Manufacturing Methods and Applications of Cable Temperature-Measuring Electronic Tags and Rolled Electronic Tags

By using cable temperature measurement electronic tags and package electronic tags based on RFID technology on the cable, the problem that cable identification in the prior art is difficult to effectively monitor and manage in complex environments, and the efficiency and accuracy of cable life management are achieved.

CN114239786BActive Publication Date: 2025-06-17BEIJING RXG TECH
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Patent Information

Application Number
CN202111248450.9
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2021-10-26
Publication Date
2025-06-17
Estimated Expiration
2041-10-26

AI Technical Summary

Technical Problem

In the prior art, cable markings mainly use inkjet codes, making it difficult to effectively monitor and manage the entire life of cables in complex environments, especially in terms of equipment asset inventory, quality control and traceability.

Method used

Using the method of producing cable temperature measurement electronic tags and packaged electronic tags based on radio frequency RFID technology, the FPC antenna is formed by bonding the RFID chip to a flexible circuit board, and dry-to-wet treatment and die-cutting, then the polyamide polymer material layer is punched and coated on aluminum foil. One end of the aluminum foil is bent to form a reserved gap. Finally, the FPC antenna is coated on the polyamide polymer material layer to prepare an electronic tag that can be suitable for complex environments.

Benefits of technology

It realizes automatic monitoring and identification of cable temperature in complex environments, improves the efficiency and accuracy of cable life management, and provides better services in equipment asset inventory, quality control and traceability.

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Abstract

The present invention discloses a manufacturing method and application of a cable temperature-measuring electronic tag and a roll-shaped electronic tag. The method includes: bonding an RFID chip to a flexible printed circuit board to form an FPC antenna, performing a dry-to-wet treatment on the FPC antenna, and die-cutting the FPC antenna after the dry-to-wet treatment; punching the polyimide polymer material layer to obtain accommodation holes for accommodating the RFID chip; laminating the punched polyimide polymer material layer on the aluminized foil after applying glue, and bending one end of the aluminized foil so that when the FPC antenna is attached to the polyimide polymer material layer, a gap with a preset width is reserved between the end of the aluminized foil and the end of the FPC antenna; laminating the FPC antenna on the polyimide polymer material layer after applying glue. This technological process can be applied to large-scale production and manufacturing, and the prepared electronic tags are suitable for complex environments, especially playing a leading role in the whole-life management of power equipment, and being able to better serve in equipment asset inventory, quality control, and tracing back to the source, etc.
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Description

Technical Field

[0001] The present invention relates to the field of RFID technology, and particularly relates to a method for manufacturing a cable temperature-measuring electronic tag and a roll-shaped electronic tag and their applications. Background Art

[0002] With the development of the national economy, higher and higher requirements have been put forward for the reliability of power system equipment. To implement the guiding opinions of relevant departments on actively promoting the innovation and application of the supply chain, the construction of a modern (intelligent) supply chain system of intelligent procurement, digital logistics, panoramic quality control, and intelligent operation has been carried out, creating a professional brand image, and achieving a series of remarkable results in promoting resource sharing, data integration, supply-demand docking, value creation, etc. At the same time, in the process of building a modern (intelligent) supply chain system, it has also been found that in each link and management department related to power materials, such as manufacturing, warehousing, distribution, engineering, and decommissioning, how to give full play to the leading role of the material department in the whole-life management of power equipment and better serve other business applications in addition to equipment asset inventory, quality control, and tracing back to the source is an important issue faced by the material department in the construction of the ubiquitous power Internet of Things. Summary of the Invention

[0003] Based on the understanding of material management technology, the inventors know that cables in the prior art are usually marked by inkjet coding. Therefore, for the cable equipment, which is one of the core equipment in power grid construction, the inventors carry out innovation in whole-life management based on radio frequency RFID technology. In view of the above problems, the present invention is proposed to provide a method for manufacturing a cable temperature-measuring electronic tag and a roll-shaped electronic tag and their applications that overcome or at least partially solve the above problems.

[0004] In a first aspect, an embodiment of the present invention provides a method for manufacturing a cable temperature-measuring electronic tag, which may include:

[0005] Bonding an RFID chip on a flexible printed circuit board to form an FPC antenna, performing a dry-to-wet treatment on the FPC antenna, and die-cutting the FPC antenna after the dry-to-wet treatment;

[0006] Punching holes in a polyimide polymer material layer to obtain accommodation holes for accommodating the RFID chip;

[0007] Laminating the punched polyimide polymer material layer on the aluminized foil after applying glue, and bending one end of the aluminized foil so that when the FPC antenna is attached to the polyimide polymer material layer, a gap with a preset width is reserved between the end of the aluminized foil and the end of the FPC antenna;

[0008] Laminating the FPC antenna on the polyimide polymer material layer after applying glue.

[0009] Optionally, after one end of the aluminum foil is bent, it may further include:

[0010] Apply glue to the side of the aluminum foil facing away from the bending direction, and laminate a release film.

[0011] Optionally, after laminating the FPC antenna on the glue-coated polyimide polymer material layer, it may further include:

[0012] Die-cut the finished cable temperature measurement electronic tag after laminating the FPC antenna on the glue-coated polyimide polymer material layer.

[0013] Optionally, after die-cutting the FPC antenna after dry-to-wet treatment, it may further include:

[0014] Inspect the FPC antenna, and reject unqualified die-cut products;

[0015] Rewrite and initialize the storage area of the RFID chip.

[0016] Optionally, after rewriting and initializing the storage area of the RFID chip, it may further include:

[0017] Laminating the identification information of the cable temperature measurement electronic tag on the surface of the FPC antenna.

[0018] Optionally, before laminating the identification information of the cable temperature measurement electronic tag on the surface of the FPC antenna, it may further include:

[0019] Inspect the FPC antenna again and reject unqualified products.

[0020] Optionally, after laminating the polyimide polymer material layer on the glue-coated aluminum foil, it may further include: laminating a thermoplastic polyester layer on the FPC antenna on the side facing away from the RFID chip.

[0021] Optionally, the polyimide polymer material layer is formed by laminating two layers of polyimide polymer materials.

[0022] In a second aspect, an embodiment of the present invention provides a method for manufacturing a roll-mounted electronic tag, which may include:

[0023] Bond an RFID chip to a flexible printed circuit board to form an FPC antenna, perform dry-to-wet treatment on the FPC antenna, and die-cut the FPC antenna after dry-to-wet treatment;

[0024] Punch holes in the polyimide polymer material layer to obtain accommodation holes for accommodating the RFID chip;

[0025] The polyimide polymer material layer after punching is laminated on the aluminized foil after coating with glue. One end of the aluminized foil is bent so that when the FPC antenna is attached to the polyimide polymer material layer, a gap with a preset width is reserved between the end of the aluminized foil and the end of the FPC antenna.

[0026] The FPC antenna is laminated on the polyimide polymer material layer after coating with glue.

[0027] Glue is applied to the side of the aluminized foil of multiple said electronic tags facing away from the bending direction, and after laminating a release film, they are wound into a roll of electronic tags.

[0028] Optionally, after laminating the FPC antenna on the polyimide polymer material layer after coating with glue, it further includes: laminating a thermoplastic polyester layer on the FPC antenna on the side facing away from the RFID chip.

[0029] In a third aspect, an embodiment of the present invention provides an application of the cable temperature measurement electronic tag prepared by the manufacturing method of the cable temperature measurement electronic tag described in the first aspect and / or the roll of electronic tags prepared by the manufacturing method of the roll of electronic tags described in the second aspect in cable identification.

[0030] The beneficial effects of the above technical solutions provided by the embodiments of the present invention at least include:

[0031] An embodiment of the present invention provides a manufacturing method and application of a cable temperature measurement electronic tag and a roll of electronic tags. The manufacturing method of the cable temperature measurement electronic tag may include: bonding an RFID chip to a flexible printed circuit board to form an FPC antenna, performing a dry-to-wet treatment on the FPC antenna, and die-cutting the FPC antenna after the dry-to-wet treatment; punching a polyimide polymer material layer to obtain a receiving hole for receiving the RFID chip; laminating the polyimide polymer material layer after punching on the aluminized foil after coating with glue. One end of the aluminized foil is bent so that when the FPC antenna is attached to the polyimide polymer material layer, a gap with a preset width is reserved between the end of the aluminized foil and the end of the FPC antenna; laminating the FPC antenna on the polyimide polymer material layer after coating with glue. The manufacturing method of the cable temperature measurement electronic tag provided in the embodiment of the present invention can be applied to large-scale production and manufacturing, and an electronic tag suitable for a complex environment can be prepared. The prepared electronic tag can play a leading role in the whole-life management of power equipment, especially for equipment asset inventory, quality control, and better service for traceability.

[0032] Other features and advantages of the present invention will be described in the subsequent specification, and some will become obvious from the specification or be understood by implementing the present invention. The objectives and other advantages of the present invention can be achieved and obtained through the structures specifically pointed out in the written specification and the drawings.

[0033] The technical solution of the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. Description of the Drawings

[0034] The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention, but do not constitute a limitation to the present invention. In the drawings:

[0035] Figure 1 It is a schematic flow chart of the manufacturing method of the cable temperature measurement electronic tag provided in Embodiment 1 of the present invention;

[0036] Figure 2 It is a schematic structural diagram of the cable temperature measurement electronic tag provided in Embodiment 1 of the present invention;

[0037] Figure 3 It is one of the schematic flow charts of the detailed manufacturing of the cable temperature measurement electronic tag provided in Embodiment 1 of the present invention;

[0038] Figure 4 It is the second of the schematic flow charts of the detailed manufacturing of the cable temperature measurement electronic tag provided in Embodiment 1 of the present invention;

[0039] Figure 5 It is a schematic flow chart of the manufacturing method of the roll-type electronic tag provided in Embodiment 2 of the present invention;

[0040] Among them, 21 is an FPC antenna; 211 is an RFID chip; 212 is a flexible circuit board; 22 is a polyimide polymer material layer; 221 is a receiving hole; 23 is glue; 24 is aluminum foil; 25 is a release film; 26 is a thermoplastic polyester layer. Detailed Embodiments

[0041] Hereinafter, exemplary embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided so that the present disclosure can be more thoroughly understood and the scope of the present disclosure can be fully conveyed to those skilled in the art.

[0042] In the description of the present invention, it should be noted that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", "far", "near", "front", "rear", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present invention. In addition, the terms "first", "second", "third" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance.

[0043] In the description of the present invention, it should be noted that unless otherwise clearly specified and limited, the terms "installed", "connected", "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

[0044] Embodiment 1

[0045] In Embodiment 1 of the present invention, a manufacturing method of a cable temperature-measuring electronic tag is provided. The cable temperature-measuring electronic tag provided in Embodiment 1 of the present invention belongs to a single / monomeric electronic tag, and the shape of the tag can be similar to the shape of a band-aid and is used alone as an RFID passive electronic tag. Moreover, the cable temperature-measuring electronic tag in the embodiment of the present invention has the function of anti-metal interference. When it is used, it is attached to the cable and can timely monitor the change of the cable temperature.

[0046] Refer to Figures 1 to 3 As shown, the method may include the following steps:

[0047] Step S111: Bond the RFID chip 211 on the flexible printed circuit board 212 to form the FPC antenna 21, perform a dry-to-wet treatment on the FPC antenna 21, and die-cut the FPC antenna 21 after the dry-to-wet treatment.

[0048] In this embodiment, the flexible printed circuit board serves as a cable. After bonding the RFID chip, it can supply power to the RFID chip and transmit data. The dry-to-wet treatment is to avoid the electronic tag produced from foaming or being unevenly pasted during use. For example, when it is attached to a cable or electromechanical equipment, it adsorbs the moisture on the adsorption surface, resulting in the tag foaming and being unevenly pasted. Die-cutting means die-cutting the required size according to the specified specifications of the electronic tag and removing the excess waste.

[0049] Step S112: Punch the polyimide polymer material layer 22 to obtain a receiving hole 221 for accommodating the RFID chip 211.

[0050] Since the RFID chip has a certain thickness, when pasted together, in order to avoid the overall appearance of the electronic tag being more flat and to effectively protect the RFID chip better. Therefore, in this step, the polyimide polymer material layer needs to be punched with a hole of the size of the chip to obtain a receiving hole for accommodating the RFID chip. The punching technology can be the existing technology in die-cutting and punching, which will not be elaborated in this embodiment.

[0051] It should be noted here that the above polyimide polymer material layer in this embodiment is composed of two layers of polyimide polymer materials laminated together. Therefore, before punching, the single-layer polyimide polymer materials need to be laminated into a double layer.

[0052] Step S113: Laminate the punched polyimide polymer material layer 22 on the aluminum foil 24 after applying the adhesive 23. One end of the aluminum foil 24 is bent so that when the FPC antenna 21 is attached to the polyimide polymer material layer 22, there is a gap with a preset width between the end of the aluminum foil 24 and the end of the FPC antenna 21.

[0053] The application environment of the cable temperature-measuring electronic tag is very complex, so the tag must be designed to be metal-resistant. As is well known, metal has a great influence on radio frequency signals (because radio frequency signals are electromagnetic signals, and metal has an adsorption effect on electromagnetic signals). In this environment, metal-resistant tags were born, and their working principle mainly relies on the medium that isolates from the metal (to increase the distance between the metal surface and the tag), and at the same time regards the metal as a reflecting surface to improve the characteristics of the tag on the metal. The metal-resistant tag is an electronic tag encapsulated with a special anti-magnetic wave-absorbing material, which technically solves the problem that the electronic tag cannot be attached to the metal surface for use. Therefore, in the embodiment of the present invention, aluminum foil is used as the anti-magnetic wave-absorbing material.

[0054] It should be noted here that the aluminum foil needs to be bent at the end. The radio frequency signal between the electronic tag and the reader is spatially (contactless) coupled through the coupling element. In the coupling channel, according to the timing relationship, the energy transfer and data exchange are realized; there are two types of their coupling.

[0055] 1) Electromagnetic backscatter coupling: The radar principle model, the electromagnetic wave emitted hits the target and then reflects, and at the same time carries back the target information, based on the spatial propagation law of the electromagnetic wave.

[0056] 2) Inductive coupling: Transformer model, which realizes coupling through a high-frequency alternating magnetic field in space and is based on the law of electromagnetic induction. Scope of application: The inductive coupling method is generally suitable for short-range radio frequency identification systems operating at medium and low frequencies. Typical operating frequencies are: 125 kHz, 225 kHz, and 13.56 MHz. The identification operating distance is less than 1 m, and the typical operating distance is 10 - 20 cm.

[0057] 3) Electromagnetic backscatter coupling method: Generally suitable for long-range radio frequency identification systems operating at high frequencies and microwaves. Typical operating frequencies are: 433 MHz, 915 MHz, 2.45 GHz, 5.8 GHz. The identification operating distance is greater than 1 m, and the typical operating distance is 3 - 10 m.

[0058] The metal-resistant cable fixed-size temperature-measuring tag uses the electromagnetic backscatter coupling method. The aluminum foil needs to be bent and bent to the plane where the FPC antenna is located, and a certain distance is maintained between the aluminum foil and the FPC antenna to form a slot coupling structure, so as to cope with complex environments.

[0059] Step S114: Laminate the FPC antenna 21 on the polyimide polymer material layer 22 after applying glue.

[0060] In the method for manufacturing the above cable temperature-measuring electronic tag provided in the embodiment of the present invention, the process flow can be applied to large-scale production and manufacturing, and an electronic tag suitable for complex environments can be prepared. The prepared electronic tag plays a leading role in the whole-life management of power equipment, especially for better services such as equipment asset inventory, quality control, and traceability.

[0061] For example, during the cable monitoring process, a special temperature-measuring tool is required to align with the outer sheath of the cable to read the temperature. In the embodiment of the present invention, by integrating a temperature-measuring sensor module in the RFID chip, automatic temperature measurement of the cable can be realized, and the operating temperature of the cable can be conveniently obtained through a reader, making the electronic tag more suitable for the application scenario of cable identification.

[0062] In a more specific embodiment, refer to Figure 4 and Figure 2 As shown, the method may specifically include the following steps:

[0063] Step S411: Bond the RFID chip 211 on the flexible printed circuit board 212 to form the FPC antenna 21, perform a dry-to-wet treatment on the FPC antenna 21, and die-cut the FPC antenna 21 after the dry-to-wet treatment.

[0064] This step can refer to the above step S111 and will not be elaborated here. Of course, before this, it is necessary to inspect the incoming FPC materials, that is, determine the quantity and batch number of the FPC antennas.

[0065] Step S412: Detect the FPC antenna 21 and reject unqualified die-cut products.

[0066] Refer to Figure 3 As shown, the detection method may include sampling inspection, visual inspection, etc. The embodiments of the present invention do not specifically limit this detection method.

[0067] Step S413: Rewrite and initialize the storage area of the RFID chip 211.

[0068] Since the RFID chip contains multiple storable areas, it is necessary to expand the storage of the EPC area, that is, it is necessary to modify the parameters of the PC bits. For example, rewrite the PC bit 3000 in the RFID chip to 4000 and record the TID.

[0069] Step S414: Detect the FPC antenna 21 again and reject unqualified products.

[0070] Step S415: Laminate the identification information of the cable temperature measurement electronic tag on the surface of the FPC antenna 21.

[0071] After initialization, laminate the surface material on the surface of the FPC antenna. The surface material may include company information, product information, etc., which is convenient for subsequent product production.

[0072] Step S416: Punch the polyimide polymer material layer 22 to obtain a receiving hole 221 for receiving the RFID chip 211.

[0073] This step may refer to the above step S112 and will not be elaborated here.

[0074] It should be noted that the above polyimide polymer material layer is composed of two layers of polyimide polymer materials laminated together. The raw material of the polyimide polymer material is soft and thin, and it needs to be laminated into the required shape and size according to requirements.

[0075] Step S417: Laminate the punched polyimide polymer material layer 22 on the aluminum foil 24 after applying glue 23.

[0076] Step S418: Laminate the thermoplastic polyester layer 26 on the FPC antenna 21 on the side away from the RFID chip 211.

[0077] The thermoplastic polyester layer may be provided with the identity identification of the electronic tag. For example, the manufacturer identification and the identity (ID) information of the electronic tag may be printed on the side of the thermoplastic polyester layer away from the RFID chip. The embodiments of the present invention do not specifically limit this. Of course, the thermoplastic polyester layer can also play a buffering role for the above electronic tag and further protect the FPC antenna inside the tag.

[0078] Step S419: Apply adhesive 23 on the side of the aluminum foil 24 facing away from the bending direction, and laminate the release film 25.

[0079] For the semi-finished product with the aluminum foil laminated, adhesive needs to be applied at the bottom of the aluminum foil. After the product is formed, it can be pasted on the surface of an object. Moreover, the surface of the release film undergoes a special process, making it easy to peel off the adhesive pasted on it.

[0080] Step S420: Laminate the FPC antenna 21 on the polyimide polymer material layer 22 after applying the adhesive.

[0081] In this step, the FPC antenna 21 is laminated on the polyimide polymer material layer 22 after applying the adhesive. During the lamination process, the position of the accommodation hole punched in the polyimide polymer material should correspond to the lamination of the RFID chip without deviation. Otherwise, the RFID chip will not be protected and the performance of the product is likely to deviate due to external pressure.

[0082] Step S421: Die-cut the finished cable temperature measurement electronic tag after laminating the FPC antenna 21 on the polyimide polymer material layer 22 after applying the adhesive 23.

[0083] In this step, the laminated semi-finished product is die-cut to meet the requirements of the size, ultimately meeting the requirements of the finished product.

[0084] Of course, the embodiment of the present invention may also include consistency inspection, appearance inspection, etc. Before leaving the warehouse, consistency detection of the product performance needs to be carried out to ensure that the product performance will not be uneven. Then, after the cable temperature measurement electronic tag is manufactured, it is placed in the packing box according to the packaging requirements.

[0085] Based on the same inventive concept, the embodiment of the present invention also provides an application of the cable temperature measurement electronic tag prepared by the manufacturing method of the above cable temperature measurement electronic tag in cable identification.

[0086] Embodiment 2

[0087] Embodiment 2 of the present invention provides a manufacturing method of a roll-type electronic tag. Referring to Figure 5 as shown, the method may include the following steps:

[0088] Step S511: Bond the RFID chip on the flexible printed circuit board to form an FPC antenna, perform a dry-to-wet treatment on the FPC antenna, and die-cut the FPC antenna after the dry-to-wet treatment.

[0089] Step S512: Punch the polyimide polymer material layer to obtain accommodation holes for accommodating the RFID chip.

[0090] Step S513: Laminate the punched polyimide polymer material layer onto the aluminized foil after applying adhesive. Bend one end of the aluminized foil so that when the FPC antenna is attached to the polyimide polymer material layer, there is a gap with a preset width between the end of the aluminized foil and the end of the FPC antenna.

[0091] Step S514: Laminate the FPC antenna onto the polyimide polymer material layer after applying adhesive.

[0092] Step S515: Apply adhesive to the side of the aluminized foil of multiple electronic tags that faces away from the bending direction, laminate a release film, and wind it into a roll of electronic tags.

[0093] In this step, during the product manufacturing process, it needs to be laminated onto the release film to facilitate winding for subsequent process manufacturing, and preparing the roll of electronic tags is convenient for industrial labeling. For example, using labeling machine equipment to quickly attach the roll of electronic tags to the cable.

[0094] In an optional embodiment, after laminating the FPC antenna onto the polyimide polymer material layer after applying adhesive, it may further include: laminating a thermoplastic polyester layer onto the FPC antenna on the side facing away from the RFID chip.

[0095] Based on the same inventive concept, the embodiments of the present invention also provide an application of the roll of electronic tags prepared by the manufacturing method of the above roll of electronic tags in cable identification.

[0096] Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present invention. The present disclosure is not limited to the exact structure described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present disclosure is only limited by the appended claims. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalent technologies, the present invention also intends to include these modifications and variations.

Claims

1. A manufacturing method of a cable temperature - measuring electronic tag, characterized in that, include: Bonding the RFID chip to a flexible circuit board to form an FPC antenna, performing a dry-to-wet conversion process on the FPC antenna, and die-cutting the FPC antenna after the dry-to-wet conversion process; Punching the polyamide polymer material layer to obtain a receiving hole for receiving the RFID chip; Laminating the punched polyamide polymer material layer on the coated aluminum foil, and bending one end of the aluminum foil so that when the FPC antenna and the polyamide polymer material layer are attached, a gap of a preset width is reserved between the end of the aluminum foil and the end of the FPC antenna to achieve spatial coupling of the radio frequency signal; Applying glue on the side of the aluminum foil away from the bending direction, and applying a release film; Laminating a thermoplastic polyester layer on the FPC antenna on the side facing away from the RFID chip; The FPC antenna is laminated on the coated polyamide polymer material layer.

2. The method according to claim 1, characterized in that, After laminating the FPC antenna on the polyamide polymer material layer after the adhesive coating, the method further includes: The finished cable temperature measuring electronic label after the FPC antenna is laminated on the polyamide polymer material layer after the adhesive is coated is die-cut.

3. The manufacturing method according to claim 1, characterized in that, After die-cutting the FPC antenna after the dry-to-wet process, the method further includes: Testing the FPC antenna and removing unqualified die-cut products; The storage area of ​​the RFID chip is rewritten and initialized.

4. The manufacturing method according to claim 3, characterized in that, After rewriting and initializing the storage area of ​​the RFID chip, the method further includes: The identification information of the cable temperature measuring electronic tag is laminated on the surface of the FPC antenna.

5. The manufacturing method according to claim 4, characterized in that, Before the identification information of the cable temperature measuring electronic tag is covered on the surface of the FPC antenna, the method further includes: The FPC antenna is tested again to remove unqualified products.

6. The method according to any one of claims 1 to 5, characterized in that, The polyamide polymer material layer is formed by laminating two layers of polyamide polymer materials.

7. A manufacturing method of a roll - type electronic tag, characterized in that, include: Bonding the RFID chip to a flexible circuit board to form an FPC antenna, performing a dry-to-wet conversion process on the FPC antenna, and die-cutting the FPC antenna after the dry-to-wet conversion process; Punching the polyamide polymer material layer to obtain a receiving hole for receiving the RFID chip; Laminating the punched polyamide polymer material layer on the coated aluminum foil, and bending one end of the aluminum foil so that when the FPC antenna and the polyamide polymer material layer are attached, a gap of a preset width is reserved between the end of the aluminum foil and the end of the FPC antenna to achieve spatial coupling of the radio frequency signal; Laminating a thermoplastic polyester layer on the FPC antenna on the side facing away from the RFID chip; Laminating the FPC antenna on the coated polyamide polymer material layer; The sides of the aluminum foils of the plurality of electronic labels facing away from the bending direction are coated with glue, and then laminated with release films and rolled up into a rolled electronic label.

8. Application of a cable temperature - measuring electronic tag prepared by the manufacturing method of the cable temperature - measuring electronic tag according to any one of claims 1 to 6 in cable identification.

9. Application of a roll - type electronic tag prepared by the manufacturing method of the roll - type electronic tag according to claim 7 in cable identification.

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