8-channel amplifier module and combined multi-beam echo sounder receiver amplifier

Abstract

The present invention relates to the field of electronic circuit technology, and specifically to an 8-channel amplifier module and a modular combination of a multi-beam echo sounder receiving amplifier; comprising a PCB board, two groups of amplifier circuits are arranged on the front and back sides of the PCB board, and the middle layer of the PCB board is arranged with a power line and a control line connected to the amplifier circuit; the amplifier circuit has a total of five stages, which are an input matching circuit, a front-stage controllable gain amplifier, a front-stage active filter, a rear-stage controllable gain amplifier and a rear-stage active filter connected in sequence; and the input matching circuit, the front-stage controllable gain amplifier, the front-stage active filter, the rear-stage controllable gain amplifier and the rear-stage active filter are arranged in a straight line, and the modular combination of the multi-beam echo sounder receiving amplifier includes a receiver base, a transducer, a motherboard and the above-mentioned 8-channel amplifier module. The present invention provides an 8-channel amplifier module, which is suitable for electronic circuits that require modular stacking installation.

Description

Technical Field

[0001] The invention relates to the technical field of electronic circuits, and in particular to an 8-channel amplifier module and a modularly combined multi-beam depth sounder receiving amplifier. Background Art

[0002] As a means of efficient underwater measurement, multi-beam echo sounders are increasingly widely used. Domestic multi-beam echo sounders have also been gradually verified and recognized by users. Due to the large number of multi-beam receiving channels, complex overall composition, and high channel consistency requirements, the production and maintenance of multi-beam echo sounders bring a lot of workload and technical difficulties, pushing up the manufacturing cost.

[0003] This type of multi-beam receiving amplifier consists of 80 channels, which is equivalent to the receiving amplifiers of 80 single-beam echo sounders installed in a centralized manner. Due to the principle structure and volume limitations, the circuits must be densely arranged, which is prone to mutual interference or self-excitation.

[0004] The 80 channels need to ensure the consistency of gain and phase, and each signal amplifier needs to be precisely debugged. The workload is quite large, and it is not easy to judge and solve mixed faults. Once interference or self-excitation occurs, it is quite difficult to solve.

[0005] The reliability of the input signal connection, including connection loss, stability, fidelity, anti-interference and other indicators, is directly related to the fidelity of the received signal. Summary of the invention

[0006] In view of the deficiencies of the prior art, the present invention provides an 8-channel amplifier module suitable for electronic circuits that require modular stacking installation.

[0007] The present invention is achieved through the following technical solutions:

[0008] An 8-channel amplifier module comprises a PCB board, two groups of amplifier circuits are arranged on the front and back sides of the PCB board, and a power line and a control line connected to the amplifier circuit are arranged on the middle layer of the PCB board;

[0009] The amplification circuit has five stages, which are an input matching circuit, a front-stage controllable gain amplifier, a front-stage active filter, a rear-stage controllable gain amplifier and a rear-stage active filter connected in sequence;

[0010] Furthermore, the input matching circuit, the front-stage controllable gain amplifier, the front-stage active filter, the rear-stage controllable gain amplifier and the rear-stage active filter are arranged in a straight line.

[0011] Preferably, each group of the amplifying circuits forms two channels, and the width of the PCB board occupied by each two channels does not exceed 120% of the width of a single widest component.

[0012] Preferably, the PCB board is arranged as a 4-layer board, and when laying the middle layer, the full area is laid.

[0013] Preferably, the PCB board is provided with reserved fixing holes for fixing to the motherboard.

[0014] Preferably, a signal input connector and a signal output connector are respectively provided at the left and right ends of the PCB board.

[0015] The present invention also provides the following technical solution: a modular multi-beam echo sounder receiving amplifier, comprising a receiver base, a transducer, a motherboard and the above-mentioned 8-channel amplifier module.

[0016] Preferably, the transducer is arranged inside the receiver base, the motherboard is arranged on the top right side of the receiver base via a fixing column, and the ten 8-channel amplifier modules are fastened to the motherboard via fixing screws.

[0017] Preferably, the signal input end connector of the 8-channel amplifier module is plug-in connected to the transducer input connector, and the signal output end connector is plug-in connected to the motherboard connector.

[0018] Preferably, the 80-channel input terminal corresponds to the position of the transducer input terminal, and 10 of the 8-channel amplifier modules are arranged in parallel.

[0019] The beneficial effects of the present invention are:

[0020] 1. Solved the feasibility problem of industrialization. The use of 80-channel + control signal integrated PCB is difficult to manufacture and repair. If an unrepairable fault occurs, the entire device can only be scrapped, resulting in great economic losses. Modularization makes production and maintenance simple, which is convenient for industrialization and promotion.

[0021] 2. The signals that are amplified step by step are arranged in a forward direction, so that the large signal output end and the small signal input end are kept far apart, which suppresses the signal space induction feedback and improves the stability of the circuit.

[0022] 3. The 80-channel input port corresponds to the transducer position, and the amplifier channels are arranged in parallel. The line loss and time delay of each channel are relatively consistent. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 It is a structural diagram of the signal trend of the channel amplifier of the present invention;

[0025] Figure 2 is a structural diagram of an 8-channel amplifier module of the present invention;

[0026] Figure 3 It is a structural diagram of the multi-beam echo sounder receiving amplifier of the present invention.

[0027] In the figure: 1-receiver base, 2-transducer, 21-transducer input connector, 3-motherboard, 31-motherboard connector, 4-8-channel amplifier module, 5-fixing column, 6-fixing screw. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] Embodiment 1:

[0030] See also Figures 1 to 3 As shown, this embodiment specifically discloses a technical solution for an 8-channel amplifier module, including a PCB board, two groups of amplifier circuits are arranged on the front and back sides of the PCB board, and a power line and a control line connected to the amplifier circuit are arranged on the middle layer of the PCB board;

[0031] The amplification circuit has five stages, which are an input matching circuit, a front-stage controllable gain amplifier, a front-stage active filter, a rear-stage controllable gain amplifier and a rear-stage active filter connected in sequence;

[0032] Furthermore, the input matching circuit, the front-stage controllable gain amplifier, the front-stage active filter, the rear-stage controllable gain amplifier and the rear-stage active filter are arranged in a straight line.

[0033] Specifically, each group of the amplifying circuits forms two channels, and the width of the PCB board occupied by each two channels does not exceed 120% of the width of a single widest component.

[0034] Specifically, the PCB board is configured with four layers, and when the middle layer is laid, the entire area is laid.

[0035] Specifically, the PCB board is provided with reserved fixing holes for fixing with the motherboard.

[0036] Specifically, a signal input connector and a signal output connector are respectively disposed at the left and right ends of the PCB board.

[0037] like Figure 1 As shown in the figure, the signal direction of the forward arrangement amplifier circuit is: the amplifier circuit has five stages from input matching to the post-stage active filtering, and the signal is amplified step by step. In order to avoid the amplified signal from crosstalking to the previous stage input and generating additional noise or self-excitation, it is necessary to follow Figure 1 The direction of the signal increasing step by step as shown in the figure limits the signal to be in a straight line when designing and laying out the PCB board, and it is not allowed to lay the signal line in the reverse direction. At the same time, the width of the board is limited to meet the modular size requirements.

[0038] The above-mentioned one-line arrangement layout effectively suppresses the feedback interference between the front and rear stages, compresses the width of the PCB layout, and creates basic conditions for the modularization of the amplifier circuit.

[0039] The embodiment of the present invention further provides the following technical solution: a modular multi-beam echo sounder receiving amplifier, comprising a receiver base 1, a transducer 2, a motherboard 3 and the above-mentioned 8-channel amplifier module 4.

[0040] Specifically, the transducer 2 is provided inside the receiver base 1, and the motherboard 3 is provided on the top right side of the receiver base 1 through a fixing column 5, and the fixing column 5 is made of insulating material. The 10 8-channel amplifier modules 4 are fastened to the motherboard 3 by fixing screws 6.

[0041] Specifically, the signal input end connector of the 8-channel amplifier module 4 is plug-connected to the transducer input connector 21 , and the signal output end connector is plug-connected to the motherboard connector 31 .

[0042] Specifically, the 80-channel input terminal corresponds to the input terminal of the transducer 2 , and the ten 8-channel amplifier modules 4 are arranged in parallel.

[0043] Moreover, due to the limitation of transducer and structure, 80 channels need to be arranged in parallel, and the arrangement width needs to meet the structural installation requirements. The input signal is connected to the transducer arrangement position correspondingly without misalignment. According to the selected component model, pin arrangement combination, such as Figure 2 As shown in the figure, each group of components forms two channels, and two groups of circuits are arranged on the front and back of each module. A 4-layer board is used, and the middle layer is the power line and control line. The middle layer is laid on the entire area to reduce the impedance of the power line and at the same time play the role of shielding and isolating the electrical signals on the front and back. The module fixing holes are reserved to fix the module to the motherboard to prevent the module from loosening or falling off due to vibration and impact. In this way, an 8-channel module is realized.

[0044] It also has the following features:

[0045] 1. The 8-channel module has good symmetry, which can ensure good consistency of the working power supply and control signal obtained by each group of circuits.

[0046] 2. The width of the PCB board occupied by every two channels shall not exceed 120% of the width of the widest single component, ensuring that the 10 modules can correspond to the transducer connection position when arranged in parallel.

[0047] 3. The input or output signal amplitude levels of adjacent integrated circuits between parallel channels are the same. This arrangement is not prone to crosstalk between adjacent channel signals.

[0048] like Figure 3 As shown, cross-layer connection is used: the front end of the amplifier module is connected to the transducer, and the back end is connected to the motherboard. The transducer connection end is on the surface of the receiver base, and the motherboard is installed above the surface of the receiver base. The motherboard and the receiver base must maintain an insulated installation height.

[0049] Since there are many connecting wires between the transducer and the amplifier module, the shorter the input connection, the less impact on interference. The two connectors for different heights are selected to directly plug in the shortest wiring. The hard connection of the dual connectors at different heights is achieved through coordination with the structure.

[0050] The three different types of modules mentioned above are hard-wired across connectors at different heights. The input signal line is connected to the shortest possible length to improve anti-interference performance and can be quickly installed and disassembled.

[0051] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit the same. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that the technical solutions described in the aforementioned embodiments may still be modified, or some of the technical features may be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. An 8-channel amplifier module, comprising a PCB board, characterized in that: Two groups of amplifier circuits are arranged on the front and back sides of the PCB board, and a power line and a control line connected to the amplifier circuit are arranged on the middle layer of the PCB board; The amplification circuit has five stages, which are an input matching circuit, a front-stage controllable gain amplifier, a front-stage active filter, a rear-stage controllable gain amplifier and a rear-stage active filter connected in sequence; The input matching circuit, the front-stage controllable gain amplifier, the front-stage active filter, the rear-stage controllable gain amplifier and the rear-stage active filter are arranged in a straight line; Each group of the amplifying circuits forms two channels, and the width of the PCB board occupied by each of the two channels does not exceed 120% of the width of a single widest component; The PCB board is arranged as a 4-layer board, and when the middle layer is laid, the whole area is laid.

2. The 8-channel amplifier module according to claim 1, characterized in that: The PCB board is provided with reserved fixing holes for fixing with the motherboard.

3. The 8-channel amplifier module according to claim 1, characterized in that: The left and right ends of the PCB board are respectively provided with a signal input terminal connector and a signal output terminal connector.

4. A modular multi-beam echo sounder receiving amplifier, characterized in that: The device comprises a receiver base, a transducer, a motherboard and an 8-channel amplifier module as claimed in any one of claims 1 to 3.

5. The modular multi-beam echo sounder receiving amplifier according to claim 4, characterized in that: The transducer is arranged inside the receiver base, the motherboard is arranged on the top right side of the receiver base via a fixing column, and the ten 8-channel amplifier modules are fastened to the motherboard via fixing screws.

6. The modular multi-beam echo sounder receiving amplifier according to claim 5, characterized in that: The signal input end connector of the 8-channel amplifier module is plug-connected with the transducer input connector, and the signal output end connector is plug-connected with the motherboard connector.

7. The modular multi-beam echo sounder receiving amplifier according to claim 6, characterized in that: The 80-channel input terminal corresponds to the position of the transducer input terminal, and 10 of the 8-channel amplifier modules are arranged in parallel.

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