Method for surface structuring of a substrate body and substrate body

Abstract

The invention relates to a method for preparing and / or structuring a surface of a substrate body. The invention also relates to a substrate body.

Description

Technical Field

[0001] This invention relates to a method for preparing the surface of a substrate and / or structuring it. The invention also relates to a substrate body. Background Technology

[0002] In order to process the starting substrate to form a predetermined surface such as a boundary surface, known separation processes in the prior art are performed by scribing and fracturing, grinding wheel cutting, laser-based thermal separation (i.e., mechanically pre-damaging the substrate and guiding cracks through the thermal stress field in the material), and laser-based perforation separation (i.e., filamentation along the contour and subsequent mechanical or thermal separation along the perforation).

[0003] However, a drawback of these processes is that they often fail to achieve the intended target surface. This is sometimes due to pre-existing damage in the substrate material, which is intentionally introduced but cannot be adequately controlled.

[0004] Therefore, the object of the present invention is to enable the reliable formation of the designed surface in the substrate body. Summary of the Invention

[0005] According to a first aspect, the object of the present invention is achieved by providing a method for preparing a predetermined or predeterminable distinguishing surface of a substrate body and / or implementing its structuring, the substrate body comprising a substrate material,

[0006] The method includes: exposing a substrate material in at least one curved effective region to an electromagnetic field, thereby inducing a nonlinear interaction between the electromagnetic field and the substrate material in each of the at least one curved effective regions, and thus at least partially affecting the substrate material in the curved effective region;

[0007] Wherein, after structuring the distinguishable surface, the distinguishable surface includes at least one first curved progression in at least certain regions, the first curved progression being at least partially determined and / or influenced by the curved shape of at least one effective curved region; and

[0008] In this process, nonlinear interactions induce at least one nonlinear absorption of the electromagnetic field in the substrate material.

[0009] This is based on the surprising discovery that the spatial extent of the electromagnetic field, i.e. the shape of the effective region of each curve, can be used to predetermine the designed surface at least in its basic extended trace.

[0010] Therefore, the substrate material is exposed to an electromagnetic field. In at least one region of the electromagnetic field, a nonlinear interaction occurs between the electromagnetic field and the substrate material, wherein this region is curved. As a result, within this curved region, the substrate material disposed in that region is at least partially affected; this curved region is referred to as the curved effective region.

[0011] In this paper, this effect on the substrate material can be understood, for example, as a volumetric modification of the substrate material. Types of modification can include cracks, voids (cavities), and / or changes in the structure of the substrate material, which in particular lead to faster etch removal (compared to unaffected substrate material).

[0012] For example, subsequently, an interface can be found between the affected and unaffected substrate materials. This corresponds to the surface of the curved effective region. This interface can extend entirely or partially within the substrate material. In cases where the cavity is generated by nonlinear interactions, the interface can correspond to the surface of the cavity.

[0013] Therefore, the unaffected substrate material has a shape complementary to the curved effective region. Or, in other words, the unaffected substrate material locally includes surfaces that positively interact with the surfaces of the affected region.

[0014] By exposing and / or further processing this surface of the unaffected substrate material, a distinctive surface can be provided while retaining the extended traces imparted.

[0015] By giving the shape corresponding to the region where the electromagnetic field can interact nonlinearly with the substrate material, the spatial formation of the curved effective region can be made very flexible. Therefore, by controlling the region of nonlinear interaction through the electromagnetic field, the curved effective region can be defined and controlled. Thus, not only can the distinguishable surface be structured on the outer side of the substrate, but it can also be structured completely or partially on the inner side of the substrate.

[0016] In one embodiment, the nonlinear interaction is achieved by ensuring that, at least in certain regions, the intensity of the electromagnetic field is such that it causes a nonlinear interaction with the substrate material. The curved effective region is then positioned within a volumetric region with a corresponding high intensity.

[0017] For example, the curved effective region can be formed entirely within the substrate. Alternatively, the curved effective region can extend from at least one surface of the substrate into the interior of the substrate body. In this respect, the curved effective region can also extend to another surface of the substrate body. Alternatively or additionally, the curved effective region can also intersect with another surface (such as a side surface) of the (unstructured) substrate body. The latter approach is particularly advantageous if the side surfaces of the substrate body are to be structured. The curved effective region can then be formed within the substrate material such that it intersects with, for example, three side surfaces of an unstructured substrate body.

[0018] Therefore, this method enables the particularly easy and efficient fabrication or execution of the designed surface structure, serving as a distinguishing surface for the substrate body. In this paper, the shape of the affected substrate material can be chosen almost arbitrarily. It is only necessary to provide, or be able to provide, a correspondingly shaped electromagnetic field, to which the substrate material is (locally) exposed and can interact nonlinearly with the electromagnetic field.

[0019] The term "structuring of a distinguishing surface" is generally understood to refer to the formation of a surface that did not previously exist in the substrate body. This can be achieved, for example, by manipulating an existing surface, such as by ultimately removing substrate material from a surface partition of the existing surface to form a new surface as a distinguishing surface. Alternatively, this can be achieved, for example, by separating a portion of the substrate material from the substrate body along the designed surface, thereby exposing a new surface as a distinguishing surface. Of course, the transition between when the existing surface is still being manipulated and when a portion of the substrate material has been separated can be smooth.

[0020] However, the difference at this point is not critical, because in both cases, the substrate material of the substrate body is affected, with the aim of determining or influencing the extended trace of the interface between the affected and unaffected substrate materials by the shape of the curved effective region, thereby determining or influencing the extended trace of the designed surface or distinguishing surface.

[0021] Therefore, preferably, the material to be removed, which structures the distinctive surface, can be removed from the original substrate in a form other than powder. This process is also feasible in rooms with high cleanliness requirements, such as cleanrooms. For example, the powder may be present with a particle size of less than 10 nm.

[0022] In one embodiment, material is removed from the original substrate body to structure the distinctive surface.

[0023] In one embodiment, the material removed from the original substrate to structure the distinctive surface is removed from the original substrate as a fully continuous or at least partially continuous block of material.

[0024] In this paper, different types of distinctive surface structures can be created. This makes it possible to provide substrates for different application purposes.

[0025] For example, nonlinear interactions can be induced only within a single effective region of the curved surface. In this case, the substrate material is affected only within that effective region. For instance, the affected substrate material can then be completely enclosed within the substrate material and cannot reach the surface of the substrate body. Alternatively, the affected substrate material can reach one or more surfaces of the substrate body, particularly two opposing surfaces. The affected substrate material then extends from one surface to at least one of the other surfaces.

[0026] For example, nonlinear interactions can be induced in several curved effective regions, and the substrate material can be influenced separately in these curved effective regions. For example, the individual curved effective regions can then follow each other. The curved effective regions can then be offset relative to each other and / or rotated about the principal axis of the respective effective region.

[0027] When the substrate material is affected within the curved effective region, the shape of that curved effective region (partially) determines or influences the first extended trace of the distinguishing surface. This is evident because, illustratively, the substrate material is affected within the curved volume partition. The surface of the curved volume partition also represents the interface with the unaffected substrate material. The surface regions of the unaffected substrate material and the surface regions of the volume partition are exactly complementary (negative). Therefore, the shape of the curved effective region can jointly determine or influence the surface regions of the unaffected substrate material. Thus, the distinguishing surface is (partially) determined or influenced by the curved shape of the effective region.

[0028] Alternatively, the method can be further implemented so that, overall, no microcracks or only a small number of microcracks are generated in the region of the distinguishing surface. Therefore, the strength of the distinguishing surface is high from the outset, and the structured substrate exhibits exceptional durability.

[0029] This method does not require the application of mechanical stress when removing a portion of the substrate material. Therefore, for example, the substrate body can be divided into two parts or a recess can be removed from the substrate body without mechanical stress. Thus, the substrate body is not subjected to stress and is neither damaged nor particularly damaged.

[0030] Therefore, the proposed method is able to process the starting substrate in order to form a predetermined or predeterminable surface (such as a boundary surface) as a distinguishing surface.

[0031] The present invention therefore provides a substrate body whose surface, particularly its peripheral side surfaces, has a predetermined desired surface in at least certain regions, and whose surface can preferably be integrally etched. In this case, a stress-applied separation process is not required.

[0032] Therefore, distinctive surfaces can be formed with very high precision.

[0033] In particular, the proposed method does not require polishing of the structured surface. Specifically, when the structured surface represents all or part of the side surface of the substrate, polishing cannot be performed or can only be performed under difficult conditions, especially for thin substrates.

[0034] This is because polishing the substrate surface (especially the side surfaces) requires the substrate to have high dimensional stability and therefore sufficient thickness to withstand the mechanical clamping of the substrate body in the polishing machine. This method eliminates the need for a polishing process, which is why even extremely thin substrate bodies can be structured.

[0035] In one embodiment, if nonlinear absorption of the substrate material occurs at least in a partition of the curved effective region due to the electromagnetic field, then there is a nonlinear interaction between the electromagnetic field and the substrate material.

[0036] For example, the nonlinear interaction between the electromagnetic field and the substrate material can include nonlinear absorption by the substrate material.

[0037] In one embodiment, the substrate body is composed of or includes glass, glass-ceramic, silicon, or sapphire.

[0038] In one embodiment, mechanical separation can be performed in a humid atmosphere and / or by CO2 splitting. This can be advantageously used to provide a substrate body with curved or wavy edges immediately after interaction with an electromagnetic field.

[0039] An electromagnetic field is set within the effective region of the curved shape, thereby inducing a nonlinear interaction between the electromagnetic field and the substrate material within this effective region, and particularly throughout the entire effective region of the curved shape.

[0040] In one embodiment, the substrate material in at least one curved effective region is exposed to an electromagnetic field, causing a nonlinear interaction between the electromagnetic field and the substrate material in the curved effective region, and causing the substrate material in the curved effective region to be at least partially affected.

[0041] In one embodiment, nonlinear absorption of the electromagnetic field in the substrate material includes inducing nonlinear absorption of the laser beam in the substrate material.

[0042] Alternatively or additionally, it may be provided that the substrate material is exposed to an electromagnetic field in multiple curved effective regions.

[0043] Preferably,

[0044] (i) The distinctive surface has the same first curved extension trace in several regions, in particular the first curved extension trace determined or influenced by the curved shape of several effective regions of the curved surface, and / or has the first curved extension trace in each location;

[0045] and / or

[0046] (ii) The curved effective regions are selected to be arranged at a certain distance from each other, wherein, particularly in the cross section of the substrate body, the center or centroid of the intersecting surface of the curved effective regions and the cross section extends along a straight line or along any desired, particularly circular, curve, and / or the distance between the continuous effective regions is between 30% and 100% or between 100% and 200% of the maximum proportion of the curved effective regions in the cross section.

[0047] When using multiple curved effective regions, extended distinguishing surfaces can be provided particularly easily. For example, extended side surfaces of the substrate body can be reliably structured in this way. For example, the individual curved effective regions can then follow each other. The curved effective regions can also be offset relative to each other and / or rotated about the principal axis of the respective effective region. Thus, multiple continuous regions with affected substrate material can be formed, and distinguishing surfaces can be formed by exposing and / or further processing the corresponding interfaces between the affected and unaffected substrate materials.

[0048] In one embodiment, the substrate material is exposed to an electromagnetic field in at least two curved effective regions. Preferably, the distinguishing surface is determined or influenced by the two curved effective regions, particularly by curved effective regions at different locations. Thus, in one embodiment, the first curved extension trace can be achieved by multiple curved effective regions at multiple partitions of the distinguishing surface.

[0049] The first curved extension trace can thus be determined or influenced by only a portion of the effective curved region, particularly by a portion of its outer surface. The extent to which the effective curved regions collectively determine the first curved extension trace can be related to the closeness of the individual effective regions to each other and how the affected substrate material is further processed.

[0050] In the cross-section of the substrate body, the individual curved effective regions can then extend along a straight line or along an arbitrary curve, particularly an arc or a complete circle. For example, there may be a distance between the centers or centroids of the continuous intersecting surfaces of the curved effective regions in the cross-section. This distance can be approximately between 100% and 200% of the maximum proportion of the curved effective regions in the cross-section, preferably between 110% and 150% or between 140% and 180%. In this case, the curved effective regions extend in a manner that they are spaced apart from each other by so-called rib regions. This distance can also be between 30% and 100% of the maximum proportion of the curved effective regions in the cross-section, preferably between 50% and 70% or between 60% and 80%. In this case, the curved effective regions can be said to be staggered, or in other words, the rib regions have a negative width.

[0051] For example, existing, such as planar or differently shaped, side surfaces of the substrate body can be restructured. To this end, the substrate material can be influenced along the existing side surfaces in a continuous, curved effective region. If this is not done, further steps can be taken to remove the affected material and fully form the distinctive surface.

[0052] If the surface is structured using several (identical) curved effective regions as in the current case, then the distinguishing surface is equally determined or influenced by the curved effective regions at several partitions. Therefore, the distinguishing surface also has the same first curved curve at each of those locations.

[0053] In one embodiment, a first curved curve can be found multiple times or consecutively at the distinguishing surface. For example, the distinguishing surface can be structured using multiple curved effective regions spaced apart from each other in a non-overlapping manner. Then, preferably, a first curved extension trace can be found at the distinguishing surface where the curved effective regions have already functioned.

[0054] For example, for the structuring of a distinguishing surface, several curved effective regions can be used, which are spaced apart and overlap each other. Specifically, the overlap can be chosen to be very significant, for example, between 0.1% and 80%, preferably between 0.1% and 20%, preferably between 0.1% and 5%, and preferably between 0.1% and 1% of the maximum proportion of the curved effective region in a plane perpendicular to the main extension direction of the curved effective region. Then, preferably, a first curved curve can be continuously found at the distinguishing surface. This is because as the overlap increases, at any point on the distinguishing surface, the shape of the distinguishing surface is increasingly determined only by the furthest outward extension of the curved effective region.

[0055] In one embodiment, the first curved extension trace extends perpendicularly to the extension traces of mutually spaced-apart curved effective regions.

[0056] For example, a recess, particularly a rectangular or circular recess, can be cut from a cubic substrate body. Then, there are two parts: the substrate body with the recess and the cut-out portion. For this purpose, the substrate material can be affected along a curve (defined in the cross-section of the substrate body), such as a rectangular or circular curve, within a continuous curved effective region. If this is not yet complete, further steps can be taken to remove the affected material. By removing the affected material, a distinct surface can be fully formed at any point, and the cut-out portion can be separated from the substrate body because there is no longer a connection between the substrate body and the cut-out portion.

[0057] According to one definition, the portion from which the recess is cut can be a structured substrate body. According to another definition, the portion removed from the substrate body to be structured can be a structured substrate body.

[0058] Similarly, the substrate body can be separated along the designed surface, thus allowing the formation of distinctive surfaces by influencing the substrate material in a continuous curved effective region along a straight line or a curve of arbitrary shape (defined within the cross-section of the substrate body). Furthermore, this allows for very flexible control and adjustment of the extended trace along the primary direction of extension of the boundary surface.

[0059] The entire distinguishing surface does not necessarily have to be determined or influenced by the shape of one or more curved effective regions. For example, it is possible that the affected substrate material in two adjacent curved effective regions has been removed, thereby introducing two cavities into the substrate body. The surface exposed by connecting the two cavities, i.e., the surface exposed by removing the wall material between them, can also be part of the distinguishing surface.

[0060] Alternative or additional land may also be provided, including:

[0061] The aforementioned effects on the substrate material include: altering, in particular improving or reducing one or more material properties of the substrate material in at least certain regions, such as, in particular, refractive index, etch rate and / or density;

[0062] and / or

[0063] The aforementioned effects on the substrate material include: at least partially removing and / or displacing the substrate material from the effective curved region, particularly compacting the substrate material into the surrounding substrate material.

[0064] By altering the material properties of the substrate material during the influence process, the substrate material to be removed can be specifically selected, for example, through further measures, to form a distinctive surface or portion thereof. Furthermore, preferably, the material properties can be used to ensure that, depending on the degree of influence, the affected material can be removed by applying measures at different rates using further measures. Therefore, the selectivity of the affected material's response to further measures can even be spatially adjusted.

[0065] In any case, distinguishing surfaces can be well identified by the different properties of the material, and then exposed by appropriate measures. Here, measures that have different effects on regions with different material properties are particularly preferred. Therefore, if a measure acts only on the affected substrate material, it can be selectively processed after the effect, for example, by removing the substrate material. When the affected substrate material is removed, the substrate body has a new surface at the location where the material was removed, which is at least a portion of the distinguishing surface. This new surface is determined or influenced by the curvature of one or more affected regions.

[0066] The structuring of a distinguishing surface can be performed very effectively by immediately removing or displacing the substrate material during the influence process. Further measures may then be unnecessary. The resulting new surface after the influence will then be identical to the distinguishing surface or a portion thereof. However, it is possible to consider further measures such that the new surface after the influence only represents the distinguishing surface or a portion thereof after further measures have been applied.

[0067] The strength of a distinctive surface can be increased by compacting the removed material into the substrate bulk. This can be illustrated by the fact that compaction makes the substrate material in the partitions of the surface to be structured denser and therefore more resilient.

[0068] Alternatively or additionally, it may also be provided that: the distinguishing surface is formed by at least partially removing the substrate material through the said influence, and / or by at least one subsequent etching process, particularly in a wet chemical manner, by means of acid and / or by means of caustic alkali solution, at least partially removing the affected substrate material, wherein, preferably, caustic potassium solution is used as the etching medium.

[0069] The affected substrate material can be removed by an etching process, preferably performed after the aforementioned effects. This allows for the provision of a distinctive surface in a particularly efficient and targeted manner. Therefore, an etching technique and / or etchant can be selected to selectively remove the affected substrate material. For example, the affected substrate material can be completely or partially etched away. On the other hand, the unaffected substrate material remains unchanged. Alternatively, a portion of the unaffected substrate material can also be etched away in certain areas.

[0070] In one embodiment, the etching process includes isotropic etching of the substrate body, particularly isotropic etching of the affected and / or unaffected substrate material.

[0071] In one embodiment, the etching process includes wet etching and / or dry etching of the substrate body, particularly wet etching and / or dry etching of the affected and / or unaffected substrate material.

[0072] Here, the etching process is particularly effective by combining several curved effective regions and their effect on the substrate material. In this way, the substrate material can be affected within several curved effective regions. In this way, the individual curved effective regions can be separated from each other, i.e., not initially connected. For example, the individual effective regions can be arranged parallel to each other and spaced apart in one direction. The regions with affected substrate material can then be removed using the etching process. By continuing etching, the substrate material in the partition between two effective regions, i.e., the unaffected substrate material, can also be removed by the etching process. This allows for the establishment of connections between the individual (etched and exposed) effective regions.

[0073] For example, if multiple effective regions and the resulting effects extend from one side to the other, this can simultaneously cause the substrate body to split into two parts.

[0074] If multiple effective regions and the resulting effects extend from one side to the other, this would only result in, for example, the outer surface of the substrate body being formed, where the effective regions extend or even terminate near the previous substrate edge surface.

[0075] Therefore, since the etching process removes at least the affected substrate material, it is also possible to remove the unaffected substrate material.

[0076] If the aforementioned effects penetrate at least one substrate surface of the substrate body (i.e., if the effects reach at least one substrate surface), the affected substrate material can be etched away from the substrate body, for example, by means of so-called laser selective etching (so-called anisotropic etching). This takes advantage of the fact that, during etching processes, such as particularly wet chemical etching, the affected area of ​​the substrate material is etched away from the substrate material faster than the unaffected area. In the case of unilateral penetration, in addition to uniformly removing the substrate material from all sides of the substrate, cavities (i.e., unilateral openings) are formed in the partition of the affected substrate material because the laser-modified partition is etched away faster than the surrounding substrate material. Furthermore, if the affected area even penetrates two surfaces, particularly surfaces opposite each other, a curved via (“through-hole”) can be formed in this way. Preferably, such a curved via can be used as a base for fabricating inserts through subsequent metallization processes.

[0077] In one embodiment, the curved effective region penetrates at least one of the surfaces of the substrate body, such as the first and / or second top surfaces.

[0078] In a preferred embodiment, the subsequent etching process therefore includes laser active etching of at least the affected substrate material.

[0079] For example, hydrofluoric acid (HF), sodium hydroxide (NaOH), and / or potassium hydroxide solution (KOH) can be used as etching media for laser selective etching.

[0080] Preferably, the etching process is carried out in an acidic and / or alkaline etching medium.

[0081] Preferably, the etching process is performed until those areas where the affected substrate material has been removed are connected.

[0082] Preferably, the etching process is performed until the affected areas are connected.

[0083] As the average processing power and electromagnetic pulse energy (e.g., the pulse energy of the laser used) increase, the resulting effects (e.g., effects produced by the laser or its line focus) no longer entirely or partially involve changes to the density and refractive index of the substrate material, but instead include, for example, the introduction of cavities into the substrate material, preferably manifested outwards on one or more sides. In this case, outward manifestation of the cavity means that the cavity can be accessed from the outside. If the cavity manifests outwards from one side, it can be accessed from one opening. If the cavity manifests outwards from both sides, it can be accessed from both openings.

[0084] In cases where cavities are exposed due to the aforementioned effects, the etching medium can penetrate these cavities and remove substrate material simultaneously from all surfaces of the substrate body during isotropic etching processes, particularly from the surfaces of the formed cavities, thereby increasing the cavity diameter. For example, a potassium hydroxide (KOH)-based etching process is used for this purpose. A key characteristic of the etched substrate surface (such as a glass surface) is that it is formed in the form of a dome-shaped recess.

[0085] For example, cavities in the form of curved holes can be introduced into the substrate material, and then, for example, these cavities are manifested on two sides opposite the outside. Preferably, an etching process is used to widen the curved holes. This can be the same etching process used previously to remove the affected material, and then this process, as part of a continuing etching process, also seamlessly removes the unaffected material. Preferably, the etching process then continues until adjacent cavities are connected to each other.

[0086] In one embodiment, the affected substrate material is at least partially and / or sometimes anisotropically etched.

[0087] In one embodiment, the affected substrate material is isotropically etched at least in certain areas and / or sometimes.

[0088] In one embodiment, the substrate material is affected, and subsequently at least the affected substrate material is anisotropically etched away, thereby forming cavities, particularly vias, within the substrate body. Optionally, further etching may also remove unaffected substrate material between the vias in at least certain areas, thereby connecting the vias to each other in at least certain areas. The surfaces of these connections can then be part of a distinguishing surface.

[0089] Particularly preferably, the distinguishing surface may be highly modulated in at least certain regions. For example, the distinguishing surface may be dome-shaped in at least certain regions. This is achieved by removing (e.g., etching away) the affected substrate material and by removing (e.g., etching away) the unaffected substrate material to expose the distinguishing surface.

[0090] Such height modulation has proven beneficial because it helps increase the strength of the distinguishing surface. Therefore, in embodiments, it is preferred that the distinguishing surface has a hemispherical cap-like structure, such as a hemispherical cap-like recess, in at least some regions.

[0091] In one embodiment, if multiple consecutive areas of substrate material are affected, an etching process is performed until the affected areas are not only opened (i.e., the affected material has been etched away) but also connected. The two substrate portions (e.g., as inner and outer portions) can then be separated from each other as a whole without force.

[0092] Alternatively or additionally, the electromagnetic field may be provided in the form of a curved focal point and / or through a curved focal point, particularly in the form of a laser beam, and / or the effective curved region is determined by the shape of the line focal point.

[0093] Providing an electromagnetic field in the form of a curved focal point is a particularly efficient method. This is because, in particular, line focal points can be formed in a variety of different shapes very easily using lasers.

[0094] A laser beam using its line focus can be guided and controlled along the optical path using known means. The line focus can be adjusted and adapted using various means such as optical elements. Therefore, an electromagnetic field can be generated within the substrate body and can have any spatial shape achievable using beam shaping and beam influence. Accordingly, nonlinear interactions with the substrate material can also be generated in appropriately shaped partitions of the substrate body.

[0095] Therefore, a laser beam with a line focus represents an extremely flexible means of realizing nonlinear interaction between the electromagnetic field and the substrate in a curved effective region, especially for nonlinear absorption.

[0096] When processing a substrate using lasers, a general distinction must be made between linear and nonlinear absorption processes. Linear absorption occurs when the material to be processed exhibits partial or complete absorption of the wavelength of the laser used (e.g., absorption of CO2 laser radiation in glass), and the intensity of the interaction can be adjusted via laser wavelength, energy, pulse duration, etc. In contrast, nonlinear absorption occurs when the material initially shows no absorption in the region of the laser radiation used; that is, the material is transparent to the laser wavelength. However, by generating so-called ultrashort laser pulses (typically in the range of 10 ps to 100 fs, particularly 1 ps to 100 fs), a sufficiently high electromagnetic field is generated in the substrate material. This causes a nonlinear change in the material properties of the substrate or its material (such as refractive index), resulting in a nonlinear change in the material's absorption characteristics. If this threshold is exceeded, the laser beam can have a permanent effect on the material. The resulting localized changes in the material extend from permanent changes in refractive index and alterations in etching behavior (selective laser etching) to the formation of cracks and channels in the substrate. These depend on the interaction between the laser and material parameters and are confined to the region of the laser focus formed in the material.

[0097] For example, the critical strength at which a glass substrate causes a nonlinear change in its material properties is at least 10. 13 W / cm 2 .

[0098] In one embodiment, the substrate material comprises glass and the electromagnetic field strength is at least 10. 13 W / cm 2 Preferably, it should be at least 5×0 13 W / cm 2 Preferably at least 10 14 W / cm 2 The optimal choice is at least 5×0. 14 W / cm 2 Optionally, the electromagnetic field strength can be at most 10. 16 W / cm 2 .

[0099] In one embodiment, the curved effective region corresponds to the region where the laser's line focus causes a nonlinear interaction with the substrate material, wherein the nonlinear interaction preferably includes and / or represents nonlinear absorption, thereby affecting the substrate material.

[0100] Due to the presence of the line focus, an electromagnetic field also exists in the effective region of the curved shape under discussion, thereby causing nonlinear interactions.

[0101] In one embodiment, the nonlinear interaction between the electromagnetic field and the substrate material occurs throughout the entire effective region of the curved shape.

[0102] In one embodiment, the electromagnetic field corresponds to the line focus.

[0103] Alternative or additional land may also be provided, including:

[0104] The laser beam is provided by an ultrashort pulse laser;

[0105] The phase of the laser beam is adjusted and / or adapted, particularly by means of a combination of spatial light modulators, diffractive optical elements and / or several cylindrical lenses;

[0106] The laser beam is focused onto the substrate, preferably by means of a microscope objective or a Fourier lens, wherein, preferably, the focusing is performed after adjusting or adapting the phase of the laser beam and / or forming a line focus.

[0107] The line focal point is the focal point of an accelerating laser beam, especially the line focal point of an Airy beam;

[0108] The laser beam wavelength is 1064 nm; the focal length of the microscope objective or Fourier lens is 10-20 mm; the value of the cubic phase coefficient (laser parameter β) is 0.5 × 10⁻⁶. 3 / m and 5×10 3 The original beam diameter (laser parameter ω0) is between 1 mm and 10 mm, preferably between 2.5 mm and 5 mm; the pulse duration (laser parameter t) is 0.1-10 ps; the pulse energy (laser parameter E) is between 0.1-10 ps. p The value of ) is between 1 μJ and 1,500 μJ, preferably between 30 μJ and 500 μJ, particularly 474 μJ; and / or the value of the pulse train number (laser parameter N) is between 1 and 200, preferably between 1 and 100, particularly between 1 and 8;

[0109] By changing the average power range of the laser and / or by changing the phase, the spatial range of the effective curved region is set and / or changed over time, preferably one of its length and / or its diameter is set and / or changed over time, and in particular, different ranges are set for at least some of the multiple effective curved regions;

[0110] and / or

[0111] By changing the inclination of the optical axis of the laser beam relative to the normal of the substrate surface, especially relative to the inclination of the normal of the substrate surface where the laser beam impacts the substrate body, the spatial orientation of the curved effective region is set and / or changed over time, particularly, different orientations are set for at least some of the multiple curved effective regions.

[0112] The phase of a laser beam can affect the spatial shape of the electromagnetic field at the line focal point, thereby adjusting and adapting the effective curved region. Therefore, spatial light modulators (SLMs), diffractive optical elements, and / or combinations of multiple cylindrical lenses, all of which can adjust the phase of the laser beam, are suitable means of controlling the spatial shape of the electromagnetic field.

[0113] The possible setup for generating the curved effective region according to the invention, and the electromagnetic field corresponding to the spatial shaping for this purpose, can in principle be configured as follows: a laser beam from an ultrashort pulse laser strikes a spatial light modulator (SLM), which alters the phase of the incident laser pulse by imparting a phase (such as a cubic phase). The beam is then focused onto the substrate body to be structured by a microscope objective and / or a Fourier lens. Based on the phase distribution formed downstream of the spatial light modulator, the imaging lens now produces a curved focal line instead of a straight one, which leaves a spatial curvature effect on the substrate material in the substrate body. In one embodiment, the secondary maximum of the Airy beam can also be suppressed. In this case, the intensity ratio (1.2-10) of the principal focal point to the rest of the beam can be optimized. This can be achieved, for example, by means of non-radial symmetric apodization of the aperture in the Fourier plane.

[0114] In a preferred embodiment, instead of using a spatial light modulator to selectively alter the phase distribution, a diffractive optical element (DOE) is used to generate a curved effective region. For example, this has a diameter of 5-15 mm, preferably 9 mm, with the DOE located within the “front focal plane” of the microscope objective or Fourier lens. Preferably, the working distance of the SLM or DOE (i.e., generally, the phase mask) from the corresponding lens is equal to the focal length of the lens and / or between 2 mm and 15 mm, preferably 5 mm. In these cases, if the “front focal plane” of the microscope objective is within the objective itself, a minimum (constructed) distance is preferred. In the SLM, a simulated setup, such as a 2f setup, can be provided. Another embodiment uses a combination of multiple cylindrical lenses to generate the phase in the laser beam, such as, in particular, a cubic phase, instead of using a spatial light modulator or diffractive optical element.

[0115] For example, an Airy beam can be used in the current situation. Airy beams are particularly suitable for asymmetric / lateral beam supply.

[0116] For example, a value of 300 μJ can be chosen as the pulse energy (laser parameter E). p The value of 2 can be selected as the pulse train number (laser parameter N), and / or the value of 5 ps can be selected as the pulse duration (laser parameter t). Optionally, the focal length of the optics can be f = 10 mm, and / or a ×2.0 beam expander can be provided (especially for an input Gaussian beam with a diameter of 10 mm).

[0117] Airy beams can also be generated particularly easily and efficiently. For example, an Airy beam can be obtained as an image of a beam with a cubic phase, which can be generated directly by a phase mask (DOE or SLM) or by a device employing cylindrical lenses.

[0118] In this way, by appropriately selecting the optical setup (in particular determining the vertical distance between the focusing optics and the substrate material to be processed, i.e., the focal point and focal length), it is possible to create an internal curved effective region in the substrate material in a penetrating manner, or also to create one or both of two large surfaces (the base surface and / or the top surface).

[0119] Preferably, in order to generate a line focal point, particularly an accelerating beam, SLM, DOE and / or lens optics are used as a single component or as an array of lenses (such as cylindrical lenses) to impart an appropriate phase function to the laser beam.

[0120] In one embodiment, in the substrate material, curved effective regions are arranged along a closed contour at predetermined distances (i.e., with so-called spacing), for example, between 1 μm and 50 μm, preferably between 1 μm and 10 μm, between 10 μm and 30 μm, between 20 μm and 40 μm, or between 30 μm and 50 μm. Spacing of 1 μm, 20 μm, or 50 μm may be preferred. Here, preferably, the orientation of the modified portion can be controlled by tracking optics (mechanical tracking DOE or phase distribution changed by software) such that a convex distinguishing surface is formed without tilting the inscribed structure or at least at a constant angle. For example, these curved effective regions allow for defining a new outer contour within the substrate body, such as the original glass substrate. Here, optionally, assisted cutting may be used to remove excess material along the desired contour.

[0121] In one embodiment, the beam orientation is tracked at a constant angle relative to the desired profile, preferably mechanically in the DOE and software-tracked in the SLM.

[0122] In one embodiment, the structuring sequence of the surface is controlled to prevent unwanted interactions, such as, in particular, shadows. Beneficial interactions can be created between successive effects, allowing a preferred orientation to be set along the target contour.

[0123] Airy beams have preferred features for providing electromagnetic fields.

[0124] By selecting appropriate laser parameters, the nonlinear interaction can be specifically adjusted in terms of its spatial range and / or intensity.

[0125] Typically, when structuring outward-facing or inward-facing surfaces (inner and / or outer surfaces), the orientation of the laser optics preferably allows for the formation of a convex first curved extension trace, either inward (when the inner surface is structured) or outward (when the outer surface is structured). Furthermore, combinations of inner and outer surfaces are possible using this method, particularly in a single embodiment.

[0126] In the embodiments, the specific shape of the curved effective region or the affected substrate material is determined by or may be determined by the phase imparted by the SLM and / or DOE.

[0127] It has been found that adjusting the spatial range of the effective region of the curved shape and thus the effect on the substrate material by adjusting the average power range of the laser is particularly effective.

[0128] Then, by changing, and in particular increasing, the pulse energy of the laser pulse, the laser power exceeds the threshold of the substrate material in a larger region of the curved focal line. Therefore, the length or influence of the effective curved region can be adjusted.

[0129] For example, by varying the laser pulse by 10 ps within the medium power range of the laser (e.g., power between 1 W and 500 W, preferably between 1 W and 40 W, particularly between 2 W and 10 W, 10 W and 20 W, 20 W and 30 W, or 30 W and 40 W, and / or pulse energy between 1 μJ and 500 μJ, preferably between 30 μJ and 300 μJ), and / or by changing the phase through a spatial light modulator, it is possible to achieve curved effective regions of different lengths and thus different influence lengths in the substrate material, such as glass.

[0130] A curved effective region or influence can be generated, particularly by means of the above-described method, for example, with a length greater than 0.1 mm to greater than 3 mm, preferably between 0.1 mm and 5 mm, particularly between 0.5 mm and 3 mm, and / or its maximum deflection from the linear focal line is 200 μm, preferably between 10 μm and 80 μm, particularly between 20 μm and 80 μm. The curvature extension trace of the influence, and thus ultimately the first curved extension trace of the distinguishing surface, is determined or influenced by a shape theoretically predetermined by the phase function used.

[0131] Therefore, in one embodiment, the length of the effective curved region is adjusted and / or modified in a timely manner by changing the pulse energy of the laser pulse.

[0132] By adjusting the average power of the pulse, the range of the electromagnetic field can be specifically affected, and thus the spatial extent of the effective region of the curved shape. The same applies to phase transitions.

[0133] For example, the higher the power, the longer the length of the curved focal point. Therefore, the power can be used and / or controlled in a targeted manner to adjust the focal point and thus the effective curved area within its spatial range.

[0134] For example, the stronger the cubic phase, the longer and more curved the focal point. Therefore, this phase can be used and / or controlled selectively to adjust the focal point and thus the effective curved area within its spatial range.

[0135] Especially when the substrate material is affected by the laser and not removed, a subsequent etching process is preferred in this embodiment. Here, etching removal and / or etching rate can be enhanced by using multiple pulses within a pulse group (i.e., by means of a so-called pulse train) instead of using individual pulses to perform a separate effect in the curved effective region. Therefore, in this embodiment, it is preferred that an ultrashort pulse laser performs several pulses as a pulse train within a pulse group.

[0136] Therefore, the proposed method enables the production of a substrate having a predetermined (lateral) geometry (thickness) and predetermined surfaces, particularly the lateral surfaces, from a starting substrate such as a glass or glass-ceramic substrate. For this purpose, for example, by means of an ultrashort pulse (UKP) laser within a curved effective region of the predetermined shape, the substrate material of the starting substrate can be affected along the designed surface, and the affected areas of the substrate material can then be selectively etched and thereby removed. In particular, etching can proceed until the regions defined in this way are joined, so that the two parts (e.g., an inner part and an outer part) can subsequently be separated from each other without force.

[0137] Alternatively or additionally, it may also be provided that, at least during the nonlinear interaction, at least one auxiliary substrate body is arranged at the substrate body and the corresponding curved effective region, and / or the line focus extends at least partially into the auxiliary substrate body, wherein, preferably, two or more auxiliary substrate bodies are arranged at the substrate body, particularly on opposite sides of the substrate body, and the corresponding curved effective region and / or line focus extends at least partially into the two or more auxiliary substrate bodies.

[0138] Preferably, the auxiliary substrate body is made of the same material as the substrate body.

[0139] Using such an auxiliary substrate body, when penetrating the effective curved region, the ablation component or effect on the free substrate surface can be avoided or at least significantly reduced.

[0140] For example, in one embodiment, the substrate body to be structured can be processed together with an auxiliary substrate body that is cast, bonded, and / or ultrashort pulse welded, such that only internal effects are initially generated during processing, and these effects are quasi-exposed in further process steps (e.g., which may be described as stripping) by removing the auxiliary substrate body.

[0141] By providing an auxiliary substrate body, the substrate material can be particularly targeted in the region near the surface of the substrate body and according to the specifications of the distinguishing surface. This is because, due to the auxiliary substrate body, the curved effective region can also extend beyond the substrate body without weakening or significantly reducing the extension of the curved effective region. This ensures that even in the region near the surface of the substrate body, the curved effective region does not deviate from the desired shape and ensures that the substrate material can be influenced spatially according to specifications.

[0142] In particular, if the auxiliary substrate body and the substrate body are made of the same material, it ensures that the effective curved area transitions seamlessly and, in particular, without offset, at the interface between the two bodies.

[0143] Following the nonlinear interaction, one or more auxiliary substrate bodies can be removed from the substrate body. In this way, the actual substrate body with the affected substrate material is exposed again.

[0144] In other words, when the auxiliary substrate is removed again after the nonlinear interaction, the pure influence can be achieved in the substrate up to the outer surface of the substrate.

[0145] One or more auxiliary substrates can be provided.

[0146] The one or more auxiliary substrate bodies can surround the substrate body from one or more sides.

[0147] The auxiliary substrate body reliably prevents substrate material from accumulating in the edge regions of the distinguishing surface due to the ablation effect.

[0148] Alternatively or additionally, it may be provided that: in at least one curved effective region, at least one, preferably multiple and / or all of the curved effective regions are completely enclosed within the substrate body, particularly at least during nonlinear interaction;

[0149] Furthermore, preferably, the method further includes: removing material from the substrate body in at least certain regions, particularly along the main extension direction of the curved effective region within the substrate body, such that the substrate material is at least partially affected in the closed curved effective region and / or affected in certain regions accessible from the outside, wherein, in particular, the removal of material from the substrate body is carried out by means of etching.

[0150] Therefore, since the effective curved area is entirely located within the substrate body, ablation components or effects on the original and acquired surfaces of the substrate body can be reliably avoided.

[0151] Utilizing the proposed feature, the nonlinear interaction occurs only between the electromagnetic field and the substrate material located within the substrate bulk and therefore inaccessible from the outside. As a result, the extended traces of the curved effective region are not weakened or significantly weakened. This ensures that the curved effective region does not deviate from the desired shape and ensures spatial influence on the substrate material according to specifications.

[0152] Following nonlinear interactions, substrate material can be removed from the substrate body up to (or even beyond) the affected substrate material. For example, corresponding etching processes have proven advantageous for this purpose because they can be performed precisely and efficiently. In this way, a new surface, distinct from the distinguishing surface, can be formed, for example, at least a new, at least temporary, top surface of the substrate body. By removing the substrate material, the affected material region becomes accessible from the outside. This makes it possible, for example, to subsequently remove the affected substrate material to form the distinguishing surface as described elsewhere.

[0153] In this way, a very reliably defined region of affected material can be obtained in the substrate, extending all the way to the surface of the substrate body after final processing. This, in turn, also allows for the achievement of a clean, distinguishable surface.

[0154] For example, by removing material from the substrate body, at least one, preferably two, top surfaces of the substrate body are altered. Here, it can be said that the top surfaces can be displaced, for example, along the main extension direction of the curved effective region.

[0155] For example, the main extension direction of the curved effective region may extend perpendicular to the original and / or modified top surface of the substrate body.

[0156] Alternative or additional land may also be provided, including:

[0157] The substrate material is successively, wholly, or partially exposed to the electromagnetic field in parallel in each of the multiple curved effective regions;

[0158] The entire substrate material within the curved effective region is simultaneously exposed to the electromagnetic field;

[0159] The maximum deflection of each effective region of the curve from the straight progression is greater than 20 μm, greater than 40 μm, greater than 60 μm, greater than 80 μm, or greater than 100 μm;

[0160] and / or

[0161] The lengths of the effective curved regions are greater than 0.1 mm, greater than 0.3 mm, greater than 0.5 mm, greater than 0.7 mm, greater than 1 mm, greater than 3 mm, or greater than 5 mm, respectively.

[0162] If the substrate material is successively exposed to an electromagnetic field at each effective curved region, thereby affecting the substrate material sequentially in each region, then structuring can be fabricated or implemented with minimal technical work. If the electromagnetic field is subsequently provided, for example, by means of a laser line focus, then only a single laser is required. Through the relative movement of the substrate body and the line focus, line focuses can then be easily formed sequentially in different effective curved regions, and the substrate material at those locations can be affected.

[0163] If the substrate material is simultaneously exposed to an electromagnetic field in several curved effective regions (or even in all of these regions), the influence on the substrate material can be performed very efficiently in time, thus enabling the preparation or execution of structuring in a shortened time. Therefore, several lasers can form parallel line focal points at different locations on the substrate material, thereby influencing the substrate material in parallel across several curved effective regions.

[0164] Furthermore, once the influence on the substrate material is completed within the corresponding curved effective region, the substrate body can then be moved relative to multiple line focal points. In this way, the substrate material can be affected sequentially and in parallel at several points. This achieves a particularly efficient structuring method. Specifically, this process is suitable for larger substrates or broader structuring processes. For broader tasks, for example, by adding more lasers, several curved effective regions can be formed in parallel, each laser creating more line focal points within the substrate material.

[0165] In the case of lasers, the line focal point is formed within the substrate material, thus defining the curved effective region. That is, the region within the substrate material where the line focal point induces an electromagnetic field is the curved effective region. Specifically, a portion of the electromagnetic field interacts nonlinearly with the substrate material.

[0166] Of course, it is conceivable that the line focus also exists partly outside the substrate body, for example, in a medium at least partially surrounding the substrate body, such as a fluid (e.g., air or liquid), and / or in an auxiliary substrate body. However, despite this, an electromagnetic field still exists inside the substrate body, such that the curved effective region can be defined within the substrate body even if the curved effective region continues in other media.

[0167] Due to the flexibility of this process, effective curved regions with individually suitable curvatures and / or lengths can be formed. Therefore, the curvature or length can be smaller or larger, depending on how the designed surface is structured.

[0168] Preferably, the curved effective region is formed in three dimensions within the substrate body. Preferably, the curved effective region has a primary extension direction within the substrate body. A central axis may pass through the curved effective region and may itself have a curved extension trace. The length of this central axis corresponds to the length of the curved effective region. This central axis has a start point and an end point in the substrate material. Preferably, the start point and end point are respectively disposed on the surface of the substrate body, for example, on the intersecting surface of the substrate body and the curved effective region. The maximum deflection of the curved effective region is the maximum distance between a point on the central axis and a point on the straight line connecting the start and end points of the central axis.

[0169] The spatial shape of the effective curved region and the spatial shape of the substrate material affected therefrom, i.e. the configuration of the distinguishing surface, depends on or can be determined by the maximum deflection, which can also be called the profile stroke.

[0170] To adjust the maximum deflection or profile travel, the aperture value A = n*sin(α) of the focusing optics can be set and / or adjusted. Generally, the larger the aperture value of the selected focusing optics, the shorter the length of the resulting focal point, and in the example of an Airy beam, the higher the curvature of the Airy beam near the focal point.

[0171] For curved effective regions or distinguishing surfaces, this means that as the substrate thickness decreases, the local curvature must be increased in order to produce a considerable profile travel at the distinguishing surface.

[0172] Accordingly, this process can be used for the processing / structuring of thin substrate bodies. This is especially true for the structuring of their side surfaces.

[0173] The substrate thickness of the thin substrate body is preferably less than 500 μm, less than 300 μm, or less than 100 μm, and more preferably in the range of 30 μm to 100 μm. Optionally, the substrate thickness of the thin substrate body is more than 0.1 μm, more than 1 μm, more than 10 μm, more than 50 μm, or more than 100 μm.

[0174] While substrates with a thickness greater than 1 mm can be mechanically clamped and their side surfaces polished using conventional methods, this is generally not possible for thin substrates due to (mechanical) instability and the risk that the thin substrate may be damaged by cracks extending inward from the side surfaces during polishing due to the applied mechanical stress.

[0175] This method is unique in being able to structure even the surface of a thin substrate for the first time, particularly thin substrates with a thickness of less than 500 μm, especially without applying force, and therefore without the risk of damaging or adversely affecting the substrate. In particular, these surfaces are the side surfaces of the substrate, preferably the peripheral surfaces.

[0176] In one embodiment, the aperture value of the optics used for focusing the laser is adjusted according to the thickness of the substrate material so that the side surface of the substrate body with a thickness of less than 500 μm and / or a thickness of more than 0.1 μm can preferably be structured into a distinctive surface.

[0177] In one embodiment, the distinguishing surface may have an adjustable slope. Optionally, this is achieved by means of an offset and / or tilted, particularly vertically offset or tilted, Airy beam.

[0178] Here, preferably, an Airy beam is used, with its beam center moving parallel to the optical axis / perpendicular to a substrate surface such as a glass surface (at zero angle) and symmetrically distributed around the center of the substrate (along the propagation direction / substrate thickness). That is, the beam reaches its maximum deflection precisely at that point (the focal position). In the case of a deflected (non-tilted) Airy beam, the focal point (and the point of maximum deflection) is offset from the center of the substrate (along the substrate thickness). In the case of a tilted Airy beam, the optical axis (as the trajectory of the beam center) is not parallel to the normal to the substrate surface.

[0179] In one embodiment, the existing surface of the substrate body, particularly the side surface, is chamfered, especially multiple times.

[0180] In one embodiment, the laser beam is an Airy beam.

[0181] In one embodiment, the combination of the inner and outer surfaces is structured, preferably used as a glass hinge for use in flexible mobile devices. This is understood to represent a structured, primarily strip-shaped glass substrate with a maximum thickness of 200 μm, preferably less than 100 μm, and particularly preferably 20 μm; the glass substrate consists of a central structured region extending between two opposite edges of the substrate and two adjacent unstructured regions. The recesses in the structured regions formed according to this method allow for reproducible bending about a bending axis perpendicular to the orientation of the glass strip.

[0182] Alternative or additional land may also be provided, including:

[0183] (i) The substrate body is transparent, made of glass, and includes a first top surface, and / or includes a second top surface, the second top surface preferably extending parallel to the first top surface and / or arranged opposite to the first top surface;

[0184] (ii) Preferably, the thickness of the substrate body measured between the first and second top surfaces is 500 μm or less, preferably 400 μm or less, more preferably 300 μm or less, more preferably 200 μm or less, more preferably 100 μm or less, more preferably 70 μm or less, more preferably 50 μm or less, more preferably 30 μm or less, and most preferably 10 μm or less.

[0185] and / or

[0186] (iii) After structuring the distinctive surface:

[0187] 1. The distinguishing surface extends between the first and second top surfaces;

[0188] 2. The distinguishing surface is connected to the first top surface and / or the second top surface in at least some areas;

[0189] 3. At least a portion of at least one side surface, preferably at least a portion of the peripheral side surface, of the substrate body includes a distinguishing surface;

[0190] 4. Preferably, at least a portion of the surface of the via extending from the first top surface to the second top surface includes a distinguishing surface, and preferably, the via is formed by influencing and / or etching the substrate material;

[0191] 5. At least one surface region of the cavity of the substrate body includes a distinguishing surface, wherein the cavity is preferably accessible from the outside or completely enclosed in the substrate material, and wherein, preferably, the cavity is formed by influencing and / or etching the substrate material;

[0192] 6. The distinguishing surface represents, at least in certain areas, the inward-facing surface of the substrate body;

[0193] and / or

[0194] 7. The distinguishing surface is, at least in some areas, the outward-facing surface of the substrate body.

[0195] Existing methods can only achieve insufficient results in terms of the efficiency and strength of the shaped surface, especially for transparent substrates. Using this method, the surface of the transparent substrate body can be reliably structured.

[0196] The first and second top surfaces can reliably influence the substrate material because the top surfaces clearly define the substrate bulk.

[0197] In one embodiment, the first and / or second top surfaces are planar.

[0198] In one embodiment, the substrate body is cubic in shape.

[0199] In one embodiment, the substrate body is transparent and includes a first top surface, a second top surface, and a peripheral surface that curves along the thickness direction of the substrate body in at least certain regions.

[0200] This method is particularly suitable for structuring the surface of thin substrates (i.e., substrates with small thickness). It is also particularly suitable for structuring surfaces that extend along the thickness of the substrate, such as the side surfaces, preferably the peripheral surfaces, of the substrate.

[0201] For example, a cubic substrate body can have a small thickness. Then, its side surfaces, or even a portion thereof, can also be structured using this method, although the substrate body may only have a small dimension corresponding to a small thickness in one direction. Optionally, the side surfaces are circumferential surfaces.

[0202] In this application, when the thickness of the substrate material is less than 500 μm and / or more than 10 μm, the substrate body is preferably considered to be thin or has a small thickness.

[0203] When a distinguishing surface is attached to at least one of the top surfaces, a particularly seamless transition can be created between the existing and structured surfaces. This results in a very stable substrate body.

[0204] For example, the side surfaces of the substrate body, such as peripheral surfaces, can be structured (i.e., formed) using this method. Then, the distinguishing surface is a part of the peripheral surface.

[0205] This method can be used in a particularly diverse manner. For example, when the curved effective region extends from one surface region (e.g., the top surface) to another surface region (e.g., to another top surface), and thus correspondingly extends into the affected substrate material, a through-hole can be formed from one top surface to another top surface (generally, a surface region) by structuring the distinguishing surface. For example, when the curved effective region extends from one surface region (e.g., one surface region) of one top surface into the substrate material without extending into another surface of the substrate body (e.g., another top surface of the substrate body), and thus the affected material also correspondingly extends from one surface region into the substrate material, a cavity can be formed in one surface (generally, the top surface) by structuring the distinguishing surface. If the affected substrate material does not extend to the outside, then a completely closed cavity can even be formed in the substrate body by structuring the distinguishing surface.

[0206] Apart from cases involving enclosed cavities, the affected material can optionally be removed directly by means of influence and / or, for example, by a subsequent etching process.

[0207] For example, this method can be used to cut circular openings from a thin cubic substrate body by structuring a distinguishing surface that has a circular profile in at least one cross-section located in a thickness partition of the substrate body.

[0208] For example, this method can be used to structure the outer surface of a thin, cubic substrate body, for example, by forming it into a convex or concave shape.

[0209] In one embodiment, structuring a distinctive surface includes protruding the outer surface of a substrate body, particularly a thin, cubic substrate body.

[0210] Alternative or additional land may also be provided, including:

[0211] After the distinguishing surface is structured, the first curved extension trace of the distinguishing surface extends perpendicular to the main extension direction of the distinguishing surface;

[0212] and / or

[0213] In the main extension direction of the distinguishing surface, particularly in the circumferential direction of the substrate body, the distinguishing surface includes a second curved extension trace in at least certain regions.

[0214] If the side surface of a circular or cubic substrate body is structured and thus represents a distinguishing surface, this side surface can have a curvature along the thickness of the substrate body, wherein this curvature is determined, or co-determined, by the curvature of the effective curved region in at least some areas. This forms a first curved extension trace. And the first curved extension trace extends perpendicular to the principal extension direction of the side surface of the substrate body, which, for example, represents a peripheral surface.

[0215] In the case of a circular substrate body, the side surface also extends in a curved shape around the substrate body accordingly, which here represents a second curved extension trace.

[0216] In one embodiment, by rotating the line focus by 180°, preferably about at least one axis extending in particular parallel to the main extension direction of the line focus, a concave or convex first curved extension trace can be provided in at least some areas.

[0217] Alternative or additional land may also be provided, including:

[0218] After the distinguishing surface is structured in at least one cross-section of the substrate body, the distinguishing surface has a profile along a first curved extension trace, the profile being:

[0219] (i) It is at least segmented into a convex or concave curved shape;

[0220] (ii) The outline of the effective region of the curved shape corresponds at least segmentally;

[0221] and / or

[0222] (iii) It includes at least a parabolic extension trace, a quartic extension trace, a logarithmic extension trace, an extension trace based on an nth-degree polynomial function, and / or a C-shaped shape, where n is preferably an even number, particularly n = 6, n = 8, n = 10 or n = 12.

[0223] By adjusting the corresponding phase, the line focus can take on various shapes, thereby forming various three-dimensional effective regions and influencing the substrate material within them. For example, the substrate material can be affected in several adjacent effective regions to subsequently obtain a distinguishing surface as a new side surface of the structured substrate body. Here, the curved effective region can be selected such that, after structuring, the curvature protrudes into the substrate material of the desired substrate body to obtain a concave distinguishing surface. Alternatively, the curved effective region can be quasi-rotated by 180 degrees to obtain a convex distinguishing surface.

[0224] This makes it particularly easy to use this method to structure distinctive surfaces of different shapes.

[0225] Depending on the subsequent application, different properties of the convex curved top / side surface can be advantageous: for example, a parabolic / cubic phase makes the top / side surface approximate the C-shaped cut commonly used in the glass industry, while a fourth-order phase function corresponds to a top / side surface chamfered to the top and bottom sides (rather than a top / side surface with a continuous curved shape). Various asymmetric top / side surface shapes can also be achieved by tilting the beam axis and / or shifting the focus relative to the substrate body. For example, such a top / side surface is used when autocentering effects become relevant in applications involving the substrate body.

[0226] Similarly, the top / side surfaces of thicker glass in certain sections can be processed in multiple passes.

[0227] According to the second aspect, the object of the present invention is achieved by providing a substrate body,

[0228] The substrate body includes: at least one first top surface and at least one distinguishing surface, particularly a distinguishing surface made or fabricable by the method according to the first aspect of the invention.

[0229] The distinguishing surface includes at least one first curved extension trace in at least certain regions;

[0230] The first curved extension trace is located in the cross-section of the substrate body, and a plane with at least one normal vector of the distinguishing surface and the normal vector of the top surface crosses the cross-section.

[0231] The first curved extension trace can be described, at least in certain regions, by parabolic, quartic, logarithmic, and / or polynomial phase functions; and

[0232] The thickness of the substrate body is less than 500 μm.

[0233] For the first time, a substrate body is provided that, despite its small thickness, has a surface, namely a distinguishing surface, which is structured with curved curves in cross-section.

[0234] This is currently impossible, especially for the surface representing the side surface of the substrate body.

[0235] This is because substrates with a thickness of less than 500 μm exhibit a tendency to bend under their own weight when clamped. This behavior is very similar to that of a sheet of paper. Therefore, such substrates are also called microsheets.

[0236] Because of this behavior, the thin substrate body, which was previously unable to be mechanically clamped to allow for, for example, the conventionally necessary polishing measures to be performed on the machined surface. Since the method according to the invention already provides a high-quality, distinctive surface, polishing measures are not required.

[0237] Electromagnetic fields can also be formed within very thin substrates, and the substrate material can be affected accordingly. This means that even very thin substrates with highly sensitive, structured, distinctive surfaces can be reliably provided. Therefore, microplates are the optimal choice.

[0238] Preferably, the substrate thickness of the substrate body is less than 400 μm, less than 300 μm, less than 200 μm, less than 100 μm, less than 50 μm, less than 20 μm, or less than 10 μm.

[0239] Preferably, the substrate thickness of the substrate body is 1 μm or more, 10 μm or more, 50 μm or more, or 100 μm or more.

[0240] In one embodiment, the narrow side of the substrate body has a C-shaped sphere.

[0241] In one embodiment, the curvature of the narrow edge of the substrate extends in at least one direction and / or in certain regions in a parabolic, polynomial, or logarithmic shape, and / or is predetermined by the intensity distribution of the fourth beam.

[0242] In one embodiment, the substrate body includes at least one modified portion internally, wherein preferably, in the substrate material, the modified portion is a spatially confined variation in density and / or refractive index, a cavity, a crack, and / or a via, preferably having a shaped external / internal curve and / or cone angle. Optionally, the modified portion may be internally confined by curves of various types (such as non-curved or curved). Furthermore, the modified portion may penetrate at least one, two, or not penetrate the top surface of the substrate body.

[0243] In one embodiment, the surface roughness Ra of the distinguishing surface is less than or equal to 5 μm, preferably less than or equal to 2 μm, and more preferably less than or equal to 1 μm. For example, this roughness is the average roughness, preferably measured according to ISO 25178:2016.

[0244] In one embodiment, the distinguishing surface includes a groove structure.

[0245] In one embodiment, the substrate body includes two or more layers and curved side surfaces. Optionally, the substrate body may be integrally machined with functional components.

[0246] In one embodiment, the substrate body is made of or includes glass, glass-ceramic, silicon, or sapphire.

[0247] In one embodiment, there is no accumulation of substrate material in the edge region of the distinguishing surface of the substrate body.

[0248] Alternatively or additionally, the distinguishing surface may also have a strength of at least 100 MPa, preferably at least 150 MPa, and more preferably at least 200 MPa.

[0249] Preferably, the distinguishing surface has been etched in whole or in part, particularly with hydrofluoric acid, sodium hydroxide, caustic alkali solutions such as potassium hydroxide, and / or acids.

[0250] The high strength of the distinguishing surface enables the substrate to resist external influences acting on it, such as mechanical stress. This is a significant advantage, especially for thin substrates, as they can remain stable in this way.

[0251] The method according to the invention provides such a distinctive surface. This is because damage that occurs in conventional methods, such as microcracks, does not appear in the proposed method, especially since these known methods are not even applicable to substrates of the thickness considered herein.

[0252] If the distinguishing surface has been etched entirely or partially, the strength can be further increased.

[0253] Alternatively or additionally, the distinguishing surface may be highly modulated in at least certain areas, particularly having a wavy and / or dome-shaped structure, preferably highly modulated along and / or perpendicular to the main extension direction of the distinguishing surface.

[0254] High modulation can enhance the strength of the distinguishing surface. As a result, the substrate body is more resistant to external influences acting on the distinguishing surface, such as mechanical stress. This is a significant advantage, especially for thin substrate bodies, as they can remain additionally stable in this way.

[0255] Until now, it has been impossible to safely and reliably provide such high modulation, especially for the side surfaces of thin substrates. Due to the mechanical instability of thin substrates, the necessary processes, such as grinding, are generally not feasible on such substrates. Using the proposed method, it is now even possible to structure very thin substrates, particularly their side surfaces, thereby enabling high modulation.

[0256] In this way, high profiles can be achieved particularly easily and reliably, for example, by influencing the substrate material in multiple curved effective regions. When the substrate material in the curved effective regions has been removed, for example by influencing itself or by a subsequent etching process, the individual cavities in the substrate body can be connected to each other by subsequent etching, for example by etching away the unaffected substrate material between the cavities. In this way, characteristic wavy structures can be achieved along the main extension direction of the distinguishing surface.

[0257] Preferably, the main extension direction of the distinguishing surface extends perpendicular to the main extension direction of the effective curved area.

[0258] Alternative or additional land may also be provided, including:

[0259] (i) The substrate body is transparent, made of glass, and / or includes a second top surface, which preferably extends parallel to the first top surface and / or is arranged opposite to the first top surface;

[0260] (ii) Preferably, the thickness of the substrate body measured between the first and second top surfaces is 500 μm or less, preferably 400 μm or less, more preferably 300 μm or less, more preferably 200 μm or less, more preferably 100 μm or less, more preferably 70 μm or less, more preferably 50 μm or less, more preferably 30 μm or less, and most preferably 10 μm or less.

[0261] and / or

[0262] (iii)

[0263] 1. The distinguishing surface extends between the first and second top surfaces;

[0264] 2. The distinguishing surface is connected to the first top surface and / or the second top surface in at least some areas;

[0265] 3. At least a portion of at least one side surface of the substrate body, preferably at least a portion of the peripheral side surface, includes a distinguishing surface;

[0266] 4. Preferably, at least a portion of the surface of the via extending from the first top surface to the second top surface includes a distinguishing surface, and wherein, preferably, the via is formed by influencing and / or etching the substrate material;

[0267] 5. At least one surface region of the cavity of the substrate body includes a distinguishing surface, wherein the cavity is preferably accessible from the outside or completely enclosed in the substrate material, and wherein, preferably, the cavity is formed by influencing and / or etching the substrate material;

[0268] 6. The distinguishing surface represents, at least in certain areas, the inward-facing surface of the substrate body;

[0269] and / or

[0270] 7. The distinguishing surface represents, at least in some areas, the outward-facing surface of the substrate body.

[0271] Alternative or additional land may also be provided, including:

[0272] The first curved extension trace of the distinguishing surface extends perpendicular to the main extension direction of the distinguishing surface;

[0273] and / or

[0274] In the main extension direction of the distinguishing surface, particularly in the circumferential direction of the substrate body, the distinguishing surface includes a second curved extension trace in at least certain regions.

[0275] Alternative or additional land may also be provided, including:

[0276] In at least one cross-section of the substrate body, the distinctive surface extension trace has a profile that follows a first curved curve:

[0277] (i) It is at least segmented into a convex or concave curved shape;

[0278] (ii) It corresponds at least segmentally to the effective region of the curved shape;

[0279] and / or

[0280] (iii) It has at least piecewise parabolic extension traces, quartic extension traces, logarithmic extension traces, extension traces based on an nth-degree polynomial function, and / or C-shaped extension traces, wherein n is preferably an even number, particularly n = 6, n = 8, n = 10 or n = 12.

[0281] These features have already been described in the corresponding features of the first aspect of the invention. The above description, with necessary modifications, also applies here. Therefore, reference can be made to the description given there.

[0282] According to the third aspect, the object of the present invention is achieved by providing a substrate body, preferably, according to the second aspect of the present invention.

[0283] The substrate body has at least one spatial modification portion of its substrate material in at least certain regions, such as a refractive index modification portion, a density modification portion, and / or a cavity.

[0284] The modified portion has a curved shape in at least certain regions of the cross-section of the substrate body;

[0285] Preferably, the modified portion extends from the first top surface of the substrate body into the substrate material, particularly extending and / or extending to the second top surface of the substrate body, wherein the second top surface is preferably arranged to extend opposite to and / or parallel to the first top surface; and

[0286] Preferably, the thickness of the substrate body is less than 500 μm, and the thickness is particularly measured between the first and second top surfaces of the substrate body.

[0287] For the first time, a substrate body is provided that, although its thickness is small, may also include a corresponding modified portion with a curved shape structured in the cross-section.

[0288] This is currently impossible, especially for such a thin substrate. Here, conventionally, the same problem arises as with the second aspect of the invention described above.

[0289] Electromagnetic fields can also be formed within a very thin substrate and can consequently affect the substrate material. Therefore, even very sensitive, and thus very thin, substrates can have such modification sections. Microplates are therefore the optimal choice.

[0290] For example, the modified portion can be a modification of the refractive index and / or density of the substrate material. The modified portion can also be a cavity in the substrate material.

[0291] Preferably, the substrate thickness of the substrate body is less than 400 μm, less than 300 μm, less than 200 μm, less than 100 μm, less than 50 μm, or less than 10 μm.

[0292] Preferably, the substrate thickness of the substrate body is 0.1 μm or more, 1 μm or more, 10 μm or more, 50 μm or more, or 100 μm or more.

[0293] In one embodiment, the substrate body is made of or includes glass, glass-ceramic, silicon, or sapphire.

[0294] Alternative or additional sites may also be provided as follows:

[0295] The maximum deflection of the extended trace from the modified part is greater than 20 μm, greater than 40 μm, greater than 60 μm, greater than 80 μm, or greater than 100 μm;

[0296] and / or

[0297] The lengths of the modified sections are greater than 0.1 mm, greater than 0.3 mm, greater than 0.5 mm, greater than 0.7 mm, greater than 1 mm, greater than 3 mm, or greater than 5 mm, respectively.

[0298] These features have been described in accordance with the corresponding features of the first aspect of the invention. In principle, their interpretation applies herein. Therefore, reference can be made to the above explanation. Attached Figure Description

[0299] Other features and advantages of the invention will become apparent from the following description, in which preferred embodiments of the invention are explained with reference to schematic diagrams.

[0300] In the attached diagram:

[0301] Figure 1 A top view of the first substrate body is shown;

[0302] Figure 2 A first cross-sectional view of the first substrate body is shown;

[0303] Figure 3 A second cross-sectional view of the first substrate body is shown;

[0304] Figure 4a A top view of a first substrate body having the affected substrate material is shown;

[0305] Figure 4b A side view of a first substrate body having the affected substrate material is shown;

[0306] Figure 5Different extended traces on the side surface of the first substrate body in the cross-section of the first cross-sectional view after the etching process are shown;

[0307] Figure 6a The first substrate body in the cross-section is shown in the first cross-sectional view after the etching process;

[0308] Figure 6b The first substrate body in the cross-section is shown in the second cross-sectional view after the etching process;

[0309] Figure 7a A top view of the second substrate body is shown;

[0310] Figure 7b A cross-sectional view of the second substrate body is shown;

[0311] Figure 8a A top view of the third substrate body is shown;

[0312] Figure 8b A cross-sectional view of the third substrate body is shown;

[0313] Figure 9 The effect of the focal length of the focusing optics on the laser beam is shown;

[0314] Figure 10 Line focal points with different laser powers are shown;

[0315] Figure 11 Different line focal points are shown in the substrate body;

[0316] Figures 12a-12c The line focus for different phase functions is shown;

[0317] Figure 13 The optical setup for the 2f configuration is shown;

[0318] Figure 14 The grayscale value encoding representation of the phase shift is shown;

[0319] Figure 15 A top view of the processed substrate body is shown;

[0320] Figure 16 A top view of the processed substrate body is shown;

[0321] Figure 17 It shows Figure 16 A substrate body with introduced modified parts;

[0322] Figure 18a A cross-sectional view of a substrate body with a closed curved effective region is shown;

[0323] Figure 18bA cross-sectional view of a substrate body having a material-modified section accessible from the outside is shown; and

[0324] Figure 18c A cross-sectional view of the structured substrate body is shown. Detailed Implementation

[0325] Example

[0326] Figure 1 A top view of a cubic transparent substrate body 1 is shown. The substrate body 1 is made of glass, that is, the substrate material is made of glass.

[0327] make Figure 1 The side surface 3 of the substrate body 1 on the right is structured. That is, a new shape is given to the side surface 3.

[0328] Figure 2 A cross-sectional view of the substrate body 1 is shown, wherein the cross-section extends parallel to the first top surface 5 of the substrate body 1.

[0329] To structure the previously unstructured side surface 3, the substrate material of the substrate body 1 is uniformly exposed to an electromagnetic field within multiple curved effective regions 7a-7c, causing a corresponding nonlinear interaction between the substrate material and the electromagnetic field. Due to this nonlinear interaction, the substrate material is affected within the curved effective regions 7a-7c. This effect is accompanied by a change in the refractive index of the substrate material.

[0330] Here, the electromagnetic field refers to the electromagnetic field of the laser's focal points, which are formed respectively within the substrate material. By moving the focal points relative to the substrate body 1, laser focal points are sequentially formed in different regions of the substrate material. That is, the substrate material is affected sequentially within the curved effective regions 7a, 7b, and 7c.

[0331] Here, the electromagnetic field at the line focal point corresponds precisely to each of the effective regions of the curved shape. Furthermore, each effective region of the curved shape corresponds to a region with the affected substrate material.

[0332] The laser beam can be propagated through a spatial light modulator, and the line focal point is also bent according to the applied phase, thereby shaping the corresponding curved effective region.

[0333] The effective regions of each curved shape are set at a certain distance from each other. Figure 2 In the cross section, the intersecting surfaces of the curved effective regions 7a-7c and the centroid of the cross section (not shown) extend along a straight line parallel to the edge 9 of the side surface 3.

[0334] Figure 3 Another cross-sectional view of the substrate body 1 is shown, wherein the cross-section extends perpendicularly to the first top surface 5 of the substrate body 1 and is in line with... Figure 2 The cross-sectional views intersect at the intersection line S, indicated by the dashed line. See also Figure 3 The effective curved area 7b is crescent-shaped. Figure 3 Other curved effective regions, not shown, have the same shape in their corresponding parallel cross-sections.

[0335] if Figure 2 and Figure 3 As the corresponding cross-sections are moved parallel to each other, the shape of their intersection surface with the effective curved region will also change, depending on the three-dimensional shape of the effective curved region. The spatial shape of the effective curved region can be adjusted by the phase of the line focus.

[0336] See further Figure 3 The curved effective regions 7a-7c intersect with the first top surface 5, the second top surface 11, and the side surface 3 to be structured of the substrate body 1, respectively. Therefore, the affected substrate material can be approached from the outside at the corresponding intersecting surfaces of the substrate body 1 and the curved effective regions 7a-7c.

[0337] Figure 4a A top view of the substrate body 1 is shown, in which the curved effective regions 7a-7c and their intersecting surfaces with the first top surface 5 can be seen from the figure. Figure 4b The substrate body 1 and the side surface 3 to be structured are shown from the side, wherein the curved effective regions 7a-7c and their intersecting surfaces with the side surface 3 can also be seen from the figure.

[0338] Next, the affected substrate material is removed by selective laser etching. For this purpose, the substrate body 1 is at least partially exposed to the etching medium.

[0339] The affected and unaffected substrate materials are etched away from the substrate body 1 by laser selective etching. However, the etch rate of the affected substrate material is much faster than that of the unaffected substrate material.

[0340] Figure 5 It shows the difference from the previous Figure 2 The same figure is shown, but in a cross-section after the etching process, representing substrate body 1. If the etching process only removes the affected substrate material, the curve of the structured substrate body will follow the solid line in... Figure 5 It extends within the cross-section. The effective curved region 7a-7c is in Figure 5 A circular curve 13 is formed in the cross-section of the substrate material.

[0341] However, because the etching process also removes unaffected material, the substrate material 15 between the effective curved regions and in the edge regions is also partially etched away. Therefore, in particular, the ribs between regions containing affected material are removed. Furthermore, for the same reason, the circular curve 13 is also shifted into the substrate material as a whole, as shown by the slightly offset extended trace of the dashed line.

[0342] Therefore, after structuring, the previously unstructured side surface 3 of the substrate body 1 has Figure 5 The dashed curve in the cross-section.

[0343] Figure 6a exist Figure 2 In the cross section and Figure 6b exist Figure 3 The curve of the structured surface 17 is shown in the cross-section, and for comparison purposes, the curve of the original unstructured surface 3 is represented by a dashed line. The height of the structured surface 17 is modulated and includes dome-shaped structures corresponding to dome-shaped recesses in certain regions.

[0344] The structured surface 17 is formed by etching away both affected and unaffected substrate material. In the context of this invention, the structured surface 17 is a distinguishing surface.

[0345] The structured surface 17 is connected to the first and second top surfaces 5 and 11 in at least certain areas. The structured surface 17 is the outer surface.

[0346] Figure 6b The curved extension trace of the structured side surface 17 shown is convex and corresponds to the first curved extension trace. The first curved extension trace is influenced by the shape of the curved effective region 7b. Therefore, although the etching process here also removes portions of the unaffected substrate material, the basic extension trace of the right-side structured side surface 17 of the substrate body 1 is jointly determined in certain regions by the curved shape of the corresponding curved effective region applied here, in this case, the curved effective region 7b. Because the curved effective regions 7a-7c contribute to the structuring of the surface at multiple points, the structured surface 17 has the same first curved extension trace in multiple regions. This is because in multiple regions, the extension trace of the structured surface 17 is determined or influenced by the curved shape of the curved effective regions 7a-7c. In other words, the first curved extension trace is achieved through multiple curved effective regions in multiple regions of the structured or distinguishing surface 17.

[0347] exist Figure 3 and Figure 6b In the substrate body 1, the first and second top surfaces 5 and 11 extend parallel to each other and are 500 μm apart.

[0348] If the effective curved region 7a-7c is rotated 180° around an axis perpendicular to the first top surface 5, then the first curved extension trace will... Figure 6b It has a concave shape in its cross-section.

[0349] When the curved effective regions 7a-7c are positioned away from surface 3 and oriented toward the center of substrate body 1, substrate body 1 can be divided into two parts. At the dividing surface, when the corresponding steps are performed as described above, the remaining substrate body includes a structured surface, such as structured surface 17.

[0350] Figure 7a A top view of the substrate body 1' is shown. Figure 7b A cross-sectional view of the substrate body 1' is shown, wherein the cross-section extends perpendicularly to the first top surface 5' of the substrate body 1' and is in line with... Figure 7a The cross-sectional views intersect at the intersection line S', indicated by dashed lines. Within the substrate body 1', the substrate material is affected only within a single curved effective region 7'. The curved effective region 7' ​​extends from the first top surface 5' along the direction of the second top surface 11'. As the affected material is etched away, cavities can be created within the substrate body 1'. The surfaces of the cavities are structured surfaces and therefore distinguishing surfaces, followed by the inner surfaces.

[0351] Figure 8a A top view of substrate body 1” is shown. Figure 8b A cross-sectional view of the substrate body 1” is shown, wherein the cross-section extends perpendicularly to the first top surface 5” of the substrate body 1” and is in line with... Figure 8a The cross-sectional views intersect at the intersection line S”, indicated by dashed lines. In the substrate body 1”, the substrate material is affected only within a single curved effective region 7”. The curved effective region 7” extends from the first top surface 5” to the second top surface 11”. When the affected material is etched away, vias, i.e., through holes, can be created in the substrate body 1”. The surface of the via is a structured surface and therefore a distinguishing surface, followed by the inner surface.

[0352] The effect of focal length on focusing optics

[0353] Figure 9 The effect of the focal length of the focusing optics on the Airy laser beam is shown. For a constant...

[0354] -cubic phase (β = 3) 1 / 3 ×10 3 / m);

[0355] -Laser wavelength (λ=1.030×10 -6 m); and

[0356] - Beam diameter (original beam diameter w0 = 5 × 10)-3 m)

[0357] As the focal length increases, the length of the focal area (relatively defined: decreases to 1 / e of the maximum value) 2 )Increase( Figure 9 (The solid curve in the image), and the angles between the upper and lower ends of the focal point and the optical axis are reduced ( Figure 9 (The dashed curve in the image). Therefore, the left ordinate refers to the solid line, and the right ordinate refers to the dashed line.

[0358] The effect of laser power on the line focal point

[0359] Figure 10 The diagram shows the material regions in a glass substrate affected by line focal points of different laser powers. Because the laser power increases from top to bottom, the corresponding effective area of ​​the curved region and the area of ​​affected material also increase.

[0360] The effect of the tilt and offset of the line focus

[0361] Offset refers to the distance from the vertex of the focal region to the center of the substrate. Tilt refers to the angle between the surface normal and the tangent at the vertex.

[0362] For a centrally located, untilted Airy beam, the vertex of the normal along the substrate surface in the focal region is located at the center of the substrate body, i.e., the center of its thickness extension, and the surface normal is parallel to the tangent of the vertex.

[0363] Figure 11 Various line focal points 23a-23e of a laser beam that are at least partially formed in the substrate body 21 are shown. Figure 11 The cross-section shows the thickness partition of the substrate body 21.

[0364] Line focus 23a represents the line focus, specifically the line focus of a centered and untilted Airy beam. Line focus 23a includes the vertex 25 of the parabolic focal region 23a.

[0365] Line focus 23b shows the line focus, in particular the line focus of the offset Airy beam.

[0366] Line focus 23c depicts the line focus, particularly the line focus of tilted and deflected Airy beams.

[0367] Line focal point 23d represents a line focal point, specifically a line focal point that differs from the Airy beam and has a function of variable curvature. For example, curvature can describe the C-distribution plot.

[0368] Line focal point 23e represents a line focal point, particularly the line focal point of an Airy beam or other function, which modifies the upper part of the substrate material 1 in the first partition 27a and the lower part of the substrate material 1 in the second partition 27b.

[0369] In addition, Figure 11 In the diagram, the length of each of the line focal points 23a-23e can be determined as the length of the curved extension trace shown, particularly within the substrate body 1. A line 29 is also shown connecting the line focal points 23a, passing through the end of the line focal point 23a within the substrate body 21. This can be understood here as a straight focal line, and the maximum deflection from the straight focal line is exactly equal to the distance between the connecting line 29 and the vertex 25.

[0370] Phase function

[0371] Various exemplary phase functions that can be applied to a laser beam and thereby form a curved effective region in the substrate material are shown in the table below:

[0372]

[0373] The above parameters are described in the publication Froehly, L., Courvoisier, F., Mathis, A., Jacquot, M., Furfaro, L., Giust, R., ... & Dudley, JM (2011), "Arbitrary accelerating micron-scale caustic beams in two and three dimensions", Optics Express, 19(17), 16455–16465.

[0374] Figures 12a-12c Exemplary line focal points for different phase functions are shown. The horizontal axis is in millimeters (mm). The vertical axis is in millimeters (mm). Figure 12a A laser beam including a line focal point with a parabolic acceleration profile is shown. Figure 12b A laser beam including a line focal point with four acceleration distribution plots is shown. Figure 12c A laser beam with a line focal point exhibiting a logarithmic acceleration distribution is shown. Different curved effective regions can be achieved through the corresponding line focal points, thereby influencing the substrate material in the corresponding spatial regions.

[0375] The entire theoretical extension trace of the line focus, based on the phase function, is shown as dashed lines. The line focus itself forms only along the segment (slightly offset to allow identification of the theoretical extension trace). Nonlinear interactions occur only where the line focus is formed. Therefore, it is fundamentally possible to understand how to obtain externally accessible or completely enclosed cavities by using the line focus.

[0376] Other aspects

[0377] Figure 13 An optical setup in configuration 2f is shown, which can be preferably used in the method according to the invention. Here, a phase distribution is applied to an incident laser beam 35 having a beam diameter 36 by a phase mask 33 and imaged into a substrate 1 by a downstream focusing optics 31 to form a curved focal point 23 within the substrate 1, wherein the downstream focusing optics 31 is located at a distance from the phase mask 33 where the input-side focal length 37 corresponds to the output-side focal length 39.

[0378] Figure 14 An exemplary grayscale encoding map of the phase shift applied to the laser beam 35 via a phase mask 33 is shown, which can preferably be implemented in the form of an SLM (spatial light modulator) or a DOE (diffractive optical element). Thus, the laser focus acquires its curvature 23. Here, phase values ​​from 0 to 2π are represented by grayscale values ​​from 0 to 255. The phase distribution exists in a cross-section perpendicular to the principal propagation direction of the laser beam.

[0379] Figure 15 A top view of a substrate body structured according to the method of the present invention is shown. Specifically, the normal vector of the distinguishing surface is... Figure 15 Extending in the drawing. Therefore, particularly advantageously, see the first curved extension trace of the distinguishing surface. Figure 15 .

[0380] Here, the laser beam used for structuring is parallel to Figure 15 The diagram extends as shown by the arrow.

[0381] The following general parameters and laser parameters were set to enable the differentiation of the surface structure:

[0382] - Microscope objectives and / or Fourier lenses with a focal length of f = 10 mm;

[0383] - Wavelength is 1030nm;

[0384] - The beam diameter is 5.3 mm;

[0385] -cubic phase This is equivalent to for x and y (mm), Where β = 3 1 / 3 mm -1 ;

[0386] -Pulse duration t = 5 ps;

[0387] -Number of pulse trains N = 2;

[0388] - Each string has an energy of 228 μJ; and

[0389] - Spacing is 10μm.

[0390] Figure 16 A top view of a substrate body structured according to the method of the present invention is shown. Specifically, the normal vector of the distinguishing surface is... Figure 16 Extending in the drawing. Therefore, particularly advantageously, see the first curved extension trace of the distinguishing surface. Figure 16 .

[0391] The laser beam used for structuring is parallel to Figure 16 The diagram extends as shown by the arrow.

[0392] The following general parameters and laser parameters were set to enable the differentiation of the surface structure:

[0393] - Substrate materials with a thickness in the range of 900-1000 μm, such as BF33;

[0394] - Spacing is 40μm;

[0395] - Microscope objectives and / or Fourier lenses with a focal length of f = 10 mm;

[0396] -×2.0 beam expander (for a 10mm diameter Gaussian input beam);

[0397] -Pulse duration t = 5 ps;

[0398] -Number of pulse trains N = 2;

[0399] - Each string has an energy of 300 μJ; and

[0400] - Wavelength is 1030nm;

[0401] -cubic phase This is equivalent to for x and y (mm), Where β = 3 1 / 3 mm -1 .

[0402] In this case, by choosing a sufficiently large spacing, the interaction between adjacent regions in the substrate can be avoided or at least greatly reduced.

[0403] Figure 17 This is a left-side top view of the substrate taken with a transmission light microscope after laser treatment and before etching (the view here is parallel to the laser propagation direction). Here, the lateral features of the modified areas are visible, with multiple modified areas visible at each of three selected different depths in the substrate. The corresponding depth markers are shown in... Figure 17 The right side of.

[0404] When introducing the modified sections, a sufficiently large spacing is chosen so that the extensions of the laterally inclined / arrow-shaped modified sections overlap to a minimum. This ensures that the propagation within the material is not disturbed or is only slightly disturbed by the previously modified sections.

[0405] Therefore, the zigzag pattern is generated by a modified portion extending laterally near the focal point, while the modified portion continues to lie on a straight line / line. Furthermore, the apex of the curved effective region remains at the center between the two top surfaces, and the curved effective region is completely formed within the substrate material.

[0406] Other embodiments

[0407] Figure 18a A rectangular substrate body 41 is shown in a cross-sectional view. Within the substrate body 41, the substrate material is exposed to an electromagnetic field in a curved effective region 43, such that in the corresponding region, the substrate material is modified by nonlinear absorption caused by the nonlinear interaction between the electromagnetic field and the substrate material.

[0408] The curved effective region 43 and the modified part introduced are completely enclosed within the substrate body 41.

[0409] Therefore, according to an embodiment of the invention, it is assumed that material is removed from the substrate body, for example, by etching. This can be accomplished along the main extension direction H of the curved effective region 43, where in this case, the main extension direction H extends perpendicular to the two top surfaces 45. In other words, material is removed from the two top surfaces 45 of the substrate body 41. The new top surfaces 45 of the substrate body are thus quasi-displaced along the main extension direction H, see [link to relevant documentation]. Figure 18b .from Figure 18b It can also be seen that, since the affected portion of the substrate material is now located at the top surface 45, the affected substrate material 43 in the closed curved effective region 43 can be accessed from the outside by removing the substrate material.

[0410] Because the interaction occurs entirely within the substrate body 41 ( Figure 18a Therefore, the curved effective region 43 and / or the substrate material 43 affected therein have extended traces that are not affected by surface effects (e.g., top surface 45).

[0411] Due to the accessibility of the modified substrate material 43 ( Figure 18b The substrate body 41 can then be further processed, as previously described, to structure the distinguishing surface 47, such as... Figure 18c As shown. For example, for this purpose, the affected material 43 is removed by etching.

[0412] The features disclosed in the foregoing description, claims and drawings are essential to the various embodiments of the invention, both individually and in any combination.

[0413] List of reference numerals

[0414] 1,1',1” Substrate body

[0415] 3 Side surfaces

[0416] 5,5',5” Top surface

[0417] 7a-7c Curved Effective Area

[0418] 7',7” Curved effective area

[0419] 9. Edge

[0420] 11,11',11” Top surface

[0421] 13 curves

[0422] 15 Substrate Materials

[0423] 17 Surface

[0424] 21 Substrate Body

[0425] 23a-23e line focal point

[0426] 25 Vertex

[0427] Areas 27a and 27b

[0428] 29 Connections

[0429] 31 Imaging Optical Devices

[0430] 33 Phase Mask

[0431] 35 laser beams

[0432] 36 Laser beam diameter

[0433] 37 Input side focal length

[0434] 39 Output side focal length

[0435] 41 Substrate

[0436] 43. Effective area of ​​curved shape

[0437] 45 Top surface

[0438] 47 Surface

[0439] H Main extension direction

[0440] Intersection lines of S, S', and S”

Claims

1. A method for preparing and / or implementing the structuring of a predetermined or predeterminable distinguishing surface of a substrate body, said substrate body comprising a substrate material, in, The method includes: The substrate material in at least one curved effective region is exposed to an electromagnetic field, thereby inducing a nonlinear interaction between the electromagnetic field and the substrate material in each of the at least one curved effective region, and thus affecting the substrate material in the curved effective region at least in part; wherein affecting the substrate material includes: increasing or decreasing one or more material properties of the substrate material in at least some regions, the material properties including refractive index, etching rate and density; Wherein, after structuring the distinguishing surface, the distinguishing surface includes at least one first curved extension trace in at least certain regions, the first curved extension trace being at least partially determined and / or influenced by the curved shape of the at least one effective curved region; and The nonlinear interaction causes at least one nonlinear absorption of the electromagnetic field in the substrate material. The electromagnetic field is provided in the form of a curved focal point of the laser beam, and / or the effective region of the curved field is determined by the shape of the curved focal point; In this configuration, at least one curved effective region penetrates two opposing surfaces to form a curved through-hole.

2. The method according to claim 1, wherein, This exposes the substrate material to the electromagnetic field in multiple curved effective regions. in, (i) The distinguishing surface has the same first curved extension trace in several regions and / or has the first curved extension trace at each location; and / or (ii) The curved effective regions are selected to be arranged at a certain distance from each other, wherein, in the cross-section of the substrate body, the center or centroid of the intersecting surface of the curved effective regions and the cross-section extends along a straight line or along any desired curve, and / or the distance between successive effective regions is between 30% and 100% or between 100% and 200% of the maximum proportion of the curved effective regions in the cross-section.

3. The method according to claim 2, wherein, (i) The first curved extension trace is determined or influenced by the curved shape of the plurality of effective curved regions; and / or (ii) The center or centroid of the intersecting surface of the effective curved region and the cross section extends along a circle.

4. The method according to any one of claims 1-3, in, Affecting the substrate material includes: at least partially removing and / or displacing the substrate material from the effective region of the curved shape.

5. The method according to claim 4, wherein, Influencing the substrate material includes: compacting the substrate material into the surrounding substrate material.

6. The method according to any one of claims 1-3, in, The distinctive surface is formed by influencing the removal of at least part of the substrate material.

7. The method of claim 4, wherein the distinctive surface is formed by at least partially removing at least the affected substrate material through at least one subsequent etching process.

8. The method according to claim 7, wherein, The subsequent etching process removes at least part of the affected substrate material in a wet chemical manner, by means of acid and / or by means of caustic alkali solutions.

9. The method according to claim 8, wherein, A caustic potassium solution was used as the etching medium.

10. The method according to any one of claims 1-3, in, The laser beam is provided by an ultrashort pulse laser; The phase of the laser beam is adjusted and / or adapted. The laser beam is focused onto the substrate body, wherein the focusing and / or the formation of the curved focal point are performed after adjusting or adapting the phase of the laser beam; Wherein, the curve focus is the curve focus of the accelerating laser beam; The wavelength of the laser beam is 1064 nm; the value of the cubic phase coefficient β is 0.5 × 10⁻⁶. 3 / m and 5×10 3 Between / m; the diameter of the original beam The value of 0 is between 1 mm and 10 mm; the pulse duration t is 0.1-10 ps; the pulse energy E p The value is between 1 µJ and 1500 µJ; and / or the value of the pulse train number N is between 1 and 200; The spatial range of the effective curved region is set and / or changed over time by altering the average power range of the laser and / or by changing the phase of the laser beam. and / or Specifically, the spatial orientation of the effective curved region is set and / or changed over time by altering the inclination of the laser beam's optical axis relative to the normal of the substrate surface.

11. The method according to claim 10, in, The phase of the laser beam is adjusted and / or adapted by means of a combination of a spatial light modulator, a diffractive optical element and / or several cylindrical lenses; The laser beam is focused onto the substrate using a microscope objective or a Fourier lens; The curve focus is the curve focus of the Airy beam; The focal length of the microscope objective or the Fourier lens is 10-20 mm; the diameter of the original beam... The value of 0 is between 2.5 mm and 5 mm; pulse energy E p The value is between 30 µJ and 500 µJ; and / or the value of the pulse train number N is between 1 and 100; By changing the average power range of the laser and / or by changing the phase of the laser beam, setting and / or changing the length and / or a diameter of the curved effective region over time, different ranges are set for at least some of the multiple curved effective regions; and / or Specifically, by changing the inclination of the optical axis of the laser beam relative to the normal of the laser beam impacting the substrate surface, the spatial orientation of the curved effective region is set and / or changed over time, and different orientations are set for at least some of the multiple curved effective regions.

12. The method according to claim 10, in, Pulse energy E p The value is 474 µJ; and / or the value of the pulse train number N is between 1 and 8.

13. The method according to any one of claims 1-3, in, At least during the nonlinear interaction, at least one auxiliary substrate body is disposed at the substrate body, and the corresponding effective curved region and / or the curve focus extends at least partially into the auxiliary substrate body.

14. The method according to claim 13, wherein, Two or more auxiliary substrate bodies are arranged on the substrate body, and the corresponding curved effective area and / or the curve focus extends at least partially into the two or more auxiliary substrate bodies.

15. The method according to claim 13, wherein, Two or more auxiliary substrate bodies are arranged on opposite sides of the substrate body, and the corresponding curved effective area and / or the curve focus extends at least partially into the two or more auxiliary substrate bodies.

16. The method according to any one of claims 1-3, in, In the at least one curved effective region, at least one of the curved effective regions is completely enclosed within the substrate body; Furthermore, the method further includes: removing material from the substrate body in at least certain areas such that the substrate material is at least partially affected in the closed curved effective area and / or affected in certain areas accessible from the outside.

17. The method according to claim 16, wherein, Multiple of the aforementioned curved effective regions are completely enclosed within the substrate body at least during the nonlinear interaction process; Furthermore, the method further includes removing material along the main extension direction of the curved effective region within the substrate body.

18. The method according to claim 16, wherein, All of the aforementioned curved effective regions are completely enclosed within the substrate body at least during the nonlinear interaction process; Furthermore, the removal of material from the substrate body is carried out by means of etching.

19. The method according to any one of claims 1-3, in, The substrate material is successively, wholly, or partially exposed to the electromagnetic field in parallel in each of the plurality of curved effective regions; In this case, the entire substrate material within the effective curved region is simultaneously exposed to the electromagnetic field; Among them, the maximum deflection of each effective curved region from the straight extended trace is greater than 20 μm; and / or The length of the effective curved region is greater than 0.1 mm.

20. The method according to claim 19, wherein, Each of the aforementioned effective curved regions exhibits a maximum deflection from the straight extended trace greater than 40 μm; and / or The length of the effective curved region is greater than 0.3 mm.

21. The method according to claim 19, wherein, Each of the aforementioned effective curved regions exhibits a maximum deflection from the straight extended trace greater than 60 μm; and / or The length of the effective curved region is greater than 0.5 mm.

22. The method according to claim 19, wherein, Each of the aforementioned effective curved regions exhibits a maximum deflection of greater than 80 μm from the extended straight trace, and / or The length of the effective curved region is greater than 0.7 mm.

23. The method according to claim 19, wherein, Each of the aforementioned effective curved regions exhibits a maximum deflection from the straight extended trace greater than 100 μm; and / or The length of the effective curved region is greater than 1 mm.

24. The method according to claim 19, wherein, The length of the effective curved region is greater than 3 mm.

25. The method according to claim 19, wherein, The length of the effective curved region is greater than 5 mm.

26. The method according to any one of claims 1-3, wherein, (i) The substrate body is transparent, made of glass, and includes a first top surface and a second top surface, the second top surface extending parallel to the first top surface and / or arranged opposite to the first top surface; (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 500 μm; and / or (iii) After structuring the distinguishing surface, (1.) The distinguishing surface extends between the first top surface and the second top surface; (2.) The distinguishing surface is connected to the first top surface and / or the second top surface in at least some areas; (3.) At least a portion of at least one side surface of the substrate body includes the distinguishing surface; (4.) At least a portion of the surface of the via extending from the first top surface to the second top surface includes the distinguishing surface, and the via is formed by influencing the substrate material; (5.) At least one surface region of the cavity of the substrate body includes the distinguishing surface; (6.) The distinguishing surface represents, at least in certain regions, the inward-facing surface of the substrate body; and / or (7.) The distinguishing surface is, at least in some regions, the outward-facing surface of the substrate body.

27. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first and second top surfaces, is less than 400 μm; and / or (iii) After structuring the distinguishing surface, (3.) At least a portion of at least one peripheral surface of the substrate body includes the distinguishing surface; (4.) The via is formed by etching the substrate material; and / or (5.) At least one surface region of the cavity of the substrate body includes the distinguishing surface, the cavity being accessible from the outside or completely enclosed in the substrate material, and wherein the cavity is formed by influencing the substrate material.

28. The method according to claim 27, wherein, (5.) The cavity is formed by etching the substrate material.

29. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 300 μm.

30. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 200 μm.

31. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 100 μm.

32. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 70 μm.

33. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 50 μm.

34. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 30 μm.

35. The method according to claim 26, wherein, (ii) The thickness of the substrate body, measured between the first top surface and the second top surface, is less than 10 μm.

36. The method according to any one of claims 1-3, in, After the distinguishing surface is structured, the first curved extension trace of the distinguishing surface extends perpendicular to the main extension direction of the distinguishing surface; and / or Wherein, in the main extension direction of the distinguishing surface, the distinguishing surface includes at least some regions a second curved extension trace.

37. The method according to claim 36, wherein, In the circumferential direction of the substrate body, the distinguishing surface includes a second curved extension trace in at least certain regions.

38. The method according to any one of claims 1-3, in, After the distinguishing surface is structured in at least one cross-section of the substrate body, the distinguishing surface has a profile along the first curved extension trace, the profile being: (i) It is at least segmented and has a convex or concave curved shape; (ii) The contours of the effective region of the curved shape are at least segmented; and / or (iii) It includes at least a parabolic extended trace, a quartic extended trace, a logarithmic extended trace, an extended trace according to an nth-degree polynomial function, and / or a C-shaped shape, where n is an even number.

39. The method according to claim 38, wherein, (iii) Based on the extended trace of the nth degree polynomial function, where n=6, n=8, n=10 or n=12.

40. A substrate body, include: At least one first top surface and at least one distinguishing surface made or producible by the method according to any one of claims 1-39. The distinguishing surface includes at least one first curved extension trace in at least certain regions; Wherein, the first curved extension trace is located in the cross-section of the substrate body, and a plane having at least one normal vector of the distinguishing surface and the normal vector of the at least one first top surface crosses the cross-section; Wherein, the first curved extension trace can be described, at least in certain regions, by a parabolic, quartic, logarithmic, and / or polynomial phase function; and The thickness of the substrate body is less than 500 μm.

41. The substrate body according to claim 40, in, The strength of the distinguishing surface is at least 100 MPa; and The distinguishing surface has been etched in whole or in part.

42. The substrate body according to claim 41, wherein, The strength of the distinguishing surface is at least 150 MPa; and The distinguishing surface has been etched, in whole or in part, with a caustic alkali solution and / or an acid.

43. The substrate body according to claim 41, wherein, The strength of the distinguishing surface is at least 200 MPa; and The distinguishing surface has been etched, in whole or in part, with a caustic alkali solution and / or an acid.

44. The substrate body according to claim 42 or 43, wherein, The acid is hydrofluoric acid, and the caustic alkali solution includes sodium hydroxide and potassium hydroxide.

45. The substrate body according to any one of claims 40-43, in, The distinguishing surface is highly modulated in at least certain regions.

46. ​​The substrate body according to any one of claims 40-43, wherein, The distinguishing surface is highly modulated in at least certain regions to achieve a wavy and / or dome-shaped structure.

47. The substrate body according to any one of claims 40-43, wherein, The distinguishing surface is highly modulated in at least certain regions along its main extension direction and / or perpendicular to it.

48. The substrate body according to any one of claims 40-43, in, The substrate body has at least one spatially modified portion of its substrate material in at least certain regions; The modified portion has a curved profile in at least certain regions of the cross-section of the substrate body; The modified portion extends from a first top surface of the substrate body into the substrate material, wherein the second top surface is arranged to extend opposite to and / or parallel to the first top surface; The thickness is measured between the first top surface and the second top surface of the substrate body; Wherein, the maximum deflection of the straight extension trace of the modified part is greater than 20 μm; and / or The length of each modified part is greater than 0.1 mm.

49. The substrate body according to claim 48, wherein, The modified part includes a refractive index modified part, a density modified part, and / or a cavity; The modified portion extends from the first top surface of the substrate body, in a direction toward the second top surface of the substrate body, and / or extends to the second top surface of the substrate body. Wherein, the maximum deflection of the modified part from the straight extended trace is greater than 40 μm; and / or The length of the modified part is greater than 0.3 mm.

50. The substrate body according to claim 48, wherein, The modified portion exhibits a maximum deflection of greater than 60 μm from the straight extended trace; and / or The length of each modified part is greater than 0.5 mm.

51. The substrate body according to claim 48, wherein, The modified portion exhibits a maximum deflection of greater than 80 μm from the straight extended trace; and / or The length of the modified part is greater than 0.7 mm.

52. The substrate body according to claim 48, wherein, The modified portion deflects a maximum of 100 μm from the straight extended trace; and / or The length of each modified part is greater than 1 mm.

53. The substrate body according to claim 48, wherein, The length of each modified part is greater than 3 mm.

54. The substrate body according to claim 48, wherein, The length of each modified part is greater than 5 mm.

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