Power unit assembly

Abstract

The application discloses a power unit assembly. The power unit assembly comprises a power unit, which comprises a power structure with a plurality of pins and a plurality of busbars arranged in layers, at least one pin is connected with a busbar which is penetrated by the pin in a manner that the pin only penetrates one layer of the busbar, and the at least one pin is staggered with and electrically insulated from other busbars. According to the power unit assembly, the number of holes in other busbars can be reduced, the manufacturing process of the busbars is simplified, and the electrical insulation between the pin and other busbars is ensured.

Description

Technical Field

[0001] This invention relates to the field of frequency converter technology, and more specifically, to a power unit assembly. Background Technology

[0002] In existing frequency converters, the power structure is mounted on a substrate and is suitable for connection to the drive circuit board and multi-layer busbars. The pins of the power structure simultaneously pass through multiple positive and negative busbars, and the simultaneous connection of pins to multiple busbars easily leads to short circuits between adjacent busbars, affecting the normal operation of the frequency converter. Furthermore, in existing frequency converter power unit components, the pins of the power structure pass through multiple busbars via vias, making traditional soldering processes (such as wave soldering) unsuitable. This is because the vias are inside the metal busbars, providing a large heat dissipation area. Using traditional soldering processes, heat is rapidly lost at the solder joints due to the large busbar area, making it difficult to reach the required soldering temperature. Therefore, only spot welding techniques such as electron beam welding and laser welding can be used to concentrate the welding energy within a very small area to achieve the welding purpose. This process is extremely complex. Summary of the Invention

[0003] The present invention aims to at least partially solve one of the aforementioned technical problems in the prior art. To this end, the present invention proposes a power unit assembly that avoids electrical connections between pins and other busbars.

[0004] According to an embodiment of the present invention, a power unit assembly includes: a power unit, the power unit including: a power structure having a plurality of pins; a plurality of stacked busbars, at least one of the pins being connected to the busbar through which only one layer of the busbar is passed, and the at least one pin being offset from and electrically insulated from the other busbars.

[0005] According to the power unit assembly of the present invention, the pin is connected to the busbar through which it is passed by only one layer of busbar, and the pin is staggered from other busbars. This reduces the number of holes on other busbars, simplifies the busbar manufacturing process, and helps to ensure good electrical insulation performance between the pin and other busbars.

[0006] According to some embodiments of the present invention, the busbar has a busbar connection portion, at least one pin of the power unit is connected to the busbar through only one layer of the busbar connection portion, and the busbar connection portion is constructed as a sheet.

[0007] Optionally, the busbar and the corresponding busbar connection portion are on the same plane.

[0008] Optionally, the busbar and the corresponding connecting portion of the busbar are formed by a punching process.

[0009] According to some embodiments of the present invention, the busbar connecting portion protrudes from at least one side edge corresponding to the busbar and the busbar connecting portion is directly connected to the corresponding busbar.

[0010] According to some embodiments of the present invention, the busbar connection portion is provided with a busbar connection portion through hole that allows the pin to pass through.

[0011] According to some embodiments of the present invention, in the two busbar connection portions corresponding to two adjacent pins, the busbar connection portion through hole on one of the busbar connection portions is located outside the outline of the other busbar connection portion.

[0012] According to some embodiments of the present invention, two of the pins in the same power structure are respectively connected to the busbar connection portions of the corresponding two busbars, and each pin is only connected to the corresponding busbar connection portion.

[0013] Furthermore, either of the two pins is connected to the corresponding busbar connection portion and is adjacent to or spaced apart from the other busbar connection portion.

[0014] According to some embodiments of the present invention, either of the two pins is connected to the corresponding busbar connection portion, wherein the busbar connection portion through hole on one of the busbar connection portions is located outside the outline of the other busbar connection portion.

[0015] According to some embodiments of the present invention, the remaining pin in the same power structure is adapted to be connected to the drive circuit board, and the remaining pin is directly connected to the drive circuit board without the busbar connection portion obstructing it.

[0016] According to some embodiments of the present invention, the same power structure has a first pin, a second pin, and a third pin, the third pin being located between the first pin and the second pin, the third pin being located outside the first pin and the second pin relative to the power structure, and the gap between the first pin and the second pin allowing a busbar connector to be inserted and pass through the third pin.

[0017] Furthermore, the busbar connection portion through the first pin and the busbar connection portion through the third pin are partially stacked or staggered in the stacking direction of the plurality of busbars, and the second pin is adapted to be directly connected to the drive circuit board.

[0018] According to some embodiments of the present invention, the busbar includes: a first busbar, a second busbar, and a third busbar; the busbar connecting portion includes: a first busbar connecting portion connected to the first busbar, a second busbar connecting portion connected to the second busbar, and a third busbar connecting portion connected to the third busbar, wherein the first busbar connecting portion is located on one side of the first busbar, the second busbar connecting portion is located on the other side of the second busbar opposite to the first busbar connecting portion, and the third busbar connecting portion is located on both sides of the third busbar.

[0019] Specifically, one of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

[0020] Furthermore, the power unit assembly also includes a busbar clamp for clamping the first busbar and the second busbar.

[0021] According to some embodiments of the present invention, each of the first busbar, the second busbar and the third busbar is rectangular in shape and is stacked in the thickness direction of the busbar, and the busbar connecting portion is formed on the longitudinal long side corresponding to the busbar.

[0022] According to some embodiments of the present invention, the power structure includes: a first power structure and a second power structure, wherein the pins of the first power structure and the pins of the second power structure are respectively located on opposite sides of the first power structure and the second power structure, the pins of the first power structure are on the same first side as the first busbar connection portion and the third busbar connection portion located on the first side of the third busbar, and the pins of the second power structure are on the same second side as the second busbar connection portion and the third busbar connection portion located on the second side of the third busbar.

[0023] According to some embodiments of the present invention, a first busbar is provided at one end of the first busbar, a second busbar is provided at one end of the second busbar, the first busbar and the second busbar are located at the same end and are arranged side by side, and a third busbar is provided at the other end of the third busbar opposite to the first busbar.

[0024] According to some embodiments of the present invention, the first busbar, the second busbar and the third busbar are all flat busbars.

[0025] According to some embodiments of the present invention, the busbar connection portion is provided with a through groove that allows the pin to pass through, the through groove extending away from the busbar and penetrating the outer edge of the busbar connection portion away from the busbar.

[0026] According to some embodiments of the present invention, the entire surface of the busbar is covered with an insulating film.

[0027] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] Figure 1 This is a three-dimensional assembly diagram of the power unit when the retaining structure includes the second retaining structure;

[0029] Figure 2 This is an assembly side view of the power unit when the retaining structure includes the second retaining structure;

[0030] Figure 3 This is a three-dimensional exploded view of the power unit when the retaining structure includes the second retaining structure;

[0031] Figure 4 This is an exploded side view of the power unit when the retaining structure includes the second retaining structure;

[0032] Figure 5 This is a three-dimensional assembly diagram of a power unit when a protrusion is provided on the substrate and the holding structure includes a second holding structure.

[0033] Figure 6 This is a three-dimensional exploded view of a power unit when the substrate has a groove and the holding structure includes a second holding structure.

[0034] Figure 7 This is a three-dimensional assembly diagram of a power unit when a groove is provided on the substrate and the holding structure includes a second holding structure.

[0035] Figure 8 This is an assembly side view of the power unit when the substrate has a groove and the holding structure includes a second holding structure;

[0036] Figure 9 This is a three-dimensional schematic diagram of the tablet compression structure;

[0037] Figure 10 This is a three-dimensional assembly diagram of the power unit when the retaining structure includes the third retaining structure;

[0038] Figure 11 This is an assembly side view of the power unit when the retaining structure includes the third retaining structure;

[0039] Figure 12 This is a three-dimensional assembly diagram of a power unit with a positioning plate when the retaining structure includes a fourth retaining structure;

[0040] Figure 13This is an assembly side view of the power unit with positioning pieces when the retaining structure includes the fourth retaining structure;

[0041] Figure 14 This is a three-dimensional assembly diagram of a power unit without a positioning piece when the retaining structure includes a fourth retaining structure.

[0042] Figure 15 This is an assembly side view of a power unit without a positioning piece when the retaining structure includes a fourth retaining structure;

[0043] Figure 16 This is a three-dimensional exploded view of the power unit component;

[0044] Figure 17 This is a three-dimensional assembly diagram of the power unit components;

[0045] Figure 18 This is an assembled side view of the power unit assembly;

[0046] Figure 19 This is a schematic diagram showing the connection between the power structure and the three-layer busbar;

[0047] Figure 20 This is a three-dimensional exploded view of the power unit and the second and third busbars;

[0048] Figure 21 This is a three-dimensional assembly diagram of the power unit with the second busbar and the third busbar;

[0049] Figure 22 This is a three-dimensional exploded view of the power unit and the third busbar;

[0050] Figure 23 This is a three-dimensional assembly diagram of the power unit and the third busbar;

[0051] Figure 24 This is a three-dimensional exploded view of the power unit components and the driver circuit board;

[0052] Figure 25 This is a three-dimensional assembly diagram of the power unit components and the drive circuit board;

[0053] Figure 26 This is a side view of the power unit assembly and the drive circuit board.

[0054] Figure label:

[0055] Power module 10000, power unit assembly 1000, power unit 100, substrate 10, protrusion 11, groove 12, pressing structure 20, pressing body 21, pressing body positioning hole 211, pressing arm 22, first pressing arm 221, second pressing arm 222, pressing connection 23, bending section 24, power structure 30, first power structure 31, first connecting foot 311, second power structure 32, second connecting foot 321, first pin 331, second pin 332, third pin 333, holding structure 45, first holding structure 40, second holding structure 50, positioning piece 60, positioning port 61, annular positioning rib 62, positioning piece through hole 63 60' heat insulation structure, 70 third retaining structure, 71 small diameter end, 72 large diameter end, 80 fourth retaining structure, 81 fastener, 201 first busbar, 2011 first busbar connecting part, 2012 first busbar adapter plate, 2013 first busbar body, 2014 first busbar connecting part through hole, 202 second busbar, 2021 second busbar connecting part, 2022 second busbar adapter plate, 2023 second busbar body, 2024 second busbar connecting part through hole, 203 third busbar, 2031 first busbar connecting part, 2032 third busbar adapter plate, 2033 third busbar body, 2034 third busbar connecting part through hole, 2000 drive circuit board. Detailed Implementation

[0056] Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.

[0057] In the description of this invention, it should be understood that the terms "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0058] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0059] Reference Figures 24-26 As shown, the power module 10000 may include a power unit assembly 1000 and a drive circuit board 2000, wherein, optionally, the drive circuit board 2000 is located above the power unit assembly 1000. The following description, in conjunction with... Figures 1-26 A power unit assembly 1000 according to an embodiment of the present invention will be described in detail.

[0060] Reference Figures 16-26 As shown, the power unit assembly 1000 according to an embodiment of the present invention may include: a power unit 100 and a plurality of stacked busbars.

[0061] The power unit 100 may include: a substrate 10, a pressing structure 20, a power structure 30, and a first side of the substrate 10 (i.e., Figure 2 The upper side of the substrate 10 has a first side surface, the pressing structure 20 is located on the first side of the substrate 10, and the power structure 30 is pressed against the first side surface of the substrate 10 by the pressing structure 20.

[0062] By using the pressing structure 20 to press the power structure 30 against the first side of the substrate 10, it can be ensured that the power structure 30 is firmly and reliably installed on the substrate 10.

[0063] Reference Figures 1-9 As shown, the power unit 100 further includes a holding structure 45, which includes a first holding structure 40. The first holding structure 40 extends from the substrate 10 in a direction away from the first side, and the first holding structure 40 passes through the pressure plate structure 20, so that the pressure plate structure 20 is held on the first side of the substrate 10. Furthermore, the pressure plate structure 20 presses against the power structure 30, thus holding the power structure 30 on the first side of the substrate 10. In other words, referring to... Figure 2 , Figure 8 As shown, the first holding structure 40 passes through the pressing structure 20 from bottom to top. The pressing structure 20 is held on the first side of the substrate 10 by the first holding structure 40. That is, when the first holding structure 40 passes through the pressing structure 20, the relative position of the pressing structure 20 and the substrate 10 is determined. The first holding structure 40 can play the role of positioning the pressing structure 20.

[0064] In some embodiments not shown, the pressing structure 20 may also be directly fixed, for example, welded to the substrate 10, thus eliminating the retaining structure 45. This helps to reduce the number of connecting parts and thereby reduce the weight of the power unit 100.

[0065] Furthermore, referring to Figures 1-8 As shown, the retaining structure 45 further includes a second retaining structure 50, which is adapted to and connected to the first retaining structure 40, thereby retaining the pressing structure 20 on a first side of the substrate 10. The second retaining structure 50 is connected to the first retaining structure 40 on the side of the pressing structure 20 facing away from the substrate 10. Figure 2 As shown, the second retaining structure 50 is connected to the first retaining structure 40 on the upper side of the pressing structure 20. The upper side of the pressing structure 20 has a spacious area, providing operating space for the installation and removal of the second retaining structure 50. The pressing structure 20 is clamped between the second retaining structure 50 and the substrate 10, while the power structure 30 is clamped between the pressing structure 20 and the substrate 10.

[0066] In the description of this invention, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Furthermore, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0067] exist Figures 1-8 In the embodiment shown, the first retaining structure 40 is constructed as a columnar structure, and the second retaining structure 50 is constructed as a ring structure with the columnar structure sleeved on it. The pressing structure 20 is sandwiched between the second retaining structure 50 and the substrate 10 to prevent the pressing structure 20 from detaching from the substrate 10.

[0068] Specifically, the first retaining structure 40 is perpendicular to the first side of the substrate 10 and has a free end away from the substrate 10. The second retaining structure 50 is screwed onto the first retaining structure 40 from the side of the pressing structure 20 away from the substrate 10, which facilitates quick connection or disassembly between the second retaining structure 50 and the first retaining structure 40.

[0069] In some alternative embodiments, the first retaining structure 40 is configured as a screw with external threads, and the second retaining structure 50 is configured as a nut with internal threads, which is screwed into the screw to facilitate the installation and removal of the pressure plate structure 20.

[0070] Reference Figures 1-8As shown, the second retaining structure 50 presses against the side of the pressing structure 20 away from the substrate 10. The second retaining structure 50 can apply a pressing force towards the substrate 10 to the pressing structure 20 to prevent the pressing structure 20 from shaking and make the connection between the pressing structure 20 and the substrate 10 more reliable.

[0071] Reference Figures 1-9 As shown, the tablet compression structure 20 includes: a tablet compression body 21, which is formed as a recessed groove structure facing the first side, and the opening of the tablet compression body 21 faces away from the first side. (Refer to...) Figure 2 , Figure 4 As shown, the tablet body 21 is formed as a downwardly recessed groove structure, with the opening of the tablet body 21 facing upward.

[0072] Furthermore, at least a portion of the second retaining structure 50 is located within the recessed groove of the pressing body 21, and the end face of the first retaining structure 40 away from the substrate 10 (i.e., the upper end face of the first retaining structure 40) is also located within the recessed groove. This shortens the distance between the end face of the first retaining structure 40 away from the substrate 10 and the substrate 10, while also shortening the distance between the second retaining structure 50 and the substrate 10. In this way, the retaining structure 45 is located within the recessed groove of the pressing body 21 as much as possible, which can reduce the size of the power unit 100 in the height direction and create a larger usable space above the pressing structure 20, making it easier to leave installation space for other components and preventing mutual interference during installation.

[0073] exist Figure 2 In the embodiment shown, the second retaining structure 50 is entirely located within the recessed groove, and the upper end face of the first retaining structure 40 is also located within the recessed groove, thereby further reducing the size of the power unit 100 in the height direction.

[0074] Reference Figure 2 As shown, the overlap dimension of the second holding structure 50 and the power structure 30 in the thickness direction of the power structure 30 is more than half the thickness of the second holding structure 50, thereby ensuring that the second holding structure 50 is located in the recessed groove of the tablet body 21 as much as possible, which can further reduce the distance between the second holding structure 50 and the substrate 10.

[0075] Reference Figures 1-3 , Figure 5 , Figures 7-9As shown, the second retaining structure 50 presses against the bottom wall of the tablet body 21, and the first retaining structure 40 passes through the bottom wall of the tablet body. A tablet body positioning hole 211 adapted to the first retaining structure 40 is formed on the bottom wall of the tablet body. After the first retaining structure 40 passes through the tablet body positioning hole 211 on the bottom wall of the tablet body, the tablet structure 20 can be initially positioned, which facilitates the subsequent use of the second retaining structure 50 to fix the tablet structure 20.

[0076] Reference Figure 9 As shown, the tablet compression structure 20 includes: a tablet compression body 21 and a tablet compression arm 22, the tablet compression arm 22 being connected to the tablet compression body 21, and referring to... Figures 1-2 , Figure 5 As shown, the tablet arm 22 is used to press against the power structure 30, which is clamped between the tablet structure 20 and the substrate 10.

[0077] Reference Figures 1-8 As shown, the power structure 30 may include a first power structure 31 and a second power structure 32, which are spaced apart. The tablet compression arm 22 includes a first tablet compression arm 221 and a second tablet compression arm 222. The first tablet compression arm 221 is used to press against the first power structure 31, and the second tablet compression arm 222 is used to press against the second power structure 32. The tablet compression body 21 is located between the first power structure 31 and the second power structure 32, and the holding structure 45 is also located between the first power structure 31 and the second power structure 32.

[0078] Furthermore, the first power structure 31 has a first connecting foot 311, the second power structure 32 has a second connecting foot 321, the first connecting foot 311 and the second connecting foot 321 are respectively located on the opposite outer sides of the first power structure 31 and the second power structure 32, and the tablet body 21 is located between the opposite inner sides of the first power structure 31 and the second power structure 32.

[0079] Optionally, the angle between the first connecting pin 311 extending from the first power structure 31 and the second connecting pin 321 extending from the second power structure 32 is 180 degrees. That is, the pins of the first connecting pin 311 and the second connecting pin 321 are both arranged outwards, leaving a middle space between the first power structure 31 and the second power structure 32, so that the retaining structure 45 can fix the pressing structure 20 to the substrate 10 from this middle space.

[0080] The first connecting pin 311 and the second connecting pin 321 each include a first pin 331, a second pin 332, and a third pin 333, each of which is adapted to be electrically connected to the drive circuit board 2000 or the corresponding busbar.

[0081] Reference Figure 2 , Figure 4 As shown, the first connecting pin 311 extends to the left from the first power structure 31, and the second connecting pin 321 extends to the right from the second power structure 32, with an included angle of 180 degrees. This avoids interference between the first and second power structures 31 and 32 if the first connecting pin 311 and the second connecting pin 321 are too close together when they face each other. Furthermore, when the first power structure 31 and the second power structure 32 are connected to their respective busbars or drive circuit boards 2000, both the first connecting pin 311 and the second connecting pin 321 face outwards, providing ample space for convenient operation.

[0082] Reference Figure 1 , Figure 3 , Figures 5-7 As shown, the first power structure 31 and the second power structure 32 are arranged opposite to each other in a first direction of the substrate 10. There are multiple first power structures 31, and these multiple first power structures 31 are arranged on the substrate 10 in a second direction. There are also multiple second power structures 32, and these multiple second power structures 32 are arranged on the substrate 10 along the second direction. There are also multiple pressing structures 20, and these multiple pressing structures 20 are arranged along the second direction. The first direction and the second direction are perpendicular to each other. When the substrate 10 is rectangular, the first direction can be the width direction of the substrate 10, and the second direction can be the length direction of the substrate 10.

[0083] Furthermore, the plurality of first power structures 31, the plurality of pressing structures 20, and the plurality of second power structures 32 correspond one-to-one in the first direction. A pair of first power structures 31 and second power structures 32 arranged opposite to each other can be pressed against the substrate 10 by the same pressing structure 20.

[0084] In some embodiments not shown, the multiple tableting structures 20 may be independent entities.

[0085] exist Figure 1 , Figure 3 , Figure 9 In the illustrated embodiment, multiple pressing structures 20 are connected as a single unit via pressing connectors 23, thereby saving assembly steps for the multiple pressing structures 20 and improving the assembly efficiency of the power unit 100. Simultaneously, the integrated pressing structure 20 can simultaneously press multiple power structures 30, resulting in high pressing efficiency. The integrated pressing structure 20 is pressed against the substrate 10 by two or more retaining structures 45.

[0086] Furthermore, the tablet connecting part 23 is connected between the tablet bodies 21 of two adjacent tablet structures 20, and the width of the tablet connecting part 23 can be equal to the width of the tablet body 21.

[0087] exist Figure 1 , Figure 3 , Figure 9 In the embodiment shown, the tablet pressing structure 20 includes a tablet pressing body 21 and a tablet pressing arm 22. A first holding structure 40 passes through the tablet pressing body 21. The tablet pressing arm 22 is connected side by side with the tablet pressing body 21 in a first direction of the substrate 10, and the tablet pressing arm 22 is used to press against the power structure 30. There are multiple tablet pressing structures 20, and the multiple tablet pressing structures 20 are connected to each other in a second direction of the substrate 10. The first direction and the second direction are perpendicular to each other.

[0088] Furthermore, the tablet compression arm 22 may include a first tablet compression arm 221 and a second tablet compression arm 222, which are symmetrically connected to both sides of the tablet compression body 21; and the tablet compression bodies 21 of two adjacent tablet compression structures 20 are connected to each other through the tablet compression connecting part 23.

[0089] Reference Figure 2 , Figure 4 , Figure 9 As shown, the tablet compression body 21 is formed as a recessed groove structure facing the first side. The opening of the tablet compression body 21 is away from the first side. The first tablet compression arm 221 and the second tablet compression arm 222 are respectively connected to the two ends of the opening of the tablet compression body 21, and the first tablet compression arm 221 and the second tablet compression arm 222 extend in a direction away from each other. (Refer to...) Figure 2 , Figure 4 As shown, the tablet body 21 is formed as a downwardly recessed groove structure, with the opening of the tablet body 21 facing upward, the first tablet arm 221 extending to the left, and the second tablet arm 222 extending to the right.

[0090] In some optional embodiments, the power unit 100 may further include a positioning portion for positioning the power structure 30 on the substrate 10, thereby ensuring that the power structure 30 is accurately positioned on the substrate 10 and preventing the power structure 30 from arbitrarily shaking on the substrate 10.

[0091] exist Figures 1-4 In the illustrated embodiment, the positioning part includes a positioning piece 60, on which a through positioning opening 61 is provided. The positioning opening 61 matches the power structure 30. For example, both the outer peripheral surface of the power structure 30 and the positioning opening 61 are rectangular. The power structure 30 is positioned in the positioning opening 61, and the bottom of the power structure 30 is directly attached to the substrate 10. The substrate 10 can be a metal substrate 10. The heat of the power structure 30 can be transferred to the substrate 10. A cooling device or a heating device can be provided below the substrate 10 to cool or heat the power structure 30.

[0092] Optionally, such as Figures 3-4As shown, the positioning piece 60 is also provided with an annular positioning rib 62 surrounding the positioning opening 61, and the annular positioning rib 62 matches the outer peripheral surface of the power structure 30. The annular positioning rib 62 protrudes from the surface of the positioning piece 60, which can increase the firmness of the positioning of the power structure 30 and improve the positioning effect.

[0093] exist Figures 1-4 In the embodiment shown, the positioning piece 60 is an insulating positioning piece, and the positioning piece 60 is bonded and fixed to the first side of the substrate 10.

[0094] Reference Figure 1 , Figure 3 As shown, the positioning piece 60 is provided with a positioning piece through hole 63 for matching with the first retaining structure 40 and allowing the first retaining structure 40 to pass through to form a positioning fit. After the first retaining structure 40 passes through the positioning piece through hole 63, the positioning piece 60 can be initially positioned. After the first retaining structure 40 passes through the positioning piece through hole 63 on the positioning piece 60 and the pressing body positioning hole 211 on the pressing body 21, it connects with the second retaining structure 50, thereby fixing the positioning piece 60 and the pressing structure 20 between the second retaining structure 50 and the substrate 10.

[0095] exist Figure 5 In the embodiment shown, the positioning part includes a protrusion 11 provided on the first side of the substrate 10, thereby saving the positioning piece 60, which helps to reduce the number of parts and save assembly time.

[0096] Optionally, the ridge 11 is a continuous annular ridge 11, which matches the outer peripheral surface of the power structure 30.

[0097] Optionally, the protrusion 11 corresponding to each power structure 30 is divided into four segments, which are located on the four sides of the rectangular power structure 30, thereby limiting the power structure 30 in all directions and better positioning the power structure 30 on the substrate 10.

[0098] exist Figures 6-8 In the illustrated embodiment, the positioning portion includes a groove 12 formed on a first side surface of the substrate 10. The peripheral wall of the groove 12 is adapted to match the outer peripheral surface of the power structure 30. Preferably, the groove 12 is a blind groove, such as... Figure 8 As shown, the bottom wall of the groove 12 is adapted to fit against the bottom surface of the power structure 30 to support the power structure 30. This embodiment also saves the positioning piece 60, which helps to reduce the number of parts and save assembly time. At the same time, the groove 12 is directly formed on the first side of the substrate 10, which is simple in process, easy to operate, and refers to Figure 8 As shown, the bottom surface of the power structure 30 is lower than the first side surface of the substrate 10, which can shorten the total height of the power structure 30 after assembly with the substrate 10 and reduce the volume of the power unit 100.

[0099] In some optional embodiments, the power unit 100 may further include a heat insulation structure 60', which is disposed on a first side of the substrate 10 in a manner that surrounds the power structure 30. The heat insulation structure 60' is located between the power structure 30 and the substrate 10, and can separate the power structure 30 from the substrate 10 to prevent the heat from the power structure 30 from affecting the components below the substrate 10, and can also prevent the heat below the substrate 10 from being transferred upward to the power structure 30.

[0100] In some alternative embodiments, the first side of the substrate 10 is the side facing the busbar.

[0101] Reference Figure 2 , Figure 4 , Figure 9 As shown, the tablet compression structure 20 is constructed in a gull-wing shape, and the tablet compression structure 20 may include a tablet compression body 21, a first tablet compression arm 221, and a second tablet compression arm 222. The first tablet compression arm 221 and the second tablet compression arm 222 are symmetrically connected to both sides of the tablet compression body 21. The free ends of the first tablet compression arm 221 and the second tablet compression arm 222 each have a bent section 24 that bends towards the substrate 10. The bent section 24 is adapted to press against the power structure 30, so that the power structure 30 presses against the substrate 10.

[0102] The large planar space above the tablet compression structure 20 provides installation space for other components (taking the busbar as an example) and can significantly shorten the dimensions of the power unit 100 and the busbar assembly in the height direction.

[0103] In some embodiments, refer to Figures 10-11 As shown, the retaining structure 45 may include a first retaining structure 40 and a third retaining structure 70, wherein the third retaining structure 70 is disposed at the free end of the first retaining structure 40 away from the substrate 10, as shown. Figure 11 As shown, the first retaining structure 40 is disposed on the substrate 10, and the third retaining structure 70 is disposed on the upper end of the first retaining structure 40. The third retaining structure 70 can be configured as a snap fastener suitable for snapping the pressing structure 20. The snap fastener fixes the pressing structure 20 to the substrate 10 by snapping, making the installation and removal of the pressing structure 20 faster and more convenient, which helps to save operating time.

[0104] Specifically, the buckle has a gradually changing cross-section and has a small-diameter end 71 and a large-diameter end 72, as shown in the reference. Figure 11As shown, the upper end of the buckle is a small diameter end 71, and the lower end is a large diameter end 72. The buckle forms a guide cone surface from the small diameter end 71 to the large diameter end 72, which is suitable for guiding the insertion of the pressure plate structure 20. The pressure plate structure 20 is provided with a buckle hole suitable for the buckle to be inserted. The outer diameter of the small diameter end 71 is smaller than the diameter of the buckle hole. In the free state, the outer diameter of the large diameter end 72 is larger than the diameter of the buckle hole. The large diameter end 72 is formed as a locking surface suitable for locking the pressure plate structure 20.

[0105] Furthermore, the large-diameter end 72 is located on the side of the small-diameter end 71 closer to the substrate 10, and the small-diameter end 71 is adapted to be fixed with the first retaining structure 40, while the large-diameter end 72 is adapted to be separated from the first retaining structure 40. In this way, the large-diameter end 72 can undergo elastic deformation, thereby moving closer to or further away from the first retaining structure 40 in the circumferential direction. When the pressing structure 20 passes over the buckle from top to bottom, the small-diameter end 71 first extends out of the buckle hole, and the large-diameter end 72, under the limiting action of the hole wall of the buckle hole, converges towards the first retaining structure 40, thereby ensuring that the large-diameter end 72 can smoothly pass over the buckle hole and reach the top of the pressing structure 20, so that the locking surface of the large-diameter end 72 presses against the upper surface of the pressing structure 20, that is, the pressing structure 20 is clamped between the third retaining structure 70 and the substrate 10.

[0106] The tablet pressing body 21 is formed as a recessed groove structure recessed towards the substrate 10, and the opening of the tablet pressing body 21 faces away from the substrate 10. (Refer to...) Figure 11 As shown, the tablet body 21 is formed as a downwardly recessed groove structure, with the opening of the tablet body 21 facing upward.

[0107] At least a portion of the third retaining structure 70 is located within the recessed groove of the pressing body 21, and the end face of the first retaining structure 40 away from the substrate 10 (i.e., the upper end face of the first retaining structure 40) is also located within the recessed groove. This shortens the distance between the end face of the first retaining structure 40 away from the substrate 10 and the substrate 10, and also shortens the distance between the third retaining structure 70 and the substrate 10. In this way, the retaining structure 45 is located within the recessed groove of the pressing body 21 as much as possible, which can reduce the size of the power unit 100 in the height direction and form a larger usable space above the pressing structure 20, which facilitates the provision of installation space for other components and prevents mutual interference during installation.

[0108] exist Figure 11 In the embodiment shown, the third retaining structure 70 is entirely located within the recessed groove, and the upper end face of the first retaining structure 40 is also located within the recessed groove, thereby further reducing the size of the power unit 100 in the height direction.

[0109] Reference Figure 11As shown, the overlap dimension of the third holding structure 70 and the power structure 30 in the thickness direction of the power structure 30 is more than half the thickness of the third holding structure 70, thereby ensuring that the second holding structure 50 is located as much as possible in the recessed groove of the tablet body 21, which can further reduce the distance between the third holding structure 70 and the substrate 10.

[0110] After the third retaining structure 70 and the first retaining structure 40 pass through the bottom wall of the tablet body, the third retaining structure 70 presses against the bottom wall of the tablet body 21, which can realize the positioning and fixation of the tablet structure 20.

[0111] In some embodiments, refer to Figures 12-15 As shown, the retaining structure 45 may include a fourth retaining structure 80, which presses against a plurality of pressing bodies 21 and is fixed to the substrate 10.

[0112] Specifically, refer to Figure 12 , Figure 14 As shown, the fourth retaining structure 80 spans multiple pressing bodies 21, and the longitudinal ends of the fourth retaining structure 80 extend beyond the two outermost of the multiple pressing structures 20, with the extended portions fixed to the substrate 10. In this way, the fourth retaining structure 80 can firmly hold the multiple pressing bodies 21 on the first side of the substrate 10. When the power structure 30 is installed in the power structure mounting space, the pressing structure 20 applies a pressing force toward the substrate 10 to the power structure 30, thereby effectively preventing the power structure 30 from falling off.

[0113] Furthermore, the aforementioned extended portion is fixed to the substrate 10 by screwing or snapping. (Refer to...) Figures 11-15 As shown, the fastener 81 extends beyond the base plate 10 and is then fixed thereto, thereby securing the fourth retaining structure 80. The fastener 81 can be a bolt. The fourth retaining structure 80 can be installed and removed quickly and easily by installing or removing the fasteners 81 at both ends.

[0114] Optionally, the fourth retaining structure 80 is constructed as a pressure bar, with the surface of the pressure bar facing the pressure plate body 21 being a pressing plane. By changing the length of the fourth retaining structure 80, clamping of different numbers of power structures 30 can be achieved.

[0115] The tablet pressing body 21 is formed as a recessed groove structure recessed towards the substrate 10, and the opening of the tablet pressing body 21 faces away from the substrate 10. (Refer to...) Figure 13 , Figure 15 As shown, the tablet body 21 is formed as a downwardly recessed groove structure, with the opening of the tablet body 21 facing upward.

[0116] Furthermore, at least a portion of the fourth retaining structure 80 is located within the recessed groove of the tablet body 21, thereby shortening the distance between the fourth retaining structure 80 and the substrate 10. In this way, the retaining structure 45 is located within the recessed groove of the tablet body 21 as much as possible, which can reduce the size of the power unit 100 in the height direction and form a larger usable space above the tablet structure 20, making it easier to leave installation space for other components and preventing mutual interference during installation.

[0117] exist Figure 13 In the embodiment shown, the fourth retaining structure 80 is entirely located within the recessed groove.

[0118] Reference Figures 16-26 As shown, the power structure 30 has multiple pins, such as first pin 331, second pin 332, and third pin 333 of the first connecting pin 311 and the second connecting pin 321. At least one pin is connected to the busbar through which it is passed, and this at least one pin is offset from and electrically insulated from other busbars. That is, this at least one pin does not need to pass through other busbars; it can simply be inserted through a hole in the busbar through which it is passed, thus reducing the number of holes on other busbars and simplifying the manufacturing process of the power unit assembly 1000. At the same time, the offset of this at least one pin from other busbars ensures good insulation performance between this at least one pin and other busbars.

[0119] According to the power unit assembly 1000 of the present invention, by connecting the pin to the busbar through which it is passed, and staggering the pin from other busbars, the number of holes on other busbars can be reduced, the manufacturing process of the busbars can be simplified, and it is beneficial to ensure good electrical insulation performance between the pin and other busbars.

[0120] In some alternative embodiments, the busbar has a busbar connection portion, and at least one pin of the power unit 100 is connected to the busbar by passing through only one layer of the busbar connection portion, and the busbar connection portion is constructed as a sheet. That is, for the busbar, the busbar connection portion is only provided at the position where it needs to be connected to the pin, while no physical structure is provided at the position offset from the pin, which helps to save busbar material and thus save costs.

[0121] Optionally, the busbar and the corresponding busbar connection part are on the same plane, which helps to simplify the busbar structure and facilitate the processing and manufacturing of the busbar.

[0122] Optionally, the busbar and the corresponding busbar connection part are formed by a stamping process. The stamping process is simple and efficient, which helps to shorten the processing time of the busbar and also helps to reduce stray inductance.

[0123] In some optional embodiments, the busbar connection portion protrudes from at least one side edge of the corresponding busbar, and the busbar connection portion is directly connected to the corresponding busbar. In other words, the busbar connection portion is connected to the corresponding busbar without the use of other connecting parts, which can ensure the simplicity of the busbar structure, simplify the busbar processing steps, and reduce stray inductance.

[0124] In some optional embodiments, the busbar connection portion has a busbar connection portion through hole that allows pins to pass through. The pins of the power structure 30 extend into the corresponding busbar connection portion through hole and are electrically connected to the busbar where the busbar connection portion is located.

[0125] In some optional embodiments, in the two busbar connection portions corresponding to two adjacent pins, the busbar connection portion through-hole on one busbar connection portion is located outside the outline of the other busbar connection portion, thereby ensuring that each pin is only connected to the busbar connection portion through-hole on the corresponding busbar connection portion, and not connected to the busbar connection portion through-hole on other busbar connection portions. It should be noted that the "two adjacent pins" mentioned here can be two adjacent pins of the same power structure 30, or two adjacent pins of different power structures 30.

[0126] In some alternative embodiments, refer to Figures 16-23 As shown, two pins in the same power structure 30 are respectively connected to the busbar connection parts of the corresponding two busbars, and each pin is only connected to the corresponding busbar connection part. (Refer to...) Figures 24-26 As shown, the remaining pin in the same power structure 30 is adapted to be connected to the driver circuit board 2000.

[0127] Reference Figures 16-19 As shown, the busbar includes: a first busbar 201, a second busbar 202, and a third busbar 203, wherein the first busbar 201 includes a first busbar body 2013, the second busbar 202 includes a second busbar body 2023, and the third busbar 203 includes a third busbar body 2033; the busbar connecting part includes: a first busbar connecting part 2011, a second busbar connecting part 2021, and a third busbar connecting part 2031, wherein the first busbar connecting part 2011 is connected to the first busbar body 2013 of the first busbar 201, the second busbar connecting part 2021 is connected to the second busbar body 2023 of the second busbar 202, and the third busbar connecting part 2031 is connected to the third busbar body 2033 of the third busbar 203.

[0128] The first busbar connection part 2011 is located on one side of the first busbar 201, the second busbar connection part 2021 is located on the other side of the second busbar 202 opposite to the first busbar connection part 2011, and the third busbar connection part 2031 is located on both sides of the third busbar 203.

[0129] In some alternative embodiments, refer to Figure 16 As shown, the power structure 30 includes a first power structure 31 and a second power structure 32. The pins of the first power structure 31 and the pins of the second power structure 32 are located on opposite sides of the first power structure 31 and the second power structure 32, respectively. The pin of the first power structure 31 is a first connecting pin 311, and the pin of the second power structure 32 is a second connecting pin 321. Both the first connecting pin 311 and the second connecting pin 321 include a first pin 331, a second pin 332, and a third pin 333.

[0130] The pins 311 of the first power structure 31 are on the same first side as the first busbar connection 2011 and the third busbar connection 2031 located on the first side of the third busbar 203 (e.g., Figure 16 (Left side of the middle), the pin 321 of the second power structure 32 is on the same second side as the second busbar connection 2021 and the third busbar connection 2031 located on the second side of the busbar (e.g., on the left side of the middle), ... pin 321 of the second power Figure 16 (The right side of the middle).

[0131] The first busbar connection part 2011 has a first busbar connection part through hole 2014, the second busbar connection part 2021 has a second busbar connection part through hole 2024, and the third busbar connection part 2031 has a third busbar connection part through hole 2034.

[0132] Specifically, refer to Figures 16-19 , Figures 23-26 As shown, the first pin 331 of the first connecting pin 311 is adapted to pass through the third busbar connecting part through hole 2034 on the third busbar connecting part 2031 to achieve connection with the third busbar 203; the second pin 332 of the first connecting pin 311 is adapted to pass through the drive circuit board 2000 to achieve connection with the drive circuit board 2000; the third pin 333 of the first connecting pin 311 is adapted to pass through the first busbar connecting part through hole 2014 on the first busbar connecting part 2011 to achieve connection with the first busbar 201.

[0133] Similarly, refer to Figures 20-26As shown, the first pin 331 of the second connecting pin 321 is adapted to pass through the second busbar connecting part through hole 2024 on the second busbar connecting part 2021 to achieve connection with the second busbar 202; the second pin 332 of the second connecting pin 321 is adapted to pass through the drive circuit board 2000 to achieve connection with the drive circuit board 2000; the third pin 333 of the second connecting pin 321 is adapted to pass through the third busbar connecting part through hole 2034 on the third busbar connecting part 2031 to achieve connection with the third busbar 203. The third busbar connecting part through hole 2034 on the third busbar connecting part 2031 located on the first side of the busbar 203 is offset from the third busbar connecting part through hole 2034 on the third busbar connecting part 2031 located on the second side of the busbar 203. Figure 20 As shown, the line connecting the through holes 2034 of the third busbar connection parts on both sides of the third busbar 203 is not parallel to the short side of the third busbar 203.

[0134] The stacking positions of the first busbar 201, the second busbar 202, and the third busbar 203 can be changed according to actual needs. For example, the third busbar 203 can be located above the first busbar 201 and the second busbar 202, or it can be located between the first busbar 201 and the second busbar 202.

[0135] Furthermore, in the same power structure 30 described above, any one of two pins is connected to the corresponding busbar connection and is adjacent to or spaced apart from the other busbar connection.

[0136] like Figures 16-17 As shown, the first pin 331 of the first connecting pin 311 is connected to the third busbar connecting part 2031 and spaced apart from the first busbar connecting part 2011, and the third pin 333 of the first connecting pin 311 is connected to the first busbar connecting part 2011 and spaced apart from the third busbar connecting part 2031; the first pin 331 of the second connecting pin 321 is connected to the second busbar connecting part 2021 and spaced apart from the third busbar connecting part 2031, and the third pin 333 of the second connecting pin 321 is connected to the third busbar connecting part 2031 and spaced apart from the second busbar connecting part 2021.

[0137] In some alternative embodiments, either of two pins in the same power structure 30 described above is connected to a corresponding busbar connection, wherein a busbar connection via on one busbar connection is located outside the outline of the other busbar connection. For example... Figures 16-17As shown, the first pin 331 of the first connecting foot 311 is connected to the third busbar connecting part 2031, and the third busbar connecting part through hole 2034 on the third busbar connecting part 2031 is located outside the outline of the first busbar connecting part 2011; the third pin 333 of the first connecting foot 311 is connected to the first busbar connecting part 2011, and the first busbar connecting part through hole 2014 on the first busbar connecting part 2011 is located outside the outline of the third busbar connecting part 2031; the first pin 331 of the second connecting foot 321 is connected to the second busbar connecting part 2021, and the second busbar connecting part through hole 2024 on the second busbar connecting part 2021 is located outside the outline of the third busbar connecting part 2031; the third pin 333 of the second connecting foot 321 is connected to the third busbar connecting part 2031, and the third busbar connecting part through hole 2034 on the third busbar connecting part 2031 is located outside the outline of the second busbar connecting part 2021.

[0138] Reference Figures 24-26 As shown, the remaining pin in the same power structure 30 is adapted to connect to the driver circuit board 2000, and the remaining pin is directly connected to the driver circuit board 2000 without any busbar connection obstruction. For example, the second pin 332 of the first power structure 31 is connected to the driver circuit board 2000, and there is no busbar connection between the second pin 332 of the first power structure 31 and the driver circuit board 2000; the second pin 332 of the second power structure 32 is connected to the driver circuit board 2000, and there is no busbar connection between the second pin 332 of the second power structure 32 and the driver circuit board 2000.

[0139] In some alternative embodiments, refer to Figure 1 , Figure 3 , Figures 16-17 , Figures 19-21 , Figure 25 As shown, the same power structure 30 has a first pin 331, a second pin 332, and a third pin 333, with the third pin 333 located between the first pin 331 and the second pin 332, as shown in the figure. Figure 2 , Figure 4 , Figure 8 , Figure 18 , Figure 26 As shown, the third pin 333 is located outside the first pin 331 and the second pin 332 relative to the power structure 30. The staggered arrangement of the pins facilitates the rational layout of the connection points of the power structure 30 to the corresponding busbars. The gap between the first pin 331 and the second pin 332 allows a busbar connection part to be inserted, and this busbar connection part is connected to the third pin 333 through it.

[0140] For example, the gap between the first pin 331 and the second pin 332 of the first power structure 31 allows the insertion of the first busbar connection portion 2011, and the first busbar connection portion 2011 is connected to the third pin 333 of the first power structure 31 through a passage. The gap between the first pin 331 and the second pin 332 of the second power structure 32 allows the insertion of the third busbar connection portion 2031, and the third busbar connection portion 2031 is connected to the third pin 333 of the second power structure 32 through a passage.

[0141] Furthermore, the busbar connection portion passing through the first pin 331 and the busbar connection portion passing through the third pin 333 are partially overlapped or staggered in the stacking direction of the multiple busbars, for example... Figures 16-17 As shown, the third busbar connection portion 2031 through the first pin 331 of the first power structure 31 and the first busbar connection portion 2011 through the third pin 333 are partially overlapped or staggered in the stacking direction of multiple busbars; the second busbar connection portion 2021 through the first pin 331 of the second power structure 32 and the third busbar connection portion 2031 through the third pin 333 are partially overlapped or staggered in the stacking direction of multiple busbars. This design places the solder joints of the power structure and the metal busbars at the protruding edge of the busbars. When using conventional soldering processes, the solder joints can effectively retain soldering heat, lowering the production process threshold and allowing for mass production using conventional processes.

[0142] Reference Figures 24-26 As shown, the second pin 332 of the first power structure 31 and the second pin 332 of the second power structure 32 are both suitable for direct connection to the driver circuit board 2000.

[0143] Specifically, one of the first motherboard 201 and the second motherboard 202 is a positive motherboard and the other is a negative motherboard. The third motherboard 203 is a parallel motherboard. For example, the first motherboard 201 is a positive motherboard and the second motherboard 202 is a negative motherboard, or the first motherboard 201 is a negative motherboard and the second motherboard 202 is a positive motherboard.

[0144] Furthermore, the power unit assembly 1000 may also include a busbar clamp (not shown in the figure) for clamping the first busbar 201 and the second busbar 202, which facilitates the fit of the first busbar 201 and the second busbar 202 and can shorten the distance between the first busbar 201 and the second busbar 202, thereby further shortening the height dimension of the power unit assembly 1000.

[0145] exist Figures 16-26In the illustrated embodiment, each of the first busbar 201, the second busbar 202, and the third busbar 203 is rectangular in shape, and the first busbar 201, the second busbar 202, and the third busbar 203 are stacked in the thickness direction of the busbar, with busbar connecting portions formed on the longitudinal long sides of the corresponding busbars. Specifically, the first busbar connecting portion 2011 is formed on the first longitudinal long side of the first busbar 201, the second busbar connecting portion 2021 is formed on the second longitudinal long side of the second busbar 202, and the third busbar connecting portion 2031 is formed on both longitudinal long sides of the third busbar 203.

[0146] Reference Figures 16-17 , Figures 19-23 As shown, a first busbar 201 is provided with a first busbar transition end plate 2012 at one end, and a second busbar 202 is provided with a second busbar transition end plate 2022 at one end. The first busbar transition end plate 2012 and the second busbar transition end plate 2022 are located at the same end and are arranged side by side. The third busbar 203 is provided with a third busbar transition end plate 2032 at the other end opposite to the first busbar transition end plate 2012. This facilitates the rational arrangement of the transition end plates of each busbar.

[0147] In some alternative embodiments, the first busbar 201, the second busbar 202 and the third busbar 203 are all flat busbars, which helps to further reduce the size of the power unit assembly 1000 in the height direction.

[0148] In some embodiments (not shown), the busbar connection portion has a through slot that allows pins to pass through. The through slot extends away from the busbar and passes through the outer edge of the busbar connection portion away from the busbar. For example, the through slot can be an outward-facing "U"-shaped slot, which facilitates the pins passing through or being removed from the through slot.

[0149] In some alternative embodiments, the entire surface of the busbar is covered with an insulating film, which can prevent the busbar from making electrical connections with other pins and provides good insulation between adjacent busbars.

[0150] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0151] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A power unit component, characterized in that, include: A power unit, the power unit comprising: a power structure having multiple pins; Multiple stacked busbars, at least one of the pins is connected to the busbar through which only one layer of the busbar is passed, and the at least one pin is offset from and electrically insulated from the other busbars; The busbar has a busbar connection portion, and at least one pin of the power unit is connected to the busbar through only one layer of the busbar connection portion, and the busbar connection portion is constructed in a sheet shape; the busbar and the corresponding busbar connection portion are on the same plane; The same power structure has a first pin, a second pin, and a third pin, the third pin being located between the first pin and the second pin, the third pin being located outside the first pin and the second pin relative to the power structure, the gap between the first pin and the second pin allowing a busbar connection portion to be inserted and pass through and connected to the third pin; the busbar connection portion passing through the first pin and the busbar connection portion passing through the third pin are partially stacked or staggered in the stacking direction of the plurality of busbars, and the second pin is adapted to be directly connected to the drive circuit board; The power unit further includes a substrate and a pressing structure. The power structure is pressed against a first side of the substrate by the pressing structure. The power structure includes a first power structure and a second power structure. The first power structure and the second power structure are arranged opposite to each other in a first direction on the substrate. A plurality of the first power structures are arranged along a second direction, a plurality of the second power structures are arranged along the second direction, and a plurality of the pressing structures are arranged along the second direction, wherein the first direction and the second direction are perpendicular to each other. The tablet compression structure includes a tablet compression body and a tablet compression arm. The tablet compression arm is connected to the tablet compression body. The tablet compression body is formed as a recessed groove structure facing the first side, and the opening of the tablet compression body is away from the first side. The tablet compression arm includes a first tablet compression arm and a second tablet compression arm. The first tablet compression arm is used to press against the first power structure, and the second tablet compression arm is used to press against the second power structure. The first power structure has a first connecting foot, and the second power structure has a second connecting foot. The first connecting foot and the second connecting foot are respectively located on opposite outer sides of the first power structure and the second power structure. The tablet compression body is located between opposite inner sides of the first power structure and the second power structure. The first side of the substrate is the side facing the busbar.

2. The power unit assembly according to claim 1, characterized in that, The busbar and the corresponding connecting part of the busbar are formed by a punching process.

3. The power unit assembly according to claim 1, characterized in that, The busbar connecting portion protrudes from at least one side edge of the corresponding busbar and is directly connected to the corresponding busbar.

4. The power unit assembly according to claim 1, characterized in that, The busbar connection part is provided with a through hole that allows the pin to pass through.

5. The power unit assembly according to claim 1, characterized in that, The busbar includes: a first busbar, a second busbar, and a third busbar; The busbar connection includes: a first busbar connection connected to the first busbar, a second busbar connection connected to the second busbar, and a third busbar connection connected to the third busbar. The first busbar connection is located on one side of the first busbar, the second busbar connection is located on the opposite side of the second busbar to the first busbar connection, and the third busbar connection is located on both sides of the third busbar.

6. The power unit assembly according to claim 5, characterized in that, One of the first busbar and the second busbar is a positive busbar and the other is a negative busbar.

7. The power unit assembly according to claim 6, characterized in that, Also includes: Busbar clamps used to clamp the first busbar and the second busbar.

8. The power unit assembly according to claim 5, characterized in that, Each of the first busbar, the second busbar, and the third busbar is rectangular in shape and is stacked in the thickness direction of the busbar, and the busbar connection portion is formed on the longitudinal long side corresponding to the busbar.

9. The power unit assembly according to claim 5, characterized in that, The pins of the first power structure are on the same first side as the first busbar connection portion and the third busbar connection portion located on the first side of the third busbar, and the pins of the second power structure are on the same second side as the second busbar connection portion and the third busbar connection portion located on the second side of the third busbar.

10. The power unit assembly according to claim 5, characterized in that, A first busbar is provided with a first busbar adapter plate at one end, and a second busbar is provided with a second busbar adapter plate at one end. The first busbar adapter plate and the second busbar adapter plate are located at the same end and are arranged side by side. A third busbar adapter plate is provided at the other end of the third busbar opposite to the first busbar adapter plate.

11. The power unit assembly according to claim 5, characterized in that, The first busbar, the second busbar and the third busbar are all flat busbars.

12. The power unit assembly according to claim 1, characterized in that, The busbar connection portion is provided with a through groove that allows the pin to pass through. The through groove extends away from the busbar and passes through the outer edge of the busbar connection portion away from the busbar.

13. The power unit assembly according to claim 1, characterized in that, The entire surface of the busbar is covered with an insulating film.

Images