Display devices, modules, and apparatuses

Abstract

Display apparatuses, modules, and equipment. A display apparatus includes a display device and a light-transmissive plate overlapping the display device. The display device has a display area. A gap is provided between the display area and the light-transmissive plate. A distance G from a front surface of the display device facing the gap to a main surface of the light-transmissive plate facing the gap is greater than a height difference H of the front surface in the display area. The height difference H is greater than 1 µm.

Description

Technical Field

[0001] This disclosure relates to display devices. Background Technology

[0002] The display device includes a light-transmitting plate opposite to the display device. Japanese Patent Application Publication No. 2020-72187 discusses a display device in which a semiconductor device including a color filter layer and a light-transmitting plate is joined by an adhesive member in such a way as to provide a gap between a color filter layer and a light-transmitting plate. Summary of the Invention

[0003] According to one aspect of this disclosure, a display device includes: a display element including a display area; and a light-transmitting plate overlapping the display element, wherein a gap is provided between the display area and the light-transmitting plate, and the distance G between the display area and the light-transmitting plate, from the front surface of the display element facing the gap to the main surface of the light-transmitting plate facing the gap, is greater than the height difference H of the front surface in the display area, and the height difference H is greater than 1 μm.

[0004] Other features of this disclosure will become apparent from the following description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0005] Figure 1A , Figure 1B and Figure 1C This is a schematic diagram showing the module and display device.

[0006] Figure 2A and Figure 2B This is a schematic diagram showing a display device.

[0007] Figure 3A and Figure 3B This is a schematic diagram showing a display device.

[0008] Figure 4A and Figure 4B This is a schematic diagram showing a display device.

[0009] Figure 5 This is a schematic diagram showing a display device.

[0010] Figure 6A , Figure 6B and Figure 6C This is a schematic diagram showing a display device.

[0011] Figure 7 This is a schematic diagram showing a display device.

[0012] Figure 8A , Figure 8B , Figure 8C and Figure 8DThis is a schematic diagram showing a display device.

[0013] Figure 9A and Figure 9B This is a schematic diagram showing a display device.

[0014] Figure 10A and Figure 10B This is a schematic diagram showing the equipment. Detailed Implementation

[0015] If a display device has gaps, its reliability and display quality are more prone to degradation than if it has no gaps. This disclosure aims to provide a technique that helps prevent degradation of the reliability and display quality of display devices.

[0016] Exemplary embodiments of this disclosure will now be described with reference to the accompanying drawings. In the following description and drawings, common elements in the various figures are indicated by the same reference numerals. Therefore, common elements will be described with cross-referencing the various figures, and descriptions of elements indicated by the same reference numerals will be appropriately omitted.

[0017] The first exemplary implementation will now be described. Figure 1A It is a cross-sectional view of the display module 900, which includes the display device 800. Figure 1B This is a floor plan of display device 800. Figure 1C This is a cross-sectional view of display device 800. Although an exemplary configuration of display device 800 is described below, this exemplary embodiment does not need to include all exemplary configurations of display device 800. Display device 800 includes a display area 500 (see [link to documentation]). Figure 1B and Figure 1C The display device 100 includes a display device 100 and a light-transmitting plate 300 overlapping the display device 100. The light-transmitting plate 300 is opposite to the display area 500 with a gap 180 therebetween. In other words, the gap 180 is provided between the display area 500 and the light-transmitting plate 300. The display device 100 includes an adhesive member 200 for bonding the light-transmitting plate 300 to the display device 100. A plurality of pixels 140 are disposed in the display area 500. Each pixel 140 includes a display element such as a light-emitting element, a reflector element, and a shutter element. The display device 100 includes a substrate 105. The substrate 105 can be any of a conductor substrate, an insulator substrate, and a semiconductor substrate. In this example, the substrate 105 is a single-crystal silicon semiconductor substrate. At least some of the semiconductor elements belonging to the pixels 140 are disposed in or on the substrate 105. The display device 100 includes a peripheral region 600 located around the display area 500. The light-transmitting plate 300 is opposite to the display area 500 and the peripheral region 600. The adhesive component 200 is located between the light-transmitting plate 300 and the peripheral area 600 of the display device 100. The adhesive component 200 is in contact with the light-transmitting plate 300 and the display device 100.

[0018] like Figure 1A and Figure 1C As shown, the display device 800 has a gap 180 between the pixel 140 and the light-transmitting plate 300. The light-transmitting plate 300 has a main surface 310, a main surface 320 opposite to the main surface 310, and a side surface 330. The main surface 310 of the light-transmitting plate 300 is closer to the display device 100 than the main surface 320. Of the two main surfaces 310 and 320 of the light-transmitting plate 300, the main surface 310 faces the gap 180. The display device 100 has a front surface 101, a back surface 102 opposite to the front surface 101, and an end surface 103. The front surface 101 of the display device 100 is closer to the light-transmitting plate 300 than the back surface 102. Of the front surface 101 and the back surface 102 of the display device 100, the front surface 101 faces the gap 180. The gap 180 is a vacuum space or a space containing gas. If the space between the display area 500 and the light-transmitting plate 300 is filled with a light-transmitting member without the gap 180, the light-transmitting member can absorb light, thus reducing light utilization efficiency and degrading display quality such as brightness. The gap 180 reduces light loss (light absorption) between the front surface 101 of the display device 100 and the main surface 310 of the light-transmitting plate 300, which helps improve light utilization efficiency. The gas in the gap 180 is typically air, and the gap 180 can also be called an air gap. The gas in the gap 180 is not limited to air; it can also be an inert gas or an active gas such as nitrogen or argon. The light-transmitting plate 300 is opposite to the display area 500 and the peripheral area 600. The adhesive member 200 is located between the main surface 310 of the light-transmitting plate 300 and the front surface 101 of the display device 100. The adhesive member 200 is in contact with the main surface 310 of the light-transmitting plate 300 and the front surface 101 of the display device 100. At least some of the display elements, including those in the pixels 140 in the display area 500, are located between the light-transmitting plate 300 and the substrate 105.

[0019] Now, the distance G from the front surface 101 of the display device 100 facing the gap 180 to the main surface 310 of the light-transmitting plate 300 facing the gap 180 will be defined as a dimension corresponding to the thickness of the gap 180. Details of the distance G will be explained below. In this example, the light-transmitting plate 300 is supported by the display device 100 through the adhesive member 200. However, the light-transmitting plate 300 can be supported by other support members that do not contact the display device 100, without the adhesive member 200 between the light-transmitting plate 300 and the display device 100. For example, the display device 100 can be fixed to the bottom of the recess in a support member having a recess surrounded by a frame portion, and the light-transmitting plate 300 can be fixed to the frame portion. In this way, the frame portion can form a gap 180 between the light-transmitting plate 300 and the display device 100.

[0020] The display device 100 includes an external connection terminal 190. The external connection terminal 190 is located at a position that does not overlap with the light-transmitting plate 300 in the direction in which the display device 100 and the light-transmitting plate 300 are stacked. Figure 1B As shown, when viewed in a plan view, the area of ​​the light-transmitting plate 300 is smaller than the area of ​​the display device 100. Although most of the display device 100, including the display area 500, overlaps with the light-transmitting plate 300, the remaining portion of the display device 100 does not overlap with the light-transmitting plate 300. An external connection terminal 190 is disposed on the portion of the display device 100 that does not overlap with the light-transmitting plate 300. Optionally, if a through electrode is formed in the substrate 105, the external connection terminal 190 can be disposed at a position overlapping with the light-transmitting plate 300.

[0021] The display module 900 includes a wiring component 400, such as a flexible printed circuit, connected to an external connection terminal 190 of the display device 100 of the display device 800. Since the external connection terminal 190 is located on a portion of the display device 100 that does not overlap with the light-transmitting plate 300, the light-transmitting plate 300 does not interfere with the wiring component 400. Electrical connections between the external connection terminal 190 and the wiring component 400, such as the flexible printed circuit, are made via conductive components 410, such as solder and anisotropic conductive film (ACF). The display module 900 may also include a light-shielding member 450 fixed to the display device 800 and a light-transmitting member 470 fixed to the light-shielding member 450 in a manner that covers the light-transmitting plate 300. A space 460 surrounded by the light-shielding member 450 exists between the light-transmitting member 470 and the light-transmitting plate 300. Since the space 460 is surrounded by the light-shielding member 450, the light-shielding member 450 may be referred to as a frame member or an outer member. The light-transmitting member 470 acts as a cover enclosing the space 460. The light-transmitting component 470 can be an optical component such as a lens or a prism. The user can observe the image displayed on the display area 500 of the display device 100 through the light-transmitting component 470 and the light-transmitting plate 300.

[0022] Figure 1BA plan view of the display device 800 is shown when viewed perpendicularly to the front surface 101 or the back surface 102, which serves as the main surface of the display device 100. The layout in the plan view refers to the arrangement of the display device 800 when viewed in a direction perpendicular to the front surface 101 or the back surface 102, which serves as the main surface of the display device 100 (the normal direction of the main surface), and overlapping components are visible in perspective. In the plan view when viewed perpendicularly to the front surface 101 or the back surface 102, which serves as the main surface of the display device 100, the light-transmitting plate 300 overlaps with the display area 500 of the display device 100. The direction (relative direction) of the light-transmitting plate 300 relative to the display device 100 and the pixels 140 is perpendicular to the front surface 101 or the back surface 102, which serves as the main surface of the display device 100 (the normal direction of the main surface). The display device 100 includes a display area 500 having effective pixels and a peripheral area 600 surrounding the display area 500. The display area 500 may be referred to as the effective pixel area. The display area 500 is rectangular. For example, the display area 500 has sides with lengths of 1mm to 100mm or 5mm to 50mm, and a diagonal length of 1mm to 100mm or 5mm to 50mm. For example, the aspect ratio of the display area 500 is 16:V (V = 8 to 13, typically V = 9 or 12). The diagonal length of the display area 500 is preferably 24mm or more. Since the average eye size of an adult is 24mm, a head-mounted display including a display area 500 with a diagonal length of 24mm or more can provide users with an excellent video experience. The peripheral area 600 can include a peripheral circuit area containing one or more peripheral circuits. The peripheral circuit of the display device 800 includes a drive circuit for driving effective pixels and a processing circuit for processing signals to be input to the effective pixels, such as a digital-to-analog converter (DAC). The peripheral area 600 can include an invalid pixel area located between the peripheral circuit area and the display area 500, including invalid pixels. Invalid pixels refer to pixels that do not have the function of effective pixels. Examples include dummy pixels, baseline pixels, test pixels, and monitoring pixels.

[0023] Figure 1CThis is a cross-sectional view of display device 800. Display device 800 includes external connection terminals 190 formed on display device 100. Wiring components 400, such as flexible printed circuits (FPCs), are connected to external connection terminals 190 via conductive components 410, such as solder and ACF. Display device 100 includes a substrate 105, semiconductor elements 110, insulating components 120, wiring structures 130, pixels 140, and external connection terminals 190 (also referred to as pads). A light-transmitting plate 300 is bonded to display device 100 via adhesive components 200, and a gap 180 with a predetermined distance G is provided between the pixels 140 and the light-transmitting plate 300. Substrate 105 is made of semiconductor, such as monocrystalline silicon. Semiconductor elements 110 are transistors and diodes, wherein at least some semiconductor elements 110 are located in substrate 105. Wiring structures 130 all include multilayer wiring layers with aluminum and copper layers, as well as via plugs and contact plugs. The external connection terminal 190 can be formed by a wiring layer included in the wiring structure 130.

[0024] The insulating member 120 includes multiple interlayer insulating layers, such as a silicon oxide layer, a silicon nitride layer, and a silicon carbide layer. Silicon oxynitride and silicon carbonitride are primarily composed of nitrogen and silicon, and are therefore considered as silicon nitrides. Pixels 140 are disposed in the display area 500 of the display device 100. Examples of display elements included in pixels 140 include electroluminescent (EL) elements in an EL display (ELD), liquid crystal elements (shutter elements) in a liquid crystal display (LCD), and reflector elements in a digital mirror device (DMD).

[0025] The display element in pixel 140 is connected to wiring structure 130 via a through-hole (not shown) in insulating member 120, and is electrically connected to semiconductor element 110 via wiring structure 130. A set of red (R), green (G), and blue (B) pixels 140 generally represents the color of full-color display unit 145. Each color pixel 140 included in display unit 145 may be referred to as a sub-pixel. Each pixel 140 includes at least one display element and is attached to wiring structure 130 and semiconductor element 110 for driving the display element. Each pixel 140 may include optical elements corresponding to the display element, such as microlenses and color filters. The size of each pixel 140 will be referred to as pixel size. In this exemplary embodiment, pixel size will be defined as X.

[0026] Figure 2A It shows the result of Figure 1C An enlarged view of the outer portion of the display area 500 and the surrounding area 600, enclosed by the dashed line A. Figure 2B An enlarged view of the portion including the display area 500 and the gap 180 is shown.

[0027] Semiconductor element 110, insulating member 120, wiring structure 130, and pixel 140 are located on the main surface of substrate 105. Protective film 150 is disposed on the display element of pixel 140. A display element is disposed for each pixel 140. For example, the display element is a white EL element. Pixel 140 includes a white EL element, i.e., a display element, and a primary color filter corresponding to the white EL element. White light emitted from the white EL element is transmitted through the primary color filter, causing pixel 140 to display the primary color. If the display element included in pixel 140 is a primary color EL element, the color filter of pixel 140 can be omitted; however, a color filter can be included to improve color purity.

[0028] As described above, the size of pixel 140 is defined as X. For example, the size X of pixel 140 is 1 μm to 100 μm, 1 μm to 50 μm, 2 μm to 20 μm, 3 μm to 10 μm, 5 μm to 10 μm, or 6 μm to 8 μm. A protective film 150 is provided to prevent moisture and oxygen from penetrating into pixel 140. The protective film 150 includes an inorganic material layer of silicon nitride, silicon oxynitride, silicon oxide, or aluminum oxide. The inorganic material layer used for the protective film 150 is particularly advantageous in preventing moisture from penetrating the organic material layer located between the protective film 150 and the substrate 105. The organic material layer located between the protective film 150 and the substrate 105 is included, for example, in a display element. Examples include an organic light-emitting layer. For example, the protective film 150 has a thickness of 1 μm to 5 μm, 2 μm to 4 μm, or 3 μm. Although the protective film 150 is shown as a single layer in Figure 2, it can have a multilayer structure comprising multiple layers of inorganic material. For example, the protective film 150 can have a structure comprising two stacked silicon nitride layers, or a structure comprising an aluminum oxide layer between two silicon nitride layers. In this case, the aluminum oxide layer can be thinner than the two silicon nitride layers. A color filter array 152 is disposed on the protective film 150. Resin layers 151 and 153 are suitably disposed below and above the color filter array 152, respectively. The resin layer 151 is formed to planarize the uneven surface of the protective film 150. The resin layer 151 can be made of a transparent resin such as acrylic resin and epoxy resin. For example, the resin layer 151 has a thickness of 100 nm to 1000 nm. The thickness of the resin layer 151 is, for example, 500 nm. At least one resin layer is disposed on the protective film 150. Examples of resin layers on the protective film 150 include resin layer 151, color filter array 152, resin layer 153, and lens array 170. Resin layer 153 on the protective film 150 is disposed between color filter array 152 and voids 180. Resin layer 151 on the protective film 150 is disposed between color filter array 152 and an inorganic material layer included in the protective film 150.

[0029] Details of the color filter array 152 will be described below. The color filter array 152 in display area 500 includes primary color filters of multiple colors configured in an array. The primary colors of the color filter array 152 are R, G, and B, while cyan (C), magenta (M), and yellow (Y) color filters may be used alternatively. The color filters may be arranged in a strip, delta, or Bayer pattern. The color filter array 152 in peripheral area 600 includes a multi-color section in which color filters of multiple colors are configured in an array. The multi-color section may include the same color filter array as that in display area 500, or a color filter array having different pixel sizes for each color. Alternatively, the color filter array 152 in peripheral area 600 may include a monochromatic section in which color filters of one color extend. Here, the width of the color filter of one color in the monochromatic section is greater than the width (i.e., the pixel width) of the color filters of each color in display area 500. The width of the monochromatic color filter in the monochromatic section is also greater than the width of the color filters of each color in the multi-color section. For example, the width of the monochromatic portion is 10 μm or more, or 100 μm or more, but less than 1000 μm. The multicolor portion can be disposed outside the display area 500, and the monochromatic portion can also be disposed outside the multicolor portion. The multicolor portion and the monochromatic portion can be configured independently of the loop structure of the peripheral area 600. The color of the monochromatic portion can be one of the various colors of the color filters included in the color filter array 152, which readily absorbs longer wavelengths of visible light. Among the R, G, B, C, M, and Y color filters, it is desirable to use the B color filter for the monochromatic portion. This is because the B color filter readily absorbs G and R light. For example, the color filter array 152 has a thickness of 0.5 μm to 5 μm, 1 μm to 3 μm, or 1.5 μm to 2.5 μm.

[0030] The resin layer 153 stabilizes the shape of the lens array 170 to be formed by planarizing the surface of the color filter array 152. The resin layer 153 has a thickness of 100 nm to 1000 nm, for example, 500 nm. The lens array 170 can be disposed on the resin layer 153. The lens array 170 is disposed at least in the display area 500 and may also be disposed in the peripheral area 600. The lens array 170 is disposed to collect light emitted from the display elements of the pixel 140 to improve extraction efficiency and can be made of transparent resins such as acrylic resin and styrene resin. The lens array 170 can be made of inorganic materials such as silicon oxide and silicon nitride (if transparent). The lens array 170 is typically a fly array in which microlenses having spherical, substantially spherical, or aspherical surfaces are arranged in rows and columns in two dimensions. However, the lens array 170 can be a vertical or horizontal one-dimensional array of cylindrical lenses. In a fly array, the number of discrete vertices of the microlenses can be the same as the number of pixels 140 or the number of display units 145. In this example, the microlenses in lens array 170 correspond to pixels 140. However, the microlenses in lens array 170 can correspond to display units 145. For example, one microlens in lens array 170 can correspond to multiple pixels included in display unit 145, such as three pixels 140R, 140G, and 140B. The number of vertices C of the microlenses in lens array 170 in display area 500 is greater than or equal to the number N of display units 145 in display area 500 (C≥N). Typically, C = N×S is satisfied, where S is the number of pixels 140 included in display unit 145. If S≥2, then C≥2×N is satisfied. If, as in this example, S =3, then C = 3×N is satisfied. If the display area 500, including the three-color subpixels, has a Full HD standard resolution (1920×1080), then the number N equals 2,073,600 (N=2,073,600), and the number C equals 6,220,800 (C=6,220,800). A display area 500 with a resolution higher than the Full HD standard resolution can also be used. In this case, the lens array 170 has more than 6,220,800 vertices.

[0031] For example, the lens array 170 has a height of 0.5 μm to 5 μm, 1 μm to 3 μm, or 1.5 μm to 2.5 μm. For example, the transparent material forming the lens array 170 has a refractive index of approximately 1.4 to 2.0. The refractive index of the gap 180 is 1.0. Compared to the case where the space between the display area 500 and the light-transmitting plate 300 is filled with a solid light-transmitting member with a refractive index of approximately 1.1 to 1.5, the difference in refractive index between the gap 180 and the lens array 170 can thus increase the lens optical capability of the lens array 170. This can improve both light utilization efficiency and display quality. The display device 100 is constructed in the manner described above, and the adhesive member 200 is disposed in the peripheral region 600 of the display device 100 and the light-transmitting plate 300 is adhered to the peripheral region 600. The adhesive member 200 typically includes a resin portion primarily made of resin, while the adhesive member 200 may include inorganic materials such as glass frit and metal braze. Desiredly, spacers 210 are included in the resin portion of the adhesive member 200. The thickness (distance G) of the gap 180 between the lens array 170 constituting the front surface 101 of the display device 100 and the light-transmitting plate 300 can be controlled based on the thickness T of the adhesive member 200. Since spacers 210 are included in the adhesive member 200, the thickness of the gap 180 can be determined based on the dimensions of the spacers 210 included in the adhesive member 200. As described above, the thickness of the gap 180 is defined as distance G. As in this exemplary embodiment, if the front surface 101 of the display device 100 is not flat due to the presence of the lens array 170 in the display device 100, then distance G refers to the distance from the apex of the protrusion on the front surface 101 to the light-transmitting plate 300. The distance G can refer to the distance between the highest part of the front surface 101 of the display device 100 and the light-transmitting plate 300, or the shortest distance between the front surface 101 of the display device 100 and the light-transmitting plate 300. Resin beads or silica beads can be used as spacers 210. Desiredly, spacers 210 are spherical because their dimensions can be defined regardless of orientation. For example, spherical spacers 210 have diameters of 10 μm to 50 μm, 20 μm to 40 μm, or 30 μm. The distance G can be determined by the thickness of the layers located between the layer in contact with the spacer 210 (the inorganic material layer or resin layers 151 and 153 of the protective film 150) and the layer between the light-transmitting plate 300 (the color filter array 152 and the lens array 170). For example, if the total thickness of the layer between the layer in contact with the spacer 210 and the light-transmitting plate 300 is less than 5 μm and spacers 210 with a diameter of 30 μm are used, the distance G can be 25 μm to 30 μm.

[0032] While the light-transmitting plate 300 can be made of any light-transmitting material such as glass and acrylic resin, alkali-free glass is also suitably used. The thickness R of the light-transmitting plate 300 is not particularly limited, but is suitably, for example, 0.1 mm to 1 mm, 0.3 mm to 0.7 mm, or 0.5 mm. The thickness S of the substrate 105 is not particularly limited, but is suitably, for example, 0.3 mm to 0.8 mm. Ideally, the thickness S of the substrate 105 is greater than the thickness R of the light-transmitting plate 300 (i.e., S > R). This is because a thicker substrate 105 can prevent damage to the display device 100. If the thickness S of the substrate 105 is less than 300 μm, the substrate 105 can warp toward the gap 180. The corners adjacent to the side surface 330 of the light-transmitting plate 300 and the main surface 310 opposite to the display device 100 can have inclined surfaces 340 extending from the side surface 330 of the light-transmitting plate 300 toward the main surface 310. The inclined surface 340 is inclined relative to the side surface 330 and the main surface 310. The inclined surface 340 can be formed by chamfering the substrate of the light-transmitting plate 300. The inclined surface 340 prevents the corners of the light-transmitting plate 300 from contacting the display device 100 and damaging the display device 100 when the light-transmitting plate 300 is bonded to the display device 100. In this respect, the width of the inclined surface 340 in the direction parallel to the main surface 310 of the light-transmitting plate 300 can be greater than the width (depth) of the inclined surface 340 in the normal direction of the main surface 310 of the light-transmitting plate 300. In other words, the angle (obtuse angle) formed between the inclined surface 340 and the main surface 310 can be greater than the angle (obtuse angle) formed between the inclined surface 340 and the side surface 330. For example, the width of the inclined surface 340 in the direction parallel to the main surface 310 of the light-transmitting plate 300 is 50 μm to 250 μm, or 200 μm. For example, the width (depth) of the inclined surface 340 in the normal direction of the main surface 310 of the light-transmitting plate 300 is 50 μm to 250 μm, or 150 μm. Desiredly, at least one of the two main surfaces 310 and 320 of the light-transmitting plate 300 is formed of an anti-reflective (AR) film formed on the substrate of the light-transmitting plate 300. The formation of the AR film prevents ghosting (the phenomenon of multiple outlines appearing in the image) caused by reflection of displayed light at the interface of the light-transmitting plate 300 and subsequent reflection at the display device 100. The main surface 310 of the light-transmitting plate 300 is defined as the surface facing the void 180. If the substrate of the light-transmitting plate 300 faces the void 180, then the surface of the substrate constitutes the main surface 310. If a functional film, such as an AR film, formed on the substrate of the light-transmitting plate 300 faces the void 180, then that functional film constitutes the main surface 310 of the light-transmitting plate 300. Examples of functional films other than AR films include antistatic films, antifog films, and moisture-absorbing films.

[0033] Reference Figure 2A and Figure 2B An example organic EL display device is described as an exemplary implementation. For example... Figure 2A and Figure 2B As shown, the organic EL display device according to this exemplary embodiment includes a substrate 105. For example, a single-crystal semiconductor substrate made of silicon can be used as the substrate 105. A semiconductor element 110, such as a transistor, is disposed in / on the main surface 1, which serves as the front surface of the substrate 105. The substrate 105 can be an insulating substrate, such as a glass substrate or a resin substrate. A thin-film transistor (TFT), used as the semiconductor element 110, can be disposed on the insulating substrate. An insulating member 120 is disposed on the main surface 1 of the semiconductor element 110 and the substrate 105. The insulating member 120 is made of silicon oxide or silicon nitride. A contact plug (not shown) electrically connected to the semiconductor element 110 is disposed in the insulating member 120. A conductive member made of tungsten is embedded in the contact plug. A wiring structure 130 electrically connected to the semiconductor element 110 via the contact plug is located within the insulating member 120. The wiring structure 130 can include metal members such as aluminum members and copper members. To prevent metal from diffusing into the insulating member 120, a barrier metal such as Ti, Ta, TiN, or TaN can be provided at the interface between the insulating member 120 and the wiring structure 130. In the peripheral region 600 of the substrate 105, the external connection terminal 190 and the grounding wiring 130E are disposed in the same layer as the wiring structure 130. Figure 1C As shown, the insulating member 120 has an opening above the external connection terminal 190, thereby exposing the external connection terminal 190 through the opening in the insulating member 120. Similarly, the insulating member 120 has an opening above the grounding wiring 130E, thereby exposing the grounding wiring 130E through the opening in the insulating member 120. The grounding wiring 130E is connected to the opposing electrode of the display element in a subsequent step.

[0034] Organic EL elements serving as display elements 14 included in pixel 140 are disposed in insulating member 120 within display area 500. Each display element 14 can include a pixel electrode 141, a counter electrode 142 electrically connected to wiring structure 130 via through-hole plugs, and an organic material layer 143 disposed between the pixel electrode 141 and the counter electrode 142. The pixel electrode 141 is isolated pixel-by-pixel by pixel isolation portions (not shown), such as bank pixels, and functions as the anode or cathode (anode in this example) of each organic EL element (display element 14). The counter electrode 142 serves as the other of the anode and cathode of the organic EL element (cathode in this example). Desiredly, the pixel electrode 141 has a structure such that the end of the pixel electrode 141 is covered by a pixel isolation region (bank) made of an insulating layer to prevent short circuits between the pixel electrode 141 and the counter electrode 142. To facilitate the injection and transport of holes from the pixel electrode 141, it is desirable to form a hole injection layer and a hole transport layer between the organic light-emitting layer and the pixel electrode 141. To facilitate the injection and transport of electrons from and from the counter electrode 142, it is desirable to form an electron transport layer and an electron injection layer between the organic light-emitting layer and the counter electrode 142. Here, each display element 14 has a layered structure comprising a pixel electrode 141, a hole injection layer, a hole transport layer, an organic light-emitting layer, an electron transport layer, an electron injection layer, and a counter electrode 142. The hole injection layer, hole transport layer, organic light-emitting layer, electron transport layer, and electron injection layer are all organic material layers. The organic material constituting the organic material layer is typically a low molecular weight organic material, but it can also be a polymeric organic material. Typical resins are polymeric organic materials. Silicone resins contain an inorganic backbone and organic groups in their side chains and are hybrid materials possessing both inorganic and organic properties. Therefore, silicone resins can be classified as either organic or inorganic materials. The counter electrode 142 is common to all pixels 140. The counter electrode 142 extends to the peripheral region 600 and connects to the aforementioned ground wiring 130E. The counter electrode 142 is a conductive film disposed in the display area 500 and the peripheral area 600. The counter electrode 142 can be a conductive film made of a metallic material such as silver (Ag), an alloy material such as silver (Ag)-magnesium (Mg) alloy (AgMg), or a transparent conductive material such as indium tin oxide (ITO). For interconnection, each ground wiring 130E of the wiring structure 130 and the counter electrode 142 include a contact portion 700 called a cathode contact. The organic material layer 143 and the counter electrode 142 are formed on the entire surface of the display area 500 by vapor deposition or sputtering using a metal mask. Because there are some gaps between the metal mask and the substrate 105, the material can diffuse to the outside of the metal mask opening. Since the organic material layer 143 diffuses by more than 0.2 mm, it is desirable that the contact portion 700 be disposed at least 0.2 mm outside the edge of the display area 500.For example, the contact portion 700 has a width of 50 μm or more and 500 μm or less, or a width of 100 μm to 200 μm.

[0035] A protective film 150 for sealing is then formed on the organic EL element (display element 14) to prevent moisture penetration. The protective film 150 is provided to protect the display element 14 and may also be referred to as a passivation film or a sealing film. Additional lens structures can be provided on the protective film 150 to improve light extraction efficiency. Before forming the color filter array 152 (described later), a resin layer 151 for planarization can be formed to reduce the pixel-to-pixel height difference between the organic EL elements. The color filter array 152 is then formed at least above the display element 14 (organic EL element) in the display area 500. The color filter array 152 includes effective pixel portions with three color filters (i.e., R, G, and B colors). For example, the color filters are arranged in a delta configuration. A peripheral region 600, mainly including one or more peripheral loops, is located outside the display area 500. The color filter array 152 is also provided on the insulating member 120 in the peripheral region 600. The color filter array 152 in the peripheral area 600 can have an RGB three-color side-by-side configuration or a three-color layered structure, as in the display area 500, to improve light-blocking performance. A color filter of one color can be configured individually. In a monochrome configuration, it is desirable that the color filter array 152 in the peripheral area 600 be blue, because a blue color filter provides minimal visibility for applications where the background outside the display area 500 of an OLED display device is dark. Unlike the arrangement of the color filter array 152 in the display area 500, the color filter array 152 in the peripheral area 600 does not need to be delta-arranged and can be arranged in any pattern. The positional relationship between the color filter array 152 and the adhesive member 200 formed in subsequent steps will be explained below. Since the vicinity of the aforementioned contact portion 700 is not flat, it is desirable to place the color filter array 152 within the contact portion 700 rather than on the contact portion 700. Therefore, it is desirable that the outer edge 142E of the opposing electrode 142 is located outside the outer edge 152E of the color filter array 152. As a result, the outer edge 152E of the color filter array 152 overlaps with the opposing electrode 142. In this example, the conductive film constituting the opposing electrode 142 overlaps with the adhesive member 200. To protect and planarize the surface of the color filter array 152, a transparent resin layer 153 is formed over the color filter array 152. A lens array 170 is disposed on the resin layer 153. The lens array 170 includes a plurality of microlenses disposed for each pixel 140 and can be formed by an exposure and development process. Specifically, a film (photoresist film) made of the material used to form the microlenses is formed, and the photoresist film is exposed and developed using a mask with continuous grayscale. Examples of such masks may include grayscale masks and area grayscale masks. An area grayscale mask is a light-blocking film with a resolution of dots higher than the resolution of the exposure system, and the dot density distribution is changed so that light can illuminate the imaging surface with continuous grayscale.Microlenses formed through exposure and development processes can be etched back to adjust their shape. In this example, photosensitive transparent acrylic resin is used as the material for the lens array 170. The lens array 170 can be located not only in the display area 500 but also at any location in the peripheral area 600. The shape of the lens array 170 in the peripheral area 600 can be different from the shape of the lens array 170 in the display area 500.

[0036] Next, resin material for forming the adhesive member 200 is applied to the peripheral area 600 of the substrate 105, excluding the area of ​​the external connection terminals 190, using techniques such as dispensing and screen printing. After the light-transmitting plate 300 is mounted on the substrate 105, the resin material is cured to form the adhesive member 200. Figure 2A and Figure 2B As shown, the distance G between the outermost surface of the display device 100 (i.e., the lens array 170) and the light-transmitting plate 300 is determined by the thickness T of the cured adhesive member 200. The adhesive member 200 can be made of any resin such as epoxy resin, acrylic resin, polyurethane resin, and polyimide resin, including ultraviolet (UV) curable resin, thermosetting resin, and two-component blended resin, and it is desirable that the spacer 210 is appropriately contained within the resin. It is desirable to include the spacer 210 because the thickness T of the adhesive member 200 when bonding the substrate 105 and the light-transmitting plate 300 can be easily controlled by the dimensions of the spacer 210, thereby enabling precise control of the distance G between the lens array 170 and the light-transmitting plate 300. Although any spacer such as glass beads and resin beads can be used as the spacer 210, it is desirable to use resin beads because resin beads hardly damage the insulating member 120 and the protective film 150 on the substrate 105. If the color filter array 152 is not positioned below the entire area forming the adhesive member 200, the thickness T of the adhesive member 200 can be set to be greater than the total thickness of the color filter array 152 and the lens array 170. This creates a gap 180 defining the distance G between the lens array 170 and the light-transmitting plate 300. Although the distance G and the thickness T can be the same, the distance G is typically less than the thickness T (G < T). For example, if the color filter array 152 has a thickness of 1.5 μm and the lens array 170 has a thickness of 2 μm, it is desirable that the thickness T of the adhesive member 200 be greater than 3.5 μm. A thickness T of less than 50 μm is sufficient for the adhesive member 200. Therefore, the distance G can be less than 50 μm. In this example, the light-transmitting plate 300 is made of alkali-free glass. For example, the light-transmitting plate 300 has a thickness of 0.1 mm to 1 mm, 0.3 mm to 0.7 mm, or 0.5 mm. The inclined surface 340 is formed by chamfering at the corner between the side surface 330 and the main surface 310 of the light-transmitting plate 300 that is opposite to the display device 100.

[0037] Wafer-level packaging can be employed. For example, substrate 105 is fabricated as a silicon wafer. Multiple display devices are formed on the silicon wafer, and color filter arrays 152 are formed on each display device. Then, adhesive members 200 are formed on the silicon wafer to surround each display device. A glass wafer is fabricated to serve as a light-transmitting plate 300, and the glass wafer is bonded to the silicon wafer via the adhesive members 200. The adhesive between the silicon wafer and the glass wafer is cut for use in individual devices. The portion of the glass wafer above the external connection terminals 190 can be removed after cutting.

[0038] Then, by using mounting means (not shown) such as adhesive lines, bumps, and anisotropic conductive resin, the external connection terminal 190 and the external power supply (not shown) are connected to each other, thereby completing the organic EL display device according to this exemplary embodiment. Furthermore, the light-shielding member 450, on which the light-transmitting member 470 is pre-installed, contacts the light-transmitting plate 300 of the display device 800 and is fixed by adhesive (not shown) applied at any location, thereby completing the display module 900.

[0039] Reference Figure 2B The distance G in the display area 500 is explained. In the display area 500, the front surface 101 of the display device 100 has a height difference H. For example, the height difference H is 0.5 μm to 5 μm, 1 μm to 3 μm, or 1.5 μm to 2.5 μm. The relatively high portion of the front surface 101 will be referred to as the high portion 170T, and the relatively low portion will be referred to as the low portion 170B. For convenience, the boundary between the high portion 170T and the low portion 170B can be located at a position corresponding to half of the height difference H. Figure 2B In this context, the height difference H can be formed by protrusions and concave blocks caused by the shape of the lens array 170. Optionally, such as Figure 3A As shown, the height difference H can be formed by the bumps and recesses caused by the color filters in the color filter array 152. The shapes of the lens array 170 and the color filter array 152 can be reflected in the height difference H. The shapes of other components, such as the protective film 150, can also be reflected in the height difference H.

[0040] Since the user of the display device 800 observes the display area 500 optically, the display quality of the display device 800 is degraded by foreign matter. The degradation of the optical display quality caused by foreign matter is difficult to correct by electronic techniques such as signal processing. Therefore, measures against foreign matter are important for the display device 800. The height difference H to be considered when taking measures against foreign matter is greater than 1 μm. A height difference H of 1 μm or less is considered substantially flat, and its discussion will be omitted here. In particular, foreign matter smaller than the wavelength of visible light (400 nm to 800 nm, typically 550 nm) used in the display device 800 is considered to have little effect on the display quality for the user. When the height difference H is 100 nm or less, the front surface 101 can be considered substantially flat. It is desirable that the portion of the main surface 310 of the light-transmitting plate 300 facing the display area 500 has a height difference smaller than the height difference H of the front surface 101 of the display device 100 in the display area 500. For example, the portion of the main surface 310 of the light-transmitting plate 300 facing the display area 500 has a height difference of 1 μm or less, 500 nm or less, or 100 nm. One of the features of the present exemplary embodiment is that the distance G between the display area 500 and the light-transmitting plate 300 is greater than the height difference H.

[0041] The relationship between the inspection distance G and the foreign matter DUS included between the display area 500 and the light-transmitting plate 300 will be examined. Assume that the size Q of the foreign matter DUS does not exceed the height difference H (Q ≤ H). In this case, even if the front surface 101 and the main surface 310 are in contact (G = 0), the influence of the foreign matter DUS is small because the foreign matter DUS is located between the lower portion 170B of the front surface 101 and the light-transmitting plate 300. However, the foreign matter DUS having a size Q (Q ≤ H) less than or equal to the height difference H can sometimes adhere to the upper portion 170T. In this case, if the distance G is less than or equal to the size Q of the foreign matter DUS (G ≤ Q), the foreign matter DUS can contact and be fixed to the front surface 101 and the main surface 310. In addition, the foreign matter DUS may be pressed against the display device 100 by the light-transmitting plate 300. The fixing of the foreign matter DUS can cause a decrease in image quality. The pressurization of the foreign matter DUS can damage the display device 100. To reduce such problems, the distance G can be made greater than the size Q of the foreign matter DUS (G > Q). Considering Q ≤ H, the distance G can be set to satisfy Q ≤ H < G. Thus, setting the distance G to be greater than the height difference H is advantageous for preventing a decrease in the reliability and display quality of the display device 800 in the presence of foreign matter DUS having a size Q smaller than the height difference H. As a measure against foreign matter DUS having a size Q smaller than the height difference H, the distance G can be 10 μm or less.

[0042] Reference will be made to Figure 2BThis exemplary embodiment details the relationship between pixel size X and distance G. One feature of this exemplary embodiment is that, in the region between the display area 500 and the light-transmitting plate 300, the distance G is greater than the pixel size X (G>X). Figure 3A In this illustration, the semiconductor elements 110 and wiring structure 130 of the display device 100 are omitted to depict only the pixels 140. Display elements 14 are provided for each pixel 140. In this example, the display unit 145 includes R pixels 140R, G pixels 140G, and B pixels 140B.

[0043] Figure 4A and Figure 4B The planar layout of the pixels 140 is shown when the display unit 145 is viewed in the normal direction of the front surface 101, which is the main surface of the display device 100. Figure 4A It shows a striped arrangement, and Figure 4B Delta arrangement is shown. Figure 4B In this context, pixels 140 in each display unit 145 are surrounded by thick lines. The length of pixel 140 in the direction of periodic arrangement of pixels 140 of all colors is desired as the pixel size X. If the outline of pixel 140 has a polygonal planar shape, the pixel size X can be defined by the distance between opposite sides of the polygon. If the distance between opposite sides of one pair of opposite sides is different from that of another pair, the shortest distance can be used as the pixel size X. Figure 4A In the example, pixel 140 has a rectangular outline, and the pixel size X is defined by the distance between the longer sides of the rectangle, i.e., the length of the shorter sides. This is because, in... Figure 4A In the example, pixels 140R, 140G, and 140B are periodically arranged in a direction where the long sides of the rectangle are adjacent to each other (the horizontal direction in the figure). Figure 4B In the example, pixel 140 has a polygonal outline, and the pixel size X is defined by the distance between opposite sides of the polygonal shape. This is because, in Figure 4B In the example, pixels 140R, 140G, and 140B are periodically arranged in the direction of opposite sides of the rectangle (the horizontal direction in the figure).

[0044] Reference Figure 3A , Figure 3B , Figure 4A and Figure 4BThis describes the case where a foreign object DUS exists between the display device 100 and the light-transmitting plate 300, i.e., in the gap Ⅰ80. The foreign object DUS may have been originally attached to the display device 100 or the light-transmitting plate 300, or may have been included between them when the light-transmitting plate 300 was bonded to the display device 100. The presence of small foreign objects not exceeding the pixel size X can only be suppressed within a limited range. The structure of the display device 100 that maintains display quality in the presence of foreign objects smaller than or equal to the pixel size X will be described. As Figure 3A shown, it is assumed that the foreign object DUS of size Q has a spherical shape model with a diameter of Q. The size Q of the foreign object DUS is less than or equal to the pixel size X, i.e., Q≤X. If the distance G is less than or equal to the size Q of the foreign object DUS (G≤Q), then when the light-transmitting plate 300 is bonded to the display device 100, the foreign object DUS may be pressed into the pixel 140, thereby damaging the pixel 140 and causing the pixel 140 to not emit light. In addition, the foreign object DUS clamped and fixed between the light-transmitting plate 300 and the display device 100 can block the light from the pixel 140 or change the optical path of the light. In other words, if the distance G is less than the pixel size X, the display quality will be damaged by the foreign object DUS. On the contrary, if the distance G is greater than the size Q of the foreign object DUS (G>Q) as in the present exemplary embodiment, the foreign object DUS can be prevented from being pressed into the pixel 140. Therefore, by satisfying Q≤X<G, thus satisfying Q≤X and Q<G, or equivalently making the distance G greater than the pixel size X (X<G), the degradation of display quality caused by the foreign object DUS can be prevented. Therefore, designing the distance G to be greater than the pixel size X (G>X) can improve the display quality.

[0045] If a foreign object DUS larger than the pixel size X exists on the pixel 140, the foreign object DUS will block the emitted light and may cause pixel defects according to the standards of the display device 100. Reference will be made to Figure 5 to illustrate the desired range of the distance G. In Figure 5 , the pixel size of the pixel 140R of the first color (e.g., R) will be defined as X. The pixel size of the pixel 140G of the second color (e.g., G) different from the first color will be defined as Y. The pixel size of the pixel 140B of the third color (e.g., B) different from the first and second colors will be defined as Z. In Figure 5 , pixels of the same color are given the same shading pattern. Figure 5 The shading patterns of each color in Figure 4A and Figure 4B are the same as those in Figure 5 . The pixels 140R, 140G, and 140B in Figure 4A and Figure 4BPixels 140R, 140G, and 140B arranged horizontally. The pixel sizes X, Y, and Z can be different (X < Y < Z, X > Y > Z, or Y < X < Z) or the same (X = Y = Z). The pixel size of pixel 140R' of the same color (e.g., R) as pixel 140R of the first color will be defined as X'. The pixel size of another pixel 140R'' of the same color (e.g., R) as pixel 140R of the first color will be defined as X''. The pixel sizes X, X', and X'' may be different (X < X' < X'', X > X' > X'', or X' < X < X'') or the same (X = X' = X''). The pixel size of pixel 140G' of the same color (e.g.,

[0046] G) as pixel 140G of the second color will be defined as Y'. The pixel size of pixel 140B' of the same color (e.g., B) as pixel 140B of the third color will be defined as Z'. The pixel sizes Y and Y' can be different (Y < Y' or Y > Y') or the same (Y = Y'). The pixel sizes Z and Z' can be different (Z < Z' or Z > Z') or the same (Z = Z').

[0047] Now, focus on pixel 140R with pixel size X. Pixels 140R' and 140R'' of the same color are located on both sides of the pixel 140R of interest. Pixels of other colors are configured between pixel 140R and the pixels 140R' and 140R'' of the same color on both sides. As Figure 5 shown, if each display unit 145 has an RGB three-color structure and the pixel 140R of interest is R, then G and B pixels are configured between pixel 140R and the pixels 140R' and 140R'' of the same color on both sides. The distance from pixel 140R to pixel 140R' will be defined as Da, and the distance from pixel 140R to pixel 140R'' will be defined as Db. Generally, they are given by the following equations: Da = Y' + Z and Db = Y + Z'. The pitch between pixel 140R and 140R' will be defined as Pa, and the pitch between pixel 140R and 140R'' will be defined as Pb. The pitch between two pixels refers to the distance between the centers of the two pixels. They are given by the following equations: Pa = X / 2 + Da + X' / 2 and Pb = X / 2 + Db + X'' / 2. Generally, they are given by the following equations: Pa = X + Da and Pb = X + Db.

[0048] In the description of the case where G>X, the impact of foreign object defects (DUS) with a size Q smaller than the pixel size X on display quality has been examined. In the following description, foreign object defects with a size Q larger than the pixel size X will be examined. Because of their larger size, display defects caused by foreign object defects clamped and fixed between the light-transmitting plate 300 and the display device 100, or by foreign object defects pressed against the display device 100, affect a large range of pixels. It is desirable to limit such display defects caused by the fixing and pressure of foreign object defects to a range of three pixels (including the pixel of interest and the pixels on either side). Figure 5 In this context, the range represented by size Qc corresponds to the size Q of the foreign object (DUS) to be inspected by the indicator. A first-color (e.g., R) pixel 140R is located between a second-color (e.g., G) pixel 140G and a third-color (e.g., B) pixel 140B. The equation Q = Qc = X + Y + Z satisfies G > Q. In other words, it is desirable that the distance G is greater than the sum of the pixel size X of pixel 140R, the pixel size Y of pixel 140G, and the pixel size Z of pixel 140B (G > X + Y + Z). Applying X = Y = Z to G > X + Y + Z yields G > 3 × X. If the pixel size X is 6 μm or more, then the distance G only needs to be 18 μm or more.

[0049] Next, we will examine the foreign object DUS entering the gap 180 between the display area 500 and the light-transmitting plate 300. Assume the pattern of the adhesive member 200 has an opening (gap 250), where the adhesive member 200 is not present as described below. In this case, the larger the distance G, the easier it is for the foreign object DUS to enter. Furthermore, the larger the distance G, the more likely ghosting will occur, i.e., the phenomenon of seeing multiple image outlines caused by the portion of the display light reflected at the light-transmitting plate 300 and reflected again at the display device 100. For this reason, it is desirable to set an appropriate upper limit for the distance G. Since the quality standards of the display device 800 vary according to product specifications, the specification is intended to prevent display defects in multiple adjacent pixels of the same or different colors.

[0050] The primary criterion is to prevent display defects in the pixel of interest and the adjacent pixels of the same color. A display defect is considered likely to occur if a foreign object (DUS) exists in a total of three pixels of the same color (e.g., R), including pixels 140R, 140R', and 140R''. Figure 5 In the diagram, three pixels of the same color are described below. A first color (e.g., R) pixel 140R is located between two first color (e.g., R) pixels 140R' and 140R'" in the direction having pixel size X. Figure 5Among them, the range represented by dimension Qa corresponds to the dimension Q of the foreign object DUS to be inspected according to the first index. Two second-color (e.g., G) pixels 140G and 140G' and two third-color (e.g., B) pixels 140B and 140B' are located between two first-color pixels 140R' and 140R". The case where a foreign object DUS with dimension Q exists in three pixels of the same color (e.g., R) means the case where the condition Q > Pa + Pb is satisfied. The condition G < Q should be satisfied to prevent a foreign object DUS with dimension Q from reaching or entering, and reasonably, the condition G < Pa + Pb < Q is satisfied. The distance G can be less than the pitch Pa between pixel 140R and one of the two pixels 140R' and 140R" (here pixel 140R') and the pitch Pb between pixel 140R and the other of the two pixels 140R' and 140R" (here pixel 140R"). Substituting Pa = X + Da and Pb = X + Db into G < Pa + Pb gives G < X + Da + X + Db. To prevent display defects caused by a foreign object DUS satisfying the condition Q > X + Da + X + Db, that is, display defects in three pixels of the same color, the condition Q < X + Da + X + Db can be satisfied. Assuming the foreign object DUS is spherical, the distance G < Q can prevent a foreign object DUS with dimension Q or a larger dimension from entering the opening (gap 250) in the bonding member 200 and causing display defects. In other words, the condition G < X + Da + X + Db should be satisfied. Substituting Da = Y' + Z and Db = Y + Z' into G < X + Da + X + Db gives G < X + Y' + Z + X + Y + Z'. Applying Y' = Z = X = Y = Z' to G < X + Y' + Z + X + Y + Z' gives G < 6×X.

[0051] In the case of G < 6×X, if the pixel size X is, for example, 8 μm or less, the distance G will be less than 48 μm. Regarding measures against a foreign object DUS with dimension Q larger than the pixel size X, it is desirable that the distance G is 20 μm or more. Considering the industrially manageable dimension of the foreign object DUS, a distance G less than 50 μm is sufficient.

[0052] The second index is used to reduce display defects in the pixel of interest and pixels of different colors on both sides thereof. In Figure 5Among them, the range represented by dimension Qb corresponds to the dimension Q of the foreign object DUS to be inspected according to the second index. When dimension Q = Qb = Da + X + Db, condition G < Q is satisfied. In other words, the expected distance G is also smaller than the distance between two pixels 140R' and 140R'' (G < Da + X + Db). Substituting Da = Y' + Z and Db = Y + Z' into G < Da + X + Db gives G < Y' + Z + X + Y + Z'. Applying Y' = Z = X = Y = Z' to G < Y' + Z + X + Y + Z' gives G < 5×X. Under the condition G < 5×X, if the pixel size X is less than 8 μm, the distance G should be less than 40 μm.

[0053] Although the foreign object DUS existing between the light-transmitting plate 300 and the display device 100 has been described, the foreign object DUS can also adhere to the main surface 320 of the light-transmitting plate 300. The user can visually observe the foreign object DUS on the main surface 320. However, if the foreign object DUS on the main surface 320 is far from the display area 500, the user may not focus on the foreign object DUS on the main surface 320 when observing the display area 500, thereby reducing the influence of the presence of the foreign object DUS. To sufficiently separate the main surface 320 from the display area 500, it is desirable that the distance between the main surface 320 and the main surface 310, that is, the thickness R of the light-transmitting plate 300, is at least greater than the distance G (R > G). In other words, the distance G can be smaller than the thickness R of the light-transmitting plate 300. Since the possibility of the foreign object DUS existing in the narrow gap 180 sealed by the bonding member 200 is lower than the possibility of the foreign object DUS adhering to the main surface 320, it is appropriate to satisfy the relationship R > G as an appropriate measure against the foreign object DUS. Although the thickness R can be 0.1 mm to 1 mm, the distance G can be less than 100 μm.

[0054] The larger the area of the display area 500, the higher the possibility of the presence of the foreign object DUS and the greater the influence of the foreign object DUS. For example, the side length of the display area 500 can be 5 mm to 50 mm, and the area of the display area 500 can be 25 mm 2 to 2500 mm 2 . Considering the industrial production of the display device 100, it is desirable that the area of the display area 500 is less than 2912 mm 2 . A display area 500 less than 2912 mm 2 can be formed by batch exposure using a commercially available semiconductor exposure device (the i-line stepper "FPA-5510iX" manufactured by Canon Inc., with a maximum exposure range of 52 mm × 56 mm). It is also desirable that the display area 500 has an area less than 1392 mm 2The area is [not specified]. It is possible to form semiconductors smaller than 1392mm using batch exposures with commercially available semiconductor exposure equipment (Canon's KrF scanner "FPA-6300ESW", with an exposure range of 33mm × 42.2mm). 2 The display area is 500. Compared to using an i-line stepper, using a KrF scanner enables the formation of a size smaller than 1392mm. 2 The display area 500 has a finer structure. The display area 500 can have a size of less than 858mm². 2 The area is [not specified]. It is possible to form shapes smaller than 858mm using commercially available semiconductor exposure equipment (Canon's KrF scanner "FPA-6300ES6a", exposure area 26mm × 33mm) through batch exposure. 2 The display area is 500. It is also possible to use other commercially available semiconductor exposure equipment (such as the Nikon ArF scanner "NSR-S322F", with an exposure range of 26mm × 33mm) to form semiconductors smaller than 858mm through batch exposure. 2 The display area is 500. Compared to using a KrF scanner, using an ArF scanner can create images smaller than 858mm. 2 The display area 500 has a finer structure. Even though the display area 500 has a 214mm diameter... 2 With the above-mentioned area, an exposure device having an exposure range of 26mm × 33mm can expose the display area 500 of two or more devices in a single exposure, thus achieving high productivity. However, if the long side of the display area 500 is 16.5mm or more, the area exposed in a single exposure in the 33mm direction can only accommodate the display area 500 of one device. This reduces the productivity of the display device 100. The above-mentioned measures against foreign matter (DUS) are particularly useful in this case. If the long side of the display area 500 is 16.5mm or more and the aspect ratio of the display area 500 is 16:9, then the diagonal length is approximately 19.0mm or more and the area of ​​the display area 500 is 153mm². 2 The above applies. If the longer side of display area 500 is 16.5mm or more and the aspect ratio of display area 500 is 4:3, then the diagonal length is approximately 20.7mm or more and the area of ​​display area 500 is approximately 205mm². 2 Therefore, this exemplary embodiment is applicable to a display device 100 including a display area 500 having a diagonal length of 19 mm or more and a display device 500 having a diagonal length of 153 mm. 2 The display device 100 has a display area 500 of the above-mentioned area. If the diagonal length of the display area 500 is 24mm or more and the aspect ratio of the display area 500 is 16:9, then the area of ​​the display area 500 is 245mm². 2That's all. If the aspect ratio of display area 500 is 4:3, then the area of ​​display area 500 is 276 mm². 2 That concludes the discussion. While batch exposure was described above, split exposure (seamless exposure) can be used to form a large display area 500 without being limited by semiconductor exposure equipment. Split exposure using an exposure device with an exposure range of 26mm × 33mm can produce areas larger than 858mm². 2 The display device 100 has a display area of ​​500. Because it has a diameter greater than 858 mm... 2 The productivity of the display device 100 with a display area 500 is even lower, making the aforementioned measures against foreign matter (DUS) more useful. Exposure equipment with an exposure range of 26mm × 33mm, 33mm × 42.2mm, and 52mm × 56mm can be used together during the manufacturing process of the display device 100. Depending on the manufacturing steps of the display device 100, batch exposure and segmented exposure can be selectively used. Given the presence of the peripheral area 600 around the display device 100, the display device 100 with the aforementioned display area 500 can be manufactured by applying exposure equipment and exposure methods (batch exposure / segmented exposure) capable of exposing an area larger than the display area 500.

[0055] Figure 3B A cross-sectional view of a display device 100 is shown, wherein a lens array 170 is disposed on the display element 14 of the pixel 140. Figure 3A Same, Figure 3B Only the substrate 105 and the pixels 140 including the lens array 170 are shown; the semiconductor elements and wiring structure of the display device 100 are omitted. Figure 3B As shown, the display device 100 and the light-transmitting plate 300 are bonded together via the adhesive member 200. The lens array 170 and the light-transmitting plate 300 are spaced apart by a distance G, and a gap 180 is provided between the lens array 170 and the light-transmitting plate 300. The display unit 145 includes a set of pixels 140R, 140G and 140B corresponding to the three colors R, G and B respectively. Figure 2B yes Figure 2A and Figure 3B An enlarged view of the display unit 145. The lens array 170 includes microlenses disposed in each pixel 140. The lens array 170 has a height difference H. If adjacent microlenses are spaced apart, the thickness of the lens array 170 corresponds to the height difference H of the lens array 170. If adjacent microlenses are not spaced apart but are in contact with each other, then... Figure 2BAs shown, the distance between the upper portion 170T and the lower portion 170B of the front surface 101 of the lens array 170 corresponds to the height difference H of the lens array 170. Assume that the microlenses of the lens array 170 are hemispheres (with a height equal to half of the diameter) having the same diameter as the pixel size X. In this case, the height difference H of the lens array 170 can be half of the pixel size X (H = X / 2). However, hemispherical microlenses have low optical efficiency and low productivity. Therefore, it is desirable that the microlenses be aspherical or less than hemispherical. Thus, it is desirable that the height difference H of the lens array 170 be less than half of the pixel size X. If such a lens array 170 is used, the height difference H of the front surface 101 in the display area 500 is less than half of the pixel size X of one of the plurality of pixels 140 constituting the display area 500. It is desirable to satisfy the condition H < X / 2.

[0056] Foreign matter DUS adhering to the front surface 101 of the display device 100 is washed off before bonding the light-transmitting plate 300. In contrast, small foreign matter DUS that is stuck between the surface bumps of the lens array 170 and is smaller than the height difference H cannot be removed by washing and remains thereon. As Figure 3B shown, foreign matter DUS having a size relationship of Q < H with respect to the surface bumps and recesses having the height difference H is likely to remain. Assume that the light-transmitting plate 300 and the display device 100 are bonded in a state where such foreign matter DUS has moved to the upper portion 170T of the lens array 170. In this case, if the distance G between the light-transmitting plate 300 and the lens array 170 is too small, the foreign matter DUS may damage the display device 100. By setting the distance G to be greater than the foreign matter DUS having a size relationship of Q < H, that is, G > H, it is possible to prevent the foreign matter DUS remaining between the surface bumps of the lens array 170 from damaging the display device 100. For example, the height difference H of the lens array 170 is 0.5 μm to 5 μm, 1 μm to 3 μm, or 1.5 μm to 2.5 μm. The distance G is, for example, 3 μm to 10 μm. If the height difference H of the front surface 101 in the display area 500 is attributable to the lens array 170, there are a very large number of bumps and recesses repeating. Therefore, even if the height difference H of the front surface 101 in the display area 500 is 1 μm or less, it is desirable to satisfy the relationship G > H.

[0057] Next, other characteristic configurations of the display device 800 will be described with reference to Figures 6A to 6C As Figure 6AAs shown, a plurality of pixels 140 are configured in the display area 500 of the display device 100. Peripheral areas 601 and 602 are disposed around the display area 500. Peripheral area 601 refers to the peripheral areas on the left and right sides of the display area 500. Peripheral area 602 refers to the peripheral areas above and below the display area 500. To suppress reflections in peripheral areas 601 and 602, a color filter array 152 also extends outside the display area 500. The outer edge 152E of the color filter array 152 is located in peripheral areas 601 and 602. In this exemplary embodiment, as... Figure 6A As shown, the contact portion 700 is located in the peripheral region 601. A comparison between the widths of the peripheral regions 601 and 602 shows that the peripheral region 601, where the contact portion 700 is located, is wider, and the peripheral region 602 is narrower than the peripheral region 601. In this exemplary embodiment, the adhesive member 200 is thus positioned such that, in the peripheral region 602, a portion of the outer edge 152E of the color filter array 152 overlaps with the adhesive member 200. The inner edge 201 of the adhesive member 200, or the side facing the gap 180, overlaps with the color filter array 152. The outer edge 202 of the adhesive member 200, or the side opposite to the surface facing the gap 180, does not overlap with the color filter array 152. In other words, the inner edge 201 of the adhesive member 200 is located on the color filter array 152, and the outer edge 202 of the adhesive member 200 is located outside the outer edge 152E of the color filter array 152. In contrast, in the peripheral region 601 where the contact portion 700 is located, both the inner edge 201 and the outer edge 202 of the adhesive member 200 are located outside the outer edge 152E of the color filter array 152. Figure 6B The X-X' section of the structure of the surrounding region 601 is shown. Figure 6C The Y-Y' section of the structure in the surrounding region 602 is shown. (See figure.) Figure 6B and Figure 6CAs shown, the display device 100 includes a substrate 105. The surface on the front and back surfaces of the substrate 105 where transistors are disposed will be referred to as the main surface 1. Semiconductor elements 110, insulating members 120, and wiring structures 130 are formed in / on the main surface 1 of the substrate 105. A plurality of pixel electrodes 141, opposing electrodes 142 opposite to the plurality of pixel electrodes 141, and an organic material layer 143 between the plurality of pixel electrodes 141 and the opposing electrodes 142 are disposed in / on the insulating member 120. Although omitted here, insulating pixel separators (also referred to as dams) may be located between the plurality of pixel electrodes 141. As described above, the display element 14 of the pixel 140 is an EL element, and each EL element includes a pixel electrode 141, an organic material layer 143, and an opposing electrode 142. In each EL element, the pixel electrode 141 serves as the anode, and the opposing electrode 142 serves as the cathode. The wiring structure 130 is disposed between the plurality of pixel electrodes 141 and the substrate 105. Pixel electrode 141 and opposing electrode 142 are connected to appropriate wiring of wiring structure 130. For example... Figure 6B As shown, a contact portion 700 is provided in the peripheral region 601. In the contact portion 700, the opposing electrode 142 is connected to the grounding wiring 130E provided in the peripheral region 601.

[0058] The protective film 150 covers the display element 14 (opposing electrode 142, organic material layer 143 and pixel electrode 141), wiring structure 130, insulating member 120 and substrate 105 of the pixel 140.

[0059] A color filter array 152 is disposed on a protective film 150 with a resin layer 151 in between. A resin layer 153 is disposed on the color filter array 152. In other words, the color filter array 152 is located between resin layers 151 and 153. Resin layer 151 serves as an adhesive layer, and resin layer 153 serves as a planarization layer. Resin layer 153 is disposed on the display area 500 and peripheral areas 601 and 602. The color filter array 152 is disposed between the resin layer 153 and the display device 100. If the color filter array 152 is not disposed in the peripheral areas 601 and 602, the image quality will be degraded due to the reflection of light in the peripheral areas 601 and 602 and the incident light on the peripheral areas 601 and 602. Therefore, the color filter array 152 is disposed to some extent in the area outside the display area 500. The resin layer 153 covers the sides of the outer edge 152E of the color filter array 152. Resin layers 151 and 153 are stacked on the protective film 150 outside the outer edge 152E of the color filter array 152.

[0060] The adhesive component 200 is disposed in the peripheral areas 601 and 602 and is used to bond the light-transmitting plate 300.

[0061] To improve the light-shielding properties of the surrounding area 600, the color filter array 152 can be formed all the way to the end of the substrate 105, and an adhesive member 200 can be formed on the color filter array 152 to bond the light-transmitting plate 300. However, the color filter array 152 contains pigments, and the adhesion between the color filter array 152 and the substrate layer is low. This causes interlayer delamination problems at the interface between the color filter array 152 and the adhesive member 200, and at the interface between the color filter array 152 and the substrate layer. This interlayer delamination can occur due to the curing shrinkage of the resin during the formation of the adhesive member 200, and the expansion and contraction when the display device 800 is exposed to a high-temperature and high-humidity environment.

[0062] In this example, as described below, there is a region below the adhesive member 200 that does not include the color filter array 152. Providing a region below the adhesive member 200 that does not include the color filter array 152 prevents interlayer delamination between the adhesive member 200 and the display device 100 due to volume shrinkage during the curing of the adhesive member 200. It also prevents interlayer delamination between the adhesive member 200 and the display device 100 due to material expansion and contraction caused by exposure to high temperature and high humidity environments. Furthermore, it prevents interlayer delamination between the color filter array 152 and its substrate layer. Specifically, if the color filter array 152 contains pigment, the adhesion to the components to be bonded is lower compared to the case where the color filter array 152 contains dye. If the color filter array 152 contains pigment, interlayer delamination is prone to occur due to volume shrinkage during the curing of the adhesive member 200 and expansion and contraction when the display device 800 is exposed to high temperature and high humidity environments. This example is therefore applicable to the case where the color filter array 152 contains pigment.

[0063] The details of the placement of the adhesive component 200 will be described below. For example... Figure 6B As shown, the peripheral region 601 where the contact portion 700 is provided is wider than the peripheral region 602 where the contact portion 700 is not provided. In the peripheral region 601, the adhesive member 200 is therefore provided outside the outer edge 152E of the color filter array 152. The adhesive member 200 is provided between the resin layers 151 and 153 and the light-transmitting plate 300. In other words, there is a region where the resin layers 151 and 153 extend between the adhesive member 200 and the display device 100. As described above, providing a region below the adhesive member 200 that does not include the color filter array 152 can prevent interlayer delamination between the adhesive member 200 and the display device 100 due to volume shrinkage during the curing of the adhesive member 200. It can also prevent interlayer delamination between the adhesive member 200 and the display device 100 due to material expansion and contraction under high temperature and high humidity environments. It can also prevent interlayer delamination between the color filter array 152 and the substrate layer of the color filter array 152.

[0064] In contrast, the peripheral region 602, where the contact portion 700 is not provided, is narrower than the peripheral region 601; therefore, its structure is as follows: Figure 6C As shown, the inner edge 201 of the adhesive member 200 is disposed on the color filter array 152 formed outside the display area 500. The outer edge 202 of the adhesive member 200 is located outside the outer edge 152E of the color filter array 152. The adhesive member 200 is partially located between the resin layer 151, the color filter array 152 and the resin layer 153 and the light-transmitting plate 300, and partially located between the resin layers 151 and 153 and the light-transmitting plate 300. There is an overlap region 205 between the adhesive member 200 and the color filter array 152. In other words, there is a region where the resin layers 151 and 153 extend between the adhesive member 200 and the display device 100, and a region where the resin layers 151 and 153 and the color filter array 152 extend. By thus providing the adhesive member 200 to overlap with the color filter array 152, space equal to the width of the overlap region 205 can be saved, and the size of the display device 100 can be reduced. The overlapping region 205 has the aforementioned risk of interlayer delamination. However, since the adhesive member 200 is located in the region outside the overlapping region 205, excluding the color filter array 152, interlayer delamination is prevented from developing in the width direction throughout the adhesive member 200. As a result, interlayer delamination between the adhesive member 200 and the display device 100 due to volume shrinkage during the curing of the adhesive member 200 can be prevented. Interlayer delamination between the adhesive member 200 and the display device 100 due to the expansion and contraction of the material exposed to high temperature and high humidity environments can also be prevented. Interlayer delamination at the interface between the color filter array 152 and the substrate layer of the color filter array 152 can also be prevented.

[0065] For example, the adhesive member 200 has a width of 0.1 mm to 2 mm, 0.5 mm to 1 mm, or 0.8 mm. The distance from the inner edge 201 of the adhesive member 200 to the outer edge 152E of the color filter array 152, i.e., the width of the overlapping region 205, is, for example, 10 μm to 500 μm, 50 μm to 200 μm, or 100 μm. For example, the distance from the outer edge 152E of the color filter array 152 to the outer edge 202 of the adhesive member 200 is 0.1 mm to 1 mm, 0.5 mm to 1 mm, or 0.7 mm. The adhesive member 200 can include a resin matrix and resin spacers dispersed in the matrix. The distance G between the display device 100 and the light-transmitting plate 300 is adjusted by the particle size of the spacers. Figure 6CAs shown, the distance G between the display device 100 and the light-transmitting plate 300 in the display area 500 can vary with the thickness of the adhesive member 200 in the overlapping area 205 of the adhesive member 200 and the color filter array 152. Therefore, the distance G is the difference between the spacer diameter and the thickness of the lens array 170. For example, the lens array 170 has a total thickness of 2 μm, and the spacer has a particle size of 30 μm. In this case, the distance G is 28 μm. The matrix resin of the adhesive member 200 is in contact with both the display device 100 and the light-transmitting plate 300. As another example of the adhesive member 200, the adhesive member 200 may include a base occupying most of the thickness of the adhesive member 200, an adhesive layer bonding the base to the display device 100, and another adhesive layer bonding the base to the light-transmitting plate 300.

[0066] The light-transmitting plate 300 has an inclined surface 340 formed by chamfering at the end of the main surface 310 of the light-transmitting plate 300 opposite to the display device 100. The inclined surface 340 prevents the corner of the light-transmitting plate 300 from contacting the display device 100, thus preventing damage to the display device 100 during bonding. The width of the inclined surface 340 in the direction parallel to the main surface 310 is, for example, 0.1 mm. In this example, the inclined surface 340 is formed only at the end of the main surface 310 opposite to the display device 100. However, the inclined surface can be formed at the end of the main surface 320 that is not opposite to the display device 100 by chamfering. Alternatively, the inclined surface can be formed at the ends of both the main surfaces 310 and 320.

[0067] Below, we will refer to Figure 7 Explain the relationship between width W and distance L. In this relationship, W is the width of the adhesive member 200, and L is the distance from the outer edge of the display area 500 to at least a portion of the adhesive member 200. The distance from the outer edge of the display area 500 to the adhesive member 200 does not need to be uniform across the entire outer edge of the display area 500.

[0068] Figure 7It is a schematic diagram showing a state where the emitted light EMI is emitted from the pixel 140E at the outer edge of the display area 500 at an emission angle θ. For simplicity, the lens array 170 is omitted in the figure. The angle between the normal of the main surface of the display device 100 and the emitted light EMI will be defined as the emission angle θ. In order to prevent the emitted light EMI from the pixel 140E at the outer edge of the display area 500 from being blocked by the bonding member 200, it is desirable to satisfy the relationship L > G·tanθ. In other words, if the relationship L ≤ G·tanθ holds, the emitted light EMI from the pixel 140E at the outer edge of the display area 500 will be blocked by the bonding member 200, resulting in display defects. It can be seen that the desired distance L depends on the viewing angle. In typical applications, a viewing angle of about 45° is sufficient. If θ = 45°, the above formula gives L > G. In other words, it is desirable that the distance L from the display area 500 to at least a part of the bonding member 200 is greater than the distance G. To save space, it is also desirable that the distance L from the pixel 140E at the outer edge of the display area 500 to the bonding member 200 is less than the width W of the bonding member 200. In other words, it is desirable to satisfy the relationship W > L. Also considering the above relationship of pixel size X < G, it is desirable to design the display device 800 to satisfy the relationship X < G < L < W. For example, the pixel size X is 5 μm to 10 μm, the distance G is 10 μm to 50 μm, the distance L is 50 μm to 500 μm, and the width W is 500 μm to 1000 μm. As an example of the display device 800, the pixel size X is 6 μm, the distance G is 28 μm, the distance L is 100 μm, and the width W is 700 μm.

[0069] One of the features of this exemplary embodiment is that the void 180 communicates with the space (outer space) on the side of the bonding member 200 opposite to the void 180. For example, as Figures 8A to 8D shown, a gap 250 is provided between a part and another part of the bonding member 200 for the void 180 to communicate with the outer space. The part and another part of the bonding member 200 refer to the parts of the bonding member 200 located on both sides of the gap 250. In addition to the technique of providing the gap 250, a groove or hole for the void 180 to communicate with the outer space can be formed in the light-transmitting plate 300 or the display device 100.

[0070] The desired pattern of the adhesive member 200 will now be described. In the aforementioned exemplary embodiment, the adhesive member 200 has a closed pattern surrounding the display area 500. However, at least one of one or more gaps 250 can be formed in the adhesive member 200. If no gap 250 is provided in the adhesive member 200, the pressure in the gap 180 changes with the external environment. This can deform the light-transmitting plate 300 and impair the quality and reliability of the display device 100. For example, if the external environment suddenly changes from room temperature to below freezing point, the pressure in the gap 180 drops, creating a pressure difference between the inside and outside of the adhesive member 200, thereby causing the light-transmitting plate 300 to deform toward the display device 100. As described above, display defects that can be caused by the presence of foreign objects can be prevented by setting the distance G to be larger than the pixel size X. However, if the light-transmitting plate 300 deforms, thereby changing the distance G, the display device 100 may be damaged by foreign objects on the inside. It is difficult to define the deformation of the light-transmitting plate 300 unconditionally, as the deformation also depends on the rigidity of the light-transmitting plate 300. Therefore, it is desirable to prevent deformation of the light-transmitting plate 300 itself due to changes in the external environment. If no gap 250 is provided in the adhesive member 200 and drastic temperature cycling is repeated between high and low temperatures, the gap 180 repeatedly expands and contracts, causing repeated stress at the interface of the adhesive member 200. This can even lead to the adhesive member 200 peeling off from the display device 100 or the interlayer of the light-transmitting plate 300. In particular, the smaller the linewidth W of the adhesive member 200, the more pronounced this problem becomes. There is also the problem of moisture condensation. For example, suppose the adhesive member 200 does not have a gap 250, and the pressure in the gap 180 reaches the saturated vapor pressure when left in a high-temperature and high-humidity environment. In this case, a sharp drop in ambient temperature reduces the saturated vapor pressure, causing condensation in the gap 180. Condensation in the gap 180 can impair display quality and reliability. To avoid these problems, it is desirable that the adhesive component 200 has at least one of one or more gaps 250. Referring below... Figures 8A to 8D This describes the layout pattern of the gap 250 in the adhesive component 200.

[0071] Figures 8A to 8D This is a plan view of a display device 800 including an adhesive member 200 with a gap 250, when viewed perpendicularly to the front surface 101, which is the main surface of the display device 100.

[0072] exist Figure 8A In the middle, the gap 250 is provided on the side where the contact portion 700 is located. For example... Figure 8AAs shown, the display area 500 has a rectangular outline, and the gap 250 is located between two straight lines (shown as dashed lines) formed by imagining the top and bottom edges of the outline as extensions. There is no external connection terminal 190 at the location between the two straight lines shown by the dashed lines. If the adhesive member 200 is formed using a dispensing method, the gap ends of the adhesive member 200 corresponding to the dispensing start and end points can have a slightly larger line width compared to the portion other than the gap ends. As described above, the peripheral area 600 is wider on the side where the contact portion 700 is provided than on other sides, and the slightly larger line width of the adhesive member 200 near the gap 250 is not significant. Therefore, it is desirable to position the gap 250 on the side where the contact portion 700 is located.

[0073] As another example, in Figure 8B In the display area 500, a gap 250 is provided on the side where the external connection terminal 190 is located. The display area 500 has a rectangular outline, and the gap 250 is located between two straight lines (shown as double-dotted lines) imaginarily extending from opposite left and right sides of the outline. At least a portion of the external connection terminal 190 is located between the two straight lines shown by the double-dotted lines. For the wiring structure to be arranged, the area between the external connection terminal 190 and the display area 500 is generally wider than the other sides. As with the aforementioned layout pattern, the gap 250 can be easily provided. Since the gap 250 in the adhesive member 200 can serve as an entry point for foreign objects, it is desirable to configure a structure outside the gap 250 but not to close the gap 250. The FPC board (not shown) is bonded to the external connection terminal 190, and a reinforcing resin 260 can be provided to enhance the adhesion between the FPC board and the display device 100. The gap 250 is suitably provided on the side where the external connection terminal 190 is located because the reinforcing resin 260 for the FPC board can serve as a structure to prevent the intrusion of foreign objects.

[0074] As another example, such as Figure 8C As shown, the gap 250 can be located in the corner. The display area 500 has a rectangular outline, and the gap 250 is located outside the range between two lines (shown as dashed lines) imaginarily extending from the opposite top and bottom edges of the outline. Alternatively, the gap 250 is located outside the range between two lines (shown as double dashed lines) imaginarily extending from the opposite left and right sides of the outline. Because the distance from the gap 250 to the display area 500 is relatively large, providing the gap 250 in the corner can reduce the risk of display defects caused by foreign objects entering the gap 250.

[0075] exist Figure 8DIn this design, the adhesive member 200 has a double pattern. The adhesive member 200 includes: an adhesive member pattern 203 disposed around the display area 500 and having a gap 250; and an adhesive member pattern 202 disposed inside the adhesive member pattern 203 and spaced apart from it. The adhesive member pattern 202 is configured to overlap with the gap 250 in the adhesive member pattern 203 when viewed in a plan view. The adhesive member pattern 202 can be disposed outside the adhesive member pattern 203. The arrangement of the adhesive member pattern 202 can form a maze-like gap 250 to increase the distance that foreign objects entering the adhesive member 200 must travel to reach the display area 500. This reduces the risk of display defects.

[0076] As described above, providing a gap 250 in the adhesive component 200 can reduce the risk of display defects and reliability degradation that can be caused by changes in the external environment.

[0077] As described above, according to this exemplary embodiment, display defects that may be caused by foreign objects can be prevented by making the distance G between the display device 100 and the light-transmitting plate 300 greater than the pixel size X. If the display device 800 includes a lens array 170, display defects that may be caused by foreign objects can be prevented by making the distance G between the display device 100 and the light-transmitting plate 300 greater than the height difference H of the lens array 170. Furthermore, the risk of display defects and reliability degradation due to changes in the external environment can be reduced by forming a gap 250 in the adhesive member 200. The display quality and reliability of the display device 800 can be improved in this way.

[0078] In this exemplary embodiment, a gap 180 is provided between the light-transmitting plate 300 and the display device 100. Compared to the case where the space between the light-transmitting plate 300 and the display area 500 is filled with a light-transmitting member, this is disadvantageous in terms of the adhesive strength between the light-transmitting plate 300 and the display device 100. In other words, due to the provision of the gap 180, it is difficult to increase the adhesive area between the light-transmitting plate 300 and the display device 100. In addition, the gap 180 reduces the heat conduction between the display device 100 and the light-transmitting plate 300, and a temperature difference is more likely to occur between the display device 100 and the light-transmitting plate 300. Since the display device 100 and the light-transmitting plate 300 tend to have different amounts of thermal expansion, stress is easily generated between the display device 100 and the light-transmitting plate 300. Furthermore, in order to reduce thermal damage to the organic material layer 143, it is desirable to prevent the resin film constituting the resin layers 151 and 153 from being exposed to high temperatures. Therefore, the resin film may sometimes not cure sufficiently. If the display device 100 and the light-transmitting plate 300 are bonded via the adhesive member 200 through an insufficiently cured resin film, interlayer delamination may occur at the interface between the insufficiently cured resin film and the protective film 150. Interlayer delamination may also occur at the interface between the insufficiently cured resin film and the adhesive member 200. The insufficiently cured resin film itself may also crack. Therefore, a description of a structure that improves the adhesive strength between the light-transmitting plate 300 and the display device 100 within a limited bonding area will be given.

[0079] Figure 9A and Figure 9B It is along Figure 6A The cross-sectional view taken along line Z-Z'. The display device 100 includes a substrate 105 and an inorganic material layer located between the substrate 105 and the void 180. Figure 9AIn the protective film 150, an inorganic material layer may be included. The inorganic material layer included in the protective film 150 is typically a silicon nitride layer. The inorganic material layer included in the protective film 150 extends between the adhesive member 200 and the substrate 105. The display device 100 includes an organic material layer 143 between the substrate 105 and the inorganic material layer of the protective film 150, and a resin layer or at least one of resin layers 151 and 153 between the organic material layer 143 and the voids 180. The ends of the resin layers 151 and 153 are located inside the adhesive member 200. The resin layers 151 and 153 are formed to expose the inorganic material layer included in the protective film 150. Therefore, the adhesive member 200 contacts the inorganic material layer included in the protective film 150. Since contact between the adhesive member 200 and resin layers 151 and 153 would reduce the adhesive strength, resin layers 151 and 153 are removed so that the adhesive member 200 contacts the inorganic material layer included in the protective film 150. The absence of resin layers 151 and 153 between the adhesive member 200 and the substrate 105 reduces the possibility of interlayer delamination that may be caused by resin layers 151 and 153.

[0080] This structure can be formed as follows: a resin film constituting resin layers 151 and 153 is formed on the entire surface of substrate 105, and then the resin film is left... Figure 9A and Figure 9B In the case of residual areas shown, removal in Figure 9A and Figure 9B The resin film in the removal area is shown. For example, after forming the resin film constituting resin layer 151 and the resin film constituting resin layer 153 on the entire surface of substrate 105, the two resin films in the removal area can be etched away while the residual area is protected by a mask. This effectively removes the unwanted film from the removal area. The ends of resin layers 151 and 153 are therefore located at substantially the same position. The ends being located at substantially the same position means that the difference between the positions of the respective ends is less than 1 μm. Alternatively, each resin film can be removed from the removal area each time a resin film is formed. In this case, the ends of resin layers 151 and 153 do not need to be in the same position. If the resin film is photosensitive, each resin film can be patterned by photolithography each time a resin film is formed.

[0081] exist Figure 9BIn this embodiment, an AR film 171 is disposed on the lens array 170. The AR film 171 includes an inorganic material layer such as a silicon oxide layer, a silicon nitride layer, and a silicon oxynitride layer. An organic material layer 143 is disposed between the substrate 105 and the inorganic material layer included in the AR film 171. Like the ends of resin layers 151 and 153, the ends of the AR film 171 are located inside the adhesive member 200. Therefore, the adhesive member 200 contacts the inorganic material layer included in the protective film 150, rather than the inorganic material layer included in the AR film 171. The inorganic material layer included in the AR film 171 can also be patterned together with the resin films constituting resin layers 151 and 153.

[0082] The inorganic material layer included in AR film 171 can remain in the removal area where resin layers 151 and 153 have been removed. In this case, the inorganic material layer included in AR film 171 can extend between adhesive member 200 and substrate 105. Adhesive member 200 can contact the organic material layer included in AR film 171. Even when the inorganic metal material layer included in AR film 171 remains in the removal area where resin layers 151 and 153 have been removed, the adhesive strength advantageously does not decrease much because there is no resin layer 151 or 153 between the inorganic material layer and substrate 105 (i.e., resin layers 151 and 153 are removed).

[0083] Figure 9A The peripheral region 600 shown includes an invalid pixel region 610 and a peripheral loop region 620. Figure 9A In the example, the color filter array 152 in the invalid pixel region 610 includes a multicolor portion. Figure 9B In the example, the color filter array 152 in the invalid pixel region 610 includes a monochrome portion. Figure 9A and Figure 9B A pixel isolation portion 144, referred to as a dam, is shown. The pixel isolation portion 144 is made of an inorganic material layer such as a silicon oxide layer and a silicon nitride layer. The inorganic material layer constituting the pixel isolation portion 144 may be disposed between the substrate 105 and the adhesive member 200. The peripheral region 600 of the substrate 105 also includes a contact portion 139 electrically connected to the wiring structure 130 through a through-hole plug.

[0084] Figure 10AAn example of an equipment EQP including a display device DSPL is shown. The aforementioned display device 800 can be applied to the display device DSPL. The equipment EQP includes at least one of a control device CTRL, a communication device IF, an optical device OPT, an imaging device IS, and an audio device AUDIO. The control device CTRL controls the display device DSPL. The control device CTRL can be a digital signal processor (DSP) or an application-specific integrated circuit (ASIC). The communication device IF communicates (transmits / receives) signals including information to be displayed on the display area 500. The communication device IF includes wireless communication and / or wired communication functions. The communication device IF may only include a receiving function and not a transmitting function. The optical device OPT projects the image displayed on the display area 500 onto a screen or retina. The optical device OPT can be a lens, prism, or mirror. The imaging device IS captures the image to be displayed in the display area 500. The imaging device IS can be a complementary metal-oxide-semiconductor (CMOS) image sensor for photoelectric conversion of light input from outside the equipment EQP. The audio device AUDIO can include a microphone for inputting sound from outside the equipment EQP and / or a speaker for outputting sound. In particular, depending on the specifications of the EQP equipment and the user's needs, the imaging device IS and audio device AUDIO can be appropriately omitted.

[0085] Equipment EQP is applicable to electronic devices such as information terminals with display functions (e.g., smartphones and wearable devices) and cameras (e.g., interchangeable lens cameras, pocket cameras, camcorders, and surveillance cameras). Equipment EQP can also be transportation equipment such as vehicles, ships, and aircraft. Equipment EQP used as transportation equipment is applicable to transportation display devices 800 and devices used to assist driving (manipulation) using display functions. Alternatively, equipment EQP can be ophthalmic or other medical devices, measuring instruments such as range sensors, or office equipment such as photocopiers.

[0086] Figure 10BAn example of a head-mounted display (HMD) equipped with an EQP is shown. The HMD includes a wearable unit (WR) that uses the EQP as its head-mounted display. Examples of the wearable unit (WR) include a strap and a band. The HMD includes multiple display devices (DSPL) allowing the user to view images with both eyes. The HMD also includes multiple imaging devices (IS) enabling distance information to be acquired. The audio device (AUDIO) includes a microphone located near the user's mouth, allowing speech from the user's mouth to be input to the microphone. The audio device (AUDIO) includes speakers located near the user's ears, allowing sound to be output to the user's ears. The display area of ​​the display devices (DSPL) in the HMD can have a diagonal length of 24 mm or more.

[0087] Variations can be made to the foregoing exemplary embodiments without departing from the technical concept. The disclosure of this specification is not limited to what is described herein, and covers all matters that can be understood from this specification and the accompanying drawings.

[0088] Within the aforementioned specific numerical ranges, the symbol "e to f" (where e and f are numbers) refers to values ​​greater than or equal to e and / or less than or equal to f. Within these specific numerical ranges, if the ranges i to j and m to n (where i, j, m, and n are numbers) are written together, the lower and upper limit value groups are not limited to the groups of i and j or m and n. For example, lower and upper limits in multiple groups can be checked together. More specifically, if the ranges i to j and m to n are written together, either the range i to n or the range m to j can be checked.

[0089] The disclosure in this specification includes a supplementary set of the various concepts described herein. More specifically, if this specification states "A is greater than B" while omitting the statement "A is not greater than B," it can be said that this specification discloses "A is not greater than B." This is because "A is greater than B" is an assertion based on consideration of the case where "A is not greater than B."

[0090] While this disclosure has been described with reference to exemplary embodiments, it should be understood that this disclosure is not limited to the disclosed exemplary embodiments. The scope of the claims should be given the broadest interpretation to cover all such variations, equivalent structures, and functions.

Claims

1. A display device comprising: A display device, comprising a display area; and A light-transmitting plate, which overlaps with the display device, Its characteristic is that a gap is provided between the display area and the light-transmitting plate. The display device has foreign matter present in the gap. Between the display area and the light-transmitting plate, the distance G from the front surface of the display device facing the gap to the main surface of the light-transmitting plate facing the gap is greater than the height difference H between the highest point of the high portion and the lowest point of the low portion of the front surface in the display area, and the height difference H is greater than 1 μm. The size Q of the foreign object is less than or equal to the height difference H.

2. The display device according to claim 1, wherein, The height difference H is less than half the size X of one of the pixels that constitute the display area.

3. The display device according to claim 2, wherein, The pixel has a first color. In the direction in which the pixel has the size X, i) The pixel is located between two pixels having the first color, and ii) Between the two pixels having the first color, two pixels having the second color and two pixels having the third color are provided, and The distance G is less than the sum of the pitch Pa and the pitch Pb, wherein the pitch Pa is the pitch between the one pixel having the first color and one of the two pixels having the first color, and the pitch Pb is the pitch between the one pixel having the first color and the other of the two pixels having the first color.

4. The display device according to claim 2, wherein, The pixel has a first color. In the direction in which the pixel has the size X, i) The pixel is located between two pixels having the first color, and ii) Between the two pixels having the first color, two pixels having the second color and two pixels having the third color are provided, and The distance G is less than the distance between the two pixels having the first color.

5. The display device according to claim 2, wherein, The pixel has a first color. In the direction in which the pixel has the size X, the pixel is located between a pixel having a second color and a pixel having a third color, and The distance G is greater than the sum of the size X of the pixel having the first color, the size of the pixel having the second color in the direction, and the size of the pixel having the third color in the direction.

6. The display device according to claim 1 or 2, wherein, The distance G is less than the thickness R of the light-transmitting plate.

7. The display device according to claim 1 or 2, wherein, The distance G is less than 40 μm.

8. The display device according to claim 1 or 2, wherein, The distance G is less than 10 μm.

9. The display device according to claim 1 or 2, wherein, The distance G is greater than 20 μm.

10. The display device according to claim 1 or 2, wherein, The display device includes a peripheral area surrounding the display area, and An adhesive component configured to bond the display device to the light-transmitting plate is provided between the peripheral area and the light-transmitting plate.

11. The display device according to claim 10, wherein, The distance L from the display area to at least a portion of the adhesive member is greater than the distance G and less than the width W of the adhesive member.

12. The display device according to claim 1 or 2, wherein, The display device includes a substrate and an inorganic material layer located between the substrate and the gap.

13. The display device according to claim 12, wherein, The display device includes a peripheral area surrounding the display area. An adhesive member configured to bond the display device to the light-transmitting plate is provided between the peripheral area and the light-transmitting plate. No resin layer is located between the adhesive member and the substrate.

14. The display device according to claim 13, wherein, The inorganic material layer is a silicon nitride layer.

15. The display device according to claim 1 or 2, wherein, The display device includes a substrate, which is a single-crystal semiconductor substrate, and its thickness is greater than that of the light-transmitting plate.

16. The display device according to claim 1 or 2, wherein, The display device includes a lens array.

17. The display device according to claim 1 or 2, wherein, The display device includes a color filter array.

18. The display device according to claim 1 or 2, wherein, The display device includes a color filter array and a lens array located between the color filter array and the gap.

19. The display device according to claim 10, wherein, The adhesive component includes a resin portion and a spherical spacer.

20. The display device according to claim 10, wherein, A conductor film is provided throughout the display area and the surrounding area, and the adhesive member overlaps with the conductor film.

21. The display device according to claim 10, wherein, The display device includes a color filter array, and The adhesive member overlaps with the color filter array on the side of the gap, and the side of the adhesive member opposite to the gap does not overlap with the color filter array.

22. The display device according to claim 1 or 2, wherein, The light-transmitting plate includes an inclined surface that is tilted relative to the side surface and the main surface of the light-transmitting plate, the inclined surface extending from the side surface to the main surface.

23. The display device according to claim 1 or 2, wherein, The area of ​​the display area is greater than 153 mm². 2 And less than 2912mm 2 .

24. The display device according to claim 1 or 2, wherein, Multiple organic electroluminescent elements are arranged in the display area.

25. The display device according to claim 10, wherein, The gap is connected to the space on the side of the adhesive member opposite to the gap.

26. A display device comprising: A display device, comprising a display area; and A light-transmitting plate, which overlaps with the display device, Its characteristic is that a gap is provided between the display area and the light-transmitting plate. The display device has foreign matter present in the gap. Between the display area and the light-transmitting plate, the distance G from the front surface of the display device facing the gap to the main surface of the light-transmitting plate facing the gap is greater than the size X of one of the pixels constituting the display area. The size Q of the foreign object is less than or equal to the size X.

27. The display device according to claim 26, wherein, The pixel has a first color. In the direction in which the pixel has the size X, i) The pixel is located between two pixels having the first color, and ii) Between the two pixels having the first color, two pixels having the second color and two pixels having the third color are provided, and The distance G is less than the sum of the pitch Pa and the pitch Pb, wherein the pitch Pa is the pitch between the one pixel having the first color and one of the two pixels having the first color, and the pitch Pb is the pitch between the one pixel having the first color and the other of the two pixels having the first color.

28. The display device according to claim 26, wherein, The pixel has a first color. In the direction in which the pixel has the size X, i) The pixel is located between two pixels having the first color, and ii) Between the two pixels having the first color, two pixels having the second color and two pixels having the third color are provided, and The distance G is less than the distance between the two pixels having the first color.

29. The display device according to claim 26, wherein, The pixel has a first color. In the direction in which the pixel has the size X, the pixel is located between a pixel having a second color and a pixel having a third color, and The distance G is greater than the sum of the size X of the pixel having the first color, the size of the pixel having the second color in the direction, and the size of the pixel having the third color in the direction.

30. The display device according to claim 26, wherein, The distance G is less than the thickness R of the light-transmitting plate.

31. The display device according to claim 26, wherein, The distance G is less than 40 μm.

32. The display device according to claim 26, wherein, The distance G is less than 10 μm.

33. The display device according to claim 26, wherein, The distance G is greater than 20 μm.

34. The display device according to claim 26, wherein, The display device includes a peripheral area surrounding the display area, and An adhesive component configured to bond the display device to the light-transmitting plate is provided between the peripheral area and the light-transmitting plate.

35. The display device according to claim 34, wherein, The distance L from the display area to at least a portion of the adhesive member is greater than the distance G and less than the width W of the adhesive member.

36. The display device according to claim 26, wherein, The display device includes a substrate and an inorganic material layer located between the substrate and the gap.

37. The display device according to claim 36, wherein, The display device includes a peripheral area surrounding the display area. An adhesive member configured to bond the display device to the light-transmitting plate is provided between the peripheral area and the light-transmitting plate. No resin layer is located between the adhesive member and the substrate.

38. The display device according to claim 37, wherein, The inorganic material layer is a silicon nitride layer.

39. The display device according to claim 26, wherein, The display device includes a substrate, which is a single-crystal semiconductor substrate, and its thickness is greater than that of the light-transmitting plate.

40. The display device according to claim 26, wherein, The display device includes a lens array.

41. The display device according to claim 26, wherein, The display device includes a color filter array.

42. The display device according to claim 26, wherein, The display device includes a color filter array and a lens array located between the color filter array and the gap.

43. The display device according to claim 34, wherein, The adhesive component includes a resin portion and a spherical spacer.

44. The display device according to claim 34, wherein, A conductor film is provided throughout the display area and the surrounding area, and the adhesive member overlaps with the conductor film.

45. The display device according to claim 34, wherein, The display device includes a color filter array, and The adhesive member overlaps with the color filter array on the side of the gap, and the side of the adhesive member opposite to the gap does not overlap with the color filter array.

46. ​​The display device according to claim 26, wherein, The light-transmitting plate includes an inclined surface that is tilted relative to the side surface and the main surface of the light-transmitting plate, the inclined surface extending from the side surface to the main surface.

47. The display device according to claim 26, wherein, The area of ​​the display area is greater than 153 mm². 2 And less than 2912mm 2 .

48. The display device according to claim 26, wherein, Multiple organic electroluminescent elements are arranged in the display area.

49. The display device according to claim 34, wherein, The gap is connected to the space on the side of the adhesive member opposite to the gap.

50. A module comprising: The display device according to any one of claims 1 to 49; and Wiring components, The feature is that the display device includes a terminal at a position that does not overlap with the light-transmitting plate in the direction in which the display device and the light-transmitting plate overlap, and the wiring component is connected to the terminal.

51. A module comprising: The display device according to any one of claims 1 to 49; Light-shielding components; and Light-transmitting components, The light-shielding member is characterized in that it surrounds the space between the light-transmitting member and the light-transmitting plate.

52. An apparatus comprising: Display devices, which have: Including display devices for the display area, and A light-transmitting plate overlapping the display device, Its characteristic is that a gap is provided between the display area and the light-transmitting plate. The display device has foreign matter present in the gap. Between the display area and the light-transmitting plate, the distance G from the front surface of the display device facing the gap to the main surface of the light-transmitting plate facing the gap is greater than the height difference H between the highest point of the high portion and the lowest point of the low portion of the front surface in the display area, and the height difference H is greater than 1 μm; and The size Q of the foreign object is less than or equal to the height difference H. A control device configured to control the display device; A receiving device configured to receive a signal including information to be displayed on the display area; An optical device configured to project an image displayed on the display area; An imaging device configured to capture an image to be displayed on the display area; and Audio devices are configured to input or output sound.

53. The apparatus of claim 52, further comprising a mounting unit configured to use the apparatus as a head-mounted display.

54. The display device according to claim 52, wherein, The display device includes a peripheral area surrounding the display area, and An adhesive component configured to bond the display device to the light-transmitting plate is provided between the peripheral area and the light-transmitting plate. The gap is connected to the space on the side of the adhesive member opposite to the gap.

Images