Display device

Abstract

A display apparatus including a substrate having a display area including a plurality of sub-pixels, the plurality of sub-pixels including an emission area and a non-emission area; a plurality of light emitting diodes disposed at the plurality of sub-pixels; a package portion covering the plurality of light emitting diodes within the display area; a first inorganic insulating layer disposed on the package portion; a first touch portion disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first touch portion; a second touch portion disposed on the second inorganic insulating layer, wherein at least one of the first inorganic insulating layer and the second inorganic insulating layer includes a portion having a reduced thickness, the portion disposed at an area overlapping the emission area disposed at at least one of the plurality of sub-pixels.

Description

[0001] Cross-references to related applications

[0002] This application claims priority to Korean Patent Application No. 10-2020-0090207, filed with the Korean Intellectual Property Office on July 21, 2020, the disclosure of which is incorporated herein by reference. Technical Field

[0003] This disclosure relates to a display device, and more specifically, to a display device with improved performance. Background Technology

[0004] Display devices used in computer monitors, TVs, mobile phones, etc. include self-emissive organic light-emitting displays (OLEDs) and liquid crystal displays (LCDs) that require a separate light source.

[0005] Display devices have a wide range of applications, not only in computer monitors and TVs, but also in personal portable devices, and research is underway on display devices with large display areas, reduced size and weight.

[0006] Display devices include touchscreen-integrated displays that include a touch portion capable of recognizing user touches. Users of touchscreen-integrated displays can directly input information using their fingers or a stylus, and are therefore widely used in navigation, portable terminals, and home appliances.

[0007] To manufacture touchscreen-integrated display devices, methods have been used to manufacture separate touchscreen panels and then bond them to a display panel. However, when touchscreen panels are manufactured and bonded separately as described above, various problems arise, such as increased thickness and processing time in the touchscreen-integrated display device.

[0008] Therefore, the inventors of this disclosure have invented a touchscreen integrated display device with a novel structure for manufacturing a touchscreen panel simultaneously during the manufacturing process of a display panel. For example, the inventors of this disclosure have invented a manufacturing process for forming components that directly constitute a touchscreen on a packaging unit of a display panel, and a touchscreen integrated display device with a novel structure formed by the aforementioned manufacturing process. The touchscreen integrated display device includes a plurality of light-emitting diodes (LEDs) disposed on a substrate, a packaging portion disposed on the LEDs, and a touch portion disposed on the packaging portion. To form the touch portion, a process is used to form a first inorganic insulating layer on the packaging portion, a first touch portion on the first inorganic insulating layer, a second inorganic insulating layer on the first inorganic insulating layer and the first touch portion, and a second touch portion and an organic insulating layer on the second inorganic insulating layer. In this case, both the first and second inorganic insulating layers for the touch portion are formed at least on the front surface of the display area of ​​the display panel.

[0009] The first and second inorganic insulating layers of the touch portion can be formed from inorganic materials, thus having relatively weak ductility. Specifically, when the display device integrated with the touch screen includes a curved area, the stress generated in the curved area increases, so cracks may appear in the components (especially the inorganic layers) located in the curved area, and the panel may be damaged due to moisture penetration at the cracked portions.

[0010] Therefore, the inventors of this disclosure form the first and second inorganic insulating layers by reducing the flow rate of ammonia (NH3) during the formation of the first and second inorganic insulating layers. When the first and second inorganic insulating layers are formed by reducing the flow rate of ammonia, the first and second inorganic insulating layers can have relatively increased ductility. Therefore, cracks in the inorganic layers in bending areas can be reduced, and damage to the panel due to moisture penetration can be reduced.

[0011] However, when the first and second inorganic insulating layers are formed by reducing the flow rate of ammonia, the transmittance and viewing angle in some sub-pixels are reduced. Summary of the Invention

[0012] Therefore, the inventors of this disclosure have invented a display device with a novel structure that can improve transmittance and viewing angle by reducing the thickness of the first and second inorganic insulating layers disposed on the emission region in the curved region, while reducing the stress generated in the curved region.

[0013] One aspect of this disclosure is to provide a display device that can improve the reliability of curved areas.

[0014] One aspect of this disclosure is to provide a display device capable of improving transmittance and viewing angle characteristics.

[0015] To achieve these and other aspects of the inventive concept, as embodied and broadly described herein, a display device includes: a substrate having a display area comprising a plurality of sub-pixels, the plurality of sub-pixels including emitting and non-emitting regions; a plurality of light-emitting diodes disposed at the plurality of sub-pixels; an encapsulation portion covering the plurality of light-emitting diodes in the display area; a first inorganic insulating layer disposed on the encapsulation portion; a first touch portion disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first touch portion; and a second touch portion disposed on the second inorganic insulating layer, wherein at least one of the first and second inorganic insulating layers includes a portion having a reduced thickness disposed in a region overlapping with the emitting region disposed at at least one of the plurality of sub-pixels.

[0016] In another aspect, a display device includes: a substrate including a display area and a non-display area; a plurality of sub-pixels disposed within the display area and including an emitting area and a non-emitting area; light-emitting diodes disposed at the plurality of sub-pixels; an encapsulation portion disposed on the plurality of sub-pixels; a first inorganic insulating layer disposed on the encapsulation portion; a first touch portion disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first touch portion; and a second touch portion disposed on the second inorganic insulating layer. The first inorganic insulating layer at one or more of the plurality of sub-pixels is exposed by the second inorganic insulating layer at a region corresponding to the emitting area.

[0017] According to embodiments of this disclosure, the reliability of the bending region can be improved by reducing the thickness of the inorganic insulating layer disposed on the light-emitting diode, thereby reducing cracks caused by stress generated in the bending region.

[0018] According to embodiments of this disclosure, transmittance and viewing angle characteristics can be improved by reducing the thickness of the inorganic insulating layer disposed on the light-emitting diode.

[0019] Other systems, methods, features, and advantages will be or will become apparent to those skilled in the art upon examination of the following drawings and detailed description. All such additional systems, methods, features, and advantages are intended to be included in this specification, within the scope of this disclosure, and protected by the following claims. Nothing in this section should be construed as limiting these claims. Further aspects and advantages are discussed below in conjunction with embodiments of this disclosure. It should be understood that the foregoing general description and the following detailed description are exemplary and illustrative, and are intended to provide further explanation of the claimed inventive concept. Attached Figure Description

[0020] The accompanying drawings, which are included to provide a further understanding of this disclosure and are incorporated in and constitute a part of this application, illustrate embodiments of this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0021] Figure 1 This is a perspective view of a display device according to an embodiment of the present disclosure.

[0022] Figure 2 It is along Figure 1 The cross-sectional view of the display device taken from line II-II'.

[0023] Figure 3 yes Figure 2 A magnified planar view of region X.

[0024] Figure 4 It is along Figure 1 A cross-sectional view of the display device taken by line IV-IV'.

[0025] Figure 5 According to another embodiment of this disclosure Figure 1 A cross-sectional view of the display device taken by line IV-IV'.

[0026] Figure 6 According to another embodiment of this disclosure Figure 1 A cross-sectional view of the display device taken by line IV-IV'.

[0027] Figure 7 According to another embodiment of this disclosure Figure 1 A cross-sectional view of the display device taken by line IV-IV'. Detailed Implementation

[0028] The advantages and features of this disclosure, as well as methods for achieving these advantages and features, will become clear from the following detailed description of embodiments and in conjunction with the accompanying drawings. However, this disclosure is not limited to the embodiments disclosed herein, but will be implemented in various forms. The provided embodiments are merely examples to enable those skilled in the art to fully understand the disclosure and scope of this disclosure. Therefore, this disclosure will be limited only by the scope of the appended claims.

[0029] The shapes, dimensions, scales, angles, quantities, etc., shown in the accompanying drawings to describe embodiments of this disclosure are merely examples, and this disclosure is not limited thereto. Throughout the specification, the same reference numerals generally denote the same elements. Furthermore, in the following description of this disclosure, detailed explanations of known related technologies may be omitted to avoid unnecessarily obscuring the subject matter of this disclosure. Terms such as “comprising,” “having,” and “including” as used herein are generally intended to allow for the addition of additional components, unless these terms are used in conjunction with the term “only.” Unless otherwise expressly stated, any reference to the singular may include the plural.

[0030] Even if not explicitly stated, the components are interpreted as including the normal error range.

[0031] When using terms such as “above,” “over,” “below,” and “adjacent” to describe the positional relationship between two components, one or more components may be located between the two components unless these terms are used in conjunction with the terms “immediately adjacent” or “directly.”

[0032] When one element or layer is placed "on" another element or layer, other layers or other elements can be directly inserted on or between the other element.

[0033] Although the terms "first," "second," etc., are used to describe various components, these components are not limited by these terms. These terms are only used to distinguish one component from other components. Therefore, the first component mentioned below can be a second component in the technical concept of this disclosure.

[0034] Throughout the specification, the same reference numerals generally denote the same elements.

[0035] The dimensions and thicknesses of each component shown in the accompanying drawings are for ease of description and this disclosure is not limited to the dimensions and thicknesses of the components shown.

[0036] The features of the various embodiments of this disclosure may be partially or wholly dependent on or combined with each other, and may be technically interlocked and operated in a variety of ways, and the embodiments may be performed independently of each other or in relation to each other.

[0037] The present disclosure will now be described in detail with reference to the accompanying drawings. All components of each display device according to all embodiments of the present disclosure are operatively connected and configured.

[0038] Figure 1 This is a perspective view of a display device according to an embodiment of the present disclosure. Figure 1 In the present invention, among the various components of the display device 100, only the substrate 110 and a plurality of sub-pixels SP are shown for ease of description.

[0039] refer to Figure 1The substrate 110 is a support member configured to support other components of the display device 100 and can be formed of an insulating material. For example, the substrate 110 can be formed of glass, resin, etc. In addition, the substrate 110 can be formed of a polymer or plastic such as polyimide (PI), or it can be formed of a flexible material.

[0040] The substrate 110 may include a first region A1 and a second region A2. The first region A1 is a region formed as a flat surface, and the second region A2 is a region formed as a curved surface. The first region A1 may be a flat region, and the second region A2 may be a curved region. The first region A1 may be a flat portion, and the second region A2 may be a curved portion or a bent portion. For example, the second region A2 may be a curved region with an increasing inclination as it moves away from the first region A1. For example, the second region A2 may be disposed on both sides of the first region A1, and have an increasing inclination as it moves away from the first region A1. However, embodiments of the present disclosure are not limited thereto, and each second region A2 disposed on both sides of the first region A1 may be disposed with a different curvature. Furthermore, the second region A2 may be disposed on only one side of the first region A1, or it may be disposed on all sides of the first region A1. For example, when the first region A1 has four sides, the second region A2 may be disposed on one or more of the four sides, or it may be disposed on all four sides.

[0041] The substrate 110 includes a display area AA and a non-display area NA. The display area AA and the non-display area NA can be respectively disposed in a first region A1 and a second region A2 of the substrate 110.

[0042] The display area AA is the area for displaying an image. Multiple sub-pixels SP for displaying the image and circuitry for driving the sub-pixels SP can be located in the display area AA. The circuitry may include various thin-film transistors, capacitors, and wiring for driving the sub-pixels SP. For example, the circuitry may include various components such as driving thin-film transistors, switching thin-film transistors, storage capacitors, gate wiring, and data wiring, but is not limited thereto.

[0043] The non-display area NA is the area where no image is displayed, and it is also the area where various wiring and driver ICs for driving the sub-pixels SP located in the display area NA are arranged. For example, various driver ICs such as gate driver ICs and data driver ICs can be arranged in the non-display area NA.

[0044] exist Figure 1 In this context, the non-display area NA is shown as surrounding the display area AA, but the non-display area NA can be an area extending from one side of the display area AA, but is not limited to this.

[0045] Multiple sub-pixels SP can be disposed at the display area AA of the substrate 110. Each of the multiple sub-pixels SP can be a separate unit that emits light, and a light-emitting diode and driving circuitry are formed at each of the multiple sub-pixels SP. For example, the multiple sub-pixels SP may include red sub-pixels, green sub-pixels, and blue sub-pixels, and the multiple sub-pixels SP may also include white sub-pixels, but is not limited thereto.

[0046] In the following text, reference will be made to Figure 2 A more detailed description of multiple sub-pixels SP.

[0047] Figure 2 It is along Figure 1 The cross-sectional view taken from line II-II'. Figure 3 yes Figure 1 A magnified planar view of region X. Figure 3 In the display device 100, for ease of description, a first touch portion 164 and a second touch portion 165 are shown among the various components.

[0048] refer to Figure 2 The display device 100 according to this embodiment includes a substrate 110, a transistor TFT, a planarization layer 111, a light-emitting diode 120, a dam 112, a pad portion 140, a dam portion 130, an encapsulation portion 150, and a touch portion 160.

[0049] A transistor TFT can be disposed on the substrate 110. The transistor TFT transmits data voltage to multiple sub-pixels SP.

[0050] A transistor TFT may include a gate electrode, an active layer, a source electrode, and a drain electrode.

[0051] An active layer can be disposed on the substrate 110. The active layer may include oxide semiconductor, amorphous silicon, polycrystalline silicon, etc.

[0052] Depending on the structure of the transistor TFT, the gate electrode can be disposed above or below the active layer. The gate electrode can be formed of a conductive material, such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof, but is not limited thereto.

[0053] A gate insulating layer can be disposed between the active layer and the gate electrode. The gate insulating layer is a layer used to insulate the gate electrode and the active layer, and can be formed of an insulating material. For example, the gate insulating layer can be formed of a single layer or multiple layers of silicon oxide (SiOx) or silicon nitride (SiNx), but is not limited thereto.

[0054] Source and drain electrodes can be provided, which are electrically connected to the active layer and spaced apart from each other. The source and drain electrodes can be formed of conductive materials, such as copper (Cu), aluminum (Al), molybdenum (Mo), titanium (Ti), or alloys thereof, but are not limited thereto.

[0055] Depending on the structure of a transistor TFT, an interlayer insulating layer can be provided between the gate electrode, source electrode, and drain electrode to insulate them, but this is not the only option.

[0056] The planarization layer 111 can be disposed on the transistor TFT. The planarization layer 111 can planarize the upper portion of certain parts of the substrate 110. For example, the planarization layer 111 can be disposed at the display area AA, and the planarization layer 111 may not be disposed on all or some parts of the non-display area.

[0057] The planarization layer 111 can be formed as a single layer or multiple layers, and can be formed of an organic material. For example, the planarization layer 111 can be formed of an acrylic organic material, but is not limited thereto. The planarization layer 111 may include contact holes CH for electrically connecting the transistor TFT and the light-emitting diode 120.

[0058] The light-emitting diode 120 can be disposed on the planarization layer 111. The light-emitting diode 120 can be a self-emissive element that emits light and can be driven by receiving voltage from a transistor TFT or the like. The light-emitting diode 120 may include an anode 121, an emissive layer 122, and a cathode 123.

[0059] The anode 121 can be individually disposed on the planarization layer 111 for each sub-pixel SP. The anode 121 can be electrically connected to the transistor TFT through contact holes CH formed in the planarization layer 111. The anode 121 can be formed of a conductive material capable of providing holes to the light-emitting layer 122. For example, the anode 121 can be formed of a reflective layer, which is formed of a transparent conductive material such as tin oxide (TO), indium tin oxide (ITO), indium zinc oxide (IZO), and indium zinc tin oxide (ITZO), and a material with excellent reflectivity such as silver (Ag) and silver alloys, but is not limited thereto.

[0060] A dam 112 may be disposed on the anode 121 and the planarization layer 111. The dam 112 may be an insulating layer used to separate adjacent sub-pixels SP. The dam 112 may be configured to expose a portion of the anode 121, and the dam 112 may be an organic insulating material configured to cover the edge of the anode 121.

[0061] A light-emitting layer 122 may be disposed on an anode 121. The light-emitting layer 122 may be formed from a single light-emitting layer 122 or may have a structure in which multiple light-emitting layers 122 emitting different colors of light are stacked. For example, multiple light-emitting layers 122 may have a structure in which light-emitting layers emitting the same color of light are stacked. For example, the same color may be one of red, green, and blue. As another example, multiple light-emitting layers 122 may have a structure in which light-emitting layers emitting different colors of light are stacked. For example, multiple light-emitting layers 122 may have a stacked structure formed by a first stack or more stacks. The light-emitting layers of the first stack may be formed in one or more of blue, dark blue, and sky blue, while the light-emitting layers of the second stack may be formed in one or more of yellow, yellow-green, green, and red, but are not limited thereto. When a third stack is included, the light-emitting layers may be formed in the same color as the light-emitting layers of the first stack, but are not limited thereto. The light-emitting diode 120 may also include a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. Reference Figure 2 The light-emitting layer 122 disposed in each sub-pixel SP is shown as being separated and disposed for each sub-pixel SP, but is not limited thereto. For example, all or some of the light-emitting layers 122 may be formed from a single layer located on multiple sub-pixels SP. Furthermore, the light-emitting layer 122 may be an organic light-emitting layer formed of organic materials, but is not limited thereto. For example, the light-emitting layer 122 may be a quantum dot light-emitting layer or a micro LED.

[0062] A cathode 123 can be disposed on the light-emitting layer 122. The cathode 123 can be formed of a conductive material capable of providing electrons to the light-emitting layer 122. For example, the cathode 123 can be formed of indium tin oxide (ITO), indium zinc oxide (IZO), indium tin zinc oxide (ITZO), zinc oxide (ZnO), and tin oxide (TO)-based transparent conductive oxides or ytterbium (Yb) alloys. Alternatively, the cathode 123 can be formed of a metallic material having a very thin thickness, but is not limited thereto. Reference Figure 2 The cathodes 123, which are set at each sub-pixel SP, are shown to be connected to each other, but can be separated and set for each sub-pixel SP like the anodes 121, but are not limited thereto.

[0063] The display area AA may include the emission area EA and the non-emission area NEA located between multiple emission areas EA.

[0064] The area where each of the plurality of light-emitting diodes 120 is disposed can be a plurality of emission areas EA. Each of the plurality of emission areas EA can be an area that can independently emit light of a single color, an area corresponding to a plurality of sub-pixels SP, and an area in which no embankment 112 is disposed. For example, the plurality of emission areas EA may include a red emission area, a green emission area, and a blue emission area, but is not limited thereto. The plurality of emission areas EA can be arranged to be spaced apart from each other, and can be arranged, for example, in a grid shape arranged in the row and column directions, but is not limited thereto.

[0065] The area where no multiple light-emitting diodes 120 are provided can be a non-emitting area NEA. The non-emitting area NEA is a region disposed between multiple emitting areas EA, and can be a region where a dam 112 is provided. The non-emitting area NEA is disposed around the multiple emitting areas EA, and can be formed in a grid pattern.

[0066] The dam 130 can be disposed at a non-display area NA. For example, the dam 130 is disposed on the substrate 110 at a non-display area NA. The dam 130 is configured to control the expansion of the organic encapsulation layer 152 within the encapsulation portion 150 that is configured to cover the display area AA. For example, the dam 130 can suppress the overflow of the organic encapsulation layer 152 of the encapsulation portion 150. One or more dams 130 can be constructed, and the number of dams to be disposed is not limited thereto.

[0067] The pad portion 140 can be located in the non-display area NA. The pad portion 140 can be located outside the dam portion 130. Signals can be input through the pad portion 140 to circuit portions, driver ICs, etc., formed on the substrate 110. For example, the pad portion 140 can provide signals from the outside to circuit portions, driver ICs, etc., on the substrate 110. For example, the pad portion 140 can provide signals to the touch portion 160 for driving the touch portion 160 and receive signals from the touch portion 160 for user touch input.

[0068] An encapsulation portion 150 may be disposed on the light-emitting diode 120. The encapsulation portion 150 is a sealed member that protects the light-emitting diode 120 from external moisture, oxygen, and impact. The encapsulation portion 150 may be configured to cover the entire display area AA in which the light-emitting diode 120 is disposed, and the encapsulation portion 150 may be configured to cover a portion of the non-display area NA extending from the display area AA. The encapsulation portion 150 may include a first inorganic encapsulation layer 151 formed of an inorganic material, an organic encapsulation layer 152 disposed on the first inorganic encapsulation layer 151 and formed of an organic material, and a second inorganic encapsulation layer 153 disposed on the organic encapsulation layer 152.

[0069] The first inorganic encapsulation layer 151 can seal the display area AA to protect the light-emitting diode 120 from oxygen and moisture penetration into the display area AA. The first inorganic encapsulation layer 151 can be disposed not only in the display area AA, but also in the non-display area NA extending from the display area AA, and can be configured to cover the dam portion 130 of the non-display area NA, etc. The first inorganic encapsulation layer 151 can be formed of inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON), but is not limited thereto.

[0070] An organic encapsulation layer 152 may be disposed on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 is a layer used to planarize the upper portion of the first inorganic encapsulation layer 151, and can fill cracks that may appear in the first inorganic encapsulation layer 151, and planarize the upper portion of foreign matter when it forms on the first inorganic encapsulation layer 151. The organic encapsulation layer 152 may be disposed on a portion of the display area AA and the non-display area NA extending from the display area AA, and may be disposed inside the dam portion 130. The organic encapsulation layer 152 may be formed of an epoxy-based or acrylic-based polymer, but is not limited thereto.

[0071] The second inorganic encapsulation layer 153 can be disposed on the organic encapsulation layer 152. The second inorganic encapsulation layer 153 can seal the organic encapsulation layer 152151 together with the first inorganic encapsulation layer 151 in such a way that it contacts the first inorganic encapsulation layer at the exterior of the display device 100. The second inorganic encapsulation layer 153 can be disposed on a portion of the non-display area NA extending from the display area AA, and the second inorganic encapsulation layer 153 can be disposed in contact with the first inorganic encapsulation layer 151 disposed at the non-display area NA. The second inorganic encapsulation layer 153 can be formed of inorganic materials such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON), but is not limited thereto.

[0072] Figure 2 The encapsulation portion 150 may include a first inorganic encapsulation layer 151, an organic encapsulation layer 152, and a second inorganic encapsulation layer 153, but the number of inorganic encapsulation layers 151 and 153 and the number of organic encapsulation layers 152 included in the encapsulation portion 150 are not limited thereto.

[0073] Touch portion 160 may be disposed on package portion 150. Touch portion 160 may be disposed at display area AA including light-emitting diode 120 to sense touch input. Touch portion 160 can detect external touch information input by using a user's finger, stylus, etc. Touch portion 160 may include a first inorganic insulating layer 161, a second inorganic insulating layer 162, an organic insulating layer 163, a first touch portion 164, and a second touch portion 165.

[0074] A first inorganic insulating layer 161 may be disposed on the encapsulation portion 150. The first inorganic insulating layer 161 may contact a second inorganic encapsulation layer 153 of the encapsulation portion 150. The first inorganic insulating layer 161 may be formed of an inorganic material. For example, the first inorganic insulating layer 161 may be formed of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON), but is not limited thereto.

[0075] refer to Figure 2 and Figure 3 The first touch portion 164 can be disposed on the first inorganic insulating layer 161. The first touch portion 164 can be disposed on the first inorganic insulating layer 161, located in the non-emitting region NEA. Each first touch portion 164 can be spaced apart from each other and disposed in the X-axis and Y-axis directions. For example, the first touch portion 164 may include multiple patterns spaced apart from each other and disposed in the X-axis direction and multiple patterns disposed in the Y-axis direction. The first touch portion 164 can provide touch drive signals for driving the touch portion 160. Additionally, the first touch portion 164 can send touch information detected by the touch portion 160 to the driver IC. The first touch portion 164 can be formed in a grid shape, but is not limited thereto. The first touch portion 164 can be formed of a metallic material, but is not limited thereto.

[0076] A second inorganic insulating layer 162 may be disposed on the first touch portion 164 and the first inorganic insulating layer 161. The second inorganic insulating layer 162 may suppress short circuits in the first touch portions 164 disposed adjacent to each other. The second inorganic insulating layer 162 may be formed of an inorganic material. For example, the second inorganic insulating layer 162 may be formed of an inorganic material such as silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON), but is not limited thereto.

[0077] The refractive index of the first inorganic insulating layer 161 and the refractive index of the second inorganic insulating layer 162 can be greater than the refractive index of the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153. For example, the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 can be formed by adjusting the flow rate of ammonia gas to 100%, and the first inorganic insulating layer 161 and the second inorganic insulating layer 162 can be formed by adjusting the flow rate of ammonia gas to 30%. Thus, when the inorganic insulating layers are formed by adjusting the flow rate of ammonia gas differently, the physical properties of the inorganic insulating layers can be changed according to the flow rate of ammonia gas. For example, the refractive index of the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153 can be different from the refractive index of the first inorganic insulating layer 161 and the second inorganic insulating layer 162. For example, the refractive index of the first inorganic encapsulation layer 151 and the refractive index of the second inorganic encapsulation layer 153 can be approximately 1.85 to 1.86, and the refractive index of the first inorganic insulating layer 161 and the refractive index of the second inorganic insulating layer 162 can be approximately 1.97 to 1.99. Therefore, when inorganic insulating layers are formed by adjusting the flow rate of ammonia gas differently, their refractive indices can be different even if the materials used to form the first inorganic encapsulation layer 151 and the second inorganic encapsulation layer 153, as well as the first inorganic insulating layer 161 and the second inorganic insulating layer 162, are the same.

[0078] refer to Figure 2 and Figure 3 A second touch portion 165 is disposed on the first touch portion 164 and the second inorganic insulating layer 162. The second touch portion 165 can be electrically connected to a disconnected portion of the first touch portion 164 extending in the same direction. For example, refer to... Figure 3 The first touch portion 164 extending along the X-axis has no disconnected portion, while the first touch portion 164 extending along the Y-axis has a disconnected portion for electrical insulation from the first touch portion 164 extending along the X-axis. Therefore, the second touch portion 165 can electrically extend the first touch portion 164 that is provided and disconnected along the Y-axis. Figure 2 It is shown that the second touch portion 165 can be disposed on the first touch portion 164, but is not limited thereto. For example, the first touch portion 164 can be disposed on the second touch portion 165.

[0079] A second touch portion 165, located at the outermost edge of the display area AA, extends to the pad portion 140 of the non-display area NA and can be electrically connected to the pad portion 140. The second touch portion 165 can detect a touch position on the display area AA and can send touch information including the touch position to the pad portion 140. However, embodiments of this disclosure are not limited thereto. For example, the touch portion 160 can be electrically connected to the pad portion 140 through a portion other than the first touch portion 164 and the second touch portion 165, or the first touch portion 164 can be electrically connected to the pad portion 140.

[0080] An organic insulating layer 163 may be disposed on the second touch portion 165 and the second inorganic insulating layer 162. The organic insulating layer 163 may planarize the upper portion of the second touch portion 165 and may protect the components below the organic insulating layer 163. The organic insulating layer 163 may be formed of an epoxy-based or acrylic-based polymer, but is not limited thereto.

[0081] A polarizing plate can be further disposed on the touch portion 160. The polarizing plate can be disposed on the touch portion 160 to reduce the reflection of external light incident on the display device 100. In addition, various optical films, protective films, etc., can be further disposed on the touch portion 160.

[0082] Figure 4 It is along Figure 3 A cross-sectional view of the display device taken by line IV-IV'.

[0083] refer to Figure 4 The second inorganic insulating layer 162 may include a portion having a reduced thickness, such as an opening 162a. The opening 162a of the second inorganic insulating layer 162 may be located in a region overlapping the emission region. The opening 162a of the second inorganic insulating layer 162 may expose a portion of the structure disposed beneath the second inorganic insulating layer 162 in the region overlapping the emission region. For example, the opening 162a of the second inorganic insulating layer 162 may expose a portion of the first inorganic insulating layer.

[0084] Although a portion of the second inorganic insulating layer 162 with a reduced thickness has been illustrated and described as an opening, this portion can be a recess, notch, or blind hole in the second inorganic insulating layer 162. In other words, this portion as described above can be formed by removing all or part of the second inorganic insulating layer 162 in the region overlapping with the emission region. For ease of description, the opening is shown in the figures, and the following description will focus primarily on the opening, but this disclosure is not limited thereto.

[0085] The area of ​​the opening 162a of the second inorganic insulating layer 162 can be the same as or larger than the area of ​​the emitting region. For example, the edge of the opening 162a of the second inorganic insulating layer 162 can be the same as the edge of the emitting region, or it can be located in a non-emitting region NEA adjacent to the emitting region. Therefore, the area of ​​the first inorganic insulating layer 161 exposed by the opening 162a of the second inorganic insulating layer 162 can also be equal to or larger than the area of ​​the emitting region. In this disclosure, an area equal to (or greater than or less than) another area includes the interpretation that the size of the first area or any one or more dimensions are equal to (or greater than or less than) the size of the other area or any one or more dimensions.

[0086] The opening 162a of the second inorganic insulating layer 162 can be disposed at the emission region of at least one of the plurality of sub-pixels. For example, as Figure 4 As shown, the opening 162a of the second inorganic insulating layer 162 can be disposed at the emission region EA_B of the blue sub-pixel, one of the emission regions EA_R of the red sub-pixel, EA_G of the green sub-pixel, and EA_B of the blue sub-pixel. Therefore, the extraction efficiency of light emitted from the emission region EA_B of the blue sub-pixel can be improved.

[0087] Although the above-described structure of the touch portion 160 has been provided in the second region A2 of the substrate 110, the touch portion 160 can also be applied to the first region A1, which is a flat portion of the substrate 110. For example, when the touch portions 160 provided in the first region A1 and the second region A2 of the substrate 110 have different structures, the thickness of the second inorganic insulating layer 162 provided in the first region A1 is different from the thickness of the second inorganic insulating layer 162 provided in the second region A2. Therefore, a step may appear at the second touch portion 165 provided on the second inorganic insulating layer 162. By providing touch portions 160 with the same structure in the first region A1 and the second region A2, the occurrence of steps in the second touch portion 165 can be reduced.

[0088] In display devices with curved areas, the first and second inorganic insulating layers can be formed by reducing the flow rate of ammonia gas to decrease cracks and moisture penetration in the curved areas. In this case, the physical properties and refractive index of the first and second inorganic insulating layers can be altered. For example, compared to forming the first and second inorganic insulating layers by adjusting the ammonia gas flow rate to 100%, when the first and second inorganic insulating layers are formed by adjusting the ammonia gas flow rate to 30%, the refractive index of the first and second inorganic insulating layers increases. Therefore, due to the properties of the first and second inorganic insulating layers and the characteristics of the blue wavelength, some light emitted from the blue sub-pixel passes through the first and second inorganic insulating layers, thus altering the optical path. Consequently, the transmittance and viewing angle at the blue sub-pixel decrease.

[0089] Therefore, in the display device 100 according to an embodiment of this disclosure, by removing all or part of the second inorganic insulating layer 162 at the blue sub-pixel, the reduction in transmittance and viewing angle at the blue sub-pixel can be suppressed. For example, the opening 162a of the second inorganic insulating layer 162 can be provided in the region overlapping with the emission region EA_B of the blue sub-pixel, thus reducing the total thickness of the insulating layer (e.g., the first inorganic insulating layer 161 and the second inorganic insulating layer 162 provided in the region overlapping with the emission region EA_B of the blue sub-pixel). Therefore, the thickness of the inorganic insulating layer that alters the path of light emitted from the blue sub-pixel can be reduced. Thus, by providing the opening 162a of the second inorganic insulating layer 162 in the region overlapping with the emission region EA_B of the blue sub-pixel, the reduction in transmittance and viewing angle at the blue sub-pixel can be suppressed.

[0090] In some embodiments of this disclosure, when the display device 100 is formed of a flexible display device, the above-described structure of the touch portion 160 can be applied to the entire area of ​​the substrate 110. A flexible display device is a display device 100 that can be freely bent or folded, and the entire area of ​​the substrate 110 can be a curved area. Therefore, by applying the structure of the touch portion 160 of this disclosure to the entire area of ​​the substrate 110, stress generated in the curved area can be reduced, and the reliability of the curved area can be improved.

[0091] In some embodiments of this disclosure, when the display device 100 is formed of a foldable display device, the above-described structure of the touch portion 160 can be applied to the folded region. The foldable display device 100 is a foldable display device 100, wherein the folded region of the display device 100 can be a curved region. Therefore, by applying the structure of the touch portion 160 of this disclosure to the folded region of the substrate 110, the stress generated in the folded region can be reduced.

[0092] Figure 5 According to another embodiment of this disclosure Figure 1 A cross-sectional view of the display device taken by line IV-IV'. Figure 5 Display device 100 and Figures 1 to 4 The difference between the display device 100 and the touch part 160 is that the other parts are basically the same, so a redundant description will be omitted.

[0093] refer to Figure 5 The second inorganic insulating layer 162 of the touch portion 160 may include a portion having a reduced thickness, such as an opening 162a. The opening 162a of the second inorganic insulating layer 162 may be provided at each of the plurality of sub-pixels. For example, the opening 162a of the second inorganic insulating layer 162 may be configured to overlap with the emission region EA_R of the red sub-pixel, the emission region EA_G of the green sub-pixel, and the emission region EA_B of the blue sub-pixel, respectively. Therefore, the opening 162a of the second inorganic insulating layer 162 may expose a portion of the first inorganic insulating layer 161 at each of the plurality of sub-pixels. It should be noted that the portion having a reduced thickness may be formed in the form of a blind aperture other than an opening, as per [reference to...]. Figure 4 As mentioned above.

[0094] In a display device 100 according to another embodiment of the present disclosure, by removing all or part of the second inorganic insulating layer 162 at each of the plurality of sub-pixels, a decrease in transmittance and viewing angle at each of the plurality of sub-pixels can be suppressed. For example, an opening 162a of the second inorganic insulating layer 162 can be provided at a region overlapping with the emission region EA_R of the red sub-pixel, the emission region EA_G of the green sub-pixel, and the emission region EA_B of the blue sub-pixel, respectively. Therefore, the thickness of the inorganic insulating layer (e.g., the second inorganic insulating layer 162) that alters the path of light emitted from the plurality of sub-pixels can be reduced. Therefore, by providing the opening 162a of the second inorganic insulating layer 162 at a region overlapping with the emission region of each of the plurality of sub-pixels, a decrease in transmittance and viewing angle at the plurality of sub-pixels can be suppressed.

[0095] Figure 6 According to another embodiment of this disclosure Figure 1 A cross-sectional view of the display device taken by line IV-IV'. Figure 6 Display device 100 and Figures 1 to 4 The difference between the display device 100 and the touch part 160 is that the other parts are basically the same, so a redundant description will be omitted.

[0096] refer to Figure 6The first inorganic insulating layer 161 of the touch portion 160 may include a portion having a reduced thickness, such as an opening 161a. The opening 161a of the first inorganic insulating layer 161 may be located in a region overlapping with an opening 162a of the second inorganic insulating layer 162. For example, the opening 161a of the first inorganic insulating layer 161 may be located in a region overlapping with the emission region EA_B of the blue sub-pixel. Therefore, the opening 161a of the first inorganic insulating layer 161 may expose a portion of the structure disposed beneath the first inorganic insulating layer 161. For example, the opening 161a of the first inorganic insulating layer 161 may expose a portion of the second inorganic encapsulation layer 153.

[0097] The area of ​​the opening 161a of the first inorganic insulating layer 161 can be the same as or larger than the area of ​​the emitting region. For example, the edge of the opening 161a of the first inorganic insulating layer 161 can be the same as the edge of the emitting region, or it can be disposed in the non-emitting region NEA adjacent to the emitting region. Therefore, the area of ​​the second inorganic encapsulation layer 153 exposed by the opening 162a of the first inorganic insulating layer 161 can also be equal to or larger than the area of ​​the emitting region.

[0098] The opening 161a of the first inorganic insulating layer 161 can be disposed in the emission region of at least one of the plurality of sub-pixels. For example, the opening 161a of the first inorganic insulating layer 161 can be disposed only in the emission region EA_B of the blue sub-pixel among the emission regions EA_R of the red sub-pixel, EA_G of the green sub-pixel, and EA_B of the blue sub-pixel. Therefore, the extraction efficiency of light emitted from the emission region EA_B of the blue sub-pixel can be improved.

[0099] In a display device 100 according to another embodiment of the present disclosure, by removing all or part of the first inorganic insulating layer 161 and the second inorganic insulating layer 162 from the blue sub-pixel, the reduction in transmittance and viewing angle at the blue sub-pixel can be suppressed. For example, the opening 161a of the first inorganic insulating layer 161 and the opening 162a of the second inorganic insulating layer 162 can be provided in a region overlapping with the emission region EA_B of the blue sub-pixel. Therefore, the thickness of the inorganic insulating layer (e.g., the first inorganic insulating layer 161 and the second inorganic insulating layer 162) that alters the path of light emitted from the blue sub-pixel can be reduced. Therefore, by providing the opening 161a of the first inorganic insulating layer 161 and the opening 162a of the second inorganic insulating layer 162 in the region overlapping with the emission region EA_B of the blue sub-pixel, the reduction in transmittance and viewing angle in the blue sub-pixel can be suppressed.

[0100] Figure 7 According to another embodiment of this disclosure Figure 1A cross-sectional view of the display device taken by line IV-IV'. Figure 7 Display device 100 and Figure 5 The difference between the display device 100 and the touch portion 160 is that the other components are basically the same, so redundant descriptions will be omitted or provided briefly.

[0101] refer to Figure 7 The opening 162a of the second inorganic insulating layer 162 can be provided at each of the plurality of sub-pixels. For example, the opening 162a of the second inorganic insulating layer 162 can be provided to overlap with the emission region EA_R of the red sub-pixel, the emission region EA_G of the green sub-pixel, and the emission region EA_B of the blue sub-pixel, respectively.

[0102] refer to Figure 7 An opening 161a of the first inorganic insulating layer 161 can be disposed in a region overlapping with an opening 162a of the second inorganic insulating layer 162. For example, the opening 161a of the first inorganic insulating layer 161 can be disposed at the emission region of each of the plurality of sub-pixels and in a region overlapping with the opening 162a of the second inorganic insulating layer 162. Therefore, the opening 161a of the first inorganic insulating layer 161 can expose a portion of the structure disposed beneath the first inorganic insulating layer 161. For example, the opening 161a of the first inorganic insulating layer 161 can expose a portion of the second inorganic encapsulation layer 153 at each of the plurality of sub-pixels.

[0103] The opening 161a of the first inorganic insulating layer 161 can be disposed at each of the plurality of sub-pixels. For example, the opening 161a of the first inorganic insulating layer 161 can be disposed at the emission region EA_R of the red sub-pixel, the emission region EA_G of the green sub-pixel, and the emission region EA_B of the blue sub-pixel, respectively. Therefore, the extraction efficiency of light emitted from the emission regions of the red, green, and blue sub-pixels can be improved.

[0104] In a display device 100 according to another embodiment of the present disclosure, by removing the first inorganic insulating layer 161 and the second inorganic insulating layer 162 from each of the plurality of sub-pixels, the reduction in transmittance and viewing angle at each of the plurality of sub-pixels can be suppressed. For example, the opening 161a of the first inorganic insulating layer 161 and the opening 162a of the second inorganic insulating layer 162 can be provided in the region overlapping with the emission region EA_R of the red sub-pixel, the emission region EA_G of the green sub-pixel, and the emission region EA_B of the blue sub-pixel. Therefore, the thickness of the inorganic insulating layer (e.g., the first inorganic insulating layer 161 and the second inorganic insulating layer 162) that alters the path of light emitted from the plurality of sub-pixels can be reduced. Therefore, by providing the opening 161a of the first inorganic insulating layer 161 and the opening 162a of the second inorganic insulating layer 162 at each of the regions overlapping with the emission regions of each of the plurality of sub-pixels, the reduction in transmittance and viewing angle at the plurality of sub-pixels can be suppressed.

[0105] A display device according to one or more embodiments of the present disclosure will now be described.

[0106] According to an embodiment of this disclosure, a display device includes: a substrate having a display area comprising a plurality of sub-pixels, the plurality of sub-pixels being formed by an emitting region and a non-emitting region; a plurality of light-emitting diodes disposed at the plurality of sub-pixels; an encapsulation portion covering the plurality of light-emitting diodes in the display area; a first inorganic insulating layer disposed on the encapsulation portion; a first touch portion disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first touch portion; and a second touch portion disposed on the second inorganic insulating layer, wherein at least one of the first inorganic insulating layer and the second inorganic insulating layer includes a portion having a reduced thickness, the portion being disposed in a region overlapping with the emitting region disposed at at least one of the plurality of sub-pixels.

[0107] According to some embodiments of this disclosure, the area of ​​this portion may be equal to or greater than the area of ​​the launch region.

[0108] According to some embodiments of this disclosure, this portion can be set in each of a plurality of sub-pixels.

[0109] According to some embodiments of this disclosure, the sub-pixel that is provided in this portion may include a blue sub-pixel.

[0110] According to some embodiments of this disclosure, the substrate may include a bent portion or a folded region, and such portion may be disposed at the bent portion or folded region.

[0111] According to some embodiments of this disclosure, the encapsulation portion may include a first encapsulation layer disposed on a plurality of light-emitting diodes; an organic encapsulation layer disposed on the first encapsulation layer; and a second encapsulation layer disposed on the organic encapsulation layer. The refractive index of the first encapsulation layer and the refractive index of the second encapsulation layer may be less than the refractive index of the first inorganic insulating layer or the refractive index of the second inorganic insulating layer.

[0112] According to another embodiment of this disclosure, the portion is formed as an opening.

[0113] According to another embodiment of this disclosure, a display device includes: a substrate having a display area and a non-display area; a plurality of sub-pixel areas disposed in the display area and including an emitting area and a non-emitting area; a plurality of light-emitting diodes disposed at the plurality of sub-pixels; an encapsulation portion disposed on the plurality of sub-pixels; a first inorganic insulating layer disposed on the encapsulation portion; a first touch portion disposed on the first inorganic insulating layer; a second inorganic insulating layer disposed on the first touch portion; and a second touch portion disposed on the second inorganic insulating layer. The first inorganic insulating layer at one or more of the plurality of sub-pixels is exposed by the second inorganic insulating layer at a region corresponding to the emitting area.

[0114] According to some embodiments of this disclosure, a first inorganic insulating layer at each of the plurality of sub-pixels may be exposed by a second inorganic insulating layer at a region corresponding to the emission region.

[0115] According to some embodiments of this disclosure, the area of ​​the first inorganic insulating layer exposed by the second inorganic insulating layer can be equal to or greater than the area of ​​the emission region.

[0116] According to some embodiments of this disclosure, the encapsulation portion may include a first encapsulation layer disposed on a plurality of light-emitting diodes, an organic encapsulation layer disposed on the first encapsulation layer, and a second encapsulation layer disposed on the organic encapsulation layer. The second encapsulation layer may be exposed by a first inorganic insulating layer at a region corresponding to the emitting region.

[0117] According to some embodiments of this disclosure, the second encapsulation layer can be configured to be exposed at each of the plurality of sub-pixels. The area of ​​the second encapsulation layer exposed by the first inorganic insulating layer can be equal to or greater than the area of ​​the emission region.

[0118] According to some embodiments of this disclosure, the first touch portion can be configured as a grid shape.

[0119] According to some embodiments of this disclosure, the substrate may include one or more curved portions or folded regions. An opening in the second inorganic insulating layer may be provided at the curved portion or folded region.

[0120] According to some embodiments of this disclosure, the substrate may include one or more curved portions or folded regions. Openings in the second inorganic insulating layer and the first inorganic insulating layer may be provided at the curved portions or folded regions.

[0121] It will be apparent to those skilled in the art that various modifications and variations can be made to this disclosure without departing from the technical spirit or scope thereof. Therefore, embodiments of this disclosure are intended to cover such modifications and variations as they fall within the scope of the appended claims and their equivalents.

Claims

1. A display device, comprising: A substrate having a display area comprising a plurality of sub-pixels, the plurality of sub-pixels including an emitting area and a non-emitting area; Multiple light-emitting diodes located at the multiple sub-pixels; An encapsulation portion covering the plurality of light-emitting diodes within the display area, wherein the encapsulation portion includes: a first inorganic encapsulation layer disposed on the plurality of light-emitting diodes; an organic encapsulation layer disposed on the first inorganic encapsulation layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer; A first inorganic insulating layer disposed on the encapsulation portion; The first touch portion is disposed on the first inorganic insulating layer; A second inorganic insulating layer disposed on the first touch portion; and The second touch portion is disposed on the second inorganic insulating layer; Wherein, at least one of the first inorganic insulating layer and the second inorganic insulating layer includes a portion having a reduced thickness, said portion being disposed in a region overlapping with the emission region disposed at at least one of the plurality of sub-pixels; Wherein, the refractive index of the first inorganic encapsulation layer and the refractive index of the second inorganic encapsulation layer are less than the refractive index of the first inorganic insulating layer or the refractive index of the second inorganic insulating layer.

2. The display device according to claim 1, wherein, The area of ​​the portion is equal to or greater than the area of ​​the emission region.

3. The display device according to claim 1, wherein, The portion is set at each of the plurality of sub-pixels.

4. The display device according to claim 1, wherein, The sub-pixels that include the aforementioned portion include blue sub-pixels.

5. The display device according to claim 1, wherein, The substrate includes a bent portion or a folded area, and The portion is located at the curved portion or the folded area.

6. The display device according to any one of claims 1 to 5, wherein, The portion is formed as an opening.

7. A display device, comprising: A substrate, comprising a display area and a non-display area; Multiple sub-pixels are disposed within the display area and include emitting and non-emitting areas; Multiple light-emitting diodes are disposed at the multiple sub-pixels; An encapsulation portion disposed on the plurality of sub-pixels, wherein the encapsulation portion includes: a first inorganic encapsulation layer disposed on the plurality of light-emitting diodes; an organic encapsulation layer disposed on the first inorganic encapsulation layer; and a second inorganic encapsulation layer disposed on the organic encapsulation layer; A first inorganic insulating layer disposed on the encapsulation portion; The first touch portion is disposed on the first inorganic insulating layer; A second inorganic insulating layer disposed on the first touch portion; and The second touch portion is disposed on the second inorganic insulating layer. Wherein, the first inorganic insulating layer at one or more of the plurality of sub-pixels is exposed by the second inorganic insulating layer at the region corresponding to the emission region; Wherein, the refractive index of the first inorganic encapsulation layer and the refractive index of the second inorganic encapsulation layer are less than the refractive index of the first inorganic insulating layer or the refractive index of the second inorganic insulating layer.

8. The display device according to claim 7, wherein, At each of the plurality of sub-pixels, the first inorganic insulating layer is exposed by the second inorganic insulating layer in the region corresponding to the emission region.

9. The display device according to claim 7, wherein, The area of ​​the first inorganic insulating layer exposed by the second inorganic insulating layer is equal to or greater than the area of ​​the emission region.

10. The display device according to claim 7, in, The second inorganic encapsulation layer is exposed by the first inorganic insulating layer in the region corresponding to the emission region.

11. The display device according to claim 10, wherein, The second inorganic encapsulation layer is configured such that the first inorganic insulating layer is exposed at each of the plurality of sub-pixels, and The area of ​​the second inorganic encapsulation layer exposed by the first inorganic insulating layer is equal to or greater than the area of ​​the emission region.

12. The display device according to claim 7, wherein, The first touch portion is configured as a grid shape.

13. The display device according to claim 7, wherein, The substrate includes one or more curved portions or folded areas, and The opening of the second inorganic insulating layer is provided at the curved portion or the folded area.

14. The display device according to claim 10, wherein, The substrate includes one or more curved portions or folded areas, and The openings of the second inorganic insulating layer and the first inorganic insulating layer are located at the curved portion or the folded area.

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