Method, medium and device for generating parameterized bonding data based on bonding wire model

Abstract

The present invention provides a method, medium and device for generating parameterized bonding data based on a bonding wire model, wherein the method for generating parameterized bonding data based on a bonding wire model comprises: obtaining matching parameters in an integrated circuit design file; selecting bonding wire models that meet a preset matching range from a bonding wire model library according to the matching parameters; performing interference simulation inspection on the selected bonding wire models; and generating parameterized bonding data using the bonding wire models that pass the interference simulation inspection. The present invention uses data learning and optimization judgment to replace manual operation, greatly improving work efficiency and quality, thereby further reducing the production cost of the enterprise.

Description

Technical Field

[0001] The present invention belongs to the technical field of integrated circuit packaging, and relates to a method for generating bonding data, and in particular to a method, medium and device for generating parameterized bonding data based on a bonding wire model. Background Art

[0002] As electronic products such as mobile phones and laptops develop towards miniaturization, portability, ultra-thinness, multimedia, and low cost to meet the needs of the general public, high-density, high-performance, high-reliability, and low-cost packaging and assembly technologies have developed rapidly. Among them, wire bonding technology, as a key process for integrated circuit packaging, has been widely used in the modern semiconductor industry. Its main purpose is to achieve electrical connection between chips and external circuits, and between chips. With the development of systematization and integration of device packaging, there are more and more bonding wires inside the package, so the packaging bonding procedure required in production and manufacturing has become very important.

[0003] At present, most of the packaging bonding programs produced in the industry adopt the method of manually setting various parameters. On the one hand, this method is too inefficient, and on the other hand, the accuracy and adaptability are too poor, and it relies more on experience. In addition, there is a method in the prior art that uses the bonding point coordinate data to automatically generate a bonding program through formula calculation. This method also has some problems in practical applications: for example, when certain objective conditions of the bonding equipment change, the bonding data generated by calculation cannot achieve accurate adaptive changes, which leads to a decrease in the accuracy of the bonding data. Among them, changes in objective conditions refer to changes in working range, working mode, and so on. For example, the working range, that is, the change of the working head, different devices have different working modes, some devices have one working mode, some devices have two working modes, and some devices have three working modes.

[0004] Therefore, how to provide a method, medium and equipment for generating parameterized bonding data based on a bonding wire model to solve the defects of the prior art that it is impossible to replace manual operation to generate parameterized bonding data with higher accuracy has become a technical problem that needs to be urgently solved by technical personnel in this field. Summary of the invention

[0005] In view of the above-mentioned shortcomings of the prior art, an object of the present invention is to provide a method, medium and device for generating parameterized bonding data based on a bonding wire model, so as to solve the problem that the prior art cannot replace manual operation to generate parameterized bonding data with high accuracy.

[0006] To achieve the above-mentioned purpose and other related purposes, the present invention provides, on one hand, a method for generating parameterized bonding data based on a bonding wire model, characterized in that the method for generating parameterized bonding data based on a bonding wire model includes: obtaining matching parameters in an integrated circuit design file; based on the matching parameters, screening a bonding wire model that meets a preset matching range from a bonding wire model library; performing interference simulation check on the screened bonding wire model; and generating parameterized bonding data using the bonding wire model that passes the interference simulation check.

[0007] To achieve the above-mentioned purpose and other related purposes, the present invention provides, on the other hand, a computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the method for generating parameterized bonding data based on a bonding wire model.

[0008] To achieve the above-mentioned purpose and other related purposes, the last aspect of the present invention provides an electronic device, including: a processor and a memory; the memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device executes the method for generating parameterized bonding data based on a bonding wire model.

[0009] As described above, the method, medium and device for generating parameterized bonding data based on a bonding wire model according to the present invention have the following beneficial effects:

[0010] The present invention uses the matching parameters of the design file to screen the bonding wire model from the bonding wire model library, and generates parameterized bonding data after performing interference simulation check on the bonding wire model, and then imports the parameterized bonding data into different bonding devices for use in different bonding scenarios. The present invention uses data learning and optimization judgment to replace manual operation, which greatly improves work efficiency and quality, thereby further reducing the production cost of the enterprise. On the one hand, it improves the defects of manual operation methods such as low efficiency, poor accuracy and adaptability, and more reliance on experience. On the other hand, compared with the existing bonding program generation method, when certain objective conditions or environments of the bonding equipment change, accurate adaptive changes can be achieved, thereby improving the accuracy of the bonding data. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 FIG. 1 is a flow chart showing a principle of a method for generating parameterized bonding data based on a bonding wire model according to an embodiment of the present invention.

[0012] Figure 2 FIG. 1 is a schematic diagram of wire bonding in an embodiment of a method for generating parameterized bonding data based on a bonding wire model according to the present invention.

[0013] Figure 3FIG. 1 is a flow chart showing a principle of a method for generating parameterized bonding data based on a bonding wire model according to another embodiment of the present invention.

[0014] Figure 4 FIG. 1 is a flowchart of an iterative model library optimization process in an embodiment of a method for generating parameterized bonding data based on a bonding wire model according to the present invention.

[0015] Figure 5 FIG. 1 is a flow chart of bonding data generation in an embodiment of a method for generating parameterized bonding data based on a bonding line model according to the present invention.

[0016] Figure 6 FIG. 1 is a schematic diagram of interference simulation of a method for generating parameterized bonding data based on a bonding wire model according to an embodiment of the present invention.

[0017] Figure 7 It is a schematic diagram showing the structural connection of an electronic device in one embodiment of the present invention.

[0018] Component number description

[0019] 7 Electronic devices

[0020] 71 Processor

[0021] 72 Memory

[0022] Steps S10 to S15 DETAILED DESCRIPTION

[0023] The following describes the embodiments of the present invention by specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and the details in this specification can also be modified or changed in various ways based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other without conflict.

[0024] It should be noted that the illustrations provided in the following embodiments are only used to illustrate the basic concept of the present invention in a schematic manner, and thus the illustrations only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0025] The method, medium and device for generating parameterized bonding data based on a bonding wire model described in the present invention utilize data learning and optimization judgment to replace manual operation, which greatly improves work efficiency and quality, thereby further reducing the production cost of the enterprise.

[0026] The following will be combined Figures 1 to 7 The principles and implementation methods of a method, medium and device for generating parameterized bonding data based on a bonding wire model of this embodiment are described in detail so that those skilled in the art can understand the method, medium and device for generating parameterized bonding data based on a bonding wire model of this embodiment without creative work.

[0027] See also Figure 1 , which is a principle flow chart of a method for generating parameterized bonding data based on a bonding wire model in one embodiment of the present invention. Figure 1 As shown, the method for generating parameterized bonding data based on the bonding wire model specifically includes the following steps:

[0028] S11, obtaining matching parameters in the integrated circuit design file.

[0029] In one embodiment, the matching parameters include: a height difference between the first pad and the second pad, a length of a line between projection points of the first pad and the second pad on a horizontal plane, a bonding wire type, and a bonding wire diameter.

[0030] In another embodiment, the matching parameters further include: pad parameters.

[0031] Specifically, the design files include but are not limited to: Allegro SIP design files, Mentor Expedition PCB design files or bonding point files (dxf, dwg, txt), etc.

[0032] See also Figure 2 , which is a schematic diagram of wire bonding in an embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention. Figure 2 As shown, according to the coordinates (x, y) of the first pad D1 and the coordinates (x1, y1) of the second pad D2, the length of the line between the projection points of the first pad D1 and the second pad D2 on the horizontal plane is calculated. The height z of the first pad D1 and the height z1 of the second pad D2 are determined according to the assembly method, and then the height difference z-z1 between the first pad D1 and the second pad D2 is obtained.

[0033] It should be noted that when point P and point P1 represent pads, L represents the length of the line between the projection points on the horizontal plane. When point P and point P1 represent bonding points, z-z1 represents the height difference between the first bonding point D1' and the second bonding point D2', and L represents the length of the line between the projection points on the horizontal plane.

[0034] S12: Screening, according to the matching parameters, bonding wire models that meet a preset matching range from a bonding wire model library.

[0035] Specifically, the obtained matching parameters: the height difference between the first pad D1 and the second pad D2 (can be extracted, if not, it needs to be set), the length of the line between the projection points of the first pad D1 and the second pad D2 on the horizontal plane, the bonding wire type, and the bonding wire diameter are used as associated conditions, and the corresponding bonding wire model is automatically screened out in the bonding wire model library according to the pre-set matching range of ±5%.

[0036] It should be noted that ±5% is one implementation of the preset matching range, and other reasonably set numerical ranges other than ±5% are also within the scope of protection of the present invention.

[0037] In one embodiment, after step S12 and before step S13, the method for generating parameterized bonding data based on bonding wire models further includes: analyzing the number of screened bonding wire models.

[0038] In response to the number being one, a step of performing interference simulation check on the screened bonding wire model is executed.

[0039] In response to the number being at least two, a preferred bonding wire model is determined using a priority parameter, and an interference simulation check is performed on the preferred bonding wire model; the priority parameter includes: at least one of a usage frequency, an update time, or a set priority level.

[0040] Specifically, if the priority parameter is the frequency of use, the bonding wire model with the highest frequency of use is selected as the preferred bonding wire model; if the priority parameter is the update time, the bonding wire model with the latest update time is selected as the preferred bonding wire model; if the priority level is set to priority, the bonding wire model with the highest priority level is selected as the preferred bonding wire model.

[0041] In response to the number being zero, a new bonding wire model is created. Specifically, the creation method may be manual creation or model algorithm creation.

[0042] S13, performing interference simulation check on the selected bonding wire model.

[0043] In one embodiment, S13 specifically includes the following steps:

[0044] (1) A simplified model of the bonding wire is obtained according to the wire arc trajectory parameters, and a simplified trajectory of the bonding wire is obtained according to the simplified model. Through the simplified trajectory of the bonding wire, it can be determined whether the height of the frame package body and the highest point of the bonding wire meet the standard and whether the spacing between the bonding wires meets the minimum spacing requirement.

[0045] (2) Determine whether the simplified trajectory of the bonding wires simultaneously satisfies the following conditions: the spacing between bonding wires is greater than or equal to twice the bonding wire diameter, the height limit is less than or equal to the preset package height, the pad size is greater than or equal to 4 times the bonding wire diameter, the arc length is less than or equal to 100 times the bonding wire diameter, and a special inspection of the double-wire bonding process is performed when double-wire bonding is performed. Specifically, the specific process of the special inspection of the double-wire bonding process is as follows: determine whether the bonding wire is a double-wire bonding based on the number of coordinates on the same pad. Specifically, when the number of coordinates on the same pad is greater than 1, it can be determined that there is a double-wire bonding. If there is a double-wire bonding, the special inspection of the double-wire bonding process treats the two bonding wires as a whole to determine whether the spacing between the adjacent bonding wires is within the range; if there is no double-wire bonding, there is no need for a special inspection of the double-wire bonding process.

[0046] (3) If yes, it is determined that the interference simulation check has passed; if not, an interference simulation check is performed on another bonding wire model.

[0047] Specifically, if all parameters determined based on the simplified trajectory of the bonding wire are within corresponding ranges, it is determined that the interference simulation check has been passed, and the bonding wire model that has passed the interference simulation check is further used to generate parameterized bonding data.

[0048] If at least one parameter is not within the range, an interference simulation check is performed on another bonding wire model; if only one bonding wire model is screened out before the interference simulation check, and the simulation interference check shows that at least one of the parameters is not within the corresponding range, an alarm is sent and an abnormality report is output to inform relevant personnel that no bonding wire model that can be used to output parameterized bonding data is found.

[0049] S14, generating parameterized bonding data using the bonding wire model checked by interference simulation. The parameterized bonding data can be imported into bonding equipment of different models for use in different bonding scenarios. Different bonding scenarios refer to different materials (for example, different materials and diameters of bonding wires), different bonding precision requirements, etc.

[0050] See also Figure 3 , which is a principle flow chart of another embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention. Figure 3 As shown, in one embodiment, before step S11, the method for generating parameterized bonding data based on the bonding wire model further includes:

[0051] S10, creating a bonding wire model library. Specifically, the following steps are included:

[0052] (1) Extract characteristic parameters and machine parameters from the bonding process.

[0053] Specifically, the characteristic parameters include: the height difference between the first bonding point and the second bonding point, the length of the line between the projection points of the first bonding point and the second bonding point on the horizontal plane, the bonding wire type, the bonding wire diameter, and the pad parameters corresponding to the first bonding point and the second bonding point.

[0054] It should be noted that, in different embodiments, pad parameters may not be a necessary condition for screening and matching bonding wire models.

[0055] In practical applications, the bonding program contains coordinate parameters, combined with Figure 2 , according to the coordinates of the first bonding point (x, y, z) and the second bonding point (x1, y1, z1), calculate the length of the line between the projection points of the first bonding point and the second bonding point on the horizontal plane And a height difference z-z1 between the first bonding point and the second bonding point.

[0056] The machine parameters include: ultrasonic mode, power, welding time, welding pressure, bonding temperature, and solder ball size of the first bonding point; ultrasonic mode, power, welding time, welding pressure, and bonding temperature of the second bonding point; and arc trajectory parameters.

[0057] (2) Generate a bonding wire model according to the characteristic parameters and the machine parameters. Specifically, according to the characteristic parameters and the machine parameters of each pair of bonding points, a bonding wire model corresponding to the pair of bonding points can be generated.

[0058] (3) Creating the bonding wire model library based on the generated bonding wire models.

[0059] Furthermore, priority parameters can be extracted in the bonding process, such as the usage frequency of each machine parameter, the update time of each machine parameter, or the preferred priority level, and any other parameter value that can represent the priority order. In different embodiments, each priority parameter can be used in combination or individually.

[0060] In actual applications, a characteristic parameter in the bonding wire model library may correspond to multiple machine parameters, and the machine parameters are selected according to the preset priority parameters. For example: if the preset priority parameter is frequency of use, the machine parameter with the highest frequency of use is directly selected; or if the preset priority parameter is update time, the machine parameter with the latest update time is directly selected; or if the preferred priority level is selected as priority, the machine parameter with the highest priority level is directly selected.

[0061] See also Figure 4 , which is a flowchart of model library optimization iteration in one embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention. Figure 4As shown, in one embodiment, after step S14, the method for generating parameterized bonding data based on the bonding wire model further includes:

[0062] S15, based on the characteristic parameters of the produced bonding program, the bonding wire model that meets the preset matching range is screened from the bonding wire model library, and the machine parameters of the screened bonding wire model are updated; and / or the machine parameters and characteristic parameters of the screened bonding wire model are updated according to the pad parameters. In actual applications, the following process changes and pad parameters are updated:

[0063] Objectively speaking, specifically, because the bonding machine parameters will be constantly revised with process changes such as equipment upgrades and welding material upgrades during the production process, it is necessary to continuously iterate the bonding wire model library. First, determine a bonding program that has been produced, extract the characteristic parameters, and screen the bonding wire models that meet the preset range in the bonding wire model library based on the characteristic parameters, and update the bonding machine parameters in the searched bonding wire model. Among them, welding material upgrade refers to changes in the composition or proportion of the bonding wire material; the bonding program that has been produced means that it has been put into production and used.

[0064] Subjectively speaking, in practice, the parameterized bonding data output by the interference simulation of this scheme can be returned to the bonding wire model library for updating after the parameters adjusted through trial production verification in actual production, and the machine parameters and characteristic parameters of the bonding wire model are updated; for the parameters that do not need to be adjusted through trial production verification in actual production, they are returned to the bonding wire model library to update their usage frequency.

[0065] Specifically, for pad parameters, if the searched bonding wire model already contains pad parameters (pad material and pad graphic shape), or the bonding program contains pad parameters, then all the changed bonding machine parameters and feature parameters are updated. If the searched bonding wire model and bonding program do not contain pad parameters (pad material and pad graphic shape), find the corresponding design file, obtain the pad parameters, and add them to the corresponding bonding feature parameters, and update all the changed bonding machine parameters and feature parameters.

[0066] See also Figure 5 , which is a flow chart of bonding data generation in an embodiment of the method for generating parameterized bonding data based on a bonding wire model of the present invention. Figure 5 As shown, taking K&S equipment as an example, the specific implementation process of generating parameterized bonding data based on the bonding wire model of the present invention is explained.

[0067] First, matching parameters are extracted based on the pad information in the design file.

[0068] Read the Bonding data in the SiP (System In a Package) design file (SiP design file is a type of integrated circuit design file), and obtain the first pad information and the second pad information of each bonding line from the Bonding data. The pad information includes: component name, pin name, pad center coordinates (X, Y coordinates), pad graphic shape and pad height. Among them, the pad height: the cumulative height is calculated as the pad height according to the component type, the actual size of the component and the assembly method in the vertical direction; the length L of the line between the projection points on the horizontal plane of the pad and the pad height difference are calculated by the pad coordinates and pad height of each pair of solder points. The data not marked in the following data are in μm.

[0069] For the first pair of solder joints:

[0070] (1) First pad information: component name: DIE2, pin name: P2, pad shape: 90*90um, pad coordinates (4800.0, 7206.0). DIE2 is a chip, thickness: 90, assembly method is stacking, and the height of the first pad is: 180.

[0071] (2) Second pad information: Component name: DIE1, pin name: P1, pad shape: 90*90um, pad coordinates (4800.0, 7911.0). DIE1 is a chip, thickness: 90, assembly method is stacking, and the height of the second pad is: 90.

[0072] Extract the matching parameters as follows:

[0073] (3) The height difference between the first pad D1 and the second pad D2 = 180 - 90 = 90.

[0074] (4) The length L of the line between the projection points of the first pad D1 and the second pad D2 on the horizontal plane is expressed as:

[0075] (5) Set the bonding wire type: gold alloy, bonding wire diameter 0.8 mil (20.32 μm).

[0076] (6) The pad parameters are: the pad material is nickel-gold and the pad graphic shape is 90*90.

[0077] Then, the matching parameters are used to search for matches in the bonding wire model library to associate and obtain the bonding wire model.

[0078] The height difference between the first pad and the second pad is 90, the length of the line between the projection points of the first pad and the second pad on the horizontal plane is L=705.0, the bonding wire type is gold alloy, and the bonding wire diameter is 0.8mil (20.32μm). The bonding wire model library is searched according to the matching range of ±5%, and the two bonding wire models are obtained as follows:

[0079] The characteristic parameters of the first bonding wire model are: height difference 90; length of the line between the projection points on the horizontal plane 705.0; bonding wire type: gold alloy, bonding wire diameter 0.8 mil, (20.32 μm); first bonding point pad parameters: pad material is nickel gold, pad graphic shape: 90*90; second bonding point pad parameters: pad material is nickel gold, pad graphic shape: 90*90.

[0080] The machine parameters of the first bonding line model are: bonding parameters of the first bonding point: ultrasonic mode: power mode; power output 400mW; welding time: 7ms; welding pressure: 35g; bonding temperature: 240℃; solder ball size: 48.8um. ​​Bonding parameters of the second bonding point: ultrasonic mode: power mode; power output 400mW; welding time: 6ms; welding pressure: 85g; bonding temperature: 240℃. The arc trajectory parameters of the current machine are: a. Arc shape: standard arc; b. Line neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

[0081] Priority parameters for the first bond wire model: Most frequently used: 50, parameter update time 2021-10-20 16:00.

[0082] The characteristic parameters of the second bonding wire model are: height difference 90; length of the line between the projection points on the horizontal plane 705.0; bonding wire type obtained: gold alloy, bonding wire diameter 0.8mil, (20.32μm); first bonding point pad parameters: none; second bonding point pad parameters: none. Furthermore, the second bonding wire model has no pad parameters, so in the subsequent bonding wire model library optimization iteration, the pad parameters in the first pair of pad matching parameters can be filled into the pad parameters of the second bonding wire model to update the second bonding wire model.

[0083] The machine parameters of the second bonding line model are: bonding parameters for the first bonding point: ultrasonic mode: power mode; power output 400mW; soldering time: 7ms; soldering pressure: 37g; bonding temperature: 240℃; solder ball size: 49.0um. Bonding parameters for the second bonding point: ultrasonic mode: power mode; power output 400mW; soldering time: 6ms; soldering pressure: 85g; bonding temperature: 240℃. The arc trajectory parameters of the current machine are: a. Arc shape: standard arc; b. Line neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

[0084] The priority parameters of the second bond wire model are: Most frequently used: 45, parameter update time 2021-9-20 9:00.

[0085] If the priority parameter is preset to use frequency priority, the use frequency of the first bonding wire model is 50 at most, and the use frequency of the second bonding wire model is 45 at most, then the first bonding wire model is selected as the bonding wire model M1.

[0086] For the second pair of solder joints:

[0087] (1) First pad information: component name: DIE2, pin name: P2, pad shape: 85*85um, pad coordinates (4930.0, 7206.0). DIE2 is a chip, thickness: 90, assembly method is stacking, and the height of the first pad is: 180.

[0088] (2) Second pad information: component name: DIE1, pin name: P1, pad graphic shape: 85*85um, pad coordinates (4890.0, 7911.0), DIE1 chip thickness: 90, assembly method is stacking, and the second pad height is: 90.

[0089] Extract the matching parameters as follows:

[0090] (3) The height difference between the first pad D1 and the second pad D2 = 180 - 90 = 90.

[0091] (4) The length L of the line between the projection points of the first pad D1 and the second pad D2 on the horizontal plane is expressed as:

[0092] (5) Set the bonding wire type: gold alloy, bonding wire diameter 0.8 mil (20.32 μm).

[0093] (6) The pad parameters are nickel-gold and the pad graphic shape is 85*85.

[0094] Then, the matching parameters are used to search for matches in the bonding wire model library to associate and obtain the bonding wire model.

[0095] The height difference between the first pad and the second pad is 90, the length of the line between the projection points of the first pad and the second pad on the horizontal plane is L=706.1, the bonding wire type is gold alloy, and the bonding wire diameter is 0.8mil (20.32μm). The bonding wire model library is searched according to the matching range of ±5%, and only one bonding wire model is obtained as follows:

[0096] The characteristic parameters of this bonding wire model are: height difference 90; length of the line between the projection points on the horizontal plane 706.1; bonding wire type: gold alloy, bonding wire diameter 0.8 mil, (20.32 μm); first bonding point pad parameters: pad material is nickel gold, pad graphic shape: 85*85; second bonding point pad parameters: pad material is nickel gold, pad graphic shape: 85*85.

[0097] The machine parameters of this bonding line model are: bonding parameters for the first bonding point: ultrasonic mode: power mode; power output 400mW; soldering time: 7ms; soldering pressure: 35g; bonding temperature: 240℃; solder ball size: 48.8um. ​​Bonding parameters for the second bonding point: ultrasonic mode: power mode; power output 400mW; soldering time: 6ms; soldering pressure: 85g; bonding temperature: 240℃. The arc trajectory parameters of the current machine are: a. Arc shape: standard arc; b. Line neck height: 3mil; c. Reverse shift: 3mil; d. Reverse shift angle: 90°, etc.

[0098] The priority parameters of this bond wire model are: Highest frequency of use: 100, parameter update time 2021-10-2016:02.

[0099] Because only one bonding model is screened out for this pair of solder joints, this bonding line model is directly used as the bonding line model M2.

[0100] The bonding wire model matching operation of subsequent pairs of solder joints is performed one by one until all pairs of solder joints are matched.

[0101] Then, perform interference simulation check.

[0102] See also Figure 6 , which is a schematic diagram of interference simulation of a method for generating parameterized bonding data based on a bonding wire model in one embodiment of the present invention. Figure 6As shown, a simplified model of the bonding wire can be obtained according to the arc shape, wire diameter height and reverse displacement in the arc trajectory parameters, and a simplified trajectory of the bonding wire is obtained by simulation according to the simplified model. Taking the arc shape as the standard arc as an example, the simplified model of the bonding wire obtained according to the above is: the first trajectory STEP1 (0, b), the second trajectory STEP2 (c, c), the third trajectory STEP3 (c*2, 0), taking STEP1 as an example, the horizontal coordinate is the horizontal displacement of this trajectory, and the vertical coordinate is the vertical displacement of this trajectory; the fourth trajectory is a straight line from STEP3 to the second bonding point.

[0103] According to the standard arc shape, wire diameter height of 3 mil (75 μm) and reverse shift of 3 mil (75 μm), the simplified trajectory of the bonding wire can be obtained: the first trajectory STEP1 (0.0, 75.0), the second trajectory STEP2 (75.0, 75.0), and the third trajectory STEP3 (150.0, 0.0).

[0104] The following interference simulation check is performed based on whether the spacing between bonding wires is greater than or equal to twice the bonding wire diameter, the height limit is less than or equal to the preset package height, the pad size is greater than or equal to 4 times the bonding wire diameter, and the arc length is less than or equal to 100 times the bonding wire diameter.

[0105] (1) Perform interference simulation check on the spacing between bonding wires, as follows:

[0106] According to the simplified trajectory, the key points of the space curve corresponding to this trajectory are obtained, and the line segment corresponding to the simplified trajectory is determined according to the key points. The algorithm for the shortest distance between two line segments in space is: calculate the length of the common perpendicular line between the two line segments (1 value), the vertical distance from each endpoint to another line segment (4 values), and the distance between the four endpoints (4 values), and a total of 9 values ​​are obtained. The smallest value is selected as the minimum distance between the two line segments in space. After calculation, the shortest distance between the two bonding wires is 90.

[0107] From the above example of paired solder joint matching, it can be seen that the diameter of the bonding wire is 20.32 μm, and the shortest distance 90 between two bonding wires is greater than 2 times the bonding wire diameter: 20.32*2=40.64, so the spacing simulation check between the bonding wires passes.

[0108] (2) Perform interference simulation check on the height limit, as follows:

[0109] The judgment standard is whether the highest point of the bonding wire is less than or equal to the preset package height; the package height can be obtained according to the device type and design standard: 900μm.

[0110] The arc height (H) is determined according to the data of the three trajectories of STEP1, STEP2 and STEP3 respectively: STEP1 (0.0, 75.0), STEP2 (75.0, 75.0), STEP3 (150.0, 0.0). The arc height is calculated by adding the values ​​of the vertical displacement (this example is calculated based on the first bonding point): 75.0+75.0+0.0=150.

[0111] The highest point of the bonding wire is: frame base 300+first bonding point height 180+arc height 150+bonding wire radius 10.16=640.16, which is less than the package height 900, that is, the height limit simulation inspection is passed.

[0112] (3) Perform interference simulation check on the pad size, as follows:

[0113] The pad size of the bonding wire model M1 is 90*90, and 4 times the bonding wire diameter is 20.32*4=81.28, which satisfies the requirement that the pad size is larger than 4 times the bonding wire diameter.

[0114] The pad size of the bonding wire model M2 is 85*85, and 4 times the bonding wire diameter is 20.32*4=81.28, which satisfies the requirement that the pad size is larger than 4 times the bonding wire diameter.

[0115] Therefore, the pad size simulation check of the bonding wire model M1 and the bonding wire model M2 passes.

[0116] (4) Perform interference simulation check on the arc length, as follows:

[0117] The judgment criterion is whether the arc length is less than or equal to 100 times the diameter of the bonding wire.

[0118] The height difference between the first pad D1 and the second pad D2 = 180-90 = 90 (H1), the projection length on the horizontal plane = 705 (L), STEP1 (0.0, 75.0), STEP2 (75.0, 75.0), STEP3 (150.0, 0.0), according to the corresponding coordinates of STEP1, STEP2, STEP3, the arc lengths corresponding to these three trajectories are calculated as follows:

[0119]

[0120] The bonding wire length corresponding to STEP4 of bonding wire model M1 is:

[0121] The bonding wire length corresponding to STEP4 of bonding wire model M2 is:

[0122] Therefore, the total arc length of the bonding wire model M1 = 331.1 + 536.7 = 867.8;

[0123] The total arc length of the bonding wire model M2 = 331.1 + 537.6 = 868.7.

[0124] From the above example of paired solder joint matching, it can be seen that the diameter of the bonding wire is 20.32 μm. By analyzing and comparing the arc length of the bonding wire model M1 (867.8) and the arc length of the bonding wire model M2 (868.7), they are both less than or equal to 100 times the diameter of the bonding wire (20.32*100=2032), so the arc length simulation check passes.

[0125] It should be noted that since the embodiments of this solution are all single-wire bonding, interference simulation inspection of double-wire bonding process is not involved.

[0126] Finally, based on the bonding wire model after the interference simulation check, the parameterized bonding data is generated and output, and different bonding devices are imported for use in different bonding scenarios. Based on the bonding wire model after the interference simulation check, the parameterized bonding data is generated, and the format of the bonding data is converted according to the bonding data format required by the current device. After the format conversion is completed, the current bonding device is imported to generate a bonding program for current production. The different bonding scenarios include but are not limited to: different materials (materials of the bonding wire), different bonding precision requirements, etc.

[0127] Based on the bonding wire model that has passed the interference simulation inspection, the corresponding parameterized bonding data is generated, and the parameterized bonding data is: the coordinates and machine parameters of the bonding points corresponding to the bonding wire model that has passed the simulation inspection. The parameterized bonding data is managed in a list to form a parameterized bonding data table in Table 1.

[0128] Table 1 Parameterized bonding data table

[0129]

[0130]

[0131] The protection scope of the method for generating parameterized bonding data based on a bonding wire model described in the present invention is not limited to the execution order of the steps listed in this embodiment. All solutions implemented by adding, reducing or replacing steps in the prior art based on the principles of the present invention are included in the protection scope of the present invention.

[0132] This embodiment provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the method for generating parameterized bonding data based on a bonding wire model is implemented.

[0133] Those skilled in the art can understand that all or part of the steps of implementing the above-mentioned method embodiments can be completed by hardware related to the computer program. The aforementioned computer program can be stored in a computer-readable storage medium. When the program is executed, the steps of the above-mentioned method embodiments are executed; and the aforementioned computer-readable storage medium includes: ROM, RAM, magnetic disk or optical disk, etc., various computer storage media that can store program codes.

[0134] See also Figure 7 , which is a schematic diagram showing the structural connection of an electronic device in one embodiment of the present invention. Figure 7 As shown, this embodiment provides an electronic device 7, which specifically includes: a processor 71 and a memory 72; the memory 72 is used to store computer programs, and the processor 71 is used to execute the computer programs stored in the memory 72, so that the electronic device 7 performs each step of the method for generating parameterized bonding data based on a bonding wire model.

[0135] The above-mentioned processor 71 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components.

[0136] The memory 72 may include a random access memory (RAM), and may also include a non-volatile memory, such as at least one disk memory.

[0137] In actual applications, the electronic device may be a computer including all or part of the components such as a memory, a storage controller, one or more processing units (CPU), a peripheral interface, an RF circuit, an audio circuit, a speaker, a microphone, an input / output (I / O) subsystem, a display screen, other output or control devices, and an external port; the computer includes but is not limited to personal computers such as desktop computers, laptop computers, tablet computers, smart phones, personal digital assistants (PDAs), etc. The electronic device may also be a server, which may be arranged on one or more physical servers according to various factors such as function and load, or may be a cloud server composed of a distributed or centralized server cluster, which is not limited in this embodiment.

[0138] In summary, the method, medium and device for generating parameterized bonding data based on the bonding wire model of the present invention utilize the matching parameters of the design file to select the bonding wire model from the bonding wire model library, and generate parameterized bonding data after performing interference simulation check on the bonding wire model, and then import the parameterized bonding data into different bonding devices for use in different bonding scenarios. The present invention utilizes data learning and optimization judgment to replace manual operation, which greatly improves work efficiency and quality, thereby further reducing the production cost of the enterprise. On the one hand, it improves the defects of the manual operation mode such as low efficiency, poor accuracy and adaptability, and more reliance on experience. On the other hand, compared with the existing bonding program generation method, when certain objective conditions or environments of the bonding equipment change, accurate adaptive changes can be achieved, thereby improving the accuracy of the bonding data. The present invention effectively overcomes the various shortcomings in the prior art and has a high industrial utilization value.

[0139] The above embodiments are merely illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Anyone familiar with the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by a person of ordinary skill in the art without departing from the spirit and technical concept disclosed by the present invention shall still be covered by the claims of the present invention.

Claims

1. A method for generating parameterized bonding data based on a bonding wire model, characterized in that: The method for generating parameterized bonding data based on a bonding wire model comprises: Acquire matching parameters in the integrated circuit design file; the matching parameters include: a height difference between the first pad and the second pad, a length of a line between projection points of the first pad and the second pad on a horizontal plane, a bonding wire type, and a bonding wire diameter; According to the matching parameters, a bonding wire model that meets a preset matching range is screened from a bonding wire model library; the creation of the bonding wire model library includes: extracting characteristic parameters and machine parameters from a bonding program; generating a bonding wire model according to the characteristic parameters and the machine parameters; and creating the bonding wire model library based on the generated bonding wire model; Optimize and select one of the selected bonding wire models and perform interference simulation check; Generate parameterized bonding data using bond wire models checked by interference simulation.

2. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that: After the step of screening the bonding wire model that meets the preset matching range from the bonding wire model library according to the matching parameters, and before the interference simulation check on the screened bonding wire model, the method for generating parameterized bonding data based on the bonding wire model further includes: Analyze the number of screened bond wire models; In response to the number being one, performing a step of performing interference simulation check on the screened bonding wire model; In response to the number being at least two, determining a preferred bonding wire model using a priority parameter, and performing an interference simulation check on the preferred bonding wire model; the priority parameter comprising: at least one of a usage frequency, an update time, or a set priority level; In response to the quantity being zero, a new bond wire model is created.

3. The method for generating parameterized bonding data based on a bonding wire model according to claim 2, characterized in that: The step of determining the preferred bonding wire model using the priority parameters comprises: If the priority parameter is the usage frequency, then the bonding wire model with the highest usage frequency is selected as the preferred bonding wire model; If the priority parameter is update time, then the bonding wire model with the latest update time is selected as the preferred bonding wire model; If the priority level is set to priority, the bonding wire model with the largest priority level is selected as the preferred bonding wire model.

4. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that: The step of performing interference simulation check on the selected bonding wire model comprises: Obtaining a simplified model of the bonding wire according to the wire arc trajectory parameters, and obtaining a simplified trajectory of the bonding wire according to the simplified model; Determine whether the simplified trajectory of the bonding wires simultaneously satisfies the following conditions: the spacing between bonding wires is greater than or equal to twice the bonding wire diameter, the height limit is less than or equal to a preset package height, the pad size is greater than or equal to 4 times the bonding wire diameter, the arc length is less than or equal to 100 times the bonding wire diameter, and special inspections for double-wire bonding processes in the case of double-wire bonding; If so, it is determined that the interference simulation check has passed; if not, an interference simulation check is performed on another bonding wire model.

5. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that: The characteristic parameters include: a height difference between the first bonding point and the second bonding point, a length of a line between projection points of the first bonding point and the second bonding point on a horizontal plane, a bonding wire type, a bonding wire diameter, and pad parameters corresponding to the first bonding point and the second bonding point; The machine parameters include: ultrasonic mode, power, welding time, welding pressure, bonding temperature, and solder ball size of the first bonding point; ultrasonic mode, power, welding time, welding pressure, and bonding temperature of the second bonding point; and arc trajectory parameters.

6. The method for generating parameterized bonding data based on a bonding wire model according to claim 1, characterized in that: After the step of generating parameterized bonding data using the bonding wire model checked by interference simulation, the method of generating parameterized bonding data based on the bonding wire model further includes: Based on the characteristic parameters of the produced bonding program, the bonding wire model that meets the preset matching range is screened from the bonding wire model library, and the machine parameters of the screened bonding wire model are updated; and / or the machine parameters and characteristic parameters of the screened bonding wire model are updated according to the pad parameters.

7. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the method for generating parameterized bonding data based on a bonding wire model according to any one of claims 1 to 6 is implemented.

8. An electronic device, characterized in that: include: Processor and memory; The memory is used to store a computer program, and the processor is used to execute the computer program stored in the memory, so that the electronic device executes the method for generating parameterized bonding data based on a bonding wire model according to any one of claims 1 to 6.

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