Display module and manufacturing method thereof, and electronic device

Abstract

The embodiments of the present application disclose a display module and a manufacturing method thereof, and an electronic device. The display module includes a first substrate, a second substrate, a conductive connecting portion, and a transfer circuit board. The first substrate has a first circuit for realizing a touch function of the display module; the second substrate is stacked with the first substrate and has a second circuit for realizing a display function of the display module; the conductive connecting portion is electrically connected to the first circuit and the second circuit for transferring the first circuit to the second circuit; the transfer circuit board is bound to the second substrate and is electrically connected to the second circuit for transferring the first circuit and the second circuit to a mainboard of the electronic device.

Description

Technical Field

[0001] The present application relates to the field of electronic technology, and in particular to a display module and a manufacturing method thereof, and an electronic device. Background Art

[0002] With the development of electronic devices, users have higher and higher requirements for the screen display effect of electronic devices. However, the screen-to-body ratio of display screens in related technologies needs to be further improved. Summary of the invention

[0003] Embodiments of the present application provide a display module and a manufacturing method thereof, and an electronic device capable of improving the screen-to-body ratio.

[0004] The display module of the embodiment of the present application is used in an electronic device, and the display module includes:

[0005] A first substrate having a first circuit for realizing a touch function of the display module;

[0006] A second substrate is stacked with the first substrate, and the second substrate has a second circuit for realizing the display function of the display module;

[0007] a conductive connection portion, electrically connected to the first circuit and the second circuit, for switching the first circuit to the second circuit; and

[0008] The transfer circuit board is bound to the second substrate and electrically connected to the second circuit to transfer the first circuit and the second circuit to the mainboard of the electronic device.

[0009] According to some embodiments of the present application, the conductive connection portion includes a welding wire, and two ends of the welding wire are electrically connected to the first circuit and the second circuit respectively.

[0010] According to some embodiments of the present application, the first substrate includes a first binding area, the first binding area is located at an edge of the first substrate close to the second substrate, and the first substrate is further provided with a first pad electrically connected to the first circuit, and the first pad is provided in the first binding area;

[0011] The second substrate includes a second binding area, which is located at an edge of the second substrate close to the first substrate and corresponds to the position of the first binding area. The second substrate is also provided with a second pad electrically connected to the second circuit, and the second pad is provided in the second binding area.

[0012] Two ends of the bonding wire are respectively bonded to the first bonding pad and the second bonding pad.

[0013] According to some embodiments of the present application, the display module further includes a chip, which is bound to the second substrate and electrically connected to the second circuit, and is used to drive the first circuit and the second circuit.

[0014] According to some embodiments of the present application, the transfer circuit board includes a first circuit board and a second circuit board electrically connected to each other, two ends of the first circuit board are respectively bound to the second substrate and the second circuit board, and the second circuit board is electrically connected to the main board;

[0015] The display module also includes a chip, which is bound to the first circuit board and is used to drive the first circuit and the second circuit.

[0016] According to some embodiments of the present application, the first circuit board is bonded to the second substrate via an anisotropic conductive adhesive film.

[0017] According to some embodiments of the present application, the first circuit board and the second circuit board are bonded together by an anisotropic conductive adhesive film.

[0018] According to some embodiments of the present application, the display module further includes a glue layer, which covers the connection between the conductive connection part and the first circuit and the second circuit.

[0019] The electronic device of the embodiment of the present application includes a mainboard and any one of the display modules described above.

[0020] The manufacturing method of the display module of the embodiment of the present application includes:

[0021] Providing a first substrate, wherein the first substrate has a first circuit for realizing a touch function of the display module;

[0022] Providing a second substrate, wherein the second substrate is stacked with the first substrate and has a second circuit for realizing the display function of the display module;

[0023] Using a conductive connection portion to electrically connect the first circuit and the second circuit to transfer the first circuit to the second circuit;

[0024] A transfer circuit board is provided, which is bound to the second substrate and electrically connected to the second circuit, so as to transfer the first circuit and the second circuit to a mainboard of an electronic device.

[0025] One embodiment of the above application has at least the following advantages or beneficial effects:

[0026] The display module of the embodiment of the present application uses a conductive connection part to connect the first circuit of the first substrate and the second circuit of the second substrate, and a transfer circuit board is bound to the second substrate and electrically connected to the second circuit, so that the first circuit can be transferred to the second circuit through the conductive connection part, and then the first circuit and the second circuit are transferred to the mainboard of the electronic device through the transfer circuit board. Since the display module of the embodiment of the present application uses a conductive connection part to replace the flexible circuit board to electrically connect to the first circuit and the second circuit respectively, on the one hand, the flexible circuit board is saved, and two binding processes are saved on the basis of saving material costs. On the other hand, there is no need to bend the flexible circuit board to the back of the panel, and the problem of increasing the distance of the black border of the screen in the bending area is avoided, and the effect of increasing the screen-to-body ratio is finally achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 FIG. 1 is a schematic diagram of an embodiment of a display module in the related art.

[0028] Figure 2 FIG. 1 is a schematic diagram of another embodiment of a display module in the related art.

[0029] Figure 3 The figure shows a schematic diagram of a touch flexible circuit board and a main flexible circuit board of a display module in the related art when they are bent to the back of a lower glass substrate.

[0030] Figure 4 Shown is a schematic diagram of an embodiment of a display module of the present application.

[0031] Figure 5 Shown is a schematic diagram of a transfer circuit board of a display module according to an embodiment of the present application being bent to the back side of a second substrate.

[0032] Figure 6 It shows Figure 4 A partial enlarged view of point K in the middle.

[0033] Figure 7 Shown is a schematic diagram of another embodiment of the display module of the present application.

[0034] Figure 8 Shown is a schematic diagram of a first circuit board and a second circuit board of a display module of an embodiment of the present application being bent to the back side of a second substrate.

[0035] The reference numerals are described as follows:

[0036] 100. First substrate

[0037] 101. First pad

[0038] 110. First Binding Area

[0039] 200. Second substrate

[0040] 201, second pad

[0041] 210. Second Binding Area

[0042] 300. Conductive connection part

[0043] 310. Welding wire

[0044] 400, transfer circuit board

[0045] 401, Lead

[0046] 410, first circuit board

[0047] 420, Second Circuit Board

[0048] 500, Chip

[0049] 600, glue layer

[0050] 710, upper glass substrate

[0051] 720, lower glass substrate

[0052] 730, Touch-sensitive flexible circuit board

[0053] 740, Main flexible circuit board

[0054] 750. Integrated Circuit Chip

[0055] 760, Flexible Circuit Board

[0056] 800, Cover DETAILED DESCRIPTION

[0057] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in a variety of forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that the present invention will be comprehensive and complete and fully convey the concepts of the example embodiments to those skilled in the art. The same reference numerals in the figures represent the same or similar structures, and thus their detailed description will be omitted.

[0058] First, let's introduce the basic structure of the display screen. Generally speaking, the basic structure of the screen is divided into three layers from top to bottom, including the glass cover, touch layer and display panel, such as the traditional G / G and GFF screens.

[0059] The glass cover plays a protective role. The touch layer includes ITO touch film and ITO glass substrate. The display panel can be further divided into three layers from top to bottom, including upper glass substrate, liquid crystal layer and lower glass substrate.

[0060] In order to meet users' demand for thinner and lighter screens, OGS screens, In Cell screens and On Cell screens have appeared in related technologies. These screens use a glass cover layer + display panel layer structure, which has one less touch layer compared to the traditional screen structure, making the screen thinner and lighter.

[0061] Furthermore, OGS screens, In Cell screens and On Cell screens are distinguished according to the specific location of the touch layer integration, that is, the OGS screen integrates the glass cover layer and the touch layer together, while the In Cell screen and On Cell screen integrate the touch layer and the display panel together.

[0062] Furthermore, as mentioned above, the touch layer includes an ITO touch film and an ITO glass substrate. In Cell screens and On Cell screens are distinguished based on the specific location where the ITO touch film is embedded in the display panel, i.e., an On Cell screen places the ITO touch film on the upper glass substrate of the display panel, while an In Cell screen places the ITO touch film under the lower glass substrate of the display panel.

[0063] like Figure 1 As shown, Figure 1 The display module of this embodiment is an On Cell screen structure, and an integrated circuit (IC) chip 750 is bonded to a lower glass substrate 720 (Chip On Glass, COG).

[0064] Specifically, Figure 1 The display module shown includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730, a main flexible circuit board 740 and an integrated circuit chip 750. The upper glass substrate 710 has a touch circuit (not shown in the figure), and the lower glass substrate 720 has a display drive circuit (not shown in the figure). The integrated circuit chip 750 is bound to the lower glass substrate 720 and is electrically connected to the display drive circuit. One end of the touch flexible circuit board 730 is bound to the upper glass substrate 710 and is electrically connected to the touch circuit, and the other end of the touch flexible circuit board 730 is bound to the main flexible circuit board 740. The main flexible circuit board 740 is bound to the lower glass substrate 720 and is electrically connected to the display drive circuit.

[0065] exist Figure 1 In the illustrated embodiment, the touch circuit of the upper glass substrate 710 is first transferred to the main flexible circuit board 740 through the touch flexible circuit board 730, and then transferred to the main board of the device (not shown in the figure) through the connector of the main flexible circuit board 740 (not shown in the figure).

[0066] like Figure 2 As shown, Figure 2 The figure shows another embodiment of a display module in the related art. The display module of this embodiment is an On Cell screen structure, and an integrated circuit (IC) chip 750 is bound to a flexible circuit board 760 (Chip On FPC, COF).

[0067] Specifically, Figure 1 The display module shown includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730, a main flexible circuit board 740, a flexible circuit board 760 and an integrated circuit chip 750. The upper glass substrate 710 has a touch circuit (not shown in the figure), and the lower glass substrate 720 has a display drive circuit (not shown in the figure). One end of the flexible circuit board 760 is bound to the lower glass substrate 720, and the other end is bound to the main flexible circuit board 740. The integrated circuit chip 750 is bound to the flexible circuit board 760. One end of the touch flexible circuit board 730 is bound to the upper glass substrate 710 and is electrically connected to the touch circuit, and the other end of the touch flexible circuit board 730 is bound to the main flexible circuit board 740.

[0068] Combination Figure 1 and Figure 2 As shown, the touch circuits in the COG structure and the COF structure are first transferred to the main flexible circuit board 740 through the touch flexible circuit board 730, and then transferred to the device main board through the main flexible circuit board 740. The difference lies in that the positions where the integrated circuit chip 750 is bound are different, that is, the integrated circuit chip 750 in the COG structure is bound to the lower glass substrate 720, and the integrated circuit chip 750 in the COF structure is bound to the flexible circuit board 760.

[0069] Therefore, for the display modules of COG structure and COF structure in the related art, a touch flexible circuit board 730 must be separately provided, and the touch circuit on the upper glass substrate 710 can be transferred through two additional binding processes, which results in high cost and complex structure.

[0070] In addition, if Figure 3 As shown, Figure 3 The figure shows a schematic diagram of the touch flexible circuit board 730 and the main flexible circuit board 740 of the display module in the related art being bent to the back of the lower glass substrate 720. Figure 3 The display module shown has a touch flexible circuit board 730, so when the main flexible circuit board 740 and the touch flexible circuit board 730 are bent to the back of the lower glass substrate 720, the thickness of the touch flexible circuit board 730 will further increase the black border distance D1 of the display screen. In the context of full-screen design, the increase in the black border distance reduces the screen-to-body ratio, thereby affecting the user's visual effect.

[0071] Based on this, the embodiments of the present application provide a display module and a manufacturing method thereof, and an electronic device.

[0072] like Figure 4 As shown, Figure 4 The figure shows a schematic diagram of an embodiment of the display module of the present application. The display module of the embodiment of the present application is an On Cell screen structure, and an integrated circuit (IC) chip 500 is bound to a lower glass substrate (COG structure).

[0073] The display module of the embodiment of the present application includes a first substrate 100, a second substrate 200, a conductive connection part 300 and a transfer circuit board 400. The first substrate 100 has a first circuit (not shown in the figure), and the first circuit is used to realize the touch function of the display module. The second substrate 200 is stacked with the first substrate 100 and has a second circuit (not shown in the figure), and the second circuit is used to realize the display function of the display module; the conductive connection part 300 is electrically connected to the first circuit and the second circuit to transfer the first circuit to the second lower circuit; the transfer circuit board 400 is bound to the second substrate 200 and is electrically connected to the second circuit to transfer the first circuit and the second circuit to the mainboard of an electronic device.

[0074] Compared with the technical solution used in the related art of configuring multiple flexible circuit boards to connect the first circuit with the second circuit and transfer them to the device mainboard, since the display module of the embodiment of the present application adopts a conductive connecting part 300 to be electrically connected to the first circuit and the second circuit respectively, the number of flexible circuit boards is saved. Since the flexible circuit boards are saved, two binding processes are omitted on the basis of saving material costs.

[0075] In addition, if Figure 5 As shown, Figure 5 The schematic diagram shows the transfer circuit board 400 of the display module of the present application embodiment when it is bent to the back of the second substrate 200. Figure 5 The display module shown does not have a touch flexible circuit board, so when the transfer circuit board 400 is bent to the back of the second substrate 200, the thickness of the touch flexible circuit board does not increase the black edge distance of the display screen.

[0076] In detail, Figure 1 or Figure 2As shown, the display module in the related art includes an upper glass substrate 710, a lower glass substrate 720, a touch flexible circuit board 730 and a main flexible circuit board 740. One end of the touch flexible circuit board 730 is bound to the upper glass substrate 710, and the other end is bound to the main flexible circuit board 740. The main flexible circuit board 740 is bound to the lower glass substrate 720. Since the touch flexible circuit board 730 is bound to the main flexible circuit board 740, the touch flexible circuit board 730 and the main flexible circuit board 740 are overlapped in the thickness direction of the two. In other words, the touch flexible circuit board 730 is arranged above the main flexible circuit board 740. When the touch flexible circuit board 730 and the main flexible circuit board 740 are bent together to the back side of the display module (that is, bent to the side of the lower glass substrate 720 away from the upper glass substrate 710), the sum of the thickness of the touch flexible circuit board 730 and the main flexible circuit board 740 affects the black edge distance of the screen, that is Figure 3 D1 in . Looking at this application again, combined with Figure 5 As shown, since the display module of the embodiment of the present application does not have a touch flexible circuit board, when the adapter circuit board 400 is bent to the back of the module, only the thickness of the adapter circuit board 400 will affect the black border distance of the screen. In other words, D1-D2 should be equal to the thickness of the touch flexible circuit board, that is, the black border distance reduced by the display module of the present application is the thickness of the touch flexible circuit board. As an example, the thickness of the touch flexible circuit board is about 0.2mm. Therefore, compared with Figure 3 The black border distance D1 in the display module shown is smaller than the black border distance D2 in the display module of the embodiment of the present application, which further increases the screen-to-body ratio and improves the user's visual effect.

[0077] It is understood that the first substrate 100 and the second substrate 200 of the embodiment of the present application can be the upper glass substrate and the lower glass substrate respectively. The first circuit of the first substrate 100 is a touch circuit, and the second circuit of the second substrate 200 is a display drive circuit.

[0078] The touch circuit is set by etching the touch circuit on glass. The touch circuit may include a plurality of conductive lines crossing each other, a plurality of irregular polygonal grids formed by the plurality of conductive lines crossing each other, and a plurality of nodes respectively located at the intersections of the plurality of conductive lines, each node being a hollow ring structure, but not limited thereto.

[0079] The transfer circuit board 400 may be a flexible printed circuit (FPC).

[0080] like Figure 4As shown, the display module of the embodiment of the present application further includes a chip 500, which is bound to the second substrate 200 and electrically connected to the second circuit for driving the first circuit and the second circuit. In this embodiment, the chip 500 is bound to the second substrate 200, that is, the display module of this embodiment forms a COG structure.

[0081] As described above, the first circuit may be a touch control circuit, and the second circuit may be a display drive circuit, and the chip 500 drives the first circuit and the second circuit. In other words, in this embodiment, the display drive and the touch control drive are integrated to realize the TDDI (Touch and Display Driver Integration) drive mode, that is, one chip can be used to drive the touch control circuit and the display drive circuit to work. Due to the integration of touch control and display drive, the number of chips is saved, thereby saving material costs.

[0082] Of course, it is understandable that the first circuit and the second circuit can also be driven by two chips respectively.

[0083] like Figure 6 As shown, Figure 6 It shows Figure 4 The conductive connection part 300 includes a welding wire 310, and two ends of the welding wire 310 are electrically connected to the first circuit and the second circuit respectively.

[0084] The first substrate 100 includes a first binding area 110 , which is located at an edge of the first substrate 100 close to the second substrate 200 . The first substrate 100 is also provided with a first solder pad 101 electrically connected to the first circuit, and the first solder pad 101 is provided in the first binding area 110 .

[0085] The second substrate 200 includes a second binding area 210, which is located at the edge of the second substrate 200 close to the first substrate 100 and corresponds to the position of the first binding area 110. The second substrate 200 is also provided with a second soldering pad 201 electrically connected to the second circuit, and the second soldering pad 201 is arranged in the second binding area 210.

[0086] Two ends of the bonding wire 310 are respectively bonded to the first bonding pad 101 and the second bonding pad 201 .

[0087] The bonding wire 310 may be a gold wire, which has high electrical conductivity, good corrosion resistance, toughness and oxidation resistance, and is conducive to the reliability of electrical connection. Of course, other conductive materials, such as conductive films, may also be selected according to actual needs.

[0088] In this embodiment, the first circuit and the second circuit are connected by welding the two ends of the welding wire 310 to the first welding pad 101 and the second welding pad 201 respectively, that is, the welding method of the welding wire 310 replaces the two binding methods, thereby achieving the effect of eliminating the touch flexible circuit board. On the one hand, while saving material costs, it also reduces the space occupied by the touch flexible circuit board of the whole machine; on the other hand, it also reduces the process flow and saves process costs.

[0089] It should be noted that the transfer circuit board 400 of the embodiment of the present application can be bound to the second substrate 200 through anisotropic conductive film (ACF) and electrically connected to the second circuit of the second substrate 200. Specifically, the transfer circuit board 400 can be electrically connected to the second pad 201 of the second circuit through the lead 401.

[0090] By using anisotropic conductive film to bind the transfer circuit board 400 and the second substrate 200, the anisotropic conductive film can form a stable structure with vertical conduction and horizontal insulation after being heated and pressurized for a certain period of time, which can make the transfer circuit board 400 and the second substrate 200 stably electrically connected to meet the requirement that the welding process of the display module cannot use high-temperature lead-tin welding. In addition, the anisotropic conductive film has the advantages of high-temperature stability, low thermal expansion and hygroscopicity, etc., and can well adapt to the use environment of the display module.

[0091] like Figure 7 As shown, Figure 7 The figure shows another embodiment of the display module of the present application. The display module of this embodiment is an On Cell screen structure, and an integrated circuit (IC) chip 500 is bound to a flexible circuit board (Chip On FPC, COF).

[0092] Specifically, the display module of the embodiment of the present application is similar to the display module of the previous embodiment and is not described in detail. The difference is that the transfer circuit board 400 includes a first circuit board 410 and a second circuit board 420 electrically connected to each other, and the two ends of the first circuit board 410 are respectively bound to the second substrate 200 and the second circuit board 420, and the second circuit board 420 is electrically connected to the main board of the electronic device. The chip 500 is bound to the first circuit board 410.

[0093] The first circuit board 410 may be bonded to the second substrate 200 by an anisotropic conductive adhesive film. The first circuit board 410 and the second circuit board 420 may be bonded by an anisotropic conductive adhesive film.

[0094] Combination Figure 4 and Figure 7 As shown, in Figure 4 In the embodiment, the chip 500 is bound to the second substrate 200, and the adapter circuit board 400 is bound to the second substrate 200, and the binding area where the adapter circuit board 400 is bound to the second substrate 200 is set adjacent to the chip 500. When the adapter circuit board 400 is bent to the back of the second substrate 200, the border distance of the display module is determined by the chip 500 and the binding area between the adapter circuit board 400 and the second substrate 200. Figure 7 , because one end of the first circuit board 410 is bound to the second substrate 200, and the chip 500 is bound to the first circuit board 410. In other words, there is only the binding area of ​​the first circuit board 410 and the second substrate 200 on the second substrate 200, and there is no chip 500. When the second circuit board 420 is bent to the back of the second substrate 200, the first circuit board 410 and the chip 500 can also be bent to the back of the second substrate 200 together. In this way, Figure 7 The second substrate 200 in the embodiment can save the width for binding the chip 500, and only reserve the width for binding the first circuit board 410, thereby reducing the size of the second substrate 200 and narrowing the frame of the display module.

[0095] It can be understood that the first circuit board 410 and the second circuit board 420 can both be flexible circuit boards.

[0096] In this embodiment, the first circuit is connected to the second circuit and is transferred to the main board of the device through the first circuit board 410 and the second circuit board 420.

[0097] Combination Figure 4 and Figure 7 As shown, one or more bonding wire 310 bonding areas may be provided between the first substrate 100 and the second substrate 200 according to design requirements. Figure 4 The bonding area of ​​the welding wire 310 of the display module shown is one place. Figure 7 The display module shown has two bonding areas for the welding wires 310. The term "multiple areas" refers to two or more areas.

[0098] like Figure 8 As shown, Figure 8 The first circuit board 410 and the second circuit board 420 of the display module of the present embodiment are shown in a schematic diagram when they are bent to the back of the second substrate 200. The display module further includes an adhesive layer 600, which covers the connection between the conductive connection part 300 and the first circuit and the second circuit.

[0099] In this embodiment, after the cover plate 800 is attached, the adhesive layer 600 is provided on the end surface of the display module, and the adhesive layer 600 covers the connection between the conductive connection part 300 and the first circuit and the second circuit, so that the reliability of the connection between the conductive connection part 300 and the first circuit and the second circuit can be further improved. In addition, the adhesive layer 600 can also improve the waterproof performance of the display module.

[0100] It should be noted that Figure 8 The adhesive layer 600 is applied in Figure 7 The display module shown, namely Figure 8 The display module is a COF structure. Of course, the adhesive layer 600 can also be applied to Figure 4 The display module with COG structure will not be described in detail here.

[0101] Another aspect of the present application is to provide an electronic device, including the display module of any of the above embodiments. Since the electronic device includes the display module of any of the above embodiments, the electronic device of the present application has all the advantages and beneficial effects of any of the above embodiments, which will not be described in detail here.

[0102] It will be appreciated that the electronic device in the embodiments of the present application may be a mobile phone or a smart phone (e.g., an iPhone™-based phone, an Android™-based phone), a portable gaming device (e.g., a Nintendo DS™, a PlayStation Portable™, a Gameboy Advance™, an iPhone™), a laptop, a PDA, a portable Internet device, a music player, and a data storage device, other handheld devices, and devices such as watches, earphones, pendants, headphones, etc. The electronic device may also be other wearable devices (e.g., head mounted devices (HMD) such as electronic glasses, electronic clothes, electronic bracelets, electronic necklaces, electronic tattoos, electronic devices, or smart watches).

[0103] The electronic device can also be any one of a plurality of electronic devices, including but not limited to cellular phones, smart phones, other wireless communication devices, personal digital assistants, audio players, other media players, music recorders, video recorders, cameras, other media recorders, radios, medical devices, vehicle transportation instruments, calculators, programmable remote controls, pagers, laptop computers, desktop computers, printers, netbook computers, personal digital assistants (PDAs), portable multimedia players (PMPs), Moving Picture Experts Group (MPEG-1 or MPEG-2) audio layer (MP3) players, portable medical devices, and digital cameras and combinations thereof.

[0104] According to another aspect of the embodiments of the present application, a method for manufacturing a display module is provided, comprising: providing a first substrate 100, the first substrate 100 having a first circuit, the first circuit being used to realize the touch function of the display module; providing a second substrate 200, the second substrate 200 being stacked with the first substrate 100 and having a second circuit, the second circuit being used to realize the display function of the display module; utilizing a conductive connecting portion 300 to electrically connect the first circuit and the second circuit to transfer the first circuit to the second circuit; providing a transfer circuit board 400, bound to the second substrate 200 and electrically connected to the second circuit, to transfer the first circuit and the second circuit to a mainboard of an electronic device.

[0105] In summary, the display module and the manufacturing method thereof, and the electronic device according to the embodiments of the present application have the following advantages and beneficial effects:

[0106] The display module of the embodiment of the present application uses a conductive connection part 300 to connect the first circuit of the first substrate 100 and the second circuit of the second substrate 200, and the transfer circuit board 400 is bound to the second substrate 200 and electrically connected to the second circuit, so that the first circuit and the second circuit can be transferred out through the transfer circuit board 400. Since there is no need to set up a separate touch flexible circuit board, on the one hand, the cost is saved, and on the other hand, two binding processes are omitted.

[0107] In addition, the black border distance D2 in the display module of the embodiment of the present application is smaller, which further increases the screen-to-body ratio and improves the user's visual effect.

[0108] In the application embodiments, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise expressly defined. The terms "installed", "connected", "connected", "fixed", etc. should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the application embodiments can be understood according to the specific circumstances.

[0109] In the description of the application embodiments, it should be understood that the directions or positional relationships indicated by the terms "up", "down", "left", "right", "front", "back", etc. are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the application embodiments and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, should not be understood as a limitation on the application embodiments.

[0110] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the application embodiment. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0111] The above are only preferred embodiments of the application embodiments and are not intended to limit the application embodiments. For those skilled in the art, the application embodiments may have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the application embodiments shall be included in the protection scope of the application embodiments.

Claims

1. A display module for electronic equipment, characterized in that: The display module comprises: A first substrate having a first circuit for realizing a touch function of the display module; A second substrate is stacked with the first substrate, and the second substrate has a second circuit for realizing the display function of the display module; A conductive connection portion, comprising a welding wire, two ends of which are electrically connected to the first circuit and the second circuit respectively, so as to transfer the first circuit to the second circuit; a transfer circuit board, bound to the second substrate and electrically connected to the second circuit, so as to transfer the first circuit and the second circuit to the main board of the electronic device; the transfer circuit board comprises a first circuit board and a second circuit board electrically connected to each other, two ends of the first circuit board are respectively bound to the second substrate and the second circuit board, and the second circuit board is used to be electrically connected to the main board; A chip is bound to the first circuit board and is used to drive the first circuit and the second circuit.

2. The display module according to claim 1, characterized in that: The first substrate comprises a first binding area, the first binding area is located at an edge of the first substrate close to the second substrate, the first substrate is further provided with a first pad electrically connected to the first circuit, the first pad is provided in the first binding area; The second substrate includes a second binding area, which is located at an edge of the second substrate close to the first substrate and corresponds to the position of the first binding area. The second substrate is also provided with a second pad electrically connected to the second circuit, and the second pad is provided in the second binding area. Two ends of the bonding wire are respectively bonded to the first bonding pad and the second bonding pad.

3. The display module according to claim 1, characterized in that: The first circuit board is bonded to the second substrate via an anisotropic conductive adhesive film.

4. The display module according to claim 1, characterized in that: The first circuit board and the second circuit board are bonded together by an anisotropic conductive adhesive film.

5. The display module according to claim 1, characterized in that: The display module further includes a glue layer, and the glue layer covers the connection between the conductive connection part and the first circuit and the second circuit.

6. An electronic device, characterized in that: The electronic device comprises a mainboard and a display module according to any one of claims 1 to 5.

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