Display panel and manufacturing method thereof, and display device

Abstract

The embodiments of the present application provide a display panel and a method for preparing the same, as well as a display device. The display panel includes: a display area, and a frame area surrounding the display area; the display area and the frame area of ​​the display panel include a substrate, an organic layer, and an encapsulation layer stacked in sequence; the thickness of at least part of the organic layer located in the frame area is less than the thickness of the organic layer located in the display area, and the thickness is a dimension perpendicular to the plane where the substrate is located. The embodiments of the present application optimize the structure of the organic layer in the display panel, specifically, the thickness of at least part of the organic layer of the display panel located in the frame area is less than the thickness of the organic layer located in the display area, so that the organic layer in the frame area forms a certain low-lying structure, which is conducive to guiding the encapsulation material to be more fully leveled during the process of the encapsulation layer, can adapt to narrower frame sizes, and improve the effectiveness of encapsulation.

Description

Technical Field

[0001] The present application relates to the field of display technology, and more specifically, to a display panel and a method for preparing the same, and a display device. Background Art

[0002] With the development of display technology, the border size requirements of display devices are getting narrower and narrower. Too narrow border size makes it easier for external corrosive media such as water vapor and oxygen to invade the interior of the display device from the edge of the package, causing corrosion to the internal electrical components, resulting in package failure and causing defects such as dark spots on the display. Summary of the invention

[0003] In view of the shortcomings of the existing methods, the present application proposes a display panel and a method for preparing the same, and a display device, so as to solve the technical problem in the prior art that too narrow a frame size is more likely to cause packaging failure.

[0004] In a first aspect, an embodiment of the present application provides a display panel, comprising: a display area, and a frame area surrounding the display area; the display area and the frame area of ​​the display panel comprise a substrate, an organic layer, and an encapsulation layer stacked in sequence;

[0005] The thickness of at least a portion of the organic layer located in the frame area is smaller than the thickness of the organic layer located in the display area, and the thickness is a dimension perpendicular to the plane where the substrate is located.

[0006] In one embodiment, the organic layer includes a first planar layer, a second planar layer, and a pixel defining layer;

[0007] In the display area, a first flat layer, a second flat layer, a pixel defining layer and an encapsulation layer are stacked in sequence;

[0008] In at least a portion of the border area, a first planarization layer, a pixel defining layer and an encapsulation layer are stacked in sequence.

[0009] In one embodiment, the display panel further includes a first conductive layer and a second conductive layer stacked in sequence;

[0010] In at least a portion of the frame area, the first conductive layer is located between the substrate and the first flat layer, and the second conductive layer is located between the first flat layer and the pixel defining layer.

[0011] In one embodiment, in the border area, at least a portion of the first planar layer has a first via hole, and the first via hole overlaps the second conductive layer and the first conductive layer;

[0012] At least in the frame area, the second conductive layer has a first through hole.

[0013] In one embodiment, within the border area, a projection of at least a portion of the pixel defining layer on the substrate at least partially overlaps with a projection of the first through hole on the substrate.

[0014] In one embodiment, at least a portion of the first conductive layer located in the display area forms a source-drain structure;

[0015] And / or, at least a portion of the second conductive layer located in the display area forms an anode structure.

[0016] In one embodiment, the organic layer further includes: a third flat layer; the third flat layer is located between the substrate and the first flat layer;

[0017] The display panel further includes: a driving layer; in at least a portion of the frame area, the driving layer is located between the substrate and the third flat layer.

[0018] In one embodiment, a first isolation dam is provided in the border area of ​​the display panel, and the first isolation dam is far away from the display area;

[0019] The first isolation dam includes a third flat layer, a first flat layer and a pixel defining layer stacked in sequence;

[0020] At least a portion of the encapsulation layer is located on a side of the pixel defining layer away from the first planar layer.

[0021] In one embodiment, a second isolation dam is further provided in the border area of ​​the display panel, and the second isolation dam is located on a side of the first isolation dam close to the display area;

[0022] The second isolation dam includes a first planar layer and a pixel defining layer stacked in sequence;

[0023] The encapsulation layer is located on a side of the pixel defining layer away from the first planar layer.

[0024] In one embodiment, the first isolation dam further includes a spacer layer, and the spacer layer is located between the pixel defining layer and the encapsulation layer;

[0025] And / or, the second isolation dam further includes a spacer layer, and the spacer layer is located between the pixel defining layer and the encapsulation layer.

[0026] In one embodiment, the organic layer has an isolation channel in the border region;

[0027] The isolation trench is at least filled with a packaging layer.

[0028] In one embodiment, the encapsulation layer includes: a first inorganic encapsulation layer, an inkjet printing material layer, and a second inorganic encapsulation layer;

[0029] The second inorganic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the substrate;

[0030] The inkjet printing material layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

[0031] In a second aspect, an embodiment of the present application provides a display device, comprising: a display panel as provided in the first aspect.

[0032] In one embodiment, the display device further includes: a touch panel;

[0033] The touch panel is located on a side of the encapsulation layer in the display panel away from the substrate.

[0034] In a third aspect, an embodiment of the present application provides a method for preparing a display panel, comprising:

[0035] A first flat layer and a second flat layer are sequentially formed in the display area and the frame area of ​​the substrate;

[0036] Patterning the second planar layer to remove at least a portion of the second planar layer located in the border area;

[0037] forming a pixel definition layer on the second planar layer and the exposed first planar layer;

[0038] A packaging layer is fabricated on the pixel definition layer.

[0039] In one embodiment, forming an encapsulation layer on a pixel definition layer includes:

[0040] forming a first inorganic encapsulation layer on the pixel definition layer;

[0041] printing an inkjet printing material layer on a portion of the first inorganic encapsulation layer;

[0042] A second inorganic encapsulation layer is formed on the inkjet printing material layer and the exposed first inorganic encapsulation layer.

[0043] The beneficial technical effects brought about by the technical solution provided in the embodiments of the present application include: by optimizing the structure of the organic layer in the display panel, specifically making the thickness of at least part of the organic layer of the display panel located in the frame area smaller than the thickness of the organic layer located in the display area, so that the organic layer in the frame area forms a certain low-lying structure, which is beneficial to guiding the packaging material to more fully level during the process of the packaging layer, can adapt to narrower frame sizes, and improve the effectiveness of packaging.

[0044] Additional aspects and advantages of the present application will be partially given in the following description, which will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0045] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the following description of the embodiments in conjunction with the accompanying drawings, in which:

[0046] Figure 1 A schematic diagram of a top view structure of a display panel provided in an embodiment of the present application;

[0047] Figure 2 A schematic diagram of a partial cross-sectional structure of a first display panel provided in an embodiment of the present application;

[0048] Figure 3 A partial cross-sectional structural diagram of a second display panel provided in an embodiment of the present application;

[0049] Figure 4 A partial cross-sectional structural diagram of a third display panel provided in an embodiment of the present application;

[0050] Figure 5 A schematic diagram of a partial cross-sectional structure of a fourth display panel provided in an embodiment of the present application;

[0051] Figure 6 A schematic diagram of a partial cross-sectional structure of a fifth display panel provided in an embodiment of the present application;

[0052] Figure 7 A schematic diagram of a process for preparing a display panel provided in an embodiment of the present application;

[0053] Figure 8 A schematic flow chart of a method for preparing a display panel provided in an embodiment of the present application.

[0054] In the figure:

[0055] 100 - display panel; 101 - display area; 102 - frame area; 103 - first isolation dam; 104 - second isolation dam; 105 - isolation channel; 106 - first via hole;

[0056] 110 - base;

[0057] 120 - organic layer; 121 - third flat layer; 122 - first flat layer; 123 - second flat layer; 124 - pixel definition layer;

[0058] 130 - packaging layer; 131 - inkjet printing material layer; 132 - first inorganic packaging layer; 133 - second inorganic packaging layer;

[0059] 140 - spacer layer; 150 - driving layer; 160 - first conductive layer; 170 - second conductive layer. DETAILED DESCRIPTION

[0060] The present application is described in detail below, and examples of embodiments of the present application are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar components or components with the same or similar functions. In addition, if the detailed description of the known technology is unnecessary for the features of the present application shown, it will be omitted. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be interpreted as limiting the present application.

[0061] It will be understood by those skilled in the art that, unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as those generally understood by those skilled in the art to which this application belongs. It should also be understood that terms such as those defined in general dictionaries should be understood to have meanings consistent with those in the context of the prior art, and will not be interpreted with idealized or overly formal meanings unless specifically defined as here.

[0062] It will be understood by those skilled in the art that, unless expressly stated, the singular forms "one", "said", and "the" used herein may also include plural forms. It should be further understood that the term "comprising" used in the specification of the present application refers to the presence of the features, integers, steps, operations, elements and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components and / or groups thereof. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, it may be directly connected or coupled to the other element, or there may be an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein includes all or any unit and all combinations of one or more associated listed items.

[0063] The inventors of the present application have conducted research and found that the packaging structure can be made of organic materials and can be suitable for inkjet printing process. However, the increasingly narrow frame size of the display device will lead to defects such as difficulty in effectively controlling the leveling of the inkjet printing material, such as insufficient leveling or overflow of glue, which makes it easier for external corrosive media such as water vapor and oxygen to invade the interior of the display device from the edge of the package, causing corrosion to the internal electrical components, resulting in packaging failure and causing defects such as dark spots on the display.

[0064] The display panel and its manufacturing method, and the display device provided in the present application are intended to solve the above technical problems in the prior art.

[0065] The technical solution of the present application and how the technical solution of the present application solves the above-mentioned technical problems are described in detail below with specific embodiments.

[0066] The embodiment of the present application provides a display panel 100, and the structural schematic diagram of the display panel 100 is shown in FIG. Figure 1 and Figure 2 As shown, the display panel 100 includes a display area 101 and a frame area 102 surrounding the display area 101. The display area 101 and the frame area 102 of the display panel 100 include a substrate 110, an organic layer 120 and an encapsulation layer 130 stacked in sequence.

[0067] The thickness of at least a portion of the organic layer 120 located in the frame area 102 is smaller than the thickness of the organic layer 120 located in the display area 101 , and the thickness is a dimension perpendicular to the plane where the substrate is located.

[0068] In this embodiment, the display panel 100 optimizes the structure of the organic layer 120, specifically, the thickness of at least part of the organic layer 120 located in the border area 102 of the display panel 100 is smaller than the thickness of the organic layer 120 located in the display area 101, so that the organic layer 120 in the border area 102 forms a certain low-lying structure, which is conducive to guiding the part of the packaging material (for example: inkjet printing material) located in the display area 101 to flow to the border area 102 during the process of the packaging layer 130, so that the leveling is more sufficient, and it is also conducive to reducing the probability of overflow of glue, which can adapt to narrower frame sizes, improve the effectiveness of packaging, and provide more adequate protection for the electrical components inside the display panel 100. The inventor of the present application considers that the thickness of at least part of the organic layer 120 located in the border area 102 needs to be smaller than the thickness of the organic layer 120 located in the display area 101. To this end, the present application provides the following possible implementation method for the display panel 100:

[0069] like Figure 3 As shown, in the display panel 100 according to the embodiment of the present application, the organic layer 120 includes a first planar layer 122 , a second planar layer 123 and a pixel defining layer 124 .

[0070] In the display area 101 , a first planar layer 122 , a second planar layer 123 , a pixel defining layer 124 and an encapsulation layer 130 are stacked in sequence.

[0071] In at least a portion of the border area 102 , the third planar layer 121 , the first planar layer 122 , the pixel defining layer 124 and the encapsulation layer 130 are stacked in sequence.

[0072] In this embodiment, the first flat layer 122, the second flat layer 123 and the pixel defining layer 124 in the organic layer 120 can be used to realize the flattening or insulation of each corresponding conductive functional layer. At least part of the second flat layer 123 in the organic layer 120 located in the frame area 102 is removed, so that the organic layer 120 in the frame area 102 forms a certain step difference with the organic layer 120 in the display area 101, that is, the thickness of at least part of the organic layer 120 located in the frame area 102 needs to be less than the thickness of the organic layer 120 located in the display area 101, so that the organic layer 120 in the frame area 102 forms a certain low-lying structure, which is conducive to guiding the encapsulation material to be more fully leveled in the process of the encapsulation layer 130, and is also conducive to reducing the probability of glue overflow.

[0073] In one example, all the second flat layers 123 in the border area 102 are removed, which is beneficial for expanding the range of the low-lying structure formed by the organic layer 120 in the border area 102 and improving the capacity for guiding the leveling of the encapsulation layer 130 .

[0074] In another example, the second flat layer 123 in the border area 102 away from the display area 101 is removed, leaving a portion of the second flat layer 123 close to the display area 101. The remaining portion of the second flat layer 123 can serve as a transition structure forming a step difference from the display area 101 to the border area 102, which is beneficial to provide a certain extended protection for the display area 101.

[0075] like Figure 4-Figure 6 As shown, the display panel 100 of the embodiment of the present application further includes a driving layer 150 , a first conductive layer 160 , and a second conductive layer 170 stacked in sequence.

[0076] In at least a portion of the border region 102 , the first conductive layer 160 is located between the substrate 110 and the first planar layer 122 , and the second conductive layer 170 is located between the first planar layer 122 and the pixel defining layer 124 .

[0077] In this embodiment, the first conductive layer 160 and the second conductive layer 170 located in the display area 101 can be respectively used to form the required conductive functional layers to construct various electrical devices in the display panel, and the first conductive layer 160 and the second conductive layer 170 located in the border area 102 can be respectively used to form leads associated with the conductive functional layers, which can help realize jumpers or overlapping of the conductive functional layers.

[0078] In some possible implementations, at least a portion of the first conductive layer 160 located in the display area 101 forms a source-drain structure. That is, the first conductive layer 160 located in the display area 101 can supply power to the light-emitting device of the display panel 100 to emit light.

[0079] In some other possible implementations, the second conductive layer 170 is located in at least a portion of the display area 101 to form an anode structure. The second conductive layer 170 located in the display area 101 can help the display panel 100 realize an LED (light emitting diode) display structure.

[0080] In one example, the second conductive layer 170 may include a sandwich structure of ITO (Indium Tin Oxide)-Ag (Silver)-ITO.

[0081] The inventor of the present application considers that part of the second conductive layer 170 in the border area 102 can be overlapped with the first conductive layer 160, for example, the overlap can be achieved by making a via hole on the first flat layer 122 between the second conductive layer 170 and the first conductive layer 160. However, the organic material used in the first flat layer 122 may generate gas during the process of making the via hole and the second conductive layer 170. If these gases cannot be released, they will have an adverse effect on the film stacking, for example, causing bubbling and other undesirable phenomena. To this end, the present application provides the following possible implementation method for the display panel 100:

[0082] like Figure 4-Figure 6 As shown, in the display panel 100 of the embodiment of the present application, within the frame area 102 , at least a portion of the first planar layer 122 has a first via hole 106 , and the first via hole 106 overlaps the second conductive layer 170 and the first conductive layer 160 .

[0083] At least in the border area 102 , the second conductive layer 170 has a first through hole (not shown).

[0084] A projection of at least a portion of the pixel defining layer 124 on the substrate 110 overlaps with a projection of the first through hole on the substrate 110 .

[0085] In this embodiment, in the frame area 102 , at least a portion of the first vias 106 on the first flat layer 122 can achieve overlapping between the second conductive layer 170 and the first conductive layer 160 , meeting the wiring requirements in the frame area 102 of the display panel 100 .

[0086] In the frame area 102 , the first through hole opened on the second conductive layer 170 can release the gas generated by the first flat layer 122 when preparing the second conductive layer 170 , which is beneficial to reduce the probability of bubbling, improve the quality of film layer stacking, and improve the yield of the display panel 100 .

[0087] The inventor of the present application considers that after the first through hole is opened on the second conductive layer 170, corrosive media such as water vapor and oxygen from the outside may use the first through hole to corrode the second conductive layer 170. To this end, the present application provides the following possible implementation for the display panel 100:

[0088] like Figure 4 As shown, in the display panel 100 of the embodiment of the present application, within the border area 102 , a projection of at least a portion of the pixel defining layer 124 on the substrate 110 at least partially overlaps with a projection of the first through hole on the substrate 110 .

[0089] In this embodiment, the pixel defining layer 124 is used to block or cover the first through hole on the second conductive layer 170, so as to achieve waterproof and oxygen-proof properties for the second conductive layer 170. In addition, the pixel defining layer 124 can be formed by using the pixel defining layer 124 material left over from the full film-making process of the display panel 100, which can effectively improve the utilization rate of the film material and save costs.

[0090] The inventor of the present application considers that the display panel 100 may further include more conductive functional film layers. To this end, the present application provides the following possible implementation for the display panel 100:

[0091] like Figure 4 As shown, in the display panel 100 of the embodiment of the present application, the organic layer 120 further includes: a third flat layer 121 . The third flat layer 121 is located between the substrate 110 and the first flat layer 122 .

[0092] The display panel 100 further includes a driving layer 150 . In at least a portion of the frame area 102 , the driving layer 150 is located between the substrate 110 and the third planar layer 121 .

[0093] In this embodiment, the driving layer 150 can help the electrical devices of the display panel 100 to provide control signals, for example, helping the light-emitting devices in the display area 101 of the display panel 100 to adjust the brightness of the light.

[0094] The third planarization layer 121 may planarize or insulate the driving layer 150 .

[0095] The inventor of the present application considers that if the encapsulation material is allowed to flow excessively toward the edge of the display panel 100 during the process of manufacturing the encapsulation layer 130, the thickness of the encapsulation layer 130 may be insufficient, resulting in encapsulation failure or difficulty in achieving the required flatness. To this end, the present application provides the following possible implementation method for the display panel 100:

[0096] like Figure 4 As shown, the display panel 100 of the embodiment of the present application has a first isolation dam 103 in the border area 102 , and the first isolation dam 103 is far away from the display area 101 .

[0097] The first isolation dam 103 includes a third planarization layer 121 , a first planarization layer 122 , and a pixel defining layer 124 which are sequentially stacked.

[0098] At least a portion of the encapsulation layer 130 is located on a side of the pixel defining layer 124 away from the first planarization layer 122 .

[0099] In this embodiment, the first isolation dam 103 can make the display panel 100 present, at least below the encapsulation layer 130 in the frame area 102, a film layer stacking form that first decreases and then increases in the direction from the display area 101 to the edge. That is, the first isolation dam 103 can constrain the leveling of the encapsulation material, which is helpful to prevent the encapsulation material from excessively flowing to the edge of the display panel 100, thereby ensuring the thickness of the encapsulation layer 130 and improving the flatness of the encapsulation layer 130. The first isolation dam 103 is also helpful to prevent corrosive media such as water vapor and oxygen from entering the interior of the display panel 100.

[0100] The first isolation dam 103 can be formed by using the film structure including the third flat layer 121 , the first flat layer 122 and the pixel defining layer 124 left by the full film forming process of the display panel 100 , which can effectively improve the utilization rate of the film material and save costs.

[0101] On the basis of the aforementioned first isolation dam 103, as Figure 5 As shown, a second isolation dam 104 is further provided in the border area 102 of the display panel 100 . The second isolation dam 104 is located on a side of the first isolation dam 103 close to the display area 101 .

[0102] The second isolation dam 104 includes a first planarization layer 122 and a pixel defining layer 124 which are sequentially stacked.

[0103] The encapsulation layer 130 is located on a side of the pixel defining layer 124 away from the first planarization layer 122 .

[0104] In this embodiment, compared with the first isolation dam 103, the second isolation dam 104 lacks the third flat layer 121, so the height of the second isolation dam 104 can be lower than the height of the first isolation dam 103. The second isolation dam 104 cooperates with the first isolation dam 103, which is conducive to making the display panel 100 present, at least below the encapsulation layer 130 in the frame area 102, a film layer stacking form that first decreases and then gradually increases in the direction from the display area 101 to the edge. On the one hand, it can be beneficial to the preparation of the encapsulation layer 130 and improve the effectiveness of the encapsulation; on the other hand, the two-level isolation formed by the first isolation dam 103 and the second isolation dam 104 is conducive to strengthening the barrier of corrosive media such as water vapor and oxygen from the outside from entering the interior of the display panel 100.

[0105] The second isolation dam 104 may also be formed by using the film structure including the first planar layer 122 and the pixel defining layer 124 left by the full film forming process of the display panel 100 , which can effectively improve the utilization rate of the film material and save costs.

[0106] In some possible implementations, a certain distance may be provided between the second isolation dam 104 and the first isolation dam 103 to enhance the barrier effect against external corrosive media such as water vapor and oxygen.

[0107] It should be noted that the border area 102 of the display panel 100 is not limited to the first isolation dam 103 and the second isolation dam 104, and a third isolation dam, a fourth isolation dam, etc. may be added as appropriate. The more isolation dams there are, the slower the increase in each level of isolation dams can be, and the better the performance of isolating corrosive media such as water vapor and oxygen outside the display panel 100.

[0108] The present application provides the following three possible implementations for the display panel 100:

[0109] In a first possible implementation manner, the first isolation dam 103 further includes a spacer layer 140 , and the spacer layer 140 is located between the pixel defining layer 124 and the encapsulation layer 130 .

[0110] In a second possible implementation manner, the second isolation dam 104 further includes a spacer layer 140 , and the spacer layer 140 is located between the pixel defining layer 124 and the encapsulation layer 130 .

[0111] In a third possible implementation manner, both the first isolation dam 103 and the second isolation dam 104 further include a spacer layer 140 , and the spacer layer 140 is located between the pixel defining layer 124 and the encapsulation layer 130 .

[0112] In the above three embodiments, the spacer layer 140 is respectively used to adjust the height of the first isolation dam 103, or the height of the second isolation dam 104, or the height of the first isolation dam 103 and the second isolation dam 104 to meet the height requirements of each isolation dam in different scenarios.

[0113] The inventor of the present application considers that in the prior art, many organic layers 120 including the planar layer are often designed to cover the entire surface (or a larger area). Once corrosive media such as water vapor and oxygen outside the display panel 100 invade, they can continue to invade the display panel 100 through the gaps between the film layers, contact the electrical components in the display area 101 of the display panel 100, and cause electrochemical corrosion to the electrical components, resulting in packaging failure or the appearance of black spots and other defects. To this end, the present application provides the following possible implementation method for the display panel 100:

[0114] like Figure 6 As shown, in the display panel 100 according to the embodiment of the present application, the organic layer 120 has an isolation channel 105 in the frame area 102 .

[0115] The isolation trench 105 is at least filled with a packaging layer 130 .

[0116] In the present embodiment, the isolation channel 105 of the organic layer 120 in the border area 102 can effectively cut off the channel through which corrosive media such as water vapor and oxygen outside the display panel 100 may invade the display area 101 of the display panel 100, thereby isolating water vapor and oxygen, improving the barrier performance of the package, and reducing the probability of black spots occurring in the display area 101 of the display panel 100, thereby improving the yield rate of the display panel 100 as a whole.

[0117] It is understandable that the isolation trench 105 of the organic layer 120 in the border area 102 is conducive to filling the isolation trench 105 with the encapsulation layer 130 after the process of the organic layer 120, which can further strengthen the isolation of water vapor and oxygen.

[0118] In some possible embodiments, the isolation channel 105 is located on a side of the first isolation dam 103 or the second isolation dam 104 close to the display area 101, so as to facilitate the realization of a film layer stacking form that first decreases and then increases in a direction from the display area 101 to the edge, thereby preventing the packaging material from excessively flowing to the edge of the display panel 100.

[0119] The inventor of the present application considers that the encapsulation structure can be made of organic materials and can be applied to the inkjet printing process. To this end, the present application provides the following possible implementation method for the encapsulation layer 130:

[0120] like Figure 4-Figure 6 As shown, the encapsulation layer 130 of the embodiment of the present application further includes a first inorganic encapsulation layer 132 , an inkjet printing material layer 131 and a second inorganic encapsulation layer 133 .

[0121] The second inorganic encapsulation layer 133 is located on a side of the first inorganic encapsulation layer 132 away from the substrate 110 .

[0122] The inkjet printing material layer 131 is located between the first inorganic encapsulation layer 132 and the second inorganic encapsulation layer 133 .

[0123] In this embodiment, the encapsulation layer 130 adopts a sandwich structure including a first inorganic encapsulation layer 132, an inkjet printing material layer 131 and a second inorganic encapsulation layer 133, so as to take into account the requirements of leveling and encapsulation.

[0124] In some possible embodiments, the first inorganic encapsulation layer 132 and the second inorganic encapsulation layer 133 respectively cover the entire area of ​​the display panel 100 including the display area 101 and the border area 102, the inkjet printing material layer 131 mainly covers the display area 101 of the display panel 100, and the inkjet printing material layer 131 covers a partial area within the border area 102 close to the display area 101.

[0125] In one example, the inkjet printing material layer 131 extends from the display area 101 of the display panel 100 to the isolation channel 105 of the border area 102 .

[0126] In another example, the inkjet printed material layer 131 extends from the display area 101 of the display panel 100 to the second isolation dam 104 of the frame area 102. Specifically, the inkjet printed material layer 131 can reach the side of the second isolation dam 104 close to the display area 101, can also cover the first inorganic encapsulation layer 132 located on the second isolation dam 104, and can also reach between the first isolation dam 103 and the second isolation dam 104.

[0127] Based on the same inventive concept, an embodiment of the present application provides a display device, including: any one of the display panels 100 provided in the above embodiments.

[0128] In this embodiment, since the display device adopts any one of the display panels 100 provided in the aforementioned embodiments, its principles and technical effects can be referred to in the aforementioned embodiments and will not be described in detail here.

[0129] The display device may be any curved or flat display product such as a television, a digital photo frame, a mobile phone, a smart watch, a tablet computer, or a bendable display product, or at least one of related display components.

[0130] In some possible implementations, the display panel 100 may include a second conductive layer 170, a light-emitting layer, and a cathode layer stacked in sequence. That is, the display panel 100 may adopt a display structure such as LED (light-emitting diode) or Micro-LED (micro-light-emitting diode) or OLED (Organic Light-Emitting Diode) or QLED (Quantum Dot Light Emitting Diodes).

[0131] The inventor of the present application considers that any of the display panels 100 provided in the above embodiments optimizes the structure of the organic layer 120 so that the encapsulation material can be more fully leveled during the manufacturing process of the encapsulation layer 130, that is, the flatness of the encapsulation layer 130 of the display panel 100 is better, which is not only conducive to the internal wiring of the display panel 100 being at a relatively flat height, but also conducive to the related wiring of the touch function in the display device with a touch function being at a relatively flat height. To this end, the present application provides the following possible implementation method for the display device:

[0132] The display device in the embodiment of the present application further includes: a touch panel.

[0133] The touch panel is located on a side of the encapsulation layer 130 of the display panel 100 away from the substrate 110 .

[0134] In this embodiment, the touch panel can be grown and prepared directly on the encapsulation layer 130 of the display panel 100, which is conducive to realizing an On-Cell structure for the touch panel in the display device (for example, embedding the touch panel between the color filter substrate and the polarizer of the display panel 100), thereby achieving thinning of the film layer of the display device.

[0135] Based on the same inventive concept, the present application embodiment provides a method for preparing a display panel 100, and the flow chart of the preparation method is as follows: Figure 7 As shown, steps S101-S104 are included:

[0136] S101: a first flat layer and a second flat layer are sequentially formed in the display area and the frame area of ​​the substrate.

[0137] In step S101 , a full film forming process may be used to first form a first flat layer 122 on both the display area 101 and the frame area 102 of the substrate 110 , and then form a second flat layer 123 on a side of the first flat layer 122 away from the substrate 110 .

[0138] S102: patterning the second planar layer to remove at least a portion of the second planar layer in the border area.

[0139] In step S102, an etching process may be used to remove at least a portion of the second flat layer 123 located in the border area 102, so that the organic layer 120 in the border area 102 can form a certain low-lying structure, that is, the thickness of at least a portion of the organic layer 120 located in the border area 102 is less than the thickness of the organic layer 120 located in the display area 101.

[0140] S103: forming a pixel defining layer on the second planar layer and the exposed first planar layer.

[0141] S104: making an encapsulation layer on the pixel definition layer.

[0142] In step S104 , based on the low-lying structure formed in the organic layer 120 within the border area 102 in step S102 , the encapsulation material can be more fully leveled during the manufacturing process of the encapsulation layer 130 .

[0143] In a method for preparing a display panel 100 provided in the present embodiment, during the process of manufacturing an organic layer 120 including a first flat layer 122, a second flat layer 123 and a pixel defining layer 124, at least a portion of the second flat layer 123 in the organic layer 120 located in the border area 102 is removed, so that the organic layer 120 in the border area 102 forms a certain step difference relative to the organic layer 120 in the display area 101, that is, the thickness of at least a portion of the organic layer 120 located in the border area 102 needs to be smaller than the thickness of the organic layer 120 located in the display area 101, so that the organic layer 120 in the border area 102 forms a certain low-lying structure, which is beneficial to guiding the packaging material (for example: inkjet printing material) to be more fully leveled during the process of the packaging layer 130, and is also beneficial to reducing the probability of glue overflow.

[0144] Based on the same inventive concept, the embodiment of the present application provides a method for developing a method for manufacturing a display panel 100. The flowchart of the developed method is as follows: Figure 8 As shown, steps S201-S211 are included:

[0145] S201: A third flat layer is formed on both the display area and the frame area of ​​the substrate.

[0146] In step S201 , a full film forming process may be used to form a third planar layer 121 in both the display area 101 and the frame area 102 of the substrate 110 .

[0147] In some possible implementations, before step S201 , a required conductive functional layer, such as a driving layer 150 , may be fabricated in the display region 101 and the frame region 102 of the substrate 110 .

[0148] S202: forming a first conductive layer on the third planar layer.

[0149] In step S202 , a metal material may be first deposited on the third planar layer 121 , and then the metal material may be patterned to obtain the desired first conductive layer 160 .

[0150] S203: manufacturing a first planar layer on the first conductive layer, and patterning the first planar layer so that at least a portion of the first planar layer located in the border area has a second through hole.

[0151] After step S203 , at least a portion of the first planar layer 122 is provided with second through holes, and these second through holes are prepared for subsequent production of via holes for overlapping the first conductive layer 160 and the second conductive layer 170 .

[0152] S204: depositing an anode material on the first planar layer and in the second through hole, so that the second through hole forms a first via hole.

[0153] After step S204 , part of the anode material is filled into the second through hole, so that the second through hole forms a via hole, and the via hole can overlap the anode material on the first flat layer 122 and the first conductive layer 160 under the first flat layer 122 .

[0154] S205: patterning the anode material to obtain a second conductive layer, and making the second conductive layer at least in the frame area have a first through hole.

[0155] After step S205, a second conductive layer 170 is obtained on the first flat layer 122, and a first through hole is opened on the second conductive layer 170. The first through hole can release the gas that may be generated by the first flat layer 122, which is beneficial to reduce the probability of bubbling, improve the quality of film layer stacking, and improve the yield of the display panel 100.

[0156] S206: forming a second planar layer on the second conductive layer, in the first through hole, and on the exposed first planar layer, and patterning the second planar layer to remove at least a portion of the second planar layer in the border area.

[0157] In step S206, a full film forming process may also be used to form a second flat layer 123 on the second conductive layer 170, in the first through hole, and on the exposed first flat layer 122, and then an etching process may be used to remove at least a portion of the second flat layer 123 in the border area 102, so that the organic layer 120 in the border area 102 can form a certain low-lying structure.

[0158] S207: coating a pixel defining material on the second planar layer, the exposed first planar layer, and the exposed second conductive layer.

[0159] In step S207 , a full film forming process may be used to coat the pixel defining material on the second planar layer 123 , the exposed first planar layer 122 , and the exposed second conductive layer 170 , in preparation for the next step of forming the pixel defining layer 124 .

[0160] S208: patterning the pixel defining material to obtain a pixel defining layer, so that a projection of at least a portion of the pixel defining layer on the substrate at least partially overlaps with a projection of the first through hole on the substrate.

[0161] After step S208 , the pixel defining layer 124 is obtained. The pixel defining layer 124 is used to block or cover the first through hole on the second conductive layer 170 , so as to achieve waterproof and oxygen-proof properties for the second conductive layer 170 .

[0162] S209: forming a first inorganic encapsulation layer on the pixel definition layer.

[0163] In step S209, a vapor deposition method may be used to fully deposit the first inorganic encapsulation layer 132 on the display area 101 and the frame area 102 of the display panel 100. And based on the fact that at least a portion of the second flat layer 123 located in the frame area 102 is removed in step S206, the organic layer 120 in the frame area 102 forms a certain low-lying structure, and the first inorganic encapsulation layer 132 also follows the surface morphology of the low-lying structure.

[0164] S210: Printing an inkjet printing material layer on a portion of the first inorganic encapsulation layer.

[0165] In step S209 , the inkjet printing material may be printed onto the first inorganic encapsulation layer 132 by inkjet printing, and the inkjet printing material may be more fully leveled under the guidance of the depression structure.

[0166] S211: forming a second inorganic encapsulation layer on the inkjet printing material layer and the exposed first inorganic encapsulation layer.

[0167] In step S211, the second inorganic encapsulation layer 133 can also be deposited on the display area 101 and the frame area 102 of the display panel 100 by vapor deposition, so that the second inorganic encapsulation layer 133 forms a sandwich encapsulation structure with the first inorganic encapsulation layer 132 and the inkjet printing material layer 131 prepared by the previous process.

[0168] By applying the embodiments of the present application, at least the following beneficial effects can be achieved:

[0169] 1. The display panel 100 optimizes the structure of the organic layer 120, specifically, the thickness of at least part of the organic layer 120 located in the frame area 102 of the display panel 100 is made smaller than the thickness of the organic layer 120 located in the display area 101, so that the organic layer 120 in the frame area 102 forms a certain low-lying structure, which is beneficial to guiding the packaging material to flow more fully during the process of the packaging layer 130, and is also beneficial to reducing the probability of glue overflow, can adapt to a narrower frame size, improve the effectiveness of packaging, and provide more adequate protection for the electrical components inside the display panel 100.

[0170] 2. The first flat layer 122, the second flat layer 123 and the pixel defining layer 124 in the organic layer 120 can be used to realize the flattening or insulation of the corresponding conductive functional layers. At least part of the second flat layer 123 in the organic layer 120 located in the frame area 102 is removed, so that the organic layer 120 in the frame area 102 forms a certain step difference with the organic layer 120 in the display area 101, that is, the thickness of at least part of the organic layer 120 in the frame area 102 needs to be less than the thickness of the organic layer 120 in the display area 101, so that the organic layer 120 in the frame area 102 forms a certain low-lying structure.

[0171] 3. In the frame area 102 , the first through hole opened on the second conductive layer 170 can release the gas generated by the first flat layer 122 when preparing the second conductive layer 170 , which is beneficial to reduce the probability of bubbling, improve the quality of film layer stacking, and improve the yield of the display panel 100 .

[0172] 4. In the frame area 102, at least part of the projection of the pixel defining layer 124 on the substrate 110 overlaps at least partly with the projection of the first through hole on the substrate 110, that is, the first through hole on the second conductive layer 170 is blocked or covered with the pixel defining layer 124, so as to achieve waterproof and oxygen-proof properties for the second conductive layer 170. In addition, the pixel defining layer 124 can be formed by using the pixel defining layer 124 material left by the full film-making process of the display panel 100, which can effectively improve the utilization rate of the film material and save costs.

[0173] 5. The first isolation dam 103 can make the display panel 100 present, at least below the encapsulation layer 130 in the frame area 102, a film layer stacking form that first decreases and then increases in the direction from the display area 101 to the edge. That is, the first isolation dam 103 can constrain the leveling of the encapsulation material, which is helpful to prevent the encapsulation material from excessively flowing to the edge of the display panel 100, thereby ensuring the thickness of the encapsulation layer 130 and improving the flatness of the encapsulation layer 130. The first isolation dam 103 is also helpful to prevent corrosive media such as water vapor and oxygen from entering the interior of the display panel 100.

[0174] 6. Compared with the first isolation dam 103, the second isolation dam 104 lacks the third flat layer 121, so the height of the second isolation dam 104 can be lower than that of the first isolation dam 103. The second isolation dam 104 cooperates with the first isolation dam 103, which is conducive to making the display panel 100 present, at least below the encapsulation layer 130 in the frame area 102, a film layer stacking form that first decreases and then gradually increases in the direction from the display area 101 to the edge. On the one hand, it can be beneficial to the preparation of the encapsulation layer 130 and improve the effectiveness of the encapsulation; on the other hand, the two-level isolation formed by the first isolation dam 103 and the second isolation dam 104 is conducive to strengthening the barrier against external corrosive media such as water vapor and oxygen from entering the interior of the display panel 100.

[0175] 7. The spacer layer 140 can be used to adjust the height of the first isolation dam 103, or the height of the second isolation dam 104, or the height of the first isolation dam 103 and the second isolation dam 104, so as to meet the height requirements of each isolation dam in different scenarios.

[0176] 8. The isolation channel 105 of the organic layer 120 in the frame area 102 can effectively cut off the channel through which corrosive media such as water vapor and oxygen outside the display panel 100 may invade the display area 101 of the display panel 100, thereby isolating water vapor and oxygen, improving the barrier performance of the package, and reducing the probability of black spots in the display area 101 of the display panel 100, thereby improving the overall yield rate of the display panel 100.

[0177] 9. The encapsulation layer 130 adopts a sandwich structure including a first inorganic encapsulation layer 132, an inkjet printing material layer 131 and a second inorganic encapsulation layer 133 to take into account the requirements of leveling and encapsulation.

[0178] Those skilled in the art will appreciate that the various operations, methods, steps, measures, and schemes in the processes discussed in this application may be alternated, altered, combined, or deleted. Further, other steps, measures, and schemes in the various operations, methods, and processes discussed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted. Further, the steps, measures, and schemes in the prior art that are similar to those disclosed in this application may also be alternated, altered, rearranged, decomposed, combined, or deleted.

[0179] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0180] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0181] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0182] In the description of this specification, specific features, structures, materials or characteristics may be combined in an appropriate manner in any one or more embodiments or examples.

[0183] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least a part of the steps in the flowchart of the accompanying drawings may include multiple sub-steps or multiple stages, and these sub-steps or stages are not necessarily executed at the same time, but can be executed at different times, and their execution order is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a part of the sub-steps or stages of other steps.

[0184] The above description is only a partial implementation method of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A display panel, comprising: A display area, and a frame area surrounding the display area; wherein the display area and the frame area of ​​the display panel include a substrate, an organic layer and an encapsulation layer stacked in sequence; The thickness of at least a portion of the organic layer located in the frame area is smaller than the thickness of the organic layer located in the display area, and the thickness is a dimension perpendicular to the plane where the substrate is located; The frame area of ​​the display panel has a first isolation dam, and the first isolation dam is far away from the display area; The first isolation dam includes a third flat layer, a first flat layer and a pixel defining layer stacked in sequence. At least a portion of the encapsulation layer is located on a side of the pixel defining layer away from the first planar layer; The frame area of ​​the display panel further comprises a second isolation dam, wherein the second isolation dam is located on a side of the first isolation dam close to the display area; The second isolation dam includes a first planar layer and a pixel defining layer stacked in sequence; The encapsulation layer is located on a side of the pixel defining layer away from the first planar layer.

2. The display panel according to claim 1, characterized in that: The organic layer includes a first flat layer, a second flat layer and a pixel defining layer; In the display area, the first planar layer, the second planar layer, the pixel defining layer and the encapsulation layer are stacked in sequence; In at least a portion of the border area, the first planar layer, the pixel defining layer and the encapsulation layer are stacked in sequence.

3. The display panel according to claim 2, characterized in that: The display panel further includes a first conductive layer and a second conductive layer stacked in sequence; In at least a portion of the border area, the first conductive layer is located between the substrate and the first planar layer, and the second conductive layer is located between the first planar layer and the pixel defining layer.

4. The display panel according to claim 3, characterized in that: In the border area, at least a portion of the first planar layer has a first via hole, and the first via hole overlaps the second conductive layer and the first conductive layer; At least in the frame area, the second conductive layer has a first through hole.

5. The display panel according to claim 4, characterized in that: In the border area, a projection of at least a portion of the pixel defining layer on the substrate at least partially overlaps with a projection of the first through hole on the substrate.

6. The display panel according to any one of claims 3, characterized in that: At least a portion of the first conductive layer located in the display area forms a source-drain structure; And / or, at least a portion of the second conductive layer located in the display area forms an anode structure.

7. The display panel according to any one of claims 2 to 6, characterized in that: The organic layer further includes: a third flat layer; the third flat layer is located between the substrate and the first flat layer; The display panel further includes: a driving layer; in at least a portion of the frame area, the driving layer is located between the substrate and the third flat layer.

8. The display panel according to claim 1, characterized in that: The first isolation dam further includes a spacer layer, and the spacer layer is located between the pixel definition layer and the encapsulation layer; And / or, the second isolation dam further includes a spacer layer, and the spacer layer is located between the pixel defining layer and the encapsulation layer.

9. The display panel according to claim 1, characterized in that: In the frame area, the organic layer has an isolation channel; The isolation trench is at least filled with the packaging layer.

10. The display panel according to claim 1, characterized in that: The encapsulation layer comprises: a first inorganic encapsulation layer, an inkjet printing material layer, and a second inorganic encapsulation layer; The second inorganic encapsulation layer is located on a side of the first inorganic encapsulation layer away from the substrate; The inkjet printing material layer is located between the first inorganic encapsulation layer and the second inorganic encapsulation layer.

11. A display device, characterized in that: include: A display panel as claimed in any one of claims 1 to 10.

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