Expansion card assembly and water cooling device

Abstract

An expansion card assembly and a water-cooled heat dissipation device, the water-cooled heat dissipation device is used to be thermally coupled to an interface card. The water-cooled heat dissipation device includes a water-cooling head and a water-cooling row. The water-cooling head is thermally coupled to the interface card. The water-cooling row includes a first water tank, a second water tank and a heat dissipation channel structure. The first water tank and the second water tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of fluid conveying parts. The first chamber of the first water tank and the second chamber of the second water tank are respectively connected to opposite sides of the heat dissipation channel structure, and one end of all of these fluid conveying parts of the heat dissipation channel structure is connected to the first chamber of the first water tank. The other ends of all of these fluid conveying parts are connected to the second chamber of the second water tank, and the first chamber and the second chamber are connected to the water-cooling head to form a cooling cycle.

Description

Technical Field

[0001] The invention relates to an expansion card assembly and a water-cooling heat dissipation device, in particular to an expansion card assembly and a water-cooling heat dissipation device with a horizontal blowing heat dissipation method. Background Art

[0002] With the development and progress of science and technology, computers have gradually become an indispensable necessity in people's daily lives. In order to enable computers to meet various functional requirements, the motherboard of a computer usually has multiple function expansion slots for installing these function expansion cards such as display cards, sound cards, network cards, etc. to enhance its additional functions. When the function expansion card is in operation, the current in the circuit will generate heat due to the influence of impedance. If this heat cannot be effectively removed and accumulates on the electronic components inside the function expansion card, the electronic components may be damaged due to the increasing temperature.

[0003] In order to improve the heat dissipation efficiency of the function expansion card, a heat dissipation device is generally used to quickly remove the heat generated by the function expansion card. However, the heat dissipation efficiency of the current heat dissipation device for the function expansion card is still insufficient. Therefore, how to further improve the heat dissipation efficiency of the heat dissipation device for the function expansion card has become a major design issue. Summary of the invention

[0004] The invention provides an expansion card assembly and a water-cooling heat dissipation device, so as to improve the heat dissipation efficiency of the heat dissipation device for the function expansion card.

[0005] An expansion card assembly disclosed in one embodiment of the present invention includes an interface card, a water-cooled heat dissipation device and an airflow generator. The water-cooled heat dissipation device includes a water-cooled head and a water-cooled radiator. The water-cooled head is thermally coupled to the interface card. The water-cooled radiator includes a first water tank, a second water tank and a heat dissipation channel structure. The first water tank and the second water tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of fluid conveying parts. The first chamber of the first water tank and the second chamber of the second water tank are respectively connected to opposite sides of the heat dissipation channel structure, and one end of all these fluid conveying parts of the heat dissipation channel structure is connected to the first chamber of the first water tank. The other ends of all these fluid conveying parts are connected to the second chamber of the second water tank, and the first chamber and the second chamber are connected to the water-cooled head to form a cooling cycle. The airflow generator is located next to the water-cooled radiator and is used to generate an airflow to the heat dissipation channel structure of the water-cooled radiator.

[0006] Another embodiment of the present invention discloses a water-cooled heat dissipation device for thermally coupling to an interface card. The water-cooled heat dissipation device includes a water-cooling head and a water-cooling row. The water-cooling head is thermally coupled to the interface card. The water-cooling row includes a first water tank, a second water tank and a heat dissipation channel structure. The first water tank and the second water tank have a first chamber and a second chamber, respectively. The heat dissipation channel structure includes a plurality of fluid conveying parts. The first chamber of the first water tank and the second chamber of the second water tank are respectively connected to opposite sides of the heat dissipation channel structure, and one end of all these fluid conveying parts of the heat dissipation channel structure is connected to the first chamber of the first water tank. The other ends of all these fluid conveying parts are connected to the second chamber of the second water tank, and the first chamber and the second chamber are connected to the water-cooling head to form a cooling cycle.

[0007] According to the expansion card assembly and the water-cooling heat sink of the above-mentioned embodiment, one end of all the fluid conveying members of the heat dissipation channel structure is connected to the first chamber of the first water tank, and the other end of all the fluid conveying members is connected to the second chamber of the second water tank, so that each chamber does not produce a situation where cold and hot fluids intersect, thereby improving the heat dissipation efficiency of the water-cooling heat sink.

[0008] The above description of the content of the present invention and the following description of the embodiments are intended to demonstrate and explain the principles of the present invention and to provide further explanation of the claims of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0009] Figure 1 is a three-dimensional schematic diagram of an expansion card assembly according to a first embodiment of the present invention;

[0010] Figure 2 for Figure 1 Schematic diagram of the exploded view of the water cooling device;

[0011] Figure 3 for Figure 2 A three-dimensional schematic diagram of a water cooling head;

[0012] Figure 4 for Figure 1 Schematic cross-section diagram of .

[0013]

Explanation of symbols

[0014] 10...Expansion card assembly

[0015] 100...Interface card

[0016] 110...Circuit board

[0017] 111...Component setting page

[0018] 120...Baffle

[0019] 200...Water cooling device

[0020] 210...Water cooling head

[0021] 211...Thermal contact surface

[0022] 212...Evaporation chamber

[0023] 213...Fluid inlet

[0024] 214...Fluid outlet

[0025] 215...Impeller

[0026] 220...Water cooling radiator

[0027] 221...First water tank

[0028] 2211...First Chamber

[0029] 222...Second water tank

[0030] 2221...Second chamber

[0031] 223...Heat dissipation channel structure

[0032] 2231...Fluid conveying parts

[0033] 2232...Heat dissipation structure

[0034] 2235...Side edge

[0035] 224...First fluid connector

[0036] 225...Second fluid connector

[0037] 230...First flow tube

[0038] 240...Second flow tube

[0039] 300...Airflow generator

[0040] 400...Housing

[0041] 410...Ventilation

[0042] A...Side by side direction

[0043] H1, H2...Thickness

[0044] N...Normal direction

[0045] S1... Accommodation space DETAILED DESCRIPTION

[0046] See also Figures 1 to 4 . Figure 1 FIG. 4 is a perspective schematic diagram of an expansion card assembly according to a first embodiment of the present invention. Figure 2 for Figure 1 Schematic diagram of the water cooling device. Figure 3 for Figure 2 A three-dimensional schematic diagram of a water cooling head. Figure 4 for Figure 1 Schematic cross-section diagram of .

[0047] The expansion card assembly 10 of this embodiment is, for example, a display card assembly. The expansion card assembly 10 includes an interface card 100, a water cooling device 200, and an airflow generator 300. The interface card 100 is, for example, a display card. The interface card 100 includes a circuit board 110 and a baffle 120. The baffle 120 is disposed on one side of the circuit board 110. The circuit board 110 is, for example, installed on a housing (not shown) through the baffle 120, and the baffle 120 has, for example, a plurality of openings for the input and output connectors to pass through. The input and output connectors are, for example, signal transmission lines.

[0048] The water-cooled heat sink 200 includes a water-cooled head 210 and a water-cooled row 220. The water-cooled head 210 has a thermal contact surface 211. The thermal contact surface 211 is thermally coupled to a heat source of the interface card 100, such as a processor. The water-cooled head 210 has an evaporation chamber 212, a fluid inlet 213, and a fluid outlet 214. The fluid inlet 213 and the fluid outlet 214 are connected to the evaporation chamber 212. The water-cooled head 210 may also include an impeller 215, which is located in the evaporation chamber 212, and the projection of the extension surface of the thermal contact surface 211 is at least partially located outside the thermal contact surface 211. The impeller 215 can rotate and drive the cooling fluid in the evaporation chamber 212 to flow from the fluid inlet 213 to the fluid outlet 214.

[0049] In the expansion card assembly of this embodiment, the water cooling head includes a plurality of heat dissipation columns, and the projections of the heat dissipation columns on the extension surfaces of the thermal contact surface are located on the thermal contact surface.

[0050] The water cooling radiator 220 includes a first water tank 221, a second water tank 222 and a heat dissipation channel structure 223. The first water tank 221 and the second water tank 222 have a first chamber 2211 and a second chamber 2221, respectively. The heat dissipation channel structure 223 includes a plurality of fluid conveying members 2231. The first chamber 2211 of the first water tank 221 and the second chamber 2221 of the second water tank 222 are respectively connected to opposite sides of the heat dissipation channel structure 223, and one end of all of the fluid conveying members 2231 of the heat dissipation channel structure 223 is connected to the first chamber 2211 of the first water tank 221, and the other end of all of the fluid conveying members 2231 is connected to the second chamber 2221 of the second water tank 222, and the first chamber 2211 and the second chamber 2221 are connected to the evaporation chamber 212 of the water cooling head 210 to form a cooling cycle.

[0051] In detail, the water cooling device 200 further includes a first flow tube 230 and a second flow tube 240. The water cooling radiator 220 further includes a first fluid connector 224 and a second fluid connector 225. The first fluid connector 224 and the second fluid connector 225 are respectively disposed in the first water tank 221 and the second water tank 222. The first fluid connector 224 is connected to the fluid outlet 214 of the water cooling head 210 through the first flow tube 230. The second fluid connector 225 is connected to the fluid inlet 213 of the water cooling head 210 through the second flow tube 240.

[0052] In this embodiment, the heat dissipation channel structure 223 further includes a plurality of heat dissipation structures 2232 . These heat dissipation structures 2232 are, for example, heat dissipation fins, and any one of these heat dissipation structures 2232 is connected to any two adjacent fluid conveying members 2231 .

[0053] In this embodiment, the first water tank 221 and the second water tank 222 protrude from a side edge 2235 of the heat dissipation channel structure 223 close to the interface card 100, and the first water tank 221 and the second water tank 222 and the heat dissipation channel structure 223 together surround an accommodating space S1, the water cooling head 210 is at least partially located in the accommodating space S1, and the opposite sides of the water cooling head 210 are separated from the first water tank 221 and the second water tank 222 respectively.

[0054] In this embodiment, the first water tank 221 and the second water tank 222 protrude from the side edge 2235 of the heat dissipation channel structure 223 close to the interface card 100, but the present invention is not limited thereto. In other embodiments, one side of the first water tank and the second water tank may also be flush with the side edge 2235 of the heat dissipation channel structure 223 close to the interface card 100.

[0055] In this embodiment, the circuit board 110 of the interface card 100 has a component placement surface 111 and defines a parallel direction A, which is perpendicular to the normal direction N of the component placement surface 111. The fluid conveying members 2231 are divided into a plurality of groups. The fluid conveying members 2231 of each group are arranged along the normal direction N of the component placement surface 111 of the interface card 100, and the groups of the fluid conveying members 2231 are arranged at intervals along the parallel direction A.

[0056] In this embodiment, the fluid conveying members 2231 are divided into multiple groups and arranged at intervals, but the present invention is not limited thereto. In other embodiments, there may be only one group of fluid conveying members, which extend from one end of the first water tank to the other end of the first water tank.

[0057] In this embodiment, at least two groups of the fluid transporting members 2231 have different thicknesses in the normal direction N of the device placement surface 111 , that is, the thickness H1 of one group of the fluid transporting members 2231 is greater than the thickness H2 of the other group of the fluid transporting members 2231 .

[0058] In this embodiment, at least two groups of the fluid transport members 2231 have different thicknesses in the normal direction N of the component setting surface 111, but the invention is not limited thereto. In other embodiments, the thicknesses of the fluid transport members 223 in the normal direction N of the component setting surface 111 may also be the same, or the thickness design values ​​of each group of the fluid transport members 223 in the normal direction N of the component setting surface 111 may be changed according to the shape of the water cooling head 210.

[0059] The airflow generator 300 is, for example, a centrifugal fan, and the water cooling radiator 220 is disposed between the baffle 120 of the interface card 100 and the airflow generator 300. The airflow generator 300 is used to generate a lateral airflow toward the heat dissipation channel structure 223 of the water cooling radiator 220, so as to quickly remove the heat generated by the interface card 100 through the opening of the baffle 120.

[0060] In this embodiment, the expansion card assembly 10 may further include a housing 400. The housing 400 has a vent 410. The housing 400 is mounted on the circuit board 110 and covers the water cooling device 200 and the airflow generator 300. The airflow generator 300 draws in external airflow through the vent 410 of the housing 400 and flows out from the opening of the baffle 120.

[0061] According to the expansion card assembly and the water-cooling heat sink of the above-mentioned embodiment, one end of all the fluid conveying members of the heat dissipation channel structure is connected to the first chamber of the first water tank, and the other end of all the fluid conveying members is connected to the second chamber of the second water tank, so that each chamber does not produce a situation where cold and hot fluids intersect, thereby improving the heat dissipation efficiency of the water-cooling heat sink.

[0062] In addition, the two opposite sides of the water cooling head are respectively separated from the first water tank and the second water tank and are indirectly connected to the first water tank and the second water tank through the flow pipe, which can improve the manufacturing convenience of the water cooling device.

[0063] Although the present invention is disclosed as above with the aforementioned embodiments, they are not used to limit the present invention. Anyone familiar with similar skills can make some changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of patent protection of the present invention shall be based on the scope defined by the claims attached to this specification.

Claims

1. An expansion card assembly, characterized in that: Include: An interface card; A water cooling device, comprising: a water cooling head thermally coupled to the interface card; and A water-cooling radiator, comprising a first water tank, a second water tank and a heat dissipation channel structure, wherein the first water tank and the second water tank respectively have a first chamber and a second chamber, and the heat dissipation channel structure comprises a plurality of fluid conveying members, the first chamber of the first water tank and the second chamber of the second water tank are respectively connected to opposite sides of the heat dissipation channel structure, and one end of all the fluid conveying members of the heat dissipation channel structure is connected to the first chamber of the first water tank, and the other end of all the fluid conveying members is connected to the second chamber of the second water tank, and the first chamber and the second chamber are connected to the water cooling head to form a cooling cycle, the first water tank and the second water tank protrude from a side edge of the heat dissipation channel structure close to the interface card, and the first water tank, the second water tank and the heat dissipation channel structure jointly surround an accommodation space, the water cooling head is at least partially located in the accommodation space, and opposite sides of the water cooling head are respectively separated from the first water tank and the second water tank; and An airflow generator is located beside the water cooling radiator and is used to generate airflow to the heat dissipation channel structure of the water cooling radiator.

2. The expansion card assembly according to claim 1, wherein: The interface card has a component setting surface, which defines a side-by-side direction perpendicular to the normal direction of the component setting surface. The fluid transport components are divided into multiple groups, and the fluid transport components of each group are arranged along the normal direction of the component setting surface of the interface card, and each group of the fluid transport components is arranged at intervals along the side-by-side direction.

3. The expansion card assembly according to claim 2, wherein: At least two groups of the fluid transport components have different heights in the normal direction of the element placement surface.

4. The expansion card assembly according to claim 2, wherein: The heat dissipation channel structure further includes a plurality of heat dissipation structures, and any one of the heat dissipation structures is connected to any two adjacent fluid conveying members.

5. The expansion card assembly according to claim 1, wherein: The water-cooling heat dissipation device also includes a first flow tube and a second flow tube. The water-cooling head has an evaporation chamber, a fluid inlet and a fluid outlet. The fluid inlet and the fluid outlet are connected to the evaporation chamber. The water-cooling row also includes a first fluid connector and a second fluid connector. The first fluid connector and the second fluid connector are respectively arranged on the first water tank and the second water tank. The first fluid connector is connected to the fluid outlet of the water-cooling head through the first flow tube, and the second fluid connector is connected to the fluid inlet of the water-cooling head through the second flow tube.

6. The expansion card assembly according to claim 1, wherein: The water cooling head has a thermal contact surface for thermally contacting the interface card. The water cooling head includes an impeller. The projection of the impeller on the extension surface of the thermal contact surface is at least partially located outside the thermal contact surface.

7. The expansion card assembly according to claim 6, wherein: The water cooling head comprises a plurality of heat dissipation columns, and the projections of the heat dissipation columns on the extension surfaces of the heat contact surface are located on the heat contact surface.

8. The expansion card assembly according to claim 1, wherein: The interface card includes a circuit board and a baffle, wherein the baffle is arranged on one side of the circuit board, and the water cooling row is located between the baffle and the airflow generator.

9. The expansion card assembly according to claim 8, wherein: The airflow generator is a centrifugal fan.

10. A water cooling device, characterized in that: Used for thermal coupling to an interface card, comprising: a water cooling head for thermally coupling to the interface card; and A water cooling radiator comprises a first water tank, a second water tank and a heat dissipation channel structure, the first water tank and the second water tank respectively have a first chamber and a second chamber, the heat dissipation channel structure comprises a plurality of fluid conveying parts, the first chamber of the first water tank and the second chamber of the second water tank are respectively connected to opposite sides of the heat dissipation channel structure, and one end of all the fluid conveying parts of the heat dissipation channel structure is connected to the first chamber of the first water tank, and the other end of all the fluid conveying parts is connected to the second chamber of the second water tank, and the first chamber and the second chamber are connected to the water cooling head to form a cooling cycle, the first water tank and the second water tank protrude from a side edge of the heat dissipation channel structure close to the interface card, and the first water tank, the second water tank and the heat dissipation channel structure jointly surround an accommodating space, the water cooling head is at least partially located in the accommodating space, and opposite sides of the water cooling head are respectively separated from the first water tank and the second water tank.

11. The water cooling device according to claim 10, characterized in that: The interface card has a component setting surface, which defines a side-by-side direction perpendicular to the normal direction of the component setting surface. The fluid transport components are divided into multiple groups, and the fluid transport components of each group are arranged along the normal direction of the component setting surface of the interface card, and each group of the fluid transport components is arranged at intervals along the side-by-side direction.

12. The water cooling device according to claim 11, characterized in that: At least two groups of the fluid transport components have different heights in the normal direction of the element placement surface.

13. The water cooling device according to claim 11, characterized in that: The heat dissipation channel structure further includes a plurality of heat dissipation structures, and any one of the heat dissipation structures is connected to any two adjacent fluid conveying members.

14. The water cooling device according to claim 10, characterized in that: It also includes a first flow tube and a second flow tube. The water cooling head has an evaporation chamber, a fluid inlet and a fluid outlet. The fluid inlet and the fluid outlet are connected to the evaporation chamber. The water cooling row also includes a first fluid connector and a second fluid connector. The first fluid connector and the second fluid connector are respectively arranged on the first water tank and the second water tank. The first fluid connector is connected to the fluid outlet of the water cooling head through the first flow tube, and the second fluid connector is connected to the fluid inlet of the water cooling head through the second flow tube.

15. The water cooling device according to claim 10, characterized in that: The water cooling head has a thermal contact surface for thermally contacting the interface card. The water cooling head includes an impeller. The projection of the impeller on the extension surface of the thermal contact surface is at least partially located outside the thermal contact surface.

16. The water cooling device according to claim 15, characterized in that: The water cooling head comprises a plurality of heat dissipation columns, and the projections of the heat dissipation columns on the extension surfaces of the heat contact surface are located on the heat contact surface.

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