Optical image stabilization device, electronic device

Abstract

The present invention provides an optical image stabilization device and electronic device that utilize a mobile image sensor chip for motion compensation. The optical image stabilization device comprises an image sensor chip, a carrier, a lower substrate, and a shape memory alloy drive assembly. The image sensor chip is fixedly mounted on the carrier, which is connected to the lower substrate via metal wires to electrically connect the image sensor chip to an external circuit. Driven by the shape memory alloy drive assembly, the image sensor chip and the carrier move in the X and Y directions and rotate in a plane to perform motion compensation for optical image stabilization. The technical solution provided by the present invention utilizes an image sensor chip for motion compensation, and the image sensor chip is electrically connected to the external circuit via metal bonding and / or flip-chip bonding. The structure is simple and image quality can be improved.

Description

Technical Field

[0001] The present invention relates to the field of image imaging technology, and in particular to an optical anti-shake device and electronic equipment that uses a mobile image sensor chip for motion compensation. Background Art

[0002] When taking photos with a handheld portable smart device, the human body's physiological tremors are unavoidable and cannot be overcome through training. As a result, the handheld portable smart device will inevitably shake along with the human body when taking photos, resulting in a decrease in image quality. The most obvious manifestation is blurry and unclear images.

[0003] Existing handheld portable smart devices utilize lens assemblies within their camera modules that can move in the XY axes to compensate for physiological human tremors and produce high-quality images. However, with technological advancements and consumers' ever-increasing demands for image quality, the size of the image sensor in the camera modules of existing handheld portable smart devices has led to a proportional increase in the size and weight of the lens. Traditional methods of compensating for lens movement in the XY axes have become increasingly difficult to move with these heavy lenses. Furthermore, the angles compensated for by these XY axis compensation methods no longer meet consumer demand for image quality.

[0004] In the prior art, the optical image stabilization method provided by the mobile image sensor chip is complex in structure and is mostly used in SLR digital cameras. There are few cases of mass production in handheld portable smart devices. Summary of the Invention

[0005] The purpose of the present invention is to provide an optical image stabilization device and electronic device that uses a mobile image sensor chip for motion compensation, so as to solve the technical problem that in traditional technology, the lens is required to be moved in the XY axis direction for compensation, but the lens is heavy and difficult to move, and the lens is large in size, making it difficult to meet the compensation requirements for certain angles, and therefore insufficient to meet the higher image quality requirements.

[0006] In order to solve the above technical problems, the present invention provides an optical image stabilization device that uses a mobile image sensor chip for motion compensation, comprising:

[0007] Image sensor chip, carrier board, lower substrate and shape memory alloy drive assembly;

[0008] The image sensor chip is fixedly mounted on the carrier board, and the carrier board is connected to the lower substrate via metal wires, so that the image sensor chip is electrically connected to an external circuit.

[0009] The image sensor chip and the carrier plate are driven by a shape memory alloy driving component to move in the X and Y directions and rotate in a plane to perform motion compensation for optical image stabilization.

[0010] Preferably, the metal wires connect the carrier and the lower substrate by bonding and / or welding.

[0011] Preferably, the carrier board is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0012] The circuit wiring unit is adapted to realize electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip;

[0013] The number of the metal wires is less than the number of pads of the image sensor chip.

[0014] Preferably, the carrier plate is further provided with: a rebound component;

[0015] The shape memory alloy driving component is adapted to deform when powered, so as to drive the image sensor chip to move in the X and Y directions and to rotate in a plane, so as to perform motion compensation;

[0016] The rebound component is suitable for driving the image sensor chip to return to its original position through rebound force when the shape memory alloy driving assembly is powered off.

[0017] Preferably, the shape memory alloy driving component includes: a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip to be electrically connected to the external circuit; there are at least two shape memory alloy wires.

[0018] Preferably, the resilient component comprises: an inner mounting frame and a flexure;

[0019] The inner mounting frame is fixedly connected to the carrier plate, and the outer ring of the inner mounting frame is suitable for leading out the flexure;

[0020] The flexure is provided with a plurality of elastic cantilevers, the elastic cantilevers are fixedly connected to the outer fixing frame, and the image sensor chip is suitable for restoring an initial position under the action of the elastic cantilevers.

[0021] Preferably, the elastic cantilever has at least one bent portion, semi-surrounding the inner mounting frame.

[0022] Preferably, the shape memory alloy wire is suitable for being arranged around the image sensor chip, corresponding to the flexure.

[0023] Preferably, the material of the metal wire is any one of gold, copper, silver and aluminum.

[0024] Preferably, the length of the metal wire is greater than 1 mm.

[0025] Preferably, the capacitor unit is arranged around the chip.

[0026] Preferably, the capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the chip.

[0027] Preferably, the image sensor chip is electrically connected to the carrier board through a flip chip bonding method or a metal wire bonding method.

[0028] Preferably, the outer fixing frame is provided on the lower substrate and is suitable for limiting the movement of the image sensor chip within a certain space.

[0029] Preferably, the optical image stabilization device using a mobile image sensor chip for motion compensation further comprises feeding back the displacement of the image sensor chip via a change in resistance of the shape memory alloy wire after power is applied.

[0030] The present invention further provides an electronic device, comprising: an imaging device, wherein the imaging device comprises the optical image stabilization device for performing motion compensation using a mobile image sensor chip as described above.

[0031] Compared with the prior art, the optical image stabilization device and electronic device using a mobile image sensor chip for motion compensation of the present invention have the following beneficial effects:

[0032] In the technical solution provided by the present invention, an image sensor chip is used for motion compensation, wherein the image sensor chip is electrically connected to an external circuit through metal bonding and / or flip-chip bonding. Therefore, the overall structure and manufacturing process are simple, which can improve product yield, reduce manufacturing costs, increase reliability, and improve image quality.

[0033] Furthermore, in the technical solution provided by the present invention, the image sensor chip is mounted on and electrically connected to the carrier board. Circuits are integrated within the carrier board, and the electrical connection between the carrier board and the lower substrate is achieved through gold (metal) wire bonding. This design can reduce external circuitry, thereby reducing the number of gold wires between the carrier board and the lower substrate, and thus reducing the resistance to movement of the carrier board (including the chip).

[0034] Furthermore, the length of the gold wire electrically connecting the carrier and the lower substrate provided by the present invention exceeds 1 mm, thereby increasing the flexibility of the carrier's movement.

[0035] Furthermore, in the technical solution provided by the present invention, a shape memory alloy wire is used to provide a driving force, and an elastic flexure portion is used to provide a restoring force, resulting in a light and simple structure, a small size, and a low cost.

[0036] Furthermore, in the technical solution provided by the present invention, the change in resistance of the shape memory alloy wire during deformation can reflect the displacement of the chip, and there is no need to set a Hall feedback loop to feedback the displacement. The structure is simple, the volume is small, and the cost is low. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] Figures 1 to 4 This is a schematic structural diagram of an optical image stabilization device that uses a mobile image sensor chip for motion compensation in an embodiment of the present invention. DETAILED DESCRIPTION

[0038] The following description sets forth numerous specific details to facilitate a thorough understanding of the present invention. However, the present invention can be implemented in many other ways than those described herein, and those skilled in the art can make similar generalizations without departing from the scope of the present invention. Therefore, the present invention is not limited to the specific implementations disclosed below.

[0039] Secondly, the present invention is described in detail using schematic diagrams. When describing the embodiments of the present invention in detail, for the convenience of explanation, the schematic diagrams are only examples and should not limit the scope of protection of the present invention.

[0040] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and understandable, the method for optical image stabilization of an image sensor of the present invention is described in detail below with reference to the accompanying drawings.

[0041] The technical solution of the present invention provides an optical image stabilization device, which uses an image sensor chip to translate on the XY axis and rotate around the optical axis of the chip to achieve the purpose of optical image stabilization compensation.

[0042] Specifically, the following combination Figures 1 to 4 The implementation method of this case is specifically explained.

[0043] In this embodiment, reference Figure 1 and Figure 2 Specifically, this embodiment provides an optical image stabilization device that uses a mobile image sensor chip for motion compensation, including:

[0044] An image sensor chip 111, a carrier 100 supporting the image sensor chip 111, a lower substrate 200, and metal wires 120 connecting the carrier 100 and the lower substrate 200. A shape memory alloy drive assembly 300 and a rebound component are also provided between the carrier 100 and the lower substrate 200. Driven by the shape memory alloy drive assembly 300, the image sensor chip 111 and the carrier 100 move in the X and Y directions and rotate in a plane to perform motion compensation. The rebound component is adapted to restore the image sensor chip 111 to its original position through its rebound force when the shape memory alloy drive assembly 300 is powered off.

[0045] Furthermore, in this embodiment, an external fixing frame 500 is provided. The external fixing frame 500 is provided on the lower substrate 200 and is suitable for limiting the movement of the image sensor chip 111 within a certain space.

[0046] Specifically, the image sensor chip 111 is fixedly mounted on the carrier 100. The carrier 100 is connected to the lower substrate 200 via the metal wires 120, thereby electrically connecting the image sensor chip 111 to an external circuit (not shown). Driven by a shape memory alloy drive assembly, the image sensor chip 111 and the carrier 100 move in the X and Y directions and rotate in a plane to perform motion compensation.

[0047] Specifically, in this embodiment, the metal wire 120 connects the carrier 100 and the lower substrate 200 by bonding and / or welding.

[0048] Specifically, in this embodiment, the carrier board 100 is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit;

[0049] The circuit wiring unit is suitable for achieving electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip; in this embodiment, the circuit wiring unit on the carrier 100 merges the pins of the image sensor chip 111 through lines to simplify the external circuit of the chip, reduce the connection points between the carrier 100 and the circuit on the lower substrate 200, and make the number of metal wires 120 required to connect between the carrier 100 and the lower substrate 200 less than the number of pads of the image sensor chip 111.

[0050] Gold wire bonding is then used to electrically connect the carrier 100 to the lower substrate 200. This design reduces the number of gold wires between the carrier 100 and the lower substrate 200, thereby reducing the motion resistance of the carrier 100, which carries the image sensor chip 111, during motion compensation required for image stabilization, and increasing flexibility.

[0051] Specifically, in this embodiment, the capacitor unit 330 is disposed around the chip. Preferably, the capacitor unit 330 includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip 111 .

[0052] Specifically, in this embodiment, the image sensor chip 111 is electrically connected to the carrier 100 through a flip chip bonding method or a metal wire bonding method.

[0053] Specifically, in this embodiment, the material of the metal wire is any one of gold, copper, silver, and aluminum.

[0054] Specifically, in this embodiment, the length of the metal wire connecting the carrier 100 and the lower substrate 200 is greater than 1 mm. This ensures the flexibility of the carrier 100 during movement, while improving the reliability of the gold wire and preventing plastic deformation of the gold wire.

[0055] Combine Figure 2 ,refer to Figure 4 Specifically, in this embodiment, the shape memory alloy drive assembly 300 includes a shape memory alloy wire 301, one end of which is electrically connected to the carrier 100 and the other end of which is electrically connected to the lower substrate 200 below the image sensor chip 111, thereby electrically communicating with an external circuit. There are at least two shape memory alloy wires 301, distributed on opposite sides of the carrier 100 to maintain the balance of the carrier's movement. Preferably, there are four shape memory alloy wires 301, evenly distributed on the four sides of the carrier 100.

[0056] The shape memory alloy driving component 300 is adapted to deform when powered, so as to drive the image sensor chip 111 to move in the X and Y directions and to rotate in a plane, so as to perform motion compensation.

[0057] In addition, continue to refer to Figure 1 As shown, in this embodiment, the carrier plate 100 is further provided with: a rebound component;

[0058] The rebound component is adapted to drive the image sensor chip 111 to return to its original position through a rebound force when the shape memory alloy driving assembly 300 is powered off.

[0059] Specifically, in this embodiment, the resilient component includes: an inner mounting frame 240 and a flexure 241;

[0060] The inner mounting frame 240 is fixedly connected to the carrier board 100 , and the outer ring of the inner mounting frame 240 is suitable for leading out the flexible portion 241 ;

[0061] The flexure 241 is provided with multiple elastic cantilevers, which are fixedly connected to the outer fixing frame 500. The image sensor chip is adapted to return to its initial position under the action of these elastic cantilevers. In this embodiment, the elastic cantilevers are L-shaped, semi-enclosing the inner mounting frame 240. One end of each elastic cantilever is connected to one side of the inner mounting frame in the Y direction, and the other end is connected to one side of the outer fixing frame 500 in the Y direction. At least two elastic cantilevers are arranged in the same direction and arrangement, with adjacent cantilevers connected end to end.

[0062] Furthermore, the two mounting ends of the elastic cantilever are not in the same horizontal plane, so that the flexure 241 has a downward elastic preload in the Z-axis direction (-Z direction) applied to the carrier 100, so that the carrier 100 is relatively stably mounted on the lower substrate 200.

[0063] Specifically, in this embodiment, the elastic cantilever has at least one bent portion, which half surrounds the inner mounting frame 240 .

[0064] Specifically, in this embodiment, the shape memory alloy wire 301 is suitable for being disposed around the image sensor chip 111 , corresponding to the flexure 241 .

[0065] Specifically, the rebound force of the flexure 241 is in the opposite direction to the traction force generated by the contraction of the shape memory alloy wire 301 when power is supplied. Thus, when the shape memory alloy wire 301 is de-energized and returns to its original shape, the rebound force provided by the flexure 241 can quickly drive the carrier 100 to return to its original position, thereby ensuring that the position of the image sensor chip 111 is quickly restored to its original position.

[0066] Furthermore, in the technical solution provided by the present invention, the shape memory alloy wire 301 and the flexible portion 241 of the rebound component are arranged between the carrier 100 and the lower substrate 200 in cooperation with each other, ensuring that the carrier 100 can, when powered on, drive the image sensor chip 111 to move and complete the anti-shake position compensation through the shape memory alloy wire 301, and can also, when powered off, quickly drive the image sensor chip 111 to return to its original position under the action of the rebound force of the flexible portion 241.

[0067] Furthermore, the shape memory alloy wire 301 and the flexure 241 of the resilient component are both slender components, which are arranged in cooperation with each other on both sides or around the carrier board 100, and do not occupy too much space of the entire optical image stabilization device that uses a mobile image sensor chip for motion compensation, thereby saving the overall volume of the optical image stabilization device that uses a mobile image sensor chip for motion compensation.

[0068] Specifically, in this embodiment, the optical image stabilization device using a mobile image sensor chip for motion compensation further includes providing feedback on the displacement of the image sensor chip via a change in resistance of the shape memory alloy wire after power is applied. Thus, in the optical image stabilization device using a mobile image sensor chip for motion compensation provided by the present invention, the displacement of the image sensor chip 111 can be reflected by the resistance of the shape memory alloy wire, eliminating the need for a Hall effect feedback loop to provide displacement feedback. This results in a simple structure, compact size, and low cost.

[0069] In addition, an embodiment provided by the present invention also includes an electronic device including a device for performing optical image stabilization using the mobile image sensor chip as described above.

[0070] Although the present invention has been disclosed above in terms of preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art may make possible changes and modifications to the technical solutions of the present invention by using the methods and technical contents disclosed above without departing from the spirit and scope of the present invention. Therefore, any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention without departing from the content of the technical solutions of the present invention shall fall within the scope of protection of the technical solutions of the present invention.

Claims

1. An optical image stabilization device using a mobile image sensor chip for motion compensation, characterized in that: include: Image sensor chip, carrier board, lower substrate and shape memory alloy drive assembly; The image sensor chip is fixedly mounted on the carrier board, and the carrier board is connected to the lower substrate via metal wires, so that the image sensor chip is electrically connected to an external circuit. The metal wires are connected to the carrier and the lower substrate by bonding and / or welding; The image sensor chip and the carrier plate are driven by a shape memory alloy drive assembly to move in the X and Y directions and rotate in the plane to perform motion compensation for optical image stabilization; The shape memory alloy driving component includes a shape memory alloy wire, one end of which is electrically connected to the carrier board, and the other end of which is electrically connected to the lower substrate below the image sensor chip, so as to be electrically connected to an external circuit.

2. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The carrier board is further provided with: a capacitor unit and / or a resistor unit and / or an inductor unit and / or an auxiliary chip, and a circuit wiring unit; The circuit wiring unit is adapted to realize electrical connection between the image sensor chip and the capacitor unit and / or resistor unit and / or inductor unit and / or auxiliary chip; The number of the metal wires is less than the number of pads of the image sensor chip.

3. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The carrier plate is further provided with: a rebound component; The shape memory alloy driving component is adapted to deform when powered, so as to drive the image sensor chip to move in the X and Y directions and to rotate in a plane, so as to perform motion compensation; The rebound component is suitable for driving the image sensor chip to return to its original position through rebound force when the shape memory alloy driving assembly is powered off.

4. The optical image stabilization device for motion compensation using a mobile image sensor chip according to claim 1, wherein: There are at least two shape memory alloy wires.

5. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 3, wherein: The resilient component comprises: an inner mounting frame and a flexure; The inner mounting frame is fixedly connected to the carrier plate, and the outer ring of the inner mounting frame is suitable for leading out the flexure; The flexure is provided with a plurality of elastic cantilevers, the elastic cantilevers are fixedly connected to the outer fixing frame, and the image sensor chip is suitable for restoring an initial position under the action of the elastic cantilevers.

6. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5, wherein: The elastic cantilever has at least one bent portion and semi-surrounds the inner mounting frame.

7. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 5 or 6, characterized in that: The shape memory alloy wire is suitable for being arranged around the image sensor chip and corresponding to the bending portion.

8. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The material of the metal wire is any one of gold, copper, silver and aluminum.

9. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The length of the metal wire is greater than 1 mm.

10. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 2, wherein: The capacitor unit is arranged around the chip.

11. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 10, wherein: The capacitor unit includes a plurality of capacitors arranged in a strip shape and disposed on both sides of the image sensor chip.

12. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The image sensor chip is electrically connected to the carrier board through a flip-chip bonding method or a metal wire bonding method.

13. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 3, wherein: The outer fixing frame is arranged on the lower substrate and is suitable for limiting the movement of the image sensor chip within a certain space.

14. The optical image stabilization device using a mobile image sensor chip for motion compensation according to claim 1, wherein: The displacement of the image sensor chip is fed back through the change in resistance of the shape memory alloy wire after power is applied.

15. An electronic device, characterized in that: The optical image stabilization device comprises the optical image stabilization device for performing motion compensation using a mobile image sensor chip as claimed in any one of claims 1 to 14.

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