Dynamic noise shaping filter and corresponding method

By dynamically switching the response through a dynamic filter system, the problem of inconsistent noise tolerance in ion trap systems is solved, improving system performance and functional execution efficiency, especially in the application of ion traps in quantum computers.

CN113659951BActive Publication Date: 2026-06-09HONEYWELL INTERNATIONAL INC

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
HONEYWELL INTERNATIONAL INC
Filing Date
2021-04-08
Publication Date
2026-06-09

AI Technical Summary

Technical Problem

In the prior art, ion trap systems have different noise tolerance requirements when performing different functions, which can lead to improper noise handling affecting system performance.

Method used

A dynamic filter system is adopted, which dynamically switches the filter response through the controller and filter driver. The appropriate filter response is selected according to the functional requirements to shape the signal and ensure that the noise meets the system tolerance requirements.

Benefits of technology

This technology enables dynamic shaping of signal noise during different function executions, improving system performance, particularly the efficiency and stability of ion trap functionality in quantum computers.

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Abstract

The invention is entitled "Dynamic noise shaping filter and corresponding method". Various embodiments provide a method, apparatus, system or computer program product for providing a signal with dynamically shaped noise. In an exemplary embodiment, the system comprises a dynamic filter, wherein the dynamic filter is a filter capable of switching between at least two responses; a signal generator configured to generate a signal; and a controller configured to control operation of the signal generator and to select an operating response from the at least two responses of the dynamic filter. The controller causes the signal generator to generate a signal, which is provided to the dynamic filter, and the controller causes the dynamic filter to filter the signal according to the operating response. The filtered signal is then provided to an electronic component of the system to cause at least a portion of the system to perform a function.
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Description

Technical Field

[0001] Various embodiments relate to apparatus, systems, and methods for dynamically shaping signal noise. For example, some exemplary embodiments relate to the dynamic shaping of noise in signals applied to electrodes of an ion trap. Background Technology

[0002] In various cases, systems with electronic components can be configured to perform multiple functions, and different functions may have different tolerances to noise present in the signals applied to the various electronic components. For example, an ion trap can use a combination of electric and magnetic fields to trap multiple ions in a potential trap. Various functions can be performed to cause ions to move in a specific manner through a portion of the ion trap and / or be contained within a specific portion of the ion trap. These various functions may have different noise tolerances in the signals used to generate the combination of electric and magnetic fields. Through effort, ingenuity, and innovation, many shortcomings of such previous ion traps have been overcome by developing solutions constructed according to embodiments of the present invention, many examples of which are described in detail herein. Summary of the Invention

[0003] Exemplary embodiments provide methods, systems, apparatuses, computer program products, etc., for dynamically shaping noise in signals applied to electronic components of a system. For example, various embodiments provide dynamic filters that have a dynamically adjustable response. In exemplary embodiments, the response of the dynamic filter can be adjusted or switched between two or more responses. For example, exemplary embodiments include an ion trap having multiple electrodes, wherein a signal applied to at least one electrode undergoes dynamic shaping of signal noise based on a function performed within the ion trap.

[0004] According to a first aspect, a system is provided for providing a signal with dynamically shaped noise. In an exemplary embodiment, the system includes: a dynamic filter, wherein the dynamic filter is a filter capable of switching between at least two responses; a signal generator configured to generate a signal; and a controller configured to control the operation of the signal generator and select an operating response from at least two responses of the dynamic filter. The controller causes the signal generator to generate a signal, which is provided to the dynamic filter, and the controller causes the dynamic filter to filter the signal according to the operating response. The filtered signal is then provided to the electronic components of the system to cause at least a portion of the system to perform a function.

[0005] In an exemplary embodiment, the system further includes a filter driver controlled by a controller to activate one or more switches or attenuators of a dynamic filter, thereby selecting an operating response from at least two responses of the dynamic filter. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a combination of a first low-pass filter response and a second low-pass filter response, and the second response being a second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a recombined high-pass filter response and a first low-pass filter response, the high-pass filter response and the first low-pass filter response having the same cutoff frequency, combined with a second low-pass filter response, and the second response being a combination of the first low-pass filter response and the second low-pass filter response, the second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the controller is further configured to: determine a function to be performed via applying a filtered signal to electronic components of the system; and select an operating response from the at least two responses based on the determined function. In an exemplary embodiment, the controller is further configured to: determine a second function to be performed; select a second operational response from at least two responses based on the determined second function; and cause a dynamic filter to filter a second portion of the signal to be filtered based on the second operational response, wherein applying the second portion of the signal to the electronic components of the system causes the system to perform the second function. In an exemplary embodiment, the system is a quantum computer and / or part of a quantum computer. In an exemplary embodiment, the electronic components are electrodes in an ion trap in which a plurality of ions are trapped, at least some of which serve as qubits of the quantum computer.

[0006] According to another aspect, a method is provided for providing a signal with dynamically shaped noise to electronic components of a system. In an exemplary embodiment, the method includes: causing a signal generator to generate a signal by a controller of the system; and causing a dynamic filter to operate in response to an operation, wherein the dynamic filter is a filter capable of switching between at least two responses. The signal generated by the signal generator is provided to the dynamic filter, which filters the signal according to the operation response, and the filtered signal is provided to the electronic components of the system to cause at least a portion of the system to perform a function.

[0007] In an exemplary embodiment, the controller causes a dynamic filter to operate with an operational response by controlling a filter driver, wherein the filter driver is controlled by the controller to activate one or more switches or attenuators of the dynamic filter, thereby selecting an operational response from at least two responses of the dynamic filter. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a combination of a first low-pass filter response and a second low-pass filter response, and the second response being a second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a recombined high-pass filter response and a first low-pass filter response, the high-pass filter response and the first low-pass filter response having the same cutoff frequency, combined with a second low-pass filter response, and the second response being a combination of the first low-pass filter response and the second low-pass filter response, the second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the method further includes: determining, by the controller, a function to be performed via applying a filtered signal to electronic components of the system; and selecting an operational response from the at least two responses by the controller based on the determined function. In an exemplary embodiment, the method further includes: determining a second function to be performed by a controller; selecting a second operational response from at least two responses based on the determined second function by the controller; and causing a dynamic filter to filter a second portion of a signal to be filtered based on the second operational response, wherein applying the second portion of the signal to electronic components of the system causes the system to perform the second function. In an exemplary embodiment, the system is a quantum computer. In an exemplary embodiment, the electronic components are electrodes in an ion trap in which a plurality of ions are trapped, at least some of which serve as qubits of the quantum computer.

[0008] According to another aspect, a computer program product is provided. In an exemplary embodiment, the computer program product includes a non-transitory machine-readable storage medium storing executable instructions that, when executed by a processor of a controller, cause the controller to cause a signal generator to generate a signal; and causes a dynamic filter to operate in response to an operation, wherein the dynamic filter is a filter capable of switching between at least two responses. The signal generated by the signal generator is provided to the dynamic filter, which filters the signal according to the operation response, and the filtered signal is provided to the electronic components of the system to cause at least a portion of the system to perform a function.

[0009] In an exemplary embodiment, the computer program product includes a non-transitory machine-readable storage medium storing executable instructions that, when executed by a processor of a controller, cause the controller to operate a dynamic filter with an operational response by controlling a filter driver, wherein the filter driver is controlled by the controller to activate one or more switches or attenuators of the dynamic filter, thereby selecting an operational response from at least two responses of the dynamic filter. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a combination of a first low-pass filter response and a second low-pass filter response, and the second response being a second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the at least two responses include a first response and a second response, the first response being a recombined high-pass filter response and a first low-pass filter response having the same cutoff frequency, combined with a second low-pass filter response, and the second response being a combination of the first low-pass filter response and the second low-pass filter response, the second low-pass filter response having a higher cutoff frequency than the first low-pass filter response. In an exemplary embodiment, the computer program product includes a non-transitory machine-readable storage medium storing executable instructions that, when executed by a processor of a controller, cause the controller to determine a function to be performed via applying a filtered signal to electronic components of the system; and to select an operational response from at least two responses based on the determined function. In another exemplary embodiment, the computer program product includes a non-transitory machine-readable storage medium storing executable instructions that, when executed by a processor of a controller, cause the controller to determine a second function to be performed; to select a second operational response from at least two responses based on the determined second function; and to cause a dynamic filter to filter a second portion of the signal to be filtered based on the second operational response, wherein applying the second portion of the signal to electronic components of the system causes the system to perform the second function. In another exemplary embodiment, the system is a quantum computer. In yet another exemplary embodiment, the electronic components are electrodes in an ion trap in which a plurality of ions are trapped, at least some of which serve as qubits of the quantum computer. Attached Figure Description

[0010] Therefore, the invention has been described in general terms, and reference will now be made to the accompanying drawings, which are not necessarily drawn to scale, and in which:

[0011] Figure 1 A top view of an exemplary atomic object limiting device that can be used in an exemplary implementation is provided.

[0012] Figure 2This is a block diagram illustrating a system for dynamically shaping signal noise of a signal to be applied to an electrode of an exemplary atomic object limiting device, according to an exemplary embodiment.

[0013] Figure 3 It is a flowchart of various processes, procedures and / or operations that may be executed, for example, by the controller of the atomic object limiting device according to an exemplary embodiment, and dynamically shaping the signal noise of the signal applied to the electrodes of the atomic object limiting device based on the function to be performed by the atomic object limiting device by applying a signal to the electrodes.

[0014] Figure 4 This is a schematic diagram of an exemplary dynamic filter according to an exemplary embodiment.

[0015] Figure 5 This is a schematic diagram of another exemplary dynamic filter according to an exemplary implementation.

[0016] Figure 6 This is a schematic diagram illustrating an exemplary quantum computing system configured to perform dynamic signal noise shaping according to various embodiments.

[0017] Figure 7 A schematic diagram of an exemplary controller for a quantum computer configured to perform dynamic signal noise shaping, according to various implementation schemes, is provided.

[0018] Figure 8 A schematic diagram of an exemplary computing entity of a quantum computer system that can be used according to an exemplary implementation is provided. Detailed Implementation

[0019] The invention will now be described more fully below with reference to the accompanying drawings, which illustrate some, but not all, embodiments of the invention. In fact, the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided to enable this disclosure to meet applicable legal requirements. Unless otherwise specified, the term “or” (also denoted as “ / ”) is used herein in both alternative and combined senses. The terms “illustrative” and “exemplary” are used for examples without an indication of quality level. Unless otherwise specified, the terms “general” and “about” mean within engineering and / or manufacturing limits and / or within the user’s measurement capabilities. Throughout the text, similar reference numerals refer to similar elements.

[0020] In various embodiments, methods, apparatus, systems, computer program products, etc., are provided for generating and providing signals with dynamically shaped noise. For example, the signal may be generated (e.g., by a waveform generator) and applied to electronic components (e.g., electrodes) of a system. Applying the signal to the electronic components causes the system to perform a function. In various embodiments, depending on the signal applied to the electronic components, the system may be configured to perform various functions. In exemplary embodiments, different functions may have different requirements regarding the permissible amount of noise and / or noise frequency in the applied signal. In various embodiments, a dynamic filter is used to filter the signal before applying it (e.g., generated by a waveform generator) to the electronic components (e.g., electrodes) of the system. A dynamic filter is a filter with a dynamically adjustable response. Specifically, a dynamic filter is capable of filtering signals having at least two responses. The operational response currently used to filter the signal may be selected from two or more responses (e.g., via the operation of one or more switches, attenuators, etc.). In addition, the operating response can be dynamically changed as needed and / or required (e.g., during system operation), so that the system can perform various functions through functionally appropriate and / or function-specific shaping of signal noise.

[0021] In an exemplary embodiment, the system is a quantum computer. For example, the system may be a captured ion quantum computer comprising an ion trap with multiple electrodes. Applying a voltage signal to the electrodes causes the ion trap to perform various functions corresponding to moving or holding atomic objects (e.g., ions, atoms, etc.) trapped within the ion trap. For example, the various functions may include transferring an atomic object from one location within the ion trap to another, holding an atomic object at a specific location within the ion trap, enabling the execution of quantum logic gates on the atomic object to cause two atomic objects to exchange positions within the ion trap, moving two atomic objects closer together, moving two atomic objects that are close together apart, etc. Each of these functions may be associated with a function-specific noise tolerance. Based on the function-specific noise tolerance corresponding to the function, a specific response of two or more responses of a dynamic filter may be assigned to that function. Thus, when a waveform generator generates a signal, when that signal is applied to the electrodes of the system (e.g., the ion trap), the system will perform a specific function, and the dynamic filter will be controlled to filter the signal using the response assigned to that function as an operational response. A signal with dynamically shaped noise can then be applied to the electrode, causing the ion trap to perform the function and the noise tolerance of the function to be appropriately satisfied.

[0022] Exemplary atomic object confinement device

[0023] In exemplary embodiments, the system is an atomic object confinement device or includes an atomic object confinement device (also referred to herein as a confinement device). In exemplary embodiments, the confinement device is an ion trap (e.g., a surface ion trap). For example, the ion trap may include a plurality of electrodes configured to receive electrical signals (e.g., voltages) to generate an electric potential field that controls the movement of one or more atomic objects (e.g., ions) within the ion trap.

[0024] Various functions performed to control the movement of one or more atomic objects may have different noise requirements. For example, the noise requirement for performing a transfer function (where an atomic object moves from one location in the ion trap to another location in the ion trap) may be a first noise requirement, and the noise requirement for holding the atomic object at a specific location within the ion trap (e.g., gate operations of a quantum computer where the executable atomic object is a qubit) may be a second noise requirement. In exemplary embodiments, the first and second noise requirements may differ. For example, when performing a transfer function, the execution of that function may be sensitive to noise at a frequency of approximately 1 MHz. In another example, when performing a hold function (e.g., holding an atomic object at a specific location within the ion trap such that a quantum logic gate can be performed on the atomic object), the execution of that function may be sensitive to noise at a frequency of approximately 250 kHz. Therefore, performing a transfer function using noise requirements configured to optimize the performance of the hold function results in a performance degradation of the transfer function. For example, performing a transfer function using noise requirements configured to optimize the performance of the hold function reduces the speed and / or bandwidth of the executable transfer function.

[0025] Figure 1 A top schematic diagram of an exemplary surface ion trap 100 is provided. In exemplary embodiments, the surface ion trap 100 is configured as part of an ion trap chip and / or an ion trap device and / or package. In exemplary embodiments, the surface ion trap 100 is at least partially defined by a plurality of radio frequency (RF) rails 112 (e.g., 112A, 112B). In various embodiments, the ion trap 100 is at least partially defined by a plurality of sequences 114 (e.g., 114A, 114B, 114C) of trap and / or transport (TT) electrodes. In exemplary embodiments, the ion trap 100 is a surface Paul trap with symmetrical RF rails. In various embodiments, the potential generating elements of the limiting device include TT electrodes 116 of the sequences 114 of TT electrodes and / or RF rails 112. In various embodiments, the upper surface of the ion trap 100 has a planarized topology. For example, the upper surface of each of the plurality of RF rails 112 and the upper surface of each of the plurality of sequences 114 of TT electrodes may be substantially coplanar.

[0026] In various embodiments, the ion trap 100 includes a plurality of RF rails 112 and / or is at least partially defined by a plurality of RF rails. The RF rails 112 are formed with substantially parallel longitudinal axes 111 (e.g., 111A, 111B) and have substantially coplanar upper surfaces. For example, the RF rails 112 are substantially parallel such that the distance between the RF rails 112 is approximately constant along the length of the RF rails 112 (e.g., the length of the RF rails along the longitudinal axis 111 of the RF rails 112). For example, the upper surfaces of the RF rails 112 may be substantially flush with the upper surface of the ion trap 100. In an exemplary embodiment, the plurality of RF rails 112 includes two RF rails 112 (e.g., 112A, 112B). In various embodiments, the ion trap 100 may include a plurality of RF rails 112. For example, ion trap 100 may be a two-dimensional ion trap comprising a plurality of (e.g., pairs and / or groups) RF rails 112, wherein each (e.g., pairs and / or groups) of RF rails 112 has substantially parallel longitudinal axes 111. In an exemplary embodiment, a first number of RF rails 112 have longitudinal axes 111 that are substantially parallel to each other, a second number of RF rails 112 have longitudinal axes 111 that are substantially parallel to each other, and the longitudinal axes of the first number of RF rails are substantially non-parallel (e.g., laterally) to the longitudinal axes of the second number of RF rails. Figure 1 An exemplary one-dimensional ion trap 100 with two RF rails 112 is shown, although other embodiments may include additional RF rails in various configurations.

[0027] In various embodiments, two adjacent RF rails 112 may be separated from each other (e.g., insulated) by a longitudinal gap 105. For example, the longitudinal gap (in one or two dimensions) may define a confinement channel or confinement region of the ion trap 100, wherein one or more atomic objects (e.g., ions in the case of the confinement device being the ion trap 100) may be trapped at various locations within the ion trap. In various embodiments, the longitudinal gap 105 defined thereby may extend substantially parallel to the longitudinal axis 111 of the adjacent RF rails 112. For example, the longitudinal gap 105 may extend substantially parallel to the y-axis. In exemplary embodiments, the longitudinal gap 105 may be at least partially filled with an insulating material (e.g., a dielectric material). In various embodiments, the dielectric material may be silicon dioxide (e.g., formed by thermal oxidation) and / or other dielectric and / or insulating materials. In various embodiments, the height of the longitudinal gap 105 (e.g., in the x-direction) is approximately between 40 μm and 500 μm. In various embodiments, one or more sequences 114 of the TT electrode (e.g., a second sequence 114B of the TT electrode) may be disposed and / or formed within the longitudinal gap 105.

[0028] In an exemplary embodiment, a lateral gap may exist between adjacent and / or neighboring electrodes 116 of one or more sequences 114 of electrodes. In an exemplary embodiment, the lateral gap may be an empty space and / or at least partially filled with a dielectric material to prevent electrical communication between adjacent and / or neighboring electrodes. In an exemplary embodiment, the lateral gap between adjacent and / or neighboring electrodes may be in the range of approximately 1 μm to 10 μm.

[0029] In an exemplary embodiment, a longitudinal gap exists between the sequence 114 of TT electrodes and adjacent and / or adjacent RF rails 112. In an exemplary embodiment, the longitudinal gap may be at least partially filled with a dielectric material and / or an insulating material to prevent electrical connection between the TT electrodes 116 in the sequence 114 and the RF rails 112. In an exemplary embodiment, the longitudinal gap between adjacent and / or adjacent electrodes may be in the range of approximately 1 μm to 10 μm.

[0030] In various embodiments, the ion trap 100 may be at least partially defined by a plurality of sequences 114 of TT electrodes (e.g., a first sequence 114A, a second sequence 114B, and a third sequence 114C of TT electrodes). Each sequence 114 of the TT electrodes is formed to extend substantially parallel to a substantially parallel longitudinal axis 111 of the RF rail 112. For example, the plurality of sequences 114 of the TT electrodes may extend substantially parallel to the y-axis, such as... Figure 1 As shown. In various embodiments, the plurality of sequences 114 of the TT electrode includes two, three, four, and / or another number of sequences 114 of the TT electrode. In an exemplary embodiment, the ion trap 100 includes a plurality of sequences 114 of the TT electrode. For example, the ion trap 100 shown is a one-dimensional ion trap including three sequences 114 of the TT electrode. For example, the ion trap 100 may be a two-dimensional ion trap including a plurality of sequences 114 of the TT electrode, each of the plurality of sequences of the TT electrode extending substantially parallel to a substantially parallel longitudinal axis 111 of a corresponding number of RF rails 112. In an exemplary embodiment, a first number of sequences 114 of the TT electrode extends substantially parallel to a substantially parallel longitudinal axis 111 of a first number of RF rails 112, a second number of sequences 114 of the TT electrode extends substantially parallel to a substantially parallel longitudinal axis 111 of a second number of RF rails 112, and the longitudinal axes of the first number of RF rails are substantially non-parallel (e.g., laterally) to the longitudinal axes of the second number of RF rails. In some embodiments, each of the multiple sequences 114 of TT electrodes 116 may be formed with a substantially coplanar upper surface that is substantially coplanar with the upper surface of the RF rail 112.

[0031] In exemplary implementations (e.g., such as) Figures 3-5As shown, a plurality of (e.g., a pair) RF rails 112 may be formed between a first sequence 114A of TT electrodes and a third sequence 114C of TT electrodes, wherein a second sequence 114B of TT electrodes extends along a longitudinal channel 105 between the RF rails 112. For example, each sequence 114 of the TT electrodes may extend in a direction substantially parallel to the longitudinal axis 111 of the RF rails (e.g., in the y-direction). In various embodiments, the upper surface of the sequence 114 of the TT electrodes is substantially coplanar with the upper surface of the RF rails 112.

[0032] In various embodiments, an RF signal may be applied to the RF rail 112 to generate an electric and / or magnetic field that is used to retain ions trapped within the ion trap 110 in directions transverse to the longitudinal direction (e.g., the x and z directions) of the ion trap 110. In various embodiments, a TT voltage may be applied to the TT electrode 116 to generate a time-dependent potential field that causes objects in the object group to traverse corresponding rails to perform deterministic reshaping and / or reordering functions. In various embodiments, a plurality of sequences 114 of the TT electrodes may be combined and biased with TT voltages that facilitate the trapping of at least one atomic object (e.g., an ion) in a potential well above at least one of the upper surfaces of the sequences 114 of the TT electrodes and / or the upper surfaces of the RF rail 112. For example, an electric and / or magnetic field generated at least partially by the voltage applied to the TT electrodes in the sequence 114 of the TT electrodes may trap at least one atomic object in a potential well above the upper surface of the second sequence 114B of the TT electrodes and / or the longitudinal gap 105. Additionally, the TT voltage applied to electrode 116 allows ions trapped in the potential well on the upper surface of the second sequence 114B above the TT electrode and / or in the longitudinal gap 105 to traverse the various functions of the ion trap.

[0033] Depending on factors such as the shape and / or amplitude of the electric and / or magnetic fields and / or the charge on at least one atomic object, at least one atomic object can be stabilized at a specific distance (e.g., approximately 20 μm to approximately 200 μm) above the upper surface of the ion trap 110 (e.g., the coplanar surface of the sequence 114 of the TT electrodes and the RF rails 112). To further facilitate control of the transport of the atomic object along a desired trajectory, in various embodiments, the ion trap 110 can be operated in a low-temperature chamber and / or a vacuum chamber capable of cooling the ion trap to temperatures below 124 Kelvin (e.g., below 100 Kelvin, below 50 Kelvin, below 10 Kelvin, below 5 Kelvin, etc.).

[0034] In various embodiments, the RF rails 112, the sequence of electrodes 114, and / or the confinement potential generated by the RF rails and / or the sequence of electrodes 114 define the confinement plane 103 of the ion trap. In various embodiments, the RF rails 112, the sequence of electrodes 114, and / or the confinement potential generated by the RF rails and / or the sequence of electrodes 114 define the axis 101 of the ion trap.

[0035] In various embodiments, the TT voltage applied to the TT electrode 116 is supplied by one or more connected devices (e.g., such as...). Figure 6 The controller 30 (as shown) is controlled via leads. For example, the TT voltage can be increased or decreased for the TT electrode 116 near a specific ion based on the positive or negative charge on at least one atom, causing the specific ion to traverse a desired trajectory. For example, the controller 30 can control a voltage driver to apply a TT voltage to the TT electrode to generate a time-dependent potential (e.g., a potential that evolves over time), which enables the performance of various functions of the ion trap (e.g., transferring an atom from one location within the ion trap to another, holding an atom at a specific location within the ion trap, enabling the execution of quantum logic gates on the atom, thereby causing two atoms to exchange positions within the ion trap, causing two atoms to move closer together, causing two atoms that are close together to move apart, etc.). In various embodiments, the voltage driver is electrically connected to the TT electrode 116 via a dynamic filter. For example, the dynamic filter can be controlled (e.g., via a filter driver) to dynamically shape noise in the signal applied to the TT electrode 116 based on the function to be performed by the ion trap / in the ion trap via the potential generated by applying a signal to the TT electrode.

[0036] Exemplary dynamic filter system

[0037] Figure 2 An exemplary dynamic filter system 200 according to an exemplary embodiment is shown. In various embodiments, the controller 30 may control one or more waveform generators 210 (e.g., Figure 6A voltage source 50 is shown to apply a signal (e.g., a voltage signal) to an electronic component (e.g., electrode 116) of a system configured to perform multiple functions with different signal noise requirements. For example, as described above, applying a signal to electrode 116 results in the generation of a potential field that can cause one or more functions to be performed on atomic objects trapped within ion trap 100. Different functions have different noise sensitivities and therefore different noise requirements. Thus, dynamic filter system 200 can be used to dynamically shape noise in signals generated by one or more waveform generators 210 (or other signal generators) and applied to electrode 116. In an exemplary embodiment, waveform generator 210 is an arbitrary waveform generator (AWG).

[0038] In various embodiments, the dynamic filter system 200 includes a dynamic filter 215 and a filter driver 205. In various embodiments, the filter driver 205 is controlled by a controller 30 to control the dynamic response of the dynamic filter 215. As described above, the dynamic filter 215 is a filter that can be controlled to switch between / among two or more responses. For example, the response of the dynamic filter 215 can be dynamically controlled to dynamically shape noise in a signal filtered by the dynamic filter. The filter driver 205 can control one or more switches, attenuators, etc., of the dynamic filter 215 to control the operational response. For example, the dynamic filter 215 can influence the signal applied to it via two or more dynamically selectable responses (e.g., via operation of the filter driver 205). The currently selected response (e.g., the response currently acting on the signal applied to the dynamic filter 215) is referred to herein as the operational response. The operational response may be a first response for a first time period, and then, through operation of the filter driver 205, the operational response may be switched to a second response for a second time period.

[0039] In various embodiments, the dynamic filter 205 may include multiple (e.g., two or more) low-pass, high-pass, band-pass, and / or band-stop filter elements. In an exemplary embodiment, a buffer is used to drive multiple filter elements. For example, each filter element may have a variable step attenuator and / or switch at its input, which can be used to include or remove the filter element during the filtering process (e.g., via operation of filter driver 205). In an exemplary embodiment, each filter element is a single-ended type with a Butterworth response. In various embodiments, various other filter elements (e.g., having various responses) may be used. In an exemplary embodiment, the low-impedance sides or ends of the filter elements are connected together. The operating response of the dynamic filter 215 can then be selected to provide a desired operating response by allowing the appropriate series of filter elements to be selected at the input of each filter element via (e.g., via the logic interface of the filter and / or filter driver 205) using the variable step attenuator and / or switch. Schematic diagrams of two exemplary dynamic filters 215 (e.g., exemplary dynamic filter 400 and exemplary dynamic filter 500) are shown in [the diagram]. Figure 4 and Figure 5 As shown in the image.

[0040] Therefore, controller 30 can control waveform generator 210 (e.g., voltage source 50) to provide a specific signal to dynamic filter 215. Controller 30 can also control filter driver 205 to control the operating response of dynamic filter 215. Dynamic filter 215 can receive the signal generated by waveform generator 210 (e.g., voltage source 50) and filter the signal according to the operating response selected by filter driver 205. The filtered signal (e.g., a signal with dynamically shaped noise) is then provided to electrode 116 such that the resulting potential field can be used to perform a function. Furthermore, the filtered signal provided to electrode 116 has an appropriate noise distribution suitable for performing a function via the potential field generated by applying the signal to electrode 116.

[0041] Figure 3 Flowcharts illustrating exemplary processes, procedures, operations, etc., are provided, which may be executed by controller 30 to result in a signal with dynamically shaped noise being provided to electronic components (e.g., electrode 116). For clarity, we focus on applying a signal with dynamically shaped noise to a single electrode 116. However, it should be understood that the system may include multiple waveform generators 210, multiple dynamic filters 215, and multiple corresponding filter drivers 205, such that a signal with dynamically shaped noise can be provided to multiple electrodes 116 and / or other electronic components.

[0042] Starting with step / operation 302, a function execution trigger can be identified. For example, controller 30 (e.g., using...) Figure 7 The processing device 705 shown can read the next command from the command queue. For example, the command may indicate that a specific group of voltages should be applied to a set of electrodes 116 to perform a specific function. Reading the command allows the controller 30 to recognize a function execution trigger. At step / operation 304, the function to be performed is determined. For example, based on the command and / or function execution trigger, the controller 30 (e.g., using the processing device 705, memory 710, etc.) may determine the function to be performed. For example, as described above, in an exemplary embodiment, the function might be to transfer an atomic object from one location within the ion trap to another location within the ion trap, hold an atomic object at a specific location within the ion trap, enable the execution of quantum logic gates on the atomic object, thereby causing two atomic objects to exchange positions within the ion trap, causing two atomic objects to move closer together, causing two atomic objects that are close together to move apart, etc. Based on the determined function, a corresponding response of the dynamic filter can be identified.

[0043] For example, ion trap 100 may include 300 TT electrodes 116. Each TT electrode 116 may be associated with waveform generator 210 and dynamic filter 215, such that the signal applied to each individual TT electrode 116 can be individually customized. For example, the group of electrodes may include twelve electrodes. Based on the identified function to be performed via applying a signal to the twelve electrodes, the response of the dynamic filter corresponding to that function can be identified. The dynamic filter corresponding to the twelve electrodes can then be controlled (e.g., via filter driver 205) to operate with the operational response identified as corresponding to that function.

[0044] For example, at step / operation 306, one or more switches and / or attenuators corresponding to each dynamic filter in the set of electrodes are operated such that the dynamic filters are operated with an operational response corresponding to the determined function. For example, controller 30 (e.g., using driver controller element 715) may cause one or more filter drivers 205 to operate one or more switches and / or attenuators corresponding to each dynamic filter in the set of electrodes 215 such that the filters are operated with an operational response corresponding to the determined function.

[0045] At step / operation 308, the controller 30 causes the waveform generator 210 corresponding to that set of electrodes to generate a signal according to a command and provide the signal to the dynamic filter 205. The dynamic filter 205 filters the signal with a selected operational response (corresponding to the response of the determined function). Thus, the noise of the signal is dynamically shaped according to the function that the signal will cause the system to perform. The filtered signal is then applied to the corresponding electrode, causing the function to be performed.

[0046] In various implementations, the process then returns to step / operation 302 and reads another command corresponding to another function. The operating response of the dynamic filter can be adjusted and / or switched accordingly, such that the dynamic filter filters the next signal using the operating response corresponding to the function that the next signal will cause the system to execute. Therefore, it can be repeated as needed by controller 30. Figure 3 The process shown is to enable the system to perform the desired function.

[0047] First exemplary dynamic filter

[0048] Figure 4 A schematic diagram of an exemplary dynamic filter 400 is shown. In an exemplary embodiment, the dynamic filter 400 includes an input terminal 420 and an output terminal 430. In an exemplary embodiment, the dynamic filter 400 includes filtering elements: a high-pass filter 406, a first low-pass filter 408, and a second low-pass filter 410. In an exemplary embodiment, the high-pass filter 406 and the first low-pass filter 408 have the same cutoff frequency. In an exemplary embodiment, each of the high-pass filter 406, the first low-pass filter 408, and the second low-pass filter 410 has a Butterworth response. It should be understood that the low-pass filter passes frequencies below the cutoff frequency but not frequencies above the cutoff frequency. The high-pass filter passes frequencies above the cutoff frequency but not frequencies below the cutoff frequency. It should be understood that the response of the filter around the cutoff frequency may not be an idealized step function and may include some inversion and / or transition regions.

[0049] In an exemplary embodiment, input 420 receives a signal generated by waveform generator 210. This signal is then separated via splitter 401. A first portion of the separated signal is passed to a first amplifier 402A, and a second portion of the separated signal is passed to a second amplifier 402B. The first portion of the separated signal, after being amplified by the first amplifier 402A, is passed to a first switch / attenuator 404A. The first switch / attenuator 404A controls whether the first portion of the separated signal is passed to a high-pass filter 406. The low-impedance terminal of the high-pass filter 406 communicates with a second low-pass filter 410 via a summing node or combiner 409. The second portion of the separated signal, after being amplified by the second amplifier 402B, is passed to the second switch / attenuator 404B. The second switch / attenuator 404B controls whether the second portion of the separated signal is passed to a first low-pass filter 408. The low-impedance terminal of the low-pass filter 408 communicates with the second low-pass filter 410 via a summing node or combiner 409. For example, the summing node or combiner 409 may receive the result of a first portion of the separated signal interacting with a first amplifier 402A, a first switch / attenuator 404A, and a high-pass filter 406, and may receive the result of a second portion of the separated signal interacting with a second amplifier 402B, a second switch / attenuator 404B, and a first low-pass filter 408. The summing node or combiner 409 may combine the two received portions of the separated signal and provide the combined signal to a second low-pass filter 410.

[0050] In an exemplary embodiment, the dynamic filter 400 can be operated as an operational response to a first response, wherein a first portion of the separated signal is passed to a high-pass filter 406, and a second portion of the separated signal is passed to a first low-pass filter 408, after which the two filtered signals are recombined, and the combined signal is filtered using a second low-pass filter 410. Therefore, the first response is approximately the response corresponding to the second low-pass filter 410 (e.g., in an exemplary embodiment where the high-pass filter 406 and the first low-pass filter 408 have the same cutoff frequency). In an exemplary embodiment, the dynamic filter 400 can be operated as an operational response to a second response, wherein the first portion of the separated signal is not passed to the high-pass filter 406, and the second portion of the separated signal is passed to the first low-pass filter 408, after which the second portion of the separated signal is filtered using the second low-pass filter 410. Therefore, the second response is a dual low-pass filter response. In an exemplary embodiment, the cutoff frequency of the second low-pass filter 410 is a higher frequency than the cutoff frequencies of the first low-pass filter 408 and the high-pass filter 406. In an exemplary embodiment, the dynamic filter 400 can be operated as a third response, wherein a first portion of the separated signal is passed to the high-pass filter 406, and a second portion of the separated signal is not passed to the first low-pass filter 408, after which the first portion of the separated signal is filtered by the second low-pass filter 410. Therefore, the third response is a bandpass filter response across the frequency band between the cutoff frequency of the high-pass filter 406 and the cutoff frequency of the second low-pass filter 410.

[0051] Another exemplary dynamic filter

[0052] Figure 5 A schematic diagram of an exemplary dynamic filter 500 is shown. In an exemplary embodiment, the dynamic filter 500 includes an input terminal 520 and an output terminal 530. In an exemplary embodiment, the dynamic filter 500 includes filtering elements: a first low-pass filter 508 and a second low-pass filter 510. In an exemplary embodiment, each of the first low-pass filter 508 and the second low-pass filter 510 has a Butterworth response.

[0053] In an exemplary embodiment, input 520 receives a signal generated by waveform generator 210. In various embodiments, the signal is provided to a first arm and / or a second arm of a dynamic filter. For example, a signal generated by waveform generator 210 and received by input 520 may be passed to and / or provided (e.g., via leads, traces, etc.) to a first arm including a first buffer 504. The first buffer 504 is configured to receive the signal and adjust the signal for any desired and / or required time delay, such that the timing of the signal being applied to the corresponding electrode can be accurately and / or precisely controlled. The first buffer 504 may then pass the (buffered and / or delayed) signal to a second low-pass filter 510 via a switch / attenuator 502. For example, a signal generated by waveform generator 210 and received by input 520 may be passed to and / or provided (e.g., via leads, traces, etc.) to a second arm including a second buffer 506. The second buffer 506 is configured to receive a signal and adjust the signal for any desired and / or required time delay, such that the timing of the signal being applied to the corresponding electrode can be accurately and / or precisely controlled. The second arm may also include a first low-pass filter 508. For example, the second buffer 506 may pass a (buffered and / or delayed) signal to the first low-pass filter 508. The first low-pass filter may then pass a (filtered, buffered and / or delayed) signal, possibly via a switch / attenuator 502, to the second low-pass filter. The low-impedance terminal of the first low-pass filter 508 is connected to the second low-pass filter 510.

[0054] In various implementations, the operating switch / attenuator 502 determines whether the signal processed by the first arm or the second arm is passed to the second low-pass filter 510. For example, the controller 30 may control the switch / attenuator 502 such that an appropriate signal (e.g., a signal processed / modulated via the first arm or a signal processed / modulated via the second arm) is used for one or more operations performed by the quantum computer, for example, being provided to the second low-pass filter 510.

[0055] In an exemplary embodiment, the dynamic filter 500 can be operated as an operational response to a first response, wherein the signal is buffered and filtered by a second low-pass filter 510. Therefore, the first response is a low-pass filter response. In an exemplary embodiment, the dynamic filter 500 can be operated as an operational response to a second response, wherein the signal is buffered and filtered by a first low-pass filter 508 and a second low-pass filter 510. Therefore, the second response is a dual low-pass filter response. In an exemplary embodiment, the cutoff frequency of the second low-pass filter 510 is a higher frequency than the cutoff frequency of the first low-pass filter 508.

[0056] Technical advantages

[0057] Various implementations provide technical solutions to the technical problem of generating signals and providing them to a system that enables the system to perform different functions with different noise tolerances. For example, in the exemplary system of the captured ion quantum computer described above, the execution of a transmission function may be sensitive to noise at a frequency of about 1 MHz, and the execution of a hold function (e.g., holding an atomic object at a specific location within an ion trap so that quantum logic gates can be executed on the atomic object) may be sensitive to noise at a frequency of about 250 kHz. Current methods for noise shaping of signals include filtering all signals based on the noise tolerance of the function with the most stringent noise tolerance. However, in the described example, using noise requirements configured to optimize the performance of the hold function to perform the transmission function results in a degraded performance of the transmission function. For example, using noise requirements configured to optimize the performance of the hold function to perform the transmission function reduces the speed and / or bandwidth at which the transmission function can be performed. Exemplary implementations provide technical solutions to these technical problems by providing dynamic filters and a method of dynamically shaping the noise of the signal based on the function that the signal will cause the system to perform using dynamic filters. Therefore, exemplary implementations provide technical solutions that result in improved system performance. For example, in the example above, the signal used to perform the transmission function may have noise dynamically shaped based on the noise tolerance of the transmission function, and the signal used to perform the hold function may have noise dynamically shaped based on the noise tolerance of the hold function, so that both the transmission function and the hold function can be performed effectively and the bandwidth / speed of the transmission function is not affected by excessive noise shaping.

[0058] Exemplary quantum computer including ion trap device

[0059] As described above, the dynamic filter can be part of the quantum computer 610. For example, the dynamic filter 215 can be used to dynamically shape noise in the signal applied to the electrodes 116 of the ion trap, which traps atomic objects that serve as qubits for the quantum computer 610. Figure 6A schematic diagram of an exemplary quantum computer system 600 including a confinement device (e.g., ion trap 100) according to an exemplary embodiment is provided. In various embodiments, the quantum computer system 600 includes a computing entity 10 and a quantum computer 610. In various embodiments, the quantum computer 610 includes a controller 30, a cryostat and / or vacuum chamber 40 encapsulating the confinement device (e.g., ion trap 100), and one or more manipulation sources 60. In exemplary embodiments, the one or more manipulation sources 60 may include one or more lasers (e.g., optical lasers, microwave sources, etc.). In exemplary embodiments, beams, pulses, fields, etc., generated by the manipulation sources 60 may be provided to the ion trap 100 via one or more optical paths 66 (e.g., 66A, 66B, 66C). In various embodiments, the one or more manipulation sources 60 are configured to manipulate and / or induce controlled quantum state evolution of one or more atomic objects within the confinement device. For example, in an exemplary embodiment, one or more manipulation sources 60 include one or more lasers that may provide one or more laser beams to the confinement device within the cryostat and / or vacuum chamber 40. In various embodiments, the quantum computer 610 includes one or more voltage sources 50. For example, the voltage source 50 may include multiple TT voltage drivers and / or voltage sources and / or at least one RF driver and / or voltage source. For example, the voltage source 50 may include one or more waveform generators 210. In an exemplary embodiment, the voltage source 50 may be electrically coupled via a dynamic filter 215 to a corresponding potential generating element (e.g., TT electrode 116) of a confinement device (e.g., ion trap 100).

[0060] In various embodiments, computing entity 10 is configured to allow a user to provide input to quantum computer 610 (e.g., via a user interface of computing entity 10) and receive, view, etc., output from quantum computer 610. Computing entity 10 may communicate with controller 30 of quantum computer 610 via one or more wired or wireless networks 20 and / or via direct wired and / or wireless communication. In exemplary embodiments, computing entity 10 may convert, configure, format, etc., information / data, quantum computing algorithms, etc., into a computing language, executable instructions, command sets, etc., that controller 30 can understand and / or implement.

[0061] In various embodiments, controller 30 is configured to control voltage source 50, cryogenic and / or vacuum systems controlling temperature and pressure within cryogenic and / or vacuum chamber 40, manipulation source 60, and / or control various environmental conditions (e.g., temperature, pressure, etc.) within cryogenic and / or vacuum chamber 40, and / or other systems configured to manipulate and / or cause controlled evolution of the quantum states of one or more atomic objects within the confinement device. For example, controller 30 may cause controlled evolution of the quantum states of one or more atomic objects within the confinement device to execute quantum circuits and / or algorithms. In various embodiments, the atomic objects confined within the confinement device serve as qubits of quantum computer 610.

[0062] Exemplary controller

[0063] In various embodiments, a confinement device is incorporated into the quantum computer 610. In various embodiments, the quantum computer 610 also includes a controller 30 configured to control various elements of the quantum computer 610. For example, the controller 30 may be configured to control a voltage source 50, a cryogenic system and / or a vacuum system controlling the temperature and pressure within a cryogenic chamber and / or vacuum chamber 40, a manipulation source 60, and / or control the environmental conditions (e.g., temperature, humidity, pressure, etc.) within the cryogenic chamber and / or vacuum chamber 40, and / or other systems configured to manipulate and / or cause the controlled evolution of the quantum states of one or more atomic objects within the confinement device.

[0064] like Figure 7 As shown, in various embodiments, controller 30 may include various controller elements, including processing element 705, memory 710, driver controller element 715, communication interface 720, analog-to-digital converter element 725, etc. For example, processing element 705 may include a programmable logic device (PLD), complex PLD (CPLD), microprocessor, coprocessor entity, application-specific instruction set processor (ASIP), integrated circuit, application-specific integrated circuit (ASIC), field-programmable gate array (FPGA), programmable logic array (PLA), hardware accelerator, other processing devices and / or circuits, etc., and / or controllers. The term "circuit" may refer to a completely hardware implementation or a combination of hardware and computer program products. In an exemplary embodiment, processing element 705 of controller 30 includes a clock and / or communicates with a clock.

[0065] For example, memory 710 may include non-transitory memory such as volatile and / or non-volatile memory, such as one or more of the following: hard disk, ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, track memory, RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, etc. In various embodiments, memory 710 may store qubit records corresponding to qubits of a quantum computer (e.g., in a qubit record data store, qubit record database, qubit record table, etc.), calibration table, executable queue, computer program code (e.g., one or more computer languages, dedicated controller languages, etc.). In an exemplary embodiment, execution of at least a portion of the computer program code stored in memory 710 (e.g., via processing element 705) causes controller 30 to execute one or more steps, operations, processes, programs, etc., as described herein for applying a signal with dynamically shaped noise to the electrodes of ion trap 100 to perform a function corresponding to the dynamically shaped signal.

[0066] In various embodiments, the drive controller element 715 may include one or more drive and / or controller elements, each configured to control one or more drives. In various embodiments, the drive controller element 715 may include drives and / or drive controllers. For example, a drive controller may be configured to cause one or more corresponding drives to be operated according to executable instructions, commands, etc., scheduled and executed by controller 30 (e.g., by processing element 705). In various embodiments, the drive controller element 715 may enable controller 30 to operate manipulation source 60. In various embodiments, the drive may be a laser drive; a vacuum component drive; a drive for controlling the current and / or voltage applied to TT, RF (e.g., voltage source 50) and / or other electrodes for maintaining and / or controlling the ion trapping potential of ion trap 100 (and / or other drives for providing a sequence of drive actions to the potential generating element of the confinement device); a drive for controlling the operational response of one or more dynamic filters (e.g., filter drive 205); a cryogenic and / or vacuum system component drive; and so on. For example, the driver may control and / or include TT and / or RF voltage drivers and / or voltage sources that provide voltage and / or electrical signals to the TT electrode 116 and / or RF rail 112. In various embodiments, the controller 30 includes devices for transmitting and / or receiving signals from one or more optical receiver components, such as cameras, MEM cameras, CCD cameras, photodiodes, photomultiplier tubes, etc. For example, the controller 30 may include one or more analog-to-digital converter elements 725 configured to receive signals from one or more optical receiver components, calibration sensors, etc.

[0067] In various embodiments, controller 30 may include a communication interface 720 for interacting with and / or communicating with computing entity 10. For example, controller 30 may include communication interface 720 for receiving executable instructions, command sets, etc., from computing entity 10, and providing computing entity 10 with output received from quantum computer 610 (e.g., from a light collection system) and / or the results of processing that output. In various embodiments, computing entity 10 and controller 30 may communicate via a direct wired and / or wireless connection and / or one or more wired and / or wireless networks 20.

[0068] Exemplary computing entity

[0069] Figure 8 An exemplary schematic diagram of an exemplary computing entity 10 that can be used in conjunction with embodiments of the present invention is provided. In various embodiments, the computing entity 10 is configured to allow a user to provide input to the quantum computer 610 (e.g., via a user interface of the computing entity 10) and to receive, display, analyze, etc., output from the quantum computer 610.

[0070] like Figure 8As shown, computing entity 10 may include antenna 812, transmitter 804 (e.g., radio component), receiver 806 (e.g., radio component), and processing element 808, which provides signals to transmitter 804 and receives signals from receiver 806, respectively. The signals provided to transmitter 804 and received from receiver 806 may include information / data signaling according to the applicable air interface standard of the wireless system for communication with various entities such as controller 30, other computing entities 10, etc. In this regard, computing entity 10 may be able to operate using one or more air interface standards, communication protocols, modulation types, and access types. For example, computing entity 10 may be configured to receive and / or provide communication using a wired data transmission protocol such as Fiber Distributed Data Interface (FDDI), Digital Subscriber Line (DSL), Ethernet, Asynchronous Transfer Mode (ATM), Frame Relay, Data over Line Service Interface Data Specification (DOCSIS), or any other wired transmission protocol. Similarly, computing entity 10 can be configured to communicate via a wireless external communication network using any of a variety of protocols, such as General Packet Radio Service (GPRS), Universal Mobile Telecommunications System (UMTS), Code Division Multiple Access 2000 (CDMA2000), CDMA2000 1X (1xRTT), Wideband Code Division Multiple Access (WCDMA), Global System for Mobile Communications (GSM), Enhanced Data Rate Evolution of GSM (EDGE), Time Division Synchronous Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), Evolved Universal Terrestrial Radio Access Network (E-UTRAN), Evolved Data Optimization (EVDO), High Speed ​​Packet Access (HSPA), High Speed ​​Downlink Packet Access (HSDPA), IEEE 802.11 (Wi-Fi), Wi-Fi Direct, 802.16 (WiMAX), Ultra Wideband (UWB), Infrared (IR) protocol, Near Field Communication (NFC) protocol, Wibree, Bluetooth protocol, Wireless Universal Serial Bus (USB) protocol, and / or any other wireless protocol. Computing entity 10 may use such protocols and standards to communicate using the following: Border Gateway Protocol (BGP), Dynamic Host Configuration Protocol (DHCP), Domain Name System (DNS), File Transfer Protocol (FTP), Hypertext Transfer Protocol (HTTP), TLS / SSL / secure HTTP, Internet Message Access Protocol (IMAP), Network Time Protocol (NTP), Simple Mail Transfer Protocol (SMTP), Telnet, Transport Layer Security (TLS), Secure Sockets Layer (SSL), Internet Protocol (IP), Transmission Control Protocol (TCP), User Datagram Protocol (UDP), Datagram Congestion Control Protocol (DCCP), Stream Control Transfer Protocol (SCTP), Hypertext Markup Language (HTML), etc.

[0071] Through these communication standards and protocols, computing entity 10 can communicate with various other entities using concepts such as Unstructured Supplemental Service Message / Data (USSD), Short Message Service (SMS), Multimedia Messaging Service (MMS), Dual-Tone Multi-Frequency Signaling (DTMF), and / or Subscriber Identity Module (SIM) dial pad. Computing entity 10 can also download changes, add-ons, and updates, such as to its firmware, software (e.g., including executable instructions, applications, program modules), and operating system.

[0072] The computing entity 10 may also include a user interface device, which includes one or more user input / output interfaces (e.g., a display 816 coupled to the processing element 808 and / or a speaker / speaker driver, and a touchscreen, keyboard, mouse, and / or microphone coupled to the processing element 808). For example, the user output interface may be configured to provide applications, browsers, user interfaces, interfaces, dashboards, screens, web pages, and / or similar terms used herein that are interchangeably executed on and / or accessible via the computing entity 10 to result in the display or auditory presentation of information / data, and for interaction with it via one or more user input interfaces. The user input interface may include any of a plurality of devices that allow the computing entity 10 to receive data, such as a keypad 818 (hard or soft), a touch display, a voice / speech or motion interface, a scanner, a reader, or other input device. In embodiments including a keypad 818, the keypad 818 may include (or result in the display of) conventional numeric keys (0-9) and associated keys (#, *) for operating the computing entity 10, and may include a full set of alphanumeric keys or a set of keys that can be enabled to provide a full set of alphanumeric keys. In addition to providing input, the user input interface can also be used to activate or deactivate certain functions, such as screen savers and / or sleep modes. Through such input, computing entity 10 can collect information / data, user interactions / inputs, etc.

[0073] The computing entity 10 may also include embeddable and / or removable volatile storage devices or memories 822 and / or non-volatile storage devices or memories 824. For example, non-volatile memory may be ROM, PROM, EPROM, EEPROM, flash memory, MMC, SD memory card, memory stick, CBRAM, PRAM, FeRAM, RRAM, SONOS, track memory, etc. Volatile memory may be RAM, DRAM, SRAM, FPM DRAM, EDO DRAM, SDRAM, DDR SDRAM, DDR2 SDRAM, DDR3 SDRAM, RDRAM, RIMM, DIMM, SIMM, VRAM, cache memory, register memory, etc. The volatile and non-volatile storage devices or memories may store databases, database instances, database management system entities, data, applications, programs, program modules, scripts, source code, object code, bytecode, compiled code, interpreted code, machine code, executable instructions, etc., to implement the functions of the computing entity 10.

[0074] Conclusion

[0075] Those skilled in the art to which this invention pertains will, upon benefiting from the teachings presented in the foregoing description and the accompanying drawings, contemplate numerous modifications and other embodiments of the invention set forth herein. Therefore, it should be understood that the invention is not limited to the specific embodiments disclosed, and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terminology is used herein, it is used only in a general and descriptive sense and not for purposes of limitation.

Claims

1. A system for providing a signal with dynamically shaped noise, The system includes: A dynamic filter, wherein a dynamic filter is a filter capable of switching between at least two responses; A signal generator, configured to generate a signal; A controller configured to determine a function to be performed by the system, control the operation of the signal generator based on the determined function, and select an operating response from the at least two responses of the dynamic filter. Electronic components The controller causes the signal generator to generate a signal, which is provided to the dynamic filter, and the controller causes the dynamic filter to filter the signal according to the operational response in order to dynamically shape noise in the filtered signal. The filtered signal is provided to the electronic components of the system, which are electrodes of an ion trap configured to capture a plurality of ions. The dynamic filter described therein comprises at least two arms parallel to each other and a final filter, each of the at least two arms comprising at least one of a filtering element or a buffer, and the output of the two arms is passed to the final filter via a summing node or a switch controlled by the controller.

2. The system of claim 1, further comprising a filter driver, wherein the filter driver is controlled by the controller to activate one or more switches or attenuators of the dynamic filter, thereby selecting the operating response from the at least two responses of the dynamic filter.

3. The system of claim 1, wherein the at least two responses include a first response and a second response. The first response corresponds to the combined response of the signal passed through a first low-pass filter and a final filter in series, wherein the first low-pass filter is characterized by its first low-pass filter response, and the final filter, which is the second low-pass filter, is characterized by its second low-pass filter response. The second response is the second low-pass filter response, which has a higher cutoff frequency than the first low-pass filter response.

4. The system of claim 1, wherein the at least two responses include a first response and a second response. The first response corresponds to a recombination response of the signal divided into a first part and a second part, the first part passing through a high-pass filter characterized by a high-pass filter response, and then the second part passing through a first low-pass filter characterized by a first low-pass filter response before being recombinated with the second part to form a recombined signal, the recombined signal subsequently passing through the final filter, the final filter being a second low-pass filter characterized by a second low-pass filter response, the high-pass filter response and the first low-pass filter response having the same cutoff frequency, and The second response corresponds to the signal passed through the first low-pass filter and the second low-pass filter connected in series, the second low-pass filter response having a higher cutoff frequency than the first low-pass filter response.

5. The system of claim 1, wherein the controller is further configured to: The function to be performed by the system is determined, at least in part, based on a command queue comprising commands to be executed by the controller, via applying the filtered signal to the electronic components of the system; and The operation response is selected from the at least two responses based on the determined function.

6. The system of claim 5, wherein the controller is further configured to: The second function to be executed by the system is determined at least in part based on the command queue; Based on the determined second function, a second operational response is selected from the at least two responses; and The dynamic filter filters a second portion of the signal to be filtered based on the second operational response, wherein the second portion of the signal is applied to the electronic components of the system to cause the system to perform the second function.

7. The system of claim 1, wherein the system is a quantum computer, and at least some of the plurality of ions are used as qubits of the quantum computer.

8. A method for providing a signal with dynamically shaped noise to electronic components of a system, the method comprising: The system controller determines the functions that will be performed by the system. The system's controller, based on a determined function, causes the signal generator to generate a signal; as well as The controller causes a dynamic filter to operate with operational responses, wherein the dynamic filter is a filter capable of switching between at least two responses. The signal generated by the signal generator is provided to the dynamic filter, which filters the signal according to the operational response to dynamically shape noise in the filtered signal, and the filtered signal is provided to the electronic components of the system, which are electrodes of an ion trap configured to capture multiple ions therein. The dynamic filter includes at least two arms parallel to each other, one or more switches, and a final filter. Each of the at least two arms includes at least one of a filter element or a buffer, and the dynamic filter is operated in response to an operation by controlling the one or more switches to control the outputs of the at least two arms provided to the final filter.

9. The method of claim 8, wherein the controller causes the dynamic filter to operate with the operation response by controlling a filter driver, wherein the filter driver is controlled by the controller to activate one or more switches or attenuators of the dynamic filter, thereby selecting the operation response from the at least two responses of the dynamic filter.

10. The method according to claim 8, further comprising: The controller determines, at least in part, the functions to be performed by the system via the electronic components of the system through applying the filtered signal to the system, the command queue including commands to be executed by the controller; as well as The controller selects the operation response from the at least two responses based on the determined function.