A container

Abstract

The present invention relates to a container for being detachably installed in an imaging device provided with a plurality of contact terminals, the container comprising a shell and a chip mounting portion located on the shell, the shell forming a cavity that can accommodate imaging materials, the chip mounting portion comprising a plurality of supporting portions for supporting the chip, the plurality of supporting portions being at different distances from a reference plane; the reference plane is a plane passing through the geometric center of the cavity and parallel to at least one of the plurality of supporting portions, when the chip is installed, on the one hand, the electrical contact portion of the chip that is further away from the reference plane is in closer contact with the contact terminal in the imaging device, on the other hand, the lateral movement of the plurality of contact terminals in the imaging device can be prevented, and the possible situation that the chip is installed misplaced or inverted is also eliminated.

Description

Technical Field

[0001] The invention relates to the field of imaging, and in particular to a container detachably installed in an imaging device. Background Art

[0002] In general office or home environments, imaging devices are one of the essential devices for people. Graphic information displayed in visual electronic devices can be imaged on a medium through the imaging device for people to read conveniently. Before the existing imaging device works, a container containing imaging materials needs to be installed in it. When the imaging device works, the imaging material is transported to the medium in a predetermined manner, so that the graphic information to be imaged appears.

[0003] In order to enable the imaging device to obtain information such as the model of the container installed therein and the remaining amount of imaging material in the container, the existing container is installed with a chip that can establish a communication connection with the imaging device. The chip includes a storage unit and an electrical contact unit that are connected to each other. Information such as the model, manufacturer, production date, and service life of the container is stored in the storage unit. The electrical contact unit is used to contact the contact terminals of the contact mechanism in the imaging device, so that a communication connection between the container and the imaging device can be established. Summary of the invention

[0004] Typically, the electrical contact portion includes multiple terminals such as short-circuit detection terminals, ground terminals, power terminals, drive terminals, reset terminals, clock terminals, and data terminals. Accordingly, the number of contact terminals in the imaging device must be no less than the number of terminals in the electrical contact portion. When the number of terminals in the electrical contact portion and the number of contact terminals in the imaging device are both multiple, stable and precise contact between the electrical contact portion and the contact terminals is an important issue.

[0005] The present invention provides a container, which can make the two maintain contact accurately and stably when the number of terminals in the electrical contact part and the number of contact terminals in the imaging device are both set to multiple, and adopts the following technical solutions:

[0006] A container is used to be detachably installed in an imaging device provided with multiple contact terminals, the container includes a shell and a chip mounting portion located on the shell, the shell forms a cavity that can accommodate imaging materials, the chip mounting portion includes a plurality of supporting portions for supporting the chip, the plurality of supporting portions are at different distances from a reference plane; the reference plane is a plane passing through the geometric center of the cavity and parallel to at least one of the plurality of supporting portions.

[0007] The chip that can be supported by the chip mounting portion is provided with a plurality of electrical contacts that can contact the contact terminals, and when the chip is mounted to the chip mounting portion, height differences are formed between the plurality of electrical contacts.

[0008] Wherein, the multiple supporting parts are all parallel to the reference plane; or, one of the multiple supporting parts is inclined relative to the reference plane.

[0009] In some embodiments, the chip includes a plurality of separately formed parts, each of which is provided with at least one electrical contact portion; if necessary, the plurality of parts of the chip are electrically connected.

[0010] In some other embodiments, the chip includes a substrate, the electrical contact portion is disposed on the substrate, and the substrate is a flexible circuit board.

[0011] Preferably, along the extension direction of the electrical contact portions, the plurality of electrical contact portions are arranged in a manner of forming more than two rows in a direction perpendicular to the extension direction.

[0012] In an embodiment of the present invention, the container is an ink cartridge, and the imaging material is ink; or, the container is a toner cartridge, and the imaging material is toner, and the toner cartridge also includes a developing part rotatably mounted in the shell, and the developing part is used to transport the toner out; or, the container is a powder cartridge, and the imaging material is toner, and the powder cartridge also includes a powder outlet portion arranged on the shell, and the powder outlet portion is used to transport the toner out.

[0013] In the container of the present invention, when the chip is installed, on the one hand, the electrical contact portion of the chip that is farther away from the reference plane is in closer contact with the contact terminal in the imaging device, and on the other hand, the lateral movement of multiple contact terminals in the imaging device can be prevented, and the possible situation of the chip being installed misplaced or inverted is also eliminated. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a stereoscopic diagram of a contact mechanism in an imaging device to which the container according to the present invention is applicable.

[0015] Figure 2 It is a schematic diagram of the disassembled state of the chip and the chip mounting part in the container involved in the first embodiment of the present invention.

[0016] Figure 3 It is a top view of the chip involved in the first embodiment of the present invention.

[0017] Figure 4 It is a three-dimensional diagram of a chip mounting portion in a container according to a first embodiment of the present invention.

[0018] Figure 5 Schematic diagram of the position of the chip mounting portion in the container in the container shell according to the first embodiment of the present invention.

[0019] Figure 6 It is a side view of the chip involved in the first embodiment of the present invention when in contact with the contact terminal.

[0020] Figure 7It is a schematic diagram of the disassembled state of the chip and the chip mounting part in the container involved in the second embodiment of the present invention.

[0021] Figure 8 It is a three-dimensional diagram of a chip mounting portion in a container according to a second embodiment of the present invention.

[0022] Fig. 9 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the third embodiment of the present invention.

[0023] Fig.10 Schematic diagram of the position of the chip mounting portion in the container shell according to the third embodiment of the present invention.

[0024] Fig.11 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the fourth embodiment of the present invention.

[0025] Fig.12 Schematic diagram of the position of the chip mounting portion in the container shell according to the fourth embodiment of the present invention.

[0026] Fig.13 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the fifth embodiment of the present invention.

[0027] Fig.14 It is a schematic diagram of the chip mounting portion and the chip after being disassembled in the container according to the sixth embodiment of the present invention.

[0028] Fig.15 Schematic diagram of the position of the chip mounting portion in the container shell according to the sixth embodiment of the present invention.

[0029] Fig.16 It is a three-dimensional diagram of a container involved in the seventh embodiment of the present invention.

[0030] Fig.17 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the seventh embodiment of the present invention.

[0031] Fig.18 Schematic diagram of the position of the chip mounting portion in the container shell according to the seventh embodiment of the present invention.

[0032] Fig.19 It is a three-dimensional diagram of the container involved in the eighth embodiment of the present invention.

[0033] Fig. 20 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the eighth embodiment of the present invention.

[0034] Fig.21 It is a three-dimensional diagram of the chip involved in the eighth embodiment of the present invention.

[0035] Fig. 22 It is a schematic diagram of the position of the chip mounting portion in the container shell involved in the eighth embodiment of the present invention.

[0036] Fig.23 It is a three-dimensional diagram of a container involved in the ninth embodiment of the present invention.

[0037] Fig.24 Schematic diagram of the position of the chip mounting portion in the container shell according to the ninth embodiment of the present invention. DETAILED DESCRIPTION

[0038] The embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0039] Figure 1 It is a stereoscopic diagram of a contact mechanism in an imaging device to which the container according to the present invention is applicable.

[0040] In order to more clearly show the structure of the contact mechanism, the imaging device is not shown in the figure. Figure 1 The contact mechanism shown is only one of them; generally speaking, the appearance and internal structure of different types of imaging devices may be different, and the contact mechanism structure and the number of contact terminals in the contact mechanism in the imaging device may also be different. However, when the container is installed in the imaging device, the contact terminal will definitely contact the electrical contact part in the container, so it can be used. Figure 1 The contact mechanism shown illustrates the technical solution of the present invention.

[0041] As shown in the figure, the contact mechanism 9 includes a bracket 91 and a plurality of contact terminals mounted on the bracket 91, wherein the plurality of contact terminals can move along the thickness direction b of the bracket 91. In the illustrated contact mechanism 9, the plurality of contact terminals are distributed in two rows, including a first contact terminal 92a1, a second contact terminal 92a2, a third contact terminal 92a3 and a fourth contact terminal 92a4 located in the first row 92a, and a fifth contact terminal 92b1, a sixth contact terminal 92b2, a seventh contact terminal 92b3, an eighth contact terminal 92b4 and a ninth contact terminal 92b4 located in the second row 92b, wherein the first contact terminal 92a1, the second contact terminal 92a2, the third contact terminal 92a3 and the fourth contact terminal 92a4 are arranged in the first row 92a. The contact portions of the contact terminal 92a2, the third contact terminal 92a3 and the fourth contact terminal 92a4 are connected to form a first row 92a, the first contact terminal 92a1 and the fourth contact terminal 92a4 are respectively located at two ends of the first row, the contact portions of the fifth contact terminal 92b1, the sixth contact terminal 92b2, the seventh contact terminal 92b3, the eighth contact terminal 92b4 and the ninth contact terminal 92b4 are connected to form a second row 92b, the fifth contact terminal 92b1 and the ninth contact terminal 92b4 are respectively located at two ends of the second row, each contact terminal of the first row is located between two adjacent contact terminals of the second row, and thus, in Figure 1In the angle shown, the contact terminals in the first row and the contact terminals in the second row are staggered in the up-down direction (a direction perpendicular to direction b) and in the left-right direction (another direction perpendicular to direction b).

[0042] Before the container is installed, each contact terminal of the contact mechanism 9 protrudes to the outside of the bracket 91. When the container is installed, each contact terminal contacts the corresponding terminal in the container chip and moves approximately along the direction b toward the bracket 91. When the container is taken out, each contact terminal moves approximately along the direction b toward the direction away from the bracket 91 and protrudes to the outside of the bracket 91.

[0043] [Example 1]

[0044] Figure 2 It is a schematic diagram of the disassembled state of the chip and the chip mounting part in the container involved in the first embodiment of the present invention; Figure 3 It is a top view of the chip involved in the first embodiment of the present invention.

[0045] The container 100 involved in this embodiment is an ink cartridge, and correspondingly, the imaging material is ink, and the imaging device is an inkjet printer. As shown in the figure, the ink cartridge 100 includes a shell 1, an ink outlet portion 3 (an embodiment of an imaging material supply portion) combined with the shell 1, and a chip mounting portion 5. The ink cartridge 100 can be installed along an installation direction a, and a cavity 2 for accommodating ink is formed in the shell 1. The ink is supplied to the outside through the ink outlet portion 3. The chip 6 is installed in the chip mounting portion 5, and the handle 4 is combined with the shell 1. When the ink cartridge 100 is installed in the inkjet printer, the handle 4 abuts against the abutment portion in the inkjet printer to prevent the ink cartridge from withdrawing in a direction opposite to the installation direction a.

[0046] Chip 6 includes multiple parts that are separately formed. In practice, chip 6 may include two parts, or three parts, or more than three parts that are separately formed. However, no matter how many parts chip 6 is configured to include, the technical solution described in the present invention is still applicable. For the convenience of description, this embodiment is described by taking the example that chip 6 includes a first part 61 and a second part 62 that are separately formed.

[0047] As shown in the figure, the first part 61 includes a first substrate 611 and at least one electrical contact portion 612 arranged on the first substrate. In this embodiment, four electrical contact portions are arranged in two rows on the first substrate 611, namely two electrical contact portions 612a arranged in the first row and two electrical contact portions 612b arranged in the second row. The first substrate 611 is also provided with a combining portion 614 for combining with the second part 62.

[0048] The second part 62 includes a second substrate 621 and at least one electrical contact portion 622 arranged on the second substrate. In this embodiment, five electrical contacts are arranged in two rows on the second substrate 621, namely two electrical contacts 622a arranged in the first row and three electrical contacts 622b arranged in the second row; the second substrate 621 is adapted to the first substrate 611 and is also provided with a combined portion that can be combined with the combining portion 614. It can be realized that the combining portion 614 is a clearance groove arranged on the first substrate 611, and the combined portion has a shape matching the clearance groove. At this time, the second part 62 is accommodated by the first part 61, or the combined portion is a clearance groove arranged on the second substrate 621, and the combining portion has a shape matching the clearance groove. At this time, the first part 61 is accommodated by the second part 62; generally, the chip 6 also includes a storage portion (not shown) for storing data. According to the setting of the electrical contact portion, the storage portion can be set on at least one of the first part 61 and the second part 62.

[0049] Furthermore, at least one of the first part 61 and the second part 62 is provided with a limiting part 613 / 623 that can be combined with the chip mounting part 5. That is to say, the first part 61 and the second part 62 can be combined with the chip mounting part 5 respectively to be limited, or after the two are combined, the limiting part provided by one of them can be combined with the chip mounting part to be limited.

[0050] like Figure 3 As shown, when the first part 61 is combined with the second part 62, the contact points cp of the two electrical contact portions 612a in the first row of the first part are located on the straight line L1, the contact points cp of the two electrical contact portions 622a in the first row of the second part are located on the straight line L2, the contact points cp of the two electrical contact portions 612b in the second row of the first part are located on the straight line L3, and the contact points cp of the three electrical contact portions 622b in the second row of the second part are located on the straight line L4, and the straight lines L1, L2, L3 and L4 are parallel to each other but do not overlap.

[0051] Figure 4 is a three-dimensional diagram of a chip mounting portion in a container according to a first embodiment of the present invention; Figure 5 is a schematic diagram of the position of the chip mounting portion in the container in the container shell involved in the first embodiment of the present invention; Figure 6 It is a side view of the chip involved in the first embodiment of the present invention when in contact with the contact terminal.

[0052] The chip mounting portion 5 includes a base 50 and a chip supporting portion arranged on the base 50. Preferably, the number of the chip supporting portions is the same as the number of the parts formed by the chip 6. Figure 4As shown, the chip mounting portion 5 includes a first supporting portion 51 and a second supporting portion 52 adjacently arranged on the base 50, the first portion 61 of the chip is supported by the first supporting portion 51, and the second portion 62 of the chip is supported by the second supporting portion 52, the first supporting portion 51 and the second supporting portion 52 protrude from the base 50 in the same direction, but the protruding dimensions (heights) of the two portions are different. In this embodiment, the first supporting portion 51 supports the first portion 61 of the chip in a point-supporting manner, and the second supporting portion 52 supports the second portion 62 of the chip in a point-supporting manner, as shown in FIG. Figure 4 As shown, the first support portion 51 includes a front support portion 511 and a rear support portion 512 which are arranged at intervals and protrude from the base 50 by the same size (height), and the second support portion 52 includes a front support portion 521 and a rear support portion 522 which are arranged at intervals and protrude from the base 50 by the same size (height), and a groove 53 (such as a groove 53) arranged on the base 50 is provided between the front support portion 511 / 521 and the rear support portion 512 / 522. Figure 4 The first chip portion 61 is supported by the front supporting portion 511 and the rear supporting portion 512 of the first supporting portion, and the second chip portion 62 is supported by the front supporting portion 521 and the rear supporting portion 522 of the second supporting portion.

[0053] like Figure 5 As shown, the geometric center point of the cavity 2 is C, the plane passing through point C and parallel to the installation direction a is S1, the plane passing through the center line of the ink outlet portion 3 and parallel to the installation direction a is S2, the line connecting the front support portion 511 and the rear support portion 512 of the first support portion 51 is parallel to the plane S1 / S2, and the line connecting the front support portion 521 and the rear support portion 522 of the second support portion 52 is parallel to the plane S1 / S2. In the enlarged schematic diagram of the local R1, the distance between the first support portion 51 and the plane S2 is h1, and the distance between the second support portion 52 and the plane S2 is h2, h1 is not equal to h2, because the plane S1 and the plane S2 are parallel to each other, therefore, the distance between the first support portion 51 and the plane S1 is different from the distance between the second support portion 52 and the plane S1, that is, when the plane S1 is taken as the reference, the distance between the first support portion 51 and the plane S1 is different from the distance between the second support portion 52 and the plane S2.

[0054] like Figure 6As shown, when the chip 6 is mounted on the chip mounting portion 5, the first portion 61 and the second portion 62 do not overlap, and a height difference will be formed between the first portion 61 and the second portion 62 along the thickness direction of the substrate; when the ink cartridge 100 mounted with the chip 6 is mounted on the imaging device, each contact terminal of the contact mechanism 9 contacts the corresponding electrical contact portion respectively. For the chip 6 with nine electrical contacts described in this embodiment, the two electrical contact portions 612a located in the first row of the first portion contact the first contact terminal 92a1 and the fourth contact terminal 92a4 respectively, the two electrical contact portions 612b located in the second row of the first portion contact the fifth contact terminal 92b1 and the ninth contact terminal 92b5 respectively, the two electrical contact portions 622a located in the first row of the second portion contact the second contact terminal 92a2 and the third contact terminal 92a3 respectively, and the three electrical contact portions 622b located in the second row of the second portion contact the sixth contact terminal 92b2, the seventh contact terminal 92b3 and the eighth contact terminal 92b4 respectively.

[0055] For the chip 6, it is generally mass-produced, and therefore, the thickness of the first substrate 611 and the second substrate 621 can be assumed to be the same. However, since the first support portion 51 and the second support portion 52 are at different distances from the plane S1, the first portion 61 and the second portion 62 are also at different distances from the plane S1. Taking h2>h1 as an example, the second portion 62 will be farther away from the plane S1 than the first portion 61, which is reflected in the situation that the chip 6 contacts the contact mechanism 9, as shown in FIG. Figure 6 As shown, the contact terminals 92a2 / 92a3 / 92b2 / 92b3 / 92b4 in contact with the electrical contact portion of the second part move farther in the b direction than the contact terminals 92a1 / 92a4 / 92b1 / 92b5 in contact with the electrical contact portion of the first part. Relative to the bracket 91, the contact terminals 92a2 / 92a3 / 92b2 / 92b3 / 92b4 in contact with the electrical contact portion of the second part are more deformed than the contact terminals 92a1 / 92a4 / 92b1 / 92b5 in contact with the electrical contact portion of the first part. As mentioned above, since the straight lines L1, L2, L3 and L4 do not overlap, the contact terminals of the contact mechanism will form four rows when contacting the chip 6.

[0056] The height difference between the first portion 61 and the second portion 62 or the height difference between the first support portion 51 and the second support portion 52 may bring the following beneficial effects:

[0057] First, the electrical contact portion on the chip portion further away from the plane S1 will be in closer contact with the contact terminal, and the communication connection stability between the two will be higher. Therefore, the chip designer can place the electrical contact portion with a relatively high frequency of use on the chip portion further away from the plane S1, and place the electrical contact portion with a relatively low frequency of use on another part of the chip.

[0058] On the other hand, when the ink cartridge 100 or the imaging device is shaken, the lateral movement (along the directions of the straight lines L1, L2, L3 and L4) of the contact terminals can be prevented;

[0059] Thirdly, compared with the existing chip support portion which is a whole plane, the staggered first support portion 51 and second support portion 52 are more conducive to chip installers to find the corresponding installation position, prevent the first part 61 and the second part 62 from being installed in the wrong position, and prevent the chip 6 from being inverted.

[0060] [Example 2]

[0061] Figure 7 is a schematic diagram of the disassembled state of the chip and the chip mounting part in the container involved in the second embodiment of the present invention; Figure 8 It is a three-dimensional diagram of a chip mounting portion in a container according to a second embodiment of the present invention.

[0062] This embodiment is a variation of the first embodiment. In this embodiment, the first part 61 and the second part 62 are respectively supported by the first supporting portion 51 and the second supporting portion 52 in a surface contact manner. Compared with the point support method in the first embodiment, the surface support method can ensure that the chip 6 is supported more stably.

[0063] like Figure 7 and Figure 8 As shown in the partial R3, the plane where the front support part 511 and the rear support part 512 of the first support part 51 are located is parallel to the installation direction a, and the plane where the front support part 521 and the rear support part 522 of the second support part 52 are located is parallel to the installation direction a, but the first support part 51 and the second support part 52 are still staggered. Relative to the plane S1, the distance between the first support part 51 and the plane S1 is different from the distance between the second support part 52 and the plane S1. When the chip 6 is installed, the first part 61 and the second part 62 of the chip will also be staggered.

[0064] [Example 3]

[0065] Fig. 9 is a schematic diagram of a disassembled chip mounting portion and a chip in a container according to a third embodiment of the present invention; Fig.10 Schematic diagram of the position of the chip mounting portion in the container shell according to the third embodiment of the present invention.

[0066] like Fig. 9 As shown in the partial R4 in the figure, the difference between this embodiment and the second embodiment is that the plane where the first support portion 51 is located is not parallel to the plane S1, and the plane where the second support portion 52 is located is parallel to the plane S1. Fig.10As shown in the partial R5, the distance between the second support portion 52 and the plane S2 is h2, and the distance between the first support portion 51 and the plane S2 gradually changes, with a maximum distance of h11 and a minimum distance of h12, wherein h11 is less than or equal to h2. Along the installation direction a, or along the length / extension direction of the electrical contact portion, the distance between the first support portion 51 and the plane S2 decreases. It is understandable that the first support portion 51 can also be configured such that along the installation direction a, or along the length / extension direction of the electrical contact portion, the distance between the first support portion 51 and the plane S2 increases.

[0067] Similarly, in this embodiment, a height difference is still formed between the first support portion 51 and the second support portion 52, or in other words, the first support portion 51 and the second support portion 52 are staggered. When the chip 6 is installed, a height difference is also formed between the first part 61 of the chip and the second part 62 of the chip, or in other words, the first part 61 and the second part 62 are staggered, which can still bring about the above-mentioned beneficial effects.

[0068] [Example 4]

[0069] Fig.11 is a schematic diagram of a disassembled state of a chip mounting portion and a chip in a container according to a fourth embodiment of the present invention; Fig.12 Schematic diagram of the position of the chip mounting portion in the container shell according to the fourth embodiment of the present invention.

[0070] This embodiment is opposite to the third embodiment. Fig.11 As shown in the partial R6 in the middle, in this embodiment, the plane where the second support portion 52 is located is set to be non-parallel to the plane S1, and the plane where the first support portion 51 is located is set to be parallel to the plane S1. Fig.12 As shown in the partial R7, the distance between the first support portion 51 and the plane S2 is h1, the maximum distance between the second support portion 52 and the plane S2 is h21, and the minimum distance is h22, wherein h21 is less than or equal to h1, and along the installation direction a, or along the length / extension direction of the electrical contact portion, the distance between the second support portion 52 and the plane S2 decreases. It is understandable that the second support portion 51 can also be configured to increase the distance between the second support portion 51 and the plane S2 along the installation direction a, or along the length / extension direction of the electrical contact portion.

[0071] This embodiment and embodiment three record the situation where one of the plane where the first support portion 51 is located and the plane where the second support portion 52 is located is not parallel to the reference plane S1. The plane where the first support portion 51 is located and the plane where the second support portion 52 is located are both planes. It can be understood that when the first support portion 51 is set as a curved surface or the second support portion 52 is set as a curved surface, the technical solution of the present invention is still applicable. At this time, at least one of the two end point connecting lines of the curved surface forming the first support portion 51 and the two end point connecting lines of the curved surface forming the second support portion 52 is parallel to the reference plane S1.

[0072] [Example 5]

[0073] Fig.13 It is a schematic diagram of the chip mounting portion and the chip in the container after being disassembled according to the fifth embodiment of the present invention.

[0074] In this embodiment, the chip mounting portion 5 is formed separately from the housing 1 , and a height difference is still formed between the first supporting portion 51 and the second supporting portion 52 in the chip mounting portion 5 , thereby forming a height difference between the first portion 61 and the second portion 62 of the chip 6 .

[0075] One of the benefits of forming the chip mounting portion 5 and the shell 1 separately is that the installation operation of the chip 6 is freer. For the production factory, before producing the ink cartridge 100, the chip 6 can be pre-installed on the chip mounting portion 5, and then the chip mounting portion 5 can be installed on the shell 1. Not only does the operator have more freedom to install the chip 6, but other parts of the shell 1 will not be damaged during the installation of the chip 6.

[0076] [Example 6]

[0077] Fig.14 is a schematic diagram of a disassembled state of a chip mounting portion and a chip in a container according to a sixth embodiment of the present invention; Fig.15 Schematic diagram of the position of the chip mounting portion in the container shell according to the sixth embodiment of the present invention.

[0078] In this embodiment, the ink cartridge can still be installed along the installation direction a. The difference is that the chip mounting portion 5 is arranged as a whole to be inclined relative to the installation direction a. Fig.14 As shown, the first support portion 51 and the second support portion 52 are both inclined relative to the installation direction a. At this time, the reference plane S1 is no longer parallel to the plane S2 where the center line of the ink outlet portion 3 is located. Fig.15 As shown, the reference plane S1 intersects with the plane S2 , and at least one of the first supporting portion 51 or the second supporting portion 52 is parallel to the reference plane S1 .

[0079] Similarly, the distance h1 between the first support portion 51 and the reference plane S1 is different from the distance h2 between the second support portion 52 and the reference plane S2 . There is a height difference between the two. When the chip 6 is installed, there is also a height difference between the chip first portion 61 and the chip second portion 62 .

[0080] [Example 7]

[0081] Fig.16 is a three-dimensional diagram of a container according to a seventh embodiment of the present invention; Fig.17 is a schematic diagram of a disassembled chip mounting portion and a chip in a container according to a seventh embodiment of the present invention; Fig.18 Schematic diagram of the position of the chip mounting portion in the container shell according to the seventh embodiment of the present invention.

[0082] The container involved in this embodiment is a toner cartridge, and accordingly, the imaging material is toner, and the imaging device is a laser printer. Fig.16 As shown, the toner cartridge 100 includes a shell 1, a developing member 11 and an imaging member 12 rotatably mounted in the shell 1, the shell 1 includes a developing shell 1a and an imaging shell 1b combined with each other, and a first end cover 1c and a second end cover 1d respectively located at two longitudinal ends of the developing shell, the developing member 11 is located in the developing shell 1a, and the imaging member 12 is located in the imaging shell 1b, the developing shell 1a and the imaging shell 1b are combined by the first end cover 1c and the second end cover 1d, a cavity 2 for accommodating toner is formed in the developing shell 1a, the developing member 11 is used to supply toner to the imaging member 12, and the imaging member 12 (another embodiment of the imaging material supply unit) is used to supply toner to the outside.

[0083] like Fig.17 As shown in the partial R8, the toner cartridge also includes a chip mounting portion 5 arranged on the shell 1, and the chip mounting portion 5 can be arranged on any one of the developing shell, the imaging shell, the first end cover and the second end cover of the shell 1 according to the position of the contact mechanism 9; the chip 6 is mounted on the chip mounting portion 5, and the same as the above embodiment, the chip 6 in this embodiment still includes a first part 61 and a second part 62 which are separately arranged, and accordingly, the chip mounting portion 5 is still provided with a first supporting portion 51 for supporting the first part 61 and a second supporting portion 52 for supporting the second part 62.

[0084] The reference surface S1 in this embodiment is different from that in the above embodiment. Fig.18As shown, in order to more clearly show the reference plane S1 in this embodiment, only the developing housing 1a and the first end cover 1c are shown in the figure, and the first end cover 1c is cut along a plane parallel to the installation direction. The reference plane S1 passes through the geometric center point C of the cavity 2, and the reference plane S1 is also parallel to at least one of the first support portion 51 and the second support portion 52. At this time, the reference plane S1 intersects with the installation direction a. Preferably, the reference plane S1 and the installation direction a are perpendicular to each other.

[0085] The distance between the first support portion 51 and the reference plane S1 is h1, and the distance between the second support portion 52 and the reference plane S2 is h2. h1 is not equal to h2. Therefore, a height difference is formed between the first support portion 51 and the second support portion 52. When the chip 6 is installed, a height difference is also formed between the chip first part 61 and the chip second part 62.

[0086] [Embodiment 8]

[0087] Fig.19 is a three-dimensional diagram of a container according to an eighth embodiment of the present invention; Fig. 20 is a schematic diagram of a disassembled state of a chip mounting portion and a chip in a container according to an eighth embodiment of the present invention; Fig.21 is a three-dimensional diagram of a chip involved in Embodiment 8 of the present invention; Fig. 22 It is a schematic diagram of the position of the chip mounting portion in the container shell involved in the eighth embodiment of the present invention.

[0088] Different from the seventh embodiment, the toner cartridge 100 in this embodiment no longer has an imaging housing 1b and an imaging member 12 located in the imaging housing 1b. Fig.19 As shown, the developing member 11 (another embodiment of the imaging material supply portion) is rotatably mounted on the housing 1, and the housing 1 includes a developing housing 1a forming a cavity 2 and a first end cover 1c and a second end cover 1d respectively located at two longitudinal ends of the developing housing 1a. Similarly, the chip mounting portion 5 in this embodiment can be arranged on any one of the developing housing 1a, the first end cover 1c and the second end cover 1d.

[0089] like Fig. 20 As shown, a height difference is still formed between the first supporting portion 51 and the second supporting portion 52 of the chip mounting portion 5, such as Fig. 22 As shown, the toner cartridge can be installed along the installation direction a, the reference plane S1 passes through the geometric center point C of the cavity 2, and is parallel to at least one of the first support portion 51 and the second support portion 52. At this time, the reference plane S1 is parallel to the installation direction a, the distance between the first support portion 51 and the reference plane S1 is h1, and the distance between the second support portion 52 and the reference plane S1 is h2, h1 is not equal to h2, and when the chip 6 is installed, a height difference is also formed between the first part 61 of the chip and the second part 62 of the chip.

[0090] When the first part 61 and the second part 62 of the chip 6 need to be electrically connected, such as Fig.21 As shown, the chip 6 also includes a connecting portion 63 for electrically connecting the first part 61 and the second part 62. The connecting portion 63 is preferably a flexible circuit board, so that the first part 61 and the second part 62 can be overlapped or separated according to the position of the shell 1; alternatively, the connecting portion 63 can also be a metal contact arranged at the corresponding position of the first part 61 and the second part 62.

[0091] [Example 9]

[0092] Fig.23 is a three-dimensional diagram of a container according to a ninth embodiment of the present invention; Fig.24 Schematic diagram of the position of the chip mounting portion in the container shell according to the ninth embodiment of the present invention.

[0093] Compared with the seventh and eighth embodiments, the container in this embodiment is further simplified. Fig.23 As shown, the container is a powder cartridge, which can be installed along an installation direction a parallel to its length direction, and includes a shell 1, a powder outlet 3 (another embodiment of an imaging material supply portion) arranged on the shell 1, and a chip mounting portion 5 arranged on the shell 1, and a cavity 2 for accommodating carbon powder is formed in the shell 1.

[0094] like Fig.24 As shown in the partial R9, the chip mounting portion 5 still includes a first support portion 51 and a second support portion 52 with a height difference. The reference plane S1 in this embodiment passes through the geometric center point C of the cavity 2 and is parallel to at least one of the first support portion 51 and the second support portion 52. The distance between the first support portion 51 and the reference plane S1 is h1, and the distance between the second support portion 52 and the reference plane S1 is h2, and h1 is not equal to h2. When the chip 6 is mounted, a height difference is also formed between the first chip portion 61 and the second chip portion 62.

[0095] [Other Notes]

[0096] The above records the situation where the chip 6 is formed separately. For those skilled in the art, the chip 6 can also be configured to be formed as an integral part. When the chip 6 is in a shape in which the second part 62 is accommodated by the first part 61, the substrate 611 of the first part and the substrate 621 of the second part are formed as a whole, and in the thickness direction of the substrate, the first part 61 and the second part 62 are staggered. There will be a space between the side of the second part 62 where the electrical contact part is not set and the side of the first part 61 where the electrical contact part is not set. For the chip mounting part 5, the above-mentioned first supporting part 51 and the second supporting part 52 with a height difference can still be set. Finally, the chip 6 is stably supported in the chip mounting part 5.

[0097] In addition, the substrate of the chip 6 can also be a flexible circuit board. In this case, the chip 6 can be formed in one piece, and the chip mounting portion can still be provided with the above-mentioned first supporting portion 51 and second supporting portion 52 with a height difference. When the chip 6 is installed, the flexible circuit board enables the chip 6 to also form a height difference.

[0098] As described above, the chip mounting portion 5 provided in the container of the present invention can be applicable to both integrally formed chips and separately formed chips, and a plurality of supporting portions for supporting the chip 6 are formed in the chip mounting portion 5, and the plurality of supporting portions are at different distances from the reference plane S1, so that a height difference is formed between the plurality of supporting portions. When the chip 6 is installed, the electrical contact portion of the chip also forms a height difference. On the one hand, the electrical contact portion of the chip 6 that is farther away from the reference plane is in closer contact with the contact terminal in the imaging device, and on the other hand, the lateral movement of the plurality of contact terminals in the imaging device can be prevented, and the possible situation where the chip 6 is installed misplaced or inverted is also eliminated.

Claims

1. A container for detachably mounting in an imaging device provided with a plurality of contact terminals, the container comprising a shell and a chip mounting portion located on the shell, the shell forming a cavity for accommodating imaging materials, characterized in that: The chip mounting portion includes a first supporting portion and a second supporting portion for supporting the chip, wherein the distance between the first supporting portion and the reference plane is different from the distance between the second supporting portion and the reference plane; The reference plane is a plane passing through the geometric center of the cavity, and one of the plane where the first support portion is located and the plane where the second support portion is located is parallel to the plane, and the other of the plane where the first support portion is located and the plane where the second support portion is located is not parallel to the plane; The chip includes a first part and a second part formed separately and an electrical contact portion arranged on the first part and the second part, the first part is supported by the first supporting portion, the second part is supported by the second supporting portion, and the electrical contact portion is used to contact with the contact terminal; One of the first part and the second part is provided with a space-avoiding groove, and the other of the first part and the second part is accommodated in the space-avoiding groove.

2. The container according to claim 1, characterized in that The chip that can be supported by the chip mounting portion is provided with a plurality of electrical contacts that can contact the contact terminals, and when the chip is mounted to the chip mounting portion, height differences are formed between the plurality of electrical contacts.

3. The container according to claim 2, characterized in that The chip includes a plurality of parts which are formed separately, and at least one electrical contact portion is arranged in each part.

4. The container according to claim 3, characterized in that The various parts of the chip are electrically connected.

5. The container according to claim 3, characterized in that The chip comprises a substrate, the electrical contact portion is arranged on the substrate, and the substrate is a flexible circuit board.

6. The container according to claim 2, characterized in that Along the extension direction of the electrical contact portions, the plurality of electrical contact portions are arranged in a manner of forming more than two rows in a direction perpendicular to the extension direction.

7. The container according to any one of claims 1 to 6, characterized in that: The container is an ink cartridge, and the imaging material is ink.

8. The container according to any one of claims 1 to 6, characterized in that: The container is a toner box, the imaging material is toner, and the toner box further comprises a developing component rotatably mounted in the shell, and the developing component is used for conveying the toner out.

9. The container according to any one of claims 1 to 6, characterized in that: The container is a powder cartridge, the imaging material is carbon powder, and the powder cartridge further comprises a powder outlet portion arranged on the shell, and the powder outlet portion is used to transport the carbon powder out.

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