Display device

Abstract

The application discloses a display device, and belongs to the technical field of display. The display device comprises a display panel, a chip on film and a support layer. The support layer is connected to the side of the chip on film far from the display panel, and the support layer can cover at least part of the bending film in the chip on film. Therefore, when the bending film in the chip on film is bent, and the second planar film in the chip on film is connected to the back of the display panel, the bending film still has a certain rebound force, but the support layer can support the bending film, so that the support layer can offset the rebound force exerted by the bending film. In this way, the support layer can effectively reduce the tension exerted by the bending film on the back plate of the display panel through the second planar film, thereby improving the firmness of the connection between the second planar film in the chip on film and the back plate of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display device. Background Technology

[0002] With the development of display technology, display devices are becoming increasingly widely used. Common display devices include smartphones, tablets, televisions, and monitors.

[0003] Display devices typically include a display panel and a driver chip. To reduce the size of the bezel in a display device, the driver chip is usually packaged using Chip On Flex (COF) technology. When packaging a driver chip using COF technology, one end of the COF film is electrically connected to the display panel on the front side (the side opposite the display surface), while the remaining portion is bent to the back side (the side opposite the display surface) and then bonded to the display panel.

[0004] However, the bent portion of the flip-chip film has a certain rebound force, resulting in poor adhesion between the flip-chip film and the display panel. The part of the flip-chip film that is bonded to the display panel is very prone to lifting. The lifted flip-chip film may come into contact with other structures in the display device and interfere, seriously affecting the product yield of the display device. Summary of the Invention

[0005] This application provides a display device. It solves the problem of poor adhesion between the flip-chip film and the display panel in existing display devices. The technical solution is as follows:

[0006] A display device is provided, the device comprising:

[0007] Display panel;

[0008] A flip-chip film, the flip-chip film having a bent film and a first planar film and a second planar film located on both sides of the bent film, the first planar film being electrically connected to the display panel on the front side of the display panel, and the second planar film being connected to the display panel on the back side of the display panel;

[0009] And a support layer connected to the side of the flip-chip film away from the display panel, the support layer covering at least a portion of the bent film.

[0010] Optionally, the support layer is a planar support structure.

[0011] Optionally, the outer boundary of the support layer's orthographic projection onto the flip-chip film coincides with the outer boundary of the flip-chip film.

[0012] Optionally, the outer boundary of the support layer's orthographic projection onto the flip-chip film coincides with the outer edge of the bent film within the flip-chip film.

[0013] Optionally, the support layer includes a plurality of strip structures that extend along the bending direction of the bent portion.

[0014] Optionally, the plurality of strip structures are arranged in parallel.

[0015] Optionally, the distance between any two adjacent strip structures is equal.

[0016] Optionally, the support layer is made of a metallic material.

[0017] Optionally, the flip-chip film includes: a flexible substrate, a circuit layer located on the flexible substrate near the display panel, and a driving chip electrically connected to the circuit layer, wherein the driving chip is located on a second planar film of the flip-chip film;

[0018] The support layer is located on the side of the flexible substrate away from the circuit layer.

[0019] Optionally, the display device further includes: a gasket bonded to the back of the display panel, the side of the gasket facing away from the display panel having a groove;

[0020] The side of the pad facing away from the display panel is bonded to the second planar film, and after the pad is bonded to the second planar film, the driving chip is located in the groove.

[0021] The beneficial effects of the technical solutions provided in this application include at least the following:

[0022] A display device includes a display panel, a flip-chip film, and a support layer. The support layer is connected to the side of the flip-chip film away from the display panel, and the support layer covers at least a portion of the bent film within the flip-chip film. Therefore, even after the bent film in the flip-chip film is bent and the second planar film in the flip-chip film is connected to the back of the display panel, although the bent film still has a certain rebound force, the support layer can support the bent film, thus offsetting the rebound force exerted by the bent film. In this way, the support layer can effectively reduce the tensile force exerted by the bent film on the back of the display panel through the second planar film, thereby improving the bonding strength between the second planar film in the flip-chip film and the back of the display panel, reducing the probability of the second planar film in the flip-chip film connected to the back of the display panel lifting, and thus improving the product yield of the display device. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a schematic diagram of the structure of a common display device.

[0025] Figure 2 yes Figure 1 The diagram shows the effect of separation between the gasket and the flip-chip film in the display device.

[0026] Figure 3 This is a schematic diagram of the structure of a display device provided in an embodiment of this application;

[0027] Figure 4 This is a schematic diagram of the structure of a flip-chip film when it is not bent, according to an embodiment of this application;

[0028] Figure 5 yes Figure 4 The top view of the flip-chip film is shown;

[0029] Figure 6 yes Figure 5 The diagram shows the structure of the flip-chip film after bending.

[0030] Figure 7 yes Figure 4 Another bottom view of the flip-chip film is shown;

[0031] Figure 8 yes Figure 7 The diagram shows the structure of the flip-chip film after bending.

[0032] Figure 9 yes Figure 4 Another bottom view of the flip-chip thin film is shown;

[0033] Figure 10 This is a schematic diagram of another display device provided in an embodiment of this application;

[0034] Figure 11 This is a schematic diagram of the structure of another display device provided in the embodiments of this application;

[0035] Figure 12 This is a schematic diagram of another display device provided in the embodiments of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0037] Please refer to Figure 1 , Figure 1 This is a schematic diagram of a common display device. The display device may include: a display panel 01 and a flip-chip film 02.

[0038] One end of the flip-chip film 02 can be electrically connected to the display panel 01 on the front side (that is, the side on the same side as the display surface 01a of the display panel 01), and after the flip-chip film 02 is electrically connected to the display panel 01, the remaining part of the flip-chip film 02 can be bent to the back side of the display panel 01 (that is, the side opposite to the display surface 01a of the display panel 01) and bonded to the back side of the display panel 01.

[0039] For example, the display device may further include a gasket 03 bonded to the back of the display panel 01. The side of the gasket 03 facing away from the display panel 01 can be bonded to a portion of the flip-chip film 02 bent to the back of the display panel 01. In this way, the gasket 03 can achieve bonding between the portion of the flip-chip film 02 bent to the back of the display panel 01 and the display panel 01.

[0040] However, after the flip-chip film 02 is bent and bonded to the back of the display panel 01, the internal stress in the bent portion of the flip-chip film 02 becomes relatively concentrated, resulting in a certain rebound force in the bent portion of the flip-chip film 02. Under the action of this rebound force, the gasket 03 in the display device will be subjected to the tension of the flip-chip film 02. Under the action of this tension, the adhesion between the gasket 03 and the flip-chip film 02 will become weaker, causing the gasket 03 to separate from the flip-chip film 02.

[0041] For example, please refer to Figure 2 , Figure 2 yes Figure 1 The diagram illustrates the separation between the spacer and the flip-chip film in a display device. After separation occurs between the spacer 03 and the flip-chip film 02, the portion of the flip-chip film 02 bonded to the spacer 03 is prone to lifting. This lifted flip-chip film 02 may interfere with other structures in the display device (e.g., the back cover), severely impacting the product yield of the display device.

[0042] This application provides a display device. The display device can be any electronic device with display functionality, such as a mobile phone, tablet computer, laptop computer, monitor, or television.

[0043] Please refer to Figure 3 , Figure 3This is a schematic diagram of the structure of a display device provided in an embodiment of this application. The display device 000 may include: a display panel 100, a flip-chip film 200, and a support layer 300.

[0044] The display panel 100 has a display surface 100a.

[0045] The flip-chip film 200 in the display device 000 may have a bent film 200a, and a first planar film 200b and a second planar film 200c located on both sides of the bent film 200a.

[0046] The first planar film 200b in the flip-chip film 200 can be electrically connected to the display panel 100 on the front side.

[0047] For example, the area surrounding the display surface 100a of the display panel 100 (also called the non-display area) has a bonding structure, and the first planar film 200b in the flip-chip film 200 has a connecting structure. The first planar film 200b in the flip-chip film 200 can be electrically connected to the bonding structure in the display panel 100 through the connecting structure, thus achieving an electrical connection between the first planar film 200b and the display panel 100. In one possible implementation, the bonding structure in the display panel 100 and the connecting structure in the first planar film 200b can be bonded together using an anisotropic conductive film (ACF). This anisotropic conductive film not only achieves an electrical connection between the display panel 100 and the first planar film 200b but also ensures a secure connection between them.

[0048] After the first planar film 200b in the flip-chip film 200 is electrically connected to the display panel 100, the bending film 200a in the flip-chip film 200 can be bent so that the second planar film 200c in the flip-chip film 200 can be located on the back side of the display panel 100. Furthermore, the second planar film 200c in the flip-chip film 200 can be connected to the display panel 100 on the back side of the display panel 100.

[0049] For example, the second planar film 200c in the flip-chip film 200 can be bonded to the back of the display panel 100 by means of adhesive.

[0050] It should be noted that, in the above embodiments, the front side of the display panel 100 refers to the side of the display panel 100 that is on the same side as the display surface 100a, and the back side of the display panel 100 refers to the side of the display panel 100 that is opposite to the display surface 100a.

[0051] The support layer 300 in the display device 000 may be located on the side of the flip-chip film 200 away from the display panel 100, and the support layer 300 may be connected to the side of the flip-chip film 200 away from the display panel 100. Furthermore, the support layer 300 in the display device 000 may cover at least a portion of the bent film 200b of the flip-chip film 200.

[0052] In this embodiment, the support layer 300, connected to the side of the flip-chip film 200 away from the display panel 100, can cover at least a portion of the bent film 200b of the flip-chip film 200. Therefore, even though the internal stress of the bent film 200b in the flip-chip film 200 is still relatively concentrated and the bent film 200b still has a certain rebound force after the second planar film 200c in the flip-chip film 200 is connected to the display panel 100 on the back side, the support layer 300 can support the bent film 200b, thereby offsetting the rebound force exerted by the bent film 200b.

[0053] In this way, the support layer 300 can effectively reduce the tension exerted by the bending film 200b on the back plate of the display panel 100 through the second planar film 200c, thereby improving the firmness of the connection between the second planar film 200c in the flip-chip film 200 and the back plate of the display panel 100, reducing the probability of the second planar film 200c in the flip-chip film 200 connected to the back plate of the display panel 100 lifting, thereby improving the product yield of the display device 000.

[0054] In summary, the display device provided in this application includes a display panel, a flip-chip film, and a support layer. Since the support layer is connected to the side of the flip-chip film away from the display panel, and the support layer can cover at least a portion of the bent film of the flip-chip film, even when the bent film in the flip-chip film is bent and the second planar film in the flip-chip film is connected to the back of the display panel, although the bent film still has a certain rebound force, the support layer can support the bent film, thus offsetting the rebound force applied by the bent film. In this way, the support layer can effectively reduce the tensile force exerted by the bent film on the back of the display panel through the second planar film, thereby improving the firmness of the connection between the second planar film in the flip-chip film and the back of the display panel, reducing the probability of the second planar film connected to the back of the display panel in the flip-chip film lifting, and thus improving the product yield of the display device.

[0055] In the embodiments of this application, for a clearer view of the structure of the flip-chip film 200, please refer to... Figure 4 , Figure 4This is a schematic diagram of the structure of a flip-chip film when it is not bent, according to an embodiment of this application. The flip-chip film 200 may include: a flexible substrate 201, a circuit layer 202 located on one side of the flexible substrate 201, and a driver chip 203 electrically connected to the circuit layer 202.

[0056] The driver chip 203 in the flip-chip film 200 can be located on the side of the circuit layer 202 away from the flexible substrate 201, and the driver chip 203 can be located within the second planar thin film 200a in the flip-chip film 200. Furthermore, the driver chip 203 in the flip-chip film 200 can be electrically connected to the display panel 100 through the circuit layer 202, enabling the driver chip 203 in the flip-chip film 200 to control the content displayed on the display panel 200.

[0057] In this application, the support layer 300 in the display device 000 may be located on the side of the flexible substrate 201 away from the circuit layer 202, and the support layer 300 may be connected to the side of the flexible substrate 300 away from the circuit layer 202.

[0058] It should be noted that after the flip-chip film 200 is connected to the display panel 100, the circuit layer 202 in the flip-chip film 200 is located on the side of the flexible substrate 201 closer to the display panel 100. This not only ensures that the circuit layer 202 in the flip-chip film 200 can be electrically connected to the display panel 100 normally, but also ensures that the support layer 300 in the display device 000 is located on the side of the flexible substrate 201 away from the display panel 100, so that the support layer 300 can effectively support at least a portion of the bent film 200a in the flip-chip film 200.

[0059] Optionally, the flexible substrate 201 in the flip-chip film 200 is made of a flexible material. For example, the flexible substrate 201 in the flip-chip film 200 is made of polyimide (PI) material.

[0060] In this embodiment, when the flexible substrate 201 in the flip-chip film 200 is made of a flexible material, the flexible substrate 201 in the flip-chip film 200 has greater elasticity after being bent. Thus, after the bending film 200a in the flip-chip film 200 is bent, the portion of the flexible substrate 201 located within the bending film 200a has a stronger rebound force.

[0061] Because a support layer 300 exists on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202, and the support layer 300 can cover the portion of the flexible substrate 201 located within the bent film 200a, the support layer 300 can support the portion of the flexible substrate 201 located within the bent film 200a, thus counteracting the rebound force exerted on this portion. This ensures a high degree of bonding strength between the second planar film 200c in the flip-chip film 200 and the back surface of the display panel 100.

[0062] Optionally, the support layer 300 in the display device 000 may be made of a metallic material. For example, the metallic material may be copper, aluminum, silver, or an alloy.

[0063] It should be noted that when the support layer 300 in the display device 000 is made of a metallic material, the support layer 300 and the circuit layer 202 in the flip-chip film 200 are insulated from each other. For example, the support layer 300 and the circuit layer 202 in the flip-chip film 200 can be insulated from each other by a flexible substrate 201. In this way, the support layer 300 does not participate in the conductivity of the flip-chip film 200; the support layer 300 only serves to support the flip-chip film 200. Thus, the support layer 300 can improve the firmness of the connection between the second planar film 200c in the flip-chip film 200 with a single circuit layer 202 and the back surface of the display panel 100.

[0064] In this application embodiment, the support layer 300 in the display device 000 has various structures. This application will illustrate the following two optional implementation methods as examples:

[0065] The first optional implementation method, such as Figure 5 As shown, Figure 5 yes Figure 4 The image shows a bottom view of the flip-chip film. The support layer 300 in the display panel 000 can be a planar support structure 301.

[0066] In this case, the planar support structure 301 can completely cover the bent film 200a in the flip-chip film 200, thus the planar support structure 301 provides good support for the bent film 200a in the flip-chip film 200.

[0067] It should be noted that when the support layer 300 in the display panel 000 is a planar support structure, there are various structures for the support layer 300 on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202. This application embodiment will illustrate the following two cases as examples:

[0068] The first case, such as Figure 5 and Figure 6 As shown, Figure 6 yes Figure 5 The diagram shows the structure of the flip-chip film after bending. The outer boundary of the orthographic projection of the support layer 300 in the display panel 000 onto the flip-chip film 200 coincides with the outer boundary of the flip-chip film 200.

[0069] In this case, a metal layer can be formed on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202 by any of the following methods: deposition, coating, and sputtering, thus obtaining... Figure 6 The support layer 300 is shown.

[0070] Here, the support layer 300 can not only completely cover the bent film 200a in the flip-chip film 200, but also completely cover the first planar film 200b and the second planar film 200c in the flip-chip film 200. That is, the support layer 300 can cover the entire flip-chip film 300.

[0071] The second scenario, such as Figure 7 and Figure 8 As shown, Figure 7 yes Figure 4 Another bottom view of the flip-chip film is shown. Figure 8 yes Figure 7 The diagram shows the structure of the flip-chip film after bending. The outer boundary of the orthographic projection of the support layer 300 in the display panel 000 onto the flip-chip film 200 coincides with the outer boundary of the bent film 200a in the flip-chip film 200.

[0072] In this case, a metal layer can be formed on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202 by any of the following methods: deposition, coating, and sputtering. A patterning process can then be performed on this metal layer to obtain... Figure 8 The support layer 300 is shown. A single patterning process refers to: photoresist coating, exposure, development, etching, and photoresist stripping.

[0073] Here, the support layer 300 only completely covers the bent film 200a in the flip-chip film 200, and does not cover the first planar film 200b and the second planar film 200c in the flip-chip film 200. That is, the support layer 300 only covers a part of the flip-chip film 200.

[0074] The second optional implementation method, such as Figure 9 As shown, Figure 9 yes Figure 4Another bottom view of the flip-chip film is shown. The support layer 300 in the display panel 000 may include a plurality of strip structures 302. The strip structures 302 in the support layer 300 may extend along the bending direction of the bent film 200a in the flip-chip film 200.

[0075] In this case, when the support layer 300 in the display panel 000 may include a plurality of strip structures 302, the support layer 300 may cover a portion of the bent film 200a.

[0076] Optionally, the multiple strip structures 302 in the support layer 300 are arranged in parallel. For example, all the multiple strip structures 302 in the support layer 300 are parallel to the target edge of the flip-chip film 200. The target edge of the flip-chip film 200 is the side that needs to be bent.

[0077] It should be noted that the length of each strip structure 302 in the support layer 300 needs to be greater than the length of the target edge (i.e., the side that needs to be bent) of the bent film 200a in the flip-chip film 200. For example, the length of each strip structure 302 in the support layer 300 can be equal to the length of the target edge of the flip-chip film 200. In this way, each strip structure 302 in the support layer 300 can effectively support the bent film 200a in the flip-chip film 200.

[0078] In this embodiment, the distance between any two adjacent strip structures 302 in the support layer 300 is equal. Thus, the plurality of strip structures 302 in the support layer 300 can be uniformly distributed on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202. Therefore, the plurality of strip structures 302 in the support layer 300 can further improve the support effect on the bent film 200a in the flip-chip film 200.

[0079] In this case, a metal layer can be formed on the side of the flexible substrate 201 in the flip-chip film 200 away from the circuit layer 202 by any of the following methods: deposition, coating, and sputtering. A patterning process can then be performed on this metal layer to obtain... Figure 10 The support layer 300 is shown. A single patterning process refers to: photoresist coating, exposure, development, etching, and photoresist stripping.

[0080] It should be noted that, in the first and second optional implementation methods mentioned above, the material of the metal layer can be: copper, aluminum, silver, or an alloy.

[0081] Optional, such as Figure 10 As shown, Figure 10This is a schematic diagram of another display device provided in an embodiment of this application. The display device 000 may further include a gasket 400 bonded to the back of the display panel 100. The side of the gasket 400 away from the display panel 100 may be bonded to the second planar film 200c in the flip-chip film 200. Thus, the display device 000 can achieve bonding between the display panel 100 and the second planar film 200c in the flip-chip film 200 through the gasket 400.

[0082] In this application, since the support layer 300 in the display device 000 can support the bent film 200b in the flip-chip film 200, it can counteract the rebound force of the bent film 200b. Therefore, the second planar film 200c in the flip-chip film 200 will not exert a tensile force on the gasket 400, effectively improving the adhesion between the second planar film 200c in the flip-chip film 200 and the gasket 400, and preventing separation between the second planar film 200c in the flip-chip film 200 and the gasket 400.

[0083] Optionally, the display panel 100 in the display device 000 can be a display panel fabricated based on Organic Light-Emitting Diode (OLED) display technology, or it can be a display panel fabricated based on liquid crystal display technology. Therefore, this application embodiment will be described using the following two exemplary implementation methods as examples:

[0084] The first exemplary implementation is as follows: Figure 10 As shown, when the display panel 100 is a display panel made based on OLED display technology, the display panel 100 may include: a panel body 101, and a heat dissipation film 102 connected to the side of the panel body 101 facing away from the display surface 100a.

[0085] In this case, the pad 400 in the display device 000 can be bonded to the side of the heat dissipation film 102 away from the panel body 101.

[0086] The panel body 101 may include multiple OLED light-emitting devices and multiple pixel driving circuits that are electrically connected to each of the multiple OLED light-emitting devices.

[0087] The heat dissipation film 102 is formed of a material with good thermal conductivity. For example, the heat dissipation film 102 may include a single thermally conductive foam, or it may include a layered buffer foam and an aluminum foil, with the aluminum foil facing away from the panel body 101 relative to the buffer foam. The heat dissipation film 102 in the display panel 100 can dissipate the heat generated by the OLED light-emitting device in the panel body 101 when emitting light, thereby improving the luminous efficiency of the OLED light-emitting device.

[0088] The second exemplary implementation method is as follows: Figure 11 As shown, Figure 11 This is a schematic diagram of another display device provided in the embodiments of this application. When the display panel 100 is a display panel made based on liquid crystal display technology, the display panel 100 may include: a liquid crystal panel 103, and a backlight module 104 located on the side of the liquid crystal panel 103 opposite to the display surface 100a.

[0089] In this case, the spacer 400 in the display device 000 can be bonded to the side of the backlight module 104 away from the liquid crystal panel 103.

[0090] The liquid crystal panel 103 may include an array substrate and a color filter substrate disposed opposite to each other, and a liquid crystal layer located between the array substrate and the color filter substrate.

[0091] The backlight module 104 provides a light source for the LCD panel 103, so that the light emitted by the backlight module 104 is controlled by the LCD panel 103 and emitted from the display surface 100a to present the corresponding display image.

[0092] Optional, such as Figure 10 and Figure 11 As shown, the pad 400 in the display device 000 has a groove 401 on the side facing away from the display panel 100. After the pad 400 is bonded to the second planar film 200c in the flip-chip film 200, the driving chip 203 on the second planar film 200c can be located within the groove 401 of the pad 400. Furthermore, after the driving chip 203 is located within the groove 401, a gap exists between the outer surface of the driving chip 203 and the groove surface of the groove 401. This prevents contact interference between the driving chip 203 and the pad 400, thereby preventing the driving chip 203 from being damaged by the pad 400.

[0093] In this case, the gasket 400 in the display device 000 can be a double-sided adhesive with a certain thickness. For example, the gasket 400 in the display device 000 can be double-sided foam adhesive.

[0094] Optional, such as Figure 12 As shown, Figure 12 This is a schematic diagram of another display device provided in an embodiment of this application. The display device 000 may further include a control circuit board 500. The control circuit board 500 can be bonded to the back of the display panel 100 using double-sided adhesive A. After the second planar film 200c in the flip-chip film 200 is bonded to the spacer 400, the circuit layer 203 in the second planar film 200c can be electrically connected to the control circuit board 500. Here, the control circuit board 500 can control the driver chip 203 through vias to control the image displayed on the display panel 100.

[0095] In the embodiments of this application, such as Figure 12 As shown, the display device 000 may further include: a touch panel 600 located on the front side of the display panel 100, and a flexible circuit board 700 electrically connected to the touch panel 600. The touch panel 600 can be bonded to the display panel 100 on the front side via a first adhesive layer B. After one end of the flexible circuit board 700 is electrically connected to the touch panel 100, the remaining portion of the flexible circuit board 700 can be bent to the back side of the display panel 100 and electrically connected to a control circuit board 500. Here, the control circuit board 500 is electrically connected to the touch panel 600 via the flexible circuit board 700 and can detect the touch position on the touch panel 600.

[0096] Optional, such as Figure 12 As shown, the display device 000 may further include a protective cover plate 800 located on the side of the touch panel 600 away from the display panel 100. The protective cover plate 800 may be bonded to the side of the touch panel 600 away from the display panel 100 via a second adhesive layer C.

[0097] In summary, the display device provided in this application includes a display panel, a flip-chip film, and a support layer. Since the support layer is connected to the side of the flip-chip film away from the display panel, and the support layer can cover at least a portion of the bent film of the flip-chip film, even when the bent film in the flip-chip film is bent and the second planar film in the flip-chip film is connected to the back of the display panel, although the bent film still has a certain rebound force, the support layer can support the bent film, thus offsetting the rebound force applied by the bent film. In this way, the support layer can effectively reduce the tensile force exerted by the bent film on the back of the display panel through the second planar film, thereby improving the firmness of the connection between the second planar film in the flip-chip film and the back of the display panel, reducing the probability of the second planar film connected to the back of the display panel in the flip-chip film lifting, and thus improving the product yield of the display device.

[0098] It should be noted that the dimensions of layers and regions may be exaggerated in the accompanying drawings for clarity. Furthermore, it is understood that when an element or layer is referred to as being "on" another element or layer, it can be directly on the other element, or there may be intermediate layers. Additionally, it is understood that when an element or layer is referred to as being "below" another element or layer, it can be directly below the other element, or there may be more than one intermediate layer or element. Furthermore, it is also understood that when a layer or element is referred to as being "between" two layers or two elements, it can be the only layer between the two layers or two elements, or there may be more than one intermediate layer or element. Similar reference numerals throughout indicate similar elements.

[0099] In this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. The term "multiple" refers to two or more unless otherwise expressly defined.

[0100] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display device, characterized in that, include: Display panel; A flip-chip film, the flip-chip film having a bent film and a first planar film and a second planar film located on both sides of the bent film, the first planar film being electrically connected to the display panel on the front side of the display panel, and the second planar film being connected to the display panel on the back side of the display panel; And a support layer connected to the side of the flip-chip film away from the display panel, the support layer covering at least a portion of the bent film; The support layer is made of a metallic material and is used to support the bent film and counteract the rebound force applied by the bent film. The flip-chip film includes: a flexible substrate, and a circuit layer located on the flexible substrate near the display panel; The flexible substrate is made of polyimide material; the support layer is located on the side of the flexible substrate away from the circuit layer, and the support layer is used to support the portion of the flexible substrate located within the bending film and to counteract the rebound force applied to the portion of the flexible substrate located within the bending film.

2. The display device according to claim 1, characterized in that, The support layer is a planar support structure.

3. The display device according to claim 2, characterized in that, The outer boundary of the support layer's orthographic projection onto the flip-chip film coincides with the outer boundary of the flip-chip film.

4. The display device according to claim 2, characterized in that, The outer boundary of the support layer's orthogonal projection onto the flip-chip film coincides with the outer edge of the bent film within the flip-chip film.

5. The display device according to claim 1, characterized in that, The support layer includes a plurality of strip structures that extend along the bending direction of the bent portion.

6. The display device according to claim 5, characterized in that, The multiple strip structures are arranged in parallel.

7. The display device according to claim 6, characterized in that, The distance between any two adjacent strip structures is equal.

8. The display device according to any one of claims 1 to 7, characterized in that, The flip-chip film further includes a driver chip electrically connected to the circuit layer, the driver chip being located on a second planar film of the flip-chip film.

9. The display device according to claim 8, characterized in that, The display device further includes: a gasket bonded to the back of the display panel, the side of the gasket facing away from the display panel having a groove; The side of the pad facing away from the display panel is bonded to the second planar film, and after the pad is bonded to the second planar film, the driving chip is located in the groove.

Images