Electromagnetic shielding type solar cell monolithic cover plate, solar cell module and manufacturing method

Abstract

This invention relates to an electromagnetically shielded solar cell cover plate, a solar cell module, and a manufacturing method thereof. The electromagnetically shielded solar cell cover plate includes a radiation-resistant glass cover sheet. A conductive metal layer is deposited on the radiation-resistant glass cover sheet, and the conductive metal is etched into a "well"-shaped grid structure. An infrared and visible light transparent ITO thin film is then deposited on the glass cover sheet with the missile-like metal grid structure, transforming the cover sheet surface from an insulator to a conductor. The conductive metal plating at the four corners of the cover sheet serves as lead-out electrodes. The electromagnetically shielded solar cell module prepared using this cover plate can effectively conduct charges generated on the surface of the glass cover sheet from the space environment to the substrate, avoiding electrostatic discharge caused by charge accumulation and improving the electromagnetic shielding capability of the solar cell module.

Description

Technical Field

[0001] This invention relates to a method for manufacturing an electromagnetically protected solar cell module, belonging to the field of photovoltaic cells. Background Technology

[0002] With the development of high-capacity communication satellites, multi-functional scientific exploration and application satellites, and large space stations, the power demand for primary power supplies of space solar arrays has increased significantly, with a development trend reaching the 10kW to 1MW level. Meeting these high-power demands requires increasing the bus voltage of the solar array, using high-voltage solar arrays operating above 100V. With the increase in bus voltage, high-voltage solar arrays have experienced primary electrostatic discharge (ESD) and the secondary ESD phenomena it induces. Primary ESD affects the electronic system of the solar array, causing leakage losses and generating electromagnetic interference, but it does not damage the array structure. However, secondary ESD has a fatal impact on the array, causing severe power loss from the high-voltage solar array power supply. Summary of the Invention

[0003] The technical problem solved by this invention is to overcome the shortcomings of the prior art. Traditional space solar cell arrays do not have electromagnetic protection capabilities. In the space environment, the accumulation of charge on the surface of the cover plate causes electrostatic discharge, which in turn causes a serious loss of the output power of the cell array. To this end, an electromagnetic protection solar cell module manufacturing method is proposed.

[0004] The solution of the present invention is: an electromagnetic protection type solar cell monolayer cover plate, the cover plate includes a radiation-resistant glass cover plate, a layer of conductive metal is deposited on the radiation-resistant glass cover plate, the conductive metal is etched into a "well" shaped grid structure, and an infrared and visible light transparent ITO film is deposited on the glass cover plate with the missile metal grid structure, so that the surface of the cover plate changes from an insulator to a conductor, and the conductive metal coating on the four corners of the cover plate is the lead-out electrode.

[0005] Another technical solution of the present invention is: a method for preparing the above-mentioned electromagnetically protected solar cell monolayer cover plate, the method comprising the following steps:

[0006] S1-1. A conductive metal layer is deposited on the surface of the radiation-resistant glass cover using electron beam evaporation, and a grid-shaped conductive metal grid and lead-out electrodes are prepared by photolithography etching.

[0007] S1-2. A layer of infrared and visible light transparent ITO thin film is deposited on the surface of a glass cover plate with a conductive metal grid using magnetron sputtering process to complete the fabrication of an electromagnetically protected solar cell monolayer cover plate.

[0008] Preferably, the specific steps in step S1-1 are as follows:

[0009] S1-1-1. A conductive metal layer is prepared using electron beam evaporation technology. The thickness is 0.2 to 1 micrometer. The metal grid is shaped like a "well" and the line width is 3 to 5 micrometers. The grid hollow unit size is 50 to 100 micrometers × 50 to 100 micrometers. The lead-out electrodes are located at the four corners of the cover plate and are in the shape of a "triangle".

[0010] S1-1-2, Use ferric chloride solution to corrode away the copper outside the metal grid and electrode area.

[0011] The third technical solution of the present invention is: a solar cell module with an electromagnetic protection type cover plate, the module comprising an aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface, and N sets of electromagnetic protection type solar cell strings, where N is greater than or equal to 1;

[0012] The aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface has a pre-embedded columnar conductor structure inside. One end of the conductor extends into the aluminum honeycomb layer of the substrate, and the aluminum honeycomb layer of the substrate is connected to the electrical "ground" terminal of the battery module. The other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate.

[0013] An electromagnetically protected solar cell string is formed by connecting individual electromagnetically protected solar cells in series. N sets of electromagnetically protected solar cell strings are embedded side by side in a substrate to form a solar cell array. Each electromagnetically protected solar cell is covered with an electromagnetically protected solar cell cover plate, which is located on the surface of the substrate. The electrodes of adjacent electromagnetically protected solar cell cover plates are connected by interconnecting plates. The electrodes of the electromagnetically protected solar cell cover plates located at the edge of the substrate are connected to a pre-embedded columnar conductor structure through interconnecting plates, and then connected to the electrical "ground" terminal of the battery module through the pre-embedded columnar conductor structure.

[0014] Preferably, the interconnecting sheets are of two types: "X" shaped interconnecting sheets and "Y" shaped interconnecting sheets. The "X" shaped interconnecting sheet includes four overlapping pieces that form an "X" shape and is placed in the middle area of ​​the substrate to realize the interconnection of the cover sheets between individual battery cells. The "Y" shaped interconnecting sheet includes three overlapping pieces that form a "Y" shape and is placed in the edge area of ​​the substrate to realize the connection between the battery cover sheet and the pre-embedded conductors of the substrate.

[0015] Preferably, an Ω-shaped stress-reducing ring is formed in the middle of each overlapping piece of the interconnecting sheet.

[0016] The fourth technical solution of the present invention is: a method for preparing a solar cell module with an electromagnetically protected cover plate, comprising the following steps:

[0017] S2-1. Preparation of electromagnetically protected solar cell cover plate;

[0018] S2-2: An aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface is used. An embedded columnar conductor structure is made inside. One end of the conductor is inserted into the aluminum honeycomb layer, and the other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate.

[0019] S2-3. Apply the electromagnetic protection cover sheet to the solar cell single-cell fabrication process to complete the fabrication of electromagnetic protection solar cell single cell.

[0020] S2-3. Electromagnetic protective solar cell strings are prepared by connecting electromagnetic protective solar cells in series using resistance welding process, and N protective solar cell strings are attached to the surface of the substrate.

[0021] S2-4. Prepare and fabricate irregularly shaped cover plate interconnects with Ω stress-reducing rings;

[0022] S2-4. Connect the electrodes of adjacent electromagnetically protected solar cell cover plates through cover plate interconnection sheets. Connect the electrodes of the electromagnetically protected solar cell cover plates located at the edge of the substrate to the pre-embedded columnar conductor structure through the cover plate interconnection sheets. Connect the pre-embedded columnar conductor structure to the electrical "ground" terminal of the battery module to complete the fabrication of the electromagnetically protected solar cell module.

[0023] Preferably, the specific steps of step S2-1 are as follows:

[0024] S2-1-1. A conductive metal layer is deposited on the surface of the radiation-resistant glass cover using electron beam evaporation, and a grid-shaped conductive metal grid and lead-out electrodes are prepared by photolithography etching.

[0025] S2-2-2, A layer of infrared and visible light transparent ITO thin film is deposited on the surface of a glass cover plate with a conductive metal grid using magnetron sputtering technology to complete the fabrication of an electromagnetically protected solar cell monolayer cover plate.

[0026] Preferably, the specific steps of steps S2-3 are as follows:

[0027] S2-3-1. Apply a cover film adhesive to the surface of the solar cell;

[0028] S2-3-2. Press the electromagnetic protection cover onto the surface, making the cover naturally horizontal, and cure at room temperature plus 60℃ high temperature.

[0029] The advantages of this invention compared to the prior art are:

[0030] (1) The electromagnetic protection cover of the present invention is prepared by electron beam evaporation, photolithography etching and magnetron sputtering. The preparation process is mature and can be well combined with the existing solar cell single cell manufacturing process.

[0031] (2) The electromagnetic protection cover of the present invention has a transmittance of more than 80% in the visible and near-infrared bands, which effectively improves the conductivity of the cover surface while minimizing the impact on photovoltaic power generation.

[0032] (3) The present invention prepares irregularly shaped cover sheet interconnection sheet and substrate pre-embedded conductor structure. The effective connection between battery cover sheets and the electrical ground terminal of the cover sheet and the substrate is achieved by on-board welding process. The preparation process is mature and can be well integrated with the existing battery module preparation process.

[0033] (4) The electromagnetic protection solar cell module prepared by the present invention can effectively conduct the charge generated on the surface of the glass cover by the space environment to the substrate, avoid the electrostatic discharge phenomenon caused by charge accumulation, and improve the electromagnetic protection capability of the solar cell module. Attached Figure Description

[0034] Figure 1 A schematic diagram of the electromagnetic shielding cover structure provided for the invention;

[0035] Figure 2 A schematic diagram of an electromagnetically protected solar cell module provided for the invention;

[0036] Figure 3 A schematic diagram of the "X"-shaped cover plate interconnection structure provided for the invention;

[0037] Figure 4 A schematic diagram of the "Y"-shaped cover plate interconnection structure provided for the invention. Detailed Implementation

[0038] The present invention will be further described below with reference to the embodiments.

[0039] Electrostatic discharge (ESD) is caused by the charging of the cover plate by ions in the surrounding environment and secondary electron emission between the interconnects and the cover plate, which raises the cover plate potential to the discharge threshold. Improving the electromagnetic protection capability of a solar array involves preventing the accumulation of charging charges on the cover plate surface and reducing the cover plate charging potential. Therefore, this invention provides an electromagnetic protection cover plate with surface conductivity, which is connected to the electrical ground terminal of the solar array, while simultaneously avoiding any impact on photovoltaic power generation.

[0040] This invention provides an electromagnetically protected monolayer cover for a solar cell. The cover includes a radiation-resistant glass cover sheet, on which a conductive metal layer is deposited. The conductive metal is etched into a grid structure resembling a "well". An infrared and visible light transparent ITO thin film is then deposited on the glass cover sheet with the missile-like metal grid structure, transforming the cover sheet surface from an insulator to a conductor. The conductive metal plating at the four corners of the cover sheet serves as lead-out electrodes. Preferably, the conductive metal includes copper, silver, or gold.

[0041] The preparation method of the above-mentioned electromagnetically protected solar cell monolayer cover plate includes the following steps:

[0042] S1-1. A conductive metal layer is deposited on the surface of the radiation-resistant glass cover using electron beam evaporation. A grid-shaped conductive metal grid and lead-out electrodes are then fabricated using photolithography etching. The specific steps are as follows:

[0043] S1-1-1. A conductive metal layer is prepared using electron beam evaporation technology. The thickness is 0.2 to 1 micrometer. The metal grid is shaped like a "well" and the line width is 3 to 5 micrometers. The grid hollow unit size is 50 to 100 micrometers × 50 to 100 micrometers. The lead-out electrodes are located at the four corners of the cover plate and are in the shape of a "triangle".

[0044] S1-1-2, Use ferric chloride solution to corrode away the copper outside the metal grid and electrode area.

[0045] S1-2. A layer of infrared and visible light transparent ITO thin film is deposited on the surface of a glass cover plate with a conductive metal grid using magnetron sputtering process to complete the fabrication of an electromagnetically protected solar cell monolayer cover plate.

[0046] The present invention also provides a solar cell module based on the above-mentioned electromagnetic protection type cover plate, the module comprising an aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface and N sets of electromagnetic protection type solar cell strings, where N is greater than or equal to 1.

[0047] The aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface has a pre-embedded columnar conductor structure inside. One end of the conductor extends into the aluminum honeycomb layer of the substrate, and the aluminum honeycomb layer of the substrate is connected to the electrical "ground" terminal of the battery module. The other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate.

[0048] An electromagnetically protected solar cell string is formed by connecting individual electromagnetically protected solar cells in series. N sets of electromagnetically protected solar cell strings are embedded side by side in a substrate to form a solar cell array. Each electromagnetically protected solar cell is covered with an electromagnetically protected solar cell cover plate, which is located on the surface of the substrate. The electrodes of adjacent electromagnetically protected solar cell cover plates are connected by interconnecting plates. The electrodes of the electromagnetically protected solar cell cover plates located at the edge of the substrate are connected to a pre-embedded columnar conductor structure through interconnecting plates, and then connected to the electrical "ground" terminal of the battery module through the pre-embedded columnar conductor structure.

[0049] Preferably, the interconnecting sheets are of two types: "X" shaped interconnecting sheets and "Y" shaped interconnecting sheets. The "X" shaped interconnecting sheet includes four overlapping pieces that form an "X" shape and is placed in the middle area of ​​the substrate to realize the interconnection of the cover sheets between individual battery cells. The "Y" shaped interconnecting sheet includes three overlapping pieces that form a "Y" shape and is placed in the edge area of ​​the substrate to realize the connection between the battery cover sheet and the pre-embedded conductors of the substrate.

[0050] Preferably, an Ω-shaped stress-reducing ring is formed in the middle of each overlapping piece of the interconnecting sheet.

[0051] The method for manufacturing the solar cell module with the aforementioned electromagnetic protection cover plate includes the following steps:

[0052] S2-1. Fabrication of an electromagnetically protected solar cell cover plate; specific steps are as follows:

[0053] S2-1-1. A conductive metal layer is deposited on the surface of the radiation-resistant glass cover using electron beam evaporation, and a grid-shaped conductive metal grid and lead-out electrodes are prepared by photolithography etching.

[0054] S2-2-2, A layer of infrared and visible light transparent ITO thin film is deposited on the surface of a glass cover plate with a conductive metal grid using magnetron sputtering technology to complete the fabrication of an electromagnetically protected solar cell monolayer cover plate.

[0055] S2-2. An aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface is used. An embedded columnar conductor structure is made inside. One end of the conductor is inserted into the aluminum honeycomb layer, and the other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate. The embedded conductor is made of cylindrical copper. The embedded conductor is inserted into the aluminum honeycomb layer and forms a good electrical contact with it. The conductor passes through the carbon fiber and polyimide to the surface of the substrate.

[0056] S2-3. Apply the electromagnetic protection cover sheet to the solar cell single-cell fabrication process to complete the fabrication of electromagnetic protection solar cell single cell.

[0057] S2-3. Electromagnetic protective solar cell strings are prepared by connecting electromagnetic protective solar cells in series using resistance welding process, and N protective solar cell strings are attached to the surface of the substrate.

[0058] The specific steps are as follows:

[0059] S2-3-1. Apply a cover film adhesive to the surface of the solar cell;

[0060] S2-3-2. Press the electromagnetic protection cover onto the surface, making the cover naturally horizontal, and cure at room temperature plus 60℃ high temperature.

[0061] S2-4. Prepare and fabricate irregularly shaped cover plate interconnects with Ω stress-reducing rings;

[0062] S2-5. Connect adjacent electromagnetically protected solar cell cover plate electrodes through cover plate interconnection sheets. Connect the electrodes of the electromagnetically protected solar cell cover plate located at the edge of the substrate to the pre-embedded columnar conductor structure through the cover plate interconnection sheets. Connect the pre-embedded columnar conductor structure to the electrical "ground" terminal of the battery module to complete the fabrication of the electromagnetically protected solar cell module.

[0063] Example 1

[0064] A method for manufacturing an electromagnetically protected solar cell module involves preparing a metal grid and an ITO thin film on a glass cover sheet, transforming the cover sheet surface from an insulator to a conductor while minimizing the impact on photovoltaic power generation performance. Irregularly shaped interconnect sheets are designed and fabricated, and an on-board welding process is used to connect the cover sheet surface to the electrical ground terminal of the substrate. The specific manufacturing steps are as follows:

[0065] (1) A layer of metallic copper with a thickness of 1 micrometer was deposited on the surface of the radiation-resistant glass cover using electron beam evaporation. A copper metal grid with a grid shape was prepared by photolithography and etching using a mask. The grid line width was 5 micrometers, and the size of the hollow unit was 100 micrometers × 100 micrometers. The lead-out electrodes were located at the four corners of the cover, forming a triangle shape. The etching was performed using a ferric chloride solution wet etching process.

[0066] (2) Infrared and visible transparent ITO thin films were prepared by magnetron sputtering. The preparation process is different from the traditional ITO thin film preparation process. The process parameters are: sputtering power 1500W, deposition temperature 150℃, oxygen flow rate 10sccm, which improves the transmittance in the near-infrared band.

[0067] (3) The aluminum honeycomb is the base material with a thickness of 20mm. Epoxy adhesive is used to attach a carbon fiber layer (230 micrometers) and a polyimide film layer (50 micrometers) to the surface of the aluminum honeycomb. Cylindrical copper metal is used as a pre-embedded conductor with a length of 15mm, which penetrates into the interior of the aluminum honeycomb layer and forms a good electrical contact with it. The copper pillar passes through the carbon fiber and polyimide to the surface of the substrate. Foam is filled around the aluminum honeycomb area around the copper pillar for fixation.

[0068] (4) The single cell is a gallium arsenide triple junction solar cell. First, a cover film adhesive is applied to the surface of the solar cell, and then an electromagnetic protection cover film is pressed onto the surface, so that the cover film is naturally horizontal. It is cured at room temperature plus 60°C. The cell string attachment process is a common process for space solar cell arrays. That is, first, a layer of fishbone-shaped cover film adhesive is brushed onto the substrate surface using a peel-off sticker as a template. Then, the cell string is attached to the cover film adhesive and fixed with a pressure block. After curing for 72 hours, the gas is removed.

[0069] (5) Two types of irregularly shaped interconnect sheets are fabricated: an "X"-shaped interconnect sheet used in the central area and a "Y"-shaped interconnect sheet used in the edge area. The "X"-shaped interconnect sheet enables interconnection between individual battery cells, while the "Y"-shaped interconnect sheet enables connection between the battery cover sheet and the pre-embedded conductor on the substrate. An Ω-shaped stress-reducing ring is fabricated on each interconnect sheet using a stamping process to reduce the damage to the interconnect sheet caused by tensile stress due to thermal deformation.

[0070] (6) The “X”-shaped interconnect pieces and “Y”-shaped interconnect pieces are welded to the corresponding positions of the battery module using a plate welding process. The “X”-shaped interconnect piece requires 4 welding points to achieve the interconnection between the cover pieces of the battery cells, and the “Y”-shaped interconnect piece requires 3 welding points to achieve the connection between the battery cover piece and the pre-embedded conductor of the substrate. The “X”-shaped interconnect pieces in the central area are resistance welded to connect the 4 adjacent cover pieces, and the “Y”-shaped interconnect pieces at the edge are resistance welded to connect the 2 adjacent cover pieces and the pre-embedded conductor of the substrate.

[0071] In this embodiment, as Figure 1 As shown, nine radiation-resistant glass coverslips, each 40mm × 60mm in size and 120 micrometers thick, were selected. A 1-micrometer thick layer of copper was deposited on the coverlip surface using electron beam evaporation. A copper metal grid, shaped like a grid, was fabricated using photolithography and etching. The grid line width was 5 micrometers, and the cutout unit size was 100 micrometers × 100 micrometers. The lead-out electrodes were located at the four corners of the coverlip, forming a triangle with two right-angled sides of 4mm. A wet etching process using ferric chloride solution was then used to remove the copper metal layer, excluding the metal grid and lead-out electrodes, after photolithography.

[0072] Figure 1 In the diagram, 1 is a triangular electrode, 2 is a grid-shaped metal grid, and 3 is the area where the copper metal layer needs to be etched away.

[0073] An ITO thin film was deposited on the surface of the glass cover after the metal grid was prepared using magnetron sputtering. The preparation process parameters were: sputtering power 1500W, deposition temperature 150℃, oxygen flow rate 10sccm, and ITO thickness of 200nm. This improved the transmittance in the near-infrared band. In this embodiment, the transmittance in the visible and near-infrared bands was greater than 80%. This completed the preparation of 9 electromagnetic protection glass cover sheets.

[0074] Select a 40mm × 60mm triple-junction gallium arsenide solar cell wafer. First, apply a cover adhesive to the surface of the solar cell, then press the electromagnetic shielding cover onto the surface, ensuring the cover is naturally horizontal. Curing is then performed at room temperature for 24 hours followed by a high-temperature curing process at 60℃ for 2 hours. This completes the fabrication of 9 electromagnetic shielding solar cells.

[0075] By selecting resistance welding, three electromagnetically protected battery strings are prepared by connecting three individual cells of nine electromagnetically protected batteries in series.

[0076] Fabricating irregularly shaped cover plates for interconnection, such as Figure 2 As shown, the "X"-shaped interconnect is made of silver, and the four welding strips are 5mm wide with an included angle of 90 degrees. Figure 3 As shown, the "Y"-shaped interconnect has two thin welding rods with a width of 5mm and a thick welding rod with a width of 8mm. An Ω-shaped stress-reducing ring is fabricated on each interconnect using a stamping process to reduce damage to the interconnect caused by tensile stress due to thermal deformation. The "X"-shaped interconnect enables the interconnection of the cover plates between individual battery cells, while the "Y"-shaped interconnect connects the battery cover plates to the pre-embedded conductors on the substrate. In this embodiment, the protective solar cell strings are attached to corresponding positions on the substrate, meaning that a pair of pre-embedded conductor structures correspond to the ends of adjacent battery strings.

[0077] Figure 2 In the diagram, 1 represents a welding rod, and 2 represents an Ω-shaped stress-reducing ring.

[0078] Figure 3 In the diagram, 1 represents a fine welding rod, 2 represents an Ω-shaped stress-reducing ring, and 3 represents a coarse welding rod.

[0079] like Figure 4 As shown, aluminum honeycomb material with a thickness of 20mm was selected and cut into dimensions of 240mm × 180mm. Copper pillars with a length of 15mm and a diameter of 8mm were vertically placed into the aluminum honeycomb, with one end of the copper pillar flush with the surface of the aluminum honeycomb substrate. Foam was used to fill and fix the aluminum honeycomb area around the copper pillar. A carbon fiber layer (230 micrometers) and a polyimide film layer (50 micrometers) were then attached to the surface of the aluminum honeycomb using epoxy adhesive. The carbon fiber and polyimide materials in the corresponding areas of the copper pillars were then removed, exposing the copper pillar surface. A layer of herringbone-shaped cover adhesive was brushed onto the polyimide surface of the substrate using a peel-off sticker as a template. The battery string was then attached to the cover adhesive and fixed with a pressure block. After curing for 72 hours, the gas was removed.

[0080] Figure 4 In the diagram, 1 is a "Y"-shaped interconnect sheet, 2 is an "X"-shaped interconnect sheet, 3 is an electromagnetically protected solar cell, 4 is an aluminum honeycomb panel with a carbon fiber layer and a polyimide layer attached to its surface, and 5 is a pre-embedded copper conductor column.

[0081] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make possible changes and modifications to the technical solutions of the present invention by utilizing the methods and techniques disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the protection scope of the technical solutions of the present invention.

Claims

1. A solar cell module based on an electromagnetic protection type electromagnetic protection type cover sheet, characterized by Includes an aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface, and N sets of electromagnetically protected solar cell strings, where N is greater than or equal to 1; The aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface has a pre-embedded columnar conductor structure inside. One end of the conductor extends into the aluminum honeycomb layer of the substrate, and the aluminum honeycomb layer of the substrate is connected to the electrical "ground" terminal of the battery module. The other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate. An electromagnetically protected solar cell string is formed by connecting individual electromagnetically protected solar cells in series. N sets of electromagnetically protected solar cell strings are embedded side by side in a substrate to form a solar cell array. Each electromagnetically protected solar cell is covered with an electromagnetically protected solar cell cover plate, which is located on the surface of the substrate. The electrodes of adjacent electromagnetically protected solar cell cover plates are connected by interconnecting plates. The electrodes of the electromagnetically protected solar cell cover plates located at the edge of the substrate are connected to a pre-embedded columnar conductor structure through interconnecting plates, and then connected to the electrical "ground" terminal of the battery module through the pre-embedded columnar conductor structure. The electromagnetic protection type solar cell single-cell cover plate includes a radiation-resistant glass cover plate, on which a layer of conductive metal is deposited by vapor deposition. The conductive metal is etched into a "well" shaped grid structure. An infrared and visible light transparent ITO film is then deposited on the glass cover plate with the missile metal grid structure, so that the surface of the cover plate changes from an insulator to a conductor. The conductive metal coating on the four corners of the cover plate is the lead-out electrode. The interconnecting sheets are divided into two types: "X" shaped interconnecting sheets and "Y" shaped interconnecting sheets. The "X" shaped interconnecting sheet includes four overlapping pieces, which form an "X" shape and are placed in the middle area of ​​the substrate to realize the interconnection of the cover sheets between individual battery cells. The "Y" shaped interconnecting sheet includes three overlapping pieces, which form a "Y" shape and are placed in the edge area of ​​the substrate to realize the connection between the battery cover sheet and the pre-embedded conductors of the substrate. The interconnecting pieces form an Ω-shaped stress-reducing ring in the middle of each overlapping piece.

2. The method of claim 1, wherein the solar cell module is prepared by Includes the following steps: S2-1. Preparation of electromagnetically protected solar cell cover plate; S2-2: An aluminum honeycomb carbon fiber substrate with a polyimide film attached to its surface is used. An embedded columnar conductor structure is made inside. One end of the conductor is inserted into the aluminum honeycomb layer, and the other end passes through the carbon fiber layer and the polyimide layer to the surface of the substrate. S2-3. Apply the electromagnetic protection cover sheet to the solar cell single-cell fabrication process to complete the fabrication of electromagnetic protection solar cell single cell. S2-3. Electromagnetic protective solar cell strings are prepared by connecting electromagnetic protective solar cells in series using resistance welding process, and N protective solar cell strings are attached to the surface of the substrate. S2-4. Prepare and fabricate irregularly shaped cover plate interconnects with Ω stress-reducing rings; S2-4. Connect adjacent electromagnetically protected solar cell cover plate electrodes through cover plate interconnection sheets. Connect the electrodes of the electromagnetically protected solar cell cover plate located at the edge of the substrate to the pre-embedded columnar conductor structure through the cover plate interconnection sheets. Connect the pre-embedded columnar conductor structure to the electrical "ground" terminal of the battery module to complete the fabrication of the electromagnetically protected solar cell module.

3. The method for preparing a solar cell module according to claim 2, characterized in that... The specific steps of step S2-1 are as follows: S2-1-1. A conductive metal layer is deposited on the surface of the radiation-resistant glass cover using electron beam evaporation, and a "well"-shaped conductive metal grid and lead-out electrodes are prepared by photolithography etching. S2-2-2, A layer of infrared and visible light transparent ITO thin film is deposited on the surface of a glass cover plate with a conductive metal grid using magnetron sputtering technology to complete the fabrication of an electromagnetically protected solar cell monolayer cover plate.

4. The solar cell module production method according to claim 3, wherein The specific steps in step S2-1-1 are as follows: S2-1-1-1. A conductive metal layer is prepared using electron beam evaporation technology. The thickness is 0.2 to 1 micrometer. The metal grid is shaped like a "well" and the line width is 3 to 5 micrometers. The grid hollow unit size is 50 to 100 micrometers × 50 to 100 micrometers. The lead-out electrodes are located at the four corners of the cover plate and are in the shape of a "triangle". S2-1-1-2, Use ferric chloride solution to corrode away the copper outside the metal grid and electrode area.

5. The solar cell module production method according to claim 2, wherein The specific steps of step S2-3 are as follows: S2-3-1. Apply a cover film adhesive to the surface of the solar cell; S2-3-2. Press the electromagnetic protection cover onto the surface, making the cover naturally horizontal, and cure at room temperature plus 60℃ high temperature.

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