A drive characteristic test system

Abstract

The application provides a driving characteristic test system and relates to the field of rail vehicle traction technology.The driving characteristic test system comprises a heating and cooling system, wherein the heating and cooling system comprises a high-low temperature test box and a liquid cooling system, and the high-low temperature test box comprises a temperature control base plate; the temperature control base plate comprises an installation base plate and an electric heater arranged in sequence from top to bottom; the installation base plate is connected with the liquid cooling system, the installation base plate is injected with cooling liquid through the liquid cooling system, low-temperature circulation control of the installation base plate is realized through the cooling liquid, and high-temperature control of the installation base plate is realized through the electric heater; and the installation base plate conducts temperature to a measured device located above the installation base plate. The driving characteristic test system provided in the application can perform driving characteristic test of the measured device under high-low temperature operation working condition environment.

Description

Technical Field

[0001] This invention relates to the field of rail vehicle traction technology, and more specifically to a drive characteristic testing system. Background Technology

[0002] Given the vast differences in regional climate and the complex topography, the operating environment for high-speed trains, including high temperatures, low temperatures, and high humidity, is extremely harsh. This is determined by the characteristics of the operating lines themselves.

[0003] As the most important energy conversion component of the traction auxiliary converter, the power module's design performance directly determines whether the train can operate safely and stably for a long time, and is also closely related to the train's failure rate and operating costs. The design of the IGBT / SiC-MOSFET driver is an important core technology in this regard.

[0004] As a crucial component of power modules, the driver's adaptability to complex environments directly determines the reliability of the power module's operation. Existing IGBT / SiC-MOSFET drive characteristic test benches can only meet the testing requirements of drivers in trains under normal temperature conditions, and cannot conduct tests for high-temperature, low-temperature, and high-humidity operating environments. Summary of the Invention

[0005] To address the problems in the prior art, embodiments of the present invention provide a driving characteristic testing system that can at least partially solve the problems existing in the prior art.

[0006] On one hand, the present invention proposes a driving characteristic testing system, comprising:

[0007] A heating and cooling system, comprising a high and low temperature test chamber and a liquid cooling system, wherein the high and low temperature test chamber includes a temperature control substrate;

[0008] The temperature control substrate includes a mounting base plate and an electric heater arranged sequentially from top to bottom; the mounting base plate is connected to the liquid cooling system, and the mounting base plate is injected with coolant through the liquid cooling system to achieve low temperature circulation control of the mounting base plate through the coolant, and high temperature control of the mounting base plate through the electric heater;

[0009] The mounting base plate conducts heat to the device under test located above the mounting base plate.

[0010] The mounting base plate is equipped with a water-cooling connector, and the mounting base plate is connected to the liquid cooling system through a flexible hose passing through the water-cooling connector.

[0011] The high and low temperature test chamber is equipped with a cooling system port on its inner side, through which a flexible hose located outside the high and low temperature test chamber is introduced into the high and low temperature test chamber.

[0012] The mounting base plate is provided with drainage holes, which are used to drain the liquid inside the mounting base plate before high-temperature testing.

[0013] The high and low temperature test chamber is equipped with a low temperature regulation device, which is used to adjust the internal temperature of the high and low temperature test chamber to below zero degrees Celsius in advance when conducting low temperature tests.

[0014] The temperature control substrate also includes a height adjustment fixture located below the electric heater. The height adjustment fixture is used to adjust the height of the device under test by adjusting the lifting height of the height adjustment fixture.

[0015] The electric heater body has an electric heating tube located below it; the power distribution of the electric heating tube is uniform.

[0016] The driving characteristic test system further includes a pulse control system; the pulse control system is used to provide the signal conditions required for the driving characteristic test of the device under test.

[0017] The high and low temperature test chamber is equipped with a driver and a signal port located inside the chamber. The driver is used to provide a drive signal to the device under test, with one end connected to the device under test and the other end connected to the signal port.

[0018] The pulse control system connects to the driver by inserting an optical fiber into the signal port.

[0019] The drive characteristic test system also includes a power supply system; the power supply system is used to provide the high voltage conditions required for the drive characteristic test of the device under test.

[0020] The high and low temperature test chamber is equipped with a bus capacitor, an adjustable busbar, and a power port located inside the high and low temperature test chamber; the bus capacitor and the device under test are electrically connected through the adjustable busbar.

[0021] The power system charges the bus capacitor by connecting a cable to the power port.

[0022] The driving characteristic testing system further includes a testing system; the testing system is used to measure the test parameters required for the driving characteristic testing of the device under test.

[0023] The high and low temperature test chamber is equipped with a detection probe port inside. The test probe of the test system is connected to the device under test by passing a cable through the detection probe port.

[0024] The driving characteristic testing system provided in this invention includes a heating and cooling system, which comprises a high and low temperature test chamber and a liquid cooling system. The high and low temperature test chamber includes a temperature control substrate. The temperature control substrate includes a mounting base plate and an electric heater arranged sequentially from top to bottom. The mounting base plate is connected to the liquid cooling system, and coolant is injected into the mounting base plate through the liquid cooling system. The coolant enables low-temperature circulation control of the mounting base plate, while the electric heater enables high-temperature control of the mounting base plate. The mounting base plate conducts temperature to the device under test located above it. This system enables driving characteristic testing of the device under test under high and low temperature operating conditions. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. In the drawings:

[0026] Figure 1 This is a schematic diagram of the structure of a driving characteristic testing system provided in an embodiment of the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of a temperature control substrate provided in an embodiment of the present invention.

[0028] High and low temperature test chamber 1

[0029] Liquid cooling system 2

[0030] Temperature control board 11

[0031] Mounting base plate 101

[0032] Electric heater 102

[0033] Water-cooled connector 1011

[0034] Cooling system port 12

[0035] Drain hole 1012

[0036] Low temperature control device 13

[0037] Height Adjustment Fixture 103

[0038] Drive 14

[0039] Signal port 15

[0040] Bus capacitor 16

[0041] Adjustable busbar 17

[0042] Power port 18

[0043] Detection probe port 19 Detailed Implementation

[0044] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings. Here, the illustrative embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this application can be arbitrarily combined with each other.

[0045] Figure 1 This is a schematic diagram of the structure of a driving characteristic testing system provided in an embodiment of the present invention, as shown below. Figure 1 As shown, the driving characteristic testing system provided in this embodiment of the invention includes:

[0046] The heating and cooling system includes a high and low temperature test chamber 1 and a liquid cooling system 2. The high and low temperature test chamber 1 includes a temperature control substrate 11. The heating and cooling system mainly provides the temperature and humidity conditions required for the test of the device under test.

[0047] The high and low temperature test chamber 1 can simulate various extreme working environments such as high temperature, low temperature, and high humidity.

[0048] The temperature control substrate 11 is designed to ensure that the bottom temperature of the device under test meets the test requirements.

[0049] like Figure 2 As shown, the temperature control substrate 11 includes a mounting base plate 101 and an electric heater 102 arranged sequentially from top to bottom; the mounting base plate 101 is connected to the liquid cooling system 2, and the mounting base plate 101 is injected with coolant through the liquid cooling system 2, so as to realize the low temperature circulation control of the mounting base plate 101 through the coolant, and realize the high temperature control of the mounting base plate 101 through the electric heater 102.

[0050] The mounting base 101 conducts heat to the device under test (DUT) located above the mounting base 101. The DUT may include IGBTs and SiC, etc.

[0051] Furthermore, the mounting base plate 101 is provided with a water-cooling connector 1011, and the mounting base plate 101 is connected to the liquid cooling system 2 through a flexible hose passing through the water-cooling connector 1011.

[0052] Furthermore, a cooling system port 12 is provided inside the high and low temperature test chamber 1, through which a flexible hose located outside the high and low temperature test chamber 1 is introduced into the high and low temperature test chamber 1.

[0053] Furthermore, the mounting base plate 101 is provided with a drain hole 1012 for pre-draining the liquid inside the mounting base plate 101 during high-temperature testing. At high temperatures, the temperature control substrate 11 should first drain the internal liquid to prevent the coolant from vaporizing due to excessive temperature, thus avoiding excessive pressure and protecting the safety of the drive characteristic testing system.

[0054] Furthermore, the high and low temperature test chamber 1 is equipped with a low-temperature regulation device 13, which is used to pre-adjust the internal temperature of the high and low temperature test chamber 1 to below zero degrees Celsius before conducting low-temperature tests. To ensure the effectiveness of the low-temperature regulation, the low-temperature regulation device 13 can be located in the center of the high and low temperature test chamber 1. The low-temperature regulation device 13 may include equipment for refrigeration, etc. Since the lowest test temperature can reach below -40°C, and the device under test is at a low temperature, it is necessary to set the ambient temperature inside the high and low temperature test chamber 1 to below zero to prevent condensation from occurring on the device under test.

[0055] Furthermore, the temperature control substrate 11 also includes a height adjustment fixture 103 located below the electric heater 102. The height adjustment fixture 103 is used to adjust the height of the device under test by adjusting the lifting height of the fixture 103. By raising the height adjustment fixture 103, the mounting base 101 supporting the device under test is raised; by lowering the height adjustment fixture 103, the mounting base 101 supporting the device under test is lowered, thereby achieving height adjustment of the device under test.

[0056] Furthermore, an electric heating tube (not shown in the figure) is provided below the body of the electric heater 102; the power distribution of the electric heating tube is uniform, which helps to make the heating temperature more uniform.

[0057] Furthermore, the electric heater 102 uses a multi-point temperature measurement method to monitor the liquid temperature, monitor the temperature uniformity at each point on the electric heater 102, and select the average temperature at each point as the control reference temperature to improve the temperature monitoring accuracy.

[0058] The base plate of the electric heater 102 can be made of aluminum alloy to reduce thermal inertia and improve control accuracy. The mounting base plate 101 can be made of copper to improve the temperature uniformity of the material surface and ensure that the temperature difference at each point is less than 0.2℃.

[0059] Furthermore, the driving characteristic test system also includes a pulse control system; the pulse control system is used to provide the signal conditions required for the driving characteristic test of the device under test; the high and low temperature test chamber 1 is provided with a driver 14 and a signal port 15 located inside the high and low temperature test chamber 1; the driver 14 is used to provide a driving signal to the device under test, one end of which is connected to the device under test, and the other end of which is connected to the signal port 15; the pulse control system is connected to the driver 14 by connecting an optical fiber to the signal port 15.

[0060] Furthermore, the driving characteristic test system also includes a power supply system; the power supply system is used to provide the high voltage conditions required for the driving characteristic test of the device under test; the high and low temperature test chamber 1 is provided with a bus capacitor 16, an adjustable busbar 17 and a power port 18 located inside the high and low temperature test chamber 1; the bus capacitor 16 and the device under test are electrically connected through the adjustable busbar 17; the power supply system charges the bus capacitor 16 by connecting a cable to the power port 18.

[0061] Furthermore, the driving characteristic test system also includes a test system; the test system is used to measure the test parameters required for the driving characteristic test of the device under test; a detection probe port 19 is provided inside the high and low temperature test chamber 1, and the test probe of the test system (not shown in the figure) is connected to the device under test by passing a cable through the detection probe port 19.

[0062] The test probes of the test system may include: high voltage differential probes, ordinary voltage probes, Rogowski coils, opto-isolated probes, and oscilloscopes, etc.

[0063] The drive characteristic test system also includes a monitoring system for monitoring the operation of the drive characteristic test system and has video recording and storage functions. The monitoring system may include video recording equipment and display devices, etc.

[0064] The aforementioned pulse control system, power supply system, testing system, and monitoring system can all be controlled through a host computer control system.

[0065] The driving characteristic testing system provided in this invention includes a heating and cooling system, which comprises a high and low temperature test chamber and a liquid cooling system. The high and low temperature test chamber includes a temperature control substrate. The temperature control substrate includes a mounting base plate and an electric heater arranged sequentially from top to bottom. The mounting base plate is connected to the liquid cooling system, and coolant is injected into the mounting base plate through the liquid cooling system. The coolant enables low-temperature circulation control of the mounting base plate, while the electric heater enables high-temperature control of the mounting base plate. The mounting base plate conducts temperature to the device under test located above it. This system enables driving characteristic testing of the device under test under high and low temperature operating conditions.

[0066] For high-temperature tests, such as during an 80°C test, when a temperature higher than the ambient temperature is required, the electric heater is activated to heat the coolant to the target temperature, and the temperature of the temperature control substrate is controlled after circulation.

[0067] For low-temperature tests, such as those at -20°C, when a temperature lower than ambient temperature is required, the liquid cooling system is activated to cool the coolant. Temperature control can employ PID closed-loop regulation, with a temperature control accuracy of no less than 1°C. During high-temperature tests, the circulating water pump is shut off, and the solenoid valve is activated to introduce compressed air, blowing out the coolant from the temperature control board to prevent the coolant from boiling at high temperatures, which could lead to excessively high pressure in the piping system.

[0068] Taking the IGBT device under test as an example, the test process of the drive characteristic test system is as follows:

[0069] The drive characteristic testing system is self-tested via the host computer control system to ensure it is safe and fault-free. The data model of the IGBT to be tested is selected, and the following operations are performed through the host computer control system:

[0070] The test voltage, pulse, and inductance settings are configured, along with the test drive parameters such as drive resistor and gate capacitor. Then, a test is conducted at room temperature. The test results are compared and analyzed using the IGBT datasheet to determine the basic drive parameters. The designed driver is then replaced and the test is repeated. The test data is saved to a fixed hard drive for later data retrieval.

[0071] The high-temperature, low-temperature, and high-humidity testing procedures for the drive characteristic testing system are implemented as follows:

[0072] When the required IGBT test temperature is below 80℃, liquid cooling or heat treatment should be used.

[0073] When the required IGBT test temperature is above 80℃, an electric heater control method is used. When the IGBT needs to be tested at low temperature or room temperature, low-temperature cooling water is circulated inside the temperature control board. The inlet temperature of the cooling water can be precisely controlled with an accuracy better than 1℃. The minimum test temperature can be guaranteed to be below -40℃. Because the IGBT base plate is at a low temperature, the ambient temperature needs to be set below zero to prevent condensation from occurring on the IGBT module.

[0074] When the IGBT test temperature exceeds 80℃, the coolant inside the temperature control board is discharged using compressed air. The electric heater at the bottom of the temperature control board is then activated to control the temperature of the temperature control board. The electric heater uses PID regulation, and the temperature control accuracy is better than 1℃. The maximum test temperature can be guaranteed to be above 175℃. It should be noted that at high temperatures, the internal liquid of the temperature control board should be discharged first to avoid excessive temperature causing the coolant to vaporize and generate excessive pressure, thus protecting the system safety.

[0075] When IGBT testing requires operation in a high-humidity environment, the appropriate humidity can be set directly using a high-low temperature test chamber.

[0076] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or computer program products. Therefore, the present invention can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention can take the form of a computer program product embodied on one or more computer-usable storage media (including, but not limited to, disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0077] This invention is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0078] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0079] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0080] In the description of this specification, the references to terms such as "an embodiment," "a specific embodiment," "some embodiments," "for example," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above descriptions are merely specific embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A drive characteristic test system characterized by comprising: The application relates to a high-low temperature test box and a liquid cooling system, and the high-low temperature test box comprises a temperature control base plate. The temperature control base plate comprises a mounting base plate and an electric heater arranged in sequence from top to bottom; the mounting base plate is connected with the liquid cooling system, the mounting base plate is injected with cooling liquid through the liquid cooling system, low-temperature circulation control of the mounting base plate is realized through the cooling liquid, and high-temperature control of the mounting base plate is realized through the electric heater. The mounting base plate conducts temperature to a device under test located above the mounting base plate. A low-temperature adjusting device is arranged in the high-low temperature test box, which is used for adjusting the temperature in the high-low temperature test box to below zero centigrade in advance through the low-temperature adjusting device when a low-temperature test is performed. The temperature control base plate further comprises a height adjusting tool located below the electric heater, which is used for adjusting the height of the device under test by adjusting the lifting height of the height adjusting tool. An electric heating pipe is arranged below the body of the electric heater; the power distribution of the electric heating pipe is uniform distribution; the electric heater adopts a multi-point temperature measuring mode to monitor the temperature of liquid, monitors the temperature uniformity of each point on the electric heater, and selects the average temperature of each point as a control reference temperature. The drive characteristic test system further comprises a pulse control system; the pulse control system is used for providing a signal condition required by a drive characteristic test of the device under test; A driver is arranged in the high-low temperature test box, and a signal port is arranged in the high-low temperature test box; the driver is used for providing a driving signal for the device under test, one end of the driver is connected with the device under test, and the other end of the driver is connected with the signal port; The pulse control system is connected with the driver by connecting an optical fiber into the signal port; The drive characteristic test system further comprises a power supply system; the power supply system is used for providing a high-voltage condition required by the drive characteristic test of the device under test; A bus capacitor, an adjustable busbar and a power supply port are arranged in the high-low temperature test box; the bus capacitor and the device under test are electrically connected through the adjustable busbar; The power supply system charges the bus capacitor by connecting a cable into the power supply port; The drive characteristic test system further comprises a test system; the test system is used for measuring a test parameter required by the drive characteristic test of the device under test; A detection probe port is arranged in the high-low temperature test box; a test probe of the test system is connected with the device under test by passing a cable through the detection probe port; The drive characteristic test system further comprises a monitoring system, which is used for monitoring the running condition of the drive characteristic test system and has a video storage function; the monitoring system comprises video equipment and a display device; The pulse control system, the power supply system, the test system and the monitoring system are controlled through an upper computer control system. The test method based on the drive characteristic test system comprises the following steps: ​ The driving characteristic test system is self-checked by the host computer control system to ensure that the driving characteristic test system is safe and fault-free; the data type of the test IGBT is selected, and the following operations are realized by the host computer control system: Test voltage setting, test pulse setting, test inductance setting, test driving parameter setting, including driving resistance and gate capacitance, then test at room temperature, call IGBT specification book to compare and analyze the test results, determine the basic driving parameters, replace the designed driver for retest, save the test data to the fixed hard disk for subsequent data calling; The high temperature, low temperature and high humidity test process of the driving characteristic test system is implemented as follows: When the IGBT test temperature needs to be lower than 80 DEG C, liquid cooling heating or cooling method is adopted; When the IGBT test temperature needs to be higher than 80 DEG C, the control method of electric heater is adopted; when the IGBT needs to be tested at low temperature or room temperature, low temperature cooling circulating water is introduced into the temperature control substrate, the inlet temperature of the cooling circulating water can be accurately controlled, and the precision is better than 1 DEG C, and the minimum test temperature can be guaranteed below-40 DEG C, because the IGBT bottom plate is at low temperature, therefore, the environmental chamber temperature needs to be set at zero temperature to prevent the condensation phenomenon of the IGBT module; When the IGBT test temperature is higher than 80 DEG C, the cooling liquid in the temperature control substrate is discharged by compressed air, the electric heater at the bottom of the temperature control substrate is started, the temperature of the temperature control substrate is controlled, the electric heater adopts PID regulation, the temperature control precision is better than 1 DEG C, the maximum test temperature can be guaranteed above 175 DEG C, when the temperature is high, the temperature control substrate should discharge the internal liquid first to avoid the temperature being too high to cause the cooling liquid to vaporize and generate excessive pressure, so as to protect the system safety; When the IGBT test needs to work in a high humidity environment, the corresponding humidity can be directly set by using the high and low temperature test box.

2. The drive characteristic test system according to claim 1, characterized by The mounting bottom plate is provided with a water cooling joint, and the mounting bottom plate is connected with the liquid cooling system through a hose penetrating the water cooling joint.

3. The drive characteristic test system according to claim 2, characterized by The high and low temperature test box is provided with a cooling system port inside, and a hose outside the high and low temperature test box is introduced into the high and low temperature test box through the cooling system port.

4. The drive characteristic test system according to claim 3, characterized by The mounting bottom plate is provided with a drain hole for discharging the liquid in the mounting bottom plate through the drain hole in advance when high temperature test is carried out.

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