A method, device and system for simulating film investment plan

Abstract

The present application discloses a method, device and system for simulating a wafer investment plan. Among them, the wafer investment plan simulation method includes: obtaining the production information of the wafer investment plan to be simulated; obtaining the wafer production information according to the production information and the work-in-progress information; if it is monitored that the system operation time reaches any of the planned investment times in the wafer production information, then the state information of the target un-invested batch corresponding to any of the planned investment times in the wafer production information is modified to the idle state, and according to the production instructions corresponding to the target un-invested batch received, the state information of the target un-invested batch is modified from the idle state to the production state. This method can simulate the investment plan, prevent the investment plan from being directly applied to the production line and causing unpredictable risks, and continuously and stably improve the overall production efficiency.

Description

Technical Field

[0001] The present application relates to the field of integrated circuit manufacturing technology, and in particular to a chip investment plan simulation method, device and system. Background Art

[0002] Semiconductor manufacturing is a high-tech industry with high investment. To achieve operational goals and improve productivity, semiconductor manufacturing plants are increasingly automating their production control activities. Automated control of work dispatch is particularly important in the semiconductor manufacturing process.

[0003] Most advanced wafer fabs utilize a real-time dispatch (RTD) system to manage production line work. RTD uses built-in algorithms to make optimal work dispatch decisions for each lot (lot) on the line. The manufacturing department (MA) only needs to produce according to the RTD's recommended lot sequence, thereby improving overall fab production efficiency.

[0004] Fabs typically need to replenish the production line's work-in-process (WIP) based on a wafer start plan (WSP) to ensure continued high production efficiency. The accuracy of a wafer start plan decreases over time. Directly applying the plan to the production line can lead to unforeseen risks, impacting overall production efficiency.

[0005] How to provide a method to simulate wafer production plans has important practical significance for the semiconductor manufacturing industry. Summary of the Invention

[0006] The embodiments of the present application provide a method, device, and system for simulating a wafer investment plan.

[0007] In a first aspect, the present application provides a method for simulating a wafer production plan, comprising:

[0008] Obtaining production information of a wafer launch plan to be simulated; the production information includes first production material information of multiple unlaunched batches and a planned launch time corresponding to the first production material information;

[0009] According to the production information and the work-in-process information, wafer production information is obtained; the work-in-process information includes second production material information of multiple production batches; the wafer production information includes the first production material information, the planned wafer launch time, the batch status of the batch not put into production, the second production material information, and the status information of the production batch; the status information of the batch not put into production is a pending production transfer status; the status information of the batch not put into production is an idle status or a production status;

[0010] If it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state, and based on the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch is modified from the idle state to the production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

[0011] In an optional embodiment, obtaining wafer production information according to the wafer casting plan and work-in-progress information includes:

[0012] Integrating the wafer casting plan and the work-in-process information to obtain first wafer production information;

[0013] The status information of the unproduced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

[0014] In an optional implementation manner, the first production material information and the second production material information include the same information items.

[0015] In an optional embodiment, the unproduced batch and the produced batch have multiple production steps; modifying the status information of the target unproduced batch corresponding to any of the planned wafer launch times in the wafer production information to the idle state, and modifying the status information of the target unproduced batch from the idle state to the production state based on receiving a production instruction corresponding to the target unproduced batch, includes:

[0016] The status information of the target un-produced batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state corresponding to the current production step, and based on the receipt of the first production instruction corresponding to the target un-produced batch, the status information of the target un-produced batch is modified from the idle state to the production state corresponding to the current production step.

[0017] In an optional embodiment, the production cycle simulation is such that each of the production steps enters the idle state and then enters the production state in sequence according to the production order; the method further includes:

[0018] After the current production step of the target unproduced batch is completed, the following steps are performed until the production cycle simulation of the target unproduced batch is completed:

[0019] Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step;

[0020] After receiving a second production instruction corresponding to the next production step of the target unproduced batch, modifying the status information of the target unproduced batch from the idle state corresponding to the next production step to the production state corresponding to the next production step;

[0021] The current production step of the target unproduced batch is assigned as the next production step.

[0022] In an optional embodiment, after completing the production cycle simulation of the target unproduced batch, the method further includes:

[0023] The status information of the target un-produced batch is modified to the simulated production end state; the simulated production end state indicates that the simulation of the corresponding un-produced batch has been completed.

[0024] In an optional embodiment, the idle state of each production step represents the process from the start of the step to the start of loading on the machine; the production state of each production step represents the process from the start of loading on the machine to the end of unloading.

[0025] The embodiments of the present application have at least the following advantages:

[0026] By adopting the above-mentioned wafer investment plan simulation method, wafer production information can be obtained based on the production information and work-in-progress information of the wafer investment plan to be simulated. If it is monitored that the system operation time reaches the planned investment time of the product in the wafer production information, the batch status of the product in the wafer production information is modified, and the simulation of the production cycle is started to realize the simulation of the investment plan, thereby preventing the investment plan from being directly applied to the production line and causing unpredictable risks, and continuously and steadily improving the overall production efficiency.

[0027] In a second aspect, the present application provides a device for simulating a film investment plan, comprising:

[0028] An information acquisition unit, wherein the information input module is used to acquire production information of a wafer launch plan to be simulated; the production information includes first production material information of multiple unlaunched batches and a planned launch time corresponding to the first production material information;

[0029] An information integration unit, wherein the information adjustment module is configured to obtain wafer production information based on the production information and work-in-process information; the work-in-process information includes second production material information of multiple production batches; the wafer production information includes the first production material information, the planned wafer launch time, the batch status of the unproduced batch, the second production material information, and status information of the production batch; the status information of the unproduced batch is a pending production transfer status; the status information of the unproduced batch is an idle status or a production status;

[0030] A simulation monitoring unit, wherein the simulation monitoring unit is used to modify the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information to the idle state if it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, and to modify the status information of the target non-production batch from the idle state to the production state according to the production instruction corresponding to the target non-production batch received; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

[0031] In an optional implementation manner, the information integration unit is specifically configured to:

[0032] Integrating the wafer casting plan and the work-in-process information to obtain first wafer production information;

[0033] The status information of the unproduced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

[0034] In an optional implementation manner, the first production material information and the second production material information include the same information items.

[0035] In an optional embodiment, the unproduced batch and the produced batch have multiple production steps; the simulation monitoring unit is specifically configured to:

[0036] The status information of the target un-produced batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state corresponding to the current production step, and based on the receipt of the first production instruction corresponding to the target un-produced batch, the status information of the target un-produced batch is modified from the idle state to the production state corresponding to the current production step.

[0037] In an optional embodiment, the production cycle simulation is such that each of the production steps enters the idle state and then the production state in sequence according to the production order; the simulation monitoring unit is further configured to:

[0038] After the current production step of the target unproduced batch is completed, the following steps are performed until the production cycle simulation of the target unproduced batch is completed:

[0039] Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step;

[0040] After receiving a second production instruction corresponding to the next production step of the target unproduced batch, modifying the status information of the target unproduced batch from the idle state corresponding to the next production step to the production state corresponding to the next production step;

[0041] The current production step of the target unproduced batch is assigned as the next production step.

[0042] In an optional implementation, the simulation monitoring unit is further configured to:

[0043] After completing the production cycle simulation of the target un-produced batch, the status information of the target un-produced batch is modified to the simulated production end state; the simulated production end state indicates that the corresponding un-produced batch has been simulated.

[0044] In an optional embodiment, the idle state of each production step represents the process from the start of the step to the start of loading on the machine; the production state of each production step represents the process from the start of loading on the machine to the end of unloading.

[0045] In a third aspect, the present application provides a wafer investment plan simulation system, comprising:

[0046] A memory, the memory being used to store data or program codes used when the chip investment plan simulation system is running;

[0047] A processor, the processor being configured to: obtain production information of a wafer launch plan to be simulated; the production information comprising first production material information of a plurality of unlaunched batches and a planned launch time corresponding to the first production material information;

[0048] According to the production information and the work-in-process information, wafer production information is obtained; the work-in-process information includes second production material information of multiple production batches; the wafer production information includes the first production material information, the planned wafer launch time, the batch status of the batch not put into production, the second production material information, and the status information of the production batch; the status information of the batch not put into production is a pending production transfer status; the status information of the batch not put into production is an idle status or a production status;

[0049] If it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state, and based on the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch is modified from the idle state to the production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

[0050] In an optional implementation, the processor is specifically configured to:

[0051] Integrating the wafer casting plan and the work-in-process information to obtain first wafer production information;

[0052] The status information of the unproduced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

[0053] The technical effects brought about by any one of the implementation methods of the second aspect to the third aspect can refer to the technical effects brought about by the implementation method of the first aspect, and will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0055] Figure 1 A flowchart of a chip investment plan simulation provided in an embodiment of the present application;

[0056] Figure 2 A schematic diagram of the structure of a chip investment plan simulation device provided in an embodiment of the present application;

[0057] Figure 3A schematic diagram of the structure of a film investment plan simulation system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0058] To make the objectives, technical solutions, and advantages of this application more clear, this application will be further described in detail below with reference to the accompanying drawings. It should be understood that the embodiments described herein are only some of the embodiments of this application, and not all of them. All other embodiments derived by persons of ordinary skill in the art based on the embodiments of this application without inventive effort are intended to fall within the scope of protection of this application.

[0059] In the embodiments of the present application, the word “exemplary” is used to mean “serving as an example, embodiment, or illustration.” Any embodiment described as “exemplary” is not necessarily to be construed as being superior or better than other embodiments.

[0060] The terms "first" and "second" are used for descriptive purposes only and should not be construed as explicitly or implicitly indicating relative importance or the number of the technical features indicated. Therefore, features specified as "first" or "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of this application, unless otherwise specified, "plurality" means two or more.

[0061] The following explains some of the terms used in the embodiments of the present application to facilitate understanding by those skilled in the art.

[0062] (1) Wafer: Wafers are made of pure silicon (Si). They are generally available in sizes of 6 inches, 8 inches, and 12 inches. Chips are produced based on these wafers. Wafers refer to the silicon wafers used in the manufacture of silicon semiconductor integrated circuits. Due to their circular shape, they are called wafers. Various circuit component structures can be processed on silicon wafers to become integrated circuit products with specific electrical functions.

[0063] (2) Wafer Start Plan (WSP): Wafer Start Plan refers to the production plan of a chip processing enterprise.

[0064] (3) Work in Process (WIP): Work in Process refers to products that are being processed and produced but have not yet been completed in chip processing companies.

[0065] Semiconductor manufacturing is a high-tech industry with high investment. To achieve operational goals and improve productivity, semiconductor manufacturing plants are increasingly automating their production control activities. Automated control of work dispatch is particularly important in the semiconductor manufacturing process.

[0066] Most advanced wafer fabs utilize a real-time dispatching (RTD) system to manage production line work. RTD uses built-in algorithms to make optimal dispatch decisions for each lot (lot) within the production line. The manufacturing department (MA) only needs to produce according to the RTD's recommended lot sequence, thereby improving overall fab production efficiency.

[0067] Fabs typically need to replenish work-in-process (WIP) on production lines based on wafer schedules (WSPs) to ensure consistently efficient production. As wafer schedules grow in length, their accuracy decreases. Directly applying wafer schedules to production lines can lead to unforeseen risks, impacting overall production efficiency.

[0068] How to provide a method to simulate wafer production plans has important practical significance for the semiconductor manufacturing industry.

[0069] The present application provides a wafer investment plan simulation method, device and system for simulating the wafer investment plan. Among them, the wafer investment plan simulation method includes: obtaining the production information of the wafer investment plan to be simulated; obtaining wafer production information based on the production information and work-in-progress information; if it is monitored that the system operation time reaches any planned investment time in the wafer production information, then the status information of the target un-invested batch corresponding to any planned investment time in the wafer production information is modified to an idle state, and according to the production instruction corresponding to the target un-invested batch received, the status information of the target un-invested batch is modified from an idle state to a production state. The method obtains wafer production information based on the production information and work-in-progress information of the wafer investment plan to be simulated; if it is monitored that the system operation time reaches the planned investment time of the product in the wafer production information, then the batch status of the product in the wafer production information is modified, and the simulation of the production cycle is started. The wafer investment plan can be simulated, which can prevent the wafer investment plan from being directly applied to the production line and causing unpredictable risks, and continuously and stably improve the overall production efficiency.

[0070] In order to further illustrate the technical solution provided by the embodiment of the present application, the wafer investment plan simulation method provided by the embodiment of the present application is further described below.

[0071] Figure 1 FIG. 1 shows a flow chart of a method for simulating a chip investment plan provided by an embodiment of the present application. Figure 1 As shown, the chip investment plan simulation method may include the following steps:

[0072] Step S101: obtaining production information of a wafer tape-out plan to be simulated.

[0073] The production information includes first production material information of multiple batches that have not yet been put into production and a planned production time corresponding to the first production material information.

[0074] As can be understood, to simulate the wafer schedule to be simulated, the wafer schedule (WSP) to be simulated is first obtained. The format of the WSP can be generally consistent with the format of the work-in-progress (WIP), but the WSP contains one additional piece of information: the planned schedule time. This planned schedule time is the time set to begin the production cycle simulation for the products in the WSP. Specifically, when the system operating time reaches the planned schedule time, the production cycle simulation for the products in the WSP begins.

[0075] The wafer casting plan may include, but is not limited to, the following information items: batch number, model, starting step code, production time, and number of wafers. In the embodiments of the present application, the information items included in the wafer casting plan may be referred to as production information. Table 1 shows the format of a wafer casting plan provided in the embodiments of the present application.

[0076] Table 1

[0077] TECH_ID PRODGRP_ID START_OPE_NO START_HOUR START_DATE DAILY_QTY TechA ProdA 0010.010000 8:00 May 21 125 … … … … … …

[0078] As shown in Table 1, the production information included in the wafer tape-out plan is specifically the following information items: batch number TECH_ID, model PRODGRP_ID, starting step code START_OPE_NO, production hour START_HOUR, production day START_DATE, and number of wafers DAILY_QTY.

[0079] The above information items shown in Table 1 can be divided into: first production material information and the planned wafer launch time corresponding to the first production material information. In the following embodiments of this application, the wafer launch plan is illustrated in the format shown in Table 1, where the first production material information includes: batch number TECH_ID, model number PRODGRP_ID, starting step code START_OPE_NO, and number of wafers DAILY_QTY; the planned wafer launch time corresponding to the first production material information includes: production start hours START_HOUR and production start days START_DATE.

[0080] It is understood that Table 1 is only an example of the format of a wafer casting plan in an embodiment of the present application. In other embodiments, the wafer casting plan may also include other information items, and correspondingly, the first production material information may also include other corresponding information items. The specific format of the wafer casting plan is not specifically limited in this application.

[0081] Step S102: Obtain wafer production information based on the production information and work-in-progress information.

[0082] Among them, the work-in-progress information includes the second production material information of multiple batches that have been put into production; the wafer production information includes the first production material information, the planned wafer production time, the batch status of the batch that has not been put into production, the second production material information, and the status information of the batch that has been put into production; the status information of the batch that has not been put into production is the waiting for transfer status; the status information of the batch that has not been put into production is the idle status or production status.

[0083] In a possible implementation manner, the first production material information and the second production material information include the same information items.

[0084] Exemplarily, the work-in-progress information includes information of second production materials of multiple batches that have been put into production, wherein the second production material information and the first production material information include the same information items. For example, Table 2 shows a format of work-in-progress information provided in an embodiment of the present application. As shown in Table 2, the work-in-progress information may also include the same information items as those shown in Table 1, such as: batch number TECH_ID, model PRODGRP_ID, starting step code START_OPE_NO, and number of pieces DAILY_QTY.

[0085] Table 2

[0086] TECH_ID PRODGRP_ID START_OPE_NO DAILY_QTY TechB ProdB 0011.010000 100 … … … …

[0087] The method of this embodiment establishes production information in the same format as the work-in-process information, wherein the production information has one more planned wafer launch time than the work-in-process information, thereby facilitating the integration of the wafer launch plan with the work-in-process information and reducing the computational complexity of the wafer launch plan simulation.

[0088] In an embodiment of the present application, the wafer production information includes first production material information, planned wafer production time, batch status of batches that have not been put into production, second production material information, and status information of batches that have been put into production; the status information of batches that have not been put into production is the waiting for production transfer status; the status information of batches that have not been put into production is the idle status or production status.

[0089] In an optional embodiment, wafer production information is obtained based on the wafer casting plan and work-in-progress information, including:

[0090] Integrate the wafer casting plan and work-in-progress information to obtain the first wafer production information;

[0091] The status information of the un-produced batches in the first wafer production information is set to the waiting-for-production state, and the status information of the produced batches in the first wafer production information is set to the idle state or the production state to obtain the wafer production information.

[0092] For example, wafer production information can be obtained based on the wafer casting plan and work-in-process information by the following steps: integrating the wafer casting plan shown in Table 1 and the work-in-process information shown in Table 2 to obtain the first wafer production information shown in Table 3; setting the status information Lot Status of the unlaunched batch in the first wafer production information shown in Table 3 to the waiting state WS, and setting the status information Lot Status of the launched batch in the first wafer production information shown in Table 3 to the idle state Idle, to obtain the wafer production information shown in Table 4. It is understandable that the status information Lot Status of the launched batch can also be set to the production state Run.

[0093] Table 3

[0094] TECH_ID PRODGRP_ID START_OPE_NO START_HOUR START_DATE DAILY_QTY TechA ProdA 0010.010000 8:00 May 21 125 TechB ProdB 0011.010000 100 … … … … … …

[0095] Table 4

[0096]

[0097] The method of this embodiment integrates the wafer casting plan and the work-in-process information, and sets the status information of the un-produced batches associated with the wafer casting plan to the waiting-for-production status. This status is different from the status information of the produced batches associated with the work-in-process information, thereby enhancing the distinction between the un-produced batches and the produced batches, thereby integrating the wafer casting plan and the work-in-process information and preventing the reduction of the accuracy of the semiconductor production simulation of the produced batches.

[0098] Step S103: If it is monitored that the system operation time reaches any planned wafer production time in the wafer production information, the status information of the target non-production batch corresponding to any planned wafer production time in the wafer production information is modified to an idle state, and according to the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch is modified from an idle state to a production state.

[0099] Among them, the production instruction is triggered when the target unproduced batch meets the production scheduling rules.

[0100] In specific implementations, a production instruction may be triggered when a target un-produced batch satisfies a production scheduling rule. The present embodiment of the application does not specifically limit the method used by the system to determine whether a target un-produced batch satisfies a production scheduling rule. For example, a simulated dispatching algorithm similar to real-time dispatching (RTD) may be used to determine whether a target un-produced batch satisfies a production scheduling rule; a built-in simulated dispatching module may be used to determine whether a target un-produced batch satisfies a production scheduling rule; or other simulated dispatching methods may be used.

[0101] In the embodiments of the present application, unlaunched and already-launched batches can have multiple production steps. Assume that in actual production, batch LOT01 has N production steps: Ope1, ..., OpeN, where N is a natural number satisfying N ≥ 1. In the embodiments of the present application, the production step plan for batch LOT01 used in the simulation is set to N+2, specifically:

[0102] Ope first, Ope1,…, OpeN, Ope Last.

[0103] In this embodiment of the present application, in a batch production step plan, the first step Ope first is the initial state marking step; the last step Ope Last is the final state marking step. The initial state marking step and the final state marking step are only used to assist in marking the batch status during the simulation process. In the production step plan, except for the first step Ope first and the last step Ope Last, the other steps Ope1 to OpeN are defined as production steps. The status information Lot Status corresponding to each specific step in production steps Ope1 to OpeN can be set to two status information: Run and Idle.

[0104] Corresponding to production steps Ope1 through OpeN, the status information for steps marking the initial status can only be set to WS, and the status information for steps marking the final status can only be set to WO. Therefore, if the status information for lot LOT01 is set to WS, it indicates that the lot has not yet entered the first step of the actual production process, Ope1. However, when the status information for lot LOT01 is set to WO, it indicates that the lot has completed the final step of the actual production process, OpeN.

[0105] In an optional embodiment, modifying the status information of a target unproduced batch corresponding to any planned wafer launch time in the wafer production information to an idle state, and modifying the status information of the target unproduced batch from an idle state to a production state upon receiving a production instruction corresponding to the target unproduced batch, can be achieved by:

[0106] The status information of the target un-produced batch corresponding to any planned wafer production time in the wafer production information is modified to the idle state corresponding to the current production step, and based on the first production instruction corresponding to the target un-produced batch received, the status information of the target un-produced batch is modified from the idle state to the production state corresponding to the current production step.

[0107] For example, if it is monitored that the system operation time reaches the planned wafer launch time "May 21 8:00" of LOT02, the value of the status information Lot Status of the target un-produced batch with TECH_ID "TechA" corresponding to the planned wafer launch time "May 21 8:00" in the wafer production information shown in Table 4 is modified to the idle state Idle corresponding to the current production step Ope1, where the value of Ope1 can be "0010.010000" in Table 4; and based on the receipt of the first production instruction corresponding to the target un-produced batch with TECH_ID "TechA", the value of the status information Lot Status of the target un-produced batch with TECH_ID "TechA" is modified from the idle state Idle to the production state Run corresponding to the current production step Ope1.

[0108] The method of this embodiment can be based on multiple production steps of batches that have not been put into production and batches that have been put into production. When it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target batch that has not been put into production can be modified to the idle state corresponding to the current production step. After receiving the first production instruction corresponding to the target batch that has not been put into production, the status information of the target batch that has not been put into production can be modified from the idle state corresponding to the current production step to the production state corresponding to the current production step, thereby realizing state control of the current production step and performing a more detailed simulation of the production schedule based on the production steps.

[0109] In one possible implementation, the production cycle is simulated so that each production step enters the idle state and then enters the production state in sequence. The wafer planning simulation method further performs the following process:

[0110] After the current production step of the target unreleased batch is completed, perform the following steps until the production cycle simulation of the target unreleased batch is completed:

[0111] Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step;

[0112] After receiving a second production instruction corresponding to a next production step of the target unproduced batch, modifying the state information of the target unproduced batch from an idle state corresponding to the next production step to a production state corresponding to the next production step;

[0113] Assign the current production step of the target unproduced batch to the next production step.

[0114] For example, it is assumed that the batch with TECH_ID "TechA" in the wafer production information shown in Table 4 has M corresponding production steps (M is a positive integer): Ope1', ..., OpeM'. For the convenience of explanation, in the following embodiments, the batch with TECH_ID "TechA" in the wafer production information shown in Table 4 is recorded as LOT02. For batch LOT02, the production cycle simulation is to make each production step in the production steps Ope1'~OpeM' enter the idle state Idle in sequence and then enter the production state Run. Assuming that the target unproduced batch is LOT02, when performing the wafer investment plan simulation, the following process is also performed:

[0115] According to Table 4, the current production step of LOT02 is Ope1', whose value is "0010.010000", which can be recorded as Ope1'"0010.010000". After the current production step Ope1'"0010.010000" of LOT02 ends, perform the following steps until the production cycle simulation of LOT02 is completed:

[0116] The value of the status information Lot Status of LOT02 is modified from the production status Run corresponding to the current production step Ope1'"0010.010000" to the idle status Idle corresponding to the next production step of the current production step Ope1'"0010.010000"; after receiving the second production instruction corresponding to the next production step of the current production step Ope1'"0010.010000", the value of the status information Lot Status of LOT02 is modified from the idle status Idle corresponding to the next production step of the current production step Ope1'"0010.010000" to the production status Run corresponding to the next production step of the current production step Ope1'"0010.010000"; thereafter, the current production step of LOT02 is assigned to the next production step corresponding to the current production step Ope1'"0010.010000". The above method can be used to gradually shift the current production step backward, thereby continuously simulating subsequent production steps until the production cycle simulation of LOT02 is completed.

[0117] In specific implementations, the system can determine whether the LOT02 production cycle simulation is complete based on whether the value of the current production step is any one of Ope1'-OpeM'. It is understood that in embodiments of the present application, the system can use a variety of methods to determine whether the LOT02 production cycle simulation has been completed, and this application does not specifically limit the method for performing this determination.

[0118] The method of this embodiment can simulate the remaining production steps after the current production step of the target un-produced batch is completed, one by one, so that the target un-produced batch completes the production cycle simulation, and can perform more refined production step simulation control on the production plan, thereby improving the accuracy of the production plan simulation.

[0119] In an optional embodiment, after completing the production cycle simulation of the target un-produced batch, the status information of the target un-produced batch can also be modified to the simulated production end state; the simulated production end state indicates that the corresponding un-produced batch has been simulated.

[0120] For example, after completing the production cycle simulation of LOT02, the value of the status information LotStatus of LOT02 may be modified to the simulated production end state WO; the simulated production end state WO indicates that the corresponding un-produced batch has been simulated.

[0121] The method of this embodiment can mark the simulated but not put into production batches through status information, so that the simulated but not put into production batches can exit the production cycle simulation and prevent repeated simulation of the not put into production batches. It can perform more comprehensive simulation control of the production plan and improve the accuracy of the production plan simulation.

[0122] In an optional embodiment, the idle state of each production step represents the process from the start of the step to the start of loading on the machine; the production state of each production step represents the process from the start of loading on the machine to the end of unloading.

[0123] In specific implementation, in the embodiment of the present application, each production step can be divided into multiple actions, and the divided actions include A1, A2, and A7 as shown in Table 5.

[0124] Table 5

[0125]

[0126]

[0127] Taking the action division of production steps shown in Table 5 as an example, the idle state of each production step represents the process from the start of the step (A1) to the start of loading the machine (A2); the production state of each production step represents the process from the start of loading the machine (A2) to the end of unloading (A7).

[0128] The method of this embodiment can make the idle state and the production state correspond to two different stages of the production steps based on the actions in the production steps, which can enhance the accuracy of simulating each production step of the wafer investment plan, thereby improving the accuracy of the production plan simulation.

[0129] In an embodiment of the present application, when each production step is divided into multiple actions, the divided actions may also include A8 as shown in Table 5, which represents a signal written by the system to feed back the end of the production step to the system for assisting data statistics.

[0130] Figure 1 In the method shown, the production information of the wafer investment plan to be simulated is obtained; wafer production information is obtained based on the production information and work-in-process information; if it is monitored that the system operation time reaches any planned investment time in the wafer production information, the status information of the target un-invested batch corresponding to any planned investment time in the wafer production information is modified to an idle state, and based on the production instruction corresponding to the target un-invested batch received, the status information of the target un-invested batch is modified from an idle state to a production state. This method obtains wafer production information based on the production information and work-in-process information of the wafer investment plan to be simulated; if it is monitored that the system operation time reaches the planned investment time of the product in the wafer production information, the batch status of the product in the wafer production information is modified, and the simulation of the production cycle is started. The investment plan can be simulated, which can prevent the investment plan from being directly applied to the production line and causing unpredictable risks, and continuously and steadily improve the overall production efficiency.

[0131] and Figure 1 The investment plan simulation method shown is based on the same inventive concept. In the embodiments of this application, a investment plan simulation device is also provided. Since this device corresponds to the investment plan simulation method of this application and solves the problem in a similar manner to the method, the implementation of this device can be referred to as the implementation of the above method, and the repeated parts will not be repeated here.

[0132] Figure 2 FIG. 1 shows a schematic diagram of a structure of a chip investment plan simulation device provided in an embodiment of the present application. Figure 2 As shown, the film investment plan simulation device includes an information acquisition unit 201 , an information integration unit 202 and a simulation monitoring unit 203 .

[0133] The information acquisition unit 201 is configured to acquire production information of a wafer launch plan to be simulated; the production information includes first production material information of multiple unlaunched batches and a planned launch time corresponding to the first production material information;

[0134] The information integration unit 202 is configured to obtain wafer production information based on the production information and the work-in-process information; the work-in-process information includes the second production material information of multiple production batches; the wafer production information includes the first production material information, the planned wafer launch time, the batch status of the batches not yet put into production, the second production material information, and the status information of the production batches; the status information of the batches not yet put into production is the pending production status; the status information of the batches not yet put into production is the idle status or the production status;

[0135] The simulation monitoring unit 203 is used to modify the status information of the target non-production batch corresponding to any planned wafer production time in the wafer production information to an idle state if it is monitored that the system operation time reaches any planned wafer production time in the wafer production information, and to modify the status information of the target non-production batch from an idle state to a production state according to the production instruction corresponding to the target non-production batch received; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

[0136] In an optional implementation, the information integration unit 202 is specifically configured to:

[0137] Integrate the wafer casting plan and work-in-progress information to obtain the first wafer production information;

[0138] The status information of the un-produced batches in the first wafer production information is set to the waiting-for-production state, and the status information of the produced batches in the first wafer production information is set to the idle state or the production state to obtain the wafer production information.

[0139] In an optional implementation manner, the first production material information and the second production material information include the same information items.

[0140] In an optional embodiment, the unproduced batch and the produced batch have multiple production steps; the simulation monitoring unit 203 is specifically used to:

[0141] The status information of the target un-produced batch corresponding to any planned wafer production time in the wafer production information is modified to the idle state corresponding to the current production step, and based on the first production instruction corresponding to the target un-produced batch received, the status information of the target un-produced batch is modified from the idle state to the production state corresponding to the current production step.

[0142] In an optional embodiment, the production cycle simulation is such that each production step enters the idle state and then enters the production state in sequence according to the production order; the simulation monitoring unit 203 is further configured to:

[0143] After the current production step of the target unreleased batch is completed, perform the following steps until the production cycle simulation of the target unreleased batch is completed:

[0144] Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step;

[0145] After receiving a second production instruction corresponding to a next production step of the target unproduced batch, modifying the state information of the target unproduced batch from an idle state corresponding to the next production step to a production state corresponding to the next production step;

[0146] Assign the current production step of the target unproduced batch to the next production step.

[0147] In an optional implementation, the simulation monitoring unit 203 is further configured to:

[0148] After completing the production cycle simulation of the target un-produced batch, the status information of the target un-produced batch is modified to the simulated production end state; the simulated production end state indicates that the corresponding un-produced batch has been simulated.

[0149] In an optional embodiment, the idle state of each production step represents the process from the start of the step to the start of loading on the machine; the production state of each production step represents the process from the start of loading on the machine to the end of unloading.

[0150] and Figure 1 The investment plan simulation method shown is based on the same inventive concept. In the embodiments of this application, a investment plan simulation system is also provided. Since this system corresponds to the investment plan simulation method of this application and the principles of solving the problem are similar to those of the method, the implementation of this system can be referred to the implementation of the above method, and the repeated parts will not be repeated here.

[0151] Figure 3 FIG. 1 shows a schematic diagram of a structure of a chip investment plan simulation system provided by an embodiment of the present application. Figure 3 As shown, the chip investment plan simulation system includes a memory 101 , a communication module 103 and one or more processors 102 .

[0152] Memory 101 is used to store computer programs executed by processor 102. Memory 101 may mainly include a program storage area and a data storage area. The program storage area may store an operating system and programs required for running instant messaging functions, while the data storage area may store various instant messaging messages and operating instruction sets.

[0153] Memory 101 may be a volatile memory, such as random-access memory (RAM); a non-volatile memory, such as read-only memory, flash memory, a hard disk drive (HDD), or a solid-state drive (SSD); or any other medium capable of carrying or storing desired program code in the form of instructions or data structures and accessible by a computer, but is not limited thereto. Memory 101 may be a combination of the above memories.

[0154] The processor 102 may include one or more central processing units (CPUs) or digital processing units, etc.

[0155] The processor 102 is configured to:

[0156] Obtaining production information of a wafer launch plan to be simulated; the production information includes first production material information of multiple unlaunched batches and a planned launch time corresponding to the first production material information;

[0157] According to the production information and work-in-progress information, wafer production information is obtained; the work-in-progress information includes the second production material information of multiple batches that have been put into production; the wafer production information includes the first production material information, the planned wafer launch time, the batch status of the batches that have not been put into production, the second production material information, and the status information of the batches that have been put into production; the status information of the batches that have not been put into production is the waiting-to-transfer status; the status information of the batches that have not been put into production is the idle status or the production status;

[0158] If it is monitored that the system operation time reaches any planned wafer production time in the wafer production information, the status information of the target non-production batch corresponding to any planned wafer production time in the wafer production information will be modified to an idle state, and according to the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch will be modified from an idle state to a production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

[0159] In an optional embodiment, the processor 102 is specifically configured to:

[0160] Integrate the wafer casting plan and work-in-progress information to obtain the first wafer production information;

[0161] The status information of the un-produced batches in the first wafer production information is set to the waiting-for-production state, and the status information of the produced batches in the first wafer production information is set to the idle state or the production state to obtain the wafer production information.

[0162] In an optional embodiment, the unproduced batch and the produced batch have multiple production steps; the processor 102 is specifically configured to:

[0163] The status information of the target un-produced batch corresponding to any planned wafer production time in the wafer production information is modified to the idle state corresponding to the current production step, and based on the first production instruction corresponding to the target un-produced batch received, the status information of the target un-produced batch is modified from the idle state to the production state corresponding to the current production step.

[0164] In an optional embodiment, the production cycle simulation is such that each production step enters the idle state and then enters the production state in sequence according to the production order; the processor 102 is further configured to: after the current production step of the target unproduced batch is completed, perform the following steps until the production cycle simulation of the target unproduced batch is completed:

[0165] Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step;

[0166] After receiving a second production instruction corresponding to a next production step of the target unproduced batch, modifying the state information of the target unproduced batch from an idle state corresponding to the next production step to a production state corresponding to the next production step;

[0167] Assign the current production step of the target unproduced batch to the next production step.

[0168] In an optional embodiment, the processor 102 is further used to: after completing the production cycle simulation of the target un-produced batch, modify the status information of the target un-produced batch to the simulated production end state; the simulated production end state indicates that the corresponding un-produced batch has been simulated.

[0169] The communication module 103 is used to communicate with the database and other terminals.

[0170] The specific connection medium between the memory 101, the communication module 103 and the processor 102 is not limited in the embodiment of the present application. Figure 3 In the embodiment, the memory 101 and the processor 102 are connected via a bus 104. The bus 104 is connected to the processor 102 via a bus 104. Figure 3The connections between the other components are shown in bold lines, which are only for illustration and are not intended to be limiting. The bus 104 can be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, Figure 3 Only one thick line is used in the diagram, but this does not mean that there is only one bus or one type of bus.

[0171] Obviously, those skilled in the art may make various changes and modifications to this application without departing from the spirit and scope of this application. Thus, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application is intended to include these modifications and variations.

Claims

1. A chip investment plan simulation method, characterized in that: include: Obtaining production information of the wafer launch plan to be simulated; The production information includes first production material information of multiple batches that have not been put into production and a planned production time corresponding to the first production material information; According to the production information and the work-in-process information, the wafer production information is obtained; the work-in-process information includes the second production material information of multiple batches that have been put into production; the wafer production information includes the first production material information, the planned wafer launch time, the status information of the batch that has not been put into production, the second production material information, and the status information of the batch that has been put into production; the status information of the batch that has not been put into production is a waiting-to-transfer status; the status information of the batch that has not been put into production is an idle status or a production status; If it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state, and based on the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch is modified from the idle state to the production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

2. The method according to claim 1, characterized in that The step of obtaining wafer production information according to the wafer casting plan and the work-in-process information includes: Integrate the wafer casting plan and the work-in-process information to obtain first wafer production information; The status information of the un-produced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

3. The method according to claim 1, characterized in that The first production material information and the second production material information include the same information items.

4. The method according to claim 1, characterized in that The unproduced batch and the produced batch have multiple production steps; the state information of the target unproduced batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state, and according to the production instruction corresponding to the target unproduced batch, the state information of the target unproduced batch is modified from the idle state to the production state, including: The status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state corresponding to the current production step, and based on the receipt of a first production instruction corresponding to the target non-production batch, the status information of the target non-production batch is modified from the idle state to the production state corresponding to the current production step.

5. The method according to claim 4, characterized in that The production cycle simulation is to make each of the production steps enter the idle state and then enter the production state in sequence according to the production sequence; the method also includes: After the current production step of the target unproduced batch is completed, the following steps are performed until the production cycle simulation of the target unproduced batch is completed: Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step; After receiving a second production instruction corresponding to the next production step of the target unproduced batch, modifying the status information of the target unproduced batch from the idle state corresponding to the next production step to the production state corresponding to the next production step; The current production step of the target unproduced batch is assigned as the next production step.

6. The method according to claim 5, characterized in that After completing the production cycle simulation of the target unproduced batch, the method further includes: The status information of the target un-put-into-production batch is modified to a simulated production end state; the simulated production end state indicates that the corresponding un-put-into-production batch has been simulated.

7. The method according to any one of claims 4 to 6, characterized in that: The idle state of each of the production steps represents the process from the start of the step to the start of loading on the machine; the production state of each of the production steps represents the process from the start of loading on the machine to the end of unloading.

8. A film investment plan simulation device, characterized in that: include: An information acquisition unit, the information acquisition unit is used to acquire production information of a wafer investment plan to be simulated; The production information includes first production material information of multiple batches that have not been put into production and a planned production time corresponding to the first production material information; An information integration unit, the information integration unit is used to obtain wafer production information according to the production information and the work-in-process information; the work-in-process information includes the second production material information of multiple production batches; the wafer production information includes the first production material information, the planned production time, the status information of the batches not put into production, the second production material information, and the status information of the production batches; the status information of the batches not put into production is a waiting-to-transfer status; the status information of the batches not put into production is an idle status or a production status; A simulation monitoring unit, wherein if it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information will be modified to the idle state, and according to the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch will be modified from the idle state to the production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

9. The device according to claim 8, characterized in that The information integration unit is specifically used for: Integrate the wafer casting plan and the work-in-process information to obtain first wafer production information; The status information of the un-produced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

10. The device according to claim 8, characterized in that The first production material information and the second production material information include the same information items.

11. The device according to claim 8, characterized in that The unproduced batch and the produced batch have multiple production steps; the simulation monitoring unit is specifically used for: The status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state corresponding to the current production step, and based on the receipt of a first production instruction corresponding to the target non-production batch, the status information of the target non-production batch is modified from the idle state to the production state corresponding to the current production step.

12. The device according to claim 11, characterized in that The production cycle simulation is to make each of the production steps enter the idle state and then enter the production state in sequence according to the production sequence; the simulation monitoring unit is also used to: After the current production step of the target unproduced batch is completed, the following steps are performed until the production cycle simulation of the target unproduced batch is completed: Modify the status information of the target unproduced batch from the production status corresponding to the current production step to the idle status corresponding to the next production step; After receiving a second production instruction corresponding to the next production step of the target unproduced batch, modifying the status information of the target unproduced batch from the idle state corresponding to the next production step to the production state corresponding to the next production step; The current production step of the target unproduced batch is assigned as the next production step.

13. The device according to claim 12, characterized in that The simulation monitoring unit is further used for: After completing the production cycle simulation of the target un-produced batch, the status information of the target un-produced batch is modified to a simulated production end state; the simulated production end state indicates that the corresponding un-produced batch has been simulated.

14. The device according to any one of claims 11 to 13, characterized in that The idle state of each of the production steps represents the process from the start of the step to the start of loading on the machine; the production state of each of the production steps represents the process from the start of loading on the machine to the end of unloading.

15. A film investment plan simulation system, characterized in that: include: A memory, the memory being used to store data or program codes used when the chip investment plan simulation system is running; A processor, the processor is used to: obtain production information of a wafer investment plan to be simulated; the production information includes first production material information of multiple un-invested batches and a planned investment time corresponding to the first production material information; According to the production information and the work-in-process information, the wafer production information is obtained; the work-in-process information includes the second production material information of multiple batches that have been put into production; the wafer production information includes the first production material information, the planned wafer launch time, the status information of the batch that has not been put into production, the second production material information, and the status information of the batch that has been put into production; the status information of the batch that has not been put into production is a waiting-to-transfer status; the status information of the batch that has not been put into production is an idle status or a production status; If it is monitored that the system operation time reaches any of the planned wafer production times in the wafer production information, the status information of the target non-production batch corresponding to any of the planned wafer production times in the wafer production information is modified to the idle state, and based on the production instruction corresponding to the target non-production batch received, the status information of the target non-production batch is modified from the idle state to the production state; the production instruction is triggered when the target non-production batch meets the production scheduling rules.

16. The system according to claim 15, characterized in that The processor is specifically used for: Integrate the wafer casting plan and the work-in-process information to obtain first wafer production information; The status information of the un-produced batch in the first wafer production information is set to the pending transfer status, and the status information of the produced batch in the first wafer production information is set to the idle status or the production status to obtain the wafer production information.

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