An antenna transceiving structure and an antenna transceiving assembly
By introducing a metal heat dissipation layer and heat dissipation holes into the antenna transceiver structure, the problem of poor heat dissipation performance was solved, and efficient heat dissipation and improved reliability of the chip were achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG JIDI TECH CO LTD
- Filing Date
- 2021-10-29
- Publication Date
- 2026-06-23
AI Technical Summary
The poor heat dissipation performance of existing antenna transceiver structures leads to problems with reliability and short lifespan.
The structure is designed with a multi-functional chip, a signal transmission layer, a heat dissipation layer and an antenna. The heat dissipation layer includes a metal heat dissipation layer and heat dissipation holes. The signal transmission channel enables signal transmission between the chip and the antenna, and the metal heat dissipation layer is used for real-time heat dissipation.
The heat dissipation of the antenna transceiver structure has been improved, enhancing the reliability and lifespan of the multi-functional chip and ensuring the heat dissipation requirements of the chip when operating at high power.
Smart Images
Figure CN114204243B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of antenna technology, and in particular to an antenna transceiver structure and an antenna transceiver assembly. Background Technology
[0002] Currently, the development of mobile communication devices has driven the explosive growth of their internal components, such as antennas. Existing technologies typically integrate antenna transceiver structures based on PCB boards and chips. However, because the PCB board substrate is an insulating layer composed of polymer synthetic resin and reinforcing materials, its thermal conductivity is extremely low, making it difficult to effectively dissipate heat from the PCB. This leads to reduced efficiency and lifespan of heat-generating components, and low reliability of the antenna transceiver structure. To solve this technical problem, the basic approach is to place numerous metal vias under the heat dissipation device. However, the copper walls of these vias are thin, and the transmission path is relatively long. Therefore, this heat dissipation method is not very efficient in high-density multilayer circuit designs. Summary of the Invention
[0003] The present invention aims to solve the technical problem of poor heat dissipation performance of antenna transceiver structures in the prior art, which leads to poor reliability and short lifespan.
[0004] To address the aforementioned technical problems, this application discloses an antenna transceiver structure, which includes a multi-functional chip, a signal transmission layer, a heat dissipation layer, and an antenna.
[0005] The first surface of the signal transmission layer is provided with the multifunctional chip; the multifunctional chip is used to process the received radio frequency signals;
[0006] The signal transmission layer contains the heat dissipation layer and the signal transmission channel. The heat dissipation layer is connected to the multifunctional chip and includes a metal heat dissipation layer.
[0007] One end of the signal transmission channel is connected to the multi-functional chip, and the other end of the signal transmission channel is connected to the antenna;
[0008] The antenna is located on the second surface of the signal transmission layer, which is opposite to the first surface. The antenna is used to transmit signals with the multifunctional chip through the signal transmission channel.
[0009] Optionally, the heat dissipation layer may also include heat dissipation holes;
[0010] The heat dissipation hole has a metal layer on its interior and upper and lower surfaces;
[0011] The lower surface of the heat dissipation hole is connected to the metal heat dissipation layer through the metal layer;
[0012] The upper surface of the heat dissipation hole is connected to the multifunctional chip through the metal layer.
[0013] Optionally, the number of these multi-functional chips can be multiple;
[0014] The metal heat dissipation layer includes multiple spaced metal heat dissipation areas, and the number of these metal heat dissipation areas is greater than or equal to the number of the multifunctional chips.
[0015] Optionally, the thickness of the metal heat dissipation layer ranges from 0.5 to 3 mm.
[0016] Optionally, the material of the metal heat dissipation layer includes copper;
[0017] The material of the metal layer includes copper;
[0018] The signal transmission layer is a multi-layer PCB board.
[0019] Optionally, the signal transmission layer includes a second structural layer and a first structural layer stacked together;
[0020] The multifunctional chip is located on the top of the first structural layer; and a metal heat dissipation layer is provided in a preset area of the first structural layer; the preset area is close to the bottom of the first structural layer; the width of the first structural layer is smaller than the width of the second structural layer.
[0021] The antenna is located at the bottom of the second structural layer; and the metal heat dissipation layer is located at the top of the second structural layer; the width of the metal heat dissipation layer is greater than the width of the first structural layer and less than or equal to the width of the second structural layer.
[0022] Optionally, a power combining network may also be included;
[0023] This multi-functional chip is a receiver multi-functional chip;
[0024] The power combining network is located within the signal transmission layer and is used to combine multiple received radio frequency signal beams into a single radio frequency signal beam to be output. Each of the multiple radio frequency signal beams is output by a corresponding receiver multifunction chip.
[0025] Optionally, a power splitting network may also be included;
[0026] This multi-functional chip is a transmitter multi-functional chip;
[0027] The power divider network is located within the signal transmission layer and is used to divide the received initial radio frequency signal beam into multiple radio frequency signal beams, thereby enabling a single radio frequency signal from the multiple radio frequency signal beams to be transmitted to a corresponding transmitter multifunction chip.
[0028] In another aspect, this application also discloses an antenna transceiver assembly, which includes a mounting structure and the aforementioned antenna transceiver structure;
[0029] The mounting structure is connected to the top of the antenna transceiver structure;
[0030] The mounting structure has a recessed area in the middle, which is connected to the antenna transceiver structure to form a receiving cavity, and the multi-functional chip is located in the receiving cavity.
[0031] Optional, thermal grease may also be included;
[0032] The mounting structure is connected to the antenna transceiver structure via the thermally conductive silicone grease.
[0033] Optionally, the mounting structure can be made of metal.
[0034] By adopting the above technical solution, the antenna transceiver structure provided in this application has the following beneficial effects:
[0035] The antenna transceiver structure includes a multi-functional chip, a signal transmission layer, a heat dissipation layer, and an antenna. The multi-functional chip is disposed on a first surface of the signal transmission layer, and this chip processes received radio frequency signals. The heat dissipation layer and a signal transmission channel are disposed within the signal transmission layer. The heat dissipation layer, which includes a metal heat dissipation layer, is connected to the multi-functional chip. One end of the signal transmission channel is connected to the multi-functional chip, and the other end is connected to the antenna. The antenna is located on a second surface of the signal transmission layer, opposite to the first surface, and is used to transmit signals to the multi-functional chip through the signal transmission channel. Because the antenna transceiver structure provided in this application has a metal heat dissipation layer, the overall heat dissipation of the structure can be greatly improved, thereby improving the reliability and lifespan of the multi-functional chip. Attached Figure Description
[0036] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0037] Figure 1 This is a side view of an optional antenna transceiver structure according to this application;
[0038] Figure 2 This is a schematic diagram of an optional heat dissipation layer according to this application;
[0039] Figure 3 This is a layout diagram of a multi-functional chip for an optional antenna transceiver structure according to this application;
[0040] Figure 4 This is a layout diagram of a multi-functional chip for another optional antenna transceiver structure in this application;
[0041] Figure 5This is a side view of another optional antenna transceiver structure of this application;
[0042] Figure 6 This is a schematic diagram of the radio frequency signal processing of an optional antenna transceiver structure according to this application;
[0043] Figure 7 This is a schematic diagram of the radio frequency signal processing of another optional antenna transceiver structure in this application;
[0044] Figure 8 This is a side view of an optional antenna transceiver assembly according to this application.
[0045] The following is supplementary explanation of the attached figures:
[0046] 1-Signal transmission layer; 11-First structural layer; 111-First side; 112-Second side; 12-Second structural layer; 121-Third side; 122-Fourth side; 2-Multifunctional chip; 3-Heat dissipation layer; 31-Metal heat dissipation layer; 311-Metal heat dissipation area; 32-Heat dissipation hole; 4-Signal transmission channel; 5-Antenna; 6-Ground hole; 7-Mounting structure; 71-Groove area; 8-Thermal grease. Detailed Implementation
[0047] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0048] The term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. In the description of this application, it should be understood that the terms "upper," "lower," "top," "bottom," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. Moreover, the terms "first," "second," etc., are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein.
[0049] See Figure 1 , Figure 1 This is a side view of an optional antenna transceiver structure according to this application. One aspect of this application discloses an antenna transceiver structure including a multi-functional chip 2, a signal transmission layer 1, a heat dissipation layer 3, and an antenna 5. The multi-functional chip 2 is disposed on the first surface of the signal transmission layer 1. The multi-functional chip 2 is used to process received radio frequency signals. The heat dissipation layer 3 and a signal transmission channel 4 are disposed within the signal transmission layer 1. The heat dissipation layer 3 is connected to the multi-functional chip 2 and includes a metal heat dissipation layer 31. One end of the signal transmission channel 4 is connected to the multi-functional chip 2, and the other end of the signal transmission channel 4 is connected to the antenna 5. The antenna 5 is located on the second surface of the signal transmission layer 1, opposite to the first surface, and is used to transmit signals with the multi-functional chip 2 through the signal transmission channel 4. Because the antenna transceiver structure provided by this application has a metal heat dissipation layer 31, the chip can be cooled in real time, avoiding overheating and solving the problem of insufficient heat dissipation inside traditional low-profile high-density transceiver (TR) components. This allows for truly high-power operation of the chip and high-power signal transmission.
[0050] To further improve the heat dissipation effect of the heat dissipation layer 3, in some feasible embodiments, see [reference needed]. Figure 2 , Figure 2This is a schematic diagram of an optional heat dissipation layer 3 according to this application. The heat dissipation layer 3 also includes heat dissipation holes 32; the interior and upper and lower surfaces of the heat dissipation holes 32 are provided with metal layers; the lower surface of the heat dissipation holes 32 is connected to the metal heat dissipation layer 31 through the metal layer; the upper surface of the heat dissipation holes 32 is connected to the multifunctional chip 2 through the metal layer, thereby reducing the heat dissipation path between the multifunctional chip 2 and the metal heat dissipation layer 31 and improving heat dissipation efficiency.
[0051] If the signal transmission layer 1 only has heat dissipation holes 32 that penetrate the signal transmission layer 1, the heat dissipation efficiency is not high in high-density multilayer circuit designs because the metal layers inside the heat dissipation holes 32 and the upper and lower surfaces are relatively thin and the transmission path is relatively long. However, based on the above-described embodiments of this application, heat dissipation is mainly based on the metal heat dissipation layer 31, and the heat dissipation holes 32 are only used as auxiliary heat dissipation structures. This not only avoids the problem of poor heat dissipation efficiency caused by the long transmission path of the heat dissipation holes 32, but also helps to conduct the heat of the multifunctional chip 2 to the metal heat dissipation layer 31, thus improving the heat dissipation effect.
[0052] Optional, see below Figure 2 The heat dissipation hole 32 can be multiple or one; in order to further improve the heat dissipation effect, when there are multiple multi-function chips 2, each multi-function chip 2 corresponds to a set of heat dissipation holes 32, and each set of heat dissipation holes 32 includes multiple heat dissipation holes 32.
[0053] In some feasible embodiments, the thickness of the metal heat dissipation layer 31 ranges from 0.5 to 3 mm, thereby improving the heat dissipation effect while effectively ensuring the overall structural quality is not high.
[0054] In some feasible embodiments, the material of the metal heat dissipation layer 31 includes copper; copper has advantages such as high thermal conductivity and fast heat conduction speed, which can quickly transfer heat to other areas and rapidly equalize the heat. The material of the metal layer includes copper; the signal transmission layer 1 is a printed circuit board (PCB). Of course, the materials of the metal heat dissipation layer 31 and the metal layer can also include silver, aluminum, and gold, etc.
[0055] In order to improve the application range of the antenna 5 receiving structure, ensure heat dissipation, and reduce costs, some feasible embodiments are described in [reference needed]. Figure 2 The number of the multi-functional chips 2 is multiple, and the metal heat dissipation layer 31 includes multiple spaced metal heat dissipation areas 211, the number of which is greater than or equal to the number of the multi-functional chips 2.
[0056] Optional, see below Figure 3 and Figure 4 , Figure 3This is a layout diagram of a multi-functional chip 2 with an optional antenna transceiver structure according to this application; Figure 4 This diagram shows the arrangement of the multi-functional chip 2, which represents another optional antenna transceiver structure of this application. The number of these multi-functional chips 2 can be 8, 16, or 2. n There are 1, n is an integer greater than or equal to 5, and the number of channels contained in each multi-function chip 2 can be selected as needed. Optionally, the multi-function chip 2 is an 8-channel chip.
[0057] Optionally, the signal transmission layer 1 may also be provided with a ground hole 6 as needed, and the number of antennas 5 may be set as needed, such as 2, 4, 8, etc., which are not limited here.
[0058] To further improve heat dissipation, optional, please refer to... Figure 5 , Figure 5 This is a side view of another optional antenna transceiver structure of this application. The signal transmission layer 1 is a convex structure, and includes a second structural layer 12 and a first structural layer 11 stacked sequentially from bottom to top. The multifunctional chip 2 is located on the top of the first structural layer 11, and a metal heat dissipation layer 31 is provided in a preset area of the first structural layer 11; the preset area is close to the bottom of the first structural layer 11; the width of the first structural layer 11 is smaller than the width of the second structural layer 12, and the antenna 5 is located at the bottom of the second structural layer 12; the metal heat dissipation layer 31 is located on top of the second structural layer 12, and the width of the metal heat dissipation layer 31 is greater than the width of the first structural layer 11 and less than or equal to the width of the second structural layer 12; optionally, the first structural layer 11 includes opposing first side surface 111 and second side surface 112; the second structural layer... 12 includes a third side 121 and a fourth side 122, with the first side 111 close to the third side 121 and at a predetermined distance from it; the second side 112 close to the fourth side 122 and at a predetermined distance from it, so that a portion of the metal heat dissipation layer 31 is exposed, allowing the mounting structure 7 and the antenna 5 receiving structure to conduct heat directly through the metal heat dissipation layer 31. Compared to heat transfer based solely on through holes, this has advantages such as high heat conduction and fast heat transfer speed, further enhancing the heat dissipation effect on the multi-functional chip 2, ensuring that the multi-functional chip 2 will not overheat during operation, meeting the heat dissipation requirements of the multi-functional chip 2 during high-power operation, and providing a reliable guarantee for the high-power operation of the multi-functional chip 2.
[0059] It should be noted that the width mentioned above refers to the amount along the x-axis.
[0060] In some feasible embodiments, when the antenna transceiver structure is used to receive radio frequency signals, the antenna transceiver structure further includes a power combining network; the multi-function chip 2 is a receiving multi-function chip; the power combining network is located within the signal transmission layer 1 and is used to combine multiple received radio frequency signal beams into a radio frequency signal beam to be output, and a single radio frequency signal beam among the multiple radio frequency signal beams is output by a corresponding receiving multi-function chip.
[0061] Optionally, the antenna transceiver structure also includes a power supply and control unit, which is connected to the aforementioned multi-functional chip 2 to provide power and control to the chip; optionally, the power supply and control unit is connected to the multi-functional chip 2 via a connector.
[0062] It should be noted that when the antenna transceiver structure is a radio frequency signal receiving device, the aforementioned antenna transceiver structure is used to realize functions such as dual-beam left / right-hand polarization duplex reception of radio frequency signals, low-noise amplification, phase shifting and attenuation, and power combining; see reference Figure 6 , Figure 6 This is a schematic diagram of the radio frequency signal processing process of an optional antenna transceiver structure according to this application. The specific principle is as follows: Each multi-function chip 2 can correspond to multiple antennas 5. When the antenna 5 receives radio frequency signals from space, it will be amplified, phase-shifted, and attenuated in the channel of its corresponding signal aperture. The signal is then combined into a single signal through the 8-in-1 power combining network inside the multi-function chip 2 and output to the signal output layer. In the signal output layer, it is divided into two beams, each using a power combining network. Each beam undergoes 8-in-1 power combining once, and finally, the radio frequency signals of the two beams are output.
[0063] Optionally, when the number of multi-function chips 2 is 16 and the number of channels of multi-function chips 2 is 8, the power combining network can be an 8-in-1 power combining network or a 16-in-1 power combining network, and there is no limitation here.
[0064] In some feasible embodiments, see [reference] Figure 7 , Figure 7 This is a schematic diagram of the radio frequency signal processing of another optional antenna transceiver structure of this application. When the antenna transceiver structure is used to transmit radio frequency signals, the antenna transceiver structure also includes a power divider network; the multi-function chip 2 is a transmit multi-function chip; the power divider network is located in the signal transmission layer 1 and is used to divide the received initial radio frequency signal beam into multiple radio frequency signal beams, thereby enabling a single radio frequency signal in the multiple radio frequency signal beams to be transmitted to a corresponding transmit multi-function chip.
[0065] It should be noted that when the antenna transceiver structure is a radio frequency signal transmitting device, the above-mentioned antenna transceiver structure is used to realize functions such as power distribution, attenuation and phase shifting, power amplification, and dual-polarization reconfigurable transmission of radio frequency signals. The specific principle is as follows: Each multi-function chip 2 can correspond to multiple antennas 5. When the radio frequency signal is input from the feed port, it will first be distributed equally to multiple multi-function chips 2 through the power divider network. In each multi-function chip 2, the power will be distributed equally to 8 outputs. After phase shifting, attenuation, and power amplification in each channel, it will be output to antenna 5 and then radiated into space through antenna 5.
[0066] Optionally, continuing with the above example, the number of multi-function chips 2 is 16, and the number of channels of multi-function chips 2 is 8. The power divider network can be a 1 to 16 power divider network. Of course, as the number of chips changes, the power divider network also needs to be adjusted accordingly, as long as it can distribute the received RF signal to each multi-function chip 2 with equal power.
[0067] It should be noted that, for reference Figure 6 The polarization of the antenna 5 includes horizontal polarization and vertical polarization, and can form left and right circular polarization.
[0068] This application also discloses an antenna transceiver assembly, see reference . Figure 8 , Figure 8 This is a side view of an optional antenna transceiver assembly according to this application. The antenna transceiver assembly includes a mounting structure 7 and the aforementioned antenna transceiver structure; the mounting structure 7 is connected to the top of the antenna transceiver structure; a recessed area 71 is provided in the middle of the mounting structure 7, and the recessed area 71 is connected to the antenna transceiver structure to form a receiving cavity, in which the multifunctional chip 2 is located.
[0069] In some feasible embodiments, see [reference] Figure 8 The antenna transceiver assembly also includes thermal grease 8; the mounting structure 7 is connected to the antenna transceiver structure via the thermal grease 8, and optionally, the mounting structure 7 is connected to the metal heat dissipation layer 31 via the thermal grease 8. Optionally, the thickness of the thermal grease 8 ranges from 0.1 to 1 mm.
[0070] In some feasible embodiments, the mounting structure 7 is made of metal, such as aluminum, copper, or an alloy, as long as it meets the required hardness and heat dissipation.
[0071] Because hard contact between metals creates a large number of gaps, the heat-conducting medium becomes air. However, air has low thermal conductivity. Thermal grease 8 is a high thermal conductivity insulating silicone material that almost never hardens and can maintain its grease state for a long time. It has both excellent electrical insulation and excellent thermal conductivity. Through the above design, it can fill the gap between the mounting structure 7 and the metal heat dissipation layer 31, and at the same time, it can quickly transfer the heat of the TR component (i.e., the antenna transceiver component) to the antenna transceiver structure below, further improving the heat dissipation effect of the TR component and meeting the heat dissipation requirements of the multi-functional chip 2 when it is operating at high power.
[0072] The above description is only an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An antenna transceiver assembly, characterized in that, This includes the mounting structure (7) and the antenna transceiver structure; The antenna transceiver structure includes a multi-functional chip (2), a signal transmission layer (1), a heat dissipation layer (3), and an antenna (5). The first surface of the signal transmission layer (1) is provided with the multifunctional chip (2); the multifunctional chip (2) is used to process the received radio frequency signal; the signal transmission layer (1) is a printed circuit board; The signal transmission layer (1) is provided with the heat dissipation layer (3) and the signal transmission channel (4). The heat dissipation layer (3) is connected to the multi-functional chip (2). The heat dissipation layer (3) includes a heat dissipation hole (32) penetrating the signal transmission layer (1) and a metal heat dissipation layer (31). The heat dissipation hole (32) has a metal layer inside and on its upper and lower surfaces; the lower surface of the heat dissipation hole (32) is connected to the metal heat dissipation layer (31) through the metal layer; the upper surface of the heat dissipation hole (32) is connected to the multifunctional chip (2) through the metal layer. One end of the signal transmission channel (4) is connected to the multifunctional chip (2), and the other end of the signal transmission channel (4) is connected to the antenna (5); The antenna (5) is located on the second surface of the signal transmission layer (1), the second surface being opposite to the first surface, and the antenna (5) is used to transmit signals with the multifunctional chip (2) through the signal transmission channel (4); A portion of the metal heat dissipation layer (31) is exposed so that the mounting structure (7) and the antenna transceiver structure are connected through the metal heat dissipation layer (31); the mounting structure (7) is made of metal. The mounting structure (7) has a groove area (71) in the middle, and the groove area (71) is connected to the antenna transceiver structure to form a receiving cavity, and the multi-functional chip (2) is located in the receiving cavity.
2. The antenna transceiver assembly according to claim 1, characterized in that, The thickness of the metal heat dissipation layer (31) ranges from 0.5 to 3 mm; The material of the metal heat dissipation layer (31) includes copper; The material of the metal layer includes copper; The signal transmission layer (1) is a multilayer printed circuit board (PCB).
3. The antenna transceiver assembly according to claim 1, characterized in that, The signal transmission layer (1) includes a stacked second structural layer (12) and a first structural layer (11). The first structural layer (11) is provided with the multifunctional chip (2) at its top; and the first structural layer (11) is provided with the metal heat dissipation layer (31) in a preset area; the preset area is close to the bottom of the first structural layer (11); the width of the first structural layer (11) is smaller than the width of the second structural layer (12); The antenna (5) is provided at the bottom of the second structural layer (12); and the metal heat dissipation layer (31) is located at the top of the second structural layer (12); the width of the metal heat dissipation layer (31) is greater than the width of the first structural layer (11) and less than or equal to the width of the second structural layer (12).
4. The antenna transceiver assembly according to claim 1, characterized in that, The number of the multi-functional chips (2) is multiple; The metal heat dissipation layer (31) includes a plurality of spaced metal heat dissipation areas (211), the number of which is greater than or equal to the number of the multifunctional chips (2).
5. The antenna transceiver assembly according to claim 1, characterized in that, It also includes power combining networks; The multi-functional chip (2) is a receiving multi-functional chip; The power combining network is located within the signal transmission layer (1) and is used to combine multiple received radio frequency signal beams into a radio frequency signal beam to be output. Each radio frequency signal beam in the multiple radio frequency signal beams is output by a corresponding receiving multifunction chip.
6. The antenna transceiver assembly according to claim 1, characterized in that, It also includes power distribution networks; The multi-functional chip (2) is a transmitting multi-functional chip; The power divider network is located within the signal transmission layer (1) and is used to divide the received initial radio frequency signal beam into multiple radio frequency signal beams, thereby enabling a single radio frequency signal in the multiple radio frequency signal beams to be transmitted to a corresponding transmitting multifunction chip.
7. The antenna transceiver assembly according to claim 1, characterized in that, It also includes thermal grease (8); The mounting structure (7) is connected to the antenna transceiver structure via the thermal grease (8).