Substrate processing apparatus, polishing head, and substrate processing method
By using a grinding head device and cleaning fluid spraying technology, the problem of removing firmly attached substances from the periphery of the substrate was solved, achieving a highly efficient substrate cleaning effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2021-05-13
- Publication Date
- 2026-06-09
AI Technical Summary
Existing technologies struggle to effectively remove firmly attached materials, such as unwanted films, from the periphery of a substrate, especially on the bevels and ends of the substrate.
The device employs a grinding head assembly, which includes a grinding disc and a grinding block containing abrasive particles. The grinding head comes into contact with the periphery of the substrate through a rotation and movement mechanism. Combined with the spraying of cleaning fluid, this achieves effective cleaning of the periphery of the substrate.
It can effectively remove firmly attached substances from the periphery of the substrate, improve cleaning efficiency, and reduce cleaning time and material waste.
Smart Images
Figure CN114102423B_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to a substrate processing apparatus, a grinding head, and a substrate processing method. Background Technology
[0002] The substrate cleaning apparatus described in Patent Document 1 includes a brush made of sponge-like resin for cleaning the periphery of the substrate. The brush removes deposits attached to the periphery of the substrate.
[0003] Existing technical documents
[0004] Patent documents
[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-182507 Summary of the Invention
[0006] The problem the invention aims to solve
[0007] One of the technical solutions disclosed herein provides a technique for effectively removing unwanted films or other firmly attached substances accumulated on the periphery of a substrate.
[0008] Solution for solving the problem
[0009] A substrate processing apparatus according to the present disclosure includes: a holding part for holding a substrate having a bevel and an end face on its peripheral portion; a rotating part for rotating the holding part; a grinding head for abutting against the peripheral portion of the substrate held by the holding part and grinding the peripheral portion of the substrate; and a retaining member for mounting the grinding head.
[0010] Alternatively, the grinding head may include a grinding disc containing abrasive grains and a grinding block having a flat surface for fixing the grinding disc, wherein the grinding disc is fixed to the flat surface of the grinding block and can abut against the periphery of the substrate.
[0011] Alternatively, the grinding block may have a pyramidal shape, the pyramidal shape having a flat surface (i.e., a pyramidal surface), and the grinding disc may be fixed to the pyramidal surface of the pyramidal shape to grind the inclined surface of the substrate.
[0012] Alternatively, the grinding block may have a prism with a flat surface (i.e., a side surface), and the grinding disc may be fixed to the side surface of the prism to grind the end face of the substrate.
[0013] Alternatively, the holder can be rotatable and stop rotating during the grinding process of the substrate. The grinding block has a plurality of flat surfaces arranged symmetrically about the rotation center line of the holder. The grinding disc is fixed to the plurality of flat surfaces and arranged symmetrically about the rotation center line of the holder.
[0014] The substrate processing apparatus described above may also include: a rotation determination unit that determines whether it is necessary to switch the grinding disc by rotating the holder; and a notification control unit that performs notification control to urge the holder to rotate based on the determination result of the rotation determination unit.
[0015] The substrate processing apparatus described above may also include: a rotation mechanism that causes the holder to rotate about the rotation center line; a rotation control unit that controls the rotation mechanism; and a rotation determination unit that determines whether it is necessary to switch the grinding disc by rotating the holder, wherein the rotation control unit rotates the holder according to the determination result of the rotation determination unit.
[0016] Alternatively, the substrate processing apparatus described above may include: a moving mechanism that moves the holder between a grinding position in which the grinding head abuts against the periphery of the substrate and a standby position that prevents interference between the substrate and the holder during substrate feeding and feeding out; a moving control unit that controls the moving mechanism; and a change-needs determination unit that determines whether the grinding position of the holder needs to be changed, wherein the moving control unit changes the grinding position of the holder according to the determination result of the change-needs determination unit.
[0017] For the above-mentioned substrate processing apparatus, the grinding head may also include a flexible sheet disposed between the grinding disc and the grinding block.
[0018] Alternatively, the substrate processing apparatus described above may include a mounting member that allows the grinding head to be replacedly mounted on the retainer.
[0019] Alternatively, the substrate processing apparatus described above may include a liquid supply unit that supplies cleaning fluid to the substrate held by the holding unit, the liquid supply unit having a nozzle that sprays the cleaning fluid toward the periphery of the substrate, the nozzle moving together with the holding member.
[0020] The present disclosure discloses a grinding head for grinding the peripheral portion of a substrate having a bevel and an end face at its periphery. The grinding head includes: a grinding disc containing abrasive grains; and a grinding block having a flat surface for fixing the grinding disc, the grinding disc being fixed to the flat surface of the grinding block and capable of abutting against the peripheral portion of the substrate.
[0021] Alternatively, the grinding head described above may have a grinding block with a pyramidal shape, the pyramidal shape having a flat surface, i.e., a pyramidal surface, and the grinding disc fixed to the pyramidal surface of the pyramidal shape to grind the inclined surface of the substrate.
[0022] Alternatively, the grinding head described above may have a grinding block with a prism having a flat surface (i.e., a side surface), and the grinding disc is fixed to the side surface of the prism to grind the end face of the substrate.
[0023] Alternatively, the grinding head described above may have the grinding block mounted on a rotatable retainer, having a plurality of flat surfaces arranged symmetrically about the rotational center line of the retainer, and the grinding disc fixed to the plurality of flat surfaces, arranged symmetrically about the rotational center line of the retainer.
[0024] Alternatively, the grinding head may also include a flexible sheet disposed between the grinding disc and the grinding block.
[0025] A substrate processing method disclosed herein includes: rotating a substrate having a bevel and an end face at its periphery; and bringing a grinding head into contact with the periphery of the substrate, thereby grinding the periphery of the substrate using the grinding head.
[0026] Alternatively, the above-described substrate processing method may include a polishing head comprising: a polishing disc containing abrasive grains, and a polishing block having a flat surface for fixing the polishing disc, wherein the polishing disc is fixed to the flat surface of the polishing block and can abut against the periphery of the substrate.
[0027] The effects of the invention
[0028] According to a technical solution disclosed herein, unwanted films and other firmly attached substances deposited on the periphery of a substrate can be effectively removed. Attached Figure Description
[0029] Figure 1 This is a cross-sectional view showing a substrate processing apparatus according to one embodiment.
[0030] Figure 2 This is a cross-sectional view showing an example of the periphery of a substrate.
[0031] Figure 3 This is a cross-sectional view showing a modified example of the periphery of the substrate.
[0032] Figure 4 This is a cross-sectional view showing an example of a moving mechanism.
[0033] Figure 5A This is a sectional view showing an example of an installed component. Figure 5B It is along Figure 5A A cross-sectional view of the BB line.
[0034] Figure 6A This is a diagram obtained by viewing the grinding head of one embodiment from the side. Figure 6B Viewed from below Figure 6A The diagram shows the result obtained using the grinding head shown.
[0035] Figure 7A It means Figure 2 A cross-sectional view of an example of grinding the first inclined plane shown. Figure 7B It means Figure 2 A cross-sectional view of an example of grinding of the end face shown.
[0036] Figure 8A It means Figure 3 A cross-sectional view of an example of grinding the first inclined plane shown. Figure 8B It means Figure 3 A cross-sectional view of an example of grinding of the end face shown.
[0037] Figure 9 This diagram illustrates the components of a control device for a substrate processing apparatus according to one embodiment, using functional modules.
[0038] Figure 10 This is a flowchart illustrating a substrate processing method according to one embodiment.
[0039] Figure 11 This is a timing diagram illustrating a substrate processing method according to one embodiment.
[0040] Figure 12A This is a diagram obtained by viewing the grinding head of the first modified example from the side. Figure 12B Viewed from below Figure 12A The diagram shows the result obtained using the grinding head shown.
[0041] Figure 13A This is a diagram obtained by viewing the grinding head of the second modified example from the side. Figure 13B Viewed from below Figure 13A The diagram shows the result obtained using the grinding head shown.
[0042] Figure 14A This is a diagram obtained by viewing the grinding head of the third modified example from the side. Figure 14B Viewed from below Figure 14A The diagram shows the result obtained using the grinding head shown. Detailed Implementation
[0043] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. In the drawings, sometimes the same or corresponding structures are labeled with the same reference numerals, and descriptions are omitted.
[0044] First, refer to Figure 1 The substrate processing apparatus 1 is described below. The substrate processing apparatus 1 processes a substrate W. In this embodiment, the substrate W is a silicon wafer, but it can also be a compound semiconductor wafer or a glass substrate. Electronic circuits and other devices are formed on the surface of the substrate W, and conductive films, insulating films, or photoresist films are formed thereon. Multiple films may also be formed. The substrate processing apparatus 1 includes: a processing container 11 that houses the substrate W, a holding portion 12 that holds the substrate W, and a rotating portion 13 that rotates the holding portion 12.
[0045] The processing container 11 has a door (not shown) and a gate valve (not shown) for opening and closing the door. The substrate W is fed into the interior of the processing container 11 through the door, processed inside the processing container 11, and then discharged out of the processing container 11 through the door.
[0046] The holding part 12 holds the substrate W horizontally, for example. The holding part 12 holds the substrate W horizontally such that the surface on which the device is formed faces upwards and the center of the upper surface of the substrate W is aligned with the rotation center line of the rotation axis 14. In this embodiment, the holding part 12 is a vacuum chuck, but it can also be a mechanical chuck or an electrostatic chuck, etc. The holding part 12 can be any rotatable rotary chuck.
[0047] The rotating part 13 includes, for example, a vertical rotating shaft 14 and a rotary motor 15 that rotates the rotating shaft 14. The rotational driving force of the rotary motor 15 can also be transmitted to the rotating shaft 14 by means of a rotational transmission mechanism such as a timing belt or gears. When the rotating shaft 14 rotates, the holding part 12 also rotates.
[0048] The substrate processing apparatus 1 includes a cup 17 for collecting cleaning fluid or the like supplied to the substrate W. The cup 17 surrounds the periphery of the substrate W held by the holding part 12 and receives cleaning fluid or the like that splashed from the periphery of the substrate W. In this embodiment, the cup 17 does not rotate with the rotation axis 14, but it may rotate with the rotation axis 14.
[0049] The cup 17 includes: a horizontal bottom wall 17a, an outer peripheral wall 17b extending upward from the periphery of the bottom wall 17a, and an inclined wall 17c extending obliquely upward from the upper end of the outer peripheral wall 17b toward the radially inward side of the outer peripheral wall 17b. The bottom wall 17a is provided with a drain pipe 17d for discharging liquid accumulated inside the cup 17 and an exhaust pipe 17e for discharging gas accumulated inside the cup 17.
[0050] The substrate processing apparatus 1 includes a polishing head 20. The polishing head 20 abuts against the peripheral edge Wa of the substrate W held by the holding part 12 and polishes the peripheral edge Wa of the substrate W. The polishing head 20 can remove unwanted films and other stubborn deposits accumulated on the peripheral edge Wa of the substrate W. Therefore, compared with cleaning the peripheral edge Wa of the substrate W with a sponge-like brush, it is possible to effectively remove deposits.
[0051] like Figure 2 As shown, the peripheral portion Wa of the substrate W includes, for example, a first inclined surface Wa1, a second inclined surface Wa2, and an end face Wa3. The first inclined surface Wa1 slopes downwards from the periphery of the upper surface of the substrate W towards the radial outward direction of the substrate W. On the other hand, the second inclined surface Wa2 slopes upwards from the periphery of the lower surface of the substrate W towards the radial outward direction of the substrate W. The end face Wa3 is formed vertically between the first inclined surface Wa1 and the second inclined surface Wa2. The end face Wa3 is also referred to as the apex.
[0052] like Figure 2 As shown, in sectional observation, the first inclined plane Wa1, the second inclined plane Wa2, and the end face Wa3 are all straight lines. However, as... Figure 3 As shown, in cross-sectional observation, the first inclined surface Wa1, the second inclined surface Wa2, and the end face Wa3 can all be curved. The grinding head 20 grinds at least one of the first inclined surface Wa1 and the end face Wa3.
[0053] like Figure 6A and Figure 6B As shown, the grinding head 20 includes, for example, a grinding disc 21 containing abrasive grains and a grinding block 22 having a flat surface for fixing the grinding disc 21. The grinding disc 21, for example, has an abrasive material layer formed by fixing abrasive grains such as diamond particles with resin and a resin film supporting the abrasive material layer. The abrasive material layer may also have a raised or recessed pattern on its surface to prevent clogging. The grinding block 22 is formed of a hard resin, such as PVC (polyvinyl chloride).
[0054] The abrasive disc 21 is fixed to the flat surface of the abrasive block 22 and abuts against the peripheral edge Wa of the substrate W. Unlike the case where the abrasive disc 21 is fixed to a curved surface, when the abrasive disc 21 is fixed to a flat surface, it can be directly fixed without deforming. Therefore, a harder abrasive disc 21 can be used, and the deposits can be effectively removed.
[0055] The grinding block 22, for example, has a pyramid 23. The pyramid 23 is a cone shape facing downwards. The pyramid 23 includes: a plurality of pyramidal faces 23a, a horizontal upper surface 23b, and a horizontal lower surface 23c. Thus, the pyramid 23 can also be a frustum formed by removing the top of the cone. The pyramidal faces 23a are configured to face downwards. The grinding disc 21 is fixed to the pyramidal faces 23a of the pyramid 23, such as... Figure 7A or Figure 8A As shown, the first inclined surface Wa1 of the substrate W is polished.
[0056] Alternatively, the grinding block 22 may also have a prism 24. The prism 24 is, for example, disposed on a pyramid 23. The prism 24 includes: a plurality of side faces 24a, a horizontal upper surface 24b, and a horizontal lower surface 24c. The side faces 24a are vertically disposed. The lower surface 24c of the prism 24 has the same shape and size as the upper surface 23b of the pyramid 23, but may also have different shapes or sizes. The grinding disc 21 is fixed to the side faces 24a of the prism 24, such as... Figure 7B or Figure 8B As shown, the end face Wa3 of the substrate W is ground.
[0057] In addition, the grinding block 22 may also have a cylinder 25 (see reference). Figure 5A (etc.). A cylinder 25 is disposed on a prism 24. The cylinder 25 is mounted on a retainer 30. Alternatively, in the absence of a cylinder 25, the prism 24 is mounted on the retainer 30. Alternatively, in the absence of a prism 24, the pyramid 23 is mounted on the retainer 30.
[0058] The retainer 30 is formed of a hard resin, such as PEEK (polyetheretherketone). The retainer 30 can also be rotated, as described later. The grinding block 22 rotates together with the retainer 30.
[0059] With the polishing pad 21 fixed to the flat surface of the polishing block 22, the rotation of the retainer 30 is stopped during the polishing process of the substrate W so that the polishing block 22 does not rotate. The purpose of stopping the rotation of the retainer 30 during the polishing process of the substrate W is to maintain a constant distance between the rotation center of the substrate W and the polishing pad 21.
[0060] Pyramid 23, for example Figure 6A and Figure 6B As shown, it is a regular square pyramid, comprising a plurality of pyramidal faces 23a arranged rotationally symmetrically about the rotation center line R of the retainer 30. The pyramid 23 can be any regular polyhedron, for example, it could be... Figure 12A and Figure 12B As shown, it is a regular triangular pyramid.
[0061] The polishing discs 21 are fixed to multiple pyramidal surfaces 23a and are arranged rotationally symmetrically around the rotation center line R of the retainer 30. In the event that one polishing disc 21 wears out and its lifespan is exhausted, even without replacing the polishing head 20, the first inclined surface Wa1 of the substrate W can be polished using other polishing discs 21 simply by rotating the retainer 30, and the polishing disc 21 that abuts against the first inclined surface Wa1 can be switched.
[0062] Additionally, prism 24, for example, Figure 6A and Figure 6B As shown, it is a regular square prism, including multiple facets 24a arranged rotationally symmetrically about the rotation center line R of the retainer 30. The prism 24 can be any regular polyprism, for example, it could also be... Figure 12A and Figure 12B As shown, it is a regular triangular prism.
[0063] The polishing discs 21 are fixed to multiple sides 24a and are arranged rotationally symmetrically around the rotation center line R of the retainer 30. In the event that one polishing disc 21 wears out and its lifespan is exhausted, the end face Wa3 of the substrate W can be polished using other polishing discs 21 simply by rotating the retainer 30, without replacing the polishing head 20. The polishing disc 21 that abuts against the end face Wa3 can be switched.
[0064] Alternatively, the grinding block 22 may not have regular polyhedrons or regular polyprisms. For example, Figure 13A and Figure 13B As shown, the grinding block 22 may also have a wedge 26 formed by tilting a pair of sides of the quadrangular prism. The wedge 26 includes a pair of conical surfaces 26a arranged rotationally symmetrically about the rotation center line R of the retainer 30. The pair of conical surfaces 26a are cone-shaped and face downwards at an angle.
[0065] The polishing disc 21 is fixed to a pair of conical surfaces 26a and is arranged rotationally symmetrically with respect to the rotation center line R of the retainer 30. In the event that one polishing disc 21 wears out and its lifespan is exhausted, the first inclined surface Wa1 of the substrate W can be polished using other polishing discs 21 simply by rotating the retainer 30, without replacing the polishing head 20. The polishing disc 21 that abuts against the first inclined surface Wa1 can be switched.
[0066] like Figure 13B As shown, the grinding disc 21 can be fixed only to one pair of side surfaces 24a of the prism 24, or it can be left unfixed to the remaining pair of side surfaces 24a. The side surfaces 24a of the prism 24 for fixing the grinding disc 21 and the conical surface 26a of the wedge 26 for fixing the grinding disc 21 are arranged at the same angle around the rotation center line R of the retainer 30. When the rotation of the retainer 30 has stopped, the first inclined surface Wa1 and the end surface Wa3 of the substrate W can be ground successively.
[0067] Furthermore, the abrasive block 22 may have only one or more flat surfaces for fixing the abrasive disc 21, or it may not have multiple such flat surfaces. As described above, when the abrasive disc 21 is fixed to a flat surface, a harder abrasive disc 21 can be used, and the deposits can be effectively removed. Therefore, it is also possible for multiple flat surfaces to be arranged not rotationally symmetrically about the rotation center line R of the retainer 30.
[0068] For example, Figure 14A and Figure 14B As shown, the grinding block 22 may also have a solid 27 formed by tilting one side of the quadrangular prism. This solid 27 includes a downwardly tilted surface 27a. An grinding disc 21 is formed on this tilted surface 27a.
[0069] like Figure 14B As shown, the grinding disc 21 can be fixed to only one side 24a of the prism 24, or it can be left unfixed to the remaining three sides 24a. The side 24a of the prism 24 for fixing the grinding disc 21 and the inclined surface 27a of the solid 27 for fixing the grinding disc 21 are arranged at the same angle around the rotation center line R of the holder 30. When the rotation of the holder 30 has stopped, the first inclined surface Wa1 and the end surface Wa3 of the substrate W can be ground successively.
[0070] The polishing head 20 may also include a flexible sheet 28 disposed between the polishing pad 21 and the polishing block 22. The flexible sheet 28 is formed of a sponge-like resin, such as PVA (polyvinyl alcohol) sponge. The flexible sheet 28 is deformed to conform to the shape of the peripheral portion Wa of the substrate W, so that the polishing pad 21 is in close contact with the peripheral portion Wa of the substrate W.
[0071] like Figure 5A and Figure 5B As shown, the substrate processing apparatus 1 includes a holder 30 on which a polishing head 20 is mounted. For example, a polishing block 22 is mounted on the lower surface of the holder 30. A recess 31 is formed on the lower surface of the holder 30, and a protrusion 29 is provided on the upper surface of the polishing block 22, the protrusion 29 engaging with the recess 31.
[0072] The substrate processing apparatus 1 includes a mounting member 35 for replacing the polishing head 20 in a retaining member 30. The mounting member 35 is, for example, a set screw, which is screwed into the screw hole 32 of the retaining member 30 and pressed against the side of the quadrangular prism 29a of the protrusion 29. Compared to a cylinder, the quadrangular prism 29a can suppress rotational deviation. Therefore, rotational deviation of the polishing head 20 can be suppressed.
[0073] In addition to the quadrangular prism 29a, the protrusion 29 of the grinding head 20 also has a disc-shaped upper flange 29b located at the upper end of the quadrangular prism 29a and a disc-shaped lower flange 29c located at the lower end of the quadrangular prism 29a. The diameters of the upper flange 29b and the lower flange 29c are both smaller than the diameter of the recess 31.
[0074] When replacing the grinding head 20, first, remove the set screw from the recess 31. Next, pull the protrusion 29 of the used grinding head 20 out of the recess 31 of the retainer 30. Then, insert the unused grinding head 20 protrusion 29 into the recess 31 of the retainer 30. Next, screw the set screw in and press it against the side of the tetragonal prism 29a of the protrusion 29.
[0075] like Figure 4 As shown, the substrate processing apparatus 1 includes a moving mechanism 40 that moves the holding member 30 between a polishing position and a standby position. Figure 1 As shown, the polishing position is the position where the polishing head 20 abuts against the periphery Wa of the substrate W. The standby position, though not shown, is the position used to prevent interference between the substrate W and the polishing head 20 during substrate W feeding and feeding. Compared to the polishing position, the standby position is set radially outward from the substrate W.
[0076] like Figure 4 As shown, the moving mechanism 40 has a horizontal moving part 41 that moves the retaining member 30 in a horizontal direction. The horizontal moving part 41 includes, for example, a vertical rotating shaft 41a, a bearing 41b of the rotating shaft 41a, and a motor 41c that rotates the rotating shaft 41a. The rotating shaft 41a is connected to the retaining member 30 by a horizontal arm 50. The arm 50 is fixed to the upper end of the rotating shaft 41a. When the rotating shaft 41a rotates under the action of the motor 41c, the retaining member 30 rotates about the rotating shaft 41a as a center.
[0077] The horizontal moving part 41 moves the holding member 30 radially along the substrate W held by the holding part 12. Alternatively, although not shown, the horizontal moving part 41 may include: a horizontal guide rail, a motor that moves the arm 50 along the length of the guide rail, and a ball screw that converts the rotational motion of the motor into the linear motion of the arm 50. When the arm 50 moves, the holding member 30 moves.
[0078] The moving mechanism 40 has a vertical moving part 42 that moves the retaining member 30 in a vertical direction. The vertical moving part 42 includes, for example, a lifting plate 42a, a motor 42b that moves the lifting plate 42a up and down, and a ball screw 42c that converts the rotational motion of the motor 42b into the linear motion of the lifting plate 42a. The lifting plate 42a holds the motor 41c of the horizontal moving part 41 and holds the bearing 41b of the rotating shaft 41a. When the lifting plate 42a moves up and down, the arm 50 moves up and down, resulting in the retaining member 30 moving up and down.
[0079] The substrate processing apparatus 1 may also include a rotation mechanism 45 for rotating the holder 30. In the event that one polishing disc 21 wears out and its lifespan is exhausted, the holder 30 can be automatically rotated, and the substrate W can be polished using other polishing discs 21, thereby enabling the switching of the polishing disc 21 that abuts against the substrate W.
[0080] The rotating mechanism 45 includes, for example, a vertical rotating shaft 45a, a bearing 45b for the rotating shaft 45a, and a motor 45c that rotates the rotating shaft 45a. The rotational motion of the motor 45c is transmitted to the rotating shaft 45a via a drive pulley 45d, a timing belt 45e, and a driven pulley 45f. The retaining member 30 is coaxially configured with the rotating shaft 45a and rotates together with it. The axis of the rotating shaft 45a of the rotating mechanism 45 is the rotation center line R of the retaining member 30.
[0081] Arm 50 is, for example, cylindrical, and houses a motor 45c, a drive pulley 45d, a timing belt 45e, and a driven pulley 45f. Additionally, arm 50 holds a bearing 45b for a rotating shaft 45a. The rotating shaft 45a protrudes downward from arm 50, and a retainer 30 is held at its lower end. The rotating shaft 45a includes, for example, a shaft 45a1 for mounting the driven pulley 45f and a shaft 45a2 for mounting the retainer 30.
[0082] like Figure 1 As shown, the substrate processing apparatus 1 includes a liquid supply section 60 that supplies cleaning fluid to the substrate W held by the holding section 12. The cleaning fluid is not particularly limited, but may be, for example, DIW (deionized water). The cleaning fluid rinses away particles such as polishing shavings, thereby inhibiting particle adhesion. In addition, the cleaning fluid suppresses the temperature rise caused by frictional heat between the substrate W and the polishing head 20.
[0083] The liquid supply unit 60 includes a first nozzle 61 that sprays cleaning liquid toward the periphery Wa of the substrate W. The first nozzle 61 supplies cleaning liquid to the first inclined surface Wa1 of the substrate W from above. The first nozzle 61 moves together with the holding member 30 under the action of the moving mechanism 40. The first nozzle 61 is held, for example, by a bracket 51 fixed to the lower surface of the arm 50. The first nozzle 61 moves together with the holding member 30, thus preventing interference between the substrate W and the first nozzle 61 during the feeding and feeding of the substrate W, and also enabling the supply of cleaning liquid toward the polishing head 20 during the polishing of the substrate W.
[0084] The liquid supply unit 60 may also have a second nozzle 62. The second nozzle 62 supplies cleaning liquid from directly above the center of the upper surface of the rotating substrate W towards the center of the upper surface of the substrate W. Under the action of centrifugal force, the cleaning liquid wets the entire upper surface of the substrate W, rinsing away the particles and thus throwing them off from the periphery of the upper surface of the substrate W. The second nozzle 62 moves between a central position directly above the center of the upper surface of the substrate W and a standby position to prevent interference between the substrate W and the second nozzle 62 during the feeding and unfeeding of the substrate W.
[0085] Alternatively, the liquid supply section 60 may also have a third nozzle 63. The third nozzle 63 supplies cleaning liquid to the second inclined surface Wa2 of the substrate W from below, thereby preventing particles from circling around to the lower surface of the substrate W. Unlike the first nozzle 61 and the second nozzle 62, the third nozzle 63 does not interfere with the substrate W and therefore does not need to move. The third nozzle 63 is fixed relative to the cup 17.
[0086] The substrate processing apparatus 1 includes a control unit 90. The control unit 90 is, for example, a computer, including a CPU (Central Processing Unit) 91 and a storage medium 92 such as a memory. The storage medium 92 stores programs that control various processes performed by the substrate processing apparatus 1. The control unit 90 causes the CPU 91 to execute the programs stored in the storage medium 92, thereby controlling the operation of the substrate processing apparatus 1.
[0087] Next, refer to Figure 9 This explains the functions of the control unit 90. Among them, Figure 9 The functional modules illustrated are conceptual and do not necessarily need to be physically arranged as shown. All or part of each functional module can be functionally or physically separated and combined in any unit. All or any part of the processing functions performed by each functional module can be implemented using a program executed by the CPU or as hardware implemented using wiring logic. The control unit 90 includes, for example, a rotation determination unit 93, a notification control unit 94, a rotation control unit 95, a change determination unit 96, and a movement control unit 97.
[0088] The rotation determination unit 93 determines whether it is necessary to switch the polishing pad 21 by rotating the holding member 30. The rotation determination unit 93 monitors the wear amount of the polishing pad 21. The wear amount of the polishing pad 21 is represented, for example, by at least one of the number of times the polishing pad 21 has been used and the usage time. The number of uses is the total number of substrates W that have been polished. The usage time is the total time spent in contact with the substrate W. The rotation determination unit 93 monitors the wear amount of the polishing pad 21, and when the wear amount reaches a set value, it determines that: the holding member 30 needs to be rotated, and the polishing pad 21 that abuts against the peripheral portion Wa of the substrate W needs to be switched.
[0089] The notification control unit 94 prompts the rotation of the retaining member 30 based on the determination result of the rotation need determination unit 93. When the rotation need determination unit 93 determines that the retaining member 30 needs to be rotated, the notification control unit 94 activates a notification device such as a display device or an audio device, and outputs a visual or auditory prompt to rotate the retaining member 30. The retaining member 30 can be manually rotated even when one polishing pad 21 has worn out and its lifespan has been exhausted, and the substrate W can be polished using other polishing pads 21.
[0090] The rotation control unit 95 controls the rotation mechanism 45 of the holder 30. For example, the rotation control unit 95 stops the rotation of the holder 30 during the polishing process of the substrate W. Furthermore, the rotation control unit 95 rotates the holder 30 based on the determination result of the rotation necessity determination unit 93. When the rotation necessity determination unit 93 determines that the holder 30 needs to be rotated, the rotation control unit 95 rotates the holder 30. The holder 30 can be automatically rotated even when one polishing disc 21 has worn out and its lifespan has been exhausted, allowing the substrate W to be polished using other polishing discs 21.
[0091] The need-to-change determination unit 96 determines whether the grinding position of the retainer 30 needs to be changed. The need-to-change determination unit 96 divides a single grinding disc 21 into multiple management areas for management, and monitors the wear amount for each management area. One management area selected from the multiple management areas comes into contact with the peripheral edge Wa of the substrate W. The need-to-change determination unit 96 monitors the wear amount of the management area contacting the substrate W. When the wear amount reaches a set value, it determines that the management area contacting the substrate W needs to be switched, and the grinding position needs to be changed.
[0092] The movement control unit 97 controls the movement mechanism 40 of the holding member 30. For example, the movement control unit 97 moves the holding member 30 between a polishing position and a standby position. Furthermore, the movement control unit 97 changes the polishing position based on the determination result of the change-needs-to-change determination unit 96. When the change-needs-to-change determination unit 96 determines that a change in polishing position is necessary, the movement control unit 97 changes the polishing position. Even if a management area wears out and its lifespan is exhausted, the substrate W can be polished using other management areas simply by changing the polishing position, without wasting the entire polishing pad 21, even without switching the polishing pad 21.
[0093] When the wear amount of all management areas of a single grinding disc 21 reaches a set value, the rotation determination unit 93 determines that the retaining member 30 needs to be rotated. Finally, when the wear amount of all management areas of multiple rotatingly symmetrically arranged grinding discs 21 reaches a set value, the grinding head 20 is replaced.
[0094] Next, refer to Figure 10and Figure 11 The substrate processing method is described. Figure 10 The steps S1 to S5 shown in the figure are performed under the control of the control unit 90.
[0095] First, in S1, a conveying device (not shown) feeds the substrate W into the processing container 11. After the substrate W is placed in the holding part 12, the conveying device withdraws from the processing container 11. The holding part 12 receives the substrate W from the conveying device and holds the substrate W.
[0096] After S1 and before S2, such as Figure 11 As shown, the rotating part 13 rotates the holding part 12, causing the substrate W to rotate. Additionally, the second nozzle 62 moves from the standby position P2 to the central position P3, and then supplies cleaning fluid to the center of the upper surface of the substrate W. Furthermore, the third nozzle 63 supplies cleaning fluid to the peripheral portion Wa of the substrate W from below. Moreover, the moving mechanism 40 moves the holding member 30 from the standby position P0 to the polishing position P1. The moving mechanism 40 also moves the first nozzle 61 together with the holding member 30.
[0097] Next, in S2, with the moving mechanism 40 stopping the holding member 30 at the polishing position P1, the polishing head 20 abuts against the peripheral portion Wa of the substrate W, polishing the peripheral portion Wa of the substrate W. During this process, the first nozzle 61 supplies cleaning fluid to the peripheral portion Wa of the substrate W from above. The cleaning fluid is kept within limits that allow it to be recovered into the cup 17, such as... Figure 11 As shown, the first nozzle 61 can also supply cleaning fluid to the grinding head 20 before the retainer 30 reaches the grinding position P1.
[0098] In S2, the grinding of the first inclined surface Wa1 and the end face Wa3 can also be performed sequentially. This order is not specifically limited; the grinding of the first inclined surface Wa1 can be performed first, or the grinding of the end face Wa3 can be performed first. The grinding position P1 is set according to the grinding of the first inclined surface Wa1 and the end face Wa3.
[0099] After S2 and before S3, such as Figure 11 As shown, the moving mechanism 40 moves the holding member 30 from the polishing position P1 toward the standby position P0. As a result, the polishing head 20 moves away from the peripheral portion Wa of the substrate W. Afterward, the first nozzle 61 stops spraying the cleaning liquid. In addition, after S2 and before S3, the rotating part 13 increases the rotational speed of the holding part 12 from the first rotational speed R1 to the second rotational speed R2.
[0100] Next, in S3, the second nozzle 62 supplies cleaning fluid to the center of the upper surface of the substrate W, and the third nozzle 63 supplies cleaning fluid to the periphery Wa of the substrate W from below, thereby rinsing the particles attached to the substrate W. In S3, because the rotational speed of the substrate W is higher than in S2, the centrifugal force is greater, making it easier to rinse the particles. However, the rotational speed of the substrate W can be the same in both S3 and S2.
[0101] After S3 and before S4, such as Figure 11 As shown, the second nozzle 62 stops spraying the cleaning fluid and moves from the central position P3 toward the standby position P2. Additionally, the third nozzle 63 stops spraying the cleaning fluid. Furthermore, after S3 and before S4, the rotating part 13 increases the rotational speed of the holding part 12 from the second rotational speed R2 to the third rotational speed R3.
[0102] Next, in S4, the rotating unit 13 rotates the substrate W, shaking off the cleaning solution remaining on the substrate W, thereby drying the substrate W. In S4, since the rotational speed of the substrate W is higher than in S3, the centrifugal force is greater, making drying easier. However, the rotational speed of the substrate W can be the same in both S4 and S3.
[0103] After S4 and before S5, such as Figure 11 As shown, the rotating part 13 stops the rotation of the substrate W.
[0104] Finally, in step S5, the holding unit 12 releases its grip on the substrate W, and then a transport device (not shown) receives the substrate W from the holding unit 12 and sends the received substrate W to the outside of the processing container 11. After this, the process ends.
[0105] After substrate W is delivered and before the next substrate W is delivered, the change determination unit 96 determines whether the polishing position P1 of the holding member 30 needs to be changed. When the change determination unit 96 determines that the polishing position P1 needs to be changed, the movement control unit 97 changes the polishing position P1. The changed polishing position P1 is stored in the storage medium 92 and is read and used during the next polishing of substrate W.
[0106] Furthermore, after substrate W is delivered and before the next substrate W is delivered, the rotation determination unit 93 determines whether a switching operation using the holder 30 to rotate the polishing disc 21 is required. If the rotation determination unit 93 determines that the holder 30 needs to be rotated, the rotation control unit 95 rotates the holder 30. Alternatively, if the rotation determination unit 93 determines that the holder 30 needs to be rotated, it notifies the control unit 94 to output a visual or auditory prompt to rotate the holder 30. In the latter case, the next delivery of substrate W is prohibited until the holder 30 is rotated.
[0107] The above describes embodiments of the substrate processing apparatus, grinding head, and substrate processing method of this disclosure, but this disclosure is not limited to the above embodiments. Various changes, modifications, substitutions, additions, deletions, and combinations can be made within the scope of the claims. These, of course, also fall within the technical scope of this disclosure.
Claims
1. A substrate processing apparatus, characterized in that, The substrate processing apparatus includes: A holding part that holds a substrate having a beveled surface and an end face at its peripheral edge; A rotating part that causes the holding part to rotate; A grinding head abuts against the peripheral portion of the substrate held by the holding portion, and grinds the peripheral portion of the substrate; and A retainer for mounting the grinding head. The grinding head includes: a grinding disc containing abrasive grains, and a grinding block having a flat surface for fixing the grinding disc. The abrasive pad is fixed to the flat surface of the abrasive block and can abut against the peripheral portion of the substrate. The substrate processing apparatus also includes: A moving mechanism that moves the holder between a grinding position in which the grinding head abuts against the periphery of the substrate and a standby position that prevents interference between the substrate and the holder during the feeding and feeding of the substrate. A movement control unit that controls the movement mechanism; and The determination unit determines whether the grinding position of the retaining member needs to be changed. The change-needs determination unit divides a polishing wafer into multiple management areas for management, and monitors the wear amount for each management area. The movement control unit causes a selected management area from the multiple management areas to come into contact with the peripheral portion of the substrate. The change-needs determination unit monitors the wear amount of the management area in contact with the substrate, and when the wear amount reaches a set value, it determines that the management area in contact with the substrate needs to be switched. The movement control unit changes the grinding position of the retaining member based on the judgment result of the change determination unit.
2. The substrate processing apparatus according to claim 1, characterized in that, The grinding block has a pyramidal shape. The pyramid has the flat surface, i.e., the pyramidal surface. The grinding disc is fixed to the pyramidal surface of the pyramid and grinds the inclined surface of the substrate.
3. The substrate processing apparatus according to claim 1 or 2, characterized in that, The grinding block has a prism shape. The prism has the flat surface, i.e., the side surface. The grinding disc is fixed to the side of the prism and grinds the end face of the substrate.
4. The substrate processing apparatus according to claim 1 or 2, characterized in that, The retainer is rotatable and stops rotating during the grinding process of the substrate. The grinding block has a plurality of flat surfaces arranged rotationally symmetrically about the rotation center line of the retainer. The grinding disc is fixed to a plurality of flat surfaces and is arranged rotationally symmetrically about the rotation center line of the retainer.
5. The substrate processing apparatus according to claim 4, characterized in that, The substrate processing apparatus includes: The rotation determination unit determines whether the switching of the grinding disc using the rotation of the holding member is required; and The control unit is notified, which, based on the determination result of whether rotation is required, prompts the retaining member to rotate.
6. The substrate processing apparatus according to claim 4, characterized in that, The substrate processing apparatus includes: A rotating mechanism that causes the retaining member to rotate about the rotation center line; A rotation control unit that controls the rotation mechanism; and The rotation determination unit determines whether the switching of the grinding disc using the rotation of the holding member is required. The rotation control unit rotates the retaining member according to the judgment result of the rotation determination unit.
7. The substrate processing apparatus according to claim 1 or 2, characterized in that, The grinding head also includes a flexible sheet disposed between the grinding pad and the grinding block.
8. The substrate processing apparatus according to claim 1 or 2, characterized in that, The substrate processing apparatus includes a mounting member for replacing the grinding head on the holder.
9. The substrate processing apparatus according to claim 1 or 2, characterized in that, The substrate processing apparatus includes a liquid supply unit that supplies cleaning fluid to the substrate held by the holding unit. The liquid supply unit has a nozzle that sprays the cleaning liquid toward the periphery of the substrate. The nozzle moves together with the retainer.
10. A substrate processing method, characterized in that, The substrate processing method includes: Rotate a substrate having beveled edges and end faces at its periphery; and The grinding head is brought into contact with the peripheral portion of the substrate, and the peripheral portion of the substrate is ground using the grinding head. The grinding head includes: a grinding disc containing abrasive grains, and a grinding block having a flat surface for fixing the grinding disc. The abrasive pad is fixed to the flat surface of the abrasive block and can abut against the peripheral portion of the substrate. The substrate processing method further includes: dividing a polishing wafer into multiple management areas for management, and monitoring the wear amount for each management area; bringing a selected management area from the multiple management areas into contact with the periphery of the substrate; monitoring the wear amount of the management area in contact with the substrate, and determining that the management area in contact with the substrate needs to be switched when the wear amount reaches a set value; and performing the switching when it is determined that the management area in contact with the substrate needs to be switched.