Electronic devices

Abstract

The present disclosure relates to electronic devices. An electronic device may include a housing that at least partially defines an interior volume and an exterior surface of the electronic device. The electronic device may also include a display assembly that includes a display layer, a substrate disposed below the display layer, and a substantially continuous sheet of conductive material disposed on the substrate, the sheet of conductive material substantially covering the entire surface of the substrate. A transparent cover may cover the display assembly and may be attached to the housing.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This disclosure claims priority to U.S. Provisional Patent Application No. 63 / 037,987, entitled “ELECTRONIC DEVICE,” filed on June 11, 2020, the entire disclosure of which is hereby incorporated by reference herein. Technical Field

[0003] The embodiments generally relate to electronic devices. More specifically, the embodiments relate to wearable electronic devices. Background Art

[0004] When designing electronic devices, the portability of the devices is increasingly considered, for example, to allow users to use the devices in a variety of situations and environments. In the context of wearable devices, these devices can be designed to include many different functions and operate in many different locations and environments. The components of the electronic device, such as the processor, memory, antenna, display, and other components can partially determine the performance level of the electronic device. In addition, the arrangement of these components relative to each other in the device can also determine the performance level of the electronic device.

[0005] Continued advancements in electronic devices and their components have resulted in considerable improvements in performance. However, existing components and structures of electronic devices may limit the performance levels of such devices. For example, while some components may achieve high performance levels in some cases, including multiple components in a device that is sized to enhance portability may limit the performance of the components, and thus the performance of the device. Therefore, it may be desirable to further customize and arrange components of electronic devices to provide additional or enhanced functionality without introducing or adding undesirable device characteristics. Summary of the invention

[0006] According to some aspects of the present disclosure, an electronic device may include: a housing that at least partially defines an internal volume and an external surface of the electronic device; a display assembly that includes: a display layer; a substrate that is disposed below the display layer; and a substantially continuous sheet of conductive material that is disposed on the substrate and that substantially covers the entire surface of the substrate; and a transparent cover that covers the display assembly and is attached to the housing, the transparent cover at least partially defining the external surface of the electronic device.

[0007] In some examples, the conductive material includes a metal. The conductive material includes copper and gold. The display layer may include a light emitting diode display or an organic light emitting diode display. The device may also include an antenna, wherein the conductive material is in electrical communication with the antenna and includes a radiating element of the antenna. The conductive material defines an electrical ground. The device may also include a spring finger in electrical contact with the conductive material.

[0008] According to some aspects, a display assembly may include: a display layer; a touch-sensitive layer, the touch-sensitive layer covered by the display layer; a substrate, the substrate covered by the touch-sensitive layer and the display layer, the substrate comprising a substantially continuous sheet of conductive material at least partially surrounded by a non-conductive material, the non-conductive material defining a hole connected to the conductive material; and a grounding component, the grounding component attached to the substrate relative to the display layer, the grounding component being electrically connected to the conductive material through the hole.

[0009] In some examples, the conductive material includes copper. The non-conductive material includes a polymer. The grounding component includes a spring finger. The hole may include a first hole, and the spring finger includes a connecting portion defining a second hole, the second hole covering the first hole. The device may also include solder positioned on the first hole and the second hole, the solder being electrically connected to the spring finger and the conductive material. The solder is applied by a jet-based soldering process. The hole may include a first hole, and the non-conductive material defines a second hole in communication with the conductive material. The first hole is positioned proximate to a first edge of the substrate, and the second hole is positioned proximate to a second, different edge of the substrate.

[0010] According to some aspects, a display assembly may include: a display layer; a substrate covered by the display layer, the substrate comprising a substantially continuous sheet of conductive material at least partially surrounded by a non-conductive material, the non-conductive material defining a first hole in communication with the conductive material; and a grounding component, the grounding component comprising: an insulating body; a first contact portion extending from the body and defining a second hole covering the first hole; a second contact portion extending from the body and configured to be electrically connected to an operating component; and a tuning component disposed on the body and defining an electrical communication path between the first contact portion and the second portion.

[0011] In some examples, the tuning component has an inductance between 1 nH and 10 nH. The tuning component has an adjustable inductance, an adjustable capacitance, or an adjustable resistance. The device may also include an antenna, wherein the second contact portion is in electrical communication with the antenna. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The present disclosure will be readily understood through the following detailed description in conjunction with the accompanying drawings, in which like reference numerals refer to like structural elements, and in which:

[0013] Figure 1A A perspective view of an electronic device is shown.

[0014] Figure 1B A top perspective view of an electronic device is shown.

[0015] Figure 1C Shows Figure 1B A bottom perspective view of an electronic device.

[0016] Figure 1D An exploded view of the electronic device is shown.

[0017] Figure 2A A top cutaway view of an electronic device is shown.

[0018] Figure 2B Shows Figure 2A Perspective view of a battery for an electronic device.

[0019] Figure 2C Shows Figure 2A A cross-sectional view of an electronic device.

[0020] Figure 2D Shows Figure 2A A side view of components of an electronic device.

[0021] Figure 3A A side view of components of an electronic device is shown.

[0022] Figure 3B Shows Figure 3A A perspective view of the components.

[0023] Figure 4A Shown are a top view and a close-up view of a portion of an electronic device.

[0024] Figure 4B Shows Figure 4A view of components of electronic device.

[0025] Figure 4C Shows Figure 4A A cross-sectional view of a component of an electronic device.

[0026] Figure 4D Shows Figure 4A view of components of electronic device.

[0027] Figure 4E Shown in an alternative configuration Figure 4A view of components of electronic device.

[0028] Figure 5A An exploded view of a portion of an electronic device is shown.

[0029] Figure 5B Shows Figure 5A A cross-sectional view of an electronic device.

[0030] Figure 5C Shows Figure 5A An exploded view of the components of an electronic device.

[0031] Fig. 6A A top cutaway view of an electronic device is shown.

[0032] Figure 6B Shows Fig. 6A A cross-sectional view of a portion of an electronic device.

[0033] Figure 6C Shows Fig. 6A A cross-sectional view of a component of an electronic device.

[0034] Fig.6D Shows Fig. 6A Rear view of components of an electronic device.

[0035] Fig. 7A A partially disassembled view of the electronic device is shown.

[0036] Figure 7B Shows Fig. 7A view of a part of an electronic device.

[0037] Figure 7C Shows Fig. 7A view of a part of an electronic device.

[0038] Fig. 8A A bottom perspective view of a portion of an electronic device is shown.

[0039] Figure 8B Shows Fig. 8A A bottom perspective view of a portion of an electronic device.

[0040] Figure 8C Shows Fig. 8A view of a part of an electronic device.

[0041] Fig.8D Shows Fig. 8A view of a part of an electronic device.

[0042] Fig. 9 A perspective view of components of an electronic device is shown.

[0043] Fig. 10A An exploded view of a portion of an electronic device is shown.

[0044] Fig. 10B Shows Fig. 10A A cross-sectional view of an electronic device.

[0045] Fig.11A An exploded view of a portion of an electronic device is shown.

[0046] Fig. 11B Shows Fig.11A A cross-sectional view of a component of an electronic device.

[0047] Fig. 11C Shows Fig.11A Rear view of components of an electronic device.

[0048] Fig. 12A An exploded view of a portion of an electronic device is shown.

[0049] Fig. 12B Shows Fig. 12A view of a part of an electronic device.

[0050] Fig. 12C Shows Fig. 12A A cross-sectional view of a portion of an electronic device.

[0051] Fig.12D Shows Fig. 12A A cross-sectional view of a portion of an electronic device.

[0052] Fig.12E A cross-sectional view of components of an electronic device is shown.

[0053] Fig.12F A cross-sectional view of components of an electronic device is shown.

[0054] Figure 12G A cross-sectional view of components of an electronic device is shown.

[0055] Fig.13A A perspective view of components of an electronic device is shown.

[0056] Fig. 13B Shows Fig.13A Top view of components.

[0057] Fig. 13C A perspective view of components of an electronic device is shown.

[0058] Fig.13D Shows Fig. 13C Top view of components. DETAILED DESCRIPTION

[0059] Reference will now be made specifically to the representative embodiments shown in the accompanying drawings. It should be understood that the following description is not intended to limit the embodiments to a preferred embodiment. On the contrary, it is intended to cover alternatives, modifications and equivalent forms that may be included in the spirit and scope of the embodiments defined by the appended claims.

[0060] The architecture and components of the electronic devices described herein can allow for configurations and designs that can maximize the available space or volume that can be occupied by one or more components within the internal volume defined by the housing of the device. For example, certain aspects of device performance, such as battery life, can be improved by increasing the size or volume of the device's battery. Additionally or alternatively, the size of the device itself can be reduced while achieving similar or even higher performance levels.

[0061] In addition to saving space or providing other useful or desirable features, the architectures and components described herein may also challenge conventional techniques for grounding or tuning antennas present in devices. Thus, the devices and components described herein may include configurations and features that allow for optimization and improvement of the performance of one or more antennas included in such devices. For example, one or more components may serve as both an operating component and an antenna radiating element. The various components of the device and the grounding of the antenna may also be controlled, tuned, or designed to achieve a desired level of performance.

[0062] Refer to Figures 1 to Fig.13D However, those skilled in the art will readily appreciate that the detailed description given herein with respect to these drawings is for illustrative purposes only and should not be construed as limiting.

[0063] Figure 1A An example of an electronic device 100 is shown. Figure 1A The electronic device shown in FIG. 1 is a watch, such as a smart watch. Figure 1A The smartwatch is merely a representative example of a device that can be used in conjunction with the systems and methods disclosed herein. The electronic device 100 may correspond to any form of wearable electronic device, portable media player, media storage device, portable digital assistant ("PDA"), tablet computer, computer, mobile communication device, GPS unit, remote control device, or other electronic device. The electronic device 100 may be referred to as an electronic device or a consumer device. In some examples, the electronic device 100 may include a housing 101 that may, for example, carry operating components in an interior volume at least partially defined by the housing. The electronic device 100 may also include a strap 103 or other retaining component that can secure the device 100 to the user's body as desired. Reference is made below to Figure 1B Further details of the electronic equipment are provided.

[0064] Figure 1B A smartwatch 200 is shown, which can be substantially similar to a device described herein, such as electronic device 100, and can include some or all of the features of the device described herein. Device 200 can include a housing 202 and a display assembly 210 attached to the housing. Housing 202 can substantially define at least a portion of an exterior surface of device 200.

[0065] Display assembly 210 may include glass, plastic, or any other substantially transparent outer layer, material, component, or assembly. Display assembly 210 may include multiple layers, each of which provides a unique function, as described herein. Thus, display assembly 210 may be an interface component or may be a portion of an interface component. Display assembly 210 may define a front outer surface of device 200, and as described herein, the outer surface may be considered an interface surface. In some examples, the interface surface defined by display assembly 210 may receive input from a user, such as a touch input.

[0066] In some examples, housing 202 can be a substantially continuous or integral component and can define one or more openings to receive components of electronic device 200. In some examples, device 200 can include input components, such as one or more buttons 224 and / or crown 222 that can be disposed in the openings. In some examples, a material can be disposed between button 224 and / or crown 222 and housing 202 to provide an airtight and / or waterproof seal at the location of the opening. Housing 202 can also define one or more openings or holes, such as hole 204, which can allow sound to pass into or out of an internal volume defined by housing 202. For example, hole 204 can be in communication with a microphone component disposed in the internal volume. In some examples, housing 202 can define or include features such as recess 206 to removably couple housing 202 and a strap or retaining component.

[0067] Figure 1C A bottom perspective view of an electronic device 200 is shown. The device 200 may include a back cover 230, which may be attached to the housing 202, for example, relative to the display assembly 210. The back cover 230 may include ceramic, plastic, metal, or a combination thereof. In some examples, the back cover 230 may include at least partially electromagnetically transparent components 232. The electromagnetically transparent components 232 may be transparent to any desired wavelength of electromagnetic radiation (such as visible light, infrared light, radio waves, or a combination thereof). In some examples, the electromagnetically transparent components 232 may allow sensors and / or transmitters disposed in the housing 202 to communicate with the external environment. The housing 202, the display assembly 210, and the back cover 230 together may substantially define the internal volume and external surface of the device 200.

[0068] Figure 1DAn exploded view of a smartwatch 300 is shown, which can be substantially similar to the devices described herein, such as electronic devices 100 and 200, and can include some or all of the features of the devices described herein. The device 300 can include a housing 302, a display assembly 310, and a back cover 330. The housing 302, the display assembly 310, and the back cover 330 together can define an outer surface and an inner volume of the device 300.

[0069] Housing 302 can be a substantially continuous or unitary component and can define one or more openings 304, 306, and 308 to receive components of electronic device 300 and / or provide access to interior portions of electronic device 300. In some examples, device 300 can include input components such as one or more buttons 348 and / or crown 344 that can be disposed in openings 306, 308. Microphone 346 can be disposed in the interior volume that communicates with the exterior or surrounding environment through opening 304.

[0070] The display assembly 310 may be received by the housing 302 and may be attached to the housing. The display assembly may include a cover 314, which includes a transparent material such as plastic, glass and / or ceramic. The display assembly 310 may also include a display stack 312, which may include multiple layers and components, each of which may perform one or more desired functions. For example, the display stack 312 may include a display layer 312, which may include a touch detection layer or component, and may include one or more display layers or components of one or more pixels and / or light-emitting portions for displaying visual content and / or information to a user. In some examples, the display layer or component 312 may include a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, and / or any other form of display. The display layer 312 may also include one or more electrical connectors to provide signals and / or power to the display layer 312 from other components of the device 300.

[0071] In some examples, the device 300 may include a gasket or seal 316 that may be disposed between the display assembly 310 and the housing 302 to define a barrier to liquid or moisture from the external environment entering the internal volume generally at the location of the seal 316. As described herein, the seal 316 may include a polymer, metal, and / or ceramic material. The device 300 may also include a seal 334 that may be disposed between the housing 302 and the back cover 330 to define a barrier to liquid or moisture from the external environment entering the internal volume generally at the location of the seal 334. In some examples, the display assembly 310 may optionally include a force-sensitive layer or component. For example, the force-sensitive layer may be located near or adjacent to the seal 316, although the force-sensitive component may be located or positioned at any desired location of the display assembly 310. In addition, in some examples, the gasket 316 may be compliant and may allow a desired amount of deformation to enable the cover 314 or other portion of the display assembly 310 to move relative to the housing 302. In some examples, the force-sensitive layer of display assembly 310 can use the amount of movement to detect the magnitude of the force applied to cover 314. In some examples, and as described herein, the movement can be used to dissipate the force applied to cover 314 during high-force events. As described herein, seal 334 can include polymer, metal, and / or ceramic materials. Seal 334 can be substantially similar to seal 316 and can include some or all of the features of that seal.

[0072] The device 300 may also include internal components such as a haptic engine 324, a battery 322, and a logic board 340 (also referred to as a main logic board 340), which may include a system-in-package (SiP) 342 disposed thereon, the system-in-package including one or more integrated circuits such as a processor, a sensor, and a memory. The SiP may also include a packaging component.

[0073] In some examples, the internal components may be disposed below the main logic board 340 and may be at least partially disposed in a portion of the internal volume defined by the back cover 330. For example, the device 300 may include an electromagnetic shielding component, or an electronic shield 352, which may shield other components in the device 300 from electromagnetic radiation from the surrounding environment and / or electromagnetic radiation emitted by other components in the device 300. The device 300 may also include a second logic board 350, which may communicate with one or more sensors or transmitters of the device 300, for example, to receive information or signals from the external environment. In some examples, the second logic board 350 may also include a SiP. In some examples, the device 300 may include one or more wireless antennas, such as an antenna 354 that may be electrically connected to one or more other components of the device 300. In some examples, the antenna 354 may receive and / or transmit wireless signals at one or more frequencies, and may be, for example, a cellular antenna such as an LTE antenna, a Wi-Fi antenna, a Bluetooth antenna, a GPS antenna, a multi-frequency antenna, and the like. One or more. Antenna 354 may be communicatively coupled to one or more additional components of electronic device 300 .

[0074] The internal components may be disposed within an internal volume at least partially defined by the housing 302 and may be attached to the housing 302 via an adhesive, internal surface, attachment feature, threaded connector, stud, column, or other feature formed into, defined by, or otherwise becoming part of the housing 302 and / or the cover 318 and / or the back cover 330.

[0075] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and the concepts related to their use may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 2A to FIG. 3B Various examples of electronic devices and electronic device components are described, including some components having various features in various arrangements.

[0076] Figure 2AA top cross-sectional view of an electronic device is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. In some examples, housing 402 may define an internal volume in which components are housed. For simplicity, several components have been omitted, but housing 402 may include a battery 422 and a tactile feedback module 424 positioned near or adjacent to battery 422. Other components of the device may also be positioned near the battery, such as crown 444, microphone module 446, and button 448.

[0077] In order to maximize the size of battery 422 and thus maximize the performance of the device, it may be desirable to have as large a battery as possible and to arrange the components of the device to allow for a relatively large battery volume. In some examples, battery 422 is rechargeable. In some examples, the battery may be greater than about 240 milliampere hours (mAh), greater than about 250 mAh, greater than about 260 mAh, greater than about 270 mAh, or greater than about 280 mAh, or greater. Battery 422 may be any type of battery desired, such as a lithium ion battery, a lithium polymer battery, a metal-air battery, a nickel-containing battery, or any form of battery developed in the future.

[0078] In addition, the position of battery 422 and the volume or space between the battery and adjacent components can affect the performance of one or more antennas of the device. In some examples, the distance between the outside of battery 422 and adjacent components may be at least about 0.3 mm, at least about 0.4 mm, at least about 0.5 mm, or at least about 0.6 mm. Therefore, the battery can be fixed in a desired position by one or more components. For example, battery 422 can be fixed to housing 402 or another component of the device by an adhesive such as a pressure-sensitive adhesive, by a fixing device (such as a screw) that can cooperate with or pass through a feature defined by a flange on battery 422. In addition, the position of battery 422 can be fixed by using a bracket, a gasket, foam, or a combination thereof.

[0079] Figure 2BA perspective view of a battery 422 including a battery housing is shown, the housing including a top or top wall 427, a bottom or bottom wall (not shown), and a side wall 425. The top 427 may overhang the side wall 425 at one or more locations to define a flange or shelf 426, which may at least partially protrude beyond the plane defined by the side wall. The battery 422 may also include one or more operating components or electronic components such as a processor or controller, a printed circuit board, etc., which may regulate the power flow between the battery 422 and other components of the device. In some examples, the electronic components of the battery 422 may be overmolded or encapsulated with a polymer material to form a system-level package (SiP) 423 that is electrically connected to the battery 422. The overmolded material may be used to support components on the printed circuit board and may reduce the amount of stress experienced by the solder joints between the components and the board, thereby requiring a smaller amount of solder to achieve a reliable electrical connection. Therefore, the battery 422 including the SiP 423 with a processor may have a smaller overall size while maintaining the same electrical capacity as a conventional battery.

[0080] Figure 2C Shows Figure 2A 4, wherein the battery 422 is positioned adjacent to the housing 402, wherein the flange 426 of the battery protrudes beyond a portion of the sidewall of the housing 402 that at least partially defines the internal volume of the device. In this way, the shape of the battery 422 can be matched to the housing 402 and / or any available volume within the housing to provide a battery 422 with as much volume as desired without significantly modifying the architecture or design of the device or its components. In addition, as shown, the transitions between the various portions of the exterior of the battery 422 can be substantially curved.

[0081] Figure 2DA side view of a battery 422 and an adjacent tactile feedback module 424 is shown. It can be seen that the height of the flange 426 of the battery 422 may correspond to the height of the tactile feedback module 424 so as to maximize the available volume of the battery 422. In some examples, the height of the flange 426 may be higher than or above the height of the tactile feedback module 424 so as to enable at least a portion of the tactile feedback module 424 to be nested below the flange 426. In addition, portions of the tactile feedback module 424, such as electronic components and / or flexible electrical connectors 429, may be sized, shaped, and positioned to fit below the flange 426 of the battery so as to enable the battery 422 to be positioned relatively close to the tactile feedback module 424 or other components, thereby allowing a larger available battery volume, and therefore allowing a larger available capacity. As used herein, the term flexible electrical connector may be used to refer to any type of flexible electronic component or circuit that can be electrically coupled to one or more other components of a device. A flexible electrical connector may also be referred to as a ribbon cable or ribbon connector. The flexible electrical connector may be connected to one or more components via a permanent or semi-permanent connection (such as welding), and / or the flexible electrical connector may include a connecting portion that can be removably or attachably coupled to a corresponding portion on a component to provide an electrical connection.

[0082] In some examples, tactile feedback module 424 can be fixed or attached to a housing or other structure by bracket 430. In some examples, bracket 430 can define one or more features to receive one or more retaining members 432. In some examples, retaining members 432 can pass through holes defined by bracket 430 to be received and / or retained by corresponding retaining features 431 defined by the housing or other structural components of the device. In some examples, retaining members 432 can include screws, bolts, or rivets. In some examples, retaining members 432 can define threads, and retaining features 431 can define corresponding threads.

[0083] In some examples, the bracket 430 may be secured by one, two, three, four, or even more retaining members 432. For example, the bracket 430 may be secured by two retaining members 432. In some examples, the retaining members 432 may be disposed at a single end or region of the bracket 430 such that the bracket 430 is cantilevered.

[0084] In some examples, one or more of the retaining members 432 may be at least partially disposed beneath at least a portion of the battery 422. This design may allow the tactile feedback module 424 to be securely secured to the device with the bracket 430, while still allowing the tactile feedback module 424 to be positioned close to or adjacent to the battery 422. For example, the battery 422 may define a curved region or edge 421, and the retaining members 432 may be positioned beneath and / or near the curved region 421. In some examples, the curved region 421 may have a two-dimensional curvature or a three-dimensional curvature. In some examples, the retaining members 432 may have a top that defines a curved surface. In some examples, the curved surface of the retaining members 432 may allow the retaining members 432 to be at least partially nested or positioned beneath the battery 422, such as beneath the curved region 421. See Figures 3A and 3B below. Figure 3B More details of the haptic feedback module are described.

[0085] Figure 3A A side view of a tactile feedback module 524 is shown, which can be substantially similar to the components described herein (such as tactile feedback module 424) and can include some or all of the features of the components described herein. It can be seen that the tactile feedback module 524 may include a housing or shell 525, which can at least partially define the module volume and internal volume housing parts or components of the tactile feedback module 524, such as a translatable mass, and an actuator or motor for translating the mass in a linear manner, for example. Although the housing 525 may have a substantially rectangular or rectangular prism shape, the housing 525 may be substantially any desired shape. In some examples, the transition between the top surface and the side surfaces of the housing 525 may be substantially curved or rounded, for example to provide clearance for adjacent components such as a battery, as shown in reference to FIG. FIG. 2A to FIG. 2D In some examples, housing 525 can be a substantially unitary component, or can be a two-part component.

[0086] The tactile feedback module 524 may also include an electrical connector 528 that may be in electrical communication with other components of the device and may provide signals to and from the other components of the device. In some examples, the flexible connector 528 may be attached to the connecting portion 529. In some examples, the bending radius of the flexible electrical connector 528 may be selected to have a relatively small radius of curvature and allow the tactile feedback module 524 to be positioned close to or adjacent to other components such as a battery or a housing of the device. Figure 3B A perspective view of haptic feedback module 524 is shown, including the rounded transition 523 from the top to the side of housing 525 , and the location of flexible connector 528 .

[0087] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and the concepts related to their use may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 4A to FIG. 5C Various examples of electronic devices and electronic device components are described, including those components having various features in various arrangements.

[0088] Figure 4A A partial top view of an electronic device 600 is shown, which may be substantially similar to devices described herein, such as device 300, and may include some or all of the features of devices described herein. Device 600 may include a housing 602 that at least partially defines an exterior surface and an interior volume of the device. Housing 602 may also define one or more apertures 604 that may communicate with a portion of the interior volume and the surrounding environment.

[0089] As shown, one or more components or modules may be disposed at the aperture 604, such as a speaker module 626, which may communicate with the surrounding environment and may also act as a seal or barrier between the surrounding environment and the internal volume. In some exemplary situations, such as when the device 600 is submerged in water, a relatively large area of ​​the speaker module 626 exposed to the environment may be subjected to a relatively large amount of water pressure, such as Figure 4A . That is, immersion of the device 600 in water or other environments may result in high loads or forces being applied to the speaker module 626. Therefore, it may be desirable for the speaker module 626 to have a high level of stiffness to resist deformation or bending in response to the force in order to maintain a barrier or seal and prevent water or environmental contaminants from entering the internal volume. In addition, since the speaker module 626 is disposed in the internal volume, it may be desirable for the speaker module 626 to be as thin as possible in order to maximize the area or volume available for other components such as the battery 622.

[0090] Figure 4B Shows Figure 4A602. The speaker module 626 may include a housing or shell 634, a seal or gasket 635, a diaphragm or vibrating membrane 636, and an integrated acoustic and support component 632 that may be involved in driving the vibrating membrane 636 to produce acoustic signals or sounds and provide rigidity and structural support for the speaker module 626. The speaker module 626 may also include one or more other operating components or sensors that may have reasons for communicating with the surrounding environment, for example. In some examples, the speaker module 626 may also include a pressure sensor module 640. In some examples, the gasket 635 may contact one or more surfaces of the housing 602 to define a seal between the surrounding environment and the internal volume defined by the housing 602.

[0091] Figure 4C Shown along Figure 4B 6. A cross-sectional view of the speaker module 626 taken along the line shown. As shown, the speaker module 626 may include a housing 634, which may include attachment features for attaching the speaker module 626 to the housing 602, and may further seal against the housing 602 to provide a barrier to prevent liquid or contaminants from entering the interior volume of the housing 602. The speaker module 626 also includes an integrated acoustic and support component 632. The component may include a support member 642, which may provide structural support to the speaker module 626 to substantially prevent the module 626 from bending or deforming under an applied load. The support member 642 may include a metal material, such as steel. In some examples, the support member 642 may include a stainless steel alloy, such as 316 stainless steel or 17-4 stainless steel.

[0092] In some examples, the support member 642 can be formed by any combination of additive and / or subtractive manufacturing processes. For example, the support member 642 can be a metal injection molding (MIM) component. In some examples, the support member may also be subjected to one or more processes to achieve a desired level of flatness. For example, the MIM support member 642 can be reconstructed in a stamping process to achieve a desired level of flatness. In some examples, the support member 642 may have a flatness of less than about 0.05, less than about 0.04, or even less than about 0.03 or less. In addition, the speaker module 626 may have a width W1 of less than about 4 mm, less than about 3.5 mm, less than about 3.2 mm, or less than about 3.1 mm or less. As used herein, the term flatness may refer to the spacing between two imaginary parallel planes that limit the highest and lowest points of the measured surface.

[0093] The acoustic and support component 632 may also include one or more magnets, such as magnets 644, 646, and 648 directly attached or bonded to the support member 642. In some examples, the magnets 644, 646, 648 may be bonded to the support member 642 by any desired method, such as welding, brazing, adhesives, or combinations thereof. The magnets 644, 646, 648 may be used to drive the diaphragm 636 to produce an acoustic signal or sound. The magnets 644, 646, 648 may include any desired magnetic material and may be permanent, semi-permanent, or electromagnets as desired. The acoustic and support component 632 may also include a ring or plate 645, which may also be bonded or attached to the magnets 644, 646, 648, for example, in the same or similar manner as the support member 642. The ring 645 may include any desired material, such as a polymer and / or a metallic material, including steel. The ring 645 may then be attached to the housing 634 as desired. Thus, in some examples, the integrated acoustic and support components 632 can provide sufficient rigidity and robustness to the speaker module 626 to provide the device 600 with water resistance to depths of at least about 25 m, at least about 50 m, or at least about 75 m or more.

[0094] Figure 4D A rear view of a speaker module 626 including an integrated acoustic and support component 632 is shown. Operational components such as a pressure sensor 640 (obscured by the acoustic and support component 632 in this view) can be mounted to the acoustic and support component 632. The pressure sensor 640 and components of the speaker module 626 (such as magnets and / or drive components) can both be in electrical communication with other components of the device 600 (such as one or more processors) through an integrated flexible connector 650. That is, a single flexible connector 650 can include a first portion 652 that communicates with the speaker component and a second portion 654 that communicates with the sensor 640. These portions can be connected to a single connection point 656 that can communicate with other components in the device 600.

[0095] Figure 4E A rear view of a speaker module 626 is shown including an integrated flexible connector 650 to fold into a desired configuration around the acoustic and structural component 632 when the speaker module is assembled into the device 600. It can be seen that the flexible connector 650 or a portion thereof can be placed substantially flat against the acoustic and structural component 632 to save space and provide a connection point 656 in a desired orientation and position for connection to other components of the device 600. Figure 5A Further details of the additional audio components are provided in Figure 5C.

[0096] Figure 5AAn exploded view of a portion of an electronic device 700 is shown that can be substantially similar to the devices described herein and can include some or all of the features of the devices described herein. The device 700 can include a housing 702 that at least partially defines an exterior surface and an interior volume of the device 700. The housing 702 can also define one or more apertures 704 that can communicate with a portion of the interior volume and the surrounding environment.

[0097] As shown, one or more components or modules may be disposed at the aperture 704, such as a microphone module 746, which may be in communication with the surrounding environment and may also act as a seal or barrier between the surrounding environment and the interior volume.

[0098] Figure 5B A cross-sectional view of an electronic device 700 is shown that includes a housing 702 and a microphone module 746 sealed to the housing 702 within a recess or cavity. In some examples, by designing the microphone module 746 and the housing 702 such that the relatively bulky microphone module 746 is disposed within a cavity defined by the walls of the housing, additional space in the interior volume defined by the housing 702 may be freed up for use by other components or for reducing the size of the device 700. Furthermore, for these same reasons, it may be desirable to provide a microphone module 746 that is as thin as possible.

[0099] In some examples, the microphone module includes a housing 750, which may include any desired material, such as a polymer material or plastic. The housing may hold other components of the microphone module 746 that may be attached thereto. In some examples, a seal 754 may be attached, bonded, or otherwise fixed to the housing 750. The seal 754 may include a compliant material, such as a polymer material similar to rubber or plastic. In some examples, the seal 754 may include silicone or silicone rubber. In some examples, the seal 754 may be overmolded onto the housing 750 and may directly contact the housing and the housing 702 to provide a seal or barrier between the surrounding environment and the internal volume of the device 700.

[0100] The microphone module 746 may also include a grille 752 that may be positioned at or near the aperture 704. The grille 752 may be secured to the housing 750 and may act as a physical barrier to prevent objects such as dust or rocks from entering the aperture 704 and damaging the microphone module 746. The grille 752 may be air or liquid permeable, and the acoustic signal may pass through the grille to the diaphragm or diaphragm 758. The diaphragm may be coupled to one or more electronic components 756 that may convert the movement of the diaphragm in response to the acoustic signal into an electrical signal that may be transmitted to other components of the device 700 via the electrical connector 760.

[0101] Figure 5CAn exploded view of the various portions of the microphone module 746 is shown, including a seal 754, a housing 750 defining an aperture, an air or liquid permeable grille 752 attachable to the housing 750 at or above the aperture, and a diaphragm 758 attachable or secured to the housing 750 by an adhesive 757, such as a pressure sensitive adhesive.

[0102] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and the concepts related to their use may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 6A to FIG. 6D Various examples of electronic devices and electronic device input components are described, including those components having various features in various arrangements.

[0103] Fig. 6A A top cross-sectional view of an electronic device 800 is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. In some examples, the housing 802 may define an internal volume in which components are housed. For simplicity, several components have been omitted, but the housing 802 may include a battery 822, as well as various input components, such as a crown 844 and a button 848. It may be desirable for these modules to be as small and as thin as possible while still providing a desired level of functionality, so as to leave room for other components such as the battery 822 to occupy the internal volume or reduce the size of the internal volume, thereby reducing the overall size of the device 800.

[0104] Figure 6B A cross-sectional view of a portion of a device 800 including a battery 822 and a button module 848 is shown. As described with respect to battery 422, battery 822 may include a top that overhangs and extends beyond the sidewalls to define a flange or shelf 823 that may allow for additional battery capacity. Button module 848 may include a bracket 856 that may secure button module 848 to a housing (not shown). An input portion 852 of button module 848 may define an outer surface of module 848 and may at least partially protrude through an aperture defined by the housing to partially define an outer surface of device 800. Input portion 852 may be coupled to bracket 856 by mechanism 854 that may allow button 848 to be actuated by a user, such as by pressing input portion 852 with a limb.

[0105] In some examples, the bracket 856 can define a groove 857 that can be positioned in line with the flange 823 of the battery 822. In addition, a flexible electrical connector 860 that can provide electrical communication between other components of the device 800, such as a display and a processor, can be routed to pass over the bracket 856. In some examples, the flexible connector 860 can be secured to the bracket 856, for example, by an adhesive 858, such as a pressure-sensitive adhesive, to maintain a desired position of the flexible connector 860. Retention of the flexible connector 860 in this desired position can enhance or facilitate performance and / or tuning of one or more antennas of the device 800.

[0106] Additionally, during a drop event or when a high force is applied to the device 800, the battery 822 may be slightly displaced or moved relative to the housing 802 and the bracket 856. The positioning and dimensions of the groove 857 are set so that any such displacement of the battery 822 will cause the flange 823 to simply deflect the flexible connector 860 into the groove 857, rather than squeezing the flexible connector 860 between the flange 823 and the bracket 856, thereby potentially causing damage. In this way, the architecture of the bracket 856 and the battery 822 can provide increased reliability in the device 800.

[0107] Figure 6C A top cross-sectional view of a button module 848 is shown, which includes an input portion 852 coupled to a mechanism 854 and a bracket 856. As shown, the bracket can define one or more retention features that can receive and retain one or more retention components (such as screws 872, 874). Fig.6D A rear view of the bracket 856 is shown including retention features (here, holes 862 , 864 ) sized and shaped to receive retention members 872 , 874 , respectively, to retain the input portion 852 and mechanism 854 to the bracket 856 .

[0108] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components, and the concepts regarding their use and function, may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 7A to FIG. 9 Various examples of electronic devices and electronic device antenna and display components are described, including components having various features in various arrangements.

[0109] Fig. 7A 900 is a partially disassembled view of an electronic device that may be substantially similar to the electronic devices described herein, such as devices 200, 300, and may include some or all of the features of such electronic devices. Figure 1C The device 200 is shown in the same orientation, with the display assembly 910 partially removed from the housing 902. For simplicity, several components of the device 900 are not shown, but the device 900 may include a main logic board 940 having a memory and one or more processors, a haptic module 924, and a flexible electrical connector 950 that may provide electrical coupling and transmit power and / or signals between the logic board 940 and the display assembly 910. The device 900 may also include a conductive member 960 that may electrically couple the display assembly 910 to other parts or components of the device, for example, to provide an electrical ground.

[0110] In addition, as in Fig. 7A As can be seen in the figure, in some examples, the flexible electrical connector 950 and the conductive member 960 can be positioned so that they extend from the same side or area of ​​the display assembly 910. In some examples, the flexible electrical connector 950 and the conductive member 960 can therefore also extend from the display assembly 910 along the same side or area of ​​the housing 902 into the portion of the interior space defined by the housing 902, whereby the flexible electrical connector 950 and the conductive member 960 can be coupled to one or more other components as desired. Therefore, in some examples, all or substantially all of the electrical connectors (such as members 950, 960) extending between the display assembly 910 and any other components disposed in the portion of the interior space defined by the housing 902 of the device 900 can be positioned along the same side of the housing 902 and the display assembly 910. That is, in the case where the device 900 includes a housing 902 having multiple side walls, the flexible electrical connector 950 and the conductive member 960 can be disposed adjacent to only a single side wall.

[0111] In some examples, where the electrical connections between the display assembly 910 and other components of the device 900 are aligned along a single side, this configuration can allow the device 900 to include an antenna with a higher bandwidth than can be effectively achieved using other connector configurations. In some examples, the ability to effectively radiate and receive signals with a high bandwidth can be at least partially due to the ability to radiate and / or receive signals from all or substantially all other sides or areas of the housing 902 that are not adjacent to the flexible electrical connector 950 and the conductive member 960. In some examples, this configuration of the flexible electrical connector 950 and the conductive member 960 can enable the device 900 to include one or more antennas operating at frequencies up to about 2000 MHz, up to about 2700 MHz, up to about 3000 MHz, up to about 5000 MHz, up to about 7500 MHz, up to about 8000 MHz, up to about 8.25 MHz, or up to about 8500 MHz, or even higher.

[0112] Figure 7BA top view of a portion of an electronic device 900 is shown. The device 900 is shown at a stage in the assembly process whereby the display assembly 910 has not yet been attached to the flexible electrical connector 950. At this stage, the flexible electrical connector 950 may be coupled or attached to a component of the device 900, but may include a releasable liner 951 that may be used to protect one or more areas containing conductive material and / or adhesive material disposed on the flexible electrical connector 950, such as with respect to Figure 7C In some examples, the releasable liner 951 can include a polymer material. In some examples, the releasable liner 951 can include a single or continuous portion of material that can be used to protect two portions of the connector 950, as described herein.

[0113] As can be seen, the flexible electrical connector 950 may include a first end that connects to the logic board 940 at a connection point, for example, and a second end that may pass through one or more holes defined by the housing 902, thereby connecting an additional connection point to a display assembly (not shown). In some examples, the flexible electrical connector may act as a radiating element of an antenna and may be driven by one or more components disposed on the logic board 940 and / or the display assembly 910. In some examples, the flexible electrical connector 950 may act as a radiating element to radiate signals in the direction of the display assembly. Additionally, the flexible electrical connector 950 may be substantially L-shaped or curved and may include two portions that may be connected at a second end of the flexible electrical connector 950 but separated at a first end.

[0114] Figure 7C It shows that Figure 7B A similar top view of a portion of a device 900 including a flexible electrical connector 950, the second end of which is folded or bent upward as in the assembled configuration. As can be seen, the flexible electrical connector 950 may include a first portion 952 and a second portion 954, which may be separate or connected at one end (such as the second end). In some examples, one portion 952 may serve as an electrical connector between a touch-sensitive layer of the display assembly 910 and a logic board 940, while the second portion 954 may serve as an electrical connector between a display layer of the display assembly 910 and a logic board 940, and / or vice versa.

[0115] In some examples, the size, width, and / or number of portions of flexible electrical connector 950 can be reduced by positioning as many components as possible on logic board 940 (e.g., in a SiP disposed thereon). In some examples, one or more antennas, such as a near field communication (NFC) antenna, can be located on logic board 940, and thus a flexible electrical connector may not be required to electrically communicate with a processor on logic board 940.

[0116] In some examples, the flexible electrical connector 950 can be electrically grounded to a display assembly (not shown), which can Figure 7C The orientation shown is overlaid on the flexible electrical connector 950. For example, each portion 952, 954 may have a section of conductive material 956, 958 disposed thereon to provide an electrical ground path between each portion 952, 954 of the flexible electrical connector 950 and the display assembly 910. In some examples, the section of conductive material 956, 958 may include a conductive adhesive and / or an adhesive including a conductive material. For example, the conductive material 956, 958 may include a conductive pressure-sensitive adhesive. In some examples, conductive tape or other conductive materials may be used. In some examples, the conductive material 956, 958 may have a width of about 25 microns or more, about 50 microns or more, about 100 microns or more, or more. In some examples, the conductive material 956, 958 may span the entire width of each portion 952, 954 of the flexible electrical connector 950. In some examples, the conductive material 956, 958 can have a thickness or height of about 50 microns or less, about 75 microns or less, about 100 microns or less, about 125 microns or less, about 150 microns or less, about 200 microns or less, or about 500 microns or less above the flexible electrical connector 950. Although four portions of conductive material 956, 958 are shown, in some examples, any number of portions can be used.

[0117] In some examples where the conductive materials 956, 958 include an adhesive, the conductive materials 956, 958 can be used to maintain the position of the flexible connector 950 in a desired portion relative to the display assembly 910. In some cases where the display assembly 910 may include an antenna, as described herein, maintaining the flexible electrical connector 950 in a desired position relative to the display assembly can result in reliable and improved antenna performance. In addition, the electrical grounding provided by the conductive materials 956, 958 can allow the drive signal to return to the ground terminal from the antenna connected to the flexible electrical connector 950 after passing through the flexible electrical connector 950. FIG. 8A to FIG. 8D Further details are provided regarding display assemblies including one or more antennas.

[0118] Fig. 8A Shown is a bottom perspective view of a display assembly 1010 , which can be substantially similar to the display assemblies described herein, and can include some or all of the features of the display assemblies described herein. Fig. 8A The display assembly 1010 is shown relative to, for example, Figure 2AThe display assembly 310 is shown in an inverted configuration. The display assembly 1010 may include a transparent cover 1014 and a display stack 1012, which may include multiple layers and components, each of which may perform one or more desired functions. For example, the display stack 1012 may include a display layer, which may include a touch detection layer or component, a force sensitive layer or component, and one or more display layers or components that may include one or more pixels and / or light-emitting portions for displaying visual content and / or information to a user. In some examples, the display layer may include a liquid crystal display (LCD), a light emitting diode (LED) display, an organic light emitting diode (OLED) display, and / or any other form of display.

[0119] The display assembly may also include a ground layer 1060, which may be disposed below the display stack 1012 or disposed above the display stack 1012. Fig. 8A The display assembly 1010 may also include additional components not shown for simplicity. Ground layer 1060 may be a sheet or plane of conductive material such as one or more metallic materials, which may extend over substantially the entire area of ​​the display assembly 1010. In some examples, ground layer 1060 may include metallic materials such as copper, silver and / or gold. In some examples, ground layer 1060 may include copper and gold. For example, a copper surface coated with gold by any desired deposition or coating process. In some examples, ground layer 1060 may be disposed on and / or supported by a surface of a printed circuit board or other substantially flat surface of the display assembly 1010. In some examples, ground layer 1060 may be a layer of a printed circuit board of the display assembly.

[0120] In some examples, in addition to providing electrical grounding for components of the display assembly 1010 and other components of the electronic device that includes the display assembly 1010, the ground layer 1060 may also act or be used as a radiating element or body for one or more antennas that are in communication with the ground layer 1060. For example, one or more LTE, Wi-Fi, ultra-wideband (UWB), and / or other antennas. By utilizing a ground layer 1060 that is a substantially solid sheet or plane of conductive material that extends over all or substantially all areas of the display assembly 1010, the display assembly 1010 may be considered a relatively "solid block" of conductive material for the purpose of tuning one or more antennas, thereby reducing the complexity of the tuning process and improving antenna performance and / or reliability. The display assembly 1010 may include one or more spring fingers 1062, 1064 that may be in electrical communication with the ground layer 1060 and may be electrical connections to other components in a device that includes the display assembly 1010 to provide an electrical path to the ground layer 1060, as further described herein.

[0121] The display assembly may also include one or more electrical connection points 1066, 1068 that may communicate with components of the display assembly 1010 (such as the display stack 1012) and may receive a flexible electrical connector (such as a 7A to 7C The display assembly 1010 may also include one or more of its own flexible electrical connectors 1070 that provide electrical connectivity between one or more components of the display assembly 1010. In some examples, the flexible electrical connector 1070 may include a ferrite material and may include an integrated antenna therein. In some examples, the integrated antenna may include an NFC coil, but may include substantially any type of antenna. Both the ferrite material and the coil may be coated or covered with an insulating polymer material, such as a polyimide or a pressure-sensitive adhesive material. In some examples, the flexible electrical connector 1070 including the ferrite material and the NFC coil may have a thickness of less than about 300 microns, less than about 250 microns, less than about 225 microns, or even thinner.

[0122] Thus, a separate NFC coil or component is not necessary, and the amount of space occupied by display assembly 1010 can be reduced. In some examples, the NFC coil in flexible electrical connector 1070 is driven as a radiating element by one or more components in communication therewith.

[0123] Additional conductive components may also be provided to help ground components of display assembly 1010 and other system components of a device that includes display assembly 1010. For example, a conductive material such as conductive tape 1072 may be disposed over one or more components (not shown) and may be electrically connected to a ground plane. Additional tape or conductive components may be provided to cover Fig. 8A In some examples, using one or more conductive tapes 1072 to electrically connect the component to ground plane 1010 can improve antenna performance by at least about 0.2 dB, at least about 0.3 dB, at least about 0.4 dB, at least about 0.5 dB, or at least about 1 dB or more at all radiation frequencies compared to display assembly 1010 that does not include tape 1072.

[0124] Figure 8B It shows that Fig. 8A1060 . A bottom perspective view of display assembly 1010 is shown, with several components omitted for simplicity. As shown, spring fingers 1062, 1064 can be positioned on ground plane 1060 and can be electrically connected thereto. In addition, since ground plane 1060 is a substantially continuous sheet or plane extending over a majority of the area of ​​the display assembly, spring fingers 1062, 1064 can be disposed at substantially any desired location on ground plane 1060. Thus, the arrangement of other components of display assembly 1010 can be designed based on other objectives, such as a desired level of antenna performance and / or a level of space reduction, and spring fingers 1062, 1064 can be positioned to accommodate the locations of those components. That is, spring fingers 1062, 1064 can be positioned independently of other components of display assembly 1010.

[0125] Figure 8C A close-up view of a spring finger 1064 disposed near a contact portion 1080 of a ground plane 1060 is shown. In some examples, the spring finger 1064 may include any form of conductive material, such as one or more metals. As shown, the spring finger 1064 may include a receiving portion 1074 that may receive a portion of a connector or another electronic component to provide an electrical connection thereto. The spring finger 1064 may also include a connecting portion 1072 that may be disposed in contact with the contact portion 1080. The connecting portion 1072 may define one or more holes 1076. During assembly, solder or another conductive material may be placed or otherwise positioned over or in the holes 1076 to electrically connect the spring finger 1064 to the ground plane 1060 and mechanically secure it thereto.

[0126] In some examples, spring fingers 1064 can be soldered to ground layer 1060 via a jet or nozzle-based soldering process, whereby a solder ball or solder portion can be ejected or dropped from a nozzle toward hole 1076. The solder can be melted by a laser after being emitted from the nozzle, whereby it can reach a molten or semi-molten state and can impact hole 1076. The solder can then be cooled to provide a strong and reliable electrical connection without subjecting other components of display assembly 1010 to excessive heat. Fig.8D Shows Figure 8C 1064. FIG. 10A is a top view of the same portion of the display assembly 1010 shown with the spring finger 1064 omitted. As can be seen, the contact portion or pad 1080 of the ground layer 1060 can be sized and shaped to correspond to the hole 1076 of the spring finger 1064. Fig. 9 Further details regarding grounding of components in electronic devices are described.

[0127] Fig. 9A perspective view of a grounding component 1100 of an electronic device, such as any of the electronic devices described herein, is shown. The grounding component 1100 may be used to connect any number of components of an electronic device to each other and / or to a ground terminal, such as with respect to a grounding device. FIG. 8A to FIG. 8D In some examples, the grounding component 1100 may replace or assist with the grounding layer 1060. FIG. 8A to FIG. 8D The spring fingers 1062 and 1064 are used.

[0128] In some examples, the ground component 1100 can include a first contact portion 1108 that can define an aperture 1110. As with the aperture 1076 defined by the spring finger 1064, solder can be placed or deposited on or in the aperture 1110 to electrically and mechanically connect the ground component 1100 to another component, such as the ground layer 1060. The ground component 1100 can also include a body 1106 connected to the first contact portion 1108, and a second contact portion 1102 that can extend from the body 1106 to electrically and / or physically connect to one or more components of a device that includes the ground component 1100. Although the second ground portion 1102 is shown as having a particular geometric shape, it can have substantially any desired shape, and the shape and size of the second contact portion 1102 can be selected based on the location of the ground component 1100 and any components that are desired to connect with the second contact portion 1102.

[0129] The body 1106 may be a polymer material and may be insert molded around the contact portions 1102, 1108. The body may also carry a tuning component 1104 that may be electrically connected to the contact portions 1102, 1108. In some examples, the contact portions 1102, 1108 may be electrically isolated from each other except for their connection to the tuning component 1104. In some examples, the tuning component 1104 may include an electronic component with a desired resistance, inductance, and / or capacitance. Therefore, in some examples, the tuning component 1104 may include an inductor and / or a capacitor. In some examples, the tuning component 1104 may be an inductor with an inductance between about 1 nanohenry (nH) and about 10 nanohenry (nH), but the tuning component 1104 may have substantially any inductance as desired. In addition, in some examples, after assembling or partially assembling the device including the grounding component 1100, one or more of the resistance, inductance, or capacitance of the tuning component 1104 may be selectively tuned or adjusted as desired.

[0130] In some examples where ground component 1100 is electrically connected to an antenna, electrical characteristics (such as resistance, inductance, and / or capacitance) of tuning component 1104 may be selected as desired to tune or shift the resonant frequency of the antenna or a circuit including the antenna. Such tuning or shifting may have the effect of making the antenna appear "shorter" or "longer," effectively making it appear from the antenna's perspective that the antenna is grounded at a different location. In this way, the antenna's grounding location may be selected based on design considerations other than the path length to ground, such as the location of other components, and ground component 1100 may then be tuned as desired to provide an effective grounding "location" that achieves optical antenna performance.

[0131] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components and the concepts regarding their use and operation may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. Fig. 10A and Fig. 10B Various examples of electronic devices, electronic device seals, and cover assemblies are described, including those components having various features in various arrangements.

[0132] Fig. 10A An exploded view of several components of an electronic device is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Figure 2A As described in the electronic device 300, the electronic device may include a housing 1202 that may at least partially define an internal volume and a display assembly 1210 that may be held by the housing. The display assembly 1210 may be received by the housing 1202 and may be attached to the housing, for example, at a feature defined by the housing 1202, such as a protrusion, lip, or flange 1203. The display assembly may include a cover 1214 that includes a transparent material, such as plastic, glass, and / or ceramic. The display assembly 1210 may include a display stack 1212 that may include multiple layers and components, each of which may perform one or more desired functions. In some examples, a gasket or seal 1216 may be disposed between the display assembly 1210 and the housing 1202, for example at the flange 1203, to substantially define a barrier that prevents liquid or moisture from entering the internal volume from the external environment at the location of the seal 1216.

[0133] Fig. 10BA cross-sectional view of housing 1202 is shown, wherein transparent cover 1214 and seal 1216 are attached to the housing in an assembled configuration. It can be seen that seal 1216 can contact transparent cover 1214 and housing 1202, and the two components can be fixed or fastened together. In some examples, seal 1216 may include multiple layers of material. As described herein, seal 1216 may include polymer, metal and / or ceramic materials. In some examples, seal 1216 may substantially surround the periphery of the hole defined by housing 1202, and may have a shape corresponding to the periphery shape of one or more parts of display assembly 1210.

[0134] In some examples, the width of the seal 1216 and / or the width of the adhesive bond between the seal 1216 and the housing 1202 and / or the cover 1214 may be important for increasing the chemical resistance of the seal 1216 and preventing corrosion of the seal 1216 and / or liquids or contaminants from passing through it into the internal volume. As shown, the housing 1202 and the cover 1214 may define a gap 1205 therebetween. In some examples, the gap may provide a certain amount of rocking or movement of the cover 1214 relative to the housing 1202, such as during a high-force event or a drop event. This rocking and / or squeezing of the seal 1216 may reduce the risk of forces being directly transmitted to the cover 1214 through the housing 1202, thereby reducing the risk of damaging the cover 1214. In some examples, the seal 1216 may include a relatively low modulus, such as less than about 20 MPa, less than about 15 MPa, less than about 10 MPa, less than about 5 MPa, or even less than about 1 MPa, so as not to transfer loads to the cover 1214. In this way, the seal 1216 can act as a shock absorber for the cover 1214 relative to the housing 1202. In some examples, the seal 1216 can be sufficiently compliant so that the cover 1214 can move laterally and / or vertically relative to the housing 1202. In some examples, this amount of movement may be desirable even though the device may not include a force sensor or other component that may need to rely on movement of the cover 1214 relative to the housing 1202 to function.

[0135] However, in some examples, liquids, particles, contaminants, and / or corrosive materials may inadvertently enter gap 1205 and come into contact with seal 1216. Therefore, it may be desirable for seal 1216 to be corrosion resistant and for the bond length between seal 1216 and housing 1202 and cover 1214 to be relatively large.

[0136] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components, and the concepts regarding their function and operation, may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 11A to FIG. 11C Various examples of electronic devices and electronic device input components are described, including those components having various features in various arrangements.

[0137] Fig.11A An exploded view of several components of an electronic device is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Figure 2A As described in the electronic device 300, the electronic device may include a housing 1302 that may at least partially define an interior volume and a crown or dial 1346 that may be positioned at and at least partially extend through an aperture 1306 defined by the housing 1302. The crown module 1346 may be connected to a flexible electrical connector 1347 that may communicate with one or more other components of the device (not shown).

[0138] Fig. 11B A partial cutaway view of crown module 1346 is shown attached to housing 1302 in an assembled configuration. In some examples, a sleeve or gasket 1354 can be disposed adjacent housing 1302 and can be secured and / or sealed to the housing. Sleeve 1354 can be used to assist in sealing the interior volume of housing 1302. In some examples, sleeve 1354 can be an insulating material and can insulate a portion or all of crown module 1346 from housing 1302.

[0139] The crown module 1346 may include a dial or button 1350, which may be a generally flange-shaped member that may have a cylindrical body and a rounded or flat top. The button 1350 includes an outer surface configured to receive user input and a stem extending from an inner surface of the button 1350. The button 1350 may also include an annular member 1352 that may at least partially define an outer surface of the button 1350 and may include an electrically insulating material, such as to electrically insulate two or more portions of the button 1350. In some examples, one or more sealing members 1356 such as an O-ring, a cup seal, or a diaphragm may be received around the axis of the button 1350 to seal against the sleeve 1354.

[0140] The crown module 1346 may also include a conductive grounding component 1358 that may be in electrical communication with one or more portions of the crown module and may provide electrical grounding thereto. In some examples, the grounding component 1358 may include one or more metals and may be formed into a desired shape by a metal injection molding (MIM) process. The grounding component 1358 may also be in electrical communication with a conductive component 1368 that may be electrically connected to other components of an electronic device that includes the crown module 1346. By using a metal component rather than a separate electrical connector to provide grounding, the overall size of the crown module 1346 may be reduced by eliminating the need for connection points and / or solder for the electrical connector. The crown module 1346 may include one or more bushings, such as an insert-molded bushing 1360. The bushing 1360 may include any material as desired. In addition, because it is insert-molded, it may be shaped and sized as desired, for example to reduce the overall size of the crown module 1346.

[0141] The tactile switch mechanism 1364 may be arranged to contact the stem of the button 1350 and may be fixed to a support structure or bracket 1370. The tactile switch mechanism 1364 may be depressed when the user presses the button 1350 and may transmit one or more signals when such an event occurs. The bracket 1370 may also support one or more operating components of the crown module 1346, such as one or more electrical and / or electronic components. In some examples, the overmolded material 1362 may be provided around these components in a SiP configuration to reduce the overall size of the crown module, as described herein. A shear plate may also be attached to the bracket to prevent shear forces from being transmitted to the tactile switch mechanism 1364 or other components. In some examples, the shear plate may be laser welded to the bracket 1370 or one or more other components of the crown module 1346. The crown module 1346 may also include one or more sensors 1366, such as one or more rotation sensors, to detect rotational input on the button 1350.

[0142] Fig. 11CA rear view of the crown module 1346 disposed in the housing 1302 in an assembled configuration is shown. As can be seen, substantially all of the components of the crown module 1346 can be disposed within a volume defined at least in part by the bracket 1370. This configuration can allow other components of the device including the crown module 1346 to be positioned substantially proximate or adjacent to the crown module 1346, thereby further increasing the available space within the interior volume defined by the housing 1302. In some examples, one or more operational components overmolded with a polymer material to form a SiP 1372 as described herein can be disposed on, carried by, and / or positioned within a volume defined at least in part by the bracket 1370. Overmolding one or more components to form the SiP 1372 can reduce potential interference of the operational components of the SiP 1372 with other systems of the device, thereby further enabling other components to be positioned adjacent or substantially proximate to the crown module 1346.

[0143] Any number or type of components in any configuration described herein may be included in an electronic device, as described herein. The components may include any combination of the features described herein, and may be arranged in any of the various configurations described herein. The structure and arrangement of the device components, and the concepts regarding their function and operation, may be applied not only to the specific examples discussed herein, but also to any number of embodiments in any combination. FIG. 12A to FIG. 13D Various examples of electronic devices and electronic device components are described, including components having various features in various arrangements.

[0144] Fig. 12A An exploded view of several components of an electronic device is shown, which may be substantially similar to the electronic devices described herein and may include some or all of the features of the electronic devices described herein. Figure 2A As described in the electronic device 300 , the electronic device may include a housing 1402 that may at least partially define an internal volume, a main logic board 1440 disposed in the internal volume, and a back cover 1430 that may be attached to the housing 1402 .

[0145] In some examples, the back cover 1430 can carry a plurality of components thereon, such as a second logic board 1450, an electronics shield 1460, and an antenna element 1454. In some examples, a seal 1434 can be disposed between the back cover 1430 and the housing 1402 to provide or define a barrier between the interior volume and the surrounding environment, as described herein. In some examples, as shown, the shape of the seal 1434 can correspond to the shape of the logic board 1440 and / or the antenna element 1454. This design can allow the area of ​​the logic board 1440 to be increased to provide space for additional components, as well as allow the area or size of the antenna element 1454 to be increased.

[0146] Fig. 12B shows the load relative to Fig. 12A A top view of the back cover 1430 of the components described. The back cover 1430 may carry additional components that have been omitted for simplicity. In some examples, the antenna element 1454 may be a radiating element of one or more antennas of an electronic device, such as any antenna described herein. In some examples, the size and shape of the antenna element 1454 may be set to correspond to any available volume in the device that is not occupied by other components. In some examples, the antenna element 1454 may include conductive materials such as one or more metals, and non-conductive materials such as one or more polymers. The antenna element 1454 may be electrically connected to other components of the device, such as the logic board 1440, to provide signals and / or power to drive the antenna. In some examples, the antenna element 1454 may be formed by a laser direct structuring (LDS) process, and therefore may include a polymer, such as a thermoplastic material, in which a metal or metal-containing design or path is formed.

[0147] In some examples, the size and shape of the electronic shielding component 1460 can be set to correspond to the size and shape of one or more components of the device or the back cover 1430 (such as the logic board 1450). In some examples, the electronic shield may include one or more metals and may protect one or more components of the device from electromagnetic radiation. However, in some examples, the electronic shield 1460 may be electrically connected to the antenna to additionally act as a radiating element of the antenna. In some examples, the electronic shield 1460 may provide an auxiliary shorting point for the antenna and / or may be used to increase the length of the radiating element of the antenna. In addition, in some examples, a portion or all of the electronic shield 1460 may be disposed below the radiating element 1454 and may be capacitively coupled thereto to enhance antenna performance.

[0148] Fig. 12C A cross-sectional view of a portion of a back cover 1430 that is joined to a housing 1402 in an assembled configuration is shown, wherein a seal 1434 is disposed between the back cover and the housing. As described herein, the back cover 1430 may also include an electromagnetically transparent component 1432. The seal 1434 may include a multilayer material, such as silicone, polyimide, and / or a pressure-sensitive adhesive. In some examples, the seal 1434 may have a substantially rectangular cross-sectional area, and may be substantially similar to the seal described herein and may include some or all of the features of the seal described herein. In some examples, the seal 1434 may not extend beyond the edge of the housing 1402 and / or the back cover 1430. In addition, the mating surface of the housing 1402 and / or the back cover 1430 may be substantially flat to provide a large adhesion area with the seal 1434. In some examples, the back cover 1430 may directly abut the housing 1402, for example, to serve as a reference.

[0149] Fig.12D Shown with Fig. 12C 1402 and 1403, which includes an alternative configuration of the surface of the back cover 1430 that mates with the housing 1402 and the seal 1434. In this example, the seal 1434 can have a substantially circular or annular cross-sectional area. The mating surface of the back cover 1430 can be inclined or have an inclined area that can exert pressure on the seal 1434 in a direction against the housing 1402.

[0150] Fig.12E A cross-sectional view of a seal 1516 is shown, which can be substantially similar to other seals described herein (such as Fig. 12C The seal 1216 and / or seal 1434 shown in the figure may include some or all of the features of other seals described herein and may be used to replace other seals described herein. In some examples, seal 1516 may include multiple layers of material bonded or joined together in a stacked configuration. In some examples, seal 1516 may include a compliant layer 1520. In some examples, compliant layer 1520 may include a polymer, such as an elastomer. In some examples, compliant layer 1520 may include silicone and / or silicone rubber, such as a silicone layer or a silicone rubber layer. compliant layer 1520 may be an intermediate layer or core of seal 1516 and may have a thickness between about 50 microns and about 500 microns, or between about 100 microns and about 300 microns, for example, about 150 microns. In some examples, compliant layer 1520 may be substantially transparent. The compliant layer 1520 may have a hardness of greater than about 5, greater than about 10, or greater than about 15 or more on the Shore A hardness scale.

[0151] In some examples, polymer layers 1523 and 1525 may be disposed on the top and bottom surfaces of compliant layer 1520. These polymer layers 1523, 1525 may be the same or different materials, and in some examples, may include polyimide. In some examples, polymer layers 1523, 1525 may be transparent or translucent. In some examples, polymer layers 1523, 1525 may be colored translucent materials, such as translucent amber materials. In some examples, polymer layers 1523, 1525 may have the same or different thicknesses. Polymer layers 1523, 1525 may have a thickness between about 25 microns and about 150 microns, or between about 50 microns and about 100 microns, for example, about 75 microns.

[0152] In order to fix the back cover 1430 to the housing 1402, as shown in FIG. Fig. 12CAs shown, in some examples, the top outer surface and the bottom outer surface of the seal can be limited by adhesive layers 1522, 1524. These adhesive layers can be the same or different materials, and can have the same or different thickness. In some examples, adhesive layers 1522, 1524 may include pressure-sensitive adhesive materials. Adhesive layers 1522, 1524 can have a thickness between about 10 microns and about 100 microns, or between about 25 microns and about 75 microns, for example, about 50 microns. Adhesive layers 1522, 1524 can have a hardness greater than about 5, greater than about 10, greater than about 12, or greater than about 15 or greater on the Shore A hardness scale.

[0153] Thus, in some examples, the entire seal 1516 may have a thickness between about 200 microns and about 600 microns, or between about 300 microns and about 600 microns, such as about 400 microns. In addition, the seal may have a width between about 500 microns and about 1500 microns, or between about 750 microns and about 1250 microns, such as about 900 microns.

[0154] See again Fig. 12C The width of seal 1516 and / or the width of the adhesive bond of adhesive layers 1522, 1524 may be important to increasing the chemical resistance of seal 1516 and preventing corrosion of seal 1516 and / or the passage of liquids or contaminants therethrough into the interior volume.

[0155] Fig.12F and Figure 12G A cross-sectional view of an alternative seal design 1616 and 1716 is shown. In some examples, the seal 1616 may include a relatively rigid core material 1622 surrounded by a relatively soft or pliable material 1620. In some examples, the core 1622 may include one or more metals and / or polymers, such as stainless steel. The core 1622 may then be overmolded with a polymer material 1620, such as a silicone material in any desired shape. In some examples, one or more adhesive layers 1625 may be disposed on one or more surfaces of the silicone layer 1620 to adhere the seal 1616 to a component such as a housing or cover.

[0156] The seal 1716 may also include a core 1722 that may include one or more metals and / or polymers such as stainless steel and may be overmolded with a polymer material 1720 (e.g., silicone). As shown, the seal 1716 may have a generally X-shaped cross-section, for example, defining one or more depressions or dimples that may extend partially or completely along one or more surfaces of the seal 1716. In some examples, the shape of the seal 1716 may allow for a desired level of compression or deformation of the seal 1716 to effectively dissipate energy and provide a desired level of sealing between components. Fig.13D More details are provided regarding components carried by back cover 1430, such as a logic board.

[0157] Fig.13A A perspective view of a logic board 1850 of an electronic device as described herein is shown. The logic board 1850 may be substantially similar to the logic boards described herein (such as the logic board 1450) and may include some or all of the features of the logic boards described herein. The logic board 1850 may include a substrate 1852, which may include any desired material and may be a printed circuit board. Various components such as one or more processors, sensors, and / or memories may be disposed on the substrate 1852. One or more components may be overmolded with a material to provide a SiP 1854, as described herein. Additional components 1856 may be disposed near and / or around the SiP 1854. The logic board 1850 may be connected to the back cover of the device using an adhesive material, for example, a pressure sensitive adhesive disposed on the underside of the logic board 1850 (i.e., the side opposite to the components 1854, 1856). In order to ensure the desired level of adhesion, it may be desirable to apply pressure on the logic board 1850 against the back cover or other components to which it is adhered. Thus, in some examples, logic board 1850 can include one or more pillars 1858 that can be mechanically connected to substrate 1852 and on which a desired level of pressure can be applied, for example, by a tool, to ensure a desired level of adhesion. In some examples, one or more pillars 1858 can be mounted to substrate 1852 by any desired process surface. Fig. 13B A top view of logic board 1850 is shown.

[0158] Fig. 13CA perspective view of a logic board 1950 is shown, which can be substantially similar to the logic boards described herein (such as logic board 1850) and can include some or all of the features of the logic boards described herein. In this example, operating components disposed on substrate 1952 adjacent to or proximate to SiP 1954 can also be overmolded with polymer material 1956 as desired. In this way, pressure can be applied to overmold 1956 to ensure a desired level of adhesion of logic board 1950. Additionally, overmold 1956 can have a stepped geometry as shown, thereby increasing the gap or distance between portions of overmold 1956 and any overlying antenna to improve antenna performance. Fig.13D A top view of logic board 1950 is shown.

[0159] Any features or aspects of the devices and components discussed herein may be combined or included in any combination of variations. For example, the design and shape of the components or devices are not limited in any way and may be formed by any number of processes, including those discussed herein. As used herein, the terms exterior, outside, interior, and inside are used for reference purposes only. An exterior portion or exterior portion of a composite component may form a portion of the exterior surface of a component, but may not necessarily form the entire exterior of the exterior surface of the component. Similarly, an interior portion or interior portion of a composite component may form or define an interior portion or interior portion of a component, but may also form or define a portion of the exterior surface or exterior surface of a component.

[0160] Various inventions are described herein with reference to certain specific embodiments and examples. However, those skilled in the art will recognize that many variations may be made without departing from the scope and spirit of the invention disclosed herein, as those inventions set forth in the following claims are intended to cover all variations and modifications disclosed herein without departing from the spirit of the invention. The terms "including" and "having" as used in the specification and claims shall have the same meaning as the term "comprising".

[0161] To the extent applicable to the present technology, the collection and use of data obtained from various sources can be used to improve the delivery of inspirational content or any other content that may be of interest to users. The present disclosure contemplates that in some instances, such collected data may include personal information data that uniquely identifies or can be used to contact or locate a specific person. Such personal information data may include demographic data, location-based data, phone numbers, email addresses, ID, home address, data or records related to the user's health or fitness level (e.g., vital sign measurements, medication information, exercise information), date of birth, or any other identifying or personal information.

[0162] The present disclosure recognizes that the use of such personal information data in the present invention technology can be used to benefit users. For example, the personal information data can be used to deliver targeted content that users are more interested in. Therefore, the use of such personal information data enables users to have planned control over the content delivered. In addition, the present disclosure also anticipates other uses of personal information data that benefit users. For example, health and fitness data can be used to provide insights into the user's overall health status, or can be used as positive feedback for individuals who use technology to pursue health goals.

[0163] This disclosure envisions that entities responsible for collecting, analyzing, disclosing, transmitting, storing or otherwise using such personal information data will comply with established privacy policies and / or privacy practices. Specifically, such entities should implement and adhere to privacy policies and practices that are recognized as meeting or exceeding industry or government requirements for maintaining the privacy and security of personal information data. Such policies should be easily accessible to users and should be updated as the collection and / or use of data changes. Personal information from users should be collected for legitimate and reasonable purposes of the entity and not shared or sold outside of these legitimate uses. In addition, such collection / sharing should be performed after receiving informed consent from the user. In addition, such entities should consider taking any necessary steps to defend and secure access to such personal information data and ensure that others who have access to personal information data comply with their privacy policies and processes. In addition, such entities may subject themselves to third-party assessments to demonstrate their compliance with widely accepted privacy policies and practices. In addition, policies and practices should be adjusted to specific types of personal information data collected and / or accessed, and to applicable laws and standards including specific considerations of jurisdiction. For example, in the United States, the collection or access of certain health data may be governed by federal and / or state laws, such as the Health Insurance Portability and Accountability Act (HIPAA), while health data in other countries may be subject to other regulations and policies and should be handled accordingly. Therefore, different privacy practices should be maintained in each country for different types of personal data.

[0164] Regardless of the foregoing, the present disclosure also contemplates implementation schemes in which users selectively block the use or access of personal information data. That is, the present disclosure contemplates that hardware elements and / or software elements may be provided to prevent or block access to such personal information data. For example, with respect to an advertising delivery service, the technology of the present invention may be configured to allow a user to choose to "opt in" or "opt out" at any time during or after registration for the service to participate in the collection of personal information data. In another example, a user may choose not to provide emotion-related data for a target content delivery service. In another example, a user may choose to limit the length of time that emotion-related data is retained, or completely prohibit the development of basic emotional conditions. In addition to providing "opt-in" and "opt-out" options, the present disclosure contemplates providing notifications related to access or use of personal information. For example, a user may be notified that their personal information data will be accessed when downloading an application, and then the user may be reminded again just before the personal information data is accessed by the application.

[0165] In addition, it is an object of the present disclosure that personal information data should be managed and processed to minimize the risk of unintentional or unauthorized access or use. Risks can be minimized by limiting data collection and deleting data once it is no longer needed. In addition, and when applicable, including in certain health-related applications, data de-identification can be used to protect the privacy of users. De-identification can be facilitated by removing specific identifiers (e.g., date of birth, etc.), controlling the amount or specificity of stored data (e.g., collecting location data at the city level rather than at the address level), controlling how data is stored (e.g., aggregating data on users), and / or other methods when appropriate.

[0166] Thus, while the present disclosure broadly covers the use of personal information data to implement one or more of the various disclosed embodiments, the present disclosure also contemplates that various embodiments may also be implemented without access to such personal information data. That is, various embodiments of the present technology will not fail to function properly due to the lack of all or a portion of such personal information data. For example, content may be selected and delivered to a user by inferring preferences based on non-personal information data or an absolute minimum amount of personal information, such as content requested by a device associated with the user, other non-personal information available to a content delivery service, or publicly available information.

[0167] For the purpose of illustration, the foregoing description uses specific nomenclature to provide a thorough understanding of the embodiments. However, it will be apparent to those skilled in the art that the embodiments can be practiced without specific details. Therefore, for the purpose of illustration and description, the foregoing description of the specific embodiments described herein is presented. They are not intended to be exhaustive or to limit the embodiments to the precise form disclosed. It will be apparent to those of ordinary skill in the art that, in view of the above teachings, many modifications and variations are feasible.

Claims

1. An electronic device, comprising: a housing that at least partially defines an interior volume and an exterior surface of the electronic device; A display assembly, the display assembly comprising: Display layer; a substrate disposed below the display layer, the substrate comprising a non-conductive material defining a hole; and a continuous sheet of conductive material layered in the substrate, the sheet of conductive material configured to make electrical connections through the apertures; and A transparent cover overlies the display assembly and is attached to the housing, the transparent cover at least partially defining an exterior surface of the electronic device.

2. The electronic device according to claim 1, wherein: The conductive material includes metal.

3. The electronic device according to claim 2, wherein: The conductive material includes copper and gold.

4. The electronic device according to claim 1, wherein: The display layer includes a light emitting diode display.

5. The electronic device according to claim 1, wherein: The display layer includes an organic light emitting diode display.

6. The electronic device according to claim 1, wherein: The electronic device further comprises an antenna, The conductive material is electrically connected to the antenna, and the conductive material includes a radiating element of the antenna.

7. The electronic device according to claim 1, wherein: The conductive material defines an electrical ground.

8. The electronic device according to claim 1, wherein: The electronic device also includes a spring finger in electrical contact with the conductive material.

9. A display assembly comprising: Display layer; a touch-sensitive layer, the touch-sensitive layer being covered by the display layer; a substrate comprising a non-conductive material and covered by the touch-sensitive layer and the display layer, the substrate comprising a continuous layer of conductive material at least partially surrounded by the non-conductive material, the non-conductive material defining holes in communication with the conductive material; and A grounding member is attached to the substrate opposite to the display layer, the grounding member being in electrical communication with the conductive material through the hole.

10. The display assembly according to claim 9, wherein: The conductive material includes copper.

11. The display assembly according to claim 9, wherein: The non-conductive material comprises a polymer.

12. The display assembly according to claim 9, wherein: The grounding feature includes a spring finger.

13. The display assembly of claim 12, wherein: The aperture comprises a first aperture; and The spring finger includes a connecting portion defining a second aperture overlying the first aperture.

14. The display assembly of claim 13, wherein: The display assembly also includes solder positioned over the first hole and the second hole, the solder being in electrical communication with the spring fingers and the conductive material.

15. The display assembly of claim 14, wherein: The solder is applied via a jet-based soldering process.

16. The display assembly according to claim 9, wherein: The aperture includes a first aperture, and The non-conductive material defines a second aperture in communication with the conductive material.

17. The display assembly of claim 16, wherein: The first hole is positioned proximate a first edge of the substrate, and The second hole is positioned proximate a second, different edge of the substrate.

18. A display assembly comprising: Display layer; a substrate comprising a non-conductive material and covered by the display layer, the substrate comprising a continuous layer of conductive material, the layer of conductive material being at least partially surrounded by the non-conductive material, the non-conductive material defining a first hole in communication with the conductive material; and A grounding component, the grounding component comprising: Insulation body; a first contact portion extending from the insulating body and defining a second hole covering the first hole; a second contact portion extending from the insulating body and configured to be electrically connected to an operating member; and A tuning component is disposed on the insulating body and defines an electrical communication path between the first contact portion and the second contact portion.

19. The display assembly of claim 18, wherein: The tuning component has an inductance between 1 nH and 10 nH.

20. The display assembly of claim 18, wherein: The tuning component has an adjustable inductance, an adjustable capacitance or an adjustable resistance.

21. The display assembly of claim 18, wherein: The display assembly also includes an antenna, wherein the second contact portion is in electrical communication with the antenna.

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