Chip replacement board, package and electrical equipment

Abstract

The present invention relates to a chip replacement board, a package, and an electrical device. The chip replacement board is used to replace a first chip adapted on a target circuit board. The target circuit board is provided with a chip mounting area adapted for the first chip. The pads of the chip mounting area correspond one-to-one with the pins of the first chip. The chip replacement board includes: a substrate, the size of which matches the chip mounting area; a second chip, which is arranged on the substrate and can provide at least all the functions of the first chip; a pin group, which includes a plurality of pins arranged on the substrate, the pins in the pin group correspond one-to-one with the pins of the first chip, so that the pins in the pin group match the pads of the chip mounting area, and the pins in the pin group are electrically connected to the target pins of the second chip, so that the pins in the pin group have the same functions as the corresponding pins of the first chip. The present invention reduces the manufacturing cost of the target circuit board.

Description

Technical Field

[0001] The present invention relates to the field of chips, and in particular to a chip replacement board, a packaging body and an electrical device. Background Art

[0002] With the advancement of chip technology, various industries rely on chips as the core control of their products to achieve intelligentization. However, due to the ever-increasing demand for chips, some chips are in short supply. Traditionally, developing chips to adapt to product circuit boards or redesigning product circuit boards using new chips is time-consuming and costly. Summary of the Invention

[0003] Based on this, it is necessary to provide a chip replacement board and a package that can replace a chip on a target circuit board of an electrical device, and an electrical device containing the chip replacement board or the package.

[0004] On the one hand, an embodiment of the present invention provides a chip replacement board for replacing a first chip adapted on a target circuit board. The target circuit board is provided with a chip mounting area adapted to the first chip, and the solder pads of the chip mounting area correspond one-to-one to the pins of the first chip. The chip replacement board includes: a substrate, the size of the substrate matches the chip mounting area; a second chip, arranged on the substrate, and the second chip can at least provide all the functions of the first chip; a pin group, including a plurality of pins arranged on the substrate, the pins in the pin group correspond one-to-one to the pins of the first chip, so that the pins in the pin group match the solder pads of the chip mounting area, and the pins in the pin group are electrically connected to the target pins of the second chip, so that the pins in the pin group have the same functions as the pins of the corresponding first chip.

[0005] In one embodiment, the pin group includes a first pin group, a second pin group, a third pin group and a fourth pin group, and the target pins include a first type of pins, a second type of pins, a third type of pins and a fourth type of pins; the first pin group is electrically connected to the first type of pins, and is used to input touch key signals and analog signals to the second chip; the second pin group is electrically connected to the second type of pins, and is used to input digital signals to the second chip, and output digital signals generated by the second chip; the third pin group is electrically connected to the third type of pins, and is used to receive power signals and provide power signals to the second chip; the fourth pin group is electrically connected to the fourth type of pins, and is used to connect the second chip to the ground terminal.

[0006] In one embodiment, the substrate is further provided with a power conversion module, which is electrically connected between the third pin group and the third type of pins, and the power conversion module is used to convert the power signal provided by the third pin group into a power signal matching the second chip.

[0007] In one embodiment, the second chip also includes a fifth type of pin for receiving a clock signal of a preset frequency. A crystal oscillator module is also provided on the substrate. The crystal oscillator module is electrically connected to the fifth type of pin. The crystal oscillator module is used to provide a clock signal of a preset frequency to the second chip through the fifth type of pin.

[0008] In one embodiment, a decoupling capacitor is further provided on the chip replacement board, and the decoupling capacitor is electrically connected between the fourth pin group and the fourth type of pins.

[0009] In one embodiment, the pin group includes pins 1 to 10 arranged in sequence on the first side of the substrate in a first direction, and pins 11 to 20 arranged in sequence on the second side of the substrate in a second direction; the first side of the substrate is opposite to the second side of the substrate, and the first direction is opposite to the second direction; the first pin group includes pin 2, pin 4, pins 6 to 8, and pins 18 to 20; the second pin group includes pin 1, pin 3, pin 5, and pins 11 to 17; the third pin group includes pin 10; and the fourth pin group includes pin 9.

[0010] On the other hand, an embodiment of the present invention provides a package body, in which the chip replacement board as described above is arranged. The size of the package body matches the substrate of the chip replacement board, and the package body is provided with an opening for allowing the pin group of the chip replacement board to extend to the outside.

[0011] On the other hand, an embodiment of the present invention provides an electrical device, including a target circuit board, which is provided with a chip mounting area adapted for a first chip; the first chip is the main control chip of the electrical device, the pads of the chip mounting area correspond one-to-one to the pins of the first chip, and the chip mounting area is provided with a chip replacement board as described above, and the pin group of the chip replacement board is welded one-to-one to the pads of the chip mounting area; or the chip mounting area is provided with a package as described above, and the pin group of the chip replacement board in the package is welded one-to-one to the pads of the chip mounting area.

[0012] In one embodiment, the electrical device includes a household appliance.

[0013] In one embodiment, the household appliance includes a juicer, a food processor, a rice cooker, or an ice cream maker.

[0014] After the chip replacement board is placed in the mounting area of the first chip on the target circuit board, the second chip on the board cooperates with the pin group, enabling the second chip to provide the same functions as the first chip through each pin of the pin group. This allows the chip replacement board to replace the first chip on the target circuit board and control the target circuit board without changing the original components and wiring structure of the target circuit board. This allows the chip replacement board, which uses the second chip as its core and is readily available but has an overall lower cost than the first chip, to perfectly replace the first chip, thereby reducing the cost of the target circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the conventional technology, the following briefly introduces the drawings required for use in the embodiments or the conventional technology descriptions. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0016] Figure 1 is a partial schematic diagram of a target circuit board in one embodiment;

[0017] Figure 2 This is a schematic structural diagram of a chip replacement board in one embodiment;

[0018] Figure 3 A schematic diagram of installing a chip replacement board on a target circuit board in one embodiment;

[0019] Figure 4 A schematic structural diagram of a chip replacement board in another embodiment;

[0020] Figure 5 A schematic structural diagram of a chip replacement board in another embodiment;

[0021] Figure 6 FIG. 1 is a schematic diagram of the numbering of pin groups in an embodiment. DETAILED DESCRIPTION

[0022] To facilitate understanding of the present application, the present application will be described more fully below with reference to the accompanying drawings. The accompanying drawings provide embodiments of the present application. However, the present application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to make the disclosure of the present application more thorough and comprehensive.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application pertains. The terms used herein in the specification of this application are for the purpose of describing specific embodiments only and are not intended to limit this application.

[0024] It will be understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor without departing from the scope of this application. The first resistor and the second resistor are both resistors, but they are not the same resistor.

[0025] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if there is transmission of electrical signals or data between the connected circuits, modules, units, etc.

[0026] As used herein, the singular forms "a," "an," and "the" may also include the plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include," "comprising," "having," and the like specify the presence of stated features, integers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, integers, steps, operations, components, parts, or combinations thereof. Furthermore, the term "and / or" as used in this specification includes any and all combinations of the relevant listed items.

[0027] As described in the background, the chip industry is currently facing a chip shortage. The inventors have discovered that this phenomenon is caused by the rapid development of consumer electronics and electric vehicles, which has led many chip manufacturers to focus on producing and selling chips with higher profit margins. This has led to chip shortages in some areas. Traditionally, a chip model is selected during product circuit board design, and the wiring and layout of the product circuit board are adapted to that chip. When chip supply is insufficient, either developing a chip adapted to the product circuit board or reselecting a chip model and redesigning the product circuit board is a long and costly process.

[0028] Please refer to Figures 1 to 3An embodiment of the present invention provides a chip replacement board 10 for replacing a first chip on a target circuit board 100. The target circuit board 100 is provided with a chip mounting area 110 adapted for the first chip, and the solder pads 130 of the chip mounting area 110 correspond one-to-one with the pins of the first chip. Specifically, the target circuit board 100 is a circuit board for an electrical device, and the target circuit board 100 is designed to reserve a corresponding chip mounting area 110 for the first chip. By soldering the pins of the first chip to the solder pads 130 of the chip mounting area 110 in a one-to-one correspondence, the first chip can be placed on the target circuit board 100 to realize the intended functions of the target circuit board 100. For example, the target circuit board 100 can be a main control board, a slave control board, an interface board, etc. of the electrical device. In one specific embodiment, the first chip has analog-to-digital conversion functions, synchronous serial port functions, LCD / LED driver functions, program EEPROM control functions, and touch key functions to realize the intended functions of the target circuit board 100.

[0029] The chip replacement board 10 includes a substrate 11, a second chip 13, and a pin group 15 disposed on the substrate 11. The size of the substrate 11 matches the chip mounting area 110. Specifically, matching the size of the substrate 11 with the chip mounting area 110 means that the size of the substrate 11 is substantially equivalent to that of the chip mounting area 110. The substrate 11 may be different in size from the first chip, but the substrate 11 should ensure that it does not affect the normal operation of the components and wiring around the chip mounting area 110 and that the pin group 15 on the substrate 11 can be easily soldered to the pads 130 of the chip mounting area 110.

[0030] Second chip 13 can at least provide all the functions of the first chip. It should be understood that second chip 13 has at least the same signal reception, processing, and output capabilities as the first chip. That is, second chip 13 can receive at least the same number and signal properties as the first chip, process the received signals with processing power comparable to the first chip, and ultimately output processing results that match those of the first chip. A chip replacement board with second chip 13 as its core can still perform the intended functions of the target circuit board 100 after being soldered to the chip mounting area of the target circuit board 100.

[0031] The pin group 15 includes a plurality of pins arranged on the substrate 11, and the pins in the pin group 15 correspond one-to-one with the pins of the first chip, so that the pins in the pin group 15 match the pads 130 of the chip mounting area 110. Specifically, the pads 130 of the chip mounting area 110 are designed for soldering the pins of the first chip. In order to ensure that the pins of the pin group 15 can be normally soldered to the pads 130 of the chip mounting area 110, the number of pins in the pin group 15 is the same as the number of pins of the first chip, and the pin arrangement of the pin group 15 also matches the arrangement of the pins of the first chip, so as to meet the requirement that they can be normally soldered to the pads 130 of the chip mounting area 110. Common pin forms include gold fingers, stamp holes, etc. The pin group 15 can choose a pin form different from the pin form of the first chip, as long as it is ensured that each pin in the pin group 15 can be stably soldered to the pads 130 of the chip mounting area 110 and can work normally after soldering.

[0032] The pins in the pin group 15 are electrically connected to the target pins of the second chip 13 (the connection method is not shown in the figure) so that the pins in the pin group 15 have the same functions as the pins of the corresponding first chip. The target pins refer to the pins on the second chip 13 that can at least perform the same functions as the pins of the first chip corresponding to the pins of the pin group 15. The first chip uses its own pins as a medium for sending and / or receiving signals with other components on the target circuit board 100. Each pin of the first chip is configured with a specific function to send and / or receive signals of a specific nature. Since the pin definition and pin arrangement of the second chip 13 are not exactly the same as those of the first chip, in order to enable the chip replacement board 10 to replace the first chip and work on the target circuit board 100 without changing the original wiring structure of the target circuit board 100, the pins of the pin group 15 of the chip replacement board 10 are electrically connected to the target pins corresponding to the second chip 13 so that the pins of the pin group 15 have the same functions as the corresponding pins of the first chip.

[0033] It is worth mentioning that in addition to the above requirements, cost should also be fully considered when selecting the pin form of the pin group 15, the material of the substrate 11, and the model of the second chip 13. The overall manufacturing cost of the entire chip replacement board 10 should be lower than that of the first chip or equivalent to that of the first chip.

[0034] After the chip replacement board 10 is placed in the mounting area of the first chip on the target circuit board 100, the second chip 13 on the chip replacement board 10 cooperates with the pin group 15, enabling the second chip 13 to provide the same functions as the pins of the first chip through the pin group 15. This allows the chip replacement board 10 to replace the first chip on the target circuit board 100 and control the target circuit board 100 without changing the original components and wiring structure of the target circuit board 100. This allows the chip replacement board 10, which uses the second chip 13 as its core and has an overall cost lower than the first chip, to perfectly replace the first chip, thereby reducing the cost of the target circuit board 100.

[0035] In one embodiment, the pin group 15 includes a first pin group 15, a second pin group 15, a third pin group 15, and a fourth pin group 15, and the target pins include a first type of pins, a second type of pins, a third type of pins, and a fourth type of pins. It can be understood that, based on the pin function, the pins of the first chip in this embodiment are divided into at least four types on the target circuit board 100. Therefore, there should also be corresponding four types of pin groups 15 in the pin group 15. In order for the pin group 15 to have the same function as the corresponding pins of the first chip, the target pins should have at least the same four types of pins as the first chip. Specifically, the four types of pins of the first chip include pins for inputting touch key signals and analog signals to the first chip, pins for inputting digital signals to the first chip and outputting digital signals generated by the first chip, pins for providing power signals to the first chip, and pins for grounding the first chip.

[0036] To ensure that each pin group 15 has the four functions described above, the first pin group 15 is electrically connected to the first pin group. The first pin group 15 is used to input touch key signals and analog signals to the second chip 13. In other words, the first pin group 15 of the second chip 13 is used to receive touch key signals and analog signals. It is understood that the target circuit board 100 should be equipped with a touch key module, which can be capacitive, resistive, or other types. The touch key signal is the signal generated when the touch key module is triggered. Currently, many electrical devices are equipped with one or more buttons. Users can activate the touch key module by operating a button to select functions, configure parameters, and so on. In this embodiment, the target circuit board 100 is the circuit board of an electrical device equipped with touch keys. Furthermore, the touch key signal is also an analog signal. The analog signal received by the first pin group 15 and the first pin group of the second chip 13 refers to an analog signal other than the touch key signal. The second pin group 15 is electrically connected to the second pin group. The second pin group 15 is used to input digital signals to the second chip 13 and output digital signals generated by the second chip 13. In other words, the second pin group 15 has the function of digital signal IO. The third pin group 15 is electrically connected to the third type of pins, and is used to receive a power signal and provide a power signal to the second chip 13. The power module on the target circuit board 100 sequentially supplies power to the second chip 13 through the third pin group 15 and the third pins. The fourth pin group 15 is electrically connected to the fourth type of pins, and is used to connect the second chip 13 to the ground terminal through the fourth type of pins and the fourth pin group 15.

[0037] In some embodiments, the various pins of the second chip 13 may also have other functions, and only one of the multiple functions multiplexed by the various pins is selected to replace the first chip.

[0038] In one embodiment, the power module on the target circuit board 100 can provide a matching power supply for the first chip, but the power required by the second chip 13 and the first chip may be different. Figure 4 The substrate 11 is further provided with a power conversion module 17. The power conversion module 17 is electrically connected between the third pin group 15 and the third type of pins. The power conversion module 17 is configured to convert the power signal provided by the third pin group 15 into a power signal that matches the second chip 13. In a specific embodiment, the power conversion module 17 may be a DC / DC module.

[0039] In one embodiment, in order to fully utilize the performance of the second chip 13, the second chip 13 requires an external crystal oscillator to provide a high-precision clock signal of a preset frequency. The second chip 13 also includes a fifth type of pin for receiving a clock signal of a preset frequency. Figure 5A crystal oscillator module 19 is also provided on the substrate 11. The crystal oscillator module 19 is electrically connected to the fifth type of pins. The crystal oscillator module 19 is used to provide a clock signal of a preset frequency to the second chip 13 through the fifth type of pins.

[0040] In one embodiment, the chip replacement board 10 is further provided with a decoupling capacitor electrically connected between the fourth pin group 15 and the fourth category pins. Connecting some of the fourth category pins of the second chip 13 to ground via the decoupling capacitor can reduce interference and ensure more stable operation of the second chip 13.

[0041] In one embodiment, Figure 6 As shown, the first chip to be replaced in this embodiment is a 20-pin chip. The first chip is rectangular and has 10 pins on each of its two long sides. On one long side, pins 1 to 10 of the first chip are arranged in sequence in a first direction, and on the other opposite long side, pins 11 to 20 are arranged in sequence in a second direction. In order to maintain a one-to-one correspondence with the pins of the first chip, the pin group 15 is provided. As shown in the figure, the pin group 15 includes pins 1 to 10 (i.e., PIN1 to PIN10) arranged in sequence on the first side of the substrate 11 in a first direction, and pins 11 to 20 (i.e., PIN11 to PIN20) arranged in sequence on the second side of the substrate 11 in a second direction. The first side of the substrate 11 is opposite to the second side of the substrate 11, and the first direction is opposite to the second direction.

[0042] The pins on the first chip used to input touch key signals and analog signals to the first chip are pins 2, 4, 6-8, and 18-20. Therefore, the first pin group 15 of the chip replacement board includes pins 2, 4, 6-8, and 18-20. The pins on the first chip used to input digital signals to the first chip and output digital signals generated by the first chip are pins 1, 3, 5, and 11-17. Therefore, the second pin group 15 of the chip replacement board includes pins 1, 3, 5, and 11-17. The pin on the first chip used to receive and provide power signals to the first chip is pin 10. Therefore, the third pin group 15 of the chip replacement board includes pin 10. The pin on the first chip used to ground the first chip is pin 9. Therefore, the fourth pin group 15 of the chip replacement board includes pin 9.

[0043] An embodiment of the present invention provides a package body, in which a chip replacement board 10 in any of the above-mentioned embodiments is arranged inside the package body, and the size of the package body matches the substrate 11 of the chip replacement board 10. It can be understood that in order to protect, fix, and seal the chip replacement board 10 and reduce the impact of the external environment on the chip replacement board 10, the chip replacement board 10 is packaged using packaging technology. The package body obtained by the packaging process is provided with an opening that allows the pin group 15 of the chip replacement board 10 to extend to the outside, and the pin group 15 of the chip replacement board 10 can be welded to the pad 130 of the chip mounting area 110 on the target circuit board 100. In addition, since there are many choices of packaging forms and packaging materials, the appropriate packaging form and packaging material can be selected to package the chip replacement board 10 based on cost, protection effect, etc.

[0044] An embodiment of the present invention provides an electrical device, including a target circuit board 100, on which a chip mounting area 110 adapted for a first chip is provided. The first chip is the main control chip of the electrical device, and the target circuit board 100 is the main control board of the electrical device. The solder pads 130 of the chip mounting area 110 correspond one-to-one with the pins of the first chip. The chip mounting area 110 is provided with a chip replacement board 10 as described in any of the above-mentioned embodiments. The pin group 15 of the chip replacement board 10 is soldered one-to-one with the solder pads 130 of the chip mounting area 110, so that the chip replacement board 10 replaces the first chip to control the components in the target circuit board 100. Alternatively, the chip mounting area 110 is provided with a package as described in any of the above-mentioned embodiments. The pin group 15 of the chip replacement board 10 is soldered one-to-one with the solder pads 130 of the chip mounting area 110, so that the package replaces the first chip to control the components in the target circuit board 100.

[0045] In one embodiment, the electrical device includes a household appliance. In a specific embodiment, the first chip has analog-to-digital conversion, synchronous serial port functionality, LCD / LED driver functionality, program EEPROM control functionality, and touch key functionality to implement the intended functions of the target circuit board 100. Specifically, the household appliance is equipped with an LCD screen or LED light to display the appliance's status information, gear position, etc. The first chip can access and execute the corresponding program stored in the first chip's storage unit through the synchronous serial port functionality and program EEPROM control functionality, and cooperate with the LCD / LED driver functionality to drive the LCD screen on the target circuit board to display relevant information about the household appliance. The household appliance is also equipped with touch keys, which the user can operate to select functions, gear position, set operating hours, etc. The first chip receives user operation of the touch keys through the touch key functionality and controls the components on the target circuit board that execute the corresponding functions in conjunction with the corresponding program stored in the first chip's storage unit. Taking a juicer as an example, the first chip can control the juicer's motor based on user operation and the corresponding program to blend fruit.

[0046] In one embodiment, the household appliance includes a juicer, a food processor, a rice cooker, or an ice cream maker.

[0047] Throughout this specification, references to terms such as "some embodiments," "other embodiments," and "desired embodiments" indicate that a particular feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. Although these terms are used interchangeably throughout this specification, they do not necessarily refer to the same embodiment or example.

[0048] The technical features of the above embodiments can be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0049] The above embodiments merely illustrate several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent. It should be noted that a person skilled in the art would be able to make various modifications and improvements without departing from the spirit of the present invention, all of which fall within the scope of protection of the present invention. Therefore, the scope of protection of the patent for this invention shall be determined by the appended claims.

Claims

1. A chip replacement board, characterized in that: A chip replacement board is used to replace a first chip adapted on a target circuit board, wherein the target circuit board is provided with a chip mounting area adapted for the first chip, and the pads of the chip mounting area correspond one-to-one with the pins of the first chip. The chip replacement board comprises: a substrate, wherein the size of the substrate matches the chip mounting area; a second chip, disposed on the substrate, wherein the second chip can at least provide all the functions of the first chip; A pin group includes a plurality of pins arranged on the substrate, the pins in the pin group correspond one-to-one with the pins of the first chip so that the pins in the pin group match the pads of the chip mounting area, and the pins in the pin group are electrically connected to the target pins of the second chip so that the pins in the pin group have the same functions as the corresponding pins of the first chip; the target pins include pins for inputting touch key signals and analog signals to the second chip, pins for inputting digital signals to the second chip and outputting digital signals generated by the second chip, pins for receiving power signals and providing the power signals to the second chip, and pins for connecting the second chip to the ground terminal; the pin form of the pin group is different from the pin form of the first chip.

2. The chip replacement board according to claim 1, characterized in that: The pin groups include a first pin group, a second pin group, a third pin group and a fourth pin group, and the target pins include a first type of pins, a second type of pins, a third type of pins and a fourth type of pins; The first pin group is electrically connected to the first type of pins and is used to input touch key signals and analog signals to the second chip; The second pin group is electrically connected to the second type of pins and is used to input digital signals to the second chip and output digital signals generated by the second chip; The third pin group is electrically connected to the third type of pins, and is used to receive a power signal and provide the power signal to the second chip; The fourth pin group is electrically connected to the fourth type of pins and is used to connect the second chip to the ground.

3. The chip replacement board according to claim 2, characterized in that: The substrate is also provided with a power conversion module, which is electrically connected between the third pin group and the third type of pins. The power conversion module is used to convert the power signal provided by the third pin group into a power signal matching the second chip.

4. The chip replacement board according to claim 1, characterized in that: The second chip also includes a fifth type of pin for receiving a clock signal of a preset frequency. A crystal oscillator module is also provided on the substrate. The crystal oscillator module is electrically connected to the fifth type of pin. The crystal oscillator module is used to provide the clock signal of the preset frequency to the second chip through the fifth type of pin.

5. The chip replacement board according to claim 2, characterized in that: The chip replacement board is further provided with a decoupling capacitor, and the decoupling capacitor is electrically connected between the fourth pin group and the fourth type of pins.

6. The chip replacement board according to claim 2, characterized in that: The pin group includes pins 1 to 10 arranged in sequence along a first direction on a first side of the substrate, and pins 11 to 20 arranged in sequence along a second direction on a second side of the substrate; the first side of the substrate is opposite to the second side of the substrate, and the first direction is opposite to the second direction; The first pin group includes pin 2, pin 4, pins 6 to 8, and pins 18 to 20; The second pin group includes pin 1, pin 3, pin 5, and pins 11 to 17; The third pin group includes pin 10; The fourth pin group includes pin No.

9.

7. A package, characterized in that: The chip replacement board according to any one of claims 1 to 6 is arranged inside the package body, the size of the package body matches the substrate of the chip replacement board, and the package body is provided with an opening for allowing the pin group of the chip replacement board to extend outside.

8. An electrical device, comprising a target circuit board, wherein the target circuit board is provided with a chip mounting area adapted for a first chip; the first chip is a main control chip of the electrical device, and the pads of the chip mounting area correspond one-to-one with the pins of the first chip, characterized in that: The chip mounting area is provided with a chip replacement board as described in any one of claims 1 to 6, and the pin group of the chip replacement board is welded to the pads of the chip mounting area in a one-to-one correspondence; or the chip mounting area is provided with a package as described in claim 7, and the pin group of the chip replacement board in the package is welded to the pads of the chip mounting area in a one-to-one correspondence.

9. The electrical equipment according to claim 8, characterized in that: The electrical equipment includes household appliances.

10. The electrical equipment according to claim 9, characterized in that: The household appliances include: a juicer, a food processor, an electric rice cooker or an ice cream machine.

Images