry of electronic device 100. In such cases, these components may be formed of or include conductive materials and may be welded or otherwise electrically coupled to the circuitry within the interior volume of housing 104. As used herein, components formed of conductive materials may be referred to as conductive components.

[0035] The housing 104 also includes a joint structure 112 located between the main body portion 106 and the top portion 108 and the bottom portion 110. The joint structure 112, also referred to as an intermediate structure or component, couples and / or holds one component to another component and can form a waterproof seal between its joined or adjacent components. For example, as described herein, the joint structure 112 couples the end portions 108, 110 to the main body portion 106. The joint structure 112 can include multiple parts, sections, elements, layers, etc. For example, as described herein, the joint structure 112 can include a first element that mechanically holds the housing components together, and a second element that forms a waterproof seal between the joint structure 112 and adjacent housing components.

[0036] The joint structure 112 may be formed of or include any suitable material. For example, the joint structure 112 or a portion thereof may be formed of a polymer such as nylon, polyetheretherketone, polysulfone, polyphenylsulfone, polyaryletherketone, polyetherimide, polyethersulfone, or any other suitable material. In addition, the joint structure 112 may be reinforced with reinforcing fibers of glass, carbon, or any other suitable material. The joint structure 112 may also be formed of or include ceramics such as zirconium oxide, aluminum oxide, or any other ceramic material.

[0037] The outer surface of the joint structure 112 may form a continuous surface with the outer surfaces of other housing components. Alternatively, the outer surface of the joint structure 112 may be recessed or protruded from the portion of the housing 104 adjacent to the joint structure 112. In addition, the outer surface of the joint structure 112 may be configured to blend with other portions of the housing 104. For example, the joint structure 112 may have the same color as the adjacent portion of the housing 104, may have the same surface finish / texture as the outer portion of the housing 104, etc. As described herein, the outer surfaces of the joint structure 112 and the housing 104 may be finished together. In other words, the joint structure 112 and the housing 104 may be subjected to the same finishing process (e.g., grinding, machining or polishing) to produce a continuous surface extending through the adjacent portion of the joint structure 112 and the housing 104, and to produce a similar surface finish and / or appearance on the joint structure 112 and the housing 104.

[0038] The main body portion 106 and / or the end portions 108, 110 may be part of the circuitry of the device 100. For example, one or both of the end portions 108, 110 may be an antenna or part of an antenna for wireless communication (e.g., cellular, Wi-Fi, Bluetooth, etc.). In the case where the end portion is an antenna or other part of a circuit, it may be necessary or desirable to electrically and / or capacitively isolate the end portion from other parts of the housing 104 (such as the main body portion 106). Therefore, the joint structure 112 may be formed of or include an electrical insulator to electrically and / or capacitively isolate the housing components from each other, while also coupling them together to form a structurally strong and waterproof housing 104. In some embodiments, the role of the housing components may be reversed, so that the joint structure 112 is configured to act as an antenna or other circuit component. In such cases, the connector structure 112 may be formed of or include a conductive material, and the main body portion 106 and / or the end portions 108, 110 of the housing 104 may be formed of a non-conductive material or may be otherwise electrically isolated from the connector structure 112. The electronic device 100 may also or alternatively include an antenna positioned within the housing and proximate to (or embedded in) the connector structure 112. In such cases, the connector structure 112 may be formed of a non-conductive material to facilitate wireless signals passing through the housing 104 and reaching (and leaving) the internal antenna.

[0039] Figure 2A An example electronic device 200 is shown having a different housing configuration than the electronic device 100. Figure 2A As shown, the electronic device 200 is a smart watch, but this is only one example of an electronic device that can use the housing described herein. Other example electronic devices include, but are not limited to, smart phones, tablet computers, laptop computers, other wearable devices, etc.

[0040] The electronic device 200 includes a housing 204 and a cover 202, such as glass, plastic, or other substantially transparent material, component, or assembly, attached to the housing 204. The cover 202 can cover a display and / or a touch-sensitive surface (e.g., a touch screen). The device 200 also includes a strap or band 205 for attaching the device 200 to a user (e.g., to a user's wrist).

[0041] As shown, housing 204 can be a multi-piece housing. For example, housing 204 can be formed from lower housing member 206 and upper housing member 210. Device 200 also includes internal components, such as a processor, memory, circuit boards, batteries, sensors, etc. (not shown), which can be disposed within an internal volume at least partially defined by housing 204.

[0042] Figure 2BAn exploded view of the device 200 is shown. The housing 204 includes a lower housing component 206, a joint structure 208, an upper housing component 210, and a cover 202. The upper housing component 206 and the lower housing component 210 may be formed of any suitable material, such as aluminum, titanium, amorphous metal, polymer, etc. One or both of the upper housing component 206 and the lower housing component 210 may be part of the circuit of the electronic device 100 (for example, they may act as an antenna for a wireless communication circuit), and thus may be a conductive component formed of or including a conductive material. In the case where the housing component is part of the circuit, the housing component may be welded or otherwise electrically coupled to the circuit. Similar to the above discussion, the joint structure 208 may be electrically operated, rather than a housing component, in which case the joint structure 208 may be formed of or include a conductive material, and the housing components 206, 210 may be formed of or include a non-conductive material (or they may be electrically isolated from the joint structure 208 in other ways). Furthermore, as described above, the non-conductive tab structure 208 may facilitate passage of wireless signals through the housing 204 to an antenna positioned within the housing 204 or embedded in the tab structure 208 .

[0043] return Figure 2B , the housing 204 includes a joint structure 208 between an upper housing member 206 and a lower housing member 210. Similar to the joint structure 112 described above, the joint structure 208 couples and / or retains the upper housing member 206 to the lower housing member 210. The joint structure 208 is an example joint structure that may be used in the electronic device 200. More specifically, the joint structure 208 is a substantially frame-shaped member that connects the upper housing member 206 and the lower housing member 210 along a plane that is substantially coplanar with the cover 202. However, other embodiments or implementations of the housing 204 may have housing members and joint structures with different configurations and geometries, such as housing members that are separated from each other along a joint that is substantially perpendicular to the cover 202. For example, the housing 104 ( Figure 1A-1B ) includes a joint structure having a section that is substantially perpendicular to the cover 102. A similar structure may be used in the housing 204. Fig. 12C Another housing with an alternative joint structure is shown. In fact, the joint structure described herein can be used between any housing components or parts, not just those specific examples shown in the figures.

[0044] Joint structure 112( Figure 1A-1B ) and joint structure 208( Figure 2A-2B ) and the components or parts of the housings 104 and 204 may be similar in terms of materials, functions, structures, manufacturing methods, etc. Therefore, any discussion of the connector structure or housing components of a given electronic device is also applicable to the connector structure or housing components of other electronic devices. In addition, although Figure 3-12CAn example connector structure of electronic device 200 is shown, but the same geometry, materials, electrical characteristics, functions, and manufacturing methods may be applied to connector structures of electronic device 100 or any suitable electronic device.

[0045] Figure 3 It is along Figure 2A A partial cross-sectional view of the electronic device 200 viewed along line AA of FIG. 1 shows an example configuration of a joint structure that can provide a waterproof seal between housing components. For clarity, other components of the device 200, such as the cover 202, the battery, the display, etc., are shown in FIG. Figure 3 (and other figures) are omitted.

[0046] Figure 3 A joint structure 300 is shown including a molding element 302 and a sealing member 304. The molding element 302 and the sealing member 304 are positioned between an interface surface 306 of the upper housing component 210 and an interface surface 308 of the lower housing component 206. The interface surfaces 306, 308 face each other and may be substantially parallel.

[0047] The upper housing component 210 and / or the lower housing component 206 may be formed of or include a conductive material and may be part of the circuitry of the electronic device 200. In such cases, the joint structure 300 including the molding element 302 and the sealing member 304 may be formed of an electrical insulator or non-conductive material such that the sealing member 304 and the molding element 302 electrically isolate the lower housing component 206 from the upper housing component 210.

[0048] The upper housing component 210 and the lower housing component 206 may include interlocking features 310 with which the molding element 302 engages to retain the upper housing component 210 and the lower housing component 206 to the molding element 302 and thereby to each other. Figure 3 As shown, the interlocking feature 310 is a trapezoidal channel (similar to a "dovetail" channel) having inclined surfaces that prevent the housing components 210, 206 and the molded element 302 from separating from each other. Figure 3 An alternative or addition to the trapezoidal channels shown Figure 3 In addition to the trapezoidal channels shown, other interlocking features may be used. For example, the housing components may include channels, pins, protrusions, surfaces, textures, recesses, or any other features or elements that engage the molded element 302 to hold the housing components 210, 206 together.

[0049] The interlocking feature 310 may extend continuously around the perimeter of the housing 204. Alternatively, the housing 204 may include multiple discrete interlocking features that do not extend around the entire housing 204. The housing 204 may also include different interlocking features (or no interlocking features) at different locations, such as along a side of the housing 204 (e.g., Figure 3 ) and along the other side of the housing 204 (e.g., the housing 204 and the Figure 3 The interface surfaces 306, 308 may also have different interlocking features 310. For example, the interface surface 306 may include a trapezoidal channel (such as Figure 3 ), and the interface surface 308 may include different interlocking features, such as pins, trapezoidal protrusions, etc. In addition, the housing 204 may include multiple interlocking features 310 along a given molded element / housing component interface. For example, two trapezoidal channels may be formed in one or both of the interface surfaces 306, 308.

[0050] In some cases, the interlocking feature 310 may be omitted. For example, the molded element 302 may be secured to the housing components 210, 206 via an adhesive or adhesive-like bond, such as in the case where, despite the absence of a macro-scale interlocking feature, the molded element 302 is a polymer that contains an adhesive or otherwise forms a bond with the housing components 210, 206. A separate adhesive may also or alternatively be applied to the housing components 210, 206 and / or the molded element 302 to retain the molded element 302 to the housing components 210, 206.

[0051] Molding element 302 can form a portion of an exterior surface of housing 204. In some cases, molding element 302 can form a continuous or substantially continuous surface with adjacent portions of upper housing component 210 and lower housing component 206. That is, the seam between upper housing component 210 and lower housing component 206 and molding element 302 can lack visually or tactilely perceptible gaps and can generally define a continuous geometry (e.g., without sharp or abrupt cavities, channels, seams, gaps, etc. at the seam).

[0052] As described above, the molding element 302 may be finished together with adjacent portions of the upper housing component 210 and the lower housing component 206, which may include grinding, polishing, machining or other operations. In some cases, the molding element 302 may be formed so that the outer surface is recessed relative to the outer surface of the housing component, and material may be removed from the housing component to form a flush and / or continuous surface through the housing component and the molding element 302. In such cases, the tool used to trim the housing component may not contact (or may only accidentally contact) the molding element, thereby reducing the possibility of the tool damaging the molding element 302. After the material is removed from the housing component, further grinding, polishing or other finishing operations that are unlikely to cause damage to the molding element 302 may still be applied to the molding element 302 and / or the housing components 210, 206.

[0053] In some embodiments, the molding element 302 may not form a waterproof seal between the upper housing component 210 and the lower housing component 206. For example, the molding element 302 can be formed by introducing (e.g., injecting) a flowable polymer material into the gap between the upper housing component 210 and the lower housing component 206. When the polymer cures, it can shrink, effectively pulling the molding element 302 away from intimate contact with the housing components 210, 206 in at least some interface portions. These areas can allow water, liquids, or other contaminants to enter the housing 204 and potentially damage the internal components of the electronic device 200. In the event that the molding element 302 does not reliably create a waterproof seal or provide a secondary or backup seal, the housing 204 may include a sealing member 304 positioned on the interior side of the molding element 302. The sealing member 304 can be configured to intimately contact the interface surfaces 306, 308 of the housing components to form a waterproof seal between the upper housing component 210 and the lower housing component 206. Furthermore, as discussed herein, the molding element 302 and the sealing member 304 may abut one another, which may eliminate or reduce the occurrence of voids or gaps in the joint structure 300 and / or between the joint structure 300 and the housing components 210 , 206 .

[0054] Sealing member 304 may be formed of or include an elastomeric material that provides suitable sealing properties, such as rubber, silicone, etc. Sealing member 304 may be similar to a gasket or O-ring that substantially surrounds housing 204 and seals upper housing component 210 and lower housing component 206 .

[0055] In some cases, sealing member 304 is compressed between housing components 210, 206 in order to maintain intimate contact between sealing member 304 and housing components 210, 206. That is, the distance between housing components 210, 206 can be less than the thickness of sealing member 304 in an uncompressed or "resting" state. Once compressed between housing components, sealing member 304 will attempt to expand to its uncompressed or resting thickness, thereby forcing itself against interface surfaces 306, 308. This interaction can form or contribute to a watertight seal.

[0056] By forming the joint structure 300 by a plurality of parts (e.g., molded element 302 and sealing member 304), the function of the joint structure 300 can be shared between different parts. This can allow the joint structure 300 to be subjected to less design compromises. For example, it can be expected that the joint structure 300 will firmly hold the shell components together, electrically isolate the shell components, form a waterproof seal, form a suitable hard and durable surface, withstand the chemical and mechanical finishing processes (e.g., grinding, polishing, anodizing) that the outer surface of the shell undergoes, and meet aesthetic or decorative requirements (e.g., can be dyed into a desired color or have an attractive visual appearance). In some cases, these design considerations can compete with each other, so that the performance (e.g., sealing) of improving one aspect can reduce the performance (e.g., hardness and durability) of another aspect. By providing a separate sealing element, it is possible to provide a joint structure 300 that is better than the joint structure formed by only a single material or structural element in several aspects. For example, the molded element 302 may be formed from or include a material that is hard, durable, and holds the housing components securely together, while the sealing member 304 may be formed from a softer material that forms a watertight seal, but which may be too soft to be used as an exterior surface of the housing 204.

[0057] In some cases, the molding element 302 can form a watertight seal with adjacent surfaces of the housing components 210, 206. In such cases, the sealing member 304 can be omitted or can be used as a secondary sealing member. The molding element that forms the watertight seal can be formed of or include the following materials: ceramic, epoxy, metal ceramic, or a composite material (including a combination of polymers, ceramics, epoxies, adhesives, etc.).

[0058] Figure 4A-4C For along Figure 2A The partial cross-sectional view of the housing 204 viewed from AA in FIG. 1 shows an example process of forming the joint structure 300. Figure 4A , a sealing member 304 is positioned in a gap 401 between the upper housing component 210 and the lower housing component 206. As shown, the sealing member 304 is placed on the interface surface 308 of the lower housing component 206. In some cases, the sealing member 304 can be placed on the upper housing component 210, or a portion of the sealing member 304 can be placed on each of the housing components. The sealing member 304 is shown as having a circular cross-section, but any shape or size of sealing member can be used.

[0059] The sealing member 304 may be any suitable structure, component or material. For example, the sealing member 304 may be a preformed gasket, an O-ring or other component positioned between the housing components 206, 210 (or a portion thereof positioned between the housing components 206, 210). As another example, the sealing member 304 may be formed by flowing or depositing a deformable material on one of the housing components 206, 210. The deposited deformable material may be cured to form an elastic or deformable structure, or may be suitable for sealing without curing. Suitable deformable materials for the sealing member may include foam, rubber, silicone, wax, polyurethane, neoprene, etc.

[0060] After the sealing member 304 or deformable material is positioned in the gap 401 (or after the sealing member 304 or deformable material is otherwise placed in place, such as on an interface surface of a housing component), Figure 4B A force 400, indicated by an arrow in FIG. 4 , may be applied to one or both of the housing components 206, 210. The force compresses the sealing member 304 or the deformable material in a first portion of the gap 401 proximate the interior volume of the housing 204, thereby forming a seal between the surface of the sealing member 304 and the interface surfaces 306, 308 of the housing components 206, 210. As described above, the seal formed by the sealing member 304 or the deformable material may be a watertight seal. Figure 4A-4B As shown, the sealing member 304 or deformable material changes shape in response to being compressed, but the specific shapes and variations in size, shape, and aspect ratios shown in the figures are for representation and may not correspond to an actual implementation.

[0061] Force 400 can be generated by placing upper housing component 210 and lower housing component 206 in a jig, mold, clamp or other fixture after sealing member 304 is properly positioned. The fixture can maintain housing components 210, 206 in a spaced-apart orientation so that gap 401 is formed and sealing member 304 is compressed between the housing components. Shims, spacers or other components (not shown) can also be positioned in gap 401 or otherwise located between upper housing component 210 and lower housing component 206 to establish and maintain the gap size during further processing. For example, shims, spacers or other components can be positioned in gap 401 before sealing member 304 is compressed in gap 401, and can cooperate with jigs, molds, clamps or other fixtures to define and maintain the size of gap 401. Shims can have any suitable size or shape, such as a continuous shim that extends along the entire gap (but does not necessarily fill the entire gap), or a smaller shim that extends along only a portion of the gap. Furthermore, multiple shims may be used, such as one shim for each linear portion of housing 204, or one shim for each corner of housing 204, or in the case of a circular housing, three shims spaced 120 degrees around the housing. Other shims and shim arrangements are also contemplated.

[0062] The jig, mold, clamp or other fixture may also define a mold surface that substantially covers and / or closes the outer opening of the gap 401 and defines the shape of the outer surface of the mold element 302. Thus, when the joining material is introduced into the gap 401, the joining material may flow against the mold surface, thereby forming the mold element 302 having an outer surface corresponding to the mold surface. More specifically, the mold surface may define a contour or shape that will result in the mold element 302 having an outer surface that is continuous with the adjacent portion of the housing.

[0063] After the sealing member 304 is compressed, the bonding material can be injected, flowed or otherwise introduced into the second portion of the gap 401 (the second portion is near the outer surface of the housing or generally outside the sealing member 304) to form the molded element 302 (such as Figure 4B As shown by arrow 402 in FIG. Figure 4CAs shown, the bonding material may flow into, around and / or against the interlocking feature 310 to form a complementary shape and / or structure in the material. Similarly, the bonding material may flow against and adjacent to the sealing member 304 to form a shape complementary to the sealing member 304. The bonding material may adhere to or otherwise be bonded to the sealing member 304. The close contact between the bonding material and the sealing member 304 may reduce or eliminate the gaps in the joint structure 300 (and in particular the gaps between the molded element 302 and the sealing member 304), thereby producing a more secure or waterproof seal between the housing components 210, 206. In fact, such gaps or gaps may cause liquids to be drawn into the gaps via capillary action, which may increase the possibility of liquids entering the housing 204 or increase the possibility of other damage to the housing 204 and / or the joint structure 300.

[0064] The joining material may also flow against the mold surface to define the exterior surface of the molded element 302, which is also the exterior surface of the housing 204. The joining material is then cured, causing the joining material to solidify or harden and form the molded element 302. In the case where shims or spacers are used to maintain the size of the gap 401, the shims or spacers may be removed after the joining material is cured, as the cured material holds the housing components together and maintains the size of the gap 401.

[0065] Because the bonding material is introduced into the gap 401 and cured while the sealing member 304 is compressed between the housing components, the sealing member 304 can remain in a compressed state after the force is removed. That is, once the bonding material is introduced into the gap and cured to form the molding element 302, the size of the gap 401 is maintained so that the residual compressive force is maintained on the sealing member 304, thereby providing positive contact between the sealing member 304 and the housing components.

[0066] After the molded element 302 is at least partially cured, the housing 204 may be subjected to further finishing or processing steps. For example, the housing 204 may be anodized, chemically treated, plated, cleaned, etc. As another example, the housing 204 may be subjected to machining, grinding, or polishing. Such finishing and processing steps may be applied to the housing components 210, 206 (which may be metal) and the molded element 302 (which may be a polymer). In particular, the grinding, machining, or polishing steps may include traversing the outer surface of the housing 204 with a suitable tool, including traversing along the upper housing component 210, the molded element 302, and the lower housing component 206 in a continuous path. Therefore, the molded element 302 may be formed of a material that can be subjected to the same finishing or processing steps as the housing components. For example, if the housing components 206, 210 are to be ground and polished to obtain a desired surface finish, the molding element 302 may be formed from a material that produces the desired surface finish when subjected to the same grinding and polishing operations as the housing components 206, 210 (e.g., the material does not chip, crack, or melt, and produces a smooth or other desired surface).

[0067] Figure 5A-5D For along Figure 2A FIG. 2 is a partial cross-sectional view of the housing 204 viewed along line AA in FIG. 2 , illustrating another example process of forming the joint structure 300 described above. Figure 5A-5D The process shown in is similar to that described in Figure 4A-4C The process described in the procedure shown in Figures 5A-5D The following process is shown: the upper housing component 210 and the lower housing component 206 are secured to each other by a connecting member to define and / or substantially maintain the size of the gap until the molding element 302 (and / or the sealing member 304) is formed and cured.

[0068] Figure 5A The upper housing component 210 is shown secured to the lower housing component 206 via a connecting member 500. As shown, the connecting member 500 and the upper housing component 210 and the lower housing component 206 are a single, unitary component. In other embodiments (not shown), the connecting member may be a separate piece of material that is bonded to or otherwise attached to the upper housing portion 210 and the lower housing portion 206. The connecting member 500 may extend continuously around the entire inner perimeter of the interior volume of the housing 204 (e.g., completely enclosing the inner opening of the gap 401). Alternatively, the connecting member 500 may be a section of material that does not extend around the entire housing 204. In some cases, multiple connecting members 500 may be distributed at different locations around the perimeter of the interior volume of the housing 204.

[0069] like Figure 5B As shown, the sealing member 304 can be introduced or pressed into the gap 401 while the connecting member 500 maintains the size of the gap. Figure 5A Only a portion of the sealing member 304 is shown in FIG. For example, the sealing member 304 may be an O-ring or otherwise form a continuous collar, and for clarity, the sealing member 304 is omitted. Figure 5A However, in some cases, the sealing member 304 may not form a continuous collar. For example, multiple discrete sealing members 304 may be positioned along the interface between the upper housing component 210 and the lower housing component 206.

[0070] In its relaxed or uncompressed state, the sealing member 304 (or other deformable material) may be higher than the gap 401. Thus, when pressed or forced into the gap 401, the sealing member 304 is compressed between the upper housing component 210 and the lower housing component 206, thereby forming a watertight seal between the sealing member 304 and the interface surfaces 306, 308 of the housing components 210, 206. As described above, the sealing member 304 may be an O-ring, a gasket, or other piece of material (e.g., a deformable material) that can fit into the gap 401. In the case where the gap 401 extends around the perimeter of the housing 204, the sealing member 304 may be a continuous elastomeric gasket that is stretched to fit around the outer edge and then returns to a resting size to pull itself into the gap 401.

[0071] Instead of compressing the larger sealing member 304 into the smaller gap 401, the sealing member 304 may be formed of or include an expandable material, such as a polymer material, that may be introduced into the gap 401 and then expand to form a watertight seal with the interface surfaces 306, 308. For example, a propellant, such as a pressurized gas or a chemical that decomposes to form a gas, may be mixed with or otherwise incorporated into the expandable polymer material. Once the material is introduced into the gap 401, the propellant may cause the material to expand and force the material against the interface surfaces 306, 308.

[0072] After sealing member 304 is introduced into gap 401, housing 204 may be introduced into a mold or other device having a mold surface that covers an opening of gap 401. Material (e.g., a joining material) is then flowed, injected, or otherwise introduced into gap 401 (e.g., Figure 5B The joining material may flow into, around and / or against the interlocking features 310 to form complementary structures in the material, and may also flow against the mold surface to define the exterior surface of the mold element 302. Other aspects of the mold element 302 and the process of forming the mold element 302 are described above and are equally applicable to the following aspects. Figure 5A-5D For example, the molding element 302 can contact and / or abut the sealing member 304 and form a complementary surface against the sealing member 304.

[0073] After the material forming the molding element 302 has cured and the molding element 302 has held the upper housing component 210 and the lower housing component 206 together, the connecting member 500 can be removed. For example, a machining or cutting operation (e.g., laser, plasma, or water jet cutting) can be performed along the Figure 5C The line 504 in the figure is cut to remove the connecting member 500. Because the sealing member 304 and the molding element 302 are electrical insulators, removing the connecting member 500 will electrically decouple the upper housing component 210 and the lower housing component 206. Figure 5D The housing 204 is shown after the joining member 500 has been removed.

[0074] In some cases, it may be useful to electrically couple one housing component to another housing component. For example, an antenna design may require that the housing components be physically separated from each other at certain locations (optionally with a joint structure 300 therebetween) and electrically coupled at other locations. In a housing where the housing components are to be electrically coupled at certain locations, the connecting member 500 (or other connecting member) may not be removed to provide the desired electrical connection between the housing components.

[0075] Figure 6 A joint structure 600 is shown including a first molded element 602 and a sealing member 604 as a second molded element. Joint structure 600 may be an alternative to joint structure 300, but may otherwise perform the same or similar functions as joint structure 300, including mechanically holding housing components together, electrically isolating housing components, and forming a waterproof seal between housing components.

[0076] First molding element 602 is similar to molding element 302 described above. For example, first molding element 602 can be formed from the same materials and using the same techniques (e.g., injecting or flowing a polymer material into gap 401 and against a mold surface that defines an outer edge of molding element 602). First molding element 602 can also have the same or similar structure as molding element 302 and perform the same or similar functions as molding element 302. For example, first molding element 602 can engage interlocking features of upper housing component 210 and lower housing component 206.

[0077] Second molding element 604 can perform the same or similar functions as sealing member 304. For example, second molding element 604 can form a watertight seal between upper housing component 210 and lower housing component 206. Instead of compressing a preformed sealing member or material (e.g., to deform the material and rely on the residual force of the sealing member to form a watertight seal), second molding element 604 can be molded in place in a manner similar to molding element 302.

[0078] Figure 7A-7C For along Figure 2AFIG. 6 is a partial cross-sectional view of the housing 204 viewed along line AA in FIG. 1 , illustrating an example process of forming the joint structure 600 described above. Figure 7A-7C Aspects of the process shown may be similar or identical to Figure 4A-4C and Figure 5A-5D For clarity, these details can be found in Figure 7A-7C , but it should be understood that they are equally applicable to the process.

[0079] exist Fig. 7A , the spacer 700 is positioned between the upper housing component 210 and the lower housing component 206 to support the housing components in a spaced-apart configuration. For example, the spacer 700 can be positioned in a portion of the gap 401 that is adjacent to the interior volume of the housing 204. Thus, the spacer 700 can support the housing components to define the size of the gap 401 and also occupy a portion of the gap 401 that will be later filled by the second molding element 604.

[0080] After the spacer 700 is positioned in the gap 401, the first molding element 602 is formed in a portion of the gap 401 proximate to the exterior surface of the housing 204. For example, a first material (eg, a bonding material) may be flowed, injected, or otherwise introduced into the gap 401 (eg, Fig. 7A 702). The first material may flow into, around and / or against the interlocking features 310 to form complementary shapes and / or structures in the first material, and may also flow against the mold surface to define the exterior surface of the first mold element 602. Aspects of the mold element 302 and the process of forming the mold element 302 are described above with respect to the mold element 302, and are equally applicable to the first mold element 602 and the process of forming the first mold element 602.

[0081] After the first molding element 602 is at least partially cured, the spacer 700 can be removed from the gap 401 to expose a portion of the gap 401 that is proximate to the interior volume of the housing 204 (e.g., the interior portion of the gap 401). The second material can then be flowed, injected, or otherwise introduced into the interior portion of the gap (e.g., Figure 7B The second material is formed by the inner surface of the first molding element 602 (indicated by arrow 704 in the figure), and then cured to form the second molding element 604. The second material flows against the inner surface of the first molding element 602 and is bounded on one side by the inner surface of the first molding element 602. Once cured, the second material can form a waterproof seal between the upper housing component 210 and the lower housing component 206.

[0082] Similar to Figure 3-5D As shown in the molding element 302 and the sealing member 304, the first molding element 602 and the second molding element 604 can be adjacent to each other in the gap 401. In particular, when the second material is introduced into the inner portion of the gap ( Figure 7B), the material flows against and conforms to the surface of the first mold element 602. Thus, the second mold element 604 forms a complementary surface adjacent to the first mold element 604, thereby reducing or eliminating voids, cavities, or gaps in the joint structure 600.

[0083] The first molded element 602 and the second molded element 604 can be designed to provide different functions to the housing 204 and can therefore be formed of different materials. For example, the first molded element 602 can be configured to rigidly hold the upper housing component 210 and the lower housing component 206 together while being hard and durable enough to serve as the external surface of the device. On the other hand, the second molded element 604 can be configured to form a waterproof seal between the housing components, and its structural rigidity and impact toughness can be less important. In some cases, the first material is substantially not bonded to the interface surface of the housing components 210, 206, and thus can allow liquids or other contaminants to pass between the first molded element 602 and the interface surface. In such cases, the second molded element 604 (e.g., a sealing member) can be formed of an epoxy, an adhesive, a bonding agent, or other material that forms a waterproof bond with the interface surface.

[0084] Figure 8A-8D For along Figure 2A A partial cross-sectional view of the housing 204 viewed along line AA in FIG. 1 shows another exemplary process for forming the joint structure 600 described above. Figure 7A-7C The process shown in FIG. 4 uses spacers 700 to occupy the portion of gap 401 that is ultimately occupied by sealing member 604, but Figure 8A-8D The process shown in 404 includes filling the portion of the gap 401 with material of the first molding element 602 and then removing some of the material to form a space for the sealing member 604 .

[0085] For example, Fig. 8A As shown, the upper housing component 210 and the lower housing component 206 can be positioned relative to each other to define a gap 401. As described above, this can include placing the housing components 210, 206 in a mold, jig or other fixture. Alternatively or in addition, the upper housing component 210 and the lower housing component 206 can be connected by a connecting member, such as the connecting member 500 ( Figure 5A ) are joined. A first material (e.g., a joining material) may then be flowed, injected, or otherwise introduced into gap 401 (as indicated by arrow 800), which may include flowing the first material against interlocking features 310, as described above. The first material may substantially fill gap 401, or may otherwise occupy a greater portion of gap 401 than is required or desired for the final dimensions of first molded element 602. The first material is then cured or hardened.

[0086] Once the first material is at least partially cured or hardened, at least a portion of the hardened material is removed from the interior portion of the gap 401 to form the final interior size and / or shape of the first molding element 602. The first material may be removed by any suitable method. Figure 8B As shown, a cutting or grinding tool 802 may be used to remove a portion of the first material proximate the interior volume of the housing 204, thereby forming a space in the gap 401 for a second molding element 604 or other sealing member to be positioned or formed. Other techniques including chemical etching, laser cutting, water jet cutting, etc. may be used instead of or in addition to grinding or machining.

[0087] After the first material is removed from the interior portion of gap 401, a second material (eg, a sealing material) is flowed, injected, or otherwise introduced into the now empty interior portion of the gap (eg, Figure 8C The second material flows against the inner surface of the first molding element 602 and is bounded on one side by the inner surface of the first molding element 602. Once cured, the second material can form a waterproof seal between the upper housing component 210 and the lower housing component 206.

[0088] Although in Figure 6-Figure 8D 204. Although not shown in the drawings, the housing components 210, 206 may include additional interlocking features that engage the second molded element 604. Such interlocking features may be the same or similar to the interlocking features 310 described above. In addition, such interlocking features may be shaped or otherwise configured to help prevent water or other liquids from entering the interior volume of the housing 204. For example, the interlocking features may include grooves, ridges, racks, serrated channels, etc.

[0089] Fig. 9 1 is a partial cross-sectional view of a housing 900 that can be used for electronic device 100 or 200. Housing 900 can be similar to housing 204 described above and can provide similar functionality. For example, one or more components of housing 900 can be part of the circuitry of the electronic device. More specifically, one or more components of housing 900 can be an antenna or a part of an antenna that forms a wireless communication circuit. Figure 9-10D The cross-sectional view in FIG. 1 may correspond to the housing 900 along a plane similar to Figure 2A Line AA in the line view.

[0090] The housing 900 includes an upper housing component 902 and a lower housing component 904. The lower housing component 904 can be connected to the lower housing component 206 ( Figure 2A-Figure 8D The upper housing member 902 may have the same structure as the upper housing member 210 and the joint structure 208 ( Figure 2A) but may have a different mechanical structure. In particular, instead of separate housing components and joint structures as described in the previous examples, the upper housing component 902 includes a structural member 906 and a coating 908 on at least a portion of the structural member 906. The structural member 906 may be a polymer or other non-conductive material, and the coating 908 may be a metal or a conductive material.

[0091] Upper housing member 902 can be configured to support a cover, such as cover 202 ( FIG. 2 ), and to form a watertight seal between upper housing member 902 and cover 202. For example, upper housing member 902 can define a surface 910 that supports cover 202 (or another component). Surface 910 can be a portion of coating 908 (e.g., Fig. 9 ), or it may be part of the structural member 906. For example, the coating 908 may be omitted to define Fig. 9 A portion of surface 910 is exposed and structural member 906 may be exposed instead.

[0092] When the cover is coupled to the surface 910, a waterproof seal can be formed between the cover and the surface 910. For example, a gasket, adhesive, or other sealing material can attach the cover to the surface 910 and seal the interface between the cover and the surface 910.

[0093] like Fig. 9 As shown, a portion of structural member 906 forms a portion of the exterior surface of housing 900, as does coating 908. In some cases, a portion of each of coating 908, structural member 906, and lower housing component 904 forms a substantially continuous surface. For example, the seams between structural member 906 and coating 908 and between structural member 906 and lower housing component 904 can lack gaps, grooves, or other surface discontinuities or irregularities, such that the exterior surface of housing 900 is a continuous and / or smooth surface.

[0094] In some cases, both lower housing component 904 and coating 908 may be formed of or include a conductive material, such as metal, aluminum, stainless steel, etc. Structural member 906 may be formed of a non-conductive material, such as a polymer, ceramic, etc. The non-conductive material of structural member 906 electrically isolates conductive coating 908 from conductive lower housing component 904. This may allow coating 908 and / or lower housing component 904 to be used in circuits of an electronic device, as described above. For example, by electrically isolating conductive coating 908 from conductive lower housing component 904, conductive coating 908 can be used as an antenna for wireless communications or radio circuits. In addition, because coating 908 is electrically isolated from lower housing component 904, it may be easier to optimize the size, shape, material, or other properties of coating 908 for use as an antenna without having to consider the effects of the rest of the housing on antenna performance.

[0095] Structural member 906 may be coupled to lower housing component 904 using an adhesive or other bonding agent that forms a watertight seal between structural member 906 and lower housing component 904. For example, epoxy, cyanoacrylate, heat sensitive adhesive (HAS), pressure sensitive adhesive (PSA), etc. may be used to form a watertight seal.

[0096] Figures 10A-10D is a partial cross-sectional view of housing 900 (or a portion thereof) illustrating an example process for forming housing 900 . Fig. 10A Structural member 906 is shown. Structural member 906 may be formed by molding (eg, injection molding) a polymer material, such as a polymer that is an electrical insulator.

[0097] like Fig. 10B As shown, at least a portion of the structural member 906 may then be coated with a conductive material 1000. The conductive material 1000 may be coated on portions of the structural member 906 that ultimately form the exterior surface of the housing 900 and / or an electrical device using the housing 900. In some cases, the conductive material 1000 may have or may include the same material as the lower housing component 904. For example, both the conductive material 1000 and the lower housing component 904 may have or include aluminum, stainless steel, copper, etc. In some cases, the conductive material 1000 and the lower housing component 904 are different materials with similar visual and / or tactile properties (e.g., surface finish, color, and texture). In other cases, the conductive material 1000 is different from the material of the lower housing component 904 in these or other aspects.

[0098] Conductive material 1000 may be coated, deposited, or otherwise applied to structural member 906 in any suitable manner. For example, conductive material 1000 may be applied to structural member 906 by chemical vapor deposition, physical vapor deposition, printing (e.g., inkjet printing with metallic ink), plating (e.g., electroplating, electroless plating), laser direct structuring, etc. In the case of using laser direct structuring, structural member 906 may be formed of a material doped with a metal-plastic additive. A laser beam is then directed onto the portion of structural member 906 where conductive layer 908 is to be formed, thereby forming a metal or metallized surface on structural member 906. The metal or metallized surface may then be further metallized using a plating technique such as electroplating or electroless plating to build conductive layer 908 to a desired thickness.

[0099] The upper housing component 902 may be coupled to the lower housing component 904. For example, an adhesive or bonding agent may be applied to one or both of the upper housing component 902 and the lower housing component 904, and the housing components may contact each other. The adhesive or bonding agent may be selected so that the joint between the upper housing component 902 and the lower housing component 904 is waterproof. Example adhesives include epoxies, cyanoacrylates, heat sensitive adhesives (HAS), pressure sensitive adhesives (PSA), etc., which can be used to form a waterproof seal. In order to securely bond the lower housing component 904 to the structural member 906, a force may be applied to the structural member 906 and / or the lower housing component 904 after the adhesive is applied, such as with a clamp, a vacuum bag, or other device. The upper housing component 902 and the lower housing component 904 may be coupled together before or after the conductive layer 908 is formed on the structural member 906.

[0100] The coating of conductive material 1000 formed on structural member 906 may be thicker than the desired final thickness of conductive layer 908. In such cases, some conductive material 1000 may be removed by further processing or trimming operations to achieve the desired thickness. Fig. 10C As shown, tool 1002 may be used to grind or otherwise remove excess conductive material. The machining operation may remove all of conductive material 1000 in a certain position to expose structural member 906 below. For example, structural member 906 may define a protruding feature 1004 that is flush with adjacent portions of lower housing component 904 and conductive layer 908 when conductive material 1000 is removed from structural member 906. When the trimming operation is complete, protruding feature 1004 may visually appear as a joint structure between the upper metal portion and the lower metal portion, even though the upper metal portion is a coating on structural member 906, as shown. Fig. 10D shown.

[0101] Tool 1002 may be used to jointly finish lower housing component 904 and upper housing component 902. In particular, the same machining operation may be used along at least a portion of lower housing component 904, conductive coating 908, and structural member 906 to produce a substantially uniform texture and / or appearance on the various different components and materials defining the exterior surface of housing 900. Fig. 10C As shown, the co-finishing operation may include moving the rotating machining tool 1002 along a path 1006 (as indicated by arrow 1008 ), which will bring the tool into contact with the lower housing component 904 , the conductive coating 908 , and the structural member 906 .

[0102] Figure 11A-11CA process for forming a housing including conductive housing components electrically isolated from each other by a joint structure is shown. In particular, the process includes forming a housing blank including materials to be formed into the housing in a pre-assembled configuration. More particularly, with reference to Figure 11A-11B The housing blank can be formed by combining the first conductive component 1100, the non-conductive component 1102 and the second conductive component 1104 together to form the housing blank 1106. The first conductive component 1100 and the second conductive component 1104 can be formed of or include any suitable conductive material, such as aluminum, steel, etc. The housing 1108 ( Fig. 11C ) can be formed of or include any suitable non-conductive material, such as nylon, polyetheretherketone, polysulfone, polyphenylsulfone, polyaryletherketone, polyetherimide, polyethersulfone, or any other suitable material.

[0103] The first conductive component 1100 and the second conductive component 1104 may be bonded to the non-conductive component 1102 in any suitable manner. For example, an adhesive or other bonding agent may be applied to the components that are then laminated to form the housing blank 1106. In order to securely bond the conductive and non-conductive components, a force may be applied to the components after the adhesive is applied, such as with a clamp, a vacuum bag, or other device. Alternatively, the first conductive component 1100 and the second conductive component 1104 may be maintained in a spaced-apart configuration, and the material may be flowed, injected, or otherwise introduced between the conductive components 1100, 1104. The material may then be cured to form the non-conductive component 1102 and bonded to the conductive components 1100, 1104. Other potential techniques for bonding the first conductive component 1100 and the second conductive component 1104 to the non-conductive component 1102 include diffusion bonding, ultrasonic welding, torsional welding, linear ultrasonic welding, insert molding, and friction welding.

[0104] The bond between the conductive components 1100, 1104 and the non-conductive component 1102 may be waterproof. Fig. 11C ) is formed from the housing blank 1106, and the housing 1108 itself can be waterproof at least along the seams or interfaces between the conductive components 1100, 1104 and the non-conductive component 1102.

[0105] After the shell blank 1106 is formed, material is removed from the shell blank 1106 to form the shell 1108 ( Fig. 11C ), the housing 1108 having an exterior surface and an interior volume for receiving electronic components such as a battery, a processor, etc. Removing material may include machining the housing blank 1106 with a tool 1107, or any other suitable process or operation such as laser ablation, plasma cutting, grinding, etc. For example, Fig. 11BAs shown, a tool 1107, such as an end mill, can be rotated as indicated by arrow 1110 and moved along path 1112 to at least partially define the interior volume. Other machining or material removal operations can also be used to form other aspects of the housing 1108, such as angled interior corners and rounded exterior surfaces of the interior volume.

[0106] The housing blank 1106 is configured such that after material is removed to form the housing 1108, the remaining portion of the non-conductive component 1102 electrically isolates the remaining portion of the first conductive component 1100 and the second conductive component 1104 from each other. For example, the electrical isolation of the conductive components 1100, 1104 can be used in which the portion of the conductive components 1100, 1104 remaining after the machining operation acts as an antenna or other component of the circuit, as described above. In addition, similar to the housing described above, at least a portion of the first conductive component 1100 and the second conductive component 1104 and at least a portion of the non-conductive component 1102 can define the exterior surface of the housing 1108 after the housing blank 1106 is machined to form the housing 1108.

[0107] Figure 11A-11C An example housing blank 1106 and a housing 1108 that can be formed from the housing blank 1106 are shown. Where other housing geometries are desired, such as different arrangements of housing components and joint structures, housing blanks with different structures can be used. For example, Figure 12A-12C A process for forming a shell is shown, which is similar to that described with respect to Figure 11A-11C The process described above differs in that the housing blank 1208 ( Fig. 12B ) and the resulting housing 1210 ( Fig. 12C ) have different structures. In particular, Fig. 12C As shown, housing 1210 includes conductive housing components 1212. Each conductive housing component is electrically isolated from other conductive housing components by a connector structure 1214 and can be used as an antenna or other component of a circuit. In order to form housing 1210, in which the conductive components have the desired shape, size and position, housing blank 1208 is configured to have a corresponding structure.

[0108] Reference Fig. 12A , the housing blank 1208 can be formed by joining the conductive components 1200, 1202, and 1206 to the non-conductive component 1204. The non-conductive component can have a protrusion, beam, arm or other feature extending between the conductive components 1200, 1202, 1206 to ensure electrical isolation between these components. As shown, beams 1216 extend from the base of the non-conductive component 1204, and each beam is positioned between two conductive components. These features can cause the joint structure to be positioned at a desired location between the housing components in the final housing 1210.

[0109] like Fig. 12B As shown, housing blank 1208 may be machined or otherwise have material removed (e.g., using tool 1211 or any other suitable material removal operation) to form the interior volume and exterior surface of housing 1208, such as Fig. 12C For example, Fig. 12B As shown, a tool 1211, such as an end mill, can be rotated as indicated by arrow 1218 and moved along path 1220 to at least partially define the interior volume. Other machining or material removal operations can also be used to form other aspects of the housing 1210, such as angled interior corners and rounded exterior surfaces of the interior volume.

[0110] The molded elements described herein can be formed by molding (including, for example, injecting) a material into a gap between housing components. However, the molded elements or portions thereof can also be formed in other ways and are not necessarily limited to any particular manufacturing or forming process. For example, one or more molded elements can be formed separately from other housing components (using any suitable process, such as extrusion, machining, etc.) and positioned in the gap after the molded elements are formed.

[0111] In the above description, for the purpose of explanation, the specific naming used provides a thorough understanding of the embodiment. However, it will be apparent to those skilled in the art that these specific details are not required for practicing the embodiment. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiment described herein is presented. They are not intended to be exhaustive or to limit the embodiment to the disclosed precise form. It will be apparent to those of ordinary skill in the art that, according to the above teachings, many modifications and variations are possible. For example, although the method or process disclosed herein has been described and shown with reference to the specific operations performed in a particular order, these operations can be combined, subdivided, or reordered to form equivalent methods or processes without departing from the teachings of the present disclosure. In addition, the structure, features, components, materials, steps, processes, etc. described herein with respect to an embodiment can be omitted from the embodiment or incorporated into other embodiments.

Claims

1. An electronic device, comprising: monitor; a cover over the display; Wireless communication systems; as well as A housing, the housing comprising: an electrically conductive upper housing member defining a frame, the frame defining: an opening at least partially receiving the cover therein; and a first portion of a side surface of the electronic device, the conductive upper housing member conductively coupled to the wireless communication system and configured to function as an antenna or a portion of an antenna for the electronic device; A conductive lower housing member, the conductive lower housing member defining: a second portion of the side surface of the electronic device; and at least a portion of a rear surface of the electronic device; and a non-conductive joint structure located between the conductive upper housing member and the conductive lower housing member and comprising: a first material having a first hardness and defining a third portion of the side surface of the electronic device; and A second material having a second hardness less than the first hardness, the second material being bonded to an inner surface of the first material.

2. The electronic device according to claim 1, wherein: the conductive upper housing member defining a first interlock feature; the conductive lower housing member defining a second interlock feature; and The non-conductive joint structure includes a molded element, the molded element defining: a first complementary interlocking feature engaging with the first interlocking feature; and A second complementary interlocking feature engages with the second interlocking feature.

3. The electronic device according to claim 2, wherein: Engagement between the first interlocking feature and the first complementary interlocking feature and between the second interlocking feature and the second complementary interlocking feature secures the conductive upper housing member to the conductive lower housing member.

4. The electronic device according to claim 1, wherein: The non-conductive connector structure facilitates wireless signals to enter the housing.

5. The electronic device according to claim 1, wherein: The second material forms a waterproof seal between the conductive upper housing member and the conductive lower housing member.

6. The electronic device according to claim 1, wherein: The conductive lower housing member defines a slot configured to receive an end of a watch band to couple the watch band to the housing.

7. The electronic device of claim 1, the housing further comprising a conductive connecting member conductively coupling the conductive upper housing member to the conductive lower housing member.

8. The electronic device according to claim 1, wherein: The non-conductive tab structure is adhesively bonded to the conductive upper housing member and the conductive lower housing member.

9. An electronic device, comprising: monitor; a cover over the display; as well as A housing, the housing comprising: A front housing member, the front housing member defining a support frame for supporting the cover body and the display screen, the support frame defining: at least a first portion of a side surface of the electronic device; A rear housing member, the rear housing member defining: at least a second portion of the side surface of the electronic device; and a portion of a rear surface of the electronic device; and a non-conductive joint structure, the non-conductive joint structure being located between the front shell member and the rear shell member and being coupled to the front shell member and the rear shell member, the non-conductive joint structure comprising: a first material defining at least a third portion of the side surface of the electronic device; and a second material defining a portion of an interior surface of the electronic device, the second material being softer than the first material and bonded to the interior surface of the first material; and A wireless communication system is conductively coupled to at least one of the front housing member and the rear housing member.

10. The electronic device according to claim 9, wherein: The at least one of the front housing member and the rear housing member is configured to function as an antenna or a portion of an antenna for the wireless communication system.

11. The electronic device according to claim 9, wherein: The front casing member and the rear casing member are formed of metal.

12. The electronic device according to claim 9, wherein: The front housing member is conductively coupled to the rear housing member.

13. The electronic device according to claim 9, wherein: The front housing member is a first portion of a unitary metal structure; and The rear housing member is a second portion of the unitary metal structure.

14. The electronic device according to claim 9, wherein: said front housing member defining a first interlocking feature; the rear housing member defining a second interlocking feature; and The first material defines: a first complementary interlocking feature engaging with the first interlocking feature; and A second complementary interlocking feature engages with the second interlocking feature.

15. An electronic watch comprising: monitor; a cover over the display; as well as A housing, the housing comprising: A front housing member comprising a metal material and defining: at least a first portion of a side surface of the electronic watch; and a frame extending around the periphery of the cover, the front housing member being configured to function as an antenna or a portion of an antenna for a wireless communication system of the electronic watch; A rear housing member comprising a metal material and defining: at least a second portion of the side surface of the electronic watch; and a rear surface of the electronic watch; a joint structure positioned between the front housing member and the rear housing member, the joint structure extending along the periphery of the housing and comprising: a first molded polymer material defining at least a third portion of the side surface of the electronic watch; and a second molded polymer material bonded to an inner surface of the first molded polymer material and forming a waterproof seal against inner surfaces of the front and rear housing members; A strap is coupled to the rear housing member and is configured to secure the electronic timepiece to a user.

16. An electronic watch according to claim 15, wherein: The rear housing member defines a slot; and The ends of the strap are positioned in the slots and retained to the rear housing member.

17. The electronic watch according to claim 15, wherein: The joint structure is adhesively bonded to the front housing member and the rear housing member.

18. An electronic watch according to claim 17, wherein: The front housing member defines a recess; and The joint structure extends into the groove to retain the front housing member to the joint structure.

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