Optical transmit module, optical transceiver module and optical module

Abstract

An optical transmitting module, an optical transceiver module, and an optical module are provided that reduce warpage of the substrate housing a temperature control element when the temperature control of the first and second optical elements is performed independently. The optical transmitting module includes: a semiconductor laser element; an optical modulation element optically coupled to the semiconductor laser element; a temperature regulating device having a substrate, a first mounting portion, and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element and housing the semiconductor laser element, and the second mounting portion being disposed on the main surface of the substrate via a second temperature control element and housing the optical modulation element; a package having a bottom surface opposite the back surface of the substrate, housing the semiconductor laser element, the optical modulation element, and the temperature regulating device; and an intermediate block disposed between the first and second temperature control elements, having a back surface directly or indirectly fixed to the main surface of the substrate.

Description

Technical Field

[0001] This invention relates to an optical transmitting module, an optical transceiver module, and an optical module. Background Technology

[0002] Patent Document 1 discloses a technology related to an optical module. This optical module includes: multiple components, each containing at least one heating element; and a temperature regulator. The temperature regulator includes: a plate-shaped lower substrate; multiple thermoelectric elements disposed in different regions at a predetermined distance from the upper surface of the lower substrate; and multiple upper substrates disposed on the respective upper surfaces of the multiple thermoelectric elements. The temperature regulator regulates the temperature of the components disposed on the respective upper surfaces of the multiple upper substrates through the Peltier effect.

[0003] Patent Document 1: Japanese Patent Application Publication No. 2019-140306

[0004] For example, in optical modules such as optical transmitting modules or optical transceiver modules, the temperature control of the first optical element (e.g., a semiconductor laser element) and the second optical element (e.g., an optical modulation element) is sometimes performed independently. In such cases, the first optical element is mounted on a first temperature control element (also called a temperature regulating element or thermoelectric element), and the second optical element is mounted on a second temperature control element. Moreover, by arranging these temperature control elements on a common substrate, the relative positional relationship between the first and second optical elements is fixed.

[0005] However, in the case described above, since multiple temperature control elements are arranged on a common substrate, there is a tendency for the substrate size to become longer. If the substrate size becomes longer, the warping of the substrate is more likely to increase due to temperature changes during the installation of each temperature control element or during the operation of the optical module. If the substrate warping increases, the optical axes of each optical element will be tilted relative to each other, and the optical coupling efficiency between the optical elements will decrease. In addition, the warping of the substrate will generate stress in each temperature control element, which may cause abnormalities in each temperature control element. Summary of the Invention

[0006] Therefore, the object of the present invention is to provide an optical transmitting module, an optical transceiver module, and an optical module that can reduce the warpage of the substrate on which the temperature control element is mounted when the temperature control of the first optical element and the second optical element are performed independently.

[0007] One embodiment of the optical transmitting module includes: a semiconductor laser element; an optical modulation element optically coupled to the semiconductor laser element; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element and the semiconductor laser element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element and the optical modulation element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate for housing the semiconductor laser element, the optical modulation element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0008] One embodiment of the optical transceiver module includes: a semiconductor laser element; an optical modulation element optically coupled to the semiconductor laser element; an optical receiving element optically coupled to the semiconductor laser element; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element and the semiconductor laser element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element and the optical modulation element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate for housing the semiconductor laser element, the optical modulation element, the optical receiving element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0009] One embodiment of the optical module includes: a first optical element and a second optical element optically coupled to each other; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element, the first optical element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element, the second optical element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate, for housing the first optical element, the second optical element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0010] The effects of the invention

[0011] According to the present invention, an optical transmitting module, an optical transceiver module, and an optical module can be provided that reduce the warpage of the substrate on which the temperature control element is mounted when the temperature control of the first optical element and the second optical element are performed independently. Attached Figure Description

[0012] Figure 1 This is a cutaway perspective view showing the structure of an optical transceiver module 10 according to one embodiment of the present invention.

[0013] Figure 2 It is a cut-out perspective view with the various optical components of the optical transceiver module 10 omitted.

[0014] Figure 3 yes Figure 2 A partial top view of the optical transceiver module 10 shown.

[0015] Figure 4 It is along Figure 3 A cross-sectional view along line IV-IV.

[0016] Figure 5 This is a top view showing the temperature regulating device 40.

[0017] Figure 6 This is a bottom view showing the back side 50b of the middle block 50.

[0018] Figure 7 This is a flowchart showing the assembly sequence of the optical transceiver module 10.

[0019] Figure 8 This is a cutaway perspective view showing the structure of the optical transceiver module 10A involved in the third variation.

[0020] Figure 9 This is a top view showing the structure of the optical transceiver module 10A involved in the third variation. Detailed Implementation

[0021] [Description of embodiments of the present invention]

[0022] First, embodiments of the present invention will be described. One embodiment of the optical transmitting module includes: a semiconductor laser element; an optical modulation element optically coupled to the semiconductor laser element; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element, the semiconductor laser element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element, the optical modulation element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate, for housing the semiconductor laser element, the optical modulation element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0023] In this optical transmission module, laser light output from a semiconductor laser element is input to an optical modulation element, which generates an optical signal by modulating the laser light. Furthermore, a first temperature control element controls the wavelength of the laser light by controlling the temperature of the semiconductor laser element, and a second temperature control element suppresses variations in the characteristics of the optical modulation element by maintaining its temperature constant. Since the temperature control of the semiconductor laser element and the optical modulation element is performed independently, their temperatures can be controlled with high precision. Moreover, in this optical transmission module, an intermediate block is disposed between the first and second temperature control elements, and its back side is directly or indirectly fixed to the main surface of the substrate. Therefore, the intermediate block prevents warping of the substrate on which the first and second temperature control elements are mounted (especially warping of the portion between the first and second temperature control elements), thus reducing substrate warping. Consequently, the relative tilt of the optical axes of the semiconductor laser element and the optical modulation element can be reduced, suppressing a decrease in their optical coupling efficiency. In addition, it can reduce the stress generated in each temperature control element due to substrate warping, thereby improving the reliability of each temperature control element.

[0024] In the aforementioned optical transmission module, the length of the fixing region, which secures the main surface of the substrate to the intermediate block in the arrangement direction of the first mounting part, the intermediate block, and the second mounting part, is greater than or equal to 10% and less than or equal to 50% of the substrate length in that direction. Since the length of the fixing region is greater than or equal to 10% of the substrate length, the intermediate block can effectively prevent substrate warping. Furthermore, since the length of the fixing region is less than or equal to 50% of the substrate length, sufficient space can be ensured on the main surface of the substrate for arranging the first temperature control element and the second temperature control element.

[0025] In the aforementioned optical transmission module, the width of the fixing region, which fixes the main surface of the substrate and the intermediate block in a direction orthogonal to the arrangement direction of the first mounting part, the intermediate block, and the second mounting part, is greater than or equal to 50% of the width of the substrate in that direction. Because the width of the fixing region is greater than or equal to 50% of the width of the substrate, the intermediate block can effectively prevent warping of the substrate.

[0026] In the aforementioned optical transmission module, a first metal film may be disposed on the main surface of the substrate, and a second metal film may be disposed on the back side of the intermediate block. The first and second metal films are fixed to each other via a metal bonding material. In this case, the intermediate block and the substrate are firmly fixed together, preventing peeling between the intermediate block and the substrate caused by substrate warping, and effectively preventing substrate warping.

[0027] In the aforementioned light transmission module, the main surface of the substrate and the back surface of the intermediate block can be fixed together with resin. In this case, the intermediate block and the substrate can be easily fixed together, simplifying the manufacturing process.

[0028] In the aforementioned optical transmission module, a mark may be provided on the main surface of the intermediate block. This mark is used to align the semiconductor laser element and the optical modulation element with the intermediate block. In this case, by clamping the intermediate block, the relative positions of the semiconductor laser element and the optical modulation element, which are spaced further apart, can be aligned with high precision.

[0029] In the aforementioned optical transmission module, a temperature regulating device may have wiring on the main surface of the substrate. This wiring supplies control signals to at least one of a first temperature control element and a second temperature control element. The wiring is arranged side-by-side with a fixing area that is fixed to the main surface of the substrate and the intermediate block in a direction intersecting the arrangement directions of the first mounting portion, the intermediate block, and the second mounting portion. The intermediate block includes a portion that covers the wiring. In this case, the area of ​​the intermediate block can be increased, thus ensuring sufficient space on the main surface of the intermediate block for arranging optical components such as beam splitters.

[0030] The aforementioned optical transmitting module may further include: a first base component having a mounting surface for mounting a semiconductor laser element and a back surface facing in the opposite direction to the mounting surface; and a second base component having a mounting surface for mounting an optical modulation element and a back surface facing in the opposite direction to the mounting surface; an intermediate block having a main surface facing in the opposite direction to the back surface; the back surface of the first base component being fixed to the first mounting portion; the back surface of the second base component being fixed to the second mounting portion; and the mounting surface of the first base component, the main surface of the intermediate block, and the mounting surface of the second base component being coplanar. In this case, the optical axes of the semiconductor laser element and the optical modulation element in the height direction (the normal direction of the main surface of the substrate) can be aligned with high precision.

[0031] One embodiment of the optical transceiver module includes: a semiconductor laser element; an optical modulation element optically coupled to the semiconductor laser element; an optical receiving element optically coupled to the semiconductor laser element; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element and the semiconductor laser element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element and the optical modulation element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate for housing the semiconductor laser element, the optical modulation element, the optical receiving element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0032] In this optical transceiver module, a portion of the laser light output from the semiconductor laser element is input to an optical modulation element, which generates an optical signal by modulating the laser light. The remaining portion of the laser light output from the semiconductor laser element is input to an optical receiving element, which demodulates the received optical signal using this laser light. A first temperature control element controls the wavelength of the laser light by controlling the temperature of the semiconductor laser element, and a second temperature control element suppresses variations in the characteristics of the optical modulation element by maintaining a constant temperature. Because the temperature control of the semiconductor laser element and the optical modulation element is performed independently, their temperatures can be controlled with high precision. Furthermore, in this optical transceiver module, an intermediate block is disposed between the first and second temperature control elements, and its back side is directly or indirectly fixed to the main surface of the substrate. This intermediate block prevents warping of the substrate on which the first and second temperature control elements are mounted (particularly, warping of the portion between the first and second temperature control elements), thus reducing substrate warping. Therefore, the relative tilt of the optical axes of semiconductor laser elements and optical modulation elements can be reduced, suppressing the decrease in their optical coupling efficiency. Furthermore, the stress generated in each temperature control element due to substrate warping can be reduced, improving the reliability of each temperature control element.

[0033] In the aforementioned optical transceiver module, the intermediate block may have a main surface facing the opposite direction to the back surface. On the main surface of the intermediate block, an optical component is disposed to branch the output light from the semiconductor laser element. One of the branched output lights is input to an optical modulation element, and the other is input to an optical receiving element. In this case, a portion of the laser light output from the semiconductor laser element can be input to the optical modulation element, and the remaining portion of the laser light output from the semiconductor laser element can be input to the optical receiving element. Furthermore, by arranging the optical component as described above on the main surface of the intermediate block, the space on the intermediate block can be utilized efficiently.

[0034] In the aforementioned optical transceiver module, the intermediate block may have a main surface facing the opposite direction to the back surface, and the package may have a mounting surface arranged side-by-side with the main surface of the intermediate block. A light receiving element is mounted on this mounting surface. Marks are provided on both the main surface of the intermediate block and the mounting surface of the package to align the intermediate block and the package. In this configuration, the relative position of the intermediate block with respect to the package can be aligned with high precision, thereby enabling high-precision optical coupling between the light receiving element and the semiconductor laser element disposed on the mounting surface of the package.

[0035] One embodiment of the optical module includes: a first optical element and a second optical element optically coupled to each other; a temperature regulating device having a substrate, a first mounting portion and a second mounting portion, the substrate having a main surface and a back surface, the first mounting portion being disposed on the main surface of the substrate via a first temperature control element, the first optical element being mounted on the first mounting portion, the second mounting portion being disposed on the main surface of the substrate via a second temperature control element, the second optical element being mounted on the second mounting portion; a package having a bottom surface opposite to the back surface of the substrate, for housing the first optical element, the second optical element and the temperature regulating device; and an intermediate block disposed between the first temperature control element and the second temperature control element, having a back surface directly or indirectly fixed to the main surface of the substrate.

[0036] In this optical module, a first temperature control element controls the temperature of a first optical element, and a second temperature control element controls the temperature of a second optical element. Since the temperature control of the first and second optical elements is performed independently, their temperatures can be controlled with high precision. Furthermore, in this optical module, an intermediate block is disposed between the first and second temperature control elements, and its back side is directly or indirectly fixed to the main surface of the substrate. This intermediate block prevents warping of the substrate on which the first and second temperature control elements are mounted (particularly, warping of the portion between the first and second temperature control elements), thus reducing substrate warping. Therefore, the relative tilt of the optical axes of the first and second optical elements can be reduced, suppressing a decrease in their optical coupling efficiency. In addition, the stress generated in each temperature control element due to substrate warping can be reduced, improving the reliability of each temperature control element.

[0037] [Detailed Description of Embodiments of the Invention]

[0038] Hereinafter, specific examples of the optical transmitting module, optical transceiver module, and optical module of the present invention will be described with reference to the accompanying drawings. Furthermore, the present invention is not limited to these examples, but is shown in the claims, encompassing all modifications equivalent to and within the scope of the claims. In the following description, the same reference numerals are used to denote the same elements as in the description of the drawings, and repeated descriptions are omitted.

[0039] Figure 1 This is a cutaway perspective view showing the structure of an optical transceiver module 10 according to one embodiment of the present invention. Figure 2 It is a cut-out perspective view with the various optical components of the optical transceiver module 10 omitted. Figure 3 yes Figure 2 A partial top view of the optical transceiver module 10 shown.

[0040] Figure 4 It is along Figure 3A cross-sectional view along line IV-IV. The optical transceiver module 10 is an example of an optical module in this embodiment. As shown in these figures, the optical transceiver module 10 of this embodiment includes: a semiconductor laser element 11; an optical modulation element 12 optically coupled to the semiconductor laser element 11; and an optical receiving element 13 optically coupled to the semiconductor laser element 11. In addition, the optical transceiver module 10 also includes a lens 21, a beam splitter 22, mirrors 23, 24, and 25, a polarization combining filter 26, a polarization separating filter 27, and lens arrays 28 and 29. Furthermore, the optical transceiver module 10 includes a package 30, a light source support 31, a light source base 32, a modulation element support 33, a modulation element base 34, a receiving element support 35, a temperature regulating device 40, and an intermediate block 50.

[0041] Semiconductor laser element 11 is an example of the first optical element in this embodiment. Semiconductor laser element 11 is, for example, a DFB laser, which outputs a continuous wave of a single wavelength, i.e., laser light La, from one end. Furthermore, semiconductor laser element 11 has a structure for setting the output wavelength to be variable. In one example, semiconductor laser element 11 is an InP type semiconductor laser element. Semiconductor laser element 11 is mounted on a light source support 31 and arranged such that the optical axis of laser light La is along direction D1. Light source support 31 is a rectangular plate-shaped component made of a dielectric material. The dielectric material is, for example, ceramic, and includes at least one of aluminum nitride and aluminum oxide. Multiple wirings for supplying drive current, etc., to semiconductor laser element 11 are provided on the upper surface of light source support 31.

[0042] Lens 21 is positioned on the optical axis of the laser La and optically coupled to one end of the semiconductor laser element 11. Lens 21 is, for example, a convex lens, which parallelizes (collimates) the laser La output from the semiconductor laser element 11. Lens 21 is, for example, made of glass or silicon.

[0043] The light source base 32 is an example of the first base component in this embodiment. The light source base 32 is a plate-shaped component with a rectangular planar shape, made of a dielectric material. The dielectric material is, for example, ceramic, and the ceramic may contain at least one of aluminum nitride and aluminum oxide. Figure 4 As shown, the light source base 32 has: a flat mounting surface 32a on which the semiconductor laser element 11 is mounted; and a back surface 32b facing in the opposite direction to the mounting surface 32a. A light source support member 31 and a lens 21 are mounted on the mounting surface 32a of the light source base 32. The light source support member 31 is fixed to the mounting surface 32a, for example, by solder. The lens 21 is fixed to the mounting surface 32a, for example, by resin adhesive.

[0044] Beam splitter 22 is disposed on the optical axis of laser La and optically coupled to one end of semiconductor laser element 11 via lens 21. Beam splitter 22 is an optical component that branches the laser La output from semiconductor laser element 11 into two lasers, La1 and La2. One laser, La1, passes through beam splitter 22 and travels straight along direction D1. The other laser, La2, is reflected at beam splitter 22 and travels along direction D2, which intersects (e.g., is orthogonal) to direction D1. Beam splitter 22 is, for example, constructed from a dielectric multilayer film formed on the surface of a glass block.

[0045] Reflector 23 is positioned relative to beam splitter 22 in direction D2 and is optically coupled to beam splitter 22. Reflector 23 reflects the laser La2 reflected at beam splitter 22 again. The laser La2 reflected at reflector 23 then travels again along direction D1.

[0046] Lens array 28 comprises three lenses arranged along direction D2. The central lens of these three lenses is positioned relative to beam splitter 22 in direction D1 and is optically coupled to beam splitter 22. This central lens focuses the laser La1 transmitted through beam splitter 22 toward light modulation element 12. Lens array 29 comprises three lenses arranged along direction D2. The central lens of these three lenses is positioned relative to mirror 23 in direction D1 and is optically coupled to mirror 23. This central lens focuses the laser La2 reflected in mirror 23 toward light receiving element 13. Each lens in lens arrays 28 and 29 is made of, for example, glass or silicon.

[0047] The optical modulation element 12 is an example of the second optical element in this embodiment. The optical modulation element 12 receives a laser La1 as input, internally branches the laser La1, and modulates each branched laser beam separately, thereby generating two signal beams Lb1 and Lb2. The modulation method in the optical modulation element 12 is, for example, phase shift keying (PSK). The following describes the case of quadrature phase shift keying (QPSK). The optical modulation element 12 is, for example, made of InP-type or silicon (Si)-type semiconductors, and internally contains multiple electric field absorption (EA) type optical modulators for modulating light intensity. The optical modulation element 12 is mounted on a modulation element support 33 for height adjustment. The modulation element support 33 is a rectangular plate-shaped component made of a dielectric material. The dielectric material is, for example, ceramic, which includes at least one of aluminum nitride and aluminum oxide. The optical modulation element 12 outputs two generated signal beams, Lb1 and Lb2, respectively, from a pair of output ports configured across the input port of the laser La1. The signal beams Lb1 and Lb2 output from the pair of output ports travel in the opposite direction to the laser La1 along direction D1. The pair of output ports are optically coupled to the lenses at both ends of the three lenses in the lens array 28, and the signal beams Lb1 and Lb2 are parallelized by these lenses. A mirror 25 is optically coupled to one of the pair of output ports of the optical modulation element 12 via the lens array 28. The mirror 25 reflects the signal beam Lb1 output from that output port toward the polarization combining filter 26. The signal beam Lb1 then travels in a direction D2 that intersects (e.g., is orthogonal to) direction D1.

[0048] The polarization combining filter 26 is optically coupled to another optical output port of the optical modulation element 12 via the lens array 28, receiving the parallelized signal light Lb1. Additionally, the polarization combining filter 26 is optically coupled to the reflector 25, receiving the signal light Lb2 reflected at the reflector 25. Furthermore, one of the signal lights Lb1 and Lb2, before reaching the polarization combining filter 26, has its polarization direction rotated by 90° by a wavelength plate (not shown) disposed inside or outside the optical modulation element 12. Moreover, the polarization combining filter 26 reflects the signal light Lb1 and allows the signal light Lb2 to pass through, thereby combining the signal lights Lb1 and Lb2, and outputting the combined transmitted signal light Lb to the outside of the optical transceiver module 10. The polarization combining filter 26 is, for example, constructed from a dielectric multilayer film formed on the surface of a glass block.

[0049] The modulation element base 34 is an example of the second base component in this embodiment. The modulation element base 34 is a plate-shaped component with a rectangular planar shape, made of a dielectric material. The dielectric material is, for example, ceramic, and in the ceramic, it includes at least one of aluminum nitride and aluminum oxide. Figure 4 As shown, the modulation element base 34 has: a flat mounting surface 34a on which the optical modulation element 12 is mounted; and a back surface 34b facing in the opposite direction to the mounting surface 34a. The modulation element support 33, the reflector 25, the polarizing filter 26, and the lens array 28 are mounted on the mounting surface 34a of the modulation element base 34, and are fixed to the mounting surface 34a, for example, by solder or resin adhesive.

[0050] Polarization separator 27 receives received signal light Lc from an external input of the optical transceiver module 10. The received signal light Lc contains two signal lights Lc1 and Lc2 with different polarization directions. Polarization separator 27 separates the received signal light Lc into the two signal lights Lc1 and Lc2. Polarization separator 27 is, for example, constructed from a dielectric multilayer film formed on the surface of a glass block. Polarization separator 27 is optically coupled to an input port of optical receiver 13 via a lens at one end of the three lenses of lens array 29. The signal light Lc1 separated by polarization separator 27 is focused by the lens at that end of lens array 29 and input to an input port of optical receiver 13.

[0051] Reflector 24 is positioned relative to polarization separator 27 in direction D2. Reflector 24 is optically coupled to polarization separator 27 and, via a lens at the other end of the three lenses in lens array 29, is optically coupled to another input port of light receiver 13. Another signal light Lc2 separated by polarization separator 27 travels along direction D2, is reflected at reflector 24, travels along direction D1, is focused by a lens at the other end of lens array 29, and is input to another input port of light receiver 13.

[0052] The optical receiving element 13 is a semiconductor element that demodulates the received signal light Lc input from the external optical transceiver module 10 and converts it into an electrical signal, and is mounted on the receiving element support 35. The optical receiving element 13 uses, for example, InP-type or Si-type semiconductors as its main constituent material. The receiving element support 35 is made of a dielectric material. The dielectric material is, for example, ceramic, which includes at least one of aluminum nitride and aluminum oxide. In this embodiment, the received signal light Lc is a signal light modulated by a PSK method, and the optical receiving element 13 is a so-called optical 90° mixing element. Specifically, the optical receiving element 13 has two signal light input ports and one local oscillator input port. These light input ports are disposed on one side of the optical receiving element 13, with the local oscillator input port located between the two signal light input ports. One signal light input port is optically coupled to the polarization separation filter 27 via a lens array 29, and the signal light Lc1 is focused by the lenses of the lens array 29 and input to this signal light input port. Another signal light input port is optically coupled to mirror 24 via lens array 29. Signal light Lc2 is focused by the lenses of lens array 29 and input to this signal light input port. Local oscillator input port is optically coupled to mirror 23 via lens array 29. Laser La2 is focused by the lenses of lens array 29 and input to the local oscillator input port as local oscillator light.

[0053] Optical receiving element 13 causes signal lights Lc1 and Lc2 to interfere with laser light (local oscillator) La2, respectively. This demodulates the information contained in each of the signal lights Lc1 and Lc2. Specifically, optical receiving element 13 includes a multimode interference waveguide (MMI waveguide) and a photodiode optically coupled to the waveguide. The MMI waveguide is, for example, an optical waveguide formed on an InP substrate. After the laser light La2 is input to optical receiving element 13 from the local oscillator input port, it branches into two local oscillator beams. The MMI waveguide optically interferes with the signal light Lc1 and one of the local oscillator beams branching from the laser La2, performing homodyne or heterodyne detection. Thus, the MMI waveguide separates and demodulates the information contained in the signal light Lc1 into a phase component that is in phase with the local oscillator beam and a phase component that is 90° out of phase with respect to the local oscillator beam. That is, optical receiving element 13 demodulates two independent pieces of information with respect to the signal light Lc1. Similarly, the MMI waveguide optically interferes with the signal light Lc2 and another local oscillator light branching from the laser La2, performing homodyne or heterodyne detection. Thus, the MMI waveguide separates and demodulates the information contained in the signal light Lc2 into a phase component with the same phase as the local oscillator light and a phase component with a 90° phase difference from the local oscillator light. That is, the optical receiving element 13 also demodulates two independent pieces of information with respect to the signal light Lc2. The four independent pieces of information demodulated by the optical receiving element 13 are then processed and sent to the outside of the optical transceiver module 10.

[0054] Temperature regulation device 40 is a structural element used to independently control the temperature of each component of the semiconductor laser element 11 and the optical modulation element 12. For example... Figure 4 As shown, the temperature regulating device 40 has a lower substrate 41, two upper substrates 42 and 43, and two Peltier elements 44 and 45. The lower substrate 41 is a plate-shaped component having a main surface 41a and a back surface 41b. The planar shape of the lower substrate 41 is a rectangle with direction D1 as its length direction. The length of the lower substrate 41 in direction D1 is, for example, 15 mm, and the width of the lower substrate 41 in direction D2 is, for example, 5 mm. The lower substrate 41 is made of a dielectric material. The dielectric material is, for example, ceramic, and the ceramic includes, for example, at least one of aluminum nitride and aluminum oxide.

[0055] The upper substrate 42 is an example of the first mounting part in this embodiment. The upper substrate 42 is a plate-shaped component, and its planar shape is a rectangle with direction D1 as its length direction. The length of the upper substrate 42 in direction D1 is, for example, 5 mm, and the width of the upper substrate 42 in direction D2 is, for example, 4 mm. The upper substrate 42 is disposed on the main surface 41a of the lower substrate 41 via a Peltier element 44, and a semiconductor laser element 11 is mounted on the upper substrate 42. Specifically, the upper substrate 42 is disposed on the Peltier element 44 with direction D3, which intersects (e.g., is orthogonal) both directions D1 and D2, as its thickness direction, and the back surface 32b of the light source base 32 is fixed to the plate surface of the upper substrate 42 on the side opposite to the Peltier element 44. In one example, the light source base 32 and the upper substrate 42 are joined together by a metal bonding material.

[0056] The upper substrate 43 is an example of the second mounting part in this embodiment. The upper substrate 43 is a plate-shaped component, and its planar shape is a rectangle with direction D1 as the length direction. The length of the upper substrate 43 in direction D1 is, for example, 6 mm, and the width of the upper substrate 43 in direction D2 is, for example, 5 mm. As described above, the upper substrate 43 is longer than the upper substrate 42 in direction D1, and the upper substrate 43 is longer than the upper substrate 42 in direction D2. The upper substrate 43 is disposed on the main surface 41a of the lower substrate 41 via the Peltier element 45, and the light modulation element 12 is mounted on the upper substrate 43. Specifically, the upper substrate 43 is disposed on the Peltier element 45 with direction D3 as the thickness direction, and the back surface 34b of the modulation element base 34 is fixed to the plate surface of the upper substrate 43 on the side opposite to the Peltier element 45. In one example, the modulation element base 34 and the upper substrate 43 are joined together by a metal bonding material. The upper substrate 42 and the upper substrate 43 are arranged at intervals in the direction D1.

[0057] Peltier element 44 is an example of the first temperature control element in this embodiment. Peltier element 45 is an example of the second temperature control element in this embodiment. Peltier elements 44 and 45 are arranged spaced apart from each other along direction D1 on the main surface 41a of the lower substrate 41. Peltier elements 44 and 45 are driven by power supplied from outside the optical transceiver module 10 and move thermally between the upper substrates 42 and 43 and the lower substrate 41. The constituent materials of Peltier elements 44 and 45 are, for example, Bi-Sb-Te-Se.

[0058] The intermediate block 50 is a plate-like component disposed between the Peltier elements 44 and 45. In other words, on the main surface 41a of the lower substrate 41, the Peltier elements 44, the intermediate block 50, and the Peltier elements 45 are arranged sequentially along direction D1. In the example shown, the planar shape of the intermediate block 50 is a rectangle with direction D2 as its length direction. The length of the intermediate block 50 in direction D2 is, for example, 5 mm, and the width of the intermediate block 50 in direction D1 is, for example, 4 mm. As described above, in direction D1, the intermediate block 50 is shorter than the upper substrates 42 and 43, and in direction D2, the length of the intermediate block 50 is greater than or equal to the length of the upper substrates 42 and 43. The intermediate block 50 is made of at least one of a metallic material and a dielectric material. The dielectric material is, for example, ceramic, which includes, for example, at least one of aluminum nitride and aluminum oxide. The intermediate block 50 has a main surface 50a and a back surface 50b facing in the opposite direction to the main surface 50a. The main surface 50a and the back surface 50b are parallel to each other. In the example shown, the back surface 50b of the intermediate block 50 is directly fixed to the main surface 41a of the lower substrate 41. Alternatively, the back surface 50b of the intermediate block 50 can also be indirectly fixed to the main surface 41a of the lower substrate 41 via other components.

[0059] like Figure 4 As shown, the mounting surface 32a of the light source base 32, the main surface 50a of the intermediate block 50, and the mounting surface 34a of the modulation element base 34 are arranged sequentially in direction D1 and are coplanar with each other. In other words, the mounting surfaces 32a and 34a and the main surface 50a have the same normal direction, and their heights are equal with reference to the main surface 41a of the lower substrate 41. Figure 1 As shown, a beam splitter 22 is disposed on the main surface 50a of the intermediate block 50. In addition, in the example shown, the mounting surface 32a and the main surface 50a are adjacent to each other without any other clamping, and similarly, the mounting surface 34a and the main surface 50a are adjacent to each other without any other clamping.

[0060] Figure 5 This is a top view showing the temperature regulating device 40. (Example) Figure 5As shown, a metal pattern 48 (first metal film) is provided on the main surface 41a of the lower substrate 41. The metal pattern 48 is formed between the mounting areas of the Peltier element 44 and the mounting areas of the Peltier element 45 in the main surface 41a, and its planar shape is, for example, rectangular or square. When the planar shape of the metal pattern 48 is rectangular or square, one side is along direction D1 and the other side is along direction D2. The metal pattern 48 is formed by depositing metal material on the main surface 41a by vapor deposition, plating, or the like. In one example, the metal pattern 48 includes a Ni layer vapor-deposited on the main surface 41a and an Au layer deposited on the Ni layer.

[0061] Figure 6 This is a bottom view showing the back side 50b of the middle block 50. (Example) Figure 6 As shown, a metal pattern 51 (second metal film) is provided on the back surface 50b of the intermediate block 50. The metal pattern 51 is formed at one end 50ba of the back surface 50b in direction D2, and its planar shape is, for example, rectangular or square. When the planar shape of the metal pattern 51 is rectangular or square, one side is along direction D1 and the other side is along direction D2. The metal pattern 51 is formed by depositing metal material onto the back surface 50b by vapor deposition, plating, or the like. In one example, the metal pattern 51 includes a Ti layer vapor-deposited on the back surface 50b, a Pt layer vapor-deposited on the Ti layer, and an Au layer plated on the Pt layer. Furthermore, the metal pattern 51 of the intermediate block 50 and the metal pattern 48 of the lower substrate 41 are bonded to each other via a metal bonding material, thereby fixing the back surface 50b of the intermediate block 50 to the main surface 41a of the lower substrate 41. Therefore, the area occupied by the metal pattern 48 in the main surface 41a coincides with the bonding area where the lower substrate 41 and the intermediate block 50 are fixed together. Metal bonding materials, for example, are SuAgCu type solders.

[0062] The length Ea of the metal pattern 48 (fixed area) on direction D1 (reference) Figure 5 For example, the width Wa of the metal pattern 48 (fixed area) in a direction orthogonal to direction D1 (e.g., direction D2) is greater than or equal to 10% and less than or equal to 50% of the length Eb of the lower substrate 41 in that direction.

[0063] Refer again Figure 5On the main surface 41a of the lower substrate 41, there are a pair of wirings 46a and 46b for supplying drive current as a control signal to the Peltier element 44; and a pair of wirings 47a and 47b for supplying drive current as a control signal to the Peltier element 45. The ends of wirings 46a and 46b opposite to the Peltier element 44 are connected to bonding pads 46c and 46d, respectively, and the ends of wirings 47a and 47b opposite to the Peltier element 45 are connected to bonding pads 47c and 47d, respectively. The bonding pads 46c, 46d, 47c, and 47d are arranged relative to the Peltier element 44 in direction D2 and are sequentially arranged along the side edge of the main surface 41a extending in direction D1. Furthermore, a pair of wirings 47a and 47b connecting the bonding pads 47c and 47d and the Peltier element 45 extend along the aforementioned side edge of the main surface 41a in direction D1, passing next to the metal pattern 48. That is, the wirings 47a and 47b are arranged side by side with the metal pattern 48 (fixed area) in direction D2.

[0064] like Figure 6 As shown, the back surface 50b of the intermediate block 50 has a region A where the metal pattern 51 is not provided (in other words, the back surface 50b of the intermediate block 50 is exposed). Region A is provided in the direction D2 towards the other end 50bb of the back surface 50b, and is arranged on the other end 50bb side relative to the metal pattern 51. When the intermediate block 50 is disposed on the main surface 41a of the lower substrate 41, the portion of the intermediate block 50 constituting region A is located on the wirings 47a and 47b, covering the wirings 47a and 47b. Since the metal pattern 51 is not provided in region A, even if region A is in contact with the wirings 47a and 47b, short circuits between the wirings 47a and 47b can be avoided.

[0065] Refer again Figure 1 , Figure 2 and Figure 3 The package 30 houses the semiconductor laser element 11, the optical modulation element 12, the optical receiving element 13, and the temperature regulating device 40. The package 30 has a base plate 36 and walls 37. The base plate 36 is a plate-shaped component with a rectangular planar shape. The base plate 36 is primarily made of a metallic material such as CuW or a Korva iron-nickel-cobalt alloy (an alloy in which at least nickel and cobalt are present in iron). One surface of the base plate 36 forms a flat bottom surface 36a that divides the internal space of the package 30. The aforementioned temperature regulating device 40 is disposed on the bottom surface 36a, with the back surface 41b of the lower substrate 41 facing the bottom surface 36a.

[0066] A wall portion 37 is disposed on the bottom surface 36a of the base plate 36, surrounding the semiconductor laser element 11, the optical modulation element 12, and the temperature regulation device 40. The wall portion 37 is a rectangular frame arranged along the four sides of the bottom surface 36a. That is, the wall portion 37 includes: a pair of portions 371 and 372, which are opposite to each other in direction D1 and extend along direction D2; and a pair of portions 373, which are opposite to each other in direction D2 and extend along direction D1. Holes 37b and 37c are formed in portions 371, which pass through portions 371 in direction D1. Holes 37b and 37c are arranged in direction D2, with hole 37b leading out the transmitted signal light Lb to the outside of the package 30, and hole 37c leading in the received signal light Lc from the outside of the package 30. The wall portion 37 is made of, for example, a dielectric material. The dielectric material is, for example, ceramic, which includes, for example, at least one of aluminum nitride and aluminum oxide.

[0067] Additionally, the wall portion 37 has a mounting surface 37a for mounting the light receiving element 13, reflector 23, reflector 24, polarization separator 27, and lens array 29. The mounting surface 37a extends from a portion 373 of the wall portion 37 toward the interior space of the package 30. The mounting surface 37a extends in direction D1 in the same direction as the mounting surface 32a of the light source base 32, the main surface 50a of the intermediate block 50, and the mounting surface 34a of the modulation element base 34, and is arranged in direction D2 relative to the mounting surfaces 32a, 50a, and 34a. In one example, the mounting surface 37a is coplanar with the mounting surfaces 32a, 50a, and 34a.

[0068] The package 30 also has a rectangular frame-shaped component 38 disposed on the wall portion 37. The component 38 is made of a metal such as a Kova iron-nickel-cobalt alloy and is used to secure a cover (outer cover) (not shown) to the wall portion 37.

[0069] like Figure 2 and Figure 3 As shown, to align the intermediate block 50 and the package 30, one or more marks M1 are provided on the side of the main surface 50a of the intermediate block 50 opposite to the mounting surface 37a, and one or more marks M2 corresponding to the marks M1 are provided on the side of the mounting surface 37a of the package 30 opposite to the main surface 50a. By aligning the positions of marks M1 and M2, the relative position of the intermediate block 50 within the package 30 in the direction D1 is precisely positioned. Marks M1 and M2 can have various shapes, such as a cross shape.

[0070] To align the intermediate block 50 and the semiconductor laser element 11, one or more marks M3 are provided on the side of the main surface 50a of the intermediate block 50 opposite to the light source base 32, and one or more marks M4 corresponding to marks M3 are provided on the side of the mounting surface 32a of the light source base 32 opposite to the main surface 50a. By aligning the positions of marks M3 and M4, the relative positions of the intermediate block 50 and the light source base 32 in direction D2, and consequently the relative positions of the intermediate block 50 and the semiconductor laser element 11 in direction D2, are precisely positioned. Furthermore, to align the intermediate block 50 and the optical modulation element 12, one or more marks M5 are provided on the side of the main surface 50a of the intermediate block 50 opposite to the modulation element base 34, and one or more marks M6 corresponding to marks M5 are provided on the side of the mounting surface 34a of the modulation element base 34 opposite to the main surface 50a. By aligning the positions of marker M5 and marker M6, the relative positions of the intermediate block 50 and the modulation element base 34 in direction D2, and consequently the relative positions of the intermediate block 50 and the optical modulation element 12 in direction D2, are precisely positioned. Markers M3, M4, M5, and M6 can have various shapes, such as a cross shape.

[0071] The assembly sequence of the optical transceiver module 10 of this embodiment, which has the above structure, will be explained. Figure 7 This is a flowchart showing the assembly sequence of the optical transceiver module 10. For example... Figure 7 As shown, firstly, as step S1, a package 30 having the above-described structure is prepared. Next, as step S2, a light-receiving element assembly with a light-receiving element 13 mounted on a support 35 for receiving elements is mounted on the mounting surface 37a of the package 30. Next, as step S3, a temperature regulating device 40 is fixed to the bottom surface 36a of the package 30. Next, as step S4, an intermediate block 50 is fixed to the main surface 41a of the lower substrate 41. Next, as step S5, a modulation element assembly with a support 33 for modulation elements and a light modulation element 12 mounted on a base 34 for modulation elements is fixed to the upper substrate 43 of the temperature regulating device 40. Next, as step S6, a wavelength-variable light source assembly with a support 31 for light sources and a semiconductor laser element 11 mounted on a base 32 for light sources is fixed to the upper substrate 42 of the temperature regulating device 40. Furthermore, the order of steps S5 and S6 can be interchanged. Next, as step S7, the beam splitter 22, reflectors 23, 24, and 25, polarization combining filter 26, and polarization separating filter 27 are respectively installed in their designated positions. Then, lens 21 and lens arrays 28 and 29 are respectively installed in their designated positions. Finally, the cover (outer cover) of the package 30 is closed to hermetically seal the internal space of the package 30. After the above steps, the optical transceiver module 10 of this embodiment is manufactured.

[0072] The effects obtained by the optical transceiver module 10 of this embodiment described above will be explained. As described above, in this optical transceiver module 10, a portion of the laser La (laser La1) output from the semiconductor laser element 11 is input to the optical modulation element 12, which generates signal lights Lb1 and Lb2 by modulating the laser La. The remaining portion of the laser La (laser La2) output from the semiconductor laser element 11 is input to the optical receiving element 13, which demodulates the received signal light Lc using the laser La2 (local oscillator light). The Peltier element 44 controls the wavelength of the laser La by controlling the temperature of the semiconductor laser element 11, and the Peltier element 45 suppresses variations in the characteristics of the optical modulation element 12 by keeping its temperature constant. As described above, the Peltier elements 44 and 45 independently control the temperature of the semiconductor laser element 11 and the optical modulation element 12, thus enabling high-precision temperature control. Furthermore, in this optical transceiver module 10, an intermediate block 50 is disposed between Peltier elements 44 and 45, and its back surface 50b is directly or indirectly fixed to the main surface 41a of the lower substrate 41. Thus, the intermediate block 50 prevents warping caused by temperature variations in the lower substrate 41 on which the Peltier elements 44 and 45 are mounted (particularly, warping of the portion between Peltier elements 44 and 45), thereby reducing warping of the lower substrate 41. Therefore, the relative tilt of the optical axis of the semiconductor laser element 11 and the optical modulation element 12 caused by temperature variations can be reduced, suppressing variations in their optical coupling efficiency. Additionally, the stress generated in the Peltier elements 44 and 45 due to warping of the lower substrate 41 can be reduced, improving the reliability of the Peltier elements 44 and 45.

[0073] As in this embodiment, the length Ea of the metal pattern 48 (fixed area) in direction D1 can be greater than or equal to 10% and less than or equal to 50% of the length Eb of the lower substrate 41 in that direction. Since the length Ea of the metal pattern 48 (fixed area) is greater than or equal to 10% of the length Eb of the lower substrate 41, the intermediate block 50 can effectively prevent warping of the lower substrate 41. Furthermore, since the length Ea of the metal pattern 48 (fixed area) is less than or equal to 50% of the length Eb of the lower substrate 41, sufficient space can be ensured in the main surface 41a of the lower substrate 41 for arranging the Peltier elements 44 and 45.

[0074] As in this embodiment, a metal pattern 48 may be provided on the main surface 41a of the lower substrate 41, and a metal pattern 51 may be provided on the back surface 50b of the intermediate block 50. The metal pattern 48 and the metal pattern 51 are fixed to each other by a metal bonding material such as solder. In this case, the intermediate block 50 and the lower substrate 41 are firmly fixed together, which can prevent the peeling between the intermediate block 50 and the lower substrate 41 caused by the warping of the lower substrate 41, and effectively prevent the warping of the lower substrate 41.

[0075] As in this embodiment, the width Wa of the metal pattern 48 (fixed area) in a direction orthogonal to direction D1 (e.g., direction D2) can be greater than or equal to 50% of the width Wb of the lower substrate 41 in that direction. Since the width Wa of the metal pattern 48 (fixed area) is greater than or equal to 50% of the width Wb of the lower substrate 41, the intermediate block 50 can effectively prevent warping of the lower substrate 41.

[0076] As in this embodiment, marks M3 and M5 for aligning the semiconductor laser element 11 and the optical modulation element 12 with the intermediate block 50 can be provided on the main surface 50a of the intermediate block 50. In this case, the relative positions of the semiconductor laser element 11 and the optical modulation element 12, whose spacing has increased due to the clamping of the intermediate block 50, can be aligned with high precision.

[0077] As in this embodiment, marks M1 and M2 for aligning the intermediate block 50 and the package 30 can be provided on the main surface 50a of the intermediate block 50 and the mounting surface 37a of the package 30. In this case, the relative position of the intermediate block 50 with respect to the package 30 can be aligned with high precision, thereby enabling high-precision optical coupling between the light receiving element 13 and the semiconductor laser element 11 disposed on the mounting surface 37a of the package 30.

[0078] As in this embodiment, the temperature regulating device 40 may have wirings 47a and 47b on the main surface 41a of the lower substrate 41, which supply control signals to at least one of the Peltier elements 44 and 45. The wirings 47a and 47b are arranged side by side with the metal pattern 48 (fixed area) in direction D2, and the intermediate block 50 includes portions covering the wirings 47a and 47b. In this case, the area of ​​the intermediate block 50 can be increased, thus ensuring sufficient space for arranging optical components such as the beam splitter 22 on the main surface 50a of the intermediate block 50.

[0079] As in this embodiment, the mounting surface 32a of the light source base 32, the main surface 50a of the intermediate block 50, and the mounting surface 34a of the modulation element base 34 can be coplanar. In this case, the optical axes of the semiconductor laser element 11 and the optical modulation element 12 in the height direction (the normal direction of the main surface 41a of the lower substrate 41) can be aligned with high precision. Furthermore, in this embodiment, the lower substrate 41 is interconnected in the Peltier elements 44 and 45, thus reducing height fluctuations between the upper substrates 42 and 43, and consequently reducing height fluctuations between the mounting surfaces 32a and 34a. Therefore, fluctuations in the coupling efficiency between the semiconductor laser element 11 and the optical modulation element 12 can be reduced.

[0080] As in this embodiment, an optical component (beam splitter 22) for branching the laser La output from the semiconductor laser element 11 can be disposed on the main surface 50a of the intermediate block 50. One of the branched lasers, La1, is input to the optical modulation element 12, and the other laser, La2, is input to the optical receiving element 13. By disposing of the optical component as described above on the main surface 50a of the intermediate block 50, the space on the intermediate block 50 can be utilized efficiently. Alternatively, the beam splitter 22 can be replaced on the main surface 50a of the intermediate block 50, or other optical components can be disposed together with the beam splitter 22.

[0081] (First variation)

[0082] The structure of the optical transceiver module 10 described in the above embodiment, excluding the optical receiving element 13, beam splitter 22, reflectors 23, 24, 25, polarization separator 27, and lens array 29, can be used as an optical transmitting module. The optical transmitting module described above, except for the parts related to the optical receiving element 13, can achieve the same effects as the optical transceiver module 10 described in the above embodiment.

[0083] (Second variation)

[0084] In the above embodiment, the main surface 41a of the lower substrate 41 and the back surface 50b of the intermediate block 50 are fixed together using a metal bonding material such as solder. However, the method of fixing the main surface 41a and the back surface 50b is not limited to a metal bonding material. For example, the main surface 41a and the back surface 50b can also be fixed together with resin. In this case, the intermediate block 50 and the lower substrate 41 can be easily fixed together, which simplifies the manufacturing process.

[0085] (3rd variation)

[0086] Figure 8 and Figure 9 This is a diagram illustrating the structure of the optical transceiver module 10A according to the third variation of the above-described embodiment. Figure 8This is a cutaway perspective view of the optical transceiver module 10A. Figure 9 This is a top view of the optical transceiver module 10A. Furthermore, the lenses 21, 22, 23, 24, 25, 26, 27, and 28 and 29 are omitted from these figures.

[0087] The difference between this variation and the above-described embodiment lies in the shape of the markings M1, M2, M3, M4, M5, and M6. In this variation, the markings M1, M2, M3, M4, M5, and M6 are not cross-shaped, but rather straight lines extending in directions intersecting the sides of the main surface 50a of the intermediate block 50. The shapes described above can achieve the same effect as in the above-described embodiment.

[0088] The optical transmitting module, optical transceiver module, and optical module involved in this invention are not limited to the embodiments described above, and various other modifications are possible. For example, in the optical module involved in this invention, a semiconductor laser element 11 is exemplified as the first optical element, and an optical modulation element 12 is exemplified as the second optical element, but various other optical elements can be used as these optical elements.

[0089] Explanation of the label

[0090] 10, 10A… Optical transceiver module

[0091] 11…Semiconductor laser components

[0092] 12…Optical modulation element

[0093] 13…Optical receiving element

[0094] 21…lens

[0095] 22… Spectrometer

[0096] 23, 24, 25… mirrors

[0097] 26…Polarization combining filter

[0098] 27…Polarization Separation Filter

[0099] 28, 29… Lens array

[0100] 30… Package

[0101] 31… Support for light source

[0102] 32…Light source base

[0103] 32a…mounted surface

[0104] 32b…back

[0105] 33…Support for modulation element

[0106] 34…Base for modulation elements

[0107] 34a…mounted surface

[0108] 34b…back

[0109] 35… Support for receiving element

[0110] 36…base plate

[0111] 36a…bottom surface

[0112] 37…wall section

[0113] 37a…Equipped with

[0114] 37b, 37c...holes

[0115] 38…parts

[0116] 40…Temperature regulating device

[0117] 41…Lower base plate (base plate)

[0118] 41a…Main face

[0119] 41b…back

[0120] 42…Upper substrate (first mounting section)

[0121] 43…Upper substrate (second mounting section)

[0122] 44… Peltier element (first temperature control element)

[0123] 45… Peltier element (second temperature control element)

[0124] 46a, 46b, 47a, 47b… wiring

[0125] 46c, 46d, 47c, 47d… bonding pads

[0126] 48…Metal Pattern (First Metal Film)

[0127] 50… intermediate block

[0128] 50a…Main side

[0129] 50b…back

[0130] 50ba…one end

[0131] 50bb…the other end

[0132] 51…Metallic pattern (second metal film)

[0133] 371, 372, 373… (partial list)

[0134] A… area

[0135] Directions D1, D2, D3…

[0136] La, La1, La2… lasers

[0137] Lb…sends signal light

[0138] Lb1, Lb2… signal light

[0139] Lc…receives signal light

[0140] Lc1, Lc2... signal lights

[0141] M1, M2, M3, M4, M5, M6… markings

Claims

1. An optical transmission module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back surface of the substrate, for housing the semiconductor laser element, the optical modulation element, and the temperature control device; and An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. Optical components are mounted on the intermediate block.

2. The optical transmission module according to claim 1, wherein, The width of the fixing area where the main surface of the substrate and the intermediate block are fixed in a direction orthogonal to the arrangement direction of the first mounting part, the intermediate block and the second mounting part is greater than or equal to 50% of the width of the substrate in that direction.

3. The optical transmission module according to claim 1 or 2, wherein, The main surface of the substrate and the back surface of the intermediate block are fixed together by resin.

4. The optical transmission module according to claim 1 or 2, wherein, The temperature regulating device has wiring on the main surface of the substrate, the wiring supplying control signals to at least one of the first temperature control element and the second temperature control element. The wiring is arranged side-by-side with the fixing area of ​​the substrate and the intermediate block in a direction intersecting the arrangement directions of the first mounting part, the intermediate block and the second mounting part. The intermediate block includes a portion that covers the wiring.

5. An optical transmission module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back surface of the substrate, for housing the semiconductor laser element, the optical modulation element, and the temperature control device; and An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. The length of the fixing area in the direction in which the main surface of the substrate and the intermediate block are fixed together in the arrangement direction of the first mounting part, the intermediate block and the second mounting part is greater than or equal to 10% and less than or equal to 50% of the length of the substrate in that direction.

6. The optical transmission module according to claim 5, wherein, The width of the fixing area where the main surface of the substrate and the intermediate block are fixed in a direction orthogonal to the arrangement direction of the first mounting part, the intermediate block and the second mounting part is greater than or equal to 50% of the width of the substrate in that direction.

7. The optical transmission module according to claim 5 or 6, wherein, The main surface of the substrate and the back surface of the intermediate block are fixed together by resin.

8. The optical transmission module according to claim 5 or 6, wherein, The temperature regulating device has wiring on the main surface of the substrate, the wiring supplying control signals to at least one of the first temperature control element and the second temperature control element. The wiring is arranged side-by-side with the fixing area of ​​the substrate and the intermediate block in a direction intersecting the arrangement directions of the first mounting part, the intermediate block and the second mounting part. The intermediate block includes a portion that covers the wiring.

9. An optical transmission module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back surface of the substrate, for housing the semiconductor laser element, the optical modulation element, and the temperature control device; and An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. A first metal film is disposed on the main surface of the substrate. A second metal film is provided on the back side of the intermediate block. The first metal film and the second metal film are fixed together by a metal bonding material.

10. The optical transmission module according to claim 9, wherein, The main surface of the substrate and the back surface of the intermediate block are fixed together by resin.

11. The optical transmission module according to claim 9 or 10, wherein, The temperature regulating device has wiring on the main surface of the substrate, the wiring supplying control signals to at least one of the first temperature control element and the second temperature control element. The wiring is arranged side-by-side with the fixing area of ​​the substrate and the intermediate block in a direction intersecting the arrangement directions of the first mounting part, the intermediate block and the second mounting part. The intermediate block includes a portion that covers the wiring.

12. An optical transmission module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back surface of the substrate, for housing the semiconductor laser element, the optical modulation element, and the temperature control device; and An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. A mark is provided on the main surface of the intermediate block for aligning the semiconductor laser element and the optical modulation element with the intermediate block.

13. The optical transmission module according to claim 12, wherein, The temperature regulating device has wiring on the main surface of the substrate, the wiring supplying control signals to at least one of the first temperature control element and the second temperature control element. The wiring is arranged side-by-side with the fixing area of ​​the substrate and the intermediate block in a direction intersecting the arrangement directions of the first mounting part, the intermediate block and the second mounting part. The intermediate block includes a portion that covers the wiring.

14. An optical transmission module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back side of the substrate, for housing the semiconductor laser element, the optical modulation element, and the temperature control device; An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate; a first base component, having a mounting surface for mounting the semiconductor laser element and a back side facing in the opposite direction to the mounting surface; as well as The second base component has a mounting surface for mounting the optical modulation element and a back surface facing in the opposite direction to the mounting surface. The intermediate block has a main face facing the opposite direction to the back face. The back side of the first base component is fixed to the first mounting part. The back side of the second base component is fixed to the second mounting part. The mounting surface of the first base component, the main surface of the intermediate block, and the mounting surface of the second base component are coplanar.

15. An optical transceiver module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A light-receiving element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back side of the substrate, for housing the semiconductor laser element, the optical modulation element, the optical receiving element, and the temperature regulating device; as well as An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. Optical components are mounted on the intermediate block.

16. An optical transceiver module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A light-receiving element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back side of the substrate, for housing the semiconductor laser element, the optical modulation element, the optical receiving element, and the temperature regulating device; as well as An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. The intermediate block has a main face facing the opposite direction to the back face. On the main surface of the intermediate block, an optical component is disposed to branch the output light from the semiconductor laser element. One of the branched-out output beams is input to the optical modulation element, and the other is input to the optical receiving element.

17. An optical transceiver module, comprising: Semiconductor laser components; An optical modulation element, which is optically coupled to the semiconductor laser element; A light-receiving element, which is optically coupled to the semiconductor laser element; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a semiconductor laser element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and an optical modulation element is mounted on the second mounting portion. A package having a bottom surface opposite the back side of the substrate, for housing the semiconductor laser element, the optical modulation element, the optical receiving element, and the temperature regulating device; as well as An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. The intermediate block has a main face facing the opposite direction to the back face. The package has a mounting surface that is arranged side-by-side with the main surface of the intermediate block, and the light receiving element is mounted on this mounting surface. Markings are provided on the main surface of the intermediate block and the mounting surface of the package, which are used to align the intermediate block and the package.

18. An optical module, comprising: The first optical element and the second optical element are optically coupled to each other; A temperature regulating device has a substrate, a first mounting portion and a second mounting portion. The substrate has a main surface and a back surface. The first mounting portion is disposed on the main surface of the substrate via a first temperature control element, and a first optical element is mounted on the first mounting portion. The second mounting portion is disposed on the main surface of the substrate via a second temperature control element, and a second optical element is mounted on the second mounting portion. A package having a bottom surface opposite the back surface of the substrate, for housing the first optical element, the second optical element, and the temperature regulating device; and An intermediate block, disposed between the first temperature control element and the second temperature control element, has a back side that is directly or indirectly fixed to the main surface of the substrate. Optical components are mounted on the intermediate block.

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