loudspeaker

By designing a dual-layer diaphragm structure, the driving structure and the displacement structure are decoupled, solving the problem of mutual constraints between the driving structure and the displacement structure in existing MEMS loudspeakers, and improving the full-frequency sound pressure output performance of the loudspeaker.

CN113727239BActive Publication Date: 2026-01-20AAC KAITAI TECHNOLOGIES (WUHAN) CO LTD +1
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Patent Information

Application Number
CN202111145144.2
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-09-28
Publication Date
2026-01-20
Estimated Expiration
2041-09-28

AI Technical Summary

Technical Problem

The existing MEMS loudspeaker's driving structure and displacement structure have not been decoupled, resulting in limited vibration displacement and preventing further optimization of loudspeaker performance.

Method used

A double-layer diaphragm structure is adopted, in which the first diaphragm and the second diaphragm have different stiffnesses. The second diaphragm is superimposed on the first diaphragm. The in-plane stress generated by the driver causes the first diaphragm to expand and contract in the in-plane. The second diaphragm constrains the in-plane expansion and contraction of the first diaphragm and induces out-of-plane warping, thereby achieving decoupling between the driving structure and the displacement structure.

Benefits of technology

It achieves high-level sound pressure output across the entire frequency range of the loudspeaker, with the driver only responsible for in-plane stress, avoiding self-warping and improving the overall performance of the loudspeaker.

✦ Generated by Eureka AI based on patent content.

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Abstract

The application provides a loudspeaker, which comprises a base with a receiving cavity and a vibration sound production component received in the receiving cavity, the vibration sound production component comprising a first diaphragm and a second diaphragm fixed to the base, and a driver fixed to the first diaphragm to drive the first diaphragm and the second diaphragm to vibrate and produce sound; wherein the second diaphragm is stacked on the first diaphragm, and the rigidity of the second diaphragm is different from that of the first diaphragm. The loudspeaker architecture of the application realizes decoupling of the depth of the driving structure and the displacement structure, the driver is only responsible for generating in-plane stress, and does not itself occur out-of-plane warping, so that the vibration of the loudspeaker is greatly freed from the influence of the performance of the driver itself, and a high level of sound pressure output in the full frequency band can be easily obtained. In addition, the first diaphragm and the second diaphragm in the loudspeaker of the application can be arbitrarily selected in rigidity and material matching, and the maximum warping displacement scheme can be optimized under the same driving force, so that the performance of the loudspeaker is maximized.
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Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of electro-acoustic conversion, and in particular to a loudspeaker. BACKGROUND

[0002] The loudspeaker is widely used in personal terminals and intelligent electronic devices, and is mainly used for converting electrical signals into sound signals. The traditional loudspeaker usually adopts a moving coil structure, which has very excellent low-frequency performance, but has obvious deficiencies in high-frequency listening. At the same time, the production efficiency of the assembly structure adopted by the traditional loudspeaker is obviously restricted, and the production cost is correspondingly increased.

[0003] In view of the above problems, players in the market are trying to develop a micro loudspeaker based on MEMS (Micro-Electro-Mechanical System). The micro loudspeaker is mainly based on a piezoelectric driving mode, and the use of MEMS technology can effectively improve the efficiency and rapidly expand the production capacity. At the same time, through the control of the piezoelectric driver mode, good high-frequency performance can also be obtained.

[0004] However, according to the existing MEMS loudspeaker structure, the decoupling of the driving structure and the displacement structure cannot be realized, so the driving structure needs to bear the functions of providing power and displacement. The two are mutually restricted, and the vibration displacement of the loudspeaker is still greatly limited, so the further optimization of the overall performance of the loudspeaker cannot be realized.

[0005] Therefore, it is necessary to provide a new loudspeaker to solve the above technical problems. SUMMARY

[0006] The present application aims to at least solve one of the technical problems existing in the prior art, and provides a loudspeaker.

[0007] The present application provides a loudspeaker, which comprises a base having a receiving cavity and a vibration sound generating assembly received in the receiving cavity, the vibration sound generating assembly comprising a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm to drive the first diaphragm and the second diaphragm to vibrate and sound; wherein the second diaphragm is stacked on the first diaphragm, and the stiffness of the second diaphragm is different from that of the first diaphragm.

[0008] Optionally, the first diaphragm is provided with a through hole in the thickness direction thereof, and the driver is arranged in the through hole.

[0009] Optionally, the driver is fixed to the upper surface or the lower surface of the first diaphragm.

[0010] Optionally, the second diaphragm and the driver are arranged on the same side of the first diaphragm.

[0011] Optionally, the second diaphragm is arranged on a different side of the first diaphragm from the driver.

[0012] Optionally, the second diaphragm comprises a plurality of sub-diaphragms.

[0013] The plurality of sub-diaphragms are arranged on the same side of the first diaphragm, or the plurality of sub-diaphragms are arranged on different sides of the first diaphragm.

[0014] Optionally, the first diaphragm has a rigidity less than that of the driver.

[0015] Optionally, the rigidity of the driver is symmetrically distributed along an axis thereof.

[0016] Optionally, the rigidity of the driver is uniformly distributed.

[0017] Optionally, the driver is fixed to the first diaphragm by adhesive.

[0018] In the loudspeaker of the present application, the vibration generating assembly comprises two diaphragms, wherein the first diaphragm corresponds to a transmission structure, the first diaphragm is fixed with a driver and arranged with a second diaphragm, the second diaphragm generates in-plane expansion and contraction effect by accepting in-plane stress generated by the driver, and based on the rigidity difference between the first diaphragm and the second diaphragm, the second diaphragm constrains the in-plane expansion and contraction of the first diaphragm to generate out-of-plane warping, thereby driving the entire system to vibrate out-of-plane. The loudspeaker architecture of the present application realizes deep decoupling of the driving structure and the displacement structure, the driver is only responsible for generating in-plane stress and does not itself warp out-of-plane, so that the vibration of the loudspeaker is greatly freed from the influence of the performance of the driver itself, and a high level of sound pressure output in the full frequency band is easily obtained. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 is a cross-sectional view of a loudspeaker of an embodiment of the present application;

[0020] Figure 2 is a structural schematic diagram of out-of-plane movement of a loudspeaker of another embodiment of the present application;

[0021] Figure 3 is a cross-sectional view of a loudspeaker of another embodiment of the present application;

[0022] Figure 4 is a cross-sectional view of a loudspeaker of another embodiment of the present application;

[0023] Figure 5 is a cross-sectional view of a loudspeaker of another embodiment of the present application. DETAILED DESCRIPTION

[0024] In order for those skilled in the art to better understand the technical solutions of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0025] As shown in Figures 1 to 5 The present application provides a loudspeaker 100, comprising a base 110 with a receiving cavity and a vibration sound production assembly received in the receiving cavity, the vibration sound production assembly comprising a first diaphragm 120 and a second diaphragm 130 fixed to the base 110, and a driver 140 fixed to the first diaphragm 120 to drive the first diaphragm 120 and the second diaphragm 130 to vibrate and produce sound; wherein the second diaphragm 130 is stacked on the first diaphragm 120, and the stiffness of the second diaphragm 130 is different from that of the first diaphragm 120, and the projection of the second diaphragm 130 on the first diaphragm 120 does not overlap.

[0026] As shown in Figure 1 and Figure 2 Based on the above architecture, if a dynamic input carrying an audio signal is applied to the driver 140, the driver 140 accepts the above audio driving signal to generate in-plane stress and strain (please refer to the horizontal arrow direction in Figure 1 and Figure 2 ), and transmits the stress and strain to the first diaphragm 120, and the first diaphragm 120 generates its own in-plane expansion and contraction effect by accepting the stress and strain transmitted by the driver 140, and transmits the in-plane expansion and contraction to the second diaphragm 130, at the same time, the second diaphragm 130 stacked on the first diaphragm 120 has a restraining effect on the in-plane expansion and contraction of the first diaphragm 120, that is, the second diaphragm 130 restricts the in-plane expansion and contraction of the first diaphragm 120, and because the stiffness of the second diaphragm 130 and the stiffness of the first diaphragm 120 are mismatched, the second diaphragm 130 and the first diaphragm 120 together undergo out-of-plane warping (please refer to the upward bending arrow direction in Figure 2 ), driven by the out-of-plane warping displacement, the driver 140 also undergoes up and down vibration out of plane, that is, the entire structure undergoes reciprocating out-of-plane vibration, and restores the audio signal. That is, the first diaphragm of the present example is equivalent to a transmission structure, which completely decouples force and displacement, and the driver is only responsible for generating in-plane stress and does not itself warp, which is equivalent to a driving structure. The first diaphragm and the second diaphragm form a composite warping layer, which is equivalent to a displacement structure.

[0027] It should be noted that the structure of the base in the present example is not specifically limited, for example, it can be in the form of a ring structure, in some embodiments, it can be in the form of a circular ring structure, of course, in other embodiments, it can also be in the form of a triangular ring structure or other polygonal ring structure, etc.

[0028] Specifically, as shown in Figures 1 to 5As shown, the base 110 includes a sidewall forming a receiving cavity, and the first diaphragm 120 and the second diaphragm 130 are fixed to the sidewall. That is, the base 110 surrounds the periphery of the vibrating sound-generating assembly and provides fixed support for the first diaphragm 120 and the second diaphragm 130.

[0029] It should be further noted that this embodiment does not impose specific limitations on the specific architecture between the driver, the first diaphragm, and the second diaphragm in the vibration sound-generating component, as long as it can achieve the decoupling of force and displacement through the first diaphragm.

[0030] Specifically, in some embodiments, such as Figure 1 As shown, the first diaphragm 120 has a through hole along its thickness direction, the driver 140 passes through the through hole, and the second diaphragm 130 is stacked on the upper surface of the first diaphragm 120. That is, in this example, the first diaphragm extends from the edge of the driver toward the side wall of the base.

[0031] It should be understood that in some other embodiments, the first diaphragm is provided with a through hole along its thickness direction, the driver is disposed in the through hole, and the second diaphragm may also be stacked on the lower surface of the first diaphragm, without specific limitation.

[0032] Furthermore, in other embodiments, such as Figure 3 and Figure 4 As shown, the driver 140 can also be fixed to the upper or lower surface of the first diaphragm 120 by adhesive, that is, the driver 140 can span the first diaphragm 120.

[0033] Since the driver in this example is fixed to the surface of the first diaphragm, the second diaphragm and the driver can be disposed on the same side of the first diaphragm. Of course, the second diaphragm and the driver can also be disposed on different sides of the first diaphragm.

[0034] Specifically, please refer to Figure 3 In some embodiments, the driver 140 is fixed to the upper surface of the first diaphragm 120, and the second diaphragm 130 is also stacked on the upper surface of the first diaphragm 120.

[0035] Specifically, please refer to Figure 4 In other embodiments, the driver 140 is fixed to the lower surface of the first diaphragm 120, and the second diaphragm 130 is stacked on the upper surface of the first diaphragm 120.

[0036] It should be understood that, in other embodiments, the positional relationship of the structures in the driving sound-generating assembly can be modified as follows: for example, the driver is fixed to the upper surface of the first diaphragm, and the second diaphragm is stacked on the lower surface of the first diaphragm. Another example is that the driver is fixed to the lower surface of the first diaphragm, and the second diaphragm is stacked on the lower surface of the first diaphragm.

[0037] It should be noted that the second diaphragm of the present example can be a single layer structure or a multi-layer material stack structure. For example, the second diaphragm includes a plurality of sub-diaphragms, which are stacked on the same side of the first diaphragm, or which are stacked on different sides of the first diaphragm.

[0038] Specifically, as shown in FIG. 1B, the second diaphragm 130 includes a first layer of sub-diaphragm 131 and a second layer of sub-diaphragm 132, wherein the first layer of sub-diaphragm 131 is stacked on the upper surface of the first diaphragm 120, and the second layer of sub-diaphragm 132 is stacked on the lower surface of the first diaphragm 120. Of course, in other embodiments, the two layers of sub-diaphragms described above can be stacked on the upper surface of the first diaphragm, or the two layers of sub-diaphragms described above can be stacked on the lower surface of the first diaphragm. Figure 5

[0039] Further, it should be noted that the first diaphragm of the present example can also be a single layer structure or a multi-layer structure, which is not specifically limited.

[0040] Still, it should be noted that since the main function of the first diaphragm is to transmit the stress and strain provided by the driver, the overall stiffness of the first diaphragm should not be too large, otherwise the transmission of stress and strain may be blocked.

[0041] Specifically, in some preferred embodiments, the overall stiffness of the first diaphragm is at least less than the overall stiffness of the driver.

[0042] It should be noted that based on the premise that the stiffness of the first diaphragm and the stiffness of the second diaphragm are different, the first diaphragm and the second diaphragm can be arbitrarily selected to match the stiffness of the material, and the maximum warping displacement can be optimized under the same driving force to maximize the performance of the loudspeaker.

[0043] Further, the stiffness of the driver of the present example should also be reasonably configured. It should be understood that the overall stiffness of the driver should not be too large to prevent the generation of sufficient out-of-plane displacement. Of course, the overall stiffness of the driver should not be too small to prevent the driver from generating its own arch warping.

[0044] Specifically, in some embodiments, the stiffness of the driver is uniformly distributed. Alternatively, in other embodiments, the stiffness of the driver is symmetrically distributed along the central axis thereof, which can prevent the driver from warping itself due to uneven internal stiffness while providing driving force.

[0045] It should be noted that the driver of the present example is a single block, but in fact it should be regarded as a "black box", i.e. a functional body containing multiple layers of complex structures such as electrodes and functional layers, which can contain multiple layers, multiple materials, and even complex spatial structures, but the overall structure is a structure module that generates in-plane stress and transmits functions to the first diaphragm.​

[0046] Specifically, the driver can be a piezoelectric transducer, including a piezoelectric layer and metal electrodes respectively attached to opposite sides of the piezoelectric layer. Of course, the driver can also be an electrostatic transducer or an electromagnetic transducer, without specific limitation.

[0047] Compared with the prior art, in the loudspeaker of the present application, the vibration generating assembly includes two diaphragms, wherein the first diaphragm corresponds to a transmission structure, the first diaphragm is fixed with the driver and is provided with the second diaphragm, the second diaphragm generates in-plane expansion and contraction effect by accepting the in-plane stress generated by the driver, and based on the different stiffness of the first diaphragm and the second diaphragm, the second diaphragm constrains the in-plane expansion and contraction of the first diaphragm to generate out-of-plane warping to drive the whole system to vibrate out of plane. The overall architecture of the loudspeaker of the present application realizes the decoupling of the depth of the driving structure and the displacement structure, the driver is only responsible for generating in-plane stress and does not itself generate out-of-plane warping, so that the vibration of the loudspeaker is greatly freed from the influence of the performance of the driver itself, and a high level of sound pressure output in the full frequency band can be easily obtained. In addition, the first diaphragm and the second diaphragm in the loudspeaker of the present application can be arbitrarily selected in terms of stiffness and material, and the maximum warping displacement scheme can be optimized under the same driving force, so as to maximize the performance of the loudspeaker.

[0048] It can be understood that the above embodiments are only exemplary embodiments adopted for illustrating the principles of the present application, and the present application is not limited thereto. Various modifications and improvements can be made by those of ordinary skill in the art without departing from the spirit and essence of the present application, and these modifications and improvements are also considered to be within the protection scope of the present application.

Claims

1. A speaker comprising a base having a housing cavity and a vibration sound production assembly housed in the housing cavity, characterized in that, The vibration sound production assembly comprises a first diaphragm and a second diaphragm, and a driver fixed to the first diaphragm to drive the first diaphragm and the second diaphragm to vibrate and produce sound; wherein the second diaphragm is laminated on the first diaphragm, and the stiffness of the second diaphragm is different from that of the first diaphragm, and the driver generates in-plane stress-strain to be transmitted to the first diaphragm.

2. The loudspeaker of claim 1, wherein, The first diaphragm is provided with a through hole along the thickness direction of the first diaphragm, and the driver is arranged in the through hole.

3. The loudspeaker of claim 1, wherein, The driver is fixed to the upper surface or the lower surface of the first diaphragm.

4. The loudspeaker of claim 3, wherein, The second diaphragm and the driver are arranged on the same side of the first diaphragm.

5. The loudspeaker of claim 3, wherein, The second diaphragm and the driver are arranged on different sides of the first diaphragm.

6. The loudspeaker of any one of claims 1 to 5, wherein, The second diaphragm comprises a plurality of sub-diaphragms. The plurality of sub-diaphragms are laminated on the same side of the first diaphragm; or the plurality of sub-diaphragms are laminated on different sides of the first diaphragm.

7. The loudspeaker of any one of claims 1 to 5, wherein, The stiffness of the first diaphragm is less than the stiffness of the driver.

8. The loudspeaker of any one of claims 1 to 5, wherein, The stiffness of the driver is symmetrically distributed along the axis thereof.

9. The loudspeaker of any one of claims 1 to 5, wherein, The stiffness of the driver is uniformly distributed.

10. The loudspeaker of claim 3, wherein, The driver is fixed to the first diaphragm by adhesion.

Citation Information

Patent Citations

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    CN103535053A